High-frequency module and communication device

Abstract

To provide a high-frequency module capable of improving isolation between a transmitting component and an electronic component.SOLUTION: A high-frequency module 1 includes a mounting board 70, a transmitting component 75, an electronic component 76, and metal members 72 and 73. The transmitting component 75 is disposed on the mounting board 70. The electronic component 76 is also disposed on the mounting board 70 and handles signals in a frequency band that at least partially overlaps the frequency band of harmonic components of a transmission signal generated by the transmitting component 75. The metal members 72 and 73 are disposed near at least one of the transmitting component 75 and the electronic component 76 and have an electrical length that is 1 / 2 or 1 / 4 the wavelength of the harmonic components.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention generally relates to a high frequency module and a communication device, and more particularly to a high frequency module including a transmitting component and an electronic component, and a communication device including the high frequency system. [Background technology]

[0002] The front-end module described in Patent Document 1 includes a module substrate (mounting substrate), a power amplifier (transmission component) for LB (Low Band) of the 3GPP standard, and a low-noise amplifier (electronic component) for MB (Mid Band) of the 3GPP standard. The power amplifier for LB and the low-noise amplifier for MB are arranged on the same module substrate. In this front-end module, in carrier aggregation, transmission of a transmission signal in the LB band and reception of a reception signal in the MB band may be performed simultaneously. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] US Patent Application Publication No. 2019 / 0115946 Summary of the Invention [Problem to be solved by the invention]

[0004] In the front-end module described in Patent Document 1, the LB power amplifier and the MB low-noise amplifier may be arranged close to each other on the same module substrate. In such an arrangement, when a transmission signal in the LB band and a reception signal in the MB band are simultaneously transmitted, for example, the LB power amplifier emits a second or third harmonic (harmonic component) of the LB band transmission signal to the surrounding area. The emitted second or third harmonic is then superimposed as noise on the MB band reception signal flowing through the MB low-noise amplifier. As a result, the reception sensitivity of the MB band reception signal deteriorates.

[0005] In view of the above problems, an object of the present invention is to provide a high-frequency module and a communication device that can improve isolation between a transmitting component and an electronic component. [Means for solving the problem]

[0006] A high-frequency module according to one aspect of the present invention includes a mounting board, a transmitting component, an electronic component, and a metal member. The transmitting component is disposed on the mounting board. The electronic component is disposed on the mounting board and handles signals in a frequency band that at least partially overlaps with the frequency band of harmonic components of a transmission signal generated by the transmitting component. The metal member is disposed near at least one of the transmitting component and the electronic component and has an electrical length that is 1 / 2 or 1 / 4 the wavelength of the harmonic components.

[0007] A communication device according to one aspect of the present invention includes the high-frequency module and a signal processing circuit, the signal processing circuit being connected to the high-frequency module and processing a high-frequency signal. [Effects of the Invention]

[0008] The high-frequency module and communication device according to the present invention have the advantage of being able to improve isolation between the transmitting component and the electronic component. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a block diagram of a high-frequency module and a communication device according to the first embodiment. [Figure 2] FIG. 2 is an explanatory diagram illustrating an example of the arrangement of the main parts of the high-frequency module. [Figure 3] FIG. 3 is an explanatory diagram illustrating an example of the arrangement of the main parts of a high-frequency module according to a sixth modification of the first embodiment. [Figure 4] FIG. 4 is an explanatory diagram illustrating an example of a circuit connected between a metal member and a ground electrode in the high-frequency module. [Figure 5] FIG. 5 is an explanatory diagram illustrating another example of a circuit connected between a metal member and a ground electrode in the high-frequency module. [Figure 6] FIG. 6 is an explanatory diagram illustrating another example of a circuit connected between a metal member and a ground electrode in the high-frequency module. [Figure 7] FIG. 7 is an explanatory diagram illustrating another example of a circuit connected between a metal member and a ground electrode in the high-frequency module. [Figure 8] FIG. 8 is an explanatory diagram for explaining a metal member according to a seventh modification of the first embodiment. [Figure 9] FIG. 9 is an explanatory diagram for explaining a metal member according to Modification 8 of Embodiment 1. In FIG. [Figure 10] FIG. 10 is an explanatory diagram illustrating an example of the arrangement of main components of the high-frequency module according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] (Embodiment 1) A high-frequency module 1 and a communication device 100 including a power amplifier according to a first embodiment will be described in detail with reference to the drawings.

[0011] (1) Background In recent years, communication devices such as mobile phones have become compatible with multiple wireless communication systems (e.g., LTE (Long Term Evolution), a registered trademark), Bluetooth (registered trademark), Wi-Fi (registered trademark), NR (New Radio), and GNSS (Global Navigation Satellite System)), and the available frequency bands for communication are continuously expanding. Meanwhile, there is a demand for miniaturization of communication devices. This miniaturization has resulted in narrower spacing between multiple signal paths corresponding to different frequency bands within communication devices, and narrower spacing between multiple electronic components corresponding to different frequency bands. This can cause degradation of wireless performance in electronic components due to the influence of harmonic components transmitted from other electronic components used for different wireless communication systems. For example, harmonic components generated during communication in the Cellular LB (Low Band) band may be superimposed on signals in the Cellular MB (Middle Band) band and Cellular UHB (Ultra High Band) band, degrading communication quality during, for example, ENDC (E-UTRAN New-radio Dual Connectivity) communication. For this reason, it is necessary to ensure isolation between electronic components used in different wireless communication systems.

[0012] (2) Overview 2, the high-frequency module 1 according to the first embodiment includes a mounting board 70, a transmitting component 75, an electronic component 76, and metal members 72 and 73. The transmitting component 75 is disposed on the mounting board 70. The electronic component 76 is also disposed on the mounting board 70 and handles signals in a frequency band that at least partially overlaps with the frequency band of harmonic components of a transmission signal generated by the transmitting component 75. The metal members 72 and 73 are disposed near at least one of the transmitting component 75 and the electronic component 76 (the transmitting component 75 in the example of FIG. 2), and have an electrical length that is ½ or ¼ the wavelength of the harmonic components.

[0013] According to this configuration, the metal members 72 and 73 can improve the isolation between the transmitting component 75 and the electronic component 76. That is, the metal members 72 and 73 can prevent the harmonic components transmitted from the transmitting component 75 from affecting the signal flowing through the electronic component 76 as noise.

[0014] (3) Configuration of communication device As shown in FIG. 1, the communication device 100 is a communication device including a high-frequency module 1. The communication device 100 is, for example, a mobile terminal (e.g., a smartphone), but is not limited to a mobile terminal and may be, for example, a wearable terminal (e.g., a smart watch). The high-frequency module 1 is, for example, a module that is compatible with the 4G (fourth generation mobile communication) standard and the 5G (fifth generation mobile communication) standard. The 4G standard is, for example, 3GPP (registered trademark, Third Generation Partnership Project) or the LTE standard. The 5G standard is, for example, 5G NR. The high-frequency module 1 is a module that is compatible with carrier aggregation and dual connectivity.

[0015] In addition to the high-frequency module 1, the communication device 100 further includes a signal processing circuit 2 and an antenna 3.

[0016] The high-frequency module 1 is configured to amplify a reception signal (high-frequency signal) received by the antenna 3 and output the amplified signal to the signal processing circuit 2. The high-frequency module 1 is also configured to amplify a transmission signal (high-frequency signal) output from the signal processing circuit 2 and transmit the amplified signal from the antenna 3. The high-frequency module 1 is controlled by the signal processing circuit 2, for example.

[0017] The signal processing circuit 2 is connected to the high-frequency module 1 and configured to process a received signal output from the high-frequency module 1. The signal processing circuit 2 is also configured to process a transmission signal to be output to the high-frequency module 1. The signal processing circuit 2 includes an RF (Radio Frequency) signal processing circuit 21 and a baseband signal processing circuit 22.

[0018] The RF signal processing circuit 21 is, for example, an RFIC (Radio Frequency Integrated Circuit), and performs signal processing on high-frequency signals (transmission signals and reception signals). The RF signal processing circuit 21 performs signal processing such as down-conversion on the reception signals output from the high-frequency module 1, and outputs the results to the baseband signal processing circuit 22. The RF signal processing circuit 21 also performs signal processing such as up-conversion on the transmission signals output from the baseband signal processing circuit 22, and outputs the results to the high-frequency module 1.

[0019] The baseband signal processing circuit 22 is, for example, a BBIC (Baseband Integrated Circuit). The baseband signal processing circuit 22 outputs the received signal output from the RF signal processing circuit 21 to the outside. This output signal (received signal) can be used, for example, as an image signal for image display or as an audio signal for communication. The baseband signal processing circuit 22 also generates a transmission signal from a baseband signal (for example, an audio signal and an image signal) input from the outside, and outputs the generated transmission signal to the RF signal processing circuit 21.

[0020] (4) Configuration of high-frequency module 1 The high-frequency module 1 performs communication using a plurality of different communication bands. The plurality of communication bands are, for example, the LB (Low Band), MB (Mid Band), and HB (High Band). As shown in Fig. 1, the high-frequency module 1 includes a plurality of external terminals 10a to 10d and a plurality of electronic components. In the example of Fig. 1, the plurality of electronic components include a switch 20, matching circuits 31, 32, 51, and 52, a transmit filter 41, a receive filter 42, a power amplifier 61, and a low-noise amplifier 62.

[0021] The external terminal 10a is an antenna terminal to which the antenna 3 is connected. The external terminal 10b is connected to an output section (not shown) of the signal processing circuit 2 and is an input terminal for inputting a transmission signal processed by the signal processing circuit 2 to the high-frequency module 1. The external terminal 10c is connected to an input section (not shown) of the signal processing circuit 2 and is an output terminal for outputting a reception signal processed by the high-frequency module 1 to the input section of the signal processing circuit 2. The external terminal 10d is a ground terminal for maintaining the ground electrodes of each of the plurality of electronic components at ground potential. The external terminal 10d is electrically connected to a ground external to the high-frequency module 1 and is maintained at ground potential.

[0022] In the first embodiment, "A is connected to B" does not necessarily mean that A is directly connected to B, but also means that A is indirectly connected to B via another electronic component. Furthermore, "A is connected to B" means that A and B are electrically connected (i.e., electrically connected).

[0023] The switch 20 is, for example, an antenna switch. The switch 20 selects a connection destination of the external terminal 10a from among a plurality of filters (a transmit filter 41 and a receive filter 42 in the example of FIG. 1). The switch 20 is, for example, a switch IC (Integrated Circuit). The switch 20 is controlled by, for example, the signal processing circuit 2. The switch 20 has a common terminal 20a and a plurality of (two in the example of FIG. 1) select terminals 20b and 20c. The common terminal 20a can be selectively connected to at least one of the plurality of select terminals 20b and 20c. The common terminal 20a is connected to the external terminal 10a. The select terminal 20b is connected to an output section 41b (described later) of the transmit filter 41 via a matching circuit 31. The select terminal 20c is connected to an input section 42a (described later) of the receive filter 42 via a matching circuit 32.

[0024] The transmit filter 41 has a pass band that includes the transmission band of the first communication band. The first communication band is, for example, the LB band. The transmit filter 41 has an input unit 41a and an output unit 41b. The input unit 41a is connected to the output unit 61b of the power amplifier 61 via a matching circuit 51. The output unit 41b is connected to the selection terminal 20b of the switch 20 via a matching circuit 31. The transmit filter 41 receives a signal (transmission signal) from the input unit 41a, restricts the input signal to a signal in the transmission band of the first communication band, passes the signal, and outputs the passed signal from the output unit 41b.

[0025] The receive filter 42 has a pass band that includes the receive band of the second communication band. The second communication band is, for example, the MB band or the HB band. The pass band of the second communication band overlaps at least a portion of the frequency band of the harmonic components of the transmit signal of the first communication band. The "harmonic components of the transmit signal" refers to a signal having a frequency that is N times the frequency of the transmit signal (N: an integer of 2 or greater). The receive filter 42 has an input unit 42a and an output unit 42b. The input unit 42a is connected to the selection terminal 20c of the switch 20 via the matching circuit 32. The output unit 42b is connected to the input unit 62a of the low-noise amplifier 62 via the matching circuit 52. The receive filter 42 receives a signal (receive signal) from the input unit 42a, limits the input signal to a signal in the receive band of the second communication band, and outputs the passed signal from the output unit 42b.

[0026] The power amplifier 61 amplifies a signal (transmission signal) input to the high-frequency module 1 from the signal processing circuit 2 via the external terminal 10b. The power amplifier 61 is connected between the external terminal 10b and the transmission filter 41. The power amplifier 61 has an input section 61a and an output section 61b. The input section 61a is connected to the external terminal 10b. The output section 61b is connected to the input section 41a of the transmission filter 41 via the matching circuit 51. The power amplifier 61 amplifies the signal (transmission signal) input to the input section 61a and outputs the amplified signal from the output section 61b.

[0027] The low-noise amplifier 62 amplifies the output signal (received signal) of the receive filter 42. The low-noise amplifier 62 is connected between the external terminal 10c and the receive filter 42. The low-noise amplifier 62 has an input section 62a and an output section 62b. The input section 62a is connected to the output section 42b of the receive filter 42 via the matching circuit 52. The output section 62b is connected to the external terminal 10c. The low-noise amplifier 62 amplifies the signal (received signal) input to the input section 62a and outputs the amplified signal from the output section 62b.

[0028] The matching circuit 31 is a circuit for achieving impedance matching between the selection terminal 20b of the switch 20 and the transmit filter 41. The matching circuit 31 is connected between the selection terminal 20b of the switch 20 and the transmit filter 41.

[0029] The matching circuit 32 is a circuit for achieving impedance matching between the selection terminal 20c of the switch 20 and the receive filter 42. The matching circuit 32 is connected between the selection terminal 20c of the switch 20 and the receive filter 42.

[0030] The matching circuit 51 is a circuit for achieving impedance matching between the transmit filter 41 and the power amplifier 61. The matching circuit 51 is connected between the transmit filter 41 and the power amplifier 61.

[0031] The matching circuit 52 is a circuit for achieving impedance matching between the receiving filter 42 and the low-noise amplifier 62. The matching circuit 52 is connected between the receiving filter 42 and the low-noise amplifier 62.

[0032] (5) Operation of the high-frequency module

[0033] (5-1) Transmission behavior When the high-frequency module 1 is transmitting, the common terminal 20a is connected to the selection terminal 20b in the switch 20. A transmission signal is input to the external terminal 10b from the signal processing circuit 2. The transmission signal input to the external terminal 10b passes through the power amplifier 61, the matching circuit 51, the transmission filter 41, the matching circuit 31, the switch 20, and the external terminal 10a in this order, and is then transmitted from the antenna 3.

[0034] (5-2) Receiving operation When the high-frequency module 1 receives a signal, the common terminal 20a is connected to the selection terminal 20c of the switch 20. Then, the received signal is received by the antenna 3. The received signal received by the antenna 3 passes through the external terminal 10a, the switch 20, the matching circuit 32, the receiving filter 42, the matching circuit 52, the low-noise amplifier 62, and the external terminal 10c in this order, and is then output to the signal processing circuit 2.

[0035] (6) Example of high-frequency module structure 2, the high-frequency module 1 further includes a mounting substrate 70, a first resin member 71 (resin member), metal members 72 and 73, a second resin member 74, and an external shielding layer (not shown), in addition to the above-mentioned electronic components and external terminals 10a to 10d. In the example of FIG. 2, only the area of ​​the mounting substrate 70 where the transmitting component 75 and the electronic component 76 are arranged is cut out and shown.

[0036] The mounting substrate 70 is a substrate on which the above-described electronic components are arranged (mounted). The mounting substrate 70 has, for example, a rectangular flat plate shape when viewed from a plane in the thickness direction D1 of the mounting substrate 70. The mounting substrate 70 is, for example, a resin multilayer substrate. Note that the mounting substrate 70 is not limited to a resin multilayer substrate, and may be, for example, a printed wiring board, an LTCC (Low Temperature Co-fired Ceramics) substrate, or an HTCC (High Temperature Co-fired Ceramics) substrate.

[0037] The mounting substrate 70 has a first main surface 70a and a second main surface 70b. The first main surface 70a and the second main surface 70b are main surfaces that face each other in the thickness direction D1 of the mounting substrate 70. The above-mentioned electronic components are arranged on the first main surface 70a of the mounting substrate 70. In the example of FIG. 2, of the above-mentioned electronic components, only a transmitting component 75 and an electronic component 76 (described later) are illustrated. More specifically, a plurality of pad electrodes are provided on the first main surface 70a of the mounting substrate 70. The above-mentioned electronic components are arranged on the first main surface 70a of the mounting substrate 70 by connecting the external electrodes of the above-mentioned electronic components to the above-mentioned pad electrodes by solder. A plurality of external terminals 10a to 10d of the high-frequency module 1 are arranged on the second main surface 70b of the mounting substrate 70. The above-mentioned pad electrodes are connected to the above-mentioned external terminals 10a to 10c via wiring electrodes (e.g., via electrodes and conductor layers) provided on the mounting substrate 70.

[0038] The mounting substrate 70 includes a ground layer therein. The ground layer is electrically connected to the external terminal 10d. The external terminal 10d is a ground terminal electrically connected to a ground external to the high-frequency module 1. By connecting the ground layer to the external ground via the external terminal 10d, the potential of the ground layer is maintained at the ground potential. The ground layer is electrically connected to the ground electrodes of each of the plurality of electronic components.

[0039] The plurality of pad electrodes includes a ground electrode 70g connected to the ground layer.

[0040] The mounting board 70 is, for example, a board with a single-sided mounting structure in which the plurality of electronic components are mounted on a first main surface 70a of the mounting board 70. In the example of Fig. 2, as an example, only a transmitting component 75 and an electronic component 76 are illustrated among the plurality of electronic components.

[0041] The transmitting component 75 is disposed on the first main surface 70a of the mounting board 70. The transmitting component 75 is one of the plurality of electronic components used to process a transmission signal transmitted from the antenna 3, and is an electronic component provided in a transmission path between the external terminal 10b and the external terminal 10a. In the first embodiment, the transmitting component 75 is any one of the power amplifier 61, the matching circuit 51, the transmission filter 41, and the matching circuit 31. In the example of FIG. 2, it is assumed that the transmitting component 75 is, for example, the power amplifier 61. A transmission signal in the first communication band flows through the transmitting component 75. The transmitting component 75 processes (e.g., amplifies) the transmission signal in the first transmission band. The transmitting component 75 has, for example, a rectangular parallelepiped shape.

[0042] More specifically, the transmitting component 75 includes a plurality of first external electrodes (not shown) and a first component body 75a. The first component body 75a is a portion of the transmitting component 75 other than the plurality of first external electrodes, and includes a first circuit section that controls the function of the transmitting component 75. The first component body 75a has, for example, a rectangular parallelepiped shape. The first circuit section is electrically connected to the plurality of first external electrodes. Each of the plurality of first external electrodes is electrically connected to one of the plurality of pad electrodes of the mounting board 70. The plurality of first external electrodes are provided on the back surface of the first component body 75a. The back surface of the first component body 75a is the main surface of the first component body 75a that faces the mounting board 70.

[0043] The transmitting component 75 has a top surface 75t and an outer peripheral surface 75s. The top surface 75t is the main surface of the transmitting component 75 (more specifically, the first component body 75a) on the side opposite the mounting board 70. The top surface 75t has, for example, a rectangular shape. The outer peripheral surface 75s is the outer peripheral surface that surrounds the top surface 75t of the transmitting component 75 (more specifically, the first component body 75a).

[0044] The electronic component 76 is disposed on the first main surface 70a of the mounting board 70. The electronic component 76 is, for example, a receiving component. The receiving component is, among the plurality of electronic components, an electronic component used to process a reception signal received by the antenna 3, and is an electronic component provided in a reception path between the external terminal 10c and the external terminal 10a. In the first embodiment, the receiving component is, for example, one of the matching circuit 32, the reception filter 42, the matching circuit 52, and the low-noise amplifier 62. In the example of FIG. 2, the electronic component 76 is assumed to be, for example, the low-noise amplifier 62. The electronic component 76 handles a reception signal in the second communication band (i.e., a reception signal in a frequency band that at least partially overlaps with the frequency band of the harmonic components of the transmission signal generated by the transmission component 75). The electronic component 76 processes (for example, amplifies) the reception signal in the second communication band.

[0045] More specifically, the electronic component 76 includes a second component body 76a and a plurality of second external electrodes (not shown). The second component body 76a is the portion of the electronic component 76 other than the plurality of second external electrodes. The second component body 76a includes a second circuit section that controls the functions of the electronic component 76. The second circuit section is electrically connected to the plurality of second external electrodes. The second component body 76a has, for example, a rectangular parallelepiped shape. The plurality of second external electrodes are provided on a back surface of the second component body 76a. The back surface of the second component body 76a is the main surface of the second component body 76a that faces the mounting board 70. Each of the plurality of second external electrodes is electrically connected to one of the plurality of pad electrodes of the mounting board 70.

[0046] The electronic component 76 is arranged adjacent to the transmitting component 75, for example. Here, "A is arranged adjacent to B" means that no other electronic component is arranged between A and B. Therefore, in a plan view of the mounting board 70 in the thickness direction D1, no other electronic component is arranged between the transmitting component 75 and the electronic component 76. However, the electronic component 76 does not have to be arranged adjacent to the transmitting component 75. In other words, another electronic component may be arranged between the electronic component 76 and the transmitting component 75.

[0047] The first resin member 71 is made of resin. The first resin member 71 is provided on the surface of at least one of the transmitting component 75 and the electronic component 76 (the transmitting component 75 in the example of FIG. 2). Here, "A is provided on the surface of B" may mean that A is provided on the entire surface of B, or that A is provided on a part of the surface of B. In the example of FIG. 2, the first resin member 71 is provided on the entire surface of the transmitting component 75.

[0048] As described below, metal members 72 and 73 are disposed on the surface of the first resin member 71. That is, the first resin member 71 is interposed between the transmitting component 75 and the metal members 72 and 73. As a result, the first resin member 71 ensures a certain degree of spacing between the transmitting component 75 and the metal members 72 and 73. Because the first resin member 71 ensures a certain degree of spacing between the transmitting component 75 and the metal members 72 and 73, it is possible to improve the noise attenuation function of the metal members 72 and 73, which will be described later, compared to when the metal members 72 and 73 are disposed directly on the surface of the transmitting component 75.

[0049] The first resin member 71 has a top surface portion 71t and an outer peripheral portion 71s. The top surface portion 71t is provided on a top surface 75t of the transmitting component 75. The top surface portion 71t has, for example, a rectangular shape. In the example of FIG. 2, the top surface portion 71t is provided on the entire top surface 75t of the transmitting component 75. The outer peripheral portion 71s is provided on an outer peripheral surface 75s of the transmitting component 75. In the example of FIG. 2, the outer peripheral portion 71s is provided on the entire outer peripheral surface 75s of the transmitting component 75.

[0050] The metal members 72 and 73 are members for shielding harmonic components of a transmission signal generated by the transmitting component 75, which are harmonic components emitted from the transmitting component 75. The metal members 72 and 73 are made of a metal or an alloy. The metal members 72 and 73 are disposed near at least one of the transmitting component 75 and the electronic component 76 (the transmitting component 75 in the example of FIG. 2).

[0051] Here, "the metal members 72 and 73 are disposed near the transmitting component 75" means that, when the metal members 72 and 73 are not disposed between the transmitting component 75 and the electronic component 76, the metal members 72 and 73 are provided on the surface of the transmitting component 75 directly or indirectly via the first resin member 71. Furthermore, "the metal members 72 and 73 are disposed near the transmitting component 75" means that, when the metal members 72 and 73 are disposed between the transmitting component 75 and the electronic component 76, the metal members 72 and 73 may be provided on the surface of the transmitting component 75 directly or indirectly via the first resin member 71, or may not be provided on the surface of the transmitting component 75 directly or indirectly via the first resin member 71. That is, in this case, the metal members 72 and 73 may be disposed anywhere between the transmitting component 75 and the electronic component 76. Here, "A is disposed between B and C" means that, in a plan view of the mounting substrate 70 seen in the thickness direction D1, at least one of a plurality of line segments connecting an arbitrary point in the region B and an arbitrary point in the region C passes through the region A. In the example of FIG. 2, the metal members 72 and 73 are disposed on the surface of the first resin member 71.

[0052] The metal members 72 and 73 have an electrical length that is 1 / 2 or 1 / 4 the wavelength of the harmonic component of the transmission signal flowing through the transmitting component 75. That is, in embodiment 1, the metal members 72 and 73 have different electrical lengths. The metal members 72 and 73 are, for example, linear (or strip) shaped.

[0053] More specifically, the metal member 72 has an electrical length that is 1 / 2 the wavelength of the harmonic component. The metal member 72 mainly blocks signals of frequency components included in the harmonic component that correspond to the 1 / 2 electrical length. The metal member 72 has a first end 72a and a second end 72b. The length of the metal member 72 along the metal member 72, and the length between the first end 72a and the second end 72b, is 1 / 2 the electrical length of the harmonic component. The metal member 72 is disposed on a top surface 71t of the first resin member 71. That is, the metal member 72 is disposed on a top surface 75t of the transmitting component 75 via the top surface 71t. The first end 72a and the second end 72b of the metal member 72 are each open ends and disposed on the top surface 71t of the first resin member 71. The metal member 72 is disposed so as to linearly connect the first end 72a and the second end 72b. The metal member 72 is disposed, for example, along one of the four outer sides (for example, the long side) of the top surface portion 71t.

[0054] The metal member 73 has an electrical length that is ¼ of the wavelength of the harmonic component. The metal member 73 mainly blocks signals of frequency components included in the harmonic component that correspond to the ¼ electrical length. The metal member 73 has a first end 73a and a second end 73b. The length of the metal member 73 is along the length of the metal member 73, and the length between the first end 73a and the second end 73b is ¼ of the electrical length of the harmonic component. The metal member 73 is disposed on at least the outer peripheral portion 71s of the top surface portion 71t and the outer peripheral portion 71s of the first resin member 71. In the example of FIG. 2, the metal member 73 is disposed across the top surface portion 71t and the outer peripheral portion 71s. The first end 73a of the metal member 73 is connected to a ground electrode 70g provided on the first main surface 70a of the mounting substrate 70. The first end 73a is electrically connected to the ground layer of the mounting board 70 via the ground electrode 70g. That is, the first end 73a is electrically connected to an external ground via the ground layer. The second end 73b of the metal member 73 is an open end and is disposed on the outer circumferential portion 71s or the top surface 71t of the first resin member 71. That is, the second end 73b is disposed on the outer circumferential surface 75s or the top surface 75t of the transmitting component 75 via the first resin member 71. In the example of FIG. 2, the second end 73b is disposed on the top surface 71t of the first resin member 71. That is, the second end 73b is disposed on the top surface 75t of the transmitting component 75 via the top surface 71t.

[0055] The metal member 73 has a first portion 73u and a second portion 73v.

[0056] The first portion 73u is a portion that is disposed on the outer peripheral portion 71s of the first resin member 71 (i.e., a portion that is disposed on the outer peripheral surface 75s of the transmitting component 75 with the first resin member 71 interposed therebetween). One end of the first portion 73u is a first end 73a. The other end of the first portion 73u is connected to the other end of the second portion 73v, which will be described later. The first portion 73u extends linearly from the first end 73a to the top surface portion 71t of the first resin member 71 in the outer peripheral portion 71s of the first resin member 71 along the thickness direction of the transmitting component 75 (i.e., the same direction as the thickness direction D1 of the mounting board 70).

[0057] The second portion 73v is a portion that is disposed on the top surface 71t of the first resin member 71 (i.e., a portion that is disposed on the top surface 75t of the transmitting component 75 via the first resin member 71). One end of the second portion 73v is the second end 73b. The other end of the second portion 73v is connected to the other end of the first portion 73u. The second portion 73v extends in a straight line from the other end of the second portion 73v to the second end 73b. In the example of FIG. 2, the second portion 73v extends parallel to one side (e.g., a long side) of the four outer sides of the top surface 71t of the first resin member 71.

[0058] That is, the metal member 73 extends linearly along the thickness direction of the transmitting component 75 from the first end 73a to the top surface 71t at the outer peripheral portion 71s of the first resin member 71, bends at the boundary between the outer peripheral portion 71s and the top surface 71t, and extends linearly along the top surface 71t to the second end 73b.

[0059] The second resin member 74 is a resin member for sealing the plurality of electronic components and the metal components 72, 73 arranged on the first main surface 70a of the mounting substrate 70. The second resin member 74 is provided on the first main surface 70a of the mounting substrate 70 so as to cover the plurality of electronic components and the metal components 72, 73. In the example of Fig. 2, only the portions of the second resin member 74 that cover the transmitting component 75, the electronic component 76, the first resin member 71, and the metal components 72, 73 are shown.

[0060] The external shield layer (not shown) is a member for electromagnetically shielding the inside and outside of the high-frequency module 1. The external shield layer is made of a conductive member (e.g., copper). The external shield layer is provided to cover the surface of the second resin member 74. The surface of the second resin member 74 includes a top surface 74t and an outer peripheral surface of the second resin member 74. The top surface 74t of the second resin member 74 is the main surface of the second resin member 74 on the side opposite to the mounting board 70. The outer peripheral surface of the second resin member 74 is the outer peripheral surface that surrounds the top surface 74t of the second resin member 74. The external shield layer is electrically connected to the ground layer of the mounting board 70 at the outer peripheral surface of the mounting board 70. As a result, the potential of the external shield layer is maintained at ground potential via the ground layer.

[0061] (7) Noise attenuation function of metal members 72 and 73 The noise attenuation function of the metal members 72 and 73 will now be described. When a transmission signal flows through the transmitting component 75, harmonic components of the transmission signal are emitted from the transmitting component 75 into the surrounding space. A reception signal flows through the electronic component 76, the frequency band of which at least partially overlaps with the frequency band of the harmonic components. Therefore, the harmonic components emitted from the transmitting component 75 may be superimposed as noise on the reception signal flowing through the electronic component 76. However, the harmonic components emitted from the transmitting component 75 are shielded by the metal members 72 and 73 arranged near the transmitting component 75. This shielding reduces the propagation of the harmonic components around the transmitting component 75. Therefore, the harmonic components are reduced from being superimposed as noise on the reception signal flowing through the electronic component 76. In other words, the noise superimposed on the reception signal flowing through the electronic component 76 is attenuated.

[0062] (8) Effects As described above, the high-frequency module 1 according to the first embodiment includes a mounting board 70, a transmitting component 75, an electronic component 76, and metal members 72 and 73. The transmitting component 75 is disposed on the mounting board 70. The electronic component 76 is also disposed on the mounting board 70 and handles signals in a frequency band that at least partially overlaps with the frequency band of harmonic components of a transmission signal generated by the transmitting component 75. The metal members 72 and 73 are disposed near at least one of the transmitting component 75 and the electronic component 76 and have an electrical length that is ½ or ¼ the wavelength of the harmonic components.

[0063] According to this configuration, the metal members 72 and 73 can improve the isolation between the transmitting component 75 and the electronic component 76. As a result, the metal members 72 and 73 can prevent the harmonic components from being superimposed as noise on the signal flowing through the electronic component 76.

[0064] In the high-frequency module 1 according to the first embodiment, the transmitting component 75 is the power amplifier 61. According to this configuration, the metal members 72 and 73 can improve the isolation between the power amplifier 61 (i.e., the electronic component that transmits the harmonic components most strongly) and the electronic component 76.

[0065] Moreover, the high-frequency module 1 according to the first embodiment further includes a first resin member 71 (resin member). The first resin member 71 is provided on a surface of at least one of the components (the transmitting component 75 in the first embodiment). The metal members 72 and 73 are disposed on the surface of the first resin member 71. This configuration improves the degree of freedom in arranging the metal members 72 and 73. It also ensures a gap between the metal members 72 and 73 and the at least one of the components. This further improves the isolation between the transmitting component 75 and the electronic component 76 provided by the metal members 72 and 73. That is, it further improves the noise attenuation function of the metal members 72 and 73.

[0066] Furthermore, in the high-frequency module 1 according to the first embodiment, the metal member 72 has an electrical length that is 1 / 2 the wavelength of the harmonic component. The metal member 72 is a linear member with both ends 72a, 72b that are open. With this configuration, the metal member 72 has an electrical length that is 1 / 2 the wavelength of the harmonic component, and both ends 72a, 72b can be open, which improves the degree of freedom in the placement positions of the metal members 72, 73.

[0067] Furthermore, in the high-frequency module 1 according to the first embodiment, the metal member 73 has an electrical length that is ¼ of the wavelength of the harmonic component. The metal member 73 is a linear member having a first end 73a (one end) connected to a ground electrode 70g provided on the mounting substrate 70. This configuration allows the noise attenuation effect of the metal member 73 to be effectively exerted.

[0068] Furthermore, in the high-frequency module 1 according to the first embodiment, the metal member 73 has a first portion 73u. The first portion 73u is indirectly disposed on the outer peripheral surface of at least one of the transmitting component 75 and the electronic component 76 (the transmitting component 75 in the first embodiment) via the first resin member 71. The first portion 73u extends linearly along the thickness direction D1 of the at least one of the components. This configuration allows the noise attenuation function of the metal member 73, which has an electrical length ¼ the wavelength of the harmonic component, to be effectively exhibited.

[0069] Moreover, the high-frequency module 1 according to the first embodiment includes a plurality of metal members 72 and 73. With this configuration, the noise attenuation effect of the metal members 72 and 73 can be improved.

[0070] Furthermore, in the high-frequency module 1 according to the first embodiment, the plurality of metal members 72, 73 include two or more metal members 72, 73 having different electrical lengths. This configuration makes it possible to shield the plurality of frequency components included in the harmonic components (i.e., the plurality of frequency components corresponding to the different electrical lengths).

[0071] The communication device 100 according to the first embodiment includes a high-frequency module 1 and a signal processing circuit 2. The signal processing circuit 2 is connected to the high-frequency module 1 and processes high-frequency signals. With this configuration, it is possible to provide a communication device 100 that has the effects of the high-frequency module 1.

[0072] (9) Variations Modifications of the high-frequency module 1 according to the first embodiment will be described. In the following description, the same configurations as those in the first embodiment will be omitted, and the description may focus on the configurations that are different from those in the first embodiment. The following modifications may also be implemented in combination.

[0073] (9-1) Variation 1 In the first embodiment, the metal members 72 and 73 are illustrated as being linear. However, the metal member 72 may be curved, for example, in an S-shape or an arc, or may be bent. Similarly, the first portion 73u and the second portion 73v of the metal member 73 may each be curved, for example, in an S-shape or an arc, or may be bent.

[0074] (9-2) Variation 2 In the first embodiment, a case is exemplified in which a metal member 72 having an electrical length that is 1 / 2 the wavelength of the harmonic component and a metal member 73 having an electrical length that is 1 / 4 the wavelength of the harmonic component are provided. However, it is sufficient if at least one of the metal member 72 and the metal member 73 is provided. In other words, even if only the metal member 72 or only the metal member 73 is provided, it is possible to achieve the same effects as in the first embodiment.

[0075] (9-3) Variation 3 In the first embodiment, the metal members 72 and 73 are disposed near the transmitting component 75. However, the metal members 72 and 73 may be disposed near the electronic component 76 instead of near the transmitting component 75. In this case, the first resin member 71 is disposed on the surface of the electronic component 76 instead of on the surface of the transmitting component 75. The metal members 72 and 73 are disposed on the surface of the electronic component 76 via the first resin member 71. In this case, the same effects as those of the first embodiment can be achieved.

[0076] Furthermore, the metal members 72 and 73 may be arranged near the transmitting component 75 and also near the electronic component 76. In this case, the first resin member 71 is provided on the surface of the transmitting component 75 and also on the surface of the electronic component 76. In addition to being arranged near the transmitting component 75, the metal members 72 and 73 are also arranged on the surface of the electronic component 76 via the first resin member 71. In this case, the same effects as those of the first embodiment can be achieved.

[0077] (9-4) Variation 4 In the first embodiment, the metal members 72 and 73 are disposed near the transmitting component 75. However, the metal members 72 and 73 may be disposed between the transmitting component 75 and the electronic component 76. In this case, the metal members 72 and 73 do not need to contact the surfaces of either the transmitting component 75 or the electronic component 76. In this case, the same effect as in the first embodiment can be achieved. In the fourth modification, as in the first embodiment, the metal members can improve the isolation between the transmitting component 75 and the electronic component 76.

[0078] (9-5) Variation 5 In the first embodiment, the electronic component 76 is illustrated as a receiving component. However, the electronic component 76 may also be a transmitting component. In this case, the electronic component 76 as a transmitting component is a transmitting component through which a transmission signal flows, the frequency band of which at least partly overlaps with the frequency band of the harmonic components of the transmission signal flowing through the transmitting component 75.

[0079] The high-frequency module 1 according to Modification 5 is, for example, the high-frequency module 1 according to Embodiment 1, further including another transmission filter, another matching circuit, and another power amplifier corresponding to another communication band having a passband that at least partially overlaps with the passband of the first communication band. The electronic component 76, which is a transmission component in Modification 5, is, for example, any one of a plurality of electronic components (including the other power amplifier, the other matching circuit, and the other transmission filter) provided in a transmission path in which the other power amplifier, the other matching circuit, and the other transmission filter are provided.

[0080] The fifth modification has the effect of reducing the harmonic components transmitted from the transmitting component 75 from being superimposed as noise on the transmission signal flowing through the electronic component 76, which is a transmitting component.

[0081] (9-6) Variation 6 As shown in FIG. 3 , in Modification 6, in Embodiment 1, a first end 73a of a metal member 73 is connected to a ground electrode 70g of a mounting substrate 70 via a circuit 80. The circuit 80 is a circuit for adjusting (e.g., shortening) the electrical length of the metal member 73. The circuit 80 includes at least one of an inductor and a capacitor. The circuit 80 is configured as a single packaged circuit component (e.g., an SMD (Surface Mount Device)). The circuit 80 has an input end and an output end. The input end of the circuit 80 is connected to the first end 73a of the metal member 73. In the example of FIG. 3 , the input end of the circuit 80 is connected to the first end 73a of the metal member 73 via a pad electrode 70f provided on the first main surface 70a of the mounting substrate 70. The output end of the circuit 80 is connected to a ground electrode 70g provided on the first main surface 70a of the mounting substrate 70.

[0082] 4 to 7 show variations of the circuit configuration of the circuit 80. FIG.

[0083] 4 includes an input terminal 80a, which is the input terminal, an output terminal 80b, which is the output terminal, and an inductor L1. The input terminal 80a is connected to a first terminal 73a of the metal member 73. The output terminal 80b is connected to ground via a ground electrode 70g of the mounting substrate 70. The inductor L1 is connected in series between the input terminal 80a and the output terminal 80b.

[0084] 5 includes an input terminal 80a, which is the input terminal, an output terminal 80b, which is the output terminal, and a capacitor C1. The input terminal 80a is connected to a first terminal 73a of the metal member 73. The output terminal 80b is connected to ground via a ground electrode 70g of the mounting substrate 70. The capacitor C1 is connected in series between the input terminal 80a and the output terminal 80b.

[0085] 6 includes an input terminal 80a, which is the input terminal, an output terminal 80b, which is the output terminal, an inductor L1, and a capacitor C1. The input terminal 80a is connected to a first terminal 73a of the metal member 73. The output terminal 80b is connected to the ground via a ground electrode 70g of the mounting substrate 70. The inductor L1 and the capacitor C1 are connected in series between the input terminal 80a and the output terminal 80b.

[0086] 7 includes an input terminal 80a, which is the input terminal, an output terminal 80b, which is the output terminal, an inductor L1, and a capacitor C1. The input terminal 80a is connected to a first terminal 73a of the metal member 73. The output terminal 80b is connected to the ground via a ground electrode 70g of the mounting substrate 70. The inductor L1 and the capacitor C1 are connected in parallel with each other and are connected in series between the input terminal 80a and the output terminal 80b.

[0087] As described above, in the sixth modification, the first end 73a (one end) of the metal member 73 is connected to the ground electrode 70g via the circuit 80 including at least one of the inductor L1 and the capacitor C1. This configuration can shorten the electrical length of the metal member 73. As a result, the metal member 73 can be made smaller.

[0088] In addition, in Modification 6, the circuit 80 is configured as an SMD, but the circuit 80 may be provided inside the mounting substrate 70 or on the first main surface 70a using wiring electrodes provided inside the mounting substrate 70 or on the first main surface 70a.

[0089] (9-7) Variation 7 In the first embodiment, the high-frequency module 1 includes a plurality of metal members 72, 73 having different electrical lengths. However, as shown in FIG. 8, the high-frequency module 1 may include a plurality of metal members having the same electrical length. The example of FIG. 8 illustrates a case in which the high-frequency module 1 includes three metal members 72 having electrical lengths that are, for example, half the wavelength of the harmonic component. In the example of FIG. 8, the three metal members 72 are disposed on a top surface 71t of the first resin member 71. As an example, one of the three metal members 72 is disposed along one of the four outer sides (e.g., a short side) of the top surface 71t. Two of the three metal members 72 are disposed along another of the four outer sides (e.g., a long side) of the top surface 71t.

[0090] As described above, in Modification 7, the multiple metal members included in the high-frequency module 1 include two or more metal members (for example, metal member 72) that have the same electrical length. This configuration can enhance the function of blocking specific frequency components (frequency components that correspond to the same electrical length) included in the harmonic components.

[0091] (9-8) Variation 8 9, at least one of metal members 72 and 73 of Modification 8 is formed in a mesh shape. More specifically, the at least one metal member has a band-like outer shape and a mesh-like inner shape.

[0092] (Embodiment 2) A high-frequency module 1 according to the second embodiment will be described with reference to Fig. 10. In the following description, the same configuration as in the first embodiment will be omitted, and the description will focus on the configuration different from the first embodiment.

[0093] The high-frequency module 1 according to the second embodiment has the same configuration as the high-frequency module 1 according to the first embodiment, except that the first resin member 71 is omitted. The second embodiment will be described in detail below.

[0094] (1) Composition As described above, in the second embodiment, the first resin member 71 is omitted compared to the first embodiment. As a result, the metal members 72 and 73 are disposed on the transmitting component 75 in a state of contact with the surface of the transmitting component 75. In the second embodiment, the metal members 72 and 73 are disposed on the transmitting component 75 in a state of contact with the surface of the transmitting component 75, and are thereby disposed near the transmitting component 75.

[0095] More specifically, the metal member 72 is disposed on a top surface 75t of the transmitting component 75. That is, the first end 72a and the second end 72b of the metal member 72 are disposed on the top surface 75t of the transmitting component 75. The metal member 72 is disposed so as to connect the first end 72a and the second end 72b, for example, in a straight line. The metal member 72 is disposed, for example, along one side (for example, a long side) of the four outer sides of the top surface 75t.

[0096] The metal member 73 is disposed on at least the outer peripheral surface 75s of the top surface 75t and outer peripheral surface 75s of the transmitting component 75. In the example of FIG. 10, the metal member 73 is disposed across the top surface 75t and outer peripheral surface 75s of the transmitting component 75. A first end 73a of the metal member 73 is connected to a ground electrode 70g provided on the first main surface 70a of the mounting board 70. The first end 73a is electrically connected to the ground layer of the mounting board 70 via the ground electrode 70g. In other words, the first end 73a is electrically connected to an external ground via the ground layer. A second end 73b of the metal member 73 is disposed on the outer peripheral surface 75s or the top surface 75t of the transmitting component 75. In the example of FIG. 10, the second end 73b is disposed on the top surface 75t of the transmitting component 75. That is, the metal member 73 extends linearly along the thickness direction of the transmitting part 75 from the first end 73a to the top surface 75t on the outer peripheral surface 75s of the transmitting part 75, bends at the boundary between the outer peripheral surface 75s and the top surface 75t, and extends linearly along the top surface 75t to the second end 73b.

[0097] More specifically, the metal member 73 has a first portion 73u and a second portion 73v.

[0098] The first portion 73u is a portion disposed on an outer peripheral surface 75s of the transmitting component 75. One end of the first portion 73u is a first end 73a. The other end of the first portion 73u is connected to the other end (described below) of the second portion 73v. The first portion 73u extends linearly on the outer peripheral surface 75s of the transmitting component 75 from the first end 73a to a top surface 75t of the transmitting component 75 along the thickness direction of the transmitting component 75 (i.e., the same direction as the thickness direction D1 of the mounting board 70).

[0099] The second portion 73v is a portion disposed on the top surface 75t of the transmitting component 75. One end of the second portion 73v is the second end 73b. The other end of the second portion 73v is connected to the other end of the first portion 73u. The second portion 73v extends in a straight line from the other end of the second portion 73v to the second end 73b. In the example of FIG. 2, the second portion 73v extends parallel to one side (e.g., a long side) of the four outer sides of the top surface 75t of the transmitting component 75.

[0100] (2) Effects In the high-frequency module 1 according to the second embodiment, the same components as those of the high-frequency module 1 according to the first embodiment have the same effects as those of the high-frequency module 1 according to the first embodiment.

[0101] In the high-frequency module 1 according to the second embodiment, the metal members 72 and 73 are arranged in contact with at least one of the transmitting component 75 and the electronic component 76 (the transmitting component 75 in the second embodiment). This configuration can prevent the component on which the metal members 72 and 73 are arranged (i.e., the at least one of the components) from increasing in size.

[0102] Furthermore, in the high-frequency module 1 according to the second embodiment, the metal member 73 has a first portion 73u. The first portion 73u is disposed directly on the outer peripheral surface of at least one of the transmitting component 75 and the electronic component 76 (the transmitting component 75 in the second embodiment). The first portion 73u extends linearly along the thickness direction (the same direction as the thickness direction D1) of the at least one of the components. This configuration allows the noise attenuation function of the metal member 73, which has the ¼-times electrical length, to be effectively exhibited.

[0103] Although the first and second embodiments and their modifications have been described above, the first and second embodiments and their modifications may be combined and implemented.

[0104] (Aspect) The present specification discloses the following aspects.

[0105] A high-frequency module (1) of a first aspect includes a mounting board (70), a transmitting component (75), an electronic component (76), and metal members (72, 73). The transmitting component (75) is disposed on the mounting board (70). The electronic component (76) is disposed on the mounting board (70) and handles signals in a frequency band that at least partially overlaps with the frequency band of harmonic components of a transmission signal generated by the transmitting component (75). The metal members (72, 73) are disposed near at least one of the transmitting component (75) and the electronic component (76), and have an electrical length that is 1 / 2 or 1 / 4 the wavelength of the harmonic components.

[0106] According to this configuration, the metal members (72, 73) can improve isolation between the transmitting component (75) and the electronic component (76), thereby preventing the harmonic components from being superimposed as noise on the signal flowing through the electronic component (76).

[0107] In the high frequency module (1) of the second embodiment, the transmitting component (75) in the first embodiment is a power amplifier (61).

[0108] According to this configuration, the metal members (72, 73) can improve isolation between the power amplifier (61) (that is, the electronic component that emits the strongest harmonic components) and the electronic component (76).

[0109] The high-frequency module (1) of the third aspect is the high-frequency module (1) of the first or second aspect, further including a resin member (71). The resin member (71) is provided on a surface of at least one of the components. The metal members (72, 73) are disposed on the surface of the resin member (71).

[0110] This configuration improves the degree of freedom in arranging the metal members (72, 73). It also ensures a sufficient distance between the metal members (72, 73) and at least one of the components. This further improves the isolation between the transmitting component (75) and the electronic component (76) provided by the metal members (72, 73).

[0111] In the high-frequency module (1) of the fourth aspect, in the first or second aspect, the metal members (72, 73) are arranged in contact with at least one of the components.

[0112] This configuration can prevent the components (at least one of the components) on which the metal members (72, 73) are disposed from increasing in size.

[0113] In a fifth aspect of the high-frequency module (1), in the third or fourth aspect, the metal members (72, 73) have an electrical length that is 1 / 2 the wavelength of the harmonic component. The metal member (72) is a linear member whose both ends (72a, 72b) are open.

[0114] According to this configuration, both ends (72a, 72b) of the metal member (72) having an electrical length half the wavelength of the harmonic component can be opened, thereby improving the degree of freedom in arranging the metal members (72, 73).

[0115] In the high-frequency module (1) of the sixth aspect, in the third or fourth aspect, the metal members (72, 73) have an electrical length that is ¼ of the wavelength of the harmonic component. The metal member (73) is a linear member connected to a ground electrode (70g) provided on the mounting board (70).

[0116] This configuration allows the metal member (73) to effectively exhibit its noise attenuation effect.

[0117] In the high-frequency module (1) of the seventh aspect, in the sixth aspect, the metal member (73) has a first portion (73u) disposed on the outer peripheral surface of the at least one component directly or indirectly via a resin member (71). The first portion (73u) extends linearly along the thickness direction (D1) of the at least one component.

[0118] This configuration allows the metal member (73) having a quarter electrical length to effectively exhibit its noise attenuation function.

[0119] The high-frequency module (1) of the eighth aspect is any one of the first to seventh aspects, and includes a plurality of metal members (72, 73) including the metal members (72, 73).

[0120] This configuration can improve the noise attenuation effect of the metal members (72, 73).

[0121] In a high-frequency module (1) of a ninth aspect, in the eighth aspect, the plurality of metal members includes two or more metal members (72, 73) having different electrical lengths.

[0122] According to this configuration, it is possible to block a plurality of frequency components (a plurality of frequency components corresponding to the different electrical lengths) included in the harmonic components.

[0123] In a high-frequency module (1) of a tenth aspect, in the eighth or ninth aspect, the plurality of metal members includes two or more metal members (72) having the same electrical length.

[0124] According to this configuration, it is possible to strengthen the function of blocking specific frequency components (frequency components corresponding to the same electrical length) included in the harmonic components.

[0125] In the high-frequency module (1) of the eleventh aspect, in the sixth or seventh aspect, one end (73a) of the metal member (73) is connected to the ground electrode (70g) via a circuit (80). The circuit (80) includes at least one of an inductor (L1) and a capacitor (C1).

[0126] This configuration allows the electrical length of the metal member (73) to be adjusted (for example, shortened).When the electrical length of the metal member (73) is shortened, the size of the metal member (73) can be reduced.

[0127] In the high-frequency module (1) of the twelfth aspect, in any one of the first to eleventh aspects, the metal members (72, 73) are arranged between the transmitting component (75) and the electronic component (76).

[0128] According to this configuration, the metal members (72, 73) can improve the isolation between the transmitting component (75) and the electronic component (76).

[0129] A communication device according to a thirteenth aspect includes the high-frequency module (1) according to any one of the first to twelfth aspects and a signal processing circuit (2). The signal processing circuit (2) is connected to the high-frequency module (1) and processes a high-frequency signal.

[0130] According to this configuration, a communication device (100) having the effect of the high frequency module (1) can be provided. [Explanation of symbols]

[0131] 1. High frequency module 2. Signal processing circuit 3 Antennas 10a~10d External terminals 20 Switch 20a common terminal 20b, 20c selection terminal 21 RF signal processing circuit 22 Baseband signal processing circuit 31,32,51,52 matching circuit 41 Transmission Filter 41a Input section 41b Output section 42 Receive Filter 42a Input section 42b Output section 61 Power Amplifier 61a Input section 61b Output section 62 Low-noise amplifier 62a Input section 62b Output section 70 Mounting board 70a First principal surface 70b 2nd principal surface 70f Pad electrode 70g ground electrode 71 First resin member (resin member) 71s outer periphery 71t Top section 72,73 Metallic parts 72a 1st end 73a 1st end (one end) 72b,73b 2nd end 73u 1st part 73v 2nd part 74 Second resin member 74t top 75 Transmission parts 75a First part body 75s outer surface 75t top 76 Electronic Components 76a Second part body 80 circuits 80a input terminal 80b output end 100 Communication equipment C1 capacitor D1 thickness direction L1 inductor

Claims

1. a mounting board; a transmitting component disposed on the mounting board; an electronic component disposed on the mounting board and handling signals in a frequency band that at least partially overlaps with a frequency band of harmonic components of a transmission signal generated by the transmitting component; a metal member disposed near at least one of the transmitting component and the electronic component, and having an electrical length that is 1 / 2 or 1 / 4 the wavelength of the harmonic component; High frequency module.

2. The transmitting component is a power amplifier. The high frequency module according to claim 1 .

3. a resin member provided on a surface of the at least one component, The metal member is disposed on the surface of the resin member. The high frequency module according to claim 1 .

4. The metal member is disposed in contact with the at least one component. The high frequency module according to claim 1 .

5. The metal member is a linear member having an electrical length that is 1 / 2 the wavelength of the harmonic component and both ends of which are open.

5. The high frequency module according to claim 3.

6. the metal member is a linear member having an electrical length that is ¼ of the wavelength of the harmonic component and one end of which is connected to a ground electrode provided on the mounting substrate; 5. The high frequency module according to claim 3.

7. the metal member has a first portion disposed on an outer peripheral surface of the at least one component directly or via a resin member; The first portion extends linearly along a thickness direction of the at least one component. The high frequency module according to claim 6.

8. A plurality of metal members including the metal member are provided. The high frequency module according to any one of claims 1 to 4.

9. the plurality of metal members include two or more metal members having different electrical lengths; The high frequency module according to claim 8 .

10. the plurality of metal members include two or more metal members having the same electrical length; The high frequency module according to claim 8 .

11. the one end of the metal member is connected to the ground electrode via a circuit including at least one of an inductor and a capacitor; The high frequency module according to claim 6.

12. the metal member is disposed between the transmitting component and the electronic component. The high frequency module according to any one of claims 1 to 4.

13. a high-frequency module according to any one of claims 1 to 4; a signal processing circuit connected to the high-frequency module and processing a high-frequency signal; Communication equipment.

Images