Processing device

Abstract

To provide a processing device which can remove debris, water, and dirt etc. around the processing device without contaminating an environment where the processing device is installed.SOLUTION: A processing device includes: holding means 7 for holding a workpiece; and processing means 8 for processing the workpiece held by the holding means 7. The processing device includes cleaning means 30A. The cleaning means 30A is formed including: a nozzle part 31A including a suction port 31Aa for suctioning dirt; a suction force generating part 32A which generates a suction force in the nozzle part 31A; and a dirt collection part 33A which collects the dirt suctioned by the suction force generated by the suction force generating part 32A.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a processing apparatus including a holding means for holding a workpiece and a processing means for processing the workpiece held by the holding means. [Background technology]

[0002] A wafer has multiple devices such as ICs and LSIs formed on its surface, separated by planned dividing lines. The back surface is ground by a grinding machine to form the wafer to a specified thickness, and then the wafer is divided into individual device chips using a dicing machine and laser processing machine. These chips are then used in electrical devices such as mobile phones and personal computers.

[0003] Furthermore, processing equipment including grinding equipment, dicing equipment, etc. is equipped with a nozzle that is connected to a high-pressure air source and sprays ionized air onto a region including a wafer or a processing chamber to scatter and remove debris, water, dust, etc. that has adhered to the processing chamber (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-169613 Summary of the Invention [Problem to be solved by the invention]

[0005] However, when high-pressure air is sprayed from the nozzle to remove debris, water, dust, etc., the debris, water, dust, etc. scatter and float around, leaving them in the air, which can contaminate the environment of the space (clean room) where the processing equipment is installed.

[0006] The present invention has been made in consideration of the above facts, and its main technical object is to provide a processing device that can remove debris, water, dirt, etc. around the processing device without polluting the environment in which it is installed. [Means for solving the problem]

[0007] In order to solve the above-mentioned main technical problem, according to the present invention, there is provided a processing apparatus including a holding means for holding a workpiece and a processing means for processing the workpiece held by the holding means, wherein the processing apparatus is equipped with a cleaning means, the cleaning means including a nozzle portion having a suction port for sucking in dust, a suction force generating portion for generating suction force in the nozzle portion, and a dust collecting portion for collecting dust sucked in by the suction force generated by the suction force generating portion.

[0008] The suction force generating unit preferably includes an ejector, a high-pressure air path connecting the ejector to a high-pressure air source, and a negative pressure path connecting the negative pressure generated by the ejector to the dust collecting unit, and the nozzle unit preferably includes a dust path connecting to the dust collecting unit. The nozzle may also include a high-pressure on-off valve that can select between an open and closed state for the high-pressure air path. The nozzle may also include a negative pressure on-off valve that can select between an open and closed state for the negative pressure path.

[0009] The dust collection unit preferably includes a negative pressure chamber connected to the negative pressure path and a dust chamber connected to the dust path, and the negative pressure chamber and the dust chamber are detachably fastened so that the dust chamber can be separated from the negative pressure chamber to allow dust accumulated in the dust chamber to be disposed of as needed. A filter is also preferably provided to separate the negative pressure chamber from the dust chamber. Furthermore, the processing device preferably has air connectors at multiple locations, including the front, side, and back, that communicate with the high-pressure air source, and the high-pressure air path preferably has a connector that detachably connects to the air connector. [Effects of the Invention]

[0010] The processing apparatus of the present invention is a processing apparatus including a holding means for holding a workpiece and a processing means for processing the workpiece held by the holding means, and the processing apparatus is equipped with a cleaning means which includes a nozzle portion with a suction port for sucking up dirt, a suction force generating portion which generates suction force in the nozzle portion, and a dirt collecting portion which collects the dirt sucked up by the suction force generated by the suction force generating portion.This makes it possible to suck up and remove debris, water, dirt, etc. that has adhered to the outside and inside of the processing apparatus, as well as around the processing apparatus, and eliminates the problem of scattered debris, water, dirt, etc. scattering and floating around and polluting the environment, such as a clean room. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is an overall perspective view of a cutting device shown as an example of a processing device according to an embodiment of the present invention; [Figure 2] 2(a) is an exploded view of the cleaning means disposed in the cutting device shown in FIG. 1, and FIG. 2(b) is a perspective view showing the cleaning means shown in (a) assembled into one unit. [Figure 3] 3(a) is a cross-sectional view of the cleaning means shown in FIG. 2 with the high-pressure on-off valve in a closed state, and FIG. 3(b) is a cross-sectional view of the cleaning means shown in FIG. 2 with the high-pressure on-off valve in an open state. [Figure 4] 1A is a perspective view showing another embodiment of a cleaning means according to the present invention, and FIG. 1B is a cross-sectional view of the cleaning means shown in FIG. 1A. [Figure 5] (a) is a perspective view showing yet another embodiment of the cleaning means based on the present invention, in which the negative pressure on-off valve is in a closed state; (b) is a perspective view showing the cleaning means shown in (a), in which the negative pressure on-off valve is in an open state; DETAILED DESCRIPTION OF THE INVENTION

[0012] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a processing apparatus configured based on the present invention will be described in detail with reference to the accompanying drawings.

[0013] The processing device of the present invention is a processing device that includes a holding means for holding a workpiece and a processing means for processing the workpiece held by the holding means, and the processing device is equipped with a cleaning means that includes a nozzle portion with a suction port for sucking in dirt, a suction force generating portion that generates suction force in the nozzle portion, and a dirt collecting portion that collects the dirt sucked in by the suction force generated by the suction force generating portion.

[0014] A cutting device 1 shown as an example of a processing device configured based on the present invention will be described with reference to Fig. 1. The workpiece processed by the cutting device 1 described below is, for example, a circular semiconductor wafer 10 supported on an annular frame F via an adhesive protective tape T, as shown in Fig. 1.

[0015] The cutting device 1 shown in FIG. 1 includes a holding means 7 for holding a wafer 10, a cutting means 8 arranged as a processing means for performing cutting processing on the wafer 10 held by the holding means 7, and a cleaning means 30A configured to be able to clean the inside and surroundings of the cutting device 1.

[0016] The illustrated cutting device 1 has a housing 2 having an approximately rectangular parallelepiped shape, a cassette 4 placed on a cassette table 4a that can be raised and lowered, a transfer means 3 that transfers the wafer 10 held in a frame F from the cassette 4 to a temporary storage table 5, a transport means 6 having a swivel arm that transports the wafer 10 transferred to the temporary storage table 5 to a holding means 7 having a holding surface 7a, a cutting means 8 including a cutting blade 83 arranged as a processing means for processing the wafer 10 held on the holding means 7, an alignment means 9 that takes an image of the wafer 10 held on the holding means 7 and detects the planned division line to be cut by the cutting blade 83 of the cutting means 8, a cleaning device 11 (details omitted) that cleans the processed wafer 10 that is transferred from the transfer position where the holding means 7 is positioned in Figure 1, a cleaning and transfer means 12 that transfers the wafer 10 from the holding means 7 to the cleaning device 11, and a control means not shown.

[0017] The holding surface 7a of the holding means 7 is a substantially horizontal XY plane defined by the X-axis direction and the Y-axis direction perpendicular to the X-axis direction. The holding surface 7a is made of a breathable material, and is connected to a suction means (not shown). Activating the suction means generates negative pressure on the holding surface 7a. A plurality of clamps 7b (four in the illustrated embodiment) are disposed at equal intervals around the outer periphery of the holding means 7 to grip a frame F that supports the wafer 10. Inside the housing 2, there are disposed an X-axis feed means for moving the holding means 7 in the X-axis direction, a Y-axis feed means for moving the cutting means 8 in the Y-axis direction, a Z-axis feed means for moving the cutting means 8 in the Z-axis direction (up and down), a rotary drive means for rotating the holding means 7, and other components (none of which are shown).

[0018] The cutting device 1 has roughly the above-described configuration. When cutting a wafer 10 using the cutting device 1, the wafer 10 is carried out from the cassette 4 to the temporary storage table 5 by the carry-in / out means 3, the position is adjusted by the temporary storage table 5, and then the wafer 10 is transported to the holding means 7 and held by suction by the transport means 6. Next, the X-axis feed means is operated, the holding means 7 is imaged by the alignment means 9, the position of the planned dividing lines to be machined is detected, and the X-axis feed means, the Y-axis feed means rotation drive means, etc. are operated, and the cutting means 8 is operated to perform cutting of the planned dividing lines to be machined on the wafer 10. Then, after the cutting process is performed, the cleaning and carrying-out means 12 transports the wafer 10 to the cleaning device 11, where it is cleaned and dried. The transport means 6 again sucks the wafer 10 and transports it to the temporary storage table 5, and the carry-in / out means 3 stores the wafer 10, which has been cut, in a predetermined position in the cassette 4.

[0019] The cleaning means 30A is configured to include at least a nozzle portion 31A equipped with a suction port 31Aa for sucking in dust, a suction force generating portion 32A for generating suction force in the nozzle portion 31A, and a dust collecting portion 33A for collecting dust sucked in by the suction force generated by the suction force generating portion 32A. Note that the nozzle portion 31A shown in the figure is merely an example, and it is possible to replace it with a nozzle of a different shape depending on the area to be cleaned.

[0020] 1 is connected to a high-pressure air source S1 that supplies high-pressure air F1 to the cutting device 1, and is provided with air connectors that supply the high-pressure air F1 supplied from the illustrated high-pressure air source S1 to the outside via a path (not shown) within the device housing 2. In the illustrated embodiment, an air connector 20A is provided on the front of the device housing 2, an air connector 20B is provided on a side of the device housing 2, and an air connector 20C (shown by a dashed line) is provided on the back of the device housing 2. High-pressure air F1 can be supplied to the cleaning means 30A via the air connectors 20A to 20C, and a connecting portion 36a of a high-pressure air communication passage 36 that constitutes a high-pressure air path that forms part of the suction force generating unit 32A into which the high-pressure air F1 is introduced is detachably connected to the air connectors 20A to 20C. The air connectors 20A to 20C function as one-way valves that are closed when the connecting portion 36a is not connected, and open when the connecting portion 36a is connected.

[0021] The cleaning means 30A configured according to the present invention will be described in more detail with reference to FIGS.

[0022] FIG. 2(a) shows an exploded view of the cleaning means 30A of this embodiment. The dust collection unit 33A includes a dust collection container 33Aa and a negative pressure generating container 34A. The dust collection container 33Aa has a dust collection opening 33Ab, which is connected to a flexible hose-like dust path 31Ab equipped with the nozzle 31A. A male thread 33Ad is formed on the outer edge of the upper end of the dust collection container 33Aa. This thread is threaded into a female thread (not shown) formed on the inner edge of the lower end of the negative pressure generating container 34A, thereby integrating the negative pressure generating container 34A and the dust collection container 33Aa, as shown in FIG. 2(b). Note that the method of integrating the negative pressure generating container 34A and the dust collection container 33Aa is not limited to the above-described threaded engagement. For example, they may be integrated by providing multiple snap locks or similar structures on the outer peripheral side surfaces.

[0023] The suction force generating unit 32A includes an ejector 32Aa to which high-pressure air F1 is introduced via a high-pressure air communicating passage 36 connected to the air connectors 20A to 20C, and a negative pressure path 32Ab that connects the negative pressure generated by the ejector 32Aa to the negative pressure generating container 34A of the dust collecting unit 33A. Figures 3(a) and 3(b) show a cross-sectional view of the suction force generating unit 32A, which is a combination of a cross-section taken along the longitudinal direction of the ejector 32Aa and a cross-section taken along the longitudinal direction of the ejector 32Aa that passes through the center of the dust collecting unit 33A in a plan view and is parallel to the longitudinal direction of the ejector 32Aa.

[0024] As shown in FIG. 3(a), an internal passage 32Ac is formed within the ejector 32Aa of the suction force generator 32A, constituting a high-pressure air path through which the high-pressure air F1 passes. A narrowed section 32Af with a narrow passage area is formed between the inlet 32Ad and the outlet 32Ae of the internal passage 32Ac. A high-pressure on-off valve 32Ag is disposed upstream of the narrowed section 32Af, allowing the internal passage 32Ac to be opened or closed. The high-pressure on-off valve 32Ag controls the flow of the high-pressure air F1 through the high-pressure air path formed by the high-pressure air communication passage 36 and the internal passage 32Ac of the ejector 32Aa. The high-pressure on-off valve 32Ag is, for example, a ball valve, and a communication passage 32Ah is formed therein. The high-pressure on-off valve 32Ag is not necessarily limited to a ball valve and may be another type of on-off valve (e.g., a butterfly valve, a gate valve, etc.).

[0025] The internal passage 32Ai of the negative pressure path 32Ab communicates with the throttle portion 32Af and a negative pressure chamber 34Aa formed in the negative pressure generating container 34A. A filter 37 is disposed at the opening on the lower end side of the negative pressure generating container 34A to separate the negative pressure chamber 34Aa from the dust chamber 33Ac.

[0026] 2(b), in addition to the above configuration, the cleaning means 30A also includes an operating unit 35A. The operating unit 35A includes a grip 35Aa to be grasped by the operator's hand, a connecting portion 35Ab that connects the upper end of the grip 35Aa to the side of the negative pressure generating container 34A, a lever member 35Ac that is disposed along the grip 35Aa and has its upper end passing through a through-hole 35Ae formed in the connecting portion 35Ab and protruding upward, a link member 35Af that is connected to the upper end of the lever member 35Ac, and a link lever 35Ag that is rotated by the link member 35Af. The lever member 35Ac is supported by a rotation axis within the through hole 35Ae, and when an operator pulls the lever member 35Ac in the direction indicated by arrow R1 against the spring 35Ad, the lever member 35Ac rotates around the rotation axis within the through hole 35Ae, moving the link member 35Af in the direction indicated by arrow R2 and rotating the link lever 35Ag in the direction indicated by arrow R3.

[0027] The link lever 35Ag described above is connected to the high-pressure on-off valve 32Ag of the suction force generating unit 32A shown in Figures 3(a) and (b). When the link lever 35Ag rotates in the direction indicated by the arrow R3 as described above, the high-pressure on-off valve 32Ag rotates in the direction indicated by the arrow R3 as shown in Figure 3(b). The communication passage 32Ah of the high-pressure on-off valve 32Ag changes the internal passage 32Ac that constitutes the high-pressure air path within the ejector 32Aa from a closed state to an open state, and the high-pressure air F1 introduced from the high-pressure air communication passage 36 flows through the internal passage 32Ac of the ejector 32Aa.

[0028] High-pressure air F1 introduced from the high-pressure air communication passage 36 flows through the internal passage 32Ac of the ejector 32Aa, passes through the throttle section 32Af, and accelerates at the outlet side of the throttle section 32Af, causing the ejector effect to suck in the air in the negative pressure path 32Ab. This causes an air flow F2 from the negative pressure chamber 34Aa in the negative pressure generating container 34A toward the throttle section 32Af, creating a negative pressure in the negative pressure chamber 34Aa. This causes an air flow F3 from the dust chamber 33Ac to the negative pressure generating container 34A through the filter 37. This generates a suction force at the suction port 31Aa of the nozzle 31A via the dust collection port 33Ab and the dust path 31Ab, making the sucked dust available for collection in the dust chamber 33Ac. The filter 37 is disposed at the position separating the negative pressure chamber 34Aa and the dust chamber 33Ac, so that the dust collected in the dust chamber 33Ac is captured by the filter 37, and only clean air flows toward the negative pressure chamber 34Aa, through the throttle portion 32Af of the ejector 32Aa, and is discharged from the discharge portion 32Ae. In this way, by introducing high-pressure air F1 into the ejector 32Aa, the surroundings of the cutting device 1 can be cleaned by the cleaning means 30A.

[0029] Furthermore, the above-mentioned dust collection section 33A is equipped with a negative pressure chamber 34Aa connected to the negative pressure path 32Ab and a dust chamber 33Ac connected to the dust path 31Ab. The negative pressure chamber 34Aa and the dust chamber 33Ac are detachably fastened together, so that the dust collection container 33Aa forming the dust chamber 33Ac can be separated from the negative pressure chamber 34Aa and the dust accumulated in the dust chamber 33Ac can be disposed of as appropriate. Furthermore, the filter 37 separating the negative pressure chamber 34Aa and the dust chamber 33Ac can be easily cleaned or replaced.

[0030] When the operator releases lever member 35Ac of operating unit 35A, the lever member 35Ac returns to its original position due to the elastic force of spring 35Ad, and high-pressure on-off valve 32Ag is brought into the closed state shown in Figure 3(a), blocking the flow of high-pressure air F1 through the high-pressure air path and thereby stopping the suction force generated at suction port 31Aa of nozzle portion 31A. In this way, by operating lever member 35Ac, it is possible to control the suction force acting on suction port 31Aa.

[0031] As described above, the air connectors 20A-20C and the connecting portion 36a of the high-pressure air passage 36 are detachable. This allows the connecting portion 36a of the high-pressure air passage 36 to be changed depending on the area to be cleaned. For example, to clean the area on the front side of the cutting device 1, the connecting portion 36a of the high-pressure air passage 36 is connected to the air connector 20A disposed on the front side of the device housing 2, and the operating unit 35A is operated to send high-pressure air F1 to the ejector 32Aa, generating suction force at the suction port 31Aa of the nozzle portion 31A, thereby performing cleaning. Furthermore, to clean the rear side of the cutting device 1, the connecting portion 36a of the high-pressure air passage 36 is connected to the air connector 20C formed on the rear side of the device housing 2, and cleaning can be performed using the cleaning unit 30A.

[0032] In the above embodiment, the air connectors 20A-20C are disposed at three locations on the front, side, and back of the cutting device 1, but the locations are not limited to these. The number of air connectors may be one or four or more. By disposing air connectors at multiple locations, it is possible to suck and remove debris, water, dust, etc., adhering to the area including the machining chamber where cutting is performed in the cutting device 1, without increasing the length of the high-pressure air communication passage 36. This solves the problem of scattered debris, water, dust, etc., scattering and floating around, contaminating the environment, such as a clean room. Furthermore, by disposing the air connectors inside the device housing 2, the interior of the device housing 2 of the cutting device 1, particularly the interior of the electrical equipment area where the control means, motor, etc. are disposed, can also be efficiently cleaned.

[0033] The cleaning means configured according to the present invention is not limited to the above-described cleaning means 30A. Another embodiment of the cleaning means 30B will be described with reference to FIG.

[0034] Like the cleaning means 30A described above, the cleaning means 30B shown in Figure 4(a) is configured to include at least a nozzle portion 31B having a suction port 31Ba for sucking in dust, a suction force generating portion 32B for generating suction force in the nozzle portion 31B, and a dust collecting portion 33B for collecting the dust sucked in by the suction force generated by the suction force generating portion 32B.

[0035] The dust collection unit 33B includes a dust collection container 33Ba and a negative pressure generating container 34B. A dust collection opening 33Bb is formed in the dust collection container 33Ba, and dust collected from the dust collection opening 33Bb via the nozzle 31B and the hose-like dust path 31Bb is collected in a dust chamber 33Bc formed inside the dust collection container 33Ba shown in FIG. 4(b).

[0036] In addition to the nozzle unit 31B, suction force generating unit 32B, and dirt collecting unit 33B, the cleaning unit 30B also includes an operating unit 35B that is used to operate the cleaning unit 30B. The operating unit 35B includes a grip 35Ba that is held by the operator's hand, a connecting unit 35Bb that connects the upper end of the grip 35Ba to the side of the negative pressure generating container 34B of the dirt collecting unit 33B, a lever member 35Bc that is disposed along the grip 35Ba and has its upper end protruding through a through-hole 35Be formed in the connecting unit 35Bb, a link member 35Bf that is connected to the upper end of the lever member 35Bc, and a link lever 35Bg that is rotated by the link member 35Bf. The lever member 35Bc is supported by a rotation axis within the through hole 35Be, and by pulling the lever member 35Bc in the direction indicated by arrow R1 against the spring 35Bd connecting the grip 35Ba and the lower end side of the lever member 35Bc, the lever member 35Bc rotates around the rotation axis within the through hole 35Be, moving the link member 35Bf in the direction indicated by arrow R2 and rotating the link lever 35Bg in the direction indicated by arrow R3.

[0037] Comparing cleaning means 30B with the above-described cleaning means 30A, the position of the on-off valve disposed in suction force generating unit 32B is different from that of cleaning means 30A, but the other configurations are the same. The on-off valve will be described below.

[0038] In the cleaning means 30A, the on-off valve (high-pressure on-off valve 32Ag) operated by the operating unit 35A is disposed in the internal passage 32Ac of the ejector 32Aa through which the high-pressure air F1 flows, whereas in the cleaning means 30B, as can be seen from Figure 4(b), which shows a cross section of the suction force generation unit 32B and the dust collection unit 33B, the on-off valve is disposed in the internal passage 32Bi of the negative pressure path 32Bb of the suction force generation unit 32B. Hereinafter, this on-off valve will be referred to as the negative pressure on-off valve 32Bg. The link lever 35Bg is connected to this negative pressure on-off valve 32Bg, and as shown in Figure 4(a), by operating the lever member 35bc of the operating unit 35B and pulling it in the direction indicated by arrow R1, moving the link member 35Bf in the direction indicated by arrow R2, and rotating the link lever 35Bg in the direction indicated by arrow R3, the internal passage 32Bi of the negative pressure path 32Bb can be changed from a closed state to an open state by the communicating passage 32Bh of the negative pressure on-off valve 32Bg.

[0039] 4(b), operating the operating unit 35B to open the internal passage 32Bi of the negative pressure path 32Bb via the negative pressure on-off valve 32Bg connects the ejector 32Ba to the negative pressure chamber 34Ba. High-pressure air F1 flows through the internal passage 32Bc of the ejector 32Ba, which has the throttle portion 32Ba. This causes an air flow F2 from the negative pressure chamber 34Ba in the negative pressure generating container 34B toward the throttle portion 32Bf, creating a negative pressure in the negative pressure chamber 34Ba. This causes an air flow F3 from the dust chamber 33Bc toward the negative pressure generating container 34B, which generates a suction force at the suction port 31Ba of the nozzle 31B via the dust collection opening 33Bb and the dust path 31Bb. Since a filter 37 is disposed at the position separating the negative pressure chamber 34Ba and the dust chamber 33Bc, dust collected in the dust chamber 33Bc through the nozzle portion 31B is captured by the filter 37, and only clean air flows from the negative pressure chamber 34Ba to the throttle portion 32Bf of the ejector 32Ba and is exhausted from the discharge portion 32Be. In this way, by opening the internal passage 32Bi of the negative pressure path 32Bb, the cleaning means 30B can also clean the periphery of the cutting device 1, achieving the same effect as the cleaning means 30A.

[0040] 5(a) and (b) show cleaning means 30C, another embodiment constructed according to the present invention. Like cleaning means 30A and 30B, the illustrated cleaning means 30C includes at least a nozzle portion (not shown) with a suction port for sucking in dust, a suction force generating portion 32C for generating suction force in the nozzle portion, and a dust collecting portion 33C for collecting dust sucked by the suction force generated by suction force generating portion 32C. Note that cleaning means 30C has substantially the same configuration as cleaning means 30A and 30B, except for the configuration described below, and therefore the connection portion of high-pressure air communication passage 36, the nozzle portion, the dust path, and the like are omitted.

[0041] The dust collection unit 33C includes a dust collection container 33Ca and a negative pressure generating container 34C. A dust collection opening 33Cb is formed in the dust collection container 33Ca, and dust collected from the dust collection opening 33Cb via a nozzle and dust path (not shown) is collected in a dust chamber (not shown) formed inside the dust collection container 33Ca. The filter 37 is disposed at a position separating the negative pressure chamber (not shown) of the negative pressure generating container 34C from the dust chamber (not shown) inside the dust collection container 33Ca.

[0042] In addition to the nozzle unit, suction force generating unit 32C, and dirt collecting unit 33C, cleaning unit 30C also includes an operating unit 35C that is used to operate cleaning unit 30C. Operating unit 35C includes a grip 35Ca that is held by the operator's hand, a connecting unit 35Cb that connects the upper end of grip 35Ca to the side of negative pressure generating container 34C of dirt collecting unit 33C, a lever member 35Cc that is disposed along grip 35Ca and has its upper end protruding through a through-hole 35Ce (see FIG. 5(b)) formed in connecting unit 35Cb, and a slide valve 32Cg that is formed by a flat link plate 35Cf connected to the upper end of lever member 35Cc.

[0043] The lever member 35Cc is supported by a rotation shaft within the through-hole 35Ce. When the operator pulls the lever member 35Cc in the direction indicated by arrow R1 against the spring 35Cd connecting the grip 35Ca and the lower end of the lever member 35Cc, the lever member 35Cc rotates about the rotation shaft within the through-hole 35Ce, and the link plate 35Cf moves in the direction indicated by arrow R2, as shown in FIG. 5(b). This causes the hole 32Ch formed in the slide valve 35Cg to align with the internal passage within the negative pressure path 32Cb, switching the internal passage within the negative pressure path 32Cb from a closed state to an open state. In other words, the slide valve 35Cg functions as a negative pressure valve similar to the negative pressure valve 32Bg of the cleaning means 30B described above.

[0044] With the above configuration, an airflow F2 is generated from the negative pressure chamber in the negative pressure generating vessel 34C toward the ejector 32Ca through an internal passage connected to a throttle (not shown) formed in the ejector 32Ca of the suction force generating unit 32. This generates an airflow from the dust chamber of the dust collecting unit 33Ca toward the negative pressure generating vessel 34C, generating suction at the suction port of the nozzle (not shown). As a result, the cleaning means 30C can suck and remove debris, water, dust, etc., adhering to the area including the machining chamber where cutting is performed in the cutting device 1. This solves the problem of scattered debris, water, dust, etc., scattering and floating around, contaminating the environment, such as a clean room. Note that the negative pressure path 32Cb shown in Figure 5(b) is partially cut away for ease of explanation; in reality, it covers the slide valve 35Cg, as shown in Figure 5(a).

[0045] In the above-described embodiment, an example is shown in which a cutting device 1 is used as the processing device of the present invention, but the present invention is not limited to the above-described cutting device 1, and can be applied to other processing devices, such as grinding devices, polishing devices, laser processing devices, etc., as long as the processing device includes a holding means for holding a workpiece and a processing means for processing the workpiece held by the holding means. [Explanation of symbols]

[0046] 1:Cutting device 2: Device housing 3: Carrying in / out means 4: Cassette 5: Temporary table 6: Means of transport 7: Holding means 7a: Holding surface 8: Cutting means 83: Cutting blade 9: Alignment means 10: Wafer 11: Cleaning equipment 12: Cleaning transport means 20A~20C: Air connector 30A, 30B, 30C: Cleaning means 31A, 31B: Nozzle part 31Aa, 31Ba: Suction port 31Ab, 31bb: Garbage pathway 32A, 32B, 32C: Suction force generation part 32Aa, 32Ba, 32Ca: Ejector 32Ab, 32Bb, 32Cb: Negative pressure path 32Ac, 32Bc: Internal passage 32Ad, 32Bd, 32Cd: Inlet 32Ae, 32Be, 32Ce: Discharge port 32Af, 32Bf: aperture section 32Ag: High pressure shut-off valve 32Bg: Low pressure shut-off valve 32Cg: Slide valve (low pressure on-off valve) 32Ah, 32Bh: Communication path 32Ch: Hole 32Ai, 32Bi: Internal passage 33A, 33B, 33C: Garbage collection section 33Aa, 33Ba, 33Ca: Garbage collection container 33Ab, 33Bb, 33Cb: Garbage collection outlet 33Ac, 33Bc: Garbage room 34A, 34B, 34C: Negative pressure generating vessel 34Aa, 34Ba: Negative pressure chamber 35A, 35B, 35C: Operation section 35Aa, 35Ba, 35Ca: Grip 35Ab, 35Bb, 35Cb: Connection part 35Ac, 35Bc, 35Cc: Lever parts 35Ad, 35Bd, 35Cd: Spring 35Ae, 35Be, 35Ce: Through hole 35Af, 35Bf: Link members 35Cf: Link plate 35Ag, 35Bg: Link lever 36: High-pressure air passage 36a: Connection part 37: Filter S1: High pressure air source

Claims

1. A processing device including a holding means for holding a workpiece and a processing means for processing the workpiece held by the holding means, The processing device includes a cleaning means; The cleaning means is a processing device that includes a nozzle portion having a suction port for sucking in dust, a suction force generating portion that generates suction force in the nozzle portion, and a dust collecting portion that collects the dust sucked in by the suction force generated by the suction force generating portion.

2. the suction force generating unit includes an ejector, a high-pressure air path that connects the ejector to a high-pressure air source, and a negative pressure path that connects the negative pressure generated by the ejector to the dust collecting unit; 2. The processing device according to claim 1, wherein the nozzle portion includes a dust passage communicating with the dust collection portion.

3. 3. The processing apparatus according to claim 2, further comprising a high-pressure on-off valve that can select between an open state and a closed state of the high-pressure air path.

4. 3. The processing apparatus according to claim 2, further comprising a negative pressure on-off valve that can select an open state or a closed state of the negative pressure path.

5. 3. The processing device according to claim 2, wherein the dust collection unit comprises a negative pressure chamber connected to the negative pressure path and a dust chamber connected to the dust path, the negative pressure chamber and the dust chamber being detachably fastened together so that the dust collected in the dust chamber can be separated from the negative pressure chamber and disposed of as needed.

6. 6. The processing apparatus according to claim 5, further comprising a filter separating the negative pressure chamber from the dust chamber.

7. The processing device has air connectors communicating with the high-pressure air source provided at a plurality of locations including at least one of a front surface, a side surface, and a rear surface; 3. The processing apparatus according to claim 2, wherein the high-pressure air path is provided with a connecting portion that is detachably connected to the air connector.

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