Photovoltaic generator and manufacturing method thereof

Abstract

To seal a photoelectric conversion element while shielding the photoelectric conversion element from the external environment, thereby preventing power generation efficiency from deteriorating in a short period due to the effects of moisture, oxygen and the like existing in the air.SOLUTION: A photovoltaic generator includes: a photoelectric conversion module 2 including a photoelectric conversion element 4 and power extraction conductors 5, 6; and an encapsulated panel 3 in which the photoelectric conversion module is encapsulated while the power extraction conductors are drawn outward. The encapsulated panel comprises a pair of synthetic resin panel covers 21, 22 which house the photoelectric conversion element, the panel covers being superimposed and bonded to each other to be integrated. At least one of the pair of panel covers which faces the surface, of the photoelectric conversion element, where light for power generation is incident is formed of a light-transmitting synthetic resin material. The pair of panel covers is heat-welded and integrated while an intermediate member 26 for laser beam bonding is interposed between coupling faces where the panel covers are superimposed and bonded to each other.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a photovoltaic device in which a photoelectric conversion element is encapsulated in an encapsulation panel, and a method for manufacturing the same. [Background technology]

[0002] 2. Description of the Related Art Various photovoltaic power generation devices using a photoelectric conversion element that converts light energy directly into electrical energy by utilizing the photoelectric effect have been proposed and put to practical use.

[0003] Photovoltaic power generation devices of this type that use silicon-based power generation elements or photoelectric conversion elements using gallium arsenide have been put to practical use. Furthermore, in recent years, perovskite-type photovoltaic power generation devices have been proposed that use photoelectric conversion elements with a perovskite crystal structure that have improved photoelectric conversion efficiency compared to the above-mentioned power generation elements.

[0004] Various photoelectric conversion elements, particularly perovskite-type photoelectric conversion elements, that make up photovoltaic devices that generate electricity using sunlight are affected by moisture and oxygen present in the air, causing their power generation efficiency to deteriorate in a short period of time.

[0005] Therefore, in order to improve the durability of photovoltaic devices and extend their lifespan, techniques have been proposed for protecting photovoltaic conversion elements from the external environment.

[0006] As a technology for protecting a photoelectric conversion element from the external environment, a sealed element housing that houses the photoelectric conversion element is sealed with a sealing layer (Patent Document 1).

[0007] Furthermore, a photovoltaic device using a perovskite-type photoelectric conversion element has been proposed in which the photoelectric conversion element placed on a support is covered with an adhesive layer, and the adhesive layer is further covered with a sealant layer (Patent Document 2). [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Publication No. 2022-073832 [Patent Document 2] Japanese Patent Publication No. 2023-067523 Summary of the Invention [Problem to be solved by the invention]

[0009] The technical objective of the present invention is to provide a photovoltaic device and a method for manufacturing the same that more reliably isolates the photoelectric conversion element from the external environment and prevents the power generation efficiency from deteriorating in a short period of time due to the influence of moisture, oxygen, etc. present in the air.

[0010] Furthermore, the technical objective of the present invention is to provide a photovoltaic device and a manufacturing method thereof that suppresses the effects of the means for encapsulating the photovoltaic conversion element in the encapsulation panel, suppresses deterioration in the power generation efficiency of the photovoltaic conversion element, and achieves an even longer lifespan.

[0011] Furthermore, the technical objective of the present invention is to provide a photovoltaic device and a manufacturing method thereof that prevents deterioration of the power draw conductor derived from the photovoltaic conversion element, encapsulates the photovoltaic conversion element in an encapsulation panel, and achieves an even longer lifespan. [Means for solving the problem]

[0012] The means proposed to solve the technical problems described above is a photovoltaic power generation device comprising a photovoltaic conversion module having a photovoltaic conversion element and a power drawing conductor derived from the photovoltaic conversion element, and an encapsulating panel that encapsulates the photovoltaic conversion module with the power drawing conductor drawn outward, wherein the encapsulating panel comprises a pair of panel covers made of synthetic resin that house the photovoltaic conversion element and are overlapped and joined together to form an integrated unit.

[0013] At least one of the pair of panel covers, which is disposed opposite the light incident surface of the photoelectric conversion element for generating power, is made of a light-transmitting synthetic resin material, and is joined and integrated by thermal welding with a laser beam joining intermediate member interposed between the joined surfaces where the pair of panel covers are joined together. In this case, the power lead-out conductor is drawn out to the outside of the encapsulated panel from between the joined surfaces of the pair of panel covers.

[0014] In the photovoltaic device, one panel cover is provided with an element housing portion for housing the photoelectric conversion element of the photoelectric conversion module.

[0015] It is also preferable that an intermediate member for laser beam joining be attached to the surface of the power lead conductor that faces the overlapping joining surface of the pair of panel covers.

[0016] The power lead conductor may be bonded to the laser beam bonding intermediate member via a metal adhesive.

[0017] Furthermore, the intermediate member for laser beam bonding may have an adhesive layer on one or both sides of the base material.

[0018] Furthermore, it is desirable that one or more of an inert gas, an oxygen scavenger, and a steam scavenger be disposed inside the enclosure panel.

[0019] In addition, the encapsulated panel encapsulates a photoelectric conversion module having a translucent surface on either one or both opposing sides of the photoelectric conversion element, and one or both of the pair of panel covers constituting the encapsulated panel can be formed from a synthetic resin material having optical transparency.

[0020] Furthermore, the technology proposed here is a method for manufacturing a photovoltaic device that includes a photovoltaic module having a photovoltaic element and a power lead-out conductor led out from the photovoltaic element, and that is encapsulated in an encapsulation panel with the power lead-out conductor of the photovoltaic module led outward, wherein a laser beam joining intermediate member is interposed between overlapping and joining surfaces of a pair of panel covers that are overlapping and joined to form the encapsulation panel, and the photovoltaic module is installed on the other panel cover of the pair of panel covers with the power lead-out conductor led outward, and then the photovoltaic module is encapsulated on the other panel cover. and then irradiating a laser beam onto the overlapping bonding surfaces of the pair of panel covers that are overlapped with the laser beam bonding intermediate member interposed therebetween to heat the laser beam bonding intermediate member, thereby heating and melting the overlapping bonding surfaces of the pair of panel covers that are in contact with the heated area of ​​the laser beam bonding intermediate member to thermally weld the pair of panel covers, thereby integrating the pair of panel covers and producing an enclosed panel that encapsulates the photoelectric conversion module.

[0021] In addition, a metal adhesive may be applied to the joining surface of the power draw conductor with the laser light joining intermediate member, and the power draw conductor may be joined to the laser light joining intermediate member via the metal adhesive.

[0022] Furthermore, a metal adhesive is applied to both sides of the power lead conductor. Then, auxiliary pieces of a laser light joining intermediate member having a width equal to that of the power lead conductor and a length equal to that of the laser light joining intermediate member and made of the same material as the laser light joining intermediate member are bonded to both sides of the power lead conductor via the metal adhesive. Then, the auxiliary pieces may be heated to melt a portion of the panel cover, thereby joining the panel cover and the power lead conductor. [Effects of the Invention]

[0023] The present invention protects a photovoltaic conversion module from the external environment, prevents the power generation efficiency from deteriorating in a short period of time, and extends the life of the device.

[0024] Furthermore, the present invention prevents the photoelectric conversion element from being deteriorated by the means for encapsulating the photoelectric conversion module, thereby protecting the photoelectric conversion element and realizing a longer life for the photovoltaic device.

[0025] Furthermore, the present invention makes it possible to generate photovoltaic power with fewer restrictions on installation locations.

[0026] Other advantages of the present invention will become more apparent from the embodiments described below. [Brief explanation of the drawings]

[0027] [Figure 1] 1 is a perspective view showing the appearance of a photovoltaic device according to an embodiment of the present invention; [Figure 2] 1 is an exploded perspective view of a photovoltaic device according to an embodiment of the present invention. [Figure 3] 1 is a cross-sectional view of a photoelectric conversion element constituting a photoelectric conversion module used in a photovoltaic device according to an embodiment of the present invention. [Figure 4] FIG. 2 is a cross-sectional view showing a power generation layer of a photoelectric conversion element. [Figure 5] 10 is a perspective view showing the inner surface side of the other panel cover that constitutes the encapsulation panel, covering the photoelectric conversion module. FIG. [Figure 6] FIG. 10 is a perspective view showing a state in which a photoelectric conversion module is installed on one panel cover. [Figure 7] FIG. 2 is a perspective view showing a state in which a pair of panel covers are overlapped. [Figure 8] 10 is a cross-sectional view of a power lead conductor in which a metal adhesive is applied to an area where an intermediate member for laser light bonding and an auxiliary piece of the power lead conductor are bonded. FIG. [Figure 9] 10 is a side view showing a state in which a pair of overlapping panel covers are irradiated with laser light to melt and bond them together. FIG. [Figure 10]1 is a cross-sectional view of an encapsulation panel showing the coupling between a pair of power lead-out conductors and a pair of panel covers. [Figure 11] FIG. 10 is a cross-sectional view showing another example of an intermediate member for laser beam bonding. [Figure 12] 10 is a plan view of a power lead conductor to which an auxiliary piece of an intermediate member for laser light bonding is attached via a metal adhesive. FIG. [Figure 13] 10 is a cross-sectional view of a power lead conductor to which an auxiliary piece of an intermediate member for laser light bonding is attached via a metal adhesive. FIG. [Figure 14] FIG. 10 is a perspective view showing another example of an intermediate member for laser beam bonding. [Figure 15] 15 is a perspective view showing a state in which a photoelectric conversion module is placed on the other panel cover on which the separated laser beam bonding intermediate member shown in FIG. 14 is placed. FIG. [Figure 16] FIG. 10 is a cross-sectional view showing an example in which an inert gas, an oxygen scavenger and / or a desteamer is disposed inside the encapsulation panel. DETAILED DESCRIPTION OF THE INVENTION

[0028] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0029] As shown in FIG. 1, a photovoltaic device 1 according to this embodiment includes a photovoltaic conversion module 2 that converts light energy into electrical energy by the photovoltaic effect, and an encapsulation panel 3 that encapsulates this photovoltaic conversion module 2.

[0030] As shown in Fig. 2, the photoelectric conversion module 2 used in this embodiment includes a photoelectric conversion element 4 and a pair of power extraction conductors 5 and 6 extending from the photoelectric conversion element 4. As shown in Fig. 3, the photoelectric conversion element 4 constituting the photoelectric conversion module 2 is configured by stacking a translucent conductive layer 8 and an electrode 9 with a power generation layer 7 sandwiched between them. The photoelectric conversion element 4 is supported by a support substrate 10, with the translucent conductive layer 8 side serving as the support surface.

[0031] The power generation layer 7 constituting the photoelectric conversion element 4 of this embodiment is a layer that causes photoelectric conversion when irradiated with light, generating electrons and holes from excitons generated by absorbing light. As shown in Figure 4, the power generation layer 7 includes a hole transport layer 11, a photoelectric conversion layer 12, and an electron transport layer 13. The hole transport layer 11, the photoelectric conversion layer 12, and the electron transport layer 13 are stacked in this order along the direction from the translucent conductive layer 8 toward the electrode 9.

[0032] The hole transport layer 11 constituting the power generation layer 7 extracts holes generated in the photoelectric conversion layer 12 to the translucent conductive layer 8, and prevents electrons generated in the photoelectric conversion layer 12 from moving to the translucent conductive layer 8. The hole transport layer 11 is formed of a metal oxide. Examples of metal oxides include titanium oxide, molybdenum oxide, vanadium oxide, zinc oxide, nickel oxide, lithium oxide, calcium oxide, cesium oxide, and aluminum oxide.

[0033] The photoelectric conversion layer 12 is a layer that converts absorbed light into electricity, and in this embodiment, a perovskite compound is used. The photoelectric conversion layer 12 containing a perovskite compound has the advantage that the power generation efficiency has a relatively low dependency on the angle of incident light. This allows for higher power generation efficiency to be obtained in this embodiment. Here, the perovskite compound includes a perovskite crystal structure and a structure having a crystal similar thereto.

[0034] The electron transport layer 13 extracts electrons generated in the photoelectric conversion layer 12 to the electrode 9 and prevents holes generated in the photoelectric conversion layer 12 from moving to the electrode 9. The electron transport layer 13 preferably contains, for example, either a halogen compound or a metal oxide. The electrode 9 is conductive and functions as an anode. The electrode 9 extracts electrons from the photoelectric conversion layer 12 in response to photoelectric conversion occurring in the photoelectric conversion layer 12. The electrode 9 is formed of platinum, gold, silver, copper, aluminum, rhodium, indium, titanium, nickel, tin, zinc, an alloy containing any of these, or the like.

[0035] When the photoelectric conversion element 4 used in this embodiment is irradiated with light, the photoelectric conversion layer 12 of the power generation layer 7 absorbs the light and performs photoelectric conversion, generating electrons and holes in the photoelectric conversion layer 12. The electrons are extracted via the electron transport layer 13 to the electrode 9 functioning as an anode, and the holes are extracted via the hole transport layer 11 to the translucent conductive layer 8 functioning as a cathode.

[0036] In this embodiment, current is extracted from the power extraction conductors 5 and 6 connected to the electrode 9 and the translucent conductive layer 8, respectively. That is, power is generated.

[0037] The photoelectric conversion module 2 used in this embodiment is configured as a single-sided type in which power is generated by light incident on one surface of the photoelectric conversion element 4.

[0038] The photoelectric conversion module 2 having the above-described configuration is encapsulated in an encapsulation panel 3, as shown in FIG.

[0039] As shown in Fig. 2, the encapsulation panel 3 includes a pair of panel covers 21 and 22 that are overlapped and joined together. The pair of panel covers 21 and 22 are formed to be the same size and have matching peripheral shapes. One panel cover 21 is overlapped on the other panel cover 22, covering the placed photovoltaic conversion module 2. The overlapped pair of panel covers 21 and 22 are joined together by heat welding their overlapping joining surfaces.

[0040] In this embodiment, the other panel cover 22, which is located on the lower side in FIG. 2 and on which one panel cover 21 is superimposed, is formed in a flat plate shape.

[0041] 2 and 5, one panel cover 21 that is placed on the other panel cover 22 has a photoelectric conversion element storage recess 23 formed in the center thereof in which the photoelectric conversion element 4 of the photoelectric conversion module 2 is stored. Furthermore, one panel cover 22 has conductor lead-out recesses 24, 25 formed in series with the photoelectric conversion element storage recess 23, through which the power lead-out conductors 5, 6 extend, as shown in Figs. 2 and 5. These conductor lead-out recesses 24, 25 are formed from the photoelectric conversion element storage recess 23 to the outer periphery of one longitudinal side of the one panel cover 21.

[0042] 6, the photovoltaic conversion module 2 enclosed in the encapsulation panel 3 formed by overlapping and joining a pair of panel covers 21, 22 is placed on the other panel cover 22, with the photovoltaic conversion element 4 positioned in a photovoltaic element storage recess 23 formed in one panel cover 21, and the power lead-out conductors 5, 6 extending into conductor lead-out recesses 24, 25 formed in one panel cover 21. At this time, the pair of power lead-out conductors 5, 6 overlap each other and protrude outward from between the pair of panel covers 21, 22.

[0043] In this embodiment, at least one panel cover 21, which is arranged on the side of the photovoltaic conversion module 2 enclosed in the encapsulated panel 3 on which light for power generation is incident, is formed from a synthetic resin material that transmits at least 30% of light with a wavelength of at least 300 to 1200 nm, including sunlight with a wavelength sufficient for the photovoltaic conversion element 4 using a perovskite compound to generate power, and further, is formed from a synthetic resin material that allows light transmission that transmits at least 30% of laser light with a wavelength of 800 nm to 1500 nm, which is used to thermally weld the pair of panel covers 21, 22.

[0044] Examples of this type of synthetic resin material that can be used include polycarbonate (PC), polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), copolymer polyester (PETG), polyvinyl chloride (PVC), cyclic olefin polymer (COC, COP), polyethylene (PE), polyvinylidene chloride (PVDC), ionomer resin (IO), transparent polypropylene (PP), fluorinated ethylene propylene copolymer (FEP), styrene-methyl methacrylate (SMMA), styrene-acrylonitrile resin (SAN), general-purpose polystyrene (GPPS), transparent ABS (MABS), and polymethylpentene (PMP).

[0045] In this embodiment, one panel cover 21 is formed using a plate-like member made of polycarbonate resin with a thickness of 0.5 mm that transmits 70 to 90% of light in the wavelength range of 300 to 1500 nm, including the visible light range. Note that the thickness of one panel cover 21 can be appropriately selected from the viewpoint of maintaining mechanical strength, as long as it transmits 70 to 90% of light in the wavelength range of 300 to 1500 nm.

[0046] The other panel cover 22 is made of a synthetic resin material that has good compatibility with the one panel cover 21 for joining.

[0047] In this embodiment, the other panel cover 22 is also made of polycarbonate resin having the same optical transparency as the one panel cover 21.

[0048] In addition, the other panel cover 22 may be made of the same type of polycarbonate resin that has good bonding compatibility with the one panel cover 21 made of polycarbonate resin, or it may be made of any of the synthetic resins such as ABS, acrylic resin, or PVC.

[0049] Furthermore, like the one panel cover 21, it is desirable that the other panel cover 22 be formed from a plate-like material of an appropriate thickness to maintain mechanical strength, and in this embodiment it is formed using a plate material made of polycarbonate resin having a thickness of 0.5 mm.

[0050] 2, a laser beam joining intermediate member 26 used for thermal welding between the pair of panel covers 21, 22 is disposed on the overlapping joining surface of the other panel cover 22 to which one panel cover 21 is overlapping and joined. The laser beam joining intermediate member 26 is disposed on overlapping and joining surface 22a which is overlapping and joined to overlapping and joining surface 21a of one panel cover 21, in an area which surrounds the entire periphery of the outer periphery of the photoelectric conversion element 4 placed on the other panel cover 22.

[0051] The laser beam joining intermediate member 26 used in this embodiment is formed from a film sheet that has a transmittance of 30% or less for laser light of 800 nm or more and 1500 nm or less, which is used to thermally weld the pair of panel covers 21, 22, and that absorbs the irradiated laser light and generates heat. This film sheet is colored with a black dye or black pigment and is formed by stretching polycarbonate resin that has a laser beam transmittance of 30% or less. The film sheet that constitutes this laser beam joining intermediate member 26 has a thickness of 0.1 to 0.5 mm. In this embodiment, the laser beam joining intermediate member 26 is formed from a film sheet with a thickness of 0.3 mm.

[0052] The intermediate member 26 for laser light bonding can be one whose base material is a film sheet made of a polymer material such as ABS, acrylic, or PVC that is compatible with bonding to the pair of upper and lower panel covers 21, 22 made of polycarbonate resin. The intermediate member 26 for laser light bonding using these film sheets is endowed with a light absorption function by controlling the transmittance of laser light of 800 nm or more and 1500 nm or less by mixing carbon black, graphite, ketchin black, or the like into the film sheet base material.

[0053] Then, the photoelectric conversion module 2 is placed on the other panel cover 22 on which the laser light bonding intermediate member 26 is disposed. As shown in Fig. 6, the photoelectric conversion module 2 is installed so that the photoelectric conversion element 4 is located in a photoelectric conversion element installation area 27 formed in the center surrounded by the laser light bonding intermediate member 26. At this time, the photoelectric conversion module 2 is installed so that the pair of power draw conductors 5, 6 extend over the laser light bonding intermediate member 26 and protrude outward from one side edge of one panel cover 21.

[0054] As shown in Fig. 7, one panel cover 21 is placed on the other panel cover 22 on which the photovoltaic conversion module 2 is placed so as to cover the photovoltaic conversion module 2. At this time, one panel cover 21 stores the photovoltaic conversion element 4 in a photovoltaic conversion element storage section 23 formed in the center, and is placed on the other panel cover 22. At this time, the power lead-out conductors 5 and 6 are positioned within the conductor lead-out recesses 24 and 25, and protrude outward from between the pair of panel covers 21 and 22 that are placed on top of each other, as shown in Fig. 7.

[0055] 2 and 6, it is desirable to attach an auxiliary piece 26a of the laser light joining intermediate member made of the same material as the laser light joining intermediate member 26 to at least the surface of the power lead conductors 5, 6 made of a conductive metal such as copper that faces one of the panel covers 21 and that does not come into contact with the laser light joining intermediate member 26. The metal power lead conductors 5, 6 can be well adhered to the synthetic resin panel covers 21, 22 via the laser light joining intermediate member 26 and the auxiliary piece 26a. The close contact of the power lead conductors 5, 6 makes it possible to seal the space between the pair of panel covers 21, 22.

[0056] In this embodiment, a metal adhesive 28 may be applied to the area of ​​the power draw conductors 5, 6 where the laser light joining intermediate member 26 and auxiliary piece 26a are joined, as shown in Fig. 8. The metal adhesive 28 used here bonds the power draw conductors 5, 6 made of a metal such as copper to the laser light joining intermediate member 26 made of a synthetic resin film sheet, and the auxiliary piece 26a, and Chemlok (trade name) or the like can be used, for example.

[0057] By applying the metal adhesive 28 to the power lead conductors 5, 6, it is possible to more reliably adhere the metal power lead conductors 5, 6 to the laser light joining intermediate member 26 and its auxiliary piece 26a, which are made of a synthetic resin film sheet as a base material, and to more reliably seal the pair of panel covers 21, 22 joined via the laser light joining intermediate member 26 and its auxiliary piece 26a.

[0058] As described above, the pair of panel covers 21, 22 that house the photovoltaic conversion module 2 and are stacked on top of each other are integrated by thermal welding of the stacked joining surfaces 21a, 22a with the laser light joining intermediate member 26 and its auxiliary piece 26a interposed therebetween, thereby forming the encapsulated panel 3 that encapsulates the photovoltaic conversion module 2. The encapsulated panel 3 that encapsulates the photovoltaic conversion module 2 constitutes the photovoltaic power generation device 1 that outputs electric power from the power draw conductors 5, 6.

[0059] The photovoltaic device 1 according to this embodiment configured as described above is assembled through the following steps.

[0060] First, as shown in FIG. 6, a frame-shaped intermediate member 26 for laser beam bonding is placed on the overlapping and joining surface 22a of the other panel cover 22 onto which one panel cover 21 is to be overlapped.

[0061] Next, as shown in Fig. 6, the photovoltaic conversion module 2 is placed on the other panel cover 22 with the photovoltaic conversion element 4 positioned within the photovoltaic conversion element installation area 27. At this time, the pair of power draw conductors 5, 6 extend so as to protrude outward from one of the long sides of the other panel cover 22.

[0062] Next, one panel cover 21 is placed on the other panel cover 22 so as to cover the photoelectric conversion module 2 placed on the other panel cover 22. At this time, as shown in Fig. 7, the one panel cover 21 is placed on the other panel cover 22 so as to store the photoelectric conversion element 4 in the photoelectric conversion element storage section 23. Then, as shown in Fig. 9, the one panel cover 21 and the other panel cover 22 are placed in a state where their overlapping joining surfaces 21a, 22a are overlapped with each other, with the laser light joining intermediate member 26 sandwiched therebetween.

[0063] It is desirable that the pair of panel covers 21, 22 overlapped with the laser beam joining intermediate member 26 sandwiched therebetween be held together using a fixture such as a clamper to prevent misalignment in the overlapping state.

[0064] The pair of panel covers 21, 22, which house the photoelectric conversion module 2 and are stacked with the intermediate member 26 for laser light joining interposed therebetween, are integrated by thermal welding of the joining surfaces 21a, 22a, which are stacked with the intermediate member 26 for laser light joining interposed therebetween.

[0065] 9, the pair of overlapping panel covers 21, 22 are thermally welded by irradiating a laser beam L onto the area of ​​each panel cover 21, 22 where the laser beam bonding intermediate member 26 is interposed. The laser beam L has a wavelength in the infrared region of 800 nm to 1500 nm, and is generated by a gas laser, semiconductor laser, solid-state laser, or the like.

[0066] When laser light L is irradiated onto an area of ​​a pair of panel covers 21, 22 that are overlapped and joined together, where the laser light joining intermediate member 26 is interposed, the laser light L passes through one of the panel covers 21 on the incident side of the laser light L and reaches the laser light joining intermediate member 26. The area of ​​the laser light joining intermediate member 26 that is irradiated with the laser light L absorbs the irradiated laser light L, generates heat, and melts or softens. Then, at least a portion of the pair of overlapping panel covers 21, 22 that are in close contact with the laser light joining intermediate member 26 is melted by the heat of the melted or softened laser light joining intermediate member 26.

[0067] The pair of panel covers 21 and 22 are heated and melted by the heat generated by the laser beam joining intermediate member 26, and are thereby integrally joined with the melted laser beam joining intermediate member 26.

[0068] The joining by irradiation of the laser light L is performed over the entire periphery of the area where the laser light joining intermediate member 26 is interposed between the pair of overlapping and joined panel covers 21, 22. At this time, the laser light L, which is focused into a spot shape using a focusing means, irradiates the area where the laser light joining intermediate member 26 is interposed while sequentially moving the irradiation position, heating the laser light joining intermediate member 26 and melting and joining the pair of overlapping panel covers 21, 22.

[0069] In this embodiment, the pair of power lead conductors 5, 6 and the panel covers 21, 22 are connected via a laser beam joining intermediate member 26 and its auxiliary piece 26a, as shown in FIG.

[0070] In this embodiment, the panel covers 21, 22, the laser beam joining intermediate member 26 and its auxiliary piece 26a are made of materials with good joining compatibility, so they can be closely joined together to be integrated.

[0071] The pair of panel covers 21 and 22 that are stacked on top of each other are integrated to form an encapsulation panel 3 that encapsulates the photovoltaic conversion module 2.

[0072] Incidentally, a pair of power lead conductors 5, 6 led out from the photoelectric conversion element 4 sealed in the encapsulation panel 3 also adhere to the fused panel covers 21, 22 via the laser light bonding intermediate member 26 and the laser light bonding intermediate member auxiliary 26a. Furthermore, by being coated with the metal adhesive 28, these power lead conductors 5, 6 adhere to the laser light bonding intermediate member 26 and its auxiliary piece 26a, and are also in close contact with each panel cover 21, 22 via the laser light bonding intermediate member 26 and its auxiliary piece 26a, preventing the adhesion between each panel cover 21, 22 from being impaired.

[0073] As described above, the photovoltaic device 1 according to this embodiment is constructed by encapsulating the photovoltaic conversion module 2 in the encapsulation panel 3 made up of a pair of panel covers 21, 22 that are overlapped and joined together to form an integrated unit.

[0074] In this embodiment, a laser light joining intermediate member 26 and its auxiliary piece 26a for joining the panel covers 21 and 22 are interposed on each of the opposing surfaces of the power draw conductors 5 and 6, but if the laser light irradiation can provide a heat capacity sufficient to melt the panel covers 21 and 22 using only the laser light joining intermediate member 26, it is not necessary to provide the auxiliary piece 26a of the laser light joining intermediate member 26.

[0075] In this embodiment, the laser beam bonding intermediate member 26 may have adhesive layers 31 and 32 provided on both sides of a film sheet 30 serving as a base material, as shown in Fig. 11. The adhesive layers 31 and 32 may be formed from a thermoplastic elastomer, a non-crosslinked rubber, or the like.

[0076] By providing adhesive layers 31, 32 on both sides of the laser beam bonding intermediate member 26, the pair of overlapping panel covers 21, 22 can be temporarily fixed with this laser beam bonding intermediate member 26 in between, and the panel covers 21, 22 can be easily and accurately welded together by laser beam. Note that the adhesive layers 31, 32 may be provided on only one side.

[0077] In this embodiment, in order to improve the adhesion between the power lead-out conductors 5, 6 that are led out from between the pair of panel covers 21, 22 to the outside and these panel covers 21, 22, auxiliary pieces 35, 36 of the laser light joining intermediate member 26 made of the same material as the laser light joining intermediate member 26 are adhered to both sides of the power lead-out conductors 5, 6 via metal adhesives 33, 34, as shown in Figures 12 and 13. These auxiliary pieces 35, 36 have a width W equal to the width of the power lead-out conductors 5, 6, and are sized to have a length L equal to the width of the laser light joining intermediate member 26.

[0078] When the photovoltaic conversion module 2 having the auxiliary pieces 35, 36 of the laser light bonding intermediate member 26 previously bonded to the power lead-out conductors 5, 6 is sealed, a cutout portion 37 for conductor lead-out is formed in the laser light bonding intermediate member 26 interposed between the pair of panel covers 21, 22 in the portion where the power lead-out conductors 5, 6 extend, as shown in Fig. 14. Then, when the pair of panel covers 21, 22 are overlapped and joined together, a further auxiliary piece 38 of the laser light bonding intermediate member 26 is arranged in the portion corresponding to the portion between the pair of power lead-out conductors 5, 6 extending into the cutout portion 37.

[0079] In this way, by arranging the additional auxiliary piece 38 of the laser light joining intermediate member 26 in the portion corresponding to the space between the pair of power lead-out conductors 5, 6, the laser light joining intermediate member 26, the auxiliary pieces 35, 36 provided on the power lead-out conductors 5, 6, and the additional auxiliary piece 38 extend all around the overlapping and joining surfaces 21a, 22a of the pair of panel covers 21, 22. Therefore, the pair of panel covers 21, 22 are joined all around the overlapping and joining surfaces 21a, 22a, and the interiors thereof are sealed more reliably.

[0080] Furthermore, the auxiliary pieces 35, 36 of the laser light bonding intermediate member 26 are adhered to the power lead-out conductors 5, 6, so that the auxiliary pieces 35, 36 are heated and melted by irradiation with laser light, and are tightly joined to the overlapping joining surfaces 21a, 22a of the pair of panel covers 21, 22. By tightly joining the power lead-out conductors 5, 6 to the overlapping joining surfaces 21a, 22a of the pair of panel covers 21, 22, the space between the pair of panel covers 21, 22 can be sealed with high precision.

[0081] Furthermore, the auxiliary pieces 35, 36 are adhered to the power draw conductors 5, 6 via metal adhesives 33, 34, thereby ensuring a secure bond between the power draw conductors 5, 6 and the auxiliary pieces 35, 36, and a stable bond between the power draw conductors 5, 6 and the panel covers 21, 22.

[0082] To encapsulate the photovoltaic conversion module 2, in which the auxiliary pieces 35, 36 of the intermediate member 26 for laser light connection are adhered to the aforementioned power draw conductors 5, 6, in the encapsulating panel 3, the intermediate member 26 for laser light connection is placed on the overlapping joining surface 22a of the other panel cover 22 on which one panel cover 21 is overlapped, as shown in Figure 15.

[0083] Next, the photoelectric conversion module 2 is placed on the other panel cover 22 with the photoelectric conversion element 4 positioned within the photoelectric conversion element installation area 27, as shown in Fig. 15. At this time, the pair of power draw conductors 5, 6 are positioned within the notches 37 formed in the laser light bonding intermediate member 26, as shown in Fig. 15, and extend so as to protrude outward from one of the long sides of the other panel cover 22.

[0084] 15, an additional auxiliary piece 38 of the laser light bonding intermediate member 26 is placed between the pair of power lead conductors 5, 6 positioned in the cutout 37. The additional auxiliary piece 38 may be placed on the other panel cover 22 together with the laser light bonding intermediate member 26.

[0085] In particular, by using the intermediate member 26 for laser light joining and the further auxiliary piece 38 coated with adhesive layers 31, 32 on both sides, even if the intermediate member 26 for laser light joining and the further auxiliary piece 38 are cut apart, they can be reliably positioned in the specified position on the panel cover 22.

[0086] Next, the encapsulation panel 3 is assembled through the same assembly steps as described above, and therefore a detailed description thereof will be omitted.

[0087] In this embodiment, an inert gas G such as argon or nitrogen may be sealed inside the encapsulation panel 3 housing the photoelectric conversion module 2, as shown in Fig. 16. Furthermore, a deoxidizing and / or desiccant agent 41 may be provided. The deoxidizing and / or desiccant agent 41 is placed in the photoelectric conversion element housing portion 23 formed in the other panel cover 22, as shown in Fig. 16.

[0088] In addition, the inert gas G and the deoxidizing and / or dewatering vaporizing agent 41 may be enclosed and installed in the enclosure panel 3 in combination.

[0089] By sealing and placing an inert gas G, or gas G and a deoxidizing and / or desteaming agent 31 inside the encapsulation panel 3, it is possible to protect the perovskite-type photoelectric conversion element 4 used in this embodiment, which is vulnerable to moisture and oxygen.

[0090] In this embodiment, the pair of panel covers 21, 22 that are overlapped and joined to form the encapsulating panel 3 are made of polycarbonate resin, which is a synthetic resin material that is optically transparent and transmits light with a wavelength of at least 300 to 1200 nm, so that both surfaces of the encapsulating panel 3 can be light incident surfaces. Therefore, a bifacial power generation type photoelectric conversion element 4 that can generate power using light incident from both surfaces can be used as the photoelectric conversion module 2.

[0091] As described above, the photovoltaic device 1 of this embodiment encapsulates the photoelectric conversion element 4 in the encapsulation panel 3 that is fused and integrated, thereby reliably isolating it from the external environment, protecting the photoelectric conversion element 4, and achieving a long life for the photovoltaic device 1. [Explanation of symbols]

[0092] 1 Photovoltaic device 2. Photoelectric conversion module 3 Enclosed Panel 4 Photoelectric conversion element 5, 6 Power lead-out conductor 21, 22 Panel cover 23 Photoelectric conversion element housing recess 24, 25 Power lead-out conductor 26 Intermediate material for laser beam joining 28 Metal Adhesive 41 Deoxidizer and / or desteamer

Claims

1. a photoelectric conversion module including a photoelectric conversion element and a power drawing conductor extending from the photoelectric conversion element; an encapsulation panel that encapsulates the photovoltaic conversion module with the power lead-out conductor led outward, the encapsulation panel has a pair of panel covers made of synthetic resin that house the photoelectric conversion elements and are overlapped and joined together to form an integrated unit; The pair of panel covers are At least one of the housings is formed from a light-transmitting synthetic resin material and is disposed opposite to the light-incident surface of the photoelectric conversion element for power generation, An intermediate member for laser beam joining is interposed between the joining surfaces to be joined together and heat-welded to form an integrated unit. The power lead-out conductor is led out from between the overlapping joining surfaces of the pair of panel covers to the outside of the enclosure panel. A photovoltaic device characterized by:

2. 2. The photovoltaic device according to claim 1, wherein the one panel cover is provided with an element housing portion for housing a photoelectric conversion element of the photoelectric conversion module.

3. 3. The photovoltaic device according to claim 1, wherein an intermediate member for laser beam bonding is attached to the surface of the power lead conductor that faces the overlapping joining surfaces of the pair of panel covers.

4. 4. The photovoltaic device according to claim 3, wherein the power lead conductor is bonded to the laser beam bonding intermediate member via a metal adhesive.

5. 4. The photovoltaic device according to claim 1, wherein the intermediate member for laser beam bonding has an adhesive layer on one or both sides of a base material.

6. A photovoltaic device as described in any one of claims 1 to 5, characterized in that one or more of an inert gas, an oxygen absorber and / or a desiccant is arranged inside the encapsulating panel.

7. a photoelectric conversion module having a light-transmitting surface on one or both opposing surfaces of the photoelectric conversion element is enclosed in the encapsulation panel; A photovoltaic device according to any one of claims 1 to 6, characterized in that one or both of the pair of panel covers constituting the encapsulating panel are formed from a synthetic resin material having optical transparency.

8. 1. A method for manufacturing a photovoltaic device comprising: a photovoltaic module including a photovoltaic conversion element and a power drawing conductor extending from the photovoltaic conversion element; and the photovoltaic module being enclosed in an encapsulation panel with the power drawing conductor of the photovoltaic conversion module extended outward, the method comprising: a pair of panel covers that are joined together to form the encapsulating panel and an intermediate member for laser beam joining is interposed between the joined surfaces of the panel covers; the photovoltaic conversion module is installed on the other panel cover of the pair of panel covers, with the power lead-out conductor being led outward; Next, one of the pair of panel covers is superimposed on the other panel cover, covering at least the photoelectric conversion elements of the photoelectric conversion module installed on the other panel cover; Thereafter, a laser beam is irradiated onto the overlapping and joining surfaces of the pair of panel covers that are overlapped with the laser beam joining intermediate member interposed therebetween, the laser beam joining intermediate member is heated, and the overlapping and joining surfaces of the pair of panel covers that are in contact with the heated area of ​​the laser beam joining intermediate member are heated, melted, and welded together, thereby integrating the pair of panel covers and producing an encapsulated panel in which the photoelectric conversion module is encapsulated. A method for manufacturing a photovoltaic device comprising:

9. a metal adhesive is applied to a joining surface of the power lead conductor with the laser light joining intermediate member; 9. The method for manufacturing a photovoltaic device according to claim 8, wherein the power lead conductor is bonded to the laser beam bonding intermediate member via the metal adhesive.

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