Method for manufacturing base material including conductive pattern, method for manufacturing electronic device, method for manufacturing electromagnetic wave shield film, method for manufacturing planar heating element, and base material including conductive pattern

Abstract

To form a fine circuit pattern and / or form a highly precise circuit pattern when forming a conductive pattern using a conductive composition containing conductive particles.SOLUTION: A method for manufacturing a base material including a conductive pattern includes: a preparation step of preparing a base material with a partition wall where a partition wall for partitioning a conductive pattern formation region A and a conductive pattern non-formation region B is formed, on the surface of the base material; a printing step of printing a conductive composition containing conductive particles, on the region A in the base material with the partition wall, and obtaining a pattern of the conductive composition; and a pressing step of applying at least pressure to the pattern by the conductive composition to obtain a conductive pattern.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a substrate having a conductive pattern, a method for manufacturing an electronic device, a method for manufacturing an electromagnetic wave shielding film, a method for manufacturing a sheet heating element, and a substrate having a conductive pattern. More specifically, the present invention relates to a method for manufacturing a substrate having a conductive pattern using a conductive composition containing conductive particles. [Background technology]

[0002] A known technique involves forming a pattern on a substrate using a conductive composition containing conductive particles and then heating the pattern to obtain a conductive pattern. This technique is thought to be applicable to printed electronics, which has been actively developed in recent years. Printed electronics is a technology that uses printing technology to form electronic circuits, sensors, elements, etc. on a substrate such as a film.

[0003] Patent Document 1 discloses a method for manufacturing a wiring board, which includes the steps of forming grooves for a circuit pattern in an insulating film using a laser processing machine, applying a conductive paste made by dispersing ultrafine particles of a conductive material in a solvent onto the insulating film, removing the solvent from the applied conductive paste by heat treatment and firing the ultrafine particles of the conductive material, and polishing the surface of the insulating film.

[0004] Patent Document 2 discloses a method for manufacturing a printed wiring board, which includes the steps of: forming an uncured resin layer of uniform thickness on a substrate; curing the uncured resin layer while pressing a relief plate against the surface of the uncured resin layer so that the relief plate is parallel to the substrate; peeling the relief plate from the cured resin layer on the substrate to form grooves on the surface of the resin layer; filling a conductive paste into the grooves in the resin layer to form conductor wiring; forming an extraction conductor portion that covers the conductor wiring and a predetermined portion on the surface of the resin layer; and forming a protective coat that covers the entire conductor wiring and a predetermined portion of the conductor portion.

[0005] Patent Document 3 discloses a method for manufacturing a wiring board, characterized by comprising the steps of: pressing a mold having a plate surface including convex portions formed according to a desired wiring pattern against a softened insulating sheet; releasing the mold from the hardened insulating sheet to form concave portions according to the wiring pattern; filling the concave portions with a conductive material to form wiring; performing a removal process on the upper surface of the wiring to remove a portion of the upper surface of the wiring and make the height of the upper surface of the wiring lower than the height of the main surface of the insulating sheet; and forming the insulating protective layer on the upper surface of the wiring so that it is at approximately the same height as the insulating sheet.

[0006] Patent Document 4 discloses a method for forming a conductor pattern of an electronic component, which comprises a step of preparing a resin intaglio plate having projections and depressions corresponding to the conductor pattern, and a step of forming a conductor pattern by filling the resin intaglio plate with a conductive paste and transferring the pattern of the conductive paste filled in the resin intaglio plate to a ceramic substrate, wherein the step of preparing the resin intaglio plate comprises a first step of preparing a master mold and a second step of filling the master mold with resin and curing it. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Publication No. 10-200236 [Patent Document 2] Japanese Patent Application Laid-Open No. 2004-253432 [Patent Document 3] Japanese Patent Application Laid-Open No. 2013-161951 [Patent Document 4] Japanese Patent Application Laid-Open No. 2003-068555 Summary of the Invention [Problem to be solved by the invention]

[0008] In principle, the formation of a conductive pattern using a conductive composition containing conductive particles is disadvantageous in terms of forming a fine circuit pattern or a high-precision circuit pattern compared to pattern formation by photolithography or etching. However, due to the increasing expectations for cost reduction in circuit pattern formation and printed electronics suitable for mass production, there is a growing demand for the formation of a fine circuit pattern or a high-precision circuit pattern even in the formation of a conductive pattern using a conductive composition.

[0009] The present invention has been made in view of the above circumstances, and an object of the present invention is to form a fine circuit pattern and / or a high-precision circuit pattern when forming a conductive pattern using a conductive composition containing conductive particles. [Means for solving the problem]

[0010] The present inventors have completed the invention provided below and solved the above problems.

[0011] 1. a preparation step of preparing a substrate with partition walls, the partition walls separating a conductive pattern forming region A and a conductive pattern non-forming region B formed on the surface of the substrate; a printing step of printing a conductive composition containing conductive particles onto the region A of the partition-wall-formed substrate to obtain a pattern of the conductive composition; a pressing step of applying at least pressure to the pattern made of the conductive composition to obtain a conductive pattern; A method for manufacturing a substrate having a conductive pattern, comprising: 2. 1. A method for manufacturing a substrate having the conductive pattern according to claim 1, The method for producing a substrate provided with a conductive pattern, wherein the printing step is carried out by a screen printing method, an inkjet printing method or a dispenser printing method. 3. A method for manufacturing a substrate having a conductive pattern according to 1. or 2., The method for manufacturing a substrate having a conductive pattern, wherein the partition wall is formed of a material different from that of the substrate. 4. A method for manufacturing a substrate provided with the conductive pattern according to any one of 1. to 3., The method for manufacturing a substrate having a conductive pattern, wherein the preparation step includes a transfer step of transferring a curable resin material filled in recesses of an intaglio plate onto the surface of the substrate. 5. 4. A method for manufacturing a substrate having the conductive pattern according to claim 4, The method for manufacturing a substrate provided with a conductive pattern includes curing or semi-curing the curable resin material during the transfer step. 6. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 5., A method for manufacturing a substrate having a conductive pattern, wherein the thickness of the substrate is 30 μm or more. 7. A method for manufacturing a substrate provided with the conductive pattern according to any one of 1. to 6., a step of removing an oxide film, after the printing step and before or simultaneously with the pressing step, of allowing a component X capable of removing an oxide film on the surface of the conductive particles to penetrate into the pattern made of the conductive composition. 8. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 7., In the pressing step, the pattern made of the conductive composition is pressed while being heated. 9. 8. A method for manufacturing a substrate having the conductive pattern according to claim 8, A method for producing a substrate provided with a conductive pattern, wherein in the pressing step, the pattern made of the conductive composition is pressed with a pressure of 1 to 500 MPa and heated at a temperature of 80 to 400°C. 10. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 9., The method for manufacturing a substrate having a conductive pattern, wherein the conductive composition is in a paste state at room temperature. 11. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 10., The method for producing a substrate having a conductive pattern, wherein the amount of the resin component in the conductive composition is 15 parts by mass or less per 100 parts by mass of the conductive particles. 12. A method for manufacturing a substrate provided with the conductive pattern according to any one of 1. to 11., A method for producing a substrate having a conductive pattern, wherein the conductive composition does not substantially contain a curable component as a component other than the conductive particles. 13. A method for manufacturing a substrate provided with the conductive pattern according to any one of 1. to 12., The particle diameter D at which the cumulative frequency reaches 50% in a volume-based cumulative particle diameter distribution curve obtained when the particle diameter of the conductive particles is measured by a laser diffraction scattering method. 50 A method for producing a substrate provided with a conductive pattern, wherein the thickness is 0.5 to 100 μm. 14. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 13., In the pressing step, the exposed surface of the pattern made of the conductive composition is covered with a member, and then the pattern made of the conductive composition is at least pressed. 15. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 14., The method for manufacturing a substrate having a conductive pattern, wherein a cross-sectional shape of at least a part of the partition wall is substantially rectangular. 16. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 14., A method for manufacturing a substrate having a conductive pattern, wherein the cross-sectional shape of at least a part of the partition wall is tapered in a direction away from the substrate. 17. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 16., A method for producing a substrate provided with a conductive pattern, wherein the height of the partition walls is 3 to 100 μm. 18. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 17., The method for manufacturing a substrate having a conductive pattern, wherein the substrate is flexible. 19. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 18., A method for manufacturing a substrate having a conductive pattern, wherein the substrate includes at least one selected from the group consisting of polyester, polyolefin, polycarbonate, polyimide, and paper. 20. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 19., A method for manufacturing a substrate provided with a conductive pattern, wherein the partition walls contain a filler that changes the dielectric constant of the convex portions or increases the electromagnetic wave absorption properties of the convex portions. twenty one. A method for manufacturing an electronic device, comprising manufacturing an electronic device using a substrate having a conductive pattern obtained by the method for manufacturing a substrate having a conductive pattern according to any one of 1. to 20. twenty two. 21. A method for producing an electronic device according to claim 21, comprising: The method for manufacturing an electronic device, wherein the electronic device is an RF tag. twenty three. A method for producing an electromagnetic wave shielding film, comprising producing an electromagnetic wave shielding film using a substrate having a conductive pattern obtained by the method for producing a substrate having a conductive pattern according to any one of 1. to 20. twenty four. A method for producing a sheet heating element, comprising producing a sheet heating element using a substrate having a conductive pattern obtained by the method for producing a substrate having a conductive pattern described in any one of 1. to 20. twenty five. a substrate with partition walls formed on the surface of the substrate, the partition walls separating a conductive pattern forming region A and a conductive pattern non-forming region B; a conductive pattern formed by sintering conductive particles on the region A of the partition-wall-equipped substrate; A substrate provided with a conductive pattern. 26. 25. A substrate provided with a conductive pattern according to claim 25, A substrate provided with a conductive pattern, wherein the partition walls are formed of a material different from that of the substrate. 27. A substrate having a conductive pattern according to 25. or 26., The partition wall is formed of a cured product of a curable resin material, and the substrate is provided with a conductive pattern. 28. A substrate provided with the conductive pattern according to any one of 25 to 27, A substrate provided with a conductive pattern, wherein the thickness of the substrate is 30 μm or more. 29. A substrate provided with the conductive pattern according to any one of 25 to 28, The particle diameter D at which the cumulative frequency reaches 50% in a volume-based cumulative particle diameter distribution curve obtained when the particle diameter of the conductive particles is measured by a laser diffraction scattering method. 50 A substrate having a conductive pattern, wherein the thickness is 0.5 to 100 μm. 30. A substrate provided with the conductive pattern according to any one of 25 to 29, A substrate having a conductive pattern, wherein the cross-sectional shape of at least a part of the partition wall is substantially rectangular. 31. A substrate provided with the conductive pattern according to any one of 25 to 29, A substrate having a conductive pattern, wherein the cross-sectional shape of at least a part of the partition wall is tapered in a direction away from the substrate. 32. A substrate provided with the conductive pattern according to any one of 25 to 31, A substrate provided with a conductive pattern, wherein the height of the partition walls is 3 to 100 μm. 33. A substrate provided with the conductive pattern according to any one of 25 to 32, The substrate is flexible and has a conductive pattern. 34. A substrate provided with the conductive pattern according to any one of 25 to 33, The substrate is provided with a conductive pattern and includes at least one selected from the group consisting of polyester, polyolefin, polycarbonate, polyimide, and paper. 35. A substrate provided with the conductive pattern according to any one of 25 to 34, A substrate having a conductive pattern, wherein the partition walls contain a filler that changes the dielectric constant of the partition walls or increases the electromagnetic wave absorption properties of the partition walls. [Effects of the Invention]

[0012] According to the present invention, when a conductive pattern is formed using a conductive composition containing conductive particles, a fine circuit pattern and / or a highly accurate circuit pattern can be formed. [Brief explanation of the drawings]

[0013] [Figure 1] 3A to 3C are diagrams illustrating a method for manufacturing a substrate provided with a conductive pattern according to the first embodiment. [Figure 2] 3A to 3C are diagrams illustrating a method for manufacturing a substrate provided with a conductive pattern according to the first embodiment. [Figure 3] 10A to 10C are diagrams illustrating a method for manufacturing a substrate provided with a conductive pattern according to a second embodiment. [Figure 4] 10A to 10C are diagrams illustrating a method for manufacturing a substrate provided with a conductive pattern according to a second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0014] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In all the drawings, similar components are denoted by similar reference numerals and descriptions thereof will be omitted where appropriate. To avoid complexity, (i) when there are multiple identical components in the same drawing, only one of them is given a symbol, and not all of them, or (ii) particularly in Figure 2 and subsequent figures, components similar to those in Figure 1 are not given a symbol again. All drawings are for illustrative purposes only, and the shapes and dimensional ratios of the components in the drawings do not necessarily correspond to the actual products.

[0015] In this specification, unless otherwise specified, the expression "X to Y" in the description of a numerical range means at least X and at most Y. For example, "1 to 5% by mass" means "at least 1% by mass and at most 5% by mass."

[0016] In this specification, the term "(meth)acrylic" represents a concept that encompasses both acrylic and methacrylic. The same applies to similar terms such as "(meth)acrylate." In this specification, the term "electronic device" is used to encompass elements, devices, final products, etc. to which electronic engineering technology is applied, such as semiconductor chips, semiconductor elements, printed wiring boards, electric circuit display devices, information and communication terminals, light-emitting diodes, physical batteries, and chemical batteries.

[0017] <Method for manufacturing a substrate with a conductive pattern: Overview> The method for manufacturing a substrate having a conductive pattern of this embodiment includes the steps of: a preparation step of preparing a substrate with partition walls, the partition walls separating a conductive pattern forming region A and a conductive pattern non-forming region B formed on the surface of the substrate; a printing step of printing a conductive composition containing conductive particles in the region A of the partition-wall-formed substrate to obtain a pattern of the conductive composition; a pressing step of applying at least pressure to the pattern made of the conductive composition to obtain a conductive pattern; Includes:

[0018] In this embodiment, at least pressure is applied to the pattern formed from the conductive composition in the pressing step to increase the conductivity of the pattern and obtain a conductive pattern. However, if the pattern formed from the conductive composition is simply pressed, there is a concern that the pattern may be deformed, making it impossible to obtain a thin conductive pattern or a high-precision conductive pattern (close to the intended dimensions and shape).

[0019] In consideration of this concern, in this embodiment, first, a partition wall is provided on the surface of the substrate to separate a conductive pattern formation region A (a region where a conductive pattern is to be formed later) from a conductive pattern non-formation region B (a region where no conductive pattern is to be formed). A conductive composition containing conductive particles is then printed on region A to obtain a pattern of the conductive composition, and at least pressure is then applied to the pattern of the conductive composition to obtain a conductive pattern. In this manner, when pressure is applied to the pattern of the conductive composition, the partition wall limits deformation of the pattern, making it easier to obtain a thin conductive pattern or a high-precision conductive pattern (close to the intended dimensions and shape). In other words, the partition wall literally becomes a "wall" that limits deformation of the pattern by the conductive composition.

[0020] A substrate with partition walls, on the surface of which a substrate is formed, has partition walls that separate a conductive pattern forming region A and a conductive pattern non-forming region B, and can be obtained by forming walls on the surface of the substrate using a partition wall-forming resin material (preferably a curable resin material), as will be described in the first and second embodiments below. However, the method for obtaining a substrate with partition walls is not limited to this method. For example, a method of etching a resin film with a laser or a method of thermally deforming a resin film by thermal imprinting can also be considered.

[0021] The above is an outline of the method for manufacturing a substrate provided with a conductive pattern according to this embodiment. As more specific embodiments, a first embodiment and a second embodiment will be described below.

[0022] <Method for manufacturing a substrate provided with a conductive pattern: First embodiment (FIGS. 1 and 2)> 1 and 2 are diagrams illustrating a method for manufacturing a substrate having a conductive pattern according to the first embodiment. Specifically, FIGS. 1 and 2 show, in the form of cross-sectional views, an example of a series of steps for finally manufacturing a substrate having a conductive pattern as shown in FIG. 2J. The pattern shape of the conductive pattern 3C in FIG. 2J when viewed from above can be a pattern shape that functions as an electric circuit or an antenna. Incidentally, it is preferable to take a cross section in a direction perpendicular to the direction in which the conductive pattern extends in a straight portion of the conductive pattern. Hereinafter, a method for manufacturing a substrate provided with a conductive pattern according to the first embodiment will be described with reference to FIGS.

[0023] FIG. 1 illustrates a series of steps for obtaining a substrate having partition walls on its surface. By the steps shown in FIG. 1, a substrate with partition walls is prepared, on which partition walls that separate a conductive pattern forming region A and a conductive pattern non-forming region B are formed.

[0024] Each step will be explained below.

[0025] (Figure 1A: Preparation of intaglio plate 30) FIG. 1A schematically shows an intaglio plate 30 for providing partition walls on the surface of a substrate. The intaglio plate 30 can be produced by referring to the intaglio production method used in gravure printing and other intaglio printing techniques. Specific intaglio production methods include laser platemaking and electroforming. Furthermore, the production of the intaglio plate 30 can also be based on the stamper production technique used in imprinting technology. The intaglio plate 30 is typically made of metal. For subsequent processes, the recesses of the intaglio plate 30 may be subjected to a surface treatment to facilitate release from the mold. By properly designing the intaglio 30, it is possible to ultimately produce a substrate with a desired conductive pattern.

[0026] Considering the ease of manufacturing the intaglio plate 30 and the ease of peeling in Figure 1E, which will be explained later, it is preferable that the cross-sectional shape of the recess in the intaglio plate 30 be inverted tapered, i.e., a shape in which the width of the recess increases from the bottom to the outside.

[0027] (Figure 1B: Filling the recess with resin material for forming the partition wall) FIG. 1B shows the state in which the recesses of the intaglio plate 30 have been filled with the partition wall forming resin material 2. The filling can be carried out using, for example, a squeegee. Alternatively, various other coating methods or printing methods may also be used. If there is excess partition wall forming resin material that does not fit into the recesses, it may be removed using a squeegee or the like.

[0028] The partition wall-forming resin material 2 is typically a material different from that of the substrate 1 described below. That is, the partition walls 2B (FIG. 1E) obtained through the process of FIG. 1 are usually made of a material different from that of the substrate 1. Of course, the partition walls 2B may be made of the same material as that of the substrate 1.

[0029] The partition wall-forming resin material 2 is preferably a curable resin material. The curable resin material is typically thermosetting and / or photocurable. The curable resin material may have both thermosetting and photocurable properties, or may have only one of thermosetting and photocurable properties. Specific examples of the curable resin material include epoxy resin-containing materials, polymerizable (meth)acrylate-containing materials, urethane-based materials, urethane (meth)acrylate-containing materials, silicone-based materials, etc. Commercially available thermal or optical imprint materials may also be used.

[0030] (Fig. 1C and Fig. 1D: Transfer of the partition-forming resin material filled in the recesses to the substrate) 1C and 1D show how the partition wall forming resin material 2 (preferably a curable resin material) filled in the recesses of the intaglio plate 30 in FIG. 1B is transferred to the surface of the substrate 1. FIG.

[0031] 1C, the surface of the substrate 1 is brought into contact with at least the recessed portion of the intaglio 30, which is filled with the partition wall-forming resin material 2 (preferably a curable resin material). At this time, an appropriate pressing force may be applied. For example, a roller may be pressed against the substrate 1 from above, so that the substrate 1 and the partition wall-forming resin material 2 (preferably a curable resin material) come into sufficient contact with each other.

[0032] 1D, the curable resin material in the recesses is cured or semi-cured while the surface of the substrate 1 is in contact with the partition wall-forming resin material 2 (curable resin material) in the recesses of the intaglio plate 30. As a result, the partition wall-forming resin material 2 (curable resin material) in the recesses becomes a partition wall (indicated by reference symbol 2B in FIG. 1E), and the adhesive strength of the partition wall-forming resin material 2 (curable resin material) to the substrate 1 is increased. The specific method of curing or semi-curing is not particularly limited. Appropriate methods and conditions may be determined depending on the properties of the partition wall-forming resin material 2 (curable resin material). Incidentally, if the partition wall-forming resin material 2 (curable resin material) is photocurable and the base material 1 is light-transmitting, the curing reaction may be promoted by applying light (e.g., ultraviolet light) to the partition wall-forming resin material 2 (curable resin material) from the base material 1 side. Similarly, if the partition wall-forming resin material 2 (curable resin material) is photocurable and the intaglio 30 is light-transmitting, the curing reaction may be promoted by applying light (e.g., ultraviolet light) to the partition wall-forming resin material 2 (curable resin material) from the intaglio 30 side.

[0033] The curing of the partition-forming resin material 2 (curable resin material) here may be substantially complete or partial. The curing here may be partial, provided that deformation of the pattern due to the conductive composition is sufficiently suppressed during the pressing step (FIG. 2I) described below. However, if the curing here is limited to partial curing, it is preferable to perform heating or light irradiation for complete curing before performing the pressing step (FIG. 2I) described below.

[0034] A specific embodiment of the substrate 1 will now be described. The substrate 1 is usually in the form of a film, sheet or plate, and from the viewpoint of industrial productivity, the shape of the substrate 1 is preferably any of these. The substrate 1 is preferably flexible. By employing a flexible substrate 1, a flexible printed circuit (FPC) can be manufactured. By using a flexible substrate 1, pressing using a "roll" becomes easier in the pressing step described below. This is preferable from the viewpoint of mass production. Just to be clear, the substrate 1 may be a rigid substrate that does not have flexibility.

[0035] Considering cost and end use, the substrate 1 is preferably at least one selected from the group consisting of polyesters such as PET (polyethylene terephthalate) and PEN (polyethylene naphthalate), polyolefins such as polyethylene and polypropylene, polycarbonate, polyimide, and paper. Here, the paper may be coated paper (paper whose surface is coated with a coating agent) or ordinary uncoated paper. Furthermore, the substrate 1 is not limited to PET and other materials, and general resin films can also be used. Furthermore, the substrate 1 may be transparent or opaque. Examples of opaque resin films include those containing foamed resins, specifically, foamed resin films such as foamed PET films or foamed resin sheets. In the first embodiment, a conductive pattern with sufficiently low resistivity can be obtained without heating or by heating at a relatively low temperature in the pressing step described below. Therefore, a substrate 1 with low heat resistance, such as polyester, polyolefin, polycarbonate, or paper, can also be suitably used as the substrate. Furthermore, when a substrate 1 with high heat resistance, such as polyimide, is used, the resistivity of the resulting conductive pattern can be further reduced by heating at a high temperature in the pressing step.

[0036] The thickness of the substrate 1 is not particularly limited and can be appropriately set depending on the final use (electronic device, RF tag, electromagnetic wave shielding film, planar heating element, etc.) described below and various other circumstances. The thickness of the substrate 1 is, for example, 10 μm or more, preferably 30 μm or more. More specifically, the thickness of the substrate 1 is typically 10 to 250 μm, preferably 30 to 100 μm. However, from the viewpoint of suppressing the occurrence of curling, it is preferable that the substrate 1 be somewhat thick. Specifically, the thickness of the substrate 1 is preferably 100 to 250 μm, more preferably 100 to 150 μm. The substrate 1 may have a single layer structure or a laminate structure of two or more layers.

[0037] (Figure 1E: Separation) The structure obtained up to the process shown in FIG. 1D, in which partition walls 2B are provided on one surface of the substrate 1, is separated from the intaglio 30. This results in a substrate with partition walls formed on the surface of the substrate, which partition walls separate a conductive pattern forming region A and a conductive pattern non-forming region B. In the substrate with partition walls (substrate 1 and partition walls 2B) shown in FIG. 1E, the area sandwiched between the leftmost partition wall and the second partition wall from the left, and the area sandwiched between the rightmost partition wall and the second partition wall from the right, are the conductive pattern forming region A, i.e., the area where a conductive composition containing conductive particles is printed in the printing process. The separation method is not particularly limited as long as damage to the substrate 1 and the partition walls 2B can be suppressed.

[0038] In the substrate with partition walls obtained in this manner, the cross-sectional shape of at least a part of the partition walls 2 is preferably substantially rectangular. Furthermore, taking into consideration the thickness or height of the conductive pattern that is ultimately desired to be obtained, the height of the partition walls 2 is preferably 3 to 100 μm, more preferably 10 to 50 μm, and even more preferably 10 to 30 μm.

[0039] The partition walls 2B may contain a filler that changes the dielectric constant of the partition walls 2B or that increases the electromagnetic wave absorption properties of the partition walls 2B. That is, the partition walls 2B may be formed of a curable resin material that contains a filler that has characteristic electric / magnetic properties. When the partition walls 2B contain such a filler, the performance of the substrate having the final conductive pattern may be improved or new functions may be added to the substrate having the final conductive pattern.

[0040] An example of the filler is a low dielectric constant filler, which preferably has a low dielectric constant as well as a low dielectric loss tangent. Use of a low dielectric constant filler can reduce the dielectric constant of the barrier ribs 2. This can reduce transmission delay and loss in high-speed transmission in high frequency bands such as millimeter wave bands when the final substrate with a conductive pattern is used as an antenna. A specific example of the low dielectric constant filler is glass flakes, etc. Low dielectric glass flakes are available commercially from, for example, Nippon Sheet Glass Co., Ltd.

[0041] Another example of the filler is a high dielectric constant filler, which preferably has a high dielectric constant and a low dielectric loss tangent. When the final substrate with a conductive pattern is used as an antenna, the use of a high-dielectric filler can reduce the decrease in communication distance even if the antenna size is reduced. This is because the high-dielectric filler has a wavelength shortening effect, making it possible to resonate even if the antenna size (antenna length) is reduced. Specific examples of high dielectric constant fillers include calcium titanate, strontium titanate, etc. Calcium titanate and strontium titanate are commercially available from Kyoritsu Material Co., Ltd., for example.

[0042] Another example of the filler is an electromagnetic wave absorbing filler. When the final substrate with a conductive pattern is applied to an RF tag, if the partition wall 2B contains an electromagnetic wave absorbing filler, communication may be possible even if the substrate with a conductive pattern (RF tag) is directly attached to metal. Examples of electromagnetic wave absorbing fillers include soft magnetic powders, specifically soft magnetic flake powders. More specifically, Fe-Si-Al alloys are available. Such electromagnetic wave absorbing fillers are commercially available from, for example, Sanyo Special Steel Co., Ltd.

[0043] (Figure 2F: Printing of conductive composition in region A) FIG. 2F shows that a conductive composition containing conductive particles is printed on region A of the substrate with partition walls obtained in FIG. 1E to form a pattern 3 of the conductive composition. The conductive composition is "printed" in region A. That is, by appropriately designing the printing apparatus in advance, the conductive composition is selectively applied to region A, but not to region B. The specific printing method is not particularly limited, but from the viewpoint of ease of printing the conductive composition containing conductive particles, screen printing, inkjet printing, or dispense printing is preferred. The amount of the conductive composition to be printed is preferably adjusted appropriately depending on the area of ​​region A and the height of partition wall 2B. The height (thickness) of pattern 3 is preferably the same as or greater than partition wall 2B.

[0044] At this stage, it is preferable that the conductive particles in the pattern 3 are not substantially sintered. Incidentally, the conductive particles can usually be sintered in the pressing step described below. The conductive composition is preferably in a paste form at room temperature (for example, 25° C.) from the viewpoint of ease of pattern formation and shape retention. From the viewpoint of further increasing the conductivity of the finally obtained conductive pattern, the amount of the resin component in the conductive composition is preferably 15 parts by mass or less, i.e., 0 to 15 parts by mass, more preferably 0 to 10 parts by mass, and even more preferably 0 to 5 parts by mass, per 100 parts by mass of the conductive particles. The remaining component in the conductive composition is preferably conductive particles. If there is no problem with pattern formability, the conductive composition may not contain a resin component. From the viewpoint of improving conductivity, it is preferable that the conductive composition does not substantially contain a curable component other than the conductive particles. On the other hand, from the viewpoint of improving the printability and coatability of the conductive composition, the conductive composition may contain a resin component such as a resin or a binder. From the viewpoint of fully obtaining the effects of using the resin component, the amount of the resin component in the conductive composition is preferably 1 to 15 parts by mass, more preferably 1 to 10 parts by mass, and even more preferably 1 to 5 parts by mass, per 100 parts by mass of the conductive particles. The remaining component in the conductive composition is preferably the conductive particles. Specific examples of resin components that can be contained in the conductive composition include polyvinylpyrrolidone, polyester, epoxy resin, phenoxy resin, (meth)acrylic resin, polyvinyl acetal, cellulose resin (e.g., ethyl cellulose), and phenol resin.

[0045] The conductive composition may contain a solvent. When the conductive composition contains a solvent, the conductive composition can be easily applied or printed onto a substrate. The solvent typically contains an organic solvent. The solvent may contain water as long as the conductive particles can be appropriately dispersed in the solvent. The type of solvent is not particularly limited, as long as it does not substantially alter the components in the conductive composition. The amount of the solvent used may be adjusted as appropriate depending on the specific method for embedding the conductive composition, etc. The amount of the solvent used is, for example, 3 to 30 mass %, preferably 5 to 25 mass %, and more preferably 10 to 20 mass % of the total conductive composition.

[0046] The conductive particles contained in the conductive composition preferably contain at least one element selected from the group consisting of silver and copper, from the viewpoints of availability and good conductivity. Specifically, the conductive particles preferably include at least one selected from the group consisting of particles primarily composed of silver and particles primarily composed of copper. Here, the expression "primarily composed of silver" means that the ratio of silver element to all constituent elements in the particles is preferably 50 mol% or more, more preferably 75 mol% or more, even more preferably 90 mol% or more, and particularly preferably 95 mol% or more. Similarly, the expression "primarily composed of copper" means that the ratio of copper element to all constituent elements in the particles is preferably 50 mol% or more, more preferably 75 mol% or more, even more preferably 90 mol% or more, and particularly preferably 95 mol% or more. Just to be clear, the conductive particles may contain elements other than silver and copper as long as the desired conductivity is obtained. Examples of elements other than silver and copper include gold, aluminum, platinum, palladium, iridium, tungsten, nickel, tantalum, lead, and zinc. Of course, the conductive particles do not have to be substantially free of elements other than silver and copper. "Substantially free" means that the conductive particles may unavoidably contain elements other than silver and copper as impurities, but they do not intentionally or artificially contain elements other than silver and copper.

[0047] The conductive particles may contain only one element, or may contain two or more elements. For example, conductive particles in which the surface of copper particles is silver-plated (silver-coated copper particles) are preferably used in this embodiment. Silver-coated copper particles are particles whose main component is copper, and the surface of the copper particles is plated with silver in an amount of, for example, up to 35 mass% based on the total mass of the particles.

[0048] The particle diameter D at which the cumulative frequency reaches 50% in the volume-based cumulative particle diameter distribution curve obtained when measuring the particle diameter of conductive particles using the laser diffraction scattering method. 50is preferably 0.5 to 100 μm, more preferably 0.6 to 50 μm, even more preferably 0.7 to 30 μm, and particularly preferably 0.7 to 20 μm. D 50 By making the ρ appropriately large, the number of grain boundaries between conductive particles per unit volume can be reduced, which is thought to lead to a smaller specific resistance of the resulting conductive pattern. D 50 It is believed that by not making the size too large, the "gaps" between the conductive particles are reduced, which leads to a smaller specific resistance of the resulting conductive pattern.

[0049] Conductive particles can be purchased from, for example, DOWA Electronics Co., Ltd., Fukuda Metal Foil and Powder Co., Ltd. Two or more different conductive particles may be mixed together for the purpose of adjusting or optimizing the particle size distribution or for other purposes.

[0050] From the viewpoint of further reducing the resistivity of the final conductive pattern, it is preferable that the proportion of conductive particles in the conductive composition is high. Specifically, the proportion of conductive particles in the total non-volatile components of the conductive composition is preferably 95% by mass or more, more preferably 97% by mass or more, even more preferably 98% by mass or more, and particularly preferably 99% by mass or more. In other words, from the viewpoint of further reducing the resistivity of the resulting conductive pattern, it is preferable that the conductive composition is substantially free of resin components such as resins and binders. Here, "substantially free of resin components" means that the composition does not contain any resin components at all, or that the amount of resin components contained is so small that the expected effect of using the resin components cannot be obtained (for example, 1% by mass or less, specifically 0.5% by mass or less, of the total non-volatile components of the conductive composition). The conductive composition does not need to contain resins or binders as long as the desired conductive pattern can be obtained.

[0051] The conductive composition may or may not contain various additive components found in conventional ink compositions and conductive pastes.

[0052] (Figure 2G: Drying) If the conductive composition printed in FIG. 2F contains a solvent, that is, if pattern 3 in FIG. 2F contains a solvent, it is preferable to volatilize the solvent by heat treatment. FIG. 2G shows that when pattern 3 in FIG. 2F contains a solvent, the solvent is evaporated to form pattern 3B. The drying conditions are not particularly limited, and may be any temperature and time that allows the solvent to be sufficiently dried and does not damage or deteriorate the substrate.

[0053] (Figure 2H: Oxide film removal) In the first embodiment, it is preferable to infiltrate component X, which can remove oxide films on the surfaces of conductive particles in pattern 3 or pattern 3B, into pattern 3 or pattern 3B before or simultaneously with the pressing step described below. By doing so, sintering of the conductive particles tends to proceed more easily during pressing described below, and the conductivity of the finally obtained conductive pattern tends to be further increased.

[0054] Component X preferably penetrates into the interior of pattern 3 or pattern 3B through the gaps between the conductive particles that make up pattern 3 or pattern 3B. This tends to further increase the conductivity of the final conductive pattern. For this reason, in the oxide film removal step, the pattern 3 or pattern 3B that is in contact with component X may be pressed to promote penetration of component X into the interior. In this case, oxide film removal and pressing, which will be described later, may be performed simultaneously. Of course, the oxide film removal may be performed as a separate step from the pressing.

[0055] The oxide film can be removed by contacting, and preferably penetrating, liquid 7 containing component X, which is capable of removing oxide films on the surfaces of conductive particles, with pattern 3B (or pattern 3), as shown in Figure 2H, for example. While Figure 2H shows an embodiment in which liquid 7 containing component X is dropped or sprayed onto pattern 3B, pattern 3B may also be immersed in the liquid containing component X. Alternatively, liquid 7 containing component X may be brought into contact with pattern 3B using an inkjet method or a dispenser method. The liquid 7 containing component X is preferably water in which component X is dissolved or dispersed. The use of water is preferable from the viewpoints of reducing the environmental load and process safety (non-flammability). Of course, an organic solvent in which component X is dissolved or dispersed can also be used. Instead of using the liquid 7 containing the component X, the oxide film removal step may be carried out by bringing the component X in a gaseous state into contact with the pattern 3B. It is also conceivable to bring a sheet containing component X into contact with pattern 3B, preferably by applying pressure, thereby causing component X to permeate into pattern 3B. Specific examples of the sheet here include paper or nonwoven fabric containing component X, and resin sheets having component X coated or printed on their surfaces. Additionally, the method for bringing component X into contact with and permeating pattern 3B is not particularly limited.

[0056] Component X is not particularly limited as long as it is capable of removing the oxide film on the surface of the conductive particles. In this specification, "removal" of an oxide film includes not only the removal of the oxide itself present on the surface of a conductive particle, but also the case where the oxide undergoes a chemical change such as reduction, causing the oxide to return to a non-oxide state.

[0057] According to the findings of the present inventors, it is preferable to include at least one selected from the group consisting of organic acids, phosphorus oxoacids, and hydrazine or its derivatives, which are particularly suitable when the conductive particles include copper or silver.

[0058] Examples of organic acids include carboxylic acids such as citric acid, formic acid, acetic acid, malonic acid, malic acid, tartaric acid, ascorbic acid, succinic acid, fumaric acid, and propionic acid. Specific examples of phosphorus oxoacids include phosphinic acid, phosphonic acid, phosphorous acid, phosphoric acid, diphosphoric acid, triphosphoric acid, and metatriphosphoric acid. Of these, phosphinic acid is particularly preferred. Examples of hydrazine or its derivatives include hydrazine itself; hydrazine salts such as hydrazine monohydrochloride, hydrazine dihydrochloride, hydrazine monohydrobromide, and hydrazine sulfate; and other compounds having an -NH-NH2 structure.

[0059] Additionally, from the viewpoint of removing an oxide film, a compound having a small pKa in water can be used as component X. Specifically, a compound having a pKa in water of -5.0 to 5.0 is preferred as component X, and a compound having a pKa of -4.0 to 4.5 is more preferred as component X. Incidentally, when component X is a polybasic acid, it is preferred that the smallest pKa among the multiple pKas is within the above range. Considering only the small pKa and the resulting ability to remove oxide films, it is conceivable to use an inorganic acid such as hydrochloric acid, nitric acid, or sulfuric acid as component X. However, taking into consideration the inconvenience that may occur if the acid remains in pattern 3B, an organic acid is preferred as component X. The pKa value used here can be the value at room temperature (e.g., 25°C). However, from the viewpoint of the removability of the oxide film in the actual process, it can be said that it is preferable to use the pKa value at the temperature in the penetration step or conductive film formation step.

[0060] Additionally, any compound capable of returning an oxide film to a non-oxidized state by a reduction reaction can also be used as component X. For example, a compound having an aldehyde group can be used as component X because it may be able to reduce an oxide.

[0061] Furthermore, compounds that have a small pKa in water and can return an oxidized film to a non-oxidized state through a reduction reaction are also preferably used as component X. An example of such a compound is formic acid. Formic acid has the advantage that it is easily volatile and therefore does not easily remain in the pattern.

[0062] In addition to the above, examples of component X include pyrogallol, phenidone, hydroquinone, and orthoaminophenol, which are known to function as reducing agents in the field of silver halide photography. If a conductive pattern having a lower resistivity can be obtained by infiltrating a certain compound A into pattern 3B compared to a conductive pattern without infiltrating the compound A, then the compound A can be used as component X.

[0063] When a liquid in which component X is dissolved or dispersed is brought into contact with pattern 3B, the concentration of component X in the liquid may be adjusted as appropriate. The concentration may be adjusted from the viewpoints of allowing a sufficient amount of component X to penetrate into pattern 3B and reducing the amount of residual component X to suppress corrosion or deterioration of the conductive pattern. The concentration of component X in the liquid is, for example, 0.05 to 50 mol / L, preferably 0.1 to 40 mol / L, more preferably 0.1 to 30 mol / L, even more preferably 0.1 to 10 mol / L, and particularly preferably 0.15 to 5.0 mol / L. Of course, a liquid containing component X at a concentration lower than the concentrations shown here may be used, or a liquid containing component X at a concentration higher than the concentrations shown here (for example, saturation concentration) may be used.

[0064] (Figure 2I: Pressing) At least pressure is applied to the pattern 3B of Fig. 2G or 2H. This increases the conductivity of the pattern 3B, resulting in the conductive pattern 3C (Fig. 2H). Preferably, the pressure sinters at least a portion of the conductive particles in the pattern 3B.

[0065] As shown in Fig. 2I, the pressure is preferably applied by covering the exposed surface of pattern 3B with member 9 and then at least pressing pattern 3B. As an example, the pressure can be applied by sandwiching the laminate of substrate 1, partition wall 2B, pattern 3B, and member 9 between two opposing rolls 10A and 10B and transporting the laminate between the two rolls. Member 9 is preferably a film-like material.

[0066] During the pressing, liquid 7 containing component X, which can remove the oxide film on the surface of the conductive particles, as described in FIG. 2H, may be present on top of pattern 3B. In this case, it is believed that component X penetrates into pattern 3B due to the application of pressure, removing the oxide film from the conductive particles, while simultaneously sintering the conductive particles. In other words, FIG. 2H can be said to represent a mode in which oxide film removal and pressing are performed simultaneously.

[0067] There are several advantages to using the member 9 when applying pressure. Examples of the advantages include the following: Damage to the roll 10A can be suppressed. In addition, it may be possible to suppress the pattern 3B from being partially or entirely peeled off and adhering to the roll 10A. Direct contact of roll 10A with pattern 3B is avoided, making it easier to prevent unintended deformation or collapse of pattern 3B. The member 9 acts as a buffer, making it easier to apply pressure uniformly to the pattern 3B. This leads to, for example, an improvement in the yield of the substrate with the final conductive pattern. Furthermore, when oxide film removal and pressing are performed simultaneously, applying pressure uniformly to the pattern 3B is also preferable because it leads to the component X penetrating uniformly into the pattern 3B.

[0068] From one viewpoint, the material of the member 9 can be the same as that of the base material 1. That is, the member 9 can be preferably a polyester film such as a PET film. From another perspective, in order to prevent peeling or damage to the pattern 3B, an easily peelable film or release paper can be preferably used as the member 9. A specific example of the easily peelable film or release paper is a resin film whose surface is coated with a silicone resin. From another perspective, the member 9 may be made of a non-resin material such as aluminum foil.

[0069] On the other hand, in order to simplify the manufacturing process and reduce waste by reducing the amount of process materials, pressurization may be performed without using the member 9. Furthermore, when the member 9 is used, it may be used only once or may be used repeatedly.

[0070] FIG. 2I shows an embodiment in which the pattern 3B is pressed by two opposing rolls 10A and 10B, but it goes without saying that the pattern 3B may be pressed by other methods. As one example, the stack of the substrate 1, partition wall 2B, pattern 3B, and member 9 may be sandwiched between two flat plates and pressed (flat press). As another example, the stack of the substrate 1, partition wall 2B, pattern 3B, and member 9 may be placed on a flat plate, and a roll may be applied from above to press the pattern 3B while rolling the roll. As yet another example, a method may be considered in which a roll is applied from below the substrate 1, partition wall 2B, pattern 3B, and member 9 to press the pattern 3B while rolling the roll.

[0071] In the pressing step, it is preferable to apply pressure to the pattern 3B while heating it, which tends to improve the conductivity of the resulting conductive pattern 3C. Preferably, pattern 3B is pressed at a pressure of 1 to 500 MPa and heated at a temperature of 80 to 400°C. More preferably, pattern 3B is pressed at a pressure of 10 to 400 MPa and heated at a temperature of 80 to 300°C. Even more preferably, pattern 3B is pressed at a pressure of 50 to 300 MPa and heated at a temperature of 80 to 150°C. Incidentally, when oxide film removal and pressing are performed simultaneously, the heating temperature is preferably set in consideration of the volatilization or evaporation of liquid 7 and component X. The lower limit of the temperature, "80°C," described above is a value that takes into consideration the moderate rate of evaporation when liquid 7 is a mixture of water and a low-boiling point alcohol, for example. When pressing is performed using two opposing rolls 10A and 10B as shown in FIG. 2I, it is preferable to use rolls with built-in heaters that can adjust the temperature.

[0072] (Figure 2J) After the pressing is completed, the member 9, if used, is removed. Then, a substrate with a conductive pattern can be obtained, which includes the substrate 1 having the partition wall 2B formed on one side thereof, the conductive pattern forming region A and the conductive pattern non-forming region B partitioned by the partition wall 2B, and the conductive pattern 3C formed by sintering conductive particles in the recesses of the region A.

[0073] <Method for manufacturing a substrate provided with a conductive pattern: Second embodiment (FIGS. 3 and 4)> 3 and 4 are diagrams for explaining a method for manufacturing a substrate having a conductive pattern according to the second embodiment. Hereinafter, the method for manufacturing a substrate having a conductive pattern according to the second embodiment will be described with reference to FIGS. 3 and 4.

[0074] The second embodiment differs from the first embodiment in that the cross-sectional shape of at least a part of the partition wall is tapered in a direction away from the substrate. In other words, the cross-sectional shape of at least a part of the partition wall is trapezoidal, and when the side of the trapezoid that is in contact with the substrate is the lower base and the side opposite to the lower base is the upper base, it is preferable that the length of the upper base is smaller than the length of the lower base. As described above, the partition wall serves to limit deformation of a pattern formed by a conductive composition when pressure is applied to the pattern. It is believed that the above-described cross-sectional shape of at least a portion of the partition wall further suppresses deformation of the pattern formed by the conductive composition. In other words, it is believed that a thinner circuit pattern or a circuit pattern with higher precision can be formed.

[0075] A specific aspect of the second embodiment will be described in more detail with reference to the drawings.

[0076] (Figure 3A: Preparation of intaglio plate 30) In the first embodiment, as in the second embodiment, a partition wall can be formed on a substrate using an intaglio plate 30, but in the second embodiment, as shown in Figure 3A, for example, at least a portion of the recess of the intaglio plate 30 is reverse tapered in the direction away from the intaglio plate 30. The intaglio 30 in the second embodiment can be similar to the intaglio 30 in the first embodiment, except that the shape of at least some of the recesses of the intaglio 30 is different.

[0077] (Figures 3B, 3C, 3D, and 3E) These figures correspond to Figures 1B, 1C, 1D and 1E, respectively. Except for the different shapes of the recesses in the intaglio plate 30 and the corresponding different shapes of the partition walls 2B, the processes shown in Figures 3B, 3C, 3D, and 3E can be similar to the processes shown in Figures 1B, 1C, 1D, and 1E, respectively.

[0078] (Figures 4F, 4G, 4H, 4I, and 4J) These figures correspond to Figures 2F, 2G, 2H, 2I, and 2H, respectively. Except for the different shapes of the partition wall 2B, the processes represented in Figures 4F, 4G, 4H, 4I, and 4H can be similar to those in Figures 2F, 2G, 2H, 2I, and 2H, respectively. It is believed that by tapering the cross-sectional shape of at least a part of the partition wall 2B in the direction away from the base material 1, deformation of the pattern 3B when pressed (FIG. 4I) can be further suppressed.

[0079] <Substrate with conductive pattern> Up to this point, we have explained the "manufacturing method" for the substrate having a conductive pattern. Here, we will describe the physical characteristics of the substrate having a conductive pattern that is finally obtained.

[0080] By the method for manufacturing a substrate having a conductive pattern described in the present specification, for example, as shown in FIG. 2J or FIG. 4J, "A substrate with partition walls formed on the surface of the substrate, the partition walls separating a conductive pattern forming region A and a conductive pattern non-forming region B; a conductive pattern formed by sintering conductive particles on the region A of the partition-wall-equipped substrate; "A substrate having a conductive pattern, can be manufactured.

[0081] In the substrate having the conductive pattern, the partition walls are preferably formed of a material different from that of the substrate, and more preferably formed of a cured product of a curable resin material.

[0082] The thickness of the substrate is, for example, 10 μm or more, preferably 30 μm or more. More specifically, the thickness of the substrate 1 is typically 10 to 250 μm, preferably 30 to 100 μm. However, from the viewpoint of suppressing the occurrence of curling, it is preferable that the substrate is somewhat thick. Specifically, the thickness of the substrate is preferably 100 to 250 μm, more preferably 100 to 150 μm. The substrate is preferably flexible. The substrate preferably contains at least one selected from the group consisting of polyester, polyolefin, polycarbonate, polyimide, and paper.

[0083] The particle diameter D at which the cumulative frequency reaches 50% in the volume-based cumulative particle diameter distribution curve obtained when measuring the particle diameter of conductive particles using the laser diffraction scattering method. 50 is preferably 0.5 to 100 μm, more preferably 0.6 to 50 μm, even more preferably 0.7 to 30 μm, and particularly preferably 0.7 to 20 μm. The conductive particles preferably contain at least one element selected from the group consisting of silver and copper, from the viewpoints of availability and good conductivity.

[0084] In one embodiment, the cross-sectional shape of at least a portion of the partition wall can be substantially rectangular. In another embodiment, the cross-sectional shape of at least a portion of the partition wall can be tapered in a direction away from the substrate. The height of the partition walls is preferably 3 to 100 μm, more preferably 10 to 50 μm, and further preferably 10 to 30 μm. The septum may include a filler that changes the dielectric constant of the septum or increases the electromagnetic wave absorption properties of the septum.

[0085] For other matters not described here regarding the substrate provided with a conductive pattern, the descriptions of the first and second embodiments can be referred to.

[0086] <Electronic device manufacturing method> An electronic device can be manufactured using a substrate having a conductive pattern obtained as described above. By appropriately designing a pattern using a conductive composition, a substrate having a conductive pattern (circuit pattern) that can function as a circuit can be manufactured. Then, by combining this substrate with other electronic elements, an electronic device can be manufactured.

[0087] Here, some examples of electronic devices will be described, but it should be noted that the electronic devices including a substrate with a conductive pattern obtained by the manufacturing method described herein are not limited to these. Sensors: For example, a substrate having a conductive pattern obtained by the manufacturing method described herein can be applied to conductive members / circuits in sensors such as pressure sensors and vital sensors. Solar cells: For example, a substrate having a conductive pattern obtained by the manufacturing method described in this specification can be applied to the current collecting wiring of a solar cell. Membrane switch: A membrane switch is a thin sheet-like switch made by printing circuits and contacts on a film and then laminating it. The manufacturing method of a substrate with a conductive pattern described in this specification can be applied to form the circuits and contacts. Touch sensor / touch panel: For example, the method for manufacturing a substrate having a conductive pattern described herein can be applied to form lead wiring in a touch sensor / touch panel. It is also conceivable that the method for manufacturing a substrate having a conductive pattern described herein can be applied to form transparent electrodes in a touch sensor / touch panel. Flexible substrate: Conventionally, circuits are formed by first coating the entire surface of a flexible film with a metal film and then using chemicals to remove unnecessary parts of the metal film. Instead of this conventional method, it is conceivable to form circuits using the method for manufacturing a substrate with a conductive pattern described in this specification.

[0088] In particular, in electronic devices where circuits have conventionally been formed using conductive paste, by using the manufacturing method described in this specification as a method for forming circuits, the resistivity of the circuits can be reduced, and improved performance of the electronic devices can be expected.

[0089] A particularly preferred example of the electronic device is an RF tag. That is, the method for producing a conductive substrate of this embodiment is preferably used to produce a conductive circuit such as an antenna portion of an RF tag. For the specific structure of the RF tag, reference can be made to, for example, Japanese Patent Application Laid-Open No. 2003-332714 and Japanese Patent Application Laid-Open No. 2020-46834.

[0090] <Method of manufacturing electromagnetic wave shielding film> As an application other than electronic devices, the method for manufacturing a substrate having a conductive pattern according to the present embodiment can be used to manufacture an electromagnetic wave shielding film. Specifically, in the lamination step, the conductive composition is printed in a pattern specific to the electromagnetic wave shielding film (such as a mesh pattern), thereby manufacturing the electromagnetic wave shielding film.

[0091] <Method of manufacturing a sheet heating element> As another application, the method for manufacturing a substrate having a conductive pattern according to this embodiment may be used to manufacture a sheet heating element. A sheet heating element is an element that generates heat by passing an electric current through electrical wiring provided on a substrate. A specific example of a sheet heating element is a sheet heating element for preventing fogging or cold weather, such as on the rear window of a passenger car.

[0092] Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various other configurations may be adopted. Furthermore, the present invention is not limited to the above-described embodiments, and modifications and improvements within the scope of achieving the object of the present invention are included in the present invention. [Explanation of symbols]

[0093] 30 Intaglio 1 Base material 2. Resin material for forming partition walls (preferably curable resin material) 2B Bulkhead 3 Pattern (Pattern made of conductive composition) 3B Pattern (Pattern made of conductive composition) 7. Liquid (liquid containing component X capable of removing oxide film on the surface of conductive particles) 3C Conductive Pattern 9. Member (preferably film-like material) 10A roll 10B roll

Claims

1. a preparation step of preparing a substrate with partition walls, the partition walls separating a conductive pattern forming region A and a conductive pattern non-forming region B formed on a surface of the substrate; a printing step of printing a conductive composition containing conductive particles in the region A of the partition-wall-formed substrate to obtain a pattern of the conductive composition; a pressing step of applying at least pressure to the pattern made of the conductive composition to obtain a conductive pattern; A method for manufacturing a substrate having a conductive pattern, comprising:

2. A method for manufacturing a substrate provided with the conductive pattern according to claim 1, comprising: The method for producing a substrate provided with a conductive pattern, wherein the printing step is carried out by a screen printing method, an inkjet printing method or a dispenser printing method.

3. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: The method for manufacturing a substrate having a conductive pattern, wherein the partition wall is formed of a material different from that of the substrate.

4. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: The method for manufacturing a substrate having a conductive pattern, wherein the preparation step includes a transfer step of transferring a curable resin material filled in recesses of an intaglio plate onto the surface of the substrate.

5. A method for manufacturing a substrate provided with the conductive pattern according to claim 4, comprising: The method for manufacturing a substrate provided with a conductive pattern includes curing or semi-curing the curable resin material during the transfer step.

6. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: A method for manufacturing a substrate having a conductive pattern, wherein the substrate has a thickness of 30 μm or more.

7. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: a step of removing an oxide film after the printing step and before or simultaneously with the pressing step, of allowing a component X capable of removing an oxide film on the surface of the conductive particles to penetrate into the pattern made of the conductive composition.

8. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: In the pressing step, the pattern made of the conductive composition is pressed while being heated.

9. A method for manufacturing a substrate provided with the conductive pattern according to claim 8, comprising: In the pressing step, the pattern made of the conductive composition is pressed with a pressure of 1 to 500 MPa and heated at a temperature of 80 to 400°C.

10. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: The method for manufacturing a substrate having a conductive pattern, wherein the conductive composition is in a paste state at room temperature.

11. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: The method for producing a substrate having a conductive pattern, wherein the amount of the resin component in the conductive composition is 15 parts by mass or less per 100 parts by mass of the conductive particles.

12. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: A method for producing a substrate having a conductive pattern, wherein the conductive composition does not substantially contain a curable component as a component other than the conductive particles.

13. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: The particle diameter D at which the cumulative frequency reaches 50% in a volume-based cumulative particle diameter distribution curve obtained when the particle diameter of the conductive particles is measured by a laser diffraction scattering method. ５０ A method for manufacturing a substrate having a conductive pattern, wherein the thickness is 0.5 to 100 μm.

14. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: In the pressing step, the exposed surface of the pattern made of the conductive composition is covered with a member, and then the pattern made of the conductive composition is at least pressed.

15. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: The method for manufacturing a substrate having a conductive pattern, wherein a cross-sectional shape of at least a part of the partition wall is substantially rectangular.

16. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: A method for manufacturing a substrate having a conductive pattern, wherein the cross-sectional shape of at least a part of the partition wall is tapered in a direction away from the substrate.

17. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: The method for producing a substrate provided with a conductive pattern, wherein the height of the partition walls is 3 to 100 μm.

18. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: The method for manufacturing a substrate having a conductive pattern, wherein the substrate is flexible.

19. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: A method for manufacturing a substrate having a conductive pattern, wherein the substrate includes at least one selected from the group consisting of polyester, polyolefin, polycarbonate, polyimide, and paper.

20. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: A method for manufacturing a substrate provided with a conductive pattern, wherein the partition walls contain a filler that changes the dielectric constant of the convex portions or increases the electromagnetic wave absorption properties of the convex portions.

21. A method for producing an electronic device, comprising the steps of: producing an electronic device using a substrate having a conductive pattern obtained by the method for producing a substrate having a conductive pattern according to claim 1 or 2.

22. 22. The method of manufacturing an electronic device according to claim 21, comprising: The method for manufacturing an electronic device, wherein the electronic device is an RF tag.

23. A method for producing an electromagnetic wave shielding film, comprising producing an electromagnetic wave shielding film using a substrate having a conductive pattern obtained by the method for producing a substrate having a conductive pattern according to claim 1 or 2.

24. A method for producing a sheet heating element, comprising producing a sheet heating element using a substrate having a conductive pattern obtained by the method for producing a substrate having a conductive pattern according to claim 1 or 2.

25. a substrate with partition walls formed on a surface of the substrate, the partition walls separating a conductive pattern forming region A and a conductive pattern non-forming region B; a conductive pattern formed by sintering conductive particles on the region A of the partition-wall-equipped substrate; A substrate provided with a conductive pattern.

26. A substrate provided with the conductive pattern according to claim 25, A substrate provided with a conductive pattern, wherein the partition walls are formed of a material different from that of the substrate.

27. A substrate provided with the conductive pattern according to claim 25 or 26, The partition wall is formed of a cured product of a curable resin material, and the substrate is provided with a conductive pattern.

28. A substrate provided with the conductive pattern according to claim 25 or 26, A substrate provided with a conductive pattern, wherein the thickness of the substrate is 30 μm or more.

29. A substrate provided with the conductive pattern according to claim 25 or 26, The particle diameter D at which the cumulative frequency reaches 50% in a volume-based cumulative particle diameter distribution curve obtained when the particle diameter of the conductive particles is measured by a laser diffraction scattering method. ５０ A substrate provided with a conductive pattern, wherein the thickness is 0.5 to 100 μm.

30. A substrate provided with the conductive pattern according to claim 25 or 26, A substrate having a conductive pattern, wherein the cross-sectional shape of at least a part of the partition wall is substantially rectangular.

31. A substrate provided with the conductive pattern according to claim 25 or 26, A substrate having a conductive pattern, wherein the cross-sectional shape of at least a part of the partition wall is tapered in a direction away from the substrate.

32. A substrate provided with the conductive pattern according to claim 25 or 26, A substrate provided with a conductive pattern, wherein the height of the partition walls is 3 to 100 μm.

33. A substrate provided with the conductive pattern according to claim 25 or 26, The substrate is flexible and has a conductive pattern.

34. A substrate provided with the conductive pattern according to claim 25 or 26, The substrate is provided with a conductive pattern and includes at least one selected from the group consisting of polyester, polyolefin, polycarbonate, polyimide, and paper.

35. A substrate provided with the conductive pattern according to claim 25 or 26, A substrate having a conductive pattern, wherein the partition walls contain a filler that changes the dielectric constant of the partition walls or increases the electromagnetic wave absorption properties of the partition walls.

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