One-stop cleaning method and system for semiconductor carrier

Abstract

To provide a one-stop cleaning method and system for a semiconductor carrier.SOLUTION: A method includes the steps of disassembly, classification, ultra fine bubble washing, negative pressure vacuum drying, and the like. A system includes multiple cleaning chambers, an ultra fine bubble generator, a drainage device, and a negative pressure vacuum drying device. With one-stop integration of the steps of disassembly, classification, ultra fine bubble washing, negative pressure vacuum drying, and the like, contaminants and organic compounds can be effectively removed from of a semiconductor carrier to provide suitability for cleaning the semiconductor carrier.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a semiconductor carrier cleaning method and system, and more particularly to a one-stop type semiconductor carrier cleaning method and system. [Background technology]

[0002] In the semiconductor industry, semiconductor carriers are often used to protect, store, and transport semiconductor workpieces. The interior of semiconductor process vessels can become contaminated due to various factors, including process and environmental factors, making cleaning necessary. Semiconductor workpieces can be wafers, reticles, PCBs, substrates, or other electronic components. Semiconductor carriers can be wafer carriers, reticle carriers, PCB carriers, or other electronic component carriers, such as Front Opening Unified Pods (FOUPs).

[0003] These semiconductor carriers have the potential for contamination of various components due to various factors such as the process and the environment, and both the semiconductor processing equipment and the semiconductor carriers must be maintained at an extremely high level of cleanliness. To maintain this cleanliness, the semiconductor carriers must be cleaned to improve the yield of the semiconductor process.

[0004] However, in conventional technology, semiconductor carrier cleaning typically involves the use of multiple workstations for cleaning, dehydration, drying, etc. Each workstation performs only a single function, so to complete cleaning of semiconductor carriers and their components, they must be transferred to each station and a different function must be performed. This can lead to complex processes, time-consuming transfers, and the use of space. Furthermore, semiconductor carriers and their components are often washed with deionized water (DIW) and then dried, but this method has limited cleaning effectiveness and makes it difficult to further address the issue of residual harmful gases such as volatile organic compounds (VOCs), toluene, and isopropyl alcohol.

[0005] Therefore, it is very important to provide a semiconductor carrier cleaning method and system that is fast, multi-functionally integrated, and can effectively remove volatile organic compounds (VOCs), toluene, and isopropyl alcohol, thereby improving the cleaning effect of semiconductor carriers. Summary of the Invention [Problem to be solved by the invention]

[0006] Therefore, the semiconductor carrier cleaning method and semiconductor carrier cleaning system provided by the present invention can effectively achieve a one-stop type complete cleaning process within a single cleaning system, and can not only perform differentiated cleaning for each component of the semiconductor carrier, but also effectively remove residual contaminants and volatile organic compounds, and reduce the space required for arranging the cleaning equipment and the long working time of the cleaning process divided into workstations. [Means for solving the problem]

[0007] One aspect of the present invention provides a one-stop type semiconductor carrier cleaning method including a disassembly step of disassembling a semiconductor carrier to be cleaned into a plurality of components, a classification step of classifying the plurality of components and placing them in cleaning tanks of the corresponding category, an ultra-fine bubble cleaning step of cleaning the components in each cleaning tank according to a cleaning process set in accordance with the characteristics of the components to be cleaned, and a negative pressure vacuum drying step of drying the internal components in each cleaning tank.

[0008] In one embodiment, in the ultra-fine bubble cleaning step, the cleaning liquid is sent to the cleaning tank using an ultra-fine bubble generator, thereby thoroughly cleaning the micropores of the component.

[0009] In one embodiment, the cleaning solution is deionized water mixed with carbon dioxide gas, ozone gas, or ammonia gas.

[0010] In one embodiment, in the ultra-fine bubble cleaning step, an ultrasonic vibration device is provided in the cleaning tank, and the components are cleaned by an ultrasonic vibration method in which high-frequency sound waves are generated to vibrate and agitate the cleaning solution in the cleaning tank.

[0011] In one embodiment, in the ultra-fine bubble cleaning step, a heating device is provided in the cleaning tank for heating the cleaning liquid in the cleaning tank.

[0012] In one embodiment, after heating the cleaning solution, the method further comprises a step of immersing the component in the cleaning solution until a predetermined soil removal condition is reached, the predetermined soil removal condition being at least 50% removal of soil from the component.

[0013] In one embodiment, in the ultra-fine bubble cleaning step, the cleaning process can accommodate the cleaning requirements of all different categories of components by controlling and setting parameters in the back-end system.

[0014] In one embodiment, the ultra-fine bubble cleaning step further includes an overflow step for circulating and replacing the cleaning liquid in the cleaning tank.

[0015] In one embodiment, the method further includes a dehydration step, prior to the negative pressure vacuum drying step, of emptying the cleaning liquid in the cleaning tank and removing a portion of the liquid adhering to the component.

[0016] Another aspect of the present invention provides a one-stop semiconductor carrier cleaning system for cleaning semiconductor carriers equipped with components of different categories. The semiconductor carrier cleaning system includes a plurality of cleaning tanks each storing a different category of component, and at least one ultra-fine bubble generator coupled to the cleaning tanks for delivering a cleaning liquid to at least one of the cleaning tanks to thoroughly clean the fine pores of the components. The cleaning tank is further equipped with at least one dehydrator disposed in the cleaning tank for emptying the cleaning liquid therein and removing a portion of the liquid adhering to the components, and at least one negative-pressure vacuum dryer disposed in the cleaning tank for drying the components in the cleaning tank. The cleaning tank, ultra-fine bubble generator, dehydrator, and negative-pressure vacuum dryer are operated sequentially, completing the processes from cleaning to drying the components in a one-stop system.

[0017] In one embodiment, the semiconductor carrier cleaning system further includes a disassembly device for disassembling different categories of components of the semiconductor carrier and transporting them to corresponding cleaning baths.

[0018] In one embodiment, the semiconductor carrier cleaning system further includes at least one ultrasonic vibration device disposed in the cleaning tank for cleaning components by an ultrasonic vibration method that generates high-frequency sound waves to vibrate and agitate the cleaning solution in the cleaning tank.

[0019] In one embodiment, the semiconductor carrier cleaning system further includes at least one heating device disposed within the cleaning bath for heating the cleaning solution within the cleaning bath.

[0020] In one embodiment, the semiconductor carrier cleaning system further includes a back-end system that controls and sequentially operates the cleaning tank, ultra-fine bubble generator, dehydrator, and negative pressure vacuum dryer, thereby completing the processes from cleaning to drying of components in a one-stop system.

[0021] In one embodiment, each cleaning tank has an overflow port, and a circulation space within the cleaning tank is defined between the overflow port and the ultra-fine bubble generator for circulating and replacing the cleaning liquid within the cleaning tank.

[0022] In one embodiment, the cleaning solution is deionized water mixed with carbon dioxide gas, ozone gas, or ammonia gas. [Effects of the Invention]

[0023] The semiconductor carrier cleaning method and system according to the present invention improve the cleaning effect of semiconductor carriers, solve the problem of harmful substances such as volatile organic compounds, toluene, and isopropyl alcohol remaining on semiconductor carriers, and effectively realize a complete one-stop cleaning process within a single cleaning system, enabling differentiated cleaning of each semiconductor carrier and its components, thereby reducing the space required for arranging cleaning equipment and the long working hours required for cleaning processes divided into workstations. [Brief explanation of the drawings]

[0024] [Figure 1] 1 is a flowchart of a semiconductor carrier cleaning method according to an embodiment of the present invention. [Figure 2A] 1 is a sub-flowchart of an ultra-fine bubble cleaning step in a semiconductor carrier cleaning method according to one embodiment of the present invention. [Figure 2B] 1 is a sub-flowchart of an ultra-fine bubble cleaning step in a semiconductor carrier cleaning method according to one embodiment of the present invention. [Figure 2C]1 is a sub-flowchart of an ultra-fine bubble cleaning step in a semiconductor carrier cleaning method according to one embodiment of the present invention. [Figure 2D] 1 is a sub-flowchart of an ultra-fine bubble cleaning step in a semiconductor carrier cleaning method according to one embodiment of the present invention. [Figure 2E] 1 is a sub-flowchart of an ultra-fine bubble cleaning step in a semiconductor carrier cleaning method according to one embodiment of the present invention. [Figure 3] 1 is a flowchart of a semiconductor carrier cleaning method according to an embodiment of the present invention. [Figure 4] 1 is a schematic block diagram of a semiconductor carrier cleaning system according to one embodiment of the present invention; [Figure 5] 1 is a schematic block diagram of a semiconductor carrier cleaning system according to one embodiment of the present invention; [Figure 6] 1 is a schematic block diagram of a semiconductor carrier cleaning system according to one embodiment of the present invention; [Figure 7] 1 is a schematic block diagram of a semiconductor carrier cleaning system according to one embodiment of the present invention; [Figure 8] 1 is a schematic block diagram of a semiconductor carrier cleaning system according to one embodiment of the present invention; [Figure 9] 1 is a schematic block diagram of a semiconductor carrier cleaning system according to one embodiment of the present invention; [Figure 10] 1 is a schematic diagram showing a partial configuration of a semiconductor carrier cleaning system according to an embodiment of the present invention; [Figure 11] 1 is a schematic diagram showing a partial configuration of a semiconductor carrier cleaning system according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0025] Hereinafter, in order to explain the technical content of the present invention in more detail, embodiments will be described in detail with reference to the drawings. Those skilled in the art can understand the objectives, features, and advantages of the present invention from the content disclosed in this specification. It should be noted that the present invention may be implemented or applied through other different specific examples, and the details of this specification may be variously modified and changed based on different perspectives and applications without departing from the spirit of the present invention. The following embodiments will explain the technical content related to the present invention in more detail, but the disclosed content is not intended to limit the scope of the claims of the present invention.

[0026] It should be noted that, in this specification, terms such as "first," "second," and "third" are used to distinguish between different elements, but not to limit the elements themselves or to indicate a particular order of elements. Furthermore, in this specification, the article "a" means one element or more than one element, unless a specific number is specifically recited. Each step described in this specification can be performed sequentially, in reverse order, or by changing or skipping the order as appropriate during the control process. It should be noted that, in this specification, "the first step can be performed following the second step" can also be expressed as "after performing the second step, the first step is performed directly" and / or "after performing the second step, another step (e.g., the third step) is first performed, and then the first step is performed."

[0027] The term "coupled" used herein may be expressed as "directly coupled" and / or "indirectly coupled." Specifically, "a first element is arranged so as to be coupled to a second element" may be expressed as "a first element is arranged so as to be directly coupled to a second element" and / or "a first element is arranged so as to be indirectly coupled to a second element."

[0028] One aspect of the present invention discloses a one-stop type semiconductor carrier cleaning method, which is used to clean carriers, containers and related parts in semiconductor processes, such as wafer transport containers, reticle transport containers, substrate transport containers or other device carriers (also referred to as "containers" in this specification) in semiconductor processes, and for example, carrier housings, pod bodies, supports, limiters, door panels, trays, etc., but is not limited to the examples shown here.

[0029] Fig. 1 is a flowchart of a semiconductor carrier cleaning method according to one embodiment of the present invention, and Figs. 2A to 2E are sub-flowcharts of the ultra-fine bubble cleaning step of the semiconductor carrier cleaning method according to one embodiment of the present invention.

[0030] See FIG. 1. The semiconductor carrier cleaning method provided by the present invention can be implemented, for example, in electronic devices. The method can be completed through steps S100 to S400 shown in FIG. 1 to perform a one-stop cleaning process. It can also effectively remove residual contaminants and volatile organic compounds while performing differentiated cleaning on each semiconductor carrier and its components. The step numbers are for illustrative purposes only and do not limit the order of execution. The electronic device can be a desktop computer, laptop, tablet computer, workstation, server, cloud server, smartphone, or other device, such as a microcomputer, processor, circuit board, or CPU. The electronic device can directly or indirectly provide a user interface for user operation. The electronic device can perform the method indirectly through other electronic devices through electrical communication with other electronic devices, or each electronic device can operate cooperatively. The electronic device may also include an output module capable of providing visual or auditory output, such as a display, touchscreen, control panel, projection, stereo projection, speaker, or telephone voice, and an input module, such as a keyboard, mouse, handle, touchscreen, motion detection, or voice recognition. However, it should be noted that the method is not limited to being performed on the electronic device.

[0031] Next, the flow of a semiconductor carrier cleaning method according to one embodiment of the present invention will be described.

[0032] See FIG. 1 . Step S100 is a disassembly step in which a semiconductor carrier to be cleaned is disassembled into multiple components. In one embodiment, the semiconductor carrier is, for example, a front-opening unified pod, and the multiple components to be disassembled are, for example, a pod body and a lid of the front-opening unified pod. The pod body is used to store wafers, and the lid is used to cover the pod body. However, the disassembled components are not limited to the example shown here, and in some embodiments, the disassembled components can be further disassembled into different components. Through the disassembly step, the semiconductor carrier can be disassembled into different components, and the different components have different properties, such as size, shape, physical properties, and chemical properties, and therefore have different subsequent processing steps corresponding to the different components.

[0033] See FIG. 1 . Step S200 is a classification step in which multiple components are classified and placed in cleaning tanks of corresponding categories. In one embodiment, the semiconductor carrier cleaning method provides at least one cleaning tank for storing components of a corresponding category, and the categories can be preset, for example, the pod body of the semiconductor carrier is the first category and the lid of the semiconductor carrier is the second category, but this is not limited to the example shown here. In this way, the classification step classifies the components disassembled through the disassembly step and places them in cleaning tanks of corresponding categories according to the classification results. This allows components of different categories to be placed in different cleaning tanks, which facilitates subsequent cleaning processes for different components.

[0034] See FIG. 1. Step S300 is an ultra-fine bubble cleaning step in which each cleaning tank cleans components in the cleaning tank according to a cleaning process set according to the characteristics of the components to be cleaned. In one embodiment, different cleaning processes, such as different cleaning times and cleaning intensities, are used for different components to be cleaned. That is, different cleaning processes are used for different cleaning tanks, but the same cleaning process may also be used for different components depending on the category and characteristics of the components. The cleaning process may also be preset according to the characteristics of different components. In one embodiment, the ultra-fine bubble cleaning step generates fine bubbles, such as ultra-fine bubbles (UFB), using, for example, an ultra-fine bubble generator, and removes contaminants, chemicals, etc. from the components to be cleaned via the fine bubbles.

[0035] See Figures 1 and 2A. In one embodiment, the ultra-fine bubble cleaning step S300 further includes a sub-step S310 in which a cleaning solution containing ultra-fine bubbles is delivered to the one or more cleaning tanks using an ultra-fine bubble generator to thoroughly clean the micropores of the component. In one embodiment, the cleaning solution is a mixture of deionized water and carbon dioxide gas, ozone gas, and / or ammonia gas. For different components, different component characteristics, and different cleaning processes, the ultra-fine bubble cleaning step can provide cleaning solutions with different properties, such as different amounts of ultra-fine bubbles, different flow rates, different pressures, and different bubble sizes, to achieve different cleaning effects on different components, but is not limited to this example.

[0036] Referring to FIG. 1 , step S400 is a negative pressure vacuum drying step in which each cleaning tank dries the components therein. In one embodiment, each cleaning tank is equipped with a drying device, such as a negative pressure vacuum drying device, and the drying step is performed using heat, airflow, or a combination of negative pressure and / or vacuum to dry the components in the cleaning tank. In one embodiment, the negative pressure vacuum drying step can be performed after the ultra-fine bubble cleaning step to dry the components after cleaning. In one embodiment, the negative pressure vacuum drying step can be performed before the ultra-fine bubble cleaning step to pre-bake the components. For example, by releasing volatile organic compounds contained in or attached to the components and allowing them to rise to the surface, the relevant volatile organic compounds can be more effectively removed when the ultra-fine bubble cleaning step is performed subsequently. In one embodiment, the negative pressure vacuum drying step can be performed before or after the ultra-fine bubble cleaning step to pre-bake the components and dry them after cleaning.

[0037] In one embodiment, steps S100 to S400 are completed by a single machine or station, realizing one-stop integrated semiconductor carrier cleaning. This improves cleaning efficiency and reduces the space required for cleaning station placement and the lengthy cleaning process time required for separate workstations. At the same time, steps S100 to S400 provide differentiated cleaning according to the characteristics of different components, thereby effectively removing contaminants and / or volatile organic compounds from each component.

[0038] See Figures 1 and 2B. In one embodiment, the ultra-fine bubble cleaning step S300 further includes a substep S320 of cleaning components using an ultrasonic vibration method in which an ultrasonic vibration device is provided in the cleaning tank and generates high-frequency sound waves to vibrate and agitate the cleaning solution in the cleaning tank. In one embodiment, an ultrasonic vibration device is provided in the cleaning tank and generates high-frequency sound waves to vibrate and agitate the cleaning solution in the cleaning tank, thereby enhancing the cleaning of components and improving the efficiency of removing contaminants and chemicals from the components. In one embodiment, the amplitude and frequency of the ultrasonic waves generated by the ultrasonic vibration device are adjustable and can be adjusted according to the characteristics of different components.

[0039] See Figures 1 and 2C. In one embodiment, the ultra-fine bubble cleaning step S300 further includes a sub-step S330 of providing a heating device in the cleaning tank to heat the cleaning solution in the cleaning tank. In one embodiment, providing a heating device such as an electric heater, a heating plate, or a high-temperature steam generator in the cleaning tank can heat the cleaning solution in the cleaning tank to improve the efficiency of removing contaminants and chemicals from the components. In one embodiment, the heating temperature is adjustable and can be adjusted according to the characteristics of different components.

[0040] See Figures 1 and 2D. In one embodiment, the ultra-fine bubble cleaning step S300 further includes a sub-step S340, which is a soaking step in which the component is soaked in the cleaning solution until a predetermined dirt removal condition is reached. The predetermined dirt removal condition is, but is not limited to, removing at least 50% of the dirt from the component. Different predetermined dirt removal conditions can be set for different types of components and corresponding different cleaning tanks. In one embodiment, the heating step S330 is followed by the soaking step S340, in which the component in the cleaning tank is continuously soaked in the cleaning solution until the predetermined dirt removal condition is reached. In one embodiment, the dirt removal condition is removing at least 50% of the dirt from the component. In one embodiment, the soaking step S340 may be performed independently and is not limited to being performed after the heating step S330. Therefore, the soaking step increases the interaction time between the cleaning solution and the contaminants and chemicals on the component, thereby improving the cleaning effect. In one embodiment, the soaking step can be used in combination with the aforementioned ultrasonic vibration and / or ultra-fine bubble injection to improve the dirt removal effect during soaking.

[0041] See Figures 1 and 2E. In one embodiment, the ultra-fine bubble cleaning step S300 further includes a sub-step S350, which is an overflow step of circulating and replacing the cleaning liquid in the cleaning tank. In one embodiment, the cleaning tank is provided with an overflow port for discharging the cleaning liquid from the cleaning tank, and at the same time, the cleaning liquid in the cleaning tank is circulated and replaced by continuously feeding the cleaning liquid therein. This allows the cleaning liquid containing contaminants and / or chemicals to be discharged and replaced with clean cleaning liquid, thereby preventing secondary contamination of components and improving the cleaning effect.

[0042] FIG. 3 is a flowchart of a semiconductor carrier cleaning method according to one embodiment of the present invention.

[0043] See FIG. 3. In one embodiment, the semiconductor carrier cleaning method according to one embodiment of the present invention further includes a dehydration step S390 performed before the negative-pressure vacuum drying step S400. The dehydration step S390 is a step of emptying the cleaning solution from the cleaning tank and removing some of the liquid adhering to the components. In one embodiment, after the components undergo the ultra-fine bubble cleaning step S300, the cleaning solution is emptied from the cleaning tank through the dehydration step S390. The components are then drained and dehydrated using a centrifugal force generating method, such as by rotating a centrifugal force generating mechanism. Specifically, the components can be clamped and rotated for spin dehydration. This allows the cleaning solution from the cleaning tank and components to be drained in advance before the negative-pressure vacuum drying step S400, thereby improving the subsequent drying efficiency.

[0044] In one embodiment, in step S300, the ultra-fine bubble cleaning step, the cleaning process corresponds to the cleaning conditions for all different categories of components by controlling and setting parameters in a back-end system. In one embodiment, the back-end system may be in the form of, for example, any of the electronic devices described above, which provides a device and / or user interface for controlling and setting parameters, and can connect signals to the equipment and devices corresponding to each of the steps described above. To perform each step of the semiconductor carrier cleaning method, the back-end system can also store at least one cleaning process corresponding to a different component category and control each step to be performed sequentially.

[0045] As described above, the cleaning bath provided by the semiconductor carrier cleaning method according to one embodiment of the present invention can have one-stop integrated functions, such as cleaning, heating, dehydration, drying, and vacuum baking. Each function can provide a cleaning process with different parameters set according to the characteristics of different components, thereby improving the cleaning effect. For example, when performing functional steps such as steam heating, drying, or vacuum baking, different parameters can be set for the corresponding cleaning bath to perform different cleaning processes according to the heat resistance of each component, thereby improving the cleaning performance of each component. The order in which the functions provided by the semiconductor carrier cleaning method are performed is not limited. For example, for certain components, the cleaning bath may perform cleaning, dehydration, and baking in that order. For other components, the cleaning bath may perform the following steps in the order of baking, cleaning, dehydration, and drying. By first baking the component, substances such as volatile organic compounds contained therein can be released and floated to the surface of the component. Then, by cleaning with a cleaning solution, the substances that floated to the surface can be removed, thereby improving the cleaning effect. Furthermore, the steps provided in the semiconductor carrier cleaning method according to one embodiment of the present invention allow each cleaning step to be completed in one station, thereby enabling the integration of various functional steps, thereby improving the efficiency of cleaning semiconductor carriers.

[0046] 4 to 9 are schematic block diagrams of semiconductor carrier cleaning systems according to several embodiments of the present invention.

[0047] See Figure 4. Another aspect of the present invention provides a semiconductor carrier cleaning system 10 for cleaning a semiconductor carrier SC. The semiconductor carrier SC includes a plurality of different categories of members, such as a first member C1, a second member C2, a third member C3, etc., such as, but not limited to, a pod body, a lid, etc. of the semiconductor carrier SC.

[0048] See Figure 4. The semiconductor carrier cleaning system 10 includes a plurality of cleaning tanks 100, at least one ultra-fine bubble generator 200, at least one dehydrator 300, and at least one negative pressure vacuum dryer 400.

[0049] In one embodiment, each of the plurality of cleaning tanks 100 stores a different category of components, for example, as shown in Figure 4, a first component C1 is stored in a portion of the cleaning tanks 100, a second component C2 is stored in a portion of the cleaning tanks 100, and a third component C3 is stored in a portion of the cleaning tanks 100. The different components have different corresponding properties, such as different sizes, different structural strengths, different heat resistances, etc.

[0050] In one embodiment, the ultra-fine bubble generator 200 is coupled to the cleaning tanks 100 and is used to deliver a cleaning solution CF to at least one cleaning tank 100 to thoroughly clean the micropores of components (e.g., a first component C1, a second component C2, etc.). In one embodiment, one corresponding ultra-fine bubble generator 200 is provided for each cleaning tank 100. In one embodiment, the ultra-fine bubble generator 200 may be configured to deliver the cleaning solution CF to multiple cleaning tanks 100. In one embodiment, the ultra-fine bubble generator 200 generates microbubbles, such as ultra-fine bubbles (UFB), and is used to remove contaminants, chemicals, etc. from the component to be cleaned by introducing the ultra-fine bubbles into the cleaning solution CF. In one embodiment, the cleaning solution CF is a mixture of deionized water with carbon dioxide gas, ozone gas, and / or ammonia gas. In one embodiment, the ultra-fine bubble generator 200 can provide different cleaning processes for different components in the cleaning tank 100 and for different component characteristics, and by providing cleaning solutions CF with different characteristics, for example, cleaning solutions CF with different ultra-fine bubble amounts, different flow rates, different pressures, and different bubble sizes, different cleaning effects can be achieved for different components, but this example is not limiting.

[0051] In one embodiment, the cleaning tank 100 includes at least one dehydrator 300 and at least one negative-pressure vacuum dryer 400. The dehydrator 300 is disposed in the cleaning tank 100 and empties the cleaning liquid CF from the cleaning tank 100 and removes some of the liquid adhering to the components. The negative-pressure vacuum dryer 400 is disposed in the cleaning tank 100 and is used to dry the components (e.g., the first component C1, the second component C2, etc.) in the cleaning tank 100. "Disposed in the cleaning tank 100" means that the dehydrator 300 may be disposed within the cleaning tank 100 or may be integrated with the cleaning tank 100, for example, disposed next to the cleaning tank 100. In one embodiment, the dehydrator 300 drains and dehydrates the components using a centrifugal force generation method that generates rotation, such as a centrifugal force generating mechanism. Specifically, the components are clamped and rotated for dehydration. In one embodiment, the negative pressure vacuum drying device 400 dries the components in the cleaning tank by methods such as temperature, blowing air, negative pressure, and / or vacuum.

[0052] In one embodiment, the cleaning tank 100, ultra-fine bubble generator 200, dehydrator 300, and negative pressure vacuum dryer 400 operate in sequence to complete the processes from cleaning to drying of components (e.g., first component C1, second component C2, etc.) in the cleaning tank 100 in a one-stop system. This not only improves the cleaning effect of the semiconductor carriers and further alleviates the problem of contaminants and harmful substances such as volatile organic compounds remaining on the semiconductor carriers, but also effectively achieves a complete one-stop cleaning process within a single semiconductor carrier cleaning system, thereby reducing the space required for arranging the cleaning equipment and the long working hours required for the cleaning process divided into different workstations.

[0053] See FIG. 5. In one embodiment, the semiconductor carrier cleaning system 10 includes a disassembly device 500 for disassembling the semiconductor carrier SC into different categories (e.g., first component C1, second component C2, third component C3, etc.), sorting the components, and transporting them into the corresponding cleaning baths 100. In one embodiment, the semiconductor carrier SC is, for example, a front-opening unified pod (FOUP), and the disassembled components are, for example, the pod body (e.g., first component C1) and the lid (e.g., second component C2) of the front-opening unified pod, but the disassembled components are not limited to this example. In some embodiments, the semiconductor carrier SC can be further disassembled into different components. Through the disassembly device 500, the semiconductor carrier SC can be disassembled into different components, and the different components have different characteristics, such as size, shape, physical properties, and chemical properties, so that the different components have different corresponding subsequent processing steps in the different cleaning baths 100. In one embodiment, the disassembly device 500 includes, for example, a robot arm for disassembling the semiconductor carrier SC.

[0054] See FIG. 6. In one embodiment, the semiconductor carrier cleaning system 10 includes at least one ultrasonic vibration device 600 disposed within the cleaning bath 100. The ultrasonic vibration device 600 generates high-frequency sound waves to vibrate and agitate the cleaning solution CF within the cleaning bath 100, thereby cleaning components (e.g., first component C1, second component C2, third component C3, etc.) using an ultrasonic vibration method. Therefore, by enhancing cleaning of the components using the ultrasonic vibration method, the efficiency of removing contaminants and chemicals from the components is improved. In one embodiment, the amplitude and frequency of the ultrasonic waves generated by the ultrasonic vibration device 600 are adjustable and can be adjusted according to the characteristics of different components.

[0055] See FIG. 7 . In one embodiment, the semiconductor carrier cleaning system 10 includes at least one heating device 700 disposed in the cleaning bath 100. The heating device 700 is used to heat the cleaning solution CF in the cleaning bath 100. In one embodiment, the heating device 700 may be, for example, but not limited to, an electric heater, a heating plate, a high-temperature steam generator, an infrared heating device, etc. In one embodiment, the heating device 700 is disposed in the cleaning bath 100 to heat the cleaning solution CF in the cleaning bath 100 and improve the efficiency of separating contaminants and chemicals from the components. In one embodiment, the heating temperature of the heating device 700 is adjustable and can be adjusted according to different component characteristics.

[0056] See FIG. 8. In one embodiment, the semiconductor carrier cleaning system 10 includes a back-end system 800 that is signal-connected to the cleaning bath 100, the ultra-fine bubble generator 200, the dehydration device 300, and the negative pressure vacuum dryer 400. The back-end system 800 controls and sequentially operates the cleaning bath 100, the ultra-fine bubble generator 200, the dehydration device 300, and the negative pressure vacuum dryer 400, thereby enabling a one-stop process for cleaning and drying components (e.g., first component C1, second component C2, third component C3, etc.) in the cleaning bath 100. In one embodiment, the cleaning process of the ultra-fine bubble generator 200 can accommodate the cleaning requirements of all different categories of components by controlling and setting parameters in the back-end system 800. In one embodiment, the back-end system 800 is used to control and integrate the operation and sequence of the cleaning bath 100, the ultra-fine bubble generator 200, the dehydration device 300, and the negative pressure vacuum dryer 400. In one embodiment, the backend system 800 may take the form of, for example, any of the electronic devices described above, providing a device and / or user interface for controlling and setting parameters, signaling connections to equipment corresponding to each of the steps described above, and storing at least one cleaning process corresponding to different part categories.

[0057] See Figure 9. Each cleaning tank 100 in the semiconductor carrier cleaning system 10 is equipped with an overflow port 110, and a circulation space is defined between the overflow port 110 and the ultra-fine bubble generator 200 to circulate and replace the cleaning liquid in the cleaning tank 100. In one embodiment, the cleaning tank 100 is provided with the overflow port 110 for discharging the cleaning liquid from the cleaning tank 100, and at the same time, the cleaning liquid CF is continuously fed into the cleaning tank 100 to circulate and replace the cleaning liquid CF in the cleaning tank 100. This allows the cleaning liquid CF containing contaminants and / or chemicals to be discharged and replaced with clean cleaning liquid CF, thereby preventing secondary contamination of components and improving the cleaning effect.

[0058] In one embodiment, the above-mentioned devices can be arbitrarily arranged in the semiconductor carrier cleaning system 10 according to different combinations, arrangements, and needs, but are not limited to those explicitly shown above.

[0059] Figure 10 is a schematic diagram showing a partial configuration of a semiconductor carrier cleaning system according to an embodiment of the present invention. Figure 11 is a schematic diagram showing a partial configuration of a semiconductor carrier cleaning system according to an embodiment of the present invention.

[0060] Please refer to Figures 10 and 11. Figure 10 is a schematic diagram showing a partial configuration of a semiconductor carrier cleaning system according to one embodiment of the present invention. A first member C1 (e.g., a pod body of a FOUP) is stored in the cleaning tank 100. Figure 11 is a schematic diagram showing a partial configuration of a semiconductor carrier cleaning system according to another embodiment. A second member C2 (e.g., a lid body of a FOUP) is stored in the cleaning tank 100.

[0061] See Figures 10 and 11. The cleaning tank 100 is equipped with an ultrasonic vibration device 600, and the ultra-fine bubble generator 200 is connected to the cleaning tank 100 via piping to deliver the cleaning solution CF. The ultra-fine bubble generator 200 is connected to a liquid conduit 210 to receive deionized water (DI Water) and a gas conduit 220 to receive a gas for generating ultra-fine bubbles, such as carbon dioxide (CO2) gas, ozone (O3) gas, ammonia (NH3) gas, or a substance capable of generating ultra-fine bubbles. These gases are mixed within the ultra-fine bubble generator 200 to produce a cleaning solution CF containing ultra-fine bubbles. Furthermore, depending on the installation positions of the ultra-fine bubble generator 200 and the piping that delivers the cleaning solution CF, a liquid flow can be generated within the cleaning tank 100, as shown by the arrows in Figures 10 and 11, to effectively clean the components in the cleaning tank 100. In one embodiment, the overflow port (not shown) can be provided on the opposite side of the cleaning tank 100 to the side where the piping for the ultra-fine bubble generator 200 is provided, so that the cleaning solution CF can be sufficiently introduced into the cleaning tank 100 and the cleaning solution CF can continuously overflow and circulate, thereby removing the cleaning solution CF and contaminants floating on its surface. In one embodiment, the overflow port (not shown) can be provided above the side of the cleaning tank 100 where the piping for the ultra-fine bubble generator 200 is provided, so that the cleaning solution CF can be sufficiently introduced into the cleaning tank 100 and the cleaning solution CF can more easily overflow and circulate effectively, thereby removing the cleaning solution CF and contaminants floating on its surface.

[0062] As a result, the one-stop semiconductor carrier cleaning method and semiconductor carrier cleaning system according to the present invention, which includes integrated steps such as disassembly, classification, ultra-fine bubble cleaning, and negative pressure vacuum drying, effectively improves the cleaning effect of semiconductor carriers and alleviates the problem of contaminants and harmful substances such as volatile organic compounds, toluene, and isopropyl alcohol remaining on semiconductor carriers. A complete one-stop cleaning process can be effectively achieved within a single cleaning system, allowing for differentiated cleaning of each semiconductor carrier component, thereby reducing the space required for cleaning equipment setup and the lengthy work times required for cleaning processes divided into workstations. Furthermore, the use of ultrasonic vibration devices, heating devices, back-end systems, immersion steps, and overflow steps further improves the cleaning effect of the semiconductor carrier cleaning method and system, thereby improving the cleanliness of semiconductor carriers.

[0063] Although the above description is provided with exemplary embodiments of the present invention, it will be apparent to those skilled in the art that the above embodiments are merely for the purpose of facilitating understanding of the present invention and should not be construed as limiting the scope of the present invention. Furthermore, all variations and replacements equivalent to the above embodiments should be considered to be within the scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the content defined in the appended claims, and the appended claims should be interpreted broadly to include, for example, modifications, similar arrangements, and processes. [Explanation of symbols]

[0064] 10. Semiconductor Carrier Cleaning System 100 cleaning tank 110 Overflow port 200 Ultra Fine Bubble Generator 210 Liquid conduit 220 Gas Pipe 300 Dehydration equipment 400 Negative pressure vacuum drying device 500 Decomposition equipment 600 Ultrasonic vibration device 700 Heating device 800 Backend System CF cleaning solution C1 First member C2 Second member C3 Third member SC Semiconductor Carrier S100~S400 steps S310~S350 Step S390 Step

Claims

1. a disassembly step of disassembling the semiconductor carrier to be cleaned into a plurality of components; a classification step of classifying the plurality of components and placing them in a cleaning tank of a corresponding category; an ultra-fine bubble cleaning step in which, in each of the cleaning tanks, components in the cleaning tanks are cleaned according to a cleaning process set according to the characteristics of the components to be cleaned; and The semiconductor carrier cleaning method further comprises a negative pressure vacuum drying step for drying the internal members in each of the cleaning tanks.

2. 2. The semiconductor carrier cleaning method according to claim 1, wherein in the ultra-fine bubble cleaning step, the cleaning liquid is sent to the cleaning tank using an ultra-fine bubble generator, thereby thoroughly cleaning the micropores of the member.

3. 3. The semiconductor carrier cleaning method according to claim 2, wherein said cleaning liquid is a mixture of deionized water and carbon dioxide gas, ozone gas, or ammonia gas.

4. 2. The semiconductor carrier cleaning method according to claim 1, wherein in the ultra-fine bubble cleaning step, an ultrasonic vibration device is provided in the cleaning tank, and the components are cleaned by an ultrasonic vibration method in which high-frequency sound waves are generated to vibrate and agitate the cleaning solution in the cleaning tank.

5. 2. The semiconductor carrier cleaning method according to claim 1, wherein in said ultra-fine bubble cleaning step, a heating device is provided in said cleaning tank for heating the cleaning liquid in said cleaning tank.

6. 6. The semiconductor carrier cleaning method according to claim 5, further comprising a step of immersing the member in the cleaning solution after heating the cleaning solution until a predetermined contamination removal condition is reached, wherein the predetermined contamination removal condition is that 50% or more of the contamination is removed from the member.

7. 2. The semiconductor carrier cleaning method according to claim 1, wherein in the ultra-fine bubble cleaning step, the cleaning process controls and sets parameters in a back-end system to accommodate cleaning conditions for all different categories of the components.

8. 2. The semiconductor carrier cleaning method according to claim 1, further comprising an overflow step for circulating and replacing the cleaning liquid in the cleaning tank in the ultra-fine bubble cleaning step.

9. 2. The semiconductor carrier cleaning method according to claim 1, further comprising a dehydration step, before the negative pressure vacuum drying step, of emptying the cleaning solution in the cleaning tank and removing a portion of the liquid adhering to the member.

10. Used to clean semiconductor carriers with multiple different categories of components, a plurality of cleaning tanks each containing a different category of components; At least one ultra-fine bubble generator coupled to the cleaning tank for delivering a cleaning liquid to the at least one cleaning tank to thoroughly clean the micropores of the component; 1. A semiconductor carrier cleaning system comprising: The cleaning tank comprises: at least one dewatering device disposed in the cleaning tank for emptying the cleaning liquid from the cleaning tank and removing a portion of the liquid adhering to the component; at least one negative pressure vacuum drying device disposed in the cleaning tank for drying the components in the cleaning tank; The cleaning tank, the ultra-fine bubble generator, the dehydration device, and the negative pressure vacuum dryer are operated in sequence, completing the processes from cleaning to drying of the components in a one-stop system.

11. 11. The semiconductor carrier cleaning system of claim 10, further comprising a disassembly device for disassembling different categories of components of the semiconductor carrier and transporting them to the corresponding cleaning baths.

12. 11. The semiconductor carrier cleaning system of claim 10, further comprising at least one ultrasonic vibration device disposed in the cleaning tank for cleaning the member by an ultrasonic vibration method that generates high-frequency sound waves to vibrate and agitate the cleaning liquid in the cleaning tank.

13. 11. The semiconductor carrier cleaning system of claim 10, further comprising at least one heating device disposed within said cleaning bath for heating said cleaning solution within said cleaning bath.

14. 11. The semiconductor carrier cleaning system of claim 10, further comprising a back-end system for controlling the cleaning tank, the ultra-fine bubble generator, the dehydration device, and the negative pressure vacuum dryer to operate in sequence, thereby completing the processes from cleaning to drying of the components in a one-stop system.

15. 11. The semiconductor carrier cleaning system of claim 10, wherein each of the cleaning tanks has an overflow port, and a circulation space within the cleaning tank is defined between the overflow port and the ultra-fine bubble generator for circulating and replacing the cleaning liquid within the cleaning tank.

16. 11. The semiconductor carrier cleaning system according to claim 10, wherein the cleaning liquid is a mixture of deionized water and carbon dioxide gas, ozone gas, or ammonia gas.

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