Socket assembly

Abstract

To provide a socket assembly.SOLUTION: The socket assembly includes a main body, a plurality of shielding components, and a plurality of retractable probes. The main body has a plurality of through-holes and a plurality of recesses. The through-holes accommodate the retractable probes. At least one recess is formed between any two through-holes adjacent to each other. The plurality of shielding components is inserted into the recesses.SELECTED DRAWING: Figure 2A

Description

[Technical Field]

[0001] The present disclosure relates to a socket assembly, and more particularly to a socket assembly having shielding features and adapted for use with a chip test socket. [Background technology]

[0002] Once the chip packaging is complete, the packaged chips must be tested to screen out unsatisfactory packaged chips. Typically, packaged chips are tested in a socket equipped with test probes, which are usually elastic probes commonly known as pogo pins. To perform the test, one end of each pogo pin contacts the circuit board on the socket, and the other end of the pogo pin contacts a pin on the packaged chip.

[0003] The socket has through-holes for receiving the pogo pins. However, due to the short distance between the through-holes, signals associated with adjacent pogo pins interfere with each other during testing, impairing the accuracy of the test results. The interference is particularly serious during high-frequency signal testing. Therefore, it is essential to reduce signal interference, thereby improving test stability and accuracy.

[0004] The above description of the "Background Art" merely serves to clarify the background art, and is not intended as an admission that the above description of the "Background Art" discloses the subject matter of the present disclosure, constitutes prior art to the present disclosure, or is part of the present disclosure. Summary of the Invention [Problem to be solved by the invention]

[0005] In consideration of the above-mentioned conventional problem of test signal interference, the present disclosure provides a socket assembly. [Means for solving the problem]

[0006] One embodiment of the present disclosure provides a socket assembly for use with a chip test socket, the socket assembly including a main body, a plurality of first shielding components, a plurality of second shielding components, and a plurality of pogo pins. The main body has an upper surface, a lower surface opposite the upper surface, a plurality of first through-hole arrays (columns), a plurality of second through-hole arrays, a plurality of first grooves, and a plurality of second grooves. Each first through-hole array includes a plurality of first through-holes aligned in a first direction. Each second through-hole array includes a plurality of second through-holes aligned in a second direction. Each first groove extends in the first direction and is disposed between any two adjacent first through-hole arrays. Each second groove extends in the second direction and is disposed between any two adjacent second through-hole arrays. Each first shielding component has a first surface, and the plurality of first shielding components are inserted into the plurality of first grooves. Each second shielding component has a second surface, and the plurality of second shielding components are inserted into the plurality of second grooves. The plurality of pogo pins are disposed in the plurality of first through holes and the plurality of second through holes, a first distance is defined between the first surface and the bottom surface of each first shielding component, and a second distance is defined between the second surface and the bottom surface of each second shielding component.

[0007] Another embodiment of the present disclosure provides a socket assembly including a main body, a plurality of shielding components, and a plurality of pogo pins. At least a first portion of the plurality of through holes form a plurality of first through-hole arrays. At least a second portion of the plurality of through holes form a plurality of second through-hole arrays. At least a first portion of the plurality of grooves is disposed between any two adjacent first through-hole arrays. At least a second portion of the plurality of grooves is disposed between any two adjacent second through-hole arrays. The plurality of shielding components are disposed by being inserted into the plurality of grooves. The plurality of pogo pins are disposed within the plurality of through-holes.

[0008] Therefore, the socket assembly of the present disclosure includes a shielding component for blocking signal interference between pogo pins during testing, effectively blocking signal interference and thereby improving the stability and accuracy of the test.

[0009] The technical features and advantages of the present disclosure have been described generally and broadly above to make the following detailed description of the present disclosure understandable. Other technical features and advantages of the claimed subject matter of the present disclosure are described below. Those skilled in the art will understand that the concepts and specific embodiments presented below can be easily used to modify or design any other structure or manufacturing process to achieve the same purpose as the present disclosure. Those skilled in the art will also understand that the equivalent constructions described above cannot depart from the spirit and scope of the present disclosure as defined in the appended claims. [Brief explanation of the drawings]

[0010] Those skilled in the art can gain insight into the present disclosure by referring to the embodiments, claims, and drawings of the present disclosure, in which like elements are designated by like reference numerals.

[0011] [Figure 1A] FIG. 1 is a perspective view of a socket assembly according to some embodiments of the present disclosure. [Figure 1B] FIG. 1 is a perspective view of a socket assembly according to some embodiments of the present disclosure. [Figure 1C] 1 is a cross-sectional view of a socket assembly according to some embodiments of the present disclosure. [Figure 1D] 1 is a cross-sectional view of a socket assembly according to some embodiments of the present disclosure. [Figure 1E] FIG. 1 is a perspective view of a body according to some embodiments of the present disclosure. [Figure 1F] FIG. 1 is a perspective view of a body according to some embodiments of the present disclosure. [Figure 1G] FIG. 1 is a perspective view of a body according to some embodiments of the present disclosure. [Figure 1H] 1 is a cross-sectional view of a body according to some embodiments of the present disclosure. [Figure 1I] 1 is a cross-sectional view of a body according to some embodiments of the present disclosure. [Figure 2A] FIG. 1 is a perspective view of a socket assembly according to some embodiments of the present disclosure. [Figure 2B] FIG. 1 is a perspective view of a socket assembly according to some embodiments of the present disclosure. [Figure 2C] 1 is a cross-sectional view of a socket assembly according to some embodiments of the present disclosure. [Figure 2D] 1 is a cross-sectional view of a socket assembly according to some embodiments of the present disclosure. [Figure 2E] 1 is a cross-sectional view of a socket assembly according to some embodiments of the present disclosure. [Figure 2F] FIG. 1 is a perspective view of a body according to some embodiments of the present disclosure. [Figure 2G] FIG. 1 is a perspective view of a body according to some embodiments of the present disclosure. [Figure 2H] FIG. 1 is a perspective view of a body according to some embodiments of the present disclosure. [Figure 2I] 1 is a cross-sectional view of a body according to some embodiments of the present disclosure. [Figure 2J] 1 is a cross-sectional view of a body according to some embodiments of the present disclosure. [Figure 2K] 1 is a cross-sectional view of a body according to some embodiments of the present disclosure. [Figure 2L] 1 is a cross-sectional view of a shielding component according to some embodiments of the present disclosure. [Figure 2M] FIG. 1 is a perspective view of a socket assembly according to some embodiments of the present disclosure. [Figure 2N] 1 is a cross-sectional view of a socket assembly according to some embodiments of the present disclosure. [Figure 2O] 1 is a cross-sectional view of a socket assembly according to some embodiments of the present disclosure. [Figure 2P] 1 is an enlarged cross-sectional view of a socket assembly according to some embodiments of the present disclosure. [Figure 3] FIG. 1 is a perspective view of a socket assembly according to some embodiments of the present disclosure. [Figure 4A] FIG. 1 is a perspective view of a socket assembly according to some embodiments of the present disclosure. [Figure 4B]FIG. 1 is a perspective view of a socket assembly according to some embodiments of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0012] The following description is accompanied by drawings that are incorporated into and constitute a part of this specification to illustrate embodiments of the present disclosure. However, the present disclosure is not limited to these embodiments. The embodiments described below may be combined as appropriate to realize any other embodiment.

[0013] As used herein, the purpose of the phrases "one embodiment," "embodiment," "exemplary embodiment," "other embodiment," and "alternative embodiment" is to state that embodiments of the present disclosure may include a particular feature, structure, or characteristic. However, not all embodiments need include that particular feature, structure, or characteristic. Furthermore, repeated use of the phrase "in one embodiment" does not necessarily refer to the same embodiment, but should not exclude the possibility that they do. The socket assembly referred to in this specification is primarily used for chip testing during semiconductor testing.

[0014] The following description explains the processes and structures in detail to enable a complete understanding of the present disclosure. Obviously, the embodiments of the present disclosure are not limited to any specific details known to those skilled in the art. In addition, well-known structures and processes are not repeated in this specification to avoid unnecessary limitations on the present disclosure. Below, preferred embodiments of the present disclosure are described in detail. However, in addition to the detailed description, the present disclosure may be broadly implemented in other embodiments. The scope of the present disclosure is not limited to the detailed description, but is defined by the appended claims.

[0015] The following description provides different embodiments or examples for use in implementing different features of the present disclosure. Specific embodiments or examples of components and arrangements are described in detail herein to simplify the content of the present disclosure. The specific embodiments and examples are illustrative rather than limiting of the present disclosure. For example, the dimensions of the components are not limited to the disclosed ranges or values ​​and are based on process criteria and / or expected device properties. In the following description, an embodiment in which a first feature is formed on or above a second feature includes any embodiment in which the thus-formed first and second features are in direct contact with each other, or any embodiment in which an additional feature is formed between the first and second features, allowing the first and second features to not be in direct contact with each other. For simplicity and clarity, the accompanying drawings are not drawn to scale. For simplicity, some layers / features have been omitted from the accompanying drawings.

[0016] Additionally, for purposes of explanation, spatial relationship terms such as "below," "lower," "bottom," "upper," and "top" are used herein to describe the relationship between one component (or feature) and another component (or feature) as shown in the accompanying drawings. The spatial relationship terms are intended to indicate any other orientation in which the component may be used or operated in addition to the orientation shown in the accompanying drawings. The component may have any other orientation (rotated 90 degrees or aligned with another orientation) and the spatial relationship terms can be interpreted accordingly.

[0017] One embodiment of the present disclosure relates to a socket assembly for a chip test socket, the socket assembly including a main body, a plurality of shielding components, and a plurality of pogo pins. The plurality of pogo pins are configured to test high-frequency signals. The main body is made of an insulating material and has a plurality of through holes and a plurality of grooves. At least one of the grooves is disposed between two adjacent through holes. The plurality of through holes receives the plurality of pogo pins. The plurality of shielding components are made of a conductive metal material and are inserted into the plurality of grooves. With the above-described technical features, the insulating properties of the main body prevent electrical contact between the pogo pins, and the metal shielding components are inserted and disposed between the through holes for receiving the pogo pins, effectively blocking signal interference associated with the pogo pins during testing, particularly during high-frequency signal testing. Therefore, when the socket assembly is attached to a corresponding socket, the socket assembly can effectively block signal interference and improve the stability and accuracy of the test. The necessary structural features are illustrated in the following embodiments and described in detail below.

[0018] Reference is made to FIGS. 1A to 1D. FIG. 1A is a perspective view of a socket assembly 11 according to some embodiments of the present disclosure. FIG. 1B is another perspective view of the socket assembly 11 according to some embodiments of the present disclosure. FIG. 1C is a cross-sectional view of the socket assembly 11 according to some embodiments of the present disclosure. FIG. 1D is another cross-sectional view of the socket assembly 11 according to some embodiments of the present disclosure. Specifically, the socket assembly 11 includes a main body 111, a plurality of shielding components 113, and a plurality of pogo pins 13. The main body 111 has an upper surface 111S1 and a lower surface 111S2 opposite to the upper surface 111S1.

[0019] 1E-1I. FIGS. 1E and 1F are perspective views of a body 111 according to some embodiments of the present disclosure. FIG. 1G is another perspective view of the body 111 according to some embodiments of the present disclosure. FIG. 1H is a cross-sectional view of the body 111 according to some embodiments of the present disclosure. FIG. 1I is another cross-sectional view of the body 111 according to some embodiments of the present disclosure. Specifically, the body 111 has a plurality of through-holes 1110 and a plurality of grooves 1112. At least a first portion of the through-holes 1110 form a plurality of first through-hole arrays 1110AR1. The through-holes 1110 in each first through-hole array 1110AR1 are defined as first through-holes and are aligned in a first direction D13. At least a second portion of the through-holes 1110 form a plurality of second through-hole arrays 1110AR2. The through-holes 1110 in each second through-hole array 1110AR2 are defined as second through-holes and are aligned in a second direction D14. In some embodiments, one of the first through-holes and one of the second through-holes may be the same through-hole, but the first through-hole is distinguished from the second through-hole by a different through-hole array angle.

[0020] In some embodiments, the plurality of grooves 1112 includes a plurality of first grooves 11120 and a plurality of second grooves 11122. Each first groove 11120 extends in a first direction D13 and is disposed between two adjacent first arrays of through-holes 1110AR1. Each second groove 11122 extends in a second direction D14 and is disposed between two adjacent second arrays of through-holes 1110AR2.

[0021] In some embodiments, the plurality of shielding components 113 includes a plurality of first shielding components 1131 and a plurality of second shielding components 1133. The first shielding components 1131 are each inserted into the first grooves 11120 from the upper surface 111S1. The second shielding components 1133 are each inserted into the second grooves 11122 from the upper surface 111S1. The through holes 1110 receive the pogo pins 13. In some embodiments, the first shielding components 1131 and the second shielding components 1133 are staggered by an engagement structure disposed between any two adjacent shielding components.

[0022] In some embodiments, each first shielding component 1131 has a first surface 1131S, and each second shielding component 1133 has a second surface 1133S. The first surface 1131S, the second surface 1133S, and the bottom surface 111S2 face substantially in the same direction. When the first shielding component 1131 and the second shielding component 1133 are inserted into the first groove and the second groove, respectively, a first distance D11 is defined between the bottom surface 111S2 and each first surface 1131S, and a second distance D12 is defined between the bottom surface 111S2 and each second surface 1133S.

[0023] In some embodiments, the upper surface 111S1 and the lower surface 111S2 are substantially parallel, allowing the first surface 1131S of the first shielding part 1131 to be substantially coplanar, allowing the second surface 1133S of the second shielding part 1133 to be substantially coplanar, allowing the first surface 1131S and the second surface 1133S to be substantially coplanar, and allowing the first distance D11 to be substantially equal to the second distance D12, but the above technical features do not limit the embodiments of the present disclosure.

[0024] Therefore, due to the structure of the socket assembly 11, when the pogo pins 13 received in two adjacent through holes 1110 are used for signal transmission during chip testing, signal interference is effectively blocked by using the shielding component 113 inserted into the groove 1112 disposed between the two adjacent through holes 1110. Referring to FIG. 1A , for example, when the pogo pins 13A and 13B received in the through holes 1110A and 1110B are used for signal transmission during chip testing, signal interference is effectively blocked by using the shielding component 113A inserted into the groove 1112A disposed between the through holes 1110A and 1110B.

[0025] Reference is made to Figures 2A to 2E. Figure 2A is a perspective view of a socket assembly 21 according to some embodiments of the present disclosure. Figure 2B is another perspective view of the socket assembly 21 according to some embodiments of the present disclosure. Figures 2C to 2E are cross-sectional views of the socket assembly 21 according to some embodiments of the present disclosure. Specifically, the socket assembly 21 includes a main body 211, a plurality of shielding components 213, and a plurality of pogo pins 23. The main body 211 has an upper surface 211S1 and a lower surface 211S2 opposite to the upper surface 211S1.

[0026] 2F to 2K. FIGS. 2F and 2G are perspective views of the main body 211 according to some embodiments of the present disclosure. FIG. 2H is another perspective view of the main body 211 according to some embodiments of the present disclosure. FIGS. 2I to 2K are cross-sectional views of the main body 211 according to some embodiments of the present disclosure. Specifically, the main body 211 has a block shape (e.g., a cubic block shape) and includes a plurality of first through-hole arrays 2110AR1 and a plurality of second through-hole arrays 2110AR2. Each first through-hole array 2110AR1 includes a plurality of first through-holes 2110-1 aligned in a first direction D23. Each second through-hole array 2110AR2 includes a plurality of second through-holes 2110-2 aligned in a second direction D24. In these embodiments, the first direction D23 and the second direction D24 are essentially perpendicular to each other, but the present disclosure is not limited thereto. In some embodiments, one of the first through-holes 2110-1 and one of the second through-holes 2110-2 may be the same through-hole, but the first through-hole is distinguished from the second through-hole by a different through-hole array angle.

[0027] The main body 211 has a plurality of first grooves 21120 and a plurality of second grooves 21122. Each first groove 21120 extends in a first direction D23 and is disposed between two adjacent first through-hole arrays 2110AR1. Each second groove 21122 extends in a second direction D24 and is disposed between two adjacent second through-hole arrays 2110AR2. In some embodiments, the first grooves 21120 and the second grooves 21122 are disposed alternately.

[0028] In some embodiments, the plurality of shielding parts 213 include a plurality of first shielding parts 2131 and a plurality of second shielding parts 2133. The plurality of first shielding parts 2131 are respectively inserted into the plurality of first grooves 21120 of the main body 211 from the upper surface 211S1. The plurality of second shielding parts 2133 are respectively inserted into the plurality of second grooves 21122 of the main body 211 from the upper surface 211S1. The first shielding parts 2131 and the second shielding parts 2133 are arranged alternately. The plurality of first through holes 2110-1 and the plurality of second through holes 2110-2 receive the plurality of pogo pins 23.

[0029] In some embodiments, each first shielding component 2131 has a first surface 2131S, and each second shielding component 2133 has a second surface 2133S. The first surface 2131S, the second surface 2133S, and the bottom surface 211S2 face substantially in the same direction. The first groove 21120 and the second groove 21122 share a bottom surface 211S3 on the inside of the body 211. The body 211 has a thickness D25 between the bottom surface 211S3 and the bottom surface 211S2. When the first shielding components 2131 are inserted into the corresponding grooves, the first surfaces 2131S are adjacent to the bottom surface 211S3 of the body 211, and a first distance D21 is defined between each first surface 2131S and the bottom surface 211S2. When the second shielding components 2133 are inserted into the corresponding grooves, the second surfaces 2133S are adjacent to the bottom surface 211S3 of the body 211, and a second distance D22 is defined between each second surface 2133S and the bottom surface 211S2. In some embodiments, the thickness D25, the first distance D21, and the second distance D22 are equal to each other.

[0030] In some embodiments, the two first grooves 21120 and the two second grooves 21122 are arranged in a pattern that resembles a number sign (#), and a through-hole (e.g., the first through-hole 2110-1 or the second through-hole 2110-2) is formed in each of the nine cells of the number sign. Given the pattern, at least one groove (e.g., the first groove 21120 or the second groove 21122) is disposed between any two adjacent through-holes (e.g., the first through-hole 2110-1 and the second through-hole 2110-2). The first shielding part 2131 inserted in the first groove 21120 or the second shielding part 2133 inserted in the second groove 21122 is disposed between the pogo pins 23 in any two adjacent through-holes (e.g., the first through-hole 2110-1 and the second through-hole 2110-2).

[0031] In some embodiments, each first groove 21120 has a first opening 21120X in the upper surface 211S1 of the main body 211 and a plurality of second openings 21120Y in the lower surface 211S2 of the main body 211. The second openings 21120Y are formed along the extension direction of the first groove 21120 and are spaced apart from one another. The dimensions of each second opening 21120Y are smaller than the dimensions of the first openings 21120X. The first shielding part 2131 has a plurality of protrusions 2131P. When the first shielding part 2131 is inserted into the first groove 21120 through the first openings 21120X, the protrusions 2131P penetrate the corresponding second openings 21120Y of the first groove 21120 and protrude from the lower surface 211S2 (i.e., the protrusions 2131P protrude beyond the lower surface 211S2).

[0032] In some embodiments, each second groove 21122 has a third opening 21122X in the upper surface 211S1 of the main body 211, and each second groove 21122 has multiple fourth openings 21122Y in the lower surface 211S2 of the main body 211. The fourth openings 21122Y are formed along the extension direction of the second groove 21122 and are spaced apart from one another. The dimensions of each fourth opening 21122Y are smaller than the dimensions of the third openings 21122X. The second shielding part 2133 has multiple protrusions 2133P. When the second shielding part 2133 is inserted into the second groove 21122 through the third openings 21122X, the protrusions 2133P pass through the corresponding fourth openings 21122Y of the second groove 21122 and protrude from the lower surface 211S2 (i.e., the protrusions 2133P protrude beyond the lower surface 211S2).

[0033] In some embodiments, each first protrusion 2131P of the first shielding component 2131 has a third surface 2131PS, and all of the third surfaces 2131PS are substantially coplanar. Each second protrusion 2133P of the second shielding component 2133 has a fourth surface 2133PS, and all of the fourth surfaces 2133PS are substantially coplanar. In some embodiments, all of the third surfaces 2131PS and all of the fourth surfaces 2133PS are substantially coplanar.

[0034] 2L , a cross-sectional view of a first shielding part 2131 and a second shielding part 2133 is shown, according to some embodiments of the present disclosure. Specifically, each first shielding part 2131 has a plurality of first joints 21310, and each second shielding part 2133 has a plurality of second joints 21330. When the first shielding part 2131 and the second shielding part 2133 are staggered, the first joints 21310 receive the second shielding part 2133, and the second joints 21330 receive the first shielding part 2131.

[0035] In some embodiments, the first joint 21310 and the second joint 21330 are slots and are engaged with each other. In these embodiments, the depth of the first joint 21310 is substantially equal to half the height of the first shielding part 2131, and the depth of the second joint 21330 is substantially equal to half the height of the second shielding part 2133. When the first shielding part 2131 and the second shielding part 2133 have the same height, the height of the first and second shielding parts 2131, 2133 engaged with each other is equal to the original height of the first shielding part 2131 or the second shielding part 2133.

[0036] It should be noted that these embodiments do not limit the implementation of the first shielding part 2131 and the second shielding part 2133. In some embodiments, the first shielding part 2131 and the second shielding part 2133 have the same height, the sum of the depth of the first joint 21310 and the depth of the second joint 21330 is substantially equal to the height of the first shielding part 2131 or the second shielding part 2133, and the height of the first and second shielding parts 2131, 2133 engaged with each other is substantially equal to the original height of the first shielding part 2131 or the second shielding part 2133. In some embodiments, the first shielding part 2131 and the second shielding part 2133 are monolithic (integrally formed).

[0037] Therefore, due to the structure of the socket assembly 21, when the pogo pins 13 received in two adjacent through holes (e.g., the first through hole 2110-1 or the second through hole 2110-2) are used for signal transmission during chip testing, signal interference is effectively blocked by the first shielding part 2131 or the second shielding part 2133 (in this case, the first shielding part 2131 and the second shielding part 2133 are inserted into the first groove 21120 and the second groove 21122, respectively) disposed between the two adjacent through holes (e.g., the first through hole 2110-1 and the second through hole 2110-2). The protrusions 2131P and 2133P of the first shielding part 2131 and the second shielding part 2133 extend the shielding range between the pogo pins 23 and improve signal interference shielding.

[0038] 2A, for example, when the pogo pins 23A, 23B received in the through holes 2110A, 2110B are used for signal transmission during chip testing, signal interference is effectively blocked by the second shielding part 2133A inserted into the second groove 21122A disposed between the through holes 2110A, 2110B. Furthermore, the protrusion 2133P of the second shielding part 2133A extends the shielding range.

[0039] Please refer to FIGS. 2M to 2O. FIG. 2M is a perspective view of a socket assembly 21′ according to some embodiments of the present disclosure. FIG. 2N is a cross-sectional view of the socket assembly 21′ according to some embodiments of the present disclosure. FIG. 2O is another cross-sectional view of the socket assembly 21′ according to some embodiments of the present disclosure. Specifically, compared to the socket assembly 21, the socket assembly 21′ further includes a circuit board 25. The circuit board 25 is disposed on the upper surface 211S1 of the main body 211 and is electrically connected to the pogo pins 23 to transmit test-related signals. The other end of each pogo pin 23 is configured to contact a device under test (not shown). In some embodiments, the first shielding component 2131, the second shielding component 2133, and the circuit board 25 are electrically connected to form a ground loop.

[0040] In some embodiments, the socket assembly 21′ includes a first shielding part 2131′. The first shielding part 2131′ has a first fixing structure 2131F compared to the first shielding part 2131. The circuit board 25 has a second fixing structure 251 that corresponds to the shape of the first fixing structure 2131F. The first fixing structure 2131F and the second fixing structure 251 can engage with each other, firmly coupling the first shielding part 2131′ and the circuit board 25. In these embodiments, the first fixing structure 2131F is hook-shaped, and the second fixing structure 251 is notch-shaped corresponding to the hook-shaped first fixing structure 2131F, but it should be noted that the present disclosure is not limited thereto. Therefore, in an alternative embodiment, the second fixing structure 251 is hook-shaped, and the first fixing structure 2131F is notch-shaped corresponding to the hook-shaped second fixing structure 251. In some embodiments, the first fixing structure 2131F of the first shielding part 2131' and the second fixing structure 251 of the circuit board 25 are electrically connected to form a ground loop. Similarly, the second shielding part 2133 has the above-mentioned fixing structure and can thus engage with the circuit board 25, and related details will not be repeated for the sake of brevity.

[0041] 2P, an enlarged view of a portion of FIG. 2N is shown. In some embodiments, a third distance D26 is defined between the end 2133E of each protrusion 2133P of the second shielding part 2133 and the lower surface 211S2 (i.e., between the third surface 2131PS and the lower surface 211S2), and a fourth distance D27 is defined between the lower surface 211S2 and an adjacent one of the pogo pins 23 received in the through-hole, respectively. The fourth distance D27 is greater than the third distance D26, and the difference therebetween is equal to or greater than the compression stroke of the pogo pin 23 so that the compressed pogo pin 23 does not engage with the protrusion 2133P of the second shielding part 2133. Similarly, the first shielding part 2131 also has the above-mentioned technical features for preventing the compressed pogo pin 23 from engaging with the protrusion 2131P of the first shielding part 2131, and related details will not be repeated for brevity.

[0042] Referring to FIG. 3 , a perspective view of a socket assembly 31 according to some embodiments of the present disclosure is shown. Specifically, the socket assembly 31 includes a main body 311 and a plurality of shielding components 313. The main body 311 has an upper surface 311S1. The main body 311 has a plurality of through holes 3110 and a plurality of independent grooves 3112. The grooves 3112 do not communicate with each other. Each groove 3112 is disposed between two adjacent through holes 3110. The shielding components 313 are disposed by being inserted into the grooves 3112. The through holes 3110 receive a plurality of pogo pins 33.

[0043] 4A , a perspective view of a socket assembly 41 according to some embodiments of the present disclosure is shown. Specifically, the socket assembly 41 includes a main body 411 and a plurality of shielding components 413. The main body 411 has an upper surface 411S1. The main body 411 has a plurality of through holes 4110 and a plurality of grooves 4112. Two grooves 4112 are disposed between any two adjacent through holes 4110. The plurality of shielding components 413 are disposed by being inserted into the plurality of grooves 4112. The plurality of through holes 4110 receive a plurality of pogo pins 43.

[0044] 4B, a perspective view of a socket assembly 41′ according to some embodiments of the present disclosure is shown. Specifically, the difference between the socket assembly 41′ and the socket assembly 41 is that the grooves 4112 and the shielding pieces 413 of the socket assembly 41′ are interleaved, which can also achieve the effect of shielding.

[0045] In some embodiments, the width of the groove is smaller than the thickness of the corresponding pogo pin. In some embodiments, the material of the body includes an insulating material to prevent electrical contact between the pogo pins, and the body is monolithic (e.g., by injection molding) to form a block-shaped solid with through holes and grooves. In some embodiments, the material from which the shielding component is made includes a metallic material (e.g., a conductive metallic material) to block signal interference.

[0046] In these embodiments, the shielding component is disposed between any two pogo pins, but the present disclosure is not limited thereto. As will be known to those skilled in the art, in some embodiments, it is not necessary to block signals generated from all pogo pins, so it is possible to provide the shielding component only between pogo pins that need to be shielded (e.g., pogo pins for detecting high-frequency signals).

[0047] Furthermore, it should be noted that the pogo pins in this disclosure are provided for illustrative purposes, and a variety of probe pins are within the contemplated scope of this disclosure.

[0048] In an embodiment, similar components may be shown in the accompanying drawings, but for the sake of brevity and ease of understanding, without imposing limitations on the present disclosure, only one of the similar components is shown in the accompanying drawings. Those skilled in the art should be able to recognize and understand the similar components shown in the accompanying drawings.

[0049] Therefore, an embodiment of the present disclosure provides a plurality of socket assemblies each including a shielding component embedded in the socket assembly and adapted to achieve shielding between pogo pins, so as to reduce signal interference during the test process, thereby effectively improving the stability and accuracy of the test.

[0050] Although the present disclosure and its advantages have been described above, those skilled in the art will understand that various changes, substitutions, and alterations may be made to the present disclosure without departing from the spirit and scope of the present disclosure as defined in the appended claims. For example, the processes described above may be implemented in a different manner or substituted with any other processes or combinations thereof.

[0051] The scope of the present disclosure is not limited to the particular embodiments of any process, machine, manufacture, composition of matter, means, methods, and steps described herein. The disclosure described herein enables one skilled in the art to implement the present disclosure using any existing or potential process, machine, manufacture, composition of matter, means, methods, or steps that have the same function or can achieve substantially the same results as those disclosed in the above-described embodiments. Accordingly, such processes, machines, manufacture, compositions of matter, means, methods, and steps fall within the scope of the appended claims of the present disclosure. [Explanation of symbols]

[0052] 11 Socket Assembly 13 pogo pins 111 Main Unit 1110 Through hole 1110AR1 First through-hole array 1110AR2 Second Through-Hole Array 111S1 Top 111S2 Bottom side 1112 Groove 11120 First groove 11122 Second groove 113, 113A Shielding parts 1131 First shielding part 1131S 1st page 1133 Second shielding part 1133S 2nd side 21 Socket Assembly 211 Main Unit 2110AR1 First through-hole array 2110AR2 Second Through-Hole Array 2110-1 First through hole 2110-2 Second through hole 21120 First groove 21120X 1st opening 21120Y 2nd opening 21122 2nd groove 21122X 3rd opening 21122Y 4th opening 211S1 Top 211S2 Bottom side 211S3 bottom 213 Shielding parts 2131 First shielding part 21310 1st joint 2131P protrusion 2131S 1st page 2131PS 3rd page 2133 Second shielding part 21330 Second joint 2133E End 2133P protrusion 2133S 2nd side 2133PS 4th page 21' Socket Assembly 2131' First shielding part 2131F 1st fixed structure 23 pogo pins 25 Circuit Board 251 Second fixed structure 31 Socket Assembly 311 Main Unit 3110 Through hole 3112 Groove 311S1 Top 313 Shielding parts 33 pogo pin 41 Socket Assembly 411 Main Unit 4110 Through hole 4112 Groove 411S1 Top 413 Shielding parts 41' Socket Assembly 43 Pogo pin D11 1st distance D12 2nd distance D13 1st direction D14 2nd direction D21: First distance between each first surface 2131S and the lower surface 211S2 D22: A second distance between each second surface 2133S and the lower surface 211S2 D23 1st direction D24 2nd direction D25 Thickness between the bottom surface 211S3 and the lower surface 211S2 D26: A third distance between the end 2133E of each protrusion 2133P and the lower surface 211S2 D27: The fourth distance between the lower surface 211S2 and the adjacent one of the pogo pins 23

Claims

1. A socket assembly for use with a chip test socket, the socket assembly including: a body, a plurality of first shielding components, a plurality of second shielding components, and a plurality of pogo pins; The body includes: The top surface and a lower surface opposite to the upper surface; a plurality of first through-hole arrays, each array including a plurality of first through-holes aligned in a first direction; a plurality of second through-hole arrays each including a plurality of second through-holes aligned in a second direction; a plurality of first grooves each extending in the first direction, any two adjacent first through-hole arrays having one of the first grooves disposed therebetween; a plurality of second grooves each extending in the second direction, any two adjacent second through-hole arrays having one of the second grooves disposed therebetween; and Each of the plurality of first shielding components has a first surface and is inserted into the first groove from the top surface, Each of the plurality of second shielding components has a second surface and is inserted into the second groove from the top surface, the plurality of pogo pins are disposed in the first through-hole and the second through-hole; a first distance is defined between each of the first surfaces of the first shielding component and the lower surface; A socket assembly, wherein a second distance is defined between each of the second surfaces of the second shielding component and the lower surface.

2. The socket assembly of claim 1 , wherein the first surfaces are coplanar and the second surfaces are coplanar.

3. The socket assembly of claim 2 , wherein the first surface and the second surface are coplanar.

4. The socket assembly of claim 1 , wherein the first distance is equal to the second distance.

5. 2. The socket assembly of claim 1, wherein the first direction is perpendicular to the second direction, the first grooves and the second grooves are staggered, and the first shielding parts and the second shielding parts are staggered.

6. The socket assembly of claim 5 , wherein each of the first shielding components has a plurality of first mating portions, and the first mating portions receive the second shielding components.

7. The socket assembly of claim 6 , wherein each of the second shielding components has a plurality of second mating portions, the second mating portions receiving the first shielding component.

8. each of the first grooves having a first opening in the upper surface of the body and a plurality of second openings in the lower surface of the body, each of the second openings having a dimension smaller than a dimension of the first opening; 2. The socket assembly of claim 1, wherein each of the second grooves has a third opening in the upper surface of the body and a plurality of fourth openings in the lower surface of the body, each of the fourth openings having a dimension smaller than a dimension of the third opening.

9. 9. The socket assembly of claim 8, wherein at least one of the first shielding parts has a plurality of first protrusions, each of the first protrusions being disposed to penetrate through the second opening of the first groove, and the first protrusions protruding from the lower surface.

10. 10. The socket assembly of claim 9, wherein at least one of the second shielding parts has a plurality of second protrusions, each of the second protrusions being positioned to penetrate through the fourth opening of the second groove, and the second protrusions protruding from the lower surface.

11. 11. The socket assembly of claim 10, wherein a third distance is defined between an end of each of the first and second protrusions and the lower surface, and when a first pogo pin of the pogo pins is received in a corresponding one of the through-holes, a fourth distance is defined between an end of the first pogo pin and the lower surface, and a difference between the fourth distance and the third distance is equal to or greater than a compression stroke of the first pogo pin.

12. 11. The socket assembly of claim 10, wherein each of the first protrusions has a third surface, the third surfaces of the plurality of first protrusions being coplanar, and each of the second protrusions has a fourth surface, the fourth surfaces of the plurality of second protrusions being coplanar.

13. The socket assembly of claim 12 , wherein the third surface and the fourth surface are coplanar.

14. 2. The socket assembly of claim 1, further comprising a circuit board disposed on the top surface of the body, the first shielding component and the second shielding component being electrically connected to the circuit board to form a ground loop.

15. 2. The socket assembly of claim 1, further comprising a circuit board disposed on the top surface of the body, the first shielding component and the second shielding component having a plurality of first fastening structures that engage with a plurality of second fastening structures of the circuit board.

16. The socket assembly of claim 15 , wherein the first fixation structure is electrically connected to the second fixation structure.

17. The socket assembly of claim 1 , wherein a width of the first groove and a width of the second groove are smaller than a thickness of the pogo pin.

18. The socket assembly of claim 1 , wherein the body is made of an insulating material, and the material of the first shielding part and the second shielding part comprises a conductive metallic material.

19. The socket assembly of claim 1 , wherein the first groove and the second groove share a bottom surface within the body, and a thickness is defined between the bottom surface within the body and the lower surface of the body.

20. A socket assembly including a body, a plurality of shielding components, and a plurality of pogo pins; The body includes: a plurality of through holes, at least a first portion of the through holes forming a plurality of first arrays of through holes and at least a second portion of the through holes forming a plurality of second arrays of through holes; a plurality of grooves, at least a first portion of the grooves being disposed between any two adjacent first arrays of through-holes and at least a second portion of the grooves being disposed between any two adjacent second arrays of through-holes; and The plurality of shielding components are inserted into the grooves, The plurality of pogo pins are disposed in the through holes.

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