Resin composition

Abstract

To provide a resin composition capable of satisfying requirements for copper foil adhesion and film-forming properties while optimizing electrical performance of an epoxy resin system.SOLUTION: Provided is a resin composition including an epoxy resin, an active ester compound, a radical polymerizable resin, an inorganic filler material, and an accelerator, the radical polymerizable resin including an olefin compound, the olefin compound including a methacrylic compound, a styrene compound, an allyl compound, or a combination thereof.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a resin composition. [Background technology]

[0002] In recent years, with the rapid development of integrated circuit (IC) technology, there has been an increasing demand for the wiring density (L / S) and transmission speed of chips (such as high-speed computing chips). In order to achieve faster computing speeds and to make them more suitable for applications in the field of high-frequency, high-speed transmission, the electrical requirements for resin compositions are also increasing day by day. Summary of the Invention [Problem to be solved by the invention]

[0003] The challenge is how to improve the electrical requirements of resin compositions and make them more suitable for applications in the field of high-frequency, high-speed transmission.

[0004] The present invention provides a resin composition that can meet the requirements for copper clad adhesion and film-forming properties while optimizing the electrical performance of the epoxy resin system. [Means for solving the problem]

[0005] The resin composition of the present invention includes an epoxy resin, an active ester compound, a radical polymerizable resin, an inorganic filler, and an accelerator. The radical polymerizable resin includes an olefin compound. The olefin compound includes a methacrylic compound, a styrene compound, an allylic compound, or a combination thereof.

[0006] In one embodiment of the present invention, the radical polymerizable resin is at least two selected from a methacrylic compound, a styrene compound, and an allyl compound.

[0007] In one embodiment of the present invention, at least one of the above-mentioned radically polymerizable resins is a methacrylic compound.

[0008] In one embodiment of the present invention, the weight percentage of the methacrylic compound in the resin composition is between 1 wt % and 10 wt %.

[0009] In one embodiment of the present invention, the weight percentage of the above-mentioned epoxy resin in the resin composition is between 5 wt% and 15 wt%, the weight percentage of the active ester compound in the resin composition is between 10 wt% and 20 wt%, the weight percentage of the inorganic filler in the resin composition is greater than 60 wt%, the weight percentage of the radical polymerizable resin in the resin composition is between 1 wt% and 20 wt%, and the weight percentage of the accelerator in the resin composition is between 0.1 wt% and 0.5 wt%.

[0010] In one embodiment of the present invention, the epoxy resin includes a biphenyl aralkyl epoxy resin, a bisphenol A epoxy resin, or a combination thereof, the active ester compound includes a polyester resin, the inorganic filler includes spherical silica, and the accelerator includes 4-dimethylaminopyridine.

[0011] In one embodiment of the present invention, the amount of inorganic filler used in the resin composition is greater than the amounts of epoxy resin, active ester compound, radical polymerizable resin and accelerator used in the resin composition.

[0012] In one embodiment of the present invention, the amount of radically polymerizable resin used in the resin composition is greater than the amount of accelerator used in the resin composition.

[0013] In one embodiment of the present invention, the amount of radical polymerizable resin used in the resin composition is less than the amount of epoxy resin used in the resin composition.

[0014] In one embodiment of the present invention, the olefinic compound includes methacrylate polyphenylene ether resin, hydrogenated styrenic elastomer, vinylbenzyl polyphenylene ether resin, hydrocarbon-based resin, polybutadiene resin, or a combination thereof. [Effects of the Invention]

[0015] Based on the above, the present invention reduces the number of polar functional groups contained in the epoxy resin system by introducing a radical polymerizable resin into the resin composition, thereby effectively reducing the dielectric properties, thereby optimizing the electrical performance of the epoxy resin system while satisfying the requirements for copper clad adhesion and film formability.

[0016] In order to make the above-mentioned features and advantages of the present invention more apparent and understandable, the following specific examples are described in detail below. DETAILED DESCRIPTION OF THE INVENTION

[0017] In the following detailed description, for purposes of illustration and not limitation, exemplary embodiments disclosing specific details are set forth in order to provide a thorough understanding of various principles of the present invention. However, it will be apparent to one skilled in the art having the benefit of this disclosure that the present invention may be practiced in other embodiments that depart from the specific details disclosed herein.

[0018] Unless otherwise specified, the term "between" when used herein to define a numerical range is intended to include ranges equal to and between the endpoints. For example, a size range between a first number and a second number means that the size range can encompass the first value, the second value, and any value between the first and second values.

[0019] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

[0020] In this embodiment, the resin composition includes an epoxy resin, an active ester compound, a radical polymerizable resin, an inorganic filler, and an accelerator. Furthermore, the radical polymerizable resin includes an olefin compound (having an unsaturated bond), where the olefin compound includes a methacrylic compound, a styrene compound, an allylic compound, or a combination thereof. Therefore, this embodiment reduces the number of polar functional groups contained in the epoxy resin system by introducing a radical polymerizable resin into the resin composition. This effectively reduces the dielectric properties, thereby optimizing the electrical performance of the epoxy resin system while satisfying the requirements for copper clad adhesion and film formability.

[0021] In some embodiments, the olefin compound includes, but is not limited to, a methacrylate polyphenylene ether resin, a hydrogenated styrenic elastomer, a vinylbenzyl polyphenylene ether resin, a hydrocarbon-based resin, a polybutadiene resin, or a combination thereof.

[0022] In some embodiments, the radical polymerizable resin is at least two selected from methacrylic compounds, styrene compounds, and allyl compounds to have better dielectric properties, but the present invention is not limited thereto.

[0023] In some embodiments, at least one of the radical polymerizable resins is a methacrylic compound such as a methacrylate polyphenylene ether resin. The weight percentage of the methacrylic compound in the resin composition is between 1 wt% and 10 wt% (e.g., 1 wt%, 3 wt%, 5 wt%, 10 wt%, or any suitable value between 1 wt% and 10 wt%), but the present invention is not limited thereto.

[0024] In some embodiments, the weight percentage of the radical polymerizable resin in the resin composition is between 1 wt% and 20 wt% (e.g., 1 wt%, 5 wt%, 10 wt%, 15 wt%, 20 wt%, or any suitable value between 1 wt% and 20 wt%), but the present invention is not limited thereto.

[0025] In some embodiments, the epoxy resin comprises a biphenyl aralkyl epoxy resin (such as a naphthylene ether epoxy resin), a bisphenol A type epoxy resin, or a combination thereof, and the weight percentage of the epoxy resin in the resin composition is between 5 wt % and 15 wt % (e.g., 5 wt %, 7 wt %, 10 wt %, 12 wt %, 15 wt %, or any suitable value between 5 wt % and 15 wt %), but the present invention is not limited thereto.

[0026] In some embodiments, the active ester compound comprises a polyester resin, and the weight percentage of the active ester compound in the resin composition is between 10 wt% and 20 wt% (e.g., 10 wt%, 12 wt%, 15 wt%, 17 wt%, 20 wt%, or any suitable value between 10 wt% and 20 wt%), but the present invention is not limited thereto.

[0027] In some embodiments, the inorganic filler comprises spherical silica, and the weight ratio of the inorganic filler in the resin composition is greater than 60 wt%, but the present invention is not limited thereto. Here, the median particle diameter (D 50 ) may be less than 1 micrometer, or any other suitable value.

[0028] In some embodiments, inorganic fillers are prepared by synthetic methods, such as, but not limited to, solid phase synthesis, to include epoxy or acrylic surface modifications to enhance performance.

[0029] In some embodiments, the purity of the inorganic filler is 99% or greater, although the invention is not limited in this respect.

[0030] In some embodiments, the specific surface area of ​​the inorganic filler is set to 4 m or less in order to control the contact area with the functional group in a more preferable range. 2 / g~6m 2 / g, and can maintain desirable low dielectric properties, for example, Dk between 3 and 3.3, Df not more than 0.0025, but the present invention is not limited thereto, and the specific surface area of ​​the inorganic filler can be determined according to actual design requirements.

[0031] In some embodiments, the accelerator comprises 4-dimethylaminopyridine (DMAP), and the weight percentage of the accelerator in the resin composition is between 0.1 wt % and 0.5 wt %, although the invention is not limited thereto.

[0032] In some embodiments, the amount of inorganic filler used in the resin composition is greater than the amounts of epoxy resin, active ester compound, radical polymerizable resin, and accelerator used in the resin composition, but the present invention is not limited thereto.

[0033] In some embodiments, the amount of radical polymerizable resin used in the resin composition is greater than the amount of accelerator used in the resin composition, and / or the amount of radical polymerizable resin used in the resin composition is less than the amount of epoxy resin used in the resin composition, although the invention is not limited in this respect.

[0034] In some embodiments, the total weight percentage of the epoxy resin, active ester compound, radical polymerizable resin, inorganic filler, and accelerator in the resin composition is 100 wt %, but the present invention is not limited thereto.

[0035] The resin composition described above can be considered as a non-volatile component of a resin composition (varnish-like) dissolved in a solvent, but the present invention is not limited thereto. Furthermore, the resin composition of the present invention can be processed into a prepreg and a copper foil substrate (CCL) according to actual design requirements, and the specific embodiments described above do not limit the present invention.

[0036] The effects of the present invention will be explained below with reference to examples and comparative examples, but the scope of the present invention is not limited to these examples.

[0037] The products of the examples and comparative examples were evaluated according to the following methods.

[0038] Glass transition temperature (Tg) (°C): The glass transition temperature Tg (°C) of the material was measured using a thermomechanical analyzer (TMA) according to the standard test method of ASTM E1545.

[0039] Coefficient of thermal expansion (CTE) (xy plane direction): The coefficient of thermal expansion in the XY plane of the material, i.e., XY CTE (ppm / °C), was measured using a thermomechanical analyzer (TMA) in accordance with the standard test method IPC-TM-650 2.4.24. The test temperature range was 25°C to 150°C.

[0040] Dielectric constant Dk / dielectric loss Df: A resin film made from the resin composition shown in Table 1 was heated at 200°C for 90 minutes to form a cured film. The cured film was cut into a size of 10 mm in length and 7 mm in width. The dielectric constant (Dk) and dissipation factor (Df) of the material under a 10 GHz signal were measured according to the standard test method of IPC-TM-650 (Method 2.5.5.3).

[0041] Lamination and curing of resin sheet material: A copper-clad glass cloth epoxy resin substrate was prepared as an inner layer substrate, covered on both sides with a copper-clad laminate ("NPG-180INBK" manufactured by Nanya Plastics Co., Ltd.), and the copper foil on the surface of this inner layer substrate was roughened. The resin composition and the inner layer substrate were bonded together using a vacuum laminator ("V-130" manufactured by Nikko Materials Co., Ltd.). The pressure was reduced to below 1 hPa for 30 seconds, followed by pressing at 100°C and 100N pressure for 60 seconds. The resulting substrate was then heated in an oven at 130°C for 30 minutes, and then transferred to an oven at 165°C for 30 minutes. The resin composition cured as a result of the heating process, yielding Substrate A.

[0042] Copper clad adhesion: Evaluation substrate A obtained after the above-mentioned vacuum laminator and heat curing, ⊚: Stable adhesion without peeling, ×: Peeling after baking.

[0043] Film-forming properties: The resin composition was mixed with a solvent (solid content 65 wt%), applied to a support (PET film) using a slit die coater, dried to form a thin film, and then left to stand for 90 minutes at a temperature of 200°C. ⊚: A complete film surface was obtained after curing, X: A complete film surface was not obtained after curing.

[0044] <Examples 1 to 5, Comparative Example 1>

[0045] The resin compositions shown in Table 1 were dissolved in solvents (toluene, methyl ethyl ketone, cyclohexanone), applied to a support (PET film) using a slit die coater, and dried to form a film layer. Properties such as glass transition temperature, thermal expansion coefficient, dielectric constant, and dielectric loss were evaluated, and copper clad adhesion and film-formability were tested using the methods described above. The results are shown in Table 1. Comparing the results of Examples 1 to 5 in Table 1 with those of Comparative Example 1, the following conclusions can be drawn: Examples 1 to 5, which used a radically polymerizable resin, are able to optimize the electrical performance of the epoxy resin system compared to Comparative Example 1, while satisfying the requirements for copper clad adhesion and film-formability.

[0046] [Table 1]

[0047] In summary, the present invention reduces the number of polar functional groups in an epoxy resin system by incorporating a radical polymerizable resin into the resin composition, thereby effectively reducing the dielectric properties and optimizing the electrical performance of the epoxy resin system while satisfying the requirements for copper clad adhesion and film formability.

[0048] Although the present invention has been disclosed through the above embodiments, they are not intended to limit the present invention, and a person having ordinary skill in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be determined by the appended claims. [Industrial Applicability]

[0049] The resin composition of the present invention can be applied to the field of resin compositions.

Claims

1. Epoxy resin, an active ester compound; a radical polymerizable resin containing an olefin compound including a methacrylic compound, a styrenic compound, an allylic compound, or a combination thereof; an inorganic filler; A promoter; A resin composition comprising:

2. the radical polymerizable resin is at least two selected from the methacrylic compound, the styrene compound, and the allyl compound; The resin composition according to claim 1.

3. At least one of the radical polymerizable resins is a methacrylic compound. The resin composition according to claim 1.

4. The weight ratio of the methacrylic compound in the resin composition is between 1 wt % and 10 wt %. The resin composition according to claim 3.

5. the weight percentage of the epoxy resin in the resin composition is between 5 wt % and 15 wt %, the weight percentage of the active ester compound in the resin composition is between 10 wt % and 20 wt %, the weight percentage of the inorganic filler in the resin composition is greater than 60 wt %, the weight percentage of the radical polymerizable resin in the resin composition is between 1 wt % and 20 wt %, and the weight percentage of the accelerator in the resin composition is between 0.1 wt % and 0.5 wt %; The resin composition according to claim 1.

6. The epoxy resin includes a biphenyl aralkyl type epoxy resin, a bisphenol A type epoxy resin, or a combination thereof, the active ester compound includes a polyester resin, the inorganic filler includes spherical silica, and the accelerator includes 4-dimethylaminopyridine. The resin composition according to claim 1.

7. the amount of the inorganic filler used in the resin composition is greater than the amounts of the epoxy resin, the active ester compound, the radical polymerizable resin, and the accelerator used in the resin composition; The resin composition according to claim 1.

8. the amount of the radical polymerizable resin used in the resin composition is greater than the amount of the accelerator used in the resin composition; The resin composition according to claim 1.

9. the amount of the radical polymerizable resin used in the resin composition is less than the amount of the epoxy resin used in the resin composition; The resin composition according to claim 1.

10. The olefin compound includes a methacrylate polyphenylene ether resin, a hydrogenated styrene-based elastomer, a vinylbenzyl polyphenylene ether resin, a hydrocarbon-based resin, a polybutadiene resin, or a combination thereof. The resin composition according to claim 1.

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