Stage unit and processing system

Abstract

To provide a technique advantageous for moving a stage on which an electronic component is placed.SOLUTION: A stage moving mechanism 13 for moving a stage 12 with respect to a base 11 comprises: a first direction driving unit having a first direction driving source 20 and a first direction movable portion 21 that is moved in a first direction dX together with the stage by a driving force output from the first direction driving source; a second direction driving unit having a second direction driving source 30 and a second direction movable portion 31 that is moved in a second direction together with the stage by a driving force output from the second direction driving source; a first direction guide unit 15 that allows the stage to move in the first direction with respect to the base; and a second direction guide unit 16 that allows the stage to move in the second direction with respect to the base.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a stage unit on which electronic components are placed, and a processing system including such a stage unit. [Background technology]

[0002] In order to perform processes such as inspection of electronic components with high accuracy, the positions of the electronic components are adjusted.

[0003] For example, Patent Document 1 discloses a device for adjusting the positioning between a mounting surface and an electronic component to be mounted on the mounting surface. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2019-120564 Summary of the Invention [Problem to be solved by the invention]

[0005] To adjust the position of the electronic component, a stage unit can be used that moves a stage on which the electronic component is placed in the X and Y directions.

[0006] Such a stage unit includes, for example, a drive source (X-axis motor) for moving the stage in the X direction, and a drive source (Y-axis motor) for moving the stage in the Y direction. In this case, when moving the stage in the X direction, it may be necessary to move the Y-axis motor together with the stage in the X direction, and when moving the stage in the Y direction, it may be necessary to move the X-axis motor together with the stage in the Y direction.

[0007] The X-axis motor and the Y-axis motor usually have a certain size and weight. Therefore, it may not be desirable to move the entire X-axis motor and the Y-axis motor in accordance with the movement of the stage. For example, when moving the stage to adjust the position of an electronic component, the inertia acting on the entire moving part increases when the motors move together with the stage, making it difficult to increase the speed and accuracy of the stage movement.

[0008] An object of the present disclosure is to provide a technique that is advantageous for moving a stage on which an electronic component is placed. [Means for solving the problem]

[0009] One aspect of the present disclosure relates to a stage unit comprising: a base; a stage on which an electronic component is placed; and a stage movement mechanism that moves the stage relative to the base, wherein the stage movement mechanism includes a first-direction drive unit having a first-direction drive source and a first-direction movable part that is moved together with the stage in the first direction by a drive force output from the first-direction drive source; a second-direction drive unit having a second-direction drive source and a second-direction movable part that is moved together with the stage in the second direction by a drive force output from the second-direction drive source; a first-direction guide unit attached to the base and the stage and positioned between one of the base and the stage and the second-direction movable part, the first-direction guide unit allowing movement of the stage in the first direction relative to the base; and a second-direction guide unit attached to the base and the stage and positioned between one of the base and the stage and the first-direction movable part, the second-direction guide unit allowing movement of the stage in the second direction relative to the base.

[0010] The first direction and the second direction may be perpendicular to each other.

[0011] The first direction movable part may be attached to the stage via a second direction guide unit, and the second direction movable part may be attached to the stage via the first direction guide unit.

[0012] The first direction drive source and the second direction drive source may be fixedly supported by a base.

[0013] Another aspect of the present disclosure relates to a processing system including the above-mentioned stage unit, a mounting device that places electronic components on the stage, an imaging device that acquires image data of the electronic components before they are placed on the stage, and a control unit that controls a stage movement mechanism based on the image data, wherein the control unit adjusts the position of the stage by controlling the stage movement mechanism based on status information that indicates the status of the electronic components obtained by analyzing the image data.

[0014] The status information may include position information indicating a deviation of the position of the electronic component from a reference position.

[0015] The processing system may include an inspection device that inspects the electronic components placed on the stage. [Effects of the Invention]

[0016] The present disclosure is advantageous in moving a stage on which an electronic component is placed. [Brief explanation of the drawings]

[0017] [Figure 1] FIG. 1 is a perspective view showing an example of a stage unit. [Figure 2] FIG. 2 is a diagram illustrating a schematic configuration of an example of a processing system. [Figure 3] FIG. 3 is a flowchart showing an example of processing in the processing system. DETAILED DESCRIPTION OF THE INVENTION

[0018] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings.

[0019] FIG. 1 is a perspective view showing an example of a stage unit 10. As shown in FIG.

[0020] The stage unit 10 includes a base 11 , a stage 12 on which an electronic component is placed, and a stage moving mechanism 13 that moves the stage 12 relative to the base 11 .

[0021] 1 has an upper base portion 11a located relatively higher and extending horizontally (X direction dX and Y direction dY), a lower base portion 11c located relatively lower and extending horizontally, and two side base portions 11b extending in the height direction (vertical direction) between the upper base portion 11a and the side base portion 11b. The horizontal direction and the height direction form a right angle with each other.

[0022] One side base portion 11b is connected and fixed to one end of the upper base portion 11a in the X-direction dX and one end of the lower base portion 11c in the X-direction dX. The other side base portion 11b is connected and fixed to the other end of the upper base portion 11a in the X-direction dX and the other end of the lower base portion 11c in the X-direction dX. Therefore, the base 11 has an inner space surrounded by the upper base portion 11a, the side base portion 11b, and the lower base portion 11c.

[0023] The stage 12 is provided so as to be movable in both the X direction (first direction) dX and the Y direction (second direction) dY by a stage moving mechanism 13. In this embodiment, in order to arrange electronic components placed on the stage 12 at desired positions suitable for inspection of the electronic components by the inspection device 61, the X direction position and the Y direction position of the stage 12 can be adjusted for each electronic component by the stage moving mechanism 13.

[0024] In this embodiment, one target electronic component is transported from upstream by a mounting device (see reference numeral "46" in FIG. 2) and placed on stage 12, and after being inspected by inspection device 61 on stage 12, is transported downstream from stage 12 by the mounting device. This series of processes is performed consecutively for multiple target electronic components. In other words, immediately after the preceding electronic component has been inspected and transported from stage 12, the next electronic component transported from upstream is placed on stage 12 and inspected.

[0025] The inspection device 61 is capable of performing desired inspections of the electronic components on the stage 12 and is capable of performing any desired device configuration and processing. In FIG. 1 , the inspection device 61 is provided above the stage 12, but the installation position and installation form of the inspection device 61 are not limited, and it may be provided, for example, on the stage support part 41. The inspection device 61 may, for example, capture and acquire images of the electronic components on the stage 12 and analyze the images to inspect for abnormalities that can be discerned from the appearance of the electronic components (e.g., cracks or chips in the electronic components). The inspection device 61 may also contact the electronic components on the stage 12 and inspect for abnormalities in the electrical performance of the electronic components by, for example, passing a current through the electronic components on the stage 12 and measuring a state quantity of the electronic components related to the current (e.g., a voltage value).

[0026] The stage moving mechanism 13 of this embodiment can move the stage 12 two-dimensionally in the horizontal direction to place the stage 12 at a desired horizontal position. Specifically, the stage moving mechanism 13 can move the stage 12 linearly by a desired distance along each of the X direction dX and the Y direction dY that are perpendicular to each other.

[0027] The stage movement mechanism 13 shown in FIG. 1 includes X-direction drive units (first direction drive units) 20-25, Y-direction drive units (second direction drive units) 30-35, a stage X-axis guide unit (first direction guide unit) 15, and a stage Y-axis guide unit (second direction guide unit) 16.

[0028] The X-direction drive unit has an X-axis drive motor (first direction drive source) 20 and an X-axis movable table (first direction movable part) 21 that is moved in the X direction dX together with the stage 12 by the driving force output from the X-axis drive motor 20.

[0029] The Y-direction drive unit has a Y-axis drive motor (second-direction drive source) 30 and a Y-axis movable table (second-direction movable part) 31 that is moved in the Y direction dY together with the stage 12 by the driving force output from the Y-axis drive motor 30.

[0030] The X-axis drive motor 20 and the Y-axis drive motor 30 are fixedly supported by the base 11, and even if the stage 12 is moved horizontally by the stage movement mechanism 13, the X-axis drive motor 20 and the Y-axis drive motor 30 do not move horizontally.

[0031] In the example shown in FIG. 1, the X-axis drive motor body 20b of the X-axis drive motor 20 is disposed in the inner space of the base 11 and is fixedly supported by the upper base portion 11a. The X-axis drive motor shaft 20a of the X-axis drive motor 20 protrudes upward from the X-axis drive motor body 20b and extends in the height direction so as to pass through a through-hole (first through-hole) in the upper base portion 11a. Similarly, the Y-axis drive motor body 30b of the Y-axis drive motor 30 is disposed in the inner space of the base 11 and is fixedly supported by the upper base portion 11a. The Y-axis drive motor shaft 30a of the Y-axis drive motor 30 protrudes upward from the Y-axis drive motor body 30b and extends in the height direction so as to pass through a through-hole (second through-hole) in the upper base portion 11a.

[0032] The X-axis drive motor 20 and the Y-axis drive motor 30 are configured to be able to rotate the motor shafts 20a, 30a by a desired amount under the control of a control unit (see reference numeral 50 in FIG. 2 described below), as will be described later. The specific configuration of the X-axis drive motor 20 and the Y-axis drive motor 30 is not limited, and the X-axis drive motor 20 and the Y-axis drive motor 30 may be configured by servo motors, for example.

[0033] An X-axis drive cam 22 is attached to the tip end of the X-axis drive motor shaft 20a (particularly, a portion located above the upper base portion 11a). The X-axis drive cam 22 rotates integrally with the X-axis drive motor shaft 20a, which is driven to rotate by the X-axis drive motor body 20b, and the rotation axis of the X-axis drive cam 22 coincides with the rotation axis of the X-axis drive motor shaft 20a. Meanwhile, an X-axis drive cam follower 23 is fixedly attached to the X-axis movable table 21, extending so as to protrude downward (vertically) from the underside of the X-axis movable table 21. The X-axis drive cam follower 23 comes into contact with the X-axis drive cam 22, and receives a force acting in the X direction dX from the X-axis drive cam 22 as the X-axis drive cam 22 rotates, so that the X-axis drive cam follower 23 is provided so as to be able to move back and forth in the X direction dX integrally with the X-axis movable table 21.

[0034] Further, an X-axis drive spring (X-axis drive elastic portion) 24 and a table X-axis guide unit 25 are attached to the X-axis movable table 21.

[0035] The X-axis drive spring 24 in this example is a tension spring whose one end is supported by the X-axis movable table 21 and whose other end is supported by the upper base portion 11a via a connecting member. The X-axis drive spring 24 applies an elastic force (restoring force) to the X-axis movable table 21 in the direction opposite (X direction dX) to the direction of the force in the X direction dX that the X-axis movable table 21 receives from the X-axis drive cam 22 via the X-axis drive cam follower 23. In this manner, the X-axis drive spring 24 acts to ensure contact (close contact) between the X-axis drive cam 22 and the X-axis drive cam follower 23. Note that instead of the X-axis drive spring 24, an elastic body other than a spring may be used, or an arbitrary mechanism (e.g., a mechanism using a magnet) that applies an arbitrary force other than an elastic force (e.g., a magnetic force) to the X-axis movable table 21 in the direction opposite (X direction dX) to the direction of the force in the X direction dX that the X-axis movable table 21 receives from the X-axis drive cam 22 may be used.

[0036] In the above example, the X-axis movable table 21 moved by the X-axis drive cam 22 is returned to its original position by using an arbitrary mechanism such as a spring (elastic body) or a magnet, but such an arbitrary mechanism such as a spring (elastic body) or a magnet does not have to be provided. For example, if the X-axis drive cam 22 has a structure that can move the X-axis movable table 21 back and forth in the X direction dX, there is no need to install a mechanism for returning the X-axis movable table 21 to its original position.

[0037] Table X-axis guide unit 25 in this example is configured with an LM guide (Linear Motion Guide), and has an LM rail fixedly provided on the top surface of upper base portion 11a, and an LM block that slides on the LM rail fixedly attached to the underside of X-axis movable table 21. The LM rail of table X-axis guide unit 25 supports the LM block so as to allow the LM block to freely slide back and forth in the X direction dX, while restricting its movement in the Y direction dY.

[0038] Similarly, a Y-axis drive cam 32 is attached to the tip of the Y-axis drive motor shaft 30a (particularly, a portion located above the upper base portion 11a). The Y-axis drive cam 32 rotates integrally with the Y-axis drive motor shaft 30a, which is driven to rotate by the Y-axis drive motor body 30b, and the rotation axis of the Y-axis drive cam 32 coincides with the rotation axis of the Y-axis drive motor shaft 30a. Meanwhile, a Y-axis drive cam follower 33 is fixedly attached to the Y-axis movable table 31, extending so as to protrude downward (vertically) from the underside of the Y-axis movable table 31. The Y-axis drive cam follower 33 comes into contact with the Y-axis drive cam 32, and receives a force acting in the Y direction dY from the Y-axis drive cam 32 as the Y-axis drive cam 32 rotates, so that the Y-axis drive cam follower 33 is provided so as to be able to move back and forth in the Y direction dY integrally with the Y-axis movable table 31.

[0039] A Y-axis drive spring (Y-axis drive elastic portion) 34 and a table Y-axis guide unit 35 are also attached to the Y-axis movable table 31. In this example, the Y-axis drive spring 34 is a tension spring with one end supported by the Y-axis movable table 31 and the other end supported by the upper base portion 11a via a connecting member. The Y-axis drive spring 34 applies an elastic force (restoring force) to the Y-axis movable table 31 in the direction opposite to the direction of the force in the Y direction dY that the Y-axis movable table 31 receives from the Y-axis drive cam 32 via the Y-axis drive cam follower 33. In this way, the Y-axis drive spring 34 acts to ensure contact (close contact) between the Y-axis drive cam 32 and the Y-axis drive cam follower 33. Instead of the Y-axis drive spring 34, an elastic body other than a spring may be used, or any mechanism (for example, a mechanism using a magnet) may be used that applies any force other than elastic force (for example, magnetic force) to the Y-axis movable table 31 in the opposite direction (Y direction dY) to the direction of the force in the Y direction dY that the Y-axis movable table 31 receives from the Y-axis drive cam 32.

[0040] In the above example, the Y-axis movable table 31 moved by the Y-axis drive cam 32 is returned to its original position by using an arbitrary mechanism such as a spring (elastic body) or a magnet, but such an arbitrary mechanism such as a spring (elastic body) or a magnet does not have to be provided. For example, if the Y-axis drive cam 32 has a structure that allows the Y-axis movable table 31 to move back and forth in the Y direction dY, there is no need to install a mechanism for returning the Y-axis movable table 31 to its original position.

[0041] Table Y-axis guide unit 35 in this example is constituted by an LM guide, and has an LM rail fixedly provided on the top surface of upper base portion 11a, and an LM block that slides on the LM rail fixedly attached to the underside of Y-axis movable table 31. The LM rail of table Y-axis guide unit 35 supports the LM block so as to restrict movement of the LM block in the X-direction dX while allowing free reciprocating sliding movement of the LM block in the Y direction dY.

[0042] The stage X-axis guide unit 15 is attached to the upper base portion 11a and the stage 12, and allows movement of the stage 12 in the X direction dX relative to the upper base portion 11a while restricting movement in the Y direction dY. The stage X-axis guide unit 15 can be placed between one of the upper base portion 11a or the stage 12 and the Y-axis movable table 31. In the example shown in FIG. 1 , the stage X-axis guide unit 15 is placed between the stage 12 and the Y-axis movable table 31, and the Y-axis movable table 31 is attached to the stage 12 via the stage X-axis guide unit 15.

[0043] 1 is composed of an LM guide, and has an LM rail fixedly provided on the upper surface of Y-axis movable table 31, and an LM block that slides on the LM rail and is fixedly attached to stage 12 via stage support part 41. The LM rail of stage X-axis guide unit 15 supports the LM block so as to allow the LM block to freely slide back and forth in the X direction dX, while restricting its movement in the Y direction dY.

[0044] The stage Y-axis guide unit 16 is attached to the upper base portion 11a and the stage 12, and restricts movement of the stage 12 in the X-axis direction dX while allowing movement of the stage 12 relative to the upper base portion 11a in the Y-direction dY. The stage Y-axis guide unit 16 can be arranged between one of the upper base portion 11a and the stage 12 and the X-axis movable table 21. In the example shown in FIG. 1 , the stage Y-axis guide unit 16 is arranged between the stage 12 and the X-axis movable table 21, and the X-axis movable table 21 is attached to the stage 12 via the stage Y-axis guide unit 16.

[0045] 1 is composed of an LM guide, and has an LM rail fixedly provided on the upper surface of X-axis movable table 21, and an LM block that slides on the LM rail and is fixedly attached to stage 12 via stage support part 41. The LM rail of stage Y-axis guide unit 16 supports the LM block so as to restrict movement of the LM block in the X direction dX while allowing free reciprocating sliding movement of the LM block in the Y direction dY.

[0046] Next, an example of a method for driving the stage unit 10 shown in FIG. 1 will be described.

[0047] When the stage 12 is to be moved a desired distance in the X direction dX, the X-axis drive motor 20 is driven under the control of a control unit (see reference numeral "50" in FIG. 2 described later), and the X-axis drive motor shaft 20a is rotated by an amount of rotation (desired rotation amount) corresponding to the desired distance. As a result, the X-axis drive cam 22 rotates by the desired amount of rotation, and the X-axis drive cam follower 23 is moved by the desired distance in the X direction dX. By moving the X-axis drive cam follower 23 in this manner, the X-axis movable table 21, the stage Y-axis guide unit 16, and the stage support part 41 connected to the X-axis drive cam follower 23 are also moved integrally by the desired distance in the X direction dX. As a result, the stage 12 attached to the stage support part 41 is also moved by the desired distance in the X direction dX.

[0048] Similarly, when the stage 12 is to be moved a desired distance in the Y direction dY, the Y-axis drive motor 30 is driven under the control of the control unit, and the Y-axis drive motor shaft 30a is rotated by an amount of rotation (desired rotation amount) corresponding to the desired distance. As a result, the Y-axis drive cam 32 rotates by the desired amount of rotation, and the Y-axis drive cam follower 33 is moved by the desired distance in the Y direction dY. By moving the Y-axis drive cam follower 33 in this manner, the Y-axis movable table 31, the stage X-axis guide unit 15, and the stage support part 41 connected to the Y-axis drive cam follower 33 are also moved integrally by the desired distance in the Y direction dY. As a result, the stage 12 attached to the stage support part 41 is also moved by the desired distance in the Y direction dY.

[0049] The above-mentioned movement driving of the stage 12 in the X direction dX and the movement driving of the stage 12 in the Y direction dY may be performed simultaneously or at different timings.

[0050] Next, an example of a processing system 1 including the above-described stage unit 10 will be described.

[0051] FIG. 2 is a diagram showing a schematic configuration of an example of the processing system 1. As shown in FIG.

[0052] The processing system 1 shown in FIG. 2 includes a front stage mounting part 45 provided in the first station St1, an imaging device 55 provided in the second station St2, and a stage unit 10 and an inspection device 61 provided in the third station St3.

[0053] The target electronic component W is placed on the preceding stage placement section 45. The electronic component W on the preceding stage placement section 45 is held by a placement device 46 and intermittently transported from the first station St1 to the third station St3 via the second station St2, and then placed on the stage 12 of the stage unit 10.

[0054] The placement device 46 of this embodiment includes a component holding nozzle 47 that releasably holds an electronic component W under the control of the control unit 50. The component holding nozzle 47 can hold the electronic component W at the nozzle opening by vacuum suction, for example, by making the internal pressure lower than the external pressure, and can release the electronic component W by making the internal pressure equal to or greater than the external pressure.

[0055] The component holding nozzle 47 moves so as to stop intermittently at a plurality of stations (including the first to third stations St1 to St3) in sequence, and circulates through the plurality of stations. In this embodiment, the stations are arranged at equal intervals along a circular track, and the placement device 46 is equipped with a plurality of component holding nozzles 47, the same number as the number of the stations, and each of the plurality of component holding nozzles 47 stops intermittently at all the stations simultaneously.

[0056] Therefore, at the same time that the preceding component holding nozzle 47 holds an electronic component W at the first station St1 and moves with that electronic component W to place it at the second station St2, the next component holding nozzle 47 is placed at the first station St1 to hold another electronic component W. In this way, the placement device 46 holds the electronic components W on the preceding placement section 45 one at a time and transports them to the second station St2.

[0057] Only one electronic component W may be placed simultaneously on the preceding stage placement section 45, or multiple electronic components W may be placed simultaneously. When only one electronic component W is placed simultaneously on the preceding stage placement section 45, the next electronic component W may be placed on the preceding stage placement section 45 by a supply device (not shown) after the preceding component holding nozzle 47 has transported the electronic component W from the preceding stage placement section 45 toward the second station St2 (for example, before the next component holding nozzle 47 is placed at the first station St1). On the other hand, when multiple electronic components W are placed simultaneously on the pre-stage placement section 45, after the electronic component W is transported from the pre-stage placement section 45 to the second station St2 by the preceding component holding nozzle 47 (for example, before the next component holding nozzle 47 is placed at the first station St1), the next electronic component W may be moved to a holding position by a moving mechanism (not shown), or the pre-stage placement section 45 may be moved by a moving mechanism (not shown) so that the next electronic component W is placed in a holding position to be held by the next component holding nozzle 47.

[0058] In the second station St2, the imaging device 55 acquires image data D of the electronic component W before it is placed on the stage 12 of the stage unit 10, and transmits the image data D to the control unit 50. In the example shown in FIG. 2, the second station St2 is provided with the imaging device 55, an annular illumination device 57 having a central light-transmitting portion through which light for photographing the electronic component W can pass, and an imaging optical system 56 that guides the light for photographing the electronic component W to the imaging device (particularly an image sensor such as a CMOS). The imaging optical system 56 may include, for example, one or more optical elements (e.g., lenses and mirrors) that refract or reflect light. Therefore, although the electronic components W and component holding nozzles 47, the imaging optical system 56, and the imaging device 55, which are intermittently arranged in the second station St2, are positioned on the same straight line (the same vertical line) in the example shown in FIG. 2, they do not necessarily have to be positioned on the same straight line. For example, imaging light traveling vertically (downward) from the electronic component W may be reflected horizontally by the imaging optical system 56, and the imaging device 55 may receive the imaging light traveling horizontally.

[0059] Illumination light (e.g., visible light) from the illumination device 57 is directed at the electronic components W that are intermittently stopped together with the component holding nozzles 47 at the second station St2, and the reflected light, which is imaging light of the electronic components W, is received by the image sensor of the imaging device 55 via the light-transmitting portion of the illumination device 57 and the imaging optical system 56, thereby acquiring image data D of the electronic components W. The image data D may include an image of the illumination device 57 in addition to the image of the electronic components W, or it may not include an image of the illumination device 57.

[0060] The electronic component W held by the component holding nozzle 47 undergoes imaging processing at the second station St2, then moves from the second station St2, is intermittently stopped at the third station St3, and is placed on the stage 12 of the stage unit 10.

[0061] In this embodiment, the control unit 50 controls the stage movement mechanism 13 (particularly the X-axis drive motor 20 and the Y-axis drive motor 30) based on the image data D. That is, the control unit 50 adjusts the position of the stage 12 by controlling the stage movement mechanism 13 based on status information indicating the status of the electronic component W obtained by analyzing the image data D. The status information referred to here may include various information and typically includes position information indicating the deviation of the position of the electronic component W from a reference position. The position information of the electronic component W referred to here may include, for example, not only information indicating the geometric position of the electronic component W (e.g., outer dimensions) but also information indicating the electrode position deviation of the electronic component W. Therefore, by controlling the stage movement mechanism 13 based on the position information of the electronic component W, the control unit 50 can correct not only the geometric position of the electronic component W but also the electrode position deviation of the electronic component W.

[0062] 2, the control unit 50 includes an image analysis unit 51 that analyzes image data D of the electronic component W output from the imaging device 55. The image analysis unit 51 can analyze the image data D using any method to acquire status information such as position information that indicates the positional deviation of the electronic component W from a reference position.

[0063] As an example, the image analysis unit 51 may store reference image data in advance and acquire status information such as position information by comparing image data D of the electronic component W acquired by the imaging device 55 with the reference image data. The reference image data here refers to image data including an image of the electronic component W positioned in a desired appropriate position. For example, the image data D may be image data D acquired by the imaging device 55 while the electronic component W is held by the component holding nozzle 47 in the desired appropriate position. In this case, the image analysis unit 51 may identify the position of the target electronic component W in the image data D (e.g., the position of the entire or part (e.g., electrodes) of the target electronic component W) and compare it with the position of the electronic component W in the reference image data to acquire status information such as position information about the target electronic component W. Alternatively, the image analysis unit 51 may acquire status information such as position information about the target electronic component W by comparing the position of the electronic component W in the image data D of the electronic component W acquired by the imaging device 55 with a reference position in the image data D (e.g., a position that directly or indirectly indicates the component holding nozzle 47).

[0064] In this example, the component holding nozzle 47 places an electronic component W on the stage 12 after its position has been adjusted by the stage moving mechanism 13 under the control of the control unit 50 as described above. The electronic component W placed on the stage 12 is then inspected by the inspection device 61, and after the inspection, the electronic component W is transported downstream from the third station St3 by the component holding nozzle 47. Note that in this example, the position adjustment of the stage 12 by the stage moving mechanism 13 is performed before the target electronic component W stops at the third station St3.

[0065] Next, an example of processing performed by the processing system 1 shown in Fig. 2 will be described. The processing described below is appropriately performed by driving various devices of the processing system 1 under the control of the control unit 50.

[0066] FIG. 3 is a flowchart showing an example of processing in the processing system 1.

[0067] In this example, the target electronic component W located on the pre-stage placement section 45 is transferred from the first station St1 to the second station St2 by the component holding nozzle 47 of the placement device 46, and is intermittently placed at the second station St2 (S1).

[0068] Thereafter, the target electronic component W is imaged by the imaging device 55 while positioned at the second station St2, and image data D of the target electronic component W is sent from the imaging device 55 to the control unit 50 (S2).

[0069] Thereafter, before the target electronic component W is transferred to the third station St3, the image analysis unit 51 acquires status information (such as position information of the target electronic component W) from the image data D (S3), and the stage movement mechanism 13 adjusts the position of the stage 12 based on the status information (S4). Thereafter, the target electronic component W to be transferred to the third station St3 by the component holding nozzle 47 is placed on the stage 12 (S5).

[0070] In this example, the position of the stage 12 is adjusted so that the target electronic component W is placed at the reference placement position of the stage 12 (e.g., the center position of the stage 12). The component holding nozzles 47 are basically always placed at their predetermined positions without any positional deviation in the second station St2 and the third station St3. On the other hand, the position of the target electronic component W is not necessarily constant, and its position relative to the corresponding component holding nozzle 47 may deviate from the reference position. In this example, the control unit 50 acquires the amount of positional deviation of the target electronic component W from the reference position from status information (e.g., position information) obtained from the image data D, and adjusts the position of the stage 12 in advance to offset the amount of positional deviation. As a result, the target electronic component W is placed at the reference placement position of the stage 12 regardless of whether or not there is any positional deviation from the reference position.

[0071] After the target electronic component W is placed on the reference placement position of the stage 12 in this manner, the stage 12 is returned to the reference stage position together with the electronic component W by the stage moving mechanism 13 under the control of the control unit 50 (S6). Thereafter, the target electronic component W on the stage 12 is inspected by the inspection device 61 (S7). The reference stage position here is the optimum position for inspection by the inspection device 61. Therefore, even if the target electronic component W is displaced from the reference position at the first station St1 and the second station St2, it can be inspected at the optimum position at the third station St3.

[0072] Thereafter, the target electronic component W on the stage 12 is held and transported downstream by the component holding nozzle 47 (S8). At this time, since the target electronic component W is always positioned in a fixed position (a position optimal for inspection), the component holding nozzle 47 can basically always hold the electronic component W in an appropriate position and transport it stably from the third station St3 to a subsequent stage.

[0073] Although the processing flow shown in FIG. 3 is shown for one target electronic component W, the processing system 1 performs the above-described series of processes successively for each of a plurality of target electronic components W.

[0074] As described above, according to this embodiment, the stage 12 can be moved horizontally without horizontally moving the entire X-axis drive motor 20 and the entire Y-axis drive motor 30. Therefore, for example, the stage 12 can be moved while suppressing the inertia acting on the entire moving portion of the stage unit 10, and the moving speed and accuracy of the stage 12 can be increased.

[0075] [Variations] In the above-described embodiment, the position of the stage 12 is adjusted in accordance with the positional misalignment of the electronic component W before the electronic component W is placed on the stage 12. However, after the electronic component W is placed on the stage 12, the position of the stage 12 may be adjusted in accordance with the positional misalignment of the electronic component W while the electronic component W is still placed on the stage 12.

[0076] Furthermore, in the above-described embodiment, an inspection device 61 that inspects the electronic component W placed on the stage 12 is provided, but the inspection device 61 need not be provided. Furthermore, in addition to or instead of the inspection device 61, any processing device that performs processing on the electronic component W on the stage 12 may be provided. By adjusting the position of the stage 12 in response to the positional misalignment of the electronic component W, the electronic component W is placed in an appropriate position on the stage 12 where the positional misalignment is eliminated. Therefore, when the electronic component W is transported downstream from the stage 12 by the component holding nozzle 47 (placement device 46), the electronic component W is basically always held in an appropriate position by the component holding nozzle 47. In this way, the position of the electronic component W is corrected by the stage unit 10. As a result, the electronic component W can be subjected to various processes at an appropriate position downstream of the stage 12 (stage unit 10), and various processes can be performed with high accuracy.

[0077] It should be noted that the embodiments and modifications disclosed in this specification are merely illustrative in all respects and should not be construed as limiting. The above-described embodiments and modifications may be omitted, substituted, and modified in various ways without departing from the scope and spirit of the appended claims. For example, the above-described embodiments and modifications may be combined in whole or in part, and embodiments other than those described above may be combined with the above-described embodiments or modifications. Furthermore, the effects of the present disclosure described in this specification are merely illustrative, and other effects may be obtained.

[0078] The technical category that embodies the above technical idea is not limited. For example, the above technical idea may be embodied by a computer program that causes a computer to execute one or more procedures (steps) included in a method of manufacturing or using the above device. The above technical idea may also be embodied by a computer-readable non-transitory recording medium on which such a computer program is recorded. [Explanation of symbols]

[0079] 1 Processing system, 10 Stage unit, 11 Base, 11a Upper base portion, 11b Side base portion, 11c Lower base portion, 12 Stage, 13 Stage movement mechanism, 15 Stage X-axis guide unit, 16 Stage Y-axis guide unit, 20 X-axis drive motor, 20a X-axis drive motor shaft, 20b X-axis drive motor body, 21 X-axis movable table, 22 X-axis drive cam, 23 X-axis drive cam follower, 24 X-axis drive spring, 25 Table X-axis guide unit, 30 Y-axis drive motor, 30a Y-axis drive motor shaft, 30b Y-axis drive motor body, 31 Y-axis movable table, 32 Y-axis drive cam, 33 Y-axis drive cam follower, 34 Y-axis drive spring, 35 Table Y-axis guide unit, 41 Stage support portion, 45 Pre-stage placement portion, 46 Placement device, 47 Component holding nozzle, 50 Control portion, 51 Image analysis unit, 55 imaging device, 56 imaging optical system, 57 lighting device, 61 inspection device, dX X direction, dY Y direction, D image data, St1 first station, St2 second station, St3 third station, W electronic component

Claims

1. With the base, a stage on which electronic components can be placed; a stage moving mechanism that moves the stage relative to the base, The stage moving mechanism includes: a first direction drive unit having a first direction drive source and a first direction movable part that is moved together with the stage in a first direction by a driving force output from the first direction drive source; a second direction drive unit having a second direction drive source and a second direction movable part that is moved together with the stage in the second direction by a driving force output from the second direction drive source; a first direction guide unit attached to the base and the stage and disposed between one of the base and the stage and the second direction movable unit, the first direction guide unit allowing movement of the stage relative to the base in the first direction; a second direction guide unit attached to the base and the stage and disposed between one of the base and the stage and the first direction movable unit, the second direction guide unit allowing movement of the stage relative to the base in a second direction; include, Stage unit.

2. the first direction and the second direction are perpendicular to each other; The stage unit according to claim 1 .

3. the first direction movable portion is attached to the stage via the second direction guide unit, the second direction movable unit is attached to the stage via the first direction guide unit; The stage unit according to claim 1 .

4. the first direction drive source and the second direction drive source are fixedly supported by the base; The stage unit according to claim 1 .

5. A stage unit according to any one of claims 1 to 4; a mounting device that mounts the electronic component on the stage; an imaging device for acquiring image data of the electronic component before it is placed on the stage; a control unit that controls the stage movement mechanism based on the image data, the control unit adjusts the position of the stage by controlling the stage moving mechanism based on status information indicating a status of the electronic component obtained by analyzing the image data. Processing system.

6. the state information includes position information indicating a deviation of a position of the electronic component from a reference position; The processing system of claim 5 .

7. an inspection device that inspects the electronic components placed on the stage; The processing system of claim 5 .

Images