Optical module

Abstract

To provide an optical module that enables the miniaturization of optical transmitters and the like.SOLUTION: An optical module has an optical semiconductor light emitting element, a heat-insulating member made of either glass or ceramic, mechanically connected to a first surface side of the semiconductor light emitting element, and a mounting section positioned on a second surface side of the heat-insulating member, where the region corresponding to the optical circuit portion of the optical circuit board is arranged.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to optical modules. [Background technology]

[0002] Patent Document 1 discloses an optical module that includes a chip carrier that mounts a tunable laser element that emits laser light and a temperature detection element, a photodetector that detects the laser light output from the tunable laser element, a temperature control element that mounts the chip carrier and the photodetector element, and a housing that houses the temperature control element and has a window through which the laser light is output. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2020-13831 Summary of the Invention [Problem to be solved by the invention]

[0004] An optical transmitter or optical transceiver (hereinafter referred to as an optical transmitter, etc.) used in optical communications includes a semiconductor light-emitting element, such as a semiconductor laser element, and an optical modulation unit that modulates the light emitted from the semiconductor light-emitting element. Generally, within the housing of an optical transmitter, etc., the light emitted from the semiconductor light-emitting element is guided to the optical modulation unit by an optical fiber. Meanwhile, there is an increasing demand for miniaturization of optical transmitters, etc. With a structure in which an optical fiber is built into the housing, it is difficult to miniaturize an optical transmitter, etc.

[0005] An object of the present disclosure is to provide an optical module that can reduce the size of an optical transmitter or the like. [Means for solving the problem]

[0006] An optical module according to one embodiment of the present disclosure includes a semiconductor light-emitting element, a heat-insulating member made of either glass or ceramic and mechanically connected to the semiconductor light-emitting element on a first surface side, and a mounting section located on a second surface side of the heat-insulating member, in which an area corresponding to an optical circuit section of an optical circuit board is disposed. [Effects of the Invention]

[0007] According to the present disclosure, an optical module that can reduce the size of an optical transmitter or the like can be provided. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a plan view showing an optical transceiver according to a first embodiment of the present disclosure. [Figure 2] FIG. 2 is a perspective view showing the peripheral structure of the optical module and the photonic IC. [Figure 3] FIG. 3 is a perspective view showing the peripheral structure of the optical module and the photonic IC. [Figure 4] FIG. 4 is a cutaway perspective view showing the optical module together with a housing provided in the optical transceiver. [Figure 5] FIG. 5 is a side cross-sectional view showing the optical module together with the housing. [Figure 6] FIG. 6 is a perspective view showing the configuration of the optical module as seen from the heat insulating member. [Figure 7] FIG. 7 is a plan view showing the configuration of the optical module as seen from the heat insulating member. [Figure 8] FIG. 8 is a side view of the optical module. [Figure 9] FIG. 9 is an enlarged schematic diagram showing the surrounding structure of the condenser lens and the light guide member. [Figure 10] FIG. 10 is a plan view showing an optical transceiver according to the second embodiment of the present disclosure. [Figure 11] FIG. 11 is an enlarged perspective view of the optical module. [Figure 12] FIG. 12 is an enlarged perspective view of the optical module. DETAILED DESCRIPTION OF THE INVENTION

[0009] [Description of the embodiments of the present disclosure] First, the contents of the embodiments of the present disclosure will be listed and explained. [1] An optical module according to one embodiment of the present disclosure includes a semiconductor light-emitting element, a heat insulating member made of either glass or ceramic and mechanically connected to the semiconductor light-emitting element on a first surface side, and a mounting section located on a second surface side of the heat insulating member, in which an area corresponding to an optical circuit section of an optical circuit board is disposed.

[0010] [2] The optical module of [1] above may further comprise a temperature control structure that is thermally connected to the semiconductor light emitting element and includes a first plate, a second plate, and a Peltier element disposed therebetween.

[0011] [3] In the optical module of [2] above, the surface of the temperature control structure on which the semiconductor light emitting element is mounted may be disposed opposite to the heat insulating member with a space therebetween.

[0012] [4] An optical module according to one embodiment of the present disclosure includes an insulating plate made of either glass or ceramic and mechanically connected to a semiconductor light-emitting element on a first surface side thereof, a mounting section located on a second surface side of the insulating plate in an area overlapping with the semiconductor light-emitting element and in which an area corresponding to an optical circuit section of an optical circuit board is disposed, an optical circuit board disposed on the mounting section, and an optical coupling section that optically couples the semiconductor light-emitting element and the optical circuit board.

[0013] [5] The optical module of [4] above may further comprise a temperature control structure that is thermally connected to the semiconductor light emitting element and includes a first plate, a second plate, and a Peltier element disposed therebetween.

[0014] [6] In the optical module of [5] above, the first plate of the temperature control structure may be joined to face the heat insulating plate, and the semiconductor light emitting element may be placed on the surface of the first plate opposite to the heat insulating plate.

[0015] [Details of the embodiments of the present disclosure] Specific examples of the present disclosure will be described below with reference to the drawings. Note that the present invention is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims. In the following description, the same elements in the description of the drawings will be given the same reference numerals, and duplicate explanations will be omitted.

[0016] [First embodiment] 1 is a plan view showing an optical transceiver 1A according to a first embodiment of the present disclosure. The optical transceiver 1A of this embodiment includes an optical transmitter and an optical receiver. To this end, the optical transceiver 1A includes a substrate 2, a base 3, a laser diode driver (LDD) 5, a transimpedance amplifier (TIA) 6, a digital signal processor (DSP) 7, multiple terminals 8, an optical fiber 9a, an optical fiber 9b, an optical module 10A, and a photonic IC 20 (optical circuit board). The substrate 2 is a plate-like member having a planar shape, such as a rectangle. The substrate 2 is made of, for example, resin. The multiple terminals 8 are arranged in a row along a first short side 2a of the substrate 2. The base 3 is disposed on the substrate 2 and fixed to the substrate 2. The base 3 is a plate-like member having a planar shape, such as a rectangle. The base 3 is made of, for example, a glass epoxy laminate or a ceramic laminate. The optical fibers 9a and 9b are disposed on the substrate 2, closer to the second short side 2b opposite the first short side 2a. The optical fiber 9a outputs transmitted light from the optical transmitter to the outside of the optical transceiver 1A. The optical fiber 9b inputs received light from the outside of the optical transceiver 1A to the optical receiver.

[0017] The photonic IC 20 is disposed on the base 3 in a region closer to the second short side 2b. The photonic IC 20 is a device having an optical circuit section in which an optical waveguide, a photodiode, an optical modulator, and the like are integrated on, for example, a silicon substrate or an InP substrate. One end of each of the optical fibers 9a and 9b is connected to the photonic IC 20. The photonic IC 20 inputs the transmitted light modulated by the optical modulator into the optical fiber 9a. To this end, the photonic IC 20 has an optical port for inputting the unmodulated light to be input to the optical modulator. The photonic IC 20 may have a wavelength locking mechanism including an etalon filter. Furthermore, the photonic IC 20 converts the received light received from the optical fiber 9b into a current signal using a photodiode.

[0018] The LDD 5 incorporates a driver circuit for driving the optical modulator of the photonic IC 20. The TIA 6 converts the current signal output from the photodiode of the photonic IC 20 into a voltage signal. The LDD 5 and the TIA 6 are arranged side by side in an area on the base 3 near the first short side 2a. The LDD 5 and the TIA 6 are electrically connected to corresponding terminals 8 among the multiple terminals 8 via wiring embedded in the substrate 2.

[0019] The DSP 7 incorporates a large-scale integrated circuit that drives the photonic IC 20 to process high-speed signals. The DSP 7 is disposed in an area on the base 3 near the first short side 2a, and is aligned with the photonic IC 20 in the direction along the long side of the substrate 2. The DSP 7 is electrically connected to a corresponding one of the multiple terminals 8 via wiring embedded in the substrate 2.

[0020] The optical module 10A inputs unmodulated light, which is input to the optical modulator, to an optical port of the photonic IC 20. The optical module 10A is disposed in an area on the base 3 near the second short side 2b, and is aligned with the LDD 5 and the TIA 6 in the direction along the long side of the substrate 2.

[0021] 2 and 3 are perspective views showing the peripheral structure of the optical module 10A and the photonic IC 20. As shown in these figures, the LDD 5 and the TIA 6 are covered and protected by a cover 31 (shown in phantom lines in the figures).

[0022] The optical module 10A includes a temperature control structure 14, a heat insulating member 4, and a support member 17. The temperature control structure 14 includes a first plate 14a and a second plate 14b that face each other. The first plate 14a and the second plate 14b are parallel to each other. The temperature control structure 14 further includes a Peltier element 14c disposed between the first plate 14a and the second plate 14b. The Peltier element 14c transfers heat from the first plate 14a to the second plate 14b.

[0023] The heat insulating member 4 is a plate-shaped member, such as a ceramic plate or a glass plate. The ceramic is, for example, alumina. The thermal conductivity of glass is approximately 1.0 W / mK, and the thermal conductivity of alumina is 2 to 3 W / mK. The heat insulating member 4 is disposed on the opposite side of the first plate 14a from the second plate 14b. The heat insulating member 4 has a first surface 4a and a second surface 4b. The first surface 4a faces the first plate 14a of the temperature control structure 14. The second surface 4b faces away from the first surface 4a. In one example, the second surface 4b is parallel to the first surface 4a. The second surface 4b faces the photonic IC 20. In other words, the photonic IC 20 has an optical circuit section (including a modulator, a waveguide, etc.) and is disposed on the second surface 4b of the heat insulating member 4 facing the semiconductor light emitting element 11. That is, the optical module 10A has a mounting section located on the second surface 4b side of the heat insulating member 4, where an area corresponding to the optical circuit section of the photonic IC 20 is disposed. The reason for providing the heat insulating member 4 is as follows. The optical circuit section of the photonic IC 20 (optical circuit board) controls its optical characteristics by controlling the electrical or thermal refractive index. When aiming for miniaturization by arranging the optical circuit section so that it overlaps the semiconductor light emitting element 11, the semiconductor light emitting element 11 and the photonic IC 20 are mechanically connected directly or indirectly. However, this thermal coupling results in a non-negligible effect of heat generated by the photonic IC 20 on the semiconductor light emitting element 11, or the effect of heat generated by the semiconductor light emitting element 11 on the photonic IC 20. When a temperature control structure 14 (TEC) is disposed to control the temperature of the semiconductor light emitting element 11, the temperature of the temperature control structure 14 may affect the photonic IC 20.

[0024] That is, the heat insulating member 4 has a platform for placing the photonic IC 20. This makes it possible to prevent heat generated from the photonic IC 20 from being transferred to the semiconductor light emitting element 11, thereby suppressing temperature changes in the semiconductor light emitting element 11 due to the heat, and achieving wavelength stability. In addition to tunable LD, CW, EML, etc. can be used for the semiconductor light emitting element 11.

[0025] The support member 17 supports the heat insulating member 4 and the second plate 14b at a distance from each other. The support member 17 may have a shape that surrounds various optical components (described below) mounted on the first plate 14a. In this case, the optical components mounted on the first plate 14a are hermetically sealed by the heat insulating member 4, the second plate 14b, and the support member 17.

[0026] FIG. 4 is a cutaway perspective view showing the optical module 10A together with a housing 40 included in the optical transceiver 1A. FIG. 5 is a side cross-sectional view showing the optical module 10A together with the housing 40. The housing 40 houses the substrate 2 and all components arranged on the substrate 2 (including the optical module 10A and the photonic IC 20). The housing 40 has a top plate 41 and a bottom plate 42. The optical transceiver 1A further includes a thermal interface material (TIM) 33 sandwiched between the top plate 41 and the second plate 14b of the housing 40. As shown in the figure, the optical transceiver 1A may also include a fiber holding unit 32 that holds the ends of the optical fibers 9a and 9b by sandwiching them. The fiber holding unit 32 is fixed to the side surface of the photonic IC 20, thereby connecting the optical fibers 9a and 9b to the photonic IC 20.

[0027] FIG. 6 is a perspective view showing the configuration of the optical module 10A as seen from the heat insulating member 4. FIG. 7 is a plan view showing the configuration of the optical module 10A as seen from the heat insulating member 4. Note that the heat insulating member 4 is not shown in FIGS. 6 and 7. FIG. 8 is a side view of the optical module 10A. As shown in these figures, the optical module 10A includes a semiconductor light emitting element 11, a collimating lens 12, an isolator 13, a mirror member 15, a carrier 16, a condensing lens 21, and a light guiding member 22. The semiconductor light emitting element 11, the collimating lens 12, the isolator 13, the mirror member 15, and the carrier 16 are mounted on a first plate 14a and are disposed between the first plate 14a and the heat insulating member 4.

[0028] The semiconductor light-emitting element 11 is mounted on a carrier 16 and is thermally connected to the first plate 14a via the carrier 16. The surface of the temperature control structure 14 on which the semiconductor light-emitting element 11 is mounted faces the heat insulating member 4 and is disposed with a space therebetween. The semiconductor light-emitting element 11 emits light in a direction intersecting the thickness direction of the first plate 14a. The semiconductor light-emitting element 11 is, for example, a semiconductor laser element, and the light emitted from the semiconductor light-emitting element 11 is, for example, laser light. The semiconductor laser element may be a wavelength-tunable type, a continuous light-emitting type, or an EML (Electro-absorption Modulator Integrated Laser Diode) that integrates an electro-absorption optical modulator. The temperature of the semiconductor light-emitting element 11 is controlled by the temperature control structure 14 so that the emission wavelength of the semiconductor light-emitting element 11 is a predetermined wavelength. The carrier 16 is provided with a plurality of wirings connected to the semiconductor light-emitting element 11.

[0029] The collimating lens 12 is mounted on the first plate 14a and optically coupled to the semiconductor light emitting element 11. The collimating lens 12 collimates the light emitted from the semiconductor light emitting element 11. The mirror member 15 is optically coupled to the semiconductor light emitting element 11 via the collimating lens 12 and folds back the optical path of the light emitted from the semiconductor light emitting element 11. The isolator 13 is optically coupled to the semiconductor light emitting element 11 via the collimating lens 12 and the mirror member 15. The isolator 13 prevents the light emitted from the semiconductor light emitting element 11 from returning to the semiconductor light emitting element 11.

[0030] The condensing lens 21 and the light-guiding member 22 are disposed outside the first plate 14a and outside the support member 17 when viewed in the thickness direction of the first plate 14a. The condensing lens 21 is disposed on the first surface 4a of the heat insulating member 4 and fixed to the first surface 4a. The condensing lens 21 is optically coupled to the isolator 13 through an opening formed in the support member 17. When the support member 17 hermetically seals the semiconductor light-emitting element 11, the collimating lens 12, and the isolator 13, a window member 18 is provided in the opening of the support member 17 to hermetically seal the opening. The light-guiding member 22 is optically coupled to the semiconductor light-emitting element 11 via the collimating lens 12, the mirror member 15, the isolator 13, and the condensing lens 21. The light-guiding member 22 is disposed alongside the heat insulating member 4 in a direction intersecting the thickness direction of the first plate 14a (see FIG. 8). The light guide member 22 is fixed to the heat insulating member 4 .

[0031] 9 is an enlarged schematic diagram showing the surrounding structure of the condenser lens 21 and the light-guiding member 22. As shown in the figure, the condenser lens 21 is disposed on the optical path between the isolator 13 and the light-guiding member 22. The condenser lens 21 is fixed to the first surface 4a of the heat insulating member 4 with an adhesive 24. The condenser lens 21 condenses the light L emitted from the semiconductor light-emitting element 11 toward the light-guiding member 22.

[0032] The light-guiding member 22 guides light L propagating on the first surface 4a of the heat insulating member 4 (specifically, between the first surface 4a and the first plate 14a) onto the second surface 4b of the heat insulating member 4. The light-guiding member 22 of this embodiment includes a first portion 22a and a second portion 22b. The first portion 22a protrudes above the first surface 4a of the heat insulating member 4 and is fixed to the first surface 4a of the heat insulating member 4 with adhesive 25. The second portion 22b is formed integrally with the first portion 22a and is aligned with the heat insulating member 4 in a direction intersecting the thickness direction of the first plate 14a. The second portion 22b has a first mirror 22c and a second mirror 22d. The first mirror 22c reflects light L propagating on the first surface 4a in the thickness direction of the heat insulating member 4. The second mirror 22d reflects the light L reflected by the first mirror 22c toward the photonic IC 20 on the second surface 4b. The photonic IC 20 receives the light L guided by the light-guiding member 22 and modulates the light L. The second portion 22b is, for example, a member transparent to the wavelength of the light L, and is a prism having the first mirror 22c and the second mirror 22d that reflect the light L.

[0033] The following describes the effects achieved by the optical transceiver 1A and optical module 10A of the present embodiment described above. In the optical module 10A, the semiconductor light-emitting element 11 is mounted on the first plate 14a of the temperature control structure 14, and the first plate 14a is located on the heat insulating member 4. This prevents heat generated in the photonic IC 20 from being transferred to the semiconductor light-emitting element 11, thereby enabling optimal temperature control of the semiconductor light-emitting element 11. Furthermore, the light L emitted from the semiconductor light-emitting element 11 is guided from the first surface 4a to the second surface 4b of the heat insulating member 4 by the light-guiding member 22. As in the present embodiment, an optical component such as the photonic IC 20 serving as an optical modulator can be disposed on the second surface 4b of the heat insulating member 4. Therefore, the optical module 10A of the present embodiment does not require the use of an optical fiber to guide the light L emitted from the semiconductor light-emitting element 11 to the optical modulator, thereby enabling the optical transceiver 1A to be miniaturized.

[0034] As in this embodiment, the heat insulating member 4 may be a glass plate. Since glass has higher heat insulating properties than ceramic, in this case, the heat generated in the photonic IC 20 can be effectively prevented from being transmitted to the semiconductor light emitting element 11.

[0035] As in the present embodiment, the optical module 10A may include a condenser lens 21 that is disposed outside the first plate 14a when viewed in the thickness direction of the first plate 14a and condenses the light L emitted from the semiconductor light emitting element 11 toward the light guiding member 22. In this case, the light L emitted from the semiconductor light emitting element 11 can be made to enter the light guiding member 22 efficiently.

[0036] As in this embodiment, the light-guiding member 22 may be fixed to the heat-insulating member 4. In this case, the light-guiding member 22 can be easily integrated with other members (such as the semiconductor light-emitting element 11 and the temperature control structure 14).

[0037] As in the present embodiment, the light-guiding member 22 may have a first mirror 22c that reflects the light L propagating on the first surface 4a in the thickness direction of the heat insulating member 4, and a second mirror 22d that reflects the light L reflected by the first mirror 22c toward the second surface 4b. In this case, the light L emitted from the semiconductor light-emitting element 11 can be suitably guided from the first surface 4a to the second surface 4b of the heat insulating member 4.

[0038] The optical transmitter of this embodiment includes an optical module 10A and a photonic IC 20 that is disposed on the second surface 4b of the heat insulating member 4 and receives light L guided by the light-guiding member 22 and modulates the light L. According to this optical transmitter, the inclusion of the optical module 10A enables the optical transmitter to be miniaturized.

[0039] As in the present embodiment, the optical transmitter may include a housing 40 that houses the optical module 10A, and a heat dissipation sheet 33 sandwiched between the second plate 14b and the housing 40. In this case, heat generated in the semiconductor light emitting element 11 can be efficiently dissipated to the housing 40 through the temperature control structure 14.

[0040] As in the present embodiment, the optical transceiver 1A includes an optical transmitter having an optical module 10A and an optical receiver. By including the optical transmitter having the optical module 10A, the optical transceiver 1A can be made smaller.

[0041] [Second embodiment] 10 is a plan view showing an optical transceiver 1B according to a second embodiment of the present disclosure. The optical transceiver 1B according to this embodiment includes an optical module 10B instead of the optical module 10A according to the first embodiment. Other configurations of the optical transceiver 1B are the same as those of the optical module 10A.

[0042] 11 and 12 are enlarged perspective views of the optical module 10B. The optical module 10B inputs unmodulated light, which is input to the optical modulator, to an optical port of the photonic IC 20. The optical module 10B is disposed in an area on the base 3 near the second short side 2b, and is aligned with the LDD 5 and TIA 6 in the direction along the long side of the substrate 2.

[0043] The optical module 10B includes a heat insulating member 4 (heat insulating plate), a semiconductor light emitting element 11, a collimating lens 12, an isolator 13, and a temperature control structure 14. The heat insulating member 4 is a plate-shaped member, such as a ceramic plate or a glass plate, as in the first embodiment. The heat insulating member 4 has a first surface 4a and a second surface 4b. The second surface 4b faces away from the first surface 4a. In one example, the second surface 4b is parallel to the first surface 4a. The second surface 4b faces the photonic IC 20. In other words, the photonic IC 20 is disposed on the second surface 4b of the heat insulating member 4.

[0044] The temperature control structure 14 includes a first plate 14a and a second plate 14b facing each other. The first plate 14a and the second plate 14b are parallel to each other. The temperature control structure 14 further includes a Peltier element 14c disposed between the first plate 14a and the second plate 14b. The Peltier element 14c transfers heat from the first plate 14a to the second plate 14b. The first plate 14a is provided on the first surface 4a of the heat insulating member 4. In other words, the first plate 14a is joined to the heat insulating member 4 while facing each other. Furthermore, the first plate 14a has an area aligned with the Peltier element 14c in the direction along the long side of the substrate 2.

[0045] The semiconductor light emitting element 11 is placed on the surface of the first plate 14a opposite the heat insulating member 4, and is mounted on an area of ​​the first plate 14a aligned with the Peltier element 14c. In the illustrated example, the semiconductor light emitting element 11 is mounted on a carrier 16 provided on that area of ​​the first plate 14a. The semiconductor light emitting element 11 emits light in a direction intersecting the thickness direction of the first plate 14a.

[0046] The collimating lens 12 is mounted on the first plate 14a and optically coupled to the semiconductor light emitting element 11. The collimating lens 12 collimates the light emitted from the semiconductor light emitting element 11. The isolator 13 is optically coupled to the semiconductor light emitting element 11 via the collimating lens 12. The isolator 13 prevents the light emitted from the semiconductor light emitting element 11 from returning to the semiconductor light emitting element 11.

[0047] The optical module 10B further includes a condenser lens 21 and a light-guiding member 22. As in the first embodiment, the light-guiding member 22 is arranged alongside the heat insulating member 4 in a direction intersecting the plate thickness direction of the first plate 14a. The light-guiding member 22 is optically coupled to the semiconductor light-emitting element 11, and guides light that has propagated on the first surface 4a of the heat insulating member 4 onto the second surface 4b of the heat insulating member 4. The detailed configurations of the condenser lens 21 and the light-guiding member 22 are the same as those in the first embodiment.

[0048] In the optical module 10B of this embodiment, the semiconductor light-emitting element 11 is mounted on the first plate 14a of the temperature control structure 14, and the first plate 14a is located on the heat insulating member 4. This prevents heat generated in the photonic IC 20 from being transferred to the semiconductor light-emitting element 11, thereby enabling favorable temperature control of the semiconductor light-emitting element 11. Furthermore, the light emitted from the semiconductor light-emitting element 11 is guided from the first surface 4a to the second surface 4b of the heat insulating member 4 by the light-guiding member 22. An optical component such as the photonic IC 20 serving as an optical modulator can be disposed on the second surface 4b of the heat insulating member 4. Therefore, the optical module 10B of this embodiment does not require the use of an optical fiber to guide the light emitted from the semiconductor light-emitting element 11 to the optical modulator, thereby enabling the optical transceiver to be miniaturized.

[0049] The optical module according to the present disclosure is not limited to the above-described embodiment, and various other modifications are possible. For example, in the above-described embodiment, the photonic IC 20 is disposed on the second surface 4b of the heat insulating member 4, and light guided by the light-guiding member 22 is incident on the photonic IC 20. However, the component disposed on the second surface 4b of the heat insulating member 4 is not limited to the photonic IC 20. It is also possible to employ a grading coupler system in which a hole is drilled in the heat insulating member 4 and light from the semiconductor light emitting element 11 is coupled to an optical waveguide formed on the photonic IC 20.

[0050] Furthermore, in the above embodiment, an example is shown in which the light-guiding member 22 has a first mirror 22c and a second mirror 22d, but the configuration of the light-guiding member is not limited to this as long as it is possible to guide light from the first surface 4a to the second surface 4b of the heat-insulating member 4. [Explanation of symbols]

[0051] 1A, 1B...Optical transceiver 2...Substrate 2a...First short side 2b...Second short side 3...Bass 4...Insulating material 4a...Side 1 4b…Second side 5...Laser diode driver (LDD) 6...Transimpedance amplifier (TIA) 7...Digital signal processor (DSP) 8...Terminal 9a, 9b...Optical fiber 10A, 10B...Optical module 11...Semiconductor light emitting device 12...Collimating lens 13...Isolator 14...Temperature control structure 14a...1st board 14b…Second board 14c...Peltier element 15...Mirror component 16...Career 17...Support member 18...Window material 21...Condenser lens 22...Light guide member 22a...Part 1 22b…Second part 22c…1st mirror 22d…2nd mirror 24,25...Adhesive 31...Cover 32...Fiber holding part 33...Heat dissipation sheet 40…Case 41...Tabletop 42…Bottom plate 20...Photonic IC L…Light

Claims

1. a semiconductor light-emitting element; a heat insulating member made of glass or ceramic and mechanically connected to the semiconductor light emitting element on the first surface side; an optical module having a mounting section located on the second surface side of the heat insulating member, in which an area corresponding to the optical circuit section of the optical circuit board is disposed.

2. 2. The optical module according to claim 1, further comprising a temperature control structure thermally connected to the semiconductor light emitting element, the temperature control structure including a first plate, a second plate, and a Peltier element disposed therebetween.

3. 3. The optical module according to claim 2, wherein a surface of said temperature control structure on which said semiconductor light emitting element is mounted faces said heat insulating member and is spaced apart from said heat insulating member.

4. a heat insulating plate made of glass or ceramic and mechanically connected to the semiconductor light emitting element on the first surface side; a mounting portion located on the second surface side of the heat insulating plate in an area overlapping with the semiconductor light emitting element, the mounting portion having an area corresponding to an optical circuit portion of an optical circuit board; an optical circuit board disposed on the mounting section; an optical coupling portion that optically couples the semiconductor light emitting element and the optical circuit board; An optical module having:

5. 5. The optical module according to claim 4, further comprising a temperature control structure thermally connected to the semiconductor light emitting element, the temperature control structure including a first plate, a second plate, and a Peltier element disposed therebetween.

6. the first plate of the temperature control structure is coupled to the heat insulating plate in a face-to-face relationship; 6. The optical module according to claim 5, wherein the semiconductor light emitting element is mounted on a surface of the first plate opposite to the heat insulating plate.

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