Processing device

Abstract

To provide a processing device capable of reducing power consumption.SOLUTION: A processing water circulation path 8 of a processing device 2 includes: processing water supply means 24 that supplies processing water to a processing tool; a dirty tank 26 for waste fluid; filtration means 28 that filters the waste fluid to make the waste fluid into fresh water; a clean tank 30 for fresh water; and processing water regeneration means 32 that purifies the fresh water into processing water. A temperature controlling water circulation path 10 includes: temperature controlling water adjustment means 58, a temperature controlling water feeding path 60, and a temperature controlling water return path 62. To the temperature controlling water return path 62, a clean tank path 72 communicating with the clean tank 30 and a fresh water introduction path 74 for introducing fresh water in the clean tank 72 to the temperature controlling water return path 62 are connected. The processing water supplied to the processing tool is scattered to be mist, the waste fluid is cooled by evaporation heat, passes the dirty tank 26 and the filtration means 28, and is stored in the clean tank 30, the fresh water in the clean tank 30 is used by the processing water regeneration means 32 and the temperature controlling water adjustment means 58, and thereby power consumption is reduced.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a processing device such as a grinding device or a dicing device. [Background technology]

[0002] A wafer has multiple devices such as ICs and LSIs formed on its surface, separated by planned dividing lines. The back side is ground by a grinding machine to reduce the thickness to a specified level, and then the wafer is divided into individual device chips by a dicing machine. Each of these device chips is then used in electrical equipment such as mobile phones and personal computers.

[0003] The grinding device is generally composed of a chuck table that holds the wafer, a grinding means that rotatably mounts a grinding wheel equipped with a ring-shaped grinding stone that grinds the wafer held on the chuck table, and a grinding water supply means that supplies grinding water (e.g., pure water) to the grinding wheel, and is capable of grinding the wafer with high precision (see, for example, Patent Document 1).

[0004] A dicing device is generally composed of a chuck table that holds the wafer, a cutting means having a rotatably mounted cutting blade that cuts the wafer held on the chuck table, and a cutting water supply means that supplies cutting water (e.g., pure water) to the cutting blade, and can divide the wafer into individual device chips with high precision (see, for example, Patent Document 2).

[0005] In addition, processing water such as grinding water and cutting water used in grinding devices and dicing devices, and temperature-controlled water that adjusts the grinding means and cutting means to a constant temperature, are adjusted to the desired temperature by temperature adjustment means before being used in processing devices such as grinding devices and dicing devices. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-158768 [Patent Document 2] Japanese Patent Application Publication No. 2019-145583 Summary of the Invention [Problem to be solved by the invention]

[0007] However, the temperature of the processing water used as grinding water and cutting water is different from the temperature of the temperature-controlled water that regulates the grinding means and cutting means to a constant temperature. In addition, while pure water is required as processing water, clean water is sufficient for temperature-controlled water, and pure water is not required. Therefore, the circulation paths for the processing water and the temperature-controlled water are independent, which is one of the reasons why power consumption cannot be reduced.

[0008] An object of the present invention is to provide a processing device that can reduce power consumption. [Means for solving the problem]

[0009] According to the present invention, there is provided the following processing device that solves the above-mentioned problems. "A processing device, a chuck table for holding the workpiece; a processing means including a housing supporting a rotary shaft having a processing tool attached to an end thereof for processing the workpiece held on the chuck table; a processing water circulation path including a processing water supply means for supplying processing water to the processing tool, a dirty tank for storing waste liquid after processing, a filtration means for filtering the waste liquid stored in the dirty tank to produce clean water, a clean tank for storing clean water, and a processing water regeneration means for purifying the clean water stored in the clean tank into processing water and adjusting it to a desired temperature before supplying it to the processing water supply means; a temperature-controlled water circulation path for circulating temperature-controlled water through a housing supporting the rotary shaft of the processing means; The temperature-controlled water circulation path includes a temperature-controlled water adjustment means for adjusting the temperature of the temperature-controlled water to a predetermined temperature, a temperature-controlled water supply path communicating from the temperature-controlled water adjustment means to the housing, and a temperature-controlled water return path communicating from the housing to the temperature-controlled water adjustment means; The temperature-controlled water return path is connected to a clean tank path that communicates with the clean tank and discharges the temperature-controlled water, and a fresh water introduction path that introduces fresh water stored in the clean tank to the temperature-controlled water return path; The processing water supplied to the processing tools of the processing means is dispersed and atomized, and the waste liquid cooled by the heat of vaporization is stored in the clean tank as fresh water via the dirty tank and the filtration means, and the fresh water stored in the clean tank is utilized by the processing water regeneration means and the temperature-adjusted water adjustment means to reduce power consumption.

[0010] The temperature-controlled water return path is provided with a first branch portion branching into the clean tank path and a second branch portion branching into the fresh water introduction path, a first water control valve is disposed between the first branch portion and the second branch portion, a second water control valve is disposed in the clean tank path, and a third water control valve is disposed in the fresh water introduction path; In the temperature-controlled water return path, If the temperature of the temperature-controlled water up to the first branch point is lower than the temperature of the fresh water stored in the clean tank, it is preferable to open the first water control valve and close at least one of the second water control valve and the third water control valve to block the introduction of fresh water.

[0011] In the temperature-controlled water return path, If the temperature of the temperature-controlled water up to the first branch point is higher than the temperature of the fresh water stored in the clean tank, it is desirable to adjust the opening and closing of the first water control valve, the second water control valve, and the third water control valve to bring the temperature of the temperature-controlled water led to the temperature-controlled water adjustment means closer to a predetermined temperature, thereby reducing the power consumption of the temperature-controlled water adjustment means.

[0012] In the temperature-controlled water return path, When the temperature of the temperature-controlled water up to the first branch point is higher than the temperature of the fresh water stored in the clean tank and the temperature of the fresh water stored in the clean tank is lower than the desired temperature of the processing water, the opening and closing of the first water control valve, the second water control valve, and the third water control valve are adjusted to supply temperature-controlled water to the clean tank, bringing the temperature of the fresh water sent to the processing water regeneration means closer to the desired temperature to reduce the power consumption of the processing water regeneration means, and bringing the temperature of the temperature-controlled water led to the temperature-controlled water adjustment means closer to a predetermined temperature to reduce the power consumption of the temperature-controlled water adjustment means.

[0013] The clean tank is provided with a return path for returning overflowing fresh water to the dirty tank, and the clean tank is always filled with fresh water, so that the processing water regeneration means and the temperature control water adjustment means can always use fresh water. [Effects of the Invention]

[0014] The processing device of the present invention comprises: a chuck table for holding the workpiece; a processing means including a housing supporting a rotary shaft having a processing tool attached to an end thereof for processing the workpiece held on the chuck table; a processing water circulation path including a processing water supply means for supplying processing water to the processing tool, a dirty tank for storing waste liquid after processing, a filtration means for filtering the waste liquid stored in the dirty tank to produce clean water, a clean tank for storing clean water, and a processing water regeneration means for purifying the clean water stored in the clean tank into processing water and adjusting it to a desired temperature before supplying it to the processing water supply means; a temperature-controlled water circulation path for circulating temperature-controlled water through a housing supporting the rotary shaft of the processing means; The temperature-controlled water circulation path includes a temperature-controlled water adjustment means for adjusting the temperature of the temperature-controlled water to a predetermined temperature, a temperature-controlled water supply path communicating from the temperature-controlled water adjustment means to the housing, and a temperature-controlled water return path communicating from the housing to the temperature-controlled water adjustment means; The temperature-controlled water return path is connected to a clean tank path that communicates with the clean tank and discharges the temperature-controlled water, and a fresh water introduction path that introduces fresh water stored in the clean tank to the temperature-controlled water return path; The processing water supplied to the processing tools of the processing means is scattered into mist, and the waste liquid cooled by the heat of vaporization is stored in the clean tank as clean water through the dirty tank and the filtration means.The clean water stored in the clean tank is used by the processing water regeneration means and the temperature control water adjustment means to reduce power consumption, so a coexistent circulation path is formed in which the processing water regeneration means and the temperature control water adjustment means share the clean tank that stores clean water cooled by the heat of vaporization, eliminating the problem of the conventional circulation paths being independent and not being able to reduce power consumption. [Brief explanation of the drawings]

[0015] [Figure 1] 1 is a perspective view of a processing device according to the present invention. [Figure 2] FIG. 2 is a circuit diagram of the processing device shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0016] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a processing apparatus according to the present invention will now be described with reference to the drawings.

[0017] (Processing equipment 2) As shown in Figures 1 and 2, the processing device 2 includes a chuck table 4 (see Figure 1) that holds the workpiece, a processing means 6 (see Figures 1 and 2) that processes the workpiece held on the chuck table 4, a processing water circulation path 8 (see Figure 2) that circulates processing water, and a temperature-controlled water circulation path 10 (see Figure 2) that circulates temperature-controlled water.

[0018] (Chuck table 4) Referring to FIG. 1, a circular suction chuck 12 is disposed on the upper end of a chuck table 4. The suction chuck 12 is formed of a porous material such as porous ceramics. The suction chuck 12 is connected to a suction means (not shown). The suction means generates a suction force on the upper surface of the chuck table 4, thereby suction-holding a workpiece such as a wafer W placed on the upper surface of the suction chuck 12. A plurality of clamps 14 for fixing an annular frame F supporting the wafer W are disposed at intervals in the circumferential direction around the periphery of the chuck table 4. The wafer W shown in FIG. 1 is supported on the annular frame F via a dicing tape T. As shown in FIG. 2, the surface Wa of the wafer W is partitioned into a plurality of rectangular regions by grid-like dividing lines L, and devices D such as ICs and LSIs are formed in each rectangular region.

[0019] The chuck table 4 is provided so as to be movable in the X-axis direction and rotatable about the Z-axis direction. Although not shown, the chuck table 4 is processed and fed in the X-axis direction by a ball screw-type X-axis feed means. The chuck table 4 is also rotated about the Z-axis direction by a motor (not shown). The X-axis direction is the direction indicated by the arrow X in FIG. 1, and the Z-axis direction is the direction indicated by the arrow Z in FIG. 1, which is an up-down direction perpendicular to the X-axis direction. The Y-axis direction indicated by the arrow Y in FIG. 1 is a direction perpendicular to the X-axis and Z-axis directions. The XY plane defined by the X-axis and Y-axis directions is substantially horizontal.

[0020] (Processing means 6) As shown in Figure 2, the processing means 6 includes a housing 20 that supports a rotating shaft 18, the end of which is fitted with a processing tool (cutting blade 16) that processes the workpiece held on the chuck table 4. In this embodiment, the processing means 6 is a cutting means equipped with a cutting blade 16 that cuts the workpiece, but the processing means 6 is not limited to a cutting means and may be, for example, a grinding means equipped with a grinding wheel that grinds the workpiece. Because both processing water and temperature-controlled water are supplied to the processing means 6, for convenience, Figure 2 shows the housing 20 of the processing means 6 in both the processing water circulation path 8 and the temperature-controlled water circulation path 10. However, the housing 20 in the processing water circulation path 8 and the housing 20 in the temperature-controlled water circulation path 10 are the same.

[0021] (Cutting blade 16) The cutting blade 16 has an annular base 16a and an annular cutting edge 16b fixed to the outer periphery of the base 16a. The base 16a is made of a metal material such as an aluminum alloy. The cutting edge 16b may be made of abrasive grains such as diamond and a binder such as metal or resin. The cutting blade 16 is covered by a blade cover 22 attached to the housing 20.

[0022] (Rotation axis 18) The cutting blade 16 is attached to one end of the rotating shaft 18 in the Y-axis direction, and a motor (not shown) that rotates the rotating shaft 18 about its axis in the Y-axis direction is provided on the other end of the rotating shaft 18. The rotating shaft 18 is inserted into a cylindrical housing 20 and is supported by the housing 20 so as to be rotatable about its axis in the Y-axis direction.

[0023] (Housing 20) A flow path 20a is formed inside the housing 20, through which temperature-controlled water flows to adjust the temperature of the housing 20 (see the housing 20 in the temperature-controlled water circulation path 10). When processing is performed by the processing means 6, the rotating shaft 18 rotates at high speed, causing the rotating shaft 18 and the housing 20 to generate heat. Therefore, the housing 20 and the rotating shaft 18 are cooled by the temperature-controlled water flowing through the flow path 20a inside the housing 20, and the temperatures of the housing 20 and the rotating shaft 18 are adjusted to a constant temperature.

[0024] The housing 20 is configured to be movable in the Y-axis direction and the Z-axis direction. The housing 20 is indexed and fed in the Y-axis direction by a ball screw type Y-axis feed means (not shown), and is cut and fed in the Z-axis direction by a ball screw type Z-axis feed means (not shown). This allows the positions of the cutting blade 16 in the Y-axis direction and the Z-axis direction to be adjusted.

[0025] The area in which the chuck table 4 and processing means 6 are installed is defined as a processing chamber. That is, the chuck table 4 and processing means 6 are covered by a partition member (not shown) that defines the processing chamber. The partition member includes a cover member made of a transparent material that can be opened and closed freely. An operator can view the inside of the processing chamber through the transparent cover member, and can access the chuck table 4 and processing means 6 by opening the cover member.

[0026] (Processing water circulation route 8) As shown in Figure 2, the processing water circulation path 8 includes a processing water supply means 24 that supplies processing water to the processing tool (cutting blade 16), a dirty tank 26 that stores waste liquid after processing, a filtration means 28 that filters the waste liquid stored in the dirty tank 26 to produce clean water, a clean tank 30 that stores the clean water, and a processing water regeneration means 32 that purifies the clean water stored in the clean tank 30 into processing water, adjusts it to a desired temperature, and supplies it to the processing water supply means 24.

[0027] (Processing water supply means 24) The processing water supply means 24 of this embodiment has a pair of supply ports 34 provided on the upper part of the blade cover 22 of the processing means 6 and a pair of jet nozzles 36 (only one side is shown) provided on the lower part of the blade cover 22. The pair of supply ports 34 are connected to the pair of jet nozzles 36 via a flow path (not shown) in the blade cover 22. The pair of jet nozzles 36 are arranged at intervals in the Y-axis direction, sandwiching the cutting blade 16 therebetween. The jet nozzles 36 also have a plurality of jet orifices (not shown) formed at intervals in the X-axis direction. Processing water is supplied to the pair of supply ports 34 of the processing water supply means 24 from the processing water regeneration means 32, and the processing water supplied to the pair of supply ports 34 is sprayed from the plurality of jet orifices of the pair of jet nozzles 36 toward the cutting blade 16 and the workpiece.

[0028] (Dirty Tank 26) The dirty tank 26 stores the waste liquid after processing that has been used when processing the workpiece with the processing means 6. The waste liquid after processing contains foreign matter such as processing chips generated from the workpiece during processing and abrasive grains that have fallen off the cutting blade 16 during processing. The waste liquid after processing is received in a waste liquid pan 38 provided below the processing means 6, and is sent from the waste liquid pan 38 to the dirty tank 26 via a waste liquid path 40.

[0029] (filtration means 28) The filtering means 28 has a first pump 42 that sucks in the waste liquid in the dirty tank 26 and discharges it toward the clean tank 30, and a filter 44 that captures foreign matter such as machining chips and abrasive grains mixed in the waste liquid and produces clean water from the waste liquid. The first pump 42 and the filter 44 are provided in a filtering path 46 that connects the dirty tank 26 and the clean tank 30.

[0030] (Clean Tank 30) The clean tank 30 stores the fresh water produced when the waste liquid is filtered by the filtering means 28. The clean tank 30 of this embodiment is formed with a return path 48 that returns overflowing fresh water to the dirty tank 26, so that the clean tank 30 is always filled with fresh water. The clean tank 30 is also provided with a first temperature sensor 50 that detects the temperature of the fresh water.

[0031] (Processing water regeneration means 32) The processing water regeneration means 32 may include an ultraviolet irradiator that destroys organic matter contaminated in the fresh water, an ion exchange resin that produces processing water (e.g., pure water) from the fresh water from which the organic matter has been destroyed by the ultraviolet irradiator, and processing water conditioning means that adjusts the temperature of the processing water produced by the ion exchange resin to a desired temperature. The processing water conditioning means may also include a compressor that compresses a refrigerant, a condenser that condenses the refrigerant compressed by the compressor, and an evaporator that vaporizes the refrigerant condensed by the condenser. The processing water regeneration means 32 is provided in the processing water supply path 52 that connects the clean tank 30 and the processing water supply means 24. In this embodiment, the processing water supply path 52 includes, in addition to the processing water regeneration means 32, a second pump 54 that draws fresh water from the clean tank 30 and discharges it toward the processing water supply means 24, a second temperature sensor 56 that detects the temperature of the processing water purified by the processing water regeneration means 32, and a water control valve 57 that adjusts the amount of processing water sent to the processing water supply means 24.

[0032] (Temperature-controlled water circulation route 10) 2, the temperature-controlled water circulation path 10 is a path that circulates the temperature-controlled water through a housing 20 that supports the rotating shaft 18 of the processing means 6. The temperature-controlled water circulation path 10 includes a temperature-controlled water adjustment means 58 that adjusts the temperature of the temperature-controlled water to a predetermined temperature, a temperature-controlled water feed path 60 that communicates from the temperature-controlled water adjustment means 58 to the housing 20, and a temperature-controlled water return path 62 that communicates from the housing 20 to the temperature-controlled water adjustment means 58.

[0033] (Temperature control water adjustment means 58) The temperature-controlled water adjusting means 58 may be configured, similar to the processing water adjusting means of the processing water regeneration means 32, to have a compressor that compresses the refrigerant, a condenser that condenses the refrigerant compressed by the compressor, and an evaporator that vaporizes the refrigerant condensed by the condenser.

[0034] (Temperature-controlled water supply route 60) The temperature-controlled water supply path 60 is a path for supplying temperature-controlled water, which has been adjusted to a predetermined temperature by the temperature-controlled water adjustment means 58, to the housing 20 of the processing means 6. The temperature-controlled water supply path 60 is provided with a third temperature sensor 64 for detecting the temperature of the temperature-controlled water supplied to the housing 20.

[0035] (Temperature-controlled water return route 62) The temperature-controlled water return path 62 is a path for sending the temperature-controlled water that has flowed out of the housing 20 to the temperature-controlled water adjustment means 58. The temperature-controlled water return path 62 is provided with a third pump 66 for circulating the temperature-controlled water, a fourth temperature sensor 68 that detects the temperature of the temperature-controlled water upstream of the third pump 66, and a fifth temperature sensor 70 that detects the temperature of the temperature-controlled water downstream of the third pump 66.

[0036] 2, the temperature-controlled water return path 62 is connected to a clean tank path 72 that communicates with the clean tank 30 and discharges the temperature-controlled water, and a fresh water inlet path 74 that guides fresh water stored in the clean tank 30 to the temperature-controlled water return path 62. The temperature-controlled water return path 62 also has a first branch portion 76 that branches off to the clean tank path 72, and a second branch portion 78 that branches off to the fresh water inlet path 74. A first water control valve 80 is disposed between the first branch portion 76 and the second branch portion 78, a second water control valve 82 is disposed in the clean tank path 72, and a third water control valve 84 is disposed in the fresh water inlet path 74.

[0037] 1, the processing apparatus 2 further includes a cassette stage 88 that can be raised and lowered and on which a cassette 86 containing a plurality of workpieces such as wafers W is placed, a carry-in / out means 92 that extracts the uncut workpieces from the cassette 86 and carries them out to a temporary storage table 90 and carries the cut workpieces positioned on the temporary storage table 90 back into the cassette 86, a first transport means 94 that transports the uncut workpieces that have been carried out from the cassette 86 to the temporary storage table 90 to the chuck table 4, an imaging means 96 that images the workpieces held on the chuck table 4, a cleaning means 98 that cleans the cut workpieces, and a second transport means 100 that transports the cut workpieces from the chuck table 4 to the cleaning means 98. Although a detailed description will be omitted, the cleaning means 98 is also supplied with cleaning water (e.g., pure water) from the processing water reclaiming means 32, and the cleaning water is sprayed from a cleaning water spray nozzle of the cleaning means 98 toward the cut workpieces. At this time, the waste cleaning water may be led to the dirty tank 26.

[0038] Next, a method for cutting a wafer W as a workpiece using the above-described processing device 2 will be described.

[0039] (holding process) In this embodiment, first, a holding step is performed in which the wafer W is transferred from the cassette 86 to the chuck table 4 and the wafer W is held on the chuck table 4.

[0040] In the holding step, first, the uncut wafer W is carried out from the cassette 86 to the temporary placement table 90 by the carry-in / out means 92. Next, the wafer W is carried from the temporary placement table 90 to the chuck table 4, which is positioned at the transfer position (the position shown in FIG. 1), by the first carrying means 94, and the wafer W is placed on the upper surface of the chuck table 4. Next, a suction force is generated in the suction chuck 12 of the chuck table 4, causing the wafer W to be suction-held on the chuck table 4. In addition, the annular frame F, which supports the wafer W via the dicing tape T, is fixed with a plurality of clamps 14.

[0041] (cutting process) After the holding step, a cutting step is carried out in which the wafer W is cut by the cutting blade 16 of the processing means 6.

[0042] In the cutting process, first, the planned dividing line L of the wafer W is aligned in the X-axis direction. At this time, the chuck table 4 is moved to a position directly below the imaging means 96 by the X-axis feed means, and the imaging means 96 captures an image of the wafer W. Then, based on the image of the wafer W captured by the imaging means 96, the chuck table 4 is rotated as appropriate, thereby aligning the planned dividing line L of the wafer W in the X-axis direction.

[0043] After the dividing lines L are aligned in the X-axis direction, cutting is performed along the dividing lines L of the wafer W. To do this, the chuck table 4 is moved below the processing means 6 by the X-axis feed means. The cutting blade 16 is rotated at high speed (for example, about 20,000 rpm) in the direction indicated by the arrow R in FIG. 2 . The cutting blade 16 is then lowered by the Z-axis feed means, and the cutting edge 16b of the cutting blade 16 is caused to cut into the wafer W from the top surface to a predetermined depth. At the same time, the chuck table 4 is moved in the X-axis direction by the X-axis feed means for cutting. In this manner, cutting is performed along the dividing lines L of the wafer W, forming cut grooves 102 in the wafer W. The cutting blade 16 is indexed and fed in the Y-axis direction by the Y-axis feed means, and the cutting process is repeated until all of the dividing lines L aligned in the X-axis direction are cut. Thereafter, the chuck table 4 is rotated by 90 degrees, and the cutting process and the indexing feed are repeated to cut all of the division lines L that are perpendicular to the division lines L that have been previously cut.

[0044] During cutting, machining water circulates through machining water circulation path 8, and temperature-controlled water circulates through temperature-controlled water circulation path 10. First, the circulation of the machining water will be described, and then the circulation of the temperature-controlled water will be described.

[0045] (Processing water circulation) During cutting, processing water is sprayed from the spray nozzle 36 onto the processing tool. More specifically, first, the clean water in the clean tank 30 is sent by the second pump 54 to the processing water regeneration means 32. In the processing water regeneration means 32, the clean water is purified into processing water and the temperature of the processing water is adjusted to a desired temperature. Whether the temperature of the processing water has reached the desired temperature can be confirmed from the value detected by the second temperature sensor 56. The processing water adjusted to the desired temperature is supplied from the processing water regeneration means 32 to the supply port 34 of the processing water supply means 24. The processing water supplied to the supply port 34 is then sprayed from the spray nozzle 36 toward the cutting blade 16 and wafer W of the processing means 6.

[0046] The processing water sprayed from the spray nozzle 36 is cooled in the machining chamber and sent to the dirty tank 26 via a waste liquid pan 38 and a waste liquid path 40. Specifically, the processing water sprayed from the spray nozzle 36 is dispersed and atomized in the machining chamber, and the atomized processing water is cooled by the heat of vaporization. The cooled processing water (waste liquid containing foreign matter) is then received by the waste liquid pan 38 and sent from the waste liquid pan 38 to the dirty tank 26 via the waste liquid path 40.

[0047] The waste liquid sent to the dirty tank 26 is filtered by the filtering means 28 to become clean water, which is then sent to the clean tank 30 by the first pump 42. Then, as described above, the clean water in the clean tank 30 is sent to the processing water regeneration means 32, where it is purified into processing water and adjusted to a desired temperature, and then sprayed from the spray nozzle 36 onto the processing tools.

[0048] (Temperature-controlled water circulation) During cutting, temperature-controlled water circulates through temperature-controlled water circulation path 10. In temperature-controlled water circulation path 10, temperature-controlled water discharged from third pump 66 is sent to temperature-controlled water adjustment means 58, where the temperature of the temperature-controlled water is adjusted to a predetermined temperature. The temperature-controlled water adjusted to the predetermined temperature is then sent to housing 20 of processing means 6 via temperature-controlled water feed path 60. As temperature-controlled water flows through flow path 20a of housing 20, housing 20 and rotating shaft 18 are cooled, and the temperatures of housing 20 and rotating shaft 18 are adjusted to a constant temperature. The temperature-controlled water that has flowed through flow path 20a of housing 20 is sent to third pump 66 via temperature-controlled water return path 62.

[0049] In this embodiment, in the temperature-controlled water return path 62, if the temperature of the temperature-controlled water up to the first branch point 76 (the temperature detected by the fourth temperature sensor 68) is lower than the temperature of the fresh water stored in the clean tank 30 (the temperature detected by the first temperature sensor 50), the introduction of fresh water from the clean tank 30 to the temperature-controlled water circulation path 10 is blocked. When blocking the introduction of fresh water to the temperature-controlled water circulation path 10, the first water control valve 80 is opened, and at least one of the second water control valve 82 and the third water control valve 84 is closed. This prevents fresh water with a higher temperature than the temperature-controlled water from entering the temperature-controlled water circulation path 10, thereby suppressing an increase in power consumption of the temperature-controlled water adjustment means 58.

[0050] When cutting off the introduction of fresh water into the temperature-controlled water circulation path 10, both the second and third water control valves 82, 84 may be closed, but opening either the second or third water control valves 82, 84 can prevent water hammer from occurring in the temperature-controlled water circulation path 10. When either the second or third water control valves 82, 84 is opened, fresh water that is warmer than the temperature-controlled water may be introduced from the clean tank 30 into the temperature-controlled water circulation path 10, but because the amount of fresh water introduced is small, there is no substantial increase in the power consumption of the temperature-controlled water adjustment means 58.

[0051] On the other hand, in the temperature-controlled water return path 62, if the temperature of the temperature-controlled water up to the first branch point 76 is higher than the temperature of the fresh water stored in the clean tank 30, it is preferable to adjust the opening and closing of the first, second, and third water control valves 80, 82, and 84 to supply temperature-controlled water from the temperature-controlled water circulation path 10 to the clean tank 30 via the clean tank path 72, and to introduce fresh water from the clean tank 30 into the temperature-controlled water circulation path 10 via the fresh water introduction path 74. This allows the temperature of the temperature-controlled water introduced to the temperature-controlled water adjustment means 58 to approach a predetermined temperature. Whether the temperature of the temperature-controlled water introduced to the temperature-controlled water adjustment means 58 has reached the predetermined temperature can be confirmed from the detection value of the fifth temperature sensor 70. Furthermore, by bringing the temperature of the temperature-controlled water introduced to the temperature-controlled water adjustment means 58 closer to the predetermined temperature, the power consumption of the temperature-controlled water adjustment means 58 can be reduced.

[0052] Furthermore, in the temperature-controlled water return path 62, when the temperature of the temperature-controlled water up to the first branch point 76 is higher than the temperature of the fresh water stored in the clean tank 30 and the temperature of the fresh water stored in the clean tank 30 is lower than the desired temperature of the processing water, it is desirable to adjust the opening and closing of the first, second, and third water control valves 80, 82, and 84 to supply the temperature-controlled water from the temperature-controlled water circulation path 10 to the clean tank 30 via the clean tank path 72, and to introduce fresh water from the clean tank 30 into the temperature-controlled water circulation path 10 via the fresh water introduction path 74. This makes it possible to bring the temperature of the fresh water sent to the processing water regeneration means 32 closer to the desired temperature, thereby reducing the power consumption of the processing water regeneration means 32, and to bring the temperature of the temperature-controlled water introduced to the temperature-controlled water adjustment means 58 closer to a predetermined temperature, thereby reducing the power consumption of the temperature-controlled water adjustment means 58.

[0053] As described above, in the processing apparatus 2 of this embodiment, during cutting, the processing water supplied to the cutting blade 16 of the processing means 6 is dispersed into mist, and the waste liquid cooled by the heat of vaporization is stored as clean water in the clean tank 30 via the dirty tank 26 and the filtration means 28. The clean water stored in the clean tank 30 is used by the processing water regeneration means 32 and the temperature-controlled water adjustment means 58 to reduce power consumption. In other words, a coexisting circulation path (processing water circulation path 8 and temperature-controlled water circulation path 10) is configured in which the processing water regeneration means 32 and the temperature-controlled water adjustment means 58 share the clean tank 30, which stores the clean water cooled by the heat of vaporization, thereby eliminating the problem of the conventional independent circulation paths making it impossible to reduce power consumption.

[0054] In this embodiment, the clean tank 30 is formed with a return path 48 that returns overflowing fresh water to the dirty tank 26, and the clean tank 30 is always filled with fresh water, allowing the processing water reclaiming means 32 and the water temperature adjustment means 58 to always have fresh water available. The clean tank 30 is always filled with fresh water, and the liquid level in the clean tank 30 does not drop, so the water pressure in the clean tank 30 is kept constant. As a result, the load on the second pump 54 that sends fresh water to the processing water reclaiming means 32 can be reduced. Furthermore, because the size of the clean tank 30 is set to a size that always overflows, the clean tank 30 can be made smaller.

[0055] In addition, in this embodiment, since the clean tank 30 also serves as the tank for the temperature-controlled water circulation path 10, the size of the processing device 2 can be made smaller than when a tank is provided for each of the processing water circulation path 8 and the temperature-controlled water circulation path 10. [Explanation of symbols]

[0056] 2: Processing equipment 4: Chuck table 6: Processing means 8: Processing water circulation route 10: Temperature-controlled water circulation route 16: Cutting blade (processing tool) 18: Rotation axis 20: Housing 24: Processing water supply means 26: Dirty Tank 28:Filtration means 30: Clean Tank 32: Processing water regeneration means 58: Temperature control water adjustment means 60: Temperature-controlled water supply route 62: Temperature controlled water return route 72: Clean tank route 74: Freshwater introduction route

Claims

1. A processing device, a chuck table for holding the workpiece; a processing means including a housing supporting a rotary shaft having a processing tool attached to an end thereof for processing the workpiece held on the chuck table; a processing water circulation path including a processing water supply means for supplying processing water to the processing tool, a dirty tank for storing waste liquid after processing, a filtration means for filtering the waste liquid stored in the dirty tank to produce clean water, a clean tank for storing clean water, and a processing water regeneration means for purifying the clean water stored in the clean tank into processing water and adjusting it to a desired temperature before supplying it to the processing water supply means; a temperature-controlled water circulation path for circulating temperature-controlled water through a housing supporting the rotary shaft of the processing means; The temperature-controlled water circulation path includes a temperature-controlled water adjustment means for adjusting the temperature of the temperature-controlled water to a predetermined temperature, a temperature-controlled water supply path communicating from the temperature-controlled water adjustment means to the housing, and a temperature-controlled water return path communicating from the housing to the temperature-controlled water adjustment means; The temperature-controlled water return path is connected to a clean tank path that communicates with the clean tank and discharges the temperature-controlled water, and a fresh water introduction path that introduces fresh water stored in the clean tank to the temperature-controlled water return path; The processing water supplied to the processing tools of the processing means is dispersed and atomized, and the waste liquid cooled by the heat of vaporization is stored in the clean tank as clean water via the dirty tank and the filtration means, and the clean water stored in the clean tank is utilized by the processing water regeneration means and the temperature-controlled water adjustment means to reduce power consumption in the processing device.

2. The temperature-controlled water return path is provided with a first branch portion branching into the clean tank path and a second branch portion branching into the fresh water introduction path, a first water control valve is disposed between the first branch portion and the second branch portion, a second water control valve is disposed in the clean tank path, and a third water control valve is disposed in the fresh water introduction path; In the temperature-controlled water return path, 2. The processing apparatus of claim 1, wherein when the temperature of the temperature-controlled water up to the first branch is lower than the temperature of the fresh water stored in the clean tank, the first water control valve is opened and at least one of the second water control valve and the third water control valve is closed to block the introduction of fresh water.

3. In the temperature-controlled water return path, 3. The processing apparatus according to claim 2, wherein when the temperature of the temperature-controlled water up to the first branch is higher than the temperature of the clean water stored in the clean tank, the opening and closing of the first water control valve, the second water control valve, and the third water control valve are adjusted to bring the temperature of the temperature-controlled water led to the temperature-controlled water adjustment means closer to a predetermined temperature, thereby reducing the power consumption of the temperature-controlled water adjustment means.

4. In the temperature-controlled water return path, A processing apparatus as described in claim 2, wherein when the temperature of the temperature-controlled water up to the first branch point is higher than the temperature of the fresh water stored in the clean tank and the temperature of the fresh water stored in the clean tank is lower than the desired temperature of the processing water, the opening and closing of the first water control valve, the second water control valve, and the third water control valve are adjusted to supply temperature-controlled water to the clean tank, thereby bringing the temperature of the fresh water sent to the processing water regeneration means closer to the desired temperature and reducing the power consumption of the processing water regeneration means, and the temperature of the temperature-controlled water led to the temperature-controlled water adjustment means closer to a predetermined temperature and reducing the power consumption of the temperature-controlled water adjustment means.

5. 2. The processing apparatus according to claim 1, wherein the clean tank is provided with a return path for returning overflowing fresh water to the dirty tank, the clean tank being always filled with fresh water, and the processing water regeneration means and the temperature control water adjustment means always being able to utilize fresh water.

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