Three-dimensional printed wiring board

Abstract

To provide a three-dimensional printed wiring board on which electronic components can be mounted without impairing reliability.SOLUTION: A three-dimensional printed wiring board 1 comprises: a first printed wiring board 10 on which an electronic component 11 is mounted; and a second printed wiring board 20 having a plurality of printed wiring board portions 21, on which electronic components 23 are mounted, and an elastically deformable portion 22 that connects the plurality of printed wiring board portions 21 and is elastically deformable. One of the first printed wiring board 10 and the second printed wiring board 20 has a plurality of holes 12 penetrating in a thickness direction, and the other of the first printed wiring board 10 and the second printed wiring board 20 has a plurality of insertion portions 24 that are inserted into the plurality of holes 12 respectively. The first printed wiring board 10 and the second printed wiring board 20 are fixed to each other in a state where the elastically deformable portion 22 is bent and in a state where the plurality of insertion portions 24 are inserted into the plurality of holes 12 respectively.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a three-dimensional printed wiring board on which electronic components can be mounted. [Background technology]

[0002] Conventionally, printed wiring boards have been used to mount electronic components. By increasing the mounting density, it is possible to mount many electronic components on such printed wiring boards. However, there is a limit to the mounting density from the viewpoint of reliability and process. Therefore, technologies that enable mounting of many more electronic components have been studied (for example, Patent Document 1).

[0003] Patent Document 1 describes a connection structure for printed wiring boards (hereinafter referred to as "connection structure") in which one printed wiring board having a copper foil portion is directly soldered to another printed wiring board having a copper foil portion. In this connection structure, one printed wiring board has a plurality of openings whose center lines do not coincide with each other, and a plurality of connection terminals provided on the other printed wiring board are inserted into these openings, and the copper foil portion of one printed wiring board is soldered to the copper foil portion of the other printed wiring board to fix them. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Utility Model Application Publication No. 61-157361 Summary of the Invention [Problem to be solved by the invention]

[0005] In the connection structure described in Patent Document 1, as described above, multiple connection terminals provided on one printed wiring board are inserted into multiple openings provided in the other printed wiring board, the centerlines of which do not coincide, and soldering is performed. However, when inserting the connection terminals into the openings, the other printed wiring board must be twisted. However, since the other printed wiring board is not designed to be twisted in the first place, there is a possibility that the printed wiring board will crack or the copper foil pattern formed on the printed wiring board will be disconnected. In addition, the other printed wiring board is installed perpendicular to the one printed wiring board. Therefore, for example, if the other printed wiring board is subjected to an external force, the other printed wiring board may swing around the soldered portion between the one printed wiring board and the other printed wiring board as a fulcrum, potentially damaging the soldered portion. Therefore, while the connection structure described in Patent Document 1 can increase the number of electronic components to be mounted, there are issues with reliability.

[0006] Therefore, there is a demand for a three-dimensional printed wiring board that can mount many electronic components without impairing reliability. [Means for solving the problem]

[0007] The characteristic configuration of the three-dimensional structure printed wiring board of the present invention is that it comprises a first printed wiring board on which electronic components are mounted, a second printed wiring board having a plurality of printed wiring board sections on which electronic components are mounted, and an elastic deformation section that connects the plurality of printed wiring board sections and is elastically deformable, one of the first printed wiring board and the second printed wiring board having a plurality of hole sections that penetrate in the thickness direction, and the other of the first printed wiring board and the second printed wiring board having a plurality of insertion sections that are inserted into each of the plurality of hole sections, and the first printed wiring board and the second printed wiring board are fixed to each other with the elastic deformation section in a bent state and with each of the plurality of insertion sections inserted into each of the plurality of hole sections.

[0008] With this characteristic configuration, the first printed wiring board and the second printed wiring board are fixed to each other with the elastic deformation portion bent and the multiple insertion portions inserted into the multiple hole portions, respectively. Therefore, the reaction force generated when the elastic deformation portion is elastically deformed can support the second printed wiring board on the first printed wiring board. Therefore, misalignment of the second printed wiring board relative to the first printed wiring board can be prevented between the time the second printed wiring board is supported on the first printed wiring board and the time of soldering, for example. Furthermore, the reaction force can more firmly securely fix the second printed wiring board to the first printed wiring board, making it less likely for the second printed wiring board to separate from the first printed wiring board, thereby preventing a loss of reliability. Furthermore, by providing the second printed wiring board on the first printed wiring board, the mounting area for electronic components can be increased, allowing for mounting a larger number of electronic components. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 2 is a side view of a three-dimensional printed wiring board. [Figure 2] FIG. 2 is an enlarged view of a hole and an insertion portion. [Figure 3] FIG. [Figure 4] FIG. [Figure 5] FIG. 10 is a side view of a three-dimensional printed wiring board according to another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] The three-dimensional printed wiring board according to the present invention is configured to be capable of mounting more electronic components than a flat printed wiring board. The three-dimensional printed wiring board 1 according to this embodiment will be described below. However, the three-dimensional printed wiring board 1 is not limited to the following embodiment, and various modifications are possible within the scope of the gist thereof.

[0011] 1 is a side view of a three-dimensional printed wiring board 1. As shown in FIG.

[0012] The first printed wiring board 10 of this embodiment is configured using, for example, a printed wiring board, and lands (not shown) on which wiring and electronic components 11 are mounted are formed by patterning. The electronic components 11 include passive components 11A such as capacitors and resistors, and active components 11B such as transistors and diodes. Of course, the electronic components 11 may also include connectors, integrated circuits (ICs), and the like. In the example of FIG. 1, the electronic components 11 are shown as surface-mounted components, but they may also be lead components. In addition, in the example of FIG. 1, the electronic components 11 are shown mounted on the A-side 10A of the first printed wiring board 10, but the electronic components 11 may be mounted on both the A-side 10A and the B-side 10B, or may be mounted only on the B-side 10B.

[0013] Like the first printed wiring board 10, the second printed wiring board 20 of this embodiment is also configured using a printed wiring board, and lands (not shown) on which wiring and electronic components 23 are mounted are formed by patterning. The second printed wiring board 20 has a plurality of (two in this embodiment) printed wiring board portions 21 and an elastically deformable elastic deformation portion 22. The two printed wiring board portions 21 are provided spaced apart from each other, and the elastic deformation portion 22 is provided between the two printed wiring board portions 21. Therefore, the second printed wiring board 20 is configured such that the two printed wiring board portions 21 and the elastic deformation portion 22 extend along a predetermined direction. In other words, the two printed wiring board portions 21 are provided on both sides of the elastic deformation portion 22 along the predetermined direction.

[0014] Electronic component 23 is mounted on at least one of the two printed wiring board portions 21. Like electronic component 11, electronic component 23 includes passive components 23A such as capacitors and resistors, and active components 23B such as transistors and diodes. Of course, electronic component 23 may also include a connector, an IC (Integrated Circuit), or the like. In the example of FIG. 1, electronic component 23 is shown as a surface-mounted component, but it may also be a lead component. In addition, in the example of FIG. 1, electronic component 23 is shown mounted on side A 20A of second printed wiring board 20, but electronic component 23 may also be mounted on both side A 20A and side B 20B, or may also be mounted only on side B 20B.

[0015] The elastic deformation portion 22 connects two printed wiring board portions 21 that are spaced apart from each other. The elastic deformation portion 22 is configured by processing the second printed wiring board 20 so that the thickness of the portion other than the printed wiring board portion 21 is reduced, making it more likely to bend in response to an external force. Therefore, the second printed wiring board 20 does not bend as a whole, but is configured to include the elastic deformation portion 22 that bends in response to an external force and the printed wiring board portion 21 that is less likely to bend than the elastic deformation portion 22. Wiring may be formed on the elastic deformation portion 22 by patterning, similar to the printed wiring board portions 21 on the first printed wiring board 10 and the second printed wiring board 20. The elastic deformation portion 22 can be elastically deformed by bringing the end portions 31, 31 opposite the elastic deformation portion 22 of the two printed wiring board portions 21 provided on both sides of the elastic deformation portion 22 close to each other.

[0016] The first printed wiring board 10 of this embodiment has a plurality of (two in this embodiment) holes 12 penetrating through in the thickness direction. Therefore, the holes 12 are provided across the A-side 10A and the B-side 10B. The holes 12 are provided in the shape of an elongated hole in a plan view (viewed in the Z direction) (see FIG. 3), and are configured in a shape that allows an insertion portion 24 of the second printed wiring board 20 to be inserted at a predetermined angle (less than 90 degrees or more than 90 degrees), as will be described later.

[0017] The second printed wiring board 20 of this embodiment has a plurality of (two in this embodiment) insertion portions 24 inserted into the two hole portions 12 of the first printed wiring board 10, respectively. FIG. 1 is a side view of the three-dimensionally structured printed wiring board 1 with the insertion portions 24 of the second printed wiring board 20 inserted into the hole portions 12 of the first printed wiring board 10. As described above, the second printed wiring board 20 has its ends 31, 31 brought close to each other and its elastic deformation portion 22 elastically deformed. One of the two insertion portions 24, 24A, is inserted into one hole 12A of the two hole portions 12, and the other of the two insertion portions 24, 24B, is inserted into the other hole 12B of the two hole portions 12. FIG. 2 shows an enlarged view of the portion where the insertion portion 24A is inserted into the hole 12A. FIG. 3 shows an enlarged view of the hole 12A.

[0018] When insertion portion 24A is inserted into hole 12A and insertion portion 24B is inserted into hole 12B, elastic deformation portion 22 attempts to restore its pre-insertion state so that ends 31, 31 move away from each other. At this time, as shown in FIG. 2 , a reaction force is generated from first printed wiring board 10 at abutment portion 26 of insertion portion 24 that abuts against hole 12. This reaction force supports second printed wiring board 20 relative to first printed wiring board 10. Therefore, first printed wiring board 10 and second printed wiring board 20 are fixed to each other with elastic deformation portion 22 bent and with each of the multiple insertion portions 24 inserted into each of the multiple holes 12.

[0019] In this embodiment, the first printed wiring board 10 and the second printed wiring board 20 are each provided with a land 15 of the first printed wiring board 10 and a land 25 of the second printed wiring board 20 so that the land 15 is adjacent to the land 25 of the second printed wiring board 20 when the insertion portion 24 abuts against the edge 12E of the hole 12. In this embodiment, the land 15 is provided on both the A-side 10A and the B-side 10B of the first printed wiring board 10, and the land 25 is provided on both the A-side 20A and the B-side 20B of the second printed wiring board 20. As shown in FIG. 3 , a through-hole 15A that penetrates the first printed wiring board 10 in the thickness direction (Z direction) and is hemispherical when viewed in the Z direction is formed in the portion of the land 15 facing the hole 12A. The inner surface of the through-hole 15A is covered with a metal material. Therefore, the lands 15 on the A-side 10A of the first printed wiring board 10 and the lands 15 on the B-side 10B of the first printed wiring board 10 are electrically connected to each other.

[0020] Land 15 of first printed wiring board 10 and land 25 of second printed wiring board 20 are connected to each other by a conductive material such as solder. The conductive material is injected from the side where the angle between first printed wiring board 10 and second printed wiring board 20 is obtuse (sides A and B in FIG. 2 ). As a result, the conductive material flows through through hole 15A and reaches the side where the angle between first printed wiring board 10 and second printed wiring board 20 is acute (sides C and D in FIG. 2 ). This allows first printed wiring board 10 and second printed wiring board 20 to be connected to each other on both sides, thereby increasing the connection strength between first printed wiring board 10 and second printed wiring board 20. These lands 15 and 25 are electrically connected to the wiring of first printed wiring board 10 and second printed wiring board 20, respectively, thereby enabling power supply and signal transmission between first printed wiring board 10 and second printed wiring board 20.

[0021] 1, the first printed wiring board 10 and the second printed wiring board 20 are fixed in a state in which the side view of the second printed wiring board 20 with the insertion portion 24 inserted into the hole 12 is line-symmetrical with respect to a predetermined axis T set in the first printed wiring board 10. In the example of FIG. 2, the axis T is set along the Z direction at the center along the X direction of the two hole portions 12 in the first printed wiring board 10. In this embodiment, the second printed wiring board 20 is fixed to the first printed wiring board 10 in a state in which the second printed wiring board 20 is line-symmetrical with respect to the axis T. As a result, both ends of the second printed wiring board 20 are supported by the first printed wiring board 10, and the first printed wiring board 10 and the second printed wiring board 20 are connected to each other by a conductive material. Therefore, even if an external force acts on the three-dimensional structure printed wiring board 1, the second printed wiring board 20 is less likely to swing relative to the first printed wiring board 10. Therefore, damage (for example, the occurrence of cracks) to the portion (conductive material) connecting first printed wiring board 10 and second printed wiring board 20 to each other can be prevented, and the reliability of three-dimensional printed wiring board 1 can be improved.

[0022] 4, second printed wiring board 20 of this embodiment has protrusion 27 that protrudes laterally from the mounting surface for electronic component 23. Second printed wiring board 20 is configured so that length L1 along the Y direction, which is the sum of protrusion 27 and the mounting surface, is longer than length L2 along the Y direction of hole 12. This allows protrusion 27 to abut against surface A 10A of first printed wiring board 10 outside hole 12, making it possible to position second printed wiring board 20 relative to first printed wiring board 10 (positioning the insertion depth).

[0023] Other Embodiments Next, other embodiments of the three-dimensional printed wiring board 1 will be described.

[0024] In the above embodiment, the second printed wiring board 20 has been described as having two printed wiring board portions 21. However, the second printed wiring board 20 may be configured to have three or more printed wiring board portions 21. In this case, the second printed wiring board 20 may have two elastic deformation portions 22, which respectively connect two printed wiring board portions 21 that are spaced apart from each other.

[0025] In the above embodiment, the first printed wiring board 10 has two hole portions 12, and the second printed wiring board 20 has two insertion portions 24. However, it is also possible to configure the first printed wiring board 10 to have two insertion portions 24, and the second printed wiring board 20 to have two hole portions 12. A side view of such a three-dimensionally structured printed wiring board 1 is shown in FIG. 5 (electronic components 11 and 23 are omitted). In this case, the second printed wiring board 20 may be configured such that the ends 31, 31 are brought close to each other and the elastic deformation portion 22 is elastically deformed, with one insertion portion 24A of the two insertion portions 24 inserted into one hole 12A of the two hole portions 12, and the other insertion portion 24B of the two insertion portions 24 inserted into the other hole 12B of the two hole portions 12.

[0026] Furthermore, when insertion portion 24A is inserted into hole 12A and insertion portion 24B is inserted into hole 12B, elastic deformation portion 22 attempts to restore its pre-insertion state so that end portions 31, 31 are separated from each other. At this time, a reaction force is generated from first printed wiring board 10 at abutment portion 26 that abuts against insertion portion 24 in hole 12. This reaction force supports second printed wiring board 20 relative to first printed wiring board 10. Therefore, even in this configuration, first printed wiring board 10 and second printed wiring board 20 are fixed to each other with elastic deformation portion 22 in a bent state and with each of the multiple insertion portions 24 inserted into each of the multiple holes 12. Furthermore, similar to the above embodiment, by providing lands 15, 25 on each of the first printed wiring board 10 and the second printed wiring board 20 and connecting them to each other with a conductive material such as solder, it is possible to more firmly fix the first printed wiring board 10 and the second printed wiring board 20.

[0027] Furthermore, in this case, axis T is set along the mounting surface of first printed wiring board 10 and in the Y direction at the center of two insertion portions 24 of first printed wiring board 10 along the X direction. As a result, second printed wiring board 20 is fixed to first printed wiring board 10 in a state of line symmetry with respect to axis T. Therefore, in this configuration, both ends of second printed wiring board 20 are supported by first printed wiring board 10, and first printed wiring board 10 and second printed wiring board 20 are connected to each other by a conductive material. Therefore, even if an external force acts on three-dimensional printed wiring board 1, second printed wiring board 20 is less likely to swing relative to first printed wiring board 10. Therefore, damage (e.g., cracks) to the portion (conductive material) connecting first printed wiring board 10 and second printed wiring board 20 to each other can be prevented, and the reliability of three-dimensional printed wiring board 1 can be improved.

[0028] In this embodiment, protrusion 27 is provided on first printed wiring board 10 so as to protrude laterally from the mounting surface of electronic component 23. In this embodiment, two protrusions 27 are provided at different positions in the X direction relative to hole 12 of second printed wiring board 20. This allows protrusion 27 to abut against surface A 20A of second printed wiring board 20 outside hole 12, making it possible to position first printed wiring board 10 relative to second printed wiring board 20 (positioning the insertion depth).

[0029] [Summary of the above embodiment] The following provides an overview of the three-dimensional printed wiring board 1 described above.

[0030] (1) A three-dimensional structure printed wiring board 1 comprises a first printed wiring board 10 on which electronic components 11 are mounted, a plurality of printed wiring board portions 21 on which electronic components 23 are mounted, and a second printed wiring board 20 having an elastic deformation portion 22 that connects the plurality of printed wiring board portions 21 and is elastically deformable, one of the first printed wiring board 10 and the second printed wiring board 20 having a plurality of hole portions 12 that penetrate in the thickness direction, and the other of the first printed wiring board 10 and the second printed wiring board 20 having a plurality of insertion portions 24 that are inserted into each of the plurality of hole portions 12, and the first printed wiring board 10 and the second printed wiring board 20 are fixed to each other with the elastic deformation portion 22 in a bent state and with each of the plurality of insertion portions 24 inserted into each of the plurality of hole portions 12.

[0031] According to this configuration, the second printed wiring board 20 can be supported on the first printed wiring board 10 by the reaction force generated when the elastic deformation portion 22 is elastically deformed. Therefore, it is possible to prevent the second printed wiring board 20 from shifting in position relative to the first printed wiring board 10, for example, during the period from when the second printed wiring board 20 is supported on the first printed wiring board 10 until soldering is performed. In addition, the reaction force described above makes it possible to more firmly fix the second printed wiring board 20 to the first printed wiring board 10, making it difficult for the second printed wiring board 20 to separate from the first printed wiring board 10, and preventing a loss of reliability. Furthermore, by providing the second printed wiring board 20 on the first printed wiring board 10, the mounting area for electronic components 23 can be increased, allowing more electronic components 23 to be mounted.

[0032] (2) In the three-dimensional structure printed wiring board 1 described in (1), it is preferable that when the insertion portion 24 abuts against the edge portion 12E of the hole portion 12, the land 15 of the first printed wiring board 10 and the land 25 of the second printed wiring board 20 are connected to each other by a conductive material.

[0033] According to this configuration, the reaction force generated when elastically deforming portion 22 is elastically deformed as described above can support second printed wiring board 20 on first printed wiring board 10, preventing misalignment of second printed wiring board 20 with respect to first printed wiring board 10 from the time second printed wiring board 20 is supported on first printed wiring board 10 until connection with the conductive material. Furthermore, since the reaction force described above is generated in second printed wiring board 20 even after connection with the conductive material, second printed wiring board 20 can be more firmly fixed to first printed wiring board 10. Therefore, even if an external force is applied to one of first printed wiring board 10 and second printed wiring board 20, the portion connected with the conductive material is less likely to be damaged, thereby improving reliability.

[0034] (3) In the three-dimensional structure printed wiring board 1 described in (1) or (2), the multiple printed wiring board portions 21 and the elastic deformation portion 22 are electrically connected by pattern wiring, and it is preferable that the first printed wiring board 10 and the second printed wiring board 20 are fixed in a state in which the side view of the second printed wiring board 20 when the insertion portion 24 is inserted into the hole portion 12 is linearly symmetrical with respect to a predetermined axis T set on the first printed wiring board 10.

[0035] According to this configuration, second printed wiring board 20 is fixed in a state in which its side view is line-symmetrical with respect to a predetermined axis T set on first printed wiring board 10, so that even if an external force is applied to three-dimensional structure printed wiring board 1, it is possible to suppress the concentration of stress occurring on second printed wiring board 20. Therefore, damage to second printed wiring board 20 can be prevented.

[0036] (4) In the three-dimensional structure printed wiring board 1 described in any one of (1) to (3), it is preferable that the other of the first printed wiring board 10 and the second printed wiring board 20 has a protrusion 27 protruding laterally from the mounting surface of the electronic components 11, 23, and that the protrusion 27 is positioned by abutting against the surface of the hole portion 12.

[0037] This configuration makes it possible to appropriately position one of the first printed wiring board 10 and the second printed wiring board 20 relative to the other, thereby enabling efficient assembly of the three-dimensional printed wiring board 1. [Industrial Applicability]

[0038] The technology according to the present disclosure can be used for a three-dimensional printed wiring board on which electronic components can be mounted. [Explanation of symbols]

[0039] 1: three-dimensional structure printed wiring board, 10: first printed wiring board, 11: electronic component, 12: hole portion, 12E: edge portion, 15: land, 20: second printed wiring board, 21: printed wiring board portion, 22: elastic deformation portion, 23: electronic component, 24: insertion portion, 25: land, 27: protrusion portion, T: axis

Claims

1. a first printed wiring board on which electronic components are mounted; a second printed wiring board having a plurality of printed wiring board sections on which electronic components are mounted and an elastically deformable section connecting the plurality of printed wiring board sections, the second printed wiring board having an elastically deformable section, one of the first printed wiring board and the second printed wiring board has a plurality of holes penetrating in a thickness direction; the other of the first printed wiring board and the second printed wiring board has a plurality of insertion portions to be inserted into the plurality of hole portions, A three-dimensional structure printed wiring board in which the first printed wiring board and the second printed wiring board are fixed to each other with the elastic deformation portion bent and with each of the insertion portions inserted into each of the hole portions.

2. 2. A three-dimensional structure printed wiring board as described in claim 1, wherein when the insertion portion abuts against the edge of the hole portion, the land of the first printed wiring board and the land of the second printed wiring board are connected to each other by a conductive material.

3. 3. A three-dimensional structure printed wiring board as described in claim 1 or 2, wherein the plurality of printed wiring board portions and the elastic deformation portion are electrically connected by pattern wiring, and the first printed wiring board and the second printed wiring board are fixed in a state in which a side view of the second printed wiring board when the insertion portion is inserted into the hole portion is linearly symmetrical with respect to a predetermined axis set on the first printed wiring board.

4. the other of the first printed wiring board and the second printed wiring board has a protruding portion that protrudes laterally from a mounting surface of the electronic component, 3. The three-dimensional printed wiring board according to claim 1, wherein the protrusion is positioned by contacting the surface of the hole.

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