Manufacturing method for wiring circuit board

Abstract

To provide a manufacturing method for a wiring circuit board that suppresses deformation of solder plating layers and terminals after forming solder plating layers on the terminals.SOLUTION: The manufacturing method for a wiring circuit board 1 includes a step for forming a first insulating layer 12 on one surface of a metal base material M, a step for forming a circuit pattern 13 on the first insulating layer 12, a step for forming a plating resist R1 exposing a terminal 131A, a step for forming a solder plating layer 15 on the terminal 131A, and a step for placing an etching resist R11 on the plating resist R1 to cover the solder plating layer 15.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a printed circuit board. [Background technology]

[0002] BACKGROUND ART Conventionally, there has been known a wired circuit board that includes a conductor layer having terminals and a conductive member disposed on the terminals (see, for example, Patent Document 1 below). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2023-029294 Summary of the Invention [Problem to be solved by the invention]

[0004] In the manufacture of the wired circuit board described in the above-mentioned Patent Document 1, when the wired circuit board is handled in the middle of manufacture after the conductive members have been formed, the conductive members and terminals may be deformed. For example, when two wired circuit boards in the middle of manufacture are stacked, a part of one wired circuit board may come into contact with the conductive members of the other wired circuit board, which may cause the conductive members and terminals to be deformed.

[0005] The present invention provides a method for manufacturing a wired circuit board that can suppress deformation of the solder plating layer and the terminals after forming the solder plating layer on the terminals. [Means for solving the problem]

[0006] The present invention [1] is a method for manufacturing a wired circuit board, the wired circuit board comprising a metal support layer, a circuit pattern having terminals, an insulating layer disposed between the metal support layer and the circuit pattern, and a solder plating layer disposed on the terminals, the method for manufacturing the wired circuit board comprising an insulating layer forming step of forming the insulating layer on one side of a metal substrate, a pattern forming step of forming the circuit pattern on the insulating layer, a plating resist forming step of forming a plating resist that exposes the terminals, a solder plating layer forming step of forming a solder plating layer on the terminals, and a protection step of arranging a protective film that covers the solder plating layer on the plating resist.

[0007] According to this method, after the solder plating layer forming step, the plating resist is not peeled off, and in the protection step, a protective film that covers the solder plating layer is placed on the plating resist.

[0008] Therefore, the wired circuit board can be handled during manufacture with the solder plating layer surrounded by the plating resist.

[0009] This allows the plating resist to protect the solder plating layer when handling the wired circuit board during manufacture.

[0010] As a result, after the solder plating layer is formed on the terminal, deformation of the solder plating layer and the terminal can be suppressed.

[0011] The present invention [2] includes the method for manufacturing a wired circuit board according to the above [1], further comprising, after the protecting step, a contour processing step of etching the substrate to form the metal support layer, wherein the protective film is an etching resist, and in the protecting step, a second etching resist that exposes a part of the substrate is formed on the other side of the substrate.

[0012] According to this method, after the solder plating layer forming step, the solder plating layer can be protected by the plating resist until the outer shape processing step is completed.

[0013] The present invention [3] includes the method for producing a wired circuit board according to the above [2], further comprising a peeling step of peeling off the etching resist together with the plating resist after the outer shape processing step.

[0014] According to this method, in the peeling step, the etching resist used in the outer shape processing step and the plating resist used in the solder plating layer forming step can be peeled off together.

[0015] Therefore, the number of steps can be reduced.

[0016] The present invention [4] includes the method for manufacturing a wired circuit board according to any one of the above [1] to [3], wherein the insulating layer forming step, the pattern forming step, the plating resist forming step, the solder plating layer forming step, and the protection step are carried out by roll-to-roll.

[0017] According to this method, when the partially manufactured wired circuit board is wound up, the solder plating layer can be protected by the plating resist. [Effects of the Invention]

[0018] According to the method for manufacturing a wired circuit board of the present invention, deformation of the terminals can be suppressed after the solder plating layer is formed on the terminals. [Brief explanation of the drawings]

[0019] [Figure 1] FIG. 1 is a plan view of a printed circuit board according to one embodiment of the present invention. [Figure 2] FIG. 2 is a cross-sectional view of the printed circuit board shown in FIG. 1 taken along the line AA. [Figure 3] Fig. 3A shows a first insulating layer forming step in the method for producing the wired circuit board shown in Fig. 2. Fig. 3B shows a pattern forming step following Fig. 3A. Fig. 3C shows a second insulating layer forming step following Fig. 3B. [Figure 4]Fig. 4A shows the opening forming step following Fig. 3C, Fig. 4B shows the coating layer forming step following Fig. 4A, and Fig. 4C shows the plating resist forming step following Fig. 4B. [Figure 5] Fig. 5A shows the solder plating layer forming step following Fig. 4C, Fig. 5B shows the etching resist forming step following Fig. 5A, and Fig. 5C shows the outline processing step following Fig. 5B. [Figure 6] FIG. 6 is an explanatory diagram for explaining protection of the solder plating layer by the plating resist. [Figure 7] FIG. 7 is an explanatory diagram illustrating a modified example of the printed circuit board. DETAILED DESCRIPTION OF THE INVENTION

[0020] 1. Wiring circuit board As shown in Fig. 1, the wired circuit board 1 extends in the length direction and width direction. In this embodiment, the wired circuit board 1 has a substantially rectangular shape. However, the shape of the wired circuit board 1 is not limited to this embodiment. The wired circuit board 1 may be a flexible wired circuit board or a circuit-equipped suspension board.

[0021] As shown in FIG. 2, the wired circuit board 1 includes a metal support layer 11, a first insulating layer 12, a circuit pattern 13, a second insulating layer 14, and a solder plating layer 15.

[0022] (1) Metal support layer The metal support layer 11 supports the first insulating layer 12, the circuit pattern 13, and the second insulating layer 14. Examples of materials for the metal support layer 11 include stainless steel and copper alloys. The metal support layer 11 has an opening 11A.

[0023] The opening 11A is disposed at one end in the length direction of the wired circuit board 1. The opening 11A extends in the width direction.

[0024] (2) First insulating layer The first insulating layer 12 is disposed on one side of the metal support layer 11 in the thickness direction of the metal support layer 11. The thickness direction is perpendicular to the length direction and width direction. The first insulating layer 12 is disposed on one surface of the metal support layer 11 in the thickness direction. The first insulating layer 12 is disposed between the metal support layer 11 and the circuit pattern 13 in the thickness direction. The first insulating layer 12 insulates the metal support layer 11 from the circuit pattern 13. The first insulating layer 12 is made of a resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. Preferably, the first insulating layer 12 is made of polyimide. As shown in FIG. 1, the first insulating layer 12 has an opening 12A.

[0025] The opening 12A is disposed at one end in the length direction of the wired circuit board 1. The opening 12A extends in the width direction. The entire opening 12A communicates with the opening 11A of the metal support layer 11 (see FIG. 2).

[0026] (3) Circuit pattern 2, the circuit pattern 13 is disposed on one side of the first insulating layer 12 in the thickness direction. The circuit pattern 13 is disposed on one surface of the first insulating layer 12 in the thickness direction. The circuit pattern 13 is disposed on the opposite side of the first insulating layer 12 from the metal support layer 11 in the thickness direction. The shape of the circuit pattern 13 is not limited.

[0027] 1, the circuit pattern 13 has a plurality of terminals 131A and 131B, a plurality of terminals 132A and 132B, and a plurality of wirings 133A and 133B. Note that the number of terminals and the number of wirings are not limited.

[0028] (3-1) Terminals 131A, 131B The terminals 131A and 131B are arranged at one end of the wired circuit board 1 in the length direction. When the wired circuit board 1 is a suspension board with circuit, the terminals 131A and 131B are, for example, magnetic head connection terminals that are electrically connected to a magnetic head. In this embodiment, the terminals 131A and 131B are aligned in the width direction. The terminal 131B is arranged at a distance from the terminal 131A in the width direction. Each of the terminals 131A and 131B has, for example, a square land shape.

[0029] The width W (dimension in the width direction) of the terminal 131A is, for example, 40 μm or less, preferably 30 μm or less. If the width W of the terminal 131A is less than the above upper limit, it becomes difficult to form a solder layer on the terminal 131A by printing.

[0030] The width W of the terminal 131A is, for example, 5 μm or more, or preferably 10 μm or more.

[0031] As shown in FIG. 2, terminal 131A is disposed on one side of first insulating layer 12 in the thickness direction. Terminal 131A is disposed on one surface of first insulating layer 12 in the thickness direction. Specifically, one end of terminal 131A in the length direction is disposed within opening 12A (see FIG. 1) of first insulating layer 12. The other end of terminal 131A in the length direction is disposed on one surface of first insulating layer 12. Terminal 131A has a conductor layer 1311 and a covering layer 1312.

[0032] The conductor layer 1311 is made of copper and is continuous with the wiring 133A.

[0033] The covering layer 1312 covers the surface of the conductor layer 1311. The covering layer 1312 is made of a metal different from that of the conductor layer 1311. The covering layer 1312 may be a single layer or multiple layers. The covering layer 1312 has at least a surface layer 1312A made of gold. The surface layer 1312A is, for example, a gold-plated layer. The covering layer 1312 preferably has an intermediate layer 1312B. The intermediate layer 1312B is disposed between the conductor layer 1311 and the surface layer 1312A. The intermediate layer 1312B is made of a metal different from that of the conductor layer 1311 and the surface layer 1312A. The intermediate layer 1312B is preferably made of nickel. The intermediate layer 1312B is, for example, a nickel-plated layer.

[0034] The thickness T1 of the coating layer 1312 is, for example, 0.1 μm or more, preferably 0.2 μm or more, and for example, 5 μm or less, preferably 4 μm or less.

[0035] (3-2) Terminals 132A, 132B 1, the terminals 132A and 132B are arranged at the other end of the wired circuit board 1 in the length direction. In this embodiment, the terminals 132A and 132B are aligned in the width direction. The terminal 132B is arranged apart from the terminal 132A in the width direction. Each of the terminals 132A and 132B has, for example, a square land shape.

[0036] Terminal 132A is disposed on one side of first insulating layer 12 in the thickness direction. Terminal 132A is disposed on one surface of first insulating layer 12 in the thickness direction. Like terminal 131A, terminal 132A also has a conductor layer 1311 and a covering layer 1312.

[0037] The description of the terminal 132B is the same as the description of the terminal 132A, so the description of the terminal 132B will be omitted.

[0038] (3-3) Wiring One end of the wiring 133A is connected to the terminal 131 A. The other end of the wiring 133A is connected to the terminal 132 A. The wiring 133A electrically connects the terminal 131A and the terminal 132A.

[0039] One end of the wiring 133B is connected to the terminal 131 B. The other end of the wiring 133B is connected to the terminal 132 B. The wiring 133B electrically connects the terminal 131 B and the terminal 132B.

[0040] The wirings 133A and 133B are made of the same material as the conductor layer 1311.

[0041] (4) Second insulating layer As shown in FIGS. 1 and 2, the second insulating layer 14 is disposed on the first insulating layer 12 in the thickness direction. The second insulating layer 14 covers the circuit pattern 13. More specifically, the second insulating layer 14 covers the wirings 133A and 133B. The second insulating layer 14 does not cover the terminals 131A, 131B, 132A, and 132B. The second insulating layer 14 is made of a resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester.

[0042] (5) Solder plating layer As shown in FIG. 2, the solder plating layer 15 is disposed on the terminal 131A. The solder plating layer 15 is also disposed on the terminal 131B (see FIG. 1). The solder plating layer 15 may also be disposed on the terminals 132A and 132B (see FIG. 1). The solder plating layer 15 is disposed on one side of the terminal 131A in the thickness direction. The solder plating layer 15 is disposed on one surface of the terminal 131A in the thickness direction. The solder plating layer 15 is disposed on the surface layer 1312A. The solder plating layer 15 is disposed away from the conductor layer 1311 in the thickness direction. The solder plating layer 15 contacts the coating layer 1312 but does not contact the conductor layer 1311. At least a portion of the solder plating layer 15 is disposed within the opening 12A (see FIG. 1) of the first insulating layer 12.

[0043] The thickness T2 of the solder plating layer 15 is thicker than the thickness T1 of the coating layer 1312. The thickness T2 of the solder plating layer 15 is, for example, 1 μm or more, preferably 5 μm or more, more preferably 10 μm or more, and for example, 100 μm or less, preferably 50 μm or less.

[0044] Examples of materials for the solder plating layer 15 include lead, tin, silver, copper, bismuth, indium, and zinc. The solder plating layer 15 is preferably made of a tin-silver alloy.

[0045] 2. Manufacturing method of printed circuit board Next, a method for manufacturing the above-mentioned wired circuit board 1 will be described.

[0046] The method for manufacturing the wired circuit board 1 includes a first insulating layer forming process (see FIG. 3A), a pattern forming process (see FIG. 3B), a second insulating layer forming process (see FIG. 3C), an opening forming process (see FIG. 4A), a coating layer forming process (see FIG. 4B), a plating resist forming process (see FIG. 4C), a solder plating layer forming process (see FIG. 5A), an etching resist forming process (see FIG. 5B) as an example of a protection process, an outer shape processing process (see FIG. 5C), and a peeling process (see FIG. 2).

[0047] (1) First insulating layer formation process As shown in Fig. 3A, in the first insulating layer forming step, a first insulating layer 12 is formed on one surface of a metal substrate M. The substrate M is made of the same material as the above-described metal support layer 11. Of the first insulating layer 12 formed in the first insulating layer forming step, the thickness of a first portion 121 in which an opening 12A (see Fig. 2) is formed is thinner than the thickness of a second portion 122 in which an opening 12A is not formed.

[0048] More specifically, in the first insulating layer forming step, first, a solution (varnish) of a photosensitive resin is applied onto the substrate M and dried to form a coating film of the photosensitive resin.

[0049] Next, the photosensitive resin coating is exposed and developed. The photosensitive resin coating is subjected to gradational exposure using, for example, a photomask having a light-shielding portion, a fully transparent portion, and a semi-transparent portion. The light-shielding portion faces the portion of the photosensitive resin coating where the first insulating layer 12 will not be formed. The semi-transparent portion faces the portion of the photosensitive resin coating where the first portion 121 will be formed. The fully transparent portion faces the portion of the photosensitive resin coating where the second portion 122 will be formed. The gradational exposure results in a first insulating layer 12 having the first portion 121 and the second portion 122.

[0050] The first portion 121 may be formed thinner than the second portion 122 by etching the first insulating layer 12.

[0051] The first insulating layer forming step is carried out by roll-to-roll. That is, the first insulating layer 12 is formed on the substrate M that is pulled out from a roll (first roll) of the substrate M. The substrate M on which the first insulating layer 12 has been formed is wound up as a second roll.

[0052] (2) Pattern formation process The pattern forming step is carried out after the first insulating layer forming step.

[0053] As shown in FIG. 3B, in the pattern formation step, a circuit pattern 13 is formed on the first insulating layer 12. More specifically, in the pattern formation step, a conductor pattern 20 of the circuit pattern 13 is formed. The conductor pattern 20 has conductor layers 1311 of the terminals 131A, 131B, 132A, and 132B, respectively, and wirings 133A and 133B. The conductor pattern 20 is made of copper. The conductor pattern 20 does not have a covering layer 1312.

[0054] In the circuit pattern forming process, first, a seed layer is formed on one surface of the first insulating layer 12 and one surface of the substrate M in the thickness direction. The seed layer is formed by, for example, sputtering. Examples of materials for the seed layer include chromium, copper, nickel, titanium, and alloys thereof.

[0055] Next, a plating resist is attached to one surface in the thickness direction of the base material M. The plating resist covers the first insulating layer 12.

[0056] Next, the plating resist is exposed to light and developed, which removes the plating resist from the area where the conductive pattern 20 is to be formed, exposing the seed layer in the area where the conductive pattern 20 is to be formed. On the other hand, the plating resist remains in the area where the conductive pattern 20 is not to be formed.

[0057] Next, the conductive pattern 20 is formed on the exposed seed layer by electrolytic plating. After the electrolytic plating is completed, the plating resist is stripped off, and the seed layer exposed by the stripping of the plating resist is removed by etching.

[0058] The pattern forming step is carried out by roll-to-roll. More specifically, in the pattern forming step, the substrate M is pulled out from the second roll (the roll after the first insulating layer forming step), and the conductive pattern 20 is formed on the first insulating layer 12. Thereafter, the substrate M on which the conductive pattern 20 has been formed is wound up as a third roll.

[0059] (3) Second insulating layer formation process The second insulating layer forming step is carried out after the pattern forming step.

[0060] As shown in FIG. 3C, in the second insulating layer forming step, a second insulating layer 14 is formed on the first insulating layer 12.

[0061] More specifically, in the second insulating layer forming step, first, a photosensitive resin solution (varnish) is applied onto the conductive pattern 20, the first insulating layer 12, and the base material M, and then dried to form a photosensitive resin coating.

[0062] Next, the photosensitive resin coating is exposed to light and developed, thereby forming the second insulating layer 14 on the first insulating layer 12.

[0063] The second insulating layer forming step is performed by roll-to-roll. Specifically, in the second insulating layer forming step, the substrate M is pulled out from a third roll (the roll after the pattern forming step), and the second insulating layer 14 is formed on the first insulating layer 12. Thereafter, the substrate M on which the second insulating layer 14 has been formed is wound up into a fourth roll.

[0064] (4) Opening formation process The opening forming step is carried out after the second insulating layer forming step.

[0065] As shown in FIG. 4A, in the opening forming step, openings 11A are formed in the base material M, and openings 12A are formed in the first insulating layer 12.

[0066] More specifically, in the opening forming step, an etching resist is attached to the other surface of the base material M in the thickness direction.

[0067] Next, the etching resist is exposed to light and developed, whereby the etching resist is removed from the portion where the opening 11A is to be formed, exposing the substrate M in the portion where the opening 11A is to be formed. On the other hand, the etching resist remains in the portion where the opening 11A is not to be formed.

[0068] Next, the base material M exposed from the etching resist is etched to form the opening 11 A. By forming the opening 11 A in the base material M, the first insulating layer 12 is exposed in the opening 11 A.

[0069] Next, the first insulating layer 12 exposed in the opening 11A is etched. By etching the first insulating layer 12 exposed in the opening 11A, an opening 12A is formed in the first insulating layer 12.

[0070] The opening forming step is carried out by roll-to-roll. More specifically, in the opening forming step, the substrate M is pulled out from the fourth roll (the roll after the second insulating layer forming step), and the openings 11A are formed in the substrate M. Thereafter, the substrate M with the openings 11A formed therein is wound up as a fifth roll.

[0071] (5) Covering layer formation process The covering layer forming step is carried out after the opening forming step.

[0072] As shown in FIG. 4B, in the coating layer forming step, a coating layer 1312 is formed on the conductor layer 1311.

[0073] More specifically, in the coating layer forming step, first, plating resists are attached to one surface of the base material M in the thickness direction and the other surface of the base material M in the thickness direction.

[0074] Next, the plating resist is exposed and developed, whereby the plating resist covering the conductor layer 1311 is removed, exposing the conductor layer 1311.

[0075] Next, for example, electroless nickel plating and electroless gold plating are carried out in this order to form a coating layer 1312 on the conductor layer 1311, the coating layer 1312 being made up of an intermediate layer 1312B (nickel plated layer) and a surface layer 1312A (gold plated layer).

[0076] Intermediate layer 1312B (nickel plated layer) may be formed by electrolytic nickel plating, and surface layer 1312A (gold plated layer) may be formed by electrolytic gold plating.

[0077] After the coating layer forming step is completed, the plating resist is stripped off.

[0078] The coating layer forming step is carried out by roll-to-roll. Specifically, in the coating layer forming step, the substrate M is pulled out from the fifth roll (the roll after the aperture forming step), and the coating layer 1312 is formed on the conductor layer 1311. Thereafter, the substrate M on which the coating layer 1312 has been formed is wound up as a sixth roll.

[0079] (6) Plating resist formation process The plating resist forming step is carried out after the coating layer forming step.

[0080] As shown in FIG. 4C, in the plating resist formation step, a plating resist R1 that exposes the terminals 131A and 131B is formed.

[0081] More specifically, in the plating resist forming step, first, a plating resist R1 is attached to one surface of the base material M in the thickness direction.

[0082] Next, the plating resist R1 is exposed to light and developed, whereby the plating resist R1 is removed from the portion where the solder plating layer 15 is to be formed, exposing one surface of each of the terminals 131A and 131B in the thickness direction.

[0083] The plating resist R2 may also be attached to the other surface of the base material M in the thickness direction. The plating resist R2 covers the entire other surface of the base material M in the thickness direction. Also, instead of the plating resist R2, a peelable adhesive film may be attached to the other surface of the base material M in the thickness direction as a protective film.

[0084] The plating resist forming step is carried out by roll-to-roll. Specifically, in the plating resist forming step, the substrate M is pulled out from the sixth roll (the roll after the coating layer forming step) and the plating resist R1 and plating resist R2 are formed. Thereafter, the substrate M on which the plating resist R1 and plating resist R2 have been formed is wound up as a seventh roll.

[0085] (7) Solder plating layer formation process The solder plating layer forming step is carried out after the plating resist forming step.

[0086] As shown in FIG. 5A, in the solder plating layer forming step, a solder plating layer 15 is formed on the terminal 131A.

[0087] More specifically, a solder plating layer 15 is formed on each of the terminals 131A and 131B exposed from the plating resist R1 by electrolytic plating or electroless plating.

[0088] The solder plating layer forming step is carried out by roll-to-roll. More specifically, in the solder plating layer forming step, the substrate M is pulled out from the seventh roll (the roll after the plating resist forming step) and the solder plating layer 15 is formed. Thereafter, the substrate M on which the solder plating layer 15 has been formed is wound up as an eighth roll.

[0089] Here, the substrate M on which the solder plating layer 15 is formed is wound up without peeling off the plating resist R1. In other words, the substrate M on which the solder plating layer 15 is formed is wound up in a state in which the solder plating layer 15 is surrounded by the plating resist R1.

[0090] Therefore, as shown in FIG. 6, the plating resist R1 can prevent the base material M and the solder plating layer 15 from coming into contact with each other when the base material M is wound up.

[0091] As a result, deformation of the terminal 131A can be suppressed.

[0092] The plating resist R2 on the other surface of the substrate M in the thickness direction is removed after the solder plating layer forming step and before the etching resist forming step. To remove the plating resist R2, for example, the plating resist R1 is covered with a polyethylene terephthalate film or the like and immersed in a remover. This allows the plating resist R2 to be removed without removing the plating resist R1.

[0093] Furthermore, even when an adhesive film is used instead of the plating resist R2 as a protective film on the other surface of the substrate M in the thickness direction in the plating resist forming step, the adhesive film is peeled off from the substrate M after the solder plating layer forming step and before the etching resist forming step. The adhesive film can be physically peeled off from the substrate M without using a stripping solution like the plating resist R2.

[0094] (8) Etching resist formation process The etching resist forming step is carried out after the solder plating layer forming step.

[0095] As shown in FIG. 5B, in the etching resist formation step, an etching resist R11 as an example of a protective film is disposed on the plating resist R1, and an etching resist R12 is formed on the other surface of the base material M in the thickness direction.

[0096] The etching resist R11 covers the solder plating layer 15. The etching resist R11 may cover the entire plating resist R1.

[0097] The etching resist R12 exposes a portion of the base material M. Specifically, the etching resist R12 covers the portion of the base material M where the above-described metal support layer 11 is to be formed, and exposes the periphery of the portion where the metal support layer 11 is to be formed.

[0098] In the etching resist forming step, first, an etching resist R11 is attached to the plating resist R1, and an etching resist R12 is attached to the other surface of the base material M.

[0099] Next, the etching resist R12 is exposed and developed. As a result, the etching resist R12 covering the portion where the metal support layer 11 is to be formed remains, and the etching resist R12 around the portion where the metal support layer 11 is to be formed is removed. As a result, the substrate M around the portion where the metal support layer 11 is to be formed is exposed. In this embodiment, the etching resist R11 is entirely exposed and entirely remains after development.

[0100] The etching resist forming step is carried out by roll-to-roll. Specifically, in the etching resist forming step, the substrate M is pulled out from the eighth roll (the roll after the solder plating layer forming step) and etching resists R11 and R12 are formed. Thereafter, the substrate M on which the etching resists R11 and R12 have been formed is wound up as the ninth roll.

[0101] (9) External shape processing process The outer shape processing step is carried out after the etching resist forming step.

[0102] As shown in FIG. 5C, in the outer shape processing step, the base material M is etched to form the outer shape of the metal support layer 11 (that is, the outer shape of the wired circuit board 1).

[0103] (10) Peeling process The peeling step is carried out after the contour processing step.

[0104] 5C and 2, in the stripping step, the etching resist R11 is stripped together with the plating resist R1, and at the same time, the etching resist R12 is also stripped.

[0105] In this way, the above-described wired circuit board 1 is obtained.

[0106] 3. Effects (1) According to the method for manufacturing the wired circuit board 1, as shown in Figures 5A and 5B, after the solder plating layer forming process (see Figure 5A), the plating resist R1 is not peeled off, and in the etching resist forming process (see Figure 5B), an etching resist R11 that covers the solder plating layer 15 is placed on the plating resist R1.

[0107] Therefore, as shown in FIG. 6, the substrate M (partially manufactured wired circuit board 1) on which the solder plating layer 15 has been formed can be wound up in a state in which the solder plating layer 15 is surrounded by the plating resist R1.

[0108] As a result, when the base material M on which the solder plating layer 15 is formed is wound up, the solder plating layer 15 can be protected by the plating resist R1.

[0109] As a result, after the solder plating layer 15 is formed on the terminal 131A, deformation of the solder plating layer 15 and the terminal 131A can be suppressed.

[0110] (2) According to the method for manufacturing the wired circuit board 1, as shown in FIG. 5C, after the etching resist forming step, the outer shape processing step is carried out.

[0111] Therefore, after the solder plating layer forming step (see FIG. 5A), the solder plating layer 15 can be protected by the plating resist R1 until the outer shape processing step is completed.

[0112] (3) According to the method for manufacturing the wired circuit board 1, as shown in Figures 5C and 2, in the peeling process, the etching resist R11 used in the outline processing process and the plating resist R1 used in the solder plating layer formation process can be peeled off together.

[0113] Therefore, the number of steps can be reduced.

[0114] (4) According to the method for manufacturing the wired circuit board 1, each step from the first insulating layer forming step (see FIG. 3A) to the outer shape processing step (see FIG. 5C) is performed by roll-to-roll.

[0115] Here, as described above, after the solder plating layer forming step (see FIG. 5A), the partially manufactured wired circuit board 1 is rolled up without peeling off the plating resist R1.

[0116] Therefore, in each step after the solder plating layer forming step, the solder plating layer 15 can be protected by the plating resist R1.

[0117] 4. Variations In the modified example, the same components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0118] (1) As shown in Fig. 7, one end of terminal 131A in the length direction may be disposed on one edge of opening 12A in the length direction. In other words, terminal 131A may be disposed across opening 12A.

[0119] (2) The metal support layer 11 does not necessarily have to have the opening 11A. The first insulating layer 12 does not necessarily have to have the opening 12A.

[0120] (3) Each step in the manufacturing method of the wired circuit board 1 is not limited to being performed by roll-to-roll. Each step may be performed on the substrate M in sheet form. [Explanation of symbols]

[0121] 1 Wiring circuit board 11 Metal support layer 12 First insulating layer (insulating layer) 13 Circuit Pattern 131A terminal 15 Solder plating layer M Base material R1 Plating Resist R11 Etching Resist R12 Etching Resist (Second Etching Resist)

Claims

1. A method for manufacturing a printed circuit board, The printed circuit board is a metal support layer; a circuit pattern having terminals; an insulating layer disposed between the metal support layer and the circuit pattern; a solder plating layer disposed on the terminal; Equipped with The method for manufacturing the wired circuit board includes: an insulating layer forming step of forming the insulating layer on one surface of a metal substrate; a pattern forming step of forming the circuit pattern on the insulating layer; a plating resist forming step of forming a plating resist that exposes the terminals; a solder plating layer forming step of forming a solder plating layer on the terminal; a protection step of placing a protection film on the plating resist to cover the solder plating layer; A method for manufacturing a wired circuit board, comprising:

2. After the protection step, the substrate is etched to form the metal support layer, the protective film is an etching resist, 2. The method for producing a wired circuit board according to claim 1, wherein in the protecting step, a second etching resist that exposes a part of the base material is formed on the other surface of the base material.

3. The method for producing a wired circuit board according to claim 2 , further comprising a peeling step of peeling off the etching resist together with the plating resist after the outer shape processing step.

4. 4. The method for manufacturing a wired circuit board according to claim 1, wherein the insulating layer forming step, the pattern forming step, the plating resist forming step, the solder plating layer forming step, and the protection step are performed by roll-to-roll.

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