Laminated body and wiring sheet
The laminate and wiring sheet address the issues of low versatility and image clarity in light-based sensing technologies by using a substrate with a coating layer and adhesive layer optimized for near-infrared transmission and reduced surface roughness, resulting in sharper laser-irradiated images.
Patent Information
- Application Number
- JP2024057365
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-03-29
- Publication Date
- 2025-10-10
AI Technical Summary
Conventional materials used in light-based sensing technologies, such as LiDAR, suffer from low versatility, high cost, and poor image clarity due to surface roughness and layering issues, which affect the clarity of laser-irradiated images.
A laminate and wiring sheet design featuring a substrate, a coating layer with infrared transparent ink, and a pressure-sensitive adhesive layer with controlled surface roughness and refractive index, optimized for near-infrared light transmission and reduced visible light scattering.
The laminate and wiring sheet enhance image clarity by minimizing light scattering, allowing for sharper images to be obtained through laser irradiation, thereby improving the performance of light-based sensing technologies.
Smart Images

Figure 2025154392000001_ABST
Abstract
Description
[Technical Field]
[0001] The present invention relates to a laminate and a wiring sheet. [Background technology]
[0002] Known examples of light-based sensing technologies include LiDAR (Light Detection and Ranging or Laser Imaging Detection and Ranging). LiDAR is a remote sensing technology that irradiates a target with laser light and measures the distance to the target, its position, and its shape based on information such as the light reflected by the target. Examples of irradiating light used in LiDAR include near-infrared light. For example, the following technologies have been proposed as materials that are applicable to LiDAR and have high transmittance for near-infrared light.
[0003] Patent Document 1 discloses a glass that contains specific amounts (molar proportions in cation %) of silicon, sodium, and potassium cations, and can further contain specific amounts (molar proportions in cation %) of boron, aluminum, nickel, chromium, cobalt, and other cations.
[0004] Patent Document 2 discloses a window for a detection system. The window disclosed in Patent Document 2 includes a substrate having a predetermined thickness and a refractive index for electromagnetic radiation having a wavelength of 905 nm, and a layered film disposed on the substrate. The layered film includes alternating layers of high-refractive-index material and low-refractive-index material, where the high-refractive-index material has a higher refractive index than the low-refractive-index material, and each layer of the layered film has a thickness. The thicknesses of the alternating layers are configured so that the window has a transmittance of at least 80% for electromagnetic radiation having a wavelength in the range of 850 nm to 950 nm. The window has a hardness of at least 10 GPa in the layered film, as measured by a Berkovich indentation hardness test. [Prior art documents] [Patent documents]
[0005] [Patent Document 1] Patent Publication No. 2021-098644 [Patent Document 2] Special Publication No. 2022-535392 Summary of the Invention [Problem to be solved by the invention]
[0006] The glass disclosed in Patent Document 1 is characterized by suppressing transmittance in the visible light region to a low level by changing the glass composition. However, the glass disclosed in Patent Document 1 has low versatility, which prevents an increase in production volume and makes it expensive. Furthermore, the glass disclosed in Patent Document 1 does not take into consideration the roughness of the glass surface.
[0007] The window disclosed in Patent Document 2 is characterized by its hardness and scratch resistance due to the provision of a high-refractive index layer on a substrate. However, the window disclosed in Patent Document 2 is expensive and has low productivity because high-refractive index layers and low-refractive index layers are alternately laminated. Furthermore, the window disclosed in Patent Document 2 does not take into consideration the roughness of the layered film surface.
[0008] When conventional materials applicable to light-based sensing technologies are used in, for example, LiDAR, the images obtained can be unclear. For this reason, there has been a demand for materials that can sharpen the images obtained even when used in light-based sensing technologies such as LiDAR.
[0009] An object of the present invention is to provide a laminate that, even when used in an optical sensing technology, can clarify an image of an object obtained by irradiating the object with laser light. Another object of the present invention is to provide a wiring sheet that, even when used in an optical sensing technology, can clarify an image of an object obtained by irradiating the object with laser light. [Means for solving the problem]
[0010] [1] A substrate; a coating layer provided on the substrate; an adhesive layer provided on the coating layer; Equipped with the coating layer includes an infrared transparent ink; the coating layer has a minimum transmittance of 70% or more for near-infrared rays in the wavelength range of 905 nm to 1000 nm; the surface of the coating layer on which the pressure-sensitive adhesive layer is provided has an arithmetic mean roughness Ra of 0.13 μm or less and a maximum roughness height Rz of 1.2 μm or less, as measured by a method in accordance with JIS B0601:2013; Laminate.
[0011] [2] The laminate according to [1], The refractive index of the pressure-sensitive adhesive layer at a wavelength of 905 nm is 1.46 or more. Laminate.
[0012] [3] The laminate according to [1] or [2], the coating layer is a colored coating layer, and the maximum value of the visible light transmittance in the wavelength range of 380 nm to 700 nm is 10% or less; Laminate.
[0013] [4] The laminate according to any one of [1] to [3], the infrared transparent ink contains at least one pigment selected from the group consisting of perylene pigments and phthalocyanine pigments, Laminate.
[0014] [5] a substrate; a coating layer provided on the substrate; an electrode provided on the coating layer; an adhesive layer provided on the electrode; a wiring body including a conductive linear body; Equipped with the adhesive layer directly or indirectly supports the wiring body, the electrodes are a pair of electrodes that are in direct contact with the conductive linear body, the coating layer includes an infrared transparent ink; the coating layer has a minimum transmittance of 70% or more for near-infrared rays in the wavelength range of 905 nm to 1000 nm; the surface of the coating layer on which the pressure-sensitive adhesive layer is provided has an arithmetic mean roughness Ra of 0.13 μm or less and a maximum roughness height Rz of 1.2 μm or less, as measured by a method in accordance with JIS B0601:2013; Wiring sheet.
[0015] [6] In the wiring sheet according to [5], The refractive index of the pressure-sensitive adhesive layer at a wavelength of 905 nm is 1.46 or more. Wiring sheet.
[0016] [7] The wiring sheet according to [5] or [6], The coating layer is a colored coating layer, and the maximum value of the visible light transmittance in the wavelength range of 380 nm to 700 nm is 10% or less. Wiring sheet.
[0017] [8] The wiring sheet according to any one of [5] to [7], the infrared transparent ink contains at least one pigment selected from the group consisting of perylene pigments and phthalocyanine pigments, Wiring sheet.
[0018] [9] The wiring sheet according to any one of [5] to [8], The wiring body has a structure in which the conductive linear bodies are arranged at intervals. Wiring sheet.
[0019]
[10] The wiring sheet according to [5] or [6], The wiring body is composed of only one of the conductive linear bodies. Wiring sheet. [Effects of the Invention]
[0020] According to one aspect of the present invention, a laminate can be provided that, even when used in a technology for sensing by light, sharpens an image of an object obtained by irradiating the object with laser light.Furthermore, according to one aspect of the present invention, a wiring sheet can be provided that, even when used in a technology for sensing by light, sharpens an image of an object obtained by irradiating the object with laser light. [Brief explanation of the drawings]
[0021] [Figure 1] 1 is a schematic diagram illustrating an example of a laminate according to a first embodiment of the present invention. [Figure 2] FIG. 2 is a cross-sectional view showing the II-II cross section of FIG. [Figure 3] FIG. 4 is a schematic diagram illustrating an example of a wiring sheet according to a second embodiment of the present invention. [Figure 4] FIG. 4 is a cross-sectional view showing the IV-IV cross section of FIG. [Figure 5] 10 is an example of a laser irradiation light observation image according to an example. [Figure 6] 10 is an example of a laser irradiation light observation image according to a comparative example. DETAILED DESCRIPTION OF THE INVENTION
[0022] The present invention will be described below with reference to the drawings, taking an embodiment as an example. The present invention is not limited to the content of the embodiment. In the drawings, some parts are illustrated enlarged or reduced in size for ease of explanation.
[0023] [First embodiment] <Laminate> A first embodiment of the present invention is a laminate. As shown in FIGS. 1 and 2, a laminate 100 according to this embodiment includes a substrate 1, a coating layer 5 provided on the substrate 1, and a pressure-sensitive adhesive layer 3 provided on the coating layer 5. The coating layer 5 contains an infrared-transparent ink. The coating layer 5 has a minimum transmittance of 70% or more for near-infrared rays in the wavelength range of 905 nm to 1000 nm. The surface of the coating layer 5 on which the pressure-sensitive adhesive layer 3 is provided has an arithmetic mean roughness Ra of 0.13 μm or less and a maximum roughness height Rz of 1.2 μm or less, as measured by a method in accordance with JIS B0601:2013.
[0024] As shown in Fig. 2, the surface of the coating layer 5 on which the pressure-sensitive adhesive layer 3 is provided is a first coating layer surface 51, which is the surface of the coating layer 5 opposite to the surface on which the substrate 1 is provided. In Figs. 1 and 2, the coating layer 5 is provided in direct contact with the substrate 1. The pressure-sensitive adhesive layer 3 is provided in direct contact with the coating layer 5, and is in contact with the first coating layer surface 51. That is, in the laminate 100, the substrate 1, the coating layer 5, and the pressure-sensitive adhesive layer 3 are provided in this order in the thickness direction. The thickness direction is the direction in which the largest surface of each of the substrate 1, the coating layer 5, and the pressure-sensitive adhesive layer 3 faces, and is the direction in which each layer is stacked.
[0025] The inventors speculate as follows as to why the laminate 100 according to this embodiment, even when used in a technology that senses using light, sharpens the image of an object obtained by irradiating the object with laser light.
[0026] In the laminate 100, the coating layer 5 provided between the substrate 1 and the pressure-sensitive adhesive layer 3 is a layer that transmits near-infrared light with a wavelength of, for example, 905 nm to 1000 nm, absorbs unnecessary light, and suppresses the effects of ambient light. When a laser beam is irradiated onto an object through the laminate 100, the laser beam is reflected by the object, allowing an image of the object to be observed on the laminate 100. When the surface roughness of the coating layer 5 is large, light scattering is likely to occur. Therefore, the surface roughness of the coating layer 5 tends to blur the image of the object obtained by irradiating the laser beam.
[0027] In response to this, the present inventors have found that reducing the surface roughness of the coating layer 5 suppresses the scattering of light caused by irradiating the laminate 100 with laser light. That is, by setting the surface roughness (arithmetic mean roughness Ra and maximum roughness height Rz) of the surface of the coating layer 5 on which the pressure-sensitive adhesive layer 3 is provided to be equal to or less than a specific upper limit, the scattering of light between the layers is reduced, and therefore the image of the object obtained by irradiating the laser light can be made clearer. That is, when the laser light is irradiated onto the object through the laminate 100, the laser light is reflected by the object, and a cleared image of the object can be observed on the laminate 100. For this reason, the present inventors speculate that when the laminate 100 according to the present embodiment has the above-described configuration, even when used in a technology for sensing by light, the image of the object obtained by irradiating the object with laser light will be made clearer.
[0028] (base material) The substrate 1 can directly or indirectly support the coating layer 5. From the viewpoints of strength and ease of handling, the material of the substrate 1 is preferably resin, glass, or the like. Examples of resins used for the substrate 1 include polyethylene, polypropylene, polystyrene, polycarbonate, and polyacetal.
[0029] The substrate 1 may or may not contain a colorant. When the substrate 1 contains a colorant, the colorant can adjust the transmittance of visible light and near-infrared light in the laminate 100 to within a desired range. From the viewpoints of versatility, cost, and the like, it is preferable that the substrate 1 does not contain a colorant.
[0030] The thickness of the substrate 1 is preferably 0.05 mm or more, more preferably 0.25 mm or more, even more preferably 0.5 mm or more, even more preferably 1.0 mm or more, and particularly preferably 1.5 mm or more. The thickness of the substrate 1 is preferably 10 mm or less, more preferably 5 mm or less, and even more preferably 3 mm or less. When the thickness of the substrate 1 is in the range of 0.05 mm or more and 10 mm or less, excellent strength and the like can be obtained.
[0031] (covering layer) The coating layer 5 contains infrared-transparent ink. The coating layer 5 has a minimum transmittance of near-infrared light with a wavelength of 905 nm to 1000 nm of 70% or more. The infrared-transparent ink transmits near-infrared light in the wavelength range of 905 nm to 1000 nm, while suppressing the transmission of visible light and ultraviolet light. The infrared-transparent ink can transmit near-infrared light with a wavelength of 905 nm to 1000 nm, for example, by 70% or more. The minimum transmittance of near-infrared light with a wavelength of 905 nm to 1000 nm in the coating layer 5 containing the infrared-transparent ink is preferably 75% or more, more preferably 80% or more, and even more preferably 85% or more. The minimum transmittance of near-infrared light with a wavelength of 905 nm to 1000 nm in the coating layer 5 containing the infrared-transparent ink may be less than 100%, or may be 99% or less, or may be 95% or less. If the infrared-transmitting ink is contained in the coating layer 5 and the minimum transmittance of the coating layer 5 for near-infrared rays with wavelengths of 905 nm to 1000 nm is 70% or more, the laminate 100 can be easily used, for example, as a component for an optical sensor. The transmittance of near-infrared rays with wavelengths of 905 nm to 1000 nm through the coating layer 5 containing the infrared-transmitting ink can be measured by preparing a test sample of the coating layer 5 containing the infrared-transmitting ink and measuring the test sample using a spectrophotometer. The transmittance of near-infrared rays with wavelengths of 905 nm to 1000 nm through the infrared-transmitting ink can also be measured by preparing a test sample of the infrared-transmitting ink and measuring the test sample using a spectrophotometer. Specifically, the measurement can be performed by the method described in the examples below.
[0032] From the viewpoint of facilitating application to, for example, optical sensing technology, the covering layer 5 desirably has a desired infrared transmittance and a refractive index of a certain level or higher. The refractive index of the coating layer 5 at a wavelength of 905 nm is preferably 1.65 or more, more preferably 1.75 or more, and even more preferably 1.85 or more. When the refractive index of the coating layer 5 is 1.65 or more, the laminate 100 can be easily used, for example, as a component for an optical sensor used as a component for technology that performs sensing using light. There is no particular upper limit to the refractive index of the coating layer 5 at a wavelength of 905 nm, and it is, for example, preferably 3.00 or less, more preferably 2.70 or less, and even more preferably 2.40 or less.
[0033] The infrared transparent ink contains, for example, a colorant and a resin component. The infrared transparent ink preferably contains additives as needed. The colorant may contain at least one of a dye and a colored pigment. The colorant preferably contains a colored pigment. The colored pigment is not particularly limited, and examples thereof include inorganic pigments and organic pigments, which can be used alone or in combination. The inorganic pigment is not particularly limited, and examples thereof include bismuth sulfide, carbon black, red iron oxide, cadmium red, Prussian blue, and ultramarine blue, and these can be used alone or in combination. The organic pigment is not particularly limited, and examples thereof include lactam black pigments, perylene pigments, phthalocyanine pigments, benzofuranone pigments, azo pigments, anthraquinone pigments, indanthrene pigments, isoindolinone pigments, quinacridone pigments, quinophthalone pigments, diketopyrrolopyrrole pigments, dioxazine pigments, and thioindigo pigments, and these can be used alone or in combination. Among these, the color pigment is preferably an organic pigment, and preferably contains at least one pigment selected from the group consisting of perylene pigments and phthalocyanine pigments, which can be set to have a low refractive index and can suppress light scattering, from the viewpoint of making it easier to sharpen the image of the object obtained by irradiating the object with laser light. Furthermore, by containing at least one pigment selected from the group consisting of perylene pigments and phthalocyanine pigments, the infrared transparent ink can easily obtain infrared transparency while suppressing the visible light transmittance of the coating layer 5.
[0034] The perylene pigment is not particularly limited as long as it is an organic pigment having a perylene skeleton. For example, the perylene pigment has a structure in which two oxygen atoms constituting a six-membered ring of perylene tetracarboxylic dianhydride are eliminated. Specific examples of the perylene pigment include perylene red, perylene violet, and perylene black. The perylene pigment can be used alone or in combination of two or more.
[0035] The phthalocyanine pigment is not particularly limited as long as it is an organic pigment having a phthalocyanine skeleton. The phthalocyanine pigment has, for example, a cyclic structure in which four phthalic acid imides are bridged by nitrogen atoms. The phthalocyanine pigment may have a coordinated metal. Examples of the coordinated metal include copper, magnesium, titanium, iron, cobalt, nickel, zinc, and aluminum. When the phthalocyanine pigment contains a coordinated metal, the phthalocyanine pigment may be a copper phthalocyanine pigment in which copper is coordinated. Specific examples of the phthalocyanine pigment include phthalocyanine blue and phthalocyanine green. The phthalocyanine pigments can be used alone or in combination of two or more.
[0036] The resin component is not particularly limited, and examples thereof include various resins such as acrylic resins, vinyl chloride resins, butyral resins, polyester resins, polyurethane resins, cellulose resins, and epoxy resins, and these can be used alone or in combination of two or more. The resin component preferably includes an acrylic resin. It is also preferable that the resin component is an acrylic resin.
[0037] The infrared transmissive ink may contain, as needed, at least one additive such as a surfactant, a surface conditioner, an antifoaming agent, a leveling agent, a curing accelerator, a dispersant, a light stabilizer, a flow conditioner, a polymerization inhibitor, and an oxidation polymerization inhibitor.
[0038] The coating layer 5 may contain a coupling agent. Examples of coupling agents include silane-based coupling agents, titanate-based coupling agents, aluminate-based coupling agents, and phosphorus-based coupling agents, and the coating layer 5 may contain one or more of these. Examples of coupling agents include those having a hydrolyzable group, such as a chlorine group, a methoxy group, an ethoxy group, a methoxyethoxy group, or an acetoxy group, on one side, and an organic functional group, such as an amino group, a ureido group, a vinyl group, a methacryl group, an isocyanate group, or a mercapto group, on the other side. Among these, the coupling agent may be a silane-based coupling agent. Examples of silane-based coupling agents include epoxy silane coupling agents, amino silane coupling agents, and ureido silane coupling agents, and the like, and these may be used alone or in combination. When a coupling agent is used, it is preferable that the coupling agent have a basic functional group. When a silane-based coupling agent having a structure containing at least one functional group selected from the group consisting of an amino group and a ureido group is used as the coupling agent, the image of the object obtained by irradiating the object with laser light tends to be more clearly defined.
[0039] The coating layer 5 may contain a curing agent. Examples of curing agents include isocyanate compounds, amine compounds, acid anhydride compounds, mercapto compounds, imidazole compounds, dicyandiamide compounds, and organic acid hydrazide compounds. The curing agent preferably contains an isocyanate compound. The curing agent may be an isocyanate compound. The isocyanate compound may be any of aromatic isocyanates, aliphatic isocyanate compounds, and alicyclic isocyanate compounds. Specific examples of the isocyanate compound include isophorone diisocyanate, diphenylmethane diisocyanate, hydrogenated diphenylmethane diisocyanate, xylylene diisocyanate, hydrogenated xylylene diisocyanate, tolylene diisocyanate, and hexamethylene diisocyanate. These compounds may be used alone or in combination. Among these, the isocyanate compound preferably contains hydrogenated xylylene diisocyanate.
[0040] The coating layer 5 has a second coating layer surface (not shown) which is the surface having the substrate 1, and a first coating layer surface 51 which is the surface opposite to the surface having the substrate 1. In the laminate 100, the coating layer 5 has a pressure-sensitive adhesive layer 3 provided on the first coating layer surface 51. On the surface of the coating layer 5 on which the pressure-sensitive adhesive layer 3 is provided, the arithmetic mean roughness Ra measured by a method in accordance with JIS B0601:2013 is 0.13 μm or less, and the maximum roughness height Rz measured by a method in accordance with JIS B0601:2013 is 1.2 μm or less. The arithmetic mean roughness Ra and the maximum roughness height Rz of the surface of the coating layer 5 on which the pressure-sensitive adhesive layer 3 is provided can be measured by the methods shown in the examples.
[0041] From the viewpoint of making it easier to sharpen the image of the object obtained by irradiating the object with laser light, the arithmetic mean roughness Ra is preferably 0.12 μm or less, more preferably 0.10 μm or less, even more preferably 0.09 μm or less, and even more preferably 0.08 μm or less. The lower limit of the arithmetic mean roughness Ra is preferably closer to 0 (zero) μm. The lower limit of the arithmetic mean roughness Ra may be 0.01 μm or more.
[0042] From the viewpoint of making it easier to sharpen the image of the object obtained by irradiating the object with laser light, the maximum roughness height Rz is preferably 1.1 μm or less, and more preferably 1.0 μm or less. Specifically, the lower limit of the maximum roughness height Rz is preferably close to 0 (zero) μm. The lower limit of the maximum roughness height Rz may be 0.1 μm or more.
[0043] The coating layer 5 is a colored coating layer, and the maximum visible light transmittance in the wavelength range of 380 nm to 700 nm is preferably 10% or less. The maximum visible light transmittance of the coating layer 5 in the wavelength range of 380 nm to 700 nm is more preferably 8% or less, and even more preferably 6% or less. The hue of the coating layer 5 is not particularly limited as long as the maximum visible light transmittance in the wavelength range of 380 nm to 700 nm can be adjusted to 10% or less. The coating layer 5 is preferably colored, for example, black. The black color may be any hue that is generally recognized as black. When the coating layer 5 is colored black, for example, it may be colored black using an infrared-transparent ink containing one type of colorant, or may be colored black using an infrared-transparent ink containing two or more types of colorant, or may be colored black using multiple infrared-transparent inks of different colors. The visible light transmittance of the coating layer 5 in the wavelength range of 380 nm to 700 nm can be measured, for example, by preparing a test sample of the coating layer 5 and measuring the prepared test sample using a spectrophotometer. Specifically, the measurement can be performed by the method described in the examples below.
[0044] The thickness of the coating layer 5 is not particularly limited. The thickness of the coating layer 5 is preferably 1 μm or more, more preferably 2 μm or more, and even more preferably 4 μm or more. The thickness of the coating layer 5 is preferably 30 μm or less, more preferably 20 μm or less, and even more preferably 15 μm or less.
[0045] (adhesive layer) The adhesive layer 3 can protect the coating layer 5 by being provided on the coating layer 5. The adhesive layer 3 may be a layer consisting of only an adhesive, or may be an adhesive sheet comprising an adhesive base material and a layer containing an adhesive provided on one surface of the adhesive base material. The adhesive base material is a base material for supporting the adhesive layer. Here, in this specification, the adhesive is a concept that includes both a pressure-sensitive adhesive and an adhesive. For example, an adhesive that shows adhesiveness at room temperature before curing and whose adhesive strength increases when cured by a curing treatment such as heating is also included in the adhesive.
[0046] From the viewpoint of protecting the coating layer 5, the adhesive layer 3 preferably includes a layer made of a cured product of a curable adhesive. The adhesive layer 3 may be a layer made of only a cured product of a curable adhesive. The adhesive layer 3 may be an adhesive sheet including an adhesive base material and a layer made of a cured product of a curable adhesive provided on one surface of the adhesive base material. The curable adhesive will be described below.
[0047] Examples of curable adhesives include thermosetting adhesives that are cured by heat, and energy ray-curable adhesives. Examples of energy rays include ultraviolet rays, visible energy rays, infrared rays, and electron beams. Note that "energy ray curing" also includes thermal curing by heating using energy rays.
[0048] The thermosetting adhesive preferably contains a thermosetting resin. The thermosetting resin is not particularly limited, and specific examples include epoxy resins, phenolic resins, melamine resins, urea resins, polyester resins, urethane resins, acrylic resins, benzoxazine resins, phenoxy resins, amine-based compounds, and acid anhydride-based compounds. These can be used alone or in combination of two or more. Among these, epoxy resins, phenolic resins, melamine resins, urea resins, amine-based compounds, and acid anhydride-based compounds are preferred from the viewpoint of suitability for curing using an imidazole-based curing catalyst. In particular, epoxy resins, phenolic resins, mixtures thereof, or mixtures of epoxy resins with at least one selected from the group consisting of phenolic resins, melamine resins, urea resins, amine-based compounds, and acid anhydride-based compounds are preferred from the viewpoint of exhibiting excellent curability, and epoxy resins are preferred.
[0049] The energy ray-curable adhesive preferably contains an energy ray-curable resin. Examples of the energy ray-curable resin include compounds having at least one polymerizable double bond in the molecule, and acrylate compounds having a (meth)acryloyl group are preferred. In this specification, "(meth)acryloyl" means both acryloyl and methacryloyl. The same applies to other similar terms.
[0050] Examples of the acrylate compounds include dicyclopentadiene diacrylate, trimethylolpropane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butylene glycol di(meth)acrylate, and 1,6-hexanediol di(meth)acrylate. Examples of the (meth)acrylate include (meth)acrylates containing a chain aliphatic skeleton such as acrylate; (meth)acrylates containing a cyclic aliphatic skeleton such as dicyclopentanyl di(meth)acrylate; polyalkylene glycol (meth)acrylates such as polyethylene glycol di(meth)acrylate; oligoester (meth)acrylates, urethane (meth)acrylate oligomers, epoxy-modified (meth)acrylates, polyether (meth)acrylates other than polyalkylene glycol (meth)acrylates, and itaconic acid oligomers.
[0051] The weight average molecular weight (Mw) of the energy ray curable resin is preferably 100 or more, more preferably 300 or more. The weight average molecular weight is preferably 30,000 or less, more preferably 10,000 or less. The weight average molecular weight in this specification is a value measured by gel permeation chromatography (GPC) in terms of standard polystyrene.
[0052] The adhesive may contain only one type of energy ray-curable resin or two or more types of energy ray-curable resins. When two or more types of energy ray-curable resins are contained, the combination and ratio thereof can be selected arbitrarily.
[0053] When an energy ray curable resin or a thermosetting resin is used, it is preferable to use a photopolymerization initiator, a thermal polymerization initiator, etc. By using a photopolymerization initiator, a thermal polymerization initiator, etc., the polymerization reaction of the curable resin can be easily initiated, and the curing reaction can be easily controlled.
[0054] Examples of the photopolymerization initiator include photoradical polymerization initiators such as benzophenone, acetophenone, benzoin, benzoin methyl ether, 2,4-diethylthioxanthone, 1-hydroxycyclohexyl phenyl ketone, benzyl diphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, 2-chloroanthraquinone, diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide, and bis(2,4,6-trimethylbenzoyl)-phenyl-phosphine oxide.
[0055] In addition to photoradical polymerization initiators, photocationic polymerization initiators can also be used as photopolymerization initiators. A photocationic polymerization initiator is a compound that generates cationic species when irradiated with energy rays, thereby initiating the curing reaction of a cationic curable compound, and is composed of a cationic moiety that absorbs energy rays and an anionic moiety that serves as an acid generation source.
[0056] Examples of the photocationic polymerization initiator include sulfonium salt compounds, iodonium salt compounds, phosphonium salt compounds, ammonium salt compounds, antimonate compounds, diazonium salt compounds, selenium salt compounds, oxonium salt compounds, and bromine salt compounds. Among these, from the viewpoints of excellent compatibility and excellent storage stability of the resulting adhesive, sulfonium salt compounds are preferred, and aromatic sulfonium salt compounds having an aromatic group are more preferred.
[0057] Examples of sulfonium salt compounds include triphenylsulfonium hexafluorophosphate, triphenylsulfonium hexafluoroantimonate, and triphenylsulfonium tetrakis(pentafluorophenyl)borate.
[0058] Examples of iodonium salt compounds include diphenyliodonium tetrakis(pentafluorophenyl)borate, diphenyliodonium hexafluorophosphate, and (tricumyl)iodonium tetrakis(pentafluorophenyl)borate.
[0059] Examples of the phosphonium salt compound include tri-n-butyl(2,5-dihydroxyphenyl)phosphonium bromide and hexadecyltributylphosphonium chloride.
[0060] Examples of the ammonium salt compound include benzyltrimethylammonium chloride, phenyltributylammonium chloride, and benzyltrimethylammonium bromide.
[0061] Examples of antimonate compounds include triphenylsulfonium hexafluoroantimonate, p-(phenylthio)phenyldiphenylsulfonium hexafluoroantimonate, and diaryliodonium hexafluoroantimonate.
[0062] Examples of the thermal polymerization initiator include peroxodisulfates such as hydrogen peroxide, ammonium peroxodisulfate, sodium peroxodisulfate, and potassium peroxodisulfate; azo compounds such as 2,2'-azobis(2-amidinopropane) dihydrochloride, 4,4'-azobis(4-cyanovaleric acid), 2,2'-azobisisobutyronitrile, and 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile); and thermal radical polymerization initiators such as organic peroxides such as benzoyl peroxide, lauroyl peroxide, peracetic acid, persuccinic acid, di-t-butyl peroxide, t-butyl hydroperoxide, and cumene hydroperoxide.
[0063] In addition to the above-mentioned thermal radical polymerization initiators, examples of the thermal polymerization initiator include thermal cationic polymerization initiators. The thermal cationic polymerization initiator is a compound that can generate cationic species that initiate polymerization by heating. Examples of the thermal cationic polymerization initiator include sulfonium salts, quaternary ammonium salts, phosphonium salts, diazonium salts, and iodonium salts. Among these, sulfonium salts are preferred as the thermal cationic polymerization initiator from the viewpoints of ease of availability and ease of obtaining a thermal cationic polymerization initiator that is superior in adhesiveness and transparency.
[0064] Examples of sulfonium salts include triphenylsulfonium tetrafluoroborate, triphenylsulfonium hexafluoroantimonate, benzyl(4-hydroxyphenyl)methylsulfonium tetrakis(pentafluorophenyl)borate, (4-hydroxyphenyl)methyl(4-methylbenzyl)sulfonium tetrakis(pentafluorophenyl)borate, and triphenylsulfonium hexafluoroarsinate.
[0065] Examples of quaternary ammonium salts include tetrabutylammonium tetrafluoroborate, tetrabutylammonium hexafluorophosphate, and tetrabutylammonium hydrogen sulfate. Examples of phosphonium salts include ethyltriphenylphosphonium hexafluoroantimonate and tetrabutylphosphonium hexafluoroantimonate.
[0066] Examples of diazonium salts include benzenediazonium chloride, etc. Examples of iodonium salts include diphenyliodonium hexafluoroarsinate, bis(4-chlorophenyl)iodonium hexafluoroarsinate, and phenyl(4-methoxyphenyl)iodonium hexafluoroarsinate, etc.
[0067] These polymerization initiators may be used either individually or in combination of two or more. When these polymerization initiators are used to form a crosslinked structure, the amount used is preferably 0.1 parts by mass or more and 30 parts by mass or less, more preferably 0.3 parts by mass or more and 20 parts by mass or less, and particularly preferably 0.5 parts by mass or more and 10 parts by mass or less, relative to 100 parts by mass of the energy ray-curable resin or the thermosetting resin.
[0068] When a thermosetting resin is used, a curing catalyst such as an imidazole-based curing catalyst may be used.
[0069] In this embodiment, the curable adhesive may contain a flexibility-adjusting component together with the energy ray-curable resin or the thermosetting resin to facilitate maintenance of the sheet shape before curing. Examples of polymers used as the flexibility-adjusting component include phenoxy resin, polyolefin resin or modified polyolefin resin, polyamide-imide resin, polyimide resin, rubber-based resin, and acrylic resin.
[0070] These flexibility-adjusting components may be used alone or in combination of two or more.
[0071] When the curable adhesive used in the present embodiment contains a flexibility-adjusting component, the total amount of the energy ray-curable resin and the thermosetting resin contained in the adhesive is, for example, preferably 15 parts by mass or more and 300 parts by mass or less, more preferably 30 parts by mass or more and 250 parts by mass or less, and even more preferably 60 parts by mass or more and 200 parts by mass or less, per 100 parts by mass of the flexibility-adjusting component.
[0072] The curable adhesive used in this embodiment may contain a pressure-sensitive adhesive that exhibits pressure-sensitive adhesion at room temperature together with the energy ray-curable resin or the thermosetting resin. The pressure-sensitive adhesive is not particularly limited, and examples thereof include acrylic pressure-sensitive adhesives, urethane pressure-sensitive adhesives, rubber pressure-sensitive adhesives, polyester pressure-sensitive adhesives, silicone pressure-sensitive adhesives, and polyvinyl ether pressure-sensitive adhesives.
[0073] In this embodiment, the curable adhesive may or may not contain a filler. When the curable adhesive contains a filler, the hardness of the pressure-sensitive adhesive layer 3 after curing is likely to be improved. When a filler is used in the curable adhesive, the particle size of the filler is preferably 10 μm or less, from the viewpoint that an image of an object obtained by irradiating the object with laser light is likely to be sharpened. The particle size of the filler can be measured, for example, by a laser diffraction / scattering particle size distribution analyzer.
[0074] Examples of fillers include inorganic powders such as silica, alumina, talc, calcium carbonate, titanium white, red iron oxide, silicon carbide, and boron nitride; beads obtained by spheroidizing inorganic powders, single-crystal fibers, and glass fibers. Among these, silica filler and alumina filler are preferred. The fillers may be used alone or in combination of two or more.
[0075] The curable adhesive may contain other components, such as well-known additives, such as organic solvents, coupling agents, flame retardants, tackifiers, UV absorbers, antioxidants, preservatives, antifungal agents, plasticizers, antifoaming agents, and wettability adjusters.
[0076] The pressure-sensitive adhesive layer 3 may have a configuration including a layer made of a cured product of the curable adhesive as described above, or may have a configuration including a layer formed from a pressure-sensitive adhesive composition containing a pressure-sensitive adhesive. In this case, the pressure-sensitive adhesive layer 3 may have only a layer formed from a pressure-sensitive adhesive composition containing a pressure-sensitive adhesive, or may have a configuration including a pressure-sensitive adhesive base and a layer formed from a pressure-sensitive adhesive composition containing a pressure-sensitive adhesive. Examples of the pressure-sensitive adhesive include the pressure-sensitive adhesives described above. Among these, the pressure-sensitive adhesive preferably includes at least one selected from the group consisting of an acrylic pressure-sensitive adhesive, a urethane pressure-sensitive adhesive, and a rubber pressure-sensitive adhesive, more preferably includes an acrylic pressure-sensitive adhesive, and even more preferably is an acrylic pressure-sensitive adhesive.
[0077] When the pressure-sensitive adhesive layer 3 is formed from a pressure-sensitive adhesive composition containing a pressure-sensitive adhesive, the pressure-sensitive adhesive layer 3 may contain the above-mentioned filler and other components in addition to the pressure-sensitive adhesive, if necessary.
[0078] When the adhesive layer 3 includes an adhesive base material and an adhesive layer provided on one surface of the adhesive base material, the material of the adhesive base material is not particularly limited. Examples of the material of the adhesive base material include polyvinyl alcohol-based resins, polyolefin-based resins, polyester-based resins, acetyl cellulose-based resins, polycarbonate-based resins, cycloolefin-based resins, polyimide-based resins, polyamide-based resins, polyamideimide-based resins, polyphenylene ether-based resins, polyether ketone-based resins, polyether ether ketone-based resins, polysulfone-based resins, polyethersulfone-based resins, polyphenylene sulfide-based resins, polyarylate-based resins, acrylic resins, and norbornene-based resins.
[0079] The thickness of the adhesive base material is not particularly limited, and is preferably 5 μm or more, more preferably 8 μm or more, and even more preferably 10 μm or more. The thickness of the adhesive base material is preferably 500 μm or less, more preferably 300 μm or less, and even more preferably 200 μm or less.
[0080] From the viewpoint of making it easier to sharpen an image of an object obtained by irradiating the object with laser light, the refractive index of the adhesive layer 3 at a wavelength of 905 nm is preferably 1.46 or more. If the refractive index of the adhesive layer 3 at a wavelength of 905 nm is 1.46 or more, light scattering is easily suppressed, and the difference in refractive index between each layer is easily reduced. If the refractive index of the adhesive layer 3 at a wavelength of 905 nm is 1.46 or more, the difference in refractive index between the coating layer 5 and the adhesive layer 3 is easily reduced, and it is easier to sharpen an image of the object obtained by irradiating the object with laser light. The refractive index of the adhesive layer at a wavelength of 905 nm is more preferably 1.465 or more, and even more preferably 1.47 or more. The upper limit of the refractive index of the adhesive layer at a wavelength of 905 nm is not particularly limited, and is, for example, preferably 2.00 or less, more preferably 1.80 or less, even more preferably 1.70 or less, and even more preferably 1.60 or less.
[0081] From the viewpoint of easily sharpening an image of an object obtained by irradiating the object with laser light, the absolute value of the difference between the refractive index at a wavelength of 905 nm of the covering layer 5 and the refractive index at a wavelength of 905 nm of the adhesive layer 3 is preferably 0.30 or more, more preferably 0.34 or more, and even more preferably 0.38 or more. When the absolute value of the difference from the above-mentioned refractive index is 0.30 or more, the laminate 100 can be easily applied, for example, as a component for an optical sensor used as a component for technology that performs sensing using light. The upper limit of the absolute value of the difference from the refractive index at a wavelength of 905 nm of the adhesive layer 3 is not particularly limited, and is, for example, preferably 0.75 or less, more preferably 0.72 or less, even more preferably 0.69 or less, and even more preferably 0.66 or less. From the viewpoint of easily sharpening an image of an object obtained by irradiating the object with laser light, the refractive index of the covering layer 5 at a wavelength of 905 nm is preferably greater than the refractive index of the adhesive layer 3 at a wavelength of 905 nm.
[0082] The thickness of the adhesive layer 3 is not particularly limited. When the adhesive layer 3 is a layer consisting only of an adhesive, the thickness of the adhesive layer 3 is preferably 1 μm or more, more preferably 3 μm or more, even more preferably 5 μm or more, and particularly preferably 10 μm or more. When the adhesive layer 3 is a layer consisting only of an adhesive, the thickness of the adhesive layer 3 is preferably 150 μm or less, more preferably 100 μm or less, even more preferably 70 μm or less, and particularly preferably 30 μm or less. When the adhesive layer 3 comprises an adhesive base material and an adhesive layer provided on one surface of the adhesive base material, the thickness of the adhesive layer 3 is preferably within the range of the sum of the thickness of the adhesive base material and the thickness of the adhesive layer 3 when the adhesive layer is a layer consisting only of an adhesive layer.
[0083] (Applications of laminates) As described above, the laminate 100 according to this embodiment can be suitably used as a component for optical sensors, even when used in optical sensing technology, because the image of the object obtained by irradiating the object with laser light is sharpened. Specifically, the laminate 100 is useful as a laminate for optical sensors used as a component for optical sensing technology. The laminate 100 is also useful as a laminate for LiDAR sensors. In addition, the laminate 100 can be used in applications requiring the property of sharpening the image of the object obtained by irradiating the object with laser light. The wavelength of the laser light used when irradiating the object with laser light is not particularly limited, and wavelengths in the range of 905 nm to 1700 nm can be used for the laser light. Specifically, known laser light with wavelengths of, for example, 905 nm and 1550 nm can be used.
[0084] (Method of manufacturing laminate) There are no particular limitations on the method for producing the laminate 100 according to this embodiment. The laminate 100 can be produced, for example, by the following steps.
[0085] First, a step of forming a coating layer 5 on the substrate 1 is performed. In this step, the substrate 1 is prepared, and a coating layer-forming composition for forming the coating layer 5 is prepared. The coating layer-forming composition contains an infrared-transparent ink. By including the infrared-transparent ink in the coating layer-forming composition, the minimum transmittance of the coating layer 5 for near-infrared rays with wavelengths of 905 nm to 1000 nm can be adjusted to 70% or more. The coating layer-forming composition is then applied to the substrate 1 to form a coating film of the coating layer-forming composition. The coating film is then dried to form the coating layer 5 on the substrate 1. For example, by changing the composition of the coating layer-forming composition for forming the coating layer 5, the drying conditions for the coating film for forming the coating layer 5, the mesh used to filter the coating layer-forming composition, the solvent content in the coating layer-forming composition, etc., the arithmetic mean roughness Ra and maximum roughness height Rz, measured by a method in accordance with JIS B0601:2013, of the surface of the coating layer 5 on which the pressure-sensitive adhesive layer 3 is to be formed can be adjusted.
[0086] Next, a step of forming a pressure-sensitive adhesive layer 3 on the coating layer 5 formed on the substrate 1 is carried out. In this step, if the pressure-sensitive adhesive layer 3 is a layer consisting only of a pressure-sensitive adhesive, and the pressure-sensitive adhesive is a thermosetting adhesive, the thermosetting adhesive is applied onto a release sheet to form a coating film. Next, the coating film is dried to produce a pressure-sensitive adhesive layer with a release sheet. On the other hand, in this step, if the pressure-sensitive adhesive layer is a pressure-sensitive adhesive sheet comprising a pressure-sensitive adhesive base material and a layer containing a pressure-sensitive adhesive, and the pressure-sensitive adhesive is a thermosetting adhesive, the thermosetting adhesive is applied onto the pressure-sensitive adhesive base material to form a coating film.
[0087] Next, a step of placing the adhesive layer side of the adhesive layer with release sheet, or the adhesive-containing layer side of the adhesive sheet, facing the covering layer 5 on the coating layer 5 formed on the substrate 1, and curing the thermosetting adhesive is performed. In this step, if the adhesive layer 3 is a layer consisting only of an adhesive, the release sheet is peeled off and then the thermosetting adhesive is subjected to a predetermined heat treatment to form the adhesive layer 3, thereby producing the laminate 100. Alternatively, if the adhesive layer 3 is an adhesive sheet, the adhesive sheet is placed and then the thermosetting adhesive is subjected to a predetermined heat treatment to form the adhesive layer 3, thereby producing the laminate 100.
[0088] (Operation and effect of the first embodiment) According to this embodiment, the following effects can be achieved. (1) According to this embodiment, the coating layer 5 contains an infrared-transmitting ink, and has a minimum transmittance of 70% or more for near-infrared rays having wavelengths of 905 nm to 1000 nm. Furthermore, the surface on which the adhesive layer 3 is provided has an arithmetic mean roughness Ra of 0.13 μm or less and a maximum roughness height Rz of 1.2 μm or less, as measured by a method in accordance with JIS B0601:2013. This suppresses scattering of the laser light, thereby making it possible to sharpen an image of the object obtained by irradiating the object with the laser light. (2) According to this embodiment, the above-mentioned advantageous effect (1) can be achieved, and therefore the laminate 100 can be applied as a component for an optical sensor such as a LiDAR sensor. (3) According to this embodiment, the minimum transmittance of near-infrared rays with wavelengths of 905 nm to 1000 nm is 70% or more, and by providing a coating layer 5 containing infrared-transmitting ink on one side of the substrate 1, the effect of (1) described above can be achieved, and therefore the laminate 100 can be produced relatively inexpensively.
[0089] [Second embodiment] <Wiring sheet> A second embodiment of the present invention is a wiring sheet. As shown in FIGS. 3 and 4 , a wiring sheet 300 according to this embodiment includes a base material 1, a covering layer 5 provided on the base material 1, an electrode 4 provided on the covering layer 5, a pressure-sensitive adhesive layer 3 provided on the electrode 4, and a wiring body 2 including conductive linear members 21. In the wiring sheet 300, the wiring body 2 has a structure in which the conductive linear members 21 are arranged at intervals. The pressure-sensitive adhesive layer 3 directly or indirectly supports the wiring body 2. The electrodes 4 are a pair of electrodes 4 that are in direct contact with the conductive linear members 21. The covering layer 5 contains an infrared-transmitting ink and has a minimum transmittance of 70% or more for near-infrared light in the wavelength range of 905 nm to 1000 nm. The surface of the coating layer 5 on which the pressure-sensitive adhesive layer 3 is provided has an arithmetic mean roughness Ra of 0.13 μm or less and a maximum roughness height Rz of 1.2 μm or less, as measured by a method in accordance with JIS B0601:2013.
[0090] According to the wiring sheet 300 of this embodiment, even when used in a technology that senses using light, the image of the object obtained by irradiating the object with laser light is made clearer. The inventors presume that, for the same reasons as those explained for the laminate 100 of the first embodiment, even when used in a technology that senses using light, the image of the object obtained by irradiating the object with laser light is made clearer.
[0091] The wiring sheet 300 of the second embodiment differs from the first embodiment in that the laminate 100 of the first embodiment includes an electrode 4 and a wiring body 2 in which conductive linear bodies 21 are arranged at intervals. In the following description, differences from the first embodiment will be mainly described, and overlapping descriptions will be omitted or simplified. The same components as those in the first embodiment will be assigned the same reference numerals, and descriptions thereof will be omitted or simplified.
[0092] As shown in FIGS. 3 and 4 , the surface of the covering layer 5 on which the adhesive layer 3 is provided is a first covering layer surface 51, which is the surface of the covering layer 5 opposite to the surface on which the substrate 1 is provided. In the wiring sheet 300, the covering layer 5 is provided on one surface of the substrate 1 and is provided in direct contact with the substrate 1. A pair of electrodes 4 are in contact with the first covering layer surface 51 of the covering layer 5. The electrode 4 on the side opposite to the side in contact with the covering layer 5 has a portion in contact with the wiring body 2 and a portion not in contact with the wiring body 2. The portion of the electrode 4 not in contact with the wiring body 2 is in contact with the adhesive layer 3. The adhesive layer 3 is in contact with the electrode 4 and the wiring body 2, and the portion of the adhesive layer 3 not in contact with the electrode 4 and the wiring body 2 is in contact with the first covering layer surface 51 of the covering layer 5.
[0093] In the wiring sheet 300, the adhesive layer 3 directly or indirectly supports the wiring body 2. The adhesive layer 3 also stabilizes the resistance value of the wiring body 2. That is, the adhesive layer 3 can fix the conductive linear body 21, stabilize the contact between the conductive linear body 21 and the electrode 4, and make it difficult for an increase in the resistance value to occur.
[0094] In the wiring sheet 300, the thickness of the adhesive layer 3 is not particularly limited. The thickness of the adhesive layer 3 may be equal to or greater than the diameter D of the conductive linear member 21, or may be less than the diameter D of the conductive linear member 21. When the thickness of the adhesive layer 3 is equal to or greater than the diameter D of the conductive linear member 21, the wiring member 2 can be included in the adhesive layer 3. Specifically, the adhesive layer 3 is a layer made of only an adhesive, or is an adhesive sheet comprising an adhesive base material and a layer containing an adhesive on one side of the adhesive base material. Therefore, when the thickness of the adhesive-containing layer constituting the adhesive layer 3 is equal to or greater than the diameter D of the conductive linear member 21, the wiring member 2 can be included in the adhesive layer 3. When the thickness of the adhesive layer 3 is less than the diameter D of the conductive linear member 21, the wiring member 2 is exposed from the adhesive layer 3. Specifically, when the thickness of the adhesive-containing layer constituting the adhesive layer 3 is less than the diameter D of the conductive linear member 21, the wiring member 2 is exposed from the adhesive layer 3. Furthermore, when the wiring body 2 is exposed from the adhesive layer 3, the wiring body 2 may be exposed on the side of the adhesive layer 3 where the covering layer 5 is provided, or on the side opposite to the side of the adhesive layer 3 where the covering layer 5 is provided. In the wiring sheet 300, the thickness of the adhesive layer 3 is preferably within the thickness range described in the first embodiment.
[0095] In the wiring sheet 300, specific examples of the configuration other than the thickness of the adhesive layer 3 are the same as the specific examples described in the first embodiment. In the wiring sheet 300, specific examples of the base material 1 and the covering layer 5 are also the same as the specific examples described in the first embodiment. Hereinafter, the electrode 4 and the wiring body 2 will be described.
[0096] (Wiring body) In wiring sheet 300, wiring body 2 has a structure in which conductive linear bodies 21 are arranged at intervals. Furthermore, wiring body 2 has a structure in which a plurality of conductive linear bodies 21 are arranged in parallel.
[0097] The conductive linear body 21 may be linear or wavy in a plan view of the wiring sheet 300. Examples of the wavy shape include a sine wave, a rectangular wave, a triangular wave, and a sawtooth wave. For example, if the conductive linear body 21 has such a wavy structure, breakage of the conductive linear body 21 can be easily suppressed when the wiring sheet 300 is stretched in the axial direction of the conductive linear body 21.
[0098] The volume resistivity of the conductive linear body 21 is 1.0×10 -9 It is preferable that the resistance is Ω·m or more, and 3.0×10 -9 It is more preferable that the resistance is Ω·m or more, and 1.0×10 -8 The volume resistivity of the conductive linear body 21 is more preferably 1.0×10 -3 It is preferable that the resistance is Ω·m or less, and 1.0×10 -4 It is more preferable that it is Ω·m or less, and 1.0×10 -5 It is more preferable that the volume resistivity is Ω·m or less. When the volume resistivity of the conductive linear body 21 is in the above range, the surface resistance of the wiring body 2 tends to decrease.
[0099] The volume resistivity of the conductive linear body 21 was measured as follows. Silver paste was applied to the end of the conductive linear body 21 and to a portion 40 mm from the end, and the resistance of the end and the portion 40 mm from the end was measured. Then, the cross-sectional area (unit: m 2 ) is multiplied by the resistance value, and the obtained value is divided by the measured length (0.04 m) to calculate the volume resistivity of the conductive linear body 21.
[0100] The cross-sectional shape of the conductive linear body 21 is not particularly limited and may be polygonal, flat, elliptical, circular, etc. From the viewpoint of compatibility with the adhesive layer 3, the cross-sectional shape of the conductive linear body 21 is preferably elliptical or circular.
[0101] When the cross section of the conductive linear member 21 is circular, the diameter D (see FIG. 4) of the conductive linear member 21 is preferably 3 μm or more and 200 μm or less. From the viewpoints of suppressing an increase in sheet resistance and improving the heat generation efficiency and dielectric breakdown resistance characteristics of the wiring sheet 300, the diameter D of the conductive linear member 21 is more preferably 4 μm or more, and even more preferably 5 μm or more. The diameter D of the conductive linear member 21 is more preferably 150 μm or less, even more preferably 100 μm or less, even more preferably 50 μm or less, and particularly preferably 20 μm or less. When the cross section of the conductive linear body 21 is elliptical, it is preferable that the major axis is in the same range as the diameter D described above.
[0102] The diameter D of the conductive linear body 21 is determined by observing the conductive linear body 21 using a digital microscope, measuring the diameter of the conductive linear body 21 at five randomly selected points, and averaging the measured values.
[0103] When the wiring body 2 has a structure in which the conductive linear bodies 21 are arranged at intervals from one another, the interval L (see FIG. 4) between the conductive linear bodies 21 is preferably 0.3 mm or more, more preferably 0.5 mm or more, even more preferably 0.8 mm or more, and even more preferably 1.5 mm or more. The interval L between the conductive linear bodies 21 is preferably 50 mm or less, more preferably 30 mm or less, even more preferably 20 mm or less, and even more preferably 5 mm or less. If the spacing between conductive linear bodies 21 is within the above range, conductive linear bodies 21 are relatively densely packed, which improves the functionality of wiring sheet 300, such as maintaining low resistance of wiring body 2.
[0104] The distance L between the conductive linear members 21 is measured by, for example, observing the conductive linear members 21 of the wiring body 2 using a digital microscope and measuring the distance between two adjacent conductive linear members 21. The interval between two adjacent conductive linear bodies 21 is the length along the direction in which the conductive linear bodies 21 are arranged, and is the length between opposing portions of the two conductive linear bodies 21 (see FIG. 4). When the conductive linear bodies 21 are arranged at uneven intervals, the interval L is the average value of the intervals between all adjacent conductive linear bodies 21.
[0105] The conductive linear body 21 may be formed by any method, such as etching, screen printing, or inkjet printing. The conductive linear body 21 may be formed as a linear body including a metal wire (hereinafter also referred to as a "metal wire linear body"). Metal wire has high thermal conductivity, high electrical conductivity, and easy handling. A metal wire linear body can significantly reduce resistance, and even if the diameter of the metal wire linear body is extremely small, it can still pass a current required to heat the wiring sheet 300. This makes the conductive linear body 21 less visible. In other words, using a metal wire linear body as the conductive linear body 21 can reduce the resistance of the wiring body 2 while improving light transmittance. Furthermore, the wiring sheet 300 can easily generate heat quickly. Furthermore, as described above, a linear body with a small diameter can be easily obtained. The conductive linear body 21 may be a metal wire linear body, a linear body containing carbon nanotubes, or a linear body in which a thread is coated with a conductive material.
[0106] The metal wire linear body may be a linear body made of a single metal wire, or may be a linear body made of a plurality of twisted metal wires. Examples of metal wires include wires containing metals such as copper, aluminum, tungsten, iron, molybdenum, nickel, titanium, silver, and gold, or alloys containing two or more metals such as stainless steel, carbon steel, brass, phosphor bronze, zirconium-copper alloy, beryllium copper, iron-nickel, nichrome, nickel-titanium, Kanthal, Hastelloy, and rhenium-tungsten. Furthermore, the metal wire may be plated with gold, tin, zinc, silver, nickel, chromium, nickel-chromium alloy, or solder, or may be surface-coated with a carbon material or polymer, as described below. Wires containing one or more metals selected from tungsten and molybdenum, and alloys containing these, are particularly preferred from the viewpoint of low volume resistivity. The metal wire may be a metal wire coated with a carbon material. When the metal wire is coated with a carbon material, the metallic luster of the metal wire is reduced, making it easier to make the metal wire less noticeable. Furthermore, when the metal wire is coated with a carbon material, metal corrosion is also suppressed. Examples of the carbon material that can be used to coat the metal wire include amorphous carbon such as carbon black, activated carbon, hard carbon, soft carbon, mesoporous carbon, and carbon fiber; graphite, fullerene, graphene, and carbon nanotubes.
[0107] The conductive linear body 21 may be a linear body in which a conductive coating is applied to the thread. Examples of the thread include threads spun from resins such as nylon or polyester. Examples of the thread include threads made of metal fiber, carbon fiber, or ion-conductive polymer fiber. Examples of the conductive coating include coatings made of metal, conductive polymer, or carbon material. The conductive coating can be formed by plating, vapor deposition, or the like. A linear body in which a conductive coating is applied to the thread can improve the conductivity of the linear body while maintaining the flexibility of the thread. In other words, it becomes easier to reduce the resistance of the wiring body 2.
[0108] (electrode) The electrodes 4 are used to supply current to the conductive linear body 21. The electrodes 4 are in pair. The electrodes 4 are in direct contact with the conductive linear body 21. The electrodes 4 are arranged so as to be electrically connected to both ends of the conductive linear body 21. The electrode 4 can be formed using a known electrode material. Examples of the electrode material include conductive pastes such as silver paste, copper paste, and carbon paste; metal foils such as copper foil; and metal wires. When the electrode material is a conductive paste, silver paste is preferred. When the electrode material is a metal wire, the number of metal wires may be one, but two or more are preferred.
[0109] When the electrode material is a metal foil or metal wire, examples of the metal of the metal foil or metal wire include copper, aluminum, tungsten, iron, molybdenum, nickel, titanium, silver, and gold; or alloys containing two or more metals such as stainless steel, carbon steel, brass, phosphor bronze, zirconium-copper alloy, beryllium copper, iron-nickel, nichrome, nickel-titanium, Kanthal, Hastelloy, and rhenium-tungsten. The metal foil or metal wire may also be plated with gold, tin, zinc, silver, nickel, chromium, nickel-chromium alloy, solder, or the like.
[0110] The width of at least one of the electrodes 4 is preferably 10 mm or less, and more preferably 3 mm or less, in a plan view of the wiring sheet 300. The width of this electrode is preferably 0.1 mm or more. If at least one of the electrodes is a metal wire, the width of the electrode is the diameter of the metal wire. When two or more metal wires are used, the width of one electrode refers to the sum of the diameters of the metal wires when the metal wires are arranged side by side. If the metal wires are bundled, the width refers to the major axis of the bundle in a plan view.
[0111] The thickness of the electrode 4 is preferably 2 μm or more, more preferably 5 μm or more, and even more preferably 10 μm or more. The thickness of the electrode 4 is preferably 200 μm or less, more preferably 100 μm or less, even more preferably 50 μm or less, and even more preferably 25 μm or less. If the thickness of the electrode 4 is within the above range, the electrical conductivity is high and the resistance is low, and the resistance value with the wiring body 2 can be kept low. Furthermore, sufficient strength as the electrode 4 can be obtained. Note that when the electrode 4 is a metal wire, the thickness of the electrode 4 is the diameter of the metal wire.
[0112] (Use of wiring sheet) The wiring sheet 300 according to this embodiment can be suitably used, for example, as a sheet heater. Furthermore, as described above, even when used in optical sensing technology, the wiring sheet 300 according to this embodiment can be suitably used as a component for optical sensors because the image of the object obtained by irradiating the object with laser light is sharpened. For example, since the wiring sheet 300 includes the electrode 4 and the wiring body 2, it can be used as a heater for an optical sensor. Specifically, the wiring sheet 300 can be used as a heater for an optical sensor such as a LiDAR sensor, and can be used as a sheet heater for a sheet-like optical sensor such as a LiDAR sensor. Alternatively, the wiring sheet 300 can be used by being attached to an adherend, for example. In this case, if the adhesive layer 3 is a layer consisting only of an adhesive, the adhesive for forming the adhesive layer 3 can be used to attach the wiring sheet 300 to the adherend, and the adhesive can then be cured to produce an adherend to which the wiring sheet 300 is attached. In addition, the present invention can also be applied to applications such as heaters that require the property of sharpening the image of an object obtained by irradiating the object with laser light.
[0113] (Method of manufacturing wiring sheet) There are no particular limitations on the method for manufacturing interconnect sheet 300 according to this embodiment. Interconnect sheet 300 can be manufactured, for example, by the following steps.
[0114] First, a step of forming a coating layer 5 on the substrate 1 is performed. In this step, the substrate 1 is prepared, and a coating layer-forming composition for forming the coating layer 5 is prepared. The coating layer-forming composition contains an infrared-transparent ink. When the coating layer-forming composition contains the infrared-transparent ink, it becomes easier to adjust the minimum transmittance of the coating layer 5 to 70% or more for near-infrared light having a wavelength of 905 nm to 1000 nm. The coating layer-forming composition is then applied to the substrate 1 to form a coating film of the coating layer-forming composition. The coating film is then dried to form the coating layer 5 on the substrate 1. For example, the arithmetic mean roughness Ra and maximum roughness height Rz, measured by a method in accordance with JIS B0601:2013, of the surface of the coating layer 5 on which the pressure-sensitive adhesive layer 3 is to be formed can be adjusted by changing the composition of the coating layer-forming composition for forming the coating layer 5, the drying conditions for the coating film for forming the coating layer 5, the mesh used to filter the coating layer-forming composition, the solvent content in the coating layer-forming composition, etc.
[0115] Next, a process for preparing a wiring sheet including the wiring body 2 is performed. In this process, when the adhesive layer 3 is a layer consisting only of an adhesive, and the adhesive is a thermosetting adhesive, the thermosetting adhesive for forming the adhesive layer 3 is applied onto the release sheet to form a coating film. Next, the coating film is dried to prepare an adhesive layer with a release sheet. Next, conductive linear bodies 21 are arranged and disposed on the adhesive layer to form the wiring body 2. For example, with the adhesive layer with a release sheet disposed on the outer circumferential surface of a drum member, the conductive linear bodies 21 are spirally wound around the adhesive layer 3 while the drum member is rotated. Then, the bundle of spirally wound conductive linear bodies 21 is cut along the axial direction of the drum member. This forms the wiring body 2, which is then disposed on the adhesive layer 3. In this manner, a wiring sheet is obtained in which the wiring body 2 is formed on the adhesive layer with a release sheet. According to this method, for example, by rotating the drum member and moving the payout portion of the conductive linear body 21 along a direction parallel to the axis of the drum member, it is easy to adjust the interval L between adjacent conductive linear bodies 21 in the wiring body 2.
[0116] On the other hand, when the adhesive layer 3 is an adhesive sheet including an adhesive base material and a layer containing an adhesive provided on the adhesive base material, and the adhesive is a thermosetting adhesive, a thermosetting adhesive for forming the adhesive-containing layer is applied to one surface of the adhesive base material to form a coating film. Next, the coating film is dried to produce the adhesive-containing layer. The subsequent process of arranging the conductive linear members 21 in an aligned manner to form the wiring body 2 may be performed in the same manner as above. In this way, a wiring body sheet is obtained in which the wiring body 2 is formed on the adhesive-containing layer of the adhesive sheet.
[0117] Next, a step is performed in which a pair of electrodes 4 is provided on the coating layer 5 formed on the substrate 1. In this step, for example, a conductive paste or the like is printed in a predetermined arrangement on the coating layer 5, and then dried, etc., to provide the pair of electrodes 4.
[0118] Next, the wiring body sheet prepared above is placed on the covering layer 5 on which the pair of electrodes 4 is provided, and the thermosetting adhesive is cured. In this step, the wiring body sheet is attached to the covering layer 5 on which the pair of electrodes 4 is provided, so that the pair of electrodes 4 contact both ends of the conductive linear members 21 in the wiring body 2 of the wiring body sheet. When the adhesive layer 3 is a layer consisting only of an adhesive, the release sheet is peeled off, and then the thermosetting adhesive is subjected to a predetermined heat treatment to form the adhesive layer 3, thereby producing the wiring sheet 300. On the other hand, when the adhesive layer 3 is an adhesive sheet, the adhesive sheet is placed, and then the thermosetting adhesive is subjected to a predetermined heat treatment to form the adhesive layer 3, thereby producing the wiring sheet 300.
[0119] (Operation and effect of the second embodiment) According to this embodiment, it is possible to achieve the same effects as those (1) to (3) of the first embodiment. Furthermore, according to this embodiment, it is possible to achieve the following effects. (4) According to this embodiment, the effect of (1) described in the first embodiment can be achieved, so the wiring sheet 300 can be used as a component for an optical sensor such as a LiDAR sensor, and since it further includes an electrode 4 and a wiring body 2, it can also be used as a heater for an optical sensor such as a LiDAR sensor. (5) According to this embodiment, the adhesive layer 3 can fix the conductive linear body 21, suppress deformation in the thickness direction inside the wiring sheet 300, stabilize contact between the conductive linear body 21 and the electrode 4, and stabilize the resistance value of the wiring body 2. (6) According to this embodiment, the covering layer 5 contains an infrared-transmitting ink, the minimum transmittance of the covering layer 5 for near-infrared rays having wavelengths of 905 nm to 1000 nm is 70% or more, the arithmetic mean roughness Ra of the covering layer 5 on the side on which the adhesive layer 3 is provided is 0.13 μm or less, and the maximum roughness height Rz is 1.2 μm or less. This is thought to result in a structure that facilitates the escape of air bubbles when the adhesive layer 3 is provided on the covering layer 5 with the electrodes 4 and the wiring body 2 provided thereon. Therefore, a wiring body sheet including the wiring body 2 can be attached to the covering layer 5 on which the electrodes 4 are provided, with air bubbles being suppressed from remaining near the electrodes 4 and the wiring body 2. As a result, the generation of air bubbles is likely to be suppressed near the electrodes 4 and the wiring body 2 of the wiring sheet 300. Regarding the suppression of the generation of air bubbles in the wiring sheet 300, the inventors speculate that this is due to the fact that the arithmetic mean roughness Ra and the maximum roughness height Rz on the surface of the coating layer 5 on which the adhesive layer 3 is provided are below the above-mentioned upper limit values, making it possible to control the difference in the amount of air that needs to be removed.
[0120] [Modification of the embodiment] The present invention is not limited to the above-described embodiment, and includes modifications and improvements within the scope of achieving the object of the present invention. For example, in the first and second embodiments described above, the substrate 1, the coating layer 5, and the adhesive layer 3 are illustrated as having different dimensions in a planar direction when viewed in a plane, but the substrate 1, the coating layer 5, and the adhesive layer 3 may be formed so that the dimensions in a planar direction are the same. Moreover, in the second embodiment, the conductive linear body 21 has a portion that is in direct contact with the electrode 4 and a portion that is not in direct contact with the electrode 4. In the wiring body 2, the portion that is not in direct contact with the electrode 4 may or may not be in contact with the coating layer 5. Furthermore, in the second embodiment, wiring sheet 300 does not need to have a structure in which conductive linear members 21 are arranged at intervals from one another, as long as wiring sheet 300 has conductive linear members 21. Specifically, wiring sheet 300 may have a structure in which wiring member 2 is made up of only one conductive linear member. [Example]
[0121] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples in any way. The wiring sheets obtained in the examples were evaluated as follows.
[0122] [Surface roughness measurement] For the substrates with a coating layer to be measured in each example and each comparative example, the arithmetic mean roughness Ra and maximum roughness height Rz of the surface of the coating layer provided on the substrate, on which the adhesive layer was provided, were measured using a surface roughness measuring instrument (manufactured by Mitutoyo Corporation, product name "SV-3000") in accordance with a method in accordance with JIS B0601:2013.
[0123] [Refractive index measurement] Test samples were prepared from the same compositions as the coating layer-forming compositions and adhesive sheets for forming adhesive layers used in each example and comparative example. The refractive index of the prepared test samples was measured at a wavelength of 905 nm and a temperature of 25°C using a spectroscopic ellipsometer (manufactured by JAWOOLLAM, product name "M-2000").
[0124] [Transmittance measurement] Test samples were prepared using the same coating layer-forming compositions as those used in each example and comparative example. The near-infrared transmittance (905 nm or more, 1000 nm or less) of the coating layer was measured using an ultraviolet-visible-near-infrared spectrophotometer (Shimadzu Corporation, product name "UV-VIS-NIR SPECTROPHOTOMETER UV-3600"). By measuring the near-infrared transmittance (905 nm or more, 1000 nm or less) of the coating layer, the transmittance of the infrared-transmitting ink can be essentially measured. Furthermore, the visible light transmittance of the prepared test samples in the wavelength range of 380 nm to 700 nm was measured using the ultraviolet-visible-near-infrared spectrophotometer.
[0125] [Observation of images using laser irradiation light] Laser light emitted at an output of 5 mW from a laser module (manufactured by Civil Laser) with a light source having a wavelength of 905 nm was irradiated onto the substrate with a coating layer, and the laser light was allowed to pass through the substrate with a coating layer, and the image projected on a beam profiler (manufactured by Kokyosha Co., Ltd., product name "LHB-100") was observed. In Table 1, cases where no image blurring occurred are marked as "A", cases where image blurring was confirmed are marked as "F", and cases where image blurring was confirmed and the degree of image blurring was greater than "F". - " was written.
[0126] [Observation of bubbles near the wire] The wiring sheets produced in each of the examples and comparative examples were observed at a magnification of 50 times using an optical microscope (manufactured by Keyence Corporation, product name "VHX-5000") to check for the presence or absence of bubbles. In Table 1, the case where no bubbles were generated is indicated as "A", and the case where bubbles were confirmed is indicated as "F".
[0127] [Preparation of Coating Layer-Forming Composition-1] A visible-light-absorbing infrared-transmitting ink (manufactured by Jujo Chemical Co., Ltd., product name "TG-IR Ink PB-A Black") was prepared as the infrared-transmitting ink. This infrared-transmitting ink contains a perylene-based pigment. To 100 parts by weight of this infrared-transmitting ink, 2 parts by weight of an aminosilane coupling agent (manufactured by Jujo Chemical Co., Ltd., product name "JA-1090"), 15 parts by weight of a dilution additive (manufactured by Jujo Chemical Co., Ltd., product name "TG Retarder"), and 15 parts by weight of a hydrogenated xylylene diisocyanate-based curing agent (manufactured by Seiko Advance Corporation, product name "A Curing Agent") were blended to obtain a coating layer-forming composition-1.
[0128] [Preparation of substrate-1 with coating layer] The coating layer-forming composition-1 prepared above was screen-printed onto the surface of a 2 mm-thick glass substrate to form a coating film. The coating film was then dried in two stages: at 90°C for 10 minutes and then at 150°C for 30 minutes, forming a 6 μm-thick coating layer on the substrate. The coating layer formed from the coating layer-forming composition-1 was colored black, and had a maximum near-infrared transmittance of 89% and a minimum of 86% for wavelengths from 905 nm to 1000 nm, and a maximum visible light transmittance of 5% and a minimum of 0% for wavelengths from 380 nm to 700 nm. In Table 1, the type of coating layer formed from the coating layer-forming composition-1 on the coating layer-attached substrate-1 is indicated as "1."
[0129] [Preparation of Coating Layer-Forming Composition-2] A visible-light-absorbing infrared-transmitting ink (manufactured by Seiko Advance Co., Ltd., product name "HF TCI(E)IR BLACK") was prepared as the infrared-transmitting ink. This infrared-transmitting ink contains a copper phthalocyanine pigment. 2 parts by mass of a ureidosilane coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd., product name "KBM-585"), 15 parts by mass of a dilution additive (manufactured by Seiko Advance Co., Ltd., product name "T-980"), and 15 parts by mass of a hydrogenated xylylene diisocyanate-based curing agent (manufactured by Seiko Advance Co., Ltd., product name "A Curing Agent") were blended with 100 parts by mass of this infrared-transmitting ink to obtain a coating layer-forming composition-2.
[0130] [Preparation of substrate-2 with coating layer] A 7 μm thick coating layer was formed on the substrate in the same manner as in the preparation of substrate-1 with a coating layer, except that coating layer-forming composition-1 was replaced with coating layer-forming composition-2 prepared above. The coating layer formed from coating layer-forming composition-2 was colored black, and had a maximum transmittance of 92% and a minimum of 86% for near-infrared light with wavelengths of 905 nm to 1000 nm, and a maximum transmittance of 5% and a minimum of 0% for visible light with wavelengths of 380 nm to 700 nm. In Table 1, the type of coating layer formed from coating layer-forming composition-2 on substrate-2 with a coating layer is indicated as "2."
[0131] [Preparation of Coating Layer-Forming Composition-3] A visible-light-absorbing infrared-transmitting ink (manufactured by Seiko Advance Co., Ltd., product name "IR BLACK HF ATS") was prepared as the infrared-transmitting ink. This infrared-transmitting ink contains a copper phthalocyanine pigment. 100 parts by mass of this infrared-transmitting ink was blended with 3.5 parts by mass of a ureidosilane coupling agent (manufactured by Seiko Advance Co., Ltd., product name "CARE 73N"), 5 parts by mass of a dilution additive (manufactured by Seiko Advance Co., Ltd., product name "T-980"), and 20 parts by mass of a hydrogenated xylylene diisocyanate-based curing agent (manufactured by Seiko Advance Co., Ltd., product name "A Curing Agent") to obtain a coating layer-forming composition-3.
[0132] [Preparation of substrate-3 with coating layer] A 12 μm thick coating layer was formed on the substrate in the same manner as in the preparation of substrate-1 with a coating layer, except that coating layer-forming composition-1 was replaced with coating layer-forming composition-3 prepared above. The coating layer formed from coating layer-forming composition-3 was colored black, and had a maximum near-infrared transmittance of 92% and a minimum of 90% for wavelengths of 905 nm to 1000 nm, and a maximum visible light transmittance of 3% and a minimum of 0% for wavelengths of 380 nm to 700 nm. In Table 1, the type of coating layer formed from coating layer-forming composition-3 on substrate-3 with a coating layer is indicated as "3."
[0133] [Preparation of Coating Layer-Forming Composition-4] A visible-light-absorbing infrared-transmitting ink (manufactured by Teikoku Ink Mfg. Co., Ltd., product name "IRX-HF90513 TKI IR Black") was prepared as the infrared-transmitting ink. This infrared-transmitting ink did not contain either perylene-based pigments or phthalocyanine-based pigments. 100 parts by weight of this infrared-transmitting ink was blended with 2 parts by weight of an epoxy silane coupling agent (manufactured by Seiko Advance Co., Ltd., product name "CARE182N"), 15 parts by weight of a dilution additive (manufactured by Seiko Advance Co., Ltd., product name "T-980"), and 15 parts by weight of a hydrogenated xylylene diisocyanate-based curing agent (manufactured by Seiko Advance Co., Ltd., product name "A Curing Agent") to obtain a coating layer-forming composition-4.
[0134] [Preparation of substrate-4 with coating layer] The coating layer-forming composition-4 prepared above was screen-printed onto the surface of a 2 mm-thick glass substrate to form a coating film. The coating film was then dried at 160°C for 40 minutes to form a 5 μm-thick coating layer on the substrate. The coating layer formed from the coating layer-forming composition-4 was colored black, and had a maximum near-infrared transmittance of 91% and a minimum of 90% for wavelengths from 905 nm to 1000 nm, and a maximum visible light transmittance of 1% and a minimum of 0% for wavelengths from 380 nm to 700 nm. In Table 1, the type of coating layer formed from the coating layer-forming composition-4 on the coating layer-attached substrate-4 is indicated as "4."
[0135] [Preparation of adhesive sheet-1] (Preparation of (meth)acrylic acid ester polymer (A)) A (meth)acrylic acid ester polymer (A) was prepared by copolymerizing 30 parts by mass of 2-ethylhexyl acrylate, 25 parts by mass of butyl acrylate, 5 parts by mass of 4-acryloylmorpholine, 15 parts by mass of isobornyl acrylate, and 25 parts by mass of 2-hydroxyethyl acrylate. The molecular weight of this (meth)acrylic acid ester polymer (A) was measured, and the weight average molecular weight (Mw) was 600,000.
[0136] (Preparation of Pressure-Sensitive Adhesive Composition) 100 parts by mass of the obtained (meth)acrylic acid ester polymer (A), 0.2 parts by mass of trimethylolpropane-modified tolylene diisocyanate as crosslinking agent (B), 8.0 parts by mass of ε-caprolactone-modified tris-(2-acryloxyethyl)isocyanurate as energy ray-curable component (C), 0.8 parts by mass of 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide as photopolymerization initiator (D), and 0.2 parts by mass of 3-glycidoxypropyltrimethoxysilane as a silane coupling agent were mixed, thoroughly stirred, and diluted with methyl ethyl ketone to obtain a coating solution of a pressure-sensitive adhesive composition.
[0137] (Preparation of adhesive sheet) The obtained coating solution of the pressure-sensitive adhesive composition was applied to a 100 μm thick adhesive substrate (manufactured by Zeon Corporation, product name "ZEONOR ZF16") so as to have a thickness of 15 μm, followed by drying, to obtain a pressure-sensitive adhesive sheet-1 for forming a pressure-sensitive adhesive layer. In Table 1, pressure-sensitive adhesive sheet-1 is represented as pressure-sensitive adhesive layer type "1".
[0138] [Preparation of adhesive sheet-2] (Preparation of curable adhesive) A curable adhesive was obtained by blending 100 parts by mass of phenoxy resin (manufactured by Mitsubishi Chemical Corporation, product name "YX7200B35") with 170 parts by mass of a polyfunctional hydrogenated bisphenol A diglycidyl ether epoxy compound (manufactured by Mitsubishi Chemical Corporation, product name "YX8000"), 0.2 parts by mass of 8-glycidoxyoctyltrimethoxysilane as a silane coupling agent, and 2 parts by mass of benzyl(4-hydroxyphenyl)methylsulfonium tetrakis(pentafluorophenyl)borate and 2 parts by mass of (4-hydroxyphenyl)methyl(4-methylbenzyl)sulfonium tetrakis(pentafluorophenyl)borate as thermal cationic polymerization initiators.
[0139] (Preparation of adhesive sheet) The obtained curable adhesive was applied to a 100 μm thick adhesive base material (manufactured by Zeon Corporation, product name "ZEONOR ZF16") so as to have a thickness of 15 μm, followed by drying, to obtain adhesive sheet-2, which is an adhesive sheet for forming an adhesive layer. In Table 1, adhesive sheet-2 is represented as adhesive layer type "2".
[0140] [Preparation of adhesive sheet-3] (Preparation of (meth)acrylic acid ester polymer (B)) Butyl acrylate was polymerized alone to prepare a (meth)acrylic acid ester polymer (B). The molecular weight of this (meth)acrylic acid ester polymer (B) was measured, and the weight average molecular weight (Mw) was 1,000,000. The (meth)acrylic acid ester polymer (B) was diluted with methyl ethyl ketone to obtain a coating solution of a pressure-sensitive adhesive composition containing the (meth)acrylic acid ester polymer (B).
[0141] (Preparation of adhesive sheet) The obtained coating solution of the pressure-sensitive adhesive composition was applied to a 100 μm thick adhesive base material (manufactured by Zeon Corporation, product name "ZEONOR ZF16") so as to have a thickness of 15 μm, followed by drying, to obtain a pressure-sensitive adhesive sheet-3 for forming a pressure-sensitive adhesive layer. In Table 1, pressure-sensitive adhesive sheet-3 is represented as pressure-sensitive adhesive layer type "3".
[0142] [Laminate fabrication] <Examples 1 to 4, Comparative Example 1> The surface of the adhesive sheet of the type shown in Table 1 prepared above on which the adhesive layer was provided was attached to the coating layer of the substrate with coating layer prepared above, thereby obtaining laminates of Examples 1 to 4 and Comparative Example 1.
[0143] [Creating wiring sheets] <Example 5> (Production of wiring sheet) The adhesive sheet-2 was cut into a rectangle of 250 mm × 320 mm. A gold-plated tungsten wire with a diameter of 10 μm (manufactured by Tokusai Corporation, product name "Au(0.1)-TWG", volume resistivity 5.5 × 10) was used as the conductive wire. -8 A wire having a resistance of 1000 Ω·m (hereinafter simply referred to as wire) was prepared. Next, the cut adhesive sheet-2 was wrapped around a drum member with a rubber outer periphery, with the surface of the curable adhesive facing outward, ensuring no wrinkles, and both ends of the adhesive sheet-2 in the circumferential direction were fixed with double-sided tape. The wire was wound around a bobbin, and the wire wound around the bobbin was attached to the surface of the curable adhesive layer of the adhesive sheet-2 located near the end of the drum member. The wire was then unwound and wound around the drum member, and the drum member was gradually moved in a direction parallel to the drum axis so that the wire was wound around the drum member in a spiral at equal intervals of 3 mm. This formed a wiring body with 96 wires arranged on the surface of the curable adhesive. The wire was then cut and removed from the drum member. The wiring body was cut into 40 mm x 82 mm widths so that 12 wires could be removed, producing a wiring body sheet.
[0144] (Preparation of substrate with electrodes) Silver paste was screen-printed onto the substrate-1 with a coating layer so that the width was 2.5 mm and the distance between electrodes was 7.8 mm, and then dried at a temperature of 150°C for 30 minutes to form strip electrodes with a thickness of 17 μm. The strip electrodes were then subjected to electroless plating to produce the substrate-1 with electrodes.
[0145] (Creating wiring sheets) The wiring sheet prepared above was attached to the electrode-attached substrate-1 prepared above so that the electrodes were located at both ends of the wire. Then, the assembly was heated at a temperature of 120°C and a pressure of 0.5 MPa for 30 minutes to cure the curable adhesive, thereby producing the wiring sheet of Example 5.
[0146] <Example 6, Comparative Example 2> Wiring sheets were prepared in the same manner as in Example 6 and Comparative Example 2, except that the substrate-1 with a coating layer and the adhesive sheet in Example 6 and Comparative Example 2 were changed as shown in Table 1.
[0147] [Table 1]
[0148] FIG. 5 shows an example of a laser irradiation light observation image according to Example 5, and FIG. 6 shows an example of a laser irradiation light observation image according to Comparative Example 2. As shown in FIGS. 5 and 6, it was confirmed that the images irradiated with laser were sharper in the Examples than in the Comparative Examples. Furthermore, as shown in Table 1, it was confirmed that the images irradiated with laser were not blurred in Examples 1 to 6. This demonstrates that the laminate and wiring sheet according to this embodiment sharpen the images of the object obtained by irradiating the object with laser light. It was also confirmed that the wiring bodies obtained in Examples 5 and 6 did not generate bubbles. [Explanation of symbols]
[0149] 1... Base material, 2... Wiring body, 21... Conductive linear body, 3... Adhesive layer, 4... Electrode, 5... Covering layer, 100... Laminate, 300... Wiring sheet.
Claims
1. A substrate; a coating layer provided on the substrate; an adhesive layer provided on the coating layer; Equipped with the coating layer includes an infrared transparent ink; the coating layer has a minimum transmittance of 70% or more for near-infrared rays in the wavelength range of 905 nm to 1000 nm; the surface of the coating layer on which the pressure-sensitive adhesive layer is provided has an arithmetic mean roughness Ra of 0.13 μm or less and a maximum roughness height Rz of 1.2 μm or less, as measured by a method in accordance with JIS B0601:2013; Laminate.
2. The laminate according to claim 1 , The refractive index of the pressure-sensitive adhesive layer at a wavelength of 905 nm is 1.46 or more. Laminate.
3. The laminate according to claim 1 or 2, the coating layer is a colored coating layer, and the maximum value of the visible light transmittance in the wavelength range of 380 nm to 700 nm is 10% or less; Laminate.
4. The laminate according to claim 1 or 2, the infrared transparent ink contains at least one pigment selected from the group consisting of perylene pigments and phthalocyanine pigments, Laminate.
5. A substrate; a coating layer provided on the substrate; an electrode provided on the coating layer; an adhesive layer provided on the electrode; a wiring body including a conductive linear body; Equipped with the adhesive layer directly or indirectly supports the wiring body, the electrodes are a pair of electrodes that are in direct contact with the conductive linear body, the coating layer includes an infrared transparent ink; the coating layer has a minimum transmittance of 70% or more for near-infrared rays in the wavelength range of 905 nm to 1000 nm; the surface of the coating layer on which the pressure-sensitive adhesive layer is provided has an arithmetic mean roughness Ra of 0.13 μm or less and a maximum roughness height Rz of 1.2 μm or less, as measured by a method in accordance with JIS B0601:2013; Wiring sheet.
6. The wiring sheet according to claim 5, The refractive index of the pressure-sensitive adhesive layer at a wavelength of 905 nm is 1.46 or more. Wiring sheet.
7. The wiring sheet according to claim 5 or 6, The coating layer is a colored coating layer, and the maximum value of the visible light transmittance in the wavelength range of 380 nm to 700 nm is 10% or less. Wiring sheet.
8. The wiring sheet according to claim 5 or 6, the infrared transparent ink contains at least one pigment selected from the group consisting of perylene pigments and phthalocyanine pigments, Wiring sheet.
9. The wiring sheet according to claim 5 or 6, The wiring body has a structure in which the conductive linear bodies are arranged at intervals. Wiring sheet.
10. The wiring sheet according to claim 5 or 6, The wiring body is composed of only one of the conductive linear bodies. Wiring sheet.
Citation Information
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