Case and capacitor

Abstract

To provide a case that allows easy positioning of a heat dissipation member.SOLUTION: A case 30 for accommodating a capacitor module 10 and a heat dissipation member 20 includes a partition 32 that is interposed between the capacitor module 10 and the heat dissipation member 20 when the capacitor module 10 and the heat dissipation member 20 are accommodated and into which the heat dissipation member 20 can be inserted. The partition 32 includes two plate-like portions 32a that face each other with a gap between them, and an insertion portion 32b which is formed between the two plate-like portions 32a and into which the substrate portion 20a of the heat dissipation member 20 can be inserted from above and accommodated.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a case for accommodating an electronic component and a heat dissipation member, and a capacitor using the case. [Background technology]

[0002] Patent Document 1 describes a technique for cooling a capacitor by providing a cooling plate between two capacitor elements housed in a capacitor case, while Patent Document 2 describes a technique for inserting bolts into gaps that are created when multiple roughly cylindrical capacitor elements are arranged side by side, allowing heat to be released from inside the case via the bolts. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2022-178839 [Patent Document 2] Japanese Patent Application Laid-Open No. 2014-078549 Summary of the Invention [Problem to be solved by the invention]

[0004] The closer heat dissipation components such as cooling plates and bolts are to the heat source, the greater the heat dissipation effect, so positioning them within the case is important.

[0005] An object of the present invention is to provide a case in which the heat dissipation member can be easily positioned. [Means for solving the problem]

[0006] The case of the present invention is a case 30 for housing an electric component (capacitor module 10) and a heat dissipation member 20, and is characterized by having an insertion portion 32b into which the heat dissipation member 20 can be inserted and housed.

[0007] The capacitor of the present invention is characterized in that the case 30 houses, as an electrical component, a capacitor module 10 having a capacitor element 11 and an electrode plate 12 connected to the capacitor element 11, and the heat dissipation member 20 is inserted and housed in the insertion portion 32b. [Effects of the Invention]

[0008] According to the present invention, the heat dissipating member can be positioned within the case simply by inserting and accommodating the heat dissipating member into the insertion portion. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1A is a cross-sectional view of the capacitor, and FIG. 1B is a plan view of the main part when a heat dissipation member is inserted and housed in a case. [Figure 2] FIG. [Figure 3] FIG. 1 is a perspective view of a capacitor with the resin omitted. [Figure 4] FIG. 10 is a schematic plan view showing a modified example of the partition. DETAILED DESCRIPTION OF THE INVENTION

[0010] A capacitor 1 according to one embodiment of the present invention will be described below. As shown in Figures 1A and 2, the capacitor 1 includes a capacitor module (electrical component) 10, a heat dissipation member 20 for dissipating heat from within the capacitor 1 to the outside, and a case 30 for housing the capacitor module 10 and the heat dissipation member 20. Each of the above components will be described below, but the concepts of "upper and lower" refer to the case 30 when resin 40 is filled in, and do not necessarily define the "upper and lower" during use.

[0011] The capacitor module 10 includes a capacitor element 11 and an electrode plate 12 connected to the capacitor element 11 .

[0012] Capacitor element 11 is, for example, a film capacitor in which a metallized film made by vapor-depositing metal onto an insulating film is wound, and electrode portions 11a and 11b are provided on both axial end surfaces by spraying metal. A plurality of capacitor elements 11 are arranged in a row in the horizontal direction with electrode portions 11a and 11b facing up and down. However, there may be only one capacitor element 11.

[0013] Electrode plate 12 is formed by cutting a conductive metal plate such as aluminum or copper into a predetermined shape and bending it. Electrode plate 12 includes a first electrode plate 121 connected to one electrode portion 11a of capacitor element 11 (upper side in the drawing) and a second electrode plate 122 connected to the other electrode portion 11b of capacitor element 11 (lower side in the drawing).

[0014] As shown in Figure 2, the first electrode plate 121 has a base 121a that is approximately L-shaped when viewed from the side, an element connection portion 121b that extends from the tip of the part of the base 121a that corresponds to the horizontal line of the L shape so as to extend the horizontal line and is connected to one electrode portion 11a of the capacitor element 11, and an external connection portion 121c that extends upward from the top end of the part of the base 121a that corresponds to the vertical line of the L shape and is connected to an external device (not shown).

[0015] Second electrode plate 122 also includes base 122a that is generally L-shaped in side view, element connection portion 122b that extends horizontally from the tip of the portion of base 122a that corresponds to the horizontal line of the L and is connected to the other electrode portion 11b of capacitor element 11, and external connection portion 122c that extends upward from the top end of the portion of base 122a that corresponds to the vertical line of the L and is connected to an external device (not shown). However, the vertical length of the portion of base 122a that corresponds to the vertical line of the L is longer than that of first electrode plate 121 by the height of capacitor element 11.

[0016] The first electrode plate 121 and the second electrode plate 122 are mechanically and electrically connected to the electrode portions 11a and 11b of the capacitor element 11 by soldering or the like, with the portions of the bases 121a and 122a corresponding to the vertical lines of the L-shape of the bases 121a and 122a facing each other closely, and the portions corresponding to the horizontal lines sandwich the capacitor element 11 from above and below. Note that to ensure insulation between the first electrode plate 121 and the second electrode plate 122, an insulator (not shown), such as an insulating plate, may be provided between them.

[0017] The heat dissipation member 20 is made of a material with a higher thermal conductivity than the resin 40 filled in the housing portion 33. It is formed by cutting a conductive metal plate, such as aluminum or copper, into a predetermined shape and bending it. The heat dissipation member 20 is rotationally symmetric (two-fold symmetric) in a plan view. Specifically, it is substantially Z-shaped. It includes a substrate portion 20a that is substantially rectangular in a side view, extension portions 20b that extend from both lateral ends of the substrate portion 20a in the thickness direction of the substrate portion 20a, and a lead portion 20c that is led out of the case 30 from the extension portion 20b. The lead portion 20c is a portion that abuts against an externally installed cooler (not shown) to transfer heat. The lead portion 20c may be provided midway along the longitudinal direction of the substrate portion 20a, as indicated by the dashed line in FIG. 2.

[0018] The case 30 includes a case body 31 and a partition 32 that is interposed between the capacitor module 10 and the heat dissipation member 20 when the capacitor module 10 and the heat dissipation member 20 are housed in the case 30 and that can accommodate the heat dissipation member 20 by inserting it therein.

[0019] The case body 31 is generally box-shaped and includes a bottom 31a that is generally rectangular in plan view, sidewalls 31b that rise from the four sides of the bottom 31a, and an opening 31c that opens at the upper end of the sidewall 31b. The case body 31 is made of, for example, an insulating material. Specifically, it is made of an insulating synthetic resin, and more specifically, it is made of a thermoplastic resin such as polyphenylene sulfide or polybutylene terephthalate.

[0020] The partition 32 is disposed in the center of the case body 31 so as to divide the inside of the case body 31 into two in a plan view. The spaces on both sides of the partition 32 each serve as a housing section 33 for housing a capacitor module 10. The partition 32 is preferably integrally molded with the case body 31. The material is preferably the same as that of the case body 31. That is, for example, an insulating material. Specifically, the partition 32 is made of an insulating synthetic resin, and more specifically, the partition 32 is made of a thermoplastic resin such as polyphenylene sulfide or polybutylene terephthalate.

[0021] 1A and 1B, the partition 32 has two plate-shaped portions 32a. The two plate-shaped portions 32a face each other with a gap (gap) between them. The substrate portion 20a of the heat dissipation member 20 can be inserted from above and accommodated between the two plate-shaped portions 32a. This space where the substrate portion 20a can be inserted and accommodated is hereinafter referred to as the insertion portion 32b.

[0022] The width of the insertion portion 32b (the distance between the two plate-shaped portions 32a) is substantially the same as the thickness (plate thickness) of the substrate portion 20a. The width may be such that there is resistance when inserting by hand. By using such dimensions, the heat dissipation member 20 can be positioned within the case 30 and attached to the case 30 simply by inserting the substrate portion 20a into the insertion portion 32b. The insertion portion 32b opens at the top. In other words, it opens in the same direction as the opening 31c of the case body 31. The lower end of the insertion portion 32b is closed.

[0023] The plate-shaped portion 32a extends from the bottom 31a of the case body 31. The height of the plate-shaped portion 32a is set so that the entire height of the substrate portion 20a can be inserted into the insertion portion 32b and accommodated. For example, the height may be the same as the side wall 31b of the case body 31. The horizontal length of the plate-shaped portion 32a is longer than the horizontal length of the portion of the capacitor module 10 that faces the plate-shaped portion 32a. The thickness of the plate-shaped portion 32a is set to a thickness that ensures insulation between the capacitor module 10 and the substrate portion 20a. Note that if a separate insulating layer of air, resin, or the like is interposed between the capacitor module 10 and the substrate portion 20a, the thickness of the plate-shaped portion 32a may be determined taking that insulating layer into consideration. In either case, the dimensions are set to ensure insulation between the capacitor module 10 and the substrate portion 20a.

[0024] Next, the manufacturing process of the capacitor 1 of the present invention will be described. First, the substrate portion 20a of the heat dissipation member 20 is inserted into the insertion portion 32b and accommodated. Because the heat dissipation member 20 is rotationally symmetric in a planar view, there is no need to consider the insertion direction. Each of the two plate-like portions 32a has a notch 32a1 (see FIG. 1B) at a position corresponding to the extension portion 20b. When the substrate portion 20a is inserted into the insertion portion 32b and accommodated, the extension portion 20b is extended from the notch 32a1 into the accommodation portion 33 outside the insertion portion 32b. The extension portion 20b extended into the accommodation portion 33 is insulated from the capacitor module 10 by ensuring an insulating distance. However, the plate-like portion 32a may be provided between the extension portion 20b and the capacitor module 10, or the extension portion 20b may be previously insulated by wrapping insulating paper around it. The extension portion 20c is extended to the outside of the case 30, climbing over the side wall portion 31b. Although a small portion of the end of the substrate portion 20a is exposed from the insertion portion 32b due to the cutout 32a1, the entire substrate portion 20a is substantially housed in the insertion portion 32b.

[0025] Next, one capacitor module 10 is accommodated in each of the two accommodation sections 33. At this time, as shown in Figures 1A and 3, the two capacitor modules 10 are placed back to back, specifically, with the bases 122a of the second electrode plates 122 facing each other. The two capacitor modules 10 are identical, so there is no need to worry about the orientation when accommodating them.

[0026] When two capacitor modules 10 are housed, as shown in FIG. 1A, the substrate portion 20a of the heat dissipation member 20 is positioned between the base portions 122a of the two second electrode plates 122. Furthermore, as shown in FIG. 3, above the heat dissipation member 20, the external connection portions 121c of the first electrode plates 121 and the external connection portions 122c of the second electrode plates 122 overlap each other. In this case, it is preferable to position the capacitor module 10 using the partition 32 as a reference. For example, the position of the capacitor module 10 within the case 30 is automatically determined by abutting the base portions 122a of the two second electrode plates 122 against the outer surfaces of the plate-like portions 32a. Alternatively, engagement means such as recesses or protrusions may be provided on the plate-like portions 32a of the partition 32 to engage with the capacitor module 10 for positioning.

[0027] Resin 40 is then filled into housing portion 33 to resin-mold capacitor element 11. Resin 40 to be filled is an insulating synthetic resin, preferably a thermosetting resin or a photocurable resin, and more specifically, epoxy resin, urethane resin, or silicone resin is preferred. Resin 40 is then cured or allowed to harden, completing the manufacture of capacitor 1.

[0028] In the capacitor 1 configured as described above, the partition 32 allows the heat dissipation member 20 to be positioned within the case 30, attached to the case 30, and insulated from the capacitor module 10 all to be achieved in one step, eliminating the need to use a separate assembly jig or to provide an insulator between the heat dissipation member 20 and the capacitor module 10, simplifying the assembly process. Furthermore, because insulation is ensured, the capacitor module 10 can be easily placed close to the substrate portion 20a of the heat dissipation member 20, improving heat dissipation efficiency. Furthermore, because the substrate portion 20a of the heat dissipation member 20 is located between the two capacitor modules 10, where heat tends to build up, the center of the capacitor 1 can be cooled efficiently.

[0029] Next, modified examples of the partition 32 will be described. As shown in FIG. 4A, one end of the partition 32 may be connected to the side wall portion 31b, while the other end may be a free end without being connected to the side wall portion 31b. Alternatively, as shown in FIG. 4B, the partition 32 may be bent midway. Alternatively, as shown in FIG. 4C, the partition 32 may be branched, or as shown in FIG. 4D, the partition 32 may be lattice-shaped. Alternatively, as shown in FIG. 4E, the plate-shaped portion 32a may be positioned closely opposite the side wall portion 31b, with an insertion portion 32b provided between the plate-shaped portion 32a and the side wall portion 31b. This state can also be considered to form a double wall. Alternatively, as shown in FIG. 4F, the plate-shaped portion 32a may be omitted from the left-right center so as to support both left and right ends of the substrate portion 20a of the heat dissipation member 20 while not covering the center. Alternatively, the omitted portion may be divided into multiple portions as shown in FIG. 4G.

[0030] Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment and can be implemented with various modifications within the scope of the present invention. For example, the electrical component is not limited to the capacitor module 10, and various electrical components such as coils and power conversion devices can be used.

[0031] Alternatively, the case body 31 and the partition 32 may be provided separately, and the partition 32 may be attached to the case body 31 by adhesive, welding, or the like. In this case, the partition 32 does not necessarily have to be made of the same material as the case body 31. The partition 32 may be provided to stand up from the bottom 31a of the case body 31, or may be provided to extend laterally from the side wall 31b. The case body 31 is not limited to being substantially box-shaped, and various shapes having a bottom 31a and side wall 31b may be employed.

[0032] The spacing between the plate-shaped portions 32a does not necessarily have to be substantially the same as the thickness of the substrate portion 20a; as long as it can be positioned with the desired accuracy, it may be greater than the thickness of the substrate portion 20a, or ribs or protrusions may be provided within the insertion portion 32b so that the substrate portion 20a is supported by these ribs or protrusions.

[0033] There is no particular limit to the number of accommodating sections 33. The number of electrical components accommodated in one accommodating section 33 is also not limited to one, and may be multiple. Furthermore, as long as one of the multiple accommodating sections 33 accommodates an electrical component, the other accommodating sections 33 do not necessarily need to accommodate electrical components.

[0034] The lead-out portion 20c of the heat dissipation member 20 is preferably provided at both ends of the substrate portion 20a, but may be provided at only one of the ends, or if there are three or more ends, may be provided at each end.

[0035] The planar shape of the heat dissipation member 20 is not limited to a substantially Z-shape, but may be various shapes such as a U-shape, etc. The extending direction of the extending portion 20b is not particularly limited either.

[0036] The heat dissipation member 20 may be non-conductive. For example, a heat dissipation sheet may be made of an insulating resin sheet containing a highly thermally conductive filler such as metal or ceramic. In this case, the dividers 32 do not necessarily need to be insulating, and it is not necessary for the dividers 32 to insulate the electrical components from the heat dissipation member 20.

[0037] The film capacitor may be laminated instead of wound. Also, it is not limited to a film capacitor, and various capacitor elements such as a ceramic capacitor or an electrolytic capacitor may be used, and a combination of multiple types may also be used. [Explanation of symbols]

[0038] 1 capacitor 10 Capacitor module (electrical component) 11 Capacitor element 11a One electrode part 11b Other electrode part 12 Electrode plate 121 1st electrode plate 121a base 121b Element connection part 121c external connection 122 Second electrode plate 122a base 122b Element connection part 122c external connection 20 Heat dissipation material 20a Board section 20b Extension 20c Drawer section 30 cases 31 Case body 31a bottom 31b Side wall part 31c opening 32 Dividers 32a Plate-shaped part 32a1 Notch 32b Insertion part 33 Storage section 40 Resin

Claims

1. A case for accommodating an electrical component and a heat dissipation member, The case has an insertion portion into which a heat dissipation member can be inserted and accommodated.

2. A capacitor, wherein the case according to claim 1 houses a capacitor module having a capacitor element and an electrode plate connected to the capacitor element as an electrical component, and a heat dissipation member is inserted and housed in the insertion portion.

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