Method for manufacturing sheet with wiring circuit board and sheet with wiring circuit board

Abstract

To provide a method for manufacturing a sheet with a wiring circuit board, and a sheet with the wiring circuit board.SOLUTION: A method for manufacturing a sheet 1 with a wiring circuit board includes: a first process for manufacturing an assembly sheet 10 having a plurality of wiring circuit boards 3; a second process for separating the wiring circuit boards 3 from a frame 11 of the assembly sheet 10; and a third process for placing the separated wiring circuit boards 3 onto a support sheet 2.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a sheet with a wired circuit board, and a sheet with a wired circuit board. [Background technology]

[0002] BACKGROUND ART Conventionally, an assembly sheet having a plurality of wiring circuit boards has been known (see, for example, Patent Document 1 below). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2024-46012 Summary of the Invention [Problem to be solved by the invention]

[0004] When an attempt is made to increase the number of wired circuit boards in one assembly sheet, as in the assembly sheet described in Patent Document 1 above, for example, the orientation, arrangement, and spacing of the wired circuit boards may differ from the orientation, arrangement, and spacing when the wired circuit boards are mounted in a module.

[0005] Therefore, when an attempt is made to increase the number of wired circuit boards in one assembly sheet, the mountability of the wired circuit boards to the module may be reduced.

[0006] The present invention provides a method for manufacturing a sheet with a wired circuit board, which can improve the mountability of a wired circuit board to a module, and a sheet with a wired circuit board. [Means for solving the problem]

[0007] The present invention [1] includes a method for manufacturing a sheet with wired circuit boards, the method including a first step of manufacturing an assembly sheet having a plurality of wired circuit boards and a frame supporting the plurality of wired circuit boards, a second step of separating the wired circuit boards from the frame, and a third step of arranging the separated wired circuit boards on a support sheet.

[0008] According to this method, after the assembly sheet is produced, the printed circuit board is separated from the frame and placed on the support sheet.

[0009] Therefore, when manufacturing the assembly sheet, the orientation, arrangement, and spacing of the wiring circuit boards can be designed to maximize the number of wiring circuit boards obtained, thereby improving the manufacturing efficiency of the wiring circuit boards, and the wiring circuit boards can be separated from the resulting assembly sheet and arranged in an orientation suitable for mounting on a module.

[0010] As a result, the mountability of the printed circuit board to the module can be improved.

[0011] The present invention [2] includes the method for producing a sheet with a wired circuit board according to the above [1], wherein the orientation of the wired circuit board in the sheet with a wired circuit board is different from the orientation of the wired circuit board in the assembly sheet.

[0012] According to this method, the printed circuit board can be arranged in an orientation suitable for mounting on the module.

[0013] As a result, the mountability of the printed circuit board to the module can be improved.

[0014] The present invention [3] includes the method for producing a sheet with wired circuit boards according to the above [1] or [2], in which the number of the wired circuit boards per unit area in the sheet with wired circuit boards is smaller than the number of the wired circuit boards per unit area in the assembly sheet.

[0015] The present invention [4] includes the method for producing a sheet with a wired circuit board according to any one of the above [1] to [3], further comprising an alignment mark forming step of forming an alignment mark on the support sheet.

[0016] The present invention [5] includes the method for manufacturing a sheet with a wired circuit board according to the above [4], wherein the third step is performed after the alignment mark forming step, and in the third step, the cut-off wired circuit board is placed on the support sheet using the alignment mark as a reference.

[0017] According to this method, the position of the printed circuit board relative to the support sheet can be determined using the alignment marks as a reference.

[0018] Furthermore, by aligning the module and the printed circuit board using the alignment marks as references, the mountability of the printed circuit board to the module can be improved.

[0019] The present invention [6] includes the method for producing a sheet with a wired circuit board according to any one of the above [1] to [5], wherein the wired circuit board has a metal layer, a circuit pattern, and an insulating layer disposed between the metal layer and the circuit pattern, and the metal layer is disposed on the opposite side of the support sheet with respect to the circuit pattern in the sheet with a wired circuit board.

[0020] According to this method, when mounting a wiring circuit board on a module, the metal layer of the wiring circuit board is brought into contact with the module, and the module can be assembled to the wiring circuit board on the support sheet without removing the wiring circuit board from the support sheet.

[0021] Therefore, the mountability of the printed circuit board to the module can be improved.

[0022] The present invention [7] includes the method for manufacturing a sheet with a wired circuit board according to the above [6], wherein the circuit pattern has terminals, the support sheet has openings, and in the sheet with a wired circuit board, the terminals are arranged within the openings and do not come into contact with the support sheet.

[0023] This method can prevent the terminals from coming into contact with the support sheet and becoming deformed.

[0024] The present invention [8] includes the method for producing a sheet with a wired circuit board according to any one of the above [1] to [7], wherein the support sheet is an ultraviolet-peelable pressure-sensitive adhesive sheet.

[0025] According to this method, after assembling the module and the wiring circuit board, the wiring circuit board can be peeled off from the support sheet by a simple process of irradiating the support sheet with ultraviolet light.

[0026] Therefore, the mountability of the printed circuit board to the module can be improved.

[0027] The present invention [9] includes the method for producing a sheet with a wired circuit board according to any one of the above [1] to [7], wherein the support sheet is a heat-peelable pressure-sensitive adhesive sheet.

[0028] According to this method, after the module and the wiring circuit board are combined, the wiring circuit board can be peeled off from the support sheet by the simple process of heating the support sheet.

[0029] Therefore, the mountability of the printed circuit board to the module can be improved.

[0030] The present invention

[10] includes the method for producing a sheet with a wired circuit board according to any one of the above [1] to [9], wherein the support sheet is colored.

[0031] According to this method, the alignment marks can be easily recognized by image recognition.

[0032] The present invention

[11] includes a sheet with a wired circuit board, which comprises a support sheet and a wired circuit board arranged on the support sheet in the thickness direction of the support sheet, and the support sheet has an alignment mark.

[0033] With this configuration, the module and the printed circuit board can be aligned using the alignment marks as references.

[0034] Therefore, the mountability of the printed circuit board to the module can be improved.

[0035] The present invention

[12] includes the sheet with wired circuit board of the above

[11] , wherein the wired circuit board has a metal layer, a circuit pattern, and an insulating layer disposed between the metal layer and the circuit pattern, and the metal layer is disposed on the opposite side of the support sheet from the circuit pattern.

[0036] The present invention

[13] includes the sheet with wired circuit board of the above

[12] , in which the circuit pattern has terminals, the support sheet has openings, and the terminals are arranged in the openings and do not contact the support sheet.

[0037] This configuration can prevent the terminals from coming into contact with the support sheet and becoming deformed.

[0038] The present invention

[14] comprises the sheet with wired circuit board according to any one of the above

[11] to

[13] , wherein the support sheet is an ultraviolet-peelable pressure-sensitive adhesive sheet.

[0039] According to this configuration, after the module and the wired circuit board are combined, the wired circuit board can be peeled off from the support sheet by the simple process of irradiating the support sheet with ultraviolet light.

[0040] Therefore, the mountability of the printed circuit board to the module can be improved.

[0041] The present invention

[15] comprises the sheet with wired circuit board according to any one of the above

[11] to

[13] , wherein the support sheet is a heat-peelable pressure-sensitive adhesive sheet.

[0042] According to this configuration, after the module and the wired circuit board are combined, the wired circuit board can be peeled off from the support sheet by the simple process of heating the support sheet.

[0043] Therefore, the mountability of the printed circuit board to the module can be improved.

[0044] The present invention

[16] includes the sheet with wired circuit board according to any one of the above

[11] to

[15] , wherein the support sheet is colored.

[0045] With this configuration, the alignment marks can be easily recognized by image recognition. [Effects of the Invention]

[0046] According to the method for manufacturing a sheet with a wired circuit board and the sheet with a wired circuit board of the present invention, it is possible to improve the mountability of the wired circuit board to a module. [Brief explanation of the drawings]

[0047] [Figure 1] FIG. 1 is a plan view of one embodiment of a sheet with a wired circuit board of the present invention. [Figure 2] 2 is a cross-sectional view taken along the line AA of the sheet with the wired circuit board shown in FIG. [Figure 3] FIG. 3 is an explanatory diagram for explaining the mounting of the printed circuit board on the module, showing the state in which the module is aligned with the printed circuit board. [Figure 4] 4 is a BB cross-sectional view of the sheet with wired circuit board and the module shown in FIG. [Figure 5] FIG. 5 is a plan view of the assembly sheet. [Figure 6]FIG. 6 is a cross-sectional view taken along CC of the assembly sheet shown in FIG. [Figure 7] Figures 7A to 7D are process diagrams showing the first step of the method for manufacturing the sheet with wired circuit board shown in Figure 1, where Figure 7A shows the first insulating layer forming step, Figure 7B shows the circuit pattern forming step, Figure 7C shows the second insulating layer forming step, and Figure 7D shows the solder layer forming step. [Figure 8] FIG. 8 shows an alignment mark forming step in the method for producing the sheet with wired circuit board shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0048] 1. Sheet with wiring circuit board As shown in FIG. 1 , the sheet with wired circuit board 1 extends in the machine direction and the width direction. The sheet with wired circuit board 1 has a sheet shape. The machine direction is perpendicular to the width direction. The sheet with wired circuit board 1 includes a support sheet 2 and at least one wired circuit board 3. In this embodiment, the sheet with wired circuit board 1 includes multiple wired circuit boards 3. The sheet with wired circuit board 1 may also include one wired circuit board 3.

[0049] (1) Support sheet The support sheet 2 supports a plurality of wired circuit boards 3. The support sheet 2 extends in the machine direction and the width direction. The support sheet 2 has a sheet shape. The support sheet 2 has a plurality of alignment marks 21A, 21B, 21C, and 21D and openings 22 (see FIG. 2).

[0050] Alignment marks 21A and 21B are arranged at one end of support sheet 2 in the width direction. Alignment marks 21A and 21B are aligned in the flow direction. Alignment marks 21C and 21D are arranged at the other end of support sheet 2 in the width direction. Alignment marks 21C and 21D are aligned in the flow direction. Two wired circuit boards 3 are arranged between alignment mark 21A and alignment mark 21B in the width direction. Two wired circuit boards 3 are also arranged between alignment mark 21C and alignment mark 21D in the width direction. Each of alignment marks 21A, 21B, 21C, and 21D is, for example, a circular through-hole.

[0051] The number, shape, and arrangement of the alignment marks 21A, 21B, 21C, and 21D are not limited as long as they can be used as a reference for positioning the wired circuit board 3 in the third step described below, and as a reference for aligning the wired circuit board 3 with the module M when mounting the wired circuit board 3 on the module M described below. At least one alignment mark 21 needs to be provided for one module M. From the viewpoint of ensuring the positional accuracy of the module M with respect to the wired circuit board 3, the support sheet 2 preferably has a plurality of alignment marks 21A, 21B, 21C, and 21D for one module M.

[0052] The openings 22 are formed in portions of the wiring circuit board 3 facing terminals 331 in order to prevent contact between terminals 331 of the wiring circuit board 3 (described later) and the support sheet 2 .

[0053] An example of the support sheet 2 is an adhesive sheet. Examples of the adhesive sheet include a low-adhesion adhesive sheet, an ultraviolet-peeling adhesive sheet, and a thermal-peeling adhesive sheet. An ultraviolet-peeling adhesive sheet is an adhesive sheet whose adhesive strength on the adhesive surface can be reduced by irradiating it with ultraviolet light. A thermal-peeling adhesive sheet is an adhesive sheet whose adhesive strength on the adhesive surface can be reduced by heating it. Preferably, the support sheet 2 is a thermal-peeling adhesive sheet or an ultraviolet-peeling adhesive sheet. The support sheet 2 is preferably colored. If the support sheet 2 is colored, the alignment marks 21A, 21B, 21C, and 21D can be easily recognized by image recognition.

[0054] Specifically, as shown in FIG. 2, the support sheet 2 has a substrate 2A and a pressure-sensitive adhesive layer 2B.

[0055] The substrate 2A is made of, for example, a resin. Examples of resins include polyethylene terephthalate, polyvinyl chloride, and polyolefin. Examples of polyolefins include polyethylene and polypropylene. The substrate 2A is preferably colored.

[0056] The pressure-sensitive adhesive layer 2B is disposed on one side of the substrate 2A in the thickness direction of the support sheet 2. The thickness direction is perpendicular to the width direction and the flow direction. A preferred material for the pressure-sensitive adhesive layer 2B is an acrylic pressure-sensitive adhesive having an acrylic polymer as the base polymer.

[0057] (2) Wired circuit board The multiple wired circuit boards 3 are arranged on the support sheet 2 in the thickness direction of the support sheet 2. As shown in FIG. 1, the multiple wired circuit boards 3 are arranged in an arrangement suitable for mounting on a module M (see FIG. 3), which will be described later, using alignment marks 21A, 21B, 21C, and 21D on the support sheet 2 as references. The arrangement of the multiple wired circuit boards 3 is not limited. The arrangement of the multiple wired circuit boards 3 can be changed as appropriate depending on the shape of the module on which the wired circuit boards 3 are mounted. In this embodiment, the multiple wired circuit boards 3 are arranged at intervals from each other in the width direction and also at intervals from each other in the flow direction. Each of the multiple wired circuit boards 3 has the same structure. Therefore, only one of the multiple wired circuit boards 3 will be described, and descriptions of the other wired circuit boards 3 will be omitted.

[0058] The wired circuit board 3 extends in the width direction and the flow direction. In this embodiment, the wired circuit board 3 has a substantially L-shape. However, the shape of the wired circuit board 3 is not limited.

[0059] 2, the wired circuit board 3 has a metal layer 31, a first insulating layer 32, a circuit pattern 33, and a second insulating layer 34. The wired circuit board 3 may have a solder layer 35. The wired circuit board 3 is placed on the support sheet 2 so that the second insulating layer 34 contacts the pressure-sensitive adhesive layer 2B of the support sheet 2 and the metal layer 31 faces one side in the thickness direction.

[0060] (2-1) Metal layer The metal layer 31 is disposed at one end of the wired circuit board 3 in the thickness direction. The metal layer 31 is disposed on the opposite side of the support sheet 2 with respect to the circuit pattern 33 in the thickness direction. Examples of materials for the metal layer 31 include stainless steel and copper alloys. The metal layer 31 has a first surface S1 and a second surface S2 in the thickness direction. The first surface S1 is a surface on one side of the metal layer 31 in the thickness direction. The first surface S1 is also an end surface of the wired circuit board 3 in the thickness direction. The second surface S2 is a surface on the other side of the metal layer 31 in the thickness direction. The second surface S2 is disposed between the first surface S1 and the first insulating layer 32 in the thickness direction.

[0061] (2-2) First insulating layer The first insulating layer 32 is disposed on the other side of the metal layer 31 in the thickness direction. The first insulating layer 32 is disposed on the second surface S2 of the metal layer 31 in the thickness direction. The first insulating layer 32 is disposed between the metal layer 31 and the circuit pattern 33 in the thickness direction. The first insulating layer 32 insulates the metal layer 31 from the circuit pattern 33. The first insulating layer 32 is made of a resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. Preferably, the first insulating layer 32 is made of polyimide.

[0062] (2-3) Circuit pattern The circuit pattern 33 is disposed on the other side of the first insulating layer 32 in the thickness direction. The circuit pattern 33 is disposed on the other surface of the first insulating layer 32 in the thickness direction. The circuit pattern 33 is disposed on the opposite side of the metal layer 31 with respect to the first insulating layer 32 in the thickness direction. The shape of the circuit pattern 33 is not limited. The circuit pattern 33 has terminals 331 and wiring 332.

[0063] The terminal 331 is disposed on the other side of the first insulating layer 32 in the thickness direction. The terminal 331 is disposed on the other surface of the first insulating layer 32 in the thickness direction. The terminal 331 is disposed within the opening 22 of the support sheet 2. The terminal 331 does not contact the support sheet 2. The shape of the terminal 331 is not limited. The terminal 331 has, for example, a square land shape. The terminal 331 is made of metal. Examples of materials for the terminal 331 include copper, silver, gold, iron, aluminum, chromium, and alloys thereof. From the viewpoint of obtaining good electrical properties, the material for the terminal 331 is preferably copper. The terminal 331 may be made of multiple conductor layers.

[0064] The wiring 332 is connected to the terminal 331. The wiring 332 may be made of the same material as the terminal 331.

[0065] (2-4) Second insulating layer The second insulating layer 34 is disposed on the other surface of the first insulating layer 32 in the thickness direction. The second insulating layer 34 covers the circuit pattern 33. More specifically, the second insulating layer 34 covers the wiring 332. The second insulating layer 34 does not cover the terminals 331. The second insulating layer 34 is made of a resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester.

[0066] (2-5) Solder layer The solder layer 35 is disposed on the terminal 331. When the printed circuit board 3 has the solder layer 35, the terminal 331 may have a protective layer (nickel-plated layer and gold-plated layer) covering the surface of the terminal 331. The solder layer 35 is disposed in the opening 22 of the support sheet 2. The solder layer 35 does not contact the support sheet 2.

[0067] 2. Mounting the wiring circuit board to the module Next, mounting of the printed circuit board 3 on the module M will be described.

[0068] When mounting the wired circuit board 3 of the wired circuit board-attached sheet 1 on the module M, the module M is aligned with respect to the wired circuit board 3 using alignment marks 21A, 21B, 21C, and 21D as references, as shown in FIG.

[0069] Next, as shown in FIG. 4, the module M is brought into contact with the metal layer 31 of the printed circuit board 3, and the printed circuit board 3 is assembled to the module M.

[0070] Next, the support sheet 2 is irradiated with ultraviolet light, and the wired circuit board 3 is peeled off from the support sheet 2.

[0071] With the above, mounting of the printed circuit board 3 on the module M is completed.

[0072] 3. Manufacturing method of sheet with wired circuit board Next, a method for producing the sheet with wired circuit board 1 will be described.

[0073] The method for producing the sheet with wired circuit board 1 includes a first step (see FIGS. 7A to 7D), a second step, an alignment mark forming step (see FIG. 8), and a third step (see FIG. 1).

[0074] (1) First step In the first step, the assembly sheet 10 is produced.

[0075] As shown in FIG. 5, the assembly sheet 10 has a plurality of wired circuit boards 3, a frame 11, and a plurality of joints J1 and J2.

[0076] In the assembly sheet 10, the orientation, arrangement, and spacing of the wired circuit boards 3 are adjusted so as to maximize the number of wired circuit boards 3 per unit area. In this embodiment, a plurality of rectangular cells formed by combining two wired circuit boards 3 are arranged side by side to maximize the number of wired circuit boards 3 per unit area.

[0077] The frame 11 is disposed on the outer periphery of the assembly sheet 10. The frame 11 surrounds the plurality of wired circuit boards 3. The frame 11 has, for example, a frame shape. In this embodiment, as shown in FIG. 6 , the frame 11 is made of the same material as the metal layer 31 of the wired circuit board 3.

[0078] As shown in FIG. 5, the joint J1 connects the frame 11 and the wired circuit board 3. The joint J2 connects two wired circuit boards 3 together. The multiple wired circuit boards 3 are connected to the frame 11 by the joint J1 while being connected to each other by the joint J2. In this way, the frame 11 supports the multiple wired circuit boards 3. The joints J1 and J2, like the frame 11, are made of the same material as the metal layer 31 of the wired circuit board 3.

[0079] The first step includes a first insulating layer forming step (see FIG. 7A), a circuit pattern forming step (see FIG. 7B), and a second insulating layer forming step (see FIG. 7C). The first step may also include a solder layer forming step (see FIG. 7D) as needed.

[0080] As shown in FIG. 7A, in the first insulating layer forming step, a first insulating layer 32 is formed on a metal layer 31.

[0081] Specifically, in the first insulating layer forming step, a photosensitive resin solution (varnish) is first applied to the surface of the metal layer 31 and dried to form a photosensitive resin coating. Next, the photosensitive resin coating is exposed to light and developed. This results in the first insulating layer 32.

[0082] Next, as shown in FIG. 7B, in the circuit pattern forming step, a circuit pattern 33 is formed on the first insulating layer 32.

[0083] Specifically, in the circuit pattern forming process, a seed layer is first formed on the surfaces of the first insulating layer 32 and the metal layer 31. The seed layer is formed by, for example, sputtering. Examples of materials for the seed layer include chromium, copper, nickel, titanium, and alloys thereof.

[0084] Next, a plating resist is applied on the seed layer, and the plating resist is exposed and developed. This removes the plating resist from the area where the circuit pattern 33 is to be formed, exposing the seed layer in the area where the circuit pattern 33 is to be formed. On the other hand, the plating resist remains in the area where the circuit pattern 33 is not to be formed.

[0085] Next, a circuit pattern 33 is formed on the exposed seed layer by electrolytic plating. After the electrolytic plating is completed, the plating resist is stripped off, and the seed layer exposed by the stripping of the plating resist is removed by etching.

[0086] Next, as shown in FIG. 7C, in the second insulating layer forming step, a second insulating layer 34 is formed on the first insulating layer 32.

[0087] In detail, in the second insulating layer forming process, a photosensitive resin solution (varnish) is first applied onto the circuit pattern 33, the first insulating layer 32, and the metal layer 31 and then dried to form a photosensitive resin coating.

[0088] Next, the photosensitive resin coating is exposed to light and developed, thereby forming the second insulating layer 34 on the first insulating layer 32.

[0089] 7D, in the solder layer formation step, solder layer 35 is formed on terminal 331. Methods for forming solder layer 35 include, for example, electrolytic plating, electroless plating, or printing using a solder paste.

[0090] Before the solder layer forming step, a protective layer (nickel plating layer and gold plating layer) may be formed to cover the terminals 331. The protective layer is formed, for example, by sequentially carrying out electroless nickel plating and electroless gold plating.

[0091] Next, the metal layer 31 is etched to form its contour, and the assembly sheet 10 is obtained in this manner.

[0092] (2)Second process Next, in a second step, the plurality of wired circuit boards 3 are each cut off from the frame 11 (see FIG. 5) of the assembly sheet 10. More specifically, the assembly sheet 10 is cut at the plurality of joints J1, J2 (see FIG. 5). In this way, the plurality of wired circuit boards 3 are obtained.

[0093] (3) Alignment mark formation process 8, in the alignment mark forming step, alignment marks 21A, 21B, 21C, and 21D are formed on the support sheet 2. The alignment mark forming step may be performed in parallel with the first and second steps. The method for forming the alignment marks 21A, 21B, 21C, and 21D is not limited. Examples of methods for forming the alignment marks 21A, 21B, 21C, and 21D include laser processing and punching using a mold.

[0094] (4) Third step Next, as shown in Fig. 1, in the third step, a sheet with a wired circuit board 1 is produced. As described above, the sheet with a wired circuit board 1 has a support sheet 2 and at least one wired circuit board 3. The third step is performed after the second step and after the alignment mark forming step.

[0095] In the third step, the wired circuit board 3 separated in the second step is placed on the support sheet 2 using the alignment marks 21A, 21B, 21C, and 21D as references.

[0096] As described above, alignment marks 21A, 21B, 21C, and 21D are used to align the module M with respect to the wired circuit board 3. Therefore, if the third step is performed after the alignment mark forming step and the wired circuit board 3 is arranged on the support sheet 2 using alignment marks 21A, 21B, 21C, and 21D as references, the arrangement of the wired circuit board 3 on the support sheet 2 and the alignment of the module M with respect to the wired circuit board 3 can be performed using the common alignment marks 21A, 21B, 21C, and 21D. Therefore, the positional accuracy of the module M with respect to the wired circuit board 3 can be improved.

[0097] Furthermore, as described above, the multiple wired circuit boards 3 are arranged in an arrangement suitable for mounting on the module M (see FIG. 3). Therefore, as shown in FIGS. 5 and 1, the wired circuit boards 3 separated from the assembly sheet 10 are changed from their "orientation on the assembly sheet 10" to "orientation suitable for mounting on the module M" and placed in "positions suitable for mounting on the module M" on the support sheet 2. Therefore, when the "orientation on the assembly sheet 10" and the "orientation suitable for mounting on the module M" differ, the orientation of the wired circuit boards 3 on the sheet 1 with wired circuit boards (see FIG. 1) differs from the orientation of the wired circuit boards 3 on the assembly sheet 10 (see FIG. 5).

[0098] The "orientation suitable for mounting on module M" and the "position suitable for mounting on module M" are determined based on the alignment marks 21A, 21B, 21C, and 21D, which are common to "2. Mounting of the wiring circuit board on the module" described above.

[0099] The number of wiring circuit boards 3 per unit area in the obtained sheet 1 with wiring circuit boards is smaller than the number of wiring circuit boards 3 per unit area in the assembly sheet 10. In other words, in the sheet 1 with wiring circuit boards, multiple wiring circuit boards 3 are lined up on the support sheet 2 at "intervals suitable for mounting on the module M."

[0100] In this way, the sheet with wired circuit board 1 is obtained.

[0101] After the third step, the support sheet 2 of the obtained sheet 1 with wiring circuit board may be irradiated with ultraviolet light from one side in the thickness direction using the wiring circuit board 3 as a mask, thereby reducing the adhesive strength of the pressure-sensitive adhesive layer 2B (see Figure 2) that is not in contact with the wiring circuit board 3.

[0102] 4. Effects (1) According to the method for manufacturing the sheet with wired circuit board 1, after manufacturing the assembly sheet 10 as shown in FIG. 5, the wired circuit board 3 is separated from the frame 11 and placed on the support sheet 2 as shown in FIG.

[0103] Therefore, when manufacturing the assembly sheet 10, the orientation, arrangement, and spacing of the wiring circuit boards 3 can be designed to maximize the number of wiring circuit boards 3 obtained, thereby improving the manufacturing efficiency of the wiring circuit boards 3, and the wiring circuit boards 3 can be separated from the obtained assembly sheet 10 and arranged in an orientation suitable for mounting on the module M.

[0104] As a result, the mountability of the printed circuit board 3 to the module M can be improved.

[0105] (2) According to the method for manufacturing the sheet with wired circuit board 1, the orientation of the wired circuit board 3 in the sheet with wired circuit board 1 differs from the orientation of the wired circuit board 3 in the assembly sheet 10, as shown in FIGS.

[0106] Therefore, the wired circuit board 3 can be arranged in a direction suitable for mounting on the module M.

[0107] As a result, the mountability of the printed circuit board 3 to the module M can be improved.

[0108] (3) According to the manufacturing method of the sheet with wired circuit board 1, in the third step, as shown in Figures 8 and 1, the separated wired circuit board 3 is placed on the support sheet 2 using the alignment marks 21A, 21B, 21C, and 21D as references.

[0109] Therefore, the position of the wired circuit board 3 with respect to the support sheet 2 can be determined using the alignment marks 21A, 21B, 21C, and 21D as references.

[0110] Furthermore, since the module M and the wired circuit board 3 are aligned using the alignment marks 21A, 21B, 21C, and 21D as references, the mountability of the wired circuit board 3 relative to the module M can be improved.

[0111] (4) According to the sheet with wired circuit board 1, as shown in FIG. 1, the support sheet 2 is provided with alignment marks 21A, 21B, 21C, and 21D.

[0112] Therefore, as shown in FIG. 3, the module M and the printed circuit board 3 can be aligned using the alignment marks 21A, 21B, 21C, and 21D as references.

[0113] As a result, the mountability of the printed circuit board 3 to the module M can be improved.

[0114] (5) According to the sheet with wired circuit board 1, as shown in FIG. 2, the metal layer 31 is disposed on the opposite side of the support sheet 2 with respect to the circuit pattern 33.

[0115] Therefore, as shown in Figure 4, when mounting the wiring circuit board 3 on the module M, when the metal layer 31 of the wiring circuit board 3 is brought into contact with the module M, the module M can be assembled to the wiring circuit board 3 on the support sheet 2 without removing the wiring circuit board 3 from the support sheet 2.

[0116] As a result, the mountability of the printed circuit board 3 to the module M can be improved.

[0117] (6) According to the sheet 1 with wired circuit board, as shown in FIG. 2, the terminals 331 are disposed within the openings 22 of the support sheet 2 and do not come into contact with the support sheet 2.

[0118] Therefore, the terminals 331 can be prevented from coming into contact with the support sheet 2 and being deformed.

[0119] (7) According to the sheet with wired circuit board 1, the support sheet 2 is a heat-peelable adhesive sheet or an ultraviolet-peelable adhesive sheet.

[0120] According to this configuration, after the module M and the wiring circuit board 3 are combined, the wiring circuit board 3 can be peeled off from the support sheet 2 by a simple process of heating the support sheet 2 or irradiating the support sheet 2 with ultraviolet light.

[0121] Therefore, the mountability of the wired circuit board 3 to the module M can be improved.

[0122] (8) According to the sheet with wired circuit board 1, the support sheet 2 is colored.

[0123] Therefore, the alignment marks 21A, 21B, 21C, and 21D can be easily recognized by image recognition.

[0124] 5. Variations In the modified example, the same components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0125] In the above embodiment, the third step is performed after the alignment mark forming step, but the third step may be performed before the alignment mark forming step.

[0126] In this case, after the wiring circuit board 3 is placed on the support sheet 2, the alignment marks 21A, 21B, 21C, and 21D are formed using the wiring circuit board 3 as a reference.

[0127] Then, the module M is aligned with respect to the printed circuit board 3 using the alignment marks 21A, 21B, 21C, and 21D as references.

[0128] In this modification, similarly to the above-described embodiment, the mountability of the wired circuit board 3 to the module M can be improved. [Explanation of symbols]

[0129] 1 Sheet with wiring circuit board 2 Support Sheet 3 Wiring circuit board 10 Assembly Sheet 11 frames 21A Alignment Mark 22 Aperture 31 Metal layer 32 First insulating layer 33 Circuit Pattern 331 terminal

Claims

1. a first step of producing an assembly sheet having a plurality of wired circuit boards and a frame supporting the plurality of wired circuit boards; a second step of separating the printed circuit board from the frame; a third step of placing the cut-out wired circuit board on a support sheet; A method for producing a sheet with a wired circuit board, comprising:

2. The method for manufacturing a sheet with a wired circuit board according to claim 1 , wherein an orientation of the wired circuit board in the sheet with a wired circuit board is different from an orientation of the wired circuit board in the assembly sheet.

3. 2. The method for producing a sheet with wired circuit boards according to claim 1, wherein the number of the wired circuit boards per unit area in the sheet with wired circuit boards is smaller than the number of the wired circuit boards per unit area in the assembly sheet.

4. The method for producing a sheet with a wired circuit board according to claim 1 , further comprising an alignment mark forming step of forming an alignment mark on the support sheet.

5. the third step is performed after the alignment mark forming step, 5. The method for producing a sheet with a wired circuit board according to claim 4, wherein in the third step, the cut-off wired circuit board is placed on the support sheet using the alignment mark as a reference.

6. the printed circuit board has a metal layer, a circuit pattern, and an insulating layer disposed between the metal layer and the circuit pattern; 2. The method for producing a sheet with a wired circuit board according to claim 1, wherein in the sheet with a wired circuit board, the metal layer is disposed on the opposite side of the support sheet with respect to the circuit pattern.

7. the circuit pattern has a terminal; the support sheet has an opening; 7. The method for manufacturing a sheet with a wired circuit board according to claim 6, wherein in the sheet with a wired circuit board, the terminals are arranged in the openings and do not contact the support sheet.

8. The method for producing a sheet with a wired circuit board according to claim 1 , wherein the support sheet is an ultraviolet-peelable adhesive sheet.

9. The method for producing a sheet with a wired circuit board according to claim 1 , wherein the support sheet is a heat-peelable adhesive sheet.

10. The method for producing a sheet with a wired circuit board according to claim 1 , wherein the support sheet is colored.

11. A support sheet; a printed circuit board disposed on the support sheet in the thickness direction of the support sheet; Equipped with The support sheet has an alignment mark, and is a sheet with a wiring circuit board.

12. the printed circuit board has a metal layer, a circuit pattern, and an insulating layer disposed between the metal layer and the circuit pattern; The sheet with wired circuit board according to claim 11 , wherein the metal layer is disposed on the opposite side of the support sheet with respect to the circuit pattern.

13. the circuit pattern has a terminal; the support sheet has an opening; The sheet with wired circuit board according to claim 12 , wherein the terminals are disposed in the openings and do not contact the support sheet.

14. The sheet with wired circuit board according to claim 11 , wherein the support sheet is an ultraviolet-peelable adhesive sheet.

15. The sheet with wired circuit board according to claim 11, wherein the support sheet is a heat-peelable pressure-sensitive adhesive sheet.

16. The sheet with wired circuit board according to claim 11 , wherein the support sheet is colored.

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