Wafer processor

The wafer processing apparatus addresses wafer contamination by using a partition door device to isolate areas and swap boat locations, enhancing product yield through reduced contamination.

JP2025141798AActive Publication Date: 2025-09-29SWAYSURE TECHNOLOGY CO LTD
View PDF 5 Cites 0 Cited by

Patent Information

Application Number
JP2024229996
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-03-14
Filing Date
2024-12-26
Publication Date
2025-09-29
Estimated Expiration
2044-12-26

AI Technical Summary

Technical Problem

Wafer contamination occurs during the heat treatment process due to reaction by-products from the furnace tube diffusing into adjacent boats, leading to reduced product yield.

Method used

A wafer processing apparatus with a partition door device that separates the boat loading/unloading area from the wafer loading/unloading area, allowing boats to flow through a communication area only when necessary, and includes a multi-wing revolving door and boat transfer mechanisms to swap boat locations, minimizing contamination risk.

Benefits of technology

Reduces the risk of by-products contaminating wafers by isolating areas during non-transport times and efficiently swapping boat locations, thereby improving product yield.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 2025141798000001_ABST
    Figure 2025141798000001_ABST
Patent Text Reader

Abstract

To provide a wafer processing apparatus having a furnace tube, the apparatus reducing the possibility that by-products contaminate a boat and wafers on the boat.SOLUTION: The wafer processor includes: a furnace tube (100); a boat loading / unloading region (200) and a wafer loading / unloading region (300) connected via a communication region; and a partition door device including a first partition door assembly (400). The boat loading / unloading region (200) is in communication with the furnace tube (100) and includes at least a first boat loader (210) for loading and unloading a boat (901) into and from the furnace tube (100). The wafer loading / unloading region (300) includes at least a wafer loader (310) for loading and unloading wafers into and from the boat (901). The partition door device is set in the communication region and is operable for partitioning the boat loading / unloading region and the wafer loading / unloading region, and for allowing the boat (901) to circulate between the boat loading / unloading region and the wafer loading / unloading region through the communication region, while blocking by-products generated by a reaction in the furnace tube (100) from passing through the communication region.SELECTED DRAWING: Figure 1
Need to check novelty before this filing date? Find Prior Art

Description

Detailed Description of the Invention

[0001] [Technical Field] This application relates to the technical field of semiconductor manufacturing equipment, and more particularly to wafer processing equipment.

[0002] [Background technology] The wafer processing apparatus may include a connected furnace tube and a loading / unloading area, and when wafers on a first boat in the loading / unloading area are loaded into the furnace tube by a boat elevator for heat treatment, a second boat in the loading / unloading area can load wafers at a temporary placement position to improve production efficiency.

[0003] When the processing of the wafers in the first boat is completed, the boat elevator removes the first boat from the furnace tube, the boat transport device places the first boat in a temporary storage position, the boat transport device then transports the second boat to the boat elevator, and the boat elevator carries the second boat into the furnace tube for heat processing.

[0004] When the first boat is unloaded from the furnace tube, the air pressure in the furnace tube is higher than that in the loading / unloading area, so reaction by-products in the furnace tube are discharged from the furnace tube and contaminate the wafers on the second boat. Also, before and during the second boat is loaded from the temporary storage position into the furnace tube, reaction by-products in the first boat also diffuse into the second boat and contaminate the wafers in the second boat.

[0005] Summary of the Invention An object of the present application is to provide a wafer processing apparatus that reduces the risk of contamination on wafers and improves product yield.

[0006] In order to achieve the above object, the present application provides a wafer processing apparatus, the wafer processing apparatus including a furnace tube, a loading / unloading area, and a partition door device, the loading / unloading area includes a boat loading / unloading area and a wafer loading / unloading area that are connected via a communication area, the boat loading / unloading area is connected to the furnace tube, the boat loading / unloading area includes at least a first boat loader for loading / unloading a boat into / out of the furnace tube, and the wafer loading / unloading area includes at least a wafer loader for loading / unloading wafers into / out of the boat; The partition door device is installed in the communication area, and the partition door device can separate the boat loading / unloading area from the wafer loading / unloading area, and the partition door device is operable to allow the boat to flow between the boat loading / unloading area and the wafer loading / unloading area via the communication area.

[0007] Optionally, the partition door device can be driven to move the boat so that the boat can flow between the boat loading / unloading area and the wafer loading / unloading area via the communication area.

[0008] Optionally, the partition door device includes a first partition door assembly having a first partition door and a plurality of boat transfer mechanisms, each of the boat transfer mechanisms configured to load and move at least one boat, the plurality of boat transfer mechanisms including a first boat transfer mechanism and a second boat transfer mechanism, the first boat transfer mechanism and the second boat transfer mechanism being distributed on opposing first and second sides of the first partition door, at least the plurality of boat transfer mechanisms being rotatable about a rotation center to form a first state and a second state, in the first state the first boat transfer mechanism is located in the boat loading / unloading area and the second boat transfer mechanism is located in the wafer loading / unloading area, and in the second state the second boat transfer mechanism is located in the boat loading / unloading area and the first boat transfer mechanism is located in the wafer loading / unloading area.

[0009] Optionally, the boat transfer mechanism includes a support base for placing a boat thereon and for moving the placed boat when rotating around the rotation center, the support base of the first boat transfer mechanism and the support base of the second boat transfer mechanism are connected by a connector, the connector is connected to the first partition door, the connector and the support base are provided on the same side of the first partition door, and the support base, the connector, and the first partition door are rotatable synchronously around the rotation center so as to switch the multiple boat transfer mechanisms between the first state and the second state; and / or The boat transfer mechanism includes a boat holder and a holder rotation shaft, the boat holder is mounted on the holder rotation shaft, the holder rotation shaft is connected to the first partition door, the boat holder is rotatable around the holder rotation shaft until it holds a boat in order to place the boat, the boat holder is rotatable around the holder rotation shaft to release the boat it is holding, and the boat holder, the holder rotation shaft and the first partition door are rotatable synchronously around the rotation center to move the boat it holds and switch the multiple boat transfer mechanisms between the first state and the second state.

[0010] Optionally, the boat holder includes a plurality of boat sub-holders, the holder rotation shaft includes a plurality of holder sub-rotation shafts, the boat sub-holders are provided on the holder sub-rotation shafts, the holder sub-rotation shafts are connected to the first partition door, and the boat sub-holders are rotatable around the holder sub-rotation shafts; The boat holder being rotatable about the holder rotation axis until it holds a boat in order to place the boat includes the plurality of boat sub-holders of the boat holder being rotatable until they gather and clamp the boat in order to place the boat, The boat holder being rotatable about the holder rotation axis to release the boat it is holding includes the multiple boat sub-holders of the boat holder being rotatable until they separate to release the clamped boat.

[0011] Optionally, the boat transfer mechanism includes the boat holder and the holder rotation shaft, and the boat transfer mechanism includes: the boat holder can rotate about the holder rotation axis until it holds a boat in order to place the boat thereon, and the boat holder can rise to lift the boat it holds, before the boat holder, the holder rotation axis, and the first partition door rotate about the rotation center to move the held boat; After the boat holder, the holder rotation axis, and the first partition door rotate around the rotation center to move the boat it holds, the boat holder can be lowered to lift down the boat it holds, and the boat holder is configured to be rotatable around the holder rotation axis to release the boat it holds.

[0012] Optionally, the first partition door and the boat transfer mechanism can rotate synchronously, and the first partition door assembly further includes a sealing material, and when the first partition door and the boat transfer mechanism rotate, the sealing material and the first partition door form a gap, and when the rotation of the first partition door and the boat transfer mechanism stops, the sealing material seals the gap between the loading / unloading area and the first partition door.

[0013] Optionally, the first partition door is a multi-wing revolving door, and the multi-wing revolving door includes at least three door flaps, and the at least three door flaps include two main door flaps and at least one secondary door flap, and the two main door flaps are connected to partition a first side and a second side of the first partition door, and the at least one secondary door flap is located on the first side of the first partition door and / or the second side of the first partition door; The included angles between adjacent door flaps are equal, the boat transfer mechanism is installed in one-to-one correspondence between the adjacent door flaps, and the boat transfer mechanism and the multi-blade rotating door are rotatable around the rotation center and drive the boat to rotate between the boat loading / unloading area and the wafer loading / unloading area via the communication area.

[0014] Alternatively, the boat loading / unloading area may include a plurality of functional sub-areas, and / or the wafer loading / unloading area may include a plurality of functional sub-areas, with partition sections formed between adjacent door flaps, and the multi-blade revolving door and the boat transfer mechanism may rotate around the rotation center, such that each partition section is sequentially connected to the functional sub-area.

[0015] Optionally, the wafer processing apparatus includes a plurality of the loading / unloading areas and a plurality of the furnace tubes, and the boat loading / unloading areas communicate with the furnace tubes in one-to-one correspondence.

[0016] Optionally, the gate arrangement can be opened when the boat passes and closed after the boat has passed.

[0017] Optionally, the partition door system includes a second partition door assembly; the second partition door assembly includes a second partition door, the second partition door assembly includes a third state and a fourth state, in the third state, the second partition door closes the communication area and in the fourth state, the second partition door opens the communication area; and / or The second partition door assembly includes a second boat loader, the second boat loader is provided in the boat loading / unloading area, the second boat loader is configured to load a boat into the wafer loading / unloading area and close the communication area, and the second boat loader is configured to load a boat out of the wafer loading / unloading area.

[0018] Optionally, the second partition door assembly includes the second partition door, and the furnace tube and the wafer loading / unloading area are installed on the same side of the boat loading / unloading area, and the second partition door assembly includes a fifth state, in which the second partition door closes the connection end between the furnace tube and the boat loading / unloading area.

[0019] Optionally, the second partition door assembly includes the second partition door and a door drive mechanism, the door drive mechanism including a door shaft and a cross member, the door shaft being rotatably installed between the furnace tube and the wafer loading / unloading area, and the cross member connecting the second partition door and the door shaft.

[0020] Optionally, the furnace tube and the boat loading / unloading area are arranged along a vertical direction, the furnace tube and the wafer loading / unloading area are arranged on the same side of the boat loading / unloading area, and when loading or unloading the boat, the first boat loader and the second boat loader are driven to move the boat along the vertical direction.

[0021] Optionally, the wafer processing apparatus further includes a transfer area and at least one transfer port, the transfer area being provided on one side of the wafer loading / unloading area and configured to place a pod therein, the transfer port being provided in a partition wall between the wafer loading / unloading area and the transfer area, the partition wall partially surrounding the wafer loader, an axial direction of the partition wall being parallel to a vertical direction, the transfer port being configured to pass at least wafers in a pod, the wafer loader being configured to load wafers in the pod into a boat in the wafer loading / unloading area, and the wafer loader being configured to load wafers in the boat into a pod in the transfer area, a holder assembly being provided on a side of the partition wall away from the wafer loader, the holder assembly including at least one pod holder, and the pod holder being configured to place a pod in the transfer area; The holder assembly includes n rows of the pot holders arranged circumferentially around the partition wall, and the at least one transport port is arranged in n rows along the circumferential direction of the partition wall, n≧1, and the row positions of the pot holders in each row are arranged corresponding to the row positions of the transport ports in each row.

[0022] Optionally, the partition walls partially surround the wafer loader at equal intervals, and n≧2.

[0023] Optionally, in the n rows of pod holders, the m-th row of pod holders includes a plurality of the pod holders, and the m-th row of pod holders includes i m The pod holder unit is divided into pod holder units, and 1≦m≦n,i m ≧2, and the pod holder unit is m j pod holders, m ≧1, and the i m pod holder units are distributed along the vertical direction, In the n-th row of transport ports, the m-th row of transport ports has j m the transfer ports, the m-th transfer port corresponds to the column position of the m-th pod holder, and j m The transfer ports are the jth transfer ports in any one of the pod holder units in the mth row of pod holders. m is the same as the position distribution of the pod holders, The pod holder in the mth row is movable in the vertical direction so as to align any one of the pod holder units in the mth row with the transfer port in the mth row.

[0024] Selectively, j m ≧2, and in the m-th row of pod holders, the pod holders in any two adjacent pod holder units are alternately arranged in the vertical direction.

[0025] The wafer processing apparatus disclosed in the present application has the following beneficial effects.

[0026] The wafer processing apparatus of the present application includes a furnace tube, a loading / unloading area, and a partition door device, the loading / unloading area including a boat loading / unloading area and a wafer loading / unloading area that are connected via a communication area, the boat loading / unloading area communicating with the furnace tube, the boat loading / unloading area including at least a first boat loader for loading / unloading the boat into / out of the furnace tube, the wafer loading / unloading area including at least a wafer loader for loading / unloading wafers into / out of the boat, the partition door device being installed in the communication area, the partition door device being capable of separating the boat loading / unloading area from the wafer loading / unloading area, and the partition door device being operable to allow the boat to flow between the boat loading / unloading area and the wafer loading / unloading area via the communication area. The partition door device opens temporarily only when a boat is passing, allowing the boat to flow between the boat loading / unloading area and the wafer loading / unloading area via the communication area; when no boat is passing, the boat loading / unloading area and the wafer loading / unloading area are isolated from the partition door device, preventing by-products generated by reactions in the furnace tubes from passing through the communication area, reducing the risk of by-products contaminating the boat and the wafers in the boat and improving product yield.

[0027] Other features and advantages of the present application will become apparent from the following detailed description, or in part may be learned by the practice of the present application.

[0028] It should be noted that the above general and detailed descriptions are merely illustrative or exemplary and are not restrictive. [Brief explanation of the drawings]

[0029] The drawings herein are incorporated into the specification and constitute a part of this specification, are adapted to the embodiments of the present application, and are used together with the specification to interpret the principles of the present application. It is apparent that the drawings in the following description are merely some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without any creative effort. [Figure 1] 1 is a schematic front view of a wafer processing apparatus according to a first embodiment of the present invention. [Figure 2] 1 is a schematic plan view of a wafer processing apparatus according to a first embodiment of the present invention; [Figure 3] FIG. 1 is a schematic diagram showing by-products discharged from inside a furnace tube and contaminating a wafer. [Figure 4] FIG. 1 is a schematic diagram showing how by-products are diffused and contaminate the wafer. [Figure 5] FIG. 1 is a schematic diagram of a contaminated wafer. [Figure 6] FIG. 2 is a schematic diagram showing how a boat holder holds a boat in the first embodiment of the present invention. [Figure 7] FIG. 10 is a schematic diagram illustrating the boat holder releasing the boat in the first embodiment of the present invention. [Figure 8] FIG. 2 is a schematic diagram showing a boat placed on a support stand according to the first embodiment of the present invention. [Figure 9] FIG. 2 is a schematic diagram showing a state in which a first partition door is closed in the first embodiment of the present invention. [Figure 10] FIG. 2 is a schematic diagram showing a state in which a first partition door is open in the first embodiment of the present invention. [Figure 11] FIG. 1 is a schematic diagram showing a first partition door assembly according to a first embodiment of the present invention, which forms multiple partition sections. [Figure 12] 1 is a schematic diagram of a wafer processing apparatus having a plurality of furnace tubes according to a first embodiment of the present invention. [Figure 13] FIG. 2 is a schematic diagram showing how a first pod holder unit carries in and out a wafer in the first embodiment of the present invention. [Figure 14] FIG. 10 is a schematic diagram showing how a second pod holder unit in accordance with the first embodiment of the present invention carries in and out a wafer. [Figure 15] FIG. 10 is a front view of a wafer processing apparatus according to a second embodiment of the present invention. [Figure 16] FIG. 10 is a schematic plan view of a wafer processing apparatus according to a second embodiment of the present invention.

[0030] Drawing description: 100 furnace tubes, 200 boat loading / unloading area, 201 temporary storage position, 210 first boat loader, 300 wafer loading / unloading area, 310 wafer loader, 400 First partition door assembly, 410 First partition door, 411 Door flap, 421 Boat sub-holder, 422 Holder sub-rotation shaft, 431 Support base, 432 Connector, 440 Sealing material, 500 transfer area, 510 transfer port, 520 partition wall, 600 Holder Assembly, 610 Pod Holder Unit, 611 Pod Holder, 700 second partition door assembly, 710 second partition door, 720 door drive mechanism, 721 door shaft, 722 cross member, 730 second boat loader, 800 boat transfer equipment, 901 First boat, 902 Second boat, 903 Pod.

[0031] [Mode for Carrying Out the Invention] The exemplary embodiments will be described in more detail below with reference to the drawings. However, the exemplary embodiments can be implemented in various forms and are not limited to the examples set forth herein. By providing these embodiments, the present application will be more complete and thorough, and will comprehensively convey the concept of the exemplary embodiments to those skilled in the art.

[0032] Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, many specific details are provided to thoroughly understand the embodiments of the present application. However, those skilled in the art will understand that the technical solutions of the present application can be implemented without one or more of the specific details, or that other methods, components, devices, steps, etc. can be employed. In other instances, well-known methods, devices, implementations, or operations are not shown or described in detail to avoid obscuring aspects of the present application.

[0033] The present application will be described in more detail below with reference to the drawings and specific examples. The technical features of each embodiment of the present application described below can be combined with each other as long as they are not inconsistent. The embodiments described below with reference to the drawings are merely illustrative and are intended to help interpret the present application, and should not be construed as limiting the present application.

[0034] Example 1 1 and 2, the wafer processing apparatus in this embodiment includes a furnace tube 100, a loading / unloading area, and a partition door device. The loading / unloading area includes a boat loading / unloading area 200 and a wafer loading / unloading area 300, which are connected via a communication area, and the boat loading / unloading area 200 is connected to the furnace tube 100. The boat loading / unloading area 200 includes at least a first boat loader 210 for loading / unloading a boat into / from the furnace tube 100. The wafer loading / unloading area 300 includes at least a wafer loader 310 for loading / unloading wafers into / from the boat. The wafer loader 310 is used to load / unload wafers into / from a pod 903.

[0035] The partition door device is installed in the communication area, and in a stationary state, the partition door device can separate the boat loading / unloading area 200 from the wafer loading / unloading area 300, and the partition door device is operable to allow the boat to flow between the boat loading / unloading area 200 and the wafer loading / unloading area 300 through the communication area. In other words, the partition door device temporarily opens only when a boat is passing, allowing the boat to flow between the boat loading / unloading area 200 and the wafer loading / unloading area 300 through the communication area, and when no boat is passing, the boat loading / unloading area 200 and the wafer loading / unloading area 300 are blocked off by the partition door device.

[0036] In a conventional wafer processing apparatus, when wafers on a first boat in a loading / unloading area are loaded into a furnace tube by a boat elevator and subjected to heat treatment, a second boat in the loading / unloading area can be loaded with wafers at a temporary placement position to improve production efficiency. After the processing of the wafers in the first boat is completed, the boat elevator unloads the first boat from the furnace tube, the boat transport device places the first boat at the temporary placement position, the boat transfer device transfers the second boat to the boat elevator, and the boat elevator loads the second boat into the furnace tube for heat treatment.

[0037] As shown in FIGS. 3 to 5 , when the first boat 901 is unloaded from the furnace tube, the air pressure inside the furnace tube is higher than the air pressure in the loading / unloading area, so reaction by-products in the furnace tube are discharged from the furnace tube and contaminate the wafers on the second boat 902. Even if a purge gas is installed in the loading / unloading area, the discharge speed of the by-products is much faster than the speed of the purge gas, so the purge gas inevitably contaminates the wafers on the second boat 902. Furthermore, before and during the second boat 902 is loaded into the furnace tube from its temporary storage position, reaction by-products on the first boat 901 also diffuse into the second boat 902, contaminating the wafers on the second boat 902. Even if a gas purge loop is installed in the loading / unloading area, the purge gas can only purge and remove partially diffused by-products, failing to fundamentally solve the wafer contamination problem. This further exacerbates the problem of contamination of the wafers on the second boat 902 closest to the furnace tube.

[0038] In this embodiment, the wafer processing apparatus includes a furnace tube 100, a loading / unloading area, and a partition door device. The loading / unloading area includes a boat loading / unloading area 200 and a wafer loading / unloading area 300, which are connected via a communication area. The boat loading / unloading area 200 is connected to the furnace tube 100. The boat loading / unloading area 200 includes at least a first boat loader 210 for loading and unloading a boat into the furnace tube 100. The wafer loading / unloading area 300 includes a wafer loader 310 for loading and unloading wafers into the boat. The partition door device is provided in the communication area and can separate the boat loading / unloading area 200 and the wafer loading / unloading area 300. The partition door device is operable to allow the boat to flow between the boat loading / unloading area 200 and the wafer loading / unloading area 300 via the communication area. The partition door device opens temporarily only when a boat is passing, allowing the boat to flow between the boat loading / unloading area 200 and the wafer loading / unloading area 300 through the connecting area. When no boat is passing through, the boat loading / unloading area 200 and the wafer loading / unloading area 300 are blocked by the partition door device, preventing by-products generated by the reaction in the furnace tube 100 from passing through the connecting area, reducing the risk of by-products contaminating the boat and the wafers in the boat and improving product yield.

[0039] Furthermore, when the boat is unloaded from the furnace tube 100, the boat loading / unloading area 200 and the wafer loading / unloading area 300 are blocked off by a partition door device. A gas purge system can be installed in the boat loading / unloading area 200 and the wafer loading / unloading area 300. When the reaction by-products on the boat in the boat loading / unloading area 200 and the wafer loading / unloading area 300 are purged to a required level, the partition door device is activated, temporarily connecting the boat loading / unloading area 200 and the wafer loading / unloading area 300. This allows the boat to be transported between the boat loading / unloading area 200 and the wafer loading / unloading area 300. This further reduces the risk of by-products contaminating the boat and the wafers in the boat, thereby improving product yield.

[0040] In some embodiments, the partition door device can be driven to move the boat, thereby allowing the boat to flow between the boat loading / unloading area 200 and the wafer loading / unloading area 300 via the communication area. That is, the partition door device separates the boat loading / unloading area 200 and the wafer loading / unloading area 300 when in a stationary state, and when the partition door device is activated, it drives the first boat 901 in the boat loading / unloading area 200 to move to the wafer loading / unloading area 300, and drives the second boat 902 in the wafer loading / unloading area 300 to move to the boat loading / unloading area 200. After the second boat 902 has completed loading into the furnace tube 100 and the first boat 901 has completed loading and unloading wafers in the wafer loading / unloading area 300 and is again loaded with wafers, the partition door device again swaps the areas where the two boats are located, allowing the two boats to circulate between the boat loading / unloading area 200 and the wafer loading / unloading area 300, continuing the process of loading unprocessed wafers from the wafer loading / unloading area 300 into the furnace tube 100, and after wafer processing is complete, returning the wafer to the wafer loading / unloading area 300 for the next process.

[0041] The partition door device separates the boat loading / unloading area 200 from the wafer loading / unloading area 300, and the areas where the two boats are located can be swapped by opening the partition door device at the same time, thereby shortening the time during which the boat loading / unloading area 200 and the wafer loading / unloading area 300 are in communication and advantageously reducing the risk of by-products contaminating the boat and the wafers in the boat.

[0042] Illustratively, the partition door system includes a first partition door assembly 400, which includes a first partition door 410 and a plurality of boat transfer mechanisms. Each boat transfer mechanism is for loading and moving at least one boat, and the plurality of boat transfer mechanisms includes a first boat transfer mechanism and a second boat transfer mechanism, which are distributed on opposing first and second sides of the first partition door 410.

[0043] At least a plurality of boat transfer mechanisms are rotatable around a rotation center to form a first state and a second state, and in the first state, the first boat transfer mechanism is located in the boat loading / unloading area 200 and the second boat transfer mechanism is located in the wafer loading / unloading area 300, and in the second state, the second boat transfer mechanism is located in the boat loading / unloading area 200 and the first boat transfer mechanism is located in the wafer loading / unloading area 300; that is, by exchanging the areas where the boat transfer mechanisms are located, the areas where the first boat 901 and the second boat 902 are located are exchanged.

[0044] At least the boat transfer mechanism can rotate around a rotation center. That is, the first partition door 410 can be raised, lowered, or slid to connect the boat loading / unloading area 200 and the wafer loading / unloading area 300. The area where the two boats are located can be swapped simply by rotating the boat transfer mechanism. The boat transfer mechanism can also be connected to the first partition door 410, either directly or indirectly, movable or fixedly, and the boat transfer mechanism and the first partition door 410 can be rotated synchronously to swap the area where the two boats are located. In some embodiments, the two boat transfer mechanisms are arranged symmetrically about the center, and the center of symmetry, which is the common center point between the two boat transfer mechanisms, can be the rotation center of the boat transfer mechanisms. In other embodiments, the rotation center can be set according to actual conditions.

[0045] The first boat transfer mechanism and the second boat transfer mechanism are distributed on the opposing first and second sides of the first partition door 410, and the boat transfer mechanism rotates 180 degrees around the center of rotation, thereby enabling the exchange of the areas where the two boats are located.

[0046] As shown in Figures 6 and 7, the boat transfer mechanism includes a boat holder and a holder rotation shaft. The boat holder is rotatably mounted on the first partition door 410 via the holder rotation shaft. The holder rotation shaft may be directly or indirectly connected to the first partition door 410. The connection may be movable or fixed, as long as the holder rotation shaft serves as the rotation axis of the boat holder and the boat transfer mechanism rotates synchronously with the first partition door 410. The boat holder can rotate around the support rotation shaft to hold a boat for loading, and the boat holder can rotate around the holder rotation shaft to release the held boat. The boat holder, the holder rotation shaft, and the first partition door 410 can rotate synchronously around a rotation center to move the held boat and switch the multiple boat transfer mechanisms between a first state and a second state.

[0047] The boat transfer mechanism includes a boat holder and a holder rotation axis, and the boat holder is rotatable around the holder rotation axis to hold or release the boat, but is not limited to this. The boat transfer mechanism may also adopt an extendable structure, and the boat transfer mechanism holds or releases the boat by extending and retracting movement, and the specific structure may be determined depending on the situation.

[0048] The boat transfer mechanism includes a boat holder and a holder rotation axis, and the boat holder rotates around the holder axis to hold or release the boat.Compared to a system in which the boat transfer mechanism holds or releases the boat by extending and contracting, the structure for holding or releasing the boat is simpler, thereby reducing the manufacturing costs of the wafer processing device and improving the robustness of the boat transfer mechanism.

[0049] The boat transfer mechanism includes a boat holder and a holder rotation shaft, and the boat holder rotates around the holder rotation shaft to hold or release the boat.

[0050] In some embodiments, the boat holder is a single-arm holder, i.e., the boat transfer mechanism holds or releases the boat by rotating the boat holder. Preferably, when the boat holder is a single-arm holder, there is a cooperating structure between the boat holder and the boat so that the boat holder can securely hold the boat. The cooperating structure is, for example, a hooking mechanism or a gripping mechanism, which realizes the holding or release of the boat.

[0051] In some embodiments, the boat holder is a multi-arm clamping holder, i.e., the boat holder includes multiple boat sub-holders 421, and the boat placement mechanism holds or releases the boat by moving the multiple boat sub-holders 421 closer to or farther away from each other, which is simple in structure and convenient to operate.

[0052] Specifically, the boat holder includes a plurality of boat sub-holders 421, and the holder rotation shaft includes a plurality of holder sub-rotation shafts 422. The holder sub-rotation shafts 422 are connected to the first partition door 410. The connection may be direct or indirect, movable, or fixed, as long as the holder sub-rotation shafts 422 serve as the rotation shafts of the boat sub-holders 421 and can achieve synchronous rotation between the boat transfer mechanism and the first partition door 410. Each boat sub-holder 421 is rotatably connected to the first partition door 410 via each holder sub-rotation shaft 422, and the boat sub-holder 421 can rotate around the holder sub-rotation shaft 422. As shown in FIGS. 6 and 7 , the boat holder includes two boat sub-holders 421, and the holder rotation shaft includes two holder sub-rotation shafts 422. The holder sub-rotation shafts 422 are fixedly installed on the first partition door 410 at least in a horizontal position. The boat holder being rotatable around the holder rotation axis until it holds the boat in order to place the boat includes the multiple boat sub-holders 421 of the boat holder being rotatable until they bring the boat together and clamp it in order to place the boat, and the boat holder being rotatable around the holder rotation axis until it releases the boat it is holding includes the multiple boat sub-holders 421 of the boat holder being rotatable until they move apart to release the clamped boat.

[0053] Preferably, the boat holder includes two boat sub-holders 421, and the holder rotation shaft includes two holder sub-rotation shafts 422, as shown in FIG. 6. This has a simple structural design, is easy to operate, and can hold the boat relatively firmly. One boat holder is provided on each side of the first partition door 410 to hold or release the boat. In other embodiments, two or more boat holders may be provided on the same side of the first partition door 410, and the multiple boat holders are spaced apart vertically to clamp the boat at multiple points, improving the stability of the boat.

[0054] In some embodiments, the boat transfer mechanism is arranged so that at least the boat holder can move back and forth in the vertical direction. Before the boat holder, the holder rotation shaft, and the first partition door 410 rotate about the rotation center to move the held boat, the boat holder can rotate about the holder rotation shaft until it holds the boat and can rise to lift the held boat. After the boat holder, the holder rotation shaft, and the first partition door 410 rotate about the rotation center to move the held boat, the boat holder can lower the held boat and can rotate about the holder rotation shaft to release the held boat. For example, after the first boat loader 210 unloads the first boat 901 from the furnace tube 100, the boat holder can rotate around the holder rotation axis to hold the boat in order to load the boat, and then the boat holder can rise to lift the loaded boat from the first boat loader 210, thereby facilitating the rotation of the boat holder around the rotation center and realizing switching between the first state and the second state to exchange the areas where the first boat 901 and the second boat 902 are located. Before the first boat loader 210 loads the second boat 902 into the furnace tube 100, the boat holder can lower to load the second boat 902 onto the first boat loader 210, and then the boat holder can rotate around the holder rotation axis to release the boat it is holding.

[0055] In some embodiments, the boat holder achieves the reciprocating movement in the vertical direction by driving the holder rotation shaft, and the holder rotation shaft is movably connected to the first partition door 410 so as to be able to reciprocate along the vertical direction. In some embodiments, the holder rotation shaft is directly and fixedly connected to the first partition door 410, and the boat holder achieves the reciprocating movement along the vertical direction by driving the holder rotation shaft and the first partition door 410.

[0056] The boat holder can reciprocate vertically, so that when a boat is to be removed, it can be lifted from the first boat loader 210. When the boat is to be released, the boat holder can be rotated to a predetermined position and then lowered to release the boat, preventing collisions between the boats during transport and affecting product yield. Furthermore, the boat holder can reciprocate vertically to hold or release the boat, allowing smooth transfer of the boat to and from the first boat loader 210. This eliminates the need for the boat transfer device 800 in the boat loading / unloading area 200 to transfer the boat from the first boat loader 210 to the boat transfer mechanism, thereby reducing the manufacturing costs of the wafer processing apparatus.

[0057] As shown in FIG. 8 , in some embodiments, the boat transfer mechanism includes a support platform 431, with two support platforms 431 installed on the first and second sides of the first partition door 410, respectively. The support platforms 431 are configured to support a boat and move the boat when rotating around a rotation center. In the embodiment shown in FIG. 8 , the two support platforms 431 are installed symmetrically, and the rotation center may be a common center point of the two support platforms 431. In other embodiments, the rotation center of the support platforms 431 may be set according to actual needs. When the boat transfer mechanism includes the support platform 431, a boat transfer device 800 may be installed in the boat loading / unloading area 200 to transfer a boat from the first boat loader 210 onto the support platform 431 or from the support platform 431 to the first boat loader 210. Furthermore, the support base 431 may be provided with a structure such as a suction cup or a card slot for fixing the boat so that the boat does not tilt or become displaced when the support base 431 rotates around the rotation center.

[0058] The boat transfer mechanism includes a support table 431, and the boats are placed and moved by the support table 431, making it easier to exchange the areas where the two boats are located.

[0059] In some embodiments, the support base 431 of the first boat transfer mechanism and the support base 431 of the second boat transfer mechanism are connected by a connector 432, which is connected to the first partition door 410, and the connector 432 and the support base 431 are installed on the same side of the first partition door 410. The connector 432 and the support base 431 may be connected together, and a rotation drive device such as a motor may be provided on the side of the connector 432 and the support base 431 away from the first partition door 410. The support base 431, the connector 432, and the first partition door 410 can rotate synchronously, thereby exchanging the areas where the first boat transfer mechanism and the second boat transfer mechanism are located and realizing the exchange of the areas where the two boats are located.

[0060] The support base 431 is used as a boat transfer mechanism to drive the boat to rotate, and also functions as a base that drives the first partition door 410 to rotate, thereby simplifying the structure of the first partition door assembly 400.

[0061] The boat transfer mechanism may include a support base 431, or may include a boat holder and a holder rotation shaft, but is not limited thereto. The boat transfer mechanism may also include the support base 431, boat holder, and holder rotation shaft simultaneously, and the specific arrangement may be determined according to the circumstances. The boat transfer mechanism includes the support base 431, boat holder, and holder rotation shaft simultaneously. The boat held by the boat holder and holder rotation shaft is placed on the support base 431, so that the boat is less likely to tilt or sway when the boat transfer mechanism and first partition door 410 rotate. At the same time, using the support base 431 as support, the number of boat sub-holders 421 of the boat holder can be reduced, for example, to two.

[0062] 9 and 10 , the first partition door 410 and the boat transfer mechanism can rotate synchronously. The first partition door assembly 400 further includes a sealant 440, which may be installed between the first partition door 410 and the inner wall of the loading / unloading area. Before the first partition door 410 and the boat transfer mechanism rotate, the sealant 440 moves away from the first partition door 410. When the first partition door 410 and the boat transfer mechanism rotate, a gap is formed between the sealant 440 and the first partition door 410. When the rotation of the first partition door 410 and the boat transfer mechanism stops, the sealant 440 moves toward the first partition door 410, sealing the gap between the loading / unloading area and the first partition door 410.

[0063] By installing a sealant 440 between the first partition door 410 and the loading / unloading area, the blocking effect of the first partition door 410 can be enhanced, and the risk of by-products contaminating the boat and the wafers in the boat can be further reduced.

[0064] As shown in Figure 11, the first partition door 410 is a multi-wing revolving door, which includes at least three door flaps 411, including two main door flaps and at least one secondary door flap. The two main door flaps are connected to separate the first and second sides of the first partition door 410, and the at least one secondary door flap is located on the first side and / or the second side of the first partition door 410. All of the door flaps 411 are arranged in a ring array and share a common rotation axis, i.e., a rotation center. The included angles formed between each pair of adjacent door flaps 411 are equal, and partition sections are formed between the adjacent door flaps 411, with the included angles between the door flaps 411 corresponding to each partition section being the same.

[0065] The first partition door assembly 400 includes a plurality of boat transfer mechanisms, including a first boat transfer mechanism, a second boat transfer mechanism, ..., a pth boat transfer mechanism, where p is the number of partition sections. The boat transfer mechanisms are provided in one-to-one correspondence between adjacent door flaps 411, i.e., the boat transfer mechanisms are provided in one-to-one correspondence with the partition sections. The boat transfer mechanisms are rotatable about a rotation center to drive the boats to move between the boat loading / unloading area 200 and the wafer loading / unloading area 300 via the communication area.

[0066] Each boat transfer mechanism can load and move at least one boat, the first partition door 410 is a multi-wing revolving door, the door flaps 411 of the multi-wing revolving door are arranged in a ring array to form multiple partition sections, the boat transfer mechanisms are installed in one-to-one correspondence between adjacent door flaps 411, the boat transfer mechanism in the first partition door assembly 400 and the first partition door 410 can rotate synchronously, and the first partition door assembly 400 can load and move more boats simultaneously, thereby improving the work efficiency of the wafer processing apparatus in processing wafers.

[0067] 11 , the boat loading / unloading area 200 includes at least one functional sub-area, and the wafer loading / unloading area 300 includes at least one functional sub-area. The number of functional sub-areas included in the boat loading / unloading area 200 and the number of functional sub-areas included in the wafer loading / unloading area 300 may be the same or different. For example, some functional sub-areas in the boat loading / unloading area 200 may be configured to connect the furnace tube 100, some functional sub-areas in the boat loading / unloading area 200 may be configured to pre-process, cool, or temporarily store the boat, some functional sub-areas in the wafer loading / unloading area 300 may be configured to load / unload wafers into / from the boat, and some functional sub-areas in the wafer loading / unloading area 300 may be configured to pre-process, cool, or temporarily store the boat, as determined according to specific circumstances. The first partition door 410 and the boat transfer mechanism rotate around a rotation center to sequentially connect each partition section to the functional sub-areas and to sequentially transfer each boat between different functional sub-areas. As can be understood, when the first partition door 410 rotates, the functional sub-areas communicate with each other, and after the rotation of the first partition door 410 is completed and each partition section communicates with the functional sub-area in one-to-one correspondence, the first partition door 410 is closed, and the functional sub-areas are partitioned.

[0068] The number of functional sub-areas included in the boat loading / unloading area 200 and the number of functional sub-areas included in the wafer loading / unloading area 300 in the loading / unloading area can be set according to actual needs. It can be understood that the sum of the number of functional sub-areas included in the boat loading / unloading area 200 and the number of functional sub-areas included in the wafer loading / unloading area 300 is the same as the number of partition sections defined by the first partition doors 410, i.e., multi-wing revolving doors. In some embodiments, when there are an even number of partition sections, the two main door flaps connected in the first partition door 410 form an angle of 180 degrees. When there are an odd number of partition sections, the angle between the two main door flaps connected in the first partition door 410 is less than 180 degrees, but is not limited thereto. When there are an even number of partition sections, the angle between the two main door flaps connected in the first partition door 410 can be greater than 180 degrees.

[0069] The boat loading / unloading area 200 includes multiple functional sub-areas, and / or the wafer loading / unloading area 300 includes multiple functional sub-areas. A plurality of door flaps 411 arranged in a ring array form multiple partition sections, and boat transfer mechanisms are arranged in one-to-one correspondence with the partition sections, connecting each partition section to each functional sub-area in sequence. Furthermore, each boat is rotated between different functional sub-areas in sequence. By providing more functional sub-areas for pre-processing, cooling, or temporary storage of boats, the processing efficiency of wafers by the wafer processing device can be further improved. Furthermore, the first partition door assembly 400 includes a first partition door 410, i.e., a multi-wing revolving door, which separates the multiple functional sub-areas and further reduces contamination.

[0070] In some embodiments, as shown in FIG. 12 , the wafer processing apparatus includes a plurality of loading / unloading areas and a plurality of furnace tubes 100, each of which includes a boat loading / unloading area 200 and a wafer loading / unloading area 300 connected via a communication area, and a first partition door assembly 400 is provided in one-to-one correspondence with the communication area, and the boat loading / unloading area 200 communicates with the furnace tubes 100 in one-to-one correspondence.

[0071] The wafer processing apparatus includes multiple furnace tubes 100, which can process multiple boats simultaneously, thereby improving the wafer processing efficiency of the wafer processing apparatus. In the wafer processing apparatus, multiple wafer loading / unloading areas 300 can share a wafer transfer machine, and accordingly, the transfer area 500 and the transfer port 510 can be shared, thereby reducing the cost of the wafer processing apparatus and the space occupied by the wafer processing apparatus.

[0072] 2, 13, and 14 (FIGS. 13 and 14 are cross sections taken along the line AA in FIG. 2), the wafer processing apparatus further includes a transfer area 500 and a transfer port 510. There is at least one transfer port 510. The transfer area 500 is provided on the wafer loading / unloading area 300 side and is configured to receive a pod 903. The transfer port 510 is provided in a partition wall 520 between the wafer loading / unloading area 300 and the transfer area 500. The partition wall 520 partially surrounds the wafer loader 310, and the axial direction of the partition wall 520 is parallel to the vertical direction. The transfer port 510 is configured to pass at least wafers in the pod 903. Preferably, the transfer port 510 is a front-opening interface mechanical standard (FIMS) device, and the transfer port 510 is further configured to open or close the pod 903. The wafer loader 310 is configured to load the wafers in the pod 903 into a boat in the wafer loading / unloading area 300 , and the wafer loader 310 is configured to load the wafers on the boat into the pod 903 in the transfer area 500 .

[0073] A holder assembly 600 is installed on the side of the partition wall 520 away from the wafer loader 310, and the holder assembly 600 includes at least one pod holder 611 configured to hold some of the pods 903 in the transfer region 500. The holder assembly 600 includes n rows of pod holders 611 arranged along the circumferential direction of the partition wall 520, and at least one transfer port 510 is arranged in n rows along the circumferential direction of the partition wall 520, where n is 1 or more, and the row positions of the pod holders 611 in each row are arranged corresponding to the row positions of the transfer ports 510 in each row.

[0074] When n is equal to 1, one row of transfer ports 510 may include multiple transfer ports 510; when n is greater than 1, multiple rows of transfer ports 510 are installed surrounding the wafer loader 310, so that the wafer loader 310 can access wafers in different pods 903 through the multiple transfer ports 510 as needed, or once access to wafers in one pod 903 is completed, the wafer loader 310 can access wafers in another pod 903 in a timely manner, thereby improving the operating flexibility and work efficiency of the internal structure of the wafer processing apparatus.

[0075] The holder assembly 600 is installed on the partition wall 520, and the pod 903 is placed on the holder assembly 600, shortening the distance between the pod 903 and the boat, thereby reducing the time required for loading and unloading wafers and improving the working efficiency of the wafer processing apparatus.

[0076] 2, the partition walls 520 partially surround the wafer loader 310 at equal intervals, and n is equal to or greater than 2. The partition walls 520 partially surround the wafer loader 310 at equal intervals may mean that at least multiple rows of transfer ports 510 in the partition walls 520 surround the wafer loader 310 at equal intervals.

[0077] Multiple rows of pod holders 611 are arranged around the circumferential direction of partition wall 520, and multiple rows of transfer ports 510 are provided around partition wall 520, with the position of each row of pod holders 611 being set to correspond to the position of each row of transfer ports 510. Wafer loader 310 can load and unload wafers from multiple rows of pod holders 611, and by arranging partition walls 520, wafer loader 310 can be partially surrounded at equal intervals. This makes it possible to make the distance from wafer loader 310 to each row of pod holders 611 equal or approximately equal, thereby reducing the difficulty of loading and unloading wafers, improving the work efficiency of the wafer processing apparatus, and simplifying the structural design of wafer loader 310.

[0078] In some embodiments, in the n rows of pod holders 611, the m-th row of pod holders 611 includes a plurality of pod holders 611, and the m-th row of pod holders 611 includes i m The pod holder units 610 are partitioned into pod holder units 610, and 1≦m≦n, i m is equal to or greater than 2. The pod holder unit 610 m pod holders 611, m is 1 or greater, and i m The pod holder units 610 are distributed vertically. m The m-th transfer port 510 corresponds to the column position of the m-th pod holder 611, and the j m The transfer ports 510 are j in any one of the pod holder units 610 of the pod holders 611 in the m-th row. m 2, 13, and 14, n=4, m=1, 2, 3, or 4, and i m =2, j m = 2. As can be seen, when different columns of pod holders 611 in the n columns of pod holders 611, i.e., when the m value changes, i m and j m The value of may vary with m, or for each row of pod holders 611, i m and j m The value of does not need to change with m, but can be determined according to the specific situation.

[0079] The m-th row of pod holders 611 includes a plurality of pod holders 611, and the m-th row of pod holders 611 includes i mThe pod holders 611 are divided into pod holder units 610, and other pod holders 611 may be installed both above and below the multiple pod holders 611 included in the mth row of pod holders 611, but it may be understood that these other pod holders 611 do not belong to the multiple pod holders 611 included in the mth row of pod holders 611.

[0080] The n rows of pod holders 611 can move vertically synchronously or asynchronously. The synchronous vertical movement of the n rows of pod holders 611 simplifies the design of the holder assembly 600, while the asynchronous vertical movement of the n rows of pod holders 611 improves the efficiency of wafer access.

[0081] As a result, by moving the holder assembly 600 vertically, the number of transfer ports 510 in at least one row of transfer ports 510 becomes less than the number of pod holders 611 in the corresponding row, and multiple pod holders 611 in the corresponding row share the at least one row of transfer ports 510, thereby reducing the number of transfer ports 510 and lowering the manufacturing cost of the wafer processing device, while also ensuring sufficient space for arranging the transfer ports 510 and reducing the difficulty of installing the transfer ports 510.

[0082] j m is 2 or more, and in the m-th row of pod holders 611, the pod holders 611 in any two adjacent pod holder units 610 are arranged alternately in the vertical direction. For example, as shown in Figures 13 and 14, each row of pod holders 611 includes four pod holders 611, which are divided into two pod holder units 610, each pod holder unit 610 includes two pod holders 611, and the pod holders 611 in two adjacent pod holder units 610 are arranged alternately in the vertical direction. Each row of transfer ports 510 includes two transfer ports 510.

[0083] If two pod holder units 610 arranged adjacent to each other vertically differ only in the position of one pod holder 611, when moving the holder assembly 600 vertically, only the height of one pod holder 611 needs to be moved to align the pod holder 611 in the adjacent pod holder unit 610 with the transfer port 510, thereby reducing the stroke of the holder assembly 600's vertical movement, reducing collisions and contamination during the movement process, and improving wafer processing efficiency.

[0084] In another embodiment, if two adjacent pod holder units 610 arranged alternately in the vertical direction differ in position by x number of pod holders 611, when moving the holder assembly 600 in the vertical direction, the pod holders 611 in the adjacent pod holder unit 610 can be aligned with the transfer port 510 by simply moving the height of x number of pod holders 611. Obviously, x <j m is.

[0085] Preferably, i m =2, j m = 2. That is, each row of pod holders 611 includes two pod holder units 610, and each pod holder unit 610 includes two pod holders 611.

[0086] Each row of pod holders 611 includes two pod holder units 610, and each pod holder unit 610 includes two pod holders 611, which allows the wafer loader 310 to access wafers quickly, preventing the wafer access speed from becoming a bottleneck in improving the work efficiency of the wafer processing device, and at the same time preventing an increase in the manufacturing cost of the wafer processing device due to having too many pod holders 611.

[0087] In some embodiments, the wafer processing apparatus further includes a sealing device, which may be provided in the boat loading / unloading area 200 and located on the furnace tube 100 side. The sealing device is configured to seal the connection end between the furnace tube 100 and the boat loading / unloading area 200. When the furnace tube 100 processes a boat, the connection end between the furnace tube 100 and the boat loading / unloading area 200 is sealed by the first boat loader 210. After the first boat loader 210 descends, the connection end between the furnace tube 100 and the boat loading / unloading area 200 is sealed by the sealing device. This prevents contaminants in the boat loading / unloading area 200 from diffusing into the furnace tube 100 and contaminating wafers subsequently processed by the furnace tube 100, and reduces the frequency of cleaning maintenance of the furnace tube 100.

[0088] The wafer processing apparatus further includes a purge inlet for introducing an inert gas to purge the boat loading / unloading area 200 and / or the wafer loading / unloading area 300, and an exhaust port for exhausting the introduced gas. In some embodiments, when the boat loading / unloading area 200 has been purged to a required level of contamination, the partition door device operates to rotate the boat between the boat loading / unloading area 200 and the wafer loading / unloading area 300, thereby further reducing contamination caused by reaction by-products in the furnace tube 100. The furnace tube 100 and the boat loading / unloading area 200 may be arranged along a vertical direction, the boat loading / unloading area 200 and the wafer loading / unloading area 300 may be arranged along a first horizontal direction, and the purge inlet and exhaust ports may be arranged along a second horizontal direction. The first horizontal direction and the second horizontal direction are preferably perpendicular to each other, to avoid causing contamination of the wafers by circulating an air flow of purge gas between the boat loading / unloading area 200 and the wafer loading / unloading area 300.

[0089] Example 2 The main difference between the second embodiment and the first embodiment is that the partition door device is different.

[0090] In the first embodiment, the partition door device can be driven to move the boat, thereby allowing the boat to flow between the boat loading / unloading area 200 and the wafer loading / unloading area 300 via the communication area. In the second embodiment, the partition door device can be opened when the boat passes through and closed after the boat has passed. When the partition door device is opened, the boat loading / unloading area 200 and the wafer loading / unloading area 300 communicate with each other, and when the partition door device is closed, the boat loading / unloading area 200 and the wafer loading / unloading area 300 are separated by the partition door device.

[0091] The partition door device can be opened when a boat passes and closed after the boat has passed, allowing the boat to be moved without going through the partition door device, and the structure of the partition door device can be simplified.

[0092] 15 and 16 , the partition door device in this embodiment includes a second partition door assembly 700. The second partition door assembly 700 includes a second partition door 710. The second partition door assembly 700 includes a third state and a fourth state, and in the third state, the second partition door 710 closes the communication area, and in the fourth state, the second partition door 710 opens the communication area. The second partition door 710 can open and close the communication area by sliding or rotating.

[0093] The second partition door assembly 700 includes a second partition door 710, which can slide or rotate to open or close the communication area, thereby realizing communication or blocking between the boat loading / unloading area 200 and the wafer loading / unloading area 300, and has a simple structure.

[0094] In some embodiments, the furnace tube 100 and the wafer loading / unloading area 300 are located on the same side of the boat loading / unloading area 200. That is, the furnace tube 100 and the boat loading / unloading area 200 are installed along a vertical direction, the furnace tube 100 and the wafer loading / unloading area 300 are both installed above the boat loading / unloading area 200, and the furnace tube 100 and the wafer loading / unloading area 300 are installed along a horizontal direction. The second partition door assembly 700 includes a fifth state, and in the fifth state, the second partition door 710 closes the connection end between the furnace tube 100 and the boat loading / unloading area 200.

[0095] The second partition door 710 may be configured to separate the boat loading / unloading area 200 from the wafer loading / unloading area 300, or may be configured to close the connection end between the furnace tube 100 and the boat loading / unloading area 200. That is, the second partition door 710 may be multiplexed with the sealing device in the first embodiment, thereby preventing contaminants in the boat loading / unloading area 200 from diffusing into the furnace tube 100 and contaminating wafers subsequently processed by the furnace tube 100. It also reduces the frequency of cleaning maintenance of the furnace tube 100 and simplifies the structure of the wafer processing apparatus.

[0096] For example, the second partition door assembly 700 includes a second partition door 710 and a door drive mechanism 720. The door drive mechanism 720 includes a door shaft 721 and a cross member 722. The door shaft 721 is rotatably installed between the furnace tube 100 and the wafer loading / unloading area 300, and the cross member 722 connects the second partition door 710 to the door shaft 721. The second partition door 710 can rotate around the door shaft 721 to close the lower end of the furnace tube 100 (i.e., the fifth state, which is the connecting end between the furnace tube 100 and the boat loading / unloading area 200) or the communication area (i.e., the third state), or be located between the lower end of the furnace tube 100 and the communication area (i.e., the fourth state). As shown in FIG. 16, the second partition door 710 may be positioned in the illustrated position, i.e., FIG. 16 shows the second partition door assembly 700 in a fourth state, the second partition door 710 may be positioned as shown by the dotted line in FIG. 16, when the second partition door 710 is positioned as shown by the dotted line on the left side, the second partition door assembly 700 is in a fifth state, and when the second partition door 710 is positioned as shown by the dotted line on the right side, the second partition door assembly 700 is in a third state.

[0097] The second partition door 710 can be positioned at one of three positions: the lower end of the furnace tube 100, the communication area, or a position between the lower end of the furnace tube 100 and the communication area. By rotating the second partition door 710 using the door drive mechanism 720, the second partition door 710 can be moved between the three positions: the lower end of the furnace tube 100, the communication area, or a position between the lower end of the furnace tube 100 and the communication area, thereby realizing position switching, thereby making the structure of the second partition door assembly 700 simpler.

[0098] In some embodiments, second partition door assembly 700 includes second boat loader 730, which is installed in boat loading / unloading area 200. Second boat loader 730 is configured to load a boat into wafer loading / unloading area 300 and close the communication area, and second boat loader 730 is configured to unload a boat from wafer loading / unloading area 300.

[0099] The second partition door assembly 700 includes a second boat loader 730, which is configured to load and unload a boat into and from the wafer loading / unloading area 300 and to block the communication area between the boat loading / unloading area 200 and the wafer loading / unloading area 300. By using multiple second boat loaders 730, the structure of the wafer processing apparatus can be simplified.

[0100] In some embodiments, the furnace tube 100 and the boat loading / unloading area 200 are arranged along the vertical direction, and the furnace tube 100 and the wafer loading / unloading area 300 are arranged on the same side of the boat loading / unloading area 200. When loading or unloading the boat, the first boat loader 210 and the second boat loader 730 drive the boat to move in the vertical direction.

[0101] The furnace tube 100 and the boat loading / unloading area 200 are installed along the vertical direction; that is, the wafer processing apparatus includes a vertical furnace, and the furnace tube 100 and the wafer loading / unloading area 300 are located on the same side of the boat loading / unloading area 200. When loading or unloading the boat, the first boat loader 210 and the second boat loader 730 drive the boat to move along the vertical direction. The first boat loader 210 and the second boat loader 730 have the same configuration, which is advantageous for reducing the manufacturing costs of the wafer processing apparatus.

[0102] Preferably, the second compartment door assembly 700 includes a second compartment door 710 and a second boat loader 730 . During the operation of the wafer processing apparatus, the first boat 901 is processed in the furnace tube 100. During the processing, the first boat loader 210 can seal the lower end of the furnace tube 100, and the second boat 902 loads wafers into the wafer loading / unloading area 300. At this time, the second boat loader 730 can block the boat loading / unloading area 200 and the wafer loading / unloading area 300. When the processing of the first boat 901 is completed, the first boat loader 210 descends, and the first boat 901 placed on the first boat loader 210 can be moved by the boat transfer device 800 to the temporary storage position 201 in the boat loading / unloading area 200. The temporary storage position 201 is used to temporarily store the boat, and the boat waits at this position for the next processing, pre-processing, or cooling. The boat can rotate to the lower end of the furnace tube 100 until the second partition door 710 closes the furnace tube 100, and the wafers are loaded into the second boat 902. The second boat 902, which has completed loading of wafers in the loading / unloading area 300, is moved to the boat loading / unloading area 200 by the second boat loader 730, and the boat transfer device 800 transfers the second boat 902 to the first boat loader 210, and the first boat loader 210 loads the second boat 902 into the furnace tube 100 for processing. After the second boat 902 descends, the second partition door 710 opens to separate the boat loading / unloading area 200 and the wafer loading / unloading area 200. After the first boat 901 is cooled, the boat transfer device 800 transfers the first boat 901 to the second boat loader 730, the second partition door 710 rotates to a position between the lower end of the furnace tube 100 and the communicating area, and the second boat loader 730 transfers the first boat 901 to the wafer loading / unloading area 300, thereby blocking the boat loading / unloading area 200 and the wafer loading / unloading area 300.

[0103] The second partition door assembly 700 includes a second partition door 710 and a second boat loader 730, which allows the locations of the two boats to be quickly swapped, thereby advantageously reducing the time that the boat loading / unloading area 200 and the wafer loading / unloading area 300 are in communication and reducing the risk of by-products contaminating the boat and the wafers on the boat.

[0104] The main difference between Example 2 and Example 1 is the partition door device. Since the structures other than the partition door device in Example 1, i.e., the installation including the transfer port 510, the holder assembly 600, and the transfer area 500, are also applied to Example 2, a description thereof will be omitted.

[0105] The terms "first," "second," etc. are for descriptive purposes only and cannot be understood to indicate or imply relative importance or the number of the indicated technical features. Thus, a feature such as "first," "second," etc. can explicitly or implicitly include one or more features. In the description of this application, "plurality" means two or more than two, unless otherwise specified.

[0106] In this application, unless otherwise clearly specified or limited, the terms "assembled," "connected," and the like should be understood in a broad sense, and may refer to, for example, a fixed connection, a detachable connection, or an integral connection. They may be mechanically connected, electrically connected, directly connected, indirectly connected via an intermediate medium, or an internal communication between two elements or an interactive relationship between two elements. Those skilled in the art can understand the specific meanings of the above terms in this application based on specific circumstances.

[0107] In the description herein, references to terms such as "some examples," "exemplary," and the like mean that the specific features, structures, materials, or characteristics described in combination in the examples or examples are included in at least one example or example of the present application. In the present specification, schematic expressions for the above terms do not necessarily refer to the same example or example. Furthermore, the described specific features, structures, materials, or characteristics may be combined in any appropriate manner in any one or more examples or examples. Furthermore, unless mutually inconsistent, those skilled in the art may combine and combine different embodiments or examples and features of different embodiments or examples described herein.

[0108] Although the embodiments of the present application have been shown and described above, the above embodiments are merely illustrative and should not be understood as limitations on the present application. Those skilled in the art may make changes, modifications, substitutions and variations to the above embodiments within the scope of the present application, and any changes or modifications made in accordance with the claims and specification of the present application fall within the scope of the claims of the present application.

Claims

1. A wafer processing apparatus including a furnace tube, a loading / unloading area, and a partition door device, the loading / unloading area includes a boat loading / unloading area and a wafer loading / unloading area that are connected to each other via a communication area, the boat loading / unloading area is connected to the furnace tube, the boat loading / unloading area includes at least a first boat loader for loading / unloading a boat into / out of the furnace tube, and the wafer loading / unloading area includes at least a wafer loader for loading / unloading wafers into / out of the boat; the partition door device is installed in the communication area, the partition door device can separate the boat loading / unloading area from the wafer loading / unloading area, and the partition door device is operable to allow the boat to flow between the boat loading / unloading area and the wafer loading / unloading area via the communication area. A wafer processing apparatus comprising:

2. the partition door device can be driven to move the boat so that the boat can flow between the boat loading / unloading area and the wafer loading / unloading area via the communication area.

2. The wafer processing apparatus according to claim 1, wherein the wafer processing apparatus is a wafer processing apparatus.

3. the partition door device includes a first partition door assembly having a first partition door and a plurality of boat transfer mechanisms, each of the boat transfer mechanisms configured to load and move at least one boat, the plurality of boat transfer mechanisms including a first boat transfer mechanism and a second boat transfer mechanism, the first boat transfer mechanism and the second boat transfer mechanism being distributed on opposing first and second sides of the first partition door, at least the plurality of boat transfer mechanisms being rotatable about a rotation center to form a first state and a second state, in the first state, the first boat transfer mechanism being located in the boat loading / unloading area and the second boat transfer mechanism being located in the wafer loading / unloading area, and in the second state, the second boat transfer mechanism being located in the boat loading / unloading area and the first boat transfer mechanism being located in the wafer loading / unloading area.

3. The wafer processing apparatus according to claim 2.

4. the boat transfer mechanism includes a support base for placing a boat thereon and for moving the placed boat when rotating around the rotation center, the support base of the first boat transfer mechanism and the support base of the second boat transfer mechanism are connected by a connector, the connector is connected to the first partition door, the connector and the support base are provided on the same side of the first partition door, and the support base, the connector, and the first partition door are rotatable synchronously around the rotation center so as to switch the multiple boat transfer mechanisms between the first state and the second state; and / or the boat transfer mechanism includes a boat holder and a holder rotation shaft, the boat holder is provided on the holder rotation shaft, the holder rotation shaft is connected to the first partition door, the boat holder is rotatable around the holder rotation shaft until it holds a boat in order to place a boat thereon, the boat holder is rotatable around the holder rotation shaft in order to release the held boat, and the boat holder, the holder rotation shaft, and the first partition door are rotatable synchronously around the rotation center in order to move the held boat and to switch the plurality of boat transfer mechanisms between the first state and the second state.

4. The wafer processing apparatus according to claim 3.

5. the boat holder includes a plurality of boat sub-holders, the holder rotation shaft includes a plurality of holder sub-rotation shafts, the boat sub-holders are provided on the holder sub-rotation shafts, the holder sub-rotation shafts are connected to the first partition door, and the boat sub-holders are rotatable around the holder sub-rotation shafts; The boat holder being rotatable about the holder rotation axis until it holds a boat in order to place the boat includes the plurality of boat sub-holders of the boat holder being rotatable until they gather and clamp the boat in order to place the boat, The boat holder being rotatable about the holder rotation axis to release the boat held therein includes the plurality of boat sub-holders of the boat holder being rotatable until they are separated so as to release the boat held therein.

5. The wafer processing apparatus according to claim 4.

6. The boat transfer mechanism includes the boat holder and the holder rotation shaft, and the boat transfer mechanism is the boat holder can rotate about the holder rotation axis until it holds a boat in order to place the boat before the boat holder, the holder rotation axis, and the first partition door rotate about the rotation center to move the held boat, and the boat holder can rise to lift the held boat; after the boat holder, the holder rotation shaft, and the first partition door rotate about the rotation center to move the held boat, the boat holder can be lowered to lift down the held boat, and the boat holder is configured to be rotatable about the holder rotation shaft to release the held boat.

6. The wafer processing apparatus according to claim 4, wherein the wafer processing apparatus is a wafer processing apparatus.

7. the first partition door and the boat transfer mechanism are rotatable in synchronization with each other, and the first partition door assembly further includes a sealant, wherein when the first partition door and the boat transfer mechanism rotate, a gap is formed between the sealant and the first partition door, and when the rotation of the first partition door and the boat transfer mechanism stops, the sealant seals the gap between the loading / unloading area and the first partition door.

6. The wafer processing apparatus according to claim 3, wherein the wafer processing apparatus is a wafer processing apparatus.

8. the first partition door is a multi-wing revolving door, and the multi-wing revolving door includes at least three door flaps, the at least three door flaps including two main door flaps and at least one secondary door flap, the two main door flaps are connected to partition a first side and a second side of the first partition door, and the at least one secondary door flap is located on the first side of the first partition door and / or the second side of the first partition door; the included angles between the adjacent door flaps are equal, the boat transfer mechanisms are installed in one-to-one correspondence between the adjacent door flaps, the boat transfer mechanisms and the multi-blade revolving door are rotatable around the rotation center, and drive the boat to rotate between the boat loading / unloading area and the wafer loading / unloading area via the communication area; 8. The wafer processing apparatus according to claim 7, wherein the wafer processing apparatus is a wafer processing apparatus.

9. the boat loading / unloading area includes a plurality of functional sub-areas, and / or the wafer loading / unloading area includes a plurality of functional sub-areas, partition sections are formed between adjacent door flaps, and the multi-blade revolving door and the boat transfer mechanism rotate around the rotation center, so that each of the partition sections sequentially communicates with the functional sub-areas.

9. The wafer processing apparatus according to claim 8.

10. the wafer processing apparatus includes a plurality of the loading / unloading areas and a plurality of the furnace tubes, and the boat loading / unloading areas communicate with the furnace tubes in one-to-one correspondence; 3. The wafer processing apparatus according to claim 1, wherein the wafer processing apparatus is a wafer processing apparatus.

11. The partition door device can be opened when a boat passes through and closed after the boat has passed through.

2. The wafer processing apparatus according to claim 1, wherein the wafer processing apparatus is a wafer processing apparatus.

12. the partition door system includes a second partition door assembly; the second partition door assembly includes a second partition door, the second partition door assembly includes a third state and a fourth state, in the third state the second partition door closes the communication area and in the fourth state the second partition door opens the communication area; and / or the second partition door assembly includes a second boat loader, the second boat loader is provided in the boat loading / unloading area, the second boat loader is configured to load a boat into the wafer loading / unloading area and close the communication area, and the second boat loader is configured to unload the boat from the wafer loading / unloading area. The wafer processing apparatus according to claim 11 .

13. the second partition door assembly includes the second partition door, the furnace tube and the wafer loading / unloading area are installed on the same side of the boat loading / unloading area, and the second partition door assembly includes a fifth state, in which the second partition door closes a connection end between the furnace tube and the boat loading / unloading area.

13. The wafer processing apparatus according to claim 12.

14. the second partition door assembly includes the second partition door and a door drive mechanism, the door drive mechanism including a door shaft and a cross member, the door shaft being rotatably installed between the furnace tube and the wafer loading / unloading area, and the cross member connecting the second partition door and the door shaft; 14. The wafer processing apparatus according to claim 12 or 13.

15. the furnace tube and the boat loading / unloading area are provided along a vertical direction, the furnace tube and the wafer loading / unloading area are provided on the same side of the boat loading / unloading area, and when loading or unloading the boat, the first boat loader and the second boat loader are driven to move the boat along the vertical direction.

14. The wafer processing apparatus according to claim 12 or 13.

16. the wafer processing apparatus further includes a transfer area and at least one transfer port, the transfer area being provided on one side of the wafer loading / unloading area and configured to place a pod therein, the transfer port being provided in a partition wall between the wafer loading / unloading area and the transfer area, the partition wall partially surrounding the wafer loader, an axial direction of the partition wall being parallel to a vertical direction, the transfer port being configured to pass at least wafers in a pod, the wafer loader being configured to load wafers in the pod into a boat in the wafer loading / unloading area, and the wafer loader being configured to load wafers in the boat into a pod in the transfer area, a holder assembly being provided on a side of the partition wall away from the wafer loader, the holder assembly including at least one pod holder, the pod holder being configured to place a pod in the transfer area; the holder assembly includes n rows of the pot holders arranged along a circumferential direction of the partition wall, the at least one transfer port is arranged in n rows along the circumferential direction of the partition wall, n≧1, and the row positions of the pot holders in each row are arranged corresponding to the row positions of the transfer port in each row.

2. The wafer processing apparatus according to claim 1, wherein the wafer processing apparatus is a wafer processing apparatus.

17. the partition walls partially surround the wafer loader at equal intervals, and n≧2; 17. The wafer processing apparatus according to claim 16.

18. In the n rows of pod holders, the m-th row of pod holders includes a plurality of the pod holders, and the m-th row of pod holders includes i m pod holder units, and 1≦m≦n, i m ≧2, and the pod holder unit m j pod holders, m ≧1, and the i m pod holder units are distributed along the vertical direction, In the n-th row of transport ports, the m-th row of transport ports has j m the transfer ports in the m-th row correspond to the row position of the pod holder in the m-th row, and j m The transfer ports are the jth transfer ports in any one of the pod holder units in the mth row of pod holders. m is the same as the position distribution of the pod holders, the pod holder in the m-th row is movable in the vertical direction so as to align any pod holder unit of the pod holder in the m-th row with the transfer port in the m-th row.

18. The wafer processing apparatus according to claim 16 or 17.

19. j m ≧2, and in the m-th row of pod holders, the pod holders in any two adjacent pod holder units are alternately installed in the vertical direction.

20. The wafer processing apparatus according to claim 18.

Citation Information

Patent Citations

  • Semiconductor manufacturing apparatus

    JP1998242242A

  • Substrate processing apparatus

    JP2005276941A

  • Manufacturing method for semiconductor

    JP2006093201A

  • Substrate processing system

    JP2007088177A

  • Passbox and transport system

    JP4350502B2