Substrate fixing device

Abstract

To provide a substrate fixing device which can suppress electric discharging.SOLUTION: A substrate fixing device 10 has: a base plate 20; an electrostatic chuck 40 fixed onto the base plate 20; a through-hole 50 which penetrates the base plate 20 in its thickness direction; and a recess 43 which is provided on a lower surface of the electrostatic chuck 40 and communicates with the through-hole 50. The substrate fixing device 10 has: an electrode 42 which is built inside the electrostatic chuck 40; a power feeding terminal 60 which is inserted into the through-hole 50 and is electrically connected to the electrode 42 exposed from the recess 43; and a cylindrical insulation member 70 which is inserted into the through-hole 50 and surrounds an outer periphery of the power feeding terminal 60. The cylindrical insulation member 70 is formed such that it entirely surrounds an outer peripheral surface of a portion, of the power feeding terminal 60, disposed inside the through-hole 50. The cylindrical insulation member 70 is formed such that it extends over the entire length of the through-hole 50 in its axial direction. The cylindrical insulation member 70 is a single member.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a substrate fixing device. [Background technology]

[0002] Conventionally, film formation apparatuses (e.g., CVD apparatuses and PVD apparatuses) and plasma etching apparatuses used in manufacturing semiconductor devices such as ICs and LSIs have a substrate fixing device for precisely holding a substrate such as a silicon wafer in a vacuum processing chamber.

[0003] The substrate fixing device includes a metal base plate, an electrostatic chuck bonded to the base plate, an electrode built into the electrostatic chuck, a power supply terminal electrically connected to the electrode, and a cylindrical insulating member (see, for example, Patent Document 1). The substrate fixing device includes a through-hole penetrating the base plate in the thickness direction and a recessed portion provided on the underside of the electrostatic chuck and exposing the electrode. The power supply terminal is inserted into the through-hole and joined to the electrode exposed from the recessed portion. When a voltage is applied from an external power source through the power supply terminal, the electrode generates an electrostatic attraction force between the electrode and a substrate placed on the mounting surface of the electrostatic chuck. This allows the substrate to be attracted and held on the mounting surface of the electrostatic chuck. The cylindrical insulating member is inserted into the through-hole and surrounds the outer periphery of the power supply terminal. The cylindrical insulating member improves electrical insulation between the base plate and the power supply terminal, thereby suppressing discharge between the base plate and the power supply terminal. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2023-31603 Summary of the Invention [Problem to be solved by the invention]

[0005] In the substrate fixing device, it is desired to further suppress the occurrence of discharge. [Means for solving the problem]

[0006] According to one aspect of the present invention, there is provided an electrostatic chuck including: a base plate; an electrostatic chuck fixed on the base plate; a first through hole penetrating the base plate in a thickness direction; a recessed portion provided in a lower surface of the electrostatic chuck and communicating with the first through hole; an electrode built in the electrostatic chuck; a power supply terminal inserted into the first through hole and electrically connected to the electrode exposed from the recessed portion; and a cylindrical insulating member inserted into the first through hole and surrounding an outer periphery of the power supply terminal, wherein the cylindrical insulating member is formed to surround the entire outer periphery of a portion of the power supply terminal disposed inside the first through hole, and the cylindrical insulating member is formed to extend over the entire axial length of the first through hole, and the cylindrical insulating member is a single member. [Effects of the Invention]

[0007] According to one aspect of the present invention, it is possible to suppress the occurrence of discharge. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic cross-sectional view showing a substrate fixing device according to one embodiment. [Figure 2] FIG. 2 is a schematic cross-sectional view showing an enlarged portion of the substrate fixing device of one embodiment. [Figure 3] FIG. 3 is a schematic cross-sectional view showing a method for manufacturing a substrate fixing device according to one embodiment. [Figure 4] FIG. 4 is a schematic cross-sectional view showing a method for manufacturing a substrate fixing device according to one embodiment. [Figure 5] FIG. 5 is a schematic cross-sectional view showing a method for manufacturing a substrate fixing device according to one embodiment. [Figure 6] FIG. 6 is a schematic cross-sectional view showing a method for manufacturing a substrate fixing device according to one embodiment. [Figure 7] FIG. 7 is a schematic cross-sectional view showing a method for manufacturing a substrate fixing device according to one embodiment. [Figure 8] FIG. 8 is a schematic cross-sectional view showing an enlarged portion of a substrate fixing device according to a modified example. [Figure 9] FIG. 9 is a schematic cross-sectional view showing an enlarged portion of a substrate fixing device according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0009] An embodiment will be described below with reference to the accompanying drawings. For convenience, the accompanying drawings may show characteristic portions enlarged to make the features easier to understand, and the dimensional ratios of each component may differ from one drawing to another. In addition, in cross-sectional views, the hatching of some components is shown with a matte finish, and the hatching of some components is omitted, to make the cross-sectional structure of each component easier to understand. In this specification, "plan view" refers to viewing an object from the vertical direction of FIG. 1 (the up-down direction in the drawing), unless otherwise specified. In this specification, "planar shape" refers to the shape of an object viewed from the vertical direction of FIG. 1, unless otherwise specified. In this specification, the "up-down direction" and "left-right direction" refer to the direction in which the symbols indicating each component in each drawing can be correctly read, assuming the correct position.

[0010] (Overall configuration of the substrate fixing device 10) As shown in FIG. 1, the substrate fixing device 10 includes a base plate 20, an adhesive layer 30, an electrostatic chuck 40, through holes 50 and 55, a power supply terminal 60, a cylindrical insulating member 70, and an insulating film 80. The electrostatic chuck 40 is fixed to the upper surface of the base plate 20 by the adhesive layer 30. The substrate fixing device 10 is an apparatus that attracts and holds a substrate (not shown), which is an object to be attracted, using the electrostatic chuck 40 fixed to the upper surface of the base plate 20. Examples of the substrate include a silicon wafer. The diameter of the substrate can be, for example, approximately 8 inches, 12 inches, or 18 inches.

[0011] (Configuration of base plate 20) The base plate 20 is a base (base platform) on which the electrostatic chuck 40 is mounted. The base plate 20 has the rigidity to support the electrostatic chuck 40. The thickness of the base plate 20 can be, for example, about 20 mm to 50 mm. The material of the base plate 20 can be, for example, a metal material such as aluminum or cemented carbide, or a composite material of such a metal material and a ceramic material. The material of the base plate 20 in this embodiment is an aluminum alloy.

[0012] The base plate 20 has a lower portion 21 and an upper portion 22 stacked on the upper surface of the lower portion 21. The lower portion 21 is formed, for example, in a disk shape. The upper portion 22 is formed, for example, in a disk shape. The upper portion 22 is arranged, for example, concentrically on the upper surface of the lower portion 21. The upper portion 22 is smaller in size than the lower portion 21 in a plan view. The diameter of the upper portion 22 is smaller than the diameter of the lower portion 21. The upper portion 22 is formed so as to protrude upward from the upper surface of the lower portion 21.

[0013] Although not shown in the figure, the inside of the base plate 20 is provided with a cooling path through which a cooling medium for cooling the substrate attracted to the electrostatic chuck 40 is circulated, a gas path through which an inert gas for cooling the substrate attracted to the electrostatic chuck 40 is introduced, and the like.

[0014] (Configuration of adhesive layer 30) The adhesive layer 30 is provided between the base plate 20 and the electrostatic chuck 40. The adhesive layer 30 bonds the base plate 20 and the electrostatic chuck 40 together. The adhesive layer 30 is formed, for example, so as to cover the upper surface of the base plate 20, specifically the entire upper surface of the upper part 22. The adhesive layer 30 is formed, for example, so as to cover the entire lower surface of the electrostatic chuck 40.

[0015] The adhesive layer 30 may be made of, for example, an adhesive made of a polymer compound. The adhesive layer 30 may be made of, for example, a silicone adhesive. The adhesive layer 30 functions as an adhesive that bonds the base plate 20 and the electrostatic chuck 40, and also functions as a heat-conducting member that conducts heat from the electrostatic chuck 40 to the base plate 20. The adhesive layer 30 may be made of, for example, a material with high thermal conductivity. The thickness of the adhesive layer 30 may be, for example, about 0.05 mm to 2.0 mm.

[0016] (Configuration of electrostatic chuck 40) The electrostatic chuck 40 has a substrate body 41 and an electrode 42 built into the substrate body 41. The electrostatic chuck 40 is, for example, a Johnsen-Rahbek type electrostatic chuck. The electrostatic chuck 40 may also be a Coulomb force type electrostatic chuck. The electrostatic chuck 40 is a holder that attracts and holds a substrate, which is an object to be attracted.

[0017] The substrate body 41 is formed, for example, in a disk shape. The diameter of the substrate body 41 may be equal to or larger than the diameter of the upper portion 22 of the base plate 20. In this embodiment, the diameter of the substrate body 41 is equal to the diameter of the upper portion 22. The diameter of the substrate body 41 may be, for example, approximately 150 mm to 500 mm. The thickness of the substrate body 41 may be, for example, approximately 0.5 mm to 10 mm. The substrate body 41 may be made of an insulating material. The substrate body 41 may be made of ceramic materials such as aluminum oxide, aluminum nitride, and silicon nitride, or organic materials such as silicone resin and polyimide resin. In this embodiment, the substrate body 41 is made of a ceramic material containing aluminum oxide as a main component. In this specification, the term "main component" refers to a component that accounts for 90% by weight or more of the components contained in the target portion. In this specification, the substrate body 41 preferably has an aluminum oxide purity of 95% or more, and more preferably has an aluminum oxide purity of 99.5% or more. By forming the substrate body 41 from such high-purity aluminum oxide, the temperature dependency of the insulation resistance in the electrostatic chuck 40 can be reduced, and a decrease in insulation resistance due to temperature increases can be suppressed. Note that a purity of 99.5% or more indicates that the substrate is formed without adding a sintering aid. Also, a purity of 99.5% or more means that the substrate may contain impurities unintentionally produced during the manufacturing process, etc.

[0018] The substrate body 41 has a mounting surface 41A (here, the upper surface) on which a substrate, which is an object to be attracted, is mounted. The substrate body 41 is, for example, a dielectric material. The substrate body 41 is, for example, a ceramic substrate formed by sintering a green sheet made of aluminum oxide.

[0019] The electrode 42 is, for example, an electrostatic electrode for attracting a substrate placed on the mounting surface 41A. The electrode 42 is an electrode formed in a thin film shape. The electrode 42 is, for example, disposed on a plane parallel to the mounting surface 41A. The electrode 42 is electrically connected to, for example, an attraction power source provided outside the substrate fixing device 10 via a power supply terminal 60. When a predetermined voltage is applied from the attraction power source, the electrode 42 generates an electrostatic attraction force between the electrode 42 and the substrate placed on the mounting surface 41A. This allows the substrate to be attracted and held on the mounting surface 41A. The attraction and holding force of the electrostatic chuck 40 increases as the voltage applied to the electrode 42 increases. The electrode 42 may be monopolar or bipolar. The electrode 42 in this embodiment is monopolar. The voltage applied to the electrode 42 from the attraction power source via the power supply terminal 60 is, for example, approximately 3,000 V to 12,000 V. A voltage of about 12,000 V is applied to the electrode 42 in this embodiment. Electrode 42 may be made of, for example, tungsten (W) or molybdenum (Mo). While each drawing shows a single electrode 42, the electrode 42 actually includes multiple electrodes arranged on the same plane. The electrode 42 may also be an electrode for electrically connecting an electrostatic electrode built into the substrate body 41 to the power supply terminal 60.

[0020] As shown in FIG. 2, the electrostatic chuck 40 has a recess 43 provided on the lower surface of the substrate body 41. The recess 43 is formed so as to recess upward from the lower surface of the substrate body 41. The recess 43 is formed, for example, so as to expose a part of the lower surface of the electrode 42. The recess 43 is formed so as to communicate with the through holes 50, 55. The planar shape of the recess 43 can be any shape. In this embodiment, the planar shape of the recess 43 is formed to be circular.

[0021] (Configuration of the through-hole 50) The through hole 50 is formed to penetrate the base plate 20 in the thickness direction. The through hole 50 has, for example, a first recess 51 and a second recess 52 provided in the lower part 21 of the base plate 20, and a hole part 53 that penetrates the upper part 22 of the base plate 20 in the thickness direction. The first recess 51 and the second recess 52 are formed to penetrate the lower part 21 in the thickness direction in cooperation with each other.

[0022] The first recess 51 is formed so as to recess upward from the lower surface of the base plate 20, specifically the lower surface of the lower part 21. The first recess 51 extends from the lower surface of the lower part 21 to a central position in the thickness direction of the lower part 21. In other words, the bottom surface of the first recess 51 is provided at a central position in the thickness direction of the lower part 21. The first recess 51 is formed so as to open downward on the base plate 20. The planar shape of the first recess 51 can be any shape. The planar shape of the first recess 51 in this embodiment is formed to be circular.

[0023] The second recess 52 is recessed downward from the upper surface of the base plate 20, specifically the upper surface of the lower portion 21, and is formed to communicate with the first recess 51. The second recess 52 is formed to open upward from the base plate 20. The planar shape of the second recess 52 can be any shape. In this embodiment, the planar shape of the second recess 52 is formed to be circular. The second recess 52 has a smaller size than the first recess 51 in a planar view. That is, the opening area of ​​the second recess 52 is smaller than the opening area of ​​the first recess 51. In other words, the inner diameter of the second recess 52 is smaller than the inner diameter of the first recess 51. The second recess 52 is formed to overlap with the first recess 51 in a planar view. The central axis of the second recess 52 is, for example, positioned at a position shifted to the right in the figure from the central axis of the first recess 51. That is, the second recess 52 is positioned offset to the right in the left-right direction in the figure with respect to the central axis of the first recess 51.

[0024] The hole portion 53 is formed so as to penetrate from the upper surface to the lower surface of the upper portion 22 of the base plate 20. The hole portion 53 is formed so as to communicate with the second recess 52. The planar shape of the hole portion 53 can be any shape. In this embodiment, the planar shape of the hole portion 53 is formed to be circular. The hole portion 53 has the same size as the second recess 52 in a planar view. In other words, the inner diameter of the hole portion 53 is the same as the inner diameter of the second recess 52. The hole portion 53 is formed so as to overlap the entire second recess 52 in a planar view.

[0025] (Configuration of the through-hole 55) The through hole 55 is formed to penetrate the adhesive layer 30 in the thickness direction. The through hole 55 is formed to communicate with the hole portion 53. The through hole 55 is formed to communicate with the recess 43. The planar shape of the through hole 55 can be any shape. The planar shape of the through hole 55 in this embodiment is formed to be circular. The through hole 55 has the same size as the hole portion 53 in a planar view. That is, the inner diameter of the through hole 55 is the same as the inner diameter of the first recess 51. The through hole 55 is formed to overlap the entire hole portion 53 in a planar view. The through hole 55 has a size larger than the recess 43 in a planar view. That is, the inner diameter of the through hole 55 is larger than the inner diameter of the recess 43. The through hole 55 is provided to overlap the entire recess 43 in a planar view. The central axis of the through hole 55 is provided at the same position as the central axis of the recess 43, for example.

[0026] (Configuration of power supply terminal 60) The power supply terminal 60 is inserted into the through holes 50, 55 and the recess 43. The power supply terminal 60 has, for example, an electrode terminal 61, a connecting member 62, and a tubular conductive member 63. The connecting member 62 is formed to connect the electrode terminal 61 and the tubular conductive member 63. The electrode terminal 61, the connecting member 62, and the tubular conductive member 63 are, for example, separate parts. The electrode terminal 61, the connecting member 62, and the tubular conductive member 63 are each made of metal. The electrode terminal 61, the connecting member 62, and the tubular conductive member 63 are electrically connected to each other.

[0027] The electrode terminal 61 is formed, for example, in a columnar shape. The electrode terminal 61 of this embodiment is formed in a cylindrical shape. The upper end of the electrode terminal 61 is inserted inside the recess 43. The upper end of the electrode terminal 61 is joined to the electrode 42 by a joining member 65. The joining member 65 is provided, for example, inside the recess 43. The joining member 65 can be, for example, a solder material or a brazing material. In other words, the upper end of the electrode terminal 61 is soldered or brazed to the underside of the electrode 42 exposed from the recess 43. The electrode terminal 61 extends, for example, linearly downward from the electrode 42. The electrode terminal 61 is provided so as to pass through the through hole 55. The electrode terminal 61 is formed so as to extend, for example, from the electrode 42 to the first recess 51 of the through hole 50.

[0028] The connecting member 62 is inserted into the first recess 51 of the through hole 50. The connecting member 62 is connected to the lower end of the electrode terminal 61. The connecting member 62 is connected to the lower end of the electrode terminal 61 so as to be rotatable relative to the electrode terminal 61. The connecting member 62 is formed, for example, in a columnar shape. The connecting member 62 extends, for example, at an angle with respect to the axial direction of the through hole 50 (here, the up-and-down direction in the figure). The connecting member 62 extends, for example, diagonally downward (diagonally downward to the left in the figure) from the lower end of the electrode terminal 61. The lower end of the connecting member 62 is connected to the tubular conductive member 63. The connecting member 62 is crimped to the tubular conductive member 63 by, for example, a force used to screw the tubular conductive member 63 into the tubular insulating member 70. The connecting member 62 may be joined to the tubular conductive member 63 by a conductive resin.

[0029] The tubular conductive member 63 is inserted into the first recess 51 of the through hole 50. For example, the outer peripheral surface of the tubular conductive member 63 is connected to the lower end of the connecting member 62. The tubular conductive member 63 is formed in a tubular shape having a through hole 64 penetrating the tubular conductive member 63 in the thickness direction. The tubular conductive member 63 of this embodiment is formed in a cylindrical shape. Although not shown, a screw thread (external thread) is provided on the outer peripheral surface of the tubular conductive member 63 of this embodiment. The tubular conductive member 63 is provided at a position that does not overlap with the electrode terminal 61 in a plan view. The tubular conductive member 63 extends linearly, for example, in the up-down direction in the figure. The tubular conductive member 63 does not extend to the lower surface of the base plate 20. In other words, the lower surface of the tubular conductive member 63 is provided above the lower surface of the base plate 20. The outer diameter of the tubular conductive member 63 is, for example, larger than the outer diameter of the electrode terminal 61 and the outer diameter of the connecting member 62. The cylindrical conductive member 63 is electrically connected to an adsorption power supply (not shown) provided outside the substrate fixing device 10. When a voltage is supplied from the adsorption power supply to the cylindrical conductive member 63, the voltage is applied to the electrode 42 through the connecting member 62 and the electrode terminal 61.

[0030] (Configuration of insulating film 80) The insulating film 80 is formed to cover the inner surface of the through hole 50. The insulating film 80 is formed to cover the entire inner surface of the through hole 50. The insulating film 80 is formed to continuously cover the entire inner surface of the first recess 51, the entire inner surface of the second recess 52, and the entire inner surface of the hole 53. The insulating film 80 is formed, for example, to expose the inner surface of the through hole 55. For example, an aluminum oxide film can be used as the insulating film 80. For example, if the base plate 20 is made of aluminum or an aluminum alloy, the insulating film 80 can be formed by anodizing the base plate 20 or by thermally spraying aluminum oxide onto the base plate 20. The thickness of the insulating film 80 can be, for example, about 0.2 mm to 0.4 mm.

[0031] (Configuration of cylindrical insulating member 70) The cylindrical insulating member 70 is inserted into the through holes 50, 55. The cylindrical insulating member 70 is formed to be able to fit inside the through holes 50, 55. The cylindrical insulating member 70 is a single member. In other words, the cylindrical insulating member 70 is not a component formed by combining multiple parts. The cylindrical insulating member 70 is formed in a cylindrical shape that surrounds the outer periphery of the power supply terminal 60. The cylindrical insulating member 70 is formed to surround the entire outer periphery of the portion of the power supply terminal 60 that is located inside the through holes 50, 55. The cylindrical insulating member 70 is formed to extend the entire axial length of the through holes 50, 55. The cylindrical insulating member 70 is formed, for example, to fill the space between the outer periphery of the power supply terminal 60 and the inner periphery of the through holes 50, 55.

[0032] The cylindrical insulating member 70 has a first portion 71 and a second portion 72. The first portion 71 and the second portion 72 are formed continuously and integrally in the cylindrical insulating member 70. The cylindrical insulating member 70 can be made of an organic insulator such as polyimide or an inorganic insulator such as alumina. The cylindrical insulating member 70 can be made of a polyetherimide resin, which has excellent insulating properties. The cylindrical insulating member 70 can be made of a silicone resin, which has excellent insulating properties and flexibility.

[0033] The first portion 71 is fitted into the inside of the first recess 51 of the through hole 50. In this embodiment, the first portion 71 is formed in a cylindrical shape. The outer peripheral surface of the first portion 71 is formed in a shape (curved in this case) that follows the inner peripheral surface of the first recess 51. The outer diameter of the first portion 71 is, for example, slightly smaller than the inner diameter of the first recess 51. The first portion 71 extends, for example, from the lower end of the second portion 72 to the lower surface of the base plate 20. The lower end of the first portion 71 is formed, for example, to protrude downward beyond the lower surface of the tubular conductive member 63. In other words, the lower end of the first portion 71 has a protrusion 73 that protrudes downward beyond the lower surface of the tubular conductive member 63.

[0034] The second portion 72 is fitted into the second recess 52 and the hole 53 of the through hole 50, and is also fitted into the through hole 55. In this embodiment, the second portion 72 is formed in a cylindrical shape. The outer peripheral surface of the second portion 72 is formed into a shape (here, a curved surface) that follows the inner peripheral surfaces of the second recess 52, the hole 53, and the through hole 55. The outer diameter of the second portion 72 is, for example, slightly smaller than the inner diameter of the second recess 52. The outer diameter of the second portion 72 is smaller than the outer diameter of the first portion 71. The second portion 72 is provided so that its entirety overlaps with the first portion 71 in a plan view. The central axis of the second portion 72 is, for example, provided at a position shifted to the right in the figure from the central axis of the first portion 71. In other words, the second portion 72 is provided so as to be offset to the right in the left-right direction in the figure with respect to the central axis of the first portion 71.

[0035] The cylindrical insulating member 70 has, for example, a first hole 74 into which the electrode terminal 61 is inserted, a second hole 75 into which the connecting member 62 is inserted, and a third hole 76 into which the cylindrical conductive member 63 is inserted. The first hole 74, the second hole 75, and the third hole 76 are formed to cooperate to penetrate the cylindrical insulating member 70 in the thickness direction.

[0036] The first hole 74 is formed to communicate with the recess 43. The first hole 74 is formed to extend downward from the upper surface of the cylindrical insulating member 70. The inner circumferential surface of the first hole 74 is formed in a shape (here, a curved surface) that follows the outer circumferential surface of the electrode terminal 61. The inner diameter of the first hole 74 is, for example, slightly larger than the outer diameter of the electrode terminal 61.

[0037] The second hole portion 75 is formed to communicate with the first hole portion 74. The second hole portion 75 extends at an angle with respect to the axial direction of the first hole portion 74 (here, the vertical direction in the figure). The second hole portion 75 extends at an angle with respect to the axial direction of the through-hole 50 (here, the vertical direction in the figure). The second hole portion 75 extends, for example, diagonally downward (diagonally downward to the left in the figure) from the lower end of the first hole portion 74. The inner circumferential surface of the second hole portion 75 is formed in a shape (here, a curved surface) that follows the outer circumferential surface of the connecting member 62. The inner diameter of the second hole portion 75 is, for example, slightly larger than the outer diameter of the connecting member 62.

[0038] The third hole portion 76 is formed to communicate with the second hole portion 75. The third hole portion 76 is formed to extend upward from the lower surface of the cylindrical insulating member 70. The inner circumferential surface of the third hole portion 76 is formed in a shape (here, a curved surface) that follows the outer circumferential surface of the cylindrical conductive member 63. The inner diameter of the third hole portion 76 is, for example, slightly larger than the outer diameter of the cylindrical conductive member 63. The depth of the third hole portion 76 is, for example, larger than the height of the cylindrical conductive member 63. The cylindrical conductive member 63 is fitted into the upper part of the third hole portion 76. Although not shown in the figures, a screw groove (female thread) is provided on the inner circumferential surface of the third hole portion 76.

[0039] In this manner, in the substrate fixing device 10 of this embodiment, the outer periphery of the power supply terminal 60 is surrounded by the single cylindrical insulating member 70 . (Adhesive 90 composition) The substrate fixing device 10 has an adhesive 90 that bonds the base plate 20 and the cylindrical insulating member 70. The adhesive 90 bonds, for example, the power supply terminal 60 and the cylindrical insulating member 70. The adhesive 90 bonds, for example, the electrostatic chuck 40 and the cylindrical insulating member 70.

[0040] The adhesive 90 is formed, for example, to fill a gap between the cylindrical insulating member 70 and the base plate 20. The adhesive 90 is formed, for example, to fill a gap between the outer peripheral surface of the first portion 71 and the inner peripheral surface of the first recess 51. The adhesive 90 is formed, for example, to fill a gap between the outer peripheral surface of the second portion 72 and the inner peripheral surfaces of the second recess 52 and the hole 53. The adhesive 90 is formed, for example, to fill a gap between the cylindrical insulating member 70 and the adhesive layer 30. The adhesive 90 is formed, for example, to fill a gap between the outer peripheral surface of the cylindrical insulating member 70 and the inner peripheral surface of the through hole 55. The adhesive 90 is formed, for example, to fill a gap between the upper surface of the cylindrical insulating member 70 and the lower surface of the substrate body 41 of the electrostatic chuck 40. The cylindrical insulating member 70 is bonded to the inner peripheral surfaces of the through holes 50 and 55 and to the lower surface of the electrostatic chuck 40 by the adhesive 90. In addition, the adhesive 90 can eliminate gaps between the base plate 20 and the cylindrical insulating member 70, gaps between the adhesive layer 30 and the cylindrical insulating member 70, and gaps between the electrostatic chuck 40 and the cylindrical insulating member 70.

[0041] The adhesive 90 is formed so as to fill the gap between the power supply terminal 60 and the tubular insulating member 70. The adhesive 90 is formed so as to fill the gap between the outer peripheral surface of the electrode terminal 61 and the inner peripheral surface of the first hole 74. The adhesive 90 is formed so as to fill the gap between the outer peripheral surface of the connecting member 62 and the inner peripheral surface of the second hole 75. The electrode terminal 61 and the connecting member 62 are bonded to the inner peripheral surfaces of the first hole 74 and the second hole 75 by the adhesive 90. The adhesive 90 also makes it possible to eliminate the gap between the power supply terminal 60 and the tubular insulating member 70.

[0042] The adhesive 90 is formed, for example, so as to fill the gap between the electrode terminal 61 and the substrate main body 41. The adhesive 90 is formed, for example, so as to fill the recess 43 exposed from the electrode terminal 61 and the bonding member 65. Such adhesive 90 allows the electrode terminal 61 to be stably fixed to the inner surface of the recess 43.

[0043] For example, an adhesive made of a polymer compound can be used as the adhesive 90. For example, a silicone-based adhesive can be used as the adhesive 90. (Manufacturing Method of Substrate Fixing Device 10) Next, a description will be given of a manufacturing method of the substrate holding device 10. For convenience of explanation, the parts that will ultimately become the components of the substrate holding device 10 will be described using the reference numerals of the final components.

[0044] 3, an electrostatic chuck 40 is prepared, which includes a substrate body 41, an electrode 42 built in the substrate body 41, and a recess 43 that exposes a portion of the lower surface of the electrode 42. Also, in the process shown in FIG. 3, a structure is prepared which includes an electrode terminal 61 and a connecting member 62 rotatably connected to the lower end of the electrode terminal 61. Next, the upper end of the electrode terminal 61 is joined to the lower surface of the electrode 42 exposed from the recess 43 by a joining member 65. At this time, the connecting member 62 extends linearly downward from the lower end of the electrode terminal 61, for example.

[0045] 4, a base plate 20 is formed having a lower portion 21, an upper portion 22, and through holes 50 that penetrate the lower portion 21 and the upper portion 22 in the thickness direction, and an adhesive layer 30 having through holes 55 is formed on the upper surface of the base plate 20. At this time, an insulating film 80 is formed on the inner surface of the through hole 50 as needed. The insulating film 80 can be formed, for example, by anodizing or by thermal spraying of aluminum oxide onto the inner surface of the through hole 50.

[0046] 3 is placed above the structure having the base plate 20 and the adhesive layer 30. At this time, the structures are aligned so that the lower surface of the electrostatic chuck 40 faces the upper surface of the adhesive layer 30 and so that the electrode terminals 61 and the connecting members 62 can be inserted into the through holes 50, 55.

[0047] 5, the base plate 20 and the electrostatic chuck 40 are bonded together by the adhesive layer 30. At this time, the electrode terminals 61 and the connecting members 62 are disposed inside the through holes 50 and 55.

[0048] 6, a fluid adhesive 90 is applied or the like to the inner surfaces of the through holes 50 and 55, the lower surface of the substrate body 41 exposed from the through hole 55, and the outer peripheral surfaces of the electrode terminal 61 and the connecting member 62. The adhesive 90 is applied so as to fill the recess 43.

[0049] Next, a cylindrical insulating member 70 having a first portion 71, a second portion 72, a first hole portion 74, a second hole portion 75, and a third hole portion 76 is prepared. Next, the cylindrical insulating member 70 is inserted into the through holes 50, 55 from below the base plate 20. When inserting the cylindrical insulating member 70, the connecting member 62 is first inserted into the first hole portion 74 of the cylindrical insulating member 70. As the insertion of the cylindrical insulating member 70 progresses, the lower end of the connecting member 62 is inserted into the second hole portion 75 of the cylindrical insulating member 70. As the insertion of the cylindrical insulating member 70 progresses further, the lower end of the connecting member 62 is guided along the inner circumferential surface of the second hole portion 75, causing the connecting member 62 to rotate relative to the lower end of the electrode terminal 61. As a result, the connecting member 62 is formed to extend diagonally downward to the left in the figure along the second hole 75, and the lower end of the connecting member 62 is inserted into the third hole 76 of the tubular insulating member 70. The tubular insulating member 70 is then inserted, for example, until its upper surface abuts against the lower surface of the substrate main body 41 (specifically, the adhesive 90 covering the lower surface of the substrate main body 41). At this time, the fluid adhesive 90 spreads into the gap between the base plate 20 and the tubular insulating member 70, the gaps between the electrode terminal 61 and the connecting member 62 and the tubular insulating member 70, and the gap between the substrate main body 41 and the tubular insulating member 70.

[0050] Next, the adhesive 90 is cured (hardened) to bond the base plate 20 to the tubular insulating member 70, to bond the electrode terminal 61 and the connecting member 62 to the tubular insulating member 70, and to bond the substrate main body 41 to the tubular insulating member 70.

[0051] 7, the tubular conductive member 63 is inserted into the third hole 76 of the tubular insulating member 70. The tubular conductive member 63 is inserted, for example, until its top surface abuts the bottom surface of the third hole 76. In this embodiment, the tubular conductive member 63 is screwed into the third hole 76 by threading the threads on the outer peripheral surface of the tubular conductive member 63 into the thread grooves on the inner peripheral surface of the third hole 76. Then, the force used to screw the tubular conductive member 63 crimps the tubular conductive member 63 and the connecting member 62 together. This forms the power supply terminal 60 in which the electrode terminal 61, the connecting member 62, and the tubular conductive member 63 are electrically connected to one another.

[0052] The substrate fixing device 10 of this embodiment can be manufactured by the above manufacturing steps. (Effects of this embodiment) Next, the effects of this embodiment will be described.

[0053] (1) In conventional substrate fixing devices, the cylindrical insulating member is constructed by combining multiple components. In this case, gaps are formed between the multiple components that make up the cylindrical insulating member. Such gaps reduce electrical insulation. As a result, discharges may occur between the base plate and the power supply terminals due to the gaps between the multiple components that make up the cylindrical insulating member. In particular, when the voltage applied to the electrodes is a high voltage of 7 kV or more, the problem of discharges occurring between the base plate and the power supply terminals becomes more pronounced.

[0054] In contrast, in the substrate fixing device 10 of this embodiment, the cylindrical insulating member 70 is formed to completely surround the outer peripheral surface of the portion of the power supply terminal 60 located inside the through holes 50, 55 and to extend the entire axial length of the through holes 50, 55. Furthermore, the cylindrical insulating member 70 is a single member. That is, the cylindrical insulating member 70, which extends the entire axial length of the through holes 50, 55, is not a component constructed by combining multiple components. This eliminates gaps between multiple components in the cylindrical insulating member 70. This improves the electrical insulation of the cylindrical insulating member 70 compared to conventional cylindrical insulating members that are composed of multiple components. As a result, the electrical insulation between the base plate 20 and the power supply terminal 60 is improved, thereby effectively suppressing the occurrence of discharge between the base plate 20 and the power supply terminal 60. The inventors have confirmed through simulations that constructing the cylindrical insulating member 70 from a single member improves electrical insulation.

[0055] (2) The cylindrical insulating member 70 is formed to fill the gap between the outer peripheral surface of the power supply terminal 60 and the inner peripheral surface of the through hole 50. This reduces the gap between the outer peripheral surface of the power supply terminal 60 and the inner peripheral surface of the through hole 50, thereby reducing the area where electrical insulation is reduced between the outer peripheral surface of the power supply terminal 60 and the inner peripheral surface of the through hole 50. As a result, discharge between the base plate 20 and the power supply terminal 60 can be effectively suppressed.

[0056] (3) The cylindrical insulating member 70 has a protruding portion 73 that protrudes downward below the bottom surface of the power supply terminal 60. With this configuration, when a connection terminal connected to a suction power source is connected to the bottom end of the power supply terminal 60, the electrical insulation between the connection terminal and the base plate 20 can be improved by the single cylindrical insulating member 70.

[0057] (4) An insulating film 80 is formed to cover the entire inner surface of the through-hole 50. This insulating film 80 can further improve the electrical insulation between the base plate 20 and the power supply terminal 60. As a result, the occurrence of a discharge phenomenon between the base plate 20 and the power supply terminal 60 can be more effectively suppressed.

[0058] (5) The adhesive 90 is formed to fill the gap between the insulating film 80 and the cylindrical insulating member 70, and also to fill the gap between the power supply terminal 60 and the cylindrical insulating member 70. With this configuration, the adhesive 90 can fill the gap that occurs between the outer circumferential surface of the power supply terminal 60 and the inner circumferential surface of the through hole 50. This reduces the area where electrical insulation is reduced between the outer circumferential surface of the power supply terminal 60 and the inner circumferential surface of the through hole 50. As a result, discharge between the base plate 20 and the power supply terminal 60 can be effectively suppressed.

[0059] (6) The power supply terminal 60 includes an electrode terminal 61 joined to the electrode 42, a tubular conductive member 63 disposed at a position that does not overlap the electrode terminal 61 in a plan view, and a connecting member 62 that connects the electrode terminal 61 and the tubular conductive member 63. The connecting member 62 extends at an angle with respect to the axial direction of the through hole 50. With this configuration, even if the electrode terminal 61 and the tubular conductive member 63 are disposed at positions offset from each other in a plan view, the connecting member 62 can electrically connect the electrode terminal 61 and the tubular conductive member 63.

[0060] (7) The cylindrical insulating member 70 has a first hole 74 into which the electrode terminal 61 is inserted, a second hole 75 into which the connecting member 62 is inserted and which communicates with the first hole 74, and a third hole 76 into which the cylindrical conductive member 63 is inserted and which communicates with the second hole 75. The second hole 75 extends at an angle with respect to the axial direction of the through hole 50. The connecting member 62 is connected to the lower end of the electrode terminal 61 so as to be rotatable relative to the electrode terminal 61.

[0061] According to this configuration, the connecting member 62 is rotatably connected to the electrode terminal 61. Therefore, when the cylindrical insulating member 70 is attached to the outer periphery of the power supply terminal 60, the connecting member 62 is guided by the inner circumferential surface of the second hole portion 75, which extends at an angle with respect to the axial direction of the through hole 50, and the connecting member 62 can be suitably inserted into the inside of the second hole portion 75.

[0062] (Example of change) The above embodiment can be modified as follows: The above embodiment and the following modifications can be combined with each other within the scope of technical compatibility.

[0063] The structure of the power supply terminal 60 in the above embodiment can be modified as needed. For example, as shown in FIG. 8, a recess 66 may be provided on the outer peripheral surface of the cylindrical conductive member 63. The recess 66 is formed so as to be recessed from the outer peripheral surface of the cylindrical conductive member 63 toward the radially inward direction of the cylindrical conductive member 63. The recess 66 extends, for example, upward from the lower surface of the cylindrical conductive member 63. In this modified example, the recess 66 is formed so as to cut out the lower end of the cylindrical conductive member 63. In this modified example, the cylindrical insulating member 70 has a filling portion 77 formed to fill the recess 66. The filling portion 77 is formed to fill the internal space of the recess 66.

[0064] According to this configuration, by providing the recessed portion 66 on the outer peripheral surface of the cylindrical conductive member 63, it is possible to increase the distance between the cylindrical conductive member 63 and the base plate 20. Furthermore, by providing the cylindrical insulating member 70 with the filled portion 77 formed to fill the recessed portion 66, it is possible to suitably improve the electrical insulation between the cylindrical conductive member 63 and the base plate 20. This makes it possible to suitably suppress the occurrence of a discharge phenomenon between the base plate 20 and the cylindrical conductive member 63.

[0065] For example, as shown in FIG. 9 , an insulating layer 95 may be provided in the recess 66. The insulating layer 95 is formed to fill the recess 66. That is, the insulating layer 95 is formed to fill the internal space of the recess 66. The insulating layer 95 is a separate member from the cylindrical insulating member 70. For example, an aluminum oxide film can be used as the insulating layer 95. The insulating layer 95 can be formed, for example, by thermally spraying aluminum oxide onto the recess 66.

[0066] According to this configuration, it is possible to obtain the same effects as those of the modified example shown in FIG. 8 and 9, the recessed portion 66 is provided on the outer peripheral surface of the cylindrical conductive member 63, but this is not limiting. For example, the recessed portion 66 may be provided on the outer peripheral surface of the electrode terminal 61. For example, the recessed portion 66 may be provided on the outer peripheral surface of the connecting member 62.

[0067] While the power supply terminal 60 in the above embodiment is configured by combining multiple conductive components, namely, the electrode terminal 61, the connecting member 62, and the tubular conductive member 63, this is not limiting. For example, the power supply terminal 60 may be configured with only a single conductive component. For example, the power supply terminal 60 may be configured with only the electrode terminal 61. For example, the power supply terminal 60 may be configured with only the tubular conductive member 63. In these cases, for example, the power supply terminal 60 is formed so as to extend linearly in one direction (for example, a direction parallel to the axial direction of the through hole 50). Therefore, the shapes of the through holes 50, 55 are changed to match the shape of the power supply terminal 60, and the shape of the tubular insulating member 70 is changed to match the shape of the power supply terminal 60.

[0068] In the above embodiment, the lower surface of the power supply terminal 60, specifically the lower surface of the cylindrical conductive member 63, is located above the lower surface of the base plate 20, but this is not limiting. For example, the power supply terminal 60 may extend to the lower surface of the base plate 20. In other words, the lower surface of the power supply terminal 60 may be located on the same plane as the lower surface of the base plate 20.

[0069] In the above embodiment, the power supply terminal 60 is joined to the electrode 42 by the joining member 65, but this is not limiting. For example, the power supply terminal 60 may be changed to one that uses elastic force to make contact with the underside of the electrode 42 exposed from the recess 43. In this case, the power supply terminal 60 and the electrode 42 come into contact with each other using elastic force, thereby electrically connecting the power supply terminal 60 and the electrode 42 to each other.

[0070] In the above embodiment, the cylindrical insulating member 70 manufactured separately from the base plate 20 and the like is inserted into the through-hole 50, 55 of the base plate 20, but this is not limiting. For example, the cylindrical insulating member 70 may be formed by pouring a fluid resin into the through-hole 50, 55 and hardening it, with the power supply terminal 60 having the electrode terminal 61, the connecting member 62, and the cylindrical conductive member 63 disposed inside the through-hole 50, 55. In this case, the adhesive 90 can be omitted.

[0071] The insulating film 80 in the above embodiment may be formed so as to cover the inner surface of the through-hole 55 provided in the adhesive layer 30 . The insulating film 80 in the above embodiment may be omitted.

[0072] The substrate holding device 10 in the above embodiment is applied to semiconductor manufacturing equipment, such as a dry etching device. An example of a dry etching device is a parallel plate reactive ion etching device. The substrate holding device 10 can also be applied to semiconductor manufacturing equipment such as a plasma CVD (Chemical Vapor Deposition) device or a sputtering device. [Explanation of symbols]

[0073] 10 Board fixing device 20 base plate 30 Adhesive layer 40 Electrostatic Chuck 41 Board body 41A Mounting surface 42 electrodes 43 Recess 50 through hole (first through hole) 55 Through hole (second through hole) 60 Power supply terminal 61 Electrode terminal 62 Connecting member 63 Cylindrical conductive member 66 Recessed part 70 Cylindrical insulating member 73 Protrusion 74 1st hole 75 2nd hole 76 3rd hole 77 Filling section 80 insulating film 90 Adhesive 95 Insulating layer

Claims

1. A base plate and an electrostatic chuck fixed on the base plate; a first through hole penetrating the base plate in a thickness direction; a recess provided on a lower surface of the electrostatic chuck and communicating with the first through hole; an electrode built into the electrostatic chuck; a power supply terminal inserted into the first through hole and electrically connected to the electrode exposed from the recess; a cylindrical insulating member that is inserted into the first through hole and surrounds the outer periphery of the power supply terminal, the cylindrical insulating member is formed to surround the entire outer circumferential surface of the portion of the power supply terminal that is disposed inside the first through hole, the cylindrical insulating member is formed to extend over the entire axial length of the first through hole, The substrate fixing device, wherein the cylindrical insulating member is a single member.

2. The substrate fixing device according to claim 1 , wherein the cylindrical insulating member is formed so as to fill a gap between an outer peripheral surface of the power supply terminal and an inner peripheral surface of the first through hole.

3. a lower surface of the power supply terminal is provided above a lower surface of the base plate, The substrate fixing device according to claim 1 , wherein the cylindrical insulating member has a protruding portion that protrudes downward below a lower surface of the power supply terminal.

4. The substrate fixing device according to claim 1 , further comprising an insulating film that covers the entire inner surface of the first through hole.

5. The insulating member further includes an adhesive that bonds the base plate and the cylindrical insulating member together, 5. The substrate fixing device according to claim 4, wherein the adhesive is formed so as to fill a gap between the insulating film and the cylindrical insulating member, and also to fill a gap between the power supply terminal and the cylindrical insulating member.

6. an adhesive layer that bonds the base plate and the electrostatic chuck together; a second through hole penetrating the adhesive layer in a thickness direction, the second through hole is formed to communicate with the first through hole and the recess, the power supply terminal is inserted into the second through hole, the cylindrical insulating member is inserted into the second through hole and is formed to surround the entire outer circumferential surface of the portion of the power supply terminal that is disposed inside the second through hole, The substrate fixing device according to claim 1 , wherein the cylindrical insulating member is formed to extend over the entire axial length of the second through hole.

7. a recessed portion provided on an outer peripheral surface of the power supply terminal; The substrate fixing device according to claim 1 , wherein the cylindrical insulating member has a filling portion formed to fill the recessed portion.

8. a recessed portion provided on an outer peripheral surface of the power supply terminal; further comprising an insulating layer formed to fill the recessed portion, The substrate fixing device according to claim 1 , wherein the insulating layer is a separate member from the cylindrical insulating member.

9. The power supply terminal is an electrode terminal joined to the electrode; a cylindrical conductive member disposed at a position not overlapping with the electrode terminal in a plan view; a connecting member that connects the electrode terminal and the cylindrical conductive member, The substrate fixing device according to claim 1 , wherein the connecting member extends at an angle with respect to the axial direction of the first through hole.

10. The cylindrical insulating member is a first hole into which the electrode terminal is inserted; a second hole into which the connecting member is inserted and which communicates with the first hole; a third hole portion into which the cylindrical conductive member is inserted and which communicates with the second hole portion, the second hole portion extends obliquely with respect to the axial direction of the first through hole, The substrate fixing device according to claim 9 , wherein the connecting member is connected to a lower end of the electrode terminal so as to be rotatable relative to the electrode terminal.

Images