Holding device and holding method

Abstract

To provide a holding device and a holding method capable of preventing an occurrence of a holding failure in which a held object is bent.SOLUTION: A holding device EA1 includes: holding means 10 of holding objects WK1 and WK2 so as to contact an outer peripheral part of the holding objects WK1 and WK2 and form a space SP with the holding objects WK1 and WK2; and supply means 20 of supplying a gas to the space SP, and includes: acquisition means 30 of acquiring the thicknesses of the holding objects WK1 and WK2; and adjustment means 40 of adjusting a pressure in the space SP based on the thicknesses of the holding objects WK1 and WK2 acquired by the acquisition means 30.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a holding device and a holding method. [Background technology]

[0002] BACKGROUND ART A holding device for holding an object to be held is known (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-68858 Summary of the Invention [Problem to be solved by the invention]

[0004] In the suction table 1 (holding device) described in Patent Document 1, a fluid (gas) is supplied to the space formed between the suction table 1 and the semiconductor wafer 20 (held object) to balance the pressing force of the laminating roller 13. However, since the pressure in the space is not adjusted according to the thickness of the held object, which affects the bending rigidity of the processed object, there is a disadvantage in that the held object bends, resulting in poor holding performance.

[0005] An object of the present invention is to provide a holding device and a holding method that can prevent holding failures, such as bending of a held object. [Means for solving the problem]

[0006] The present invention employs the configurations set forth in the claims. [Effects of the Invention]

[0007] According to the present invention, the pressure in the space is adjusted based on the thickness of the object to be held, so that it is possible to prevent the held object from bending and causing poor holding. [Brief explanation of the drawings]

[0008] [Figure 1] 1A is an explanatory diagram of a processing apparatus according to one embodiment of the present invention, and FIGS. 1B to 1E are explanatory diagrams of processing apparatuses according to modified examples of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In this embodiment, the X-axis, Y-axis, and Z-axis are orthogonal to each other, and the X-axis and Y-axis are axes within a predetermined plane, and the Z-axis is an axis orthogonal to the predetermined plane. Furthermore, in this embodiment, when viewed from the front direction of Fig. 1(A) parallel to the Y-axis, "up" is the direction of the arrow of the Z-axis, "down" is the opposite direction, "left" is the direction of the arrow of the X-axis, "right" is the opposite direction, "front" is the direction toward the front of Fig. 1(A) parallel to the Y-axis, and "rear" is the opposite direction.

[0010] The holding device EA1 comprises a holding means 10 that performs a holding process in which the holding objects WK1, WK2 are abutted against the outer periphery of the holding objects WK1, WK2 and hold the holding objects WK1, WK2 so as to form a space SP between the holding objects WK1, WK2; a supply means 20 that performs a supply process in which the atmosphere or a gas or other gas is supplied to the space SP; an operation means 30 such as an operation panel or personal computer that serves as an acquisition means that performs an acquisition process in which the thickness of the holding objects WK1, WK2 is acquired; and an adjustment means 40 that performs an adjustment process in which the pressure in the space SP is adjusted based on the thickness of the holding objects WK1, WK2 acquired by the operation means 30. In this embodiment, the processing device EA comprises a holding device EA1 and a processing means 50 that performs a processing step of applying an adhesive sheet AS as a predetermined process to the holding objects WK1 and WK2 held by the holding device EA1, and is arranged near a moving means 60 that performs a moving step of moving the holding device EA1.

[0011] The holding means 10 includes a linear motor 11 as a driving device and a table 12 supported on an output shaft 11A of the linear motor 11. The table 12 has an annular holding portion 12B that abuts the outer periphery of the objects to be held WK1 and WK2 on a holding surface 12A that can be adsorbed and held by a pressure reducing means (not shown) such as a vacuum pump or vacuum ejector, and a recess 12C whose outer edge forms the holding portion 12B and forms a space SP between the objects to be held WK1 and WK2.

[0012] The supply means 20 includes a gas supply means 21 such as a pressure pump or a turbine that communicates with the space SP via pipes 22 and 23 connected to the adjustment means 40 .

[0013] The adjustment means 40 includes a pressure reducing valve 41 as a pressure adjustment valve, an exhaust means 42 such as a pressure reducing pump or vacuum ejector that is connected to the space SP via piping 42A, and a control means 43 such as a personal computer or sequencer that is electrically connected to the pressure reducing valve 41 and the exhaust means 42, and is configured to adjust the pressure in the space SP by changing the pressure of the gas supplied to the space SP.

[0014] The processing means 50 includes a feeding means 51 that feeds out the adhesive sheet AS, and a pressure roller 52 as a pressing means that presses the adhesive sheet AS onto the holding objects WK1 and WK2 to adhere it thereto. The unwinding means 51 comprises a base plate 51A that directly or indirectly supports the components that make up the unwinding means 51, a support roller 51B that supports the raw roll RS having an adhesive sheet AS temporarily attached to a strip-shaped release sheet RL, a guide roller 51C that guides the raw roll RS, a peeling plate 51D as a peeling means that folds the release sheet RL at the peeling edge 51E and peels the adhesive sheet AS from the release sheet RL, a drive roller 51H that is supported by an output shaft (not shown) of a rotary motor 51F as a drive device and pinches the release sheet RL between itself and a pinch roller 51G, and a recovery roller 51J that is supported by an output shaft (not shown) of the drive device and always applies a predetermined tension to the release sheet RL that is between itself and the pinch roller 51G while the processing device EA is operating automatically, and recovers the release sheet RL.

[0015] The moving means 60 includes a linear motor 61 as a driving device that supports the linear motor 11 with a slider 61A.

[0016] The operation of the processing device EA will now be described. First, a user of the processing device EA (hereinafter simply referred to as "user") sets a web RS on the processing device EA, with each component positioned in the initial position shown by the solid lines in Fig. 1, as shown in Fig. 1. Then, the user inputs the thickness of the object WK1 to be held via the operating means 30. The adjusting means 40 then adjusts the pressure reducing valve 41 based on the thickness of the object WK1 via the control means 43 so that the pressure in the space SP when processing the object WK1 becomes the desired pressure. Next, the user inputs a signal to start automatic operation via the operating means 30. The processing means 50 then drives the rotary motor 51F to unwind the web RS. As shown in Fig. 1(A), when the leading edge of the leading adhesive sheet AS in the unwinding direction is peeled off a predetermined length from the release sheet RL at the folded-back portion of the release sheet RL folded back by the peeling edge 51E of the peeling plate 51D, the driving of the rotary motor 51F is stopped.

[0017] Subsequently, when a user or a conveying means (not shown), such as an articulated robot or a belt conveyor, places the object WK1 on the holding surface 12A, the holding means 10 activates the pressure reducing means (not shown) to begin suction-holding the object WK1 on the holding surface 12A. Next, the supply means 20 activates the gas supply means 21 to supply a predetermined amount of gas to the space SP through the pressure reducing valve 41, which is adjusted based on the thickness of the object WK1, thereby achieving a desired pressure within the space SP. If the pressure within the space SP is too high or too low relative to the bending rigidity of the object WK1, the object WK1 may bend upward or downward. However, by maintaining the desired pressure within the space SP, the surface of the object WK1 becomes horizontal, preventing bending and resulting in a holding failure. The holding means 10 then activates the linear motor 11 to raise or lower the table 12 so that the distance from the top surface of the object WK1 to the lower end of the pressure roller 52 reaches a predetermined value.

[0018] Next, the moving means 60 drives the linear motor 61 to move the table 12 to the left, and when the holding object WK1 reaches a predetermined position, the processing means 50 drives the rotary motor 51F to unwind the raw web RS in accordance with the movement speed of the holding object WK1. As a result, the adhesive sheet AS is peeled off from the release sheet RL at the folded portion of the release sheet RL and is pressed onto the holding object WK1 by the pressure roller 52 and adhered to it, as shown by the two-dot chain line in FIG. 1(A). Here, since the desired pressure is maintained within the space SP, the surface of the holding object WK1 is horizontal, so the adhesive sheet AS will not be adhered to the holding object WK1 that has bent upward or downward due to excessive or insufficient pressure within the space SP, and processing defects caused by air bubbles getting in between the holding object WK1 and the adhesive sheet AS can be prevented. The entire leading adhesive sheet AS is then attached to the holding object WK1 to form a united object UP. When the leading edge of the next adhesive sheet AS following the leading adhesive sheet AS in the payout direction is peeled off a predetermined length from the release sheet RL at the folded-back portion of the release sheet RL, the processing means 50 stops driving the rotary motor 51F. Next, when the united object UP reaches a predetermined position to the left of the pressure roller 52, the moving means 60 stops driving the linear motor 61, and the adjusting means 40 drives the exhaust means 42 via the control means 43 to exhaust gas from the space SP. The holding means 10 then stops driving the pressure reducing means (not shown), releasing the suction and holding of the holding object WK1 on the holding surface 12A. Next, when the user or the transport means (not shown) transports the united object UP to the next process, the moving means 60 drives the linear motor 61 to return the table 12 to its initial position, and the same operations as above are repeated.

[0019] When applying an adhesive sheet AS to a holding object WK2 (see the two-dot chain line in FIG. 1(A)), which has a different thickness from that of the holding object WK1, the user inputs the thickness of the holding object WK2 via the operating means 30. The adjusting means 40 then adjusts the pressure reducing valve 41 via the control means 43 based on the thickness of the holding object WK2 so that the pressure in the space SP when processing the holding object WK2 becomes the desired pressure. For example, when applying an adhesive sheet AS to the holding object WK2, if the input thickness value increases from the previous value, the pressure reducing valve 41 is adjusted so that the pressure of the gas supplied to the space SP also increases. If the input thickness value decreases from the previous value, the pressure reducing valve 41 is adjusted so that the pressure of the gas supplied to the space SP also decreases. Thereafter, the user again inputs a signal to start automatic operation via the operating means 30, and the same operations as described above are repeated.

[0020] According to the above embodiment, the pressure in the space SP is adjusted based on the thickness of the objects to be held WK1 and WK2, thereby preventing poor holding performance in which the held objects WK1 and WK2 bend.

[0021] As described above, the best configurations, methods, and the like for implementing the present invention have been disclosed in the above description, but the present invention is not limited thereto. That is, although the present invention has been particularly illustrated and described mainly with reference to specific embodiments, those skilled in the art can make various modifications to the above-described embodiments in terms of shape, material, quantity, and other detailed configurations without departing from the scope of the technical idea and purpose of the present invention. Furthermore, the above-disclosed descriptions limiting the shape, material, and the like are provided as examples to facilitate understanding of the present invention and are not intended to limit the present invention. Therefore, descriptions using names of components that are free from some or all of the limitations on shape, material, and the like are included in the present invention. Furthermore, the means and steps of the present invention are not limited in any way as long as they can perform the operations, functions, or steps described for those means and steps, and are in no way limited to the components and steps of a single embodiment shown in the above embodiment. For example, the supply means may be anything that supplies gas to a space, and is not limited in any way as long as it is within the technical scope in light of the common general technical knowledge at the time of filing (the same applies to other means and steps).

[0022] The holding means 10 may be provided with a plurality of tables 12 having different volumes of the space SP depending on the size and height of the holding portions 12B, and these plurality of tables 12 may be used as adjustment members also as the adjustment means 40, and the pressure within the space SP may be adjusted by a user or a transport means (not shown) changing the tables 12 to change the volume of the space SP based on the thickness of the objects to be held WK1 and WK2, or the holding means 10 may be provided with a plurality of holding portions 12B having different sizes and heights that are provided separately from the table 12 and configured to be detachable from the table 12, and these plurality of holding portions 12B may be used as adjustment members also as the adjustment means 40, and the pressure within the space SP may be adjusted by a user or a transport means (not shown) changing the holding portions 12B to change the volume of the space SP based on the thickness of the objects to be held WK1 and WK2. The table 12 may have through holes on the bottom or sides that connect the space SP to the outside, and may be configured so that the pressure in the space SP can be released to the atmosphere through the through holes.In this case, the supply means 20 may supply gas to the space SP until the processing by the processing means 50 is completed.

[0023] The supply means 20 may also serve as the adjustment means 40, and the pressure in the space SP may be adjusted by the gas supply means 21 changing the pressure and flow rate of the gas supplied to the space SP.

[0024] The acquisition means may be a detection means such as a camera or sensor that detects the thickness of the holding objects WK1, WK2, or a reading means such as a code reader or RFID reader that reads a code such as a barcode or QR code (registered trademark) that encodes information such as the identification number or thickness of the holding objects WK1, WK2, or reads the information from an RFID (Radio Frequency Identification) that stores the information. When reading the identification numbers of the holding objects WK1, WK2, the reading means can acquire the thickness corresponding to the identification number from the correspondence between the identification numbers and thicknesses of the holding objects WK1, WK2.

[0025] The adjustment means 40 may adjust the pressure in the space SP by changing at least one of the pressure or flow rate of the gas supplied to the space SP, the volume of the space SP, or the temperature in the space SP. For example, a relief valve or a solenoid valve may be used as the pressure adjustment valve, or instead of or in combination with the pressure adjustment valve, a flow rate adjustment valve electrically connected to the control means 43 may be provided, and the flow rate adjustment valve may be adjusted via the control means 43 based on the thickness of the holding objects WK1 and WK2 to change the flow rate of the gas supplied to the space SP, thereby adjusting the pressure in the space SP. Alternatively, instead of or in combination with the pressure adjustment valve or flow rate adjustment valve, the exhaust means 42 may be driven via the control means 43 based on the thickness of the holding objects WK1 and WK2 to exhaust the gas from the space SP in accordance with the thickness of the holding objects WK1 and WK2, thereby adjusting the pressure in the space SP. If the supply means 20 also serves as the adjustment means 40 and the gas supply means 21 is capable of changing the pressure and flow rate of the gas, a pressure adjustment valve or flow rate adjustment valve may not be required. The adjustment means 40 may be used in place of or in combination with a pressure adjustment valve or a flow rate adjustment valve, and may include a linear motor 44 as a driving device arranged in the recess 12C of the table 12, as shown in Figure 1(B), and a partition member 44B supported by the output shaft 44A of the linear motor 44 and dividing the space SP into a first space SP1 on the side of the objects to be held WK1, WK2 and a second space SP2 on the opposite side, and the pressure in the first space SP1 may be adjusted by driving the linear motor 44 based on the thickness of the objects to be held WK1, WK2 via the control means 43 and raising and lowering the partition member 44B to change the volume of the first space SP1. 1(C), instead of or in combination with a pressure regulation valve or a flow rate regulation valve, adjustment means 40 may include a plurality of adjustment members 45A, 45B formed to different thicknesses, placed on the bottom surface of recess 12C, and formed with through holes 45C communicating with piping 22, and the pressure within space SP may be adjusted by a user or a conveying means (not shown) changing or stacking adjustment members 45A, 45B based on the thickness of objects WK1, WK2 to change the volume of space SP. In this case, adjustment means 40 may further include suction means 46, such as a decompression pump or a vacuum ejector, communicating with space SP via piping 46A, and may drive suction means 46 to suck and fix adjustment members 45A, 45B to the bottom surface of recess 12C. The adjustment means 40 may be used in place of or in combination with a pressure adjustment valve or a flow rate adjustment valve, and may include an elastically deformable elastic member 47 arranged along the corner of the bottom surface of the recess 12C, as shown in FIG. 1(D), which divides the space SP into a first space SP1 on the side of the objects to be held WK1, WK2 and a second space SP2 on the opposite side, and a pressure change means 48 such as a pressure change pump, vacuum ejector, turbine, or the like, which is connected to the second space SP2 via piping 48A and can pressurize or depressurize the second space SP2, and the pressure change means 48 may be driven via the control means 43 based on the thickness of the objects to be held WK1, WK2, and the pressure change means 48 may be elastically deformed by pressurizing or depressurizing the second space SP2, thereby changing the volume of the first space SP1, thereby adjusting the pressure in the first space SP1. The adjustment means 40 may be provided with, instead of or in combination with a pressure adjustment valve or a flow rate adjustment valve, a heating means 49A such as a coil heater or the heating side of a heat pipe, and a cooling means 49B such as a Peltier element or the cooling side of a heat pipe, as shown in Figure 1(E), and may adjust the pressure in the space SP by driving the heating means 49A or the cooling means 49B based on the thickness of the objects to be held WK1 and WK2 via the control means 43, heating or cooling the space SP to change the temperature in the space SP, or may adjust the pressure in the space SP by heating the gas supplied to the space SP with the heating means 49A or cooling it with the cooling means 49B to change the temperature in the space SP.

[0026] The processing means 50 may be arranged upside down or horizontally to attach the adhesive sheet AS to the underside or side of the objects to be held WK1, WK2, or instead of the pressure roller 52, a pressing means may be used that is supported by the output shaft of a linear motor as a driving device and that holds the adhesive sheet AS with a holding member that can be adsorbed and held by a pressure reduction means (not shown) such as a pressure reduction pump or vacuum ejector, and that presses the adhesive sheet AS held by the holding member onto the objects to be held WK1, WK2 to attach it, or a driving device may be used as a pressing member contact means that moves the pressure roller 52 towards and away from the objects to be held WK1, WK2 to prevent stress or damage to the objects to be held WK1, WK2, and this may or may not be provided in the holding device EA1 or processing device EA of the present invention. The unwinding means 51 may unwind a raw roll of adhesive sheet in which a closed-loop slit or a slit extending over the entire short width direction is formed in a strip-shaped adhesive sheet base material temporarily attached to a strip-shaped release sheet RL, with the predetermined area partitioned by the slit serving as the adhesive sheet AS, and then peel and unwind the adhesive sheet AS, or may employ a strip-shaped adhesive sheet base material in which a strip-shaped adhesive sheet base material is temporarily attached to a strip-shaped release sheet RL, and while unwinding the strip-shaped adhesive sheet base material, a cutting blade as cutting means is used to form a closed-loop slit or a slit extending over the entire short width direction in the adhesive sheet base material, and then peel and unwind the predetermined area partitioned by the slit. The adhesive sheet AS may be peeled off and then fed out from a raw roll RS having an adhesive sheet AS in the region, or the raw roll RS may be fan-folded without being rolled up, for example, and then the adhesive sheet AS may be peeled off and then fed out, or the release sheet RL may be fan-folded without being rolled up, or may be shredded with a shredder or the like, or may be randomly piled up, and a recovery means may be employed to recover the release sheet RL, or no recovery means may be employed, or the adhesive sheet AS may be fed out without being temporarily attached to the release sheet RL. The processing means 50 may be a sheet application means for applying an adhesive sheet AS to the holding objects WK1, WK2, or may be any means that applies a predetermined process to the holding objects WK1, WK2, such as an inspection means for inspecting the holding objects WK1, WK2, a positioning means for positioning the holding objects WK1, WK2, a sheet peeling means for peeling off the adhesive sheet AS applied to the holding objects WK1, WK2, a cleaning means for cleaning the holding objects WK1, WK2, a polishing means for polishing or grinding the holding objects WK1, WK2, etc.

[0027] The moving means 60 may move the payout means 51 and the pressure roller 52 without moving the table 12 or while moving the table 12 to attach the adhesive sheet AS to the holding objects WK1 and WK2, and may or may not be provided in the holding device EA1 or processing device EA of the present invention.

[0028] The materials, types, shapes, etc., of the adhesive sheet AS and the objects WK1 and WK2 to be held are not particularly limited. For example, the adhesive sheet AS and the objects WK1 and WK2 to be held may be circular, oval, polygonal (e.g., triangular, rectangular), or other shapes. The adhesive sheet AS may be pressure-sensitive, heat-sensitive, or other adhesive. If a heat-sensitive adhesive sheet AS is used, it may be adhered by an appropriate method, such as providing a heating means such as a coil heater or the heated side of a heat pipe. Furthermore, such adhesive sheets AS may be of any type, such as a single-layer adhesive sheet, a two-layer structure consisting of a substrate and an adhesive layer, a three-layer structure consisting of a substrate and an adhesive layer with one or more intermediate layers between them, a three-layer structure consisting of a substrate with one or more cover layers laminated on top of it, a structure with a substrate, intermediate layer, or cover layer that is releasably provided, a double-sided adhesive sheet consisting of a single layer consisting of an adhesive layer, or a double-sided adhesive sheet with adhesive layers laminated on both outermost surfaces of one or more intermediate layers. Furthermore, the objects to be held WK1 and WK2 may be, for example, a single object such as food, a resin container, a semiconductor wafer such as a silicon semiconductor wafer or a compound semiconductor wafer, a circuit board, an information recording substrate such as an optical disk, a glass plate, a steel plate, ceramics, a wooden board, or resin, or a composite formed from two or more of these, and may also be members or articles of any shape.The adhesive sheet AS may be, for example, any sheet, film, tape, etc., such as an information label, a decorative label, a protective sheet, dicing tape, die attach film, die bonding tape, or a recording layer-forming resin sheet.

[0029] The driving equipment in the above embodiments may be electric equipment such as rotary motors, linear motors, single-axis robots, so-called articulated robots with joints on two or three or more axes, actuators such as air cylinders, hydraulic cylinders, rodless cylinders and rotary cylinders, which may be used alone, or may be a direct or indirect combination of such electric equipment and actuators, or may be electric equipment, actuators, etc. that are capable of torque control, speed control, etc. for the output parts of such electric equipment, actuators, etc., or may not be capable of torque control, speed control, etc.

[0030] In the above embodiment, some object (hereinafter referred to as "object A") and an object (hereinafter referred to as "object B") that moves relative to object A, i.e., object A and object B that move relatively, object B may move relative to object A that does not move, object A may move relative to object B that does not move, or both object A and object B may move. As long as the result achieved by the movement is the same, either object A or object B may move. When a rotating member such as a roller is used, a driving device that rotates the rotating member may be provided. The surface of the rotating member or the rotating member itself may be made of a deformable member such as rubber or resin, or the surface of the rotating member or the rotating member itself may be made of a non-deformable member. Other members such as a rotating or non-rotating shaft or blade may be used instead of the roller. When a pressing means or pressing member such as a pressing roller or a pressing head that presses an object to be pressed is used, rollers, round rods, blade materials, brush-like members, or members that spray air or gas may be used instead of or in combination with the above-mentioned examples. The peeling means may be made of a deformable material such as rubber, resin, sponge, etc., or may be made of a non-deformable material such as metal or glass. When peeling means or peeling members such as peeling plates or peeling rollers are used to peel the object to be peeled, members such as plate-shaped members, round rods, rollers, etc. may be used instead of or in combination with the above-mentioned examples. The peeling means may be made of a deformable material such as rubber or resin, or may be made of a non-deformable material. When supporting (holding) means or supporting (holding) members that support (hold) the supported member (held member), etc. are used. In this case, a configuration may be adopted in which the supported member is supported (held) by gripping means such as a mechanical chuck or chuck cylinder, Coulomb force, adhesive (adhesive sheet, adhesive tape), pressure sensitive adhesive (adhesive sheet, adhesive tape), magnetic force, Bernoulli suction, suction, driving equipment, etc., or in the case where a cutting means or cutting member that cuts the member to be cut or forms an incision or cutting line in the member to be cut is used, cutting means that cut by a cutter blade, laser cutter, ion beam, fire, heat, water pressure, an electric heating wire, spraying of gas or liquid, etc., may be used instead of or in combination with the above examples,It is also possible to move the cutting object by combining appropriate driving devices. [Explanation of symbols]

[0031] EA1…Holding device 10...Holding means 20…Supply means 30...Operating means (obtaining means) 40...Adjustment means SP…Space WK1, WK2...Holding object

Claims

1. holding means that abuts against an outer periphery of the object to be held and holds the object to be held so as to form a space between the object and the holding means; a supply means for supplying a gas to the space, an acquisition means for acquiring the thickness of the object to be held; A holding device characterized by comprising an adjustment means for adjusting the pressure within the space based on the thickness of the object to be held acquired by the acquisition means.

2. The holding device according to claim 1, characterized in that the adjusting means adjusts the pressure in the space by changing at least one of the pressure or flow rate of the gas supplied to the space, the volume of the space, and the temperature in the space.

3. a holding step of contacting an outer periphery of an object to be held and holding the object to be held so as to form a space between the object and the holding member; A supply step of supplying a gas into the space is carried out, an acquisition step of acquiring a thickness of the holding object; and adjusting the pressure in the space based on the thickness of the object to be held obtained in the obtaining step.

Images