Vibration device

Abstract

To provide a vibration device or the like capable of suppressing adverse effects due to stress.SOLUTION: A vibration device 1 includes a vibration element 10, a support substrate 30 supporting the vibration element 10, and a base 2 to which the support substrate 30 is attached. The support substrate 30 includes a frame portion 40, an element mounting portion 70 provided inside the frame portion 40, on which the vibration element 10 is mounted, and a plurality of beam portions 71-74 supporting the element mounting portion 70 inside the frame portion 40. The frame portion 40 includes stress relaxation portions 61 and 62 as thin portions, narrow portions, or spring portions.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a vibration device and the like. [Background technology]

[0002] Patent Document 1 discloses a vibration device having a vibration element and a support substrate disposed opposite to the vibration element and supporting the vibration element. The support substrate in Patent Document 1 includes a first support portion, a plurality of beam portions extending from the first support portion, a second support portion, and a plurality of beam portions extending from the second support portion. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-21636 Summary of the Invention [Problem to be solved by the invention]

[0004] In the support substrate of Patent Document 1, the first support section and the second support section are mechanically connected by multiple beams via a central base section. It has been found that such a structure has problems such as stress concentration at the base of the beams, an inability to ensure rigidity at the beams, and the beams being prone to flexible deformation, making handling during mounting difficult. [Means for solving the problem]

[0005] One aspect of the present disclosure relates to a vibration device including a vibration element, a support substrate that supports the vibration element, and a base to which the support substrate is attached, wherein the support substrate includes a frame portion, an element mounting portion that is provided inside the frame portion and on which the vibration element is mounted, and a plurality of beam portions that support the element mounting portion inside the frame portion, and the frame portion includes a stress relaxation portion that is a thin portion, a narrow portion, or a spring portion. [Brief explanation of the drawings]

[0006] [Figure 1] FIG. 1 is a cross-sectional view showing an example of the configuration of a vibration device according to an embodiment of the present invention. [Figure 2] FIG. [Figure 3] FIG. [Figure 4] FIG. 4 is a plan view of the support substrate as viewed from the bottom side. [Figure 5] 1A and 1B are a plan view and a cross-sectional view of a support substrate provided with slits as stress relaxation portions. [Figure 6] 1A and 1B are a plan view and a cross-sectional view of a support substrate of a comparative example. [Figure 7] 10A and 10B are a plan view and a cross-sectional view of a support substrate in which slits are provided only on the top surface as stress relaxation portions. [Figure 8] 10A and 10B are a plan view and a cross-sectional view of a support substrate provided with a plurality of slits as stress relaxation portions. [Figure 9] 1A and 1B are a plan view and a cross-sectional view of a support substrate provided with a narrow width portion as a stress relaxation portion. [Figure 10] 10A and 10B are a plan view and a cross-sectional view of a support substrate provided with a spring portion as a stress relaxation portion. [Figure 11] 10A and 10B are a plan view and a cross-sectional view of a support substrate provided with a plurality of spring portions as stress relief portions. [Figure 12] FIG. 3 is an explanatory diagram of the arrangement relationship between a support substrate, a vibration element, and a circuit device. [Figure 13] FIG. 4 is an explanatory diagram of the positional relationship between a board bonding member and a stress relaxation portion. DETAILED DESCRIPTION OF THE INVENTION

[0007] The present embodiment will be described below. Note that the present embodiment described below does not unduly limit the content of the claims. Furthermore, not all of the configurations described in the present embodiment are necessarily essential components.

[0008] 1. Vibration Device FIG. 1 is a cross-sectional view showing an example of the configuration of a resonator device 1 according to this embodiment. As shown in FIG. 1, the resonator device 1 according to this embodiment includes a resonator element 10, a support substrate 30 supporting the resonator element 10, and a base 2 to which the support substrate 30 is attached. The resonator device 1 may further include a package 4 including a lid 3 and the base 2, and a circuit device 20. The resonator device 1 is not limited to the configuration shown in FIG. 1, and various modifications are possible, such as omitting some of these components or adding other components. For example, a modification that does not include the circuit device 20 or the lid 3 is also possible. In this embodiment, as shown in FIG. 1, directions perpendicular to each other are designated as directions DR1 and DR2, and a direction perpendicular to directions DR1 and DR2 is designated as direction DR3. The directions DR1, DR2, and DR3 are the first direction, second direction, and third direction, respectively. The tip of the arrow in each of the directions DR1, DR2, and DR3 is also referred to as the positive side, and the opposite side is also referred to as the negative side. FIG. 1 is a side view of the resonator device 1 as viewed from the side in direction DR2.

[0009] The vibration element 10 is, for example, a physical quantity detection element. The physical quantity detection element can also be called, for example, a physical quantity transducer, and is an element for detecting physical quantities. The physical quantity detection element has a vibrating element, and a physical quantity is detected using the vibration of this vibrating element. For example, if the physical quantity detection element is a gyro sensor element, angular velocity is detected as the physical quantity. Examples of gyro sensor elements include sensor elements having a piezoelectric vibrating element formed from a thin plate of a piezoelectric material such as quartz. Specifically, the gyro sensor element is a sensor element having a double-T-shaped, tuning-fork-shaped, or H-shaped vibrating element formed from a quartz substrate such as a Z-cut. Alternatively, a MEMS (Micro Electro Mechanical Systems) type sensor element may be used as the gyro sensor element. Furthermore, the physical quantity detected by the physical quantity detection element may be a physical quantity other than angular velocity, such as angular acceleration, angle, acceleration, velocity, movement distance, or pressure. Furthermore, the vibration element 10 may be a vibration element of an oscillator. In this case, the oscillator, which is the vibration device 1, may be a temperature compensated crystal oscillator (TCXO), an oven-controlled crystal oscillator (OCXO), a voltage controlled crystal oscillator (VCXO), a crystal oscillator without temperature compensation function (SPXO), a SAW (Surface Acoustic Wave) oscillator, a voltage controlled SAW oscillator, or a MEMS (Micro Electro Mechanical Systems) oscillator, etc.

[0010] The package 4 has a base 2 and a lid 3. Specifically, the package 4 includes the base 2 having a recess 9 that opens upward, and the lid 3 bonded to the upper surface of the base 2 so as to form an accommodation space S between the base 2 and the lid 3. The base 2 and the lid 3 are bonded together by bonding members 5A and 5B, for example. For example, the base 2 can be made of a ceramic such as alumina, and the lid 3 can be made of a metal material such as Kovar. However, the materials of the base 2 and the lid 3 are not limited to these.

[0011] Inside the package 4, an opening in the base 2 forms a storage space S, and the vibration element 10, the support substrate 30, and the circuit device 20 are stored in this storage space S. The storage space S, which is the internal space, is airtight and is in a reduced pressure state, preferably a state closer to a vacuum. This reduces viscous resistance and improves the vibration characteristics of the vibration element 10. However, the atmosphere in the storage space S is not particularly limited, and may be, for example, atmospheric pressure or a pressurized state. Furthermore, the vibration device 1 of this embodiment only needs to have at least the base 2, and may not have a lid 3.

[0012] The recess 9 of the base 2 is composed of multiple recesses. For example, the recess 9 has a recess 9A that opens to the top surface of the base 2, a recess 9B that opens to the bottom surface of the recess 9A and has a smaller opening width than the recess 9A, and a recess 9C that opens to the bottom surface of the recess 9B and has a smaller opening width than the recess 9B. A support substrate 30 is fixed to the bottom surface of the recess 9A while supporting the vibration element 10. The bottom surface of this recess 9A has a step portion. A circuit device 20 is fixed to the bottom surface of the recess 9C.

[0013] 1, in the accommodation space S, the vibration element 10, the support substrate 30, and the circuit device 20 are arranged so as to overlap each other in a plan view. For example, the vibration element 10, the support substrate 30, and the circuit device 20 are arranged side by side along the direction DR3. For example, the support substrate 30 has a face SF1 which is a first face and a face SF2 which is a second face as its main faces. The vibration element 10 is arranged on the face SF1 side of the support substrate 30. The circuit device 20 is arranged on the face SF2 of the support substrate 30.

[0014] The arrangement of the vibration element 10, the support substrate 30, and the circuit device 20 is not limited to that shown in Fig. 1. For example, in Fig. 1, the support substrate 30 is arranged between the vibration element 10 and the circuit device 20, but the vibration element 10 may be arranged between the support substrate 30 and the circuit device 20. Also, in Fig. 1, the vibration element 10, the support substrate 30, and the circuit device 20 are arranged in this order from the top surface side of the package 4, but the circuit device 20, the support substrate 30, and the vibration element 10 may be arranged in this order from the top surface side of the package 4.

[0015] As shown in FIG. 1, a plurality of internal terminals 6A and 6B are arranged on a stepped portion on the bottom surface of the recess 9A of the base 2. A plurality of internal terminals 7A and 7B are also arranged on a stepped portion on the bottom surface of the recess 9B of the base 2. A plurality of external terminals 8A and 8B are arranged on the underside of the base 2. The internal terminals 6A and 6B, the internal terminals 7A and 7B, and the external terminals 8A and 8B are electrically connected via internal wiring (not shown). The internal terminals 6A and 6B are electrically connected to the vibration element 10 via conductive bonding members B1 and B2 and a support substrate 30. The internal terminals 7A and 7B are electrically connected to the circuit device 20 via bonding wires BW.

[0016] The conductive bonding members B1 and B2 are members that have both conductivity and bonding properties. The conductive bonding members B1 and B2 are not particularly limited, but may be conductive adhesives in which conductive fillers such as silver fillers are dispersed in various adhesives such as polyimide, epoxy, silicone, or acrylic adhesives, or various metal bumps such as gold bumps, silver bumps, copper bumps, or solder bumps.

[0017] For example, in this embodiment, a conductive adhesive, specifically a thermosetting adhesive, is used as the bonding member B1 between the support substrate 30 and the base 2 of the package 4. Metal bumps are used as the bonding member B2 between the support substrate 30 and the vibration element 10. By using a conductive adhesive as the bonding member B1 that bonds the support substrate 30 and the base 2, which are made of different materials, the bonding member B1 can absorb and alleviate thermal stress caused by the difference in thermal expansion coefficients between them. Meanwhile, because the support substrate 30 and the vibration element 10 are bonded by multiple bonding members B2 arranged in a relatively narrow area, using metal bumps as the bonding members B2 suppresses the wetting and spreading that occurs with a conductive adhesive, thereby effectively preventing contact between the bonding members B2.

[0018] 2 is a diagram illustrating an example of the operation of the vibration element 10. In the following, the vibration element 10 is a gyro sensor element, and more specifically, a double-T shaped gyro sensor element will be mainly described as an example. However, as described above, the vibration element 10 may be a gyro sensor element other than a double-T shaped gyro sensor element, a physical quantity detection element other than a gyro sensor element, or a vibration element in an oscillator.

[0019] For example, if the Z axis is the thickness direction of the vibration element 10, the vibration element 10, which is a gyro sensor element, detects an angular velocity ω around the Z axis. The X axis and Y axis are coordinate axes that are perpendicular to the Z axis, and the X axis and Y axis are perpendicular to each other. For example, by arranging the vibration element 10 so that the Z axis in FIG. 2 is aligned with the direction DR3 in FIG. 1, it becomes possible to detect an angular velocity ω with the axis along the direction DR3 as the detection axis.

[0020] As shown in FIG. 2, the vibration device 1 includes a vibration element 10 and a circuit device 20. The circuit device 20 is, for example, an integrated circuit device called an IC (Integrated Circuit). For example, the circuit device 20 is an IC manufactured by a semiconductor process, and is a semiconductor chip in which circuit elements are formed on a semiconductor substrate. The circuit device 20 includes a drive circuit 100, a detection circuit 102, and a processing circuit 104. Note that a modified configuration in which some of these circuits are not provided is also possible.

[0021] Vibration element 10 has drive arms 18A, 18B, 18C, and 18D, detection arms 19A and 19B, a base 21, and connecting arms 22A and 22B. Detection arms 19A and 19B extend from rectangular base 21 in the +Y-axis direction and the -Y-axis direction. Connecting arms 22A and 22B extend from base 21 in the +X-axis direction and the -X-axis direction. Drive arms 18A and 18B extend from the tip of connecting arm 22A in the +Y-axis direction and the -Y-axis direction, and drive arms 18C and 18D extend from the tip of connecting arm 22B in the +Y-axis direction and the -Y-axis direction.

[0022] The vibration element 10 also has weights 27A, 27B, 27C, 27D, 28A, and 28B. These weights are also called hammerheads. Weights 27A and 27B are provided at the distal ends of drive arms 18A and 18B, respectively, and weights 27C and 27D are provided at the distal ends of drive arms 18C and 18D, respectively. Weights 28A and 28B are also provided at the distal ends of detection arms 19A and 19B, respectively. Weights 27A, 27B, 27C, and 27D provided on drive arms 18A, 18B, 18C, and 18D are balance adjustment units used to adjust the vibration balance of the vibration element 10. For example, during the manufacture of the vibration device 1, the balance of the vibration of the vibration element 10 is adjusted by performing a trimming process in which the metal of weights 27A, 27B, 27C, and 27D is removed using a laser.

[0023] The vibrating element of the vibrating element 10 can be formed from a piezoelectric material such as quartz, lithium tantalate, or lithium niobate. Among these, it is preferable to use quartz as the constituent material of the vibrating element. The X-axis, Y-axis, and Z-axis are also called the electrical axis, mechanical axis, and optical axis of the quartz substrate, respectively. The quartz substrate is formed from a plate-shaped Z-cut quartz plate having a thickness in the Z-axis direction.

[0024] Drive electrodes 13 are formed on the upper and lower surfaces of the drive arms 18A and 18B, and drive electrodes 14 are formed on the right and left sides of the drive arms 18A and 18B. Drive electrodes 14 are formed on the upper and lower surfaces of the drive arms 18C and 18D, and drive electrodes 13 are formed on the right and left sides of the drive arms 18C and 18D. A drive signal DS from a drive circuit 100 is supplied to the drive electrode 13, and a feedback signal DG from the drive electrode 14 is input to the drive circuit 100.

[0025] Detection electrodes 15 are formed on the upper and lower surfaces of detection arm 19A, and ground electrodes 17 are formed on the right and left sides of detection arm 19A. Detection electrodes 16 are formed on the upper and lower surfaces of detection arm 19B, and ground electrodes 17 are formed on the right and left sides of detection arm 19B. Ground electrode 17 is grounded, for example. Detection signals S1 and S2 from detection electrodes 15 and 16 are input to detection circuit 102.

[0026] Grooves (not shown) are provided on the top and bottom surfaces of the drive arms 18A, 18B, 18C, and 18D and the detection arms 19A and 19B to improve the electric field effect between the electrodes. The provision of the grooves makes it possible to generate a relatively large amount of charge with a relatively small amount of distortion. The top surface is the surface on the +Z-axis direction (positive side of the Z axis), and the bottom surface is the surface on the -Z-axis direction (negative side of the Z axis). The right side surface is the side surface on the +X-axis direction (positive side of the X axis), and the left side surface is the side surface on the -X-axis direction (negative side of the X axis).

[0027] The base 21 is provided with driving terminals 23 and 24 and detection terminals 25 and 26. A driving signal DS from a driving circuit 100 is input to the driving terminal 23, and a feedback signal DG to the driving circuit 100 is output from the driving terminal 24. A detection signal S1 to the detection circuit 102 is output from the detection terminal 25, and a detection signal S2 to the detection circuit 102 is output from the detection terminal 26.

[0028] The drive circuit 100 included in the circuit device 20 is a circuit that drives the vibration element 10. The drive circuit 100 outputs a drive signal DS to the vibration element 10, thereby driving the vibration elements of the vibration element 10 to vibrate. The drive signal DS is, for example, a rectangular wave signal, but may also be a sine wave signal.

[0029] The detection circuit 102 detects a physical quantity based on the detection signals S1 and S2 from the vibration element 10. In FIG. 2, angular velocity is detected as the physical quantity. The detection signals S1 and S2 are detection signals of a physical quantity with, for example, the drive frequency of the drive signal DS as the carrier frequency. The detection circuit 102 detects the physical quantity (angular velocity) in the detection signals S1 and S2 by, for example, synchronously detecting the signals based on the detection signals S1 and S2 using a synchronization signal, and outputs the detection data.

[0030] The processing circuit 104 is a circuit that performs processing such as digital signal processing on the detection data from the detection circuit 102. The processing circuit 104 performs digital signal processing, including digital filtering, on the detection data from the detection circuit 102. The detection data after digital filtering by the processing circuit 104 is then output as, for example, a final detection value of a physical quantity. Note that the signal processing performed by the processing circuit 104 is not limited to digital filtering, and various other signal processing such as temperature compensation processing and various correction processing can be performed.

[0031] Next, detailed operation will be described when the vibration element 10 is a gyro sensor element. When a drive signal DS is applied to the drive electrode 13 by the drive circuit 100, the drive arms 18A, 18B, 18C, and 18D undergo flexural vibration as indicated by arrow C1 in FIG. 2 due to the inverse piezoelectric effect. For example, the vibration modes indicated by the solid arrows and the dotted arrows are repeated at a predetermined frequency. That is, the tips of the drive arms 18A and 18C repeatedly approach and separate from each other, and the tips of the drive arms 18B and 18D also undergo flexural vibration in which they repeatedly approach and separate from each other. At this time, the drive arms 18A and 18B and the drive arms 18C and 18D vibrate symmetrically with respect to the X-axis passing through the center of gravity of the base 21. Therefore, the base 21, the connecting arms 22A and 22B, and the detection arms 19A and 19B hardly vibrate.

[0032] In this state, when an angular velocity about the Z-axis is applied to the vibration element 10, the Coriolis force causes the drive arms 18A, 18B, 18C, and 18D to vibrate as indicated by arrow C2. That is, the Coriolis force acting in the direction of arrow C2, which is perpendicular to the direction of arrow C1 and the Z-axis, acts on the drive arms 18A, 18B, 18C, and 18D, generating a vibration component in the direction of arrow C2. This vibration in the direction of arrow C2 is transmitted to the base 21 via the connecting arms 22A and 22B, causing the detection arms 19A and 19B to flexurally vibrate in the direction of arrow C3. The piezoelectric effect of this flexural vibration of the detection arms 19A and 19B generates charge signals, which are input to the detection circuit 102 as detection signals S1 and S2, allowing the angular velocity about the Z-axis to be detected.

[0033] For example, if the angular velocity of the vibration element 10 around the Z axis is ω, the mass is m, and the vibration velocity is v, the Coriolis force is expressed as Fc = 2m v ω. Therefore, the detection circuit 102 can obtain the angular velocity ω around the Z axis by detecting a desired signal that is a signal corresponding to the Coriolis force.

[0034] 2. Support substrate Next, the support substrate 30 of this embodiment will be described in detail. FIGS. 3 and 4 show an example of the configuration of the support substrate 30. The support substrate 30, also known as a relay substrate, is, for example, a plate-like substrate having a first surface SF1 and a second surface SF2. FIG. 3 is a plan view of the support substrate 30 viewed from the surface SF1 side, and FIG. 4 is a plan view of the support substrate 30 viewed from the surface SF2 side. In this embodiment, the surface SF1 is the upper surface of the support substrate 30, and the surface SF2 is the lower surface of the support substrate 30. In FIGS. 3 and 4, the first direction, DR1, is, for example, a direction along the long side of the support substrate 30, and the second direction, DR2, is, for example, a direction along the short side of the support substrate 30. The directions DR1 and DR2 are perpendicular to each other. The third direction, DR3, is perpendicular to the directions DR1 and DR2. For example, the direction DR3 is perpendicular to the surfaces SF1 and SF2 of the support substrate 30. The term "perpendicular" also includes "approximately perpendicular." For example, if the vibration device 1 is a gyro sensor element, an angular velocity ω around the axis in the direction DR3 is detected.

[0035] 3 and 4, the support substrate 30 includes a frame portion 40, an element mounting portion 70, and multiple beam portions 71, 72, 73, and 74. The element mounting portion 70 is provided inside the frame portion 40, and the vibration element 10 is mounted on the element mounting portion 70. The beam portions 71, 72, 73, and 74 support the element mounting portion 70 inside the frame portion 40. Note that the support substrate 30 is not limited to the configurations shown in FIGS. 3 and 4, and various modifications are possible, such as omitting some of the components or adding other components.

[0036] The support substrate 30 is formed of, for example, a quartz substrate. By forming the support substrate 30 from a quartz substrate, the temperature-dependent variation of the resonant frequency of the support substrate 30 can be reduced compared to when a support member formed of, for example, a bonded body of polyimide film and copper foil is used. This makes it possible to suppress unwanted vibrations in the vibration element 10 due to vibrations at the resonant frequency of the support substrate 30. Furthermore, the support substrate 30 is formed of, for example, a substrate made of the same material as the vibration element 10. For example, if the vibration element 10 is formed of a quartz substrate, the support substrate 30 is also formed of the same quartz substrate. By forming the support substrate 30 from a quartz substrate like the vibration element 10, the thermal expansion coefficients of the support substrate 30 and the vibration element 10 can be made approximately equal. Therefore, thermal stress caused by the difference in thermal expansion coefficients between the support substrate 30 and the vibration element 10 is substantially eliminated, preventing situations such as peeling of the bonding member B2 connecting the support substrate 30 and the vibration element 10 due to thermal stress. Furthermore, the vibration element 10 is less susceptible to stress, making it possible to more effectively suppress deterioration and fluctuations in the vibration characteristics of the vibration element 10.

[0037] For example, the support substrate 30 is made of a quartz crystal substrate with the same cut angle as the vibration element 10. For example, if the vibration element 10 is made of a Z-cut quartz crystal substrate, the support substrate 30 is also made of a Z-cut quartz crystal substrate. Furthermore, the orientation of the crystal axis of the support substrate 30 matches the orientation of the crystal axis of the substrate of the vibration element 10. That is, the X-axis, Y-axis, and Z-axis of the support substrate 30 and the vibration element 10 are aligned. Since quartz has different thermal expansion coefficients in the X-axis, Y-axis, and Z-axis directions, by making the support substrate 30 and the substrate of the vibration element 10 have the same cut angle and aligning their crystal axes, the aforementioned thermal stress is less likely to occur between the support substrate 30 and the vibration element 10. This makes it possible to further suppress peeling of the bonding member B2 and deterioration of vibration characteristics caused by thermal stress.

[0038] The support substrate 30 is not limited to the above, and may have, for example, the same cut angle as the substrate of the vibration element 10 but a different crystal axis direction. The support substrate 30 may also be formed from a quartz substrate with a different cut angle than the substrate of the vibration element 10. The support substrate 30 does not have to be formed from a quartz substrate. In this case, it is preferable that the constituent material of the support substrate 30 is a material whose difference in thermal expansion coefficient with quartz is smaller than the difference in thermal expansion coefficient between quartz and the constituent material of the base 2.

[0039] 3 and 4, the support substrate 30 of this embodiment includes a frame portion 40. The frame portion 40 is a frame-shaped member having an inner region formed so as to surround the element mounting portion 70. For example, the frame portion 40 is a frame-shaped member shaped so as to surround the element mounting portion 70 with a plurality of inner peripheries on its inner side. For example, while the element mounting portion 70 is surrounded by four inner peripheries SD1, SD2, SD3, and SD4 in FIGS. 3 and 4, modifications such as surrounding the element mounting portion 70 with three inner peripheries or five or more inner peripheries are also possible.

[0040] Specifically, frame portion 40 of support substrate 30 includes support portions 41 and 42 and connecting portions 51 and 52. Support portion 41 is a first support portion, and support portion 42 is a second support portion. Furthermore, connecting portion 51 is a first connecting portion, and connecting portion 52 is a second connecting portion.

[0041] For example, support portion 41, which is a first support portion, is attached to base 2. Support portion 42, which is a second support portion, faces support portion 41 and is attached to base 2. For example, as shown in FIGS. 3 and 4, support portion 41 and support portion 42 face each other in direction DR1. As shown in FIG. 1, support portions 41 and 42 are joined and attached to base 2 by joining member B1. Specifically, support portions 41 and 42 are joined and attached to a step portion of recess 9A of base 2 by joining member B1 made of a conductive adhesive. For example, joining by joining member B1 is achieved by applying a conductive adhesive made of a thermosetting adhesive such as silver paste to internal terminals 6A and 6B in FIG. 1 and joining support portions 41 and 42 of support substrate 30.

[0042] Furthermore, connecting portions 51 and 52 connect supporting portion 41, which is the first supporting portion, to supporting portion 42, which is the second supporting portion. For example, connecting portion 51, which is the first connecting portion, connects supporting portion 41 and supporting portion 42 at the upper side of FIG. 3, and connecting portion 52, which is the second connecting portion, connects supporting portion 41 and supporting portion 42 at the lower side of FIG. 3. The region surrounded by supporting portions 41 and 42 and connecting portions 51 and 52 is the inner region of frame portion 40, and element mounting portion 70 is provided in this inner region. In this embodiment, stress relief portions 61 and 62, which will be described in detail later, are provided for connecting portions 51 and 52. Note that although FIGS. 3 and 4 show two connecting portions, the number of connecting portions may be one or three or more.

[0043] The beam portions 71, 72, 73, and 74 support the element mounting portion 70 in the inner region of the frame portion 40. The beam portions 71, 72, 73, and 74 can also be called spring portions. For example, the beam portions 71 and 72 extend in the direction DR1 from the support portion 41 of the frame portion 40. The beam portions 73 and 74 extend in the opposite direction to the direction DR1 from the support portion 42 of the frame portion 40. Note that although FIGS. 3 and 4 show a case in which four beam portions 71, 72, 73, and 74 are provided as the multiple beam portions, this embodiment is not limited to this, and the number of beam portions may be two, three, or five or more. For example, modifications are also possible, such as providing only beam portions 71 and 73 or only beam portions 72 and 74 as the multiple beam portions.

[0044] As shown in FIGS. 3 and 4 , each of the beams 71, 72, 73, and 74 has an S-shaped meandering portion along its length, allowing it to easily elastically deform in the directions DR1, DR2, and DR3. The deformation of the beams 71 to 74 in the directions DR1, DR2, and DR3 effectively absorbs and alleviates stress transmitted from the base 2. For example, the S-shaped meandering allows the beams 71 to 74 to be elongated, thereby absorbing stress and strain through their flexible deformation. Mechanical shocks, such as shocks caused by dropping or vibrations, on the resonator device 1 can also be absorbed, reducing stress, strain, and mechanical shocks that occur in the resonator element 10. However, the shape of each of the beams 71 to 74 is not particularly limited. For example, the meandering portion may be omitted and the beams may be straight. Furthermore, at least one of the beams 71 to 74 may have a different shape from the others.

[0045] The vibration element 10 is attached to and mounted on the element mounting portion 70 supported by the beam portions 71 to 74. For example, the base portion 21 of the vibration element 10 in FIG. 2 is fixed via the conductive bonding member B2 in FIG. 3, thereby attaching the vibration element 10 to the element mounting portion 70. For example, each terminal, such as a driving terminal and a detection terminal, provided on the base portion 21 of the vibration element 10 is bonded to each of the bonding members B2 shown in FIG. 3. For example, the terminal for the drive signal DS provided on the base portion 21 of the vibration element 10 is bonded to the bonding member B2 for DS, which is arranged on the left side of the element mounting portion 70 in FIG. 3. Furthermore, the terminal for the feedback signal DG, the terminal for the detection signal S1, and the terminal for the detection signal S2 provided on the base portion 21 of the vibration element 10 are bonded to the bonding members B2 for DG, S1, and S2, which are arranged on the right side of the element mounting portion 70 in FIG. 3, respectively.

[0046] 3 and 4, wirings LDS, LDG, LS1, LS2, and LGND for DS, DG, S1, S2, and GND are wired on the support substrate 30. Furthermore, as shown in Fig. 4, terminals TDS, TDG, TS1, TS2, and TGND for DS, DG, S1, S2, and GND are provided on a surface SF2, which is, for example, the lower surface, of the support substrate 30. Furthermore, metal films 43 set to a GND potential are formed on the upper and lower surfaces of the support substrate 30, and the GND wiring LGND is formed by these metal films 43. GND is the potential of the low-potential power supply and can also be called VSS.

[0047] For example, one end of the DS wiring LDS is connected to the DS bonding member B2 as shown in Fig. 3, is routed through the support substrate 30, and the other end is connected to the DS terminal TDS as shown in Fig. 4. Also, one end of the DG wiring LDG is connected to the DG bonding member B2 as shown in Fig. 3, is routed through the support substrate 30, and the other end is connected to the DG terminal TDG as shown in Fig. 4. Also, one end of the S1 and S2 wiring LS1 and LS2 is connected to the S1 and S2 bonding members B2 as shown in Fig. 3, is routed through the support substrate 30, and the other end is connected to the S1 and S2 terminals TS1 and TS2 as shown in Fig. 4. Also, one end of the GND wiring LGND is connected to the GND bonding member B2 as shown in Fig. 3, is routed through the support substrate 30, and the other end is connected to the GND terminal TGND as shown in Fig. 4.

[0048] The terminals TDS, TDG, TS1, TS2, and TGND for DS, DG, S1, S2, and GND are connected to the internal terminals 6A and 6B provided in the stepped portion of the recess 9A in FIG. 1 via the bonding members B1 for DS, DG, S1, S2, and GND. As described above, the internal terminals 6A and 6B are connected to the internal terminals 7A and 7B via internal wiring (not shown), and the internal terminals 7A and 7B are connected to the circuit device 20 by bonding wires BW. This enables the drive signal DS, feedback signal DG, and detection signals S1 and S2 to be transmitted between the vibration element 10 and the circuit device 20 via the support substrate 30. In this way, the support substrate 30 also functions as a relay substrate for relaying signals. The GND terminal TGND of the support substrate 30 is connected to the GND terminal (pad) of the circuit device 20 and also to the GND external terminals provided as external terminals 8A and 8B in FIG. 1.

[0049] 3. Stress relief section In this embodiment, as shown in FIGS. 3 and 4, stress relief portions 61 and 62 are provided on the frame portion 40 of the support substrate 30. The stress relief portion 61 is a first stress relief portion, and the stress relief portion 62 is a second stress relief portion. The stress relief portions 61 and 62 are realized by, for example, a thin portion, a narrow portion, or a spring portion. The number of stress relief portions is not limited to two, and may be one, or three or more. These stress relief portions 61 and 62 will be described in detail below with reference to FIGS. 5 to 13. FIGS. 5 to 13 show a plan view of the support substrate 30 in a plan view in the direction DR3 and a cross-sectional view taken along line A1. Note that in this embodiment, the shape of the support substrate 30 is shown in a simplified form, and the dimensions, shape, and the like are not limited thereto.

[0050] For example, as a first comparative example of this embodiment, there is a method of using a support member made of a bonded body of polyimide film and copper foil as a member for supporting the vibration element 10. However, with this polyimide film support member, the resonant frequency fluctuates significantly with temperature changes, and a situation may occur in which the resonant frequency overlaps with the vibration frequency (drive frequency) of the vibration element 10, such as 50 KHz. When this situation occurs, unnecessary vibrations are generated in the vibration element 10, and unnecessary signals due to these unnecessary vibrations are detected, deteriorating the detection accuracy of physical quantities such as angular velocity.

[0051] In this regard, the support substrate 30 of this embodiment is made of a substrate such as a quartz substrate, whose resonant frequency has smaller temperature fluctuations than the polyimide film support member. Therefore, it is possible to reduce the temperature-induced fluctuations in the resonant frequency of the support substrate 30, and to suppress unwanted vibrations in the vibration element 10 due to vibrations at the resonant frequency of the support substrate 30. Furthermore, if the vibration element 10 is made of a quartz substrate, and the support substrate 30 is also made of the same quartz substrate, it is possible to make the thermal expansion coefficients of the support substrate 30 and the vibration element 10 equal. This makes it possible to prevent malfunctions and deterioration of detection accuracy caused by thermal stress due to differences in thermal expansion coefficients.

[0052] A second comparative example of this embodiment uses a support substrate without a frame, as in the prior art of Patent Document 1. In this second comparative example, a first support portion and a second support portion are provided as separate members for the support substrate, with the first support portion fixed to a first step portion on the left side of recess 9A in FIG. 1 and the second support portion fixed to a second step portion on the right side of recess 9A. The element mounting portion is supported by a plurality of beam portions extending from the first support portion toward the center and a plurality of beam portions extending from the second support portion toward the center.

[0053] However, the method of the second comparative example lacks rigidity in the beam portion, and for example, if stress that pulls the support substrate to both sides occurs, as described below, excessive stress may be applied to the beam portion, resulting in a malfunction. Furthermore, when the support substrate is mounted on the package, the beam portion is prone to flexural deformation, making handling during mounting difficult. Furthermore, since the second comparative example does not have a connecting portion in the frame, there is a risk that the laser may be irradiated onto the circuit device below when, for example, trimming the weight portion, which is the balance adjustment portion described in Figure 2, with a laser.

[0054] 5, the support substrate 30 of this embodiment has a frame portion 40. An element mounting portion 70 on which the vibration element 10 is mounted is provided inside the frame portion 40, and a plurality of beam portions 71 to 74 are configured to support the element mounting portion 70 inside the frame portion 40.

[0055] In the support substrate 30 configured as described above, the beams 71-74 are provided in an inner region of the frame 40. This allows the frame 40 to function as a reinforcing member, ensuring the rigidity of the beams 71-74 and preventing problems caused by excessive stress on the beams 71-74. For example, a connecting portion 51 of the frame 40 is provided on the side of the beams 71-74 in the direction DR2, and a connecting portion 52 of the frame 40 is provided on the side of the beams 71-74 opposite the direction DR2. Therefore, stress applied to the support substrate 30 is distributed to the connecting portions 51 and 52, preventing excessive stress from being applied to the beams 71-74. Furthermore, even when the beams 71-74 are easily deformed, the connecting portions 51 and 52 of the frame 40 ensure the rigidity of the support substrate 30, making handling during mounting easier. Furthermore, when trimming the weight portion, which is the balance adjustment portion of Figure 2, using a laser or the like, it is possible to prevent the laser from being irradiated onto the circuit device 20 below, for example, due to the connecting portions 51 and 52 of the frame portion 40 acting as a barrier.

[0056] On the other hand, it has been found that the following problems occur when using a support substrate 30 configured as shown in FIG. 5. For example, as shown in FIGS. 1 and 4, the support substrate 30 and base 2 are bonded using a bonding member B1 made of a thermosetting adhesive such as silver paste. The thermosetting adhesive hardens, for example, by applying heat in an oven. After thermal hardening, the base 2 and support substrate 30 shrink at a rate corresponding to their respective thermal expansion coefficients when returning from a high temperature to room temperature. In this case, the thermal expansion coefficient of the support substrate 30 is greater than that of the base 2. For example, the thermal expansion coefficient of alumina, the ceramic that makes up the base 2, is approximately 6.9 to 7.5 ppm / °C, while the thermal expansion coefficient of quartz crystal is approximately 13.37 ppm / °C perpendicular to the C-axis. Therefore, when returning from a high temperature to room temperature, the support substrate 30 shrinks more than the base 2. 1, the support portion 41 of the support substrate 30 is bonded and fixed to the first step portion on the left side of the recess 9A by a bonding member B1, and the support portion 42 is bonded and fixed to the second step portion on the right side of the recess 9A by a bonding member B1. Therefore, when the temperature returns from a high temperature to room temperature, a large stress is generated that pulls the support substrate 30 to both sides. When such a tensile stress acts on the support substrate 30, the stress is concentrated in areas with weak rigidity, which may cause malfunctions.

[0057] 6 shows an example of a support substrate 30 that does not have a stress relaxation portion. In this support substrate 30, stress is concentrated at the base of the beam portion 72, causing a crack defect as shown in E1. For example, in the polyimide film of the first comparative example, which is an elastic or ductile member, cracks as shown in E1 do not occur. However, in the support substrate 30, which is a brittle member, the stress generated in the support substrate 30 is not easily alleviated by deformation, so cracks as shown in E1 occur. When such a defect occurs, there is a risk of problems such as reduced reliability and adverse effects on the vibration characteristics of the vibration element 10.

[0058] Therefore, in this embodiment, in a support substrate 30 having a frame portion 40, an element mounting portion 70, and beam portions 71 to 74 as shown in Fig. 5, a configuration is adopted in which stress relief portions 61, 62 are provided in the frame portion 40. Specifically, for example, the stress relief portions 61, 62 are provided in the connecting portions 51, 52 of the frame portion 40. The stress relief portions 61, 62 are, for example, thin portions, narrow portions, or spring portions.

[0059] In FIG. 5 , thin slits are provided as the stress relief portions 61 and 62. The thin portions refer to, for example, a thin thickness in the out-of-plane direction of the support substrate 30. The out-of-plane direction is a direction perpendicular to the main surface of the support substrate 30, e.g., the direction DR3. The out-of-plane direction can also be referred to as the thickness direction of the support substrate 30. In FIG. 5 , the slits provided as the stress relief portions 61 and 62 have a reduced thickness in the direction DR3, which is the out-of-plane direction of the support substrate 30. By providing such slits as the stress relief portions 61 and 62, even if stress occurs in the support substrate 30 due to, for example, a difference in thermal expansion coefficient between the support substrate 30 and the base 2, the support substrate 30 deforms at the slits, thereby alleviating the stress acting on each portion of the support substrate 30. In other words, by providing portions of the support substrate 30 that are easily deformed, stress can be alleviated in other portions. For example, by dispersing the stress acting on the support substrate 30, stress concentration at the bases of the beam portions 71 to 74 can be suppressed, thereby preventing defects such as cracks as shown in E1 of FIG. 6 from occurring.

[0060] The thickness of the thin portions of the stress relaxation portions 61, 62 in the direction DR3 is, for example, about 1 / 5 to 4 / 5 of the thickness of the support substrate 30 in the direction DR3. The thickness of the support substrate 30 is, for example, about 80 μm to 120 μm. The smaller the thickness of the thin portions, the more easily the support substrate 30 deforms due to stress, and the more effectively the stress can be relaxed. However, if the thickness of the thin portions is too small, problems such as a decrease in the strength of the support substrate 30 may occur.

[0061] FIG. 7 shows an example in which slits, which are recessed portions, are provided as stress relief portions 61 and 62 only on the upper surface of the support substrate 30. Slits on the upper surface only, as shown in FIG. 7, can be easily formed, for example, by half-etching, which etches the upper surface, during the manufacturing process of the support substrate 30. In this case, the depth of the slits (thickness of the thin portions), which are the thin portions of the stress relief portions 61 and 62, can be controlled by the amount of half-etching performed when forming the slits. By providing slits as shown in FIG. 7, when stress occurs due to a difference in thermal expansion coefficient with the base 2, the support substrate 30 deforms, for example, into a downward concave shape, thereby relieving the stress. Deforming into such a downward concave shape increases the distance between the vibration element 10 and the support substrate 30, thereby reducing the parasitic capacitance between the vibration element 10 and the support substrate 30. This makes it possible to prevent, for example, deterioration of detection accuracy due to electrostatic leakage caused by this capacitance.

[0062] 8 shows an example in which multiple slits are provided as stress relief portions 61, 62. For example, in FIG. 8, multiple slits are provided along direction DR1, which is the long side direction of support substrate 30. By providing multiple slits as stress relief portions 61, 62 in each connecting portion of connecting portions 51, 52 in this way, support substrate 30 becomes more susceptible to deformation when stress is applied, compared to the case in which one slit is provided in each connecting portion as in FIG. 5. This makes it possible to further reduce and relieve stress acting on each portion of support substrate 30 compared to FIG. 5.

[0063] FIG. 9 shows an example in which narrow portions are provided as the stress relief portions 61, 62. The narrow portions refer to, for example, a narrow width in the in-plane direction of the support substrate 30. The in-plane direction is a direction along the main surface of the support substrate 30, such as the direction DR2. For example, in FIG. 9, narrow portions having a narrow width in the in-plane direction DR2 are provided as the stress relief portions 61, 62. These narrow portions can also be referred to as constricted portions in the in-plane direction. As can be seen from the cross-sectional view of the support substrate 30 taken along line A1, the stress relief portions 61, 62 in FIG. 9 also serve as thin portions having a small thickness in the direction DR3. Compared to the stress relief portions 61, 62 in FIG. 5, for example, the stress relief portions 61, 62 in FIG. 9 make the support substrate 30 more susceptible to deformation when stress is applied, thereby further alleviating stress acting on each portion of the support substrate 30. The width of the narrow portions of the stress relaxation portions 61, 62 in the direction DR2, for example, is, for example, about 1 / 5 to 4 / 5 of the width of the connecting portions 51, 52 of the support substrate 30 in the direction DR2.

[0064] Fig. 10 shows an example in which spring portions are provided as stress relief portions 61, 62. The spring portions in Fig. 10, like beam portions 71 to 74, have a shape that is easily elastically deformed in, for example, the in-plane directions DR1 and DR2. The elastic deformation of such spring portions makes it possible to further relieve stress acting on each portion of support substrate 30 due to differences in thermal expansion coefficients. Furthermore, the spring portions as stress relief portions 61, 62 do not require the half-etching process that is required when forming slits as stress relief portions 61, 62, which has the advantage of simplifying the manufacturing process and reducing manufacturing costs.

[0065] 11 shows an example in which a plurality of spring portions are provided as stress relief portions 62, 62. For example, in FIG. 11, a plurality of spring portions are provided along direction DR1, which is the long side direction of support substrate 30. In this way, by providing a plurality of spring portions as stress relief portions 61, 62 at each connecting portion of connecting portions 51, 52, support substrate 30 becomes more likely to deform when stress is applied compared to the case in which one spring portion is provided at each connecting portion as in FIG. 10. This makes it possible to further reduce and relieve stress acting on each portion of support substrate 30 compared to FIG. 10.

[0066] 1, 3, and 4, the vibration device 1 of this embodiment includes the vibration element 10, the support substrate 30 that supports the vibration element 10, and the base 2 to which the support substrate 30 is attached. The support substrate 30 also includes a frame portion 40, an element mounting portion 70 that is provided inside the frame portion 40 and on which the vibration element 10 is mounted, and a plurality of beam portions 71 to 74 that support the element mounting portion 70 inside the frame portion 40. As described with reference to FIGS. 5 and 7 to 11, the frame portion 40 includes stress relaxation portions 61 and 62 that are thin portions, narrow width portions, or spring portions.

[0067] As described above, in this embodiment, the support substrate 30 has a frame portion 40, an element mounting portion 70 is provided inside the frame portion 40, and a plurality of beam portions 71-74 support the element mounting portion 70 inside the frame portion 40. With a support substrate 30 configured as described above, the provision of the frame portion 40 ensures rigidity at the beam portions 71-74. This prevents defects caused by excessive stress on the beam portions 71-74 and facilitates handling during mounting. Furthermore, the frame portion 40 can function as a barrier to protect devices such as the circuit device 20 below.

[0068] In this embodiment, stress relief portions 61, 62, which are thin portions, narrow portions, or spring portions, are provided on the frame portion 40. By providing such stress relief portions 61, 62, even if stress occurs in the support substrate 30, the support substrate 30 will deform at the locations of the stress relief portions 61, 62, making it possible to relieve the stress acting on each portion of the support substrate 30. This makes it possible to suppress the occurrence of defects caused by stress occurring in the support substrate 30.

[0069] 3 to 5 and 7 to 11, frame 40 includes support portion 41, which is a first support portion attached to base 2, support portion 42, which is a second support portion attached to base 2 and faces support portion 41, and connecting portions 51 and 52 that connect support portion 41 and support portion 42. Stress relief portions 61 and 62 are provided on connecting portions 51 and 52.

[0070] By configuring the support portion 41 and the support portion 42 to be connected by the connecting portions 51 and 52 in this manner, it is possible to further increase the rigidity of the support substrate 30. By providing stress relief portions 61 and 62 to the connecting portions 51 and 52 that are provided to increase the rigidity in this manner, it becomes possible to effectively relieve stress in the direction along the connecting portions 51 and 52.

[0071] Furthermore, when directions DR1 and DR2 are perpendicular to each other, the support substrate 30 is a substrate whose long side is in the first direction, DR1, and whose short side is in the second direction, DR2, and the connecting portions 51 and 52 are members extending along the direction DR1. For example, stress generated due to a difference in thermal expansion coefficient acts more strongly along the long side direction of the support substrate 30 than along the short side direction. Therefore, by providing stress relief portions 61 and 62 to the connecting portions 51 and 52 extending along the long side direction, DR1, it is possible to effectively relieve stress in the long side direction.

[0072] In this embodiment, connecting portions 51 and 52 that connect supporting portion 41 and supporting portion 42 are provided as connecting portions, and stress relief portions 61 and 62 are provided as stress relief portions. Supporting portions 41 and 42 are the first supporting portion and the second supporting portion, respectively, connecting portions 51 and 52 are the first connecting portion and the second connecting portion, respectively, and stress relief portions 61 and 62 are the first stress relief portion and the second stress relief portion, respectively.

[0073] By providing the stress relief portion 61 in the connecting portion 51 connecting the support portion 41 and the support portion 42, stress in the direction along the connecting portion 51 can be effectively relieved. Furthermore, by providing the stress relief portion 62 in the connecting portion 52 connecting the support portion 41 and the support portion 42, stress in the direction along the connecting portion 52 can be effectively relieved. For example, stress caused by a difference in the thermal expansion coefficients of the base 2 and the support substrate 30 acts as a stress pulling the support substrate 30 to both sides along, for example, the direction DR1, with the bonding member B1 on the support portion 41 side and the bonding member B1 on the support portion 42 side as the fixing points in FIG. 4 . This stress increases the farther away from the position of the fixing point, the bonding member B1. Therefore, by providing the stress relief portion 61 in the connecting portion 51 along the direction DR1 and the stress relief portion 62 in the connecting portion 52 along the direction DR1 and deforming the support substrate 30 at a position away from the fixing points, stress caused by the difference in the thermal expansion coefficients can be effectively relieved.

[0074] Furthermore, assuming that directions DR1 and DR2 are perpendicular to each other, as shown in FIGS. 3 to 5 and 7 to 11, frame 40 has inner peripheries SD1 and SD2 aligned along direction DR1, and inner peripheries SD3 and SD4 aligned along direction DR2. Inner peripheries SD1, SD2, SD3, and SD4 are the first, second, third, and fourth inner peripheries, respectively. Furthermore, multiple beams are provided, including beams 71 and 72 extending from inner periphery SD3 of frame 40 and beams 73 and 74 extending from inner periphery SD4 of frame 40. Beams 71 and 72 are first beams, and beams 73 and 74 are second beams.

[0075] By providing such beam portions 71, 72, 73, and 74, even when stress occurs in the direction DR1 due to, for example, a difference in thermal expansion coefficient, the beam portions 71 to 74 elastically deform, thereby making it possible to alleviate the stress acting on the support substrate 30. For example, in Fig. 4, the stress occurring between the upper GND bonding member B1 and the S1 bonding member B1 can be alleviated by the stress alleviation portion 61, and the stress occurring between the lower GND bonding member B1 and the S2 bonding member B1 can be alleviated by the stress alleviation portion 62. Furthermore, the stress occurring between the middle DS bonding member B1 and the DG bonding member B2 can be alleviated by the elastic deformation of the beam portions 71 to 74.

[0076] In this embodiment, two beam portions 71 and 72 are provided as the first beam portions, and two beam portions 73 and 74 are provided as the second beam portions, but the number of each of the first beam portions and second beam portions may be one or three or more.

[0077] In this embodiment, the stress relief portions include a stress relief portion 61 arranged from the inner periphery SD1 along the direction DR2, and a stress relief portion 62 arranged from the inner periphery SD2 along the direction DR2. Taking the slits in Figures 5, 7, and 8 as examples, the slit in stress relief portion 61 has a shape that extends upward from the inner periphery SD1 along the direction DR2. The slit in stress relief portion 62 has a shape that extends downward from the inner periphery SD2 along the direction DR2.

[0078] In this way, stress generated along direction DR1 due to a difference in thermal expansion coefficient or the like can be alleviated by stress alleviation portions 61, 62 arranged along direction DR2 perpendicular to direction DR1. For example, stress alleviation portions 61, 62 arranged along direction DR2 can deform around direction DR2 as an axis, thereby effectively alleviating stress generated along direction DR1. Note that stress alleviation portions 61, 62 may be arranged along direction DR1, for example, as shown in FIG. 9, or may have a portion along direction DR2 and a portion along direction DR1, as shown in FIGS. 10 and 11.

[0079] Next, a description will be given of the positional relationship between the support substrate 30, the vibration element 10, and the circuit device 20, and the positional relationship between the bonding member B1 and the stress relaxation portions 61 and 62. FIG. 12 is a diagram showing an example of the positional relationship between the support substrate 30, the vibration element 10, and the circuit device 20.

[0080] As shown in FIG. 12, the vibrating element 10 is disposed on the surface SF1 side of the support substrate 30. The circuit device 20 is disposed on the surface SF2 side of the support substrate 30. That is, the support substrate 30 is disposed between the vibrating element 10 and the circuit device 20. As described with reference to FIG. 2, the vibrating device 1 includes a circuit device 20 having a drive circuit 100 that drives the vibrating element 10. The vibrating element 10 also includes weights 27A, 27B, 27C, and 27D that serve as balance adjustment units. As shown in FIG. 12, the weights 27A, 27B, 27C, and 27D that serve as balance adjustment units, the connecting portions 51 and 52 of the support substrate 30, and the circuit device 20 overlap in a plan view. For example, the connecting portions 51 and 52 of the support substrate 30 are located below the weights 27A to 27D of the vibrating element 10, and the circuit device 20 is located below the connecting portions 51 and 52. In this way, when adjusting the balance of the vibration element 10, the connecting portions 51 and 52 of the support substrate 30 can be effectively used as protective members for the circuit device 20.

[0081] 2, for example, in order to adjust the vibration balance of the vibration element 10, a process of trimming the metal of the weights 27A to 27D with a laser is performed. This balance adjustment is performed in the manufacturing process of the vibration device 1, with the circuit device 20, the support substrate 30, and the vibration element 10 mounted in the package 4. Therefore, there is a risk that the laser used for the balance adjustment may be irradiated onto the circuit device 20 below the weights 27A to 27D.

[0082] 12, in the present embodiment, weights 27A to 27D, which are balance adjustment units, connecting portions 51 and 52 of support substrate 30, and circuit device 20 overlap in a plan view in direction DR3. In this way, connecting portions 51 and 52 act as barriers during balance adjustment, preventing the laser from being irradiated onto circuit device 20 and protecting circuit device 20.

[0083] The vibration element 10 is, for example, a double-T type gyro sensor element as described in Fig. 2. As shown in Fig. 12, the stress relaxation portions 61 and 62 of the support substrate 30 are provided below the weights 28A and 28B of the detection arms 19A and 19B of the double-T type gyro sensor element. In this way, when balance adjustment is performed such as trimming the metal of the weights 27A to 27D of the drive arms 18A to 18D of the double-T type gyro sensor element, it is possible to suppress the occurrence of problems caused by this balance adjustment.

[0084] For example, stress relief portions 61, 62 can be positioned below weights 27A-27D of drive arms 18A-18D. However, if they are positioned below weights 27A-27D used for balance adjustment, the laser used for balance adjustment may be irradiated onto stress relief portions 61, 62, potentially causing a malfunction. In other words, it is not desirable for the laser used for balance adjustment to be irradiated onto stress relief portions 61, 62, such as thin portions. In this regard, because weights 28A, 28B of detection arms 19A, 19B are not used for balance adjustment, there is no problem with arranging stress relief portions 61, 62 below weights 28A, 28B.

[0085] The width of plummets 28A and 28B of detection arms 19A and 19B in direction DR1 is, for example, about 400 μm to 500 μm, and the width of plummets 27A to 28D of drive arms 18A to 18D in direction DR1 is, for example, about 200 μm to 300 μm. The width of the slits that are stress relaxation portions 61 and 62 in direction DR1 can be, for example, about 100 μm to 200 μm.

[0086] FIG. 13 is a diagram showing an example of the positional relationship between the substrate bonding member B1 and the stress relaxation portions 61 and 62. For example, as described with reference to FIGS. 1 to 4, the resonator device 1 of this embodiment includes an element bonding member B2 that bonds the element mounting portion 70 of the support substrate 30 to the base 21 of the resonator element 10, and a substrate bonding member B1 that bonds the support substrate 30 to the base 2. As an example, the element bonding member B2 is realized by, for example, a metal bump. The substrate bonding member B1 is realized by, for example, a conductive adhesive, more specifically, a conductive thermosetting adhesive. In this way, the resonator element 10 can be mounted and attached to the support substrate 30 by bonding the element mounting portion 70 of the support substrate 30 to the base 21 of the resonator element 10 with the element bonding member B2. Then, the support substrate 30 and the base 2 can be bonded to the base 2 with the substrate bonding member B1, and the support substrate 30 to which the resonator element 10 is attached can be attached to the base 2.

[0087] 13, first substrate bonding members 91, 92, and 93 and second substrate bonding members 94, 95, and 96 are provided as substrate bonding members B1. The second substrate bonding members 94, 95, and 96 are arranged with the first substrate bonding members 91, 92, and 93 sandwiching the element mounting portion 70. For example, the first substrate bonding members 91, 92, and 93 are arranged below the support portion 41 of the support substrate 30, and the second substrate bonding members 94, 95, and 96 are arranged below the support portion 42 of the support substrate 30. The downward direction is, for example, the opposite side of the direction DR3. Specifically, in FIG. 1, the first substrate bonding members 91, 92, and 93 are formed on the internal terminals 6A in the first stepped portion on the left side of the recess 9A of the base 2, and the second substrate bonding members 94, 95, and 96 are formed on the internal terminals 6B in the second stepped portion on the right side of the recess 9A of the base 2.

[0088] The stress relief portions 61 and 62 are provided between the first substrate bonding member and the second substrate bonding member. For example, in Fig. 13, the stress relief portion 61 is disposed between the first substrate bonding member 91 and the second substrate bonding member 94. The stress relief portion 62 is disposed between the first substrate bonding member 93 and the second substrate bonding member 96.

[0089] For example, stress due to the difference in thermal expansion coefficients between the base 2 and the support substrate 30 occurs as a stress along the direction DR1 that pulls the support substrate 30 inward, with the first-substrate bonding members 91, 92, and 93 and the second-substrate bonding members 94, 95, and 96 as the fixing points. This stress increases the farther from the fixing points. Therefore, by disposing a stress relief member 61 between the first-substrate bonding member 91 and the second-substrate bonding member 94, or by disposing a stress relief member 62 between the first-substrate bonding member 93 and the second-substrate bonding member 96, stress at locations far from the fixing points can be effectively relieved. Therefore, it is possible to effectively prevent stress concentration at other locations on the support substrate 30 due to deformation at the stress relief members 61 and 62 far from the fixing points.

[0090] The frame 40 also includes a support portion 41 attached to the base 2, a support portion 42 attached to the base 2 and facing the support portion 41, and connecting portions 51 and 52 that connect the support portion 41 and the support portion 42. The support portion 41 is joined to the base 2 by first substrate joining members 91, 92, and 93, and the support portion 42 is joined to the base 2 by second substrate joining members 94, 95, and 96.

[0091] In this way, the support portion 41 is joined to the base 2 with the first substrate joining members 91, 92, and 93, and the support portion 42 is joined to the base 2 with the second substrate joining members 94, 95, and 96, thereby making it possible to attach the support substrate 30 to the base 2. Then, by connecting such support portions 41 and 42 with the connecting portions 51 and 52, the rigidity of the support substrate 30 attached to the base 2 can be increased. This makes it possible to ensure rigidity in the beam portions 71 to 74 and the like, even when stress is generated due to, for example, a difference in the thermal expansion coefficients between the base 2 and the support substrate 30.

[0092] The substrate bonding member B1 is, for example, a thermosetting adhesive. For example, the first substrate bonding members 91, 92, and 93 and the second substrate bonding members 94, 95, and 96 in FIG. 13 are realized by a thermosetting adhesive. By using such a thermosetting adhesive, the support substrate 30 and the base 2 can be bonded by the substrate bonding member B1, which is a thermosetting adhesive, simply by placing the support substrate 30 on the base 2 and applying heat. After thermal curing, even if stress occurs due to a difference in the thermal expansion coefficients between the base 2 and the support substrate 30 when the temperature returns from a high temperature to room temperature, this stress can be effectively alleviated by the stress alleviation portions 61 and 62.

[0093] For example, the substrate bonding member B1 can be a conductive thermosetting adhesive in which a conductive filler such as silver filler is dispersed. For example, a thermosetting adhesive called silver paste is applied to the internal terminals 6A and 6B of the first and second stepped portions of the recess 9A of the base 2 shown in FIG. 1 . The support substrate 30 is then positioned so that the terminals TDS and TGND of the support portion 41 and the terminals TS1, TDG, and TS2 of the support portion 42 shown in FIG. 4 are aligned with the positions of the bonding members B1 for DS, GND, S1, DG, and S2. The resonator device 1 is then placed in an oven and heated to harden the thermosetting adhesive, thereby attaching the support substrate 30 to the base 2. In this case, stress is generated according to the difference in thermal expansion coefficients. However, in this embodiment, the stress relief portions 61 and 62 are provided to relieve this stress.

[0094] 1, 3, and 4, the support substrate 30 has a surface SF1 that is a first surface and a surface SF2 that is a second surface opposite to the surface SF1, and the vibration element 10 is supported on the surface SF1 side of the support substrate 30. As shown in FIG. 3, a metal film 43 that covers at least the stress relaxation portions 61 and 62 is provided on the surface SF1 side of the support substrate 30. For example, in FIG. 3, the metal film 43 set to a GND potential is formed on the surface SF1 of the support substrate 30. As shown in FIG. 4, a metal film 43 set to a GND potential is also formed on the surface SF2 of the support substrate 30. This metal film 43 serves as a GND shield for the support substrate 30.

[0095] 3, the metal film 43 is provided on the surface SF1 so as to cover the stress relaxation portions 61 and 62. In this way, the metal film 43 can be used as a protective film for the stress relaxation portions 61 and 62, or as a protective film for devices arranged in positions overlapping the stress relaxation portions 61 and 62.

[0096] 2 and 12, for example, the metal of the weights 27A to 27D is trimmed using a laser. In this case, it is undesirable to irradiate the laser onto the thin-walled or narrow-width stress absorbing portions 61 and 62 or onto the circuit device 20 arranged below the stress absorbing portions 61 and 62.

[0097] 3, the metal film 43 covering the stress relaxation portions 61, 62 is provided on the surface SF1 side of the support substrate 30. In this way, the metal film 43 serves as a protective film, making it possible to protect the stress relaxation portions 61, 62 and the circuit device 20.

[0098] Furthermore, in this embodiment, the support substrate 30 and the vibration element 10 are made of a quartz substrate. If the support substrate 30 is made of a quartz substrate like the vibration element 10, fluctuations in the resonant frequency of the support substrate 30 due to temperature changes can be reduced. This makes it easy to prevent the resonant frequency of the support substrate 30 from overlapping with the vibration frequency (drive frequency) of the vibration element 10. This effectively prevents unwanted vibrations from occurring in the vibration element 10, which can deteriorate detection accuracy, etc. Furthermore, if the support substrate 30 and the vibration element 10 are made of the same quartz substrate, it can also effectively prevent problems caused by differences in thermal expansion coefficients.

[0099] As described above, the vibration device of this embodiment includes a vibration element, a support substrate that supports the vibration element, and a base to which the support substrate is attached. The support substrate includes a frame portion, an element mounting portion that is provided inside the frame portion and on which the vibration element is mounted, and a plurality of beam portions that support the element mounting portion inside the frame portion. The frame portion includes a stress relief portion that is a thin portion, a narrow portion, or a spring portion.

[0100] As described above, in this embodiment, the support substrate has a frame portion, and the element mounting portion is supported by a plurality of beam portions inside the frame portion, thereby ensuring rigidity at the beam portions. Furthermore, in this embodiment, such a frame portion is provided with a stress relief portion, which is a thin portion, a narrow portion, or a spring portion. By providing such a stress relief portion, even if stress occurs in the support substrate, it is possible to relieve the stress acting on each portion of the support substrate, thereby making it possible to suppress the occurrence of defects caused by the stress generated in the support substrate.

[0101] In this embodiment, the frame portion includes a first support portion attached to the base, a second support portion attached to the base and facing the first support portion, and a connecting portion connecting the first support portion and the second support portion, and the stress relief portion may be provided on the connecting portion.

[0102] By configuring the first support section and the second support section to be connected by the connecting section in this way, the rigidity of the support substrate can be increased. Furthermore, by providing a stress relief section at the connecting section provided to increase the rigidity in this way, it becomes possible to effectively relieve stress in the direction along the connecting section.

[0103] Furthermore, this embodiment includes a circuit device having a drive circuit that drives the vibration element, and the vibration element has a balance adjustment section, and the balance adjustment section, the connecting section, and the circuit device may overlap in a plan view.

[0104] In this way, when adjusting the balance of the vibration element, the connecting portion of the support substrate can be effectively used as a protective member for the circuit device.

[0105] In addition, in this embodiment, when the directions that are perpendicular to each other are defined as a first direction and a second direction, the support substrate is a substrate whose long side is in the first direction and whose short side is in the second direction, and the connecting portion may be a member that extends along the first direction.

[0106] By providing the stress relaxation portion in the connecting portion extending along the first direction, which is the long side direction, in this manner, it becomes possible to effectively relax the stress in the long side direction.

[0107] In addition, in this embodiment, the connecting portion may include a first connecting portion and a second connecting portion that connect the first support portion and the second support portion, and the stress relief portion may include a first stress relief portion arranged on the first connecting portion and a second stress relief portion arranged on the second connecting portion.

[0108] By providing a first stress relief portion in the first connecting portion that connects the first support portion and the second support portion in this way, it becomes possible to effectively relieve stress in the direction along the first connecting portion. Also, by providing a second stress relief portion in the second connecting portion that connects the first support portion and the second support portion, it becomes possible to effectively relieve stress in the direction along the second connecting portion.

[0109] In this embodiment, the vibration element may be a double-T gyro sensor element, and the stress relaxation portion may be provided below the weight portion of the detection arm of the double-T gyro sensor element.

[0110] In this way, when balance adjustment is performed using the weight portion of the drive arm of the double T-shaped gyro sensor element, it is possible to suppress the occurrence of problems caused by this balance adjustment.

[0111] In addition, in this embodiment, when the directions that are perpendicular to each other are defined as a first direction and a second direction, the frame portion has a first inner periphery and a second inner periphery along the first direction, and a third inner periphery and a fourth inner periphery along the second direction, and the multiple beam portions may include a first beam portion extending from the third inner periphery of the frame portion and a second beam portion extending from the fourth inner periphery of the frame portion.

[0112] By providing such first and second beam portions, even if stress along the first direction occurs in the support substrate, the first and second beam portions can elastically deform, thereby alleviating the stress acting on the support substrate.

[0113] In addition, in this embodiment, the stress relief portion may include a first stress relief portion arranged along the second direction from the first inner periphery, and a second stress relief portion arranged along the second direction from the second inner periphery.

[0114] In this way, stress generated in the support substrate, for example, along a first direction, can be alleviated by the first stress relief portion and the second stress relief portion arranged along a second direction perpendicular to the first direction.

[0115] This embodiment may also include an element bonding member that bonds the element mounting portion of the support substrate to the base of the vibration element, and a substrate bonding member that bonds the support substrate to the base.

[0116] In this way, the vibration element can be attached to the support substrate by joining the element mounting portion of the support substrate and the base of the vibration element with an element bonding member, and the support substrate with the vibration element attached can be attached to the base by joining the support substrate and the base with a substrate bonding member.

[0117] In addition, in this embodiment, the substrate bonding members include a first substrate bonding member and a second substrate bonding member arranged between the first substrate bonding member and the element mounting portion, and the stress relief portion may be provided between the first substrate bonding member and the second substrate bonding member.

[0118] In this way, even if stress occurs in the support substrate when the first substrate bonding member and the second substrate bonding member are used as fixing points, the first stress relief portion and the second stress relief portion can effectively relieve the stress at points far from the fixing points, making it possible to effectively prevent stress from concentrating at other points on the support substrate.

[0119] In this embodiment, the frame may include a first support portion attached to the base, a second support portion attached to the base and facing the first support portion, and a connecting portion connecting the first support portion and the second support portion. The first support portion may be joined to the base by a first substrate bonding member, and the second support portion may be joined to the base by a second substrate bonding member.

[0120] In this way, the support substrate can be attached to the base by joining the first support part to the base with the first substrate joining member and the second support part to the base with the second substrate joining member. Then, by connecting such first support part and second support part with the connecting part, the rigidity of the support substrate attached to the base can be increased.

[0121] In this embodiment, the substrate bonding member may be a thermosetting adhesive.

[0122] By using such a thermosetting adhesive, the support substrate and the base can be bonded together by the thermosetting adhesive simply by placing the support substrate on the base and applying heat.

[0123] In addition, in this embodiment, the support substrate has a first surface and a second surface opposite to the first surface, the vibration element is supported on the first surface side of the support substrate, and a metal film covering at least the stress relaxation portion may be provided on the first surface side of the support substrate.

[0124] This makes it possible to use the metal film as a protective film for the stress relaxation section, or as a protective film for a device that is placed at a position that overlaps the stress relaxation section in a plan view.

[0125] In this embodiment, the support substrate and the vibration element may be made of a quartz substrate.

[0126] By forming the support substrate from a quartz substrate like the vibration element, fluctuations in the resonant frequency of the support substrate due to temperature changes can be reduced, and unwanted vibrations in the vibration element can be effectively prevented.

[0127] Although the present embodiment has been described in detail above, those skilled in the art will readily understand that many modifications are possible without substantially departing from the novel features and effects of the present invention. Therefore, all such modifications are intended to be included within the scope of the present invention. For example, a term described at least once in the specification or drawings together with a different term with a broader or equivalent meaning can be replaced with that different term anywhere in the specification or drawings. Furthermore, the configurations of the vibration device, supporting substrate, vibration element, circuit device, etc. are not limited to those described in the present embodiment, and various modifications are possible. [Explanation of symbols]

[0128] 1...Vibration device, 2...Base, 3...Lid, 4...Package, 5A, 5B...Joint member, 6A, 6B, 7A, 7B...Internal terminal, 8A, 8B...External terminal, 9, 9A, 9B, 9C...Recess, 10...Vibration element, 13, 14...Drive electrode, 15, 16...Detection electrode, 17...Ground electrode, 18A, 18B, 18C, 18D...Drive arm, 19A, 19B...Detection arm, 20...Circuit device, 21...Base, 22A, 22B...Connecting arm, 23, 24, 25, 26...Terminal, 27A, 27B, 27C, 27D, 28A, 28B...Plummet portion, 30...Support substrate, 40...Frame portion, 41, 42...Support portion, 43...Metal film, 51, 52...Connecting portion, 61, 62...Stress relief portion, 70...Element mounting portion, 71, 72, 73, 74...Beam portion, 91, 92, 93...Bonding member for first substrate, 94, 95, 96...Bonding member for second substrate, 100...Drive circuit, 102...Detection circuit, 104...Processing circuit, B1...Bonding member, B2...Bonding member, BW...Bonding wire, DG...Feedback signal, DR1, DR2, DR3...Direction, DS...Drive signal, LDG, LDS, LGND, LS1, LS2...Wiring, S...Accommodation space, S1, S2...Detection signal, SD1, SD2, SD3, SD4...Inner periphery, SF1, SF2...Surface, TDG, TDS, TGND, TS1, TS2...Terminal

Claims

1. A vibration element; a support substrate that supports the vibration element; a base to which the support substrate is attached; Including, The support substrate is A frame portion and an element mounting portion provided inside the frame portion and on which the vibration element is mounted; a plurality of beams that support the element mounting portion inside the frame; Including, A vibration device characterized in that the frame portion includes a stress relaxation portion that is a thin portion, a narrow portion, or a spring portion.

2. The vibrating device according to claim 1 , The frame portion is a first support portion attached to the base; a second support portion attached to the base and facing the first support portion; a connecting portion that connects the first support portion and the second support portion; Including, A vibration device, characterized in that the stress relaxation portion is provided at the connecting portion.

3. The vibration device according to claim 2, a circuit device having a drive circuit that drives the vibration element; The vibration element has a balance adjustment unit, A vibration device, characterized in that, in a plan view, the balance adjustment portion, the connection portion, and the circuit device overlap each other.

4. The vibration device according to claim 2, When directions perpendicular to each other are defined as a first direction and a second direction, the support substrate is a substrate whose long side is in the first direction and whose short side is in the second direction, A vibration device characterized in that the connecting portion is a member extending along the first direction.

5. The vibration device according to claim 2, As the connecting portion, a first connecting portion and a second connecting portion that connect the first support portion and the second support portion are provided, A vibration device characterized in that the stress relaxation portion includes a first stress relaxation portion arranged at the first connecting portion and a second stress relaxation portion arranged at the second connecting portion.

6. The vibrating device according to claim 1 , the vibration element is a double T-type gyro sensor element, A vibration device characterized in that the stress relaxation portion is provided below a weight portion of a detection arm of the double T-type gyro sensor element.

7. The vibrating device according to claim 1 , When directions perpendicular to each other are defined as a first direction and a second direction, The frame portion is a first inner periphery and a second inner periphery along the first direction, and a third inner periphery and a fourth inner periphery along the second direction; A vibration device characterized in that the multiple beam portions include a first beam portion extending from the third inner periphery of the frame portion and a second beam portion extending from the fourth inner periphery of the frame portion.

8. The vibration device according to claim 7, A vibration device characterized in that the stress relaxation portion includes a first stress relaxation portion arranged from the first inner periphery along the second direction, and a second stress relaxation portion arranged from the second inner periphery along the second direction.

9. The vibration device according to claim 1 , an element bonding member that bonds the element mounting portion of the support substrate to a base portion of the vibration element; a substrate bonding member that bonds the support substrate and the base; A vibration device comprising:

10. The vibration device according to claim 9, As the substrate bonding members, a first substrate bonding member and a second substrate bonding member are provided, the first substrate bonding member and the second substrate bonding member being disposed to sandwich the element mounting portion, The stress relaxation portion is A vibration device, characterized in that it is provided between the first substrate bonding member and the second substrate bonding member.

11. The vibration device according to claim 10, The frame portion is a first support portion attached to the base; a second support portion attached to the base and facing the first support portion; a connecting portion that connects the first support portion and the second support portion; Including, The first support portion is The first substrate is bonded to the base by the bonding member, The second support portion is A vibration device characterized in that it is joined to the base by the second substrate joining member.

12. The vibration device according to claim 9, The vibration device is characterized in that the substrate bonding member is a thermosetting adhesive.

13. The vibrating device according to claim 1 , the support substrate has a first surface and a second surface opposite to the first surface; the vibration element is supported on the first surface side of the support substrate, A resonator device, characterized in that a metal film covering at least the stress relaxation portion is provided on the first surface side of the support substrate.

14. The vibration device according to any one of claims 1 to 13, The vibration device is characterized in that the support substrate and the vibration element are made of a quartz substrate.

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