Wafer inspection device, chuck position measuring method and target

Abstract

To provide a wafer inspection device, a chuck position measuring method and a target that can improve the throughput.SOLUTION: A wafer inspection device 10 comprises a probe card 21, a chuck 22 which can electrically connect a wafer W to the probe card 21, a holding part 23 which holds the chuck 22, a target which is provided for the chuck 22, and an imaging part 25 which images the target. The target is formed larger than a movement allowance range of the chuck 22 relative to the holding part 23, and then can be imaged with the imaging part 25 fixed at a predetermined position. The position and angle of the chuck 22 are found based upon the imaged target.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a wafer inspection apparatus, a chuck position measuring method, and a target. [Background technology]

[0002] A multi-probing device is known that includes a test head used for wafer measurement and a head stage equipped with a probe card for conducting electrical signals to the wafer, and a chuck holding the wafer is detachably supported by an aligner so that the aligner can contact the chuck with the probe card held by the head stage. A multi-probing device can simultaneously test multiple wafers by providing multiple measurement chambers and making the chuck detachable from the head stage by the aligner (see, for example, Patent Document 1).

[0003] Here, for example, when the chuck is in an idle state where the power is cut off due to maintenance, an emergency power cut, etc., the chuck is held by a holding unit provided on the head stage. When the aligner goes to receive the held chuck, the imaging unit detects the mark on the back surface of the chuck and corrects the receiving position of the aligner. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-54318 Summary of the Invention [Problem to be solved by the invention]

[0005] Here, for example, the mark is formed as a small-diameter hole that can be imaged by the imaging unit. Therefore, if the chuck held by the holding unit moves significantly beyond the imaging range (field of view) of the imaging unit, the mark will also move significantly along with the chuck. Therefore, it is necessary to scan the moving range of the chuck with the imaging unit to detect the mark. This takes time to detect the mark, and there is room for improvement in terms of throughput.

[0006] The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to provide a wafer inspection apparatus, a chuck position measuring method, and a target that can improve throughput. [Means for solving the problem]

[0007] In order to solve the above problems, the present invention proposes the following means. <1> A wafer inspection apparatus according to one aspect of the present invention comprises a probe card mounted on a head stage, a chuck that holds a wafer and can electrically connect the wafer to the probe card, a holding section mounted below the head stage and that holds the chuck, a target mounted on the chuck, and an imaging section that images the target, wherein the target is formed larger than the allowable range of movement of the chuck relative to the holding section, thereby enabling the imaging section to image the target while the imaging section is fixed in a predetermined position, and the position and angle of the chuck are determined based on the target imaged by the imaging section.

[0008] According to the wafer inspection device, the target is formed larger than the allowable range of movement of the chuck relative to the holder. Therefore, with the imaging unit fixed in a predetermined position, the target can be imaged in one shot without scanning with the imaging unit. The position and angle of the chuck can be determined based on the target imaged by the imaging unit. This improves throughput.

[0009] <2> the above <1> In the wafer inspection device according to the present invention, the target may be provided on an imaging portion formed of a plate material separate from the chuck, and may have a plurality of marks each having holes with a diameter of 0.3 to 7 mm at 1 mm pitches.

[0010] According to the wafer inspection device, the imaged portion is provided on the chuck. The imaged portion is a separate member from the chuck. Therefore, costs can be reduced compared to when the target is provided directly on the chuck. Furthermore, the target has multiple marks. Therefore, by setting the arrangement and shape of the multiple marks so that the position and angle of the chuck can be measured, the position and angle of the chuck can be determined based on the marks captured by the imaging unit. This can improve throughput.

[0011] <3> the above <2> In the wafer inspection device according to the above, the imaged portion may have a surface to be imaged that has a sufficient reflectivity, and a black Mylar sheet may be provided on the opposite side of the surface to be imaged.

[0012] According to the wafer inspection device, the reflectivity of the imaged surface is ensured in the imaged portion. Also, a black Mylar sheet is provided on the opposite side of the imaged surface. Therefore, the mark can be reliably imaged by the imaging portion.

[0013] <4> A chuck position measuring method according to one aspect of the present invention is a chuck position measuring method in which a chuck is held by a holding part and a target provided on the chuck is imaged by an imaging part, and with the imaging part fixed in a predetermined position, the target, which is formed larger than the allowable range of movement of the chuck relative to the holding part, is imaged in one shot, and the position and angle of the chuck are determined based on the target imaged by the imaging part.

[0014] According to the chuck position measurement method, the target is formed larger than the allowable range of movement of the chuck relative to the holder. Therefore, with the imaging unit fixed in a predetermined position, the target can be imaged in one shot without scanning with the imaging unit. The position and angle of the chuck can be determined based on the target imaged by the imaging unit. This improves throughput.

[0015] <5> A target according to one aspect of the present invention is a target that holds a chuck in a holding portion and is imaged by an imaging portion to determine the position and angle of the chuck held in the holding portion, and is formed larger than the allowable range of movement of the chuck relative to the holding portion, so that it can be imaged by the imaging portion while the imaging portion is fixed in a predetermined position, and has a plurality of marks whose arrangement and shape are set so that the position and angle of the chuck can be measured.

[0016] According to the target, the target is formed larger than the allowable range of movement of the chuck relative to the holding part. The target also has multiple marks, and the arrangement and shape of the multiple marks are set so that the position and angle of the chuck can be measured. Therefore, with the imaging unit fixed in a predetermined position, the target can be imaged in one shot without scanning with the imaging unit. The position and angle of the chuck can be determined based on the marks imaged by the imaging unit. This improves throughput. [Effects of the Invention]

[0017] According to the present invention, it is possible to improve throughput. [Brief explanation of the drawings]

[0018] [Figure 1] 1 is a conceptual diagram showing a wafer inspection device provided in a multi-probing device according to an embodiment of the present invention. [Figure 2] FIG. 2 is a perspective view showing an aligner provided in the multi-probing device according to the embodiment. [Figure 3]FIG. 10 is a perspective view of a chuck provided on a head stage according to an embodiment, viewed from below. [Figure 4] FIG. 10 is a rear view showing a movement restricting portion provided in the chuck according to the embodiment. [Figure 5] FIG. 2 is a perspective view showing an imaged portion attached to a chuck according to the embodiment. [Figure 6] FIG. 6 is a plan view showing the imaged portion of FIG. 5. [Figure 7] 3A and 3B are conceptual diagrams illustrating the arrangement and shape of targets according to an embodiment. [Figure 8] 10A to 10D are conceptual diagrams showing the minimum configuration for capturing an image in one shot by an imaging unit according to an embodiment and determining a position. [Figure 9] FIG. 10 is a plan view showing an example in which the target according to the embodiment is used for teaching. [Figure 10] FIG. 10 is a rear view of the chuck of the comparative example as viewed from below. [Figure 11] FIG. 10 is a plan view showing an imaged portion of the first modified example. [Figure 12] FIG. 10 is a plan view showing an imaged portion of Modification 2. DETAILED DESCRIPTION OF THE INVENTION

[0019] A wafer inspection apparatus, a chuck position measuring method, and a target according to one embodiment of the present invention will be described below with reference to the drawings. Note that in the following embodiments, when the number, numerical value, amount, range, etc. of components are mentioned, they are not limited to a specific number, and may be more or less than a specific number, unless otherwise specified or when they are clearly limited to a specific number in principle.

[0020] Furthermore, when referring to the shape or positional relationship of components, etc., it includes things that are substantially similar or approximate to those shapes, etc., unless otherwise specified or when it is clearly considered otherwise in principle.

[0021] In addition, the drawings may exaggerate characteristic parts to make the features easier to understand, and the dimensional proportions of the components may not be the same as in reality. In addition, in cross-sectional views, hatching of some components may be omitted to make the cross-sectional structure of the components easier to understand.

[0022] <Multi-probing device> FIG. 1 is a conceptual diagram showing (one) wafer inspection device 10 of a multi-probing device. As shown in FIG. 1, the wafer inspection device 10 includes, for example, a housing 2, a plurality of test heads 3, and an aligner (XYZ axis unit) 4.

[0023] The housing 2 includes, for example, a plurality of head stages 12. For example, mounting holes 14 are provided in the head stages 12 at intervals in the longitudinal direction of the housing 2. Probe cards 21, which will be described later, are attached to the mounting holes 14. A plurality of test heads 3 are provided above the head stages 12. The test heads 3 are electrically connected to the probe cards 21, which will be described later.

[0024] FIG. 2 is a perspective view showing an aligner provided in the multi-probing device. As shown in FIGS. 1 and 2, the aligner 4 is provided below the head stage 12. The aligner 4 is movable in X, Y, and Z position directions and in the direction of angle T. The aligner 4 is equipped with a Z axis 18 that is movable in the direction of Z position and in the direction of angle T. The aligner 4 detachably supports a chuck 22 (described later) by, for example, vacuum suction or mechanical means. With the aligner 4 detachably supporting the chuck 22, the aligner 4 electrically connects each chip of the wafer W held by the chuck 22 to a probe card 21, and each chip is inspected by the test head 3.

[0025] <Wafer inspection equipment> FIG. 3 is a perspective view of the chuck provided on the head stage as seen from below. 1 to 3, the plurality of head stages 12 include a probe card 21, a chuck 22, a holding unit (for preventing the chuck from falling) 23, and an imaged unit 24. The wafer inspection device 10 also includes an image capturing unit 25 that is shared by one multi-probing device.

[0026] The probe card 21 is attached to the mounting hole 14 of the head stage 12 and is disposed below the test head 3. The probe card 21 is electrically connected to the test head 3. The probe card 21 is configured to be electrically connectable to the electrodes (both not shown) of each chip formed on the wafer W. With the electrodes of each chip on the wafer W electrically connected to the probe card 21, each chip on the wafer W is inspected by the test head 3.

[0027] The chuck 22 holds the wafer W by suction, for example, by vacuum suction. The chuck 22 is detachably supported by the aligner 4 and can be moved by the aligner 4 in XYZ position directions and in the direction of angle T. When the chuck 22 holds the wafer W, it can electrically connect a chip to a probe card 21 provided on the head stage 12. When the power is cut off, for example, due to maintenance or an emergency power shutdown, the chuck 22 is held by a holder 23, which will be described later.

[0028] FIG. 4 is a rear view showing a movement restricting portion provided on the chuck. As shown in FIGS. 3 and 4, the chuck 22 has a plurality of (four in this embodiment) movement restricting portions 31 around the back surface 22a. The movement restricting portions 31 are provided at predetermined intervals around the back surface 22a in the circumferential direction of the chuck 22. The movement restricting portions 31 are formed in a U-shape, with recesses 32 that open toward the outside in the radial direction of the chuck 22. A tip end 23a of a holding portion 23, which will be described later, is disposed in the recesses 32. In this embodiment, four movement restricting portions 31 are described as an example, but the number of movement restricting portions 31 can be selected as desired.

[0029] As shown in Fig. 3, the chuck 22 has a plurality of (three in this embodiment) receiving portions 34 around the periphery of the back surface 22a. Kinematic pins 37 are fitted into recesses 35 of the receiving portions 34. As shown in Fig. 2, the kinematic pins 37 are provided on the aligner 4. By fitting the kinematic pins 37 into the recesses 32 of the receiving portions 34, the chuck 22 is supported in a state where it is positioned on the aligner 4.

[0030] 1, 3, and 4, the holding portion 23 is provided on the underside of the head stage 12. The holding portion 23 holds the chuck 22 when the power is turned off due to maintenance, an emergency power shutdown, or the like. Specifically, the multiple holding portions 23 are arranged at predetermined intervals around the mounting hole 14 of the head stage 12 in the circumferential direction of the chuck 22. In the embodiment, an example will be described in which four multiple holding portions 23 are provided around the mounting hole 14 at 90-degree intervals, but the present invention is not limited to this.

[0031] The multiple holding parts 23 are arranged radially of the chuck 22 and are provided so as to be movable radially toward and away from each other around the mounting hole 14. The multiple holding parts 23 hold the chuck 22 when arranged radially close to each other. On the other hand, the multiple holding parts 23 allow the chuck 22 to be supplied and collected by the aligner 4 when arranged radially apart from each other.

[0032] 3 and 4, when the holder 23 holds the chuck 22, the holder 23 restricts the movement range of the chuck 22 by the movement restricting portion 31. Specifically, when the holder 23 holds the chuck 22, the tip 23a of the holder 23 is disposed in the recess 32 of the movement restricting portion 31. Therefore, the tip 23a of the holder 23 comes into contact with the recess 32 of the movement restricting portion 31, thereby restricting the movement range of the chuck 22. Hereinafter, the movement range of the chuck 22 restricted by the recess 32 of the movement restricting portion 31 may be referred to as the "allowable movement range of the chuck 22" relative to the holder 23.

[0033] FIG. 5 is a perspective view showing the imaged part attached to the chuck. As shown in Figures 3 and 5, for example, two imaged portions 24 are provided on the back surface 22a of the chuck 22, symmetrically about the center of the chuck 22. In the embodiment, an example in which two imaged portions 24 are provided on the back surface 22a of the chuck 22 will be described, but one imaged portion 24 may be provided in the center of the chuck 22 or in a location other than the center on the back surface 22a of the chuck 22. The imaged portion 24 is formed, for example, in a rectangular shape with four chamfered corners. The imaged portion 24 is not limited to a rectangular shape and can be formed in any shape.

[0034] The imaged portion 24 is formed, for example, from a separate member from the chuck 22. The imaged portion 24 is detachably fixed to the rear surface 22a of the chuck 22 by a fixing member such as a bolt 41. The imaged portion 24 is formed, for example, from a translucent plate material with a plate thickness of 0.3 mm. The reflectivity of the imaged surface 24a of the imaged portion 24 is ensured, for example, by electrolytic polishing. For example, a black Mylar sheet 43 is provided on the opposite side of the imaged surface 24a of the imaged portion 24.

[0035] 5, the imaged portion 24 has a target 45. The target 45 is formed to be larger than the allowable movement range of the chuck 22. The target 45 has a plurality of marks 46. By forming the target 45 to be larger than the allowable movement range of the chuck 22 and by having a plurality of marks 46 on the target 45, it is possible to hold a plurality of marks 46 within the imaging range of the imaging portion 25, which will be described later. That is, the marks 46 are provided at positions where they can be imaged when the imaging unit 25, which will be described later, is fixed at a predetermined position. Therefore, of the marks 46, the marks 46 necessary for measuring the position and angle of the chuck 22 can be imaged (detected) in one shot by the imaging unit 25.

[0036] The imaged portion 24 may have, for example, radially formed slits 48. By providing the slits 48 in the imaged portion 24, the center of the imaged portion 24 can be easily confirmed through the slits 48. This facilitates teaching, which will be described later. The direction of the slits 48 can be selected arbitrarily. For example, the slits 48 may be formed so as to intersect (orthogonal to) a straight line extending in the radial direction (see FIG. 6).

[0037] In the embodiment, an example will be described in which the imaged portion 24 is formed as a separate member from the chuck 22 and the mark 46 is provided on the imaged portion 24, but the target 45 may be provided directly on the chuck 22. The mark 46 is formed on the imaged portion 24 by, for example, etching, laser processing, laser marking, cutting, or the like.

[0038] 1 and 2, the imaging unit 25 can capture an image of the target 45 while being fixed at a predetermined position. For example, a needle-aligned camera (needle-aligned microscope) is used as the imaging unit 25. The imaging range (field of view) of the imaging unit 25 is small, for example, about 3 mm x 3 mm or 3 mm x 4 mm. The imaging unit 25 captures (detects) an image of the mark 46 of the target 45. The XYZ position and angle T of the chuck 22 are obtained based on the image of the mark 46 captured by the imaging unit 25. The receiving position of the aligner 4 is corrected based on the obtained XYZ position and angle T of the chuck.

[0039] <Mark> Next, the mark 46 of the target 45 will be described with reference to FIGS. FIG. 6 is a plan view showing the imaged portion of FIG. 7 is a conceptual diagram illustrating the arrangement and shape of the targets. In FIG. 7, the horizontal axis represents the pitch in the X direction, and the vertical axis represents the pitch in the Y direction. The values ​​from 0.3 to 0.7 represent the diameters of the marks 46. As shown in FIGS. 1, 6, and 7, the marks 46 captured by the imaging unit 25 are preferably circular, for example, so that they can be easily detected by the imaging unit 25. Since the imaging range of the imaging unit 25 is 3 mm x 3 mm or 3 mm x 4 mm, the marks 46 are preferably circular, with a diameter of 0.3 mm to 0.7 mm. The arrangement of the marks 46 is determined under the following conditions so that the marks 46 form a unique pattern. The marks 46 are arranged at lattice points with a 1 mm pitch in the X direction (0 mm, ±1.0 mm...±9.0 mm). The marks 46 are also arranged at lattice points with a 1 mm pitch in the Y direction (0 mm, ±1.0 mm...±9.0 mm).

[0040] Specifically, the target 45 has a mark 46 with a diameter of 0.7 mm at its center in the X direction. The target 45 has marks 46 with diameters of 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.6 mm, 0.5 mm, 0.4 mm, and 0.3 mm, with the center position as the reference. Furthermore, the target 45 has a mark 46 with a diameter of 0.7 mm provided at its center in the Y direction. The target 45 has marks 46 with diameters of 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.6 mm, 0.5 mm, 0.4 mm, and 0.3 mm provided with respect to the center position. Furthermore, a 0.4 mm mark 46 is provided in the square frame at the M1 position. A 0.5 mm mark 46 is provided in the square frame at the M2 position. A 0.6 mm mark 46 is provided in the square frame at the M3 position. A 0.7 mm mark 46 is provided in the square frame at the M4 position. Here, the centers of the marks 46 coincide with the center of the target 45 and the center of the imaged portion 24. Therefore, hereinafter, the center of the marks 46 may be referred to as the center of the target 45.

[0041] 8(a) to 8(d) are conceptual diagrams showing the minimum configuration for capturing an image in one shot with the imaging unit and determining the position. As shown in FIGS. 6, 7, and 8(a) to 8(d), the multiple marks 46 provided on the target 45 are arranged, for example, in a line. The multiple marks 46 have holes whose shapes (sizes) change in stages. The multiple marks 46 are arranged so that at least three marks 46 can be imaged within imaging ranges H1, H2, H3, and H4 of the imaging unit 25 (see FIG. 1). The three marks 46 will be described as marks 46a, 46b, and 46c. Marks 46a, 46b, and 46c can each be imaged in one shot by the imaging unit 25. Mark 46a indicates information about X. Mark 46b indicates information about the quadrant. Mark 46c indicates information about Y. The quadrant of mark 46b is determined by the 0.4 mm mark 46 at the M1 position, the 0.5 mm mark 46 at the M2 position, the 0.6 mm mark 46 at the M3 position, and the 0.7 mm mark 46 at the M4 position.

[0042] Here, the arrangement patterns of marks 46a, 46b, and 46c are shown in Table 1. The arrangement patterns of marks 46a, 46b, and 46c shown in Table 1 represent all patterns in which multiple marks 46 provided on target 45 can be imaged in one shot by imaging unit 25. All patterns that can be imaged are different from one another.

[0043] [Table 1]

[0044] Therefore, by capturing an image of the patterns of marks 46a, 46b, and 46c shown in Table 1 from among the multiple marks 46 provided on the target 45 with one shot by the imaging unit 25, the position and angle T of the target 45 can be measured.

[0045] That is, with the arrangement and shape of a plurality of marks 46 recorded in advance, the position and angle of the target 45 are calculated by comparing the arrangement and shape of the captured three marks 46 with the arrangement and shape of the pre-recorded marks 46. The XY position and angle T of the chuck 22 can be measured based on the position and angle of the target 45. That is, the XY position and angle T of the chuck 22 can be measured based on the marks 46 captured in one shot by the imaging unit 25 (see FIG. 1).

[0046] <Chuck position measurement method> Next, a chuck position measuring method for measuring the position of the chuck 22 in the wafer inspection device 10 will be described. First, a chuck position measuring method according to the embodiment will be described. As shown in FIG. 3, an example in which two targets 45 are provided on the chuck 22 in the wafer inspection apparatus 10 of the embodiment has been described, but an example in which one target 45 is provided on the chuck 22 in the chuck position measurement method of the embodiment will be described.

[0047] FIG. 9 is a plan view showing an example in which a target is used for teaching. 1, 3, and 9, first, before carrying out the chuck position measurement method, information necessary for measurement is recorded by teaching. Specifically, the chuck 22 is detachably supported on the Z axis 18 (see FIG. 2) of the aligner 4. The supported chuck 22 is transferred to the probe card 21 of the head stage 12 by the aligner 4. In this state, the XYZ position coordinates and angle T coordinate of the chuck 22 are recorded.

[0048] After recording the XYZ position coordinates and angle T coordinate, the chuck 22 is handed over to (held by) the holder 23 while maintaining the XYZ position coordinates and angle T coordinates. With the chuck 22 held by the holder 23, the image capture unit 25 captures an image of the mark 46 on the target 45, and the X1-Y1-Z1 position coordinates of the center of the target 45 are recorded. In addition, marks 46A at the four corners of the multiple marks 46 are detected. By detecting the marks 46A at the four corners, the angle T1 coordinate of the center of the target 45 is recorded. This completes teaching.

[0049] After teaching, the chuck position is measured. That is, when the chuck 22 is held by the holder 23 and is received by the aligner 4, the aligner 4 is moved to the X1-Y1-Z1 coordinates, and the imaging unit 25 captures (detects) an image of the mark 46 in one shot. Based on the arrangement of the marks 46 captured by the imaging unit 25, the center coordinates and angular coordinates of the target 45 are measured.

[0050] The difference between the measured center coordinates and angle coordinates of the target 45 and the X1, Y1, Z1 coordinates and angle T1 coordinates of the target 45 determined by teaching is calculated. The calculated difference is added to the transfer coordinates (XYZ position coordinates and angle T coordinate) determined by teaching to determine the receiving coordinates (chuck position and angle) of the chuck 22 by the aligner 4. The aligner 4 moves to the receiving coordinates and receives the chuck 22.

[0051] According to the chuck position measuring method of the embodiment, the coordinates at which the chuck 22 is received by the aligner 4 can be measured by capturing an image of the mark 46 provided on one target 45 in one shot using the imaging unit 25.

[0052] Here, when two targets 45 are provided on the chuck 22, the center coordinates and angular coordinates of the two targets 45 are averaged. This makes it possible to measure the reception coordinates of the chuck 22 by the aligner 4 in the same way as when one target 45 is provided.

[0053] Next, a comparative example of a chuck position measuring method will be described. FIG. 10 is a rear view of the chuck of the comparative example as seen from below. 10, the chuck 100 of the comparative example is provided with at least two marks, a first mark 100A and a second mark 100B. The first mark 100A and the second mark 100B are small holes each having a diameter of 1.0 mm, for example. The imaging range of the imaging unit 25 is small, for example, about 3 mm × 3 mm or 3 mm × 4 mm.

[0054] 1 and 10, first, before carrying out the chuck position measurement method, information necessary for measurement is recorded by teaching. Specifically, the chuck 100 is detachably supported on the Z axis 18 of the aligner 4. The held chuck 100 is transferred to the probe card 21 of the head stage 12 by the aligner 4. In this state, the XYZ position coordinates and angle T coordinate of the chuck 100 are recorded.

[0055] After recording the XYZ position coordinates and angle T coordinate, the chuck 100 is handed over to (held by) the holder 23 while maintaining the XYZ position coordinates and angle T coordinates. With the chuck 100 held by the holder 23, the first mark 100A of the chuck 100 is imaged by the imaging unit 25, and the X1-Y1-Z1 position coordinates of the first mark 100A are recorded. In addition, the second mark 100B of the chuck 100 is imaged by the imaging unit 25, and the X2-Y2-Z2 coordinates of the second mark 100B are recorded. This completes teaching.

[0056] After teaching is performed, the chuck position is measured. That is, when the chuck 100 is received by the aligner 4, the aligner 4 is moved to the X1-Y1-Z1 coordinates, and the first mark 100A is imaged (detected) by the imaging unit 25. If the first mark 100A is not within the imaging range of the imaging unit 25, the periphery of the first mark 100A is scanned to image the first mark 100A. The difference between the position of the imaged first mark 100A and the X1-Y1-Z1 coordinates of the first mark 100A recorded by teaching is calculated.

[0057] Furthermore, the imaging unit 25 is moved to the X2-Y2-Z2 coordinates, and the second mark 100B is imaged (detected) by the imaging unit 25. If the second mark 100B is not within the imaging range of the imaging unit 25, the periphery of the second mark 100B is scanned to image the second mark 100B. The difference between the position of the imaged second mark 100B and the X2-Y2-Z2 coordinates of the second mark 100B recorded by teaching is calculated.

[0058] The difference between the X1-Y1-Z1 coordinates and the difference between the X2-Y2-Z2 coordinates are the amount of deviation and the angle of deviation of the chuck 100. The amount of deviation and the angle of deviation of the chuck 100 are added to the transfer coordinates (XYZ position coordinates and angle T coordinate) obtained by teaching, and the measurement of the receiving coordinates of the chuck 100 by the aligner 4 is completed. The aligner 4 moves to the receiving coordinates and receives the chuck 100.

[0059] According to the chuck position measuring method of the comparative example, at least two marks, a first mark 100A and a second mark 100B, are imaged by the imaging unit 25. If the first mark 100A and the second mark 100B are misaligned, it is necessary to scan the first mark 100A and the second mark 100B while shifting the imaging position of the imaging unit 25. For this reason, it takes time for the imaging unit 25 to detect the first mark 100A and the second mark 100B.

[0060] According to the wafer inspection apparatus 10 and chuck position measuring method described above, as shown in Figures 1, 3, and 5, the target 45 is formed to be larger than the allowable range of movement of the chuck 22 relative to the holder 23. Therefore, with the imaging unit 25 fixed in a predetermined position, the target 45 can be imaged in one shot without scanning with the imaging unit 25. The XYZ position coordinates and angle T coordinate of the chuck 22 can be obtained based on the target 45 imaged by the imaging unit 25. This makes it possible to improve throughput.

[0061] 5, the target 45 is provided on the imaged portion 24. The imaged portion 24 is a separate member from the chuck 22. Therefore, costs can be reduced compared to when the target 45 is provided directly on the chuck 22, for example. Furthermore, the target 45 has a plurality of marks 46. Therefore, by setting the arrangement and shape of the plurality of marks 46 so that the XYZ position coordinates and angle T coordinate of the chuck 22 can be measured, the XYZ position coordinates and angle T coordinate of the chuck 22 can be obtained based on the marks 46 captured by the imaging unit 25 (see FIG. 1). This makes it possible to improve throughput.

[0062] Furthermore, the reflectivity of the imaged surface 24a of the imaged portion 24 is ensured. Also, a black Mylar sheet 43 is provided on the opposite side of the imaged surface 24a. This allows the image of the mark 46 to be captured by the imaging portion 25 reliably.

[0063] 3, 6, and 7, the target 45 provided in the wafer inspection apparatus 10 is formed larger than the allowable range of movement of the chuck 22 relative to the holder 23 (see FIG. 1). The target 45 has a plurality of marks 46, and the arrangement and shape of the plurality of marks 46 are set so that the XYZ position coordinates and angle T coordinate of the chuck 22 can be measured. Therefore, with the imaging unit 25 (see FIG. 1) fixed in a predetermined position, the target 45 can be imaged in one shot without scanning the imaging unit 25. The XYZ position coordinates and angle T coordinate of the chuck 22 can be determined based on the marks 46 imaged by the imaging unit 25. This improves throughput.

[0064] <Modification> Next, Modifications 1 and 2 of the imaged portion 24 will be described. First, the imaged portion 50 of the first modification will be described with reference to FIG. FIG. 11 is a plan view showing an imaged portion of the first modified example. 11, the imaged portion 50 of the first modification is formed of a translucent plate material with a thickness of 0.3 mm, similar to the imaged portion 24 of the embodiment. The reflectivity of the imaged surface 50a of the imaged portion 50 is ensured by, for example, electrolytic polishing.

[0065] The imaged portion 50 has a target 51. The target 51 is formed to be larger than the allowable range of movement of the chuck 22 (see FIG. 1). The target 51 has a plurality of marks 52. The plurality of marks 52 are formed in a pattern of various straight lines extending radially from the center of the target 51. Of the plurality of marks 52, the marks 52 required for measuring the position and angle of the chuck 22 can be imaged (detected) in one shot within the imaging range H by the imaging unit 25 (see FIG. 1).

[0066] As a result, by imaging the mark 52 with the imaging unit 25, the XYZ position coordinates and angle T coordinate of the chuck 22 (see Figure 1) can be obtained, similar to the imaged portion 24 in the embodiment, thereby improving throughput.

[0067] Next, an imaged portion 60 according to the second modification will be described with reference to FIG. FIG. 12 is a plan view showing an imaged portion of the second modification. 12, the imaged portion 60 of the second modification is formed of a translucent plate material with a thickness of 0.3 mm, similar to the imaged portion 24 of the embodiment. The reflectivity of the imaged surface 60a of the imaged portion 60 is ensured by, for example, electrolytic polishing.

[0068] The imaged portion 60 has a target 61. The target 61 is formed to be larger than the allowable range of movement of the chuck 22 (see FIG. 1). The target 61 has a plurality of marks 62. The plurality of marks 62 are formed in a rectangular pattern by, for example, chrome deposition. Similar to the marks 46 of the embodiment, the plurality of marks 62 are set so that, for example, their arrangement and shape (size) and the position and angle of the chuck 22 can be measured. Of the plurality of marks 62, the marks 62 required for measuring the position and angle of the chuck 22 can be imaged (detected) in one shot by the imaging unit 25 (see FIG. 1).

[0069] As a result, by imaging the mark 62 with the imaging unit 25, the XYZ position coordinates and angle T coordinate of the chuck 22 (see Figure 1) can be obtained, similar to the imaged portion 24 in the embodiment, thereby improving throughput.

[0070] The technical scope of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, in the above-described embodiment, modified example 1, and modified example 2, examples have been described in which the marks on the target are formed as circles, lines, or rectangles, but this is not limiting. As another example, the marks may be formed as patterns of letters such as numbers, symbols, or the like.

[0071] In addition, the components in this embodiment can be replaced with well-known components as appropriate, without departing from the spirit of the present invention. [Explanation of symbols]

[0072] 10...Wafer inspection equipment 12...Headstage 21...Probe card 22...Chuck 23...Holding part 24, 50, 60...Imaged area 24a, 50a, 60a...imaged surface 25...imaging unit 43...Mylar sheet 45, 51, 61...Target 46, 52, 62...Marks W...wafer

Claims

1. a probe card provided on the head stage; a chuck that holds a wafer and is capable of electrically connecting the wafer to the probe card; a holding portion provided below the head stage and holding the chuck; a target provided on the chuck; an imaging unit that images the target, The target is The range of movement of the chuck relative to the holding part is formed to be larger than the allowable range of movement of the chuck relative to the holding part, so that the imaging part can capture an image while the imaging part is fixed at a predetermined position, determining the position and angle of the chuck based on the target imaged by the imaging unit; A wafer inspection device characterized by:

2. The target is The chuck is provided on an imaged portion formed of a plate material separate from the chuck, A plurality of marks having holes with a diameter of 0.3 to 7 mm at a pitch of 1 mm are provided.

2. The wafer inspection device according to claim 1, wherein:

3. The imaged portion is The reflectivity of the imaged surface is ensured, A black Mylar sheet is provided on the opposite side of the imaged surface.

3. The wafer inspection apparatus according to claim 2, wherein:

4. The chuck is held by the holding part. A chuck position measuring method in which an image of a target provided on the chuck is captured by an imaging unit, With the imaging unit fixed at a predetermined position, the target, which is formed larger than the allowable range of movement of the chuck relative to the holding unit, is imaged in one shot; determining the position and angle of the chuck based on the target imaged by the imaging unit; A chuck position measuring method characterized by:

5. A target that holds a chuck in a holding part and is imaged by an imaging part to determine the position and angle of the chuck held in the holding part, The range of movement of the chuck relative to the holding part is formed to be larger than the allowable range of movement of the chuck relative to the holding part, so that the imaging part can capture an image while the imaging part is fixed at a predetermined position, a plurality of marks arranged and shaped so as to be able to measure the position and angle of the chuck; A target characterized by:

Images