Taping machine

Abstract

To provide a peeling device and a taping machine that can suppress a semiconductor chip from shifting in position after being peeled off.SOLUTION: A peeling device 20 comprises an extrusion member 262 which extrudes a semiconductor chip C stuck on a sheet ST through the sheet ST, an ultrasonic vibration generation part 266 which applies ultrasonic vibrations to the extrusion member 262, and a suction collet 204 which sucks the semiconductor chip C with which the extrusion member 262 has come into contact, and the suction collet 204 has a hollow 206 formed at a tip portion in a truncated pyramid shape or rectangular parallelepiped shape.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention , Te Regarding the parking machine. [Background technology]

[0002] Patent Document 1 describes a method for peeling a thin film chip from an adhesive sheet, which is characterized by applying vibration from the back surface of the adhesive sheet to the thin film chip in a pushing-away direction when peeling the thin film chip attached to the adhesive sheet from the adhesive sheet. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2-230754 Summary of the Invention [Problem to be solved by the invention]

[0004] The present invention can suppress the misalignment of the semiconductor chip after peeling. Rute The purpose of the present invention is to provide a parking machine. [Means for solving the problem]

[0005] The invention described in claim 1 is a taping machine comprising an extrusion member that extrudes semiconductor chips affixed to a sheet through the sheet, an ultrasonic vibration generating unit that applies ultrasonic vibrations to the extrusion member, an suction collet having a truncated pyramidal or rectangular parallelepiped depression formed at its tip, and a transport collet to which semiconductor chips are transferred from the suction collet, wherein the suction collet adsorbs semiconductor chips peeled from the sheet without moving back and forth relative to the sheet, the distance between the sheet and the tip of the suction collet when the semiconductor chip is peeled is less than the thickness of the semiconductor chip, and the distance between the tip of the suction collet and the tip of the transport collet when the semiconductor chip is transferred from the suction collet to the transport collet is less than the thickness of the semiconductor chip.

[0006] In a second aspect of the invention, in the taping machine of the first aspect, a part of the semiconductor chip that is sucked by the suction collet and placed in the recess protrudes from the tip end surface of the suction collet.

[0007] A third aspect of the invention is the taping machine of the second aspect, wherein the dimension of the semiconductor chip protruding from the tip end face of the suction collet is 50% or less of the thickness.

[0008] The invention described in claim 4 is a taping machine described in any one of claims 1 to 3, wherein the depression is truncated pyramid-shaped, the depth of the depression is greater than the thickness of the semiconductor chip, and the semiconductor chip is adsorbed with a gap between the depression and the bottom surface in which the suction hole is formed.

[0009] According to a fifth aspect of the present invention, in the taping machine of the fourth aspect, the ultrasonic vibration generating unit generates ultrasonic vibrations before the pushing member comes into contact with the sheet. [Effects of the Invention]

[0010] According to the present invention, it is possible to suppress the misalignment of the semiconductor chip after peeling. Rute We can provide a pooling machine. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a plan view schematically showing a taping machine according to an embodiment of the present invention; [Figure 2] FIG. 2 is a diagram illustrating a peeling device provided in the taping machine, as viewed from the side; [Figure 3] 5(A) to 5(C) are explanatory views schematically showing the operation of a peeling device provided in the taping machine. [Figure 4] 10(A) to 10(H) are timing charts showing the operation of each part of the taping machine. [Figure 5] 10 is an explanatory diagram showing a schematic view of a state in which a suction collet of a peeling device provided in the taping machine transfers a semiconductor chip to a transport collet. FIG. [Figure 6] 3(A) to 3(C) are diagrams corresponding to FIGS. 3(A) to 3(C), respectively, and are explanatory diagrams showing examples of dimensions of each part of the peeling device provided in the taping machine. [Figure 7] 3(A) to 3(C) are diagrams corresponding to FIGS. 3(A) to 3(C), respectively, and are explanatory diagrams showing examples of dimensions of each part of the peeling device when a modified example of the suction collet is used. DETAILED DESCRIPTION OF THE INVENTION

[0012] Next, embodiments of the present invention will be described with reference to the accompanying drawings to facilitate understanding of the present invention. Note that in the drawings, parts that are not relevant to the description may be omitted.

[0013] As shown in FIG. 1, a taping machine 10 according to an embodiment of the present invention includes a peeling device 20, a transporting device 30, processing units 40a to 40g, and a taping unit 42, and can encapsulate semiconductor chips C in carrier tapes.

[0014] The peeling device 20 has a chip suction section 21 and a push-out unit 22, and can push out and peel off the semiconductor chips C from the diced wafer attached to the sheet ST (see FIG. 2). This peeling device 20 will be described in detail later.

[0015] The transport device 30 has a rotary table 302 that rotates around a rotation axis AX2 and a transport collet 304 that is arranged along the outer periphery of the rotary table 302 and can move back and forth in the vertical direction. The tip end surface of the transport collet 304 is formed with suction holes for air suction. The semiconductor chip C is transferred from the suction collet 204 to the transport collet 304, and is transported while rotating together with the rotary table 302 around the rotation axis AX2 while being held by air suction to the transport collet 304.

[0016] The processing units 40a to 40g each perform a predetermined process on the semiconductor chips C delivered from the transport collet 304. Taking the processing units 40a, 40c, 40e, and 40g as an example in particular, the processing unit 40a is an appearance inspection unit that can inspect the appearance of the semiconductor chip C and the amount of positional deviation from a reference position.

[0017] The processing unit 40c is a positioning device that can position the semiconductor chip C delivered from the transport collet 304 within a predetermined tolerance range.

[0018] The processing unit 40e is a ranking unit, and can rank the semiconductor chips C according to their quality. The processing unit 40g is a forced ejection unit, and can eject semiconductor chips C that do not meet a predetermined quality.

[0019] The taping unit 42 can seal the semiconductor chips C delivered from the transport collet 304 in a carrier tape.

[0020] The semiconductor chips C peeled off from the wafer by the peeling device 20 are transported by the transport collet 304, which rotates together with the rotary table 302, to each of the processing units 40a to 40g, where they are sequentially subjected to predetermined processing, and are then sealed in a carrier tape by the taping unit 42.

[0021] Next, the peeling device 20 will be described in detail.

[0022] The peeling device 20 can peel and remove a predetermined semiconductor chip C from the sheet ST to which a plurality of diced semiconductor chips C are attached. The thickness of the sheet ST is, for example, 0.1 mm. The length of the semiconductor chip C is, for example, 0.4 to 1.0 mm, the width is, for example, 0.2 to 0.7 mm, and the thickness is, for example, 0.05 to 0.2 mm.

[0023] As shown in FIG. 2, the peeling device 20 includes a chip suction section 21 that suctions the semiconductor chip C, and a push-out unit 22.

[0024] The chip suction portion 21 has a suction collet 204 . As shown in Fig. 3(A), the suction collet 204 has a truncated pyramidal depression 206 formed on its tip surface. A suction hole HL1 for air suction is formed in the bottom surface 207 of this depression 206, and it can suction the semiconductor chip C peeled off from the sheet ST. The semiconductor chip C is sucked so that it fits into this depression 206, with some exceptions. The truncated pyramidal depression may be a rectangular parallelepiped depression. The depth of the depression 206 is set to be greater than the thickness of the semiconductor chip C.

[0025] 2, a plurality of suction collets 204 are arranged around a rotation axis AX1 extending horizontally, and rotate around this rotation axis AX1 to sequentially pick up semiconductor chips C. The picked-up semiconductor chips C are then transferred to a transport collet 304. The flow rate of the suction air for the suction collet 204 to suction the semiconductor chip C is measured by a flow rate sensor (not shown). The suction collet 204 can only rotate around the rotation axis AX1, and does not move forward or backward relative to the sheet ST (semiconductor chips C).

[0026] The extrusion unit 22 has a sheet adsorption section 24 that adsorbs the sheet ST and an extrusion section 26 that extrudes the semiconductor chip C, and can move forward and backward relative to the semiconductor chip C as shown by the arrow X in Figure 1, and extrude the semiconductor chip C through the sheet ST attached to the wafer ring 202.

[0027] The sheet adsorption unit 24 includes an adsorption holder 242 and an adsorption holder advance / retract mechanism 243 . The suction holder 242 moves forward and backward relative to the sheet ST, and can adsorb the sheet ST at its leading end surface. 3(A), a hole HL2 is formed in the center of the tip surface of the suction holder 242. Around the hole HL2, suction holes HL3 are formed for air-suctioning the sheet ST to which the semiconductor chips C are attached.

[0028] As shown in FIG. 2, the suction holder advancing / retracting mechanism 243 has a cam 244 and a servo motor 246, and is capable of advancing / retracting the suction holder 242 relative to the sheet ST. The cam 244 can advance and retreat the attachment member 248, which has the suction holder 242 at its tip, at a preset timing. The servo motor 246 is a motor that serves as a drive source for rotating the cam 244 .

[0029] The pushing section 26 has a pushing member 262, a pushing member holder 264, an ultrasonic vibration generating section 266, and a pushing member advancing and retracting mechanism 268, and as shown in Figures 3(A) to 3(C), the tip of the pushing member 262 advances from the tip of the suction holder 242.

[0030] The pushing member 262 can push the semiconductor chip C attached to the sheet ST through the sheet ST, and can also apply ultrasonic vibrations generated by the ultrasonic vibration generator 266. The tip of the pushing member 262 is formed to taper toward the tip, and the tip surface is a flat surface shaped to correspond to the shape of the semiconductor chip C. The pushing member 262 is housed inside a hole HL2 (see FIG. 3(A)) provided in the suction holder 242, and can pass through this hole HL2 to contact the semiconductor chip C attached to the sheet ST from the side of the sheet ST, pushing it. The extrusion member 262 is a consumable part that wears with repeated use and is replaced depending on the usage condition. Therefore, the extrusion member 262 is attached to the extrusion member holder 264 by screw fastening so that the extrusion member 262 can be easily replaced and can transmit ultrasonic vibrations stably. Specifically, a male screw is formed at the base of the extrusion member 262.

[0031] The ejection member holder 264 is a cylindrical member to which the ejection member 262 is attached. A female screw that corresponds to the male screw formed at the base of the ejection member 262 is formed on the tip surface of the ejection member holder 264.

[0032] As shown in FIG. 2, the ultrasonic vibration generating unit 266 has an ultrasonic oscillator 270 and an ultrasonic vibrator 272, and can generate ultrasonic vibrations based on a command signal from a control device (not shown) that controls the entire taping machine 10.

[0033] The ultrasonic oscillator 270 can drive the ultrasonic vibrator 272 based on an output command signal from a control device (not shown). The ultrasonic vibrator 272 is capable of generating ultrasonic vibrations, and the proximal end of the pusher member holder 264 is fixed thereto. The pusher member holder 264 and the pusher member 262 attached to the tip thereof function as an ultrasonic horn that transmits the generated ultrasonic vibrations.

[0034] The push-out member advancing / retreating mechanism 268 has a cam 274 and a servo motor 276, and is capable of moving the push-out member 262 forward and backward relative to the sheet ST. The cam 274 can advance and retract the ultrasonic vibrator 272 at a preset timing. That is, the pushing member 262 and the pushing member holder 264 advance and retract according to the profile of the cam 274. The servo motor 276 is a motor that serves as a drive source for rotating the cam 274 .

[0035] The chip suction section 21, sheet suction section 24, push-out section 26, transport device 30, each of the processing units 40a to 40g, taping unit 42 and other sections are controlled by the aforementioned control device (not shown).

[0036] Next, the operation of the peeling device 20 (a method for peeling the semiconductor chips C) will be described with reference to Figures 3 and 4. The semiconductor chips C attached to the sheet ST are peeled in accordance with the following steps S1 to S4, which are divided into periods T1 to T4 (see Figure 4). 4(A) to 4(H) show the operation timing of each part, with the horizontal axis representing time. FIG. 4(A) shows the operation timing of the rotary table 302. FIG. 4(B) shows the operation timing of the suction collet 204. FIG. 4(C) shows the state of the air suction operation of the suction collet 204. FIG. 4(D) shows the operation timing of the wafer positioning mechanism. FIG. 4(E) shows the operation timing of the suction holder 242, with the vertical axis representing its position. FIG. 4(F) shows the state of the air suction operation of the suction holder 242. FIG. 4(G) shows the operation timing of the push-out member 262, with the vertical axis representing its position. FIG. 4(H) shows an ultrasonic vibration command from a control device (not shown). When the command is ON, the ultrasonic oscillator 270 drives the ultrasonic vibrator 272, generating ultrasonic vibrations.

[0037] (Process S1: Period T1) The semiconductor chips C attached to the sheet ST are positioned by a wafer positioning mechanism (not shown) (see FIG. 4(D)). As a result, as shown in FIG. 3(A), the semiconductor chips C to be peeled are positioned in the direction in which the pushing member 262 advances. The suction pressure of the suction collet 204 and the suction holder 242 is maintained at a negative pressure throughout the periods T1 to T4 (see FIGS. 4(C) and 4(F)), and the suction holder 242 continues to suction the sheet ST during the periods T1 to T4. In other words, when the semiconductor chip C is positioned by the wafer positioning mechanism, the sheet ST moves while being sucked by the suction holder 242.

[0038] (Process S2: Period T2) The rotating turntable 302 (see FIG. 1) stops (see FIG. 4(A)). Also, the suction collet 204, which has been rotating around the rotation axis AX1 shown in FIG. 2, comes to a standstill facing the semiconductor chip C at the predetermined peeling position (see FIG. 4(B)). Meanwhile, the suction holder 242 and the pushing member 262 advance toward the sheet ST (see FIGS. 4(E) and 4(G)). As the pushing member 262 continues to advance, it pushes out a predetermined amount of the semiconductor chip C to be peeled through the sheet ST, as shown in FIG. 3(B). At this time, the distance g1 between the surface of the sheet ST on which the semiconductor chip C to be peeled was attached and the tip of the suction collet 204 is less than the thickness of the semiconductor chip C.

[0039] (Process S3: Period T3) The suction holder 242 and the pushing member 262 come to rest (see FIGS. 4(E) and 4(G)). A control device (not shown) outputs a command to generate ultrasonic vibrations to the ultrasonic oscillator 270 (see FIG. 4(H)). Based on this command, the ultrasonic oscillator 270 drives the ultrasonic vibrator 272, and applies ultrasonic vibrations via the pushing member 262 to the semiconductor chip C that has been pushed out by the pushing member 262 by a predetermined amount. As a result, the semiconductor chip C is peeled off, and the suction collet 204 picks up the semiconductor chip C by suction, as shown in FIG. 3(C).

[0040] In this way, according to the peeling device 20, the semiconductor chip C is peeled off using ultrasonic vibrations, which prevents the semiconductor chip C from being subjected to strong impact forces compared to when the semiconductor chip C is sandwiched between the extrusion member 262 and the suction collet 204 and peeled off, thereby reducing the possibility of damaging the semiconductor chip C.

[0041] When the suction collet 204 suctions the semiconductor chip C, the flow rate of the suction air of the suction collet 204 decreases, and it is detected that the semiconductor chip C has been detached. Here, the semiconductor chip C adsorbed by the suction collet 204 comes into contact with the inclined surface forming the recess 206, as shown in Figure 3(C), and is adsorbed with a gap between it and the bottom surface 207 of the recess 206 in which the suction hole HL1 is formed. Therefore, the behavior of the semiconductor chip C peeled off from the sheet ST is restricted by the inclined surface forming the recess 206, so that positional deviation in a direction perpendicular to the thickness direction of the sheet ST (thickness direction of the semiconductor chip C) is suppressed. In addition, if the suction collet 204 is stationary facing the semiconductor chip C at a predetermined peeling position, the ultrasonic oscillator 270 may generate ultrasonic vibrations before the push-out member 262 comes into contact with the sheet ST.

[0042] (Process S4: Period T4) A control device (not shown) outputs a command to the ultrasonic oscillator 270 to stop generating ultrasonic vibrations (see FIG. 4(H)), and the ultrasonic oscillator 270 stops operating. The suction collet 204 that has suctioned the semiconductor chip C rotates around the rotation axis AX1. Meanwhile, the pushing member 262 and the suction holder 242 both return to their original positions (the positions at the start of step S1) (see FIGS. 4(E) and 4(G)).

[0043] The semiconductor chip C sucked by the suction collet 204 is transferred to the transport collet 304. At this time, as shown in Fig. 5, the distance g2 between the tip surface of the suction collet 204 and the tip surface of the transport collet 304 is set to be less than the thickness of the semiconductor chip C, and the semiconductor chip C is transferred to the transport collet 304 within a range where the surface of the semiconductor chip C on the suction collet 204 side does not protrude from the recess 206. Therefore, the behavior of the semiconductor chip C is restricted by the inclined surface of the recess 206, and positional deviation in the direction perpendicular to the thickness direction of the semiconductor chip C is suppressed.

[0044] Thereafter, the aforementioned steps S1 to S4 are repeated for the semiconductor chips C to be peeled off, until all the semiconductor chips C attached to one sheet ST are peeled off, and the peeled semiconductor chips C are inserted into the carrier tape.

[0045] Next, the detailed positional relationship between the suction collet 204 and the semiconductor chip C when the semiconductor chip C is peeled off will be described with reference to FIGS. 6(A) to 6(C). The thickness of the semiconductor chip C is, for example, 0.1 mm, as shown in Figure 6(A), and as mentioned above, the depth of the recess 206 of the suction collet 204 is set to be greater than the thickness of the semiconductor chip C. In step S2, as shown in Fig. 6(B), the semiconductor chip C is pushed out by a predetermined amount by the pusher member 262. This predetermined amount is, for example, 0.05 to 0.50 mm, and preferably 0.05 to 0.10 mm. By having the pusher member 262 push out the semiconductor chip C by the predetermined amount in this way, in the next step S3, ultrasonic vibrations transmitted to adjacent semiconductor chips C are suppressed, reducing the possibility that semiconductor chips C that are not the target will fly off. When the semiconductor chip C is pushed out, the surface of the semiconductor chip C facing the suction collet 204 is inward, for example, by 0 to 0.05 mm from the tip surface of the suction collet 204. In other words, the semiconductor chip C is inward from the tip surface of the suction collet 204 by a dimension equivalent to 0 to 50%. 6C, the semiconductor chip C peeled off from the sheet ST is sucked in a state in which the surface of the semiconductor chip C facing the sheet ST protrudes, for example, 0 to 0.05 mm from the tip end surface of the suction collet 204. In other words, the semiconductor chip C protrudes outward from the tip end surface of the suction collet 204 by a dimension equivalent to 0 to 50% of its thickness.

[0046] Here, instead of the suction collet 204, a suction collet 204a shown in FIG. 7A may be used. Compared to the suction collet 204, this suction collet 204a has a different shape of a recess 206a. A bottom surface 207a of the recess 206a is set to be slightly larger than the planar shape of the semiconductor chip C, and the depth of the recess 206a is set to be smaller than the thickness of the semiconductor chip C. However, the inclination angle of the inclined surface of the recess 206a is substantially the same as that of the recess 206. When such a suction collet 204a is used, as shown in FIG. 7C, the adsorbed semiconductor chip C comes into contact only with the bottom surface 207a, not with the inclined surface forming the recess 206a. When suction collet 204a is used, as in the case of using suction collet 204, in step S2, as shown in Fig. 7(B), a dimension of semiconductor chip C corresponding to 0 to 50% of the chip length extends inward from the tip surface of suction collet 204a. Also, in step S3, as shown in Fig. 7(C), a dimension of semiconductor chip C corresponding to 0 to 50% of the chip thickness extends outward from the tip surface of suction collet 204a.

[0047] As described above, the peeling device 20 reduces the possibility of damaging the semiconductor chips C. Also, the positional deviation of the semiconductor chips C after peeling is suppressed.

[0048] Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and all changes in conditions that do not depart from the gist of the present invention are within the scope of application of the present invention. [Explanation of symbols]

[0049] 10 Taping Machine 20 Peeling device 21 Chip suction part 22 Extrusion unit 24 Sheet suction part 26 Extrusion section 30 Conveyor device 40a~40g ​​processing unit 42 Taping Unit 202 Wafer Ring 204, 204a Adsorption collet 206, 206a recess 207, 207a bottom 242 Suction holder 243 Suction holder advance / retract mechanism 244 Cam 246 Servo Motor 248 Mounting material 262 Extrusion members 264 Extrusion member holder 266 Ultrasonic vibration generator 268 Push-out member advance / retract mechanism 270 Ultrasonic Oscillator 272 Ultrasonic vibrator 274 Cam 276 Servo Motor 302 Rotary Table 304 Transfer collet AX1, AX2 rotation axis C. Semiconductor chip HL1 Adsorption hole HL2 hole HL3 adsorption hole ST seat

Claims

1. a push-out member that pushes out the semiconductor chip attached to the sheet through the sheet; an ultrasonic vibration generating unit that applies ultrasonic vibration to the extrusion member; a suction collet that sucks the semiconductor chip that comes into contact with the push-out member.

2. The peeling device according to claim 1, A peeling device in which a truncated pyramidal or rectangular parallelepiped depression is formed at the tip of the suction collet.

3. 3. The peeling device according to claim 2, A peeling device in which the suction collet does not move forward or backward relative to the sheet, but maintains a predetermined distance.

4. 4. The peeling device according to claim 3, The ultrasonic vibration generating unit generates ultrasonic vibrations while the pushing member is in contact with the semiconductor chip via the sheet.

5. 5. The peeling device according to claim 4, The ultrasonic vibration generating unit generates ultrasonic vibrations on the semiconductor chips extruded by the extrusion member by a predetermined amount.

6. The peeling device according to claim 5, A peeling device in which the distance between the sheet and the tip of the suction collet when the semiconductor chip is peeled is less than the thickness of the semiconductor chip.

7. 7. The peeling device according to claim 6, The ultrasonic vibration generating unit generates ultrasonic vibrations before the pushing member comes into contact with the sheet.

8. A peeling device according to any one of claims 1 to 6; a transport device that transports the semiconductor chips delivered from the peeling device; a processing unit that performs a predetermined process on the semiconductor chips transported by the transport device; a taping unit that seals the semiconductor chips processed by the processing unit in a carrier tape.

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