Heat radiation amount control system

Abstract

To provide a heat radiation amount control system which can suppress freezing of coolant.SOLUTION: A heat radiation amount control system 10 comprises: a radiant heat radiating portion 12 which performs heat radiation to outside; a cooling pipeline 16 which performs heat exchange through contact with the radiant heat radiating portion 12 and circulates coolant inside thereof; and moving devices 18, 20, 24 which make the radiant heat radiating portion 12 contact with or separate from the cooling pipeline 16 by displacing at least one of the radiant heat radiating portion 12 and the cooling pipeline 16.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a heat radiation amount control system. [Background technology]

[0002] The following Patent Document 1 discloses a structure in which independent cooling circuits are provided for the onboard equipment installed inside the vehicle and for the radiator, and heat conduction between the two circuits is controlled via a thermal switch to protect the onboard equipment by keeping it at a guaranteed temperature. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 03-227800 Summary of the Invention [Problem to be solved by the invention]

[0004] In the cooling circuit on the radiator side, there is a risk that the temperature will drop and the refrigerant will freeze, so there is room for improvement.

[0005] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a heat radiation amount control system that can suppress freezing of a refrigerant. [Means for solving the problem]

[0006] The heat dissipation control system according to the first aspect includes a radiant heat dissipation unit that dissipates heat to the outside, a cooling pipe that exchanges heat by coming into contact with the radiant heat dissipation unit and through which a refrigerant flows, and a moving device that displaces at least one of the radiant heat dissipation unit and the cooling pipe to bring the radiant heat dissipation unit into contact with or separate the cooling pipe.

[0007] In the heat dissipation amount control system according to the first aspect, the movement device can separate the radiant heat dissipation unit and the cooling pipe, thereby blocking the heat conduction path from the cooling pipe to the radiant heat dissipation unit at low temperatures. Blocking the heat conduction path prevents the exhaust heat of the onboard equipment from being transferred from the cooling pipe to the radiant heat dissipation unit, thereby suppressing a drop in the refrigerant temperature in the cooling pipe and preventing the refrigerant from freezing. [Effects of the Invention]

[0008] As described above, the heat radiation amount control system according to the present invention has the excellent effect of being able to suppress freezing of the refrigerant. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a front view schematically showing a state of a heat radiation amount control system according to a first embodiment of the present invention when a radiator is at a high temperature. [Figure 2] 2 is a front view schematically showing the state of the radiator of FIG. 1 at low temperature. FIG. [Figure 3] 10 is a graph showing the relationship between spring temperature and spring force. [Figure 4] FIG. 2 is a schematic diagram illustrating the flow of heat in the heat radiation amount control system. DETAILED DESCRIPTION OF THE INVENTION

[0010] A heat radiation amount control system 10 according to one embodiment of the present invention will be described below with reference to Figures 1 to 4. In the description of the drawings, the same or equivalent elements are denoted by the same reference numerals, and duplicated explanations will be omitted.

[0011] 1 and 2 schematically show a radiator 11 included in a heat radiation amount control system 10. As shown in Fig. 1, the radiator 11 includes a heat radiation panel 12 as a radiation heat radiation section, a thermally conductive filler 14, a cooling pipe 16, a bias spring 18, a shape memory spring 20, a spring guide 22, and a frame section 24.

[0012] The heat dissipation panel 12 is formed in a rectangular shape when viewed from above, and as an example, dissipates radiant heat to the outside. The heat dissipation panel 12 has a configuration that allows it to dissipate radiant heat, and a known configuration can be used. The heat dissipation panel 12 is provided in a position facing the upper surface of a thermally conductive filler 14, which will be described later, and in this embodiment, as an example, is formed so as to cover the column portion 24B of the frame portion 24 when viewed from above.

[0013] The cooling pipe 16 has, as an example, a flow passage 16A through which the refrigerant flows, a pipe main body 16B formed in a rectangular shape when viewed from the front, and extension parts 16C formed at the lower end of the pipe main body 16B and extending to both the left and right sides when viewed from the front. The extension part 16C has an insertion hole (not shown) at its end through which the spring guide 22 is inserted.

[0014] The cooling pipe 16 is provided at the upper end of the pipe main body 16B with a thermally conductive filler 14, which is an elastic body having a higher thermal conductivity than the cooling pipe 16. The thermally conductive filler 14 is an example of a thermal conductor.

[0015] As an example, the frame portion 24 includes a base portion 24A, a column portion 24B erected on the upper surface of the base portion 24A, and an upper end portion 24C extending inward from the column portion 24B at a substantially right angle. A second insertion hole (not shown) is formed in the upper end portion 24C at a position vertically opposing the insertion hole of the extension portion 16C. Furthermore, a support recess (not shown) that supports the lower end of the spring guide 22 is formed in the upper surface of the base portion 24A at a position vertically opposing the second insertion hole.

[0016] As an example, the spring guide 22 is formed in a rod shape, and its lower end is supported in the support recess of the base portion 24A. The upper end of the spring guide 22 is inserted through the second insertion hole of the upper end portion 24C. The insertion hole formed in the extension portion 16C of the cooling pipe 16 is slidable in the vertical direction along the center portion of the spring guide 22 between the lower end supported in the support recess and the second insertion hole.

[0017] The bias spring 18 is formed of, for example, a substantially cylindrical spring member, and is passed through the spring guide 22 and disposed in a state of being pressed and sandwiched between the extension portion 16C and the upper end portion 24C. With this assembly, the bias spring 18 biases the extension portion 16C, i.e., the cooling pipe 16, so as to push it toward the base portion 24A of the frame portion 24 (downward).

[0018] The shape memory spring 20 is formed, for example, from a substantially cylindrical spring member, and is passed through a spring guide 22 and disposed between the extension portion 16C and the base portion 24A. In this embodiment, the shape memory spring 20 is formed from a shape memory alloy, and since its spring force is weak below a predetermined temperature, as shown in FIG. 2, it is pressed by the biasing force of the bias spring 18, and its length in the vertical direction (axial direction) is contracted. Here, in this embodiment, the predetermined temperature is a deformation temperature T at which the shape memory alloy deforms. Note that the deformation temperature T can be changed as appropriate depending on the environment in which the radiator 11 is installed, etc.

[0019] On the other hand, when the temperature is equal to or higher than the predetermined temperature, the spring force of the shape memory spring 20 becomes stronger than when the temperature is lower than the predetermined temperature, and as shown in Fig. 1, the shape memory spring 20 returns to its original shape due to the spring force of the shape memory spring 20 counteracting the biasing force of the bias spring 18. In other words, the shape memory spring 20 extends (expands) in the vertical direction (axial direction).

[0020] Figure 3 is a graph showing the relationship between spring temperature and spring force. In Figure 3, the solid line represents the graph for the shape memory spring 20, and the dotted line represents the graph for the bias spring 18. As shown by the dotted line in Figure 3, the spring force of the bias spring 18 is a constant value regardless of the spring temperature, whereas, as shown by the solid line in Figure 3, the spring force of the shape memory spring 20 changes depending on the spring temperature.

[0021] Specifically, for example, when the temperature of the shape memory spring 20 increases, the spring force F of the shape memory spring 20 starts to increase from the deformation temperature T. Then, as shown to the right of the deformation temperature T in Fig. 3, when the spring force F of the shape memory spring 20 becomes larger than the spring force D that exerts a biasing force toward the base portion 24A of the bias spring 18 (spring force D < spring force F), the shape memory spring 20 starts to extend in the vertical direction (axial direction) and starts to push up the extension portion 16C of the cooling pipe 16, as shown in Fig. 1.

[0022] When the extension portion 16C starts to be pushed up, the cooling pipe 16 is also pushed up, so that the heat conductive filler 14 provided at the upper end of the pipe main body portion 16B of the cooling pipe 16 is also moved upward, and the heat conductive filler 14 abuts against the heat dissipation panel 12.

[0023] 1, when the temperature of the shape memory spring 20 drops below the deformation temperature T, the spring force D of the bias spring 18, which acts as a biasing force toward the base portion 24A of the bias spring 18, becomes greater than the spring force F of the shape memory spring 20 (to the left of the deformation temperature T in FIG. 3). As a result, as shown in FIG. 2, the shape memory spring 20 is pressed by the spring force D of the bias spring 18, causing the length in the vertical direction (axial direction) to contract, and the extension portion 16C of the cooling pipe 16 is also pressed down. As a result, the thermally conductive filler 14 is also moved downward, and the thermally conductive filler 14 moves away from the heat dissipation panel 12.

[0024] In this embodiment, as an example, the bias spring 18, the shape memory spring 20, and the frame portion 24 constitute the movement device.

[0025] Next, the effects of the heat dissipation amount control system 10 in this embodiment will be described. The heat dissipation amount control system 10 in this embodiment includes, as an example, on-board equipment (not shown) mounted on a vehicle such as a lunar vehicle or a terrestrial vehicle, and a radiator 11, and the radiator 11 cools the on-board equipment. Fig. 4 is a schematic diagram showing the flow of heat in the heat dissipation amount control system 10. In Fig. 4, straight arrows indicate heat conduction, and curved arrows indicate radiative heat dissipation.

[0026] In the radiator used in the conventional heat dissipation control system, the cooling pipes and the heat dissipation panel are integrated by adhesive or the like, as shown in Figure 4(C). Therefore, whether the ambient temperature of the vehicle is high or low, the heat discharged from the onboard equipment is thermally conducted to the cooling pipes via the refrigerant, and then to the heat dissipation panel, and then radiated from the heat dissipation panel to the outside. Therefore, at low temperatures, the heat conducted from the cooling pipes to the heat dissipation panel may lower the temperature of the cooling pipes and cause the refrigerant to freeze.

[0027] In contrast, in the heat dissipation amount control system 10 of this embodiment, when the temperature around the vehicle is high, the shape memory spring 20 expands, as shown in Fig. 1, so that the heat conductive filler 14 and the heat dissipation panel 12 come into contact with each other. Therefore, in the heat dissipation amount control system 10, as shown in Fig. 4(A), heat discharged from the mounted equipment is thermally conducted to the cooling pipe 16 via the refrigerant. The heat conducted to the cooling pipe 16 is then thermally conducted to the heat dissipation panel 12 via the heat conductive filler 14, and is radiated from the heat dissipation panel 12 to the outside.

[0028] Furthermore, when the temperature around the vehicle is low, the shape memory spring 20 contracts, as shown in Fig. 2, separating the heat conductive filler 14 from the heat dissipation panel 12. Therefore, in the heat dissipation amount control system 10, heat discharged from the mounted equipment is thermally conducted to the cooling pipe 16 and the heat conductive filler 14 via the refrigerant, as shown in Fig. 4(B). Since the heat conduction path between the heat conductive filler 14 and the heat dissipation panel 12 is blocked by the separation, the heat conducted to the heat conductive filler 14 and the cooling pipe 16 does not transfer from the mounted equipment to the cooling pipe 16 to the heat dissipation panel 12, and instead remains in the cooling pipe 16, keeping the cooling pipe 16 warm. This prevents a decrease in the refrigerant temperature in the cooling pipe, thereby preventing the refrigerant from freezing.

[0029] Furthermore, in the heat dissipation amount control system 10 of this embodiment, heat is conducted from the cooling pipe 16 to the heat dissipation panel 12 via the heat conductive filler 14, so the contact area can be increased by the heat conductive filler 14. As a result, when the spring force F of the shape memory spring 20 increases, the contact surface pressure of the heat conductive filler 14 increases, and the adhesion with the heat dissipation panel 12 improves. Furthermore, as the heat conductive filler 14 elastically deforms in the crushing direction and reduces in thickness, the heat conduction distance between the cooling pipe 16 and the heat dissipation panel 12 becomes shorter, and the thermal conductivity increases. In other words, the heat dissipation efficiency from the cooling pipe 16 to the heat dissipation panel 12 can be improved by the heat conductive filler 14.

[0030] [Additional explanation] In the above-described embodiment, the moving device moves the cooling pipes 16, but the present invention is not limited to this, and the moving device may move the radiator panel 12. In this case, instead of the cooling pipes 16, the radiator panel 12 is slidably disposed on the spring guide 22, and the cooling pipes 16 with the thermally conductive filler 14 on the lower side are disposed above the radiator panel 12. The moving device may also be configured to move both the cooling pipes 16 and the radiator panel 12.

[0031] Furthermore, the radiation heat dissipation section is not limited to the radiation panel 12, and any configuration may be used as long as it is capable of radiating heat.

[0032] Furthermore, the moving device is not limited to a passive control structure using the shape memory spring 20 as in the above-described embodiment, but may be an active control structure using a temperature sensor, an actuator, or the like.

[0033] Furthermore, the configuration of the present invention is not limited to the above-described embodiment, and the configuration can be changed as appropriate as long as the problem can be solved. [Explanation of symbols]

[0034] 10 heat radiation amount control system, 12 heat radiation panel (radiant heat radiation section), 16 cooling piping, 18 bias spring (moving device), 20 shape memory spring (moving device), 24 Frame section (moving device)

Claims

[Claim 1] a radiation heat dissipation unit that dissipates heat to the outside; a cooling pipe that exchanges heat by contacting the radiation heat dissipation portion and through which a refrigerant flows; a moving device that displaces at least one of the radiant heat radiation unit and the cooling pipe to bring the radiant heat radiation unit into contact with or separate from the cooling pipe; A heat dissipation control system including:

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