Tape peeling device and tape peeling method

Abstract

To provide a tape peeling device that can suppress a wafer from being broken when peeling a tape base material from the wafer.SOLUTION: The tape peeling device is provided with: a fixing mechanism 20 that fixes a lower surface of a wafer 13 whose upper surface is attached with a lower surface of a tape base material 11 through a tape starched layer 12; a pulling mechanism 42 that attaches a remover tape 30 to an upper surface of the tape base material 11 on the wafer 13 fixed by the fixing mechanism 20, and pulls the remover tape 30 in a direction 41 along the upper surface of the tape base material 11 while folding back the tape in a U-shape 30a upward, outside the tape base material 11; a butting member 50 that butts a tip part 50a to a space between the wafer 13 and the tape starched layer 12, while making the pulling mechanism pull the remover tape 30; and a jetting mechanism 51 that jets gas to the space between the wafer 13 and the tape starched layer 12 through a first jetting port 50b.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a tape peeling device and a tape peeling method. [Background technology]

[0002] There is a process for thinning a wafer by attaching the underside of a tape substrate to the top surface of the wafer with a tape adhesive layer, and then grinding the underside of the wafer while the wafer and tape substrate are integrated. If the wafer is made significantly thinner in this process, the rigidity of the wafer after grinding will be low, so it is necessary to use a tape substrate with high rigidity to prevent the wafer from warping.

[0003] After the grinding process of the lower surface of the wafer, a process is required to peel off the tape substrate together with the tape adhesive layer from the upper surface of the wafer. In this process, because the rigidity of the wafer is low and the rigidity of the tape substrate is high, there is a problem that the wafer may crack when the tape substrate is peeled off from the wafer. Note that technology related to the above process is described in Patent Document 1. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2017-34015 Summary of the Invention [Problem to be solved by the invention]

[0005] Various aspects of the present invention aim to provide a tape peeling apparatus and a tape peeling method that suppress wafer cracking when peeling a tape substrate from a wafer. [Means for solving the problem]

[0006] Various aspects of the present invention are described below.

[0007] [1] A fixing mechanism for fixing the lower surface of a wafer having a lower surface of a tape substrate attached to an upper surface thereof by a tape adhesive layer; a tensioning mechanism that attaches a remover tape to an upper surface of the tape substrate on the wafer fixed by the fixing mechanism, and pulls the remover tape in a direction along the upper surface of the tape substrate while folding the remover tape upward in a U-shape outside the tape substrate; abutting member that abuts a tip portion between the wafer and the tape adhesive layer while pulling the remover tape by the tensioning mechanism; a first injection hole provided at a tip end of the abutting member; a path for sending gas to the first injection hole; an injection mechanism that injects the gas through the path from the first injection hole between the wafer and the tape adhesive layer; A tape peeling device comprising:

[0008] According to the tape peeling device of one aspect of the present invention, the underside of a tape substrate is attached to the upper surface of a wafer with a tape adhesive layer, and the underside of the wafer with the attached tape substrate is fixed by a fixing mechanism. A remover tape is attached to the upper surface of the tape substrate on the fixed wafer, and the remover tape is folded upward in a U-shape outside the tape substrate. While the remover tape is pulled by a tensioning mechanism in a direction along the upper surface of the tape substrate, gas passing through a path from a first injection hole at the tip of the abutting member is injected by an injection mechanism between the wafer and the tape adhesive layer, and the tip of the abutting member is abutted between the wafer and the tape adhesive layer. At this time, the wind pressure of the injected gas easily peels the tape substrate from the wafer. Therefore, even when the wafer has low rigidity and the tape substrate has high rigidity, the gas efficiently penetrates between the wafer and the tape adhesive layer of the tape substrate, making it easier to peel the tape substrate from the wafer. As a result, wafer cracking can be suppressed.

[0009] [2] In [1] above, 10. A tape peeling device, wherein the tip of the abutting member has a shape that follows the outer periphery of the wafer.

[0010] According to the tape peeling device of the above [2] of one embodiment of the present invention, the tip of the abutting member has a shape that follows the outer periphery of the wafer, and therefore when peeling the tape substrate from the wafer, the starting point for peeling is made larger and gas is blown, thereby further suppressing wafer cracking.

[0011] [3] In [2] above, 10. A tape peeling device, wherein the first injection holes of the abutting member are arranged at a uniform distance from the tip end in a plan view.

[0012] According to the tape peeling device of the above [3] of one aspect of the present invention, the first injection holes of the abutting member are arranged at a uniform distance from the tip, so that gas can be efficiently injected at the starting point of peeling of the tape base material on the outer periphery of the wafer, thereby further suppressing wafer cracking.

[0013] [4] In paragraph [3] above, The tape peeling device, wherein the first injection hole of the abutting member is formed along the tip portion in a plan view and is formed integrally with the tip portion.

[0014] According to the tape peeling device of the above [4] of one aspect of the present invention, the first injection hole of the abutting member is formed along the tip end in a plan view and is integrally formed, so that gas can be injected more efficiently at the starting point of peeling of the tape base material on the outer periphery of the wafer, thereby further suppressing wafer cracking.

[0015] [5] In any one of paragraphs [1] to [4] above, a second injection hole provided at a tip end of the abutting member; the first injection hole is an injection hole that injects the gas in a direction parallel to the upper surface of the wafer, The tape peeling device is characterized in that the second injection hole is an injection hole that injects the gas in a direction toward the wafer side relative to the parallel direction.

[0016] According to the tape peeling device of the above [5] of one aspect of the present invention, by forming a second injection hole at the tip of the abutting member for injecting gas in a direction parallel to the upper surface of the wafer and downward toward the wafer, the tape base can be peeled off while pressing the wafer downward with the gas. As a result, it is possible to prevent the thin, low-rigidity wafer from floating up and being damaged.

[0017] [6] In paragraph [5] above, a third injection hole provided at a tip end of the abutting member; The tape peeling device is characterized in that the third injection hole is an injection hole that injects the gas in a direction opposite to the wafer side with respect to the parallel direction.

[0018] According to the tape peeling device of the above [6] of one aspect of the present invention, by forming a third injection hole at the tip of the abutting member for injecting gas in a direction parallel to the upper surface of the wafer and opposite to the wafer side, the gas can prevent the peeled tape substrate from returning to the wafer side, thereby making it possible to easily peel the tape substrate from the wafer while suppressing wafer cracking.

[0019] [7] In paragraph [6] above, the paths include a first path, a second path, and a third path that are separated from one another; the injection mechanism includes a first injection mechanism, a second injection mechanism, and a third injection mechanism; the gas injected from the first injection hole is injected through the first path by the first injection mechanism, the gas injected from the second injection hole is injected through the second path by the second injection mechanism, a tape separating device, wherein the gas injected from the third injection hole is injected through the third path by the third injection mechanism;

[0020] According to the tape separating device of [7] above, which relates to one aspect of the present invention, the first path, the second path, and the third path are separated from one another, and the first injection mechanism, the second injection mechanism, and the third injection mechanism are provided, so that the gas injected from each of the first injection hole, the second injection hole, and the third injection hole can be the same gas or different gases. Also, since the first injection mechanism, the second injection mechanism, and the third injection mechanism are provided, the flow velocity and the flow rate of the gas injected from each of the first injection hole, the second injection hole, and the third injection hole can be the same or different.

[0021] [8] In any one of paragraphs [1] to [4] above, A tape peeling device characterized in that the thickness of the wafer is 200 μm or less.

[0022] According to the tape peeling device of one embodiment of the present invention, gas is sprayed between the wafer and the tape adhesive layer by an injection mechanism, and the tip of the abutting member is abutted against the gap between the wafer and the tape adhesive layer. At this time, the wind pressure of the sprayed gas makes it easier for the tape substrate to peel off from the wafer. Therefore, even for wafers with a thickness of 200 μm or less and very low rigidity, the gas efficiently penetrates between the wafer and the tape adhesive layer of the tape substrate, making it easier to peel the tape substrate from the wafer. As a result, wafer cracking can be suppressed.

[0023] [9] In any one of paragraphs [1] to [4] above, The tape peeling device is characterized in that the gas is an inert gas or dry air.

[0024] According to the tape peeling device of the above [9] according to one aspect of the present invention, an inert gas or dry air is sprayed between the wafer and the tape adhesive layer by an injection mechanism, and the wind pressure of the sprayed gas makes it easy to peel the tape substrate from the wafer. By using an inert gas or dry air, it is possible to prevent the layers formed on the wafer from being deteriorated.

[0025]

[10] In any one of paragraphs [1] to [4] above, The tape peeling device is characterized in that the fixing mechanism has a wafer suction mechanism, and the wafer is fixed by the wafer suction mechanism.

[0026]

[11] The lower surface of the tape substrate fixes the lower surface of the wafer attached to the upper surface by the tape adhesive layer; A tape peeling method characterized by attaching a remover tape to the upper surface of the tape substrate on the fixed wafer, folding the remover tape in a U-shape outside and upward of the tape substrate, and pulling the remover tape in a direction along the upper surface of the tape substrate while spraying gas from a first injection hole at the tip of a butting member between the wafer and the tape adhesive layer, and butting the tip of the butting member between the wafer and the tape adhesive layer.

[0027] According to the tape peeling method of one aspect of the present invention, the underside of a tape substrate is attached to the upper surface of a wafer with a tape adhesive layer, and the underside of the wafer with the attached tape substrate is fixed. A remover tape is attached to the upper surface of the tape substrate on the fixed wafer, and the remover tape is folded upward in a U-shape outside the tape substrate while being pulled in a direction along the upper surface of the tape substrate. The tip of the abutting member is abutted against the wafer and the tape adhesive layer. At this time, the wind pressure of the sprayed gas makes it easy for the tape substrate to peel off from the wafer. Therefore, even when the wafer has low rigidity and the tape substrate has high rigidity, the gas efficiently penetrates between the wafer and the tape adhesive layer of the tape substrate, making it easy to peel the tape substrate from the wafer. As a result, wafer cracking can be suppressed. [Effects of the Invention]

[0028] According to various aspects of the present invention, it is possible to provide a tape peeling apparatus and a tape peeling method that suppress wafer cracking when peeling a tape substrate from a wafer. [Brief explanation of the drawings]

[0029] [Figure 1] 1 is a schematic diagram showing a tape peeling device according to one embodiment of the present invention. [Figure 2] 1, (B) is a plan view showing a first modified example of the shape of the tip end of the abutment member 50 shown in FIG. 1, and (C) is a plan view showing a second modified example of the shape of the tip end of the abutment member 50 shown in FIG. 1. [Figure 3] 1A and 1B are schematic diagrams illustrating a tape peeling method according to one embodiment of the present invention. [Figure 4] 1 is a schematic diagram showing a tape peeling device according to one embodiment of the present invention. [Figure 5] 1 is a schematic diagram showing a tape peeling device according to one embodiment of the present invention. [Figure 6]6(A) is a top view and a cross-sectional view showing the positional relationship between the abutting member 50 of the tape peeling device shown in FIG. 5 and the wafer 13, and FIG. 6(B) is a plan view of the abutting member 50 shown in FIG. 6(A) as viewed from the porous chuck side (the back surface of the wafer). DETAILED DESCRIPTION OF THE INVENTION

[0030] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it will be readily understood by those skilled in the art that various changes in form and details can be made without departing from the spirit and scope of the present invention. Therefore, the present invention should not be interpreted as being limited to the description of the embodiments shown below.

[0031] (First embodiment) Fig. 1 is a schematic diagram showing a tape separating device according to one embodiment of the present invention, Fig. 2(A) is a plan view showing the shape of the tip side of the abutting member 50 shown in Fig. 1.

[0032] The tape peeling device shown in FIG. 1 has a fixing mechanism 20 that fixes the underside of a wafer 13, and the underside of a tape substrate 11 is attached to the upper surface of the wafer 13 by a tape adhesive layer 12. The lower surface of the wafer 13 is fixed by the fixing mechanism 20, and a remover tape 30 is attached to the upper surface of the tape substrate 11 on the fixed wafer 13. The tape peeling device also has a pulling mechanism 42 that pulls the remover tape 30, and is configured to pull the remover tape 30 in a direction 41 along the upper surface of the tape substrate 11 while folding the remover tape 30 upward into a U-shape 30a outside the tape substrate 11. The tape substrate 11 can be made of a material such as PET (Poly Ethylene Terephthalate), and the thickness of the tape substrate 11 is preferably 100 μm or less. The thickness of the tape adhesive layer 12 is preferably about 150 μm, or between 100 μm and 200 μm.

[0033] The fixing mechanism 20 has a wafer suction mechanism that fixes the wafer 13. The thickness of the wafer 13 is preferably 200 μm or less, or 100 μm or less, and has low rigidity.

[0034] The tape peeling device also has an abutting member 50, and is configured to abut a tip 50a of the abutting member 50 between the wafer 13 and the tape adhesive layer 12 while pulling the remover tape 30 with a tensioning mechanism 42. The tip 50a of the abutting member 50 is provided with first injection holes 50b. As shown in FIG. 2(A), the first injection holes 50b are formed in a row of three in a horizontal direction in a plan view. The abutting member 50 also has a path 50c for sending gas to the first injection holes 50b, as shown in FIG.

[0035] The tape peeling device also has a spray mechanism 51, which sprays gas from the first spray hole 50b through the path 50c between the wafer 13 and the tape adhesive layer 12. This gas is preferably an inert gas or dry air (compressed dry air). By using an inert gas or dry air in this way, it is possible to prevent the layers formed on the wafer 13 from being altered.

[0036] In this embodiment, as shown in FIG. 2(A), the tip 50a of the abutting member 50 has a linear shape in a plan view, but this is not limited to this, and the tip 50a of the abutting member 50 may have a shape that follows the outer periphery of the wafer 13, as shown in FIGS. 2(B) and (C).

[0037] Furthermore, as shown in FIGS. 2(A) to 2(C), the first injection holes 50b of the abutting member 50 are preferably arranged at a uniform distance from the tip end 50a thereof in plan view.

[0038] Furthermore, as shown in FIG. 2(C), the first injection hole 50b of the abutting member 50 is preferably formed so as to follow the tip end portion 50a in plan view and be formed integrally therewith.

[0039] FIG. 3 is a schematic diagram illustrating a tape peeling method according to one embodiment of the present invention. A wafer 13 is prepared, with the lower surface of the tape substrate 11 attached to the upper surface by a tape adhesive layer 12, and the lower surface of this wafer 13 is fixed. For example, the lower surface of the wafer 13 is fixed by a fixing mechanism 20. This fixing mechanism 20 has a porous chuck, and the lower surface of the wafer 13 is fixed to this porous chuck.

[0040] Next, the remover tape 30 is attached to the upper surface of the tape substrate 11 on the fixed wafer 13. Then, as shown in Figure 3, the remover tape 30 is folded into a U-shape 30a outside and upward of the tape substrate 11, and while the remover tape 30 is pulled in a direction 41 along the upper surface of the tape substrate 11, gas (or high-pressure gas) is sprayed from the first injection hole 50b of the tip 50a of the abutting member 50 between the wafer 13 and the tape adhesive layer 12, and the tip 50a of the abutting member 50 is abutted between the wafer 13 and the tape adhesive layer 12. In this way, the force pulling the remover tape 30 is transmitted to the tape substrate 11, and with the wafer 13 fixed to the porous chuck, the tape substrate 11 and the tape adhesive layer 12 are peeled off from the upper surface of the wafer 13.

[0041] According to this embodiment, the underside of the tape substrate 11 is attached to the upper surface of the wafer 13 by the tape adhesive layer 12, and the underside of the wafer 13 to which the tape substrate 11 is attached is fixed by the fixing mechanism 20. A remover tape 30 is attached to the upper surface of the tape substrate 11 on the fixed wafer 13, and while the remover tape 30 is folded into a U-shape 30a outside and upward of the tape substrate 11 and pulled by the tensioning mechanism 42 in a direction 41 along the upper surface of the tape substrate 11, gas that has passed through a path 50c from a first injection hole 50b of the tip 50a of the abutting member 50 is injected by the injection mechanism 51 between the wafer 13 and the tape adhesive layer 12, creating a starting point for peeling off the remover tape 30 and the tape substrate 11, and the tip 50a of the abutting member 50 is abutted between the wafer 13 and the tape adhesive layer 12. At this time, the wind pressure of the injected gas makes it easier for the tape substrate 11 to peel off from the wafer 13. As a result, even when the wafer 13 has low rigidity and the tape substrate 11 has high rigidity, the gas can efficiently penetrate between the wafer 13 and the tape adhesive layer 12 of the tape substrate 11, making it easier to peel the tape substrate 11 from the wafer 13. As a result, it is possible to suppress the occurrence of wafer cracking (see Figures 1, 2(A), and 3).

[0042] Furthermore, in this embodiment, as described above, gas is injected between the wafer 13 and the tape adhesive layer 12 by the injection mechanism 51, and the tip 50a of the abutting member 50 is abutted between the wafer 13 and the tape adhesive layer 12. At this time, the wind pressure of the injected gas makes it easier for the tape substrate 11 to peel off from the wafer 13. Therefore, even if the wafer 13 is 200 μm or less thick and has very low rigidity, the gas can efficiently penetrate between the wafer 13 and the tape adhesive layer 12 of the tape substrate 11, making it easier to peel the tape substrate 11 from the wafer 13. As a result, wafer cracking can be suppressed (see Figures 1, 2(A), and 3).

[0043] 2(B) and 2(C) is used in the tape peeling device, the tip 50a of the abutting member 50 has a shape that follows the outer periphery of the wafer 13 (the round shape of the wafer 13), so that when peeling the tape substrate 11 from the wafer 13, it is possible to blow gas while keeping the peeling starting point large. This makes it possible to further suppress wafer cracking (see FIGS. 2(B) and 2(C)).

[0044] 2(B) and 2(C) is used in the tape peeling device, the first injection holes 50b of the abutment member 50 are arranged at a uniform distance from the tip 50a, so that gas can be efficiently injected at the starting point of peeling of the tape substrate 11 on the outer periphery of the wafer 13. As a result, wafer cracking can be further suppressed (see FIGS. 2(B) and 2(C)).

[0045] In addition, in this embodiment, by using the abutting member 50 shown in Fig. 2(C) in the tape peeling device, the first injection holes 50b of the abutting member 50 are formed so as to follow the tip end 50a in a plan view and are integrally formed, so that gas can be injected more efficiently at the starting point of peeling of the tape substrate 11 on the outer periphery of the wafer 13. As a result, wafer cracking can be further suppressed (see Fig. 2(C)).

[0046] (Second embodiment) FIG. 4 is a schematic diagram showing a tape peeling device according to one embodiment of the present invention, in which the same parts as those in FIG. 1 are given the same reference numerals, and only the different parts will be described.

[0047] The tape separating device is different from the tape separating device shown in FIG. 1 in that a second injection hole 50d is provided at the tip 50a of the abutting member 50, but is otherwise the same. Here, the first injection hole 50b is an injection hole that injects gas in a direction 61 parallel to the top surface of the wafer 13, and the second injection hole 50d is an injection hole that injects gas in a direction 62 toward the wafer 13 relative to the parallel direction 61.

[0048] In this embodiment, the same effects as in the first embodiment can be obtained.

[0049] In this embodiment, the tip 50a of the abutting member 50 is formed with a second injection hole 50d for injecting gas in a direction 62 toward the wafer 13 below a direction 61 parallel to the top surface of the wafer 13, so that the tape substrate 11 can be peeled off while the wafer 13 is pressed downward (toward the porous chuck) by the gas. As a result, the thin and low-rigidity wafer 13 can be prevented from floating up and being damaged.

[0050] (Third embodiment) Figure 5 is a schematic diagram showing a tape peeling device according to one embodiment of the present invention. The same parts as in Figure 1 are given the same reference numerals. Figure 6(A) is a top view and a cross-sectional view showing the positional relationship between the butting member 50 of the tape peeling device shown in Figure 5 and the wafer 13, and Figure 6(B) is a plan view of the butting member 50 shown in Figure 6(A) as seen from the porous chuck side (the back surface of the wafer). In Figure 5 and Figures 6(A) and (B), the same parts as in Figure 4 are given the same reference numerals, and only the differences will be described.

[0051] 5, a third injection hole 50e is provided in the tip end 50a of the abutting member 50. This third injection hole 50e is an injection hole that injects gas in a direction 63 opposite to the wafer 13 side with respect to a direction 61 parallel to the top surface of the wafer 13.

[0052] 6(A), the third injection holes 50e are arranged at a uniform distance from the tip end 50a in a plan view, and are also arranged at a uniform distance from the outer periphery of the wafer 13. The abutting member 50 has three third injection holes 50e, and the distance between adjacent third injection holes 50e is the same.

[0053] The first injection holes 50b are arranged in the same manner as the first injection holes 50b shown in Fig. 2(B). Moreover, as shown in Fig. 6(B), the second injection holes 50d are arranged at a uniform distance from the tip end 50a in plan view and are also arranged at a uniform distance from the outer periphery of the wafer 13. The abutting member 50 has three second injection holes 50d, and the distance between adjacent second injection holes 50d is the same.

[0054] In this embodiment, the same effects as in the second embodiment can be obtained.

[0055] Furthermore, in this embodiment, by forming a third injection hole 50e in the tip end 50a of the abutting member 50, which injects gas in an upward direction 63 (opposite the wafer 13 side) with respect to a direction 61 parallel to the top surface of the wafer 13, the gas can prevent the peeled tape substrate 11 from returning to the wafer 13 side. As a result, the tape substrate 11 can be easily peeled from the wafer 13 while suppressing wafer cracking.

[0056] In this embodiment, one injection mechanism 51 is provided to supply gas to be injected from the first to third injection holes 50b, 50d, and 50e, and the gas is supplied from this injection mechanism 51 to the first to third injection holes 50b, 50d, and 50e through path 50c. However, it is also possible to modify the embodiment by providing three paths for supplying gas to each of the first to third injection holes 50b, 50d, and 50e, and also providing three injection mechanisms 51.

[0057] The details of this modification are as follows. The path 50c has a first path, a second path, and a third path (not shown) that are separated from one another, and the injection mechanism 51 has a first injection mechanism, a second injection mechanism, and a third injection mechanism. The gas injected from the first injection hole 50b is injected through the first path by the first injection mechanism, the gas injected from the second injection hole 50d is injected through the second path by the second injection mechanism, and the gas injected from the third injection hole 50e is injected through the third path by the third injection mechanism.

[0058] In addition, the type of gas flowing through each of the first to third injection holes 50b, 50d, and 50e may be changed, and each of the first to third injection mechanisms may be configured so that the force of the gas ejection can be changed.

[0059] According to the above-described modified example, by having the first path, second path, and third path that are separated from one another and by having the first injection mechanism, second injection mechanism, and third injection mechanism, the gas injected from each of the first injection hole 50b, second injection hole 50d, and third injection hole 50e can be the same gas or different gases. Furthermore, by having the first injection mechanism, second injection mechanism, and third injection mechanism, the flow velocity and flow rate of the gas injected from each of the first injection hole 50b, second injection hole 50d, and third injection hole 50e can be the same or different.

[0060] It is also possible to combine the above-described first to third embodiments as appropriate. [Explanation of symbols]

[0061] 11 Tape substrate 12 Tape adhesive layer 13 wafers 20 Fixing mechanism 30 Remover Tape 30a U-shaped 41 Direction along the top surface of the tape substrate 42 Tension mechanism 50 Stopper 50a Tip of the abutting member 50b First injection hole 50c Route 50d Second injection hole 50e Third injection hole 51 Injection mechanism 61 Parallel to the top surface of the wafer 62 Direction parallel to the top surface of the wafer and toward the wafer side 63 The direction parallel to the top surface of the wafer and opposite to the wafer side

Claims

1. a fixing mechanism for fixing the lower surface of the wafer, the lower surface of which is attached to the upper surface of the tape substrate by a tape adhesive layer; a tensioning mechanism that attaches a remover tape to an upper surface of the tape substrate on the wafer fixed by the fixing mechanism, and pulls the remover tape in a direction along the upper surface of the tape substrate while folding the remover tape upward in a U-shape outside the tape substrate; abutting member that abuts a tip portion between the wafer and the tape adhesive layer while pulling the remover tape by the tensioning mechanism; a first injection hole provided at a tip end of the abutting member; a path for sending gas to the first injection hole; an injection mechanism that injects the gas through the path from the first injection hole between the wafer and the tape adhesive layer; A tape peeling device comprising:

2. In claim 1, 10. A tape peeling device, wherein the tip of the abutting member has a shape that follows the outer periphery of the wafer.

3. In claim 2, The tape peeling device according to claim 1, wherein the first injection holes of the abutting member are arranged at a uniform distance from the tip end in a plan view.

4. In claim 3, The tape peeling device, wherein the first injection hole of the abutting member is formed along the tip end portion in a plan view and is formed integrally with the tip end portion.

5. In any one of claims 1 to 4, a second injection hole provided at a tip end of the abutting member; the first injection hole is an injection hole that injects the gas in a direction parallel to the upper surface of the wafer, The tape peeling device according to claim 1, wherein the second injection hole is an injection hole that injects the gas in a direction toward the wafer side relative to the parallel direction.

6. In claim 5, a third injection hole provided at a tip end of the abutting member; The tape peeling device according to claim 1, wherein the third injection hole is an injection hole that injects the gas in a direction opposite to the wafer side with respect to the parallel direction.

7. In claim 6, the paths include a first path, a second path, and a third path that are separated from one another; the injection mechanism includes a first injection mechanism, a second injection mechanism, and a third injection mechanism; the gas injected from the first injection hole is injected through the first path by the first injection mechanism, the gas injected from the second injection hole is injected through the second path by the second injection mechanism, The tape peeling device according to claim 1, wherein the gas injected from the third injection hole is injected through the third path by the third injection mechanism.

8. In any one of claims 1 to 4, A tape peeling device characterized in that the thickness of the wafer is 200 μm or less.

9. In any one of claims 1 to 4, The tape peeling device is characterized in that the gas is an inert gas or dry air.

10. In any one of claims 1 to 4, The tape peeling device is characterized in that the fixing mechanism has a wafer suction mechanism, and the wafer is fixed by the wafer suction mechanism.

11. The lower surface of the tape substrate fixes the lower surface of the wafer attached to the upper surface by the tape adhesive layer; A tape peeling method characterized by attaching a remover tape to the upper surface of the tape substrate on the fixed wafer, folding the remover tape in a U-shape outside and upward of the tape substrate, and pulling the remover tape in a direction along the upper surface of the tape substrate, while spraying gas from a first injection hole at the tip of a butting member between the wafer and the tape adhesive layer, and butting the tip of the butting member between the wafer and the tape adhesive layer.

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