Coating exfoliating method and coating exfoliating device

Abstract

To provide a coating exfoliating method and a coating exfoliating device capable of uniformly exfoliating a wire coating at both a wire width direction end part and a wire width direction center part.SOLUTION: A coating exfoliating method exfoliates coating from a wire 100 using laser light L while moving the wire 100 in a feed direction D relative to a laser irradiation device 10. A spot area K of the laser light L is moved along the feed direction D.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] The present invention relates to a coating stripping method and a coating stripping device. [Background technology]

[0002] The coating stripping method described in Patent Document 1 discloses a method of removing an insulating coating of an electric wire by irradiating the insulating coating with a laser beam. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-158819 Summary of the Invention [Problem to be solved by the invention]

[0004] As a method for stripping the insulating coating of an electric wire, a method of irradiating the wire with laser light, as described in Patent Document 1, is known.

[0005] However, when the insulating coating is peeled off by moving the spot area of ​​the laser light back and forth between one end and the other end of the wire in the width direction, uneven peeling of the wire can occur at the end and center of the wire in the width direction. The following may be one of the reasons for the unevenness of the stripping of the wire. Specifically, when stripping the coating while moving the laser spot area back and forth between one end and the other end of the wire in the width direction, the moving speed of the laser spot area slows down before and after the turning point of the spot area near the end of the wire in the width direction. In such a case, depending on the degree of deceleration, a large difference may occur between the irradiation time of the laser light per unit area at the center of the wire in the width direction and the irradiation time of the laser light per unit area near the end of the wire in the width direction, which may result in the wire being irradiated with more laser light than necessary near the end of the wire in the width direction, causing scorching.

[0006] Therefore, an object of the present disclosure is to provide a coating stripping method and a coating stripping device that can uniformly strip the coating from the ends and center of the wire in the width direction. [Means for solving the problem]

[0007] A coating stripping method according to one aspect of the present invention includes: A coating stripping method for stripping a coating of a wire rod by using a laser beam while moving the wire rod in a feed direction relative to a laser irradiation device, The spot area of ​​the laser light is moved along the feed direction.

[0008] Furthermore, a coating stripping device according to one aspect of the present invention includes: A coating stripping device that strips a coating from a wire rod by laser light while moving the wire rod in a feed direction relative to a laser irradiation device, The laser irradiation device a laser light source unit that outputs laser light; a scanning unit that scans the wire with a spot area of ​​the laser light; a control unit that controls the scanning unit, The control unit controls the scanning unit to move the spot area along the feeding direction of the wire. [Effects of the Invention]

[0009] According to the present disclosure, it is possible to provide a coating stripping method and a coating stripping device that can uniformly strip the coating of a wire rod from both the widthwise ends and the widthwise center of the wire rod. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a schematic diagram of a coating stripping device for carrying out a coating stripping method according to this embodiment. [Figure 2] FIG. 2 is a block diagram of a laser irradiation device according to the present disclosure. [Figure 3]FIG. 3 is a schematic diagram of a galvano-optical system according to the embodiment. [Figure 4] Figure 4 shows the state of the wire immediately after the start of the first irradiation step (top) and the trajectory of the spot area (bottom). [Figure 5] FIG. 5 shows the state of the wire at the end of the first irradiation step (top) and the trajectory of the spot area (bottom). [Figure 6] FIG. 6 is a diagram showing a process of stripping a coating from a wire by the coating stripping device according to the embodiment. [Figure 7] FIG. 7 shows the state of the wire immediately after the start of the second irradiation step (top) and the trajectory of the spot area (bottom). [Figure 8] FIG. 8 shows the state of the wire at the end of the second irradiation step (top) and the trajectory of the spot area (bottom). [Figure 9] FIG. 9 is a diagram showing a process of stripping a coating from a wire by the coating stripping device according to the embodiment. [Figure 10] FIG. 10 is a diagram showing the coating stripping process after the first phase is completed and before the second phase is started. [Figure 11] FIG. 11 is a diagram showing a process of stripping a wire using the stripping device according to the embodiment. [Figure 12] FIG. 12 is a diagram showing a process of stripping a coating from a wire by the coating stripping device according to the embodiment. [Figure 13] FIG. 13 is a diagram showing the irradiation locus of the laser light from the start of the first phase to the end of the second phase. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that, for the sake of convenience of explanation, the dimensions of each component shown in the drawings may differ from the actual dimensions of each component.

[0012] FIG. 1 is a schematic diagram of a coating stripping apparatus that performs a coating stripping method according to this embodiment. As shown in FIG. 1, the coating stripping apparatus 1 includes a laser irradiation device 10 and a conveying device 200. The conveying device 200 has a pair of rollers around which a wire 100 having an insulating coating is wound. In this embodiment, the wire 100 is a coated wire having a central conductor and an insulating coating. The conveying device 200 can feed the wire 100 from one roller to the other along a feed direction D.

[0013] The laser irradiation device 10 irradiates the wire 100 with laser light L, thereby removing the insulating coating of the wire 100. The laser irradiation device 10 scans the laser light L along the feeding direction of the wire 100.

[0014] Next, the laser irradiation device 10 according to the present disclosure will be described in detail with reference to Figures 2 and 3. Figure 2 is a block diagram of the laser irradiation device 10 according to the present disclosure. Figure 3 is a schematic diagram of a galvano optical system 30 according to an embodiment. As shown in Figure 2, the laser irradiation device 10 includes a laser light source 20, a galvano optical system 30, a control unit 40, a feed speed acquisition unit 41, a wire width input unit 42, and a peeling length input unit 43.

[0015] The laser light source 20 is an oscillator capable of emitting laser light L (see FIG. 1). In this embodiment, the laser light source 20 is capable of emitting laser light having a wavelength of, for example, 400 to 470 nm. Depending on the material of the object to be removed, for example, a laser light source 20 capable of emitting laser light L having a wavelength ranging from 354 nm, which is the wavelength of a UV laser, to 1064 nm, which is the wavelength of an IR laser, may be used.

[0016] The galvano optical system 30 can displace the laser light L emitted from the laser light source 20 in any two-dimensional direction. As shown in FIG. 3 , the galvano optical system 30 has an X-axis galvano scanner 31, a Y-axis galvano scanner 32, and a mirror 33.

[0017] The X-axis galvanometer scanner 31 has an X-axis galvanometer mirror 31a and an X-axis galvanometer motor 31b. The X-axis galvanometer mirror 31a is fixed to the output shaft of the X-axis galvanometer motor 31b. By driving the X-axis galvanometer motor 31b, the orientation of the X-axis galvanometer mirror 31a changes.

[0018] The Y-axis galvanometer scanner 32 also has a Y-axis galvanometer mirror 32a and a Y-axis galvanometer motor 32b. The Y-axis galvanometer mirror 32a is fixed to the output shaft of the Y-axis galvanometer motor 32b. By driving the Y-axis galvanometer motor 32b, the orientation of the Y-axis galvanometer mirror 32a changes.

[0019] The laser light L emitted from the laser light source 20 is reflected by the X-axis galvanometer mirror 31 a and the Y-axis galvanometer mirror 32 a, and then guided to the wire 100 by the mirror 33 .

[0020] The control unit 40 can control the laser light source 20 and the galvanometer optical system 30. More specifically, the control unit 40 can control the on / off of the emission of the laser light L emitted from the laser light source 20. Furthermore, the control unit 40 controls the X-axis galvanometer motor 31b and the Y-axis galvanometer motor 32b to change the angles of the X-axis galvanometer mirror 31a and the Y-axis galvanometer mirror 32a, thereby changing the irradiation position of the laser light L and the moving speed of the irradiation position.

[0021] The feed speed acquisition unit 41 can acquire the feed speed of the wire rod 100. The feed speed acquisition unit 41 can be configured to acquire the output of a feed speed sensor (not shown) that detects the feed speed of the wire rod 100, or to acquire the rotation speed of the rollers. Alternatively, the feed speed acquisition unit 41 can acquire the feed speed input by the operator.

[0022] The wire width input unit 42 allows an operator to arbitrarily input the width direction length of the wire 100 to be irradiated with the laser light L. Alternatively, the wire width input unit 42 can acquire the width direction length of the wire 100 from a sensor or the like that detects the width direction length of the wire 100.

[0023] The stripping length input unit 43 allows an operator to arbitrarily input the length of the coating to be stripped from the wire 100. The wire width input unit 42 and the stripping length input unit 43 can be configured to acquire signals output from an input device such as a keyboard or touch panel operated by the operator.

[0024] The feed speed acquisition unit 41, the wire width input unit 42, and the peeling length input unit 43 are connected to the control unit 40. The control unit 40 controls the laser light source 20 and the galvano optical system 30 based on the information obtained from the feed speed acquisition unit 41, the wire width input unit 42, and the peeling length input unit 43.

[0025] Next, the coating stripping method of the coating stripping device 1 according to this embodiment will be described in detail with reference to Figures 4 to 12. Figures 4 to 12 are views showing the process of stripping the coating from the wire 100 by the coating stripping device 1 according to this embodiment.

[0026] 4 to 12 show the process of stripping the coating of the wire 100. In each of the figures, a coated region 101 where the coating has not been removed and a stripped region 102 where the coating has been removed are depicted in a distinguishing manner. In each figure, the stripped region 102 is hatched.

[0027] In the coating stripping method according to this embodiment, the laser irradiation device 10 strips the coating by irradiating the coated region 101 with laser light L, thereby exposing the conductor portion of the wire 100 to form a stripped region 102.

[0028] 4 to 12 show in the upper part of the drawing how the coating is peeled off from the wire 100. The lower part of the drawing shows the irradiation trajectory of the laser light L as seen from the laser irradiation device 10. The manner in which the laser light L is irradiated onto the wire 100 shown in the upper part corresponds to the irradiation trajectory of the laser light from the laser irradiation device 10 shown in the lower part. More specifically, the upper parts of FIGS. 4 to 12 show in time series how the laser light irradiated from the laser irradiation device 100 is irradiated onto the wire 100 moving in the feed direction D in order to peel off the coating of the wire 100. Meanwhile, the lower parts of FIGS. 4 to 12 show in time series the irradiation trajectory of the laser light emitted from the laser irradiation device 100 when the irradiation state of the laser light onto the wire 100 shown in the upper part is realized. In this embodiment, the coating of a coated region 101 on the wire 100, which is defined by a start line W1 and an end line W2, is removed by laser light L.

[0029] The coating stripping device 1 according to this embodiment can perform a first irradiation step, a width-feeding step, and a second irradiation step, and strips the coating from the wire 100 by repeating these steps. After performing the second irradiation step, the coating stripping device 1 performs the first irradiation step again. From the start of the first irradiation step to the end of the second irradiation step, the laser irradiation device 10 irradiates the wire 100 with laser light L, focusing it on the range of a spot region K. In the first irradiation step and the second irradiation step, the laser irradiation device 10 moves the spot region K relative to the wire 100 at a constant speed S1.

[0030] [First irradiation process] The first irradiation step according to this embodiment will be described with reference to Figures 4 and 5. Figure 4 shows the state of the wire 100 immediately after the start of the first irradiation step (upper row) and the trajectory of the spot area K (lower row). In the first irradiation step, the laser irradiation device 10 irradiates the first irradiation area A1 of the wire 100 with laser light L while moving the spot area K along the feed direction D of the wire 100. The first irradiation area A1 is an area on the surface of the wire 100 that is equal to the diameter of the spot area K in the width direction of the wire 100 and has a peeling length in the feed direction.

[0031] In the first irradiation step, the moving speed of the spot area K relative to the wire 100 is S1. The laser irradiation device 10 adjusts the relative speed of the spot area K to S1 by moving the spot area K at a speed S3 relative to the wire 100 which is fed at a speed S2. The moving speed S1 is the relative moving speed of the spot area K to the wire 100 which is fed at the feed speed S2. When the feed direction D of the wire 100 is taken as positive, the speeds S1 to S3 satisfy the relational expression S1=S3-S2.

[0032] FIG. 5 shows the state of the wire 100 at the end of the first irradiation step (top row) and the trajectory of the spot area K (bottom row). As shown in the top row, at the end of the first irradiation step, the laser irradiation device 10 has finished removing the coating from the first irradiation area A1. Note that, as shown in the bottom row of FIG. 5, the length of the trajectory T1 along which the laser irradiation device 10 actually moves the spot area K is longer than the first irradiation area A1. This is because, even though the irradiation time of the laser light L is the same, the first scanning speed S3 at which the laser irradiation device 10 moves the spot area K is faster than the speed S1 at which the spot area K moves on the wire 100 (S3>S1).

[0033] [Width feed process] Next, the width feeding process will be described with reference to Fig. 6. Fig. 6 shows the state of the wire 100 during the width feeding process (upper part) and the trajectory of the spot area K (lower part). During the width feeding process, the laser irradiation device 10 moves the irradiation position of the laser light L while stopping the emission of the laser light L. In the following description, the pseudo spot area K in the state where the laser light L is not irradiated will be represented in the figure as the intended irradiation position E.

[0034] In the width feeding step, on the wire 100 (see the upper part of FIG. 6), the intended irradiation position E is moved so as to cross perpendicularly to the feeding direction. The trajectory along which the laser irradiation device 10 actually moves the intended irradiation position E needs to be moved taking into account the feed speed of the wire 100 so that the intended irradiation position crosses perpendicularly on the wire 100. Therefore, as shown in the lower part of FIG. 6, the intended irradiation position E is moved in a direction that is a combination of the direction along the width direction of the wire 100 and the feed direction of the wire 100.

[0035] [Second irradiation process] Next, the second irradiation step will be described with reference to Fig. 7 and Fig. 8. Fig. 7 shows the state of the wire 100 immediately after the start of the second irradiation step (upper row) and the trajectory of the spot area K (lower row). In the second irradiation step, the laser irradiation device 10 irradiates the second irradiation area A2 of the wire 100 with laser light L while moving the spot area K in the direction opposite to the feed direction D of the wire 100. The second irradiation area A2 is an area adjacent to the first irradiation area A1 in the width direction and has the same length and width as the first irradiation area A1.

[0036] The moving speed of the spot area K on the wire 100 in the second irradiation step is S1, the same as in the first irradiation step. The laser irradiation device 10 moves the spot area K at a second scanning speed S4 in the direction opposite to the feeding direction D of the wire 100, relative to the wire 100 being fed at a speed S2, thereby adjusting the relative speed of the spot area K to S1. When the feeding direction of the wire 100 is defined as positive, the speeds S1, S2, and S4 satisfy the relational expression S1=S2+S4.

[0037] FIG. 8 shows the state of the wire 100 at the end of the second irradiation step (top row) and the trajectory of the spot area K (bottom row). As shown in the top row, at the end of the second irradiation step, the laser irradiation device 10 has finished removing the coating from the second irradiation area A2. As shown in the bottom row, the trajectory T2 along which the laser irradiation device 10 actually moves the spot area K is shorter than the second irradiation area A2. This is because the second scanning speed S4 at which the spot area K actually moves is slower than the speed S1 at which the spot area K moves on the wire 100 (S4 <S1)。

[0038] Fig. 9 shows the state where the laser beam L has been irradiated onto the entire region defined by the start line W1 and the end line W2. As shown in Fig. 9, the peeling region 102 on the wire 100 has a rectangular shape along the width direction of the wire 100, whereas the trajectory T1 of the spot region K moved by the laser irradiation device 10 becomes stepped until the laser beam L has been irradiated onto the entire region defined by the start line W1 and the end line W2.

[0039] According to the coating stripping method of the present disclosure, the coating of the wire 100 is stripped with laser light L while the wire 100 is moved in the feed direction D relative to the laser irradiation device 10, and the spot area K of the laser light L is moved along the feed direction D. With this configuration, the irradiation speed of the laser light L is the same at the center and ends of the wire 100 in the width direction, so that the coating can be stripped evenly at all locations on the wire 100. This makes it possible to provide a coating stripping method and a coating stripping device that can strip the coating of a wire uniformly at the ends and center of the wire in the width direction.

[0040] In the coating stripping method according to the present disclosure, the second scanning speed S4 of the laser light L in the second irradiation step may be smaller than the first scanning speed S3 of the laser light L in the first irradiation step, and the difference between the first scanning speed S3 and the second scanning speed S4 may be determined based on the feed speed S2 of the wire rod 100. According to this configuration, the first scanning speed S3 and the second scanning speed S4 are determined based on the feed speed S2 of the wire rod 100, which makes it easy to control the laser irradiation device 10.

[0041] Furthermore, in the coating stripping method according to the present disclosure, the relative speed of the first scanning speed S3 with respect to the feed speed S2 may be the same as the relative speed of the second scanning speed S4 with respect to the feed speed S2. This configuration makes it possible to suppress unevenness in the degree of coating stripping across the entire region irradiated with the laser light.

[0042] Furthermore, according to the coating stripping method of the present disclosure, the time for irradiating the laser light L in the first irradiation step may be the same as the time for irradiating the laser light in the second irradiation step. This configuration allows the area irradiated with the laser light in the first irradiation step to be the same as the area irradiated with the laser light in the second irradiation step. This makes it possible to provide an efficient coating stripping method.

[0043] Although the coating stripping method according to the present disclosure has been described above, the coating stripping method according to the present disclosure is not limited thereto. For example, the coating stripping method according to the present disclosure may be configured to irradiate a region that has already been irradiated with laser light L again. That is, the coating stripping method according to the present disclosure may have a first phase in which the first irradiation step through the second irradiation step are repeated while moving the spot region K from one end of the wire 100 in the width direction to the other end, and a second phase in which the direction of movement of the width feed step is reversed from the other end of the wire 100 in the width direction to the one end, and the first irradiation step through the second irradiation step are repeated while moving the spot region K.

[0044] In the following description, a "second phase" will be described in which the region irradiated with the laser light L in the peeling step (first phase) described with reference to FIGS. 4 to 9 is irradiated with the laser light L again.

[0045] FIG. 10 is a diagram showing the coating stripping process after the end of the first phase and before the start of the second phase. After the end of the first phase, the laser irradiation device 10 stops irradiating the laser light L and moves the intended irradiation position E to the start position of the second phase. In the example shown in FIG. 10, the laser irradiation device 10 moves the intended irradiation position E along the feed direction D of the wire 100 at a moving speed S5 (see the lower part of FIG. 10). As a result, the intended irradiation position E on the wire 100 moves in the direction opposite to the feed direction D at a relative moving speed S6 (see the upper part of FIG. 10). When the feed direction of the wire 100 is taken as positive, the speeds S2, S5, and S6 satisfy the relational expression S6=S2-S5.

[0046] 10, the trajectory T2 drawn by the planned irradiation position E is configured to be extended from the trajectory T1 drawn in the first phase. In this example, the second phase starts from a state in which the planned irradiation position E is positioned on the start line W1.

[0047] When the coating of the wire 100 is peeled off by irradiating the wire 100 with the laser light L multiple times, there is a concern that the surface of the wire 100 may become hot if the interval between the first and second irradiations is too short. Therefore, when the region irradiated in the first phase is irradiated with the laser light again in the second phase, it is desirable to provide a certain cooling time between the first and second phases.

[0048] In this embodiment, the cool-down time is the time during which the intended irradiation position E is moved after the first phase ends and before the second phase starts. This makes it possible to prevent the surface of the wire 100 from being burned. From the viewpoint of the cooling speed of the wire 100, it is desirable to provide the cool-down time of at least 1 ms. For example, in the example shown in FIG. 10, it is desirable to set the relative movement speed S6 of the intended irradiation position E so that the time required for the intended irradiation position E to finish moving from the end line W2 to the start line W1 is 1 ms or more.

[0049] Next, the irradiation mode of the laser beam L in the second phase will be described with reference to Fig. 11. In the second phase, the irradiation speed S1 of the laser beam L is the same as the irradiation speed in the first phase. In the second phase, the laser irradiation device 10 scans the spot area K at a first scanning speed S3, thereby maintaining the moving speed of the spot area K relative to the wire 100 fed at the feed speed S2 at S1.

[0050] 10 has been described as an example in which the planned irradiation position E of the laser irradiation device 10 moves along the feed direction D from the end of the first phase to the start of the second phase, but the present disclosure is not limited to this. For example, as shown in Fig. 12, after the end of the first phase, the laser irradiation device 10 may move the planned irradiation position E in a direction transverse to the feed direction of the wire 100 and then start irradiating the laser light L in the second phase. In the example shown in Fig. 12, after the end of the first phase, the laser irradiation device 10 moves the planned irradiation position E in the width direction of the wire 100 and starts irradiating the laser light L in the second phase.

[0051] According to the above-described configuration, the wire 100 can be irradiated with the laser light L multiple times without moving the laser irradiation device 10. Moreover, there is no need to provide multiple laser irradiation devices in order to irradiate the wire 100 with the laser light L multiple times. Therefore, the efficiency of coating peeling can be improved and the configuration can be made more cost-effective than conventional configurations.

[0052] 13 is a diagram showing the irradiation trajectory of the laser beam L from the start of the first phase to the end of the second phase. Since the irradiation of the laser beam L according to this embodiment is performed while feeding the wire 100, the movement range of the spot area K tends to be wide in the feeding direction of the wire 100. In the above-described embodiment, it is desirable that the movement trajectory of the spot area K of the laser beam L from the first phase to the second phase falls within the irradiation range of the laser irradiation device 10 when viewed from the laser irradiation device 10. In the example shown in FIG. 13, the distance H from the location L1 where the irradiation of the laser beam L starts to the location L2 where the irradiation of the laser beam ends falls within the irradiation range of the laser irradiation device 10.

[0053] The irradiation range of the laser beam L can also be determined from the irradiation time of the laser beam L and the feed speed of the wire 100. In the coating stripping method according to the present disclosure, the total feed length calculated by multiplying the sum of the time required for the first phase, the time required for the second phase, and the cool down time by the feed speed is preferably set to be smaller than the maximum irradiation range of the laser irradiation device 10. In the example shown in Fig. 13, the total feed length H calculated by multiplying the time required for movement along the locus T1, the time required for movement along the locus T2, and the time required for movement along the locus T3 by the feed speed S2 of the wire 100 is smaller than the maximum irradiation range of the laser irradiation device 10. [Explanation of symbols]

[0054] 1 Coating stripping device 10 Laser irradiation device 20 Laser light source 30 Galvano Optical System 31 X-axis galvanometer scanner 31a X-axis galvanometer mirror 31b X-axis galvanometer motor 32 Y-axis galvanometer scanner 32a Y-axis galvanometer mirror 32b Y-axis galvanometer motor 33 Mirror 40 Control Unit 41 Speed ​​acquisition section 42 Wire rod width input section 43 Peel length input section 100 wire rod 101 Covered Area 102 Peeling area 200 Conveyor W1 start line W2 Finish Line A1 First irradiation area A2 Second irradiation area S1 irradiation speed S2 feed rate S3 First scanning speed S4 Second scanning speed S5 Movement speed S6 Relative movement speed

Claims

1. A coating stripping method for stripping a coating of a wire rod by using a laser beam while moving the wire rod in a feed direction relative to a laser irradiation device, The coating stripping method includes moving the spot area of ​​the laser light along the feed direction.

2. a first irradiation step of irradiating a first irradiation region on the wire with the laser light along the feeding direction; a width-feeding step of moving the spot area in a width direction intersecting with the feed direction after the first irradiation step; 2. The coating stripping method according to claim 1, further comprising: a second irradiation step of irradiating a second irradiation area adjacent to the first irradiation area in the width direction with the laser light in a return direction opposite to the feed direction after the width feed step.

3. a second scanning speed of the laser light in the second irradiation step is smaller than a first scanning speed of the laser light in the first irradiation step; The coating stripping method according to claim 2 , wherein the difference between the first scanning speed and the second scanning speed is determined based on a feed speed of the wire.

4. The relative speed of the first scanning speed with respect to the feed speed is the relative speed of the second scanning speed to the feed speed is the same as The coating stripping method according to claim 3.

5. The time for irradiating the laser light in the first irradiation step is The coating stripping method according to claim 4 , wherein the laser light irradiation time is the same as that in the second irradiation step.

6. a first phase in which the first irradiation step and the second irradiation step are repeated while moving the spot area from one end to the other end in the width direction of the wire; and a second phase in which the direction of movement of the width feed process is reversed from the other end of the wire in the width direction to the one end, and the first irradiation process and the second irradiation process are repeated while moving the spot area.

7. a first phase in which the first irradiation step and the second irradiation step are repeated while moving the spot area from one end to the other end in the width direction of the wire; 3. The coating stripping method according to claim 2, further comprising: a second phase in which, after completion of the first phase, the irradiation spot area is moved to one end of the wire in the width direction, and then the first irradiation step to the second irradiation step are repeated while moving the spot area from one end of the wire in the width direction to the other end of the wire in the same manner as in the first phase.

8. 8. The coating stripping method according to claim 6, wherein a cool down time of at least 1 ms is provided between the first phase and the second phase.

9. 9. The coating stripping method according to claim 8, wherein a movement trajectory of the spot region of the laser light from the first phase to the second phase is within an irradiation range of the laser irradiation device when viewed from the laser irradiation device.

10. The total feed length calculated by multiplying the sum of the time required for the first phase, the time required for the second phase, and the cool down time by the feed rate is: The coating stripping method according to claim 9 , wherein the irradiation range is set to be smaller than the maximum irradiation range of the laser irradiation device.

11. A coating stripping device that strips a coating from a wire rod by laser light while moving the wire rod in a feed direction relative to a laser irradiation device, The laser irradiation device a laser light source unit that outputs laser light; a scanning unit that scans the wire with a spot area of ​​the laser light; a control unit that controls the scanning unit, The control unit controls the scanning unit to move the spot area along the feeding direction of the wire.

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