Radiation imaging device, radiation imaging system, and manufacturing method

Abstract

To provide a radiation imaging device that is easy to assemble even when a heat insulating member is arranged near a cable.SOLUTION: The radiation imaging device (100) has a sensor panel (101), a cable (180), a substrate (190), a first heat insulating member (160), a second heat insulating member (161), and a housing (150), where the first heat insulating member (160) is provided between the sensor panel (101) and the substrate (190), and the second heat insulating member (161) is provided between the cable (180) and a side wall (150c), and the internal space of the housing (150) has a space on the incident surface side and a space on the back surface side, with the position where the first heat insulating member (160) and the second heat insulating member (161) sandwich the cable (180) between them.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] TECHNICAL FIELD The present invention relates to a radiation imaging apparatus, a radiation imaging system, and a manufacturing method thereof.Radiation imaging apparatuses can be used as, for example, medical image diagnostic apparatuses, analytical apparatuses, and the like. [Background technology]

[0002] 2. Description of the Related Art Conventionally, there has been known a radiation imaging apparatus that converts incident radiation into an electrical signal in a sensor panel and obtains a radiation image based on this electrical signal.

[0003] Such a radiation imaging device contains many electrical components, and if heat generated from these electrical components is transmitted to the sensor panel, it can affect the quality of the radiation image.

[0004] Patent Document 1 discloses a radiation imaging device in which a heat insulating member is disposed between a sensor unit and an electric component, thereby suppressing heat transfer from the electric component to the sensor unit. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 6778118 Summary of the Invention [Problem to be solved by the invention]

[0006] Patent Document 1 leaves room for improvement in terms of ease of assembly of the device. This is because, if an insulating member is placed between the sensor unit and the electrical components, as in Patent Document 1, the placement of the insulating member is obstructed by the flexible cable (wiring) connecting the sensor unit and the electrical components. Patent Document 1 does not describe the structure of the insulating member in detail, but if a hole is provided in the insulating member and the flexible cable is passed through it, the task of passing the flexible cable through the hole during assembly is time-consuming. Furthermore, if the flexible cable needs to be replaced, the task of removing the flexible cable from the insulating member is time-consuming.

[0007] Therefore, it is desirable that a radiation imaging device in which a heat insulating member is disposed near a cable has a structure that is easy to assemble. [Means for solving the problem]

[0008] The present invention provides a radiation imaging device comprising: a sensor panel that detects radiation; a cable connected to the sensor panel; a substrate connected to the sensor panel via the cable; a plurality of insulating members including a first insulating member and a second insulating member; and a housing that houses the sensor panel, the cable, the substrate, and the plurality of insulating members, the housing having an incident surface that allows radiation to be incident on the sensor panel, a back surface located opposite the incident surface, and a side wall connecting the incident surface and the back surface, wherein the first insulating member is provided between the sensor panel and the substrate, the second insulating member is provided between the cable and the side wall, and the internal space of the housing is characterized in that the first insulating member and the second insulating member sandwich the cable. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a radiation imaging apparatus that is easy to assemble even when a heat insulating member is disposed near a cable. [Brief explanation of the drawings]

[0010] [Figure 1]1 is a cross-sectional side view of an example of the internal configuration of a radiation imaging apparatus. [Figure 2] 2(a) is a diagram showing the radiation imaging device as viewed from the radiation incident side when radiation passes through the incident surface, and FIG. 2(b) is a diagram showing the AA cross section of the radiation imaging device. [Figure 3] FIG. 10 is a schematic diagram showing how the housing is assembled. [Figure 4] 1 is a cross-sectional side view of an example of the internal configuration of a radiation imaging apparatus. [Figure 5] Fig. 5(a) is a diagram showing the radiation imaging device as viewed from the radiation incident side after radiation has passed through the incident surface, and Fig. 5(b) is a diagram showing the AA cross section of the radiation imaging device. [Figure 6] FIG. 10 is a schematic diagram showing how the housing is assembled. [Figure 7] 1 is a cross-sectional side view of an example of the internal configuration of a radiation imaging apparatus. [Figure 8] 1 is a cross-sectional side view of an example of the internal configuration of a radiation imaging apparatus. [Figure 9] FIG. 1 is a diagram illustrating a radiography system. DETAILED DESCRIPTION OF THE INVENTION

[0011] The following describes in detail the embodiments of the present invention with reference to the accompanying drawings. The claimed invention is not limited to the configurations described in the embodiments. Modifications, such as replacing or omitting parts of the configuration or processing, may be made within the scope of achieving similar effects.

[0012] Example 1 [Radiography system] FIG. 9 is a diagram showing the configuration of a radiation imaging system. As shown in FIG. 9, radiation 211 (X-rays) generated by an X-ray tube 210 (radiation source, radiation irradiation device) passes through an imaging region 221 (chest) of a patient 220 (subject) and enters a radiation imaging device 100 (radiation imaging device, radiation detection device). The incident X-rays contain information about the inside of the patient 220's body. A scintillator (phosphor) emits light in response to the incidence of X-rays, and this emission is photoelectrically converted by a sensor (photoelectric conversion element) of a sensor panel to obtain electrical information. This electrical information is converted into digital data and subjected to image processing by an image processor 230 (signal processing unit), which can then be observed on a display 240 (display unit). In this specification, radiation includes not only X-rays but also α-rays, β-rays, γ-rays, particle rays, cosmic rays, and the like.

[0013] The information image-processed by the image processor 230 can be transferred to a remote location via a transmission processing unit 250 on a network such as a telephone, LAN, or the Internet. Therefore, the information image-processed by the image processor 230 can be displayed on a display unit (display) 241 in a doctor's room or the like in another location, or stored in a recording unit such as an optical disk, enabling a diagnosis to be made by a doctor in a remote location. In addition, the information image-processed by the image processor 230 can also be recorded on a film 261 by a film processor 260.

[0014] [Radiography system] The following describes the radiation imaging apparatus 100. Fig. 1 is a cross-sectional side view of an example of the internal configuration of the radiation imaging apparatus.

[0015] The radiation imaging device 100 (radiation imaging device, radiation detection device) is a device for generating a radiation image based on radiation irradiated from an X-ray tube 210 (radiation source, radiation generation device). As shown in FIG. 9, the radiation imaging device 100 in this embodiment is a flat panel detector (FPD) in the shape of a flat plate. To clearly illustrate the configuration of the radiation imaging device 100, the length of the radiation imaging device 100 in the thickness direction (z direction) is exaggerated in each of the drawings, including FIG. 1. FIG. 2(a) is a diagram showing the radiation imaging device as viewed from the radiation incident side, with radiation transmitted through the incident surface. FIG. 2(b) is a diagram showing a cross section AA of the radiation imaging device.

[0016] The radiation imaging device 100 has the components shown in FIG. 1, including a sensor panel 101, a base 110 (support base), a support column 111, a base 130, a housing 150, heat insulating members 160 and 161, a cable 180, and a mounting board 190, among others.

[0017] The housing 150 is a casing that houses the internal configuration (internal parts) of the radiation imaging device 100. The internal configuration includes the sensor panel 101, the base 110, the support 111, the base 130, the heat insulating members 160 and 161, the cable 180, and the mounting board 190. The housing 150 includes an incident surface 150a through which radiation is incident on the sensor panel 101, a back surface 150b located on the opposite side to the incident surface, and a side wall 150c that connects the incident surface 150a and the back surface 150b. The housing 150 has a substantially rectangular parallelepiped (box-shaped) shape, and is substantially quadrilateral when viewed from the side where radiation enters.

[0018] In this embodiment, the housing 150 is composed of an upper cover 151 (front member) and a lower cover 152 (rear member). The upper cover 151 and the lower cover 152 are shaped like a tray having a bottom plate and side walls. The opening of the upper cover 151 is closed by the lower cover 152, thereby forming a box-shaped housing 150 and forming a space for accommodating internal components.

[0019] The bottom plate of upper cover 151 corresponds to incident surface 150a onto which radiation 211 is incident. Therefore, it is desirable that the portion of upper cover 151 that corresponds to incident surface 150a be made of a material that absorbs little radiation, such as plastic, carbon, or CFRP (Carbon Fiber Reinforced Plastics).

[0020] Other portions (such as side walls) of upper cover 151 and lower cover 152 may be made of the same material as incident surface 150a, or may be made of a highly rigid material such as metal, alloy, or ceramic.

[0021] The sensor panel 101 is a radiation detection panel (radiation detection sensor, radiation detector) that converts radiation into an electrical signal. When viewed from the direction of incidence of radiation, the sensor panel 101 has a substantially quadrilateral shape. The sensor panel 101 has multiple pixels, each of which generates an electrical signal according to the amount of incident radiation. The sensor panel 101 of this embodiment is, for example, an indirect radiation detector equipped with a phosphor that converts radiation into light, and has the following configuration. Each pixel of the sensor panel 101 is composed of multiple layers. The multiple layers include a switching element such as a thin-film transistor (TFT), a photoelectric conversion unit made of amorphous silicon (a-Si), low-temperature polysilicon (LTPS), an oxide semiconductor (IGZO), or the like, and a scintillator layer arranged on an insulating substrate such as a glass substrate. The scintillator layer converts radiation into visible light, and the photoelectric conversion unit converts this visible light into an electric charge. Materials such as CsI and GOS (Gd2O2S:Tb) are used for the scintillator layer. In particular, for CsI (cesium iodide), Tl (thallium) or Na (sodium) is used as an activator. The scintillator layer is covered with a protective film such as polyparaxylylene (parylene), hot melt resin, or a laminated sheet of hot melt resin and aluminum.

[0022] Alternatively, the sensor panel 101 may use a direct-type radiation detector that directly converts radiation into an electrical signal. In this case, each pixel of the sensor panel 101 has a conversion unit that directly converts radiation into an electric charge, instead of having a scintillator layer. Examples of conversion units that directly convert radiation into an electric charge include amorphous selenium (a-Se), CdTe (cadmium telluride), and CdZnTe (cadmium zinc telluride).

[0023] The mounting board 190 is a circuit board on which electrical components (not shown) are mounted. The electrical components include at least one of an integrated circuit (e.g., a drive circuit) that controls the operation of the sensor panel 101 and an integrated circuit (e.g., an amplifier IC, a readout circuit) that processes signals from the sensor panel 101. In FIG. 1, the mounting board 190 is represented by a single board, but the mounting board 190 may be made up of multiple boards. In this case, the multiple boards may be arranged on the same plane or may be stacked in the height direction (z direction).

[0024] The sensor panel 101 and the mounting board 190 are connected by a cable 180 for exchanging signals. The cable 180 is, for example, an FPC (flexible printed circuit, flexible board), and electrical components such as an integrated circuit 181 (IC chip) are arranged on the cable 180.

[0025] The base 110, the base 130, and the support pillars 111 are a support configuration for stably supporting the sensor panel 101 and the mounting board 190 in the internal space of the housing 150. The base 130 is fixed to the lower cover 152, and the base 110 is fixed to the base 130 via the support pillars 111.

[0026] The base 110 is a member that supports the sensor panel 101 and various substrates. When viewed from the side where radiation is incident, the base 110 has a substantially quadrilateral shape. The sensor panel 101 is fixed to the front surface (first surface) of the base 110 with a bonding member such as adhesive tape or adhesive.

[0027] The base 110 is preferably made of a material with high rigidity and flatness, such as an alloy, metal, resin, ceramic, etc. This allows the sensor panel 101 to be stably supported.

[0028] The base 130 may be made of a material with high thermal conductivity, such as a metal or alloy, or a resin containing filler. This allows heat generated by the mounting board 190 to be released to the lower cover 152.

[0029] The material of the support 111 can be a combination of materials such as metal, alloy, and ceramic, or resin. It is desirable to use a material with low thermal conductivity for the material of the support 111. In Fig. 1, the support 111 is depicted as having a cylindrical shape, but it may have a different shape as long as it can connect the base 110 and the base 130.

[0030] The heat insulating members 160 and 161 are members for partitioning (separating) the internal space of the housing 150 into a space on the incident surface 150a side and a space on the back surface 150b side. This prevents the air heated by the mounting board 190 from flowing into the space where the sensor panel 101 is located (thermal convection), thereby suppressing a temperature rise in the sensor panel 101. Note that the heat insulating structure formed by the heat insulating members 160 and 161 may have some gaps, etc., as long as the temperature rise in the sensor panel 101 can be sufficiently suppressed. However, it is desirable to eliminate gaps as much as possible. The heat insulating members 160 and 161 will be described in detail later.

[0031] [Insulation materials] The heat insulating structure of this embodiment is divided into a heat insulating member 161 (first heat insulating member) and a heat insulating member 160 (second heat insulating member) which are constructed separately, and when the upper cover 151 and the lower cover 152 are combined, the heat insulating members 160 and 161 sandwich the cable 180.

[0032] The heat insulating member 161 is fixed to the rear surface (second surface) of the base 110 so as to be located between the sensor panel 101 and the mounting board 190. The heat insulating member 161 may be adhered to the base 110 via an adhesive layer (not shown) such as double-sided tape or adhesive, or may be physically fixed by a fastening member such as a screw.

[0033] The heat insulating member 160 is fixed to the inner wall surface of the side wall 150c of the housing 150. The heat insulating member 160 may be adhered to the housing 150 via an adhesive layer (not shown) such as double-sided tape or adhesive, or may be physically fixed by a fastening member such as a screw.

[0034] In Figure 1, the heat insulating members 160 and 161 have approximately the same thickness (length in the vertical direction (z direction) of the paper surface of Figure 1(a)). However, the heat insulating member 160 may be thicker than the heat insulating member 161, or the heat insulating member 161 may be thicker than the heat insulating member 160. Also, one may be thicker in some regions along the circumference of the side wall 150c and thinner in other regions.

[0035] In addition, in FIG. 1, the heat insulating members 160 and 161 sandwich the cable 180 over substantially the entire area in the thickness direction, but the cable 180 may be sandwiched using only a partial area in the thickness direction (z direction).

[0036] It is desirable that the heat insulating members 160 and 161 have a property of being difficult to transfer heat, and the thermal conductivity is preferably about 0.01 to 0.5 W / (m·K).

[0037] The heat insulating members 160, 161 are made of, for example, a solid resin or laminate, a filled material structure formed by hardening a liquid resin, or a foamed resin with high heat insulating properties. Resin materials such as phenolic resin, epoxy resin, silicone resin, acrylic resin, PEEK resin, PET (polyethylene terephthalate), vinyl chloride, polycarbonate, fluororesin, urethane resin, and rubber can be used for the heat insulating members 160, 161. The heat insulating members 160, 161 may be made of the same material, or different materials.

[0038] 2(a) is a diagram showing the radiation imaging device as viewed from the radiation incident side when radiation passes through the incident surface, and FIG. 2(b) is a diagram showing the AA cross section of the radiation imaging device.

[0039] 2(a), when viewed from the radiation incident side, the area of ​​the base 110 is larger than that of the sensor panel 101, and the area of ​​the heat insulating member 161 is larger than that of the base 110. In other words, when viewed from the radiation incident side, the heat insulating member 161 has a dimension (positional relationship) that causes it to protrude beyond the edge of the base 110. This makes it possible to prevent the cable 180 from coming into contact with the edge of the base 110 and being damaged by this, by making the heat insulating member 161 wider than the base 110.

[0040] As shown in FIG. 2(b), when viewed from the AA cross section, the heat insulating members 160 and 161 are in close contact with each other and sandwich the cable 180. That is, in the area where the cable 180 is not located between them, the heat insulating members 160 and 161 are in direct contact with each other. In this way, by arranging the heat insulating members 160 and 161 without any gaps in a specific cross section, the internal space of the housing 150 can be divided into a space on the incident surface 150a side and a space on the rear surface 150b side. In other words, the internal space of the housing 150 has a space on the incident surface 150a side and a space on the rear surface 150b side, with the position where the heat insulating members 160 and 161 sandwich the cable 180 between them.

[0041] As shown in FIG. 2(b), the heat insulating member 161 has holes (openings) for passing the support posts 111 through. If the heat insulating member 161 is made of an elastic material, the holes for passing the support posts 111 should be smaller than the support posts. By passing the support posts 111 through these holes, the holes fit the shape of the support posts, enabling insulation without gaps. Double-sided tape or an adhesive layer may be provided on the surface of the heat insulating member 161 that comes into contact with the base. This configuration makes it less likely that the heat insulating member 161 will be misaligned when installed on the base 110. In addition, by using the holes in the heat insulating member 161 and the support posts 111 as positioning indicators, the heat insulating member 161 can be positioned accurately in the planar direction (the x-direction, a direction perpendicular to the incident direction of radiation).

[0042] 2(b), the heat insulating member 160 is shown as one member, but a different configuration may be adopted. For example, the heat insulating member 160 may be configured with a total of four members, with a member disposed on each of the four sides that correspond to the inner wall when viewed from the radiation incident side. Alternatively, the heat insulating member 160 may be configured with a number of multiple members other than the above.

[0043] To improve the heat insulating effect, it is desirable to make the heat insulating members 160, 161 adhere to each other appropriately. Therefore, in a configuration in which foam material is used for the heat insulating members 160, 161, it is desirable that the heat insulating members 160, 161 are crushed (compressed) upon contact. For example, it is desirable that the volume after contact is crushed by 5% or more compared to the volume before contact. Furthermore, in order to improve adhesion, the contact surfaces of the heat insulating members 160, 161 may be processed to reduce unevenness or coated.

[0044] [Easy to assemble] 3 is a schematic diagram showing the state when assembling the housing. As described above, heat insulating member 161 is provided on the base 110 side, while heat insulating member 160 is provided on the housing side. Therefore, as shown on the left side of FIG. 3, before assembling housing 150, heat insulating members 160 and 161 are not in close contact, and the internal space of housing 150 is not partitioned. Thereafter, as shown on the right side of FIG. 3, when upper cover 151 and lower cover 152 are fastened and housing 150 is assembled, heat insulating members 160 and 161 are in close contact. Therefore, the internal space of housing 150 can be partitioned without the need to pass cable 180 through a hole in the heat insulating member.

[0045] In FIG. 3, the heat insulating members 160 and 161 are provided with a tapered shape (chamfered, R) in order to control deformation of the cable 180 during assembly. This configuration allows the cable 180 to deform naturally. It also prevents the heat insulating members 160 and 161 from deforming in an unintended direction due to friction between them. It prevents the lower surface of the heat insulating member 160 from climbing up onto the upper surface of the heat insulating member 161. It prevents unintended stress from being applied to the cable 180 or the joint between the cable 180 and the sensor panel 101. That is, it improves the ease of assembly of the housing 150. Here, it is preferable from the viewpoint of ease of assembly to process the contact surfaces of the heat insulating members 160 and 161 to reduce friction.

[0046] In Fig. 3, heat insulating member 160 is attached to the inner wall of the upper cover. This is because this configuration is preferable from the viewpoint of ease of assembly in a configuration in which base 130, support column 111, and base 110 are fixed to lower cover 152. However, heat insulating member 160 may be attached to lower cover 152 as long as the method of fixing base 110 is devised so that assembly is acceptable. Alternatively, heat insulating member 160 may not be attached to housing 150, and the step of abutting heat insulating member 161 against heat insulating member 160 and the step of fastening upper cover 151 and lower cover 152 may be separate steps.

[0047] [effect] As described above, the internal space of housing 150 is divided into a space on the incident surface side and a space on the back surface side by insulating members 160 and 161 sandwiching cable 180. This suppresses thermal convection and makes it possible to suppress a temperature rise in sensor panel 101.

[0048] Example 2 Next, a second embodiment will be described. In the first embodiment, a simple structure of the heat insulating member 160 and the heat insulating member 161 is described. In the second embodiment, a complex structure of the heat insulating member 160 and the heat insulating member 161 is described. The configuration appearing in the second embodiment is substantially the same as that of the first embodiment, except for the configuration that characterizes the second embodiment. Therefore, the same reference numerals are used for the substantially similar configuration, and detailed description thereof will be omitted.

[0049] Fig. 4 is a cross-sectional view showing an example of the internal configuration of a radiation imaging device from the side. Fig. 5(a) is a view showing the radiation imaging device as viewed from the radiation incident side with radiation transmitted through the incident surface. Fig. 5(b) is a view showing the AA cross section of the radiation imaging device.

[0050] In FIG. 4, a cable 180 is connected to the left side of the sensor panel 101, and no cable 180 is connected to the right side of the sensor panel 101. The number of cables 180 connected to the sensor panel 101 depends on the number of wires in the sensor panel 101, so this type of structure is conceivable. In areas where no cable 180 is provided, the internal space of the housing 150 can be partitioned without the need to tightly attach the heat insulating member 160 and the heat insulating member 161. Therefore, in FIG. 4, the heat insulating member 161 is extended to the right and abuts against the side wall 150c, thereby partitioning the internal space of the housing 150. As shown in FIG. 5(a), on the right side of the four outer periphery sides of the sensor panel 101, the heat insulating member 161 abuts against at least a partial region (a predetermined region) of the side wall 150c (one or both of the upper cover 151 and the lower cover 152) that faces this side. The heat insulating member 160 is not disposed in this region. In FIG. 5(a), the heat insulating member 160 is not arranged on only one side, but the heat insulating member 160 may not be arranged on multiple sides.

[0051] Fig. 6 is a schematic diagram showing the state when assembling the housing. As shown on the left side of Fig. 6, heat insulating member 161 is in contact with lower cover 152. Thereafter, as shown on the right side of Fig. 6, upper cover 151 and lower cover 152 are fastened together to assemble housing 150, and as a result, the upper cover comes into contact with heat insulating member 161. Therefore, the internal space of housing 150 can be partitioned without the need to pass cable 180 through a hole in the heat insulating member.

[0052] 5(b), the heat insulating members 160 and 161 have a complex shape. Specifically, on the upper side of the four sides of the outer periphery of the sensor panel 101, the heat insulating member 161 has protrusions (convex portions) that come into contact with each of the multiple cables 180. The protrusions of the heat insulating member 160 are provided so as to fit into recesses between the protrusions of the heat insulating member 161. While this configuration is used on one side in FIG. 5(b), this configuration may also be used on multiple side sides.

[0053] On the lower side of the four sides of the periphery of the sensor panel 101, the heat insulating member 161 has one protrusion (convex portion) for every two cables of the plurality of cables 180. The protrusions of the heat insulating member 160 are provided so as to fit into the recesses between the protrusions of the heat insulating member 161. In FIG. 5(b), such a configuration is used on one side, but such a configuration may also be used on multiple sides.

[0054] On the left side of the four outer periphery sides of the sensor panel 101, the heat insulating member 161 has a protrusion that abuts against one of the cables 180, and one protrusion (convex portion) provided for every two cables. The protrusions of the heat insulating member 160 are provided so as to fit into the recesses between the protrusions of the heat insulating member 161. In FIG. 5(b), this configuration is used on one side, but this configuration may also be used on multiple sides.

[0055] [effect] As described above, by devising the shapes and arrangements of the heat insulating members 160 and 161, a further heat insulating effect can be expected.

[0056] (Other Examples) The present invention is not limited to the above-described embodiments, and various modifications (including organic combinations of the embodiments) are possible based on the spirit of the present invention, and are not excluded from the scope of the present invention. In other words, all configurations that combine the above-described embodiments and their modifications are included in the present invention.

[0057] In the first and second embodiments, the heat insulating member 161 is described as being separate from the base 110 and having a simple cross section in the thickness direction (z direction). However, the structure of the heat insulating member 161 is not limited to this. FIG. 7 is a cross-sectional side view of an example of the internal structure of the radiation imaging device. As shown in FIG. 7, the heat insulating member 161 may be configured to separate from the base 110, forming a gap 1612. By adopting such a structure, a further heat insulating effect can be expected. Alternatively, a separate member (e.g., a member with high X-ray shielding properties, such as Pb) may be provided instead of the gap 1612. Furthermore, the heat insulating member 161 may have a side wall portion 1611 that contacts the side surface of the base 110. By adopting such a structure, it is possible to further prevent damage to the cable 180 due to contact between the cable 180 and the edge of the base 110.

[0058] In the first and second embodiments, the heat insulating member 161 is provided on the second surface side of the base 110. However, the structure of the heat insulating member 161 is not limited to this. FIG. 8 is a cross-sectional side view of an example of the internal configuration of a radiation imaging device. As shown in FIG. 8, the heat insulating member 161 may be provided between the side surface of the base 110 and the cable 180. Such a structure can contribute to reducing the thickness of the radiation imaging device 100. When such a structure is adopted, it is preferable that the base 110 has a composite layer structure including a heat insulating layer. In addition, when a composite layer structure is used, the mounting board 190 may be directly fixed to the base 110. Furthermore, the housing 150 may be configured as a three-part structure including an upper cover 153, a lower cover 154, and a side wall frame 155 (side wall member) instead of being configured as a two-part structure including an upper cover 151 and a lower cover 152. Such a configuration allows for a more flexible assembly method when closely attaching the heat insulating members 160 and 161. Furthermore, the base 110 may be fixed to the lower cover 154 by the support 111. In the first embodiment, the mounting board 190 is disposed between the base 110 and the base 130. However, the mounting board 190 may be disposed between the base 130 and the lower cover 154 and attached to the lower cover 154.

[0059] [Note] The disclosure of this embodiment includes the following configuration.

[0060] [Appendix 1] a sensor panel for detecting radiation; a cable connected to the sensor panel; a substrate connected to the sensor panel via the cable; A plurality of separate heat insulating members including a first heat insulating member and a second heat insulating member; a housing that houses the sensor panel, the cable, the substrate, and the plurality of heat insulating members, the housing including an incident surface through which radiation is incident on the sensor panel, a back surface located on the opposite side to the incident surface, and a side wall connecting the incident surface and the back surface; the first heat insulating member is provided between the sensor panel and the substrate, the second insulating member is provided between the cable and the side wall, A radiation imaging device characterized in that the internal space of the housing has a space on the side of the incident surface and a space on the side of the back surface, with the position where the first insulating member and the second insulating member sandwich the cable between them.

[0061] [Appendix 2] a support base that supports the sensor panel on a first surface; The radiation imaging device described in Appendix 1, characterized in that the first heat insulating member is arranged on the side of a second surface of the support base, which is located opposite the first surface.

[0062] [Appendix 3] 3. The radiation imaging device according to claim 2, wherein when viewed from the radiation incident side, a portion of the first heat insulating member is positioned so as to protrude from the outer periphery of the support base.

[0063] [Appendix 4] 4. The radiation imaging device according to claim 2, wherein the first heat insulating member has a portion that contacts a side surface of the support base.

[0064] [Appendix 5] The support base is provided with a support for fixing the substrate, 5. The radiation imaging device according to claim 2, wherein the first heat insulating member has an opening for passing the support pillar therethrough.

[0065] [Appendix 6] The radiation imaging device described in any one of Appendixes 2 to 5, characterized in that the first insulating member is positioned at a distance from the second surface of the support base so as to form a gap between the first insulating member and the support base.

[0066] [Appendix 7] a support base that supports the sensor panel on a first surface; 7. The radiation imaging device according to claim 2, wherein the first heat insulating member is disposed on a side surface of the support base.

[0067] [Appendix 8] 8. The radiation imaging device according to claim 2, wherein the support base has a composite layer structure including a heat insulating layer.

[0068] [Appendix 9] 9. The radiation imaging device according to claim 1, wherein the first heat insulating member and the second heat insulating member are made of a resin or a foamable resin.

[0069] [Appendix 10] The radiation imaging device described in any one of appendixes 1 to 9, wherein the first heat insulating member and the second heat insulating member are compressed by sandwiching the cable therebetween.

[0070] [Appendix 11] The cable is a flexible substrate equipped with an IC chip, A radiation imaging device described in any one of Appendices 1 to 10, characterized in that when the first insulating member and the second insulating member sandwich the cable, the IC chip is located in the space on the back side.

[0071] [Appendix 12] a further cable connected to the sensor panel; A radiation imaging device described in any one of Appendixes 1 to 11, characterized in that in the area located between the cable and the further cable, a portion of the first insulating member abuts a portion of the second insulating member.

[0072] [Appendix 13] a plurality of cables including the cable; A radiation imaging device described in any one of Appendices 1 to 12, characterized in that at least a portion of the second insulating member has a convex portion located between adjacent cables of the multiple cables, and the convex portion fits into a concave portion of the first insulating member.

[0073] [Appendix 14] the housing has a front surface member having the incident surface and a rear surface member having the rear surface, 14. The radiation imaging device according to any one of claims 1 to 13, wherein the second heat insulating member is in contact with both the front member and the rear member.

[0074] [Appendix 15] the housing has a front surface member having the incident surface and a rear surface member having the rear surface, 15. The radiation imaging device according to any one of claims 1 to 14, wherein the second heat insulating member is joined to either the front member or the rear member.

[0075] [Appendix 16] the housing includes a front member having the incident surface, a rear member having the rear surface, and a sidewall member connecting the front member and the rear member, 16. The radiation imaging device according to any one of claims 1 to 15, wherein the second heat insulating member is joined to the side wall member.

[0076] [Appendix 17] a plurality of cables including the cable; 17. The radiation imaging device of claim 1, wherein when the outer periphery of the sensor panel viewed from the radiation incident side is viewed as a quadrilateral, the sensor panel has a first side to which one of the plurality of cables is connected and a second side to which none of the plurality of cables is connected.

[0077] [Appendix 18] A radiation imaging device described in any one of Appendices 1 to 17, characterized in that the second insulating member is provided on the side of the first side and the second insulating member is not provided on the side of the second side.

[0078] [Appendix 19] 19. The radiation imaging device according to claim 18, wherein the first heat insulating member abuts against a predetermined region of the side wall opposite the second side.

[0079] [Appendix 20] A radiation imaging device according to any one of Supplementary Notes 1 to 19; a signal processing unit that processes signals obtained by the radiation imaging device; A radiation imaging system comprising:

[0080] [Appendix 21] 1. A method for manufacturing a radiation imaging device having a sensor panel that detects radiation, a cable connected to the sensor panel, a substrate connected to the sensor panel via the cable, a plurality of heat insulating members formed as separate bodies including a first heat insulating member and a second heat insulating member, and a housing that houses the sensor panel, the cable, the substrate, and the plurality of heat insulating members, the housing having an incident surface through which radiation is incident on the sensor panel, a back surface located opposite to the incident surface, and a side wall connecting the incident surface and the back surface, providing the first heat insulating member between the sensor panel and the substrate; providing the second insulating member between the cable and the side wall; sandwiching the cable between the first heat insulating member and the second heat insulating member so that an internal space of the housing defines a space on the side of the incident surface and a space on the side of the back surface; A manufacturing method comprising the steps of: [Explanation of symbols]

[0081] 100 Radiation imaging device 101 Sensor Panel 110 Support base 111 Post 130 Foundation 150 cabinets 160 Heat insulating member (first heat insulating member) 161 Heat insulating member (second heat insulating member) 180 Cable 190 Mounting Board

Claims

1. a sensor panel for detecting radiation; a cable connected to the sensor panel; a substrate connected to the sensor panel via the cable; a plurality of separate heat insulating members including a first heat insulating member and a second heat insulating member; a housing that houses the sensor panel, the cable, the substrate, and the plurality of heat insulating members, the housing including an incident surface through which radiation is incident on the sensor panel, a back surface located on the opposite side to the incident surface, and a side wall connecting the incident surface and the back surface; the first heat insulating member is provided between the sensor panel and the substrate, the second insulating member is provided between the cable and the side wall, A radiation imaging device characterized in that the internal space of the housing has a space on the side of the incident surface and a space on the side of the back surface, with the position where the first insulating member and the second insulating member sandwich the cable between them.

2. a support base that supports the sensor panel on a first surface; 2. The radiation imaging apparatus according to claim 1, wherein the first heat insulating member is disposed on a second surface side of the support base that is located opposite to the first surface.

3. 3. The radiation imaging apparatus according to claim 2, wherein a part of the first heat insulating member protrudes from the outer periphery of the support base when viewed from the radiation incident side.

4. 3. The radiation imaging apparatus according to claim 2, wherein the first heat insulating member has a portion that contacts a side surface of the support base.

5. The support base is provided with a support for fixing the substrate, 3. The radiation imaging apparatus according to claim 2, wherein the first heat insulating member has an opening for passing the support column therethrough.

6. 3. The radiation imaging apparatus according to claim 2, wherein the first heat insulating member is disposed at a position spaced apart from the second surface of the support base so as to form a gap between the first heat insulating member and the support base.

7. a support base that supports the sensor panel on a first surface; 3. The radiation imaging apparatus according to claim 2, wherein the first heat insulating member is disposed on a side surface of the support base.

8. 3. The radiation imaging apparatus according to claim 2, wherein the support base has a composite layer structure including a heat insulating layer.

9. 2. The radiation imaging apparatus according to claim 1, wherein the first heat insulating member and the second heat insulating member are made of a resin or a foam resin.

10. 2. The radiation imaging apparatus according to claim 1, wherein the first heat insulating member and the second heat insulating member are compressed by sandwiching the cable therebetween.

11. The cable is a flexible substrate equipped with an IC chip, 2. The radiation imaging apparatus according to claim 1, wherein the IC chip is located in a space on the rear side when the cable is sandwiched between the first heat insulating member and the second heat insulating member.

12. a further cable connected to the sensor panel; 2. The radiation imaging apparatus according to claim 1, wherein a portion of the first heat insulating member abuts a portion of the second heat insulating member in a region located between the cable and the further cable.

13. a plurality of cables including the cable; 2. The radiation imaging device according to claim 1, wherein at least a portion of the second insulating member has a convex portion positioned between adjacent cables of the plurality of cables, and the convex portion fits into a concave portion of the first insulating member.

14. the housing has a front surface member having the incident surface and a rear surface member having the rear surface, 2. The radiation imaging apparatus according to claim 1, wherein the second heat insulating member is in contact with both the front member and the rear member.

15. the housing has a front surface member having the incident surface and a rear surface member having the rear surface, 2. The radiation imaging apparatus according to claim 1, wherein the second heat insulating member is bonded to either the front member or the rear member.

16. the housing includes a front member having the incident surface, a rear member having the rear surface, and a sidewall member connecting the front member and the rear member, 2. The radiation imaging apparatus according to claim 1, wherein the second heat insulating member is joined to the side wall member.

17. a plurality of cables including the cable; 2. The radiation imaging device according to claim 1, wherein when the outer periphery of the sensor panel viewed from the radiation incident side is regarded as a quadrilateral, the sensor panel has a first side to which one of the plurality of cables is connected and a second side to which none of the plurality of cables is connected.

18. 2. The radiation imaging apparatus according to claim 1, wherein the second heat insulating member is provided on the first side, and the second heat insulating member is not provided on the second side.

19. 19. The radiation imaging apparatus according to claim 18, wherein the first heat insulating member abuts against a predetermined region of the side wall opposite the second side.

20. A radiation imaging device according to any one of claims 1 to 19; a signal processing unit that processes signals obtained by the radiation imaging device; A radiation imaging system comprising:

21. a housing that houses the sensor panel, the cable, the substrate, and the plurality of heat insulating members, the housing having an incident surface through which radiation is incident on the sensor panel, a back surface located opposite to the incident surface, and a side wall connecting the incident surface and the back surface, the method comprising: providing the first heat insulating member between the sensor panel and the substrate; providing the second insulating member between the cable and the side wall; sandwiching the cable between the first heat insulating member and the second heat insulating member so that an internal space of the housing defines a space on the side of the incident surface and a space on the side of the back surface; A manufacturing method comprising the steps of:

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