Circuit board and manufacturing method of circuit board

Abstract

To provide a high-performance and high-quality circuit board using a glass-based substrate and a manufacturing method of the circuit board.SOLUTION: A circuit board is configured by laminating at least two or more substrates of: a glass core substrate having an insulating base material made of glass; an antenna-inductor substrate having a metal layer formed in a coil shape on at least one of a first surface and a second surface of the glass base material; a ground substrate having a ground metal layer formed as a ground on at least one of the first surface and the second surface of the glass base material; a heat spreader substrate having the glass base material and a heat spreader; an optical waveguide substrate formed inside the glass substrate or on the first surface or the second surface; a capacitor substrate having a capacitor provided inside the glass substrate or on the first surface or the second surface; and an interposer substrate.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] The present invention relates to a glass-based circuit board and a method for manufacturing the circuit board. [Background technology]

[0002] Glass has extremely advantageous properties compared to other insulating materials that make up circuit boards, such as a low relative permittivity, dielectric loss tangent, coefficient of thermal expansion, and water absorption, as well as a small surface roughness and a high Young's modulus. For this reason, attempts have been made to use glass as the substrate for circuit boards.

[0003] For example, Patent Document 1 (JP 2018-116951 A) discloses a circuit board having a laminated glass substrate and a resin substrate. In Patent Document 1, the glass substrate has a through hole, a metal layer provided on the inner wall of the through hole, and a conductive resin provided inside the metal layer. The resin substrate has a through hole whose opening end facing the through hole of the glass substrate is located inside the metal layer, and a conductive resin provided inside the through hole and connected to the conductive resin of the glass substrate. The circuit board of Patent Document 1 is said to be configured in this way to reduce stress generated at the via connection between the glass substrate and the resin substrate, thereby preventing cracks in the glass substrate caused by the stress and the resulting deterioration in the performance and reliability of the circuit board. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2018-116951 Summary of the Invention [Problem to be solved by the invention]

[0005] In the above-mentioned Patent Document 1, a circuit board is constructed by laminating a glass substrate and a resin substrate, but there is a demand for providing circuit boards with higher functionality and quality by taking advantage of the properties of glass.

[0006] Therefore, the present invention has been made to solve the above problems, and an object of the present invention is to provide a highly functional and high-quality circuit board using a substrate with a glass base material, and a method for manufacturing the circuit board. [Means for solving the problem]

[0007] According to the circuit board of the present invention, there are provided a glass core substrate having a glass substrate whose insulating substrate is made of glass, metal layers patterned on each of a first surface and a second surface of the glass substrate, and vias electrically connecting the opposing metal pads to each other; an antenna / inductor substrate having a glass substrate whose insulating substrate is made of glass, metal layers patterned on each of a first surface and a second surface of the glass substrate, vias electrically connecting the opposing metal pads to each other, and a metal layer formed in a coil shape on at least one of the first surface or the second surface; a ground substrate having a glass substrate whose insulating substrate is made of glass, metal layers patterned on each of a first surface and a second surface of the glass substrate, vias electrically connecting the opposing metal pads to each other, and a ground metal layer formed as a ground on at least one of the first surface or the second surface; the heat spreader substrate having a glass substrate configured as an insulating substrate, metal layers patterned on each of the first and second surfaces of the glass substrate, vias that electrically connect the opposing metal pads, and a heat spreader; the optical waveguide substrate having a glass substrate whose insulating substrate is made of glass and an optical waveguide formed inside the glass substrate; the capacitor substrate having a glass substrate whose insulating substrate is made of glass, metal layers patterned on each of the first and second surfaces of the glass substrate, vias that electrically connect the opposing metal pads, and a capacitor provided inside the glass substrate or on the first or second surface; and the interposer substrate having an interposer for mounting a semiconductor chip laminated on at least one of the first and second surfaces of the glass core substrate. According to this configuration, a plurality of glass substrates made of glass base materials and having various functions can be combined to provide a highly functional and high-quality circuit board.

[0008] The capacitor of the capacitor substrate may be provided in an insulating base material made of resin and laminated on the first surface or the second surface.

[0009] The interposer of the interposer substrate may be characterized in that it is configured by laminating glass base materials.

[0010] The interposer of the interposer substrate may be characterized in that it is configured by laminating resin base materials.

[0011] According to the method for manufacturing a circuit board of the present invention, there are provided a glass core substrate having a glass substrate whose insulating substrate is made of glass, metal layers patterned on each of a first surface and a second surface of the glass substrate, and vias electrically connecting the opposing metal layers to each other; an antenna / inductor substrate having a glass substrate whose insulating substrate is made of glass, metal layers patterned on each of a first surface and a second surface of the glass substrate, vias electrically connecting the opposing metal layers to each other, and a metal layer formed in a coil shape on at least one of the first surface or the second surface; a ground substrate having a glass substrate whose insulating substrate is made of glass, metal layers patterned on each of a first surface and a second surface of the glass substrate, vias electrically connecting the opposing metal layers to each other, and a ground metal layer formed as a ground on at least one of the first surface or the second surface; and a heat spreader having a glass substrate whose insulating substrate is made of glass, metal layers patterned on each of a first surface and a second surface of the glass substrate, vias electrically connecting the opposing metal layers to each other, and a heat spreader. a capacitor substrate having a glass substrate whose insulating substrate is made of glass, metal layers patterned on each of the first and second surfaces of the glass substrate, vias electrically connecting the opposing metal layers, and a capacitor provided inside the glass substrate or on the first or second surface; and an interposer substrate on which a semiconductor chip can be mounted on one of the first and second surfaces of the glass core substrate, or on which an interposer for mounting a semiconductor chip is laminated on at least one of the first and second surfaces of the glass core substrate, and determining a lamination order of the selected substrates; an adhesive layer lamination process including a step of laminating a semi-cured resin substrate on the lowest substrate in the determined lamination order, a step of forming a through hole in the laminated resin substrate, a step of filling the through hole with a conductive paste, and a step of laminating a next substrate; and after laminating all of the selected substrates,and a step of pressing the entire assembly together to harden the resin base material and the conductive paste. According to this method, a high-performance, high-quality circuit board can be easily manufactured by combining a plurality of glass substrates made of glass base materials and having various functions. [Effects of the Invention]

[0012] According to the present invention, a high-performance, high-quality circuit board can be provided by combining a plurality of glass substrates made of glass base materials and having various functions. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a schematic cross-sectional view showing an example of a glass core substrate. [Figure 2] FIG. 1 is a schematic cross-sectional view showing an example of an antenna / inductor substrate. [Figure 3] FIG. 2 is a schematic cross-sectional view showing an example of a ground substrate. [Figure 4] FIG. 2 is a schematic cross-sectional view showing an example of a heat spreader substrate. [Figure 5] FIG. 1 is a schematic cross-sectional view showing an example of an optical waveguide substrate. [Figure 6] FIG. 2 is a schematic cross-sectional view showing an example of a capacitor substrate. [Figure 7] FIG. 2 is a schematic cross-sectional view showing an example of an interposer substrate. [Figure 8] FIG. 10 is a schematic cross-sectional view showing another example of an interposer substrate. [Figure 9] FIG. 1 is a schematic cross-sectional view showing an example of a circuit board formed by combining and stacking a plurality of substrates. [Figure 10] FIG. 10 is a schematic cross-sectional view showing another example of a circuit board formed by combining and stacking a plurality of substrates. [Figure 11] 10 is a flowchart showing a method for manufacturing a circuit board in which a plurality of boards are combined and stacked. DETAILED DESCRIPTION OF THE INVENTION

[0014] The circuit board of the present invention is obtained by combining multiple types of substrates made of glass substrates. The glass may be quartz glass, synthetic quartz glass, borosilicate glass, alkali-free glass, or the like. However, for substrates on which silicon components such as semiconductor devices are mounted, it is preferable to use alkali-free glass, which has a thermal expansion coefficient close to that of silicon. Each substrate will be described below.

[0015] (glass core substrate) FIG. 1 shows a schematic cross-sectional view of a glass core substrate. The glass core substrate 10 in this embodiment has a glass substrate 11 as an insulating substrate, patterned metal layers 12 made of a metal such as copper formed on each of a first surface 11a (top surface in Figure 1) and a second surface 11b (bottom surface in Figure 1) of the glass substrate 11, and vias 14 that electrically connect opposing metal layers 12 to each other.

[0016] The vias 14 are formed by filling copper by copper filling plating into through holes formed in the glass substrate 11. The metal layer 12 is formed into a predetermined shape by etching after the through holes and the first and second surfaces 11a and 11b are simultaneously plated by copper filling plating.

[0017] The shape of the via 14 may be any shape, such as a straight type, an hourglass type, or a tapered type, depending on the shape of the through hole formed in the glass substrate 11. In this embodiment, the case of a straight type is illustrated and described.

[0018] (Antenna / inductor board) Figure 2 shows a schematic cross-sectional view of the antenna / inductor substrate. The glass substrate 11, metal layer 12, and vias 14 of the antenna / inductor substrate 20 of this embodiment have the same configuration as the glass core substrate 10 of FIG. 1, and therefore detailed description thereof will be omitted. In the antenna / inductor substrate 20 of this embodiment, a metal layer 22 formed in a coil shape is formed on the first surface 11a of the glass base material 11 of FIG.

[0019] The coil-shaped metal layer 22 is formed into a shape that functions as an antenna, an inductor, etc. The coil-shaped metal layer 22 can also be formed into a metal layer 22 of a predetermined shape by etching after the through-holes and the first and second surfaces 11a and 11b are simultaneously plated by filling copper plating.

[0020] The coil-shaped metal layer 22 may be formed not only on the first surface 11a of the glass substrate 11, but also on both the first surface 11a and the second surface 11b of the glass substrate 11, or may be formed only on the second surface 11b of the glass substrate 11.

[0021] (Ground board) Figure 3 shows a schematic cross-sectional view of the ground substrate. The glass base material 11, metal layer 12, and vias 14 of the ground substrate 30 of this embodiment have the same configuration as those of the glass core substrate 10 of FIG. 1, and therefore detailed description thereof will be omitted. In the ground substrate 30 of this embodiment, a ground metal layer 32 formed as a ground is formed on the first surface 11a of the glass base material 11 of FIG.

[0022] The ground metal layer 32 is formed as a wide-area metal layer (so-called solid ground) as a noise countermeasure. In particular, surrounding the outer periphery of the glass substrate 11 with a solid ground and arranging signal lines inside it provides an even more effective noise countermeasure. The ground metal layer 32 can also be formed into a predetermined shape by simultaneously plating the through holes and the first and second surfaces 11a, 11b by copper filling plating, and then etching the metal layer 32.

[0023] The ground metal layer 32 may be formed not only on the first surface 11a of the glass substrate 11, but also on both the first surface 11a and the second surface 11b of the glass substrate 11, or may be formed only on the second surface 11b of the glass substrate 11.

[0024] (heat spreader board) Figure 4 shows a schematic cross-sectional view of the heat spreader substrate. The glass base material 11, metal layer 12, and vias 14 of the heat spreader substrate 40 of this embodiment have the same configuration as the glass core substrate 10 of FIG. 1, and therefore detailed description thereof will be omitted. The heat spreader substrate 40 of this embodiment has a copper inlay 44, which is a mass of copper with high thermal conductivity, provided inside the glass base material 11 of Fig. 1. The metal layers 42 connected to the first surface 11a and the second surface 11b of the copper inlay 44 are formed to have a larger area than the other metal layers 12, so that they can also function as thermal pads.

[0025] The heat spreader substrate 40 is formed by forming through holes at predetermined locations in the glass base material 11 and press-fitting copper blocks into the through holes. By placing components that generate a large amount of heat on the upper surface of the copper inlay 44, the heat generated by the components can be conducted to the copper inlay 44, thereby dissipating the heat from the components.

[0026] The heat spreader substrate 40 may have thermal vias (not shown) formed therein in addition to the copper inlay 44.

[0027] (Optical waveguide board) FIG. 5 shows a schematic cross-sectional view of the optical waveguide substrate. In the optical waveguide substrate 50 of this embodiment, an optical waveguide 54 is disposed on the first surface 11a of the glass substrate 11. Furthermore, an optoelectronic component 52 such as an optoelectric conversion circuit is provided on the glass substrate 11. The optoelectronic component 52 is disposed so that a lower portion thereof is embedded in an embedding hole formed in the glass substrate 11 and an upper portion thereof protrudes from the first surface 11a of the glass substrate 11. The optical waveguide 54 is connected to the side surface of the optoelectronic component 52 protruding from the first surface 11a.

[0028] The optical waveguide 54 is composed of a core and a cladding disposed around the core, and light travels through the core after being totally reflected at the boundary between the core and the cladding. For example, the core can be made of silicon, which has a high refractive index, and the cladding can be made of polymer, which has a low refractive index.

[0029] In addition to the optical waveguide 54 and the optoelectronic component 52, the optical waveguide substrate 50 also has the vias 14 and metal layers 12 that penetrate the glass substrate 11 as described above. Furthermore, a mounting pad (not shown) may be formed on the upper surface of the optoelectronic component 52 so that a semiconductor element (not shown) can be mounted thereon.

[0030] The optical waveguide substrate 50 is not limited to the configuration shown in Fig. 5, and the optical waveguide 54 may be disposed within the glass substrate 11. In this case, the optoelectronic component 52 may also be embedded within the glass substrate 11. When the optical waveguide 54 is disposed within the glass substrate 11, it is preferable that the glass substrate 11 is formed in two layers above and below the optical waveguide 54, rather than in a single layer as shown in Fig. 5. The optical waveguide 54 may also be disposed on the second surface 11b of the glass substrate 11.

[0031] (capacitor substrate) FIG. 6 shows a schematic cross-sectional view of the capacitor substrate. The glass base material 11, metal layer 12, and vias 14 of the capacitor substrate 60 of this embodiment have the same configuration as those of the glass core substrate 10 of FIG. 1, and therefore detailed description thereof will be omitted. In the capacitor substrate 60 of this embodiment, an insulating resin base material 61 is laminated on the first surface 11a of the glass base material 11, and a capacitor 62 is disposed within the resin base material 61.

[0032] Resin substrate 61 preferably contains a thermosetting resin or a thermoplastic resin, and may be, for example, a prepreg (a nonwoven or woven substrate made of glass fiber or the like impregnated with an epoxy resin or the like.) Resin substrate 61 may also be made of, for example, a bismaleimide triazine resin, which is a thermosetting resin, or a modified polyphenylene ether resin, which is a thermoplastic resin.

[0033] A patterned metal layer 63 is formed on the surface of the resin substrate 61 opposite to the glass substrate 11 (the upper surface in FIG. 6 ). Vias 64 are provided that penetrate the resin substrate 61 and electrically connect the metal layer 63 to the metal layer 12 formed on the first surface 11a of the glass substrate 11. The vias 64 may be paste vias filled with a conductive paste, or hybrid vias in which a conductive paste is filled in a metal-plated through-hole.

[0034] Furthermore, a metal layer 65 serving as an electrode of the capacitor 62 is formed on the surface of the resin substrate 61 opposite to the glass substrate 11 (the upper surface in FIG. 6 ). A via 66 is provided that penetrates the resin substrate 61 and electrically connects the capacitor 62 to the metal layer 65. The via 66 may be a paste via filled with a conductive paste, or a hybrid via in which a conductive paste is filled in a metal-plated through-hole.

[0035] The capacitors 62 of the capacitor substrate 60 are not limited to being provided in the resin base material 61 , but may be provided in the glass base material 11 .

[0036] (Interposer board) Figure 7 shows a schematic cross-sectional view of the interposer substrate. The glass base material 11, metal layer 12, and vias 14 of the interposer substrate 70 of this embodiment have the same configuration as the glass core substrate 10 of FIG. 1, and therefore detailed description thereof will be omitted. The interposer substrate 70 of this embodiment is configured by stacking an interposer 72 on the first surface 11a side of the glass base material 11. The interposer 72 shown here is configured by stacking multiple glass base materials 73, and is configured so that a semiconductor chip (not shown) can be mounted on the first surface 72a side (the upper surface side in FIG. 7), and is stacked on the glass base material 11 on the second surface 72b side (the lower surface side in FIG. 7).

[0037] Patterned metal layers 76 and vias 74 connecting the metal layers 76 of the glass substrates 73 are formed on the multiple glass substrates 73 that make up the interposer 72. The multiple metal layers 76 and multiple vias 74 are arranged in the interposer 72 so that the spacing between terminals of the semiconductor chip mounted on the upper surface (spacing between the metal layers 76 on the first surface 72a side) is wider on the lower surface side (spacing between the metal layers 76 on the second surface 72b side).

[0038] 7 has a resin substrate 77 interposed between the interposer 72 and the glass substrate 11 as an adhesive layer. The resin substrate 77 preferably contains a thermosetting resin or a thermoplastic resin, and for example, a prepreg (a nonwoven or woven substrate such as glass fiber impregnated with an epoxy resin) can be used. The resin substrate 77 may also be, for example, a bismaleimide triazine resin, which is a thermosetting resin, or a modified polyphenylene ether resin, which is a thermoplastic resin. The interposer 72 and the glass base material 11 can be joined by pressing them together using such a resin base material 77 .

[0039] The resin substrate 77 is provided with vias 75 that penetrate the resin substrate 77, electrically connecting the metal layer 12 on the first surface 11a of the glass substrate 11 to the metal layer 76 on the second surface 72b of the interposer 72. The vias 75 may be paste vias filled with a conductive paste, or hybrid vias in which a conductive paste is filled in a metal-plated through-hole.

[0040] Furthermore, in the interposer substrate 70 of FIG. 7, the interposer 72 itself is constructed by laminating glass substrates 73, but the interposer 72 may also be constructed by laminating resin substrates (not shown).

[0041] Furthermore, the interposer substrate 70 is not limited to a substrate in which the interposer 72 and the glass base material 11 are laminated, and only the interposer 72 configured by laminating the glass base material 73 may be handled as the interposer substrate 70.

[0042] (Another embodiment of the interposer substrate) FIG. 8 shows another example of an interposer substrate. The interposer substrate 90 in FIG. 8 is an interposer substrate on which a FO-WLP (not shown) in which a semiconductor chip is fan-out packaged is mounted. The glass base material 11, metal layer 12, and vias 14 of this interposer substrate 90 have the same configuration as the glass core substrate 10 of FIG. 1, and therefore detailed description thereof will be omitted.

[0043] The interposer substrate 90 has an insulating resin base material 81 laminated on a first surface 11a of a glass base material 11, and a patterned metal layer 82 formed on the first surface 81a (upper surface) of the resin base material 81. The metal layer 82 is the portion to which the solder balls of the FO-WLP disposed on its upper surface are connected.

[0044] The interposer substrate 90 is provided with vias 84 that penetrate the resin base material 81 and electrically connect the metal layer 12 formed on the first surface 11a of the glass base material 11 to the metal layer 82. The vias 84 may be paste vias filled with a conductive paste, or hybrid vias in which a conductive paste is filled in a metal-plated through-hole.

[0045] Resin substrate 81 preferably contains a thermosetting resin or a thermoplastic resin, and may be, for example, a prepreg (a nonwoven or woven substrate made of glass fiber or the like impregnated with an epoxy resin or the like.) Resin substrate 81 may also be made of, for example, a bismaleimide triazine resin, which is a thermosetting resin, or a modified polyphenylene ether resin, which is a thermoplastic resin.

[0046] (a circuit board made up of multiple stacked boards) FIG. 9 shows an example of a circuit board formed by combining and stacking the above-mentioned substrates. 9 is configured by stacking, from the bottom up, a glass core substrate 10, a ground substrate 30, a capacitor substrate 60, and an interposer substrate 70. A semiconductor chip or the like is mounted on the upper surface of the interposer substrate 70, but this is not shown here.

[0047] An insulating resin base material 100 is laminated between the glass core substrate 10 and the ground substrate 30, between the ground substrate 30 and the capacitor substrate 60, and between the capacitor substrate 60 and the interposer substrate . The resin substrate 100 functions as an adhesive layer and preferably contains a thermosetting resin or a thermoplastic resin, and for example, a prepreg (a nonwoven or woven substrate such as glass fiber impregnated with an epoxy resin or the like) can be used. The resin substrate 100 may also be, for example, a bismaleimide triazine resin, which is a thermosetting resin, or a modified polyphenylene ether resin, which is a thermoplastic resin. Alternatively, the resin substrate 100 may be an insulating thermosetting film.

[0048] Such a resin base material 100 bonds the glass core substrate 10 and the ground substrate 30, the ground substrate 30 and the capacitor substrate 60, and the capacitor substrate 60 and the interposer substrate 70, respectively.

[0049] Each resin base material 100 has a via 102 formed therein. The vias 102 provided in the resin substrate 100 between the glass core substrate 10 and the ground substrate 30 are arranged so as to electrically connect the metal layer 12 on the first surface 11a side of the glass core substrate 10 to the metal layer 12 on the second surface 11b of the ground substrate 30. The vias 102 provided in the resin substrate 100 between the ground substrate 30 and the capacitor substrate 60 are arranged so as to electrically connect the metal layer 12 on the first surface 11a of the ground substrate 30 and the metal layer 12 on the second surface 11b of the capacitor substrate 60. The vias 102 provided in the resin substrate 100 between the capacitor substrate 60 and the interposer substrate 70 are arranged so as to electrically connect the metal layers 63 and 65 on the surface of the resin substrate 61 of the capacitor substrate 60 to the metal layer 12 on the second surface 11b of the interposer substrate 70.

[0050] The via 102 may be a paste via filled with a conductive paste, a plated via, or a hybrid via in which a conductive paste is filled in a metal-plated through hole.

[0051] (Another example of a circuit board made by stacking multiple boards) FIG. 10 shows an example of a circuit board formed by combining and stacking the above-mentioned substrates. 10 is configured by laminating, from the bottom, a ground substrate 30, an antenna / inductor substrate 20, and an interposer substrate 90. An FO-WLP or the like is mounted on the top surface of the interposer substrate 90, but this is not shown here.

[0052] Between the ground substrate 30 and the antenna-inductor substrate 20, and between the antenna-inductor substrate 20 and the interposer substrate 90, insulating resin base materials 100 that function as adhesive layers are laminated. The resin substrate 100 is the same as in the above-described embodiment and will not be described in detail here.

[0053] Furthermore, vias 102 are provided in the resin base material 100 between the ground substrate 30 and the antenna-inductor substrate 20, and between the antenna-inductor substrate 20 and the interposer substrate 90, to electrically connect the respective metal layers 12. The vias 102 are similar to those in the above-described embodiment and will not be described in detail here.

[0054] The circuit board formed by combining and laminating substrates using the glass base material 11 is not limited to the two examples described above. The circuit board can be configured by freely combining each board.

[0055] (Circuit board manufacturing method) A method for manufacturing the circuit board shown in FIGS. 9 and 10 will be described below with reference to the flowchart of FIG. First, the combination of the glass core substrate 10, antenna / inductor substrate 20, ground substrate 30, heat spreader substrate 40, optical waveguide substrate 50, capacitor substrate 60, and interposer substrate 70 is examined, and the stacking order for that combination is determined (step S100).

[0056] Once the stacking order has been determined, a semi-cured resin base material 100 is laminated on the first surface (top surface) of the substrate determined to be the bottom layer (hereinafter referred to as the first substrate) (step S102). As described above, the resin base material 100 may be, for example, a thermosetting resin or a thermosetting insulating film. Next, a resin film for a mask is laminated on the upper surface of the resin base material 100 (step S104).

[0057] Next, through holes are formed in the masking resin film and the resin base material 100 so as to reach the surface of the metal layer 12 of the first substrate (step S106). The through holes can be formed by laser processing. When forming the through holes with a laser, the type of laser used can be CO2 laser, YAG laser, or the like, and can be selected appropriately. There are also no particular limitations on the laser output, and it can be selected appropriately.

[0058] Next, the through holes are filled with conductive paste (step S108), thereby forming paste vias in the resin base material 100. However, it is also possible to form hybrid vias by metal plating the through holes and filling them with conductive paste. The conductive paste may contain a conductive filler and a binder resin. Examples of the conductive filler include metal particles of copper, gold, silver, palladium, nickel, tin, bismuth, etc. These metal particles may be used alone or in combination of two or more types. The binder resin may be, for example, an epoxy resin, which is a type of thermosetting resin. However, the binder resin is not limited to epoxy resin, and polyimide resin or the like may also be used. Furthermore, the binder resin may be a thermoplastic resin instead of a thermosetting resin.

[0059] As a method for filling the conductive paste into the through-holes, a method of filling the through-holes under atmospheric pressure or under vacuum using a jig such as a squeegee can be mentioned.

[0060] Next, the resin film is peeled off (step S110). By peeling off the resin film, the conductive paste protrudes from the surface (upper surface) of the resin base material 100 by the thickness of the resin film.

[0061] A substrate to be laminated next (hereinafter referred to as the second substrate) is laminated on the surface (upper surface) of the resin substrate 100 from which the resin film has been peeled off (step S112). At this time, the metal layer 12 on the second surface 11b of the glass substrate 11 of the second substrate abuts against the conductive paste, and the laminated substrates are electrically bonded to each other.

[0062] Next, the same steps as steps S102 to S112 (adhesive layer laminating steps) are carried out on the surface (upper surface) of the second substrate (step S114). That is, a resin base material 100 is laminated on the surface (top surface) of a second substrate, a resin film is laminated on the surface (top surface) of the resin base material 100, through holes are formed, and the through holes are filled with a conductive paste. Then, the resin film is peeled off, and the next substrate is laminated on the surface (top surface) of the resin base material 100.

[0063] When all of the substrates determined in step S100 have been stacked, the entire stack of substrates is thermocompression-bonded or pressure-bonded (step S116). By thermocompression-bonding or pressure-bonding, the resin base material 100 and the conductive paste provided between the substrates are hardened, and the substrates are bonded together.

[0064] This manufacturing method makes it possible to obtain a high-performance, high-quality circuit board by combining a plurality of glass substrates made of glass base materials and having various functions.

[0065] The circuit board of this embodiment can be used as a motherboard (support substrate) or an interposer depending on the combination. It can also be used as a circuit board that constitutes a semiconductor element. It can also be applied to inspection equipment, probe cards, etc. used to determine the quality of semiconductors. [Explanation of symbols]

[0066] 10 Glass core substrate 11 Glass substrate 11a 1st surface 11b 2nd surface 12 metal layer 14 Beer 20 Antenna and inductor board 22 Metal layer 30 Ground board 32 Ground Metal Layer 40 Heat spreader board 42 Metal layer 44 Copper Inlay 50 Optical waveguide substrate 52 Optoelectronic Components 54 Optical waveguide 60 Capacitor Board 61 Resin substrate 62 Capacitor 63 Metal layer 64 Beer 65 Metal layer 66 Beer 70 Interposer board 72 Interposer 72a 1st surface 72b 2nd surface 73 Glass substrate 74 Beer 75 Beer 76 Metal layer 77 Resin substrate 80 Circuit Board 81 Resin substrate 81a Surface 1 82 Metal layer 84 Beer 90 Interposer board 100 Resin substrate 102 Beer 110 Circuit Board

Claims

1. a glass core substrate having a glass substrate, an insulating substrate made of glass, metal layers patterned on a first surface and a second surface of the glass substrate, and vias electrically connecting the opposing metal layers to each other; an antenna / inductor substrate including a glass substrate whose insulating base material is made of glass, metal layers patterned on a first surface and a second surface of the glass substrate, vias electrically connecting the opposing metal layers, and a metal layer formed in a coil shape on at least one of the first surface and the second surface; a ground substrate including a glass substrate whose insulating substrate is made of glass, metal layers patterned on a first surface and a second surface of the glass substrate, vias electrically connecting the opposing metal layers, and a ground metal layer formed as a ground on at least one of the first surface and the second surface; a heat spreader substrate including a glass substrate having an insulating substrate made of glass, metal layers patterned on a first surface and a second surface of the glass substrate, vias electrically connecting the opposing metal layers, and a heat spreader; an optical waveguide substrate including a glass substrate whose insulating substrate is made of glass, and an optical waveguide formed inside the glass substrate or on a first surface or a second surface thereof; a capacitor substrate including a glass substrate having an insulating substrate made of glass, metal layers patterned on a first surface and a second surface of the glass substrate, vias electrically connecting the opposing metal layers, and a capacitor provided inside the glass substrate or on the first or second surface; an interposer substrate on which an interposer can be stacked, the interposer being capable of mounting a semiconductor chip on one of the first surface and the second surface of the glass core substrate, or for mounting a semiconductor chip on at least one of the first surface and the second surface of the glass core substrate; A circuit board constructed by stacking at least two types of substrates.

2. 2. The circuit board according to claim 1, wherein the capacitor of the capacitor substrate is provided in an insulating resin substrate laminated on the first surface or the second surface.

3. The circuit board according to claim 1, characterized in that the interposer laminated on at least one of the first surface or the second surface of the glass core substrate of the interposer substrate is constructed by laminating a glass substrate.

4. The circuit board according to claim 1, characterized in that the interposer laminated on at least one of the first surface or the second surface of the glass core substrate of the interposer substrate is constructed by laminating a resin base material.

5. a glass core substrate having a glass substrate, an insulating substrate made of glass, metal layers patterned on a first surface and a second surface of the glass substrate, and vias electrically connecting the opposing metal layers to each other; an antenna / inductor substrate including a glass substrate whose insulating base material is made of glass, metal layers patterned on a first surface and a second surface of the glass substrate, vias electrically connecting the opposing metal layers, and a metal layer formed in a coil shape on at least one of the first surface and the second surface; a ground substrate including a glass substrate whose insulating substrate is made of glass, metal layers patterned on a first surface and a second surface of the glass substrate, vias electrically connecting the opposing metal layers, and a ground metal layer formed as a ground on at least one of the first surface and the second surface; a heat spreader substrate including a glass substrate having an insulating substrate made of glass, metal layers patterned on a first surface and a second surface of the glass substrate, vias electrically connecting the opposing metal layers, and a heat spreader; an optical waveguide substrate including a glass substrate whose insulating substrate is made of glass, and an optical waveguide formed inside the glass substrate or on a first surface or a second surface thereof; a capacitor substrate including a glass substrate having an insulating substrate made of glass, metal layers patterned on a first surface and a second surface of the glass substrate, vias electrically connecting the opposing metal layers, and a capacitor provided inside the glass substrate or on the first or second surface; an interposer substrate on which an interposer can be stacked, the interposer being capable of mounting a semiconductor chip on one of the first surface and the second surface of the glass core substrate, or for mounting a semiconductor chip on at least one of the first surface and the second surface of the glass core substrate; selecting at least two or more types of substrates from the above and determining the stacking order of each of the selected substrates; an adhesive layer lamination process including a step of laminating a semi-cured resin substrate on the substrate of the lowest layer in the determined lamination order, a step of forming a through hole in the laminated resin substrate, a step of filling the through hole with a conductive paste, and a step of laminating a next substrate; and after stacking all of the selected substrates, pressing the entire assembly together to harden the resin base material and the conductive paste.

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