Flattening device, and article manufacturing method

Abstract

To provide a technique advantageous for reducing footprint of a flattening device and improving throughput.SOLUTION: A flattening device is provided which comprises a plurality of processing units and performs flattening processing in each of the plurality of processing units. The device comprises: a carrying-in unit for carrying in a substrate into the device; a supply unit that performs processing of supplying a composition to the substrate; a conveyance path through which the substrate is conveyed between one end where the carrying-in unit is located and the other end where the supply unit is located; an adjustment unit that is arranged in the middle of the conveyance path and performs pre-alignment of the substrate; a first carrying robot that is arranged on the conveyance path between the carrying-in unit and the adjustment unit and conveys the substrate; and a second conveying robot that is arranged on the conveyance path between the adjustment unit and the supply unit and conveys the substrate. A first processing unit is arranged within a range where the first conveying robot conveys the substrate, and a second processing unit is arranged within a range where the second conveying robot conveys the substrate.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a planarizing apparatus and a method for manufacturing an article. [Background technology]

[0002] Imprinting, which uses a mold to form an imprint material on a substrate, is a known method for manufacturing products such as semiconductor devices and MEMS. The imprinting technique is a microfabrication technique in which the imprint material supplied on the substrate is brought into contact with the mold and curing energy is applied to the imprint material, thereby forming a pattern in the cured product to which the concave and convex pattern of the mold is transferred.

[0003] Furthermore, a technique for planarizing the surface of a substrate using imprinting technology has also been proposed (see Patent Document 1). Conventionally, there have been techniques for planarizing the steps on the surface of a substrate by forming a coating film on the substrate using an existing coating device (spin coater), but such techniques are insufficient for planarizing the steps on the surface of the substrate at the nanoscale. On the other hand, the technique disclosed in Patent Document 1 can improve the precision of planarization by supplying a polymerizable substance based on the steps on the substrate and curing the polymerizable substance while bringing the supplied polymerizable substance into contact with a template having a flat surface.

[0004] In the planarization process proposed in Patent Document 1, a substrate is planarized through a supplying step, a contacting step, a curing step, and a separating step. A planarization apparatus differs from an imprint apparatus in that a flat member (called a "superstrate") on which no pattern is formed is brought into contact with a composition supplied over the entire surface of the substrate, and the composition is cured all at once in this state.

[0005] Therefore, the curing time of the composition supplied to the entire substrate surface in a planarization apparatus is longer than that in an imprint apparatus. Furthermore, a planarization apparatus requires a large amount of curing energy, and the adhesion force between the composition supplied to the entire substrate surface and the planarizing member during contact and separation is high, on the order of several hundred newtons. Therefore, the contact, curing, and separation steps described above can each require several tens of seconds, resulting in a long planarization process for each substrate after the composition supply step. If the four steps of the planarization process were simply performed sequentially, the throughput of the planarization apparatus would be limited to a maximum of several tens of substrates per hour. To increase the productivity of a planarization apparatus, it is necessary to minimize the processing time of each step or to cluster the planarization apparatus to process multiple substrates in parallel.

[0006] Patent Document 2 discloses a processing apparatus in which a plurality of coating processing sections for coating an organic material onto a substrate and a plurality of heat processing sections for heat-treating the substrate are arranged and clustered. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Special Publication No. 2011-529626 [Patent Document 2] Japanese Patent Application Laid-Open No. 2016-149576 Summary of the Invention [Problem to be solved by the invention]

[0008] In a planarization apparatus, it is also conceivable to cluster the processing sections that perform the composition supply, contact processing, curing processing, and separation processing. However, simply clustering the processing sections leads to an increase in the footprint of the apparatus. Furthermore, clustering increases the number of substrate transport destinations, which increases the load on the transport mechanism and reduces throughput.

[0009] The present invention provides advantageous techniques for reducing the footprint of a planarization device and increasing throughput. [Means for solving the problem]

[0010] According to one aspect of the present invention, there is provided a planarization apparatus including a plurality of processing sections including a first processing section and a second processing section, the planarization apparatus being configured to perform a planarization process on a substrate using a flat member in each of the plurality of processing sections, the planarization apparatus comprising: a loading section for loading a substrate or a flat member into the planarization apparatus; a supply section for supplying a composition used in the planarization process to the substrate; a transport path along which the substrate or the flat member is transported between one end where the loading section is located and the other end where the supply section is located; and an adjustment section disposed midway on the transport path, the adjustment section adjusting the amount of the substrate or the flat member loaded into any of the plurality of processing sections. a first transport robot disposed on the transport path between the loading unit and the adjustment unit and transporting the substrate or the flat member; and a second transport robot disposed on the transport path between the adjustment unit and the supply unit and transporting the substrate or the flat member, wherein the first processing unit is disposed within a transport range of the substrate or the flat member by the first transport robot, and the second processing unit is disposed within a transport range of the substrate or the flat member by the second transport robot. [Effects of the Invention]

[0011] According to the present invention, it is possible to provide an advantageous technique for reducing the footprint of a planarization device and improving throughput. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 2 is a diagram showing the configuration of a planarization apparatus. [Figure 2] FIG. 2 is a diagram showing the configuration of a loading section and a placement section. [Figure 3] 5A and 5B are diagrams for explaining a process in which a substrate is transported from an inlet to a supply unit. [Figure 4]5A and 5B are diagrams for explaining a process in which a substrate is transported from a supply unit to a processing unit. [Figure 5] 5A and 5B are diagrams for explaining a process in which a substrate is transported from a processing section to a loading section. [Figure 6] 10 is a timing chart for transporting a plurality of substrates. [Figure 7] FIG. 10 is a diagram for explaining a board swap operation. [Figure 8] 10A and 10B are diagrams showing a process in which the mold is transported to the processing section via the placement section. [Figure 9] 10A and 10B are diagrams showing a process in which the mold is transported to the processing section without passing through the mounting section. [Figure 10] FIG. 2 is a diagram showing the configuration of a planarization apparatus. [Figure 11] FIG. 10 is a diagram for explaining a flattening process. [Figure 12] FIG. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention claimed. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0014] First, we will provide an overview of planarization processes. The underlying pattern on a substrate has a roughness profile resulting from the pattern formed in the previous process. In the case of a typical logic-system process wafer, the pattern-induced roughness is approximately 80–100 nm. The step caused by the gentle waviness of the entire substrate can be corrected using the focus tracking function of the scanning exposure equipment used in photolithography. However, fine-pitch roughness that falls within the exposure slit area of ​​the exposure equipment cannot be corrected using the focus tracking function. If the amount of roughness is large, it may deviate from the depth of focus (DOF) of the exposure equipment. Conventional methods for smoothing the underlying pattern on a substrate involve forming a planarization layer, such as spin-on carbon (SOC) or chemical mechanical polishing (CMP). However, these conventional techniques have the problem of not being able to achieve sufficient planarization performance, and the unevenness of the underlying substrate is likely to increase further with the increasing number of layers.

[0015] To solve this problem, a planarization apparatus that uses jet-and-flash imprint lithography (JFIL) technology to planarize a substrate is being considered. An overview of the planarization process using JFIL technology is described with reference to FIG. 11 . In the planarization process using JFIL technology, a substrate can be planarized through the supplying process shown in FIG. 11(a), the contacting process shown in FIG. 11(b), the curing process shown in FIG. 11(c), and the separation process shown in FIG. 11(d). In FIG. 11 , a circuit pattern has already been formed on the surface of a substrate W chucked by a substrate chuck C, and pattern-induced irregularities of, for example, approximately 80 to 100 nm may exist. The requirement of the planarization apparatus in this embodiment is to planarize the surface irregularities caused by this pattern.

[0016] 11(a), a composition ML, which is a moldable material, is supplied from a dispenser DP to the surface of a substrate W chucked by a substrate chuck C. Note that, although the composition ML is depicted as being supplied from the dispenser DP to the surface of the substrate W on the substrate chuck C here, in the embodiment described later, the composition ML is supplied in a supply unit 109, which is a module separate from the processing unit that performs the planarization process.

[0017] In the contact step shown in FIG. 11(b), a superstrate SS, which is a flat member (patternless member) with an outer diameter equal to or greater than that of the substrate W and a flat surface without a pattern formed thereon, is brought into contact with the composition ML. The superstrate is also called a "planar template." This contact presses the superstrate SS over the entire surface of the substrate. This causes the composition ML to spread in a layer ("fill" or "spread").

[0018] 11(c), ultraviolet light from the light source IL is irradiated all over the surface of the substrate W (or as repeated partial exposures) with the superstrate SS in contact with the composition ML on the substrate W. This causes the composition ML, which has spread in a layer, to harden.

[0019] In the separation step shown in Figure 11(d), the superstrate SS is separated from the cured composition ML on the substrate W. In this way, the surface irregularities caused by the pattern on the substrate W are flattened. Note that the objective here is not to correct the flatness of low spatial frequency components, such as when the profile of the entire substrate is distorted relative to an absolute flat surface. Such components are compensated for as non-flat components by focus tracking control of the exposure tool in the subsequent pattern formation step.

[0020] In this way, planarization processing using imprint technology is a technique that flattens the surface at the nanometer level by supplying a composition according to the steps on the substrate, bringing a flat, thin member called a superstrate into contact with the supplied composition, and hardening the composition.

[0021] FIG. 12 is a diagram showing the configuration of a processing unit that performs the planarization process described above. In this specification and the drawings, directions are indicated in an XYZ coordinate system, with the horizontal plane being the XY plane. In the processing unit, the surface of the substrate to be processed is supported so that it is parallel to the horizontal plane (XY plane). Therefore, in the following, the directions that are perpendicular to each other in a plane along the substrate holding surface in the processing unit are referred to as the X-axis and Y-axis, and the direction perpendicular to the X-axis and Y-axis is referred to as the Z-axis. Furthermore, in the following, the directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are referred to as the X-direction, Y-direction, and Z-direction, respectively, and the directions of rotation around the X-axis, Y-axis, and Z-axis are referred to as the θX-direction, θY-direction, and θZ-direction, respectively.

[0022] In FIG. 12, the superstraight SS is a flat member (patternless member) that can serve as a flat reference surface after planarization. In this embodiment, a substrate chuck C is mounted on the substrate stage T. Sensors 501 for measuring the Z direction upward are arranged on the substrate chuck C, for example, with two channels in the depth direction of the page. These sensors 501 can measure the Z direction position and leveling (θX, θY) of the superstraight SS. Furthermore, by using these sensors 501 to observe the edge portion of the superstraight SS while scanning the substrate stage T in the Y direction, the amount of positional deviation of the superstraight SS in the X and Y directions relative to the chuck 502 can also be measured.

[0023] A cavity 503 is formed above the superstrate SS, separated by a transparent member from the exposure light source (corresponding to light source IL in Figure 11) included in the illumination / spread observation system 410. When the superstrate SS is brought into contact with the composition on the substrate W, the cavity 503 is maintained at a positive pressure relative to atmospheric pressure. This allows the superstrate SS to assume a convex shape relative to the substrate W, allowing contact from the center of the substrate first, thereby reducing air trapped between the superstrate SS and the composition. A linear motor mover 504a is fixed to the chuck 502. The mover 504a can move relative to the linear motor stator 504b via a spring hinge 505. The linear motor configured in this manner is position-controlled using a position sensor (not shown). Three sets of the mover 504a, stator 504b, spring hinge 505, and position sensor are implemented for each processing unit. With this configuration, the chuck 502 is positioned along the three axes of Z, θX, and θY by a predetermined drive profile during the contact process and the separation process.

[0024] Above the superstrate SS, an illumination and spread observation system 410 is disposed. The illumination and spread observation system 410 may include an exposure light source and an optical system for observing the spread state of the composition.

[0025] 1 is a diagram showing the configuration of a planarization apparatus 1 according to an embodiment. The planarization apparatus 1 has a cluster configuration in which a plurality of processing units work together. In the first embodiment, the planarization apparatus 1 includes four processing units. The first processing unit 110, the second processing unit 111, the third processing unit 113, and the fourth processing unit 112 may each have the configuration shown in FIG. 12 above.

[0026] The planarization apparatus 1 includes a loading unit 101 for loading a substrate or a flat member into the planarization apparatus. The loading unit 101 may be a relay unit to which a substrate transported from a substrate transport module also known as an Equipment Front End Module (EFEM) is supplied. The loading unit 101 may include a substrate relay slot capable of relaying the substrate and a pre-alignment device. The pre-alignment device configured in the loading unit 101 pre-aligns the substrate transported to the supply unit 109.

[0027] The planarization apparatus 1 includes a supply unit 109 that supplies a composition used in the planarization process to the substrate. The supply unit 109 will be described in detail later.

[0028] The flattening apparatus 1 includes a transport path 15 along which a substrate or flat member is transported between one end where the loading section 101 is located and the other end where the supply section 109 is located. In this embodiment, the transport path 15 is made up of a first transport path 103 and a second transport path 105, each extending in the X direction.

[0029] The planarization apparatus 1 includes a mounting unit 108 disposed midway along the transport path. The mounting unit 108 is configured to be able to mount a substrate or flat member to be transported to one of the processing units. In this embodiment, the mounting unit 108 is disposed between the first transport path 103 and the second transport path 105. The mounting unit 108 is also configured to pre-align the substrate placed thereon. In one example, the mounting unit 108 may include a substrate relay slot capable of relaying the substrate and a pre-alignment device. The pre-alignment device configured in the mounting unit 108 pre-aligns the substrate to be transported to one of the processing units. Therefore, the mounting unit 108 is not simply a mounting unit, but also serves as an adjustment unit having a substrate pre-alignment function.

[0030] The planarization apparatus 1 includes a first transport robot 102, which is a transport mechanism for transporting substrates or flat members. The first transport robot 102 is disposed on a transport path between the loading unit 101 and the placement unit 108, and is configured to transport substrates or flat members. The first transport robot 102 is mounted on a first transport path 103, and even if the distance between the loading unit 101 and the placement unit 108 is large, the first transport robot 102 can transport substrates by moving on the first transport path 103.

[0031] The planarization apparatus 1 includes a second transport robot 104. The second transport robot 104 is disposed on a transport path between the placement unit 108 and the supply unit 109, and is configured to transport a substrate or a flat member. The second transport robot 104 is mounted on a second transport path 105, and even if the distance between the placement unit 108 and the supply unit 109 is large, the second transport robot 102 can move on the second transport path 105 to transport the substrate.

[0032] The effective strokes of the first transport path 103 and the second transport path 105 may be different. However, the time required to move the maximum stroke of each transport path must be within the time required for the transport robot to turn 180°. This is because if the movement time of each transport path is longer than the turning time of the transport robot, the device throughput will decrease.

[0033] The first processing unit 110 is disposed within a range in which the first transport robot 102 can transport substrates or flat members. As a result, the first transport robot 102 transports substrates or flat members to the first processing unit 110. The second processing unit 111 is disposed within a range in which the second transport robot 104 can transport substrates or flat members. As a result, the second transport robot 104 transports substrates or flat members to the second processing unit 111.

[0034] In this embodiment, the first transport robot 102 is configured to transport a substrate or a flat member between the loading section 101, the placement section 108, and the first processing section 110. The second transport robot 104 is configured to transport a substrate or a flat member between the placement section 108, the supply section 109, and the second processing section 111.

[0035] The planarization apparatus 1 further includes a third transfer robot 106. The third transfer robot 106 is configured to transfer a substrate or a flat member between the first processing unit 110, the second processing unit 111, and the placement unit .

[0036] In this embodiment, the third processing unit 113 is disposed within a range in which the first transport robot 102 transports the substrate or flat member, and the fourth processing unit 112 is disposed within a range in which the second transport robot 104 transports the substrate or flat member. The planarization apparatus 1 may further include a fourth transport robot 107 configured to transport the substrate or flat member between the third processing unit 113, the fourth processing unit 112, and the placement unit 108.

[0037] The supply unit 109 supplies a composition as a moldable material to the surface of the substrate. The supply unit 109 may include a stage that holds and moves the substrate and a dispenser that dispenses the composition. The dispenser may be a jetting module that supplies the composition in the form of droplets. The composition is supplied to the entire surface of the substrate by performing multiple relative scans between the stage and the dispenser. At this time, the amount of composition supplied can be distributed depending on the arrangement of the concave-convex pattern formed on the surface of the substrate. For example, the composition is supplied so that the density of droplets is high in areas of the pattern on the substrate surface with a high proportion of recesses and low in areas with a low proportion of recesses. Therefore, when the composition is supplied by the dispenser, substrate alignment measurement may be performed to align the position of the pattern previously formed on the substrate with the shaded pattern of the composition to be supplied.

[0038] In this embodiment, as shown in FIG. 1, the loading section 101, the placement section 108, and the supply section 109 are arranged in a line on the transport path. The first processing section 110 and the second processing section 111 are arranged in a line in a direction parallel to the direction in which the transport path extends (the X direction). FIG. 1 is a plan view of the flattening apparatus 1 as seen from above in the Z direction. However, when viewed from the side as seen from the Y direction, it can be seen that the first processing section 110 is located between the loading section 101 and the placement section 108. It can also be seen that the second processing section 111 is located between the placement section 108 and the supply section 109 in the side view.

[0039] The third processing unit 113 and the fourth processing unit 112 are arranged on the opposite side of the transport path from the first processing unit 110 and the second processing unit 111. In this embodiment, the third transport robot 106 and the fourth transport robot 107 are arranged in a line in a direction intersecting the transport path at the position where the placement unit 108 is arranged. That is, the third transport robot 106 and the fourth transport robot 107 are arranged in a line in the Y direction with the placement unit 108 between them. Here, the third transport robot 106 is arranged between the first processing unit 110 and the second processing unit 111, and the fourth transport robot 107 is arranged between the third processing unit 113 and the fourth processing unit 112.

[0040] The planarization processes in the first processing unit 110, the second processing unit 111, the third processing unit 113, and the fourth processing unit 113 are described below. In each processing unit, in the contacting step, a superstrate SS having an outer diameter equal to or larger than that of the substrate is brought into contact with the composition and pressed against the entire surface of the substrate, spreading the composition in a layer. In the curing step, the superstrate SS is cured while in contact with the composition on the substrate. The composition may be, for example, a photocurable composition that is cured by ultraviolet light irradiated from a light source (included in the illumination and spread observation system 410). In the separating step, the superstrate SS is separated from the cured composition on the substrate, thereby planarizing the surface of the substrate.

[0041] The configurations of the loading unit 101 and the placement unit 108 will be described with reference to FIG. 2. FIG. 2(a) is a diagram showing the configuration of the loading unit 101, and FIG. 2(b) is a diagram showing the configuration of the placement unit 108. The loading unit 101 may include a substrate placement unit 201 on which a substrate is placed, and a pre-alignment device 202 arranged below the substrate placement unit 201 and performing pre-alignment of the substrate placed on the substrate placement unit 201. The placement unit 108 may include a substrate placement unit 203 on which a substrate is placed, and a pre-alignment device 204 arranged below the substrate placement unit 203 and performing pre-alignment of the substrate placed on the substrate placement unit 203. Each of the loading unit 101 and the placement unit 108 may be provided with multiple shelves capable of accommodating multiple substrates. The loading unit 101 and the placement unit 108 may have the same number of substrates (number of shelves) or different numbers of substrates that can be accommodated therein. Here, it is assumed that the loading unit 101 and the placement unit 108 each place a substrate thereon, but they may also be configured to place a superstrate SS thereon. The pre-alignment device 202 and the pre-alignment device 203 may have the same configuration or different configurations. Furthermore, in each of the loading unit 101 and the placement unit 108, the substrate placement unit and the pre-alignment device may be arranged upside down.

[0042] 3, the process by which the substrate W is transported from the loading unit 101 to the supply unit 109 will be described. First, the substrate W is transported to the loading unit 101. At this time, the substrate W is placed on the pre-alignment device 202 of the loading unit 101. After pre-alignment, the substrate W is placed on the substrate placement unit 203 of the placement unit 108 by the first transport robot 102. Subsequently, the substrate W placed on the placement unit 108 is transported to the supply unit 109 by the second transport robot 104. The supply unit 109 performs a supply process of supplying (dispensing) a moldable material to the substrate W that has been carried in.

[0043] 4, the process by which the substrate W is transported from the supply unit 109 to the processing unit 110 will be described. The substrate W that has been subjected to the supply processing in the supply unit 109 is placed on the pre-alignment device 204 of the placement unit 108 by the second transport robot 104. The substrate W that has been pre-aligned by the pre-alignment device 204 is received by the third transport robot 106 and transported by the third transport robot 106 to the first processing unit 110, where it is subjected to planarization processing. The third transport robot 106 can also transport a subsequent substrate to the second processing unit 111. Substrates are transported to the third processing unit 113 and the fourth processing unit 112 by the fourth transport robot 107.

[0044] When the substrate is transported from the supply unit 109 to the second processing unit 111, the second transport robot 104 transports the substrate from the supply unit 109 to the second processing unit 111 without passing through the placement unit .

[0045] 5, the process by which the substrate W is transported from the first processing unit 110 to the load unit 101 will be described. The substrate W processed in the first processing unit 110 is transported to the substrate mounting part 203 of the mounting part 108 by the third transport robot 106. Subsequently, the substrate W placed on the substrate mounting part 203 is transported to the substrate mounting part 201 of the load unit 101 by the first transport robot 102, and then transported out of the apparatus.

[0046] 3 to 5 show the process of transporting one specific substrate W. Next, the process of continuously transporting a plurality of substrates will be described.

[0047] FIG. 6 is a timing chart of the transport of multiple substrates. For example, as described above, a single substrate is transported from the loading unit 101 to the placement unit 108, the supply unit 109, the placement unit 108, the first processing unit 110, the placement unit 108, and the loading unit 101 in this order. When the first substrate is loaded into the supply unit 109, the second substrate is placed in the loading unit 101. The dispensing process for the first substrate is completed when the second substrate is loaded into the supply unit 109. Each of the first transport robot 102, the second transport robot 104, the third transport robot 106, and the fourth transport robot 107 has two hands for holding substrates. Therefore, for example, the third transport robot 106 and the fourth transport robot 107 can hold a substrate to be loaded into a processing unit while simultaneously holding a substrate to be unloaded from the processing unit, enabling substrate swapping. Details of the substrate swapping operation will be described later. As a result, a substrate swap operation is performed when the second substrate is loaded into the supply unit 109. This allows the first substrate to be retrieved from the supply unit 109. The retrieved first substrate is transported to the first processing unit 110. The number of substrates processed per hour in the supply unit 109 is at least twice the number of substrates processed per hour in each of the multiple processing units. In one example, the processing time per substrate in the supply unit 109 is ¼ or less of the processing time per substrate in each of the first processing unit 110, the second processing unit 111, the third processing unit 113, and the fourth processing unit 112. Therefore, while the first substrate is being planarized in the first processing unit 110, the second substrate supplied in the supply unit 109 is transported to the second processing unit 111. While the second substrate is being planarized in the second processing unit 111, the third substrate supplied in the supply unit 109 is transported to the fourth processing unit 112. While the third substrate is being planarized in processing section 112, the fourth substrate, which has been supplied in supply section 109, is transported to third processing section 113. When the fifth substrate is transported to first processing section 110, the planarization of the first substrate is completed, and the first substrate is recovered by a substrate swap operation. In this manner, multiple substrates are transported continuously.

[0048] The substrate swap operation will be described in detail with reference to Figure 7. Figure 7 is a diagram showing a sequence in which a first substrate 703 that has been supplied by the supply unit 109 is retrieved using two hands, and a second substrate 704 is placed on it. The supply unit 109 has a substrate chuck 701 and lift-up pins 702 that are raised and lowered relative to the chuck surface of the substrate chuck 701 by a lifting mechanism. The transfer robot (second transfer robot 104) also has two hands 705 and 706. The two hands 705 and 706 are stacked in the height direction (Z direction).

[0049] The first substrate 703 supplied in the supply unit 109 is lifted up by the lift-up pins 702 and separated from the substrate chuck 701. At this time, the hand 705 is used for substrate recovery and is therefore not holding a substrate, while the hand 706 is used for substrate placement and is therefore holding a second substrate 704 (FIG. 7(a)). The hand 705 enters below the first substrate 703 lifted up from the substrate chuck 701 (FIG. 7(b)). The hand 705 then holds and recovers the first substrate 703 (FIG. 7(c)). Next, the hand 706 holding the second substrate 704 enters above the substrate chuck 701 (FIG. 7(d)). The hand 706 then places the second substrate 704 on the lift-up pins 702, after which the hand 706 retracts (FIG. 7(e)). This series of operations completes the substrate swap operation.

[0050] The upper and lower positions of the hands 705 and 706 may be reversed. In the above example, the substrate swap operation in the supply unit 109 by the second transport robot 104 is shown, but the substrate swap operation can also be performed in the first processing unit 110, the second processing unit 111, the third processing unit 113, and the fourth processing unit 112 in the same way.

[0051] The superstrates SS used in the planarization processes in the first processing unit 110, second processing unit 111, third processing unit 113, and fourth processing unit 112 may be replaced each time a certain number of substrates are planarized. This is because the surface of the superstrate SS that comes into contact with the moldable material may be contaminated by the moldable material, which could cause defects on the substrate surface during the planarization process. The same first and second transfer robots 102 and 104 that are used to transport substrates may be used to transport the superstrates SS. As mentioned above, each of the first to fourth transfer robots has two hands for holding substrates, but they may also have one additional hand for transporting the superstrates SS.

[0052] The transport process of the superstraight SS will be described with reference to Figures 8 and 9. Figure 8 is a diagram showing the process of transporting the superstraight SS to the second processing unit 111 via the mounting unit 108. The superstraight SS carried in from the loading unit 101 is placed on the pre-alignment device 202 of the loading unit 101. The superstraight SS pre-aligned by the pre-alignment device 202 is placed on the substrate mounting unit 203 of the mounting unit 108 by the first transport robot 102. Subsequently, the second transport robot 104 receives the superstraight SS from the mounting unit 108 and transports it to the second processing unit 111. Another superstraight to be transported to the fourth processing unit 112 can be transported in a similar manner.

[0053] 9 is a diagram showing the process of transporting the superstrate SS to the first processing unit 110 without passing through the placement unit 108. The superstrate SS, which has been pre-aligned by the pre-alignment device 202 in the loading unit 101, is transported to the first processing unit 110 by the first transport robot 102. Another superstrate to be transported to the third processing unit 113 can also be transported in the same manner. In this way, when the destination of the superstrate SS is the first processing unit 110 or the third processing unit 113, the first transport robot 102 transports the superstrate SS from the loading unit 101 to the first processing unit 110 without passing through the placement unit 108.

[0054] Second Embodiment A planarization apparatus 1 in the second embodiment will be described with reference to FIG. 10. In the first embodiment (FIG. 1), the planarization apparatus 1 includes four processing units, whereas in the second embodiment (FIG. 10), the planarization apparatus 1 includes two processing units. In this embodiment, the two processing units are a first processing unit 110 and a second processing unit 111. In this case, substrates are transported between the placement unit 108 and the first processing unit 110, and between the placement unit 108 and the second processing unit 111, by the third transfer robot 106, as in the first embodiment. In this embodiment, the planarization apparatus 1 does not include the third processing unit 113 or the fourth processing unit 112, and therefore does not include the fourth transfer robot 107.

[0055] The configurations of the loading unit 101 and the placement unit 108 are the same as those in the first embodiment. Therefore, also in this embodiment, substrate transportation between the loading unit 101 and the placement unit 108 is performed by the first transport robot 102, and substrate transportation between the placement unit 108 and the supply unit 109 is performed by the second transport robot 104.

[0056] As described in the first embodiment, the number of substrates processed per unit time in the supply unit 109 is more than twice the number of substrates processed per unit time in each of the multiple processing units. However, in the second embodiment, the number of substrates and superstrates carried in per unit time differs from that in the first embodiment. As described above, the processing time per substrate in the supply unit 109 is less than one-fourth of the processing time per substrate in the first processing unit 110 and the second processing unit 111. Therefore, if the number of substrates carried in per unit time is the same as in the first embodiment, the number of substrates processed in the first processing unit 110 and the second processing unit 111 is smaller than the number of substrates processed in the supply unit 109, which causes substrate transport to be delayed. Therefore, in the second embodiment, the number of substrates carried in per unit time is half that of the first embodiment. The above-described transport method enables continuous substrate processing.

[0057] <Embodiment of an article manufacturing method> Next, a method for manufacturing an article (such as a semiconductor IC element, a liquid crystal display element, a color filter, or a MEMS) using the planarization apparatus described above will be described. This manufacturing method includes the steps of contacting a composition disposed on a substrate (such as a wafer or glass substrate) with a superstrate to planarize the composition, curing the composition, and separating the composition from the superstrate using the planarization apparatus described above. This results in a planarization film being formed on the substrate. The substrate with the planarization film formed thereon is then processed using a lithography apparatus to form a pattern, and the processed substrate is then subjected to other well-known processing steps to manufacture the article. These other well-known steps include patterning exposure and associated pre-processing, etching, resist stripping, dicing, bonding, packaging, and the like. This manufacturing method enables the manufacture of higher-quality articles than conventional methods.

[0058] The disclosure of the present specification includes at least the following technical ideas. (Item 1) A planarization apparatus comprising a plurality of processing sections including a first processing section and a second processing section, and configured to perform a planarization process on a substrate using a flat member in each of the plurality of processing sections, a loading section for loading a substrate or a flat member into the planarization apparatus; a supply unit that supplies a composition used in the planarization treatment to the substrate; a transport path along which the substrate or the flat member is transported between one end where the loading unit is located and the other end where the supply unit is located; an adjustment unit disposed midway on the transport path, on which the substrate or the flat member to be carried into any one of the plurality of processing units can be placed, and which is configured to perform pre-alignment of the placed substrate; a first transport robot disposed on the transport path between the loading unit and the adjustment unit, the first transport robot transporting the substrate or the flat member; a second transport robot disposed on the transport path between the adjustment unit and the supply unit, the second transport robot transporting the substrate or the flat member; Equipped with the first processing unit is disposed within a range in which the substrate or the flat member is transported by the first transport robot; the second processing unit is disposed within a transport range of the substrate or the flat member by the second transport robot; A flattening apparatus characterized by: (Item 2) the first transport robot is configured to transport the substrate or the flat member among the loading unit, the adjustment unit, and the first processing unit; the second transport robot is configured to transport the substrate or the flat member between the adjustment unit, the supply unit, and the second processing unit. 2. The planarization apparatus according to item 1, (Item 3) 3. The planarization apparatus described in item 2, further comprising a third transport robot configured to transport the substrate or the flat member between the first processing unit, the second processing unit, and the adjustment unit. (Item 4) The plurality of processing units include: a third processing unit disposed within a range in which the substrate or the flat member is transported by the first transport robot; a fourth processing unit disposed within a range in which the second transport robot transports the substrate or the flat member; Further comprising: further comprising a fourth transport robot configured to transport the substrate or the flat member between the third processing unit, the fourth processing unit, and the adjustment unit; 4. The planarization apparatus according to item 3, (Item 5) 5. The flattening apparatus according to item 4, wherein the loading section, the adjusting section, and the supplying section are arranged in a line on the transport path. (Item 6) the first processing section and the second processing section are arranged in a line in a direction parallel to a direction in which the transport path extends, the first processing unit is disposed at a position between the loading unit and the adjustment unit in a side view of the planarization apparatus, The second processing unit is disposed at a position between the adjustment unit and the supply unit in the side view. 6. The planarization apparatus according to item 5, characterized in that: (Item 7) 7. The flattening apparatus according to item 6, wherein the third processing section and the fourth processing section are disposed on opposite sides of the transport path from the first processing section and the second processing section. (Item 8) the third transport robot and the fourth transport robot are arranged in a line in a direction intersecting the transport path at a position where the adjustment unit is arranged, the third transfer robot is disposed between the first processing section and the second processing section, the fourth transfer robot is disposed between the third processing section and the fourth processing section; 8. The planarization apparatus according to item 7, characterized in that: (Item 9) 9. The planarization apparatus according to any one of items 6 to 8, wherein, when the substrate is transported from the supply unit to the second processing unit, the second transport robot transports the substrate from the supply unit to the adjustment unit and places it thereon, and the third transport robot receives the substrate at the adjustment unit and transports it to the first processing unit. (Item 10) 10. The planarization apparatus according to any one of items 6 to 9, wherein when the substrate is transported from the supply unit to the second processing unit, the second transport robot transports the substrate from the supply unit to the second processing unit without passing through the adjustment unit. (Item 11) 9. The flattening apparatus according to any one of items 6 to 8, wherein when the flat member is transported from the loading section to the second processing section, the first transport robot transports the flat member from the loading section to the adjustment section and places it thereon, and the second transport robot receives the flat member at the adjustment section and transports it to the second processing section. (Item 12) 10. The flattening apparatus according to any one of items 6 to 9, wherein when the flat member is transported from the loading section to the first processing section, the first transport robot transports the flat member from the loading section to the first processing section without passing through the adjustment section. (Item 13) 13. The planarization apparatus according to any one of items 1 to 12, wherein the first transport robot includes two hands for holding a substrate and one hand for holding a flat member. (Item 14) 14. The planarization apparatus according to any one of items 1 to 13, wherein the number of substrates processed per hour in the supply unit is at least twice the number of substrates processed per hour in each of the plurality of processing units. (Item 15) 15. The planarization apparatus according to any one of items 1 to 14, wherein the substrate transported from the loading section is subjected to the supply process in the supply section, the planarization process in one of the plurality of processing sections, and then the substrate is returned to the loading section. (Item 16) 16. The planarization apparatus according to any one of items 1 to 15, wherein the adjustment unit has multiple shelves capable of accommodating multiple substrates or planar members. (Item 17) 17. The planarization apparatus according to any one of items 1 to 16, wherein the planarization treatment is performed by contacting the composition supplied onto the substrate by the supply unit with the flattening member to form a planarization film of the composition on the substrate. (Item 18) forming a planarization film on a substrate using the planarization apparatus according to any one of items 1 to 17; processing the substrate on which the planarization film is formed; and manufacturing an article from the processed substrate.

[0059] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0060] 1: planarization device, 101: loading section, 110: first processing section, 111: second processing section, 112: fourth processing section, 113: third processing section, 102: first transport robot, 104: second transport robot, 106: third transport robot, 107: fourth transport robot, 108: placement section, 109: supply section

Claims

1. A planarization apparatus including a plurality of processing sections including a first processing section and a second processing section, the planarization apparatus being configured to perform a planarization process on a substrate using a flattening member in each of the plurality of processing sections, a loading section for loading a substrate or a flat member into the planarization apparatus; a supply unit that supplies a composition used in the planarization treatment to the substrate; a transport path along which the substrate or the flat member is transported between one end where the loading unit is located and the other end where the supply unit is located; an adjustment unit disposed midway on the transport path, on which the substrate or the flat member to be carried into any one of the plurality of processing units can be placed, and which is configured to perform pre-alignment of the placed substrate; a first transport robot disposed on the transport path between the loading unit and the adjustment unit, the first transport robot transporting the substrate or the flat member; a second transport robot disposed on the transport path between the adjustment unit and the supply unit, the second transport robot transporting the substrate or the flat member; Equipped with the first processing unit is disposed within a range in which the substrate or the flat member is transported by the first transport robot; the second processing unit is disposed within a transport range of the substrate or the flat member by the second transport robot; A flattening apparatus characterized by:

2. the first transport robot is configured to transport the substrate or the flat member among the loading unit, the adjustment unit, and the first processing unit; the second transport robot is configured to transport the substrate or the flat member among the adjustment unit, the supply unit, and the second processing unit.

2. The planarization apparatus according to claim 1.

3. 3. The planarization apparatus according to claim 2, further comprising a third transport robot configured to transport the substrate or the flat member between the first processing unit, the second processing unit, and the adjustment unit.

4. The plurality of processing units include: a third processing unit disposed within a range in which the substrate or the flat member is transported by the first transport robot; a fourth processing unit disposed within a range in which the second transport robot transports the substrate or the flat member; Further comprising: further comprising a fourth transport robot configured to transport the substrate or the flat member between the third processing unit, the fourth processing unit, and the adjustment unit; 4. The planarization apparatus according to claim 3.

5. 5. The flattening apparatus according to claim 4, wherein the loading section, the adjusting section, and the supplying section are arranged in a line on the transport path.

6. the first processing section and the second processing section are arranged in a line in a direction parallel to a direction in which the transport path extends, the first processing unit is disposed at a position between the loading unit and the adjustment unit in a side view of the planarization apparatus, The second processing unit is disposed at a position between the adjustment unit and the supply unit in the side view.

6. The planarization apparatus according to claim 5.

7. 7. The flattening apparatus according to claim 6, wherein the third processing section and the fourth processing section are disposed on opposite sides of the transport path from the first processing section and the second processing section.

8. the third transport robot and the fourth transport robot are arranged in a line in a direction intersecting the transport path at a position where the adjustment unit is arranged, the third transport robot is disposed between the first processing section and the second processing section, the fourth transport robot is disposed between the third processing section and the fourth processing section; 8. The planarization apparatus according to claim 7.

9. 7. The planarization apparatus of claim 6, wherein, when the substrate is transported from the supply unit to the second processing unit, the second transport robot transports the substrate from the supply unit to the adjustment unit and places it thereon, and the third transport robot receives the substrate at the adjustment unit and transports it to the first processing unit.

10. 7. The planarization apparatus according to claim 6, wherein when the substrate is transported from the supply unit to the second processing unit, the second transport robot transports the substrate from the supply unit to the second processing unit without passing through the adjustment unit.

11. The flattening apparatus described in claim 6, characterized in that when transporting the flat member from the loading section to the second processing section, the first transport robot transports the flat member from the loading section to the adjustment section and places it thereon, and the second transport robot receives the flat member at the adjustment section and transports it to the second processing section.

12. The flattening apparatus of claim 6, characterized in that when transporting the flat member from the loading section to the first processing section, the first transport robot transports the flat member from the loading section to the first processing section without passing through the adjustment section.

13. 2. The planarization apparatus according to claim 1, wherein the first transfer robot includes two hands for holding a substrate and one hand for holding a flat member.

14. 2. The planarization apparatus according to claim 1, wherein the number of substrates processed per hour in the supply section is at least twice the number of substrates processed per hour in each of the plurality of processing sections.

15. 2. The planarization apparatus according to claim 1, wherein the substrate transported from the loading section is subjected to the supply process in the supply section, the planarization process is performed in one of the plurality of processing sections, and then the substrate is returned to the loading section.

16. 2. The planarizing apparatus according to claim 1, wherein the adjustment unit has a plurality of shelves capable of accommodating a plurality of substrates or planar members.

17. 2. The planarization apparatus according to claim 1, wherein the planarization process is performed by contacting the composition supplied onto the substrate by the supply unit with the flattening member to form a planarization film of the composition on the substrate.

18. forming a planarization film on a substrate using the planarization apparatus according to any one of claims 1 to 17; processing the substrate on which the planarization film is formed; and manufacturing an article from the processed substrate.

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