Probe unit

Abstract

To provide a probe unit which allows characteristic impedance of an entire contact probe to be adjusted.SOLUTION: A probe unit of the present invention comprises: a first contact probe; a second contact probe; a probe holder having through-holes formed therethrough to surround the first contact probe; and a conductive part provided on a surface of the probe holder to provide electrical contact between the through-holes and the second contact probe.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a probe unit that houses contact probes that input and output signals to and from a predetermined circuit structure. [Background technology]

[0002] Conventionally, when testing the continuity or operating characteristics of a test object such as a semiconductor integrated circuit or a liquid crystal panel, a probe unit is used that includes a contact probe that establishes an electrical connection between the test object and a signal processing device that outputs a test signal, and a probe holder that accommodates a plurality of these contact probes.

[0003] Generally, when inputting or outputting high-frequency electrical signals, a signal loss called insertion loss occurs. In order to operate a probe unit at high speed with high precision, it is important to reduce this insertion loss in the frequency range used. For example, Patent Document 1 discloses a technology for matching characteristic impedance by providing an air layer around a contact probe. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-98219 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the technology disclosed in Patent Document 1 is capable of adjusting the impedance at the center of the contact probe, but is unable to adjust the characteristic impedance at the tip or base end.

[0006] The present invention has been made in view of the above, and has an object to provide a probe unit that can adjust the characteristic impedance of the entire contact probe. [Means for solving the problem]

[0007] In order to solve the above-mentioned problems and achieve the object, a probe unit according to the present invention comprises a plurality of first contact probes that each contact an electrode to be contacted at one end in the longitudinal direction, a second contact probe that connects to an external ground, and a probe holder that holds the first and second contact probes, wherein the probe holder is formed with a first hollow portion for inserting and holding the first contact probe, a second hollow portion for inserting and holding the second contact probe, and a through hole provided around the first hollow portion, and the probe holder has a conductive portion that constitutes the through hole and electrically connects the through hole to the second contact probe.

[0008] Furthermore, in the probe unit according to the present invention, the conductive portion is provided on the through hole and on a surface that forms an open end of the through hole.

[0009] In addition, in the probe unit according to the present invention, the through-hole has a stepped hole shape with a diameter that varies partially.

[0010] In addition, in the probe unit according to the present invention, the through holes have stepped hole shapes whose central axes are positioned at different positions from each other.

[0011] In addition, in the probe unit according to the present invention, the probe holder is formed of a single member.

[0012] Moreover, in the probe unit according to the present invention, in the above invention, the probe holder is formed by stacking a plurality of members in a direction in which the first hollow portion penetrates.

[0013] In addition, the probe unit according to the present invention is characterized in that, in the above invention, the through holes are formed by through holes formed in each of the plurality of members, and in at least one member, the through holes have a stepped hole shape in which the diameters of the through holes are partially different.

[0014] Furthermore, in the probe unit according to the present invention, in the above invention, the through holes are formed by through holes formed in each of the plurality of members, and in at least one member, the through holes have stepped hole shapes in which the positions of the central axes of the through holes are different from each other.

[0015] Furthermore, the probe unit according to the present invention is characterized in that, in the above invention, the plurality of members each have a through hole that constitutes the through hole, and at least a portion of the through holes formed in members adjacent in the stacking direction of the members overlap with each other when viewed from the penetration direction of the through holes.

[0016] Furthermore, in the probe unit according to the present invention, the through-hole has an opening that has an elongated hole shape when viewed from the penetration direction. [Effects of the Invention]

[0017] According to the present invention, it is possible to advantageously adjust the characteristic impedance of the entire contact probe. [Brief explanation of the drawings]

[0018] [Figure 1] FIG. 1 is a partial cross-sectional view showing the configuration of a main part of a probe unit according to a first embodiment of the present invention. [Figure 2] FIG. 2 is a diagram illustrating the arrangement of through holes in the probe unit according to the first embodiment of the present invention. [Figure 3] FIG. 3 is a diagram showing a state during testing of a semiconductor integrated circuit using the probe holder according to the first embodiment of the present invention. [Figure 4]FIG. 4 is a diagram illustrating the arrangement of through holes in a probe unit according to a first modification of the first embodiment of the present invention. [Figure 5] FIG. 5 is a diagram illustrating the arrangement of through holes in a probe unit according to a second modification of the first embodiment of the present invention. [Figure 6] FIG. 6 is a diagram illustrating the arrangement of through holes in a probe unit according to a third modification of the first embodiment of the present invention. [Figure 7] FIG. 7 is a cross-sectional view illustrating a configuration of a main part of a through hole of a probe unit according to a fourth modification of the first embodiment of the present invention. [Figure 8] FIG. 8 is a cross-sectional view illustrating a configuration of a main part of a through-hole of a probe unit according to a fifth modification of the first embodiment of the present invention. [Figure 9] FIG. 9 is a cross-sectional view illustrating a configuration of a main part of a through hole of a probe unit according to a sixth modification of the first embodiment of the present invention. [Figure 10] FIG. 10 is a partial cross-sectional view showing the configuration of a main part of a probe unit according to the second embodiment of the present invention. [Figure 11] FIG. 11 is a partial cross-sectional view showing the configuration of a main part of a probe unit according to a third embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0019] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following embodiments. Furthermore, the drawings referred to in the following description merely show the shapes, sizes, and positional relationships in a schematic manner to enable the contents of the present invention to be understood, and therefore the present invention is not limited to only the shapes, sizes, and positional relationships exemplified in the drawings.

[0020] (Embodiment 1) Fig. 1 is a partial cross-sectional view showing the configuration of a main part of a probe unit according to a first embodiment of the present invention. The probe unit 1 shown in Fig. 1 is a device used when testing the electrical characteristics of a semiconductor integrated circuit, which is an object to be tested, and is a device that electrically connects the semiconductor integrated circuit (a semiconductor integrated circuit 100 described later) and a circuit board (a circuit board 200 described later) that outputs a test signal to the semiconductor integrated circuit.

[0021] Probe unit 1 has conductive signal contact probes 2A (hereinafter simply referred to as "signal probes 2A") that contact two different contacted bodies, semiconductor integrated circuit 100 and circuit board 200, at both ends in the longitudinal direction and conduct test signals, ground contact probes 2B (hereinafter simply referred to as "ground probes 2B") that connect to external ground electrodes, and a probe holder 3 that houses and holds the signal probes 2A and ground probes 2B in a predetermined pattern. Note that probe unit 1 may also include a holder member that is provided around probe holder 3 and prevents the semiconductor integrated circuit from shifting position during testing.

[0022] The signal probe 2A is formed using a conductive material and includes a first plunger 21 that contacts an electrode to which a test signal of a semiconductor integrated circuit is input when testing the semiconductor integrated circuit, a second plunger 22 that contacts an electrode that outputs a test signal of a circuit board having a test circuit, and a spring member 23 that is provided between the first plunger 21 and the second plunger 22 and connects the first plunger 21 and the second plunger 22 so that they can expand and contract. The first plunger 21, the second plunger 22, and the spring member 23 that constitute the signal probe 2A have the same axis. In the signal probe 2A shown in FIG. 1, the longitudinal axes (center axes) of the first plunger 21, the second plunger 22, and the spring member 23 are aligned with the axis N. P matches.

[0023] When the signal probe 2A contacts the semiconductor integrated circuit, the spring member 23 expands and contracts to cushion the impact on the connection electrodes of the semiconductor integrated circuit and apply a load to the semiconductor integrated circuit and the circuit board. In the following, the side of the signal probe 2A that contacts the electrodes of the semiconductor integrated circuit is referred to as the tip side, and the side opposite the axial direction from the semiconductor integrated circuit is referred to as the base side. When defining the tip side and base side for a plunger alone, the semiconductor integrated circuit side of the plunger that contacts the semiconductor integrated circuit is referred to as the tip side, and the side opposite the axial direction from the semiconductor integrated circuit is referred to as the base side. Furthermore, the circuit board side of the plunger that contacts the circuit board is referred to as the tip side, and the side opposite the axial direction from the circuit board is referred to as the base side.

[0024] The first plunger 21 is movable in the axial direction by the expansion and contraction of the spring member 23, and during testing, is urged in a direction approaching the semiconductor integrated circuit by the elastic force of the spring member 23, and comes into contact with an electrode of the semiconductor integrated circuit. The second plunger 22 is movable in the axial direction by the expansion and contraction of the spring member 23, and is urged in a direction approaching the circuit board by the elastic force of the spring member 23, and comes into contact with an electrode of the circuit board.

[0025] The spring member 23 has a tightly wound portion 23a on the first plunger 21 side and a loosely wound portion 23b on the second plunger 22 side. An end of the tightly wound portion 23a is connected to the first plunger 21. On the other hand, an end of the loosely wound portion 23b is connected to the second plunger 22. The first plunger 21 and the second plunger 22 are joined to the spring member 23 by fitting and / or soldering using the winding force of the spring.

[0026] The ground probe 2B has the same configuration as the signal probe 2A. Specifically, the ground probe 2B is made of a conductive material and includes a first plunger 21 that contacts the ground electrode of a semiconductor integrated circuit when testing the semiconductor integrated circuit, a second plunger 22 that contacts the ground electrode of a circuit board, and a spring member 23 that is provided between the first plunger 21 and the second plunger 22 and connects the first plunger 21 and the second plunger 22 so that they can expand and contract. The first plunger 21 and the second plunger 22 and the spring member 23 that constitute the ground probe 2B have the same axis. In the ground probe 2B shown in FIG. 1, the longitudinal axes (center axes) of the first plunger 21, the second plunger 22, and the spring member 23 are aligned with the axis N. P matches.

[0027] The probe holder 3 is formed by laminating a first member 31, a second member 32, a third member 33, and a fourth member 34, which are formed using an insulating material such as resin, machinable ceramic, or silicon. The probe holder 3 shown in Fig. 1 is laminated in the order of the third member 33, the first member 31, the second member 32, and the fourth member 34 from the top of the drawing. The first member 31 to the fourth member 34 are fixed together by a known method such as screwing or adhesive.

[0028] The probe holder 3 is formed with a hollow portion 35 that forms a space for accommodating a plurality of signal probes 2A, and a hollow portion 36 that forms a space for accommodating a plurality of ground probes 2B. The probe holder 3 also has a plurality of through holes 37 formed around the signal probes 2A.

[0029] The surface of the first member 31 is plated. A conductive material is used for the plating. Therefore, a first conductive coating 31a and a second conductive coating 31b are formed on the surface of the first member 31. The first conductive coating 31a is formed on the surface excluding the hollow portion 35, including the portion where the through hole 37 is formed. The second conductive coating 31b is formed on the surface of the portion where the hollow portion 35 is formed. The first conductive coating 31a and the second conductive coating 31b are spaced apart from each other to ensure insulation. In the example shown in FIG. 1, the coatings are separated by removing a portion of the coating.

[0030] Like the first member 31, the second member 32 to the fourth member 34 are plated on their surfaces except for the portion that forms the inner circumferential surface of the hollow portion 35. A first conductive coating 32a and a second conductive coating 32b are formed on the surface of the second member 32. A first conductive coating 33a and a second conductive coating 33b are formed on the surface of the third member 33. A first conductive coating 34a and a second conductive coating 34b are formed on the surface of the fourth member 34. The first conductive coatings 32a to 34a are formed on the surface excluding the hollow portion 35, including the portion where the through hole 37 is formed. The second conductive coatings 32b to 34b are formed on the surface of the portion where the hollow portion 35 is formed. At least a portion of the first conductive coatings 31a to 34a constitutes a conductive portion. Therefore, in the probe holder 3 formed by laminating the first member 31 to the fourth member 34, conductive coatings are present at the boundaries between the members and on the outer surfaces.

[0031] The hollow portion 35 is formed by aligning the axes of the through holes formed in the first member 31 to the fourth member 34. Second conductive coatings 31b to 34b are formed on the inner circumferential surface of the hollow portion 35, forming a conductive inner circumferential surface. The hollow portion 35 extends in the stacking direction of the first member 31 to the fourth member 34.

[0032] The hollow portion 36 is formed by aligning the axes of the through holes formed in the first member 31 to the fourth member 34. The hollow portion 36 has first conductive coatings 31a to 34a formed on its inner circumferential surface, forming a conductive inner circumferential surface.

[0033] The positions where the hollow portions 35 and 36 are formed are determined according to the wiring pattern of the semiconductor integrated circuit. Both hollow portions 35 and 36 have a stepped hole shape with diameters that vary along the penetration direction. That is, each holder hole consists of a small-diameter portion that has an opening at the end face of the probe holder 3 and a large-diameter portion that is larger in diameter than the small-diameter portion. The probe holder 3 shown in FIG. 1 has stepped portions formed at the boundary between the first member 31 and the third member 33 and at the boundary between the second member 32 and the fourth member 34. The shape of each holder hole is determined according to the configuration of the signal probes 2A and ground probes 2B to be accommodated.

[0034] The first plunger 21 of the signal probe 2A has a flange abutting against the wall surface of the third member 33, thereby preventing the signal probe 2A from coming out of the probe holder 3. The second plunger 22 has a flange abutting against the wall surface of the fourth member 34, thereby preventing the signal probe 2A from coming out of the probe holder 3.

[0035] The first plunger 21 of the grounding probe 2B has a flange abutting against the wall surface of the third member 33, thereby preventing the grounding probe 2B from coming out of the probe holder 3. The second plunger 22 has a flange abutting against the wall surface of the fourth member 34, thereby preventing the grounding probe 2B from coming out of the probe holder 3.

[0036] The through holes 37 are formed by aligning the axes of the through holes formed in the first member 31 to the fourth member 34. That is, the through holes 37 are provided from the surface on the tip side to the surface on the base side of the signal probe 2A in the probe holder 3. The through holes 37 shown in FIG. 1 are arranged such that the central axis of each through hole is aligned with the axis N T Through-hole 37 has a circular opening in a direction perpendicular to the penetrating direction. First conductive films 31a to 34a are formed on the inner circumferential surface of through-hole 37, forming a conductive inner circumferential surface.

[0037] The through-hole 37 forms a cylindrical hollow space, and one or more through-holes 37 are formed around the signal probe 2A. In the first embodiment, an example will be described in which eight through-holes 37 are formed around one signal probe 2A. FIG. 2 is a diagram for explaining the arrangement of through-holes in a probe unit according to an embodiment of the present invention. For example, the arrangement position of the signal probe 2A (axis N) P 2, eight through holes 37 are provided at equal intervals around the axis N. In FIG. 2, the diameter of each through hole 37 is the same, and each through hole 37 and the axis N P The shortest distances between the through holes 37 and the signal probe 2A are the same as each other, i.e., the center of the circle (dashed line in FIG. 2) that passes through the centers of all the through holes 37 is the same as the center of the signal probe 2A (axis N P ) overlaps with the through holes 37. A group of through holes made up of all the through holes 37 has a coaxial structure with the signal probe 2A.

[0038] In this embodiment 1, the placement position, number, size of each through hole formed by the through holes 37, etc. are determined so that the characteristic impedance when the signal probe 2A and the ground probe 2B are viewed as one transmission path becomes a predetermined value (for example, 50 Ω).

[0039] 3 is a diagram showing a state of the probe unit 1 during testing of the semiconductor integrated circuit 100. During testing, the first plunger 21 of the signal probe 2A contacts the electrode 101 for the test signal of the semiconductor integrated circuit 100, and the second plunger 22 contacts the electrode 201 for the test signal of the circuit board 200. On the other hand, the first plunger 21 of the ground probe 2B contacts the electrode 102 for the ground of the semiconductor integrated circuit 100, and the second plunger 22 contacts the electrode 202 for the ground of the circuit board 200. During testing of the semiconductor integrated circuit 100, the spring member 23 is compressed by the contact load from the semiconductor integrated circuit 100.

[0040] During testing, a test signal supplied from the circuit board 200 to the semiconductor integrated circuit 100 travels, for example, from the electrode 201 on the circuit board 200 through the second plunger 22, the tightly wound portion 23a (or the second conductive film), and the first plunger 21 of the signal probe 2A to the electrode 101 of the semiconductor integrated circuit 100. In this way, in the signal probe 2A, the first plunger 21 and the second plunger 22 are electrically connected via the tightly wound portion 23a, minimizing the electrical signal conduction path. This prevents signals from flowing through the loosely wound portion 23b during testing, reducing resistance and inductance. In this case, the signal can be transmitted via the path that passes through the second plunger 22, the second conductive film, and the first plunger 21 without passing through the spring member 23.

[0041] Furthermore, the first plunger 21 of the grounding probe 2B contacts the first conductive film 33a or 31a. Meanwhile, the second plunger 22 of the grounding probe 2B contacts the first conductive film 34a or 32a. Furthermore, the spring member 23 of the grounding probe 2B contacts the first conductive film 31a or 32a.

[0042] It is generally known that in electronic circuits that handle AC signals, where wiring with different impedances connect, the signal is reflected by an amount that corresponds to the ratio between the different impedances, hindering signal propagation. This also applies to the relationship between the semiconductor integrated circuit 100 and the signal probe 2A used, and if the characteristic impedance of the semiconductor integrated circuit 100 and the characteristic impedance of the signal probe 2A differ significantly, loss of the electrical signal occurs and the waveform of the electrical signal is distorted.

[0043] Furthermore, the rate of signal reflection occurring at the connection point due to differences in characteristic impedance increases as the speed, i.e., frequency, of the semiconductor integrated circuit 100 increases. Therefore, when fabricating a probe unit 1 compatible with a semiconductor integrated circuit 100 that operates at high frequency, it is important to accurately adjust the impedance so that the value of the characteristic impedance of the signal probe 2A matches that of the semiconductor integrated circuit 100.

[0044] However, from the viewpoint of impedance matching, it is not easy to change the shape of the signal probe 2A because the signal probe 2A is inherently limited by its outer diameter being restricted to 1 mm or less and by its complex shape being constituted by the first plunger 21, the second plunger 22, and the spring member 23, making it difficult from the viewpoints of design and manufacturing to change the shape to one suitable for impedance matching.

[0045] Therefore, in this embodiment, instead of changing the structure of the signal probe 2A, a configuration is adopted in which the value of the characteristic impedance is adjusted by arranging through holes 37 around the first plunger 21, the second plunger 22, and the spring member 23. By adopting such a configuration, it is possible to reuse the conventional structure for the signal probe 2A. For example, the same probe as the conventional ground probe 2B can be used as the signal probe 2A.

[0046] Furthermore, in this embodiment, there is no need to change the shape of the signal probe 2A to one suitable for impedance matching, which improves the degree of freedom in the shape of the probe to be used.

[0047] Furthermore, in the first embodiment, by providing through holes 37 around the signal probe 2A, which extend from the surface on the tip side of the signal probe 2A in the probe holder 3 to the surface on the base side, the value of the characteristic impedance of the tip and base ends of the signal probe 2A can be adjusted. Specifically, the value of the characteristic impedance can be adjusted by adjusting the number of through holes, the diameter of the through holes, and the arrangement of the through holes (the distance from the signal probe 2A). Furthermore, by surrounding the signal probe 2A with multiple through holes 37, it is possible to make the signal probe 2A less susceptible to the influence of external factors such as noise, and to reduce energy loss due to energy leakage to the outside.

[0048] In the above-described first embodiment, the through holes 37 are arranged around the signal probe 2A, and the signal probe 2A is connected to an external ground via the ground probe 2B. According to the first embodiment, the characteristic impedance of the tip and base ends of the signal probe 2A can be adjusted by the through holes 37 that are indirectly connected to the external ground. According to the first embodiment, the overall characteristic impedance including the end of the signal probe 2A can be adjusted. Furthermore, according to the first embodiment, by adjusting the position of the through holes, the ground position in the direction perpendicular to the axial direction with respect to the signal probe 2A can be adjusted.

[0049] Furthermore, according to the first embodiment described above, the outer surface of the probe holder 3 is covered with a conductive film, and therefore the high frequency characteristics are superior to those of a probe holder that is not plated.

[0050] Furthermore, according to the first embodiment described above, the characteristic impedance can be adjusted by the through-holes, which improves the degree of freedom in arranging the ground probes 2B.

[0051] In the first embodiment described above, first conductive films 33a and 34a may be configured to be connected to an external ground.

[0052] In the first embodiment, the plurality of through holes are arranged along the axis N of the signal probe. P Although an example in which the electrodes are arranged symmetrically with respect to each other has been described, an asymmetric arrangement may also be used.

[0053] In the first embodiment, the example in which a plurality of through holes are evenly arranged on one signal probe has been described, but the through holes may be arranged non-uniformly. In this case, the non-uniformity means that the axis N of the signal probe is P The distances around the circumference of a circle centered on a single point may be uneven at different points, and the axis N P The distances from the points 1 to 3 may be different from each other in terms of their shortest distances (the distance d1 described above), or both.

[0054] In addition, in the above-mentioned first embodiment, an example in which a conductive coating is formed on each member of the probe holder 3 has been described. However, instead of a coating, a conductive plate, sheet, film, or the like that is sufficiently thin compared with the thickness of the member may be used.

[0055] In addition, in the above-mentioned embodiment 1, it was described that the second conductive coatings 31b to 34b are formed on the surface of the hollow portion 35 to form a conductive through hole, but it is also possible to have an insulating inner surface without forming the second conductive coating.

[0056] (Variation 1) 4 is a diagram illustrating the arrangement of through holes in a probe unit according to a first modification of the first embodiment of the present invention. The probe unit according to the first modification has a different size for some of the through holes in the probe holder 3 described above. The rest of the configuration is the same as that of the probe unit 1, and therefore a description thereof will be omitted.

[0057] In the probe holder according to the first modification, six through holes 37 and two through holes 37A are formed around the signal probe 2A. In FIG. 4, three sets of through holes 37 are arranged around the axis N. Pand the through hole 37A is disposed on the axis N P 1 shows an example in which the two sensors are arranged opposite each other with a gap therebetween.

[0058] The through holes 37A are formed by aligning the axes of the through holes formed in the first member 31 to the fourth member 34. The through holes 37A form a cylindrical hollow space. The opening of the through holes 37A in a direction perpendicular to the penetration direction is circular. The through holes 37A have a conductive coating (for example, the above-mentioned first conductive coatings 31a to 34a) formed on their inner circumferential surfaces, making the inner circumferential surfaces conductive. The diameter of the through holes 37A is larger than the diameter of the through holes of the through holes 37.

[0059] The through holes 37 and 37A are arranged such that the center of each through hole is aligned with the axis N of the signal probe 2A. P The through hole 37A and the axis N are arranged at a position passing through a circle (dashed line in FIG. 4) with the axis N at the center. P The shortest distance d2 between the through hole 37 and the axis N P is shorter than the shortest distance d1 between them.

[0060] As in the present modified example 1, through holes 37 and 37A of different sizes are arranged around the signal probe 2A, and the signal probe 2A is connected to an external ground via the ground probe 2B. In the modified example 1, as in the first embodiment, the through holes 37 and 37A indirectly connected to the external ground allow the characteristic impedance of the tip and base ends of the signal probe 2A to be adjusted.

[0061] (Variation 2) 5 is a diagram illustrating the arrangement of through holes in a probe unit according to a second modification of the first embodiment of the present invention. The probe unit according to the second modification differs in the size and arrangement of some of the through holes in the probe holder 3 described above. The rest of the configuration is the same as that of the probe unit 1, so a description thereof will be omitted.

[0062] In the probe holder according to the second modification, six through holes 37 and two through holes 37A are formed around the signal probe 2A. In FIG. 5, three sets of through holes 37 are arranged around the axis N. P and the through hole 37A is disposed on the axis N P 1 shows an example in which the two sensors are arranged opposite each other with a gap therebetween.

[0063] The through holes 37 and 37A are connected to the through hole 37 and the axis N. P The shortest distance between the through hole 37A and the axis N P and are positioned such that the shortest distance between them is the same distance d1.

[0064] As in the present modified example 2, through holes 37 and 37A of different sizes are arranged around the signal probe 2A, and the signal probe 2A is connected to an external ground via the ground probe 2B. In the modified example 2, as in the first embodiment, the through holes 37 and 37A indirectly connected to the external ground allow the characteristic impedance of the tip and base ends of the signal probe 2A to be adjusted.

[0065] (Variation 3) 6 is a diagram illustrating the arrangement of through holes in a probe unit according to a third modification of the first embodiment of the present invention. The probe unit according to the third modification differs in the size and arrangement of some of the through holes in the probe holder 3 described above. The rest of the configuration is the same as that of the probe unit 1, so a description thereof will be omitted.

[0066] In the probe holder according to the third modification, eight through holes 37B are formed around the signal probe 2A. In FIG. 6, four sets of through holes 37B are arranged around the axis N. P 1 shows an example in which the two sensors are arranged opposite each other with a gap therebetween.

[0067] The through holes 37B have an opening shaped like an elongated hole when viewed from the penetration direction. The through holes 37B are arranged such that the center of gravity of each through hole is aligned with the axis N of the signal probe 2A. PThe through-hole 37B is also disposed at a position passing through a circle (dashed line in FIG. 6) having its center at . A conductive coating (for example, the above-described first conductive coatings 31a to 34a) is formed on the inner peripheral surface of the through-hole 37B, making the inner peripheral surface conductive.

[0068] As in the present modified example 3, a plurality of through holes 37B are arranged around the signal probe 2A, and the signal probe 2A is connected to an external ground via the ground probe 2B. In the modified example 3, as in the first embodiment, the through holes 37B indirectly connected to the external ground allow the characteristic impedance of the tip and base ends of the signal probe 2A to be adjusted.

[0069] In addition, in the third modification, the opening shape of the through hole 37B is an elongated hole, so that the area surrounding the signal probe 2A by the through hole 37B is larger than that of the through holes 37 and 37A. By using a shape other than a circle for the through hole, the degree of freedom in adjusting the characteristic impedance is increased, thereby improving the high-frequency characteristics of the probe unit. Furthermore, by increasing the surrounding area, energy loss due to energy leakage to the outside can be further reduced.

[0070] (Variation 4) 7 is a cross-sectional view illustrating the configuration of a main part of a through hole of a probe unit according to a fourth modification of the first embodiment of the present invention. The probe unit according to the fourth modification differs in the shape of the through hole in the above-described probe holder 3. The other configurations are the same as those of the probe unit 1, and therefore, description thereof will be omitted.

[0071] The through hole according to the fourth modification is formed by interconnecting through holes formed in the first member 31 to the fourth member 34. The through hole has a conductive coating (for example, the above-described first conductive coatings 31a to 34a) formed on its inner circumferential surface, forming a conductive inner circumferential surface. The through hole has partially different diameters. Specifically, for example, the diameter Q1 of the through hole 37a formed in the third member 33 is different from the diameter Q2 of the through hole 37b formed in the first member 31. The central axis N1 of the through hole 37a and the central axis N2 of the through hole 37b are linearly connected.

[0072] As in the present modification 4, by arranging through holes in the shape of stepped holes around the signal probe 2A and connecting it to an external ground via the ground probe 2B, it is possible to obtain the same effect as in the first embodiment and to adjust the characteristic impedance according to the shape of the signal probe 2A.

[0073] (Variation 5) 8 is a cross-sectional view illustrating the configuration of a main part of a through hole of a probe unit according to a fifth modification of the first embodiment of the present invention. The probe unit according to the fifth modification differs in the shape of the through hole in the above-described probe holder 3. The other configurations are the same as those of the probe unit 1, and therefore, description thereof will be omitted.

[0074] The through hole according to the fifth modification is formed by interconnecting through holes formed in the first member 31 to the fourth member 34. The through hole has a conductive coating (for example, the first conductive coatings 31a to 34a described above) formed on its inner circumferential surface, forming a conductive inner circumferential surface. The through holes have partially different axial positions. Specifically, for example, the central axis N1 of the through hole 37c formed in the third member 33 is at a different position from the central axis N2 of the through hole 37d formed in the first member 31. Furthermore, the diameter Q3 of the through hole 37c and the diameter Q4 of the through hole 37d are the same. In this way, the through hole according to the fifth modification is formed by through holes whose central axes are partially different in position. In this case, when the through hole is viewed from the stacking direction of the first member 31 to the fourth member 34, at least a portion of the through holes formed in adjacent members in the stacking direction of the members overlap with each other. The through hole is formed by at least a portion of the through holes formed in each member communicating with each other.

[0075] As in the present modification 5, by arranging through holes with stepped hole shapes in which the axes of some of the through holes are offset around the signal probe 2A and connecting to an external ground via the ground probe 2B, it is possible to obtain the same effect as in the first embodiment and to adjust the characteristic impedance according to the shape of the signal probe 2A.

[0076] (Variation 6) 9 is a cross-sectional view illustrating the configuration of a main part of a through hole of a probe unit according to a sixth modification of the first embodiment of the present invention. The probe unit according to the sixth modification differs in the shape of the through hole in the probe holder 3 described above. The other configurations are the same as those of the probe unit 1, and therefore, description thereof will be omitted.

[0077] The through holes according to the sixth modification are formed by interconnecting the through holes formed in the first to fourth members 31 to 34. The through holes have a conductive coating (for example, the above-described first conductive coatings 31a to 34a) formed on the inner circumferential surface, forming a conductive inner circumferential surface. The through holes have partially different diameters and axial positions. Specifically, for example, the diameter Q5 of the through hole 37e formed in the third member 33 is different from the diameter Q6 of the through hole 37f formed in the first member 31. Furthermore, the central axis N1 of the through hole 37e is different from the central axis N2 of the through hole 37f.

[0078] As in the present modification 6, by arranging through holes around the signal probe 2A, some of which have different diameters and have stepped hole shapes with offset axes, and connecting to an external ground via the ground probe 2B, it is possible to obtain the same effects as in the first embodiment and to adjust the characteristic impedance according to the shape of the signal probe 2A.

[0079] It is also possible to appropriately combine the through-hole configurations according to Modifications 1 to 6. For example, the signal probes arranged in the same probe holder may have at least some different shapes or arrangements.

[0080] (Embodiment 2) Next, a second embodiment will be described with reference to Fig. 10. Fig. 10 is a partial cross-sectional view showing the configuration of a main part of a probe unit according to the second embodiment of the present invention. The probe unit according to the second embodiment includes a probe holder 3A instead of the above-described probe holder 3. The other configurations are the same as those of the probe unit 1, so the description will be omitted.

[0081] The probe holder 3A is made of a single member formed using an insulating material such as resin, machinable ceramic, or silicon. The probe holder 3A is formed with a hollow portion 35 that forms a space for accommodating multiple signal probes 2A, and a hollow portion (the above-mentioned hollow portion 36) that forms a space for accommodating multiple ground probes 2B. The hollow portions 35 and 36 have a hole shape with a diameter that allows the contact probes to be inserted and removed and prevents them from falling out. The probe holder 3A also has multiple through holes 38 formed around the signal probes 2A.

[0082] The surface of the probe holder 3A is plated. A conductive material is used for the plating. Therefore, a first conductive film 3a and a second conductive film 3b are formed on the surface of the probe holder 3A. The first conductive film 3a is formed on the surface excluding the hollow portion 35, including the portion where the through hole 38 is formed. The second conductive film 3b is formed on the surface of the portion where the hollow portion 35 is formed. The first conductive film 3a and the second conductive film 3b are spaced apart from each other to ensure insulation.

[0083] The through hole 38 is a through hole whose opening in a direction perpendicular to the penetration direction is circular and whose diameter varies in parts. Specifically, the through hole 38 has a first hole 38a formed on one surface side (the side from which the first plunger 21 extends in FIG. 10 ), a second hole 38b formed on the other surface side (the side from which the second plunger 22 extends in FIG. 10 ), and a third hole 38c provided between the first hole 38a and the second hole 38b. The diameters of the openings of the first hole 38a and the second hole 38b are larger than the diameter of the opening of the third hole 38c. The through hole 38 has a first conductive coating 3a formed on its inner circumferential surface, forming a conductive inner circumferential surface. The central axes of the first hole 38a, the second hole 38b, and the third hole 38c are connected in a straight line.

[0084] The through-holes 38 form cylindrical hollow spaces with steps that vary in diameter in parts, and a plurality of through-holes 38 are formed around the signal probe 2 A. For example, as in the first embodiment, eight through-holes 38 are formed around one signal probe 2 A.

[0085] In the above-described second embodiment, the through holes 38 are arranged around the signal probe 2A, and the signal probe 2A is connected to an external ground via the ground probe 2B. As a result, according to the second embodiment, the characteristic impedance of the tip and base ends of the signal probe 2A can be adjusted by the through holes 38 that are indirectly connected to the external ground. According to the second embodiment, the overall characteristic impedance including the end of the signal probe 2A can be adjusted. Furthermore, according to the second embodiment, by adjusting the position of the through holes, the ground position in the direction perpendicular to the axial direction with respect to the signal probe 2A can be adjusted.

[0086] Furthermore, in the second embodiment, the diameter of the through-hole 38 is partially different, so that the characteristic impedance can be adjusted in accordance with the shape of the signal probe 2A.

[0087] (Embodiment 3) Next, a third embodiment will be described with reference to Fig. 11. Fig. 11 is a partial cross-sectional view showing the configuration of a main part of a probe unit according to the third embodiment of the present invention. The probe unit according to the third embodiment includes a probe holder 4 instead of the above-described probe holder 3. The other configurations are the same as those of the probe unit 1, and therefore description thereof will be omitted.

[0088] The probe holder 4 is formed by laminating a first member 41 and a second member 42, each made of an insulating material such as resin, machinable ceramic, or silicon. In the probe holder 4 shown in Fig. 11, the first member 41 and the second member 42 are laminated in this order from the top of the figure. The first member 41 and the second member 42 are fixed together by a known method such as screwing or adhesive bonding.

[0089] The probe holder 4 is formed with a hollow portion 35 that forms a space for accommodating a plurality of signal probes 2A, and a hollow portion (not shown) that forms a space for accommodating a plurality of ground probes 2B. The probe holder 4 also has a plurality of through holes 43 formed around the signal probes 2A.

[0090] The surface of the first member 41 is plated. A conductive material is used for the plating. Therefore, a first conductive coating 41a and a second conductive coating 41b are formed on the surface of the first member 41. The first conductive coating 41a is formed on the surface excluding the hollow portion 35, including the portion where the through hole 43 is formed. The second conductive coating 41b is formed on the surface of the portion where the hollow portion 35 is formed. The first conductive coating 41a and the second conductive coating 41b are spaced apart from each other to ensure insulation.

[0091] Similar to the first member 41, the surface of the second member 42 is plated. A first conductive coating 42a and a second conductive coating 42b are formed on the surface of the second member 42. The first conductive coating 42a is formed on the surface excluding the hollow portion 35, including the portion where the through hole 43 is formed. The second conductive coating 42b is formed on the surface of the portion where the hollow portion 35 is formed. The first conductive coating 42a and the second conductive coating 42b are spaced apart from each other to ensure insulation. Therefore, in the probe holder 4 formed by laminating the first member 41 and the second member 42, a conductive coating is present at the boundaries between the members and on the outer surface.

[0092] Hollow portion 35 is formed by aligning the axes of through holes formed in first member 41 and second member 42. Second conductive coatings 41b, 42b are formed on the inner circumferential surface of hollow portion 35, forming a conductive inner circumferential surface.

[0093] The through-hole 43 is a through-hole whose opening in a direction perpendicular to the penetration direction is circular and whose central axis is positioned in a stepped shape with different positions in parts. Specifically, the through-hole 43 has a first hole 43a formed on one surface side of the probe holder 4 (the side from which the first plunger 21 extends in FIG. 11), a second hole 43b formed on the other surface side (the side from which the second plunger 22 extends in FIG. 11), and a third hole 43c provided between the first hole 43a and the second hole 43b. The opening diameters of the first hole 43a, the second hole 43b, and the third hole 43c are the same. In addition, the central axis N of the first hole 43a and the second hole 43b is T1 , N T2 and the central axis N of the third hole portion 43c T3 The positions of adjacent holes are different from each other within the range where the adjacent holes communicate with each other. First conductive films 41a, 42a are formed on the inner peripheral surface of through-hole 43, forming a conductive inner peripheral surface.

[0094] The through holes 43 form a stepped cylindrical hollow space, and a plurality of through holes 43 are formed around the signal probe 2 A. For example, as in the first embodiment, eight through holes 43 are formed around one signal probe 2 A.

[0095] In the above-described third embodiment, the through holes 43 are arranged around the signal probe 2A, and the signal probe 2A is connected to an external ground via the ground probe 2B. As a result, according to the third embodiment, the characteristic impedance of the tip and base ends of the signal probe 2A can be adjusted by the through holes 43 that are indirectly connected to the external ground. According to the third embodiment, the overall characteristic impedance including the end of the signal probe 2A can be adjusted. Furthermore, according to the third embodiment, by adjusting the position of the through holes, the ground position in the direction perpendicular to the axial direction with respect to the signal probe 2A can be adjusted.

[0096] Furthermore, in the third embodiment, the positions of the central axes of the through holes 43 are made to differ partially from each other, so that the characteristic impedance can be adjusted in accordance with the shape of the signal probe 2A.

[0097] The above-described first to third embodiments and their modifications can be combined as appropriate. Furthermore, the configuration of each contact probe can be individually selected from the arrangement or shape of the through holes of the first to third embodiments and modifications.

[0098] The contact probe configuration described here is merely an example, and various types of conventionally known probes can be applied. For example, the contact probe is not limited to the above-described one configured with a plunger and a coil spring, but may be a probe including a pipe member, a pogo pin, a solid conductive member, a conductive pipe, a wire probe that obtains a load by bending a wire into a bow shape, a connection terminal (connector) that connects electrical contacts, or an appropriate combination of these probes.

[0099] Furthermore, the probe holders according to the above-mentioned first to third embodiments and their modified examples have been described as being constructed by stacking four or two members, or by one member, but they may also be constructed by stacking three members or five or more members.

[0100] Furthermore, in the above-described first to third embodiments and their modifications, the conductive film may be formed in a pattern partially rather than entirely on the surface of the member of the probe holder 3, as long as it can electrically connect the through-hole and the grounding probe 2B. For example, the conductive film may be formed on the portion constituting the through-hole and on the outer surface of the member constituting the open end of the through-hole (for example, the third member 33 and the fourth member 34 shown in FIG. 1). In this case, the conductive film is electrically connected to the grounding probe 2B at least during testing.

[0101] As such, the present invention may include various embodiments not described here, and various design changes may be made within the scope of the technical idea specified by the claims. [Industrial Applicability]

[0102] As described above, the probe unit according to the present invention is suitable for adjusting the characteristic impedance of the entire contact probe. [Explanation of symbols]

[0103] 1 probe unit 2A Contact Probe (Signal Probe) 2B Contact Probe (Ground Probe) 3, 3A, 3B Probe Holder 3a, 31a to 34a, 41a, 42a First conductive film 3b, 31b~34b, 41b, 42b Second conductive film 21 First plunger 22 Second plunger 23 Spring member 23a Closely wound part 23b Coarse winding section 31, 41 First member 32, 42 Second member 33 Third member 34 Fourth member 35, 36 Hollow part 37, 37A, 37B, 38, 43 through holes 100 Semiconductor Integrated Circuit 101, 102, 201, 202 electrode 200 Circuit Boards

Claims

1. a first contact probe; a second contact probe; a probe holder; Equipped with a through hole provided around the first contact probe is formed in the probe holder; a conductive portion provided on a surface of the probe holder and electrically connecting the through hole and the second contact probe; A probe unit characterized by:

2. The through hole has an opening having a circular shape in a direction perpendicular to the penetration direction. The probe unit according to claim 1 .

3. a plurality of through holes are formed around the first contact probe; At least some of the through holes have a circular diameter different from a circular diameter of the opening of the other through holes. The probe unit according to claim 2 .

4. each through hole is at the same distance from the axis of the first contact probe; The probe unit according to claim 3 .

5. a distance of each through hole from the axis of the first contact probe varies depending on the diameter of the circle; The probe unit according to claim 3 .

6. The through-hole has an opening having an oval shape in a direction perpendicular to the penetration direction. The probe unit according to claim 1 .

7. The through hole has a stepped hole shape with a diameter that varies partially. The probe unit according to claim 1 .

8. The through holes have stepped hole shapes with central axes positioned at different positions from each other. The probe unit according to claim 1 .

9. the probe holder is formed by stacking a plurality of members in a penetrating direction of a first hollow portion through which the first contact probe is inserted and held; The probe unit according to claim 1 .

10. the through holes are formed by through holes formed in the plurality of members, In at least one member, the through hole has a stepped hole shape in which the diameter of the through hole is partially different. The probe unit according to claim 9 .

11. the through holes are formed by through holes formed in the plurality of members, In at least one member, the through holes have stepped hole shapes in which the positions of the central axes are different from each other. The probe unit according to claim 9 .

12. The plurality of members each have a through hole formed therein, The through holes are formed in adjacent members in the stacking direction of the members so that at least a portion of the through holes overlaps with each other when viewed from the penetration direction of the through holes. The probe unit according to claim 9 .

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