Evaluation device

Abstract

To provide an evaluation device capable of reducing a manufacturing cost and shortening a manufacturing period.SOLUTION: An evaluation device 1 comprises: a plurality of evaluation boards 10, each mounted with electronic components used for evaluation and calibration of a semiconductor inspection device, and electrically connecting the electronic components to electrodes of the semiconductor inspection device; and a stiffener 20 on which a plurality of mutually-independent evaluation boards 10 are arranged on the same plane with main surfaces of the evaluation boards 10 oriented in the same direction.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an evaluation device including an evaluation board used for evaluating and calibrating a semiconductor inspection device. [Background technology]

[0002] Semiconductor testing equipment such as IC testers are used to measure the electrical characteristics of test objects such as integrated circuits. To accurately measure the characteristics of test objects, the performance and functionality of the semiconductor testing equipment must be normal. For this reason, evaluation and calibration of semiconductor testing equipment is required.

[0003] For the evaluation and calibration of semiconductor testing equipment, a board (hereinafter also referred to as "evaluation board") is used that is electrically connected to the DUT (Device Under Test) unit of the semiconductor testing equipment that is connected to the object under test. For example, a circular evaluation board is used when the DUT unit is a probe card, and a rectangular evaluation board is used when the DUT unit is a handler. An evaluation device is prepared that includes an evaluation board equipped with electronic components according to the channel configuration of the semiconductor testing equipment and the purpose of evaluation, calibration, measurement, etc. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2019-163943 Summary of the Invention [Problem to be solved by the invention]

[0005] The increasing size and multi-layering of evaluation boards has resulted in higher manufacturing costs and longer manufacturing times. Furthermore, it is necessary to prepare multiple types of evaluation boards depending on the purpose. Therefore, there is a demand for reducing the manufacturing costs and time for evaluation devices.

[0006] An object of the present invention is to provide an evaluation device that can reduce manufacturing costs and shorten manufacturing time. [Means for solving the problem]

[0007] An evaluation device according to one aspect of the present invention includes a plurality of evaluation boards, each of which is mounted with electronic components used in the evaluation and calibration of a semiconductor inspection device and which electrically connect the electrodes of the semiconductor inspection device to the electronic components, and a stiffener in which a plurality of mutually independent evaluation boards are arranged on the same plane with the main surfaces of the evaluation boards facing in the same direction. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide an evaluation device that can reduce manufacturing costs and shorten manufacturing time. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic diagram showing the configuration of an evaluation device according to an embodiment. [Figure 2] FIG. 2 is a cross-sectional view taken along the line II-II in FIG. [Figure 3] FIG. 3 is a cross-sectional view taken along the line III-III in FIG. [Figure 4] FIG. 4 is a schematic diagram showing an example of the structure of a stiffener of the evaluation device according to the embodiment. [Figure 5] FIG. 5 is a schematic diagram showing an example in which the evaluation device according to the embodiment is mounted on a semiconductor inspection device. [Figure 6] FIG. 6 is a schematic diagram showing an example of a large-sized evaluation board. [Figure 7] FIG. 7 is a schematic diagram showing an example of the configuration of an evaluation board of the evaluation device according to the embodiment. [Figure 8] FIG. 8 is a schematic diagram showing the configuration of an evaluation device according to a first modified example of the embodiment. [Figure 9] FIG. 9 is a schematic diagram showing the configuration of an evaluation device according to a second modified example of the embodiment. [Figure 10]FIG. 10 is a schematic diagram showing another configuration of the evaluation device according to the second modified example of the embodiment. [Figure 11] FIG. 11 is a schematic diagram showing the configuration of an evaluation device according to another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, identical or similar parts are designated by identical or similar reference numerals. However, it should be noted that the drawings are schematic, and the thickness ratios of the various parts may differ from those in reality. Furthermore, it goes without saying that the dimensional relationships and ratios of parts included in the drawings may differ from one another. The embodiments shown below exemplify devices and methods for embodying the technical ideas of the present invention, and the materials, shapes, structures, arrangements, etc. of the components of the embodiments of the present invention are not limited to those described below.

[0011] An evaluation device 1 according to the embodiment is used for evaluation and calibration of semiconductor inspection equipment such as an IC tester. Evaluation and calibration is a concept that includes evaluation, calibration, and measurement of semiconductor inspection equipment. As shown in FIG. 1, the evaluation device 1 includes a plurality of evaluation boards 10 that are independent of one another, and a rigid stiffener 20 on which the plurality of evaluation boards 10 are arranged on the same plane with the main surfaces 101 of the evaluation boards 10 facing in the same direction. FIG. 1 is a plan view as seen from the normal direction of the main surface 101 of the evaluation board 10 (hereinafter also referred to as "plan view").

[0012] As will be described later, electronic components (not shown in FIG. 1 ) are mounted on the evaluation board 10. The electronic components mounted on the evaluation board 10 are, for example, chip resistors and chip capacitors, and are used for evaluating or calibrating semiconductor inspection equipment. These electronic components are electrically connected to connectors 15 arranged on the evaluation board 10. For example, the evaluation board 10 has wiring that electrically connects the electronic components to the connectors 15. The connectors 15 are electrically connected to electrodes used to connect the semiconductor inspection equipment to an object under test. In other words, the electronic components mounted on the evaluation board 10 and the electrodes of the semiconductor inspection equipment are electrically connected via the connectors 15. The connectors 15 may be, for example, ZIF connectors.

[0013] The evaluation substrate 10 shown in Fig. 1 has a fan shape in a planar view. The evaluation substrates 10 are arranged on the same plane with their vertices pointing to the same point on the stiffener 20. As a result, the overall shape of the array of multiple evaluation substrates 10 is circular in a planar view. The evaluation device 1 shown in Fig. 1 includes evaluation substrates 10 whose main surfaces 101 have different areas. Note that the evaluation substrates 10 may have the same shape in a planar view.

[0014] 2 and 3, the evaluation board 10 and stiffener 20 are fixed by fixing screws 30. The fixing screws 30 fix the outer periphery and top of the evaluation board 10 to the stiffener 20. The number of fixing screws 30 may be set arbitrarily depending on the area of ​​the main surface 101 of the evaluation board 10, etc. The evaluation board 10 and stiffener 20 are aligned in plan view by alignment pins 40. Therefore, by aligning the stiffener 20 with the semiconductor inspection device, the connector 15 of the evaluation board 10 and the electrodes of the semiconductor inspection device are aligned.

[0015] The stiffener 20 has higher rigidity than the evaluation substrate 10, and prevents the evaluation substrate 10 from bending, thereby ensuring the mechanical strength of the evaluation device 1. Furthermore, the stiffener 20 may be used as a support for fixing each of the components of the evaluation device 1. The stiffener 20 may be made of, for example, a metal material.

[0016] 4, the stiffener 20 has a shape in which a circular outer ring 21 and an inner circular central portion 22 are connected by spokes. Fixing screws 30 and alignment pins 40 are arranged on the outer ring 21 and the central portion 22, respectively. For example, the outer ring 21 and the outer periphery of the evaluation substrate 10 are fixed by the fixing screws 30, and the central portion 22 and the apex side of the evaluation substrate 10 are fixed by the fixing screws 30.

[0017] The evaluation device 1 is attached to the semiconductor inspection device so that the electrodes of the semiconductor inspection device are located in the gap between the outer ring 21 and the center portion 22 of the stiffener 20. Fig. 5 shows an example of the evaluation device 1 attached to the semiconductor inspection device 2. For example, the evaluation device 1 is attached to the semiconductor inspection device 2 with the surface on which the stiffener 20 is arranged facing the semiconductor inspection device 2.

[0018] As described above, in the evaluation device 1, the evaluation boards 10 and stiffeners 20 are fixed with the fixing screws 30, and the evaluation boards 10 are arranged so as to be detachable from the stiffeners 20. This makes it easy to replace the evaluation boards 10 in the evaluation device 1.

[0019] For example, even if a failure occurs in part of the evaluation board 10, the evaluation board can be easily replaced, unlike an evaluation device that uses one large evaluation board (hereinafter referred to as "large evaluation board 100") as shown in Fig. 6. Furthermore, because alignment pins 40 are used to align each evaluation board 10 and stiffener 20, alignment precision similar to that of the large evaluation board 100 can be ensured.

[0020] Fig. 7 shows an example of the configuration of an evaluation board 10. In the evaluation board 10 shown in Fig. 7, screw holes 31 into which fixing screws 30 are inserted are formed in two locations in the outer peripheral region 11 and two locations in the vertex region 12. Also, guide holes 41 into which alignment pins 40 are inserted are formed in one location each in the outer peripheral region 11 and the vertex region 12. Furthermore, a plurality of connectors 15 and electronic components 16 are arranged in a mounting region 13 between the outer peripheral region 11 and the vertex region 12 of the evaluation board 10.

[0021] The number of connectors 15 and the type and number of electronic components 16 placed on the evaluation board 10 are set according to the channel configuration of the semiconductor inspection equipment 2 and the purpose of evaluation, calibration, measurement, etc. As already mentioned, because the evaluation boards 10 in the evaluation equipment 1 are easily replaced, the evaluation boards 10 placed on the stiffener 20 can be selected arbitrarily. In other words, an appropriate evaluation board 10 can be selected and placed on the stiffener 20 according to the channel configuration of the semiconductor inspection equipment 2 and the purpose of use of the evaluation equipment 1.

[0022] For example, an evaluation board 10 may be selected that is equipped with electronic components 16 required to check the performance and functionality of the finished semiconductor inspection equipment 2 before shipping. Alternatively, an evaluation board 10 may be selected that is equipped with electronic components 16 required to calibrate the semiconductor inspection equipment 2 before inspecting and testing the characteristics of the semiconductor device. Also, an evaluation board 10 may be selected that is equipped with electronic components 16 required to perform self-diagnosis in semiconductor inspection equipment 2 that has a self-diagnosis function.

[0023] As described above, in the evaluation device 1 according to the embodiment, instead of the large evaluation board 100, a plurality of evaluation boards 10 are detachably arranged on the stiffener 20. Therefore, with the evaluation device 1, it is easier to manufacture small evaluation boards 10 than large evaluation boards 100, and therefore the number of manufacturers capable of manufacturing boards will increase, reducing manufacturing costs and shortening manufacturing time.

[0024] Furthermore, the evaluation device 1 allows flexible response by selecting and combining evaluation boards 10 according to the channel configuration of the semiconductor inspection device 2 and the intended use of the evaluation device 1. In other words, there is no need to modify or newly manufacture the large-scale evaluation board 100 according to the channel configuration of the semiconductor inspection device 2 and the intended use of the evaluation device 1.

[0025] <First Modification> 1 shows an evaluation device 1 in which evaluation boards 10 with a relatively small difference in the area of ​​their principal surfaces 101 are arranged. However, as shown in FIG. 8, evaluation device 1 may include evaluation boards 10 with largely different areas of their principal surfaces 101. For example, in the evaluation of semiconductor inspection device 2, evaluation boards 10 with a large number of connectors 15 are arranged in an area where the number of electrodes of semiconductor inspection device 2 connected to one evaluation board 10 is large. On the other hand, evaluation boards 10 with a small number of connectors 15 may be arranged in an area where the number of electrodes of semiconductor inspection device 2 is small.

[0026] <Second Modification> 1 shows an example in which the evaluation boards 10 are arranged almost without gaps across the entire surface of the stiffener 20 in a plan view. However, if the number of evaluation boards 10 required is small depending on the content of the evaluation or calibration of the semiconductor inspection device 2, the evaluation boards 10 may be arranged on the stiffener 20 with gaps between them, as shown in Fig. 9, for example. Alternatively, the evaluation boards 10 may be arranged on the stiffener 20 with dummy boards 10M that do not include electronic components, connectors 15, etc., sandwiched between them, as shown in Fig. 10.

[0027] (Other embodiments) Although the present invention has been described above by way of the preferred embodiment, the descriptions and drawings that form part of this disclosure should not be understood as limiting the present invention. From this disclosure, various alternative embodiments, examples, and operating techniques will become apparent to those skilled in the art.

[0028] For example, in the above description, the overall shape of the evaluation substrates 10 arranged is circular in plan view. However, the overall shape of the evaluation substrates 10 arranged in plan view may be a shape other than circular. For example, as shown in FIG. 11 , the shape of the evaluation substrate 10 in plan view may be rectangular. Furthermore, the overall shape of the plurality of evaluation substrates 10 arranged as shown in FIG. 11 may be rectangular in plan view. For example, when the DUT unit is a probe card, the evaluation substrate 10 may be used so that its overall shape is circular, and when the DUT unit is a handler, the evaluation substrate 10 may be used so that its overall shape is rectangular.

[0029] As such, the present invention naturally includes various embodiments not described above. Therefore, the technical scope of the present invention is defined only by the invention-specifying matters according to the scope of the claims that are appropriate from the above description. [Explanation of symbols]

[0030] 1 Evaluation device 2. Semiconductor inspection equipment 10 Evaluation Boards 11 Outer area 12 Vertex Area 13 Loading area 15 Connectors 16 Electronic Components 20 Stiffna 21 outer ring 22 Center part 30 fixing screws 40 Alignment pin 101 Main surface

Claims

1. An evaluation device for a semiconductor inspection device, a plurality of evaluation boards each mounted with electronic components used for evaluation and calibration of the semiconductor inspection device, the evaluation boards electrically connecting electrodes of the semiconductor inspection device to the electronic components; a stiffener in which a plurality of the evaluation substrates, which are independent of one another, are arranged on the same plane with the main surfaces of the evaluation substrates facing the same direction; An evaluation device comprising:

2. the evaluation board is detachably disposed on the stiffener; The evaluation board to be placed on the stiffener can be selected arbitrarily. The evaluation device according to claim 1 .

3. The evaluation device according to claim 1 , wherein the evaluation substrates have mutually different areas when viewed in a normal direction of the main surfaces of the evaluation substrates.

4. the evaluation substrate has a sector shape when viewed from a normal direction of the main surface, each vertex of the evaluation substrate points to the same point on the stiffener, and the overall shape of the arrangement of the plurality of evaluation substrates is circular when viewed from the normal direction of the main surface; The evaluation device according to any one of claims 1 to 3.

5. the evaluation substrate has a rectangular shape when viewed from the normal direction of the main surface, the overall shape of the plurality of evaluation substrates arranged is rectangular when viewed from the normal direction of the main surface; The evaluation device according to any one of claims 1 to 3.

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