Semiconductor device handling equipment and semiconductor device test equipment

Abstract

To provide semiconductor device handling equipment capable of controlling the deformation of a probe needle in a probe card with high accuracy.SOLUTION: Semiconductor device handling equipment 30 for handling a DUT100 includes: a first movement device 41 for moving the DUT100 to contact the pad 110 of the DUT100 to a probe needle 22 of a probe card 20 and press the DUT100 to the probe card 20; and acquisition devices 50 and 71 for acquiring a first state of the probe needle 22 deformed by the pressing of the first movement device 41.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a semiconductor device handling apparatus that handles semiconductor devices under test (DUTs), such as dies formed by dicing a semiconductor wafer, in order to test the DUTs, and a semiconductor device testing apparatus that includes the semiconductor device handling apparatus. [Background technology]

[0002] An electronic device testing apparatus is known that tests the electrical characteristics of electronic circuits built into bare dies (bare chips) after dicing a semiconductor wafer (see, for example, Patent Document 1). This electronic device testing apparatus includes a test head having a probe card and a handler that moves the bare die and presses it against the probe card. The handler includes an alignment unit that positions the bare die relative to the probe card and then presses pads of the bare die against contactors of the probe card. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-85203 Summary of the Invention [Problem to be solved by the invention]

[0004] In the above-mentioned electronic device test equipment, when the pads of the bare die are pressed against the contactors of the probe card, the contactors are deformed. If the contactor deformation is excessive, it may cause damage to the contactors and pads. One possible solution is to control the contactor deformation by adjusting the pressure stroke of the alignment unit. However, since the contactor deformation may be irregular relative to the pressure stroke, there is a problem in that the pressure stroke alone may not be enough to control the contactor deformation.

[0005] The problem to be solved by the present invention is to provide a semiconductor device handling apparatus and a semiconductor device testing apparatus that are capable of managing deformation of probe needles of a probe card with high precision. [Means for solving the problem]

[0006] [1] Aspect 1 of the present invention is a semiconductor device handling apparatus for handling a DUT, comprising: a first moving device that moves the DUT to bring the terminals of the DUT into contact with the probe needles of a probe card and presses the DUT against the probe card; and an acquisition device that acquires a first state, which is the state of the probe needles that have been deformed by the pressure of the first moving device.

[0007] [2] A second aspect of the present invention may be a semiconductor device handling apparatus according to the first aspect, wherein the acquisition device includes a first camera that captures an image of the probe needle.

[0008] [3] Aspect 3 of the present invention may be a semiconductor device handling device according to aspect 2, wherein the first camera captures an image of the probe needle along a first direction substantially parallel to a main surface of the probe card.

[0009] [4] A fourth aspect of the present invention may be a semiconductor device handling apparatus according to the second or third aspect, wherein the acquisition device is a semiconductor device handling apparatus equipped with a second moving device that moves the first camera.

[0010] [5] A fifth aspect of the present invention may be a semiconductor device handling apparatus according to the fourth aspect, wherein the first camera images the probe needle along a first direction substantially parallel to the main surface of the probe card, and the second moving device moves the first camera in a second direction, which is substantially parallel to the main surface of the probe card and intersects with the first direction.

[0011] [6] A sixth aspect of the present invention may be a semiconductor device handling apparatus according to the fifth aspect, wherein the second direction is substantially parallel to the main surface of the probe card and substantially perpendicular to the first direction.

[0012] [7] A seventh aspect of the present invention may be a semiconductor device handling apparatus according to any one of aspects four to six, wherein the second moving device moves the first camera along the outer periphery of the probe card.

[0013] [8] Aspect 8 of the present invention may be a semiconductor device handling apparatus according to any one of aspects 4 to 7, wherein the semiconductor device handling apparatus comprises a base having an opening into which the probe card is inserted, and the second moving device comprises a guide member provided on the base so as to surround the opening, and a moving part that supports the first camera and is movable on the guide member.

[0014] [9] A ninth aspect of the present invention may be a semiconductor device handling apparatus according to the first aspect, wherein the acquisition device includes a displacement sensor that irradiates the probe needle with laser light, and a second moving device that moves the displacement sensor.

[0015]

[10] A tenth aspect of the present invention may be a semiconductor device handling apparatus according to the ninth aspect, wherein the displacement sensor irradiates the laser light along a first direction substantially parallel to the main surface of the probe card, and the second moving device moves the displacement sensor along a second direction, the second direction being substantially parallel to the main surface of the probe card and intersecting the first direction.

[0016]

[11] Aspect 11 of the present invention may be a semiconductor device handling apparatus according to aspect 10, wherein the second direction is substantially parallel to the main surface of the probe card and substantially perpendicular to the first direction.

[0017]

[12] A twelfth aspect of the present invention may be a semiconductor device handling apparatus according to any one of aspects 9 to 11, wherein the second moving device moves the displacement sensor along the outer periphery of the probe card.

[0018]

[13] A thirteenth aspect of the present invention may be a semiconductor device handling apparatus according to any one of aspects 9 to 12, wherein the semiconductor device handling apparatus comprises a base having an opening into which the probe card is inserted, and the second moving device comprises a guide member provided on the base so as to surround the opening, and a moving part that supports the displacement sensor and is movable on the guide member.

[0019]

[14] A fourteenth aspect of the present invention may be a semiconductor device handling apparatus according to the first aspect, wherein the acquisition device includes a second camera that captures an image of the probe card along a third direction that is substantially perpendicular to the main surface of the probe card, and an optical axis changing device that changes the optical axis of the second camera to a first direction that is substantially parallel to the main surface of the probe card.

[0020]

[15] A fifteenth aspect of the present invention is a semiconductor device handling apparatus according to the fourteenth aspect, which comprises a position calculation device that calculates the relative position of the DUT with respect to the probe card, and a drive control device that controls the first moving device based on the relative position calculated by the position calculation device, and the position calculation device may calculate the relative position based on image information of the probe card captured by the second camera along the third direction.

[0021]

[16] Aspect 16 of the present invention may be a semiconductor device handling device according to any one of aspects 1 to 15, wherein the acquisition device acquires three-dimensional shape data of the probe needle viewed from one direction.

[0022]

[17] Aspect 17 of the present invention may be a semiconductor device handling apparatus according to any one of aspects 1 to 16, wherein the semiconductor device handling apparatus is equipped with a memory device that stores a second state, which is a normal state of the probe needle, and a determination device that determines whether the first state is normal or abnormal based on the first state and the second state.

[0023]

[18] Aspect 18 of the present invention may be a semiconductor device handling apparatus according to aspect 17, wherein the second state is a state in which the probe needle is not in contact with the terminal, or a state in which the probe needle is normally deformed.

[0024]

[19] A nineteenth aspect of the present invention may be a semiconductor device handling apparatus according to the seventeenth or eighteenth aspect, wherein the determination device includes a deformation amount calculation unit that calculates the deformation amount of the probe needle based on the first state and the second state, and the semiconductor device handling apparatus includes a determination unit that determines whether the first state is normal or abnormal based on the calculation result of the deformation amount calculation unit.

[0025]

[20] Aspect 20 of the present invention may be a semiconductor device handling device according to aspect 19, wherein the determination unit determines whether the first state is normal or abnormal by comparing the deformation amount calculated by the deformation amount calculation unit with a threshold value stored in the memory device.

[0026]

[21] Aspect 21 of the present invention may be a semiconductor device handling apparatus according to aspect 19 or 20, further comprising an alarm device that, when the determination device determines that the first state is abnormal, notifies that the deformation of the probe needle is abnormal.

[0027]

[22] Aspect 22 of the present invention may be a semiconductor device handling apparatus according to any one of aspects 1 to 21, wherein the acquisition device acquires a third state in which the terminal and the probe needle are separated from each other, and the semiconductor device handling apparatus is equipped with a parallelism calculation device that calculates the parallelism between the probe card and the DUT based on the third state.

[0028]

[23] Aspect 23 of the present invention may be a semiconductor device handling apparatus according to aspect 22, wherein the semiconductor device handling apparatus is equipped with a parallelism adjustment device that adjusts the parallelism between the probe card and the DUT based on the parallelism calculated by the parallelism calculation device.

[0029]

[24] Aspect 24 of the present invention is a semiconductor device handling apparatus according to any one of aspects 1 to 23, wherein the DUT may be a semiconductor device handling apparatus including a bare die alone, a 2.5D device intermediate having multiple bare dies arranged on a silicon interposer, or a 3D device intermediate having multiple bare dies stacked on top of each other.

[0030]

[25] Aspect 25 of the present invention may be a semiconductor device handling device in any one of aspects 1 to 24, wherein the first moving device presses the DUT against the probe card by lifting the DUT vertically upward.

[0031]

[26] A twenty-sixth aspect of the present invention is a semiconductor device test apparatus for testing a DUT, comprising: A semiconductor device testing apparatus includes the semiconductor device handling apparatus according to any one of aspects 1 to 25, the probe card, and a tester to which the probe card is electrically connected and which tests the DUT. [Effects of the Invention]

[0032] According to the present invention, the acquisition device acquires the first state, which is the state of the probe needle deformed by the pressure of the first moving device, so that the deformation of the probe needle can be managed with high precision. [Brief explanation of the drawings]

[0033] [Figure 1] FIG. 1 is a diagram showing the overall configuration of a semiconductor device testing apparatus and the internal structure of a handler according to an embodiment of the present invention. [Figure 2] FIG. 2 is an enlarged view showing part II in FIG. [Figure 3] FIG. 3 is a bottom view of the imaging unit according to the embodiment of the present invention, as viewed from below. [Figure 4] FIG. 4 is a block diagram showing a control system of a handler in an embodiment of the present invention. [Figure 5] FIG. 5 is a flowchart of a method for determining the deformation state of a probe needle according to an embodiment of the present invention. [Figure 6] FIG. 6 is a diagram showing an example of an image in a first state captured by a camera in the embodiment of the present invention. [Figure 7] FIG. 7 is a diagram showing an example of an image in the third state captured by a camera in the embodiment of the present invention. [Figure 8] FIG. 8 is a diagram showing a sensing unit according to another embodiment of the present invention, and corresponds to FIG. [Figure 9] FIG. 9 is a diagram showing an imaging unit according to still another embodiment of the present invention, and corresponds to FIG. DETAILED DESCRIPTION OF THE INVENTION

[0034] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0035] Fig. 1 is a diagram showing the overall configuration of a semiconductor device testing apparatus 1 and the internal structure of a handler 30 in this embodiment, and Fig. 2 is an enlarged view showing part II in Fig. 1. Fig. 3 is a bottom view of an imaging unit 50 in this embodiment as seen from below. Fig. 4 is a block diagram showing a control system for the handler 30 in this embodiment.

[0036] 1, the semiconductor device testing apparatus 1 includes a tester 10 that tests the DUT 100, a probe card 20 electrically connected to the tester 10, and a handler 30 that moves the DUT 100 and presses it against the probe card 20. The handler 30 corresponds to an example of a "semiconductor device handling apparatus" in accordance with an aspect of the present invention.

[0037] A specific example of the DUT 100 to be tested is a bare die (bare chip) formed by dicing a semiconductor wafer. The semiconductor device testing apparatus 1 tests the electrical characteristics of an electronic circuit built into this bare die 100. Note that the DUT 100 is not limited to a bare die alone, and may be, for example, a 2.5D device intermediate or a 3D device intermediate.

[0038] Here, the 2.5D device intermediate is a device intermediate that includes a silicon interposer and multiple bare dies arranged on the silicon interposer. This 2.5D device intermediate is, for example, mounted on a wiring board and packaged with a resin material to become a final product (i.e., a 2.5D device (2.5-dimensional device)).

[0039] On the other hand, a 3D device intermediate is a device intermediate that includes multiple bare dies stacked on top of each other and electrically connected by through-silicon vias (TSVs). Similar to the 2.5D device intermediate described above, this 3D device intermediate is also mounted on a wiring board and packaged with a resin material to become a final product (i.e., a 3D device (three-dimensional device)).

[0040] 1, the tester 10 includes a test head 11 and a main frame (tester body) 12. The test head 11 is connected to the main frame 12 via a cable. A probe card 20 is electrically connected to the test head 11. The probe card 20 is supported by a support mechanism 35 and enters the inside of the handler 30 through an opening 32 formed in an upper base 31 of the handler 30.

[0041] Although not shown, the support mechanism 35 includes a bridge beam to which the probe card 20 is fixed and an inclination adjustment device that adjusts the inclination of the probe card 20 via the bridge beam. The support mechanism 35 is supported by a column member (not shown) that is erected on the lower base 34. The inclination adjustment device of the support mechanism 35 adjusts the inclination of the probe card 20, thereby adjusting the parallelism between the probe card 20 and the DUT 100.

[0042] 2, the probe card 20 includes a substrate 21 and a plurality of probe needles 22. The substrate 21 is, for example, a printed circuit board (PCB). The plurality of probe needles 22 are provided on the underside of the substrate 21. The plurality of probe needles 22 are arranged on the underside of the substrate 21 in a manner corresponding to the arrangement of the plurality of pads 110 provided on the DUT 100. The pads 110 of the DUT 100 correspond to an example of a "terminal" in an aspect of the present invention.

[0043] The probe needle 22 is a needle-shaped member that is elastically deformable in the vertical direction (Z direction in the figure). The probe needle 22 is made of a conductive material such as a metal material. Although not particularly limited, in this embodiment, the probe needle 22 is a vertical type probe needle that has a straight shape that extends linearly in the vertical direction (Z direction in the figure).

[0044] Note that probe needle 22 is not limited to the above as long as it is elastically deformable in the pressing direction of DUT 100 against probe card 20 (Z direction in the figure). For example, probe needle 22 may have one or more bent portions, and the bent portions may have an arc shape. Probe needle 22 may also be a cantilever-type probe needle. In this case, probe needle 22 may have, for example, a shape inclined with respect to the plane direction of the main surface of substrate 21 or one or more bent portions.

[0045] As shown in FIGS. 1 and 2, the handler 30 includes an alignment unit 40, an imaging unit 50, a third camera 60, and a control device 70 (see FIG. 4).

[0046] The alignment unit 40 includes a first moving device 41 and a second camera 44. The first moving device 41 moves the DUT 100 relative to the probe card 20 and presses the DUT 100 against the probe card 20. The first moving device 41 includes a thermal chuck 42 and a moving mechanism 43.

[0047] The thermal chuck 42 is a member that holds the DUT 100 and adjusts the temperature of the DUT 100. The DUT 100, which has been transferred by a transfer device 36 (described later), is placed on an upper surface 421 of the thermal chuck 42. As shown in Fig. 2, a suction nozzle 422 opens on the upper surface 421 of the thermal chuck 42. The suction nozzle 422 is connected to a vacuum pump (not shown) via a flow path 423 formed in the thermal chuck 42, and is capable of suction-holding the DUT 100.

[0048] A flow path 424 through which a temperature-adjusting fluid can flow is formed inside the thermal chuck 42. Although not shown, a temperature adjustment device capable of supplying the temperature-adjusting fluid is connected to the flow path 424. For example, the flow path 424 is provided with a plurality of fins, enabling efficient heat exchange with the fluid. Note that the thermal chuck 42 may include a heater, a Peltier element, or the like, instead of the flow path 424. Alternatively, the thermal chuck 42 may include a heater, a Peltier element, or the like, in addition to the flow path 424.

[0049] The movement mechanism 43 is a device that moves the thermal chuck 42. The movement mechanism 43 includes an X-direction rail 431, an X-direction stage 432, a Y-direction rail 433, a Y-direction stage 434, a Z-direction rail 435, a Z-direction actuator 436, and a lifting block 437.

[0050] The X-direction rail 431 is provided on the lower base 34 of the handler 30 and extends along the X direction. The X-direction stage 432 is slidably held on the X-direction rail 431 and can be moved along the X direction by an actuator (not shown). The Y-direction rail 433 is provided on the X-direction stage 432 and extends along the Y direction. The Y-direction stage 434 is slidably held on the Y-direction rail 433 and can be moved along the Y direction by an actuator (not shown).

[0051] A Z-direction rail 435 is provided on the Y-direction stage 434 and extends along the Z direction. A lifting block 437 is slidably held on the Z-direction rail 435 and can be moved in the Z direction by a Z-direction actuator 436. A specific example of such a Z-direction actuator 436 is not particularly limited, but can be, for example, an electric motor equipped with a ball screw mechanism.

[0052] The thermal chuck 42 is fixed to a lifting block 437 and is movable together with the lifting block 437. As a result, the movement mechanism 43 is able to move the thermal chuck 42 in the X, Y, and Z directions. The lifting block 437 also has a rotation drive unit 438 that rotates the thermal chuck 42 around the Z axis.

[0053] The lifting block 427 may include a tilt adjustment unit that adjusts the tilt of the DUT 100 held by the thermal chuck 42. This tilt adjustment unit can cancel the relative tilt of the DUT 100 with respect to the probe card 20, thereby suppressing contact errors between the probe card 20 and the DUT 100. In particular, the effect of suppressing contact errors is significant in a 2.5D device intermediate or a 3D device intermediate having a stacked structure.

[0054] Furthermore, the lifting block 437 may include a height adjustment unit that adjusts the height of the DUT 100 held by the thermal chuck 42. This height adjustment unit can cancel the displacement of the DUT 100 in the height direction that occurs as a result of the adjustment of the tilt of the DUT 100 by the tilt adjustment unit, thereby further suppressing the occurrence of the contact errors.

[0055] The second camera 44 is a camera that captures an image of the probe card 20 from below. The second camera 44 is installed on the first moving device 41 so that its optical axis faces the +Z direction in the figure. Specific examples of the second camera 44 include a camera equipped with an imaging element such as a CCD or CMOS. When the first moving device 41 moves the second camera 44 below the probe card 20, the second camera 44 can capture an image of the probe card 20. As shown in FIG. 4, the second camera 44 is electrically connected to the control device 70 and can output captured image information to the control device 70.

[0056] 2 and 3, the imaging unit 50 includes a first camera 51 and a second moving device 52. The first camera 51 is a camera that captures images of the multiple probe needles 22 included in the probe card 20 from the side. The second moving device 52 is capable of moving the first camera 51 around the multiple probe needles 22 of the probe card 20. The imaging unit 50 and an image processing unit 71, which will be described later, correspond to an example of an "acquisition device" in this aspect of the present invention.

[0057] The first camera 51 is disposed so that its optical axis faces a first direction that is substantially parallel to the main surface (the XY plane in the figure) of the substrate 21 of the probe card 20. A specific example of the first camera 51 is a camera equipped with an imaging element such as a CCD or CMOS. As shown in FIG. 4, the first camera 51 is electrically connected to the control device 70, and is capable of outputting captured image information to the control device 70.

[0058] 2 and 3, the second moving device 52 includes a pair of guide rails 53 and a slide block 54. The guide rails 53 are installed on the lower surface of the upper base 31. The guide rails 53 extend in an annular shape so as to surround the opening 32 into which the probe card 20 is inserted. The slide block 54 is capable of sliding on the guide rails 53. The guide rails 53 correspond to an example of a "guide member" in this aspect of the present invention, and the slide block 54 corresponds to an example of a "moving unit" in this aspect of the present invention.

[0059] The first camera 51 is fixed to a slide block 54 of the second moving device 52. An actuator (not shown) moves the slide block 54 along a guide rail 53, causing the first camera 51 to move along the outer periphery of the probe card 20. During this movement, the first camera 51 continuously captures images of the outermost probe needles 22 among the multiple probe needles 22 included in the probe card 20. Note that the imaging unit 50 does not necessarily have to include the second moving device 52. In this case, the first camera 51 is installed on the underside of the upper base 31.

[0060] The moving direction (second direction) of the slide block 54 is substantially parallel to the main surface (XY plane in the figure) of the substrate 21 of the probe card 20, and is substantially perpendicular to the first direction (the direction of the optical axis of the first camera 51). Note that the moving direction of the slide block 54 is not particularly limited to the above, as long as it is substantially parallel to the main surface of the substrate 21 of the probe card 20 and intersects with the first direction.

[0061] As will be described later, this imaging unit 50 is used to check the actual deformation state of the probe needle 22 before starting normal operation (normal test process). For this purpose, the first camera 51 captures an image of the "first state." This "first state" is the state of the probe needle 22 that is deformed by the pressure of the first moving device 41 when the first moving device 41 of the alignment unit 40 presses the DUT 100 against the probe card 20.

[0062] As shown in FIG. 1, the third camera 60 is a camera that captures an image of the DUT 100 held by the thermal chuck 42 of the first moving device 41 from above. The third camera 60 is installed on the upper base 31 of the handler 30 so that its optical axis faces downward (the −Z direction in the figure). Specific examples of the third camera 60 include a camera equipped with an imaging element such as a CCD or CMOS. When the thermal chuck 42 holding the DUT 100 is moved below the third camera 60 by the first moving device 41, the third camera 60 captures an image of the DUT 100. As shown in FIG. 4, the third camera 60 is electrically connected to the control device 70 and is capable of outputting captured image information to the control device 70.

[0063] The control device 70 is configured, for example, by a computer. Although not particularly shown, this computer is an electronic calculator equipped with a CPU (processor), a main memory device (RAM, etc.), an auxiliary memory device (hard disk, SSD, etc.), an interface, etc. As shown in FIG. 4, this control device 70 functionally comprises an image processing unit 71, a position calculation unit 72, a drive control unit 73, a memory unit 74, a deformation amount calculation unit 75, a determination unit 76, and a notification unit 77. These functions 71 to 77 are functionally realized by the processor executing a program installed in the control device 70. Note that this control device 70 may be configured by a circuit board instead of a computer.

[0064] The image processing unit 71 performs image processing on the image information output from the first camera 51. The image processing unit 71 acquires three-dimensional shape data of the probe needles 22 viewed from one direction by using, for example, a focusing method (focus movement method). The first camera 51 captures images of the probe needles 22 while moving along the outer periphery of the probe card 20 by the second moving device 52, so the image processing unit 71 acquires shape data for all of the probe needles 22 located on the outermost periphery among the multiple probe needles 22 included in the probe card 20. Note that the image processing unit 71 may acquire two-dimensional shape data of the probe needles 22 instead of the three-dimensional shape data of the probe needles 22.

[0065] The image processing unit 71 also performs image processing on the image information output from the second camera 44 to detect the positions of the probe needles 22 of the probe card 20. The image processing unit 71 also performs image processing on the image information output from the third camera 60 to detect the positions of the pads 110 of the DUT 100 held by the thermal chuck 42.

[0066] The position calculation unit 72 calculates the amount of correction for the position of the DUT 100 relative to the probe card 20 based on the detection result of the image processing unit 71. Specifically, the position calculation unit 72 calculates the amount of relative deviation of the position of the pad 110 of the DUT 100 relative to the position of the probe needle 22 of the probe card 20 from the positions of the probe needle 22 and the pad 110 acquired by the image processing unit 71, and calculates the amount of position correction to cancel this amount of deviation. In other words, the position calculation unit 72 calculates the amount of position correction from the detection result of the image processing unit 71 to relatively match the position of the probe needle 22 of the probe card 20 with the position of the pad 110 of the DUT 100.

[0067] The drive control unit 73 controls the driving of the first moving device 41 of the alignment unit 40 and the second moving device 52 of the imaging unit 50. For example, the drive control unit 73 controls the driving of the first moving device 41 of the alignment unit 40 based on the position correction amount calculated by the position calculation unit 72. Furthermore, the drive control unit 73 controls the driving of the second moving device 52 of the imaging unit 50 so that the first camera 51 moves around the multiple probe needles 22 included in the probe card 20 when imaging the probe needles 22 with the first camera 51.

[0068] The storage unit 74 stores three-dimensional shape data of the "second state," which is the normal state of the probe needle. Although not particularly limited, for example, this "second state" is the state of the probe needle 22 not in contact with the pad 110 of the DUT 100. Note that this "second state" may also be the state of the probe needle 22 that is normally deformed by the pressure of the first moving device 41 when the first moving device 41 of the alignment unit 40 presses the DUT 100 against the probe card 20.

[0069] The three-dimensional shape data in this second state is set in advance based on the design information of probe needle 22 and stored in storage unit 74. Alternatively, the three-dimensional shape data in this second state may be acquired in advance by capturing an image of probe needle 22 with first camera 51 and stored in storage unit 74.

[0070] The deformation amount calculation unit 75 compares the shape data of the first state output from the image processing unit 71 with the shape data of the second state read from the memory unit 74 to calculate the deformation amount of the probe needles 22. Since the first camera 51 captures images of the probe needles 22 while moving along the outer periphery of the probe card 20 by the second moving device 52, the deformation amount calculation unit 75 calculates the deformation amount for all of the probe needles 22 located on the outermost periphery.

[0071] Determination unit 76 determines whether the first state is normal or abnormal based on the calculation result of deformation amount calculation unit 75. Specifically, determination unit 76 determines whether the first state is normal or abnormal by comparing the amount of deformation of probe needle 22 calculated by deformation amount calculation unit 75 with a predetermined threshold. The predetermined threshold is stored in advance in storage unit 74.

[0072] The notification unit 77 notifies the determination result of the determination unit 76. Specifically, when the determination unit 76 determines that the first state is abnormal, the notification unit 77 notifies, for example, an operator of the semiconductor device testing apparatus 1 via an output device included in the control device 70, that the deformation of the probe needles 22 is abnormal. The output device is, for example, a device that can output light or sound to the outside, and specifically may be a display, a warning light, a speaker, or the like. The notification unit 77 can notify the operator that the deformation of the probe needles 22 is abnormal by sound or light.

[0073] In order to test the DUT 100, the semiconductor device test apparatus 1 described above performs the following handling operations using the handler 30.

[0074] 1, the moving mechanism 43 moves the thermal chuck 42 so that the thermal chuck 42 is positioned below the opening 33 of the upper base 31 of the handler 30. Then, the transport device 36 picks up the untested DUT 100 from a tray (not shown) and transports the DUT 100 to the thermal chuck 42 through the opening 33. Once the transport device 36 places the DUT 100 on the thermal chuck 42, the thermal chuck 42 suction-holds the DUT 100.

[0075] A specific example of the transport device 36 is, but is not limited to, a pick-and-place device equipped with a suction pad. A specific example of the tray is, but is not limited to, a customer tray conforming to the Joint Electron Device Engineering Council (JEDEC) standard. A plate may be used instead of the tray. An example of such a plate is a buffer plate capable of holding the DUT 100. If the DUT 100 is a single die, the DUT 100 before testing may be held in a ring frame (wafer ring) instead of the tray or plate.

[0076] Next, as shown by the two-dot chain line in FIG. 1 , the moving mechanism 43 moves the thermal chuck 42 so that it faces the third camera 60 installed on the upper base 31 of the handler 30. The third camera 60 then captures an image of the DUT 100. Note that the probe card 20 has been previously captured by the second camera 44, and the positions of the probe needles 22 of the probe card 20 have been previously detected by the image processing unit 71 and stored in the memory unit 74. The timing for capturing the image of the probe card 20 by the second camera 44 is, for example, when the probe card 20 is replaced due to a change in the type of the DUT 100. The position calculation unit 72 calculates a position correction amount for the DUT 100 from these detection results. Then, based on the position correction amount, the moving mechanism 43 fine-tunes the position of the thermal chuck 42 holding the DUT 100, thereby positioning the DUT 100 relative to the probe card 20.

[0077] 1, the moving mechanism 43 moves the thermal chuck 42 so that the DUT 100 faces the probe card 20. The moving mechanism 43 then raises the thermal chuck 42, bringing the pads 110 into contact with the probe needles 22. The moving mechanism 43 is then raised by a predetermined stroke amount to press the DUT 100 against the probe card 20, thereby electrically connecting the DUT 100 and the probe card 20.

[0078] Next, the tester 10 inputs an electrical signal to the DUT 100 via the probe card 20. Then, based on the electrical signal output from the DUT 100 via the probe card 20, the tester 10 determines whether the DUT 100 is good or bad and its characteristics.

[0079] In this embodiment, before starting normal operation (normal test process) of the semiconductor device test apparatus 1 described above, a determination operation is performed to determine the state of the probe needles 22 that have been deformed by the pressure of the first moving device 41. Although not particularly limited, this determination operation is performed, for example, at the start of work or when the probe card 20 is replaced. Hereinafter, a method for determining the deformation state of the probe needles 22 will be described with reference to FIGS. 5 and 6.

[0080] FIG. 5 is a flowchart of a method for determining the deformation state of probe needle 22 in this embodiment, and FIG. 6 is a diagram showing an example of an image captured by first camera 51 in step S12 of FIG.

[0081] 5, in the same manner as described above, the first moving device 41 moves the DUT 100 below the probe card 20 to face the probe card 20. Then, the first moving device 41 raises the DU 100, brings the pads 110 into contact with the probe needles 22, and presses the DUT 100 against the probe card 20. At this time, the alignment unit 40 presses the DUT 100 against the probe card 20 by a preset stroke amount. The pressure of the first moving device 41 deforms the probe needles 22.

[0082] 5, the drive control section 73 of the control device 70 drives and controls the imaging unit 50, and the first camera 51 captures an image of the probe needle 22 from the side while the second moving device 52 moves the first camera 51 along the outer periphery of the probe card 20. At this time, the probe needle 22 is deformed by the pressure of the first moving device 41, so the first camera 51 captures an image of the "first state."

[0083] 5, the image processing unit 71 performs image processing on the image information output from the first camera 51 to obtain three-dimensional shape data in the first state. Since the first camera 51 images the probe needles 22 while moving along the outer periphery of the probe card 20 by the second moving device 52, in this step S13, the image processing unit 71 obtains shape data in the first state for all the probe needles 22 located on the outermost periphery and imaged by the first camera 51.

[0084] 5, the deformation amount calculation unit 75 compares the shape data in the first state output from the image processing unit 71 with the shape data in the second state read from the storage unit 74 to calculate the deformation amount of the probe needles 22. In this step S14, the deformation amount calculation unit 75 calculates the deformation amount for all of the probe needles 22 located on the outermost periphery.

[0085] 5, the determination unit 76 determines whether the first state is normal or abnormal by comparing the amount of deformation of the probe needles 22 calculated by the deformation amount calculation unit 75 with the threshold value read from the storage unit 74. In this step S15, the determination unit 76 determines the deformation states of all the probe needles 22 located on the outermost periphery.

[0086] For example, Fig. 6 shows an example of an image of the first state captured by first camera 51 in step S12 of Fig. 5. In the example shown in Fig. 6, central probe needle 22A is excessively deformed by the pressure of first moving device 41, and the amount of deformation of probe needle 22A compared to the second state is δ. In the example shown in Fig. 6, the amount of deformation δ of central probe needle 22A is greater than a predetermined threshold Th (δ > Th), so determination unit 76 determines that the deformation state of probe needle 22A is abnormal. Note that for convenience, Fig. 6 shows only central probe needle 22A as being deformed, but in reality, normal deformation has occurred in the four probe needles 22B other than central probe needle 22A, and the amounts of deformation are equal to or less than threshold Th.

[0087] If the first state in which the deformation state of probe needle 22 is determined to be abnormal in step S15 above exists (NO in step S15), in step S16 of Fig. 5, notification unit 77 notifies the operator of semiconductor device testing apparatus 1 that the deformation of probe needle 22 is abnormal. The operator, for example, adjusts the stroke amount based on this notification, and then performs steps S11 to S15 of Fig. 5 again.

[0088] On the other hand, if the first state in which the deformation state of the probe needles 22 is determined to be abnormal does not exist in step S15 above (i.e., if the deformation state of all the probe needles 22 located on the outermost periphery is determined to be normal) (YES in step S15), proceed to step S17 in Figure 5 and start normal operation of the semiconductor device testing apparatus 1 described above.

[0089] As described above, in this embodiment, the imaging unit 50 acquires the first state, which is the state of the probe needle 22 that is deformed by the pressure of the first moving device 41, so that the deformation of the probe needle 22 can be managed with high accuracy.

[0090] When the DUT is a bare die, a 2.5D device intermediate, or a 3D device intermediate, higher precision is required in controlling the pressure of the DUT against the probe card compared to a packaged device. In contrast, this embodiment can manage the deformation of the probe needles 22 with high precision, which is particularly effective when the DUT 100 is a bare die, a 2.5D device intermediate, or a 3D device intermediate.

[0091] Furthermore, in this embodiment, the judgment unit 76 judges whether the deformation state of the probe needle 22 is normal or abnormal, and if the deformation state of the probe needle 22 is abnormal, the notification unit 77 notifies the operator of this, so that the test of the DUT 100 can be carried out stably without damaging the probe needle 22 or the DUT 100.

[0092] In the above-described determination process, in addition to determining the deformation state of the probe needles 22, adjustment of the parallelism between the probe card 20 and the DUT 100, which will be described below, may also be performed.

[0093] In this case, the first camera 51 of the imaging unit 50 captures an image of the "third state." This "third state" refers to the state of the pads 110 and the probe needles 22 that are separated from each other, specifically, the state of the pads 110 of the DUT 100 and the probe needles 22 of the probe card 20 just before they come into contact with each other as the first moving device 41 is raised.

[0094] 4, the control device 70 includes a parallelism calculation unit 78 that calculates the parallelism between the probe card 20 and the DUT 100 based on the third state. Similar to the above-described functions 71 to 77, the parallelism calculation unit 78 is also functionally realized by the processor executing a program installed in the control device 70.

[0095] 5, immediately before the pad 110 comes into contact with the probe needle 22 as the first moving device 41 is raised, the first camera 51 captures images of the probe needle 22 and the pad 110 from the side, while the second moving device 52 moves the first camera 51 along the outer periphery of the probe card 20. At this time, the pad 110 and the probe needle 22 are separated from each other, so the first camera 51 captures an image of the "third state."

[0096] Next, the image processing unit 71 performs image processing on the image information output from the first camera 51 to obtain three-dimensional shape data in the third state. The first camera 51 captures images of the probe needles 22 and pads 110 while moving along the outer periphery of the probe card 20 by the second moving device 52, so the image processing unit 71 obtains shape data in the third state for all the probe needles 22 and pads 110 located on the outermost periphery.

[0097] Next, the parallelism calculation unit 78 included in the control device 70 calculates the parallelism between the probe card 20 and the DUT 100 based on the shape data in the third state. Fig. 7 is a diagram showing an example of an image in the third state captured by the first camera 51 in this embodiment.

[0098] 7, the parallelism calculation unit 78 first obtains a first imaginary plane VP1 and a second imaginary plane VP2 from the shape data in the third state. Here, the first imaginary plane VP1 is an imaginary plane to which the tips of all of the probe needles 22 located on the outermost periphery among the plurality of probe needles 22 included in the probe card 20 are added. On the other hand, the second imaginary plane VP2 is an imaginary plane that passes through the top surfaces of all of the pads 110 located on the outermost periphery among the plurality of pads 110 included in the DUT 100. The parallelism calculation unit 78 calculates the intersection angle θ between the first imaginary plane VP1 and the second imaginary plane VP2 as the parallelism between the probe card 20 and the DUT 100.

[0099] Then, based on this parallelism, the support mechanism 35 adjusts the inclination of the probe card 20 so that the probe card 20 is parallel to the DUT 100. After that, the first moving device 41 raises the DU 100, brings the pads 110 into contact with the probe needles 22, presses the DUT 100 against the probe card 20, and performs the operations from step S12 onwards in FIG.

[0100] 8, the handler 30 may be provided with a sensing unit 50B instead of the imaging unit 50. This sensing unit 50B is provided with a displacement sensor 51B instead of the first camera 51. Furthermore, this sensing unit 50B is provided with the above-mentioned second moving device 52 in addition to the displacement sensor 51B. FIG. 8 is a diagram showing a sensing unit 50B in another embodiment of the present invention, and is a diagram corresponding to FIG. 2.

[0101] Displacement sensor 51B is, for example, a laser displacement sensor that irradiates probe needles 22 with a strip-shaped (line-shaped) laser light and receives the laser light reflected by probe needles 22. Displacement sensor 51B is disposed so as to irradiate laser light along a first direction that is substantially parallel to the main surface (XY plane in the drawing) of substrate 21 of probe card 20. Displacement sensor 51B is fixed to slide block 54 of second moving device 52 and is capable of moving along the outer periphery of probe card 20.

[0102] The moving direction (second direction) of the slide block 54 is substantially parallel to the main surface (XY plane in the figure) of the substrate 21 of the probe card 20 and is substantially perpendicular to the first direction (the direction of laser light irradiation of the displacement sensor 51B). Note that the moving direction of the slide block 54 is not particularly limited to the above, as long as it is substantially parallel to the main surface of the substrate 21 of the probe card 20 and intersects with the first direction.

[0103] This displacement sensor 51B obtains three-dimensional shape data of probe needle 22 viewed from one direction, for example, by using an optical cutting method, and outputs the shape data to control device 70. In control device 70, in the same manner as described above, deformation amount calculation unit 75 calculates the amount of deformation of probe needle 22 based on this shape data, determination unit 76 determines whether the first state is normal or abnormal based on this deformation amount, and if the first state is abnormal, notification unit 77 notifies that fact.

[0104] Alternatively, as shown in Fig. 9, imaging unit 50C may use second camera 44 of alignment unit 40 instead of first camera 51, and may include mirror 55 instead of second moving device 52. Fig. 9 is a diagram showing imaging unit 50C according to yet another embodiment of the present invention, and corresponds to Fig. 2. This mirror 55 corresponds to an example of the "optical axis changing device" according to this aspect of the present invention.

[0105] Specifically, the mirror 55 is supported by a support member 56, which is fixed to the upper base 31 of the handler 30. The mirror 55 changes the optical axis of the second camera 44, which is directed in the +Z direction in the drawing, to a first direction that is substantially parallel to the main surface of the substrate 21 of the probe card 20 (the XY plane in the drawing).

[0106] This second camera 44 captures an image of the multiple probe needles 22 provided on the probe card 20 from the side via the mirror 55. Image information captured by this second camera 44 is output to the control device 70. In the control device 70, in the same manner as described above, the image processing unit 71 acquires three-dimensional shape data of the probe needles 22 viewed from one direction based on this image information, the deformation amount calculation unit 75 calculates the amount of deformation of the probe needles 22 based on this shape data, the determination unit 76 determines whether the first state is normal or abnormal based on this deformation amount, and if the first state is abnormal, the notification unit 77 notifies that fact.

[0107] In this way, the imaging unit 50C uses the second camera 44 instead of the first camera 51 and is provided with a mirror 55 instead of the second moving device 52, thereby simplifying the structure of the imaging unit 50C.

[0108] It should be noted that the above-described embodiments have been described to facilitate understanding of the present invention, and are not intended to limit the present invention. Therefore, the elements disclosed in the above embodiments are intended to include all design modifications and equivalents that fall within the technical scope of the present invention.

[0109] For example, in the above-described embodiment, the semiconductor device testing apparatus 1 tests one DUT 100 at a time, but the number of DUTs 100 tested simultaneously by the semiconductor device testing apparatus 1 is not particularly limited to the above, and the semiconductor device testing apparatus 1 may test multiple DUTs 100 simultaneously.

[0110] Furthermore, although the above-described semiconductor device testing apparatus 1 is equipped with a so-called die-level handler for testing bare dies, the type of semiconductor device testing apparatus is not particularly limited to this, as long as it is a semiconductor device testing apparatus equipped with a probe card. Specifically, the semiconductor device testing apparatus 1 may be one for so-called back-end processes, and as one example, it may be a semiconductor device testing apparatus equipped with a TAB handler. [Explanation of symbols]

[0111] 1...Semiconductor device testing equipment 10...Tester 20...Probe card 22...Probe needle 30...Handler 31...Upper Base 32,33…Aperture 40...Alignment unit 41...First moving device 42...Thermal chuck 43...Movement mechanism 44...Second camera 50, 50C...imaging unit 50B...Sensing unit 51...First camera 51B...Displacement sensor 52...Second mobile device 53...Guide rail 54...Slide block 55...Mirror 56...Support member 60...Third camera 70...Control device 71...Image processing unit 72...Position calculation section 73...Drive control unit 74...Storage section 75...Deformation amount calculation unit 76…Judgment section 77…Information Department 78...Parallelism calculation unit 100...DUT

Claims

1. A semiconductor device handling apparatus for handling a DUT, comprising: a first moving device that moves the DUT to bring terminals of the DUT into contact with probe needles of a probe card and presses the DUT against the probe card; an acquisition device that acquires a first state, which is a state of the probe needle that is deformed by the pressure of the first moving device.

2. 2. The semiconductor device handling apparatus according to claim 1, The acquisition device is a semiconductor device handling device including a first camera for capturing an image of the probe needle.

3. 3. The semiconductor device handling apparatus according to claim 2, The first camera captures an image of the probe needle along a first direction substantially parallel to a main surface of the probe card.

4. 3. The semiconductor device handling apparatus according to claim 2, The semiconductor device handling apparatus includes a second moving device that moves the first camera.

5. 5. The semiconductor device handling apparatus according to claim 4, the first camera captures an image of the probe needle along a first direction substantially parallel to a main surface of the probe card; the second moving device moves the first camera in a second direction; The second direction is substantially parallel to the main surface of the probe card and intersects with the first direction.

6. 5. The semiconductor device handling apparatus according to claim 4, the semiconductor device handling apparatus includes a base having an opening into which the probe card is inserted; the second mobile device a guide member provided on the base so as to surround the opening; a moving section that supports the first camera and is movable on the guide member.

7. 2. The semiconductor device handling apparatus according to claim 1, The acquisition device a displacement sensor that irradiates the probe needle with laser light; a second moving device that moves the displacement sensor.

8. 8. The semiconductor device handling apparatus according to claim 7, the displacement sensor irradiates the laser light along a first direction substantially parallel to a main surface of the probe card; the second moving device moves the displacement sensor along a second direction; The second direction is substantially parallel to the main surface of the probe card and intersects with the first direction.

9. 8. The semiconductor device handling apparatus according to claim 7, the semiconductor device handling apparatus includes a base having an opening into which the probe card is inserted; the second mobile device a guide member provided on the base so as to surround the opening; a moving section that supports the displacement sensor and is movable on the guide member.

10. 2. The semiconductor device handling apparatus according to claim 1, The acquisition device a second camera that images the probe card along a third direction that is substantially perpendicular to a main surface of the probe card; an optical axis changing device that changes the optical axis of the second camera to a first direction that is substantially parallel to the main surface of the probe card.

11. 2. The semiconductor device handling apparatus according to claim 1, The acquisition device is a semiconductor device handling device that acquires three-dimensional shape data of the probe needle viewed from one direction.

12. 2. The semiconductor device handling apparatus according to claim 1, The semiconductor device handling apparatus includes: a storage device that stores a second state, which is a normal state of the probe needle; a determination device that determines whether the first state is normal or abnormal based on the first state and the second state.

13. 13. The semiconductor device handling apparatus of claim 12, The determination device a deformation amount calculation unit that calculates a deformation amount of the probe needle based on the first state and the second state; The semiconductor device handling apparatus includes a determination unit that determines whether the first state is normal or abnormal based on the calculation result of the deformation amount calculation unit.

14. 14. The semiconductor device handling apparatus of claim 13, The semiconductor device handling apparatus further comprises an alarm device that, when the determination device determines that the first state is abnormal, issues an alarm that the deformation of the probe needle is abnormal.

15. 2. The semiconductor device handling apparatus according to claim 1, the acquisition device acquires a third state, which is a state of the terminal and the probe needle being separated from each other; The semiconductor device handling apparatus includes a parallelism calculation unit that calculates the parallelism between the probe card and the DUT based on the third state.

16. A semiconductor device test apparatus for testing a DUT, comprising: A semiconductor device handling apparatus according to any one of claims 1 to 15, the probe card; a tester to which the probe card is electrically connected and which tests the DUT.

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