Method and apparatus for transporting structural component

Abstract

To provide a method and apparatus for transporting structural components from a sending substrate to a receiving substrate.SOLUTION: A method for transporting structural components 2 from a sending substrate to a receiving substrate 8 has a step for at least, providing and / or fabricating structural components on the sending substrate, a step for transporting the structural components of the sending substrate to a transport substrate 4, and a step for transporting structural components from the transport substrate to the receiving substrate. The structural components can be selectively transported using bonding means 6 and / or peeling means 7, with a laser being used as the bonding means and / or peeling means.SELECTED DRAWING: Figure 1e

Description

[Technical Field]

[0001] The present invention particularly relates to a method for transferring electronic components from a sending board to a receiving board.

[0002] The prior art shows a wide variety of methods for transferring product substrates from one carrier substrate to another. Such carrier exchange processes are described in detail, for example, in the publication WO 2011 / 120537. In recent years, functional individual components have increasingly been stacked one on top of the other or arranged adjacent to each other. In this case, it is extremely important that only components that have passed a previous test, especially an electrical test, are transferred. This prevents defective components from being transferred.

[0003] It is therefore an object of the present invention to provide a method and apparatus which at least partially eliminates, and in particular completely eliminates, the drawbacks described in the prior art. In particular, it is an object of the present invention to provide an improved method and apparatus for transferring components from a sender substrate to a receiver substrate. Another object of the present invention is to provide an improved method and apparatus for manufacturing light-emitting diodes, in which individual components are transferred from a sender substrate to a receiver substrate. A further object of the present invention is to provide a method and apparatus in which no defective components are transferred to the receiver substrate, or in which only components with specific properties are transferred to the receiver substrate.

[0004] The above-mentioned problem is solved by the features of the respective independent claims. Advantageous developments of the invention are described in the respective dependent claims. All combinations of at least two features shown in the description, claims and / or drawings are also included within the scope of the invention. In the ranges of values ​​described, values ​​lying within the stated boundaries are also to be considered as disclosed boundary values ​​and can be claimed in any combination. In the following text, component is understood to mean the object to be transported. The component does not necessarily have to be functional in itself.

[0005] Therefore, the present invention provides at least i) providing and / or fabricating components on a source substrate; ii) transferring components of the source substrate to a carrier substrate; iii) transferring the component from the carrier substrate to the receiving substrate; a method for transferring components, particularly electronic components, from a sender substrate to a receiver substrate, particularly having the above sequence, wherein the components can be selectively transferred using bonding means and / or peeling means.

[0006] During the transfer, the components can be placed on or fixed to the sending substrate. It is also conceivable that the components are fabricated on the sending substrate and then placed on the sending substrate after fabrication. Electronic components in particular are extremely small components used in the semiconductor industry.

[0007] The transfer in step ii) can be understood in particular as the taking over of the component by the carrier substrate. The transfer in step iii) can be understood in particular as the delivery of the component to the receiving substrate. During the transfer in step ii), the component arranged on the sending substrate can be brought into contact with the carrier substrate.

[0008] If the components are fixed to the sender substrate, this fixation can be released during transfer to the carrier substrate, particularly selectively for individual components. Components can likewise be fixed to the carrier substrate for transfer, particularly selectively for individual components.

[0009] During the transfer of the component to the receiving substrate, the component or the carrier substrate may likewise come into contact with the receiving substrate and / or other components arranged on the receiving substrate, in particular components transferred to the receiving substrate from this and / or other sending substrates in a previously performed method.

[0010] The fixing on the carrier substrate is in particular selectively releasable, and the components are bonded, during transfer, to the receiving substrate and / or to other components arranged on the receiving substrate, in particular by means of bonding means, in particular by means of a laser.

[0011] Between the individual method steps, the substrates are aligned with one another or with the corresponding positions of the components, in particular by means of alignment marks on the substrates. In this method, it is crucial that the components are selectively transferred between the sending substrate and the receiving substrate. This advantageously allows for the transfer of only specific or selected components. In particular, defective components may not be transferred, or only components with specific properties may be transferred. While all components may be selected here, the bonding and / or peeling means provide the possibility of selection at each transfer. Furthermore, the selection of the components to be transferred may be performed by the carrier substrate, preferably in two steps.

[0012] Furthermore, the present invention relates to an apparatus for transferring a component according to the above-mentioned method for transferring a component, wherein the component can be fabricated and / or provided on a sender substrate, the component of the sender substrate can be transferred to a carrier substrate, the component can be transferred from the carrier substrate to a receiver substrate, and the transfer of the component to the carrier substrate and / or the receiver substrate can be selectively performed by bonding means and / or peeling means.

[0013] Additionally, the present invention relates to a light emitting diode (LED) manufactured using the above method of transferring components.

[0014] In one embodiment of the invention, it is provided that an individual component or a plurality of components are locally defined and fixed by the joining means, in particular by laser radiation, during the transfer in step ii) and / or step iii). It is crucial in this method that the components can be individually fixed or detached during the transfer, so that selective transfer of the components can be achieved in this way. It is also conceivable here for the joining means to act locally on more than one component. However, it is possible to fix, in particular join, each component individually to the carrier substrate or the receiving substrate. This advantageously allows for selective transfer.

[0015] In another advantageous embodiment of the invention, it is intended that an individual component or a plurality of components are locally restricted and released by the peeling means during the transfer in step ii) and / or step iii). It is crucial here that the components can be individually released by the peeling means during the transfer of the components, so that only selected components are released or transferred. Thus, by not allowing transfer, defective components can likewise be excluded from transfer. A locally restricted release of more than one component is also conceivable. In this way, a choice of transfer is advantageously possible.

[0016] Furthermore, the fastening and unfastening of individual components or locally adjacent components by the bonding or peeling means are preferably performed simultaneously and / or with a temporal and spatial lag. For example, the component to be taken over is first fastened to the carrier substrate and then unfastened from the sending substrate. This prevents slippage of the components during the takeover. The same applies when the components are transferred from the carrier substrate to the receiving substrate.

[0017] In another advantageous embodiment of the invention, it is provided that for the selection, the components are tested at least once with respect to functionality, in particular by electrical testing. In this way, it is possible to identify, in particular, functional components that are free of defects. Functional components are capable of performing the functions for which they are intended. By identifying functional components, it is possible to selectively transfer the functional components from the sender substrate to the recipient substrate. However, it is also possible that components are functional but are not transferred because, for example, these components perform functions other than those required in the manufacturing process at the corresponding positions on the recipient substrate. It is also possible that corresponding, particularly functional, components with the required functions are already present at the corresponding positions on the recipient substrate.

[0018] In principle, electrical tests can be carried out before, during or after transfer. If components are produced on the sender board, a test is preferably carried out before transfer to the carrier board in order to prevent defective components from being transferred to the carrier board. A second test can also be carried out after transfer to the carrier board. In particular, it can be checked whether the components are positioned in the intended position. If a component has slipped or is positioned incorrectly, the transfer can also be prevented in such cases, and a selection can be made accordingly.

[0019] In another advantageous embodiment of the invention, during the transfer in step ii), the carrier substrate contacts and / or applies pressure to the component provided on the sender substrate, thereby maintaining the component in a specific position between the sender substrate and the carrier substrate. In this way, slippage can be prevented, especially when the component is not or is no longer fixed to the sender substrate, and the corresponding position can be maintained when the component is fixed and / or released. Furthermore, this contact between the component and the carrier substrate makes it possible, for example, to perform a bonding process to the carrier substrate.

[0020] In another advantageous embodiment of the invention, during the transfer in step iii), the component arranged on the carrier substrate is brought into contact with and / or exerts pressure on the receiving substrate, thereby maintaining the component between the carrier substrate and the receiving substrate. In this way, slippage of the component can be prevented, especially when the component is not or is no longer fastened to the carrier substrate, and the corresponding position can be maintained during fastening and / or release of the component. Furthermore, this contact between the component and the receiving substrate makes it possible, for example, to perform a bonding process to the receiving substrate.

[0021] In another advantageous embodiment of the invention, a release layer and / or adhesive layer is applied to the sender substrate and / or the carrier substrate and / or the receiver substrate and / or the component, and the release layer and / or adhesive layer is intended to change its adhesive properties to the component in the adhesive region, particularly by the action of a release means and / or a bonding means. The release layer and adhesive layer are particularly sensitive to the bonding means and / or the release means. Thus, for example, a component fixed on the release layer can be released by a release means, particularly a laser, by melting the release layer with the laser, thereby making it possible to peel off the component. The component can remain attached or be fixed to the adhesive layer by the action of a bonding means, particularly a laser. Thus, in combination with a radiation-transparent substrate or corresponding holes in the substrate, individual components can be advantageously selectively fixed and / or released.

[0022] In another preferred embodiment of the invention, the sender substrate and / or the carrier substrate and / or the receiver substrate are designed to be transparent to laser radiation. This allows the introduction of laser radiation, preferably from the side of each substrate facing away from the components. For example, the sender substrate can be glass having a release layer on the side facing the components. This release layer secures the components to the sender substrate. The laser radiation then melts the release layer, or reduces its adhesive properties in the adhesive regions of the components, thereby enabling the components to be peeled off. This process can also be applied mutatis mutandis to the carrier substrate and the receiver substrate. This process is also possible in the case of an adhesive layer, whereby adhesive properties are increased or the components are temporarily or permanently bonded. The substrate can, for example, have holes, which allows the introduction of laser radiation advantageously without requiring the substrate to be transparent to laser radiation.

[0023] In another advantageous embodiment of the invention, the carrier substrate has fastening elements that are intended to fasten the components during transfer, particularly by surface adhesion. In such a case, the fastening elements contact and / or apply pressure to the components provided on the sending substrate. This fastens the components to the carrier substrate or to the fastening elements of the carrier substrate. The fastening elements may be individually controllably actuated, which allows for selective takeover of the fastening elements themselves. In such a case, only the components to be transferred are fastened to the fastening elements. Alternatively, it is conceivable that all components are first fastened to the carrier substrate, and then, during transfer to the receiving substrate, only the components to be transferred or selected components are transferred to the receiving substrate by the controllably actuated fastening elements. In this way, the selection during transfer can be carried out advantageously and while protecting the components.

[0024] In another advantageous embodiment of the invention, the fastening elements are made of a polymer material and / or have a suction cup-like shape. The fastening elements are preferably made of plastic and are regularly arranged on the side of the carrier substrate facing the components. In particular, the carrier substrate has a suitable fastening element for each component. The fastening elements are preferably elastic, which allows them to compensate for slight height differences between the components, especially during fastening. It is also conceivable that a flexible and elastic carrier substrate can assist or enable the compensation of height differences. Furthermore, a suction cup-like shape is advantageous because it creates a surface adhesion effect that allows the components to be fastened without additional support means.

[0025] In another advantageous embodiment of the invention, the carrier substrate is deformed during transport, particularly by mechanical and / or pneumatic means, so that components are debonded from and / or secured by the securing elements in a spatially and / or temporally offset manner. In such a case, the carrier substrate is preferably arranged or attached in a transfer mold. This deformation, particularly a concave or convex curvature, allows the time or location of contact of the components with the carrier substrate or the securing elements to be adjusted during transport. Furthermore, the deformation of the carrier substrate advantageously allows the contact of the components secured to the carrier substrate with the receiving substrate and / or other components arranged thereon to be adjusted. Advantageously, the release of the components after transfer to the receiving substrate can also be adjusted. In this sense, the carrier substrate can also be understood as a bonding and / or peeling means. It is also conceivable that the sending substrate and / or the receiving substrate are configured to be deformable in a controlled manner.

[0026] In another advantageous embodiment of the invention, the carrier substrate is intended to be a particularly elastic film. If the carrier substrate is configured as an elastic film, it is possible to carry out particularly gentle contact or pressure application to the component. Furthermore, in such cases, the film is more easily deformable. Preferably, the film is arranged in a transfer mold, which allows the film to be deformed in a controlled manner, particularly by mechanical and / or pneumatic means.

[0027] In another advantageous embodiment of the invention, it is provided that the light-emitting diode is formed from several components arranged one above the other and / or arranged adjacent to one another, in particular provided by different sender substrates. Thus, several different components can be transferred onto a receiver substrate and / or onto other components arranged on the receiver substrate. This allows for a more flexible design of the manufacturing process, in particular if only identical electronic components with the same function are produced or provided on each sender substrate.

[0028] In another advantageous embodiment of the invention, it is provided that the positions of the components are stored in an electronic data processing unit (EDP). The EDP can thus determine which components are to be transferred and in what order. It is also conceivable that the EDP takes into account the current arrangement of already transferred components on the receiving substrate. Furthermore, the EDP can analyze the positions of the components and, based on this, control the actuation of the bonding or peeling means so that the fixing or defixing of individual components is more efficient. In particular, the bonding or peeling means can act simultaneously on several adjacent components. However, in principle, it remains possible to influence individual components.

[0029] The present invention describes in particular a method for transferring functional components, in particular selectively, from a sender substrate to a receiver substrate, where the transfer is carried out by means of a carrier substrate. Components are in particular microchips, memory modules, LEDs, MEMS, etc. Components that only become functional in their original state when oriented, arranged, or stacked next to one another are also conceivable. In the broadest sense, components are understood to mean parts smaller than the substrates described in the disclosed documents, in particular the sender substrate, carrier substrate, and receiver substrate. In particular, components may simply be layers of a particular material, in particular oxide or nitride layers.

[0030] In another advantageous embodiment of the present invention, it is intended that only functional, undamaged components are transferred to the receiving substrate. In this context, functional, undamaged components are components that pass an electrical test and are therefore functional. Therefore, selective transfer can ensure that only functional components are transferred from the sending substrate to the receiving substrate. In this way, in particular, the number of defectively produced products can be reduced, leading to more efficient production.

[0031] In another advantageous embodiment of the invention, the joining and / or debonding means is a laser. The laser radiation emitted by the laser can act on the substrate or component over a large area and / or in a very spot-like manner. This allows the adhesion properties of the surface, particularly of a partial region of the substrate surface where the component is or will be fixed or placed, to be changed by the laser radiation. Since lasers can act in a very position-specific manner, they are particularly advantageous for fastening or de-fastening individual components. Furthermore, the introduction of laser radiation can be carried out quickly, especially by multiple lasers. It is also conceivable that several adjacent components that have passed inspection can be fastened together or simultaneously de-fastened, especially by a laser that acts in an area-like manner. In this way, the transfer can be carried out more quickly and efficiently. When a laser is used, the substrate can be made transparent to the laser radiation. Materials transparent to laser radiation as well as holes in the substrate are conceivable. The laser radiation can also be introduced laterally from the component, especially onto the substrate. In principle, however, other physically and / or chemically and / or mechanically acting bonding and debonding means can also be used. The laser radiation of the laser used as the bonding and / or debonding means has a wavelength in the wavelength range of 10 nm to 100 μm, preferably 100 nm to 50 μm, and most preferably 200 nm to 6 μm. It is not possible to specify a preferred wavelength more precisely, since the bonding and debonding means generally also need to be adapted to the corresponding bonding area. When a laser is used as the bonding and / or debonding means, the wavelength and / or intensity used are particularly related to the type of bonding area used.

[0032] The components can be selectively transported. The same technique is preferably used for bonding and debonding the components.

[0033] Components Thus, the components may be, for example, the following objects: 1. Layers, especially 1.1 Oxide layer 1.2 Nitride layer 1.3 Metal layers, especially 1.3.1 Metal layer consisting of Cu, Ag, Au, Al, Fe, Ni, Co, Pt, W, Cr, Pb, Ti, Ta, Zn, Sn 1.4 Semiconductor layers, especially 1.4.1 Semiconductor layer consisting of Ge, Si, α-Sn, fullerene, B, Se, and Te 1.5 Compound semiconductor layers, especially 1.5.1 Compound semiconductor layers consisting of GaAs, GaN, InP, InxGal-xN, InSb, InAs, GaSb, AlN, InN, GaP, BeTe, ZnO, CuInGaSe2, ZnS, ZnSe, ZnTe, CdS, CdSe, CdTe, Hg(1-x)Cd(x)Te, BeSe, HgS, AlxGal-xAs, GaS, GaSe, GaTe, InS, InSe, InTe, CuInSe2, CuInS2, CuInGaS2, SiC, SiGe 1.6 Glass, especially 1.6.1 Sapphire glass 2. Functional components 2.1 Mechanical components, especially 2.1.1 MEMS 2.2 Electronic components, especially 2.2.1 LED 2.2.2 Chips, especially 2.2.2.1 Microchips 2.2.2.2 Memory Chips

[0034] The thickness of the component is 0 μm to 1000 μm, preferably 0 μm to 800 μm, more preferably 0 μm to 500 μm, extremely preferably 0 μm to 250 μm, and most preferably 0 μm to 100 μm. Due to miniaturization, component thicknesses will likely become thinner than 10 μm in the future.

[0035] Bonding and Peeling Means An essential feature of the present invention is that bonding means and peeling means, collectively referred to as means in the following text, are used to bond components to or peel components from a substrate. These means can generally act over the entire area of ​​the substrate or in a highly position-specific manner. A means acting over a large area is, for example, electromagnetic radiation, especially thermal radiation, from a surface radiator. The surface radiator preferably has an emission area at least as large as the area of ​​the substrate. By applying such electromagnetic radiation acting over a large area to one side of the substrate, it is possible to apply heat to one side of the substrate. It is also conceivable to use a laser, broadened by an optical system and capable of acting over a large area on the surface to be affected.

[0036] It is also conceivable that the chamber in which the substrate is placed could be heated to a certain temperature, but in such a case the substrate would be heated on both sides.

[0037] The temperature used should, of course, be in a range that does not damage the components and / or the substrate. Therefore, it is preferable that such a temperature be as low as possible. The temperature at which the effect of the present invention is obtained is below 1000°C, preferably below 500°C, more preferably below 250°C, very preferably below 100°C, and most preferably below 50°C.

[0038] In a particularly preferred embodiment, the means are in particular movable, locally acting electromagnetic emitters, in particular lasers. The relative movement between the surface to be irradiated and the laser allows locally targeted and adjustable bonding and / or debonding. Preferably, the means themselves are stationary, whereas the substrate holder, on which one or more substrates are fixed, moves.

[0039] Sending side board The substrate carrying the components is referred to as the source substrate, which is the substrate that is present at the start of the transfer process and provides the components to be transferred to the receiving substrate.

[0040] In one embodiment, the components may be manufactured on or from the source substrate, in particular if the components are simply layers, which may be produced directly on the source substrate by special physical and / or chemical processes and possibly structured by further process steps.

[0041] In another embodiment, the components are manufactured elsewhere and positioned on the sender substrate, so that they are received by the carrier substrate in the subsequent transfer process. Here, the components are preferably connected to the sender substrate via an attachment mechanism. The sender substrate is preferably constructed so that the attachment mechanism, which secures the components to the sender substrate, can be weakened from the underside of the sender substrate. The attachment mechanism is weakened, preferably by a laser. By weakening the attachment mechanism, the components can be easily removed from the sender substrate after being bonded to the carrier substrate in the subsequent transfer process onto the carrier substrate. Weakening the attachment mechanism and subsequent removal of the components is also referred to as peeling. In particular, the peeling process can be performed selectively. It is therefore conceivable that only components that are functional and have passed previous, particularly electrical, tests are peeled off from the sender substrate. This prevents damaged components from being transported.

[0042] It is also conceivable that the component is simply placed on the sending substrate, and no special fixing mechanism acts between the sending substrate and the component.

[0043] In a particularly preferred embodiment, the source substrate is a glass substrate.

[0044] In another embodiment, the source substrate is a wafer, particularly a silicon wafer.

[0045] In another embodiment, the feed substrate is a film, which is preferably stretched over a frame to secure and stabilize the film, although it is also contemplated that equipment with a continuous film may be used to carry out this process.

[0046] In a very general embodiment, the sender substrate may be any kind of, particularly flat, surface from which components can be removed. For example, one might consider the surface of a kind of table, the surface of a machine or the surface of a granite slab. The term "send substrate" should therefore be interpreted in a very broad sense, in contrast to the other two mentioned substrate types, namely, the carrier substrate and the receiver substrate.

[0047] Carrying board A transfer substrate is used to transport components from a sending substrate to a receiving substrate.

[0048] In a particularly preferred embodiment, the carrier substrate is a film, which is preferably stretched over a frame to fix and stabilize it. However, it is also conceivable to use a device with a continuous film to carry out this process. Films have the advantage that they are elastic and flexible, making it particularly easy to bring the component into contact with the underlying surface, even when there is a height difference of a few micrometers or nanometers.

[0049] In a less preferred embodiment, the carrier substrate is made of glass.

[0050] In a highly less preferred embodiment, the carrier substrate is a wafer, particularly a silicon wafer.

[0051] In one embodiment, the carrier substrate is a substrate comprising a plurality of fastening elements.

[0052] The fixing element functions to hold the component in a fixed position. 1. Mechanical fixtures, especially Clamp 2. Vacuum fixtures, especially 2.1. Individually controllable vacuum tracks 2.2. Interconnected vacuum tracks A vacuum fixture having 3. Electrical fixtures, especially 3.1. Electrostatic fasteners 4. Magnetic fixture 5. Fixation by adhesion, especially 6. Gel pack fixture 7. Fixtures with adhesive, especially controllably actuated, surfaces These fixing elements can in particular be electronically controllable. The vacuum fixing device preferably consists of a number of vacuum tracks that appear on the surface of the carrier substrate. These vacuum tracks are preferably individually controllable.

[0053] The fixing elements have a size approximately equal to the size of the component to be transferred and are preferably symmetrically attached to the surface of the carrier substrate. The fixing elements are preferably constructed in the form of suction cups. This type of carrier substrate is used in conjunction with the transfer type described in detail in the present disclosure.

[0054] Receiving board A receiving substrate is understood to mean in particular a product substrate onto which all components of a plurality of carrier substrates and / or all components of a single carrier substrate that is used repeatedly are fixed.

[0055] Multiple components can be transported from different sender substrates to the same receiver substrate via one or more carrier substrates. This allows for a particularly efficient and particularly diverse transfer of components. Multiple components with different functions can be bonded onto the same receiver substrate from multiple sender substrates or multiple carrier substrate sources. In this case, transport or transfer to the receiver substrate also means that these components can follow components already located on the receiver substrate, in particular components bonded to the receiver substrate.

[0056] The disclosed substrates can be coated with different coatings. In particular, the layers are functional layers, the adhesion properties of which can be changed by external influences. This allows components to be transferred from one substrate to another. The intention here is to exert influences locally, i.e., on individual components. This feature is a crucial difference from prior art techniques, in which heat is used to bring about changes in adhesion properties, in particular to exert influences over a large area across the entire wafer.

[0057] Joint Type Preferably, at least one of the following types of joining is used to join the component to the support via the fastening area: Bonding by adhesion, ·Metal-metal bonding, ·Eutectic bonding, Anodic bonding or Fusion joining

[0058] These individually listed junction types are then described in more detail with respect to their mode of function.

[0059] In the case of adhesive bonding, it is conceivable that the joining means, in particular a laser, at least improves the adhesive properties of the adhesive used. For example, it is conceivable that the mixing of the two components of the adhesive is achieved by the introduction of heat, and that the adhesive properties only arise as a result of this mixing. In another embodiment, the joining means for adhesive bonding is a cooling device, which acts in a particularly localized manner and reduces the temperature. It is conceivable that the adhesive has molecular side chains that are crucial for the adhesive properties. Cooling can reduce heat transfer, and the molecular chains are aligned more significantly parallel, in particular by self-assembly, which results in improved adhesive properties.

[0060] In the case of metal-metal joining, the joining principle is that two metals, in particular fully miscible metals, are brought into contact with one another and heated by the action of a joining means, in particular a laser, to the extent that they bond to one another by compression and / or diffusion. Since the joints formed in this way are often difficult to separate, especially when intermetallic phases are formed, they should be used primarily as final joints, i.e. for joining components with surfaces that do not need to be further separated.

[0061] In eutectic bonding, the bonding principle is that at least two metals capable of forming a eutectic are heated above their eutectic temperature. Preferably, a metal combination with the lowest possible eutectic temperature is used. This results in only a small temperature increase being required. The advantage of such eutectic alloys is that the eutectic mixture can be melted at any frequency. Therefore, in contrast to metal-metal bonding, which has a relatively high melting point, eutectic bonding is also suitable for debonding processes. However, the disadvantage is that the debonding process must be performed at temperatures above the eutectic temperature, which creates a significant amount of melt that can contaminate parts of the substrate.

[0062] In anodic bonding, the migration of ions is promoted by applying an electric field. Anodic bonding is mainly used for glass substrates. This bonding process will not be described in further detail. This bonding process is known to those skilled in the art.

[0063] One of the most important joining methods for the method of the present invention is fusion bonding. In fusion bonding, the surfaces to be bonded, particularly cleaned and plasma-treated, are brought into direct contact with each other, especially at room temperature. This forms a pre-bond. The pre-bond is preferably transformed into a permanent bond by increasing the temperature. This mechanism is also well known to those skilled in the art. Fusion bonding is preferred for the method of the present invention, especially because the pre-bond between the component surface and the carrier substrate is a fast and efficient way to temporarily fix the component to the carrier substrate in an easily releasable manner. In such cases, the carrier substrate must, of course, be suitable for fusion bonding or pre-bonding. A further advantage is that fusion bonding is required in the semiconductor industry to bond multiple components directly to each other, preferably via so-called hybrid bonding. Such a particularly preferred embodiment is described in more detail in this document.

[0064] A bonding method must be selected that allows the component to be sufficiently well fixed to the carrier substrate during transfer from the sending substrate to the receiving substrate, but the bond formed must also be sufficiently easily removable by the removing means during transfer of the component from the carrier substrate to the receiving substrate. Therefore, the correct combination of the type of bond and the bonding or removing means is important, particularly to ensure smooth and error-free transfer of the component.

[0065] The carrier substrate is particularly preferably a film or rigid substrate having an adhesive layer. In such cases, the adhesive of the adhesive layer may be self-adhesive, i.e., it does not need to be activated by the bonding means of the present invention, e.g., adhesive. However, it is advantageous if the adhesive strength of the adhesive layer is at least improved by the action of a suitable bonding means.

[0066] In certain embodiments, a multilayer system is used to bond a component to a support. For example, a layer system consisting of a release layer and an adhesive layer can be combined. The release layer can also be called a reactive layer, since the action of the release means causes a reaction that reduces the adhesion between the support and the component, thereby enabling the component to be peeled off from the support. The release layer and the adhesive layer can be applied in any order, but preferably the release layer is applied to the support. WO 2017 / 076682, for example, discloses a multilayer system in which the release layer is applied to the product substrate rather than to the support substrate. In the present disclosure, the use of such multilayer systems is summarized under the more general concept of an adhesive region.

[0067] The layer system can be applied over a large area to one of a plurality of substrates and / or a component. From a technical standpoint, it is relatively easy to apply a layer system over a large area to a substrate, since known coating techniques such as centrifugal coating and / or spray coating can be used. Although it is possible to apply such a layer system partially to a substrate, this is less preferable in terms of cost. Of course, it is conceivable to apply a layer system over a large area with subsequent structuring. When a layer system is to be applied to a component, this layer system preferably completely covers the surface of the component.

[0068] Transportation Process In a first process step of the first exemplary method of the present invention, a component is fabricated or placed on a sender substrate. The component can be provided on the sender substrate or can be manufactured directly on the sender substrate. The component is coupled to the sender substrate surface, particularly via its first component surface, so that the component can be easily peeled off from the sender substrate surface, particularly in a controlled and targeted manner. If no coupling occurs between the sender substrate and the component, for example because the component is simply placed on the sender substrate, the component is more easily removed from the sender substrate.

[0069] In an optional second step of the first process, each individual component can be inspected for its functionality. The positions of defective or non-standard components can be stored by a computer program to prevent further component transport processes. In particular, such a process step can be performed individually for each component already before the first process step. However, it may be technically advantageous to first locate the components and then quickly inspect them using an automated measuring probe.

[0070] In the third process step of the first process, the transfer substrate is aligned with the sender substrate. This alignment is performed mechanically and / or optically. Preferably, the alignment is performed using alignment marks provided on the sender substrate and the transfer substrate. Preferably, an optical alignment system is used for alignment.

[0071] In the fourth process step of the first process, a component surface of a second process on the sending substrate, particularly one located opposite the first component surface, is brought into contact with the carrier substrate surface or at least brought close to the carrier substrate surface so that the component can be transferred from the sending substrate to the carrier substrate. In particular, it may be necessary for the carrier substrate and / or the sending substrate to be locally deformed to such an extent that the second component surface comes into contact with the carrier substrate surface. If the carrier substrate is a film, this step is particularly easy to carry out, since films are very easily deformable locally. For example, deformation by a small mold from the backside of the film would be conceivable. This mold is particularly combined with a laser or a laser component.

[0072] In a fifth process step of the first process, a bond is formed between the second component surface of the component on the sender substrate and the surface of the carrier substrate. This bond is preferably a temporary bond. In particularly preferred embodiments, the bond between the second component surface of each individual component and the surface of the carrier substrate is formed individually, i.e., selectively. Thus, in such a process step, a decision can already be made as to which component is to be transferred. In particularly preferred embodiments, this bond is formed using a laser. Various techniques for forming the bond are described in detail elsewhere in the open literature.

[0073] In a sixth process step of the first process, a release occurs between a first component surface of a component on a source substrate and a source substrate surface.

[0074] It would also be conceivable for process steps 5 and 6 to be interchanged, i.e., the peeling process between the first component surfaces of the components on the sender substrate would be carried out first, and only then would the bonding process between the second component surface of the components and the carrier substrate be carried out. This exchange of process steps is made possible by forces acting on the components, particularly on both sides, that hold them in place. However, when exchanging process steps, there is a risk of the components slipping. It would also be conceivable for the bonding and peeling processes to be carried out simultaneously.

[0075] In another embodiment, it would be envisioned that the bonding and debonding processes could occur simultaneously.

[0076] In the seventh process step of the first process, the previously mounted carrier substrate and the receiving substrate are aligned. This alignment is performed mechanically and / or optically. Preferably, the alignment is performed by alignment marks provided on the carrier substrate and the receiving substrate. Preferably, an optical alignment system is used for alignment.

[0077] In the eighth process step of the first process, a first component surface of a component on the carrier substrate is brought into contact with a receiving substrate surface or a second surface of another component already mounted on the receiving substrate. In particular, it may be necessary to locally deform the carrier substrate and / or the receiving substrate to such an extent that the first component surface contacts the receiving substrate surface or the surface of a previously fixed component. All advantages and disadvantages of deformation have already been described in the fourth step when the component is received on the carrier substrate and may apply mutatis mutandis to the eighth step accordingly.

[0078] In the ninth process step, a peeling and bonding process is again performed. This time, the peeling process is performed between the component on the carrier substrate and the carrier substrate, and the component is particularly simultaneously bonded to the surface of the receiving substrate or to the second surface of another component already mounted on the receiving substrate. The bonding or peeling process to be applied here is described in the present disclosure and can be selected depending on the required situation. In particular, when multiple components are stacked one on top of the other, these components are fusion-bonded, preferably hybrid-bonded, as long as they have hybrid surfaces. The hybrid bonding advantageously forms the necessary conductive connection between the components.

[0079] In a second exemplary transfer process of the present invention, the transfer substrate has individual fixing elements, which can fix components by surface adhesion. These fixing elements are preferably highly elastic, flexible, and flexible objects, preferably made of polymeric materials. The fixing elements can clearly be considered as a type of suction cup. When using such supports, completely different bonding and peeling means are used.

[0080] In such a case, joining means is understood to mean contact of the fastening element with the component on the sender substrate, in particular combined with the application of force, which may be carried out by a pressure element, for example a roller.

[0081] The applied force is in the range of 0 MPa to 1000 MPa, preferably 0 MPa to 750 MPa, more preferably 0 MPa to 500 MPa, extremely preferably 0 MPa to 250 MPa, and most preferably 0 MPa to 100 MPa.

[0082] It is also conceivable to increase the pressure in the chamber in which the fixing element is in contact with the component, which will cause the fixing element to be pressed more firmly against the component.

[0083] In such a case, a peeling means is understood to mean, inter alia, a bending of the carrier substrate in such a way that the fastening elements gradually peel off from the component, in particular from the outside to the inside, after the component has been fastened, in particular permanently bonded, to the receiving substrate. Such a bonding step can, for example, very well be carried out using the bonding means of the first process, for example using a laser.

[0084] In a second exemplary method of the present invention, a transfer mold is used that has a carrier substrate with a plurality of fastening elements on its underside. This process differs, inter alia, in that the transfer mold is constructed somewhat more complexly than a simple carrier substrate. In addition to the carrier substrate, it preferably also has additional control means that can affect and, in particular, control the bending of the carrier substrate. Furthermore, this carrier substrate has fastening elements that are not present in the carrier substrate described above. It is also conceivable to use a carrier substrate with fastening elements that does not have a mold behind it. However, in this case, the bending for bonding and debonding must be performed by other mechanical and / or pneumatic and / or hydraulic means, which should be considered independently of the carrier substrate. The second process will now be described in detail.

[0085] In the first process step of the second process, components are fabricated or placed on a sender substrate. The components can be mounted on the sender substrate or can be manufactured directly on the sender substrate. The components must be bonded to the sender substrate surface via their first component surface so that they can be easily peeled off from the sender substrate surface in a particularly controlled and targeted manner. If there is no bond between the sender substrate and the components, for example because the components are simply placed on the sender substrate, the components are more easily removed from the sender substrate. However, this can disadvantageously lead to slippage of the components in such cases. This slippage occurs before and / or during their contact with the carrier substrate in another process step.

[0086] In an optional second step of the second process, each individual component can be inspected for its functionality. The positions of defective or non-standard components can be stored by a computer program to prevent further component transport processes. In particular, such a step can be performed individually for each component already before the first step. However, it may be technically advantageous to first locate the components and then quickly inspect them using an automated measuring probe.

[0087] In the third process step of the second process, the sender substrate is aligned with the carrier substrate. The carrier substrate is preferably part of a transfer mold, but can also be used independently. In contrast to the carrier substrate of the first process, the carrier substrate has multiple fixing elements. This alignment is performed mechanically and / or optically. The alignment is preferably performed by alignment marks provided on the sender substrate and the carrier substrate. Preferably, an optical alignment system is used for alignment. The carrier substrate is positioned so that the fixing elements of the carrier substrate are located above the components to be transferred. This aspect differs from the first process.

[0088] In the fourth process step of the second process, the second component surface of the component on the sender substrate is brought into contact with the fixing element surface of the fixing element. In particular, it may be necessary to locally deform the carrier substrate and / or the sender substrate to the extent that the second component surface comes into contact with the fixing element surface. This step is particularly easy to perform if the carrier substrate is a film, since the film is very easily deformable locally. However, combining a fixing element with a film is technically disadvantageous because the film may have excessively low stability relative to the fixing element. Therefore, the fixing element is preferably manufactured or fixed on a carrier substrate that has the required stability, in particular a certain degree of rigidity. Since the fixing element is preferably a polymer fixing element, in particular a suction cup-like fixing element, it is conceivable to deform the carrier substrate by generating excess pressure. If the component is to be transferred from the sender substrate to the carrier substrate in a vacuum, it is conceivable to use mechanical auxiliary means, in particular rollers, to apply the pressure. However, in a particularly simple embodiment, the carrier substrate is simply moved in the direction of the sender substrate by the following amount: That is, the movement is such that sufficient pressure is created to cause complete contact between the securing element and the component.

[0089] In the fifth process step of the second process, bonding occurs between the second component surface of the component on the sender substrate and the surface of the carrier substrate. This bonding is preferably temporary. In a particularly preferred embodiment, bonding between the second component surface of each individual component and the surface of the carrier substrate occurs individually, i.e., selectively. Thus, in this process step, a decision can already be made as to which component is to be transferred. However, since fastening elements are used in the second process, selective selection of the component to be transferred can only be achieved if the fastening elements themselves are switchable or adjustable. Switchable adhesive fastening elements, whose adhesive properties can be changed by an electric current, are conceivable. If the fastening elements are shaped like suction cups, it is conceivable to cause the selective bonding process by the application of a desired local force. However, for this, the means for applying the force from the backside must itself be capable of locally and selectively acting, i.e., have a limited diameter. For example, the use of pins is conceivable. In particular, if a transfer mold is used, such pins would likely have to be located inside the transfer mold. This would complicate the design of the transfer mold accordingly. However, it would be conceivable to provide a small xy translation unit behind the transfer mold surface that could move the pin in the z direction. If the transfer mold is omitted, the means for applying the force would have to be part of the system in which the component transfer takes place.

[0090] In a sixth process step of the second process, a release occurs between the first component surface of the component on the sender substrate and the sender substrate surface.

[0091] It is also conceivable that process steps 5 and 6 are interchanged, i.e., the peeling process between the first component surface of the component on the sender substrate is carried out first, and only afterwards the bonding process between the second component surface of the component and the carrier substrate. This interchange between process steps is made possible by forces acting on the component, in particular on both sides, which hold the component in place. However, when exchanging process steps, there is a risk of the component slipping.

[0092] In another embodiment, it would be envisioned that the bonding and debonding processes could occur simultaneously.

[0093] In the seventh process step of the second process, the previously mounted carrier substrate and the receiving substrate are aligned. This alignment is performed mechanically and / or optically. Preferably, the alignment is performed by alignment marks provided on the carrier substrate and the receiving substrate. Preferably, an optical alignment system is used for alignment.

[0094] In an eighth process step of the second process, a first component surface of a component on the carrier substrate is brought into contact with a surface of the receiving substrate or with a second surface of another component already mounted on the receiving substrate. In particular, it may be necessary to locally or globally deform the carrier substrate and / or the receiving substrate to the extent that the first component surface contacts the receiving substrate surface. In particular, global bending of the carrier substrate by a pressing device arranged behind the carrier substrate is conceivable.

[0095] The ninth process step includes, among other things, the release of the component from the fixing element of the carrier substrate, which corresponds to a release step. The bonding step between the component and the surface of the receiving substrate or the second surface of another component already mounted on the receiving substrate is again carried out in the same manner as already mentioned in this disclosure. This is again a fusion bond, preferably a hybrid bond.

[0096] All advantages and disadvantages of this variant have already been explained in the fourth step when the components are received on the carrier substrate and can be applied mutatis mutandis to the eighth step accordingly.

[0097] The difference between the first and second process is, inter alia, that in the second process, a fixing element is used as an important technical component.

[0098] The positioning or placement of the components is an important issue. In a special development of the invention, the position of each component is determined by the self-assembly process itself. For this, the surface on which the components are to be positioned must be specially prepared.

[0099] One embodiment of self-assembly is to coat the surface with an anti-adhesion layer (ASL, anti-sticking layer), which covers only those areas of the surface where components should not be positioned. Such areas are hereinafter referred to as ASL areas. Areas of the surface where components should be positioned should not be covered by the anti-adhesion layer and therefore have a relatively high adhesion, particularly to the anti-adhesion layer. Such areas are hereinafter referred to as adhesion areas. Here, when a component is positioned on an adhesion area, the component moves due to the adhesion gradient present in the adhesion area, so that positioning errors in the micrometer or nanometer range are automatically corrected. The adhesion area itself is preferably symmetrical, in particular at least rectangular. The more symmetric the adhesion area, the more efficient the self-assembly process.

[0100] In a further embodiment of the self-assembly, the area where the component is to be positioned is coated with a fluid. The remaining surrounding areas where the component is not to be positioned are left untreated. When the component is placed in one of these areas, the component is drawn into the center of the fluid by the occurring adhesion and energy minimization processes and is positioned symmetrically relative to the fluid by the self-assembly process. That is, if the fluid is deposited very precisely, especially with micrometer or nanometer accuracy, and the contact surface of the component to be positioned has the same shape as the fluid, the component is preferably positioned so that it is symmetrically stationary relative to the fluid. In other words, the component floats on the fluid. Of course, such self-assembly according to the present invention only makes sense if the fluid is allowed to exist permanently between the surface and the component, or at least until the component is further removed to another substrate.

[0101] multilayer LED In a particularly preferred embodiment, the method is used to make light emitting diodes (LEDs), preferably white light LEDs (wLEDs). wLEDs can be manufactured in a variety of ways.

[0102] There are several types of white light produced in the semiconductor industry. One approach is the use of phosphorescent layers, which are irradiated with excitation radiation and emit a broader light spectrum (WO 2013 / 041136).

[0103] Another approach to generating white light is to fabricate a wLED consisting of three individual LEDs, each of which emits light in a specific wavelength range, specifically the red (rLED), green (gLED), and blue (bLED) wavelength ranges. White light can be generated by mixing these three color components. Each of the three individual LEDs is generally produced by different materials and manufacturing processes. Each of the individual LEDs is considered a component that can be combined on a receiving substrate with the aid of a process to form a fully functional wLED.

[0104] In a first exemplary embodiment of the present invention, the wLED to be fabricated consists of three LEDs (rLED, gLED and bLED) arranged next to each other.

[0105] In a second preferred embodiment, the wLED to be fabricated consists of three LEDs (rLED, gLED, and bLED) stacked one on top of the other. To ensure that the light of the bottom LED and / or middle LED is not too strongly absorbed by the LED(s) located above it, the size of the LEDs may decrease continuously from bottom to top. In an improved second embodiment, the bottom LED is large-area, and the middle LED bonded onto it is annular, and the top LED is also annular and has a larger inner radius than the middle LED. The annular LED may be rectangular or circular in shape.

[0106] The LEDs are preferably stacked in a way that minimizes absorption by the LEDs above them. The correct order generally must be determined empirically, and is related, inter alia, to the materials of the individual LEDs.

[0107] Further advantages, features and details of the invention will become apparent from the following description of preferred embodiments, taken in conjunction with the drawings. [Brief explanation of the drawings]

[0108] [Figure 1a] FIG. 2 illustrates a first process step of an exemplary method of the present invention. [Figure 1b] FIG. 2 illustrates a second process step. [Figure 1c] FIG. 3 illustrates a third process step. [Figure 1d] FIG. 4 illustrates a fourth process step. [Figure 1e] FIG. 5 illustrates a fifth process step. [Figure 1f] FIG. 6 illustrates a sixth process step. [Figure 2] FIG. 1 shows a fully mounted receiving substrate of the present invention. [Figure 3a] FIG. 1 shows a carrier substrate with a transfer mold in a first position. [Figure 3b] FIG. 10 shows a transfer mold in a second position. [Figure 3c] FIG. 10 shows a transfer mold in a third position. [Figure 4] FIG. 1 shows a first white light diode (wLED) of the present invention. [Figure 5] FIG. 2 shows a second white light diode (wLED) of the present invention.

[0109] In the drawings, identical components or components with identical functions are designated by the same reference numerals.

[0110] The figures are not drawn to scale. In particular, the bonded areas 3 are shown very thick for better visibility. The exaggerated representation of the bonded areas 3 is due to the use of joining means 6 and peeling means 7, which create or break down the bonded areas 3, being an essential feature of the invention. If the bonded areas 3 are shown visible, bonding in particular occurs between the components that contact the bonded areas 3. If the bonded areas 3 are not shown, such bonding does not occur or occurs so little that it is technically negligible. The absence of a bonded area 3 at a particular location does not mean that a bonding agent, for example, an adhesive, may not be located at this location. This simply means that the bonding agent, in particular the adhesive, does not have any bonding effect, or at least has a negligible bonding effect, in particular because the bonding effect has been altered, in particular reduced or completely eliminated, by the peeling means 7.

[0111] FIG. 1a shows a first process step in which a sender substrate 1 is provided with a plurality of components 2. The components 2 are preferably already fixedly bonded to the sender substrate 1 via adhesive areas 3 in this process step, thereby preventing the components 2 from slipping. The fixed bond between the components 2 and the sender substrate 1 is formed by chemical and / or physical adhesive areas 3. The adhesive areas 3 can be, for example, adhesive glue acting as a bonding agent between the sender substrate 1 and the components 2. It is also conceivable that the adhesive areas are micrometer- or nanometer-sized areas where direct adhesive forces, in particular van der Waals forces, act between the surface of the sender substrate 1 and the components 2. It is also conceivable that the adhesive areas 3 are metal alloys, in particular solders. It is also conceivable that the adhesive areas 3 are adhesive films. In general, the adhesive areas 3 can refer to any chemical and / or physical action and / or material and / or object that can fix the components 2 to the sender substrate 1. In FIG. 1 , the adhesive region 3 is always shown only at the boundary between the component 2 and the sender substrate 1. However, it is also conceivable that the adhesive region 3 extends over the entire carrier substrate surface 1o. In particular, the adhesive region 3 is a layer deposited by a coating process, in particular a centrifugal coating process. It is also conceivable that the component 2 is a layer, in particular an oxide or nitride layer, that is initially deposited over a large area by a corresponding coating process and then correspondingly structured by other process steps. In such cases, the adhesive region 3 corresponds solely to the interface between the layer and the sender substrate 1. That is, in such cases, the layer is directly connected to the sender substrate 1. Naturally, it is also conceivable that the component 2 is simply a correspondingly deposited and structured layer system. The sender substrate 1 is shown exemplarily as a wafer in all figures, but in principle it can be any type of substrate, in particular a glass substrate or a film.

[0112] 1b shows a second process step in which the carrier substrate 4, in particular a film stretched on a frame 5, is positioned and fixed on the component 2 of the sender substrate 1. In particular, only slight pressure needs to be applied from the rear side of the carrier substrate 4. It is also conceivable that the frame 5 on which the carrier substrate 4, formed as a film, is stretched is moved towards the sender substrate 1 so that the carrier substrate 4 is preloaded and presses against the component 2. In particular, the carrier substrate 4 can be aligned relative to the sender substrate 1 before contact. This alignment is preferably carried out using alignment marks (not shown) and optical aids, in particular an alignment system (not shown).

[0113] FIG. 1c shows a third process step in which a joining step of the component 2 is performed using a joining means 6, in particular a laser, so that a bonded area 3 is formed between the component 2 and the carrier substrate 4 across the component surface 2o. A peeling step is performed using a peeling means 7, preferably also a laser, in particular simultaneously, more preferably with a small time and / or distance offset. Such a peeling step is preferably performed through the sender substrate 1. Peeling from the carrier substrate 4 side is also conceivable. However, in this case, the peeling means 7 for peeling must not interact with the bonded area 3 between the carrier substrate 4 and the component 2. In a particularly preferred embodiment, the joining and peeling steps are performed simultaneously. For example, the use of a laser is conceivable. This laser acts, on the one hand, as the joining means 6 to perform the joining step between the component 2 and the carrier substrate 4, and, on the other hand, as the peeling means 7 to perform the peeling step between the component 2 and the sender substrate 1. Correspondingly, the adhesive regions 3 must react differently to the photons of the laser 6 on different sides of the component 2. The diagram shows, by way of example, only four components 2 bonding or debonding processes (see also FIG. 1d in this regard), thereby demonstrating that the transfer process can already be performed selectively in such process steps. The reason for a selective transfer process would be that some of the components 2 are defective and therefore must not be transferred. Of course, all of the components 2 could also be transferred. In particular, initially, no defective components 2 should be present on the sender substrate 1. However, when components are manufactured on the sender substrate 1, some of the components 2 may become defective during the manufacturing process. In such cases, selective selection would be technically meaningful and necessary.

[0114] Figure 1d shows a fourth process step in which the transfer substrate 4 is positioned on, and in particular aligned with, the receiving substrate 8. The alignment is preferably performed using alignment marks (not shown) and an optical alignment system (not shown).

[0115] 1e shows a fifth process step in which, after the components 2 of the carrier substrate 4 have been brought into contact with the components 2 of the receiving substrate 8, a peeling means 7, in particular a laser, carries out a peeling process between the components 2 of the carrier substrate 4 and the carrier substrate 4, preferably through the rear surface of the carrier substrate 4. In particular, the formation of bonding areas 3 between the components 2 takes place simultaneously using the bonding means 6. In the figure, only the peeling process of three components 2 is shown by way of example to show that the carrier process can also be selectively carried out in such a process step.

[0116] In a highly preferred embodiment, the components 2 are only peeled off from the carrier substrate 4 by selectively acting peeling means 7. On the other hand, the joining means 6 is not a selective joining means but an all-around joining means. For example, heating of the surrounding area would be considered. This may be relevant in particular if the components 2 are to be permanently joined to one another by a metallurgical or fusion joining process.

[0117] 1f shows the sixth process step, in which the carrier substrate 4 with the only remaining component 2 is detached and removed. It can be seen that a total of three components 2 have been transferred. A bonding process using bonding means 6, as shown in FIG. 1e, may in particular be carried out for the first time in such a step. The carrier substrate 4 now still carries a component 2 which can be transferred, for example, to another receiving substrate 8.

[0118] Naturally, it is preferable that the same number of components 2 are always transferred from the sender substrate 1 to the receiver substrate 8. Generally, each component layer of components 2 is always first completely installed on the receiver substrate 8. Only afterwards can and should other components 2, which may in particular also have different functions, be built on other component layers.

[0119] 1a-1f therefore always show the transfer of multiple components 2 of only one component layer. The process steps of Figures 1a-1f can then be repeated any number of times to build up other component layers, generally any number of component layers.

[0120] The second process is not explicitly shown. It is characterized, inter alia, in that the transfer mold 11 shown and described in Figures 3a-3c is used to transport the component 2. The transfer mold 11 may be used together with other joining and peeling means for transporting the component 2. In particular, transporting the component 2 is facilitated by the fact that the fastening elements 10 of the carrier substrate 4' can fasten the component 2 without the need for a separate joining means. In this case, the component 2 is preferably peeled from the fastening elements 10 of the carrier substrate 4' by bending the carrier substrate 4' according to either Figure 3b or Figure 3c. However, here, the peeling process from the sender substrate 1 or the bonding process to the receiver substrate 8 can also be performed by the above-mentioned joining and / or peeling means (6, 7). That is, the bendable carrier substrate 4' and / or the entire transfer mold simultaneously represent the joining and / or peeling means (6, 7).

[0121] FIG. 2 shows a finished receiving substrate 8 on which a number of components, in particular a white light LED 9, have been produced by this method. The white light LED 9 here consists of three different components 2, 2', 2''. Each component 2, 2', 2'' is a specific monochromatic LED, i.e., a light-emitting diode for a very specific wavelength range. For example, component 2 is a red light LED (rLED), component 2' is a green light LED (gLED), and component 2'' is a blue light LED (bLED). Thus, by combining monochromatic LEDs, the white light LED 9 can be easily produced. Further embodiments of the white light LED 9 are described in the other figures and figure descriptions.

[0122] In the further figures, a special embodiment of a white light LED 9 is shown. By this process, such a white light LED 9 is manufactured. The different semiconductor regions of the diodes for the monochromatic LEDs 2, 2', 2'' are not shown, as are the contacts. The white light LED 9 is shown for the sole purpose of illustrating the embodiment.

[0123] 3a shows a transfer mold 11 in a first position. The transfer mold 11 consists of a carrier substrate 4' with a number of fixing elements 10. The fixing elements 10 fix corresponding components 2 (not shown) via their surfaces. The transfer mold 11 can have deformation elements 12 that can deform the carrier substrate 4'. The deformation elements 12 can in particular be pins that can be moved in the x, y and z directions inside the transfer mold 11 by means of a corresponding mechanism and thus locally bend the carrier substrate 4'. In such a case, the deformation elements 12 are represented as supply lines and can guide fluids, in particular gases or gas mixtures, into the chamber.

[0124] 3b shows the transfer mold 11 in a second position. The carrier substrate 4' is curved concavely by the deformation element 12. If the deformation element 12 is a supply line, this curvature is in particular achieved by evacuating the interior space.

[0125] 3c shows the transfer mold 11 in a second position. The carrier substrate 4' is bent convexly by the deformation element 12. If the deformation element 12 is a supply line, this bending is achieved in particular by creating an overpressure in the interior space.

[0126] FIG. 4 shows a first white-light LED 9 consisting of monochromatic LEDs 2, 2', and 2". The monochromatic LEDs 2' and 2" are fabricated here in an annular shape. The bottom LED 2 is formed with a large area. The annular openings of the LEDs 2' and 2" allow the lower LED or LEDs to emit photons. The white-light LED 9 can be easily fabricated by emitting photons in three wavelength ranges: red, green, and blue. In particular, this process can be used to stack the LEDs 2, 2', and 2". The annular shape of the monochromatic LEDs 2, 2', and 2" can be any shape, preferably rectangular, and more preferably circular.

[0127] FIG. 5 shows a second white light LED 9', where the individual LEDs 2, 2', 2'' differ in size and relative position. [Explanation of symbols]

[0128] 1 Sending side board 1o Sending side board surface 2,2',2'' components 3 Fixed area 4,4' Carrying board 5 frames 6 Joining means 7 Peeling means 8 Receiving board 9 LED 10 Fixed Elements 10o Fixed element surface 11 Fixed type 12 Deformation Elements

Claims

1. A method for transferring components (2, 2', 2'') from a sending substrate (1) to a receiving substrate (8), comprising the steps of: i) providing and / or fabricating said components (2, 2', 2'') on said source substrate (1), ii) transferring the components (2, 2', 2'') of the sending substrate (1) to a carrier substrate (4, 4'); iii) transferring said components (2, 2', 2'') from said carrier substrate (4, 4') to said receiving substrate (8); and, in particular in the above order, The components (2, 2', 2'') can be selectively transported using joining means (6) and / or peeling means (7), method.

2. 2. The method according to claim 1, wherein the individual components (2, 2', 2'') or the plurality of components (2, 2', 2'') are locally limited and fixed by the joining means (6), in particular by laser radiation, during the transfer in step ii) and / or step iii).

3. 3. The method according to at least claim 1 or 2, wherein an individual component (2, 2', 2'') or a plurality of components (2, 2', 2'') are locally limited and released by the peeling means (7) during the transfer in step ii) and / or step iii).

4. 4. The method according to at least one of claims 1 to 3, wherein for the selection, the components (2, 2', 2'') are tested at least once with respect to functionality, in particular by electrical testing.

5. 5. The method according to at least one of claims 1 to 4, wherein during the transfer in step ii) the carrier substrate (4, 4') contacts and / or applies pressure to the components (2, 2', 2'') provided on the sender substrate (1), thereby maintaining the components (2, 2', 2'') in a specific position between the sender substrate (1) and the carrier substrate (4, 4').

6. 6. The method according to at least one of claims 1 to 5, wherein during the transfer in step iii), the components (2, 2', 2'') arranged on the carrier substrate (4, 4') contact and / or apply pressure to the receiving substrate (8), thereby maintaining the components (2, 2', 2'') between the carrier substrate (4, 4') and the receiving substrate (8).

7. 7. The method according to at least one of claims 1 to 6, further comprising applying a release layer and / or an adhesive layer to the sender substrate (1) and / or the carrier substrate (4, 4') and / or the receiver substrate (8) and / or the component (2, 2', 2''), respectively, which release layer and / or adhesive layer changes its adhesive properties to the component (2, 2', 2'') in the adhesive region (3) in particular by the action of the release means (7) and / or the joining means (6).

8. 8. The method according to at least one of claims 1 to 7, wherein the sender substrate (1) and / or the carrier substrate (4, 4') and / or the receiver substrate (8) are made transparent to the laser radiation.

9. 9. The method according to at least one of claims 1 to 8, wherein the carrier substrate (4, 4') has fixing elements (10) that fix the components (2, 2', 2'') during the transfer, in particular by surface adhesion.

10. 10. The method according to at least one of the preceding claims, wherein the fastening element (10) is made of a polymer material and / or is suction cup-shaped.

11. 11. The method according to claim 10, wherein the carrier substrate (4, 4') is deformed during the transport, in particular by mechanical and / or pneumatic means, so that in particular the components (2, 2', 2'') are peeled off from and / or fixed by the fixing elements (10) with a spatial and / or temporal offset.

12. 12. The method according to at least one of claims 1 to 11, wherein the carrier substrate (4, 4') is a particularly elastic film.

13. 13. A device for transferring components (2, 2', 2'') according to the method of at least one of claims 1 to 12, comprising: the components (2, 2', 2'') can be fabricated and / or provided on a sender substrate (1), The components (2, 2', 2'') of the sending substrate (1) can be transferred to a carrying substrate (4, 4'), the components (2, 2', 2'') are transferable from the carrier substrate (4, 4') to a receiving substrate (8); the transfer of the components (2, 2', 2'') to the carrier substrate and / or to the receiving substrate can be selectively performed by bonding means (6) and / or peeling means (7), Device.

14. A light emitting diode (LED) (9) manufactured by the method of claims 1 to 12.

15. 15. The light-emitting diode (9) according to claim 14, wherein the light-emitting diode (9) is formed from a plurality of components (2, 2', 2'') arranged one above the other and / or a plurality of components (2, 2', 2'') arranged adjacent to one another, in particular provided by different sending substrates (1).

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