Cutting device

Abstract

To facilitate the work of cutting a solder suctioning tool.SOLUTION: A cutting device 10 for cutting a solder suctioning tool comprises: a cutter 20 with a pair of blades 22a; a start part 26 which includes a sensor 24, and outputs a start command when the sensor 24 is set to a detection state; a cutter drive part which is operable to apply force for cutting the solder suctioning tool to the cutter 20; and a control part 30 which is electrically connected to the start part 26, and actuates the cutter drive part when receiving a start command.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a cutting device for cutting a solder sucker. [Background technology]

[0002] Conventionally, a cutting device for cutting a solder sucker has been known, as disclosed in Patent Document 1 below. The solder sucker is configured by woven and bundling multiple copper wires and is capable of sucking molten solder. The solder sucker is used to suck molten solder when repairing a soldered joint or removing an electronic component. As shown in FIG. 17 , the cutting device 90 disclosed in Patent Document 1 is used to cut a solder sucker 1 pulled out of a holder 3 in which the solder sucker 1 is housed. The cutting device 90 includes an upper cover 93 having a first blade 91 attached to its tip, a lower cover 94 having a second blade 92 attached to its tip, a connecting portion 95 that rotatably connects the upper cover 93 and the lower cover 94, and a spring mechanism disposed between the upper cover 93 and the lower cover 94. To cut the solder sucker 1 using this cutting device 90, the tip of the solder sucker 1 pulled out from the holder 3 is held in the meshing position of the first blade 91 and the second blade 92, and the top cover 93 is pressed firmly from above. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Utility Model Application Publication No. 5-5329 Summary of the Invention [Problem to be solved by the invention]

[0004] When performing solder sucking work, a person generally holds a soldering iron in one hand and a holder 3 containing a solder sucker 1 in the other. In this state, to cut the solder sucker 1 to a predetermined length, the position of the solder sucker 1 is first determined relative to the meshing position of the first blade 91 and the second blade 92, and then the upper cover 93 is pressed down by hand while maintaining the solder sucker 1 in this position. In this case, cutting the solder sucker 1 to a predetermined length is a cumbersome task, since the upper cover 93 must be pressed down while holding the solder sucker 1 in the hand.

[0005] SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional techniques, and has as its object to provide a cutting device that can simplify the cutting operation of a solder sucker. [Means for solving the problem]

[0006] In order to achieve the above-mentioned object, the cutting device of the present invention is a cutting device for cutting a solder sucker, and comprises a cutter having a pair of blades, a start-up unit including a sensor or a switch, which outputs a start-up command when the sensor enters a detection state or a predetermined operation is performed on the switch, a cutter drive unit operable to apply a force to the cutter to cut the solder sucker, and a control unit electrically connected to the start-up unit and which activates the cutter drive unit when it receives the start-up command.

[0007] In the cutting device according to the present invention, when the starting unit issues a start command in response to detection by a sensor or a predetermined switch operation, the control unit receives the start command and activates the cutter drive unit. The cutter drive unit then applies a force to the cutter to cut the solder sucker, causing the solder sucker to be cut by the pair of blades. Therefore, when cutting a solder sucker held by hand, there is no need to manually apply a force to the cutter, thereby reducing the hassle of the cutting operation. Therefore, even while holding the solder sucker in one hand and the soldering iron in the other, the solder sucker can be easily cut to a predetermined length.

[0008] The cutting device may further include a holding portion and a receiving portion that sandwich and hold the solder sucker when the solder sucker is cut by the pair of blades.

[0009] In this embodiment, the solder sucker can be held between the holding portion and the receiving portion before and after cutting with the pair of blades, preventing the solder sucker from shifting position during cutting. This is therefore effective when you want to accurately cut the solder sucker to a specified length. In addition, since it is possible to continue holding the solder sucker after cutting, it is easy to pull the solder sucker out of the holder in this state. This is therefore effective when using the solder sucker repeatedly.

[0010] The cutting device may further include a linking unit that links the movement of the holding unit with the operation of the cutter by the cutter driving unit.

[0011] In this embodiment, the holding portion moves in conjunction with the action of cutting the solder sucker with the pair of blades, so that the action of holding and cutting the solder sucker can be performed as a series of actions.

[0012] The interlocking portion may include a leaf spring portion and an action portion that is biased in the direction in which the pair of blades close by the spring force of the leaf spring portion. In this case, the action portion may be displaced in response to the action of the pair of blades in the closing direction by the spring force, and the holding portion may be configured to advance toward the receiving portion in accordance with the displacement of the action portion.

[0013] In this embodiment, the spring force of the leaf spring displaces the operating part in the direction in which the pair of blades closes, and the holding part advances toward the receiving part in response to this displacement of the operating part. Therefore, a mechanism that links the displacement of the holding part to the cutting operation of the solder sucker by the cutter can be realized with a simple configuration that uses the spring force of the leaf spring.

[0014] The cutting device may further include a switching unit capable of switching the state of the interlocking unit between an interlocking state in which the holding unit is interlocked with the operation of the cutter by the cutter driving unit and a disconnected state in which the holding unit is not interlocked with the operation of the cutter by the cutter driving unit. In this case, when the switching unit is switched to the disconnected state, the leaf spring unit is in a natural state in which it does not generate spring force, so that the action unit is in a position where it is not pressed against the pair of blades, and when the switching unit is switched to the interlocking state, the leaf spring unit is in an elastically deformed state in which it generates spring force, so that the action unit is in a position where it is pressed against the pair of blades.

[0015] In this embodiment, when the switching unit is switched to the interlocking state and the leaf spring unit is in an elastically deformed state, if the pair of blades act in the closing direction, the action unit follows and is displaced by the spring force of the leaf spring unit. As a result, the holding unit moves to advance toward the receiving unit. On the other hand, when the switching unit is switched to the disconnecting state and the leaf spring unit is in its natural state, if the pair of blades act in the closing direction, the action unit does not follow the pair of blades. Therefore, the holding unit does not move to advance toward the receiving unit. Therefore, since the holding unit does not necessarily move in interlocking with the pair of blades, it is possible to select a state in which the holding unit is not interlocked with the pair of blades as needed.

[0016] The cutter may have a pair of arms, and the interlocking part may have an engaging part that can engage with one of the pair of arms. In this case, the holding part may protrude toward the receiving part beyond one of the pair of blades that is provided on one of the arms in a state where the engaging part is engaged.

[0017] In this embodiment, when the pair of blades are actuated, the solder sucker can be held by the holding portion and the receiving portion before the solder sucker is cut, and can also be held after the solder sucker is cut.

[0018] The cutter driving unit may include a cam mechanism that operates under control of the control unit based on the start-up command, and a lever that, by operating the cam mechanism, applies a force to the cutter to cut the solder sucker.

[0019] In this embodiment, the lever is actuated by the cam mechanism, and when the cutter is actuated by the lever, the solder sucker is cut. Therefore, a mechanism for actuating the cutter based on an activation command can be realized with a compact and inexpensive configuration.

[0020] The cutter may be disposed in a position in which the width direction of the pair of blades faces the vertical direction and the pair of blades operates horizontally. In this case, the sensor may be disposed above the pair of blades, and the cutting device may further include a cut piece receiving portion disposed below the gap between the pair of blades to receive cut pieces of the solder sucker.

[0021] In this embodiment, the solder sucker is inserted into the space between the pair of blades by moving downward from above. That is, the solder sucker is inserted into the space between the pair of blades from one side in the width direction of the pair of blades. At this time, a sensor located above the pair of blades enters a detection state, causing the pair of blades to operate horizontally and cut the solder sucker. Therefore, when cutting the solder sucker, the tip of the solder sucker can be cut off simply by moving the solder sucker from above downward. Furthermore, because the blades cut the solder sucker by displacing horizontally, the cut pieces fall directly from between the pair of blades and are stored in the cut piece container.

[0022] The cutting device may further include a housing that houses at least the cutter. In this case, the housing may be provided with a tapered guide that guides the solder sucker toward the space between the pair of blades when the solder sucker is moved.

[0023] In this embodiment, the solder sucker can be moved along the guide to the space between the pair of blades, so that even if the space between the pair of blades is narrow, the task of moving the solder sucker toward the space between the pair of blades does not become complicated.

[0024] The cutting device may further include a housing having the receiving portion and accommodating at least the cutter.

[0025] In this aspect, since the receiving portion is formed as part of the housing, there is no need to provide a member for forming the receiving portion outside the housing, and therefore an increase in the number of parts can be suppressed. [Effects of the Invention]

[0026] As described above, according to the present invention, the cutting operation of the solder sucker can be simplified. [Brief explanation of the drawings]

[0027] [Figure 1] FIG. 10 is a diagram showing a state in which the solder sucker is pulled out from the holder. [Figure 2] 1 is a perspective view of a cutting device according to an embodiment of the present invention. [Figure 3] FIG. 2 is a perspective view of the cutting device with a housing of the cutting device partially cut away. [Figure 4] FIG. 10 is a diagram illustrating a mechanism for operating a cutter of the cutting device. [Figure 5] 10A and 10B are diagrams for explaining a state when both blades of the cutter are moved to a cutting position. [Figure 6] 10 is a diagram for explaining a cam mechanism included in the cutter driving unit, showing a state when the lever engages with the reference surface portion of the cam. FIG. [Figure 7] 10 is a diagram for explaining a cam mechanism included in the cutter driving unit, showing a state when the lever engages with the open position surface of the cam. FIG. [Figure 8]10 is a diagram for explaining a cam mechanism included in the cutter driving unit, showing a state when the lever engages with the cutting surface of the cam. FIG. [Figure 9] FIG. [Figure 10] 10 is a diagram illustrating a state in which a blocking portion on a peripheral surface of a cam included in the transmission portion faces the leaf spring portion side. FIG. [Figure 11] 10 is a diagram illustrating a state when a linking portion on a peripheral surface of a cam included in the transmission portion faces the leaf spring portion side. FIG. [Figure 12] 10A and 10B are diagrams for explaining the relationship between the rotation angle of the cam of the cam mechanism and the state of the cutter when the solder sucker is cut. [Figure 13] 10A and 10B are diagrams illustrating a modified example of the structure for interlocking the holding portion with the operation of the cutter. [Figure 14] 10A and 10B are diagrams illustrating a modified example having a structure in which the holding portion is not linked to the operation of the cutter. [Figure 15] 10A and 10B are diagrams for explaining a modified example of the switching unit; [Figure 16] 10A and 10B are diagrams for explaining a modified example of the switching unit; [Figure 17] FIG. 1 is a diagram showing a conventional cutting device. DETAILED DESCRIPTION OF THE INVENTION

[0028] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0029] (First embodiment) The cutting device according to this embodiment is a cutting device used to cut a solder sucker. The solder sucker is made of a plurality of copper wires woven together and has a long, flat cross-section. Because it is made of woven copper wires, it is capable of sucking up molten solder. As shown in FIG. 1, the solder sucker 1 is stored in a holder 3 in a wound state, and is unwound as needed through an opening formed in the holder 3. After use, the required amount is cut off, or the solder sucker is cut to the required length before use. A cutting device 10 shown in FIG. 2 is used to cut the solder sucker 1 to the required length.

[0030] The cutting device 10 has a housing 11 that houses a cutter 20, which will be described later, and this housing 11 is provided with an insertion opening 12 for inserting the solder sucker 1, an insertion opening 13 that continues from the insertion opening 12 so that the solder sucker 1 can be moved to the point where the solder sucker 1 is to be cut, and a guide 14 that guides the solder sucker 1 toward the insertion opening 12.

[0031] Insertion opening 12 opens upward in housing 11. Guide 14 is formed by recessing a portion of top surface 11a of housing 11 into a V-shaped cross section, and insertion opening 12 opens at the bottom of guide 14 with a V-shaped cross section. That is, when cutting solder sucker 1, solder sucker 1 is moved from top to bottom with the thickness direction of solder sucker 1 facing left and right, so guide 14 is formed with a tapered V-shaped cross section that gradually narrows from top to bottom.

[0032] In addition, a plurality of scales are provided on the guide 14. These scales are provided to indicate the distance from the side surface portion 11b, which will be described later, and can therefore be used as a guide for cutting the solder sucker 1 to a predetermined length.

[0033] Insertion opening 12 is formed to extend in one direction (a direction perpendicular to one side surface 11b) from one side surface 11b of housing 11, and opens to top surface 11a of housing 11. The length of insertion opening 12 in the depth direction is equal to or greater than the length at which the tip of solder sucker 1 is generally cut off.

[0034] Insertion opening 13 is connected to the end of insertion opening 12 on the side surface 11b side, and is formed to extend downwardly along side surface 11b of housing 11. The vertical width of insertion opening 13 is equal to or greater than the width of solder sucker 1, and the horizontal width of insertion opening 13 is the same as the width of insertion opening 12 and is equal to or greater than the thickness of solder sucker 1. In other words, solder sucker 1 is moved from insertion opening 12 to insertion opening 13 with its thickness facing left and right and its width facing up and down. Insertion opening 13 opens in an area that includes the outside of the area where cutting of solder sucker 1 is performed.

[0035] The housing 11 is provided with a cut piece receiving section 16 directly below the insertion opening 13, i.e., directly below the area where cutting is performed. The cut piece receiving section 16 is arranged where the cut pieces will fall and stores the fallen cut pieces. The cut piece receiving section 16 is configured to be able to be slid out of the housing 11.

[0036] As shown in FIGS. 3 and 4, the housing 11 contains a cutter 20 having a pair of blades 21a and 22a, and a sensor 24 disposed above the pair of blades 21a and 22a.

[0037] The cutter 20 has a pair of arms (a first arm 21 and a second arm 22) each made of a thin metal plate. One end (base end) of the arms 21 and 22 is joined to each other, and the other end (tip end) of the arms 21 and 22 is provided with blades 21a and 22a, respectively, that protrude in directions facing each other.

[0038] 3, the cutter 20 is disposed in the housing 11 in such a position that the width direction of the pair of blades 21a, 22a faces the vertical direction, and the pair of blades 21a, 22a face each other horizontally and operate horizontally. The cutter 20 is supported at the base ends of the pair of arms 21, 22 by a support 17 (see FIG. 4) provided in the housing 11.

[0039] Each arm 21, 22 has a shape that forms a predetermined gap between the pair of blades 21a, 22a. This gap is a gap that is equal to or greater than the thickness of the solder sucker 1. When an external force is applied to the pair of arms 21, 22, they elastically deform so that the pair of blades 21a, 22a interlock. When the external force is removed, the pair of arms 21, 22 restore their original positions so that the pair of blades 21a, 22a return to their original positions.

[0040] Sensor 24 has light-emitting section 24a and light-receiving section 24b, which face each other across an area (passing area) through which solder sucker 1 passes from insertion opening 12 toward insertion opening 13. Light-emitting section 24a and light-receiving section 24b constitute starting section 26, which outputs a start command when solder sucker 1 passes through the passing area and the light emitted from light-emitting section 24a does not reach light-receiving section 24b.

[0041] 6, the cutter 20 is actuated by a cutter driving unit 27. The cutter driving unit 27 is a mechanism for applying an external force to the pair of arms 21 and 22, and includes a cam mechanism 28 and a lever 29.

[0042] The cam mechanism 28 is actuated upon receiving a command from the control unit 30 (see FIG. 3). The control unit 30 outputs a command to actuate the cam mechanism 28 upon receiving a start command output from the start unit 26.

[0043] Cam mechanism 28 includes cam 32 that is rotatable around a rotation axis, gear mechanism 33 for rotating cam 32, and a motor (not shown) that drives gear mechanism 33. Cam 32, gear mechanism 33, and motor are all disposed inside housing 11. The motor is started upon receiving a start command output from start unit 26, and rotates cam 32 via gear mechanism 33.

[0044] 4, lever 29 has a base end 29a that engages with the circumferential surface of cam 32, and a tip end 29b that is pin-connected to housing 11 so as to contact the outer surface of one arm (first arm 21). Pin 34 is held by housing 11.

[0045] An action surface 29c is formed on the tip 29b, which displaces the first arm 21 as the attitude of the lever 29 changes and the tip 29b rotates around the pin 34. Therefore, the blade 21a provided on the first arm 21 is displaced as the cam 32 rotates and the attitude of the lever 29 changes. For example, FIG. 4 shows a state in which both blades 21a, 22a of the cutter 20 are in the open position, and FIG. 5 shows a state in which the attitude of the lever 29 changes and the action surface 29c pushes the first arm 21, changing both blades 21a, 22a of the cutter 20 to the cutting position.

[0046] The other arm (second arm 22) has its tip locked by a restricting portion 35 (see FIG. 6) provided on the housing 11, so that the blade 22a provided on the second arm 22 is not displaced even when the cam 32 rotates. Therefore, the cutter 20 of this embodiment operates so that the blade 21a of the first arm 21 approaches or moves away from the blade 22a of the second arm 22. Note that the cutter driver 27 may be configured to operate the cutter 20 so that both blades 21a, 22a are displaced.

[0047] As shown in Figures 6 to 8, the peripheral surface of the cam 32 includes a reference surface portion 32a with which the base end portion 29a of the lever 29 engages when the cam 32 is stopped and the blades 21a, 22a are positioned at the stop position; an opening surface portion 32b with which the base end portion 29a of the lever 29 engages when the first arm 21 is moved to a position (open position) where the blades 21a, 22a open; an opening position surface portion 32c with which the base end portion 29a of the lever 29 engages when the blades 21a, 22a are maintained in the open position for a predetermined time; a cutting surface portion 32d with which the base end portion 29a of the lever 29 engages when the first arm 21 is moved from the open position to a position (cutting position) where the blades 21a, 22a mesh; and a return surface portion 32e with which the base end portion 29a of the lever 29 engages when the blades 21a, 22a are moved from the cutting position to the stop position.

[0048] As shown in Figure 6, when base end 29a of lever 29 is engaged with reference surface portion 32a and blades 21a, 22a are in the stopped position, a slight gap is formed between blades 21a, 22a. This gap is small enough to prevent solder sucker 1 from passing through. However, when blades 21a, 22a are in the stopped position, no gap may be formed between blades 21a, 22a, and blades 21a, 22a may be in contact with each other. Alternatively, blades 21a, 22a may be configured to maintain an open state instead of a slight gap.

[0049] Opening surface 32b is a portion continuing from reference surface 32a in the rotational direction of cam 32, and is formed so that blade 21a of first arm 21 is rapidly displaced, moving both blades 21a, 22a to the open position. Opening surface 32b is preferably configured to move first arm 21 so that blade 21a of first arm 21 reaches the open position, for example, within 0.5 seconds, more preferably within 0.3 seconds, after receiving the activation command. In this case, it is possible to prevent the solder sucker 1 from being hindered in moving from insertion opening 12 to insertion opening 13 due to the time difference between when sensor 24 detects solder sucker 1 and when both blades 21a, 22a reach the open position.

[0050] 7, open position surface 32c is a portion that continues from open surface 32b in the rotational direction of cam 32, and is formed so as to maintain blades 21a, 22a in the open position for a predetermined time. The time for maintaining blades 21a, 22a in the open position is set based on the time required for a user to move solder sucker 1 to insertion opening 13 and position solder sucker 1 to a position where a predetermined cutting length can be obtained. For example, this time is set to approximately 1 to 3 seconds.

[0051] As shown in FIG. 8, cutting surface portion 32d is a portion that continues from open position surface portion 32c in the rotation direction of cam 32, and is formed so that both blades 21a, 22a are displaced from the open position to the cutting position.

[0052] The return surface 32e is a portion that continues from the cutting surface 32d in the rotation direction of the cam 32, and is formed so that the blades 21a, 22a are displaced from the cutting position to the stop position. After the cam 32 makes one rotation, the motor is automatically stopped by the control unit 30.

[0053] As shown in Figures 4 and 5, a holding portion 37 is further provided within the housing 11 for holding the solder sucker 1 when the solder sucker 1 is cut by the pair of blades 21a, 22a, i.e., from before to after the solder sucker 1 is cut.

[0054] The holding portion 37 is disposed along the inner surface of the side portion 11b of the housing 11 that forms the insertion opening 13, outside the blade 21a of the cutter 20 (or on the side of the insertion opening 13 or in front of the blade 21a), and is movable between a position protruding into the insertion opening 13 (FIG. 5) and a position retracted outside the insertion opening 13 (FIG. 4) by an interlocking portion 39, which will be described later. The tip of the holding portion 37 is disposed to face the tip of the receiving portion 11c. The receiving portion 11c is formed by the side portion 11b of the housing 11 that has the insertion opening 13, and the tip of the receiving portion 11c is formed by a portion of the periphery of the insertion opening 13 that is located on the opposite side from the holding portion 37.

[0055] The cutting device 10 is provided with an interlocking unit 39 for interlocking the movement of the holding unit 37 with the operation of the cutter 20 by the cutter driving unit 27, and a switching unit 40 for switching the state of the interlocking unit 39 as to whether or not to interlock. The interlocking unit 39 is configured by a member (interlocking member) integrally having a leaf spring portion 39a, a fixing portion 39b provided at one end of the leaf spring portion 39a, and an acting portion 39c provided at the other end of the leaf spring portion 39a.

[0056] The fixed portion 39b is attached to the housing 11. Therefore, even when the state of the interlocking portion 39 is switched by the switching portion 40, the fixed portion 39b remains in the same position.

[0057] The leaf spring portion 39a is made of a leaf spring and is disposed at a position where it can be engaged with the outer peripheral surface of a cam 42a (transmission portion 42) described below, and can assume two states depending on the orientation of the cam 42a: a natural state in which no spring force is generated in the leaf spring portion 39a by the outer peripheral surface of the cam 42a, and an elastically deformed state in which it generates a spring force by receiving force from the cam 42a. In addition, in this embodiment, as described below, the outer peripheral surface of the cam 42a includes an adjustment portion 42d whose outer diameter gradually changes, and therefore, in the elastically deformed state, the amount of elastic deformation changes continuously.

[0058] The acting portion 39c includes a connecting portion 39d, which is a flat plate-shaped portion arranged along the inner surface of the side surface 11b of the housing 11, and an engaging portion 39e that protrudes from the connecting portion 39d so as to be able to engage with the outer surface of the first arm portion 21. The holding portion 37 is provided at the tip of the connecting portion 39d.

[0059] The connecting portion 39d is sized so that, when the leaf spring portion 39a is in its natural state, the holding portion 37 is retracted to the outside of the insertion opening 13. In addition, the connecting portion 39d is configured so that the holding portion 37 can advance into the insertion opening 13 when the leaf spring portion 39a is elastically deformed.

[0060] As shown in FIG. 9 , the engaging portion 39e is a portion formed by cutting and raising a portion of the plate material that constitutes the connecting portion 39d. When the leaf spring portion 39a is in its natural state, the engaging portion 39e is located at a position separated from the outer surface of the first arm portion 21 or in contact with the outer surface of the first arm portion 21 without applying any force. On the other hand, when the leaf spring portion 39a is elastically deformed, the engaging portion 39e comes into contact with the outer surface of the first arm portion 21 (the surface of the first arm portion 21 opposite the second arm portion 22). At this time, the spring force of the leaf spring portion 39a biases the engaging portion 39e in a direction that presses the first arm portion 21 from the outer surface (the surface of the first arm portion 21 opposite the second arm portion 22). However, the spring force of the leaf spring portion 39a is not large enough to move the first arm 21. Therefore, simply deforming the leaf spring portion 39a into an elastically deformed state does not move the connecting portion 39d and the engaging portion 39e. When the blade 21a of the first arm portion 21 is displaced toward the blade 22a of the second arm portion 22 by the operation of the lever 29, the engaging portion 39e is displaced following the movement of the first arm portion 21.

[0061] 2 and 4, the switching unit 40 has an operation unit 41 provided at a position exposed on the top surface of the housing 11, and a transmission unit 42 that is moved by the operation unit 41. The operation unit 41 is provided rotatable about an axis, and is provided to be rotated by operation by the user.

[0062] The transmission unit 42 includes a cam 42a (FIG. 4) fixed to a shaft connected to the back surface of the operation unit 41. As also shown in FIGS. 10 and 11, the circumferential surface of the cam 42a includes a blocking portion 42b, which is a portion with a small diameter so that the circumferential surface of the cam 42a does not come into contact with the leaf spring portion 39a or the leaf spring portion does not deform, a linking portion 42c, which is a portion with a large diameter so that the circumferential surface of the cam 42a elastically deforms the leaf spring portion 39a, and an adjustment portion 42d, which continuously connects the blocking portion 42b and the linking portion 42c and has a gradually changing diameter.

[0063] The operating unit 41 is rotatable so that any one of the blocking portion 42b, the linking portion 42c, and the adjusting portion 42d on the peripheral surface of the cam 42a faces the leaf spring portion 39a. As shown in Fig. 2, the top surface 11a of the housing 11 may be provided with a mark (first mark 43b) at a position corresponding to the blocking portion 42b, a mark (second mark 43c) at a position corresponding to the linking portion 42c, and a mark (third mark 43d) at a position corresponding to the adjusting portion 42d, adjacent to the operating unit 41.

[0064] 10, when the operating unit 41 is rotated so that the blocking portion 42b faces the leaf spring portion 39a (the operating unit 41 is operated so that it aligns with the first mark 43b), the holding unit 37 is placed in a state (blocking state) in which it is not linked to the operation of the cutter 20, and is maintained in a position retracted from the insertion opening 13. Also, as shown in FIG. 11, when the operating unit 41 is rotated so that the linking portion 42c faces the leaf spring portion 39a (the operating unit 41 is operated so that it aligns with the second mark 43c), the holding unit 37 is placed in a state (linked state) in which it is displaced in linkage with the operation of the cutter 20. At this time, because the holding unit 37 is subjected to a strong spring force in the direction in which it advances into the insertion opening 13, it is linked to the operation of the cutter 20 to close it, and can firmly press the solder sucker 1 inside the insertion opening 13 against the receiving portion 11c. Furthermore, when the operating part 41 is rotated so that the adjustment part 42d faces the spring part side (the operating part 41 is operated so that it aligns with the third mark 43d), the holding part 37 is displaced in conjunction with the operation of the cutter 20, but the pressing force of the solder sucker 1 is not as strong as when the connecting part 42c is in position.

[0065] Furthermore, since the axis of the cam 42a is perpendicular to the movement direction of the pair of blades 21a, 22a and the movement direction of the holding portion 37, the rotation of the cam 42a causes elastic deformation of the leaf spring portion 39a and displacement of the first arm portion 21, thereby displacing the holding portion 37 in the direction of opening and closing the insertion port 13.

[0066] Here, a method for cutting the solder sucker 1 by the cutting device 10 according to this embodiment will be described with reference to FIG. 12. In the initial state in which the solder sucker 1 is not inserted into the insertion opening 13, the cam mechanism 28 of the cutter drive unit 27 has the reference surface portion 32a on the circumferential surface of the cam 32 engaged with the base end portion 29a of the lever 29 (FIG. 6). Therefore, the cutter 20 is in a state (start position) in which there is a slight gap between the blades 21a and 22a. The rotation angle of the cam 32 at this time is set to 0°.

[0067] The user operates the operating unit 41 to select whether to link the holding unit 37 to the cutter 20, whether to not link the holding unit 37 to the cutter 20, or whether to link the holding unit 37 to the cutter 20 while adjusting the holding force of the solder sucker 1 by the holding unit 37 when linked. For example, when the operating unit 41 is operated so as to align with the first mark 43b, the holding unit 37 is not linked to the cutter 20.

[0068] When the solder sucker 1 is inserted into the insertion opening 12 along the guide 14 on the top surface 11a of the housing 11, the sensor 24 detects the solder sucker 1, causing the activation unit 26 to output an activation command. The control unit 30 receives this activation command and activates the cam mechanism 28 of the cutter drive unit 27. This causes the cam 32 of the cam mechanism 28 to rotate, causing the opening surface 32b on the circumferential surface of the cam 32 to engage with the base end 29a of the lever 29, changing the position of the lever 29. The cam 32 further rotates, causing the opening position surface 32c to engage with the base end 29a of the lever 29 (FIG. 7). This causes the cutter 20 to reach the open position. The rotation angle of the cam 32 at this time is defined as D1°.

[0069] Because the cutter 20 quickly reaches the open position, the cutter 20 has already reached the open position between the time the sensor 24 detects the solder sucker 1 and the time the solder sucker 1 reaches the insertion opening 13. After that, the cam 32 continues to rotate, but the cutter 20 is maintained in the open position (D1° to D2°).

[0070] Then, the cutter 20 is maintained in the open position for a predetermined time, during which the user can set the solder sucker 1 in a predetermined position so that the solder sucker 1 can be cut to a predetermined length.

[0071] Then, after a predetermined time has elapsed (assuming that the rotation angle of cam 32 is D2°), cutting surface portion 32d of cam 32 engages with base end portion 29a of lever 29, and cutter 20 operates so that both blades 21a, 22a are displaced from the open position to the cutting position. As a result, solder sucker 1 is cut by cutter 20. The cut pieces fall and are stored in cut piece storage portion 16.

[0072] Since the operating part 41 is operated to align with the first mark 43b, the holding part 37 does not displace when the solder sucker 1 is cut by the cutter 20. Therefore, the holding part 37 remains in a position retracted outward from the insertion opening 13. However, if the operating part 41 is operated to align with the second mark 43c, the holding part 37 also advances into the insertion opening 13 as the cutter 20 is operated, so that the solder sucker 1 is sandwiched between the holding part 37 and the receiving part 11c. In this case, when the solder sucker 1 is cut, the solder sucker 1 is sandwiched between the holding part 37 and the receiving part 11c, so that the solder sucker 1 can be cut without moving.

[0073] After the cutter 20 reaches the cutting position, the return surface 32e of the cam 32 engages with the base end 29a of the lever 29, so the cutter 20 returns to the start position (the orientation of the cam 32 is 360°).

[0074] At this time, if the operating portion 41 is operated so as to align with the second mark 43c or the third mark 43d, when the operating portion 41 returns to the start position, the holding portion 37 advances into the insertion opening 13a of the housing 13, and the solder sucker 1 is maintained in a state where it is held by the holding portion 37 and the receiving portion 11c. That is, the length from the engaging portion 39e to the tip of the holding portion 37 is longer than the height of the blade 21a of the first arm 21 and is equal to or longer than the combined distance of the height of the blade 21a of the first arm 21 and the gap between the blades 21a, 22a at the start position. In other words, the gap between the blades 21a, 22a at the start position is set equal to or shorter than the distance from the engaging portion 39e to the tip of the holding portion 37 minus the height of the blade 21a of the first arm 21.

[0075] Therefore, when the operating portion 41 is operated to align with the second mark 43c or the third mark 43d, the solder sucker 1 can be maintained in a held state by the holding portion 37 and the receiving portion 11c even when the cutter 20 is in the start position. That is, when the cutter 20 is in the cutting position, the blades 21a and 22a are in contact with each other, and the solder sucker 1 is sandwiched between the holding portion 37 and the receiving portion 11c. At this time, the holding portion 37 is pressed against the receiving portion 11c via the solder sucker 1 by the spring force of the leaf spring portion 39a, while the engaging portion 39e is separated from the first arm 21. Even when the cutter 20 is moved from this state to the start position, the engaging portion 39e remains separated from the first arm 21 due to the above-described length relationship, and the holding portion 37 does not displace. Therefore, even when the solder sucker 1 is in the start position, the solder sucker 1 remains sandwiched between the holding portion 37 and the receiving portion 11c.

[0076] Because the solder sucker 1 is held by the holding portion 37 and the receiving portion 11c even after the solder sucker 1 is cut, when the solder sucker 1 is to be pulled out of the holder 3, it can be easily pulled out of the holder 3 by moving the holder 3 without touching the solder sucker 1. In this case, the strength with which the holding portion 37 holds the solder sucker 1 is determined by the spring force of the leaf spring portion 39a, so the spring force should be set to such an extent that the solder sucker 1 will come off the holding portion 37 when the solder sucker 1 is pulled hard.

[0077] As described above, in cutting device 10, when starting unit 26 issues a start command in response to detection by sensor 24, control unit 30 receives this start command and activates cutter driver 27. As a result, cutter driver 27 applies a force to cutter 20 to cut solder sucker 1, and solder sucker 1 is cut by pair of blades 21a, 22a. Therefore, when cutting solder sucker 1 held by hand, there is no need to manually apply a force to cutter 20 to cut solder sucker 1, which reduces the hassle of the cutting operation. Therefore, even if solder sucker 1 is held in one hand and a soldering iron in the other, the operation of cutting solder sucker 1 to a predetermined length can be easily performed.

[0078] Furthermore, because the solder sucker 1 can be held between the holding portion 37 and the receiving portion 11c before and after cutting of the solder sucker 1 by the pair of blades 21a, 22a, it is possible to prevent the solder sucker 1 from shifting position during cutting. This is therefore effective when it is desired to accurately cut the solder sucker 1 to a predetermined length. Furthermore, because the solder sucker 1 can continue to be held by the holding portion 37 and the receiving portion 11c after cutting, it is possible to easily pull out the solder sucker 1 from the holder 3. This is therefore effective when the solder sucker 1 is to be used continuously.

[0079] Furthermore, cutting device 10 is equipped with interlocking unit 39 that interlocks holding unit 37 with cutter 20, so that holding unit 37 moves in conjunction with the operation of paired blades 21a, 22a cutting solder sucker 1. Therefore, the operation of holding and cutting solder sucker 1 can be performed as a series of operations.

[0080] Furthermore, interlocking portion 39 includes leaf spring portion 39a and action portion 39c. The spring force of leaf spring portion 39a displaces action portion 39c in the direction in which pair of blades 21a, 22a closes, and this displacement of action portion 39c causes holding portion 37 to advance toward receiving portion 11c. Therefore, a mechanism for interlocking the displacement of holding portion 37 with the cutting operation of solder sucker 1 by cutter 20 can be realized with a simple configuration using the spring force of leaf spring portion 39a.

[0081] The cutting device 10 also includes a switching unit 40 that can switch the state of the interlocking unit 39 between an interlocking state and a disconnecting state. When the switching unit 40 is switched to the interlocking state and the leaf spring portion 39a is in an elastically deformed state, if the pair of blades 21a, 22a act in the closing direction, the action portion 39c follows and is displaced by the spring force of the leaf spring portion 39a. As a result, the holding portion 37 moves toward the receiving portion 11c. On the other hand, when the switching unit 40 is switched to the disconnecting state and the leaf spring portion 39a is in its natural state, if the pair of blades 21a, 22a act in the closing direction, the action portion 39c does not follow the pair of blades 21a, 22a. Therefore, the holding portion 37 does not move toward the receiving portion 11c. Therefore, since the holding portion 37 does not necessarily move in conjunction with the pair of blades 21a, 22a, it is possible to select a state in which the holding portion 37 does not move in conjunction with the pair of blades 21a, 22a as needed.

[0082] Furthermore, because the holding portion 37 protrudes further toward the receiving portion 11c than the blade 21a of the first arm 21, when the pair of blades 21a, 22a are activated, the solder sucker 1 can be held by the holding portion 37 and the receiving portion 11c before cutting the solder sucker 1. Furthermore, the solder sucker 1 can be held even after cutting.

[0083] Furthermore, cutter driving section 27 includes cam mechanism 28 and lever 29, and operation of cam mechanism 28 activates lever 29, which in turn activates cutter 20, cutting solder sucker 1. Therefore, a mechanism for operating cutter 20 based on a start command can be realized with a compact and inexpensive configuration.

[0084] Furthermore, the insertion opening 12 opens upward so that the solder sucker 1 can be moved downward from above and inserted into the space between the pair of blades 21a, 22a. The cutter 20 is positioned so that the width direction of the pair of blades 21a, 22a faces the vertical direction and the pair of blades 21a, 22a operates horizontally. That is, the solder sucker 1 is inserted into the space between the pair of blades 21a, 22a from one side of the width direction of the pair of blades 21a, 22a. At this time, the sensor 24 located above the pair of blades 21a, 22a enters a detection state, causing the pair of blades 21a, 22a to operate horizontally and cut the solder sucker 1. Therefore, when cutting the solder sucker 1, the tip portion 29b of the solder sucker 1 can be cut off simply by moving the solder sucker 1 downward from above. Furthermore, the blades 21a and 22a are displaced horizontally to cut the solder sucker 1, and the cut pieces fall directly between the pair of blades 21a and 22a and are stored in the cut piece receiving section 16.

[0085] Furthermore, the solder sucker 1 can be moved into the space between the pair of blades 21a, 22a by moving the solder sucker 1 along the guide 14. Therefore, even if the space between the pair of blades 21a, 22a is narrow, the task of moving the solder sucker 1 into the space between the pair of blades 21a, 22a can be prevented from becoming complicated.

[0086] Furthermore, since the receiving portion 11c is formed as a part of the housing 11, there is no need to provide a member for forming the receiving portion 11c other than the housing 11. Therefore, an increase in the number of parts can be suppressed.

[0087] It should be noted that the embodiments disclosed herein are illustrative in all respects and should not be considered limiting. The present invention is not limited to the above-described embodiments, and various modifications and improvements are possible without departing from the spirit and scope of the present invention.

[0088] For example, in the above embodiment, activation unit 26 includes sensor 24 and is configured to output an activation command when it detects solder sucker 1, but instead activation unit 26 may include a switch (not shown) and be configured to output an activation command when a predetermined operation is performed on the switch. Also, although sensor 24 is arranged to detect solder sucker 1, sensor 24 may be configured to detect the hand of a user holding solder sucker 1.

[0089] Furthermore, in the above embodiment, the engaging portion 39e is provided on the connecting portion 39d that supports the holding portion 37, and the holding portion 37 is configured to move in conjunction with the cutter 20 when the engaging portion 39e is pressed against the first arm portion 21, but this configuration is not limited thereto. For example, as shown in FIG. 13 , a displacement drive unit 47 that is arranged so as not to come into physical contact with the cutter drive unit 27 and that displaces the holding portion 37 may be provided. This displacement drive unit 47 may be configured to receive a command from the control unit 30 and displace the holding portion 37 in conjunction with the operation of the cutter 20. In this case, the displacement drive unit 47 may be configured to be driven by a cam or the like (not shown).

[0090] 14, the displacement drive unit 47 may be configured not to be linked to the operation of the cutter 20 by the cutter drive unit 27. In this case, the displacement drive unit 47 may be configured to be operated by a user, and the holding unit 37 may be displaced by the user operating the displacement drive unit 47. For example, the displacement drive unit 47 may be configured to have a compression spring, and may be configured to advance the holding unit 37 into the insertion opening 13 by spring force, but to retract the holding unit 37, the user may manually operate the displacement drive unit 47 to contract the compression spring.

[0091] In the above embodiment, switching unit 40 is provided for switching the state of interlocking unit 39 as to whether or not it is interlocked, and the circumferential surface of cam 42a of transmission unit 42 included in switching unit 40 includes blocking portion 42b, linking portion 42c, and adjusting portion 42d, but the present invention is not limited to this configuration. For example, adjusting portion 42d may be omitted, and the state of interlocking unit 39 as to whether or not it is interlocked may be switched only between an interlocking state in which holding unit 37 is interlocked with cutter 20 and a blocking state in which it is not interlocked with cutter 20.

[0092] In the above embodiment, the transmission unit 42 of the switching unit 40 includes a cam 42a, but this configuration is not limited thereto. For example, as shown in FIG. 15 , the transmission unit 42 of the switching unit 40 may include a compression spring 42e. In this case, the operating unit 41, which adjusts the force with which the transmission unit 42 presses the holding unit 37, may be configured to adjust the compression amount of the compression spring 42e. The operating unit 41 adjusts the compression amount of the compression spring 42e, thereby adjusting the pressing force of the holding unit 37 against the solder sucker 1. In this case, the displacement driving unit 47 may include, for example, a cam 47a, and the rotation of the cam 47a may displace the holding unit 37. The cam 47a may be electrically connected to the control unit 30 to move the holding unit 37 in conjunction with the cutter 20, or may be configured to rotate manually rather than being controlled by the control unit 30.

[0093] In the above embodiment, the interlocking portion 39 includes the leaf spring portion 39a provided separately from the cutter 20, but this is not limited thereto. For example, as shown in FIG. 16 , a coupling portion 49 that couples the holding portion 37 to the first arm 21, or a coupling portion 49 that is sandwiched between the lever 29 and the first arm 21, may be provided. In this case, when the lever 29 is actuated and the first arm 21 is displaced so that the blades 21a and 22a approach each other, the coupling portion 49 moves integrally with the first arm 21. As a result, the holding portion 37 is displaced so as to advance into the insertion opening 13. In this case, the operating portion 41 for adjusting the pressing force of the holding portion 37 on the solder sucker 1 may be configured to adjust the compression amount of a compression spring 42e connected to the connection between the holding portion 37 and the coupling portion 49.

[0094] In addition, if there is no need to accurately adjust the cutting length of the solder sucker 1 to the extent that it is not required that the solder sucker 1 does not shift position when cutting, the holding portion 37 can be omitted.

[0095] 2 shows the housing 11 placed with the insertion opening 12 facing upward, i.e., with the top surface 11a facing upward, but the housing 11 may be placed with the insertion opening 12 facing to the side. In this case, the solder sucker 1 is inserted into the insertion opening 12 while moving it to the side to perform cutting.

[0096] In the above embodiment, the receiving portion 11c is configured by the side surface portion 11b of the housing 11, but this is not limiting. For example, the receiving portion 11c may be configured by a member arranged along the inside of the side surface portion 11b of the housing 11, rather than being a part of the housing 11. In this case, the holding portion 37 is not limited to being movable, and the receiving portion 11c may also be configured to be movable.

[0097] In the above embodiment, the cutter driving unit 27 is configured by the cam mechanism 28 and the lever 29, but this is not limiting. For example, the cutter driving unit 27 can be configured by a cylinder. In this case, the cylinder can be driven to move the cutter 20 to the open position, cutting position, and stop position. [Explanation of symbols]

[0098] 1: Solder sucker 10: Cutting device 11: Housing 11c: Receiving part 14: Guide 16: Cutting piece insertion section 20: Cutter 21: 1st arm 21a :Blade 22:Second arm 22a: Blade 24: Sensor 26: Starting section 27: Cutter drive unit 28: Cam mechanism 29: Lever 30: Control section 37: Holding part 39: Interlocking part 39a: Leaf spring part 39c:Action part 39e: Engagement part 40: Switching section

Claims

1. A cutting device for cutting a solder sucker, comprising: a cutter having a pair of blades; a start-up unit including a sensor or a switch, which outputs a start-up command when the sensor is in a detection state or when a predetermined operation is performed on the switch; a cutter driver operable to apply a force to the cutter to cut the solder wick; a control unit electrically connected to the activation unit and activating the cutter driving unit upon receiving the activation command; A cutting device comprising:

2. 2. The cutting device according to claim 1, further comprising a holding portion and a receiving portion that sandwich and hold the solder wick when the solder wick is cut by the pair of blades.

3. The cutting device according to claim 2 , further comprising a linking unit that links movement of the holding unit with operation of the cutter by the cutter driving unit.

4. the interlocking portion includes a leaf spring portion and an action portion that is biased in a direction in which the pair of blades close by a spring force of the leaf spring portion, The action portion is displaced by the spring force in accordance with the pair of blades moving in the closing direction, The cutting device according to claim 3 , wherein the holding portion is configured to advance toward the receiving portion as the action portion is displaced.

5. The present invention further includes a switching unit that can switch the state of the interlocking unit between an interlocking state in which the holding unit is interlocked with the operation of the cutter by the cutter driving unit and a disconnected state in which the holding unit is not interlocked with the operation of the cutter by the cutter driving unit, The cutting device of claim 4, wherein the action portion is in a position where it is not pressed against the pair of blades when the switching portion is switched to the disconnecting state and the leaf spring portion is in a natural state where it does not generate spring force, and the action portion is in a position where it is pressed against the pair of blades when the switching portion is switched to the interlocking state and the leaf spring portion is in an elastically deformed state where it generates spring force.

6. The cutter has a pair of arms, the interlocking portion has an engaging portion that can engage with one of the pair of arm portions, The cutting device according to claim 4 , wherein the holding portion protrudes toward the receiving portion beyond one of the pair of blades that is provided on the one arm when the engaging portion is engaged.

7. 7. A cutting device as claimed in any one of claims 1 to 6, wherein the cutter drive unit includes a cam mechanism that operates in accordance with control by the control unit based on the start-up command, and a lever that applies a force to the cutter to cut the solder sucker by operating the cam mechanism.

8. The cutter is disposed in a position in which the width direction of the pair of blades faces the vertical direction and the pair of blades operate in a horizontal direction, The sensor is disposed above the pair of blades, 7. The cutting device according to claim 1, further comprising a cutting piece receiving portion disposed below the gap between the pair of blades and configured to receive the cutting piece of the solder sucker.

9. The device further includes a housing that houses at least the cutter.

2. The cutting device according to claim 1, wherein the housing is provided with a tapered guide that guides the solder sucker toward the space between the pair of blades when the solder sucker is moved.

10. The cutting device according to claim 2 , further comprising a housing having the receiving portion and accommodating at least the cutter.

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