Frame unit forming method and frame unit forming device

Abstract

To provide a method and a device for forming a frame unit that does not degrade the quality of device chips when a wafer is divided.SOLUTION: A frame unit forming method includes at least an arrangement step of arranging a wafer 4 in an opening 2a of a frame 2, and a frame unit forming step of arranging a thermocompression sheet 12 around the outer periphery of the wafer 4 and the frame 2 to integrate the wafer 4 and the frame 2 with the thermocompression sheet 12 to form a frame unit, and includes an activation step, prior to the frame unit forming step, of activating the surface of the thermocompression sheet 12 on the side that will be arranged between the wafer 4 and the frame 2 by performing plasma treatment or corona treatment.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a frame unit forming method and a frame unit forming device. [Background technology]

[0002] A wafer with multiple devices such as ICs and LSIs formed on its surface, separated by planned dividing lines, is divided into individual device chips by a cutting machine equipped with a rotatable cutting blade, and each of the divided device chips is used in electrical equipment such as mobile phones and personal computers.

[0003] Before being carried into the cutting device, the wafer is positioned in an opening of a frame having an opening for accommodating the wafer, and a dicing tape is attached to the rear surface of the wafer to form a frame unit.

[0004] The wafer, which has been integrated with the frame by the frame unit, is then divided into individual devices by a cutting device, and is then transported to a pick-up process while maintaining the wafer shape, where individual device chips are picked up from the dicing tape and bonded to a wiring board or the like (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 3076179 Summary of the Invention [Problem to be solved by the invention]

[0006] However, because dicing tape has an adhesive layer laid on top of the vinyl chloride sheet, when the wafer is cut with a cutting blade, the adhesive splashes along with the cutting water and adheres to the surface of the device, reducing the quality of the device chip.

[0007] Furthermore, when a laser beam is applied to the wafer's intended dividing lines to create dividing grooves or dividing triggers, the adhesive from the dicing tape adheres to the device, resulting in a decrease in the quality of the device chips and also becoming a source of contamination during the pick-up process.

[0008] An object of the present invention is to provide a method and apparatus for forming frame units that do not degrade the quality of device chips when a wafer is divided. [Means for solving the problem]

[0009] According to the present invention, there is provided the following frame unit forming method that solves the above-mentioned problems. "A frame unit forming method for forming a frame unit that integrates a wafer and a frame having an opening in the center for accommodating the wafer, a placing step of placing a wafer in the opening of the frame; a frame unit forming step of arranging a thermocompression sheet around the outer periphery of the wafer and the frame to integrate the wafer and the frame with the thermocompression sheet to form a frame unit; At least The present invention provides a frame unit forming method including an activation step, prior to the frame unit forming step, of subjecting the surface of the thermocompression sheet that will be attached to the wafer and frame to plasma treatment or corona treatment to activate it.

[0010] Preferably, in the activation step, the surface of the wafer to be placed on the thermocompression sheet and the surface of the frame are activated by plasma treatment or corona treatment. In the activation step, atmospheric pressure plasma treatment is preferably performed.

[0011] Furthermore, according to the present invention, there is provided the following frame unit forming device that solves the above-mentioned problems. "A frame unit forming device that forms a frame unit by placing a wafer in the opening of a frame having an opening in the center for accommodating the wafer, and using a thermocompression sheet, the wafer storage means for storing a plurality of frames, the wafer storage means for storing a plurality of wafers, the frame transport means for carrying out the frames from the frame storage means and placing them on a frame table, the thermocompression sheet placing means for placing a thermocompression sheet on the frame placed on the frame table, the frame sheet transport means for transporting the frame on which the thermocompression sheet has been placed to a frame unit forming table, the wafer carrying-out means for carrying out the wafers from the wafer storage means and transporting them to the frame unit forming table, the frame unit forming means for forming a frame unit by integrating the frame on which the thermocompression sheet has been placed and transported to the frame unit forming table with the wafer, and the cassette storage means for storing the frame unit in a cassette, The present invention provides a frame unit forming device including an activation means for performing plasma treatment or corona treatment on the thermocompression sheet on the side that is to be disposed on the frame by the thermocompression sheet disposing means.

[0012] It is preferable to provide a wafer activation means for subjecting the wafer transferred to the frame unit forming table to plasma treatment or corona treatment. [Effects of the Invention]

[0013] In the present invention, since the frame unit is formed from a thermocompression sheet without an adhesive layer, the problem of adhesive being scattered along with the cutting water when the wafer is cut with a cutting blade and adhering to the surface of the device, degrading the quality of the device chip, is eliminated. Also, even if a laser beam is irradiated along the planned dividing lines of the wafer to create dividing grooves or dividing triggers, the absence of an adhesive layer on the thermocompression sheet eliminates the problem of adhesive being stuck to the device, degrading the quality of the device chip, and becoming a source of contamination during the pick-up process.

[0014] Furthermore, according to the present invention, the surface of the thermocompression sheet that is to be attached to the wafer and frame is activated by plasma treatment or corona treatment, which improves the adhesion of the thermocompression sheet to the wafer and frame and prevents water mixed with processing debris generated during separation by a cutting blade from penetrating between the thermocompression sheet and the wafer, thereby preventing deterioration in the quality of device chips. [Brief explanation of the drawings]

[0015] [Figure 1] (a) A schematic diagram showing the disposing step, and (b) A schematic diagram showing the state in which the wafer is disposed in the opening of the frame. [Figure 2] Schematic diagram showing an activation step. [Figure 3] Schematic diagram showing a frame unit forming step. [Figure 4] FIG. [Figure 5] FIG. 10 is a schematic diagram showing a dividing step using a cutting device. [Figure 6] FIG. 10 is a schematic diagram showing a dividing process using a laser processing device. [Figure 7] (a) Schematic cross-sectional view of a wafer that has been subjected to ablation processing, (b) Schematic cross-sectional view of a wafer on which a modified layer has been formed. [Figure 8] FIG. [Figure 9] FIG. [Figure 10] FIG. 10 is a perspective view of the frame receiving means and the like shown in FIG. 9. [Figure 11] 10(a) is a perspective view of the wafer receiving means and the like shown in FIG. 9, and FIG. 10(b) is a perspective view of the hand shown in FIG. [Figure 12] FIG. 10 is a perspective view of the thermocompression sheet disposing means and the activation means shown in FIG. 9. [Figure 13] 10 is a schematic diagram of a thermocompression sheet disposing means and an activation means shown in FIG. 9. [Figure 14] 10 is a schematic diagram showing a state in which the heating roller is positioned at the lower pressing position and the thermocompression sheet is thermocompression-bonded to one end of the frame. FIG. [Figure 15]FIG. 15 is a schematic diagram showing a state in which the heating roller is moved from the state shown in FIG. 14. [Figure 16] 16 is a schematic diagram showing a state in which the heating roller has been further moved from the state shown in FIG. 15. [Figure 17] FIG. 10 is an exploded perspective view of the frame unit forming means shown in FIG. 9. [Figure 18] FIG. 10 is a perspective view of the reversing mechanism of the cassette accommodating means shown in FIG. 9; [Figure 19] 10 is a perspective view of a frame unit supporting portion and a pushing portion of the cassette receiving means shown in FIG. 9. FIG. [Figure 20] FIG. 10 is a perspective view showing a state in which a cassette accommodating step is being performed. DETAILED DESCRIPTION OF THE INVENTION

[0016] (Frame unit forming method) First, a preferred embodiment of a frame unit forming method according to the present invention will be described with reference to FIGS.

[0017] (Installation process) In the frame unit forming method of this embodiment, first, a disposing step is carried out in which a wafer is disposed in an opening of a frame.

[0018] The frame used in the frame unit formation process may be, for example, the annular frame 2 shown in FIGS. 1( a) and 1(b). A circular opening 2a large enough to accommodate a wafer 4 is formed in the center of the frame 2. The wafer 4 may be formed of an appropriate semiconductor material, such as silicon. The front surface 4a of the wafer 4 is divided into multiple rectangular regions by grid-like dividing lines 6, and devices 8 such as ICs and LSIs are formed in each of the multiple rectangular regions. The wafer 4 also has notches 9 formed around its periphery to indicate its crystal orientation. In the placement process, the wafer 4 is placed in the opening 2a of the frame 2 with its back surface 4b facing upward, and the frame 2 and wafer 4 are placed on the top surface of a table 10. The table 10 may have a built-in electric heater and a temperature sensor (neither of which are shown), and the temperature of the top surface of the table 10 may be adjusted by an appropriate control device.

[0019] (activation process) After the placement step, an activation step is carried out in which the surface of the thermocompression sheet that is to be placed on the wafer 4 and frame 2 is activated by plasma treatment or corona treatment.

[0020] As shown in FIG. 2, the thermocompression sheet 12 disposed between the wafer 4 and the frame 2 is a circular sheet, and the diameter of the thermocompression sheet 12 is slightly larger than the diameter of the opening 2a of the frame 2. The thermocompression sheet 12 is a sheet without an adhesive layer (sticky layer), but when heated to a temperature near its melting point, it softens or melts and exhibits adhesive strength. The thermocompression sheet 12 is a thermoplastic synthetic resin sheet, such as a polyolefin sheet or a polyester sheet. Examples of polyolefin sheets that can be used as the thermocompression sheet 12 include polyethylene (PE) sheets, polypropylene (PP) sheets, and polystyrene (PS) sheets. Examples of polyester sheets that can be used as the thermocompression sheet 12 include polyethylene terephthalate (PET) sheets and polyethylene naphthalate (PEN) sheets.

[0021] In this embodiment, since the thermocompression sheet 12 is disposed on the upper surface (rear surface 4b) of the wafer 4 placed on the table 10 and on the upper surface of the frame 2, in the activation step, the lower surface of the thermocompression sheet 12 in Fig. 2 is activated by plasma treatment or corona treatment. This improves the wettability of the surface of the thermocompression sheet 12 that is disposed on the wafer 4 and frame 2. The treatment in the activation step may be atmospheric pressure plasma treatment.

[0022] 2, in the activation step, it is preferable to activate the surface of the wafer 4 (back surface 4b in this embodiment) that will be placed on the thermocompression sheet 12 and the surface of the frame 2 by plasma treatment or corona treatment. This can improve the wettability of the surface of the wafer 4 that will be placed on the thermocompression sheet 12 and the surface of the frame 2.

[0023] In the activation step, before the plasma treatment or corona treatment is performed, the surface to be subjected to the plasma treatment or corona treatment may be irradiated with ultraviolet light to destroy organic matter.

[0024] (Frame unit forming process) After the activation step, a frame unit forming step is carried out in which a thermocompression sheet 12 is disposed around the outer periphery of the wafer 4 and the frame 2, and the wafer 4 and the frame 2 are integrated by the thermocompression sheet 12 to form a frame unit.

[0025] 3, in the frame unit formation process, a thermocompression sheet 12 is arranged around the outer periphery of the wafer 4 and the frame 2, and then a heating roller 14 adjusted to a temperature at which the thermocompression sheet 12 softens or melts and exerts adhesive force is used to press the thermocompression sheet 12 downward while rolling the heating roller 14, thereby heating the thermocompression sheet 12 and causing it to exert adhesive force. As a result, the softened thermocompression sheet 12 adheres closely to the back surface 4b of the wafer 4 and the outer periphery of the frame 2, and the thermocompression sheet 12 is thermocompression-bonded to the back surface 4b of the wafer 4 due to its adhesive force. As a result, a frame unit 16 can be formed in which the wafer 4 and the frame 2 are integrated by the thermocompression sheet 12 (see FIG. 4).

[0026] 3 has a built-in electric heater and temperature sensor (neither of which are shown), and the temperature of the outer surface of the heating roller 14 is adjusted by an appropriate control device. The outer surface of the heating roller 14 is coated with a fluororesin so that the thermocompression sheet 12 will not stick to the heating roller 14 even if it exerts adhesive force. Note that in the frame unit forming process, instead of adjusting the temperature of the heating roller 14, the temperature of the upper surface of the table 10 may be adjusted to a temperature at which the thermocompression sheet 12 softens or melts and exerts adhesive force.

[0027] The heating temperature of the thermocompression sheet 12 in this step may be, for example, the following temperature. <In the case of polyolefin sheets> Polyethylene sheet: 120℃~140℃ Polypropylene sheet: 160℃~180℃ Polystyrene sheet: 220℃~240℃ <In the case of polyester sheets) Polyethylene terephthalate sheet: 250℃~270℃ Polyethylene naphthalate sheet: 160℃~180℃

[0028] As described above, in this embodiment, the thermocompression bonding surface of the thermocompression bonding sheet 12 is subjected to plasma treatment or corona treatment in the activation step to improve the wettability of the thermocompression bonding surface of the thermocompression bonding sheet 12, and then the thermocompression bonding sheet 12 is thermocompression bonded to the wafer 4 and the frame 2 in the frame unit formation step. This improves the adhesion of the thermocompression bonding sheet 12 to the wafer 4 and the frame 2. Furthermore, if the wettability of the thermocompression bonding surface of the wafer 4 and the thermocompression bonding surface of the frame 2 is improved by performing plasma treatment or corona treatment on the thermocompression bonding surface of the wafer 4 and the thermocompression bonding surface of the frame 2, the adhesion of the thermocompression bonding sheet 12 to the wafer 4 and the frame 2 can be further improved.

[0029] (splitting process) In this embodiment, after the frame unit forming step is performed, a dividing step is performed in which the wafer 4 is divided into individual device chips.

[0030] (Cutting device 18) The dividing step can be performed using, for example, a cutting device 18 shown in Fig. 5. The cutting device 18 includes a chuck table (not shown) that holds the wafer 4 by suction, and cutting means 20 that cuts the wafer 4 held by suction on the chuck table. The cutting means 20 includes a spindle 22 that is rotatable about its axis in the Y-axis direction (the direction indicated by arrow Y in Fig. 5), and an annular cutting blade 24 fixed to the tip of the spindle 22. The X-axis direction indicated by arrow X in Fig. 5 is a direction perpendicular to the Y-axis direction. The XY plane defined by the X-axis and Y-axis directions is substantially horizontal.

[0031] When performing the dividing step using the cutting device 18, first, the wafer 4 is suction-held on the upper surface of the chuck table with the front surface 4a of the wafer 4 facing upward. Next, the wafer 4 is imaged from above by an imaging means (not shown) of the cutting device 18, and the dividing lines 6 are aligned in the X-axis direction based on the image of the wafer 4 taken by the imaging means. Next, the cutting edge of a cutting blade 24 rotated at high speed in the direction indicated by arrow R1 in FIG. 5 is cut into the dividing lines 6 aligned in the X-axis direction from the front surface 4a to the back surface 4b, and the chuck table is moved in the X-axis direction while supplying cutting water to the portion where the cutting edge of the cutting blade 24 will cut. This allows dividing grooves 26 to be formed along the dividing lines 6.

[0032] Next, the cutting blade 24 is indexed in the Y-axis direction by an amount corresponding to the spacing of the dividing lines 6 in the Y-axis direction. Then, by alternately repeating the formation of dividing grooves 26 and the indexing, dividing grooves 26 are formed along all of the dividing lines 6 aligned in the X-axis direction. Furthermore, the chuck table is rotated 90 degrees, and then the formation of dividing grooves 26 and the indexing are alternately repeated. In this way, dividing grooves 26 are formed along all of the dividing lines 6 that are perpendicular to the dividing lines 6 along which the dividing grooves 26 were previously formed. In this way, the dividing grooves 26 are formed in a grid pattern along the grid-like dividing lines 6. As a result, the wafer 4 can be divided into individual device chips 8.

[0033] (Laser processing equipment 28) The dividing step can also be performed using a laser processing device 28 shown in Fig. 6. The laser processing device 28 includes a chuck table (not shown) that holds the wafer 4 by suction, an oscillator (not shown) that oscillates a pulsed laser beam LB having a wavelength that is absorbable or transmissive to the wafer 4, and a condenser 30 that focuses the pulsed laser beam LB oscillated by the oscillator and irradiates the wafer 4 held by suction on the chuck table with the beam.

[0034] When the dividing step is performed using the laser processing device 28, first, the wafer 4 is suction-held on the upper surface of the chuck table with the front surface 4a of the wafer 4 facing upward. Next, the wafer 4 is imaged from above by an imaging means (not shown) of the laser processing device 28, and the dividing lines 6 are aligned in the X-axis direction based on the image of the wafer 4 taken by the imaging means. Next, the laser beam LB is aimed at the dividing lines 6 aligned in the X-axis direction, and the focal point of the laser beam LB is positioned on the front surface 4a of the wafer 4. It is preferable to coat the front surface 4a of the wafer 4 with a protective film such as a water-soluble resin in advance to prevent debris from adhering to the front surface 4a.

[0035] Then, while the chuck table is moved in the X-axis direction, a laser beam LB having a wavelength that is absorbable by the wafer 4 is irradiated from the condenser 30 onto the wafer 4. This performs ablation on the front surface 4a of the wafer 4, and laser-processed grooves 32 extending from the front surface 4a to the back surface 4b are formed along the planned dividing lines 6 (see FIGS. 6 and 7(a)). Furthermore, similar to the case of forming the dividing grooves 26 using the cutting device 18, irradiation of the laser beam LB and indexing are alternately repeated to form the laser-processed grooves 32 in a grid pattern on the front surface 4a of the wafer 4 along the grid-like planned dividing lines 6.

[0036] When dividing the wafer 4 using the laser processing device 28, a modified layer 34 serving as a dividing trigger may be formed inside the wafer 4 along the planned dividing lines 6, as shown in FIG. 7( b). Even when the modified layer 34 is formed, when the thermocompression sheet 12 is radially expanded by the expansion means 38 of the pickup device 36 described below, cracks extend from the modified layer 34 serving as a dividing trigger, thereby dividing the wafer 4 into individual device chips 8. That is, the modified layer 34 may be formed using the laser processing device 28, and then a dividing step may be performed in which the thermocompression sheet 12 is subjected to a radial external force to divide the wafer 4 into individual device chips 8. When the modified layer 34 is formed using the laser processing device 28, the focal point of a laser beam LB having a wavelength that is transparent to the wafer 4 is positioned inside the wafer 4, and the laser beam LB is irradiated onto the wafer 4 along the planned dividing lines 6.

[0037] (Pickup process) In this embodiment, after the dividing step is performed, a pick-up step is performed in which the device chips 8 are picked up from the thermocompression sheet 12.

[0038] The pick-up step can be performed using, for example, a pick-up device 36 shown in Fig. 8. The pick-up device 36 includes an expansion means 38 that expands the thermocompression sheet 12 to increase the spacing between adjacent device chips 8, and a collet 40 that sucks and transports the device chips 8. The expansion means 38 includes a cylindrical drum 42, a push-up means 44 that is disposed inside the drum 42 and pushes up the device chips 8, and an annular holding member 46 that is disposed on the outer periphery of the drum 42. A plurality of clamps 48 are disposed at intervals in the circumferential direction on the outer periphery of the holding member 46. The collet 40 is connected to a suction means (not shown) and sucks the device chips 8 at the underside of its tip.

[0039] In the pick-up process, first, the frame 2 is placed on the upper surface of the holding member 46 with the wafer 4 facing upward. Next, the frame 2 is fixed with a plurality of clamps 48. Next, the holding member 46 is lowered, and a radial external force is applied to the thermocompression sheet 12. This increases the spacing between the device chips 8 on the thermocompression sheet 12, as shown by the two-dot chain line in FIG. 8 . Note that if the modified layer 34 is formed using the laser processing device 28, applying a radial external force to the thermocompression sheet 12 will divide the wafer 4 into individual device chips 8 and increase the spacing between the device chips 8.

[0040] Next, the collet 40 is positioned above the device chip 8 to be picked up, and the push-up means 44 is positioned below the device chip 8 to be picked up. Next, the device chip 8 is pushed up by the push-up means 44, and the collet 40 is lowered, and the device chip 8 is adsorbed by the underside of the tip of the collet 40. Next, the collet 40 is raised, and the device chip 8 is picked up. Next, the picked-up device chip 8 is transported to a predetermined position such as a tray. Then, by repeating this pickup operation, all of the device chips 8 are transported from the thermocompression bonding sheet 12 of the frame unit 16.

[0041] As described above, in this embodiment, the frame unit 16 is formed from the thermocompression sheet 12 without an adhesive layer, which eliminates the problem that when the wafer 4 is cut with the cutting blade 24, the glue splashes along with the cutting water and adheres to the surfaces of the devices 8, degrading the quality of the device chips 8. Furthermore, even if the laser beam LB is irradiated along the planned division lines 6 of the wafer 4 to create division grooves (laser-processed grooves 32) or modified layers 34 that trigger division, the absence of an adhesive layer in the thermocompression sheet 12 eliminates the problem that the glue will adhere to the devices 8, degrading the quality of the device chips 8, and become a source of contamination in the pick-up process.

[0042] Furthermore, according to this embodiment, the surface of the thermocompression sheet 12 that is to be attached to the wafer 4 and frame 2 is activated by plasma treatment or corona treatment, which improves the adhesion of the thermocompression sheet 12 to the wafer 4 and frame 2 and prevents water mixed with processing debris generated during division by the cutting blade 24 from penetrating between the thermocompression sheet 12 and the wafer 4. This prevents deterioration in the quality of the device chips 8.

[0043] (Frame unit forming device) Next, a preferred embodiment of a frame unit forming apparatus according to the present invention will be described with reference to FIGS.

[0044] The frame unit forming apparatus 50 shown in Figure 9 includes a frame accommodating means 52, a wafer accommodating means 54, a frame transporting means 56, a thermocompression sheet disposing means 58, an activation means 60, a frame sheet transporting means 62, a wafer carrying out means 64, a frame unit forming means 66, and a cassette accommodating means 68.

[0045] (Frame receiving means 52) The frame accommodating means 52 accommodates a plurality of annular frames 2 each having an opening 2a in the center for accommodating a wafer 4. As shown in Fig. 10, the frame accommodating means 52 of this embodiment includes a housing 70 and a lift plate 72 arranged in the housing 70 so as to be able to move up and down freely.

[0046] 10, a door 74 with a handle 74a attached is provided on the side surface of the housing 70 on the front side in the X-axis direction. In the frame accommodating means 52, the frame 2 can be accommodated inside the housing 70 by gripping the handle 74a and opening the door 74. In addition, an opening 70a is provided at the upper end of the housing 70.

[0047] The X-axis direction in this embodiment is the direction indicated by the arrow X in Fig. 10. The Y-axis direction indicated by the arrow Y in Fig. 10 is the direction perpendicular to the X-axis direction, and the Z-axis direction indicated by the arrow Z in Fig. 10 is the up-down direction perpendicular to the X-axis and Y-axis directions. The XY plane defined by the X-axis and Y-axis directions is substantially horizontal.

[0048] 10, a Z-axis guide member 76 extending in the Z-axis direction is disposed on the side surface of the housing 70 at the rear in the X-axis direction. The lift plate 72 is supported by the Z-axis guide member 76 so that it can move up and down. Also, a lifting means (not shown), which may be of a ball screw type, for lifting and lowering the lift plate 72 is disposed inside the Z-axis guide member 76.

[0049] 10 , frames 2 are stored in a stack on the upper surface of a lifting plate 72 inside a housing 70. The uppermost frame 2 of the stacked frames 2 is transported by a frame transporting means 56 through an opening 70a of the housing 70. After the frame 2 is transported out of the opening 70a of the housing 70, the frame storing means 52 appropriately raises the lifting plate 72 by the lifting means, and positions the uppermost frame 2 at a position where it can be transported by the frame transporting means 56.

[0050] (Wafer storage means 54) The wafer accommodating means 54 accommodates a plurality of wafers 4. As shown in FIG. 11(a), the wafer accommodating means 54 of this embodiment is a cassette that accommodates a plurality of wafers 4 spaced apart in the vertical direction, with the surfaces 4a of the wafers 4 facing upward. The wafer accommodating means 54 is supported by a cassette table 78. The cassette table 78 has a top plate 80 on which the wafer accommodating means 54 is placed, and a support plate 82 that supports the top plate 80. The top plate 80 is movable up and down, and the cassette table 78 may be provided with an elevating means that raises and lowers the top plate 80 to position it at any height.

[0051] (Frame conveying means 56) Explaining with reference to FIG. 10 , the frame conveying means 56 carries out the frame 2 from the frame storing means 52 and places it on the frame table 84. The frame conveying means 56 includes an X-axis guide member 86 extending in the X-axis direction, an X-axis movable member 88 supported by the X-axis guide member 86 so as to be movable in the X-axis direction, an X-axis feed means (not shown) which may be of a ball screw type for moving the X-axis movable member 88 in the X-axis direction, a Z-axis movable member 90 supported by the X-axis movable member 88 so as to be movable in the Z-axis direction, and a Z-axis feed means (not shown) which may be of a ball screw type for moving the Z-axis movable member 90 in the Z-axis direction. The Z-axis movable member 90 has a holding portion 92 for holding the frame 2. The holding portion 92 has a rectangular base plate 94 and a plurality of suction pads 96 provided on the underside of the base plate 94, and each suction pad 96 is connected to a suction means (not shown).

[0052] The frame transport means 56 holds the top frame 2 housed in the frame storage means 52 by suction using the suction pad 96 of the holding portion 92, and then moves the X-axis movable member 88 and the Z-axis movable member 90 to transport the top frame 2 held by suction out of the frame storage means 52 and place it on the frame table 84.

[0053] (Frame Table 84) The frame table 84 is supported by a Z-axis guide member 98 so as to be movable up and down. An appropriate drive source (for example, an air drive source or an electric drive source) is attached to the Z-axis guide member 98 for raising and lowering the frame table 84. The frame table 84 receives the frame 2 carried out by the frame transport means 56 at the transfer position shown by the solid line in Fig. 10. The frame table 84 also has a built-in electric heater and temperature sensor (neither of which are shown), and the temperature of the upper surface of the frame table 84 is adjusted by an appropriate control device.

[0054] (thermocompression sheet disposing means 58) The thermocompression sheet disposing means 58 disposes the thermocompression sheet 12 on the frame 2 placed on the frame table 84. As shown in Fig. 12, the thermocompression sheet disposing means 58 includes a roll sheet supporting section 100 that supports a roll sheet 12R around which the thermocompression sheet 12 is wound before use, a sheet winding section 102 that winds up the used thermocompression sheet 12, a sheet pulling out section 104 that pulls out the thermocompression sheet 12 from the roll sheet 12R, a thermocompression bonding section 106 that thermocompresses the pulled out thermocompression sheet 12 to the frame 2, and a cutting section 108 that cuts off the thermocompression sheet 12 that protrudes beyond the outer periphery of the frame 2 along the frame 2.

[0055] (Roll sheet support part 100) The roll sheet support unit 100 includes a support roller 110 supported by an appropriate bracket (not shown) so as to be rotatable about an axis extending in the X-axis direction. The support roller 110 supports a roll sheet 12R that is rolled up into a cylindrical shape and has release paper 112 attached to the pressure-bonding surface of the thermocompression-bonding sheet 12 to protect the pressure-bonding surface of the thermocompression-bonding sheet 12.

[0056] (Sheet winding unit 102) The sheet winding unit 102 includes a winding roller 114 supported by an appropriate bracket (not shown) so as to be rotatable about an axis extending in the X-axis direction, and a motor (not shown) that rotates the winding roller 114. The sheet winding unit 102 rotates the winding roller 114 with the motor, thereby winding up the used thermocompression-bonded sheet 12, which has a circular opening 12a that corresponds to the portion thermocompression-bonded to the frame 2.

[0057] (Seat drawer 104) The sheet pull-out unit 104 includes a pull-out roller 116 arranged below the support roller 110 of the rolled sheet support unit 100, a motor (not shown) that rotates the pull-out roller 116, and a driven roller 118 that rotates in conjunction with the rotation of the pull-out roller 116. The sheet pull-out unit 104 pulls out the thermocompression sheet 12 sandwiched between the pull-out roller 116 and the driven roller 118 from the rolled sheet 12R by rotating the driven roller 118 together with the pull-out roller 116 using the motor.

[0058] The release paper 112 is peeled off from the thermocompression sheet 12 that has passed between the pull-out roller 116 and the driven roller 118, and the peeled release paper 112 is taken up by the release paper take-up unit 120. The release paper take-up unit 120 has a release paper take-up roller 122 arranged above the driven roller 118, and a motor (not shown) that rotates the release paper take-up roller 122. The thermocompression sheet 12 from which the release paper 112 has been peeled off is guided to the take-up roller 114 via a pair of guide rollers 124 arranged at an interval from the pull-out roller 116 in the Y-axis direction. In this embodiment, the release paper 112 is attached to the thermocompression sheet 12, but the thermocompression sheet 12 does not necessarily have to be provided with the release paper 112, in which case the release paper take-up roller 122 is not necessary.

[0059] (Thermal compression bonding part 106) The thermocompression bonding unit 106 includes a heating roller 126 that is arranged to be movable in the Y-axis direction, an elevator (not shown) that may be of a ball screw type for raising and lowering the heating roller 126, and a Y-axis feed (not shown) that may be of a ball screw type for moving the heating roller 126 in the Y-axis direction. The heating roller 126 has a built-in electric heater and temperature sensor (neither of which are shown), and the temperature of the outer surface of the heating roller 126 is adjusted by a control device (not shown). The outer surface of the heating roller 126 is coated with a fluororesin to prevent the thermocompression sheet 12 from sticking to the heating roller 126 even if the thermocompression sheet 12 exerts adhesive force. The elevator of the thermocompression bonding unit 106 positions the heating roller 126 at an upper standby position shown in FIG. 13 and a lower pressing position shown in FIG. 14. The Y-axis feed means of the thermocompression bonding unit 106 moves the heating roller 126 in the Y-axis direction while the heating roller 126 is positioned at the lower pressing position.

[0060] (cutting section 108) Cutting unit 108 includes a Z-axis guide member 128 extending in the Z-axis direction, a Z-axis movable member 130 supported by Z-axis guide member 128 for movement in the Z-axis direction, and a Z-axis feed mechanism (not shown), which may be of a ball screw type, for moving Z-axis movable member 130 in the Z-axis direction. Cutting unit 108 also includes a motor 132 fixed to the underside of the tip of Z-axis movable member 130, and an arm piece 134 rotated by motor 132 about an axis extending in the Z-axis direction. First and second hanging pieces 136a and 136b are attached to the underside of arm piece 134 and spaced apart from each other. A circular cutter 138 is supported on first hanging piece 136a for rotation about an axis perpendicular to the Z-axis direction, and a pressure roller 140 is supported on second hanging piece 136b for rotation about an axis perpendicular to the Z-axis direction.

[0061] The thermocompression sheet disposing means 58 uses the pull-out roller 116 and driven roller 118 to pull out the unused thermocompression sheet 12 before the frame table 84, which has received the frame 2 from the frame conveying means 56, moves from the delivery position (the position shown in FIG. 13) to the bonding start position (the position shown in FIG. 14). Next, the frame table 84 is raised to the bonding start position, and the heating roller 126 is lowered to the lower pressing position. Then, the heating roller 126, which has been adjusted to a temperature at which the thermocompression sheet 12 softens or melts and exerts adhesive force, rolls in the Y-axis direction while pressing the thermocompression sheet 12 downward. This heats the thermocompression sheet 12, causing it to exert adhesive force, and thermocompression-bonds the thermocompression sheet 12 to the frame 2.

[0062] After thermocompression-bonding the thermocompression sheet 12 to the frame 2, the thermocompression-bonding sheet disposing means 58 lowers the Z-axis movable member 130 of the cutting unit 108, presses the cutter 138 against the thermocompression-bonding sheet 12 on the frame 2, and presses the frame 2 from above the thermocompression-bonding sheet 12 with the pressure roller 140. Next, the motor 132 rotates the arm piece 134, causing the cutter 138 and pressure roller 140 to move in a circular motion along the frame 2. This allows the thermocompression-bonding sheet 12 that extends beyond the outer periphery of the frame 2 to be cut along the frame 2. Furthermore, because the pressure roller 140 presses the frame 2 from above the thermocompression-bonding sheet 12, displacement of the frame 2 and the thermocompression-bonding sheet 12 during cutting is prevented. Then, after the frame table 84 is lowered, the used thermocompression-bonding sheet 12, now with the circular opening 12a corresponding to the portion thermocompression-bonded to the frame 2, is taken up by the sheet take-up unit 102.

[0063] (Activation means 60) The activation means 60 performs plasma treatment or corona treatment on the thermocompression sheet 12 on the side that will be placed on the frame 2 by the thermocompression sheet placement means 58. Referring to FIG. 12 , the activation means 60 of this embodiment is configured to be movable in the Y-axis direction. When the activation means 60 is positioned at an operating position between the thermocompression sheet 12 drawn out by the sheet drawing section 104 of the thermocompression sheet placement means 58 and the frame 2 on the frame table 84, the activation means 60 performs plasma treatment or corona treatment on the thermocompression sheet 12 to activate it. This improves the wettability of the surface of the thermocompression sheet 12 that will be placed on the frame 2. The treatment performed by the activation means 60 may be atmospheric pressure plasma treatment.

[0064] It is preferable that the activation means 60 also activates the surface of the frame 2 that will be placed on the thermocompression sheet 12 (the upper surface of the frame 2 placed on the frame table 84) by plasma treatment or corona treatment. This improves the wettability of the surface of the frame 2 that will be placed on the thermocompression sheet 12.

[0065] (Frame sheet conveying means 62) The frame sheet conveying means 62 conveys the frame 2 (hereinafter sometimes referred to as "frame sheet 2'") on which the thermocompression sheet 12 is arranged to the frame unit forming table 142. As shown in FIG. 10, the frame sheet conveying means 62 includes a Y-axis guide member 144 extending in the Y-axis direction, a Y-axis movable member 146 supported by the Y-axis guide member 144 so as to be movable in the Y-axis direction, a Y-axis feed means (not shown) which may be of a ball screw type for moving the Y-axis movable member 146 in the Y-axis direction, a Z-axis movable member 148 supported by the Y-axis movable member 146 so as to be movable in the Z-axis direction, and a Z-axis feed means (not shown) which may be of a ball screw type for moving the Z-axis movable member 148 in the Z-axis direction. The Z-axis movable member 148 has a holding portion 150 for holding the frame sheet 2'. The holding portion 150 has a rectangular base plate 152 and a plurality of suction pads 154 provided on the lower surface of the base plate 152, and each suction pad 154 is connected to a suction means (not shown).

[0066] The frame sheet conveying means 62 holds the upper surface of the frame sheet 2' supported on the frame table 84 by suction with each suction pad 154 of the holding section 150, and by moving the Y-axis movable member 146 and the Z-axis movable member 148, conveys the frame sheet 2' held by suction with the holding section 150 from the frame table 84 to the frame unit forming table 142.

[0067] (Frame unit forming table 142) 10, the frame unit forming table 142 includes a circular wafer support portion 156 that supports the wafer 4, and an annular frame support portion 158 that is disposed on the outer periphery of the wafer support portion 156 and supports the frame 2. A plurality of suction holes 160 are formed at intervals in the circumferential direction on the periphery of the upper surface of the wafer support portion 156, and the suction holes 160 are connected to suction means (not shown). The wafer support portion 156 also includes a built-in electric heater and a temperature sensor (neither of which are shown), and the temperature of the upper surface of the wafer support portion 156 is adjusted by an appropriate control device.

[0068] (Wafer carrying-out means 64) 11(a), the wafer carrying-out means 64 carries the wafer 4 from the wafer accommodation means 54 to the frame unit forming table 142. The wafer carrying-out means 64 includes a transport arm 162 and a hand 164 disposed at the tip of the transport arm 162 and supporting the wafer 4 accommodated in the wafer accommodation means 54.

[0069] The transfer arm 162 is provided on the upper surface of the base 166 and is driven by an appropriate drive source (not shown), such as an air drive source or an electric drive source. This drive source drives the transfer arm 162 to position the hand 164 at any position in each of the X-axis, Y-axis, and Z-axis directions, and also to turn the hand 164 upside down.

[0070] The hand 164 is preferably a Bernoulli pad that generates negative pressure by ejecting air and supports the wafer 4 without contact. As shown in Fig. 11(b), the hand 164 of this embodiment is C-shaped overall, and one side of the hand 164 is formed with a plurality of air ejection ports 168 connected to a compressed air supply source (not shown). A plurality of guide pins 170 are attached to the outer periphery of the hand 164 at intervals in the circumferential direction. The guide pins 170 are configured to be movable in the radial direction of the hand 164.

[0071] The wafer unloading means 64 positions the hand 164 on the back surface 4b side (underside) of the wafer 4 in the wafer storage means 54, and then ejects compressed air from the air ejection port 168 of the hand 164 to generate negative pressure on one side of the hand 164 by the Bernoulli effect, and the hand 164 suction-supports the wafer 4 from the back surface 4b side without contact. The horizontal movement of the wafer 4 suction-supported by the hand 164 is regulated by a guide pin 170. Then, the wafer unloading means 64 moves the transfer arm 162 to transfer the wafer 4 suction-supported by the hand 164 from the wafer storage means 54 to the unloading frame unit forming table 142.

[0072] The wafer unloading means 64 is equipped with a notch detection means 172 that detects the position of the notch 9 in the wafer 4. The notch detection means 172 may include, for example, a light-emitting element 174 and a light-receiving element 176 that are spaced apart from each other in the vertical direction, and a drive source (not shown) that rotates at least one of the guide pins 170 of the hand 164. The light-emitting element 174 and the light-receiving element 176 may be attached to the transfer path of the transfer arm 162 via an appropriate bracket (not shown). When the guide pin 170 is rotated by the drive source, the rotation of the guide pin 170 causes the wafer 4 supported by the hand 164 to rotate. In order to reliably transmit rotation from the guide pin 170 to the wafer 4, the outer circumferential surface of the guide pin 170 that is rotated by the drive source is preferably made of an appropriate synthetic rubber.

[0073] The notch detection means 172 can detect the position of the notch 9 by rotating the wafer 4 via the guide pin 170 using a drive source while the wafer 4 is supported by suction with the hand 164 and the outer periphery of the wafer 4 is positioned between the light emitting element 174 and the light receiving element 176. This makes it possible to adjust the orientation of the wafer 4 to any orientation.

[0074] (Frame unit forming means 66) 17, the frame unit forming means 66 integrates the frame sheet 2' (frame 2 on which the thermocompression sheet 12 is arranged) and the wafer 4 that have been transported to the frame unit forming table 142 to form a frame unit 16. The frame unit forming means 66 includes an upper chamber 178 arranged above the frame unit forming table 142, a lower chamber 180 that houses the frame unit forming table 142, an elevating mechanism 182 that raises and lowers the upper chamber 178 to create a closed state in which it is in contact with the lower chamber 180 and an open state in which it is separated from the lower chamber 180, a vacuum section 184 that evacuates the upper chamber 178 and the lower chamber 180 in the closed state, and an atmosphere opening section 186 that opens the upper chamber 178 and the lower chamber 180 to the atmosphere.

[0075] The upper chamber 178 includes a circular top plate 188 and a cylindrical side wall 190 that hangs down from the periphery of the top plate 188. An elevation mechanism 182, which may be composed of an appropriate actuator such as an air cylinder, is attached to the upper surface of the top plate 188. In the storage space defined by the lower surface of the top plate 188 and the inner peripheral surface of the side wall 190, there are disposed a heating roller 192 for thermocompression bonding the thermocompression sheet 12 of the frame sheet 2' to one side of the wafer 4 supported on the frame unit forming table 142, a support piece 194 for rotatably supporting the heating roller 192, and a Y-axis feed means 196 for moving the support piece 194 in the Y-axis direction.

[0076] Heating roller 192 has a built-in electric heater and temperature sensor (neither of which are shown), and a control device (not shown) adjusts the temperature of the outer circumferential surface of heating roller 192. The outer circumferential surface of heating roller 192 is coated with fluororesin, so that thermocompression sheet 12 will not stick to heating roller 192 even if it exerts adhesive force.

[0077] Y-axis feed means 196 has a ball screw 198 that is connected to support piece 194 and extends in the Y-axis direction, and a motor 200 that rotates ball screw 198. Y-axis feed means 196 converts the rotational motion of motor 200 into linear motion using ball screw 198 and transmits the linear motion to support piece 194, moving support piece 194 in the Y-axis direction along a pair of guide rails 202 that extend in the Y-axis direction.

[0078] The lower chamber 180 has a cylindrical side wall 204, the upper part of which is open and the lower part of which is closed. A connection opening 206 is formed in the side wall 204. A vacuum part 184, which may be constituted by an appropriate vacuum pump, is connected to the connection opening 206 via a flow path 208. The flow path 208 is provided with an atmosphere opening part 186, which may be constituted by an appropriate valve that can open the flow path 208 to the atmosphere.

[0079] With the thermocompression sheet 12 of the frame sheet 2' positioned on one side of the wafer 4 supported on the frame unit forming table 142, the frame unit forming means 66 lowers the upper chamber 178 using the lifting mechanism 182, bringing the lower end of the side wall 190 of the upper chamber 178 into contact with the upper end of the side wall 204 of the lower chamber 180, thereby closing the upper chamber 178 and the lower chamber 180 and bringing the heating roller 192 into contact with the frame sheet 2'.

[0080] Next, the frame unit forming means 66 operates the vacuum pump that constitutes the vacuum section 184 with the valve that constitutes the atmosphere opening section 186 closed, and evacuates the interior of the upper chamber 178 and the lower chamber 180. Next, the temperature of the heating roller 192 is adjusted to a temperature at which the thermocompression-bonding sheet 12 softens or melts and exerts adhesive force. Then, the Y-axis feeding means 196 rolls the heating roller 192 in the Y-axis direction. This heats the thermocompression-bonding sheet 12, causing it to exert adhesive force, and thermocompression-bonding the thermocompression-bonding sheet 12 to one side of the wafer 4. As a result, the frame unit 16 is formed.

[0081] In this embodiment, the wafer 4 and the thermocompression-bonded sheet 12 are thermocompression-bonded with the interiors of the upper chamber 178 and the lower chamber 180 in a vacuum state, so when the open-to-air section 186 is opened after the thermocompression-bonded sheet 12 is thermocompression-bonded, the thermocompression-bonded sheet 12 is pressed against the wafer 4 by atmospheric pressure. This increases the adhesion between the thermocompression-bonded sheet 12 and the wafer 4.

[0082] (Cassette storage means 68) 9, the cassette accommodating means 68 accommodates the frame units 16 formed by the frame unit forming means 66 in a cassette 212 placed on a cassette table 210. The cassette accommodating means 68 includes frame unit carrying-out means 214 that carries out the frame units 16 formed by the frame unit forming means 66 from the frame unit forming table 142, an inversion mechanism 216 that inverts the frame units 16 carried out by the frame unit carrying-out means 214, a frame unit supporting portion 218 that supports the frame units 16 inverted by the inversion mechanism 216 so that the front surfaces 4a of the wafers 4 face upward, and a pushing portion 220 that inserts the frame units 16 supported by the frame unit supporting portion 218 into the cassette 212 placed on the cassette table 210 and accommodates them therein.

[0083] (Frame unit carrying-out means 214) As shown in FIG. 10 , the frame unit carry-out means 214 includes an X-axis guide member 222 extending in the X-axis direction, an X-axis movable member 224 supported by the X-axis guide member 222 so as to be movable in the X-axis direction, an X-axis feed means (not shown) which may be of a ball screw type for moving the X-axis movable member 224 in the X-axis direction, a Z-axis movable member 226 supported by the X-axis movable member 224 so as to be movable in the Z-axis direction, a Z-axis feed means (not shown) which may be of a ball screw type for moving the Z-axis movable member 226 in the Z-axis direction, a Y-axis movable member 228 supported by the Z-axis movable member 226 so as to be movable in the Y-axis direction, and a Y-axis feed means (not shown) which may be of a ball screw type for moving the Y-axis movable member 228 in the Y-axis direction.

[0084] A circular substrate 230 is attached to the Y-axis movable member 228 of the frame unit carry-out means 214. A wafer activation means 232 is provided on the underside of the substrate 230, which performs plasma treatment or corona treatment on the wafer 4 transported to the frame unit forming table 142. In addition, a plurality of (four in the illustrated embodiment) protruding pieces 234 are provided on the periphery of the substrate 230, which protrude radially outward at intervals in the circumferential direction. Suction pads 236 are attached to the undersides of the protruding pieces 234, and each suction pad 236 is connected to suction means (not shown).

[0085] In the frame unit carry-out means 214, after the wafer 4 is transported to the frame unit forming table 142, but before the frame sheet 2' is transported to the frame unit forming table 142, the X-, Y-, and Z-axis movable members 224, 228, and 226 are moved to position the wafer activation means 232 above the wafer 4 placed on the frame unit forming table 142. The wafer activation means 232 then activates the wafer 4 by performing a plasma treatment or a corona treatment. This improves the wettability of the surface of the wafer 4 that will be placed on the thermocompression bonding sheet 12. The treatment performed by the wafer activation means 232 may be atmospheric pressure plasma treatment.

[0086] Moreover, after performing plasma treatment or corona treatment on the wafer 4, the frame unit carry-out means 214 moves away from above the frame unit forming table 142. Then, after the frame unit 16 is formed, the frame unit carry-out means 214 suction-holds the upper surface of the frame 2 of the frame unit 16 supported on the frame unit forming table 142 with each suction pad 236, and moves the X-, Y-, and Z-axis movable members 224, 228, and 226 to carry out the frame unit 16 suction-held by the suction pads 236 from the frame unit forming table 142.

[0087] (Reversing mechanism 216) 18 , the inversion mechanism 216 includes a Y-axis guide member 238 extending in the Y-axis direction, a Y-axis movable member 240 supported by the Y-axis guide member 238 so as to be movable in the Y-axis direction, a Y-axis feed means (not shown) which may be of a ball screw type for moving the Y-axis movable member 240 in the Y-axis direction, an arm 242 supported by the Y-axis movable member 240 so as to be movable in the Z-axis direction, and a Z-axis feed means (not shown) which may be of a ball screw type for moving the arm 242 in the Z-axis direction. A substrate 246 is rotatably supported on the arm 242 via a pair of rotary shafts 244. One of the rotary shafts 244 is connected to a motor 248 which turns the substrate 246 upside down. A plurality of suction pads 250 are attached to one side of the substrate 246, and each suction pad 250 is connected to a suction means (not shown).

[0088] With the suction pad 250 facing upward, the inversion mechanism 216 sucks and holds the lower surface of the frame 2 of the frame unit 16 held by the frame unit carry-out means 214 with the suction pad 250, and receives the frame unit 16 from the frame unit carry-out means 214. Furthermore, the inversion mechanism 216 inverts the substrate 246 with the motor 248 so that the front surface 4a of the wafer 4 faces upward, and then moves the Y-axis movable member 240 to move the frame unit 16 sucked and held by the suction pad 250 toward the cassette table 210.

[0089] (Frame unit support part 218) 19, the frame unit support portion 218 includes a pair of support plates 252 spaced apart in the X-axis direction. The pair of support plates 252 are fixed by appropriate brackets (not shown).

[0090] (Push-in part 220) Pushing section 220 includes a Y-axis guide member 254 extending in the Y-axis direction, a Y-axis movable member 256 supported by Y-axis guide member 254 so as to be movable in the Y-axis direction, and a Y-axis feed means (not shown), which may be of a ball screw type, that moves Y-axis movable member 256 in the Y-axis direction. Y-axis movable member 256 has a base 258 supported by Y-axis guide member 254, a support pillar 260 extending upward from the top surface of base 258, and a pressing piece 262 attached to the upper end of support pillar 260.

[0091] 20, the frame unit support portion 218 receives the frame unit 16 held by the suction pad 250 of the reversing mechanism 216. Then, when the frame unit support portion 218 receives the frame unit 16, the pushing portion 220 moves the Y-axis movable member 256 in the Y-axis direction using the Y-axis feed means, thereby causing the frame unit 16 supported by the frame unit support portion 218 to enter into the cassette 212 placed on the cassette table 210 using the pressing piece 262 and accommodate it therein.

[0092] (Cassette table 210, cassette 212) A plurality of frame units 16 are housed in the cassette 212 at intervals in the vertical direction. As shown in Figures 19 and 20, the cassette table 210 includes a mounting portion 264 on which the cassette 212 is placed, and an elevator portion 266, which may be of a ball screw type, that raises and lowers the mounting portion 264 to position it at any height.

[0093] Next, a method for forming the frame unit 16 by placing the wafer 4 in the opening 2a of the frame 2 and using the thermocompression bonding sheet 12 using the frame unit forming apparatus 50 as described above will be described.

[0094] (Wafer setting process) 11(a), a wafer setting step is first performed in which the wafer storage means 54 storing a plurality of wafers 4 is set on the cassette table 78. The wafer storage means 54 stores a plurality of wafers 4 at intervals in the vertical direction with the surfaces 4a facing upward.

[0095] (Frame accommodation process) 9 and 10, a frame accommodating step is performed in which multiple frames 2 are accommodated in the frame accommodating means 52. In the frame accommodating step, the lift plate 72 of the frame accommodating means 52 is lowered to a desired position, and then the handle 74a is grasped to open the door 74, and multiple frames 2 are stacked and accommodated on the upper surface of the lift plate 72. The height of the lift plate 72 is also adjusted appropriately, and the uppermost frame 2 is positioned at a position where it can be transported by the frame transport means 56. The frame accommodating step may be performed before or after the wafer setting step.

[0096] (Wafer unloading process) After the wafer setting step and the frame accommodating step are performed, a wafer carrying-out step is performed in which the wafer 4 is carried out from the wafer accommodating means 54 and transferred to the frame unit forming table 142 .

[0097] Explaining with reference to FIG. 11(b), in the wafer unloading step, first, the transfer arm 162 of the wafer unloading means 64 is driven to position the hand 164, with the air outlet 168 facing upward, on the back surface 4b (lower side) of the wafer 4 in the wafer storage means 54. When the hand 164 is positioned on the back surface 4b side of the wafer 4, a gap is provided between the back surface 4b of the wafer 4 and the hand 164, and the guide pin 170 is positioned radially outward. Next, compressed air is ejected from the air outlet 168 of the hand 164 to generate negative pressure on one side of the hand 164 by the Bernoulli effect, and the hand 164 suction-supports the wafer 4 from the back surface 4b side without contact. Next, the guide pin 170 is moved radially inward, and the horizontal movement of the wafer 4 suction-supported by the hand 164 is restricted by the guide pin 170. Then, the transfer arm 162 of the wafer carrying-out means 64 is moved, and the wafer 4 supported by the hand 164 under suction is carried out from the wafer receiving means 54 .

[0098] (Notch detection process) After the wafer 4 is carried out from the wafer storage means 54, it is preferable to carry out a notch detection step of detecting the position of the notch 9 in the wafer 4.

[0099] 11(b), in the notch detection step, the outer periphery of the wafer 4 supported by suction with the hand 164 is positioned between the light emitting element 174 and the light receiving element 176 of the notch detection means 172. Next, the wafer 4 is rotated via the guide pin 170 by the drive source, thereby detecting the position of the notch 9 in the wafer 4. This makes it possible to adjust the orientation of the wafer 4 to any desired orientation.

[0100] After the notch detection step is performed, the wafer 4 supported by suction using the hand 164 of the wafer carry-out means 64 is transported to the frame unit forming table 142 (see FIG. 17). Specifically, the hand 164 of the wafer carry-out means 64 is turned upside down so that the front surface 4a of the wafer 4 faces downward. Next, the transport arm 162 of the wafer carry-out means 64 is moved, and the wafer 4 supported by suction using the hand 164 is placed on the wafer support portion 156 of the frame unit forming table 142. Next, suction force is generated in the suction holes 160 of the wafer support portion 156, and the outer periphery of the front surface 4a of the wafer 4 is suction-held. Next, the suction support of the wafer 4 by the hand 164 is released, and the hand 164 is separated from the frame unit forming table 142. In this manner, the wafer 4 is transferred from the wafer carry-out means 64 to the frame unit forming table 142. The wafer 4 transferred to the frame unit forming table 142 is held by suction through the suction holes 160, so that the position of the wafer 4 does not shift.

[0101] (Wafer activation process) After the wafer carrying-out step is performed, it is desirable to perform a wafer activation step in which the wafer 4 transferred to the frame unit forming table 142 is subjected to plasma treatment or corona treatment (see FIG. 10).

[0102] In the wafer activation step, before the frame sheet 2' is transported to the frame unit forming table 142, the X-, Y-, and Z-axis movable members 224, 228, and 226 of the frame unit unloading means 214 are moved to position the wafer activation means 232 above the wafer 4 placed on the frame unit forming table 142. The wafer 4 is then activated by plasma treatment or corona treatment using the wafer activation means 232. This improves the wettability of the surface (back surface 4b) of the wafer 4 that will be placed on the thermocompression bonding sheet 12. The treatment performed by the wafer activation means 232 may be atmospheric pressure plasma treatment. After the plasma treatment or corona treatment has been performed on the wafer 4, the frame unit unloading means 214 is moved away from above the frame unit forming table 142. In the wafer activation step, before the plasma treatment or corona treatment, the surface of the wafer 4 that is to be placed on the thermocompression bonding sheet 12 may be irradiated with ultraviolet light to destroy organic matter.

[0103] (Frame transport process) After the wafer setting step and frame accommodating step are performed, a frame transport step is performed in which the frame 2 is carried out from the frame accommodating means 52 and placed on the frame table 84, in parallel with the wafer carrying-out step and notch detection step.

[0104] Explaining with reference to Figure 10, in the frame transport step, first, the X-axis movable member 88 and Z-axis movable member 90 of the frame transport means 56 are moved so that the suction pad 96 of the holder 92 comes into contact with the top surface of the uppermost frame 2 housed in the frame housing means 52. Next, the suction means of the frame transport means 56 is activated to generate a suction force in the suction pad 96, thereby suction-holding the uppermost frame 2 with the suction pad 96. Then, the X-axis movable member 88 and Z-axis movable member 90 of the frame transport means 56 are moved, and the uppermost frame 2, which is suction-held by the suction pad 96 of the holder 92, is transported from the frame housing means 52 to the frame table 84. At this time, the frame table 84 is positioned in advance at the transfer position (the position indicated by the solid line in Figure 10).

[0105] (activation process) After the frame transport step is carried out, an activation step is carried out in which the thermocompression bonding sheet 12 on the side to be disposed on the frame 2 is subjected to plasma treatment or corona treatment by the thermocompression bonding sheet disposing means 58 .

[0106] 13, in the activation step, first, the thermocompression sheet 12 is pulled out by the sheet pull-out section 104 of the thermocompression sheet disposing means 58, and the thermocompression sheet 12, with the release paper 112 removed and in a taut state, is positioned above the frame table 84. Next, the activation means 60 is positioned at an operating position between the thermocompression sheet 12 pulled out by the sheet pull-out section 104 and the frame table 84. The activation means 60 then applies plasma treatment or corona treatment to the thermocompression sheet 12 to activate it. This improves the wettability of the surface of the thermocompression sheet 12 that will be disposed on the frame 2.

[0107] In the activation step, it is preferable to also activate the surface of the frame 2 that will be placed on the thermocompression sheet 12 (the upper surface of the frame 2 placed on the frame table 84) by plasma treatment or corona treatment. This can also improve the wettability of the surface of the frame 2 that will be placed on the thermocompression sheet 12. Note that the activation step may be performed before the frame transport step, but by performing the activation step after the frame transport step as in this embodiment, the thermocompression sheet 12 and the frame 2 can be simultaneously activated by plasma treatment or corona treatment. Note that in the wafer activation step, before the plasma treatment or corona treatment is performed, ultraviolet light may be irradiated onto the surface to be treated with plasma or corona treatment to destroy organic matter.

[0108] (Thermocompression sheet placement process) After the activation step is performed, a thermocompression sheet providing step is performed in which the thermocompression sheet 12 is provided on the frame 2 placed on the frame table 84 .

[0109] In the thermocompression sheet disposing step, first, the temperature of the outer peripheral surface of the heating roller 126 is adjusted to a temperature at which the thermocompression sheet 12 softens or melts and exerts adhesive force. Next, as shown in Figure 14, the frame table 84 is positioned at the bonding start position, and the heating roller 126 of the thermocompression sheet disposing means 58 is lowered to the lower pressing position, applying tension to the thermocompression sheet 12 to thermocompression-bond it to one end of the frame 2. At this time, the thermocompression sheet 12 forms an elevation angle α from the heating roller 126 toward the lower guide roller 124 of the sheet winding section 102.

[0110] Then, while the heating roller 126 presses the thermocompression sheet 12 against the frame 2, the heating roller 126 is moved in the Y-axis direction toward the other end of the frame 2. This heats the thermocompression sheet 12, causing it to exert adhesive force, and thermocompression-bonding the thermocompression sheet 12 to the frame 2.

[0111] When the heating roller 126 is moved, the frame table 84 is raised in synchronization with the movement of the heating roller 126, thereby maintaining a constant tension on the thermocompression-bonded sheet 12. Specifically, as shown in Figures 15 and 16, the frame table 84 is gradually raised in synchronization with the movement of the heating roller 126 so that the elevation angle α is constant. This allows the thermocompression-bonded sheet 12 to be thermocompressed to the frame 2 with a substantially uniform tension applied to the thermocompression-bonded sheet 12. Note that in the thermocompression-bonding sheet disposition step, instead of adjusting the temperature of the heating roller 126, the temperature of the upper surface of the frame table 84 may be adjusted to a temperature at which the thermocompression-bonded sheet 12 softens or melts and exhibits adhesive force.

[0112] Referring to FIG. 12 , after the thermocompression-bonded sheet 12 is thermocompressed to the frame 2, the Z-axis movable member 130 of the cutting unit 108 is lowered, and the cutter 138 is pressed against the thermocompression-bonded sheet 12 on the frame 2, while the pressure roller 140 presses the frame 2 from above the thermocompression-bonded sheet 12. Next, the motor 132 rotates the arm piece 134, and the cutter 138 and pressure roller 140 move in a circular motion along the frame 2. This allows the thermocompression-bonded sheet 12 that extends beyond the outer periphery of the frame 2 to be cut along the frame 2. Furthermore, because the pressure roller 140 presses the frame 2 from above the thermocompression-bonded sheet 12, displacement of the frame 2 and the thermocompression-bonded sheet 12 is prevented while cutting the thermocompression-bonded sheet 12. After the thermocompression-bonded sheet 12 is cut, the frame table 84 is lowered, and the used thermocompression-bonded sheet 12, now with the circular opening 12a corresponding to the portion thermocompressed to the frame 2, is taken up by the sheet take-up unit 102.

[0113] (Frame sheet transport process) After the thermocompression bonding sheet disposing step is performed, a frame sheet transporting step is performed in which the frame sheet 2' (the frame 2 on which the thermocompression bonding sheet 12 is disposed) is transported to the frame unit forming table 142 (see FIG. 10).

[0114] In the frame sheet conveying step, first, the frame table 84 is lowered to the delivery position (the position indicated by the solid line in FIG. 10 ). Next, the Y-axis movable member 146 and the Z-axis movable member 148 of the frame sheet conveying means 62 are moved, and each suction pad 154 of the holding portion 150 of the frame sheet conveying means 62 is brought into contact with the upper surface of the frame sheet 2′ supported by the frame table 84. Next, the suction means of the frame sheet conveying means 62 is activated to generate suction force in the suction pads 154, and the upper surface of the frame sheet 2′ is suction-held by the suction pads 154. Next, the Y-axis movable member 146 and the Z-axis movable member 148 of the frame sheet conveying means 62 are moved, and the frame sheet 2′ suction-held by the suction pads 154 is conveyed out of the frame table 84.

[0115] Next, the frame sheet 2' held by suction with the suction pads 154 of the frame sheet conveying means 62 is conveyed to the frame unit forming table 142, and as shown in Figure 17, the opening 2a of the frame 2 is positioned on the back surface 4b of the wafer 4 supported on the frame unit forming table 142, and the frame sheet 2' is brought into contact with the frame support parts 158 of the frame unit forming table 142. Next, the suction force of the suction pads 154 of the frame sheet conveying means 62 is released, and the frame sheet 2' is placed on the frame support parts 158. Then, the Y-axis movable member 146 and the Z-axis movable member 148 of the frame sheet conveying means 62 are moved, and the holder 150 is moved away from above the frame unit forming table 142.

[0116] (Frame unit forming process) After the frame sheet transport step is performed, a frame unit forming step is performed in which the frame sheet 2' transported to the frame unit forming table 142 and the wafer 4 are integrated to form the frame unit 16.

[0117] In the frame unit forming step, first, the upper chamber 178 is lowered by the lifting mechanism 182 of the frame unit forming means 66, and the lower end of the side wall 190 of the upper chamber 178 is brought into contact with the upper end of the side wall 204 of the lower chamber 180. This brings the upper chamber 178 and the lower chamber 180 into a closed state, and brings the heating roller 192 into contact with the frame sheet 2'.

[0118] Next, with the air vent portion 186 of the frame unit forming means 66 closed, the vacuum portion 184 is operated to evacuate the interior of the upper chamber 178 and the lower chamber 180 . Next, the temperature of the heating roller 192 is adjusted to a temperature at which the thermocompression sheet 12 softens or melts and exerts adhesive force, and then the heating roller 192 is rolled in the Y-axis direction. This heats the thermocompression sheet 12, causing it to exert adhesive force and thermocompression-bonding the thermocompression sheet 12 to the back surface 4b of the wafer 4. As a result, the frame unit 16 is formed. Next, the atmosphere vent 186 is opened, and atmospheric pressure causes the thermocompression sheet 12 to adhere tightly to the back surface 4b of the wafer 4. Then, the upper chamber 178 is raised by the lifting mechanism 182. Note that in the frame unit formation process, instead of adjusting the temperature of the heating roller 192, the temperature of the upper surface of the wafer support part 156 may be adjusted to a temperature at which the thermocompression sheet 12 softens or melts and exerts adhesive force.

[0119] (Cassette storage process) After the frame unit forming step is performed, a cassette accommodation step is performed in which the frame unit 16 is accommodated in the cassette 212.

[0120] Explaining with reference to Figure 10, in the cassette accommodation step, first, the frame unit 16 is carried out from the frame unit forming table 142 by the frame unit carrying-out means 214. Specifically, the X-, Y-, and Z-axis movable members 224, 228, and 226 of the frame unit carrying-out means 214 are actuated to bring the suction pad 236 into contact with the frame 2. Next, a suction force is generated in the suction pad 236, and the frame 2 is sucked and held by the suction pad 236. Next, the suction hold of the wafer 4 by the frame unit forming table 142 is released. Then, the X-, Y-, and Z-axis movable members 224, 228, and 226 are actuated to carry out the frame unit 16 from the frame unit forming table 142.

[0121] After the frame unit 16 is carried out from the frame unit forming table 142, the frame unit 16 is handed over from the frame unit carrying-out means 214 to the reversing mechanism 216 (see FIG. 9 ). At this time, the substrate 246 of the reversing mechanism 216 is positioned below the frame unit 16 held by the frame unit carrying-out means 214. With the suction pad 250 of the substrate 246 facing upward, the arm 242 is raised and the suction pad 250 is brought into contact with the underside of the frame 2 of the frame unit 16 held by the frame unit carrying-out means 214 with the front surface 4 a of the wafer 4 facing downward. Next, a suction force is generated in the suction pad 250, and the frame 2 of the frame unit 16 is suction-held by the suction pad 250. Then, the suction-held frame unit 16 by the frame unit carrying-out means 214 is released. In this manner, the frame unit 16 is handed over from the frame unit carrying-out means 214 to the reversing mechanism 216.

[0122] After the frame unit 16 is transferred from the frame unit carry-out means 214 to the reversing mechanism 216, the frame unit 16 is transferred from the reversing mechanism 216 to the frame unit support section 218 (see FIGS. 18 and 19). At this time, first, the substrate 246 of the reversing mechanism 216 is turned upside down, and the frame unit 16 held by suction with the suction pad 250 is also turned upside down. As a result, the frame unit 16 is positioned below the substrate 246, with the front surface 4a of the wafer 4 facing upward. Next, the Y-axis movable member 240 and the arm 242 of the reversing mechanism 216 are moved, and the frame unit 16 is brought into contact with the upper surfaces of the pair of support plates 252 of the frame unit support section 218. Then, the suction holding of the frame unit 16 by the suction pad 250 is released. In this manner, the frame unit 16 is transferred from the reversing mechanism 216 to the frame unit support section 218.

[0123] After the frame unit 16 is handed over from the reversing mechanism 216 to the frame unit support section 218, as shown in Figure 20, the Y-axis movable member 256 of the pushing section 220 is moved in the Y-axis direction, and the frame unit 16 supported by the frame unit support section 218 is inserted into the cassette 212 placed on the cassette table 210 by the pressing piece 262 and stored therein.

[0124] As described above, in this embodiment, the frame unit 16 is formed from the thermocompression sheet 12 without an adhesive layer, which eliminates the problem that when the wafer 4 is cut with the cutting blade 24, the glue splashes along with the cutting water and adheres to the surfaces of the devices 8, degrading the quality of the device chips 8. Furthermore, even if the laser beam LB is irradiated along the planned division lines 6 of the wafer 4 to create division grooves (laser-processed grooves 32) or modified layers 34 that trigger division, the absence of an adhesive layer in the thermocompression sheet 12 eliminates the problem that the glue will adhere to the devices 8, degrading the quality of the device chips 8, and become a source of contamination in the pick-up process.

[0125] Furthermore, according to this embodiment, the surface of the thermocompression sheet 12 on which the wafer 4 and frame 2 are disposed is activated by plasma treatment or corona treatment, which improves the adhesion of the thermocompression sheet 12 to the wafer 4 and frame 2 and prevents water mixed with processing debris generated during division by the cutting blade 24 from penetrating between the thermocompression sheet 12 and the wafer 4. This prevents deterioration in the quality of the device chips 8. [Explanation of symbols]

[0126] 2: Frame 2a: Frame opening 2': Frame with seat 4: Wafer 4a: Surface of wafer 4b: Backside of wafer 12: Heat-sealed sheet 16: Frame unit 50: Frame unit forming device 52: Frame accommodation means 54: Wafer receiving means 56: Frame transport means 58: Thermocompression sheet arrangement means 60: Activation means 62: Frame sheet conveying means 64: Wafer carrying means 66: Frame unit forming means 68: Cassette storage means 84: Frame table 142: Frame unit forming table 212: Cassette 232: Wafer activation means

Claims

1. A frame unit forming method for forming a frame unit that integrates a wafer and a frame having an opening in the center for accommodating the wafer, comprising: a placing step of placing a wafer in the opening of the frame; a frame unit forming step of arranging a thermocompression sheet around the outer periphery of the wafer and the frame to integrate the wafer and the frame with the thermocompression sheet to form a frame unit; At least The frame unit forming method includes an activation step, prior to the frame unit forming step, of subjecting the surface of the thermocompression bonding sheet, which is to be attached to the wafer and frame, to plasma treatment or corona treatment to activate it.

2. 2. The method for forming a frame unit according to claim 1, wherein in said activation step, the surface of the wafer to be placed on the thermocompression sheet and the surface of the frame are activated by plasma treatment or corona treatment.

3. 2. The method for forming a frame unit according to claim 1, wherein the activation step comprises performing atmospheric pressure plasma treatment.

4. A frame unit forming apparatus for forming a frame unit by placing a wafer in an opening of a frame having an opening at the center for accommodating the wafer, and using a thermocompression bonding sheet, the wafer storage means for storing a plurality of frames, the wafer storage means for storing a plurality of wafers, the frame transport means for carrying out the frames from the frame storage means and placing them on a frame table, the thermocompression sheet placing means for placing a thermocompression sheet on the frame placed on the frame table, the frame sheet transport means for transporting the frame on which the thermocompression sheet has been placed to a frame unit forming table, the wafer carrying-out means for carrying out the wafers from the wafer storage means and transporting them to the frame unit forming table, the frame unit forming means for forming a frame unit by integrating the frame on which the thermocompression sheet has been placed and transported to the frame unit forming table with the wafer, and the cassette storage means for storing the frame unit in a cassette, The frame unit forming device is provided with activation means for subjecting the thermocompression sheet on the side to be disposed on the frame by the thermocompression sheet disposing means to plasma treatment or corona treatment.

5. 5. A frame unit forming apparatus according to claim 4, further comprising wafer activation means for subjecting the wafer transferred to said frame unit forming table to plasma treatment or corona treatment.

Images