Pressurization device

Abstract

To provide a pressurization device capable of changing a temperature gradient during heating and / or cooling of a work.SOLUTION: A pressurization device 1 comprises a first mold unit 4 and a second mold unit 5. The second mold unit includes a plurality of heat pipes 7, a mold main body part 6 to which the plurality of heat pipes is fixed and which is disposed between a work and the first mold unit while the work is heated or cooled, and a heat source unit 8, 9 capable of heating or cooling a corresponding heat pipe in the plurality of heat pipes. Each of the heat pipes includes a protruding end portion 7a, 7b protruding from the mold main body part in a horizontal direction. The heat source unit includes a plurality of abutment parts 80b, 81b, 90b and 91b which can be moved to the protruding end portions and abutted to the corresponding protruding end portions and abutment switching parts 84 and 94 which switch abutment and separation of the abutment parts to and from the protruding end portions.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a pressure device. [Background technology]

[0002] Conventionally, pressure devices have been used to apply pressure to objects to be pressed (hereinafter referred to as "workpieces"), such as electronic components. For example, a pressure device disclosed in Patent Document 1 includes upper and lower pressure units, which clamp and pressurize the workpiece. The pressure device heats the workpiece using a heater provided in the lower pressure unit. The heater is located inside the mold. In this pressure device, after the workpiece has been pressurized and heated, it is cooled while still in contact with the mold. The mold has a structure that can withstand pressure so that the heater does not apply a large pressure. Therefore, the mold has a large volume and a large heat capacity. Therefore, the heating and cooling times of the workpiece are long. In other words, the temperature change rate during heating and cooling of the workpiece is relatively small (gradual).

[0003] On the other hand, in the pressure application device disclosed in Patent Document 2, the lower pressure application unit includes a heating unit that is constantly heated and a cooling unit that is constantly cooled. The heating unit and the cooling unit are configured to be movable relative to the upper pressure application unit that holds the workpiece, and are switched appropriately depending on the progress of the pressure application process. As a result, the time required to switch between heating and cooling by the lower pressure application unit is shortened, and the heating time and cooling time of the workpiece are also shortened. In other words, the temperature change rate during heating and cooling of the workpiece becomes larger (steeper). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-296746 [Patent Document 2] Japanese Patent Application Publication No. 2017-199812 Summary of the Invention [Problem to be solved by the invention]

[0005] In this way, each pressure device has opposite characteristics in the temperature gradient (heating time and cooling time) when heating and cooling the workpiece, but the temperature change rate (heating time and cooling time) when heating and cooling the workpiece is unpredictable and difficult to control.

[0006] An object of the present invention is to provide a pressure device that can control the rate of temperature change when a workpiece is heated and / or cooled. [Means for solving the problem]

[0007] In one embodiment of the present invention, a pressure applying device is a pressure applying device that applies pressure to a workpiece, and comprises: a first mold unit that is arranged below the workpiece and is capable of heating or cooling the workpiece; and a second mold unit that is capable of heating or cooling the workpiece together with the first mold unit, wherein the second mold unit comprises a plurality of heat pipes, a mold main body portion to which the plurality of heat pipes are fixed and that is arranged between the workpiece and the first mold unit when the workpiece is heated or cooled, and a heat source unit that is capable of heating or cooling corresponding heat pipes among the plurality of heat pipes, wherein each of the heat pipes has a protruding end portion that protrudes horizontally from the mold main body portion, and the heat source unit is movable relative to each of the protruding end portions and comprises a plurality of abutment portions that can abut against the corresponding protruding end portions, and an abutment switching portion that switches between abutment and separation of the abutment portions against the protruding end portions. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a pressurizing device that can change the temperature gradient when heating and / or cooling a workpiece. [Brief explanation of the drawings]

[0009] [Figure 1]1 is a schematic cross-sectional view of a pressure device showing an embodiment of the pressure device according to the present invention. [Figure 2] 2 is a schematic cross-sectional view of the device taken along the arrow A in FIG. 1. [Figure 3] FIG. 3 is a schematic plan view of a second mold unit of the pressure device. [Figure 4] 4 is a schematic view of the first heat source unit of the second mold unit as viewed from the arrow B in FIG. 3. [Figure 5] 4 is a schematic view of a second heat source unit of the second mold unit as viewed from the arrow C in FIG. 3. FIG. [Figure 6] 3 is a schematic cross-sectional view of the pressurizing device, showing a state in which a workpiece is accommodated in an accommodation chamber of the pressurizing device. FIG. [Figure 7] FIG. 2 is a schematic cross-sectional view of the pressure device, showing a state in which a heated mold unit and a main body of the pressure device are positioned at a processing position. [Figure 8] 8 is a schematic cross-sectional view of the pressure device as seen from the arrow D in FIG. 7. [Figure 9] FIG. 4 is a schematic cross-sectional view of the pressurizing device, showing a state in which a chamber unit of the pressurizing device is lowered. [Figure 10] 10 is a timing chart showing an example of temperature changes in a workpiece, the heating mold unit, and the main body when the workpiece is heated. [Figure 11] FIG. 4 is a schematic cross-sectional view of the pressure applying device, showing a state in which a first clamp member of the pressure applying device has moved to a clamping position. [Figure 12] 10 is a schematic cross-sectional view of the pressure device, showing a state in which the first clamp member has moved to a non-clamping position. FIG. [Figure 13] FIG. 2 is a schematic cross-sectional view of the pressurizing device, showing a state in which a cooling mold unit of the pressurizing device has moved to a processing position. [Figure 14] 14 is a schematic cross-sectional view of the pressure device taken along the arrow E in FIG. 13. [Figure 15] FIG. 4 is a schematic cross-sectional view of the pressurizing device, showing a state in which the chamber unit is lowered. [Figure 16]10 is a timing chart showing an example of temperature changes in the workpiece, the cooling mold unit, and the main body portion when the workpiece is cooled. [Figure 17] 10 is a schematic cross-sectional view of the pressure device, showing a state in which the first clamp member has moved to a clamping position. FIG. [Figure 18] 10 is a schematic cross-sectional view of the pressure device, showing a state in which the first clamp member has moved to a non-clamping position. FIG. [Figure 19] FIG. 10 is a schematic diagram showing an example of an actual temperature change of a workpiece. [Figure 20] 10 is a schematic cross-sectional view of the pressure device, showing a state in which a second clamp member of the pressure device has moved to a clamping position when a workpiece is heated. FIG. [Figure 21] FIG. 4 is a schematic cross-sectional view of a pressure device showing another embodiment of the pressure device according to the present invention. [Figure 22] 22 is a schematic cross-sectional view of the pressure device as viewed from the arrow F in FIG. 21. [Figure 23] FIG. 2 is a schematic plan view of a heating mold unit of the pressure device. [Figure 24] FIG. 2 is a schematic plan view of a cooling mold unit of the pressurizing device. [Figure 25] FIG. 4 is a schematic cross-sectional view of the pressure applying device, showing a state in which a first clamp member of the pressure applying device has moved to a clamping position. [Figure 26] FIG. 1 is a schematic cross-sectional view of a pressure device, showing a first modified example of the pressure device according to the present invention. [Figure 27] (a) is a schematic plan view of a second mold unit showing a second modified example of a pressure device according to the present invention, (b) is a schematic plan view of a second mold unit showing a third modified example of a pressure device according to the present invention, and (c) is a schematic plan view of a second mold unit showing a fourth modified example of a pressure device according to the present invention. [Figure 28] FIG. 10(a) is a schematic plan view of a second mold unit showing a fifth modified example of a pressurizing device according to the present invention, and FIG. 10(b) is a schematic view of the pressurizing device as seen from the arrow G in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0010] An embodiment of a pressure device (hereinafter referred to as "the device") according to the present invention will be described below. In the following description, reference will be made to the drawings as appropriate. In the drawings, the same members and elements are designated by the same reference numerals, and duplicate explanations will be omitted. Furthermore, the dimensional proportions of the elements may be exaggerated for the sake of convenience, and are not limited to the proportions shown in the drawings.

[0011] In the following description and drawings, unless otherwise specified, when three mutually orthogonal axes in space are the X-axis, Y-axis, and Z-axis, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the up-down direction. The "X-axis direction" is the direction along the X-axis, the "+X direction" is one direction along the X-axis, and the "-X direction" is the other direction along the X-axis. The +X direction is an example of the first direction in the present invention, and the -X direction is an example of the second direction in the present invention. The "Y-axis direction" is the direction along the Y-axis, the "+Y direction" is one direction along the Y-axis, and the "-Y direction" is the other direction along the Y-axis. The "Z-axis direction" is the direction along the Z-axis and is the up-down direction. The "+Z direction" is the upward direction, and the "-Z direction" is the downward direction. The "XY direction" is the direction along the X-axis and Y-axis directions, and the "XY plane" is an imaginary plane parallel to the XY direction (horizontal direction). The "XZ direction" is a direction along the X-axis direction and the Z-axis direction, and the "XZ plane" is an imaginary plane parallel to the XZ direction (vertical direction).

[0012] In the following description, the lower surface is a surface that faces downward and is parallel to the X and Y directions, and the upper surface is a surface that faces upward and is parallel to the X and Y directions. In other words, the lower and upper surfaces are flat.

[0013] ●Pressure device (1)● ●Configuration of pressure device (1) FIG. 1 is a schematic cross-sectional view of the present device, showing an embodiment of the present device. FIG. 2 is a schematic cross-sectional view of the device taken along the arrow A in FIG. Fig. 1 shows a cross section of the device 1 along the YZ plane, where the device 1 is cut at its center in the X-axis direction (the same applies to Figs. 6, 7, 13, and 20). Fig. 2 shows a cross section of the device 1 along the XZ plane, where the device 1 is cut at its center in the Y-axis direction (the same applies to Figs. 8 to 11, 14 to 17, 21, and 24 to 26).

[0014] This device 1 applies pressure to the workpiece W by sandwiching it in the vertical direction. This device 1 includes a control device 2, a mounting plate 3, a first die unit 4, a second die unit 5, a base member 12, a side member 13, an upper die 14, a frame member 15, a pressure pad 16, a first spring member 17, a second spring member 18, two seal members 19 and 20, and a pump P. The mounting plate 3, the first die unit 4, and the second die unit 5 are positioned below the workpiece W and function as a lower pressure unit DP that applies pressure to the workpiece W from below. The base member 12, the side member 13, the upper die 14, the frame member 15, the pressure pad 16, the first spring member 17, the second spring member 18, and the two seal members 19 and 20 are positioned above the workpiece W and function as an upper pressure unit UP that applies pressure to the workpiece W from above.

[0015] The control device 2 controls the overall operation of the device 1. The control device 2 includes, for example, a processor such as a CPU (Central Processing Unit), a volatile memory such as a RAM (Random Access Memory) that functions as a work area for the CPU, a non-volatile memory such as a ROM (Read Only Memory) that stores various information such as control programs, and a storage unit that stores information necessary for the operation of the device 1 (for example, temperature profiles Pr1 and Pr2 described below: see FIGS. 12 and 18).

[0016] The mounting plate 3 is a member on which the workpiece W is placed, and defines a storage chamber R (see FIG. 6; the same applies below) to be described later. The mounting plate 3 is made of, for example, a metal (e.g., a copper alloy) with high thermal conductivity. The mounting plate 3 has a rectangular, plate-like shape extending along the XY-axis direction when viewed from above. The mounting plate 3 has an upper surface 3a and a lower surface 3b. The upper surface 3a is the mounting surface on which the workpiece W is placed.

[0017] The first mold unit 4 heats and cools the workpiece W. The first mold unit 4 includes a heating mold unit 40, a cooling mold unit 41, and a first unit transport device .

[0018] The heating mold unit 40 heats the workpiece W. The heating mold unit 40 is movable between a processing position below the upper pressure unit UP and a standby position spaced apart from the processing position in the horizontal direction (in this embodiment, the -Y direction). The heating mold unit 40 includes a main body 40a, a heat insulating member 40b, multiple heating sources 40c, and multiple cooling sources 40d.

[0019] The main body 40a contains a heating source 40c and a cooling source 40d. The main body 40a is made of, for example, a metal (e.g., carbon steel) having high rigidity. The main body 40a has a rectangular shape along the XY direction when viewed from the top and bottom, that is, a rectangular parallelepiped. The main body 40a has an upper surface 40e. The heat insulating member 40b is arranged to divide the main body 40a into two, upper and lower, parts. The heat insulating member 40b suppresses the downward transfer of heat from the heat source 40c. The heat source 40c heats the workpiece W. The heat source 40c is, for example, a known straight tubular heater. The heat source 40c is arranged inside the upper half of the main body 40a so as to be parallel to the Y-axis direction. The cooling source 40d is, for example, a straight tubular flow path through which a refrigerant flows to cool the lower half of the main body 40a. The refrigerant is cooled by a cooling device (not shown; the same applies below) and circulated between the cooling source 40d and the cooling device. The cooling source 40d is disposed inside the lower half of the main body 40a so as to be parallel to the Y-axis direction.

[0020] The cooling mold unit 41 cools the workpiece W. The cooling mold unit 41 is movable between a processing position below the upper pressure unit UP and a standby position spaced apart from the processing position in the horizontal direction (in this embodiment, the +Y direction). The cooling mold unit 41 includes a main body 41a and multiple cooling sources 41b.

[0021] The main body 41a protects the cooling source 41b. The main body 41a is made of, for example, a metal having high rigidity (for example, carbon steel). The main body 41a has a rectangular shape along the XY direction when viewed from the top and bottom, that is, a rectangular parallelepiped shape. The main body 41a has an upper surface 41c. The configuration of the cooling source 41b is the same as the configuration of the cooling source 40d. The cooling source 41b is arranged inside the main body 41a so as to be parallel to the Y-axis direction.

[0022] The first unit transport device 42 transports the heated mold unit 40 and the cooled mold unit 41 between a processing position and their respective standby positions. The first unit transport device 42 includes, for example, a known power source (e.g., a motor: not shown), a power transmission mechanism (e.g., a gear, a ball screw, etc.: not shown), and a rail (not shown).

[0023] The second mold unit 5 heats or cools the workpiece W together with the first mold unit 4 when the workpiece W is being heated or cooled. The second mold unit 5 also controls the heating time and temperature change rate when heating the workpiece W, and the cooling time and temperature change rate when cooling the workpiece W. The second mold unit 5 is separate from the first mold unit 4. The second mold unit 5 includes a main body 6, multiple heat pipes 7, a first heat source unit 8, a second heat source unit 9, multiple temperature measuring devices 10, and a second unit transport device 11.

[0024] The main body 6 protects the heat pipe 7. The main body 6 is made of, for example, a highly rigid metal (e.g., carbon steel). The main body 6 has a rectangular shape extending along the XY direction when viewed from above and below, and is a rectangular parallelepiped. The main body 6 has a strength sufficient to withstand the main pressure force described below, and a thickness sufficient to reduce the heat capacity of the main body 6 during heating and cooling of the workpiece W. The volume of the main body 6 is smaller than the volume of the main body 40a, 41a (e.g., 1 / n: n is an integer of 2 or greater), and the heat capacity of the main body 6 is smaller than the heat capacity of the main body 40a, 41a. The main body 6 is movable between a processing position below the upper pressure unit UP and a standby position spaced apart from the processing position in the horizontal direction (in the -Y direction in this embodiment). The main body 6 is an example of a mold main body in the present invention. The main body 6 has an upper surface 6a, a lower surface 6b, a plurality of (six in this embodiment) insertion holes 6c, and a plurality of (three in this embodiment) insertion holes 6d.

[0025] FIG. 3 is a schematic plan view of the second mold unit 5. As shown in FIG. This figure shows the state in which the main body 6 is located at the processing position. In the following description, Figures 1 and 2 will be referred to together with Figure 3 as appropriate.

[0026] The insertion holes 6c are through-holes that penetrate the main body 6 along the X-axis direction. In the following description, when the insertion holes 6c are to be particularly distinguished from one another, the numbers "1" to "6" are added to the end of their reference numerals. In the Y-axis direction, the insertion holes 6c1 to 6c6 are arranged at equal intervals in order from the +Y direction side.

[0027] The insertion holes 6d are blind holes that extend along the X-axis direction and open toward the +X-direction side of the main body 6. In the following description, when the insertion holes 6d are to be particularly distinguished from one another, the numbers "1" to "3" are added to the end of their reference numerals. The insertion hole 6d1 is disposed between the insertion holes 6c1 and 6c2, the insertion hole 6d2 is disposed between the insertion holes 6c3 and 6c4, and the insertion hole 6d3 is disposed between the insertion holes 6c5 and 6c6.

[0028] The heat pipe 7 is, for example, a known heat pipe filled with a volatile working fluid. The heat pipe 7 has a straight tube shape. The heat pipe 7 has a first end 7a and a second end 7b. The heat pipe 7 is inserted into the corresponding insertion hole 6c and fixed to the main body 6. That is, when viewed from the top-bottom direction, the heat pipes 7 are arranged parallel to the X-axis direction and are arranged parallel to each other so as to be perpendicular to the heating source 40c and the cooling source 41b. The first end 7a protrudes from the main body 6 in the +X direction, and the second end 7b protrudes from the main body 6 in the -X direction. The first end 7a is an example of the protruding end and first protruding end in the present invention, and the second end 7b is an example of the protruding end and second protruding end in the present invention. In the following description, when the heat pipes 7 are particularly distinguished from one another, the numbers "1" to "6" are added to the end of their reference numerals.

[0029] FIG. 4 is a schematic diagram of the first heat source unit 8 as viewed from the arrow B in FIG. For ease of explanation, the drawing indicates a contact portion 80b (described later) with a thick solid line, and also illustrates a cross section of the first end portion 7a along the YZ plane. In the following description, FIGS. 1 and 2 will be referred to as appropriate, along with FIG. 3.

[0030] The first heat source unit 8 corresponds to the first end 7a and cools the heat pipe 7 (working fluid). That is, the first heat source unit 8 is a cooling unit that cools the heat pipe 7. The first heat source unit 8 includes two first clamp members 80, 81, two first heat sources 82, 83, and a first heat source moving mechanism 84.

[0031] When the heat pipe 7 is cooled, the first clamp members 80, 81 contact the first end 7a of the heat pipe 7 and transfer heat from the heat pipe 7 to the first heat sources 82, 83. The first clamp members 80, 81 are made of, for example, a metal (e.g., a copper alloy) with high thermal conductivity. The first clamp members 80, 81 have, for example, a rectangular shape extending along the XY direction when viewed from above and below, and a rectangular parallelepiped shape with its longitudinal direction extending along the Y-axis direction. The first clamp member 80 has a lower surface 80a. A portion of the lower surface 80a functions as a contact portion 80b that contacts the corresponding first end 7a when the heat pipe 7 is cooled. That is, the first clamp member 80 has multiple (six in this embodiment) abutting portions 80b. The abutting portions 80b are arranged at equal intervals in the Y-axis direction. The first clamp member 81 has an upper surface 81a. A partial region of the upper surface 81a functions as a contact portion 81b that contacts the corresponding first end portion 7a when the heat pipe 7 is cooled. That is, the first clamp member 81 has a plurality of (six in this embodiment) abutting portions 81b. The abutting portions 81b are arranged at equal intervals in the Y-axis direction. When the main body 6 is located in the standby position, the abutting portions 81b face the abutting portions 80b. The first clamp members 80, 81 are movable in the up and down direction. The first clamp members 80, 81 are an example of a heat source main body according to the present invention. In the following description, when the abutting portions 80b, 81b are to be particularly distinguished from one another, the numbers "1" to "6" are added to the end of their reference numerals.

[0032] The first heat sources 82, 83 are cooling sources that cool the heat pipe 7 via the first clamp members 80, 81. The first heat sources 82, 83 are, for example, flow paths through which a refrigerant flows that cools the first clamp members 80, 81. The refrigerant is cooled by a cooling device and circulated between the first heat sources 82, 83 and the cooling device. The first heat source 82 is disposed inside the first clamp member 80, and the first heat source 83 is disposed inside the first clamp member 81.

[0033] The first heat source moving mechanism 84 moves the first clamp members 80, 81 vertically between a clamping position and a non-clamping position. The "clamping position" is a position where the first clamp members 80, 81 clamp the first end 7a. The "non-clamping position" is a position where the first clamp members 80, 81 are separated from the first end 7a. As the first clamp members 80, 81 move between the clamping position and the non-clamping position, the contact portions 80b, 81b move relative to the first end 7a. In other words, the first heat source moving mechanism 84 switches between contact and separation of the contact portions 80b, 81b with respect to the first end 7a. The first heat source moving mechanism 84 includes, for example, a known power source (e.g., a motor; not shown) and a power transmission mechanism (e.g., a gear, a ball screw, etc.; not shown). The first heat source moving mechanism 84 is an example of an abutment switching unit defined in the present invention.

[0034] FIG. 5 is a schematic diagram of the second heat source unit 9 as viewed from the arrow C in FIG. For ease of explanation, the drawing shows a contact portion 90b (described later) with a thick solid line, and also illustrates a cross section of the second end portion 7b along the YZ plane.

[0035] The second heat source unit 9 corresponds to the second end 7b and heats the heat pipe 7 (working fluid). That is, the second heat source unit 9 is a heating unit that heats the heat pipe 7. The second heat source unit 9 includes two second clamp members 90, 91, two second heat sources 92, 93, and a second heat source moving mechanism 94.

[0036] When the heat pipe 7 is heated, the second clamp members 90, 91 contact the second end 7b of the heat pipe 7 and transfer heat from the second heat sources 92, 93 to the heat pipe 7. The configuration of the second clamp members 90, 91 is the same as the configuration of the first clamp members 80, 81. That is, the second clamp member 90 has a lower surface 90a and multiple (six in this embodiment) contact portions 90b. The second clamp member 91 has an upper surface 91a and multiple (six in this embodiment) contact portions 91b. When the main body 6 is positioned in the standby position, the contact portions 91b face each other. The second clamp members 90, 91 are movable in the vertical direction. The second clamp members 90, 91 are an example of a heat source main body according to the present invention. In the following description, when the contact portions 90b, 91b are to be specifically distinguished from each other, the numbers "1" to "6" are added to the end of their reference numerals.

[0037] The second heat sources 92 and 93 are heat sources that heat the heat pipe 7 via the second clamp members 90 and 91. The second heat sources 92 and 93 are, for example, known tubular heaters. The second heat source 92 is disposed inside the second clamp member 90, and the second heat source 93 is disposed inside the second clamp member 91.

[0038] The second heat source moving mechanism 94 moves the second clamp members 90, 91 vertically between a clamping position and a non-clamping position. The "clamping position" is a position where the second clamp members 90, 91 clamp the second end 7b. The "non-clamping position" is a position where the second clamp members 90, 91 move away from each other and away from the second end 7b. As the second clamp members 90, 91 move between the clamping position and the non-clamping position, the contact portions 90b, 91b move relative to the second end 7b. In other words, the second heat source moving mechanism 94 switches between contact and separation of the contact portions 90b, 91b with respect to the second end 7b. The configuration of the second heat source moving mechanism 94 is the same as the configuration of the first heat source moving mechanism 84. The second heat source moving mechanism 94 is an example of an abutment switching unit according to the present invention.

[0039] In the insertion hole 6c, heat pipe 7, and contact portions 80b, 81b, 90b, and 91b, the same reference numerals used for distinction correspond to each other. For example, the insertion hole 6c1 corresponds to the heat pipe 71, and the heat pipe 71 is inserted into the insertion hole 6c1. The contact portions 80b1 and 81b1 correspond to the first end portion 7a1 and can contact the first end portion 7a1. The contact portions 90b1 and 91b1 correspond to the second end portion 7b1 and can contact the second end portion 7b1.

[0040] Here, the first heat source unit 8 and the second heat source unit 9 are an example of the heat source unit in the present invention. In other words, the heat source unit in the present invention includes the first heat source unit 8 and the second heat source unit 9.

[0041] The temperature measuring devices 10 measure the temperature of the main body 6. The temperature measuring devices 10 are, for example, known thermocouples. The temperature measuring devices 10 are inserted into corresponding insertion holes 6d of the main body 6. In the following description, when the temperature measuring devices 10 are to be particularly distinguished from one another, the numbers "1" to "3" are added to the end of their reference numerals. The temperature measuring device 101 is inserted into the insertion hole 6d1, the temperature measuring device 102 is inserted into the insertion hole 6d2, and the temperature measuring device 103 is inserted into the insertion hole 6d3.

[0042] In the following description, reference will be made primarily to FIGS. The second unit transport device 11 transports the main body 6 between a processing position and a standby position. The second unit transport device 11 includes, for example, a known power source (e.g., a motor: not shown), a power transmission mechanism (e.g., a gear, a ball screw, etc.: not shown), and a rail (not shown).

[0043] The base member 12 supports the upper mold 14, the first spring member 17, and the second spring member 18. The base member 12 has a rectangular shape extending along the XY direction when viewed from above, and is a rectangular parallelepiped.

[0044] The side member 13 defines a storage chamber R, which will be described later. When viewed from below, the side member 13 has a rectangular, frame-like shape that is aligned with the XY directions. The side member 13 houses an upper mold 14, a frame member 15, and a pressure pad 16. The side member 13 is supported by the base member 12 via second spring members 18. The side member 13 has a lower surface 13a and through holes 13b that open to the inner and outer surfaces of the side member 13.

[0045] The upper die 14 presses the workpiece W from above via a pressure pad 16. The upper die 14 is disposed below the base member 12 and attached to the base member 12. The shape of the upper die 14 is a rectangular parallelepiped that is aligned with the X and Y directions when viewed from below.

[0046] The frame member 15 holds the pressure pad 16. When viewed from below, the frame member 15 has a rectangular frame shape that is aligned with the X and Y axis directions. In the horizontal direction, the frame member 15 is disposed so as to surround the upper mold 14. In the vertical direction, the lower end of the frame member 15 is positioned below the upper mold 14. The frame member 15 is supported by the base member 12 via first spring members 17.

[0047] When pressure is applied to the workpiece W, the pressure pad 16 deforms to follow the shape of the surface of the workpiece W, thereby applying uniform pressure to the workpiece W and defining an accommodation chamber R, which will be described later. The pressure pad 16 is held at the lower end of the frame member 15 and is disposed below the upper mold 14. The pressure pad 16 includes a flexible layer 16a and a heat insulating layer 16b.

[0048] The flexible layer 16a is made of, for example, a known elastic material having high fluidity and low impact resilience. The flexible layer 16a is filled between, for example, two membrane members (not shown; the same applies below) arranged above and below the flexible layer 16a, and is surrounded by a frame member 15.

[0049] The heat insulating layer 16b is made of, for example, a known fiber material having high flexibility and low thermal conductivity. The heat insulating layer 16b is disposed below and adjacent to the flexible layer 16a. Like the flexible layer 16a, the heat insulating layer 16b is filled between two membrane members (not shown; the same applies below) in the vertical direction and is surrounded by the frame member 15.

[0050] In the present invention, when the temperature of the workpiece W is lower than the heat-resistant temperature of the flexible layer 16a, the pressure pad 16 does not need to include the heat insulating layer 16b.

[0051] The first spring member 17 supports the frame member 15 so that it can move up and down relative to the upper mold 14. The first spring member 17 is disposed between the base member 12 and the frame member 15 and attached to each of them.

[0052] The second spring members 18 support the side members 13 so that they can move vertically relative to the upper mold 14 and the frame member 15. The second spring members 18 are disposed between the base member 12 and the side members 13 and attached to each of them.

[0053] The seal members 19 and 20 airtightly seal the gap between the side member 13 and the frame member 15, and the gap between the mounting plate 3 and the side member 13. The seal members 19 and 20 are, for example, well-known O-rings. The seal member 19 is disposed between the side member 13 and the frame member 15. The seal member 20 is disposed on the lower surface 13a of the side member 13.

[0054] The pump P is a known vacuum pump connected to the through hole 13b.

[0055] In this embodiment, when the workpiece W is pressurized, the upper pressurizing unit UP and the mounting plate 3 assemble a chamber unit CU (see FIG. 7) in which the workpiece W is accommodated. When the chamber unit CU is assembled, the workpiece W is accommodated in an enclosed space (hereinafter referred to as "accommodation chamber R (see FIG. 6)") defined by the mounting plate 3, side members 13, frame members 15, pressure pad 16, and seal members 19 and 20.

[0056] ●Operation of pressure device (1) Next, the operation of the present apparatus 1 will be described below. In the following description, Figures 1 to 5 will be referred to as appropriate. In the present apparatus 1, before the workpiece W is carried in, the heating mold unit 40 is located at the processing position, the cooling mold unit 41 is located at the standby position, and the upper pressure unit UP is located above the heating mold unit 40.

[0057] First, the mounting plate 3 on which the workpiece W is placed is placed on the cooling mold unit 41. Next, the first unit transport device 42 transports the heating mold unit 40 to the standby position, and transports the cooling mold unit 41 to the processing position.

[0058] Next, the control device 2 lowers the upper pressure unit UP until the seal member 20 comes into close contact with the mounting plate 3. At this time, a storage chamber R is formed between the mounting plate 3 and the upper pressure unit UP, and the workpiece W is stored in the storage chamber R.

[0059] FIG. 6 is a schematic cross-sectional view of the present device 1, showing a state in which the workpiece W is accommodated in the accommodation chamber R.

[0060] Next, the control device 2 operates the pump P to create a reduced pressure atmosphere in the accommodation chamber R. At this time, the vacuum pressure (pressure difference between the accommodation chamber R and the space outside the chamber unit CU (see FIG. 7; the same applies below)) causes the mounting plate 3 to come into close contact with (be attached to) the side member 13, and the second spring member 18 contracts, causing the mounting plate 3 and the side member 13 to rise. As a result, the pressure pad 16 comes into contact with the workpiece W, and the workpiece W is pre-pressurized by a pre-pressure force corresponding to the vacuum pressure. The pre-pressure causes the pressure pad 16 to deform according to the shape of the surface of the workpiece W, and the workpiece W is held by the mounting plate 3 and the pressure pad 16. Here, the pre-pressure force is sufficiently smaller than the main pressurization force, which will be described later. In this way, by attaching the mounting plate 3 to the upper pressurization unit UP, the chamber unit CU is assembled, and the workpiece W is accommodated in the chamber unit CU.

[0061] Next, the control device 2 raises the chamber unit CU. Next, the first unit transfer device 42 and the second unit transfer device 11 transfer the heated mold unit 40 and the main body 6 to the processing position, and transfer the cooled mold unit 41 to the standby position.

[0062] FIG. 7 is a schematic cross-sectional view of the present device 1, showing the heated mold unit 40 and the main body 6 in the processing position. FIG. 8 is a schematic cross-sectional view of the device 1 taken along the arrow D in FIG.

[0063] The first end 7a of the heat pipe 7 is located between the first clamp members 80, 81, and the second end 7b is located between the second clamp members 90, 91. The lower surface 6b of the main body 6 abuts against the upper surface 40e of the main body 40a of the heated mold unit 40. The heated mold unit 40 is heated to a predetermined heating temperature "T1: for example, approximately 400°C." Therefore, heat from the heated mold unit 40 is transferred to the main body 6, and the main body 6 is heated to the temperature "T1." Here, the temperature "T1" is set to a temperature higher than the predetermined processing temperature "T2: for example, 300°C" in order to increase the heating rate of the workpiece W.

[0064] Next, the control device 2 lowers the chamber unit CU until the mounting plate 3 abuts against the main body 6. At this time, the main body 6 and the heat pipe 7 are disposed between the mounting plate 3 and the heated mold unit 40.

[0065] FIG. 9 is a schematic cross-sectional view of the apparatus 1, showing the chamber unit CU in a lowered state. FIG. 10 is a timing chart showing an example of temperature changes in the workpiece W, the heating mold unit 40, and the main body 6 when the workpiece W is heated. Fig. 10 also shows an example of a temperature profile Pr1 that the control device 2 refers to when controlling the temperature of the workpiece W. In the following description, Fig. 10 will be referred to as appropriate.

[0066] Next, the control device 2 lowers the base member 12 until a predetermined pressure (hereinafter referred to as "main pressure") is applied to the workpiece W. At this time, the upper mold 14 lowers relative to the frame member 15 and the side member 13. As a result, the upper mold 14 presses the pressure pad 16 downward, and the pressure pad 16 deforms to follow the shape of the surface of the workpiece W, thereby applying uniform pressure to the workpiece W.

[0067] Furthermore, when the mounting plate 3 contacts the main body 6, the control device 2 changes the set temperature of the heated mold unit 40 to "T2." Because the heat capacity of the main body 40a is large, the temperatures of the heated mold unit 40 and the main body 6 decrease relatively slowly from temperature "T1" to temperature "T2." At this time, heat from the heated mold unit 40 is transferred to the workpiece W via the main body 6 and the mounting plate 3. At this time, the heating rate of the workpiece W is fast until the temperature of the workpiece W approaches the temperatures of the heated mold unit 40 and the main body 6 (temperatures "T1" to "T2"), and then slows as the temperature of the workpiece W approaches these temperatures. Therefore, in this embodiment, in order to increase the heating rate, the set temperature of the heated mold unit 40 before the mounting plate 3 contacts is set to temperature "T1," which is higher than temperature "T2." As temperature "T1" increases, the heating rate of the workpiece W increases, but the temperature of the workpiece W is more likely to exceed temperature "T2" (overshoot). Therefore, in order to prevent this temperature from exceeding the limit, the second mold unit 5 is used.

[0068] Next, when the workpiece W is heated to the predetermined temperature "T3," the first heat source moving mechanism 84 moves the first clamp members 80, 81 to the clamping position. At this time, the contact portions 80b1-80b6, 81b1-81b6 move together and come into contact with the corresponding first end portions 7a1-7a6 together. As a result, the first heat source unit 8 comes into contact with the heat pipe 7.

[0069] The temperature "T3" is preset to a temperature lower than the temperature "T2" so that the temperature of the workpiece W does not exceed the temperature "T2" due to cooling by the heat pipe 7 described below (or so that even if the temperature of the workpiece W exceeds the temperature "T2", the excess temperature is small). In this embodiment, for example, the temperature change rate of the workpiece W is measured in advance. Based on the temperature change rate and the elapsed time from when the mounting plate 3 abutted against the main body 6, the first heat source moving mechanism 84 moves the first clamping members 80, 81, assuming that the temperature of the workpiece W has reached the temperature "T2" in a predetermined elapsed time.

[0070] In the present invention, the first heat source moving mechanism 84 may move the first clamp members 80, 81 to the clamping position when the main body 6 is cooled to a predetermined temperature "Tx". That is, the first heat source moving mechanism 84 may switch the contact portions 80b1-80b6, 81b1-81b6 between separation and contact based on the measurement results of the temperature measuring device 10. In this case, for example, the temperature change rate of the workpiece W is measured in advance, and the temperature "Tx" is set in advance based on this temperature change rate.

[0071] FIG. 11 is a schematic cross-sectional view of the device 1 showing a state in which the first clamp members 80 and 81 have moved to the clamping position.

[0072] When the first clamp members 80, 81 move to the clamping position, the contact portions 80b, 81b contact the corresponding first end portions 7a from above and below. The first clamp members 80, 81 are cooled in advance to a predetermined temperature (Tc: for example, approximately 20°C) by the first heat sources 82, 83. That is, the first clamp members 80, 81 also function as cooling sources for the first end portions 7a. As described above, the first clamp members 80, 81 are shaped like a rectangular parallelepiped, and all of the contact portions 80b, 81b are located on a single first clamp member 80, 81. That is, the heat capacity of the first clamp members 80, 81 is relatively large. Therefore, the first clamp members 80, 81 are not easily heated by the heat pipe 7, and the first end portions 7a are rapidly cooled by the first clamp members 80, 81. Therefore, the heat of the main body 6 (transmitted from the heated mold unit 40) is transmitted to the first clamp members 80, 81 via the heat pipe 7. As a result, the temperature of the main body 6 becomes lower than that of the heated mold unit 40 and approaches temperature "T2." The heating rate of the workpiece W rapidly decreases between temperature "T3" and temperature "T2." At this time, the temperature change rate of the workpiece W during heating is smaller than when the power source 40c is turned off without cooling the heat pipe 7. Thereafter, the temperature of the workpiece W stabilizes at temperature "T2." In this way, the present apparatus 1 controls the temperature change rate of the workpiece W during heating by cooling the heat pipe 7 during heating. As a result, the present apparatus 1 realizes temperature control that increases the heating rate of the workpiece W while preventing the workpiece W from exceeding its temperature.

[0073] Next, when the temperature of the heated mold unit 40 drops to temperature "T2," the first heat source moving mechanism 84 moves the first clamp members 80, 81 to the non-clamping position. At this time, the abutment portions 80b1-80b6, 81b1-81b6 move together and move away from the corresponding first end portions 7a1-7a6 together. As a result, the first heat source unit 8 moves away from the heat pipe 7.

[0074] FIG. 12 is a schematic cross-sectional view of the device 1 showing a state in which the first clamping members 80 and 81 have moved to the non-clamping position.

[0075] When the first clamp members 80, 81 move to the non-clamping position, the first clamp members 80, 81 are mechanically separated from the first end 7a. As a result, the temperatures of the main body 6, the heat pipe 7, and the workpiece W are maintained at temperature "T2," which is the temperature of the heated mold unit 40.

[0076] In the present invention, the first heat source moving mechanism 84 may switch the contact portions 80b, 81b between contact with and separation from the first end 7a one or more times, for example, based on the temperature measurement results of the temperature measuring device 10, so that the workpiece W is heated according to a specified temperature profile Pr1. In this case, the temperature of the workpiece W during heating changes so as to more closely follow the temperature profile Pr1. As a result, the apparatus 1 can accurately control the rate of temperature change of the workpiece W during heating according to the temperature profile Pr1. In this way, the rate of temperature change of the workpiece W during heating is controlled by the first mold unit 4 and the second mold unit 5. In other words, when the workpiece W is being heated, the second mold unit 5 heats the workpiece W together with the first mold unit 4.

[0077] Next, after a predetermined time has elapsed, the control device 2 stops pressurizing the workpiece W. Next, the control device 2 raises the chamber unit CU to separate the mounting plate 3 from the main body 6. Next, the first unit transport device 42 moves the heating mold unit 40 to the standby position and moves the cooling mold unit 41 to the processing position. At this time, the main body 6 and the heat pipe 7 are disposed between the mounting plate 3 and the cooling mold unit 41.

[0078] FIG. 13 is a schematic cross-sectional view of the present apparatus 1, showing a state in which the cooling mold unit 41 has moved to the processing position. FIG. 14 is a schematic cross-sectional view of the device 1 taken along the arrow E in FIG.

[0079] The first end 7a of the heat pipe 7 is located between the first clamp members 80, 81, and the second end 7b is located between the second clamp members 90, 91. The lower surface 6b of the main body 6 abuts against the upper surface 41c of the main body 41a of the cooling mold unit 41. The cooling mold unit 41 is cooled in advance to a predetermined temperature "T4: for example, approximately 20°C." Also, as mentioned above, the heat capacity of the main body 6 is smaller than the heat capacity of the main body 41a. Therefore, heat from the main body 6 is transferred to the cooling mold unit 41, and the main body 6 is cooled to the temperature "T4."

[0080] Next, the control device 2 lowers the chamber unit CU until the mounting plate 3 abuts against the main body portion 6.

[0081] FIG. 15 is a schematic cross-sectional view of the apparatus 1, showing the chamber unit CU in a lowered state. FIG. 16 is a timing chart showing an example of temperature changes in the workpiece W, the cooling mold unit 41, and the main body 6 when the workpiece W is cooled. Fig. 16 also shows an example of a temperature profile Pr2 that the control device 2 refers to when controlling the temperature of the workpiece W. In the following description, Fig. 16 will be referred to as appropriate.

[0082] When the mounting plate 3 contacts the main body 6, heat from the workpiece W and the mounting plate 3 is transferred to the main body 6. As a result, the workpiece W and the mounting plate 3 are rapidly cooled, and the main body 6 is rapidly heated. At this time, the main body 6 is cooled by the workpiece W, the mounting plate 3, and the cooling mold unit 41, which includes a main body 41a having a larger heat capacity than the main body 6. Therefore, the temperature change rate (heating rate) of the main body 6 is smaller than the temperature change rate (cooling rate) of the workpiece W and the mounting plate 3.

[0083] Next, when the main body 6 is heated to the predetermined temperature "T5," the first heat source moving mechanism 84 moves the first clamp members 80, 81 to the clamping position. At this time, the abutment portions 80b1-80b6, 81b1-81b6 move together and abut against the corresponding first end portions 7a1-7a6 together. As a result, the first heat source unit 8 comes into contact with the heat pipe 7.

[0084] The temperature "T5" is preset to a temperature lower than the temperature "T6" described below so as to prevent the temperature of the main body 6 from rising too much. In this embodiment, the first heat source moving mechanism 84 switches the contact portions 80b1-80b6, 81b1-81b6 between separation and contact based on the measurement result of the temperature measuring device 10.

[0085] In the present invention, the first heat source moving mechanism 84 may move the first clamp members 80, 81 to the clamping position when the workpiece W has cooled to a predetermined temperature "Ty." In this case, for example, the temperature change rate of the workpiece W is measured in advance, and the temperature "Ty" is set in advance based on this temperature change rate. The first heat source moving mechanism 84 estimates the temperature of the workpiece W based on the elapsed time since the mounting plate 3 came into contact with the main body 6.

[0086] FIG. 17 is a schematic cross-sectional view of the device 1 showing a state in which the first clamp members 80 and 81 have moved to the clamping position.

[0087] When the first clamping members 80, 81 move to the clamping position, the abutment portions 80b, 81b abut against the corresponding first end portions 7a from above and below. As described above, the first clamping members 80, 81 function as a cooling source for the first end portions 7a. As a result, heating of the main body portion 6 is suppressed, and the temperature of the main body portion 6 is maintained near temperature "T5" (for example, a temperature between temperatures "T5" and "T6") and then gradually decreases. As a result, a decrease in the cooling rate of the workpiece W due to a rise in temperature of the main body portion 6 is suppressed. In other words, a decrease in the temperature change rate of the workpiece W is suppressed.

[0088] Next, when the temperature of the workpiece W has cooled to a predetermined temperature "T6," the first heat source moving mechanism 84 moves the first clamping members 80, 81 to the non-clamping position. At this time, the contact portions 80b1-80b6, 81b1-81b6 move together and move away from the corresponding first end portions 7a1-7a6 together. In this embodiment, for example, the temperature change rate of the workpiece W is measured in advance. Based on the temperature change rate and the elapsed time since the mounting plate 3 came into contact with the main body 6, the first heat source moving mechanism 84 determines that the temperature of the workpiece W has reached temperature "T6" in a predetermined elapsed time, and moves the first clamping members 80, 81.

[0089] In the present invention, the first heat source moving mechanism 84 may move the first clamp members 80, 81 to the non-clamping position when the main body 6 is cooled to a predetermined temperature "Tz." That is, the first heat source moving mechanism 84 may switch the contact portions 80b1-80b6, 81b1-81b6 between contact and separation based on the measurement results of the temperature measuring device 10. In this case, for example, the temperature change rate of the workpiece W is measured in advance, and the temperature "Tz" is set in advance based on this temperature change rate.

[0090] FIG. 18 is a schematic cross-sectional view of the device 1 showing a state in which the first clamping members 80 and 81 have moved to the non-clamping position.

[0091] When the first clamp members 80, 81 move to the non-clamping position, the first clamp members 80, 81 are mechanically separated from the first end 7a. Thereafter, the temperature of the workpiece W gradually decreases, and the temperatures of the cooling mold unit 41 and the main body 6 also gradually decrease to temperature "T4."

[0092] In the present invention, the first heat source moving mechanism 84 may switch the contact portions 80b, 81b between contact with and separation from the first end 7a one or more times, for example, based on the temperature measurement results of the temperature measuring device 10, so that the workpiece W is cooled according to a specified temperature profile Pr2. In this case, the temperature of the workpiece W during cooling changes so as to more closely follow the temperature profile Pr2. As a result, the apparatus 1 can accurately control the rate of temperature change of the workpiece W during cooling according to the temperature profile Pr2. In this way, the rate of temperature change of the workpiece W during cooling is controlled by the first mold unit 4 and the second mold unit 5. In other words, when the workpiece W is being cooled, the second mold unit 5 cools the workpiece W together with the first mold unit 4.

[0093] Next, after a predetermined time has elapsed, the control device 2 raises the chamber unit CU to separate the mounting plate 3 from the main body 6. Next, the second unit transport device 11 moves the main body 6 to a standby position. Next, the control device 2 lowers the chamber unit CU until the mounting plate 3 abuts against the cooling mold unit 41. Next, the control device 2 stops the pump P and purges the atmosphere in the accommodation chamber R with inert gas, thereby removing the workpiece W from the chamber unit CU.

[0094] FIG. 19 is a schematic diagram showing an example of an actual temperature change of the workpiece W.

[0095] In the figure, "Example 1" shows the temperature change when the heat pipe 7 is cooled by the device 1 during heating as an embodiment of the present invention. "Example 2" shows the temperature change when the chamber unit CU is brought into contact with a preheated heated mold unit 40 as a comparative example. "Example 3" shows the temperature change when the chamber unit CU is brought into contact with a preheated heated mold unit 40 and then the heated mold unit 40 is heated. As shown in the figure, "Example 1" achieves a different temperature change rate from "Example 2" (a temperature change rate close to "Example 3") for the same heating time as "Example 2."

[0096] Thus, in the present apparatus 1, when the workpiece W is heated, the heat pipe 7 is cooled, thereby cooling the main body 6, and the heating rate of the workpiece W is rapidly reduced. In other words, the temperature change rate of the workpiece W is rapidly reduced (largely changed). As a result, even if the workpiece W is rapidly heated to temperature "T3," the temperature of the workpiece W does not exceed temperature "T2." Then, the cooling source (first clamp members 80, 81 and first heat sources 82, 83) is mechanically separated from the heat pipe 7, forcibly terminating the cooling of the heat pipe 7. As a result, the thermal state of the heat pipe 7 instantaneously switches from a cooled state (temperature equilibrium state) to a heated state by the heated mold unit 40. Similarly, in the present apparatus 1, when the workpiece W is cooled, the heat pipe 7 is cooled, thereby cooling the main body 6, and a decrease in the cooling rate of the workpiece W due to a rise in the temperature of the main body 6 is suppressed. In other words, a decrease in the temperature change rate of the workpiece W is suppressed. As a result, the temperature change rate of the workpiece W becomes larger than when the heat pipe 7 is not cooled, and the workpiece W is cooled rapidly. Then, by mechanically separating the cooling source from the heat pipe 7, the cooling of the heat pipe 7 is forcibly terminated. As a result, the thermal state of the heat pipe 7 instantaneously switches from a cooled state (temperature equilibrium state) to a cooled state by the cooling mold unit 41. This instantaneous switching of the thermal state is made possible by mechanically separating the heat source from the heat pipe 7, and cannot be obtained by switching the heat source of the heat pipe 7 on and off.

[0097] In this apparatus 1, the second mold unit 5 cools the workpiece W together with the first mold unit 4, allowing the temperature change rate of the workpiece W during heating and cooling to be controlled in at least two stages. Therefore, the apparatus 1 can change the heating and cooling times of the workpiece W. Furthermore, by controlling the number and timing of contact and separation of the heat source with the heat pipe 7, the apparatus 1 enables complex temperature control of the workpiece W and can control the temperature change rate of the workpiece W during heating (cooling) according to the purpose. For example, if the workpiece W is a sintered material and the main pressure must be applied to the workpiece W before its temperature reaches the sintering start temperature, the apparatus 1 can accommodate this workpiece W by changing the temperature change rate during heating before and after the sintering start temperature. In this way, the apparatus 1 can control the relationship between the pressure applied to the workpiece W and its temperature for each type of workpiece W.

[0098] In the present invention, when the workpiece W is heated, the second clamping members 90, 91 may be moved to the abutting position instead of the first clamping members 80, 81.

[0099] FIG. 20 is a schematic cross-sectional view of the device 1, showing a state in which the second clamping members 90, 91 have moved to the clamping position when the workpiece W is heated.

[0100] In this case, the workpiece W is heated rapidly. That is, the rate of temperature change during heating of the workpiece W is increased, and the heating time is shortened. When the workpiece W is heated to temperature "T3", the second heat source moving mechanism 94 moves the second clamp members 90, 91 to the non-contact position, and the first heat source moving mechanism 84 moves the first clamp members 80, 81 to the contact position. As a result, the temperature of the workpiece W does not exceed temperature "T2". This configuration is particularly effective when the heating performance of the heated mold unit 40 is low.

[0101] Furthermore, in the present invention, when cooling the workpiece W, the second clamping members 90, 91 may be moved to the abutting position instead of the first clamping members 80, 81. In this case, the workpiece W is cooled slowly. That is, the rate of temperature change during cooling of the workpiece W is reduced, and the cooling time is lengthened.

[0102] Furthermore, in the present invention, the timing of contact and separation of the contact portions 80b, 81b with respect to the first end portion 7a is not limited to this embodiment, and the same applies to the timing of contact and separation of the contact portions 90b, 91b with respect to the second end portion 7b.

[0103] Summary (1) According to the embodiment described above, the apparatus 1 includes a first mold unit 4 and a second mold unit 5. The second mold unit 5 heats or cools the workpiece W together with the first mold unit 4. The second mold unit 5 includes a main body 6, a plurality of heat pipes 7, a first heat source unit 8, and a second heat source unit 9. The main body 6 is disposed between the first mold unit 4 and the workpiece W (mounting plate 3) when heating or cooling the workpiece W. The first heat source unit 8 includes a plurality of contact portions 80b, 81b and a first heat source moving mechanism 84. The second heat source unit 9 includes a plurality of contact portions 90b, 91b and a second heat source moving mechanism 94. The first heat source moving mechanism 84 switches between contact and separation of the contact portions 80b, 81b with the first end portion 7a. The second heat source moving mechanism 94 switches between contact and separation of the contact portions 90b, 91b with the second end portion 7b. With this configuration, the device 1 can instantly switch the thermal state of the heat pipe 7 between a heating state and a cooling state. Therefore, by controlling the number and timing of contact and separation of the heat source with the heat pipe 7, the device 1 enables complex temperature control of the workpiece W and can control the rate of temperature change during heating and cooling of the workpiece W according to the purpose.

[0104] Furthermore, according to the embodiment described above, the second mold unit 5 is equipped with a temperature measuring device 10. The first heat source moving mechanism 84 and the second heat source moving mechanism 94 control the contact and separation of the contact portions 80b, 81b with respect to the first end portion 7a, and control the contact and separation of the contact portions 90b, 91b with respect to the second end portion 7b, based on the temperature measurement results of the temperature measuring device 10. According to this configuration, the temperature (temperature change rate) of the workpiece W is controlled based on the actual temperature of the main body portion 6, which is the member of the lower pressure unit DP closest to the workpiece W. Therefore, the accuracy of temperature control of the workpiece W is improved.

[0105] Furthermore, according to the embodiment described above, the first mold unit 4 includes the heated mold unit 40. The first heat source unit 8 includes first heat sources 82, 83 that cool the heat pipe 7. The first heat source moving mechanism 84 controls the contact and separation of the contact portions 80b, 81b with the first end portion 7a so that the workpiece W is heated according to the temperature profile Pr1. With this configuration, the apparatus 1 can control the temperature change rate and heating time when heating the workpiece W according to the temperature profile Pr1.

[0106] Furthermore, according to the embodiment described above, the first mold unit 4 includes the cooling mold unit 41. The second heat source unit 9 includes second heat sources 92, 93 that heat the heat pipe 7. The second heat source moving mechanism 94 controls the contact and separation of the contact portions 90b, 91b with the second end 7b so that the workpiece W is cooled according to the temperature profile Pr2. With this configuration, the apparatus 1 can control the temperature change rate and cooling time during cooling of the workpiece W according to the temperature profile Pr2.

[0107] Furthermore, according to the embodiment described above, when the heat pipe 7 is cooled, the contact portions 80b, 81b are in contact with the first end 7a, and when the heat pipe 7 is heated, the contact portions 90b, 91b are in contact with the second end 7b. In other words, the first heat source moving mechanism 84 and the second heat source moving mechanism 94 switch between the first heat source unit 8 and the second heat source unit 9 in accordance with the heating and cooling of the heat pipe 7. In other words, the first heat source moving mechanism 84 and the second heat source moving mechanism 94 function as a unit switching unit in the present invention. With this configuration, the present apparatus 1 can further control the temperature change rate and heating time / cooling time when heating / cooling the workpiece W.

[0108] Furthermore, according to the embodiment described above, the second mold unit 5 includes a first heat source unit 8 corresponding to the first end 7a and a second heat source unit 9 corresponding to the second end 7b. The first heat source unit 8 is a cooling unit, and the second heat source unit 9 is a heating unit. According to this configuration, when the contact portions 80b, 81b are brought into contact with the first end 7a during heating of the workpiece W, the temperature change rate during heating of the workpiece W is reduced and the heating time is increased. Furthermore, when the contact portions 80b, 81b are brought into contact with the first end 7a during cooling of the workpiece W, the temperature change rate during cooling of the workpiece W is increased and the cooling time is reduced. On the other hand, when the contact portions 90b, 91b are brought into contact with the second end 7b during heating of the workpiece W, the temperature change rate during heating of the workpiece W is increased and the heating time is reduced. Furthermore, when the contact portions 90b, 91b are brought into contact with the second end 7b during cooling of the workpiece W, the temperature change rate during cooling of the workpiece W decreases and the cooling time increases. In this way, the device 1 can control the temperature change rate and heating time / cooling time during heating / cooling of the workpiece W.

[0109] Furthermore, according to the embodiment described above, the first heat source moving mechanism 84 moves the first clamp members 80, 81 to collectively bring the contact portions 80b, 81b into contact with or separate from the corresponding first end portions 7a. The second heat source moving mechanism 94 moves the second clamp members 90, 91 to collectively bring the contact portions 90b, 91b into contact with or separate from the corresponding second end portions 7b. This configuration simplifies the structure of the first clamp members 80, 81 and the second clamp members 90, 91. Furthermore, the heat capacities of the first clamp members 80, 81 and the second clamp members 90, 91 are relatively large.

[0110] Furthermore, according to the embodiment described above, the second mold unit 5 is separate from the first mold unit 4. The main body 6 is horizontally movable relative to the first mold unit 4. When the workpiece W is not being heated or cooled, the main body 6 moves from the processing position to the standby position. This configuration allows for free selection of whether to use the second mold unit 5. That is, the apparatus 1 can heat / cool the workpiece W using only the first mold unit 4. As a result, the apparatus 1 can change the temperature change rate and time during heating / cooling of the workpiece W by selecting whether to use the second mold unit 5. Furthermore, one second mold unit 5 can be used for both the heating mold unit 40 and the cooling mold unit 41. Therefore, the configuration of the apparatus 1 is simplified compared to when a dedicated second mold unit 5 is required for each of the heating mold unit 40 and the cooling mold unit 41. Furthermore, by abutting the main body 6 against the heating mold unit 40, the main body 6 can be heated from room temperature, not the temperature of the heating mold unit 40.

[0111] Furthermore, according to the embodiment described above, the heat pipes 7 are arranged parallel to each other and perpendicular to the heating source 40c and the cooling source 41b when viewed from the top and bottom. With this configuration, when the heat pipes 7 are not heated or cooled by the first heat source unit 8 or the second heat source unit 9, the temperature uniformity of the main body 6 is improved.

[0112] ●Pressure device (2)● Next, another embodiment of this device (hereinafter referred to as the "second embodiment") will be described below, focusing on the differences from the previously described embodiment (hereinafter referred to as the "first embodiment"). The second embodiment differs from the first embodiment in that the second mold unit is integrated with the first mold unit. In the following description, elements that are the same as those in the first embodiment and elements that have common functions are given the same reference numerals as those in the first embodiment, and their description will be omitted. In the following description, Figures 4 and 5 will be referenced as appropriate.

[0113] ●Configuration of pressure device (2) FIG. 21 is a schematic cross-sectional view of the device, showing a second embodiment of the device. FIG. 22 is a schematic cross-sectional view of the present device taken along the arrow F in FIG.

[0114] This device 1Z clamps and presses the workpiece W in the vertical direction. This device 1Z includes a control device 2, a mounting plate 3, a die unit 4Z, a base member 12, a side member 13, an upper die 14, a frame member 15, a pressure pad 16, a first spring member 17, a second spring member 18, two seal members 19 and 20, and a pump P. The mounting plate 3 and die unit 4Z are positioned below the workpiece W and function as a lower pressure unit DPZ that presses the workpiece W from below.

[0115] The mold unit 4Z heats and cools the workpiece W. The mold unit 4Z includes a heating mold unit 40Z, a cooling mold unit 41Z, a first unit transport device 42, a plurality of (six of each in the second embodiment) heat pipes 7, 7Z, a first heat source unit 8, a second heat source unit 9, and a plurality of (three of each in the second embodiment) temperature measuring devices 10.

[0116] The heating mold unit 40Z heats the workpiece W. The heating mold unit 40Z is movable between a processing position and a standby position. The heating mold unit 40Z includes a main body 40Za, a heat insulating member 40b, a plurality of heating sources 40c, a plurality of cooling sources 40d, an upper surface 40e, a plurality of (six in the second embodiment) insertion holes 40f, and a plurality of (three in the second embodiment) insertion holes 40g.

[0117] The main body 40Za protects the heating source 40c, the cooling source 40d, and the heat pipes 7. The main body 40Za is made of, for example, a metal having high rigidity (e.g., carbon steel). The main body 40Za has a rectangular shape aligned with the XY direction when viewed from the top and bottom, that is, a rectangular parallelepiped. The heat insulating member 40b is arranged so as to divide the main body 40Za into two, upper and lower. The heating source 40c is arranged inside the upper half of the main body 40Za so as to be parallel to the Y-axis direction. The cooling source 40d is arranged inside the lower half of the main body 40Za so as to be parallel to the Y-axis direction.

[0118] FIG. 23 is a schematic plan view of the heating mold unit 40Z. 23 shows the state in which the heating mold unit 40Z is located at the processing position. In the following description, FIGS. 21 and 22 will be referred to as appropriate along with FIG.

[0119] The insertion holes 40f are through-holes that penetrate the main body 40Za along the X-axis direction. The insertion holes 40f are located above the heat source 40c and in the upper part of the main body 40Za. In the following description, when the insertion holes 40f are to be particularly distinguished from one another, the numbers "1" to "6" are added to the end of their reference numerals. In the Y-axis direction, the insertion holes 40f1 to 40f6 are arranged at equal intervals in order from the +Y direction side.

[0120] The insertion holes 40g are blind holes that extend along the X-axis direction and open toward the +X-direction side of the main body portion 40Za. In the following description, when the insertion holes 40g are to be particularly distinguished from one another, the numbers "1" to "3" are added to the end of their reference numerals. The insertion hole 40g1 is disposed between the insertion holes 40f1 and 40f2, the insertion hole 40g2 is disposed between the insertion holes 40f3 and 40f4, and the insertion hole 40g3 is disposed between the insertion holes 40f5 and 40f6.

[0121] The heat pipes 7 are inserted through the corresponding insertion holes 40f and fixed to the main body 40Za. That is, the main body 40Za also functions as the mold main body of the present invention. As a result, in the vertical direction, the region of the main body 40Za where the heat pipes 7 are fixed (the upper region) functions as the second mold unit 5 of the first embodiment together with the first heat source unit 8, the second heat source unit 9, and the temperature measuring device 10. Similarly, the region of the main body 40Za below the region where the heat pipes 7 are fixed (the region where the heating source 40c and the cooling source 40d are arranged) functions as the first mold unit 4 of the first embodiment. That is, the mold unit 4Z includes the first mold unit 4 and the second mold unit 5 of the first embodiment. As such, in the second embodiment, the first mold unit 4 (heating mold unit 40) and a part of the second mold unit 5 (the main body 6 and the heat pipes 7) of the first embodiment are integrated.

[0122] In the insertion hole 40f, the heat pipe 7, and the contact portions 80b, 81b, 90b, and 91b, the same reference numerals are used to distinguish between the components. For example, the insertion hole 40f1 corresponds to the heat pipe 7Z1, and the heat pipe 7Z1 is inserted through the insertion hole 40f1. The contact portions 80b1 and 81b1 correspond to the first end portion 7a1 and can contact the first end portion 7a1. The contact portions 90b1 and 91b1 correspond to the second end portion 7b1 and can contact the second end portion 7b1.

[0123] In the following description, reference will be made primarily to FIGS. The cooling mold unit 41Z cools the workpiece W. The cooling mold unit 41Z is movable between a processing position and a standby position. The cooling mold unit 41 includes a main body 41Za, multiple cooling sources 41b, an upper surface 41c, multiple (six in this embodiment) insertion holes 41d, and multiple (three in this embodiment) insertion holes 41e.

[0124] The main body 41Za protects the cooling source 41b and the heat pipe 7Z. The main body 41Za is made of, for example, a highly rigid metal (e.g., carbon steel). The main body 41Za has a rectangular shape aligned with the XY direction when viewed from above and below, that is, a rectangular parallelepiped shape. The cooling source 41b is disposed inside the main body 41Za so as to be parallel to the Y-axis direction.

[0125] FIG. 24 is a schematic plan view of the cooling mold unit 41Z. 24. This figure shows the cooling mold unit 41Z in a state where it is located at the processing position. In the following description, FIGS. 21 and 22 will be referred to together with FIG.

[0126] The insertion holes 41d are through-holes that penetrate the main body 41Za along the X-axis direction. The insertion holes 41d are located above the cooling source 41b and in the upper part of the main body 41Za. In the following description, when the insertion holes 41d are to be particularly distinguished from one another, the numbers "1" to "6" are added to the end of their reference numerals. In the Y-axis direction, the insertion holes 41d1 to 41d6 are arranged at equal intervals in order from the +Y direction side.

[0127] The insertion holes 41e are blind holes that extend along the X-axis direction and open toward the +X-direction side of the main body 41Za. In the following description, when the insertion holes 41e are to be particularly distinguished from one another, the numbers "1" to "3" are added to the end of their reference numerals. The insertion hole 41e1 is located between the insertion holes 41d1 and 41d2, the insertion hole 41e2 is located between the insertion holes 41d3 and 41d4, and the insertion hole 41e3 is located between the insertion holes 41d5 and 41d6.

[0128] The heat pipe 7Z has a configuration common to that of the heat pipe 7. The heat pipe 7Z has a first end 7Za and a second end 7Zb. The heat pipe 7Z is inserted into the corresponding insertion hole 41d and fixed to the main body 41Za. That is, the main body 41Za also functions as the mold main body of the present invention. As a result, the region of the main body 41Za where the heat pipe 7Z is fixed (the upper region) functions as the second mold unit 5 of the first embodiment together with the first heat source unit 8, the second heat source unit 9, and the temperature measuring device 10. Similarly, the region of the main body 41Za below the region where the heat pipe 7Z is fixed (the region where the cooling source 41b is arranged) functions as the first mold unit 4 of the first embodiment. Thus, in the second embodiment, the first mold unit 4 (cooling mold unit 41Z) and a part of the second mold unit 5 of the first embodiment are integrated.

[0129] The first end 7Za protrudes from the main body 41Za in the +X direction, and the second end 7Zb protrudes from the main body 41Za in the -X direction. The first end 7Za and the second end 7Zb are examples of protruding ends in the present invention. In the following description, when the heat pipes 7Z are to be particularly distinguished from one another, the numbers "1" to "6" are added to the end of their reference numerals.

[0130] In the following description, reference will be made mainly to FIGS. The temperature measuring devices 10 are inserted into the corresponding insertion holes 40g and 41e. In the following description, when the temperature measuring devices 10 are to be particularly distinguished from one another, the numbers "1" to "6" are added to the end of the reference numerals. Temperature measuring device 101 is inserted into insertion hole 40g1, temperature measuring device 102 is inserted into insertion hole 40g2, and temperature measuring device 103 is inserted into insertion hole 40g3. Temperature measuring device 104 is inserted into insertion hole 41e1, temperature measuring device 105 is inserted into insertion hole 41e2, and temperature measuring device 106 is inserted into insertion hole 41e3.

[0131] In the insertion hole 41d, the heat pipe 7Z, and the contact portions 80b, 81b, 90b, and 91b, the same reference numerals used for distinction correspond to each other. For example, the insertion hole 41d1 corresponds to the heat pipe 7Z1, and the heat pipe 7Z1 is inserted into the insertion hole 41d1. The contact portions 80b1 and 81b1 correspond to the first end portion 7Za1 and can contact the first end portion 7Za1. The contact portions 90b1 and 91b1 correspond to the second end portion 7Zb1 and can contact the second end portion 7Zb1.

[0132] ●Operation of pressure device (2) Next, the operation of the present apparatus 1Z will be described below. In the following description, Figures 8, 9, and 21 to 24 will be referred to as appropriate. In the present apparatus 1Z, before the workpiece W is carried in, the heating mold unit 40Z is located at the processing position, and the cooling mold unit 41Z is located at the retracted position.

[0133] First, the mounting plate 3 on which the workpiece W is placed is placed on the cooling mold unit 41Z. Next, the first unit transport device 42 transports the heating mold unit 40Z to the standby position and then transports the cooling mold unit 41Z to the processing position. At this time, the first heat source unit 8 and the second heat source unit 9 are not in contact with the heat pipe 7Z.

[0134] Next, similarly to the first embodiment, the workpiece W is accommodated in the chamber unit CU.

[0135] Next, the control device 2 raises the chamber unit CU, moves the heated mold unit 40Z to the processing position, and moves the cooled mold unit 41Z to the standby position. At this time, the first end 7a of the heat pipe 7 is positioned between the first clamp members 80 and 81, and the second end 7b is positioned between the second clamp members 90 and 91. The heated mold unit 40Z has been heated in advance to a predetermined temperature "T1."

[0136] Next, the control device 2 lowers the chamber unit CU until the mounting plate 3 abuts against the main body portion 40Za. At this time, the control device 2 changes the set temperature of the heated mold unit 40 to "T2." The control device 2 also lowers the base member 12 to apply the main pressure to the workpiece W. Next, when the workpiece W is heated to the predetermined temperature "T3," the first heat source moving mechanism 84 moves the first clamp members 80, 81 to the clamping position.

[0137] FIG. 25 is a schematic cross-sectional view of the device 1Z showing a state in which the first clamp members 80 and 81 have moved to the clamping position.

[0138] Next, the first heat source moving mechanism 84 switches between contact with and separation from the first end 7a of the contact portions 80b, 81b so that the workpiece W is heated according to a specified temperature profile Pr1 (see FIG. 10; the same applies below) based on the temperature measurement results of the temperature measuring device 10. As a result, the temperature change rate of the workpiece W during heating changes so as to follow the temperature profile Pr1.

[0139] Next, when the temperature of the heated mold unit 40 drops to temperature "T2," the first heat source moving mechanism 84 moves the first clamp members 80, 81 to the non-clamping position. As a result, the temperatures of the main body 6, the heat pipe 7, and the workpiece W are maintained at temperature "T2," which is the temperature of the heated mold unit 40.

[0140] Next, after a predetermined time has elapsed, the control device 2 stops pressurizing the workpiece W. Next, the control device 2 raises the chamber unit CU to separate the mounting plate 3 from the main body 40Za. Next, the first unit transport device 42 moves the heated mold unit 40Z to the standby position and moves the cooled mold unit 41Z to the processing position. At this time, the second end 7Zb of the heat pipe 7Z is positioned between the first clamp members 80, 81, and the second end 7Zb is positioned between the second clamp members 90, 91. Here, the cooling unit 50 is cooled in advance to a predetermined temperature "T4."

[0141] Next, the control device 2 lowers the chamber unit CU until the mounting plate 3 abuts against the main body 6. Next, the first heat source moving mechanism 84 moves the first clamp members 80, 81 to the clamping position when the main body 6 is heated to a predetermined temperature "T5". Next, the first heat source moving mechanism 84 moves the first clamp members 80, 81 to the non-clamping position when the temperature of the workpiece W is cooled to the predetermined temperature "T6". Next, the control device 2 removes the workpiece W from the chamber unit CU, as in the first embodiment.

[0142] Summary (2) According to the embodiment described above, the present apparatus 1Z includes a mold unit 4Z. The area of ​​the mold unit 4Z that functions as the second mold unit 5 of the first embodiment is disposed between the area that functions as the first mold unit 4 of the first embodiment and the workpiece W (mounting plate 3). The mold unit 4Z includes main body portions 40Za and 41Za, a plurality of heat pipes 7 and 7Z, a first heat source unit 8, and a second heat source unit 9. The first heat source unit 8 includes a plurality of contact portions 80b and 81b, and a first heat source moving mechanism 84. The second heat source unit 9 includes a plurality of contact portions 90b and 91b, and a second heat source moving mechanism 94. The first heat source moving mechanism 84 switches between contact and separation of the contact portions 80b and 81b with the first end portion 7a. The second heat source moving mechanism 94 switches between contact and separation of the contact portions 90b and 91b with the second end portion 7Zb. According to this configuration, similarly to the first embodiment, the present device 1Z enables complex temperature control of the workpiece W, and can control the rate of temperature change when heating and cooling the workpiece W according to the purpose.

[0143] Furthermore, according to the embodiment described above, the mold unit 4Z is equipped with a temperature measuring device 10. The first heat source moving mechanism 84 and the second heat source moving mechanism 94 control the contact and separation of the contact portions 80b, 81b with respect to the first end 7a, and control the contact and separation of the contact portions 90b, 91b with respect to the second end 7Zb, based on the temperature measurement results of the temperature measuring device 10. According to this configuration, similar to the first embodiment, the accuracy of temperature control of the workpiece W is improved.

[0144] Furthermore, according to the embodiment described above, the first heat source moving mechanism 84 controls the contact and separation of the contact portions 80b, 81b with respect to the first end portion 7a so that the workpiece W is heated according to the temperature profile Pr1. With this configuration, the present device 1Z can control the temperature change rate and heating time when heating the workpiece W according to the temperature profile Pr1.

[0145] Furthermore, according to the embodiment described above, the second heat source moving mechanism 94 controls the contact and separation of the contact portions 90b, 91b with respect to the second end 7Zb so that the workpiece W is cooled according to the temperature profile Pr2. With this configuration, the present device 1Z can control the temperature change rate and cooling time during cooling of the workpiece W according to the temperature profile Pr2.

[0146] Furthermore, according to the embodiment described above, the first heat source moving mechanism 84 and the second heat source moving mechanism 94 function as a unit switching unit in the present invention, as in the first embodiment. With this configuration, the present device 1Z can further control the temperature change rate and heating time / cooling time when heating / cooling the workpiece W.

[0147] Furthermore, according to the embodiment described above, the mold unit 4Z includes a first heat source unit 8 corresponding to the first end 7a and a second heat source unit 9 corresponding to the second end 7Zb. The first heat source unit 8 is a cooling unit, and the second heat source unit 9 is a heating unit. With this configuration, the present device 1Z can control the temperature change rate and heating time / cooling time when heating / cooling the workpiece W, similar to the first embodiment.

[0148] Furthermore, according to the embodiment described above, the first heat source moving mechanism 84 collectively brings the contact portions 80b, 81b into contact with the corresponding first end portions 7a or collectively moves them away from each other. The second heat source moving mechanism 94 collectively brings the contact portions 90b, 91b into contact with the corresponding second end portions 7zb or collectively moves them away from each other. This configuration simplifies the structure of the first clamp members 80, 81 and the second clamp members 90, 91. Furthermore, the heat capacities of the first clamp members 80, 81 and the second clamp members 90, 91 are relatively large.

[0149] Furthermore, in the embodiment described above, the heating mold unit 40Z includes multiple heating sources 40c fixed to the main body 40Za, and the cooling mold unit 41Z includes multiple cooling sources 41b fixed to the main body 41Za. The heat pipe 7 is disposed above the heating source 40c, and the heat pipe 7Z is disposed above the cooling source 41b. In the vertical direction, the region of the main body 40Za where the heating source 40c is disposed functions as the first mold unit 4 of the first embodiment, and the region where the heat pipe 7 is disposed functions as the second mold unit 5 of the first embodiment. In the vertical direction, the region of the main body 41Za where the cooling source 41b is disposed functions as the first mold unit 4 of the first embodiment, and the region where the heat pipe 7Z is disposed functions as the second mold unit 5 of the first embodiment. With this configuration, unlike the first embodiment, there is no need to move the second mold unit 5, and the present apparatus 1Z can be made smaller than the present apparatus 1 of the first embodiment.

[0150] Furthermore, according to the embodiment described above, when viewed from the top and bottom, the heat pipes 7 are arranged parallel to each other and perpendicular to the heat source 40c, and the heat pipes 7Z are arranged parallel to each other and perpendicular to the cooling source 41b. With this configuration, when the heat pipes 7, 7Z are not heated or cooled by the first heat source unit 8 or the second heat source unit 9, the temperature uniformity of the main body 6 is improved.

[0151] In the second embodiment, the heating mold unit 40Z does not have to be equipped with the heat pipe 7, and the cooling mold unit 41Z does not have to be equipped with the heat pipe 7Z.

[0152] Furthermore, in the second embodiment, the heating mold unit 40Z may include a main body 40a and a main body 6, and the cooling mold unit 41Z may include a main body 41a and a main body 6. In this case, the main body 6 is fixed to the main bodies 40a and 41a, respectively. In this configuration, the maintainability of the heating mold unit 40Z and the cooling mold unit 41Z is improved.

[0153] ●Variations● Next, modified examples of this device will be described below, focusing on the differences from the first embodiment. In the following description of the modified examples, the same elements as in the first embodiment and elements having common functions are given the same reference numerals as in the first embodiment for the sake of convenience, and their description will be omitted. Each modified example can also be applied to the second embodiment. In the following description, reference will be made to Figures 1 to 5 as appropriate.

[0154] First modified example FIG. 26 is a schematic cross-sectional view of the present device, showing a first modified example of the present device.

[0155] In the first modified example, the second mold unit 5 includes a main body 6, a plurality of heat pipes 7, a first heat source unit 8, a second heat source unit 9, a plurality of temperature measuring devices 10, a second unit transport device 11, and a unit switching device 21. The unit switching device 21 is an example of the unit switching section of the present invention.

[0156] In the first modified example, the second heat source unit 9 also corresponds to the first end 7a. That is, when the heat pipe 7 is heated, the second clamp members 90, 91 abut against the first end 7a of the heat pipe 7 and transfer heat from the second heat sources 92, 93 to the heat pipe 7.

[0157] The unit switching device 21 switches between the first heat source unit 8 and the second heat source unit 9 for the first end 7a. Specifically, when the heat pipe 7 is heated, the unit switching device 21 switches between the first heat source unit 8 and the second heat source unit 9 so that the abutting portions 80b, 81b or the abutting portions 90b, 91b can abut against the corresponding first end 7a. Similarly, when the heat pipe 7 is cooled, the unit switching device 21 switches between the first heat source unit 8 and the second heat source unit 9 so that the abutting portions 80b, 81b or the abutting portions 90b, 91b can abut against the corresponding first end 7a. With this configuration, the same effects as in the first embodiment can be obtained.

[0158] In the first modified example, the second end portion 7b does not have to protrude from the main body portion 6, as in the second modified example described later.

[0159] In the first modified example, the second mold unit 5 may include the first heat source unit 8, the second heat source unit 9, and the unit switching device 21, which correspond to the second end portion 7b.

[0160] Second Modification to Fourth Modification Figure 27(a) is a schematic plan view of a second mold unit showing a second modified example of the device, (b) is a schematic plan view of a second mold unit showing a third modified example of the device, and (c) is a schematic plan view of a second mold unit showing a fourth modified example of the device. In the second to fourth modified examples, the arrangement and / or number of the heat pipes 7 differ from that of the first embodiment.

[0161] As shown in FIG. 27(a), in the second modified example, only the first end 7a of the heat pipe 7 protrudes from the main body 6, and the second end 7b is disposed inside the main body 6. Furthermore, the second mold unit 5 does not include a second heat source unit 9. In this configuration, when the first end 7a is heated, the second end 7b is not exposed to the atmosphere. Therefore, the second end 7b does not function as a heat sink, and the temperature of the end of the main body 6 on the -X direction side is difficult to decrease.

[0162] In the second modified example, the first heat source 82 may be a heating source, and the first heat source 83 may be a cooling source. In this case, when the first heat source 82 is ON, the first heat source 83 is OFF, and when the first heat source 83 is ON, the first heat source 82 is OFF. This ON / OFF switching is controlled, for example, by the control device 2. That is, the control device 2 can function as the heat source switching unit of the present invention. In this configuration, the present device 1 can heat and cool the heat pipes 7 with one first heat source unit 8. In other words, in this case, the first heat source unit 8 functions as a heating unit and a cooling unit, and also functions as the unit switching unit of the present invention.

[0163] 27(b), in the third modified example, first ends 7a2, 7a4, 7a6 of half of the heat pipes 72, 74, 76 protrude in the +X direction from the main body 6, and second ends 7b2, 7b4, 7b6 are disposed inside the main body 6. Similarly, second ends 7b1, 7b3, 7b5 of half of the heat pipes 71, 73, 75 protrude in the −X direction from the main body 6, and first ends 7a1, 7a3, 7a5 are disposed inside the main body 6.

[0164] As shown in FIG. 27(c), in the fourth modification, the second mold unit 5 includes eight heat pipes 71 to 78. In the Y-axis direction, the heat pipes 71 to 78 are arranged in order from the +Y direction. The distance between the heat pipes 71 and 72 is the same as the distance between the heat pipes 77 and 78 and is smaller than the distance between the heat pipes 72 and 73. The heat pipes 73 to 76 are arranged at equal intervals, and the intervals are larger than the distance between the heat pipes 72 and 73. That is, in the Y-axis direction, the intervals between adjacent heat pipes 71 to 78 become narrower toward the end of the main body 6 (the intervals are not uniform). In this configuration, by concentrating the heat pipes 7 at the end of the main body 6 where the temperature is likely to drop, the drop in temperature at the end is suppressed.

[0165] Fifth Variation FIG. 28(a) is a schematic plan view of the second mold unit 5 showing a fifth modified example of the present device, and (b) is a schematic view of the first heat source unit 8 as seen from the arrow G in (a). In the drawing, for the sake of convenience, a first area A11 and a third area A13, which will be described later, are shown hatched, and a second area A12 is shown in gray.

[0166] As shown in FIG. 28, in the fifth modified example, the first heat source unit 8 is physically divided into three sections: a first section 8A including contact portions 80b1 and 81b1; a second section 8B including contact portions 80b2 to 80b5 and 81b2 to 81b5; and a third section 8C including contact portions 80b6 and 81b6. The first section 8A, second section 8B, and third section 8C can each operate independently. The first heat source movement mechanism 84 switches the first section 8A, second section 8B, and third section 8C between contact and separation at different / same timings. That is, the contact portions 80b1, 80b6, 81b1, and 81b6 can move independently of the contact portions 80b2 to 80b5 and 81b2 to 81b5. When viewed from the top to bottom, the region of the main body 6 where the heat pipe 71 is arranged is the first region A11, the region where the heat pipes 72 to 75 are arranged is the second region A12, and the region where the heat pipe 76 is arranged is the third region A13. The second mold unit 5 includes five temperature measuring devices 101 to 105. The temperature measuring device 104 is arranged at the end of the main body 6 on the +Y direction side, and the temperature measuring device 105 is arranged at the end of the main body 6 on the -Y direction side. The heat pipe 71 (76) is an example of a first heat pipe in the present invention, and the heat pipes 72 to 75 are examples of a second heat pipe in the present invention. The contact portions 80b1, 80b6, 81b1, and 81b6 are examples of first contact portions in the present invention, and the contact portions 80b2 to 80b5 and 81b2 to 81b5 are examples of second contact portions in the present invention. In this configuration, different temperature control or the same temperature control is possible in the first area A11, the second area A12, and the third area A13.

[0167] In the fifth modified example, the number of sections into which the first heat source unit 8 is physically divided is not limited to "3." That is, for example, the first heat source unit 8 may be divided into sections for each of the heat pipes 71 to 76. In this case, the sections corresponding to the heat pipes 71, 73, and 75 may function as heating units, and the sections corresponding to the heat pipes 72, 74, and 76 may function as cooling units.

[0168] In the fifth modification, the second section 8B may also function as a cooling unit.

[0169] ●Other embodiments● In each embodiment, the present apparatus 1, 1Z may not include the heating mold unit 40, 40Z or the cooling mold unit 41, 41Z, and the first unit transport device 42. In this case, in the present apparatus 1, the chamber unit CU may not move in the vertical direction.

[0170] In the first embodiment, the second mold unit 5 may be used only when the workpiece W is heated or cooled.

[0171] Furthermore, in each embodiment, the first heat source unit 8 may be a heating unit, and the second heat source unit 9 may be a cooling unit.

[0172] Furthermore, in each embodiment, the first heat source unit 8 and the second heat source unit 9 may both be heating units or cooling units.

[0173] Furthermore, in each embodiment, the number of heat pipes 7, 7Z is not limited to 6. In this case, the numbers of insertion holes 6c, 40f, 41d are set according to the number of heat pipes 7, 7Z.

[0174] Furthermore, in each embodiment, the direction along which the heat pipes 7 extend is not limited to the X-axis direction, as long as the heat pipes 7 are arranged parallel to the horizontal direction. That is, for example, the heat pipes 7 may be arranged along the Y-axis direction. In this case, the heat pipes 7 are arranged parallel to the heating source 40c and the cooling source 41b when viewed from the top and bottom. Even with this configuration, when the heat pipes 7 are not heated or cooled by the first heat source unit 8 or the second heat source unit 9, the temperature uniformity of the main body 6 is improved.

[0175] Furthermore, in each embodiment, the heat pipes 7 do not have to be arranged at equal intervals. That is, for example, as in the fourth modified example, the intervals between some of the heat pipes 7 may be different from the intervals between other parts. Also, for example, the heat pipes 7 may be arranged in a concentrated manner at the position where the workpiece W is placed when viewed from above.

[0176] Furthermore, in each embodiment, the method by which the first heat source unit 8 and the second heat source unit 9 abut against the heat pipes 7, 7Z is not limited to clamping. That is, for example, the first heat source unit 8 and the second heat source unit 9 may have insertion holes into which the first end 7a or the second end 7b is inserted (fitted). In this case, the first heat source moving mechanism 84 and the second heat source moving mechanism 94 are configured to move the insertion holes relative to the first end 7a or the second end 7b. The insertion holes function as abutment parts in the present invention. Also, for example, only the first clamp member 80 or the first clamp member 81 may abut against the heat pipe 7. In this case, the first heat source unit 8 may have only one of the first clamp members 80, 81. The same applies to the second heat source unit 9.

[0177] Furthermore, in each embodiment, the present device 1, 1Z does not need to be equipped with the temperature measuring device 10. Even in this configuration, if the temperature change of the workpiece W is already known, the present device 1, 1Z can control the temperature (control the temperature gradient) according to the workpiece W.

[0178] Furthermore, in each embodiment, the number of temperature measuring devices 10 is not limited to "3" or "6." In this case, the numbers of insertion holes 6d, 40g, 41e are set according to the number of temperature measuring devices 10.

[0179] Furthermore, in each embodiment, the temperature measuring device 10 is not limited to a thermocouple.

[0180] Furthermore, in each embodiment, the storage unit does not have to store the temperature profiles Pr1 and Pr2. That is, the first heat source moving mechanism 84 does not have to switch the contact portions 80b and 81b between contact with and separation from the first end portion 7a so that the workpiece W is heated according to the temperature profile Pr1. The same applies to the second heat source moving mechanism 94.

[0181] Furthermore, in each embodiment, the storage unit may store a temperature profile different from the temperature profiles Pr1 and Pr2.

[0182] Furthermore, in each embodiment, the heating mold units 40, 40Z and the cooling mold units 41, 41Z may be transported along the X-axis direction.

[0183] Furthermore, in the first embodiment, the main body 6 may be transported along the X-axis direction.

[0184] ●Embodiments of the present invention● Next, the embodiments of the present invention that can be understood from the above-described embodiments will be described below, using the terms and symbols described in the respective embodiments.

[0185] A first embodiment of the present invention is a pressure device (for example, pressure device 1, 1Z) that pressurizes a work (for example, work W), and is arranged below the work and can heat or cool the work. A first mold unit (for example, first mold unit 4, mold unit 4Z) that can heat or cool the work together with the first mold unit. The second mold unit has a plurality of heat pipes (for example, heat pipes 7, 7Z) and a mold body (for example, body part) that is arranged between the work and the first mold unit when the plurality of heat pipes are fixed and the work is heated or cooled. 6, main body portion 40Za, 41Za), and a heat source unit (e.g., first heat source unit 8, second heat source unit 9) capable of heating or cooling a corresponding one of the plurality of heat pipes, wherein each of the heat pipes has a protruding end portion (e.g., first end portion 7a, second end portion 7b) protruding horizontally from the mold main body portion, and the heat source unit is movable relative to each of the protruding end portions and comprises a plurality of abutment portions (e.g., abutment portions 80b, 81b, 90b, 91b) capable of abutting against the corresponding protruding end portion, and an abutment switching portion (e.g., first heat source moving mechanism 84, second heat source moving mechanism 94) that switches between abutment and separation of the abutment portions with respect to the protruding end portions. This configuration allows for complex temperature control of the workpiece, and the rate of temperature change during heating and cooling of the workpiece can be controlled according to the purpose.

[0186] A second embodiment of the present invention is a pressure device in which, in the first embodiment, the second mold unit is equipped with a temperature measuring device (e.g., temperature measuring device 10) capable of measuring the temperature of the mold main body portion, and the contact switching unit switches between the contact and separation of the contact portion based on the measurement result of the temperature measuring device. According to this configuration, the accuracy of the temperature control of the workpiece is improved.

[0187] A third embodiment of the present invention is a pressure device in which, in the second embodiment, the first mold unit includes a heated mold unit (e.g., heated mold unit 40, 40Z) that heats the workpiece, the heat source unit includes a cooling source (e.g., first heat source 82, 83) that cools the heat pipe or a heating source (e.g., second heat source 92, 93) that heats the heat pipe, and the contact switching unit switches the contact and separation of the contact unit so that the workpiece is heated according to a specified temperature profile (e.g., temperature profile Pr1). According to this configuration, the temperature change rate and heating time when heating the workpiece can be controlled in accordance with the temperature profile.

[0188] A fourth embodiment of the present invention is a pressure device in which, in the second embodiment, the first mold unit includes a cooling mold unit (e.g., cooling mold unit 41, 41Z) that cools the workpiece, the heat source unit includes a cooling source that cools the heat pipe or a heating source that heats the heat pipe, and the contact switching unit switches the contact and separation of the contact unit so that the workpiece is cooled according to a specified temperature profile (e.g., temperature profile Pr2). According to this configuration, the temperature change rate and cooling time during cooling of the workpiece can be controlled in accordance with the temperature profile.

[0189] A fifth embodiment of the present invention is a pressure applying device in which, in the second embodiment, the first mold unit comprises a heated mold unit that heats the workpiece or a cooled mold unit that cools the workpiece, and the heat source unit comprises a heat source (e.g., first heat source 82, second heat source 92) that heats the heat pipe, a cooling source (e.g., first heat source 83, second heat source 93) that cools the heat pipe, and a heat source switching unit (e.g., first heat source moving mechanism 84, second heat source moving mechanism 94) that switches between the heating source and the cooling source, and the heat source switching unit switches between the heating source and the cooling source so that the workpiece is heated or cooled according to a specified temperature profile. According to this configuration, the present device can heat and cool the heat pipe with one first heat source unit.

[0190] A sixth embodiment of the present invention is a pressure device in which, in the first embodiment, the heat source unit comprises a heating unit (e.g., second heat source unit 9) that heats the corresponding heat pipe, a cooling unit (e.g., first heat source unit 8) that cools the corresponding heat pipe, and a unit switching unit (e.g., unit switching device 21) that switches between the heating unit and the cooling unit, and the unit switching unit switches between the heating unit and the cooling unit so that when the heat pipe is heated, the abutment portion of the heating unit can abut against the corresponding protruding end, and when the heat pipe is cooled, the abutment portion of the cooling unit can abut against the corresponding protruding end, With this configuration, the device can control the temperature change rate and heating time / cooling time when heating / cooling the workpiece.

[0191] A seventh embodiment of the present invention is a pressurizing device in the first embodiment, wherein each of the heat pipes has a first protruding end (e.g., first end 7a) that protrudes from the mold main body in a first direction (e.g., +X direction) in the horizontal direction and functions as the protruding end, and a second protruding end (e.g., second end 7b) that protrudes from the mold main body in a second direction (e.g., -X direction) that is the opposite direction to the first direction and functions as the protruding end, the heat source unit has a first heat source unit (e.g., first heat source unit 8) corresponding to the first protruding end and a second heat source unit (e.g., second heat source unit 9) corresponding to the second protruding end, the first heat source unit is a heating unit that heats the corresponding heat pipe or a cooling unit that cools the corresponding heat pipe, and the second heat source unit is the heating unit or the cooling unit. With this configuration, the device can further control the temperature gradient and heating time / cooling time when the workpiece is heated / cooled.

[0192] An eighth embodiment of the present invention is any of the first to seventh embodiments, wherein the heat source unit comprises a heat source main body portion (e.g., first clamp members 80, 81, second clamp members 90, 91) in which a plurality of the abutment portions are arranged, and the abutment switching portion is a pressure applying device that moves the heat source main body portion to collectively abut or separate the plurality of abutment portions from the protruding end portion. According to this configuration, the structures of the first clamp member and the second clamp member can be simplified.

[0193] A ninth embodiment of the present invention is a pressurizing device according to any one of the first to seventh embodiments, wherein the plurality of heat pipes comprises a first heat pipe (e.g., heat pipe 71) and a second heat pipe (e.g., heat pipes 72 to 75), and the plurality of abutment portions comprise first abutment portions (e.g., abutment portions 80b1, 80b6, 81b1, 81b6) corresponding to the protruding end portion (e.g., first end portion 7a1, 7a6) of the first heat pipe and second abutment portions (e.g., abutment portions 80b2 to 80b5, 81b2 to 81b5) corresponding to the protruding end portion (e.g., first end portion 7a2 to 7a5) of the second heat pipe, and each of the first abutment portion and the second abutment portion is independently movable. This configuration allows different temperature controls to be performed on the first heat pipe and the second heat pipe.

[0194] A tenth embodiment of the present invention is a pressure device in which, in the ninth embodiment, when viewed from the vertical direction, the mold main body portion has a first region (e.g., first region A11) and a second region (e.g., second region A12) in which temperature control different from that of the first region is performed, the first heat pipe is arranged in the first region, the second heat pipe is arranged in the second region, and the abutment switching unit switches the abutment and separation of the first abutment portion and the second abutment portion at different times. This configuration allows different temperature controls to be performed in the first and second regions.

[0195] An eleventh embodiment of the present invention is a pressure applying device in which, in the first embodiment, the first mold unit (e.g., heating mold unit 40Z, cooling mold unit 41Z) is provided with a plurality of first heating sources (e.g., heating source 40c) or a plurality of first cooling sources (e.g., cooling source 41b) fixed to the mold main body portion, and the plurality of heat pipes (e.g., heat pipes 7, 7Z) are arranged above the plurality of first heating sources or the plurality of first cooling sources, so that in the vertical direction, the area of ​​the mold main body portion where the plurality of first heating sources or the plurality of first cooling sources are arranged functions as the first mold unit, and in the vertical direction, the area of ​​the mold main body portion where the plurality of heat pipes are arranged functions as the second mold unit. This configuration enables complex temperature control of the workpiece, and the rate of temperature change during heating and cooling of the workpiece W can be controlled according to the purpose.

[0196] A twelfth embodiment of the present invention is a pressure device in which, in the first embodiment, the second mold unit (e.g., second mold unit 5) is separate from the first mold unit (e.g., first mold unit 4), the mold main body is movable horizontally relative to the first mold unit, and when the workpiece is not heated or cooled, the mold main body moves relative to the first mold unit from a processing position above the first mold unit to a waiting position horizontally spaced from the processing position. According to this configuration, the device can control the temperature change rate and heating time / cooling time when heating / cooling the workpiece by selecting whether or not to use the second die unit.

[0197] A thirteenth embodiment of the present invention is a pressure applying device in which, in the first embodiment, the first mold unit is provided with a plurality of first heating sources (e.g., heating source 40c) or a plurality of first cooling sources (e.g., cooling source 41b), the shape of the first heating sources or the first cooling sources is linear, each of the plurality of first heating sources or each of the plurality of first cooling sources is arranged parallel to each other, and when viewed in the vertical direction, the plurality of heat pipes are arranged parallel to each other so as to be perpendicular to or parallel to the first heating sources or the first cooling sources. According to this configuration, when the heat pipe is not heated or cooled by the first heat source unit or the second heat source unit, the temperature uniformity of the main body is improved. [Explanation of symbols]

[0198] 1. Pressure device 2. Control device 4. First mold unit 40 Heated mold unit 40c heating source 41 Cooling mold unit 41b Cooling source 5. Second mold unit 6 Main body 7 Heat Pipes 71 Heat pipe (first heat pipe) 72~75 Heat pipe (second heat pipe) 7a First end (protruding end, first protruding end) 7b Second end (protruding end, second protruding end) 8. First heat source unit (heat source unit, cooling unit) 80 First clamp member (heat source main body) 80b Contact part 80b1~80b6 Contact part (1st contact part, 2nd contact part) 81 First clamp member (heat source main body) 81b Contact part 81b1~81b6 Contact part (1st contact part, 2nd contact part) 82 1st heat source (cooling source, heating source) 83 1st heat source (cooling source, heating source) 84 First heat source moving mechanism (contact switching unit, heat source switching unit) 9 Second heat source unit (heat source unit, heating unit) 90 Second clamp member (heat source main body) 90b Contact part 91 Second clamp member (heat source main body) 91b Contact part 92 Second heat source (heating source, cooling source) 93 Second heat source (heating source, cooling source) 94 Second heat source moving mechanism (contact switching unit, heat source switching unit) 10 Temperature measuring device 21 Unit switching section 1Z Pressure device 4Z mold unit 40Z Heated Mold Unit 40Za main body 41Z Cooling Mold Unit 41Za main body 7Z Heat Pipe A11 1st area A12 2nd area Pr1 Temperature Profile Pr2 temperature profile

Claims

1. A pressure device that applies pressure to a workpiece, a first die unit disposed below the workpiece and capable of heating or cooling the workpiece; a second die unit capable of heating or cooling the workpiece together with the first die unit; and The second mold unit is A plurality of heat pipes; a mold body portion to which the plurality of heat pipes are fixed and which is disposed between the workpiece and the first mold unit when the workpiece is heated or cooled; a heat source unit capable of heating or cooling a corresponding one of the plurality of heat pipes; With Each of the heat pipes a protruding end portion protruding horizontally from the mold body portion; With The heat source unit is a plurality of contact portions that are movable relative to the respective protruding ends and that are capable of contacting the corresponding protruding ends; a contact switching portion that switches between contact and separation of the contact portion with the protruding end portion; Equipped with Pressure device.

2. The second mold unit is a temperature measuring device capable of measuring the temperature of the mold body; With the contact switching unit switches between the contact state and the separation state of the contact unit based on a measurement result of the temperature measuring device. The pressure device according to claim 1 .

3. The first mold unit includes: a heating mold unit for heating the workpiece; With The heat source unit is a cooling source for cooling the heat pipe; or a heat source for heating the heat pipe; With the contact switching unit switches between the contact state and the separation state of the contact unit so that the workpiece is heated according to a specified temperature profile. The pressure device according to claim 2 .

4. The first mold unit includes: a cooling mold unit for cooling the workpiece; With The heat source unit is a cooling source for cooling the heat pipe; or a heat source for heating the heat pipe; With the contact switching unit switches between the contact state and the separation state of the contact unit so that the workpiece is cooled according to a specified temperature profile. The pressure device according to claim 2 .

5. The first mold unit includes: a heating mold unit for heating the workpiece; or a cooling mold unit for cooling the workpiece; With The heat source unit is a heat source for heating the heat pipe; a cooling source for cooling the heat pipe; a heat source switching unit that switches between the heating source and the cooling source; With the heat source switching unit switches between the heating source and the cooling source so that the workpiece is heated or cooled according to a specified temperature profile. The pressure device according to claim 2 .

6. The heat source unit is a heating unit for heating the corresponding heat pipe; a cooling unit for cooling the corresponding heat pipe; a unit switching unit that switches between the heating unit and the cooling unit; With The unit switching unit When the heat pipe is heated, the heating unit and the cooling unit are switched so that the abutting portion of the heating unit can abut against the corresponding protruding end portion, switching between the heating unit and the cooling unit so that the contact portion of the cooling unit can contact the corresponding protruding end portion when the heat pipe is cooled; The pressure device according to claim 1 .

7. Each of the heat pipes a first protruding end portion that protrudes from the mold body portion in a first direction in the horizontal direction and functions as the protruding end portion; a second protruding end portion that protrudes from the mold body portion in a second direction that is the opposite direction to the first direction and functions as the protruding end portion; With The heat source unit is a first heat source unit corresponding to the first protruding end; a second heat source unit corresponding to the second protruding end; With The first heat source unit is a heating unit for heating the corresponding heat pipe; or a cooling unit for cooling the corresponding heat pipe; The second heat source unit is the heating unit; or The cooling unit, The pressure device according to claim 1 .

8. The heat source unit is a heat source main body in which the plurality of contact portions are arranged; With The contact switching unit moves the heat source main body to collectively contact or separate the plurality of contact portions from the protruding end portion. A pressure device according to any one of claims 1 to 7.

9. The plurality of heat pipes include: A first heat pipe; A second heat pipe; With The plurality of abutment portions are a first contact portion corresponding to the protruding end portion of the first heat pipe; a second contact portion corresponding to the protruding end portion of the second heat pipe; With The first contact portion and the second contact portion are independently movable. A pressure device according to any one of claims 1 to 7.

10. When viewed in the up-down direction, the mold body portion is A first region; a second region in which a temperature control different from that of the first region is performed; With The first heat pipe is disposed in the first region, The second heat pipe is disposed in the second region, the contact switching unit switches between the contact and the separation of the first contact portion and the second contact portion at different timings, The pressure device according to claim 9.

11. The first mold unit includes: a plurality of first heating sources or a plurality of first cooling sources fixed to the mold body; With the plurality of heat pipes are arranged above the plurality of first heating sources or the plurality of first cooling sources, In the vertical direction, a region of the mold body where the plurality of first heating sources or the plurality of first cooling sources are arranged functions as the first mold unit, In the vertical direction, a region of the mold body where the plurality of heat pipes are arranged functions as the second mold unit. The pressure device according to claim 1 .

12. the second mold unit is separate from the first mold unit, the mold body is movable relative to the first mold unit in a horizontal direction, When the workpiece is not heated or cooled, the mold body portion moves relatively from a processing position above the first mold unit to a standby position spaced apart from the processing position in a horizontal direction. The pressure device according to claim 1 .

13. The first mold unit includes: a plurality of first heating sources or a plurality of first cooling sources; With the first heating source or the first cooling source has a linear shape; The plurality of first heating sources or the plurality of first cooling sources are arranged parallel to each other, When viewed in the up-down direction, the heat pipes are arranged parallel to each other so as to be perpendicular to or parallel to the first heating source or the first cooling source. The pressure device according to claim 1 .

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