Heat conduction member, heat radiation unit, electronic apparatus, and assembly method for heat conduction member

Abstract

To provide a heat conduction member capable of stably holding a heat radiation member, heat radiation unit, electronic apparatus, and assembly method for a heat conduction member.SOLUTION: The heat conduction member includes a first heat transfer member, a second heat transfer member disposed apart from the first heat transfer member, a membrane-like member formed of a flexible and elastic material, which is three-dimensionally molded into a tubular shape at least in part from a first end joined to the first heat transfer member toward a second end joined to the second heat transfer member, forming a sealed space between the first heat transfer member and the second heat transfer member, and a filler filled into the sealed space within the membrane-like member.SELECTED DRAWING: Figure 21

Description

[Technical Field]

[0001] The present disclosure relates to a heat conduction member, a heat dissipation unit, an electronic device, and a method for assembling a heat conduction member. [Background technology]

[0002] It is known to dissipate heat generated by electronic components to the outside via heat dissipation components such as heat sinks, heat dissipation fins, heat pipes, etc. In such cases, a thermally conductive material called a TIM (Thermal Interface Material) is sometimes placed between the electronic component and the heat dissipation component to improve thermal conductivity between them.

[0003] For example, Patent Document 1 discloses a configuration in which a thermally conductive gel pack is disposed between an electronic component and a heat dissipation member. In this configuration, the thermally conductive gel pack is sealed in a package having a first layer including a polymer film or thermal tape and a second layer including a polymer film. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Utility Model Registration No. 3191158 Summary of the Invention [Problem to be solved by the invention]

[0005] In the configuration described in Patent Document 1, the thermally conductive gel pack is made of a material that bends with a small force, which may prevent the heat dissipation member attached to the thermally conductive member from being stably held.

[0006] An object of the present disclosure is to provide a heat conduction member, a heat dissipation unit, an electronic device, and a method for assembling a heat conduction member that solves the above-mentioned problems. [Means for solving the problem]

[0007] A heat conduction member according to one aspect of the present disclosure includes a first heat transfer member, a second heat transfer member spaced apart from the first heat transfer member, a film-like member formed from a flexible and elastic film-like material, at least a portion of which is three-dimensionally shaped into a cylindrical shape from a first end joined to the first heat transfer member toward a second end joined to the second heat transfer member, and which forms an enclosed space between the first heat transfer member and the second heat transfer member, and a filler material filled in the enclosed space within the film-like member.

[0008] A method for assembling a heat conduction member according to one aspect of the present disclosure includes a step of three-dimensionally forming a film-like member formed from a flexible and elastic film-like material and having a cylindrical shape from a first end to a second end, joining the first end of the film-like member to a first heat transfer member and joining the second end to a second heat transfer member spaced apart from the first heat transfer member, forming the sealed space within the film-like member between the first heat transfer member and the second heat transfer member, and filling the sealed space with a filler to assemble the heat conduction member. [Effects of the Invention]

[0009] According to the above aspect, the heat dissipation member attached to the heat conduction member can be stably held. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a cross-sectional view illustrating an example of an electronic device including a thermally conductive member according to the present disclosure. [Figure 2] FIG. 2 is a cross-sectional view illustrating an example of a heat conduction member according to the present disclosure. [Figure 3] FIG. 2 is a perspective view of the heat conduction member of the present disclosure, as viewed from the second heat transfer member side. [Figure 4] 1 is a cross-sectional view showing a state in which a heat dissipation member is close to a heat-generating component in a heat conduction member according to the present disclosure. [Figure 5] 1 is a cross-sectional view showing a state in which a first heat transfer member and a second heat transfer member are in contact with each other in a heat conduction member according to the present disclosure. [Figure 6]1A to 1C are diagrams showing the flow of an assembly method for a heat conduction member according to the present disclosure. [Figure 7] 10 is a cross-sectional view showing a state in which a second heat transfer member is placed on a lower mold frame in order to form a film member in the method of assembling a heat conduction member according to the present disclosure. FIG. [Figure 8] 10 is a cross-sectional view showing a state in which an upper mold frame is placed on a lower mold frame to form a film member in the method for assembling a thermal conduction member according to the present disclosure. FIG. [Figure 9] 10 is a cross-sectional view showing a state in which the material of the film-shaped member is filled between the lower mold form and the upper mold form in the method of assembling the thermal conduction member of the present disclosure. FIG. [Figure 10] 10 is a cross-sectional view showing a state in which a film member integrally molded with a second heat transfer member is set in a jig in the method of assembling a heat conduction member according to the present disclosure. FIG. [Figure 11] 10 is a cross-sectional view showing a state in which a filler material is supplied into a film member in the method of assembling a thermal conduction member according to the present disclosure. FIG. [Figure 12] 10 is a cross-sectional view showing a state in which a first heat transfer member and a second heat transfer member are connected via a film-like member in the method of assembling a heat conduction member according to the present disclosure. FIG. [Figure 13] FIG. 2 is a perspective view of the heat conduction member of the present disclosure, as viewed from the second heat transfer member side. [Figure 14] FIG. 2 is a cross-sectional view showing a heat conduction member of the present disclosure. [Figure 15] FIG. 2 is a perspective view of the heat conduction member of the present disclosure, as viewed from the second heat transfer member side. [Figure 16] 10 is a cross-sectional view showing a state in which an elastic piece is elastically deformed in the heat conduction member of the present disclosure. FIG. [Figure 17] FIG. 2 is a cross-sectional view showing a heat conduction member of the present disclosure. [Figure 18] FIG. 2 is a cross-sectional view showing a heat conduction member of the present disclosure. [Figure 19] FIG. 2 is a cross-sectional view showing a heat conduction member of the present disclosure. [Figure 20] FIG. 2 is a cross-sectional view showing a heat conduction member of the present disclosure. [Figure 21] FIG. 2 is a cross-sectional view showing a heat conduction member of the present disclosure. [Figure 22]FIG. 2 is a cross-sectional view showing a heat dissipation unit of the present disclosure. [Figure 23] FIG. 1 is a cross-sectional view showing an electronic device according to the present disclosure. [Figure 24] 1A to 1C are diagrams showing the flow of an assembly method for a heat conduction member according to the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0011] Each embodiment will be described below with reference to the drawings. In all drawings, the same or corresponding components are designated by the same reference numerals, and common descriptions will be omitted. It should be noted that in this disclosure, the drawings may relate to one or more embodiments.

[0012] First Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. FIG. 1 is a cross-sectional view showing an example of an electronic device 200 including a heat conducting member 100A according to the present disclosure. As shown in FIG. 1, an electronic device 200 according to the present disclosure includes a substrate 220 on which a heat-generating component 210 is mounted, and a heat dissipation unit 300. The heat-generating component 210 generates heat during operation. Examples of the heat-generating component 210 include an IC (Integrated Circuit) and an inverter. The heat-generating component 210 is mounted on a substrate 220 having a circuit section with a predetermined pattern. One surface of the heat-generating component 210 faces the substrate 220.

[0013] The heat dissipation unit 300 dissipates heat generated by the heat-generating component 210 to the outside. The heat dissipation unit 300 includes a heat dissipation member 310 and a heat conduction member 100A. The heat dissipation member 310 dissipates heat transmitted from the heat-generating component 210 via the thermal conduction member 100A to the outside. The heat dissipation member 310 dissipates the heat from the heat-generating component 210 into the surrounding atmosphere. The heat dissipation member 310 is made of metal. The heat dissipation member 310 is, for example, a heat sink, a heat dissipation fin, a heat pipe, or the like. The heat dissipation member 310 of the present disclosure is a heat sink having a plurality of heat dissipation fins 311.

[0014] 2 is a cross-sectional view showing an example of a heat transfer member 100A according to the present disclosure. As shown in FIGS. 1 and 2, the heat transfer member 100A includes a first heat transfer member 10, a second heat transfer member 20, a film member 30A, and a filler 40.

[0015] The first heat transfer member 10 and the second heat transfer member 20 are spaced apart from each other. Each of the first heat transfer member 10 and the second heat transfer member 20 has a flat plate shape extending along a plane intersecting the direction in which the first heat transfer member 10 and the second heat transfer member 20 are spaced apart from each other. As shown in FIG. 1 , one of the first heat transfer member 10 and the second heat transfer member 20 is provided so as to be in contact with the heat dissipation member 310. One surface 10f of the first heat transfer member 10 of the present disclosure is in contact with the bottom surface of the heat dissipation member 310. A thin material for reducing contact thermal resistance may be interposed between the one surface 10f of the first heat transfer member 10 and the bottom surface of the heat dissipation member 310. The bottom surface of the heat dissipation member 310 is, for example, flat. The one surface 10f of the first heat transfer member 10 and the bottom surface of the heat dissipation member 310 are in surface contact. Note that, for example, if the bottom surface of the heat dissipation member 310 is not flat but has a step, the first heat transfer member 10 may have a shape that engages with the bottom surface of the heat dissipation member 310 rather than being flat.

[0016] The other of the first heat transfer member 10 and the second heat transfer member 20 is provided so as to contact the heat-generating component 210. One surface 20g of the second heat transfer member 20 of the present disclosure is in contact with the upper surface of the heat-generating component 210. A thin material for reducing contact thermal resistance may be interposed between the one surface 20g of the second heat transfer member 20 and the upper surface of the heat-generating component 210. The upper surface of the heat-generating component 210 is, for example, flat. The one surface 20g of the second heat transfer member 20 and the upper surface of the heat-generating component 210 are in surface contact. Note that, for example, if the upper surface of the heat-generating component 210 is not flat but has a step, the second heat transfer member 20 may have a shape that engages with the upper surface of the heat-generating component 210 rather than being flat.

[0017] 2, the outer dimension D1 of the first heat transfer member 10 of the present disclosure is larger than, for example, the outer dimension D2 of the second heat transfer member 20. In other words, the area of ​​the first heat transfer member 10 is larger than the area of ​​the second heat transfer member 20 when viewed from a direction in which the first heat transfer member 10 and the second heat transfer member 20 of the present disclosure are separated from each other. The outer dimension D1 of the first heat transfer member 10 may be smaller than the outer dimension D2 of the second heat transfer member 20. Alternatively, the outer dimension D1 of the first heat transfer member 10 and the outer dimension D2 of the second heat transfer member 20 may be the same.

[0018] Examples of materials for forming the first heat transfer member 10 and the second heat transfer member 20 include metals with high thermal conductivity such as gold, silver, copper, magnesium, zinc, and iron, alloys containing gold, silver, copper, magnesium, zinc, and the like (for example, stainless steel, brass, phosphor bronze, and zinc die-cast), and ceramics such as aluminum nitride and silicon carbide. When a metal or an alloy is used, the surfaces of the first heat transfer member 10 and the second heat transfer member 20 may be plated with nickel, nickel phosphorus, or the like to prevent corrosion and alloying.

[0019] FIG. 3 is a perspective view of a heat conduction member 100A of the present disclosure as viewed from the second heat transfer member 20 side. As shown in FIGS. 2 and 3 , the film member 30A is formed from a flexible and elastic film-like material. When viewed from the direction in which the first heat-transfer member 10 and the second heat-transfer member 20 are spaced apart, the film member 30A has a rectangular shape and an opening 30h in its center. At least a portion of the film member 30A is cylindrically formed from a first end 30p located on the outer periphery of the film member 30A toward a second end 30q on the other side, which forms the inner periphery of the opening 30h of the film member 30A. The film member 30A of the present disclosure is pre-formed into at least a truncated pyramid shape so that the outer dimensions along a plane intersecting the direction in which the first heat-transfer member 10 and the second heat-transfer member 20 are spaced apart gradually decrease from the first end 30p toward the second end 30q.

[0020] The film-like member 30A is formed from a film-like or sheet-like elastic material that is flexible and elastic (stretchable). The film-like member 30A of the present disclosure is formed from a material containing, for example, a film-like rubber such as silicone rubber or a stretchable resin such as PET (polyethylene terephthalate).

[0021] As shown in FIGS. 1 to 3, one first end portion 30p located on the outer peripheral edge portion of the film-shaped member 30A is joined to the first heat-transfer member 10. As shown in FIGS. 1 and 2, one first end portion 30p of the film-shaped member 30A of the present disclosure is joined to the outer peripheral portion of the other surface 10g of the first heat-transfer member 10 with an adhesive 37, such as a thermosetting silicone adhesive. The other second end portion 30q forming the inner peripheral edge portion of the opening 30h of the film-shaped member 30A is joined to the second heat-transfer member 20. The other second end portion 30q of the film-shaped member 30A of the present disclosure is, for example, integrally molded with the outer peripheral portion of the one surface 20g of the second heat-transfer member 20. The other second end portion 30q of the film-shaped member 30A may be joined to the outer peripheral portion of the one surface 20g of the second heat-transfer member 20 with, for example, an adhesive.

[0022] Such a film-like member 30A forms an enclosed space S between the first heat-transfer member 10 and the second heat-transfer member 20. A filler 40, which will be described later, is filled in the enclosed space S. The film-like member 30A has an elastically deforming portion 30f between the first end portion 30p and the second end portion 30q. As will be described in detail later, the elastically deforming portion 30f can expand and contract when the first heat-transfer member 10 and the second heat-transfer member 20 are displaced relative to each other in directions toward and away from each other.

[0023] In this way, the first heat transfer member 10 and the second heat transfer member 20, which are arranged via a membrane-like member 30A, at least a portion of which has been three-dimensionally formed into a cylindrical shape in advance, are maintained apart from each other due to the rigidity (shape retention) of the membrane-like member 30A itself.

[0024] In such a heat conduction member 100A, when viewed from the direction in which the first heat transfer member 10 and the second heat transfer member 20 are separated from each other, the first end 30p of the film-like member 30A is located closer to the outer periphery than the second heat transfer member 20. On the other hand, the second end 30q is joined to one surface 20g of the second heat transfer member 20. As a result, when the heat conduction member 100A is compressed in the direction in which the first heat transfer member 10 and the second heat transfer member 20 approach each other, the film-like member 30A does not exist between the first heat transfer member 10 and the second heat transfer member 20, and the first heat transfer member 10 and the second heat transfer member 20 can be displaced to a position where they come into contact with each other.

[0025] The filler 40 fills the sealed space S in the film member 30A. A liquid metal can be used as the filler 40. Examples of the liquid metal used for the filler 40 include one containing at least one of gallium (Ga) and indium (In). Furthermore, the liquid metal used for the filler 40 may contain tin (Sn), bismuth (Bi), or zinc (Zn). A metal filler having a higher thermal conductivity than the liquid metal may be mixed into the liquid metal. Alternatively, a metal powder or a conductive paste may be used as the filler 40.

[0026] 1, in such electronic device 200, heat generated in heat-generating component 210 is efficiently transferred to heat-dissipating member 310 via second heat-transfer member 20, filler 40, and first heat-transfer member 10. Therefore, heat-generating component 210 is efficiently cooled.

[0027] In electronic device 200, the gap between heat-generating component 210 and heat dissipation member 310 must be designed to accommodate the dimensional tolerances of the components. For example, if the flatness of heat dissipation member 310 is ±0.05 mm, the positioning accuracy of heat dissipation member 310 is ±0.1 mm, the thickness accuracy of heat-generating component 210 is ±0.2 mm, and the flatness accuracy of the board is ±0.2 mm, then the root mean square variation in the gap between heat-generating component 210 and heat dissipation member 310 is ±0.3 mm. Even with such a simple configuration, taking these variations into account, the thermal conductive member 100A, which is inserted in the gap between heat-generating component 210 and heat dissipation member 310, must have a thickness and deformability of at least 0.6 mm. Furthermore, when considering actually incorporating the thermal conductive member 100A into the electronic device 200, taking into account the complexity of the structure and the safety factor, a thickness deformability is required to accommodate gaps and variations of, for example, about 1.0±0.5 mm.

[0028] FIG. 4 is a cross-sectional view showing a state in which heat dissipation member 310 approaches heat-generating component 210 in heat conduction member 100A of the present disclosure. 4, when the heat conduction member 100A is compressed in a direction in which the first heat transfer member 10 and the second heat transfer member 20 approach each other, the filler 40 that was present between the first heat transfer member 10 and the second heat transfer member 20 is pushed outward as the first heat transfer member 10 and the second heat transfer member 20 approach each other. To accommodate the pushed-out filler 40, the elastic deformation portion 30f deforms or stretches so as to expand.

[0029] FIG. 5 is a cross-sectional view showing a state in which the first heat transfer member 10 and the second heat transfer member 20 are in contact with each other in a heat conduction member 100A of the present disclosure. 5, when the heat conduction member 100A is further compressed and the first heat transfer member 10 and the second heat transfer member 20 come into contact with each other, all of the filler 40 that was present between the first heat transfer member 10 and the second heat transfer member 20 is pushed outward. As a result, the elastically deforming portion 30f deforms or stretches to bulge further than in the state shown in FIG. 4 to accommodate this.

[0030] 4, when the compression amount of the heat conduction member 100A is reduced from the state shown in Fig. 5, the restoring force of the film member 30A causes the elastic deformation portion 30f to deform so as to contract toward the inner periphery, and part of the filler 40 enters between the first heat transfer member 10 and the second heat transfer member 20. As a result, the first heat transfer member 10 and the second heat transfer member 20 are separated from each other, and the thickness of the heat conduction member 100A increases. Furthermore, when the compression of heat conducting member 100A is completely released, elastically deforming portion 30f returns to its original shape, and heat conducting member 100A returns to its original thickness, as shown in FIG.

[0031] In this way, it is possible to realize the thickness required for stable thermal connection of the gap between heat generating component 210 and heat dissipation member 310, and the thickness deformability that follows the gap variation. As shown in FIG. 4, when the heat conduction member 100A is not compressed, the internal pressure of the sealed space S is P0, the load of the first heat transfer member 10 is Wp, the load of the filler 40 is Wm, and the total area to which the load is applied is A. P0=W0 / A (where W0=Wp+Wm) This becomes:

[0032] 4, the elastically deforming portion 30f needs to start deforming or elongating when the internal pressure P exceeds P0. Conversely, when the internal pressure P falls below P0, it is desirable to minimize the deformation or elongation of the elastically deforming portion 30f. This is because it is desirable to minimize the amount of filler 40 used to obtain the thickness required to fill the gap.

[0033] As shown in FIG. 2, the force F0 that deforms or stretches the elastically deformable portion 30f due to the internal pressure P0 in the initial state is expressed as follows, where A0 is the area of ​​the elastically deformable portion 30f that receives the pressure. F0=P0×A0 This becomes: The deformation or elongation v occurring in the elastically deforming portion 30f when subjected to a force F0 in the initial state can be calculated, for example, by simply approximating it to a cantilever beam. The deformation or elongation v is given by the following equation: where h is the structural equivalent thickness of the membrane member 30A, b is the sheet width, E is the elastic modulus, and a is the length of the free portion. v=F0×a 3 / 3 / E / I (where I=b×h 3 / 12) This becomes:

[0034] The structural equivalent thickness of the membrane member 30A refers to an approximate thickness that takes into account the rigidity of the sheet of the membrane member 30A itself and the three-dimensional shape. For example, the first heat transfer member 10 is a copper plate (specific gravity 8.9) having dimensions of 36 mm length x 36 mm width x 0.2 mm thickness, the second heat transfer member 20 is a copper plate (specific gravity 8.9) having dimensions of 23 mm length x 23 mm width x 0.2 mm thickness, the separation distance between the first heat transfer member 10 and the second heat transfer member 20 is 0.8 mm, and the filler 40 is a liquid metal (Ga / In, specific gravity 6.2). The load Wp of the first heat transfer member 10 is 2.3 gf, the load Wm of the filler 40 is 5.2 gf, and the total area A to which the load is applied is 1300 mm 2 , the area A0 subjected to pressure at the elastic deformation portion 30f = 216 mm 2 This results in: W0 = 7.6 gf, and the internal pressure P0 of the sealed space S in the initial state in which the heat conductive member 100A is not compressed is 5.7 × 10 (-5) MPa. Also, the initial force F0 = 0.0124 N.

[0035] If the membrane member 30A is made of silicone rubber with a structural equivalent thickness h of 0.8 mm, a sheet width b of 36 mm, and an elastic modulus E of 3 MPa (hardness of approximately 50 degrees), and the length of the free portion a is 6 mm, the deformation or elongation v of the elastically deforming portion 30f is sufficiently small, at 0.024 mm. Therefore, the amount of filler 40 that flows into the elastically deforming portion 30f is very small, meaning that the amount of filler 40 needed to fill the gaps in the heat conduction member 100A can be reduced.

[0036] Furthermore, when the heat transfer member 100A is displaced to its maximum, that is, when the first heat transfer member 10 and the second heat transfer member 20 are displaced to a position where they come into contact with each other as shown in Fig. 5, the elastic deformation portion 30f needs to be sufficiently deformed or stretched. If the elastic deformation portion 30f is not sufficiently deformed or stretched, the heat transfer member 100A cannot be compressed to the required thickness, and the internal pressure of the sealed space S becomes excessively large. The internal pressure Pz at maximum displacement is given by the load Wd at maximum displacement and the total area to which the load is applied A. Pz=Wz / A (where Wz=Wp+Wm+Wd) This becomes: The force Fz that causes deformation or elongation in the elastic deformation portion 30f due to the internal pressure Pz at the time of maximum displacement is expressed as follows, where Az is the area of ​​the elastic deformation portion 30f that receives the pressure. Fz=Pz×Az This becomes: In this case, the area Az is determined by the volume of the displaced filler 40. To simplify the cross-section, let D be the cross-sectional area of ​​the displaced filler 40, and if this is deformed into a circle, the radius of the circle is R = (D / π) 0.5 The circumferential length L=2×π×R at this time is multiplied by the sheet width b of the film member 30A and used as Az. For example, if the load at maximum displacement is Wz 2.7 kgf and Az = 171, then Pz = 0.02 MPa and Fz = 3.5 N. When the deformation or elongation v occurring in the elastically deforming portion 30f due to the force Fz is calculated by simply approximating it to a cantilever beam, the structural equivalent thickness h of the membrane member 30A, the sheet width b, the elastic modulus E, and the length a of the free portion are given as follows: v=Fz×a 3 / 3 / E / I (where I=b×h 3 / 12) This becomes: This results in a deformation or elongation v of 6.8 mm for the film member 30A. This is sufficient deformation or elongation, and therefore can fully accommodate the filler 40 flowing into the inside of the elastically deforming portion 30f. In other words, the heat conduction member 100A can exhibit sufficient displacement capability. In this way, it is possible to save on the amount of filler 40 to be filled, while forming a thickness that will stably thermally connect the gap between the heat-generating component 210 and the heat-dissipating member 310, and achieving thickness deformability that will allow for variations in the gap.

[0037] In addition, this structure can achieve extremely high heat transfer while maintaining thickness deformability to accommodate gap variations. For example, suppose copper plates are used for the first heat transfer member 10 and the second heat transfer member 20, and a Ga / In liquid metal is used for the filler 40. In this case, the equivalent thermal conductivity of this structure (the apparent thermal conductivity when viewed as a single material) is λ, the thermal conductivity of copper is λCu, the thermal conductivity of the liquid metal is λLM, the thickness of copper is LCu, the thickness of the liquid metal (the distance between the first heat transfer member 10 and the second heat transfer member 20) is LLM, and the heat transfer area is A, as shown in the following equation: (LCu + LLM) / (A×λ)=LCu / (A×λCu) +LLM / (A×λLM)+ LCu / (A×λCu) Here, when LCu is 0.2 mm, LLM is 0.8 mm, λCu is 398 W / mK, and λLM is 21 W / mK, the equivalent thermal conductivity is calculated as λ = 30.7 W / mK. Such a heat conductive member 100A can be said to have an extremely high thermal conductivity, even compared to the thermal conductivity of general TIM materials that have deformability, which is 5 to 10 W / mK.

[0038] Next, a method for assembling the above-described heat conducting member 100A will be described. FIG. 6 is a diagram showing the flow of a method for assembling the heat conduction member 100A of the present disclosure. As shown in FIG. 6, the method for assembling the heat conducting member 100A of the present disclosure includes a step S11 of forming the film member 30A and a step S12 of assembling the heat conducting member 100A.

[0039] Fig. 7 is a cross-sectional view showing a state in which the second heat transfer member 20 is placed on a lower frame 401 to form the film member 30A in the method of assembling the heat conduction member 100A of the present disclosure. Fig. 8 is a cross-sectional view showing a state in which the upper frame 402 is placed on the lower frame 401 to form the film member 30A in the method of assembling the heat conduction member 100A of the present disclosure. As shown in Fig. 7, in step S11 of molding the membrane member 30A, the second heat transfer member 20 is placed on a lower mold frame 401 having a predetermined shape. Then, as shown in Fig. 8, an upper mold frame 402 having a predetermined shape is placed on the lower mold frame 401. A cavity 403 for forming the membrane member 30A is formed between the lower mold frame 401 and the upper mold frame 402.

[0040] FIG. 9 is a cross-sectional view showing a state in which the material of the film member 30A is filled between the lower mold frame 401 and the upper mold frame 402. 9, a predetermined material for forming the membrane member 30A is injected into the cavity 403 through an injection port 402h formed in the upper mold frame 402. After the injected material has hardened, the membrane member 30A integrally molded with the second heat transfer member 20 is removed from the lower mold frame 401 and the upper mold frame 402.

[0041] Fig. 10 is a cross-sectional view showing a state in which a film member 30A integrally molded with a second heat transfer member 20 is set in a jig 501 in the method for assembling a heat conduction member 100A according to the present disclosure. Fig. 11 is a cross-sectional view showing a state in which a filler 40 is supplied into the film member 30A in the method for assembling a heat conduction member 100A according to the present disclosure. 10, in step S12 of assembling the heat conduction member 100A, first, the film-shaped member 30A integrally molded with the second heat transfer member 20 is set in a jig 501. Next, as shown in Fig. 11, adhesive 37 is applied to the first end portion 30p of the film-shaped member 30A. Next, filler 40 is supplied into the film-shaped member 30A.

[0042] FIG. 12 is a cross-sectional view showing a state in which the first heat transfer member 10 and the second heat transfer member 20 are connected via a film member 30A in the method for assembling the heat conduction member 100A of the present disclosure. 12, the first heat transfer member 10 is placed on the first end portion 30p of the film-shaped member 30A and pressed from above. As a result, the first heat transfer member 10 is bonded to the first end portion 30p of the film-shaped member 30A via the adhesive 37. In this way, the first heat transfer member 10 and the second heat transfer member 20 are connected via the film-shaped member 30A, and an enclosed space S is formed between the first heat transfer member 10 and the second heat transfer member 20 inside the film-shaped member 30A. In this manner, the assembly of the heat conducting member 100A as shown in FIG. 2 is completed.

[0043] The heat conduction member 100A of this embodiment includes a film-like member 30A, at least a portion of which is three-dimensionally formed into a cylindrical shape from the first end 30p to the second end 30q, and which forms an enclosed space S between the first heat transfer member 10 and the second heat transfer member 20. Therefore, the shape retention of the three-dimensionally formed film member 30A allows the first heat transfer member 10 and the second heat transfer member 20 to stably support the heat dissipation member 310 and the heat generating component 210 that are in contact with each other.

[0044] In the heat conduction member 100A of the present embodiment, the first heat transfer member 10 and the second heat transfer member 20 are flat plate-shaped, which allows the first heat transfer member 10 and the second heat transfer member 20 to more stably support the heat dissipation member 310 and the heat-generating component 210 that are in contact with each other.

[0045] In the heat conduction member 100A of this embodiment, the first end portion 30p is joined to the outer periphery of the first heat transfer member 10, and the second end portion 30q is joined to the outer periphery of the second heat transfer member 20. Therefore, even if the gap between the first heat transfer member 10 and the second heat transfer member 20 is narrow, the volume of the sealed space S formed in the film member 30A can be made large, and the amount of filler 40 can be increased. Therefore, while the heat conduction member 100A can be made thinner, heat can be efficiently transferred between the first heat transfer member 10 and the second heat transfer member 20 via the filler 40.

[0046] In the heat conduction member 100A of this embodiment, the outer dimensions of the first heat transfer member 10 are larger than the outer dimensions of the second heat transfer member 20. Therefore, the film member 30A can be shaped so that the outer dimensions gradually decrease from the first end 30p to the second end 30q, and the rigidity of the film member 30A itself makes it easy to ensure shape retention.

[0047] In the heat conduction member 100A of this embodiment, the film member 30A has an elastically deformable portion 30f between the first end portion 30p and the second end portion 30q. Therefore, the elastically deformable portion 30f is elastically deformable in the direction in which the first heat transfer member 10 and the second heat transfer member 20 move toward or away from each other. Furthermore, the elastically deformable portion 30f is elastically deformable in response to the movement of the filler 40 that is extruded from between the first heat transfer member 10 and the second heat transfer member 20 as the first heat transfer member 10 and the second heat transfer member 20 move toward or away from each other.

[0048] In the heat conduction member 100A of this embodiment, the filler 40 contains at least one of gallium (Ga) and indium (In). This liquid metal has high thermal conductivity and is in a liquid state at room temperature. Therefore, when the distance between the first heat transfer member 10 and the second heat transfer member 20 changes due to a load or the like acting on the heat conduction member 100A, the filler 40 easily moves within the sealed space S accordingly.

[0049] The heat dissipation unit 300 of this embodiment includes the heat conduction member 100 A. Therefore, it is possible to provide the heat dissipation unit 300 including the heat conduction member 100 A that can stably hold the heat dissipation member 310 .

[0050] The electronic device 200 of this embodiment includes the heat conducting member 100A, which allows the electronic device 200 to be provided with the heat conducting member 100A that can stably hold the heat dissipation member 310.

[0051] The method for assembling heat conduction member 100A of this embodiment can assemble and provide heat conduction member 100A that can stably hold heat dissipation member 310.

[0052] Second Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. Fig. 13 is a perspective view of a heat conduction member 100B of the present disclosure, as viewed from the side of second heat transfer member 20. Fig. 14 is a cross-sectional view showing a heat conduction member 100B of the present disclosure. As shown in FIGS. 13 and 14, a heat conduction member 100B of the present disclosure includes a first heat transfer member 10, a second heat transfer member 20, a film-shaped member 30B, and a filler 40.

[0053] The membrane member 30B of the present disclosure includes ribs 38 in addition to the membrane member 30A. The membrane member 30B is formed from a flexible and elastic membrane material. At least a portion of the membrane member 30B is formed cylindrically from a first end 30p located on the outer periphery of the membrane member 30B to a second end 30q on the other side, which forms the inner periphery of the opening 30h of the membrane member 30B. The membrane member 30B of the present disclosure is pre-formed into a truncated pyramidal shape so that the outer dimensions along a plane intersecting the direction in which the first heat transfer member 10 and the second heat transfer member 20 are separated gradually decrease from the first end 30p to the second end 30q between the first end 30p and the second end 30q.

[0054] A plurality of ribs 38 are provided on each of the four sides of the second end portion 30q joined to the outer peripheral edge portion of the rectangular second heat transfer member 20. In the present disclosure, three ribs 38 are provided on each of the four sides of the second end portion 30q. When viewed from the direction in which the first heat transfer member 10 and the second heat transfer member 20 are separated from each other, each rib 38 extends perpendicularly from the second end portion 30q, which extends along the outer peripheral edge portion of the second heat transfer member 20, toward the first end portion 30p. Each rib 38 is formed so that its height gradually decreases from the first end portion 30p toward the second end portion 30q.

[0055] Similar to the above-described embodiments, the heat conduction member 100B of this embodiment includes a film member 30B that is three-dimensionally formed into a cylindrical shape at least partially from the first end portion 30p to the second end portion 30q. Therefore, the shape retention of the three-dimensionally formed film member 30B can stably support the heat dissipation member 310 and the heat-generating component 210 that are in contact with the first heat transfer member 10 and the second heat transfer member 20.

[0056] In the heat conduction member 100B of this embodiment, the film member 30B has ribs 38. This increases the rigidity of the three-dimensionally molded film member 30B, thereby enhancing its shape retention. As a result, the first heat transfer member 10 and the second heat transfer member 20 can stably support the heat dissipation member 310 and the heat-generating component 210 that come into contact with them.

[0057] Third Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. Fig. 15 is a perspective view of heat conduction member 100C of the present disclosure, viewed from the side of second heat transfer member 20. Fig. 16 is a cross-sectional view showing a state in which elastic piece 39 is elastically deformed in heat conduction member 100C of the present disclosure. As shown in FIGS. 15 and 16, a heat conduction member 100C of the present disclosure includes a first heat transfer member 10, a second heat transfer member 20, a film member 30A, and a filler .

[0058] The heat conduction member 100C of the present disclosure includes elastic pieces 39. The elastic pieces 39 are provided on all four sides of the rectangular first heat transfer member 10. The elastic pieces 39 have a base end (end) 39a joined to one of the first heat transfer member 10 and the second heat transfer member 20. The elastic pieces 39 extend from the base end 39a along the surface of the film-shaped member 30A toward the other of the first heat transfer member 10 and the second heat transfer member 20. The base end 39a of the elastic pieces 39 of the present disclosure is joined to the outer periphery of the first heat transfer member 10 (one of the heat transfer members). Therefore, the outer periphery of the first heat transfer member 10 of the present disclosure protrudes outward from the first end 30p of the film-shaped member 30A. The elastic pieces 39 extend from the base end 39a along the surface of the film-shaped member 30A toward the second heat transfer member 20 (the other heat transfer member). The tip end 39b of the elastic piece 39 of the present disclosure is in contact with the elastic deformation portion 30f on the outer circumferential side of the second end portion 30q. The tip end 39b of the elastic piece 39 is curved in a direction away from the surface of the elastic deformation portion 30f so as not to bite into the elastic deformation portion 30f. Such elastic piece 39 can be made of a spring material such as phosphor bronze or a resin material such as polycarbonate.

[0059] 16 , when the heat conduction member 100C is compressed in a direction that brings the first heat transfer member 10 and the second heat transfer member 20 closer to each other, the filler 40 that was present between the first heat transfer member 10 and the second heat transfer member 20 is pushed outward in response to the approaching of the first heat transfer member 10 and the second heat transfer member 20, and the elastically deforming portion 30f is deformed or stretched so as to bulge outward. At this time, the elastic piece 39 is pressed by the elastically deforming portion 30f of the membrane member 30A, and the tip end 39b is elastically deformed in a direction away from the first heat transfer member 10 relative to the base end 39a. As a result, the elastic piece 39 exerts a restoring force that attempts to return to its original shape, pressing the elastically deforming portion 30f toward the inside of the sealed space S. In this way, the elastic piece 39 suppresses deformation of the membrane member 30A.

[0060] Similar to the above-described embodiments, the heat conduction member 100C of this embodiment includes a film member 30A that is three-dimensionally formed into a cylindrical shape at least partially from the first end portion 30p to the second end portion 30q. Therefore, the shape retention of the three-dimensionally formed film member 30A can stably support the heat dissipation member 310 and the heat-generating component 210 that are in contact with the first heat transfer member 10 and the second heat transfer member 20.

[0061] The heat conduction member 100C of this embodiment has elastic pieces 39. Therefore, when the heat conduction member 100C is compressed in the direction in which the first heat transfer member 10 and the second heat transfer member 20 approach each other, deformation of the film-shaped member 30A can be suppressed. This suppresses deformation of the heat conduction member 100C in the direction in which the first heat transfer member 10 and the second heat transfer member 20 approach each other. Therefore, the heat dissipation member 310 and the heat-generating component 210 that come into contact with the first heat transfer member 10 and the second heat transfer member 20 can be stably supported. Furthermore, by supporting the film-shaped member 30A with the elastic pieces 39, it is possible to reduce the thickness of the material forming the film-shaped member 30A.

[0062] (Another modification of one embodiment) Although the film-like members 30A and 30B are exemplified in the above embodiment, the configuration thereof can be modified as appropriate. For example, in the film-like members 30A and 30B, the bonding widths of the first end portion 30p and the second end portion 30q with respect to the first heat-transfer member 10 and the second heat-transfer member 20 (the widths of the bonding portions in a direction intersecting the direction in which the first heat-transfer member 10 and the second heat-transfer member 20 are separated) may be wider or narrower than the bonding widths shown in the drawings. Furthermore, the shapes of the film members 30A and 30B can also be modified as appropriate, as shown in the following modified examples.

[0063] FIG. 17 is a cross-sectional view showing a heat conduction member of the present disclosure. 17, in a film member 30D of a heat conduction member 100D according to a modification of the present disclosure, a first end portion 30p is joined to the outer periphery of the other surface 10g of the first heat transfer member 10. A second end portion 30q of the film member 30D is joined to the outer periphery of one surface 20g of the second heat transfer member 20. The film member 30D has a cylindrical wall portion 30w between the first end portion 30p and the second end portion 30q, which extends in a direction separating the first heat transfer member 10 and the second heat transfer member 20.

[0064] FIG. 18 is a cross-sectional view showing a heat conduction member 100E of the present disclosure. As shown in FIG. 18, a heat conduction member 100E of the present disclosure includes a first heat transfer member 10, a second heat transfer member 20, a film-shaped member 30E, and a filler 40.

[0065] The film member 30E is formed from a flexible and elastic film-like material. The film member 30E includes a first film material 31 and a second film material 32. One end of the first film material 31 is joined to the outer periphery of the first heat transfer member 10 as a first end portion 30p of the film member 30E. One end of the inner periphery of the first film material 31 of the present disclosure is joined to the other surface 10g of the first heat transfer member 10. One end of the second film material 32 is joined to the outer periphery of the second heat transfer member 20 as a second end portion 30q of the film member 30E. One end of the inner periphery of the second film material 32 of the present disclosure is joined to the other surface 20f of the second heat transfer member 20. The other end of the outer periphery of the first film material 31 and the other end of the outer periphery of the second film material 32 are joined to each other at a position protruding outward from the first heat transfer member 10 and the second heat transfer member 20. In this way, the film member 30E is configured to be elastically deformable in the direction in which the first heat transfer member 10 and the second heat transfer member 20 move toward and away from each other.

[0066] FIG. 19 is a cross-sectional view showing a heat conduction member 100F of the present disclosure. As shown in FIG. 19, a heat conducting member 100F of the present disclosure includes an elastic member 391 in addition to the components of the heat conducting member 100F shown in FIG.

[0067] The elastic member 391 is arranged to sandwich the joint between the other outer peripheral end of the first membrane material 31 and the other outer peripheral end of the second membrane material 32. The elastic member 391 integrally includes a first piece 391a, a second piece 391b, and a connecting portion 391c. The first piece 391a extends along the other outer peripheral end of the first membrane material 31. The second piece 391b extends along the other outer peripheral end of the second membrane material 32. The connecting portion 391c connects the first piece 391a and the second piece 391b outside the other outer peripheral end of the first membrane material 31 and the other outer peripheral end of the second membrane material 32.

[0068] Such an elastic member 391 prevents the first film-like material 31 and the second film-like material 32 from deforming and expanding when the filler material 40 is pushed out from between the first heat transfer member 10 and the second heat transfer member 20 toward the outer periphery as the heat conduction member 100F deforms so that the first heat transfer member 10 and the second heat transfer member 20 approach each other.

[0069] (Still another modification of one embodiment) In the above embodiment, the center of the first heat transfer member 10 and the center of the second heat transfer member 20 are arranged coaxially, but the present invention is not limited to this. FIG. 20 is a cross-sectional view showing a heat conduction member of the present disclosure. 20 , in a heat conduction member 100G according to a modified example of the present disclosure, an outer dimension D3 of a first heat transfer member 10G is larger than an outer dimension D2 of a second heat transfer member 20. The first heat transfer member 10G may be provided offset relative to the second heat transfer member 20 in a direction intersecting the direction in which the first heat transfer member 10G and the second heat transfer member 20 are separated from each other. In other words, a central portion 10c of the first heat transfer member 10G may be offset relative to a central portion 20c of the second heat transfer member 20 in a direction intersecting the direction in which the first heat transfer member 10G and the second heat transfer member 20 are separated from each other.

[0070] A first end 30p of a film member 30G of the heat conduction member 100G is joined to the outer periphery of the first heat transfer member 10. A second end 30q of the film member 30G is joined to the outer periphery of the second heat transfer member 20.

[0071] <Fourth embodiment> Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 21, a heat conduction member 100H of the present disclosure includes a first heat transfer member 10, a second heat transfer member 20, a film member 30H, and a filler 40. The second heat transfer member 20 is provided spaced apart from the first heat transfer member 10 .

[0072] The film-shaped member 30H is formed from a film-shaped material having flexibility and elasticity. One first end 30p of the film-shaped member 30H is joined to the first heat-transfer member 10. The other second end 30q of the film-shaped member 30H is joined to the second heat-transfer member 20. At least a portion of the film-shaped member 30H from the first end 30p to the second end 30q is three-dimensionally shaped into a cylindrical shape. The film-shaped member 30H forms an enclosed space S between the first heat-transfer member 10 and the second heat-transfer member 20. The filler 40 is filled in the sealed space S within the membrane member 30H.

[0073] The heat conduction member 100H of this embodiment includes a film-like member 30H that is three-dimensionally shaped into a cylindrical shape at least partially from the first end 30p to the second end 30q, and forms an enclosed space S between the first heat transfer member 10 and the second heat transfer member 20. Therefore, the shape retention of the three-dimensionally formed film member 30H allows the first heat transfer member 10 and the second heat transfer member 20 to stably support the heat dissipation member 310 and the heat generating component 210 that are in contact with each other.

[0074] Fifth Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 22, a heat dissipation unit 300I of the present disclosure includes a heat conduction member 100I and a heat dissipation member 310. The heat conduction member 100I includes a first heat transfer member 10, a second heat transfer member 20, a film-like member 30I, and a filler . The second heat transfer member 20 is provided spaced apart from the first heat transfer member 10 .

[0075] The film-shaped member 30I is formed from a film-shaped material that is flexible and elastic. One first end 30p of the film-shaped member 30I is joined to the first heat-transfer member 10. The other second end 30q of the film-shaped member 30I is joined to the second heat-transfer member 20. At least a portion of the film-shaped member 30I from the first end 30p to the second end 30q is three-dimensionally shaped into a cylindrical shape. The film-shaped member 30I forms an enclosed space S between the first heat-transfer member 10 and the second heat-transfer member 20. The filler 40 is filled in the sealed space S within the membrane member 30I.

[0076] The heat dissipation member 310 is provided so as to be in contact with one of the first heat transfer member 10 and the second heat transfer member 20. The heat dissipation member 310 of the present disclosure is provided so as to be in contact with the first heat transfer member 10. The heat dissipation member 310 dissipates heat transferred from the heat-generating component 210 via the heat conduction member 100I to the outside. The heat-generating component 210 is provided so as to be in contact with the other of the first heat transfer member 10 and the second heat transfer member 20. The heat-generating component 210 of the present disclosure is provided so as to be in contact with the second heat transfer member 20. The heat-generating component 210 has heat-generating properties.

[0077] The heat conduction member 100I of the heat dissipation unit 300I of this embodiment is provided with a film-like member 30I that is three-dimensionally shaped into a cylindrical shape at least in part from the first end 30p to the second end 30q, and that forms an enclosed space S between the first heat transfer member 10 and the second heat transfer member 20. Therefore, the shape retention of the three-dimensionally formed film member 30I allows the first heat transfer member 10 and the second heat transfer member 20 to stably support the heat dissipation member 310 and the heat generating component 210 that are in contact with each other.

[0078] Sixth Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 23, an electronic device 200J of the present disclosure includes a heat dissipation unit 300J and a substrate 220. The heat dissipation unit 300J includes a heat conduction member 100J and a heat dissipation member 310. The heat conduction member 100J includes a first heat transfer member 10, a second heat transfer member 20, a film-shaped member 30J, and a filler . The second heat transfer member 20 is provided spaced apart from the first heat transfer member 10 .

[0079] The film-shaped member 30J is formed from a film-shaped material having flexibility and elasticity. One first end 30p of the film-shaped member 30J is joined to the first heat-transfer member 10. The other second end 30q of the film-shaped member 30J is joined to the second heat-transfer member 20. At least a portion of the film-shaped member 30J from the first end 30p to the second end 30q is three-dimensionally shaped into a cylindrical shape. The film-shaped member 30J forms an enclosed space S between the first heat-transfer member 10 and the second heat-transfer member 20. The filler 40 is filled in the sealed space S within the membrane member 30J.

[0080] The heat dissipation member 310 is provided so as to be in contact with one of the first heat transfer member 10 and the second heat transfer member 20. The heat dissipation member 310 of the present disclosure is provided so as to be in contact with the first heat transfer member 10. The heat dissipation member 310 dissipates heat transferred from the heat-generating component 210 via the heat conduction member 100J to the outside. The heat-generating component 210 is provided so as to be in contact with the other of the first heat transfer member 10 and the second heat transfer member 20. The heat-generating component 210 of the present disclosure is provided so as to be in contact with the second heat transfer member 20. The heat-generating component 210 has heat-generating properties. The substrate 220 is provided with a heat generating component 210 .

[0081] The electronic device 200J of this embodiment includes a heat-conducting member 100J. The heat-conducting member 100J includes a film-like member 30J that is three-dimensionally formed into a cylindrical shape at least partially from a first end portion 30p to a second end portion 30q, and that forms an enclosed space S between the first heat-transfer member 10 and the second heat-transfer member 20. Therefore, the shape retention of the three-dimensionally formed film member 30J allows the first heat transfer member 10 and the second heat transfer member 20 to stably support the heat dissipation member 310 and the heat generating component 210 that are in contact with each other.

[0082] Seventh Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 24, the method for assembling a heat conduction member according to the present disclosure includes a step S31 of forming a film member and a step S32 of assembling the heat conduction member.

[0083] In the step S31 of molding the film-like member, a film-like member is formed from a flexible and elastic film-like material, and is three-dimensionally molded to have a cylindrical shape from a first end to a second end.

[0084] In step S32 of assembling the heat conduction member, a first end of the film member is joined to a first heat transfer member. A second end of the film member is joined to a second heat transfer member spaced apart from the first heat transfer member. This forms an enclosed space within the film member between the first and second heat transfer members. Furthermore, a filler is filled into the enclosed space.

[0085] The method for assembling a heat conduction member according to this embodiment can assemble and provide a heat conduction member that can stably hold a heat dissipation member.

[0086] Although the present disclosure has been described above with reference to the embodiments, the present disclosure is not limited to the above-described embodiments. Various modifications that can be understood by those skilled in the art can be made to the configuration and details of the present disclosure within the scope of the present disclosure. Furthermore, each embodiment can be combined with other embodiments as appropriate. For example, in the above embodiment, a heat dissipation member is connected to the first heat transfer member and a heat-generating component is connected to the second heat transfer member, but it is also possible to connect a heat-generating component to the first heat transfer member and a heat dissipation member to the second heat transfer member.

[0087] Some or all of the above-described embodiments can be described as, but are not limited to, the following supplementary notes.

[0088] (Appendix 1) a first heat transfer member; a second heat transfer member provided at a distance from the first heat transfer member; a film-like member formed from a flexible and elastic film-like material, at least a portion of which is three-dimensionally shaped into a cylindrical shape from a first end joined to the first heat transfer member toward a second end joined to the second heat transfer member, and which forms an enclosed space between the first heat transfer member and the second heat transfer member; a filler material filled in the sealed space within the membrane member; Heat conducting material.

[0089] (Appendix 2) At least one of the first heat transfer member and the second heat transfer member has a flat plate shape extending along a plane intersecting a direction in which the first heat transfer member and the second heat transfer member are spaced apart from each other. 2. The thermally conductive member of claim 1.

[0090] (Appendix 3) the first end is joined to an outer periphery of the first heat transfer member; The second end is joined to the outer periphery of the second heat transfer member. 3. The thermal conductive member according to claim 1 or 2.

[0091] (Appendix 4) the film-like member is integrally formed with the second heat transfer member, The first end is bonded to the outer periphery of the first heat transfer member. 4. The thermally conductive member according to claim 3.

[0092] (Appendix 5) The outer dimensions of the first heat transfer member are larger than the outer dimensions of the second heat transfer member. 5. A thermally conductive member according to any one of claims 1 to 4.

[0093] (Appendix 6) The film-like member has an elastically deformable portion between the first end and the second end. 6. A thermally conductive member according to any one of claims 1 to 5.

[0094] (Appendix 7) The elastic deformation portion is The first heat transfer member and the second heat transfer member are elastically deformable in a direction toward and away from each other. 7. The thermally conductive member according to claim 6.

[0095] (Appendix 8) The elastic deformation portion is The filler is elastically deformable in response to movement of the filler material that is extruded from between the first heat transfer member and the second heat transfer member as the first heat transfer member and the second heat transfer member come into contact with or separate from each other. 8. The heat conduction member according to claim 6 or 7.

[0096] (Appendix 9) The film member has a rib extending in a direction connecting the first end and the second end. 9. A thermally conductive member according to any one of claims 1 to 8.

[0097] (Appendix 10) The film-like member further includes an elastic piece having an end portion joined to an end portion of one of the first heat transfer member and the second heat transfer member, the elastic piece extending along the surface of the film-like member toward the other of the first heat transfer member and the second heat transfer member. 10. The thermal conduction member according to any one of claims 1 to 9.

[0098] (Appendix 11) The filler contains at least one of gallium and indium. 11. The thermal conduction member according to any one of claims 1 to 10.

[0099] (Appendix 12) A thermally conductive member according to any one of appendices 1 to 11; a heat dissipation member provided in contact with one surface of one of the first heat transfer member and the second heat transfer member, the heat dissipation member includes a heat dissipation member that is provided in contact with one surface of the other of the first heat transfer member and the second heat transfer member and that dissipates heat transferred from a heat-generating component via the heat conduction member to the outside. Heat dissipation unit.

[0100] (Appendix 13) a heat dissipation unit according to Supplementary Note 12; and a substrate on which the heat-generating component is provided; electronic equipment.

[0101] (Appendix 14) a step of three-dimensionally molding a membrane-like member formed from a flexible and elastic membrane-like material and having a cylindrical shape from a first end portion to a second end portion; and joining the first end of the film-like member to a first heat transfer member and the second end to a second heat transfer member provided at a distance from the first heat transfer member, forming an enclosed space in the film-like member between the first heat transfer member and the second heat transfer member, and filling a filler material into the enclosed space to assemble the heat conduction member. A method for assembling a thermally conductive member.

[0102] (Appendix 15) In the step of forming the film-like member, the film-like member is integrally formed with the second heat transfer member. 15. A method for assembling the thermal conduction member according to claim 14.

[0103] Furthermore, some or all of the configurations described in Supplementary Notes 2 to 11, which are dependent on Supplementary Note 1, may also be dependent on Supplementary Notes 12 and 13 in the same dependent relationship as Supplementary Notes 2 to 11. Furthermore, not limited to Supplementary Notes 1, 12, and 13, some or all of the configurations described as Supplements may also be dependent on various heat conduction members or methods of assembling heat conduction members, as long as they do not deviate from the respective embodiments described above. [Explanation of symbols]

[0104] 10 First heat transfer member (one heat transfer member) 10G First heat transfer member 20 Second heat transfer member (other heat transfer member) 30A, 30B Membrane member 30D~30J Membrane material 30f Elastic deformation part 30p first end 30q second end 38 Ribs 39 Elastic piece 39a Proximal end 40 Filler 100A~100J Thermal Conductive Material 200, 200J electronic equipment 210 Heat-generating parts 220 board 300, 300I, 300J heat dissipation unit 310 Heat dissipation material S closed space

Claims

1. a first heat transfer member; a second heat transfer member provided at a distance from the first heat transfer member; a film-like member formed from a flexible and elastic film-like material, at least a portion of which is three-dimensionally shaped into a cylindrical shape from a first end joined to the first heat transfer member toward a second end joined to the second heat transfer member, and which forms an enclosed space between the first heat transfer member and the second heat transfer member; a filler material filled in the sealed space within the membrane member; Heat conducting material.

2. At least one of the first heat transfer member and the second heat transfer member has a flat plate shape extending along a plane intersecting a direction in which the first heat transfer member and the second heat transfer member are spaced apart from each other. The heat transfer member according to claim 1 .

3. the first end is joined to an outer periphery of the first heat transfer member; The second end is joined to the outer periphery of the second heat transfer member. The heat conducting member according to claim 1 or 2.

4. The outer dimensions of the first heat transfer member are larger than the outer dimensions of the second heat transfer member. The heat conducting member according to claim 1 or 2.

5. The film-like member has an elastically deformable portion between the first end and the second end. The heat conducting member according to claim 1 or 2.

6. The film member has a rib extending in a direction connecting the first end and the second end. The heat conducting member according to claim 1 or 2.

7. The film-like member further includes an elastic piece having an end portion joined to an end portion of one of the first heat transfer member and the second heat transfer member, the elastic piece extending along the surface of the film-like member toward the other of the first heat transfer member and the second heat transfer member. The heat conducting member according to claim 1 or 2.

8. The heat conduction member according to claim 1 or 2; a heat dissipation member provided in contact with one surface of one of the first heat transfer member and the second heat transfer member, The heat dissipation member dissipates heat transferred from a heat-generating component that is provided in contact with one surface of the other of the first heat transfer member and the second heat transfer member via the heat conduction member to the outside. Heat dissipation unit.

9. The heat dissipation unit according to claim 8; a substrate on which the heat-generating component is provided; electronic equipment.

10. a step of three-dimensionally molding a membrane-like member formed from a flexible and elastic membrane-like material and having a cylindrical shape from a first end portion to a second end portion; and joining the first end of the film-like member to a first heat transfer member and the second end to a second heat transfer member provided at a distance from the first heat transfer member, forming an enclosed space in the film-like member between the first heat transfer member and the second heat transfer member, and filling a filler material into the enclosed space to assemble the heat conduction member. A method for assembling a thermally conductive member.

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