Substrate processing system, control method thereof, and storage medium

Abstract

To simplify the configuration of a substrate processing system including a batch module and a single wafer module, and reduce the manufacturing cost of the system.SOLUTION: A single wafer processing device 2 according to the present invention includes a second control unit 132 that, when the center robot CR is able to load a substrate W into a single wafer processing chamber, sends, to the relay device 6, an enabling signal to cause a lifting mechanism 72b in the relay device 6 to perform an exposing operation to position the substrates W one by one above a standby tank 73. According to the present invention, it is possible to omit or simplify a pure water supply device in a substrate mounting unit SRM that transfers the substrates W between the relay device 6 and the single wafer processing device 2.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a substrate processing system for performing predetermined processing on various substrates such as semiconductor substrates, substrates for FPDs (Flat Panel Displays) such as liquid crystal displays and organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical disks, as well as a control method for the same and a storage medium. [Background technology]

[0002] Conventionally, this type of apparatus includes those equipped with a batch module and a single-wafer module (see, for example, Patent Document 1). A batch module performs a predetermined process on multiple substrates at once. A single-wafer module performs a predetermined process on each substrate. Batch modules and single-wafer modules each have their own unique advantages. A substrate processing apparatus equipped with a batch module and a single-wafer module combines the advantages of both, thereby achieving a configuration that is more advantageous than a batch substrate processing apparatus or a single-wafer substrate processing apparatus.

[0003] The substrate processing system described in Patent Document 1 includes a transfer table that transfers substrates between a batch module and a single-wafer module. The transfer table has a pure water supply unit, a liquid receiving unit, and three or more pins. The pure water supply unit has a nozzle that supplies pure water to the top surface of the substrate placed on the transfer table to prevent the substrate from drying out. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2023-129235 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the above configuration requires a pure water supply device that can reliably supply pure water to the position where substrates are transferred between the batch module and the single-wafer module, which is not a desirable configuration because it makes the device more complicated.

[0006] The present invention has been made in consideration of the above circumstances, and aims to simplify the configuration of a substrate processing system equipped with a batch-type module and a single-wafer-type module, thereby reducing the manufacturing costs of the system. [Means for solving the problem]

[0007] In order to solve the above-mentioned problems, the present invention has the following configuration. That is, the substrate processing system of the present invention is a substrate processing system that continuously performs batch processing, in which a plurality of substrates are processed at once, and single wafer processing, in which substrates are processed one by one, a batch processing device that performs batch processing; at least one single wafer processing apparatus for performing single wafer processing on the batch-processed substrates; at least one relay device having two positions defined therein: a carry-in position for receiving batch-processed substrates from the batch processing device; and an unloading position for transferring the substrates received at the carry-in position to the single wafer processing device; The batch processing device comprises: at least one batch processing tank capable of immersing a plurality of vertically oriented substrates at once; The single wafer processing apparatus includes: a plurality of single wafer processing chambers capable of processing horizontally oriented substrates one by one; a center robot that carries a substrate in a horizontal position into the single wafer processing chamber; Equipped with The relay device a position change mechanism capable of changing the position of the substrates from a vertical position to a horizontal position at the loading position; a standby tank for holding the plurality of substrates, which have been converted into horizontal positions, in pure water at the loading position; a lifting mechanism that performs an exposure operation to position the substrates waiting in the standby tank one by one above the standby tank; an intermediary transport mechanism provided between the loading position and the unloading position, the intermediary transport mechanism being capable of transporting a substrate positioned above the standby tank along a substrate transport path to the unloading position; a substrate placement unit on which a horizontally oriented substrate can be placed at the unloading position and which is accessible by the center robot; The single wafer processing apparatus includes a control unit that transmits, to the relay apparatus, an enabling signal for causing the lifting mechanism in the relay apparatus to perform an exposing operation when the center robot is able to load the substrate into any one of the plurality of single wafer processing chambers. It is characterized by the following.

[0008] [Operations and Effects] The present invention provides a substrate processing system including a batch processing device that performs batch processing, at least one single-wafer processing device that performs single-wafer processing on batch-processed substrates, and at least one relay device that has two defined positions: a loading position for receiving batch-processed substrates from the batch processing device and an unloading position for transferring the substrates received at the loading position to the single-wafer processing device. The single-wafer processing device includes a control unit that, when a center robot is able to load a substrate into one of multiple single-wafer processing chambers, sends an enable signal to the relay device to cause the lifting mechanism in the relay device to perform an exposure operation to position the substrate one by one above a waiting tank. With this configuration, when the center robot of the single-wafer processing device is able to load a substrate into the single-wafer processing chamber, the relay device performs the exposure operation for the substrate. Substrates that have been moved above the waiting tank by the exposure operation are quickly transported by the relay transport mechanism to the single-wafer processing device and loaded into the single-wafer processing chamber. With this configuration, the substrates are transported to the single-wafer processing chamber before they dry after the exposure operation. According to the present invention, the waiting time of the substrate on the substrate mounting part that transfers the substrate between the relay device and the single wafer processing device is minimized, so that the substrate on the substrate mounting part can be reliably prevented from drying out. The present invention simplifies the device configuration of the substrate processing system and reduces the manufacturing cost of the device by eliminating or simplifying the pure water supply device on the substrate mounting part.

[0009] In addition, in the above-mentioned substrate processing system, It is preferable that the control unit in the single wafer processing apparatus transmits the permission signal to the relay device at predetermined intervals from when the center robot transports the substrate from the substrate placement unit to the single wafer processing chamber until the center robot returns to the substrate placement unit.

[0010] [Operations and Effects] According to the above-described configuration, the center robot transmits an enable signal to the relay device at predetermined intervals from when the center robot transports a substrate from the substrate platform to the single-wafer processing chamber until the center robot returns to the substrate platform. This configuration prevents the center robot from having to wait until a substrate is transported to the substrate platform, thereby providing a substrate processing system with high throughput.

[0011] In addition, in the above-mentioned substrate processing system, If the predetermined time is shorter than the relay transport time required for the relay transport mechanism to transport the substrate from the loading position to the unloading position, it is preferable that the control unit in the sheet processing apparatus sends a permission signal to the relay device for the substrate to be next unloaded at a time that is the time difference between the relay transport time and the predetermined time before the time when the center robot unloads the substrate from the substrate loading position.

[0012] [Actions and Effects] According to the above-described configuration, if the predetermined time is shorter than the relay transport time required for the relay transport mechanism to transport a substrate from the loading position to the unloading position, a permission signal for the next substrate to be removed is sent to the relay device at a time that precedes the time when the center robot removes the substrate from the substrate mounting section by the difference between the relay transport time and the predetermined time. With this configuration, while the relay device is transporting a substrate, the subsequent substrate is moved above the standby tank by an exposure operation. Because the relay device takes longer to transport substrates than the center robot, the relay device is configured to transport multiple substrates simultaneously to make up for this delay. This configuration prevents the center robot from having to wait until a substrate is transported to the substrate mounting section, thereby providing a substrate processing system with high throughput.

[0013] In addition, in the above-mentioned substrate processing system, If the predetermined time is longer than the relay transport time required for the relay transport mechanism to transport the substrate from the loading position to the unloading position, it is preferable that the control unit in the single-wafer processing apparatus sends an authorization signal to the relay device for the substrate to be next unloaded at a time when the difference between the relay transport time and the predetermined time has elapsed since the center robot unloaded the substrate from the substrate loading position.

[0014] [Actions and Effects] According to the above-described configuration, if the predetermined time is longer than the relay transport time required for the relay transport mechanism to transport a substrate from the loading position to the unloading position, a permission signal for the next substrate to be removed is sent to the relay device at the point when the difference between the relay transport time and the predetermined time has elapsed since the center robot removed the substrate from the substrate mounting unit. This configuration prevents subsequent substrates from being exposed above the standby tank while a substrate is being transported by the relay device. Because the relay device can transport substrates faster than the center robot, the center robot waits for the operation of the center robot until it removes the substrate from the substrate mounting unit before transporting the subsequent substrate. This configuration prevents substrates from being left on the substrate mounting unit for long periods of time, providing a substrate processing system that reliably prevents substrates from drying out.

[0015] In addition, in the above-mentioned substrate processing system, The control unit in the single wafer processing apparatus It is preferable to transmit the permission signal to the relay device after there is only one empty single wafer processing chamber, and then transmit the next permission signal to the relay device at a time when it is expected that the center robot will be able to transport a substrate to the single wafer processing chamber.

[0016] [Actions and Effects] According to the above-described configuration, after an enabling signal is sent to the relay device when only one single wafer processing chamber remains empty, the next enabling signal is sent to the relay device when it is expected that the center robot will be able to transport a substrate to the single wafer processing chamber. If a substrate waiting in a standby tank is transported when the single wafer processing chambers in a single wafer processing apparatus are full, this could result in the substrate having to wait for a long time on the substrate placement unit. According to the present invention, the substrate exposure operation is not performed until it is expected that the center robot will be able to transport the substrate to the single wafer processing chamber, so this situation does not occur.

[0017] In addition, in the above-mentioned substrate processing system, It is preferable that the center robot is capable of transporting the substrate on the substrate platform at the time when the substrate is placed on the substrate platform.

[0018] [Operations and Effects] According to the above-described configuration, the center robot can transport the substrate from the substrate mounting section as soon as the substrate is placed on the substrate mounting section. This configuration eliminates the wait time for the center robot to wait for the substrate to be transported to the substrate mounting section, thereby providing a substrate processing system with high throughput.

[0019] The present specification provides a system comprising a batch processing apparatus for performing batch processing, at least one single wafer processing apparatus for performing single wafer processing on substrates that have been batch processed, and at least one relay apparatus having two defined positions: a carry-in position for receiving batch-processed substrates from the batch processing apparatus, and an unloading position for transferring the substrates received at the carry-in position to the single wafer processing apparatus, wherein the batch processing apparatus comprises at least one batch processing tank capable of immersion processing a plurality of vertically oriented substrates all at once, and the single wafer processing apparatus comprises a plurality of single wafer processing chambers capable of processing horizontally oriented substrates one by one, and a center robot for loading the horizontally oriented substrates into the single wafer processing chambers. a relay device that includes a position change mechanism capable of changing a position of a plurality of substrates from a vertical position to a horizontal position at the loading position, a standby tank that holds the plurality of substrates that have been changed to a horizontal position in pure water at the loading position, a lifting mechanism that performs an exposure operation to position the substrates waiting in the standby tank one by one above the standby tank, a relay transport mechanism that is a mechanism provided between the loading position and the unloading position and that is capable of transporting substrates positioned above the standby tank along a substrate transport path to the unloading position, and a substrate mounting section that can mount a substrate in a horizontal position at the unloading position and that is accessible by the center robot, a determining step of determining whether the center robot can transfer a substrate into any one of the plurality of single wafer processing chambers; a transmitting step of transmitting, to the relay device, an enabling signal for causing the lifting mechanism in the relay device to perform an exposure operation when the determination is true. The present invention also discloses a method for controlling a substrate processing system characterized by the above.

[0020] [Operations and Effects] According to this configuration, it is possible to provide a substrate processing method that has the same effects as the above-described substrate processing system.

[0021] This specification also discloses an invention relating to a computer-readable storage medium that stores a program for causing an apparatus to execute the above-described control method. [Effects of the Invention]

[0022] According to the present invention, the configuration of a substrate processing system including a batch-type module and a single-wafer-type module can be simplified, and the manufacturing cost of the system can be reduced. [Brief explanation of the drawings]

[0023] [Figure 1] 1 is a plan view illustrating an overall configuration of a substrate processing system according to an embodiment. [Figure 2] 1 is a plan view illustrating the overall configuration of a batch processing apparatus according to an embodiment. [Figure 3] 3A and 3B are schematic diagrams illustrating the configuration of an HVC attitude conversion unit in the embodiment. [Figure 4] 5A and 5B are schematic diagrams illustrating the configuration of a first attitude conversion mechanism in the embodiment. [Figure 5A] FIG. 4 is a schematic diagram illustrating the operation of a relay device according to an embodiment. [Figure 5B] FIG. 4 is a schematic diagram illustrating the operation of a relay device according to an embodiment. [Figure 6A] FIG. 4 is a schematic diagram illustrating the operation of a relay device according to an embodiment. [Figure 6B] FIG. 4 is a schematic diagram illustrating the operation of a relay device according to an embodiment. [Figure 6C]FIG. 4 is a schematic diagram illustrating the operation of a relay device according to an embodiment. [Figure 7A] FIG. 4 is a schematic diagram illustrating the operation of a relay device according to an embodiment. [Figure 7B] FIG. 4 is a schematic diagram illustrating the operation of a relay device according to an embodiment. [Figure 7C] FIG. 4 is a schematic diagram illustrating the operation of a relay device according to an embodiment. [Figure 8A] FIG. 4 is a schematic diagram illustrating the operation of a relay device according to an embodiment. [Figure 8B] FIG. 4 is a schematic diagram illustrating the operation of a relay device according to an embodiment. [Figure 9A] FIG. 4 is a schematic diagram illustrating the operation of a relay device according to an embodiment. [Figure 9B] FIG. 4 is a schematic diagram illustrating the operation of a relay device according to an embodiment. [Figure 9C] FIG. 4 is a schematic diagram illustrating the operation of a relay device according to an embodiment. [Figure 10A] FIG. 4 is a schematic diagram illustrating the operation of a relay device according to an embodiment. [Figure 10B] FIG. 4 is a schematic diagram illustrating the operation of a relay device according to an embodiment. [Figure 10C] FIG. 4 is a schematic diagram illustrating the operation of a relay device according to an embodiment. [Figure 11] FIG. 4 is a schematic diagram illustrating the operation of a relay device according to an embodiment. [Figure 12] FIG. 4 is a schematic diagram illustrating the operation of a relay device according to an embodiment. [Figure 13] FIG. 4 is a schematic diagram illustrating the operation of a relay device according to an embodiment. [Figure 14] 10A to 10C are cross-sectional views illustrating the operation of the inverting chuck in the embodiment. [Figure 15] 10A to 10C are cross-sectional views illustrating the operation of the inverting chuck in the embodiment. [Figure 16] 10A to 10C are cross-sectional views illustrating the operation of the inverting chuck in the embodiment. [Figure 17] 10A to 10C are cross-sectional views illustrating the operation of the inverting chuck in the embodiment. [Figure 18]FIG. 10 is a plan view illustrating the positional relationship between the lift pins and the belt in the embodiment. [Figure 19] 10A and 10B are plan views illustrating the lifting and lowering operation of the lift pins in the embodiment. [Figure 20] FIG. 10 is a side view illustrating a carry-out position in the embodiment. [Figure 21] FIG. 2 is a plan view illustrating the configuration of the single-wafer processing apparatus according to the embodiment. [Figure 22] 6 is a time chart illustrating the operation of a second control unit in the embodiment. [Figure 23] 6 is a time chart illustrating the operation of a second control unit in the embodiment. [Figure 24] 10A and 10B are plan views illustrating the operation of the relay device in the embodiment. [Figure 25] 10A and 10B are plan views illustrating the operation of the relay device in the embodiment. [Figure 26] 6 is a time chart illustrating the operation of a second control unit in the embodiment. [Figure 27] 6 is a time chart illustrating the operation of a second control unit in the embodiment. [Figure 28] 6 is a flowchart illustrating the operation of a second control unit in the embodiment. [Figure 29] 1 is a flowchart illustrating substrate processing in an embodiment. [Figure 30] FIG. 2 is a plan view illustrating substrate processing in the embodiment. [Figure 31] FIG. 2 is a plan view illustrating substrate processing in the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0024] An embodiment of the present invention will be described below with reference to the drawings. The substrate processing system of the present invention continuously performs batch processing, in which a plurality of substrates W are processed collectively, and single-wafer processing, in which substrates W are processed one by one, and is configured such that the batch processing device for batch processing and the single-wafer processing device for single-wafer processing are connected by a relay device.

[0025] The substrate processing system according to the present invention performs various processes such as chemical processing, cleaning processing, and drying processing on substrates W. The substrate processing system employs a processing method (a so-called hybrid method) that combines both a batch processing method in which a plurality of substrates W are processed collectively, and a single-wafer processing method in which substrates W are processed one by one. The batch processing method is a processing method in which a plurality of substrates W arranged in a vertical position are processed collectively. The single-wafer processing method is a processing method in which substrates W in a horizontal position are processed one by one. The substrate processing system according to the present invention continuously performs batch processing in which a plurality of substrates are processed collectively, and single-wafer processing in which substrates are processed one by one. [Example]

[0026] <1. Overall structure> As shown in Fig. 1, the substrate processing system comprises a batch processing device 1 and a single wafer processing device 2 that are configured separately, and a relay device 6 that connects the two devices 1 and 2. The batch processing device 1 is involved in batch processing, which processes multiple substrates at once, while the single wafer processing device 2 is involved in single wafer processing, which processes substrates one by one. The relay device 6 is configured to transport substrates that have been batch processed from the batch processing device 1 to the single wafer processing device 2, and is a bridge structure provided at a position intermediate the batch processing device 1 and the single wafer processing device 2.

[0027] As shown in Fig. 1, the batch processing apparatus 1 and the single wafer processing apparatus 2 each have blocks separated by partitions. That is, the batch processing apparatus 1 has a stocker block 3, a transfer block 5 adjacent to the stocker block 3, and a batch processing block 7 adjacent to the transfer block 5. Fig. 2 shows a specific configuration of the batch processing block 7 in the batch processing apparatus 1. On the other hand, the single wafer processing apparatus 2 has an indexer block 4 and a single wafer processing block 8 adjacent to the indexer block 4.

[0028] The batch processing apparatus 1 is configured to perform batch processing and has a first housing 1A that houses the blocks that make up the batch processing apparatus 1. The single-wafer processing apparatus 2 is configured to perform single-wafer processing on substrates W that have already been batch-processed and has a second housing 2A that houses the blocks that make up the single-wafer processing apparatus 2. The first housing 1A has a first load port 9 that protrudes from a first wall surface that is one of the walls that make up the first housing and is perpendicular to the Y direction from the batch processing block 7 toward the transfer block 5. The second housing 2A has a second load port 10 that protrudes from a second wall surface that is one of the walls that make up the second housing 2A and is perpendicular to the Y direction, and the second load port 10 is located at the same position as the first load port 9 in the Y direction. A carrier C can be placed on the second load port 10.

[0029] For convenience, in this specification, the direction in which the stocker block 3, the transfer block 5, and the batch processing block 7 in the batch processing apparatus 1 are arranged is referred to as the "front-rear direction X." The front-rear direction X is also the direction in which the indexer block 4 and the single-wafer processing block 8 in the single-wafer processing apparatus 2 are arranged. The front-rear direction X extends horizontally. Within the front-rear direction X, the direction from the transfer block 5 toward the stocker block 3 in the batch processing apparatus 1 is referred to as the "front." The front also refers to the direction from the single-wafer processing block 8 toward the indexer block 4 in the single-wafer processing apparatus 2. The direction opposite the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." For convenience, one direction of the "width direction Y" is referred to as the "right" and the other direction is referred to as the "left." For convenience, the direction perpendicular to the front-rear direction X and the width direction Y (height direction) is referred to as the "vertical direction Z." In each figure, for reference, front, rear, right, left, top, and bottom are indicated as appropriate.

[0030] In the substrate processing system of the present invention, substrates W are first batch-processed in a batch processing device 1, and the batch-processed substrates W are then transported by a relay device 6 to a single-wafer processing device 2. The single-wafer processing device 2 then processes the substrates W individually to complete the entire substrate processing process. Below, the specific configurations of each device will be described in the order of the batch processing device 1, relay device 6, and single-wafer processing device 2, along with the flow of substrates W in the substrate processing system of the present invention.

[0031] <2. Batch processing equipment: Stocker block> The stocker block 3 is equipped with a first load port 9, which serves as an entrance through which a carrier C, which stores multiple substrates W in a horizontal position and vertically spaced at predetermined intervals, is introduced into the block. The first load port 9 protrudes from the outer wall of the stocker block 3, which extends in the width direction (Y direction).

[0032] A plurality of substrates W (for example, 25 substrates) are stored in a single carrier C, stacked horizontally at regular intervals. The carrier C storing unprocessed substrates W to be carried into the batch processing apparatus 1 is first placed on the first load port 9. The carrier C has a plurality of horizontally extending grooves (not shown) formed therein that store the substrates W with their surfaces spaced apart. One substrate W is inserted into each of the grooves. An example of a carrier C is a sealed FOUP (Front Opening Unify Pod). In the present invention, an open container may also be used as the carrier C.

[0033] The internal structure of the stocker block 3 will now be described. The stocker block 3 is equipped with a transport storage unit ACB that stocks and manages carriers C. The transport storage unit ACB is equipped with a carrier transport mechanism 11 that transports the carriers C and shelves 13 on which the carriers C are placed. The stocker block 3 can stock one or more carriers C.

[0034] The stocker block 3 has a plurality of shelves 13 on which carriers C are placed. The shelves 13 are provided on a partition wall separating the stocker block 3 and the transfer block 5. The shelves 13 include a stock shelf 13b on which carriers C are simply placed temporarily, and a carrier placement shelf 13a which is accessed by the first substrate transport mechanism HTR of the transfer block 5 and is used to remove substrates.

[0035] The carrier mounting shelf 13a is configured to mount a carrier that stores multiple horizontally oriented substrates at a predetermined interval in the vertical direction. The carrier mounting shelf 13a is configured to mount a carrier C from which a substrate W is to be removed. In this embodiment, one carrier mounting shelf 13a is provided, but multiple carrier mounting shelves 13a may be provided. The carrier transport mechanism 11 takes in a carrier C that stores an unprocessed substrate W from the first load port 9 and places it on the carrier mounting shelf 13a for substrate removal. At this time, the carrier transport mechanism 11 can also temporarily place the carrier C on a stock shelf 13b before placing it on the carrier mounting shelf 13a. The stocker block 3 has one or more carrier mounting shelves 13a.

[0036] <3. Batch processing equipment: Transfer block> The transfer block 5 is adjacent to the carrier mounting shelf 13a. The transfer block 5 is disposed adjacent to the rear of the stocker block 3. The transfer block 5 includes a first substrate transport mechanism HTR that can access a carrier C placed on the carrier mounting shelf 13a for removing substrates, an HVC position conversion unit 23 that converts the position of multiple substrates W collectively from a horizontal position to a vertical position, and a pusher mechanism 25. The HVC position conversion unit 23 constitutes the first position conversion mechanism 15. The first position conversion mechanism 15 converts multiple substrates W removed from the carrier C collectively from a horizontal position to a vertical position. Furthermore, the transfer block 5 is provided with a substrate transfer position PP for transferring multiple substrates W to a second substrate transport mechanism WTR provided in the batch transfer region R2. The first substrate transport mechanism HTR, the HVC position conversion unit 23, and the pusher mechanism 25 are arranged in this order in the Y direction.

[0037] The first substrate transport mechanism HTR is configured to collectively remove multiple substrates W from carriers C placed on the carrier placement shelf 13a. The first substrate transport mechanism HTR is provided on the right side behind the transport and storage unit ACB of the stocker block 3. The first substrate transport mechanism HTR is a mechanism for collectively removing multiple substrates W from carriers C placed on the carrier placement shelf 13a for substrate removal and storage. The first substrate transport mechanism HTR has multiple (e.g., 25) hands 51 that collectively transport multiple substrates W. Each hand 51 supports one substrate W. The first substrate transport mechanism HTR collectively removes multiple (e.g., 25) substrates W from carriers C placed on the carrier placement shelf 13a of the stocker block 3. The first substrate transport mechanism HTR can then transport the multiple substrates W it holds to the support table 23A of the HVC attitude conversion unit 23. The HVC attitude conversion unit 23 converts the received horizontally oriented substrates W into a vertically oriented substrate. The pusher mechanism 25 is configured to hold the vertically oriented substrates W and move them up, down, left, and right.

[0038] FIG. 3 illustrates the HVC attitude conversion unit 23 of the first embodiment. The HVC attitude conversion unit 23 includes a pair of horizontal holding units 23B and a pair of vertical holding units 23C that extend in the vertical direction (Z direction). The support base 23A has a support surface extending in the XY plane that supports the horizontal holding units 23B and the vertical holding units 23C. The rotation drive mechanism 23D is configured to rotate the horizontal holding units 23B and the vertical holding units 23C together with the support base 23A by 90°. This rotation causes the horizontal holding units 23B and the vertical holding units 23C to extend in the left-right direction (Y direction). FIG. 4 is a schematic diagram illustrating the operation of the HVC attitude conversion unit 23. Hereinafter, the configuration of each unit will be described with reference to FIGS. 3 and 4.

[0039] The horizontal holding part 23B supports a plurality of horizontally oriented substrates W from below. That is, the horizontal holding part 23B has a comb-shaped structure with a plurality of protrusions corresponding to the substrates W to be supported. Between adjacent protrusions there is a long, narrow recess in which the peripheral edge of the substrate W is located. When the peripheral edge of the substrate W is inserted into this recess, the lower surface of the horizontally oriented substrate W comes into contact with the upper surface of the protrusion, and the substrate W is supported in a horizontal position.

[0040] The vertical holding part 23C supports a plurality of vertically oriented substrates W from below. That is, the vertical holding part 23C has a comb-shaped structure with a plurality of protrusions corresponding to the substrates W to be supported. Between adjacent protrusions there is a narrow V-groove in which the peripheral edge of the substrate W is located. When the peripheral edge of the substrate W is inserted into this V-groove, the substrate W is clamped between the V-grooves and supported in a vertical position. Two vertical holding parts 23C are provided on the support base 23A, so that the substrate W is clamped at two points on its peripheral edge by different V-grooves.

[0041] A pair of horizontal holding members 23B and a pair of vertical holding members 23C extending in the vertical direction (Z direction) are arranged along an imaginary circle corresponding to the substrate W in a horizontal position so as to surround the substrate W to be held. The pair of horizontal holding members 23B are spaced apart by the diameter of the substrate W and hold one end of the substrate W and the other end that is the farthest from the one end. In this way, the pair of horizontal holding members 23B support the substrate W in a horizontal position. On the other hand, the pair of vertical holding members 23C are spaced apart by a distance shorter than the diameter of the substrate W and support a predetermined portion of the substrate W and a specific portion located near the predetermined portion. In this way, the pair of vertical holding members 23C support the substrate W in a vertical position. The pair of horizontal holding members 23B are located at the same position in the left-right direction (Y direction), and the pair of vertical holding members 23C are located at the same position in the left-right direction (Y direction). The pair of vertical holding members 23C are located on the side of the pair of horizontal holding members 23B in the direction in which the support base 23A rotates and tilts (to the left).

[0042] The rotation drive mechanism 23D supports the support table 23A so that it can rotate at least 90° around a horizontal axis AX2 extending in the front-to-rear direction (X direction). When the support table 23A, which is in a horizontal state, rotates 90°, the support table 23A becomes vertical, and the postures of the multiple substrates W held by the horizontal holding part 23B and the vertical holding part 23C are changed from the horizontal posture to the vertical posture.

[0043] As shown in FIG. 4(f), the pusher mechanism 25 includes a pusher 25A on which a vertically oriented substrate W can be mounted, a lifting and rotating unit 25B for rotating and raising and lowering the pusher 25A, a horizontal moving unit 25C for moving the lifting and rotating unit 25B in the left-right direction (Y direction), and a rail 25D extending in the left-right direction (Y direction) for guiding the horizontal moving unit 25C. The pusher 25A is configured to support the lower portion of each of multiple (e.g., 50) vertically oriented substrates W. The lifting and rotating unit 25B is configured to be located below the pusher 25A and includes a telescopic mechanism for raising and lowering the pusher 25A in the vertical direction. The lifting and rotating unit 25B can also rotate the pusher 25A at least 180° around a vertical axis. The horizontal moving unit 25C is configured to support the lifting and rotating unit 25B and horizontally move the pusher 25A and the lifting and rotating unit 25B. The horizontal movement unit 25C is guided by the rails 25D and can move the pusher 25A from a pick-up position close to the HVC attitude conversion unit 23 to the substrate transfer position PP. The horizontal movement unit 25C can also shift the pusher 25A, which is in a vertical attitude, in the direction of the arrangement of the substrates W by a distance corresponding to a half pitch in the substrate arrangement.

[0044] Here, the operation of the HVC attitude conversion unit 23 and the pusher mechanism 25 will be described. The HVC attitude conversion unit 23 and the pusher mechanism 25 arrange, in a face-to-face manner, for example, a total of 50 substrates W housed in two carriers C at a predetermined interval (for example, 5 mm). The 25 substrates W in the first carrier C will be described as first substrates W1 belonging to the first substrate group. Similarly, the 25 substrates W in the second carrier C will be described as second substrates W2 belonging to the second substrate group. Note that in Figures 4(a) to 4(f), for convenience of drawing, the number of first substrates W1 is three and the number of second substrates W2 is three.

[0045] FIG. 4(a) shows the state in which the first substrates W1 in a horizontal position are transferred en bloc to the HVC position conversion unit 23 by the first substrate transport mechanism HTR. At this time, the device surfaces (surfaces on which circuit patterns are formed) of the first substrates W1 face upward. The 25 first substrates W1 are arranged at a predetermined interval (for example, 10 mm). This 10 mm interval is called the full pitch (normal pitch). The first substrates W1 in this state are held by the horizontal holding unit 23B. At this time, the pusher 25A is in a pick-up position below the support base 23A.

[0046] 4(b) shows the state when support base 23A of HVC attitude conversion unit 23 is rotated 90° by rotary drive mechanism 23D. In this way, the attitudes of 25 first substrates W1 are converted from horizontal to vertical in HVC attitude conversion unit 23. In this state, first substrates W1 are held by vertical holding unit 23C.

[0047] The pusher mechanism 25 supports a group of vertically oriented first substrates W1 stored in the first carrier C1 after the first position conversion mechanism 15 converts their positions. FIG. 4(c) shows the pusher 25A ascending from the pickup position to a position directly above the pickup position. This ascending movement is performed by the lifting and rotating unit 25B. When the pusher 25A moves from below the first substrate W1 to above it, the first substrate W1, which was supported by the vertical holding unit 23C of the HVC position conversion unit 23, is pulled out of the vertical holding unit 23C and moves onto the pusher 25A. Grooves into which the substrate W is clamped are provided on the top surface of the pusher 25A. The first substrate W1 is supported by these grooves, which are arranged at equal intervals. The grooves are arranged at half pitch, and the first substrate W1 is arranged at full pitch on the HVC posture conversion unit 23, so that on the upper surface of the pusher 25A located directly above, grooves in which the first substrate W1 is sandwiched and empty grooves that do not support a substrate W are arranged alternately.

[0048] 4(d) shows the operation of the pusher 25A being rotated 180° by the lifting and rotating unit 25B and the operation of the support base 23A of the HVC attitude conversion unit 23 being rotated 90° in the reverse direction by the rotation drive mechanism 23D. In this state, the HVC attitude conversion unit 23 is able to support the second substrate W2. When the pusher 25A rotates 180°, the substrate W supported at the right end of the pusher 25A moves to the left end of the pusher 25A, and the empty groove located at the left end of the pusher 25A moves to the right end of the pusher 25A. The positional relationship between the HVC attitude conversion unit 23 and the pusher 25A is set so that the substrate W located at the right end of the HVC attitude conversion unit 23 is transferred to the right end of the pusher 25A. Therefore, the HVC attitude conversion unit 23 can transfer the second substrate W2 at the right end to the groove at the right end of the pusher 25A regardless of the presence of the first substrate W1 supported by the pusher 25A. The same applies to the other second substrates W2 supported by the HVC posture conversion unit 23. That is, the second substrates W2 arranged at full pitch intervals on the HVC posture conversion unit 23 can be arranged at full pitch intervals starting from the right end of the pusher 25A. This is because, after rotation, the pusher 25A has empty grooves arranged at full pitch intervals starting from the right end. At this time, the first substrate W1 on the pusher 25A fits into the gaps between the second substrates W2 arranged on the pusher 25A. FIG. 4(d) shows the state when the second substrate W2 has already been transported to the HVC posture conversion unit 23. Note that in FIG. 4(d), the second substrate W2 is supported by the horizontal holding unit 23B.

[0049] When the pusher 25A, which is in the directly above position in the state of FIG. 4(d), returns to the original pick-up position, the HVC attitude conversion unit 23 can rotate the support base 23A by 90 degrees again.

[0050] FIG. 4(e) shows the state when the support table 23A is actually rotated again. At this time, the pusher 25A has been rotated 180°. Therefore, when the pusher 25A is again moved to the directly above position as shown in FIG. 4(f), the second substrate W2 fits into the empty groove between the first substrates W1 on the upper surface of the pusher 25A without interfering with the first substrate W1. In this way, a lot is formed in which the first substrates W1 and the second substrates W2 are alternately arranged. Note that in FIG. 4(e), the second substrate W2 is supported by the vertical holding portion 23C. Since the lot is formed by arranging the substrates W face-to-face, the device surfaces of the first substrates W1 constituting the lot all face right in FIG. 4(f), and the device surfaces of the second substrates W2 all face left in FIG. 4(f). In this way, the pusher mechanism 25 also supports a group of substrates in a vertical position obtained by the first position changing mechanism 15 changing the position of the second substrate W2 stored in the second carrier C2.

[0051] 4(f) shows the state when the pusher 25A has moved again to the directly above position. Then, the lot generated by the pusher 25A is transported leftward (Y direction) by the horizontal moving part 25C and moved to the substrate transfer position PP.

[0052] In this way, the pusher mechanism 25 combines two groups of substrates stored at full pitch in the carrier C to form a lot in which the substrates W are arranged at half pitch. The device surfaces of the first substrate W1 and the second substrate W2 that make up the lot face each other, and the substrates are arranged face-to-face.

[0053] Dry lot support section 33 is provided mainly for the purpose of temporarily holding lots that have been batch assembled by HVC attitude conversion section 23 and pusher mechanism 25, and is located between substrate transfer position PP and relay device 6, which will be described later. When transporting a lot from dry lot support section 33 to batch processing block 7, a second substrate transport mechanism WTR of batch processing device 1 is used.

[0054] <4. Batch processing device: Batch processing block> The batch processing block 7 is adjacent to the transfer block 5. The batch processing block 7 performs batch processing on the above-mentioned lots. The batch processing block 7 is divided into a batch processing region R1, which is arranged in the width direction (Y direction), and a batch transport region R2. Each region extends in the front-to-rear direction (X direction). In detail, the batch processing region R1 is located inside the batch processing block 7. The batch transport region R2 is adjacent to the batch processing region R1 and is located at the leftmost side of the batch processing block 7.

[0055] <4.1. Batch Processing Area> The batch processing area R1 in the batch processing block 7 is a rectangular area extending in the front-to-rear direction (X direction). One end (front side) of the batch processing area R1 is adjacent to the relay device 6. The other end (rear side) of the batch processing area R1 extends in a direction away from the transfer block 5 and the relay device 6. Therefore, the relay device 6 is a device inserted at a position that separates the batch processing device 1 from the middle. When transporting a lot from the batch processing device 1 to the relay device 6, a second substrate transport mechanism WTR provided in the batch processing device 1 is used.

[0056] The second substrate transport mechanism WTR transports multiple substrates W in a batch in a vertical position between the transfer block 5, the batch processing units BPU1 to BPU6, and the loading position IP of the relay device 6. Therefore, the batch transport area R2, which is the area in which the second substrate transport mechanism WTR can move, is not divided by the relay device 6, but extends in the Y direction along the left end of the relay device 6. The relay device 6 is configured to be fitted inside the batch processing device 1, but does not reach the left end of the batch processing device 1, because the batch transport area R2 is provided at the left end of the batch processing device 1.

[0057] The batch processing region R1 is equipped with a batch processing section that mainly performs batch processing. Specifically, the batch processing region R1 includes a batch drying chamber DC that dries multiple substrates W in a batch, and multiple batch processing units BPU1 to BPU6 that immerse multiple substrates W in a batch, arranged in the direction in which the batch processing region R1 extends. The batch processing units BPU1 to BPU6 immerse multiple substrates in a vertical position in a batch. The arrangement of the batch drying chamber DC and the batch processing units BPU1 to BPU6 will be specifically described. The batch drying chamber DC is adjacent to the relay device 6 from the rear. The first batch processing unit BPU1 is adjacent to the batch drying chamber DC from the rear. The second batch processing unit BPU2 is adjacent to the first batch processing unit BPU1 from the rear. The third batch processing unit BPU3 is adjacent to the second batch processing unit BPU2 from the rear. The fourth batch processing unit BPU4 is adjacent to the third batch processing unit BPU3 from the rear. The fifth batch processing unit BPU5 is adjacent to the rear of the fourth batch processing unit BPU4. The sixth batch processing unit BPU6 is adjacent to the rear of the fifth batch processing unit BPU5. Therefore, the batch drying chamber DC, the first batch processing unit BPU1, the second batch processing unit BPU2, the third batch processing unit BPU3, the fourth batch processing unit BPU4, the fifth batch processing unit BPU5, and the sixth batch processing unit BPU6 are arranged in this order, moving further away from the relay device 6. For convenience of illustration, the second batch processing unit BPU2 to the fifth batch processing unit BPU5 are omitted in FIG. 1. This configuration can be understood by referring to FIG. 2. The batch processing units BPU1 to BPU6 correspond to the batch processing tanks of the present invention.

[0058] Specifically, the second batch processing unit BPU2 includes a batch chemical processing bath CHB2 that performs chemical processing on the lot collectively, and a lifter LF2 that raises and lowers the lot between a substrate transfer position and a chemical processing position (see FIG. 2). The substrate transfer position is a position set above the batch chemical processing bath CHB2 that is accessible by the second substrate transport mechanism WTR, and the chemical processing position is a position set within the batch chemical processing bath CHB2 where the lot can be immersed in the chemical. The batch chemical processing bath CHB2 performs acid processing on the lot. The acid processing may be phosphoric acid processing, but may also be processing using other acids. The phosphoric acid processing is performed by etching the multiple substrates W that make up the lot. The etching processing, for example, chemically etches the nitride film on the surface of the substrate W.

[0059] The batch chemical processing tank CHB2 contains an acid solution such as a phosphoric acid solution. A lifter LF2 is attached to the batch chemical processing tank CHB2 to move the lot up and down. The batch chemical processing tank CHB2 supplies the chemical solution from below upward, for example, to create a convection current of the chemical solution. The lifter LF2 moves up and down in the vertical direction (Z direction). Specifically, the lifter LF2 moves up and down between a processing position inside the batch chemical processing tank CHB2 and a transfer position above the batch chemical processing tank CHB2. The lifter LF2 holds a lot composed of substrates W in a vertical position. At the transfer position, the lifter LF2 transfers the lot to and from the second substrate transport mechanism WTR. When the lifter LF2 moves down from the transfer position to the processing position while holding the lot, the entire substrate W is below the surface of the chemical solution. When the lifter LF2 moves up from the processing position to the transfer position while holding the lot, the entire substrate W is above the surface of the chemical solution.

[0060] Specifically, the third batch processing unit BPU3 includes a batch chemical processing tank CHB3 and a lifter LF3 that raises and lowers the lot between the substrate transfer position and the chemical processing position. The batch chemical processing tank CHB3 has the same configuration as the batch chemical processing tank CHB2 described above. That is, the batch chemical processing tank CHB3 contains the chemical solution described above and is equipped with a lifter LF3. The batch chemical processing tank CHB3 performs the same processing on the lot as the batch chemical processing tank CHB2. The batch processing apparatus 1 of this example includes multiple processing tanks capable of the same chemical processing. This is because phosphoric acid processing takes longer than other processes. Phosphoric acid processing takes a long time (e.g., 60 minutes). Therefore, the apparatus of this example is designed to perform acid processing in parallel using multiple batch chemical processing tanks.

[0061] The fourth batch processing unit BPU4 to the sixth batch processing unit BPU6 have the same configuration as the second batch processing unit BPU2 and the third batch processing unit BPU3. Specifically, the fourth batch processing unit BPU4 includes a batch chemical processing bath CHB4 and a lifter LF4 that raises and lowers the lot between the substrate transfer position and the chemical processing position. Similarly, the fifth batch processing unit BPU5 includes a batch chemical processing bath CHB5 and a lifter LF5 that raises and lowers the lot between the substrate transfer position and the chemical processing position. The sixth batch processing unit BPU6 includes a batch chemical processing bath CHB6 and a lifter LF6 that raises and lowers the lot between the substrate transfer position and the chemical processing position. Therefore, the lot is acid-treated in one of the batch chemical processing baths CHB2 to CHB6. Performing chemical processing in parallel in five processing units in this manner increases the throughput of the apparatus.

[0062] Specifically, the first batch processing unit BPU1 includes a batch rinse processing bath ONB containing a rinse liquid and a lifter LF1 for raising and lowering the lot between a substrate transfer position and a rinse position. The substrate transfer position is a position above the batch rinse processing bath ONB accessible to the second substrate transport mechanism WTR, and the rinse position is a position within the batch rinse processing bath ONB where the lot can be immersed in the rinse liquid. The batch rinse processing bath ONB has a configuration similar to the batch chemical processing bath CHB2 described above. That is, the batch rinse processing bath ONB contains a rinse liquid and is equipped with a lifter LF1. Unlike the other processing baths, the batch rinse processing bath ONB contains pure water and is provided for the purpose of cleaning the chemical liquid adhering to multiple substrates W. In the batch rinse processing bath ONB, the cleaning process is completed when the resistivity of the pure water in the bath increases to a predetermined value.

[0063] As described above, the batch rinse processing tank ONB in ​​this embodiment is located closer to the relay device 6 than the batch chemical processing tanks CHB2 to CHB6. This configuration allows the mechanisms constituting the relay device 6 to be separated as far as possible from the batch chemical processing tanks CHB2 to CHB6, preventing the relay device 6 from being adversely affected by acids such as phosphoric acid. Furthermore, by locating the relay device 6 and the batch rinse processing tank ONB close to each other, lots that have undergone rinsing processing are transported a short distance and immediately loaded into the relay device 6. Therefore, according to the configuration of this embodiment, the transport of the substrates W can be completed quickly while maintaining the wet state of the substrates W.

[0064] <4.2. Batch transport area> The batch transfer area R2 in the batch processing block 7 is a rectangular area extending in the front-to-back direction (X direction). The batch transfer area R2 is provided along the outer edge of the batch processing area R1, with one end extending to the transfer block 5 and the other end extending in a direction away from the transfer block 5. Therefore, the batch transfer area R2 is configured to also follow the relay device 6 located between the transfer block 5 and the batch processing block 7.

[0065] A second substrate transport mechanism WTR that transports multiple substrates W collectively is provided in the batch transfer region R2. The second substrate transport mechanism WTR transports multiple substrates W (specifically, lots) collectively between a substrate transfer position PP defined in the transfer block 5, the drying lot support section 33, the batch drying chamber DC, each of the batch processing units BPU1 to BPU6, and a load position IP in the relay device 6 (described later). The second substrate transport mechanism WTR is configured to be able to reciprocate in the front-to-back direction (X direction) across the transfer block 5, the relay device 6, and the batch processing block 7. The second substrate transport mechanism WTR is also able to move to the substrate transfer position PP in the transfer block 5, the drying lot support section 33, and the load position IP in the relay device 6, in addition to the batch transfer region R2 in the batch processing block 7.

[0066] The second substrate transport mechanism WTR is equipped with a pair of chucks 29 for transporting lots. The pair of chucks 29 can be switched between a closed state in which they are close to each other and an open state in which they are separated from each other. The chucks 29 are members extending in the Y direction and have grooves for gripping substrates W arranged at a half pitch. When the pair of chucks 29 is in the closed state, it receives multiple substrates W that make up a lot. When the pair of chucks 29 is in the open state, it transfers multiple substrates W that make up a lot to another member (such as the lifter LF1). The second substrate transport mechanism WTR transfers lots between the substrate transfer position PP and the drying lot support unit 33 in the transfer block 5, and the lifter LF65 belonging to the lot immersion tank 65 provided at the load position IP in the relay device 6. In addition, the second substrate transport mechanism WTR transfers lots between the lifters LF1 to LF6 belonging to the batch processing units BPU1 to BPU6 in the batch processing block 7 and the batch drying chamber DC.

[0067] The batch transfer region R2 is provided with guide rails 31X extending in the X direction to guide the second substrate transport mechanism WTR. The second substrate transport mechanism WTR is capable of moving forward and backward in the X direction along the guide rails 31X. Therefore, the guide rails 31X extend from the batch processing block 7 to the transfer block 5 via the relay device 6. More specifically, the guide rails 31X face the substrate transfer position PP in the transfer block 5 from the Y direction, and face the sixth batch processing unit BPU6 in the batch processing block 7 from the Y direction. In addition to these, the guide rails 31X face the drying lot support part 33 in the transfer block 5, the lot immersion tank 65 in the relay device 6, and the batch drying chamber DC and the first batch processing unit BPU1 to the sixth batch processing unit BPU6 in the batch processing block 7 from the Y direction.

[0068] <4.3. Other configurations> The batch drying chamber DC is located between the first batch processing unit BPU1 and the relay device 6. The batch drying chamber DC has a drying chamber that accommodates a lot of vertically arranged substrates W. The drying chamber has an inert gas supply nozzle that supplies an inert gas into the chamber and a vapor supply nozzle that supplies an organic solvent vapor into the tank. The batch drying chamber DC first supplies an inert gas to the lot supported in the chamber, replacing the atmosphere in the chamber with the inert gas. Then, pressure reduction within the chamber begins. While the chamber is depressurized, organic solvent vapor is supplied into the chamber. The organic solvent is discharged outside the chamber along with moisture adhering to the substrates W. In this manner, the batch drying chamber DC dries the lot. The inert gas may be, for example, nitrogen, and the organic solvent may be, for example, IPA (isopropyl alcohol). In this embodiment, the substrates W are dried in the single-wafer processing apparatus 2 without using the batch drying chamber DC. The batch drying chamber DC is configured to be used when substrate processing is performed using the batch processing apparatus 1 alone. In this case, the lot that has completed the batch rinse process in the batch rinse process bath ONB is not moved to the relay device 6, but is subjected to drying in the batch drying chamber DC, and then transported to the substrate transfer position PP. This lot transport is performed by the second substrate transport mechanism WTR. The lot then follows a path that is the reverse of that described in Figure 4, and is separated into an array of first substrates W1 and an array of second substrates W2. The array of first substrates W1 is returned to an empty carrier C by the first substrate transport mechanism HTR, and the array of second substrates W2 is then returned to an empty carrier C by the first substrate transport mechanism HTR.

[0069] <5.Relay Device> The relay device 6 has a structure that bridges the batch processing device 1 and the single wafer processing device 2, with its left end fitting into the interior of the batch processing device 1 and its right end fitting into the interior of the single wafer processing device 2. The relay device 6 is provided with a transport path for the substrate W that extends in the Y direction connecting the batch transfer area R2 of the batch processing device 1 to the single wafer transfer area R3 of the single wafer processing device 2. The transport path is configured to transport the substrate W in the Y direction (horizontally) without changing the position of the substrate W in the Z direction. Therefore, the insertion position of the relay device 6 in the batch processing device 1 and the insertion position of the relay device 6 in the single wafer processing device 2 are the same in the Z direction.

[0070] The relay device 6 is located on the middle floor of the batch processing device 1 and the single wafer processing device 2 (see FIG. 17). Therefore, the relay device 6 bridges the batch processing device 1 and the single wafer processing device 2 at a position in the air away from the floor surface on which the batch processing device 1 and the single wafer processing device 2 are installed. The specific location of the relay device 6 is related to the structure of the single wafer processing device 2, and will be described in detail together with the explanation of the single wafer processing device 2.

[0071] The relay device 6 includes a relay housing 6A that connects a first housing 1A for the batch processing device 1 and a second housing 2A for the single wafer processing device 2, which are spaced apart from each other in the Y direction. The relay housing 6A is provided between a third wall surface 1B that faces the second housing 2A among the wall surfaces that make up the first housing 1A, and a fourth wall surface 2B that faces the third wall surface 1B among the wall surfaces that make up the second housing 2A.

[0072] The relay housing 6A has side walls 62a, a bottom plate 62b, and a top plate 62c that connect the batch processing device 1 and the single wafer processing device 2. The configurations of the side walls 62a, bottom plate 62b, and top plate 62c are shown in detail in FIGS. 2 and 17. The relay housing 6A connects the housings of the batch processing device 1 and the single wafer processing device 2 to form a single substrate processing system. This isolates the outside air from the atmosphere inside the device in the substrate processing system.

[0073] The relay device 6 is equipped with a lot immersion tank 65 in which batch-processed lots wait in pure water, an underwater attitude change unit 55 that receives multiple substrates W arranged in the Y direction and rotates the received substrates W 90° in water all at once to change the attitude of the multiple substrates W from a vertical attitude to a horizontal attitude, a belt conveyor mechanism 67 extending in the Y direction that transports the horizontally oriented substrates W one by one to an unloading position OP, and a substrate placement unit SRM that lifts the substrates W to the unloading position OP. The lot immersion tank 65, underwater attitude change unit 55, belt conveyor mechanism 67, and substrate placement unit SRM are arranged in this order starting from the left side of the batch processing device 1 and moving to the right. Each unit will be described in detail below.

[0074] <5.1. Relay device: Lot immersion tank> The lot immersion tank 65 immerses batch-processed lots in pure water. The lot immersion tank 65 has a configuration similar to that of the first batch processing unit BPU1 of the batch processing apparatus 1. That is, the lot immersion tank 65 holds pure water and has a lifter LF65 that raises and lowers the lots. The lifter LF65 can move back and forth between a loading position IP for loading the lots into the relay device 6 and an immersion position for immersing the loaded lots in pure water. The loading position IP is a position determined for receiving batch-processed substrates from the batch processing apparatus 1. The loading position IP is located above the immersion position and is a position where the second substrate transport mechanism WTR can transport substrates. At the loading position IP, the entire area of ​​the substrates W constituting the lot is in the air, and at the immersion position, the entire area of ​​the substrates W constituting the lot is immersed in pure water.

[0075] <5.2. Relay device: Full-pitch array substrate transfer mechanism> The full-pitch array substrate transport mechanism STR sorts a lot immersed in the lot immersion tank 65 into a first substrate W1 and a second substrate W2. The full-pitch array substrate transport mechanism STR can transport 25 substrates W arranged at full pitch between the lot immersion tank 65 and the submersible posture change unit 55. The lot immersion tank 65 holds 50 substrates W arranged at half pitch, and the full-pitch array substrate transport mechanism STR picks up half of these substrates (25) and transports them to the submersible posture change unit 55. The full-pitch array substrate transport mechanism STR has a pair of chucks 30 similar to the pair of chucks 29 in the second substrate transport mechanism WTR. Like the chucks 29, the chucks 30 have grooves formed at half-pitch intervals, but differ from the chucks 29 in that the two types of grooves are arranged alternately. That is, the chucks 30 have deep grooves that cannot hold substrates W and shallow grooves that can hold substrates W, arranged alternately at half-pitch intervals. Therefore, when the full pitch array substrate transport mechanism STR attempts to grip a lot on the lifter LF65, 25 substrates W are picked up by shallow grooves that can grip the substrates W, while the remaining 25 substrates W cannot abut on the deep grooves and are left on the lifter LF65. Because the shallow grooves in the chuck 30 are arranged at a pitch (full pitch) that is twice the half pitch, the full pitch array substrate transport mechanism STR picks up the 25 substrates W arranged at full pitch from the lot on the lifter LF65. Since the lot is configured with the substrates W arranged face-to-face, the picked-up substrates W are arranged so that their front surfaces (device surfaces) are on the right and their back surfaces are on the left, so that the device surfaces of adjacent substrates W do not face each other. On the other hand, the 25 substrates W that were not picked up and remain on the lifter LF65 are arranged so that their front surfaces (device surfaces) are on the left and their back surfaces are on the right, so that the device surfaces of adjacent substrates W do not face each other.

[0076] The pair of chucks 30 of the full pitch array substrate transport mechanism STR, like the chucks 29 of the second substrate transport mechanism WTR, can be in two states: a closed state in which the chucks 30 are close to each other in the X direction, and an open state in which the chucks 30 are farther apart in the X direction. When the pair of chucks 30 are in the closed state, the chucks 30 are close enough to each other relative to the diameter of the substrate W, so that two points on the lower part of the substrate W abut against each of the chucks 30. In this way, the substrate W is gripped by the pair of chucks 30. When the pair of chucks 30 in the closed state are opened, the chucks 30 are farther apart relative to the diameter of the substrate W, so that the substrate W is detached from the chucks 30. Specifically, the pair of chucks 30 are in the open state before receiving multiple substrates W from the lifter LF65 at the loading position IP, and when transferring multiple substrates W to the inverting chuck 71, which will be described later with reference to FIGS. 6B and 9B.

[0077] The relay device 6 is provided with guide rails 31Y extending in the Y direction to guide the full pitch array substrate transport mechanism STR. The full pitch array substrate transport mechanism STR is capable of moving forward and backward in the Y direction along the guide rails 31Y. Therefore, the guide rails 31Y extend from the lot immersion tank 65 to the submersible posture change unit 55.

[0078] The full pitch array substrate transport mechanism STR is guided by guide rails 31Y and can move forward and backward from a loading position IP, where the lifter LF65 transfers the lot, to a pair of inversion chucks 71 that are waiting above a standby tank 73, described below, located to the right of the loading position IP. This allows the full pitch array substrate transport mechanism STR to transport multiple substrates W in the Y direction from the loading position IP to a position above the standby tank. In addition, the full pitch array substrate transport mechanism STR can also avoid interfering with the second substrate transport mechanism WTR by moving to a position above the standby tank when the second substrate transport mechanism WTR moves from the transfer block 5 to the batch processing block 7 (see FIG. 2).

[0079] <5.3. Repeater: Underwater converter> The submersible position conversion unit 55 converts the multiple substrates W received from the batch processing device 1 from a vertical position to a horizontal position. The submersible position conversion unit 55 converts the sorted first substrates W1 and second substrates W2 from a vertical position to a horizontal position all at once. The submersible position conversion unit 55 includes a standby tank 73 for holding pure water, a pair of inverting chucks 71 positioned above the standby tank 73, and a pair of inverting chuck support mechanisms 72 for holding each of the inverting chucks 71 and for raising, lowering, and rotating the pair of inverting chucks 71. The inverting chucks 71 can be raised and lowered from a substrate transfer position with the full-pitch array substrate transport mechanism STR, which is set above the liquid surface of the standby tank 73, to the liquid in the standby tank 73. The inverting chucks 71 immerse the multiple substrates W received from the full-pitch array substrate transport mechanism STR in the standby tank 73 and can be rotated 90° in one direction or the other while in that state. The vertical posture of the plurality of substrates W is converted into a horizontal posture by the rotation of the pair of inversion chucks 71.

[0080] In this manner, the standby tank 73 is configured to allow a plurality of substrates, which have been converted to a horizontal position, to wait in pure water on the side of the loading position IP of the relay device 6.

[0081] The inverting chuck 71 can be changed between a closed state in which it can hold multiple substrates W and an open state in which it releases the held multiple substrates W by the operation of the pair of inverting chuck support mechanisms 72. The inverting chuck 71 can also be rotated 90° in one direction or the other while maintaining its relative positions by the operation of the pair of inverting chuck support mechanisms 72. The inverting chuck 71 can be raised and lowered from above the standby tank 73 to the liquid in the standby tank 73 while maintaining its relative positions by the operation of the pair of inverting chuck support mechanisms 72.

[0082] The reversing chuck support mechanism 72 will be described in detail. The pair of reversing chuck support mechanisms 72 operate synchronously to perform an reversing operation in which the pair of reversing chucks 71 are rotated by at least 180° without changing the relative positions of the pair of reversing chucks 71, an elevation operation in which the pair of reversing chucks 71 are raised and lowered without changing the relative positions of the pair of reversing chucks 71, and an opening and closing operation in which the pair of reversing chucks 71 are moved toward and away from each other. Therefore, the reversing chuck support mechanism 72 is composed of mechanisms related to the reversing operation, the elevation operation, and the opening and closing operation. The reversing chuck support mechanism 72 includes an reversing mechanism 72a that performs the reversing operation of the reversing chucks 71, an elevation mechanism 72b that performs the elevation operation of the reversing chucks 71, and an opening and closing mechanism 72c that performs the opening and closing operation of the reversing chucks 71.

[0083] The inverting chuck 71 has a comb-like shape with multiple V-grooves 71a spaced at full pitch intervals. The pair of inverting chucks 71 holds multiple substrates W from both sides by fitting the substrates W into the V-grooves. When the inverting chuck 71 is closed by the opening / closing mechanism 72c of the inverting chuck support mechanism 72, each edge of the substrate abuts the deepest part of the V-groove. Even if the inverting chuck 71 is rotated in this state, the substrates W will not slip off the inverting chuck 71. When the inverting chuck 71 is opened by the opening / closing mechanism 72c of the inverting chuck support mechanism 72, the substrates W can be received from the full-pitch array substrate transport mechanism STR, which is waiting above the standby tank 73 and holding multiple substrates W. The inverting chuck 71 can also be in a state between the closed and open states (half-open state), which will be described later.

[0084] The inverting mechanism 72a and the lifting mechanism 72b of the inverting chuck support mechanism 72 will be described in detail later.

[0085] <5.4. Relay device: Belt conveyor mechanism> The belt conveyor mechanism 67 corresponds to the relay transport mechanism of the present invention. The belt conveyor mechanism 67 is a mechanism provided between the loading position IP and the unloading position OP, and receives horizontally oriented substrates W one by one from the submersible position change unit 55, and transports the substrates W located above the standby tank 73 along the substrate transport path to the unloading position OP. As shown in FIG. 1 , the belt conveyor mechanism 67 has rollers 67a extending in the X direction and arranged in the Y direction, and a pair of belts 67b extending in the Y direction from the submersible position change unit 55 to a substrate mounting unit SRM described below. The pair of belts 67b can be driven by rotation of the rollers 67a. The belt conveyor mechanism 67 can transport horizontally oriented substrates W in the Y direction.

[0086] <5.5. Operation of relay device> The following describes how the relay device 6 transports a substrate W at the loading position IP to the unloading position OP. The unloading position OP is a position determined for transferring the substrate W received at the loading position IP to the single wafer processing device 2. FIG. 5A shows how the lifter LF65 holds multiple substrates W at the loading position IP set above the lot immersion tank 65. The second substrate transport mechanism WTR transports the substrates to the loading position IP. The multiple substrates W placed on the lifter LF65 are arranged face-to-face, with substrates W whose device surfaces face right and substrates W whose device surfaces face left alternately.

[0087] At this time, if the lifter LF65 is lowered from the loading position IP to the immersion position, the substrates W waiting to be transported in the relay device 6 can be prevented from drying out while the substrates W are being transported one by one.

[0088] 5A shows how multiple substrates W are handed over in a batch from the lifter LF65 to the full pitch array substrate transport mechanism STR to be transported to the underwater posture conversion unit 55. At this time, the lifter LF65 supports the multiple substrates W at the loading position IP, and the full pitch array substrate transport mechanism STR moves the pair of chucks 30 to positions where they can hold the lot, and closes the chucks 30. At this time, as described above, the chucks 30 can only hold half of the multiple substrates W arranged at half pitch that make up the lot. Ultimately, the lot is arranged in such a way that substrates W held by the chucks 30 and substrates W not held by the chucks 30 are alternately arranged.

[0089] 5B shows the state when the lifter LF65 is subsequently lowered from the loading position IP to the immersion position. When the lifter LF65 is lowered from the state shown in FIG. 5A, the plurality of substrates W arranged at full pitch, which corresponds to half of the substrates W constituting the lot, remains in the full pitch arrayed substrate transport mechanism STR, and the remaining half of the substrates W are returned to the lot immersion tank 65 in a full pitch arrayed state on the lifter LF65. The plurality of substrates W remaining in the full pitch arrayed substrate transport mechanism STR have their device surfaces facing right, and the plurality of substrates W held at the immersion position by the lifter LF65 have their device surfaces facing left.

[0090] 6A shows the state after that when the full pitch array substrate transport mechanism STR transports the plurality of substrates W above the standby tank 73. At this time, the pair of inverting chucks 71 are positioned above the full pitch array substrate transport mechanism STR, and the rotation angle is the initial state of 0°. In the initial state, the inverting chucks 71 extend horizontally and are capable of receiving the plurality of substrates W in a vertical position.

[0091] FIG. 6B shows the state in which the inverting chucks 71 are then lowered to the full-pitch array substrate transport mechanism STR. This operation of the inverting chucks 71 is realized by the lifting mechanism 72b of the inverting chuck support mechanism 72. FIG. 6B shows the state in which 25 substrates W are transferred from the chucks 30 of the full-pitch array substrate transport mechanism STR to the inverting chucks 71. That is, the pair of inverting chucks 71 maintain their open state as they are lowered to the full-pitch array substrate transport mechanism STR and then closed. The pair of inverting chucks 71 in the open state are spaced apart enough to allow the substrates W to pass through, so they can approach the chucks 30 without coming into contact with the substrates W. The inverting chucks 71 are then closed by the operation of the opening / closing mechanism 72c of the inverting chuck support mechanism 72, and hold the 25 substrates W. At this time, the 25 substrates W are held by both the chucks 30 and the inverting chucks 71. The chucks 30 then open and retract in the Y direction (to the left). In this manner, the substrates W are transferred from the chuck 30 to the inverting chuck 71. Fig. 6C shows the state in which the 25 substrates W have been transferred to the inverting chuck 71. The inverting chuck 71 is lowered below the liquid surface of the standby tank 73, as indicated by the arrow in Fig. 6C, and the 25 substrates W are immersed in the pure water held in the standby tank 73.

[0092] FIG. 7A shows the state in which the inverting chuck 71 is then rotated 90° with the 25 substrates W immersed in the pure water. This operation of the inverting chuck 71 is achieved by the inverting mechanism 72a of the inverting chuck support mechanism 72. FIG. 7B shows the state in which the inverting chuck 71 has completed its 90° rotation. In this way, the device surfaces of the 25 substrates W immersed in the standby tank 73 and facing in the Y direction (leftward) are rotated 90° and now face upward. By tilting the substrates W in this manner, the substrates W can be placed in a horizontal position with the device surfaces facing upward. The substrates W in the horizontal position will then be transported with their device surfaces facing upward.

[0093] FIG. 7C shows the state when the inverting chuck 71 subsequently moves one of the 25 substrates W above the liquid surface in the standby tank 73. This movement of the inverting chuck 71 is achieved by the lifting mechanism 72b of the inverting chuck support mechanism 72. As shown in FIG. 7C, only one substrate W is above the liquid surface, and the remaining 24 substrates W are below the liquid surface in the standby tank 73. This configuration prevents the 24 substrates W from drying out while waiting to be transported. The one substrate W above the liquid surface is transported to the unloading position OP by the belt conveyor mechanism 67 while maintaining a horizontal position with a puddle of pure water formed on its upper surface. By repeating this operation, all 25 substrates W are transported to the unloading position OP by the belt conveyor mechanism 67.

[0094] In this way, the lifting mechanism 72b of this example is configured to perform an exposure operation to position the substrates W waiting in the standby tank 73 one by one above the standby tank.

[0095] The lifting mechanism 72b is a component of the relay device 6, and lifts and lowers the inversion chuck 71 under the control of a second control unit 132 included in the single wafer processing apparatus 2. The second control unit 132 is configured to transmit an enabling signal to the relay device to cause the lifting mechanism 72b in the relay device 6 to perform an exposing operation when a center robot CR (described later) is able to load a substrate W into a single wafer processing chamber (described later). The operation of the second control unit 132 is closely related to the substrate processing flow and the configuration of the single wafer processing apparatus 2 in this example. Therefore, the specific configuration of the second control unit 132 will be described later.

[0096] The opening and closing operation of the inverting chucks 71 in each state shown in FIGS. 5A to 7C will be described. As described above, the pair of inverting chucks 71 in the states shown in FIGS. 5A to 6A are in an open state and are not able to grip a substrate W. In the open state, the inverting chucks 71 can pass through the substrate W, so the inverting chucks 71 can move to the position shown in FIG. 6B without colliding with the substrate W. In FIG. 6B, the pair of inverting chucks 71 switches from the open state to the closed state. At this time, each of the V-grooves of the pair of inverting chucks 71 enters and abuts the edges of the 25 substrates W arranged at full pitch. Because the V-grooves are arranged at full pitch, the 25 substrates W arranged at full pitch can easily fit into each V-groove. The manner in which the substrates W fit into each V-groove is described in detail in FIG. 14. In FIGS. 6C to 7B, the pair of inverting chucks 71 are in a closed state and are able to grip a substrate W. In this state, even if the inversion chuck 71 is rotated, the substrate W being held will not fall.

[0097] To achieve the state shown in Fig. 7C, some measure is required to prevent the substrate W waiting in the standby tank 73 from dropping while allowing the substrate W to be transported to the belt conveyor mechanism 67. Therefore, according to this embodiment, in the state shown in Fig. 7C, the pair of inversion chucks 71 are set to a half-open state. This achieves a state in which the substrate W is supported so that it can be removed. The half-open state will be described in detail in Figs. 16 and 17.

[0098] FIG. 8A shows the state where the lifter LF65 subsequently holds multiple substrates W at a loading position IP set above the lot immersion tank 65. The second substrate transport mechanism WTR transports the substrates to the loading position IP. The 25 substrates W placed on the lifter LF65 are arranged at full pitch with their device surfaces facing right. These substrates W are the substrates W left in the lot immersion tank 65 in FIG. 5B. From FIG. 8A onwards, the state of transporting these 25 substrates W will be described. Note that FIG. 8A shows the state when the transport of the horizontally oriented substrates described in FIG. 7C is completed and the pair of inverting chucks 71 have returned to the initial state shown in FIG. 5A. The pair of inverting chucks 71 in the initial state are extended in the Y direction and are capable of introducing vertically oriented substrates W, and are positioned above the standby tank 73.

[0099] Figure 8B is a diagram corresponding to Figure 5B described above, and shows the state in which 25 substrates W have been transferred to the chucks 30 of the full pitch array substrate transport mechanism STR. Figure 9A is a diagram corresponding to Figure 6A described above, and shows the state in which the full pitch array substrate transport mechanism STR has moved the 25 substrates W to a position where they are sandwiched between the standby tank 73 and the pair of inverting chucks 71. Figure 9B is a diagram corresponding to Figure 6B described above, and shows the state in which the 25 substrates W are transferred from the full pitch array substrate transport mechanism STR to the pair of inverting chucks 71. Figure 9C is a diagram corresponding to Figure 6C described above, and shows the state in which the 25 substrates W supported by the pair of inverting chucks 71 are above the standby tank 73.

[0100] FIG. 10A shows the state in which the inverting chuck 71 is then rotated by −90° with the 25 substrates W immersed in the pure water. This operation of the inverting chuck 71 is achieved by the inverting mechanism 72a of the inverting chuck support mechanism 72. FIG. 10B shows the state in which the inverting chuck 71 has completed the −90° rotation. In this way, the device surfaces of the 25 substrates W immersed in the standby tank 73 and facing in the Y direction (to the right) are rotated by 90° and now face upward. By tilting the substrates W in this manner, the substrates W can be placed in a horizontal position with the device surfaces facing upward. The substrates W in the horizontal position will then be transported with their device surfaces facing upward.

[0101] 10C is a diagram corresponding to the above-mentioned FIG. 7C, and shows a state in which the pair of inverting chucks 71 are in a half-open state, with only the uppermost substrate W exposed above the liquid surface in the standby tank 73. Such movement of the substrate W is achieved by the lifting mechanism 72b of the inverting chuck support mechanism 72. Thereafter, upon receiving an enabling signal issued by the second control unit 132 of the single-wafer processing apparatus 2, the lifting mechanism 72b raises the pair of inverting chucks 71 by a height equivalent to the full pitch. By repeating this operation, all 25 substrates W are transported by the belt conveyor mechanism 67 to below the unloading position OP.

[0102] The lifting mechanism 72b is one component of the relay device 6, and performs the lifting and lowering operation of the inversion chuck 71 under the control of a second control unit 132 included in the single wafer processing apparatus 2. The second control unit 132 is configured to transmit an enabling signal to the relay device to cause the lifting mechanism 72b in the relay device 6 to perform an exposing operation when a center robot CR (described later) is able to load a substrate W into a single wafer processing chamber (described later).

[0103] 11 shows how the lifting mechanism 72b in the inverting chuck support mechanism 72 operates under the control of the second control unit 132. The second control unit 132 is configured to mainly control the center robot CR and the like that belong to the single wafer processing apparatus 2. The center robot CR is configured to load a substrate in a horizontal position into a single wafer processing chamber, and specifically, is a robot that receives a substrate W at the unloading position OP and distributes it to each single wafer processing chamber in the single wafer processing apparatus 2.

[0104] The second control unit 132 can grasp the current status of the center robot CR. For example, the second control unit 132 can grasp whether the center robot CR is transporting a substrate W or waiting for the substrate W to arrive at the unloading position OP as shown in FIG.

[0105] 11 is in a state where it can transport a substrate W at any time. The second control unit 132 recognizes this situation and sends an authorization signal S to the third control unit 136, indicating authorization to expose the substrate W waiting in the liquid in the standby tank 73 above the liquid surface. In response to the authorization signal S, the third control unit 136 controls the lifting mechanism 72b to position only one of the substrates W waiting in the liquid in the standby tank 73 above the liquid surface, as shown in FIG. 12. The substrate W that has risen to above the standby tank 73 is moved in the Y direction by a push mechanism 57D (described later) and transferred to the belt conveyor mechanism 67. In this way, when the center robot CR is able to transport the substrate W into any one of the single-wafer processing chambers, the second control unit 132 in this example sends an authorization signal to the third control unit 136 of the relay device 6 to cause the lifting mechanism 72b in the relay device 6 to perform an exposing operation for the substrate W.

[0106] In the case of Figure 11, the center robot CR is waiting for the arrival of the substrate W. Therefore, as long as the substrate W is transported to the unloading position OP by the belt conveyor mechanism 67, the center robot CR can immediately transport the substrate W to the single-wafer processing chamber. The substrate W transported in this manner is transported with a puddle of pure water formed on its upper surface, and therefore does not dry out. In this way, the second control unit 132 is configured to prevent a situation in which the center robot CR is not at the unloading position OP even though the substrate W has been transported from the standby tank 73 to the unloading position OP. This prevents congestion in substrate transport on the belt conveyor mechanism 67, which would dry out the substrate W during transport.

[0107] 11 , when it is expected that the center robot CR will be able to return to the unloading position OP when the substrate W reaches the unloading position OP, the second control unit 132 sends an enabling signal S to the third control unit 136. After transporting the substrate W at the unloading position OP to the single-wafer processing chamber, the center robot CR returns to the unloading position OP because it needs to transport the subsequent substrate W. If the enabling signal S is sent when the center robot CR returns to the unloading position OP, a waiting time will occur for the center robot CR during transport by the belt conveyor mechanism 67. This is because it takes a certain amount of time for the substrate W to be transported by the belt conveyor mechanism 67. In this example, to avoid such a waiting time, the enabling signal S regarding the exposure of the substrate W is sent to the third control unit 136 at a time that is a time period prior to the time when the center robot CR returns to the unloading position OP that is required for transport by the belt conveyor mechanism 67. The center robot CR is able to transport the substrate W on the substrate platform SRM when the substrate W is placed on the substrate platform SRM.

[0108] 13 illustrates how the substrate W exposed above the liquid surface by the lifting mechanism 72b is handed over to the belt conveyor mechanism 67. The push mechanism 57D has a hand 103 that grips the substrate W, and is capable of shifting the horizontally oriented substrate W in the Y direction. The push mechanism 57D grips the substrate W waiting above the standby tank 73 and pushes it up to the belt conveyor mechanism 67, thereby shifting just one of the substrates W held by the pair of inverting chucks 71 to the belt conveyor mechanism 67.

[0109] When the push mechanism 57D shifts the substrate W, the pair of inverting chucks 71 are in a half-open state, neither open nor closed. The half-open state of the inverting chucks 71 allows the push mechanism 57D to shift the substrate W while holding the substrate W in a horizontal position. The substrate shift control unit 57E is configured to control the opening and closing of the hand 103 in the push mechanism 57D and the movement of the hand 103 in the Y direction.

[0110] The half-open state of the pair of inverting chucks 71 will now be described. Fig. 14 is a cross-sectional view illustrating the state immediately after 25 substrates W have been rotated 90° or -90° as shown in Figs. 7B and 10B. At this time, the pair of inverting chucks 71 are in a closed state, and both ends of the substrates W have reached the deepest part of the V-groove 71a. If the pair of inverting chucks 71 press both ends of the substrates W to fix them in this way, the 25 substrates W will not slip off the pair of inverting chucks 71.

[0111] Fig. 15 is a cross-sectional view corresponding to the above-mentioned Fig. 13. With the pair of inversion chucks 71 in the closed state, the hand 103 of the push mechanism 57D is inserted between the substrates W. Note that the liquid level in the standby tank 73 is omitted in Fig. 15 and the following Figs. 16 and 17.

[0112] 16 shows a state in which the pair of inverting chucks 71, which were in a closed state, move slightly apart and enter a half-open state. When the pair of inverting chucks 71 enter the half-open state, both ends of the substrate W move from the deepest part of the V-groove and abut against the walls that form the V-groove. In this state, the substrate W will not slip off the inverting chucks 71 unless the inverting chucks 71 are rotated, and the substrate W itself is not fixed to the inverting chucks 71. Therefore, when the pair of inverting chucks 71 enter the half-open state, it is possible to hold a substrate W waiting in the liquid and transfer one substrate W to the hand 103 on the liquid surface. Such an operation of the inverting chucks 71 is performed by the opening / closing mechanism 72c.

[0113] However, in the state shown in FIG. 16, the hand 103 has not yet come into contact with the substrate W, and therefore, in order to transfer the substrate W to the hand 103, the substrate W needs to be lowered relative to the hand 103.

[0114] Fig. 17 is also a cross-sectional view corresponding to Fig. 13 described above. In Fig. 17, the pair of inverting chucks 71 are slightly lowered from the state shown in Fig. 16, causing the substrate W to come into contact with the hand 103. In the state shown in Fig. 17, the substrate W is placed on the hand 103 and is located away from the wall surface of the V-groove 71a of the inverting chuck 71. In other words, in the state shown in Fig. 17, the substrate W is not in contact with the inverting chuck 71. Therefore, if the push mechanism 57D is operated to move the hand 103 in this state, the substrate W will be pushed out to the belt conveyor mechanism 67 without coming into contact with the inverting chuck 71.

[0115] 18 illustrates the belt conveyor mechanism 67. The belt conveyor mechanism 67 has a plurality of rollers 67a and a pair of belts 67b held by the rollers 67a. The rollers 67a include a drive roller equipped with a motor 67c for driving the belt, and a driven roller without a motor 67c. The substrate W is transported in the Y direction with one end supported by the first belt and the other end supported by the second belt.

[0116] Next, the substrate platform SRM of this example will be described. As shown in Fig. 1, the substrate platform SRM is a mechanism provided at the unloading position OP defined in the relay device 6. As shown in Fig. 13, the substrate platform SRM has a plurality of (for example, three) lift pins 70 extending in the Z direction. The lift pins 70 are capable of freely extending and retracting in the Z direction. Each of the lift pins 70 synchronously expands and contracts so that their tips are at the same height. In Fig. 13, the tips of the lift pins 70 are located below the unloading position OP.

[0117] The substrate rest part SRM is capable of placing a substrate W in a horizontal position at the unloading position OP, and is accessible by the center robot CR.

[0118] 18, the lift pins 70 are provided at positions that avoid the pair of belts 67b of the belt conveyor mechanism 67. Specifically, the lift pins 70 are provided in the gap between the pair of belts 67b.

[0119] Next, the operation of the lift pins 70 will be described. Fig. 19(a) shows a state in which a substrate W is transported above the lift pins 70 in a contracted state. Such transportation of the substrate W is performed by the belt conveyor mechanism 67. The belt conveyor mechanism 67 can transport the substrate W located above the standby tank 73, which has been transported by the push mechanism 57D, to below the unloading position OP.

[0120] 19(b) shows the state when the lift pins 70 are subsequently extended and the substrate W supported by the belt conveyor mechanism 67 is moved to above the unloading position OP. In this way, the substrate W is transferred from the belt conveyor mechanism 67 to the lift pins 70. The extension and contraction operation of the lift pins 70 is achieved by the lift pin lifting mechanism 70a.

[0121] In this way, each of the substrates W constituting the lot that has been loaded into the loading position IP in the relay device 6 is placed in a horizontal position and transported by the belt conveyor mechanism 67 to a position below the unloading position OP. The substrates W that have been transported below the unloading position OP are then moved to the unloading position OP by the lift pins 70 of the substrate rest part SRM.

[0122] 20 illustrates that the unloading position OP is located between the single wafer processing chambers from above and below. That is, the single wafer processing chamber 49d is located above the unloading position OP, and the single wafer processing chamber 47d is located below the unloading position OP.

[0123] The single wafer processing chambers in this example include a first stack of three single wafer processing chambers, including single wafer processing chamber 48a, arranged in the Z direction, a second stack of three single wafer processing chambers, including single wafer processing chamber 48b, arranged in the Z direction, and a third stack of three single wafer processing chambers, including single wafer processing chamber 48c, arranged in the Z direction. The single wafer processing apparatus 2 in this example includes two single wafer processing chambers located on either side of the relay apparatus 6 in the Z direction. Therefore, the single wafer processing apparatus 2 includes nine single wafer processing chambers that make up the stack, and two single wafer processing chambers located above and below the unloading position OP in the relay apparatus 6, for a total of 11 single wafer processing chambers.

[0124] 20 , the shielding plate 16 is a part of the second wall surface 2B of the single wafer processing apparatus 2, and is located in a position surrounded by the relay device 6, the single wafer processing chambers 47d and 49d located above and below the relay device 6, and the indexer block 4. The shielding plate 16 is provided to close a rectangular opening that cannot be closed by the relay device 6, which is shorter in the X direction than the single wafer processing chambers 47d and 49d. By providing the shielding plate 16 on the indexer block 4 side, the relay device 6 can be positioned on the center robot CR side, so that the substrate W received from the substrate platform SRM at the unloading position OP can be transferred to the single wafer processing chamber without moving the center robot CR in the X direction.

[0125] The hand of the center robot CR, which holds the substrate W in a horizontal position, can move in the Z direction while maintaining the position of the substrate W. By configuring the center robot CR in this manner, it is possible to transfer the substrate W received from the substrate platform SRM to the single wafer processing chambers located above and below the relay device 6. By providing the relay device 6 in the middle layer of the stack of single wafer processing chambers, the substrate platform SRM is located at the middle position of the single wafer processing block 8 in the Z direction. With this configuration, the substrate platform SRM is located in the vicinity of both the upper and lower single wafer processing chambers, so there is no need to move the center robot CR a long distance in the Z direction when transporting the substrate, and the substrate W can be quickly transported from the substrate platform SRM to the single wafer processing chamber.

[0126] <6. Single wafer processing equipment: Indexer block> The indexer block 4 is adjacent to the second load port 10. As shown in FIG. 1, the indexer block 4 is equipped with the second load port 10 on which a carrier C is placed, which stores multiple substrates W in a horizontal position and at a predetermined interval in a vertical direction. Therefore, the second load port 10 is a mounting table for the carrier C. The second load port 10 is used to mount a carrier C that stores multiple substrates W for which single-substrate processing has been completed. The single-substrate processing apparatus 2 of this embodiment is configured to receive batch-processed substrates W from the relay apparatus 6 without going through the second load port 10, so the second load port 10 is used to mount an empty carrier C that stores substrates W that have been batch-processed and single-substrate processed. Therefore, the second load port 10 is used as an exit for substrates W in the single-substrate processing apparatus 2.

[0127] A description will be given of the internal structure of the indexer block 4. The indexer block 4 is equipped with an indexer robot IR that transports horizontally oriented substrates W one by one between the carrier C and a path 24 provided on the indexer block 4 side in the single wafer processing block 8 described below.

[0128] The indexer robot IR stores the processed substrate W in a carrier C placed on the second load port 10. The indexer robot IR is equipped with a hand consisting of a pair of grippers at the tip for gripping the substrate W in a horizontal position, and an arm for supporting the hand. The arm has multiple joints, and its tip is connected to the hand and its base end is connected to an arm base provided in the indexer block 4. The indexer robot IR in this embodiment is configured to receive the processed substrate W from the path 24a and store it in the second load port 10 outside the indexer block 4.

[0129] <7. Single wafer processing device: Single wafer processing block> The single wafer processing block 8 is adjacent to the indexer block 4. In other words, the single wafer processing block 8 is provided on the rear side of the indexer block 4 when viewed from the second load port 10. The single wafer processing block 8 has, in the center in the Y direction, a path 24a accessible by the indexer robot IR and a center robot CR that can place processed substrates W on the path 24a. The center robot CR receives batch-processed substrates W in a horizontal position one by one from the unloading position OP of the relay device 6 and transports them to the single wafer processing chamber. On the other hand, the path 24b is located behind the center robot CR and can be accessed by the center robot CR and the auxiliary robot AR. The auxiliary robot AR is provided behind the path 24b. The center robot CR and the auxiliary robot AR are both substrate transport robots that transport horizontally oriented substrates W one by one and are capable of reciprocating in the Z direction. Therefore, the center robot CR and the auxiliary robot AR can access any of the single wafer processing chamber, the supercritical fluid chamber, and the substrate rest part SRM that make up the stack.

[0130] The single wafer processing block 8 has multiple single wafer processing chambers that dry horizontally oriented substrates one by one. In this embodiment, the single wafer processing chambers include a supercritical fluid chamber that dries the substrates W using a supercritical fluid. Therefore, the substrate drying chambers installed in the single wafer processing apparatus 2 are supercritical fluid chambers. The supercritical fluid chamber dries the substrates W using, for example, carbon dioxide in a supercritical fluid state. Fluids other than carbon dioxide may also be used for drying. The supercritical state is achieved by placing carbon dioxide under its specific critical pressure and critical temperature. Specifically, the pressure is 7.38 MPa and the temperature is 31°C. In the supercritical state, the surface tension of the fluid becomes zero, so the gas-liquid interface is not affected by the circuit pattern on the surface of the substrate W. Therefore, drying the substrates W using a supercritical fluid can prevent the collapse of the circuit pattern on the substrate W, known as pattern collapse.

[0131] 21 illustrates the configuration of a single wafer processing apparatus 2 according to an embodiment. The supercritical fluid chamber has an inlet through which a substrate W before drying is carried in and an outlet through which a substrate W after drying is carried out. The inlet is located at the front or rear of the supercritical fluid chamber and has a shutter S25 that can be opened and closed. The outlet is located on a side wall of the supercritical fluid chamber and has a shutter S26 that can be opened and closed. The shutters S25 and S26 are closed during drying processing using supercritical fluid. The inlet of the supercritical fluid chamber faces the first wet transfer robot AR1 and the second wet transfer robot AR2, and the outlet faces the single wafer transfer region R3.

[0132] The first wet transfer robot AR1 is provided in an area sandwiched between the substrate rest part SRM and the supercritical fluid chamber 48f located to the left of the single wafer transfer region R3. The other robot, the second wet transfer robot AR2, is provided in an area sandwiched between the single wafer processing chamber 48a and the supercritical fluid chamber 48e located to the right of the single wafer transfer region R3.

[0133] In addition, the single wafer processing block 8 is provided with a single wafer processing chamber capable of chemical processing. This single wafer processing chamber is not a supercritical fluid chamber but a chemical processing chamber equipped with a chemical nozzle for supplying a chemical to the substrate W. Two chemical processing chambers are provided in the single wafer processing block 8, one of which is single wafer processing chamber 48a. The other is single wafer processing chamber 49d located above the substrate rest unit SRM. As described with reference to FIG. 20, single wafer processing chamber 49d is located above the relay device 6. IPA (isopropyl alcohol) may be used as the chemical. The chemical processing chamber is explosion-proof enough to handle flammable IPA. In this way, the chemical processing chamber can safely perform the IPA processing required before the drying process using a supercritical fluid. However, the chemical used in the chemical processing chamber of this embodiment is not limited to IPA.

[0134] The position of the chemical liquid treatment chamber can be changed relatively freely, but one of the two chemical liquid treatment chambers is located to the right of the single wafer transport region R3, and the other is located to the left. This configuration eliminates the need for the center robot CR and the auxiliary robot AR, which are located in the single wafer transport region R3, to receive the substrate W after IPA treatment. In other words, the substrate W that has been chemically treated in the chemical liquid treatment chamber is transported to the supercritical fluid chamber by the first wet transport robot AR1 or the second wet transport robot AR2, so that substrates W waiting for IPA treatment do not become congested, resulting in a decrease in throughput.

[0135] The first wet transfer robot AR1 receives horizontally oriented substrates W before drying (substrates W after chemical processing) one by one from the single wafer processing chamber 49d and transfers them through the entrances to one of the supercritical fluid chambers located to the left of the single wafer transfer region R3. Therefore, the substrate transfer hand of the first wet transfer robot AR1 can access all of the entrances of the single wafer processing chamber 49d and the nearby supercritical fluid chambers. Because the chambers are stacked in the Z direction, the hand can move vertically. Some of the chambers are located in front of the first wet transfer robot AR1, while others are located behind the first wet transfer robot AR1. Therefore, the hand can face either forward or backward.

[0136] The second wet transfer robot AR2 has a configuration similar to that of the first wet transfer robot AR1. The second wet transfer robot AR2 receives horizontally oriented substrates W before drying (substrates W after chemical processing) one by one from the single wafer processing chamber 48a and transfers them through the entrance into one of the supercritical fluid chambers located on the left side of the single wafer transfer region R3. Therefore, the substrate transfer hand of the second wet transfer robot AR2 can access all of the chambers forming the front stack and the rear stack.

[0137] The center robot CR and the auxiliary robot AR can access the outlet of the supercritical fluid chamber. The center robot CR has a first hand and a second hand. The first hand is located below the second hand. Therefore, the first hand and the second hand are stacked in the Z direction. The first hand takes out the substrate W before drying processing from the substrate rest part SRM and transports it to the single wafer processing chamber 49d. The second hand 32b takes out the dried substrate W from either the supercritical fluid chamber located on the left side of the single wafer transport region R3 or the supercritical fluid chamber located on the right side through the above-mentioned outlet.

[0138] The auxiliary robot AR has a hand that transports the dried substrate W. The auxiliary robot AR receives the dried substrate W from a nearby supercritical fluid chamber and transports it to path 24b. The substrate W transported to path 24b is then transported to path 24a by the second hand of the center robot CR. The indexer robot IR stores the substrate W in path 24a in a carrier C.

[0139] <8. Control Unit> The substrate processing system includes a first control unit 131 for controlling the batch processing device 1, a second control unit 132 for controlling the single wafer processing device 2, and a third control unit 136 for controlling the relay device 6. For details of each control unit, see FIG. 1. Although not shown in FIG. 1, the substrate processing system includes memory units corresponding to the first control unit 131 and the third control unit 136. The first control unit 131, the second control unit 132, and the third control unit 136 are each configured, for example, as a CPU (Central Processing Unit). The specific configuration of each control unit is not limited, and for example, each control unit may be configured with a single processor, or each control unit may be configured with an individual processor. Furthermore, the control related to the batch processing device 1 may be configured with multiple processors, and this also applies to the single wafer processing device 2 and the relay device 6.

[0140] Control related to the first control unit 131 includes, for example, control of the carrier transport mechanism 11, first substrate transport mechanism HTR, first posture conversion mechanism 15, second substrate transport mechanism WTR, batch processing units BPU1-BPU6, and batch drying chamber DC. Control related to the second control unit 132 includes, for example, control of the center robot CR, auxiliary robot AR, each chamber, first wet transport robot AR1, second wet transport robot AR2, and indexer robot IR. Control related to the third control unit 136 includes, for example, control of the full-pitch array substrate transport mechanism STR, lot immersion tank 65, lifter LF65, submersible posture conversion unit 55 (second posture conversion mechanism), substrate placement unit SRM, belt conveyor mechanism 67, and pure water supply unit.

[0141] The storage unit stores programs and parameters related to control. The storage unit may be configured as a single device, or may be configured as individual devices corresponding to each control unit. The substrate processing system of this embodiment does not have any particular limitations on the configuration of the device that realizes the storage unit. FIG. 1 illustrates a storage unit 142 corresponding to the second control unit 132. The storage unit 142 is a computer-readable storage medium that stores a program for causing the second control unit 132 to execute each step shown in FIG. 28.

[0142] The second control unit 132 in this example corresponds to the control unit of the present invention. In addition to control over the single wafer processing apparatus 2, the second control unit 132 also controls the lifting mechanism 72b in the relay apparatus 6. That is, the second control unit 132 performs control beyond the scope of the processing apparatus, such as requesting the relay apparatus 6 for a substrate W waiting in the standby tank 73. The second control unit 132 manages the operation schedule of the center robot CR that can access the unloading position OP. Therefore, the second control unit 132 knows the time when the center robot CR can access the unloading position OP. By having such a second control unit 132 manage the unloading of the substrate W from the standby tank 73, it is possible to realize a configuration in which the substrate W exposed above the liquid surface of the standby tank 73 can be transported to the unloading position OP without congestion and immediately received by the center robot CR.

[0143] A specific example of the operation of the second control unit 132 will be described below.

[0144] <9. Operation example 1> The operation example of the second control unit 132 in Operation Example 1 is a case where the first center robot transports substrates faster than the belt conveyor mechanism. Figure 22 shows a time chart of the substrate transport operation in this case. According to Figure 22, it takes time T1 from time D1 when a certain substrate W1 is exposed from the standby tank 73 until the substrate W1 is transported to the unloading position OP. When the substrate W1 arrives at the unloading position OP, the center robot CR, which has been waiting for its arrival, immediately transports the substrate W1 from the unloading position OP. This time is time A1.

[0145] In a series of operations, the center robot CR transports the substrate W1 from the unloading position OP to the single-wafer processing chamber and then returns to the unloading position OP, requiring a predetermined time T2. This predetermined time T2 is shorter than the time it takes for the belt conveyor mechanism 67 to transport the substrate W. Time A2 is the time when the predetermined time T2 has elapsed since the above-mentioned time A1. In this example, the subsequent substrate W2 has already arrived at the unloading position OP at time A2. Therefore, the center robot CR unloads the subsequent substrate W2 from the unloading position OP when it returns to the unloading position OP. Thereafter, the center robot CR returns to the unloading position OP each time the predetermined time T2 has elapsed since time A1 to unload the subsequent substrate W. Each time the predetermined time T2 has elapsed since time A1, time points A2, A3, A4, and A5 arrive, and the center robot CR unloads the substrates W2, W3, W4, and W5 from the unloading position OP.

[0146] 23 illustrates the operation of the second control unit 132 in Operation Example 1. Specifically, the second control unit 132 sends an exposing operation permission signal S to the lifting mechanism 72b in advance so that the substrate W arrives at the unloading position OP at time points A1, A2, A3, A4, and A5. Specifically, the second control unit 132 sends permission signals S to the lifting mechanism 72b at time points D1, D2, D3, D4, and D5, which are the time periods T1 required for the belt conveyor mechanism 67 to transport the substrate W from time points A1, A2, A3, A4, and A5. In response to each permission signal S, the lifting mechanism 72b repeatedly exposes one substrate W above the liquid surface of the standby tank 73.

[0147] In this way, the second control unit 132 transmits the permission signal S to the relay device at time D2, which is the predetermined time T2 before time A2 when the center robot CR unloads the substrate from the substrate mounting part.

[0148] As described above, when the specified time T2 is shorter than the relay transport time (time T1) required for the belt conveyor mechanism 67 to transport the substrate W from the loading position IP to the unloading position OP, the second control unit 132 sends an authorization signal S for the substrate W2 to be transported next to the relay device 6 at time D2, which is the time difference ΔT between time T1 and the specified time T2, before time A1 when the center robot CR unloads the substrate W1 from the substrate placement part SRM.

[0149] 24 illustrates the transport status of substrate W at time A1. At time A1, substrate W1 has already been transported to unloading position OP. As for the subsequent substrate W2, transport by belt conveyor mechanism 67 has already begun at a time ΔT before time A1 (time D2). Therefore, in relay device 6, there are two substrates W in a horizontal position. One of them is substrate W1 which has been transported to unloading position OP, and the other is substrate W2 which is being transported by belt conveyor mechanism 67.

[0150] 25 illustrates the transport status of substrate W at time A2. At time A2, substrate W2, which was in the middle of transport, has been transported to unloading position OP. As for the succeeding substrate W3, transport by belt conveyor mechanism 67 has already begun at time D3, which is ΔT before time A2. Therefore, in relay device 6, there are two substrates W in a horizontal position. One of them is substrate W2, which has been transported to unloading position OP, and the other is substrate W3, which is being transported by belt conveyor mechanism 67.

[0151] 24 and 25, it can be seen that the substrate W being transported is located at the same position on the belt conveyor mechanism 67 at both time points A1 and A2. That is, it takes the operation time (predetermined time T2) of the center robot CR for the substrate W2 in FIG. 24 to be transported to the unloading position OP. Similarly, it takes the predetermined time T2 for the substrate W3 in FIG. 25 to be transported to the unloading position OP.

[0152] <10. Operation example 2> The operation example of the second control unit 132 in operation example 2 is a case where the substrate transport speed of the first center robot is slower than that of the belt conveyor mechanism. Figure 26 shows a time chart of the substrate transport operation in this case. According to Figure 26, it takes time T1 from time D1 when a certain substrate W1 is exposed from the standby tank 73 until the substrate W1 is transported to the unloading position OP. When the substrate W1 arrives at the unloading position OP, the center robot CR, which has been waiting for its arrival, immediately transports the substrate W1 from the unloading position OP. This time is time A1.

[0153] In a series of operations, the center robot CR transports the substrate W1 from the unloading position OP to the single-wafer processing chamber and then returns to the unloading position OP, requiring a predetermined time T2. The predetermined time T3 is longer than the time it takes for the belt conveyor mechanism 67 to transport the substrate W. Time A2 is the time when the predetermined time T3 has elapsed since the above-mentioned time A1. In this example, the subsequent substrate W2 has already arrived at the unloading position OP at time A2. Therefore, the center robot CR unloads the subsequent substrate W2 from the unloading position OP when it returns to the unloading position OP. Thereafter, the center robot CR returns to the unloading position OP each time the predetermined time T3 has elapsed since time A1 to unload the subsequent substrate W. Each time the predetermined time T3 has elapsed since time A1, time points A2, A3, A4, and A5 occur, and the center robot CR unloads the substrates W2, W3, W4, and W5 from the unloading position OP.

[0154] 27 illustrates the operation of the second control unit 132 in Operation Example 2. Specifically, the second control unit 132 sends an exposing operation permission signal S to the lifting mechanism 72b in advance so that the substrate W arrives at the unloading position OP at time points A1, A2, A3, A4, and A5. Specifically, the second control unit 132 sends permission signals S to the lifting mechanism 72b at time points D1, D2, D3, D4, and D5, which are the time periods T1 required for the belt conveyor mechanism 67 to transport the substrate W from time points A1, A2, A3, A4, and A5. In response to each permission signal S, the lifting mechanism 72b repeats the operation of exposing only one substrate W above the liquid surface of the standby tank 73.

[0155] In this way, the second control unit 132 transmits the permission signal S to the relay device at time D2, which is the predetermined time T3 before time A2 when the center robot CR unloads the substrate from the substrate mounting part.

[0156] As described above, if the specified time T3 is longer than the relay transport time (time T1) required for the belt conveyor mechanism 67 to transport the substrate W from the loading position IP to the unloading position OP, the second control unit 132 sends an authorization signal S for the substrate W2 to be transported next to the relay device 6 at time D2, which is the time difference ΔT between time T1 and the specified time T3, from time A1 when the center robot CR unloads the substrate W1 from the substrate placing part SRM.

[0157] <11. Operation of the second control section> Figure 28 is a flowchart showing the operation of the second control unit 132. Hereinafter, the operation of the second control unit 132 will be described with reference to this figure. Note that the flowchart in Figure 28 shows the operation after the substrates W have been rotated collectively as shown in Figures 7B and 10B, and the operation starts when none of the 25 substrates W held in a horizontal position in the liquid has yet been transported from the standby tank 73.

[0158] Step S1: The second control unit 132 transmits an enabling signal S to the lifting mechanism 72b, which exposes the first of the 25 substrates W from the liquid surface of the standby tank 73, and starts transporting the substrate toward the unloading position OP.

[0159] Step S2: It is determined whether or not substrates W are waiting in the standby tank 73. If the determination is false, all of the substrates W in the standby tank 73 have been transported, and the control of the second control unit 132 ends here. If the determination is true, the process proceeds to step S3. Immediately after the transport of the substrates W begins, 24 substrates W are waiting in the liquid in the standby tank 73, and therefore the determination is true.

[0160] Step S3: It is determined whether a predetermined time T2 or a predetermined time T3 has elapsed since the previous transmission of the permission signal S. If the determination is false, the process returns to step S2. If the determination is true, the process proceeds to step S4.

[0161] Step S3 corresponds to the determination step of the present invention. In step S3, it is determined whether the center robot CR can carry the substrate W into the single wafer processing chamber.

[0162] Step S4: The second control unit 132 again transmits the permission signal S to the lifting mechanism 72b. This causes the subsequent substrate W to be exposed from the liquid surface of the standby tank 73, and substrate transport toward the unloading position OP begins. Thereafter, the process returns to step S2.

[0163] Step S4 corresponds to the transmission step of the present invention. In step S4, an enabling signal S is transmitted to the relay device 6 to cause the lifting mechanism 72b in the relay device 6 to perform an exposure operation.

[0164] That is, the second control unit 132 is configured to transmit the permission signal S to the relay device 6 at predetermined intervals from when the center robot CR transports the substrate W from the substrate platform SRM to the single wafer processing chamber until it returns to the substrate platform SRM.

[0165] In this manner, the second control unit 132 continues to transmit the permission signal S at predetermined time intervals until all the substrates W are removed from the standby tank 73. When there are no more substrates W remaining in the standby tank 73, the operation of the second control unit 132 ends.

[0166] <12. Substrate processing flow> Hereinafter, the flow of substrate processing in this embodiment will be described with reference to the flowchart in Fig. 29. Substrate processing in this embodiment is performed by first performing batch processing on substrates W, and then performing single-wafer processing. In this embodiment, substrates W are transported in this order through the first load port 9, stocker block 3, transfer block 5, batch processing block 7, relay device 6, single-wafer processing region R4, indexer block 4, and second load port 10, with batch processing and single-wafer processing completed during this time (see Figs. 30 and 31).

[0167] Step S11: A carrier C storing unprocessed substrates W in a vertically arranged position is placed on the first load port 9 of the batch processing apparatus 1. The carrier C is then taken into the stocker block 3 and placed on the carrier mounting shelf 13a. Before being placed on the carrier mounting shelf 13a, the carrier C may pass through the stock shelf 13b. The movement of the carrier C at this time is performed by the carrier transport mechanism 11. The first substrate transport mechanism HTR collectively removes multiple horizontally oriented substrates W from the carrier C placed on the carrier mounting shelf 13a and passes them to the HVC position conversion unit 23.

[0168] Step S12: The HVC attitude conversion unit 23 converts the attitudes of the received substrates W from a horizontal attitude to a vertical attitude all at once, and hands them over to the pusher mechanism 25. The HVC attitude conversion unit 23 receives another set of substrates W from a carrier C different from the carrier C that stored the attitude-converted substrates W, from the first substrate transport mechanism HTR, and converts the attitudes of the substrates W from a horizontal attitude to a vertical attitude. The attitude-converted substrates W are also handed over to the pusher mechanism 25. In this way, batch assembly is performed on the substrates W arranged at full pitch, and two carriers' worth of substrates W are arranged at half pitch on the pusher 25A. The lot generated in this way is transported by the pusher mechanism 25 to the substrate transfer position PP defined in the transfer block 5.

[0169] Step S13: The second substrate transport mechanism WTR receives the lot waiting at the substrate transfer position PP from the pusher mechanism 25 and transfers it to the lifter LF6 waiting above the batch chemical processing tank CHB6 in the sixth batch processing unit BPU6. At this time, the lot may pass through the dry lot support part 33 before being placed on the lifter LF6. The reason for transferring the lot to the lifter LF6 is to perform phosphoric acid treatment on the lot. Therefore, the lot may be transferred to any of the lifters LF2 to LF6 involved in the phosphoric acid treatment. The following description will be given assuming that the lot has been transferred to the lifter LF6.

[0170] The lifter LF6 then descends to the immersion position, and the lot is subjected to batch phosphate treatment. After the phosphate treatment, the lifter LF6 returns the lot to the space above the batch chemical treatment bath CHB6 and hands it over to the second substrate transport mechanism WTR. The second substrate transport mechanism WTR hands it over to the lifter LF1, which is waiting above the batch rinse treatment bath ONB in ​​the first batch processing unit BPU1. The lifter LF1 then descends to the immersion position, and the lot is subjected to batch rinse treatment. This completes the series of batch processing steps. After the batch treatment, the lifter LF1 returns the lot to the space above and hands it over to the second substrate transport mechanism WTR.

[0171] Step S14: The second substrate transport mechanism WTR delivers the batch-processed lot to the lifter LF65 waiting at the load position IP. The lifter LF65 then descends to the immersion position in the lot immersion tank 65, where the lot waits in the pure water. When transporting multiple substrates W from the lot immersion tank 65 to the standby tank 73 of the submersible posture conversion unit 55, the lifter LF65 first moves the lot from the immersion position to the load position IP. The full pitch array substrate transport mechanism STR receives the vertically oriented substrate array from the lifter LF65 at the load position IP and transports it in the Y direction (to the right). As described above, the full pitch array substrate transport mechanism STR cannot transport all 50 substrates W that make up a lot at once. Therefore, two transport operations are required to transport all of the substrates W that make up a lot to the submersible posture conversion unit 55. The second transport operation by the full pitch array substrate transport mechanism STR is performed after all of the substrates W transported in the first transport operation have been removed from the standby tank 73.

[0172] FIG. 30 illustrates how a plurality of substrates W are transported together in steps S11 to S14.

[0173] Step S15: The inversion chuck 71 that has received the row of substrates rotates left or right to convert the vertically oriented substrates W into a horizontal orientation all at once.

[0174] Step S16: The second control unit 132 sends an enabling signal S to the lifting mechanism 72b to expose the substrate W from the standby tank 73.

[0175] Step S17: The substrate W exposed from the liquid surface of the standby tank 73 is transported by the belt conveyor mechanism 67 to the unloading position OP.

[0176] Step S18: The substrate W received by the center robot CR into the single wafer processing chamber 49d is subjected to IPA processing on the spot. After the IPA processing, the substrate W is in a puddle state with IPA. The substrate W is then transported to the supercritical fluid chamber by the first wet transport robot AR1.

[0177] Step S19: After the drying process in the supercritical fluid chamber is completed, the substrate W is received by the post-drying substrate transfer hand of the center robot CR or the auxiliary robot AR, and is transferred from the supercritical fluid chamber to path 24a or path 24b. The indexer robot IR receives the processed substrate W from path 24a and transfers it to the carrier C placed on the second load port 10. In this manner, the transfer of the substrate W is completed. If the substrate W is transferred to path 24b, the center robot CR transfers the substrate W to path 24a. The substrate W is then transferred to the carrier C via the indexer robot IR.

[0178] FIG. 31 illustrates how the substrates W in the horizontal position are transported one by one in steps S15 to S19.

[0179] Since each step may be performed simultaneously, this point will be explained below. While the substrate W is undergoing drying processing in step S18, the substrate continues to be transported in a horizontal position to the unloading position OP. The substrate transport to the unloading position OP is repeated until all 11 single wafer processing chambers of the single wafer processing apparatus 2 are in use. Furthermore, when any of the single wafer processing chambers that were in use becomes vacant, the substrate is transported to the unloading position OP again. By performing single wafer substrate processing in parallel in this way, the throughput of the substrate processing system can be increased.

[0180] In step S15, after all of the horizontally oriented substrates W have been transported from the relay device 6 to the single-wafer processing apparatus 2, the submersible position changing unit 55 becomes able to accept a new row of substrates. At this point, the full-pitch array substrate transport mechanism STR receives the row of substrates waiting in the lot immersion tank 65 from the lifter LF65 and passes it to the submersible position changing unit 55. Thus, according to this embodiment, step S15 must be performed twice to transport one lot. Therefore, step S15 may be performed simultaneously with step S18.

[0181] By appropriately repeating steps S15, S16, S17, S18, and S19, the substrate drying process in the single wafer processing chamber can be completed while the batch assembly of the lot is released. When all of the substrates W that made up the lot have been returned to the carrier C placed on the second load port, the substrate processing in this embodiment is complete.

[0182] The substrate processing in this embodiment is configured to process two carriers C at a time. That is, the substrates W stored in the first carrier C and the second carrier C placed on the first load port 9 of the batch processing apparatus 1 are stored in the third carrier C and the fourth carrier C placed on the second load port 10 of the single wafer processing apparatus 2, respectively.

[0183] In step S15, all of the substrates W whose postures are changed originate from the first carrier C. Therefore, the relay device 6 transports only the first substrates W1 stored in the first carrier C to the single-wafer processing device 2. The indexer robot IR stores all of the first substrates W1 from the first carrier C thus transported into the third carrier C.

[0184] When all of the substrates W from the first carrier C have been transported from the underwater attitude changing unit 55, step S15 is executed again. In this case, all of the substrates W to be attitude-changed originate from the second carrier C. Therefore, the relay device 6 will now transport only the second substrates W2 stored in the second carrier C to the single-wafer processing device 2. The indexer robot IR stores all of the second substrates W2 from the second carrier C thus transported into the fourth carrier C.

[0185] In this way, the substrates W stored in the first carrier C and the substrates W stored in the second carrier C are stored in the third carrier C and the fourth carrier C, respectively, without being mixed together.

[0186] <13. Effects of the present invention> As described above, this example is a substrate processing system including a batch processing apparatus 1 that performs batch processing, at least one single wafer processing apparatus 2 that performs single wafer processing on batch-processed substrates W, and at least one relay apparatus 6 that has two defined positions: an input position IP for receiving batch-processed substrates W from the batch processing apparatus 1, and an output position OP for transferring the substrates W received at the input position IP to the single wafer processing apparatus 2. The single wafer processing apparatus 2 is equipped with a second control unit 132 that, when the center robot CR is able to load a substrate W into one of a plurality of single wafer processing chambers, sends to the relay apparatus 6 an enabling signal S that causes the elevating mechanism 72b in the relay apparatus 6 to perform an exposing operation to position the substrates W one by one above the standby tank 73. With this configuration, when the center robot CR of the single wafer processing apparatus 2 is able to load a substrate W into the single wafer processing chamber, the relay apparatus 6 performs the exposing operation for the substrate W. The substrate W moved above the standby tank 73 by the exposing operation is quickly transported by the belt conveyor mechanism 67 to the single wafer processing apparatus 2 and loaded into the single wafer processing chamber. With this configuration, the substrate after the exposing operation is transported to the single wafer processing chamber before it dries. According to the present invention, the waiting time of the substrate W on the substrate platform SRM, which transfers the substrate W between the relay device 6 and the single wafer processing apparatus 2, is minimized, thereby reliably preventing the substrate W from drying on the substrate platform SRM. The present invention simplifies the configuration of the substrate processing system and reduces the manufacturing costs of the apparatus by eliminating or simplifying the pure water supply device on the substrate platform SRM.

[0187] According to the above-described configuration, the center robot CR transmits an enable signal S to the relay device 6 at predetermined intervals from when the center robot CR transports the substrate W from the substrate platform SRM to the single-wafer processing chamber until the center robot CR returns to the substrate platform SRM. This configuration prevents the center robot CR from having to wait until the substrate is transported to the substrate platform SRM, thereby providing a substrate processing system with high throughput.

[0188] According to the above-described configuration, the permission signal S is transmitted to the relay device 6 at a time that is a predetermined time before the time when the center robot CR unloads the substrate W from the substrate platform SRM. With this configuration, the next substrate to be transported by the center robot CR arrives at the substrate platform SRM when a predetermined time has elapsed since the center robot CR placed the substrate W on the substrate platform SRM. With this configuration, it is possible to prevent the center robot CR from having to wait until the substrate is transported to the substrate platform SRM, thereby providing a substrate processing system with high throughput.

[0189] According to the above-described configuration, if the predetermined time is shorter than the relay transport time (time T1) required for the belt conveyor mechanism 67 to transport the substrate W from the loading position IP to the unloading position OP, the permission signal S for the next substrate W to be removed is transmitted to the relay device 6 at a time preceding the time when the center robot CR unloads the substrate W from the substrate platform SRM by the difference between the relay transport time and the predetermined time. With this configuration, while the substrate is being transported by the relay device 6, the subsequent substrate is moved above the standby tank 73 by the exposure operation. Because the relay device 6 takes longer to transport substrates than the center robot CR, the relay device 6 is configured to transport multiple substrates W simultaneously to make up for this delay. This configuration prevents the center robot CR from having to wait until a substrate is transported to the substrate platform SRM, thereby providing a substrate processing system with high throughput.

[0190] According to the above-described configuration, if the predetermined time is longer than the relay transport time required for the belt conveyor mechanism 67 to transport the substrate W from the loading position IP to the unloading position OP, the permission signal S for the next substrate W to be unloaded is transmitted to the relay device 6 at a time when the difference between the relay transport time and the predetermined time has elapsed since the center robot CR unloaded the substrate W from the substrate platform SRM. This configuration prevents subsequent substrates from being exposed above the standby tank 73 while a substrate is being transported by the relay device 6. Since the relay device 6 can transport substrates faster than the center robot CR, the relay device 6 waits for the operation of the center robot CR until the center robot CR unloads the substrate W from the substrate platform SRM, and then transports the subsequent substrate W. This configuration prevents substrates from being left on the substrate platform SRM for a long period of time, providing a substrate processing system that reliably prevents the substrates W from drying out.

[0191] According to the above-described configuration, the exposing operation by the lifting mechanism 72b is prohibited from the time when the permission signal S is sent to the relay device 6 after there is only one empty single wafer processing chamber, until it is expected that the center robot CR will be able to transport the substrate W to the single wafer processing chamber. If the single wafer processing chambers in the single wafer processing apparatus 2 become full and the substrate W waiting in the standby tank 73 is transported, the substrate W may end up waiting for a long time on the substrate rest part SRM. According to the present invention, the exposing operation for the substrate W is not performed until it is expected that the center robot CR will be able to transport the substrate W to the single wafer processing chamber, so this situation does not occur.

[0192] According to the above-described configuration, the center robot CR can transport the substrate W on the substrate platform SRM as soon as the substrate is placed on the substrate platform SRM. This configuration eliminates the wait time for the center robot CR to wait until the substrate is transferred to the substrate platform SRM, thereby providing a substrate processing system with high throughput.

[0193] <14. Variations> The present invention is not limited to the configuration of the above-described embodiment, but can be modified as follows.

[0194] <Variation 1> Although the substrate processing system of the embodiment has a configuration including one relay device 6, the present invention is not limited to this configuration. A configuration may be adopted in which one batch processing device 1 has a plurality of single wafer processing devices 2, and each single wafer processing device 2 has a relay device 6. The substrate processing system of this modified example has a configuration including a plurality of relay devices 6.

[0195] <Variation 2> Although the substrate processing system of the embodiment dries the substrate W using a supercritical fluid chamber, the present invention is not limited to this configuration. The substrate W may also be dried by spin drying.

[0196] <Variation 3> In addition to the configuration of the present invention, a prohibition signal that prohibits the exposing operation by the lifting mechanism 72b may be sent to the third control unit 136 of the relay device 6 from the time when the enabling signal S is sent to the relay device 6 after there is only one empty single wafer processing chamber, until it is expected that the center robot CR will be able to transport the substrate W to the single wafer processing chamber. If the substrate W waiting in the standby tank 73 is transported when the single wafer processing chambers in the single wafer processing device 2 are full, the substrate W may be forced to wait for a long time in the substrate rest part SRM. According to this modification, the exposing operation for the substrate W is not performed until it is expected that the center robot CR will be able to transport the substrate W to the single wafer processing chamber, so this situation does not occur. [Explanation of symbols]

[0197] 1. Batch processing equipment 1A First enclosure 1B 3rd wall 2 Single wafer processing equipment 2A Second housing 2B 4th wall 3 Stocker Block 4 Indexer Blocks 5 Transfer block 6. Relay Device 6A Relay enclosure 7 Batch Processing Block 8 Single-Wafer Processing Block 9. Loading Port No. 1 10. Second Loading Port 11 Carrier transport mechanism 13 Shelves 13a Carrier placement shelf 13b Shelf 15 First attitude transformation mechanism 16 Shielding plate 23 HVC attitude change unit 23A Support stand 23B Horizontal holding part 23C Vertical holding part 23D Rotation Drive Mechanism 24a Pass 24b Pass 25 Pusher mechanism 25A Pusher 25B Elevating and rotating part 25C Horizontal moving part 25D rail 29 Zipper 30 Chuck 31X Guide Rail 31Y guide rail 33 Drying rod support 47d Substrate Processing Chamber 48a Single wafer processing chamber 48b Single wafer processing chamber 48c Single Wafer Processing Chamber 48f Supercritical Fluid Chamber 48e Supercritical Fluid Chamber 49d Substrate Processing Chamber 51 hands 55 Underwater attitude change unit 57D Push Mechanism 57E Board shift control unit 62a side wall 62b bottom plate 62c top plate 65 lot immersion tank 67 Belt conveyor mechanism 67a Laura 67b Belt 67c motor 70 Lift Pin 70a Lift pin lifting mechanism 71 Reversing Chuck 71a V groove 72 Reversing chuck support mechanism 72a Reversal mechanism 72b Lifting mechanism 72c opening / closing mechanism 73 Waiting tank 103 hands 131 First Control Section 132 Second Control Section 136 Third Control Section 142 Storage section As of A1 A2 point As of A3 As of A4 As of A5 ACB transport storage area AR Assistive Robot AR1 First wet transport robot AR1 AR2 Second wet transport robot AR2 BPU1 Batch Processing Unit BPU2 Batch Processing Unit BPU3 Batch Processing Unit BPU4 Batch Processing Unit BPU5 Batch Processing Unit BPU6 Batch Processing Unit C Carrier CHB1 Batch chemical treatment tank CHB2 batch chemical treatment tank CHB3 batch chemical treatment tank CHB4 batch chemical treatment tank CHB5 batch chemical treatment tank CHB6 batch chemical treatment tank CR Center Robot As of D1 As of D2 As of D3 As of D4 As of D5 DC Batch Drying Chamber HTR substrate transport mechanism IP loading position IR Indexer Robot LF1 Lifter LF2 Lifter LF3 Lifter LF4 Lifter LF5 Lifter LF6 Lifter LF65 Lifter OP unloading position ONB batch rinse processing tank PP PCB transfer position R1 Batch Processing Area R2 Bulk transport area R3 Single wafer transport area R4 Single wafer processing area S permission signal S25 Shutter S26 Shutter SRM substrate placement section STR full pitch array substrate transport mechanism T1 time T2 specified time T3 Predetermined time WTR Second substrate transfer mechanism W substrate

Claims

1. A substrate processing system that continuously performs batch processing, in which a plurality of substrates are processed at once, and single substrate processing, in which substrates are processed one by one, a batch processing device that performs batch processing; at least one single wafer processing apparatus for performing single wafer processing on substrates that have been batch processed; at least one relay device having two positions defined therein: a carry-in position for receiving batch-processed substrates from the batch processing device; and an unloading position for transferring the substrates received at the carry-in position to the single wafer processing device; The batch processing device comprises: at least one batch processing tank capable of immersing a plurality of vertically oriented substrates at once; The single wafer processing apparatus includes: a plurality of single wafer processing chambers capable of processing horizontally oriented substrates one by one; a center robot that carries a substrate in a horizontal position into the single wafer processing chamber; Equipped with The relay device a posture change mechanism capable of changing a plurality of substrates from a vertical posture to a horizontal posture at the loading position; a standby tank for holding the plurality of substrates, which have been converted into horizontal positions, in pure water at the loading position; a lifting mechanism that performs an exposure operation to position the substrates waiting in the standby tank one by one above the standby tank; an intermediary transport mechanism provided between the loading position and the unloading position, the intermediary transport mechanism being capable of transporting a substrate positioned above the standby tank along a substrate transport path to the unloading position; a substrate placement unit on which a horizontally oriented substrate can be placed at the unloading position and which is accessible by the center robot; The single wafer processing apparatus includes a control unit that transmits, to the relay apparatus, an enabling signal for causing the lifting mechanism in the relay apparatus to perform an exposing operation when the center robot is able to load the substrate into any one of the plurality of single wafer processing chambers. A substrate processing system comprising:

2. 2. The substrate processing system according to claim 1, The control unit in the single wafer processing apparatus transmits the permission signal to the relay device at predetermined intervals from when the center robot transports the substrate from the substrate placement unit to the single wafer processing chamber until the center robot returns to the substrate placement unit. A substrate processing system comprising:

3. 3. The substrate processing system according to claim 2, When the predetermined time is shorter than an intermediary transport time required for the intermediary transport mechanism to transport the substrate from the loading position to the unloading position, the control unit in the single wafer processing apparatus transmits a permission signal to the intermediary device for the substrate to be next unloaded at a time preceding the time when the center robot unloads the substrate from the substrate mounting unit by a time difference between the intermediary transport time and the predetermined time. A substrate processing system comprising:

4. 3. The substrate processing system according to claim 2, When the predetermined time is longer than an intermediary transport time required for the intermediary transport mechanism to transport the substrate from the loading position to the unloading position, the control unit in the single wafer processing apparatus transmits a permission signal to the intermediary device for the substrate to be next unloaded at a time when a difference between the intermediary transport time and the predetermined time has elapsed since the center robot unloaded the substrate from the substrate mounting unit. A substrate processing system comprising:

5. 2. The substrate processing system according to claim 1, The control unit in the single wafer processing apparatus After the single wafer processing chamber becomes empty and the permission signal is transmitted to the relay device, the next permission signal is transmitted to the relay device at a time when the center robot is expected to be able to transport a substrate to the single wafer processing chamber. A substrate processing system comprising:

6. a batch processing apparatus for performing batch processing, at least one single wafer processing apparatus for performing single wafer processing on substrates that have been batch processed, and at least one relay apparatus having two positions: a carry-in position for receiving substrates that have been batch processed from the batch processing apparatus, and an unloading position for transferring the substrates received at the carry-in position to the single wafer processing apparatus; the batch processing apparatus having at least one batch processing bath capable of immersing a plurality of substrates in a vertical position all at once; the single wafer processing apparatus having a plurality of single wafer processing chambers capable of processing substrates in a horizontal position one by one; and a center robot for loading the substrates in a horizontal position into the single wafer processing chamber; a relay device that includes a position change mechanism capable of changing a position of a plurality of substrates from a vertical position to a horizontal position at the loading position side, a standby tank that holds the plurality of substrates that have been changed to a horizontal position in pure water at the loading position side, a lifting mechanism that performs an exposure operation to position the substrates waiting in the standby tank one by one above the standby tank, a relay transport mechanism that is a mechanism provided between the loading position and the unloading position and is capable of transporting substrates positioned above the standby tank along a substrate transport path to the unloading position, and a substrate mounting section that can mount a substrate in a horizontal position at the unloading position and is accessible by the center robot, a determining step of determining whether the center robot can transfer a substrate into any one of the plurality of single wafer processing chambers; a transmitting step of transmitting, to the relay device, an enabling signal for causing the lifting mechanism in the relay device to perform an exposure operation when the determination is true.

2. A method for controlling a substrate processing system comprising:

7. a batch processing apparatus for performing batch processing; at least one single wafer processing apparatus for performing single wafer processing on substrates that have been batch processed; and at least one relay apparatus having two defined positions: a carry-in position for receiving batch-processed substrates from the batch processing apparatus; and an unloading position for transferring the substrates received at the carry-in position to the single wafer processing apparatus; the batch processing apparatus has at least one batch processing bath capable of immersing a plurality of vertically oriented substrates all at once; the single wafer processing apparatus has a plurality of single wafer processing chambers capable of processing horizontally oriented substrates one by one; and a center robot for loading the horizontally oriented substrates into the single wafer processing chambers; the relay apparatus has a posture changing mechanism at the carry-in position capable of converting the plurality of substrates from a vertical position to a horizontal position; and a transfer mechanism at the carry-in position for transferring the plurality of horizontally oriented substrates to pure water. a substrate processing system comprising: a standby tank in which substrates are waited in the standby tank; a lifting mechanism that performs an exposing operation to position substrates waiting in the standby tank one by one above the standby tank; an intermediary transport mechanism that is a mechanism provided between the load position and the unload position and is capable of transporting the substrate positioned above the standby tank along a substrate transport path to the unload position; and a substrate mounting section at the unload position on which a horizontally oriented substrate can be placed and which is accessible by the center robot;

Images