Electronic device

Abstract

To provide an electronic device capable of inspecting each of a plurality of electronic components mounted on a mounting substrate.SOLUTION: An electronic device 1 comprises a mounting substrate 2 having a wiring pattern 22, and a plurality of electronic components mounted on the mounting substrate 2 and connected in series via the wiring pattern 22. The wiring pattern 22 has a plurality of inspection pads 221, 222, 223d to 223f formed on both sides of each electronic component in the series path section 10 where a plurality of electronic components are connected in series, to which probes 11 for inspecting each electronic component are contacted.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to electronic devices. [Background technology]

[0002] Patent Document 1 discloses a light emitting module having a mounting substrate with a wiring pattern and a plurality of light emitting elements mounted on the mounting substrate. In the light emitting module described in Patent Document 1, pads are formed on the wiring pattern for testing the electrical characteristics of the light emitting module. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2017-174601 Summary of the Invention [Problem to be solved by the invention]

[0004] In the light-emitting module described in Patent Document 1, there are a plurality of light-emitting elements, but there are only two test pads, and it is not possible to test each of the plurality of light-emitting elements individually.

[0005] The present invention has been made in view of the above circumstances, and has an object to provide an electronic device that is capable of testing each of a plurality of electronic components mounted on a mounting board. [Means for solving the problem]

[0006] In order to achieve the above-mentioned object, the present invention provides an electronic device comprising: a mounting board having a wiring pattern; and a plurality of electronic components mounted on the mounting board and connected in series via the wiring pattern, wherein the wiring pattern is formed on both sides of each of the electronic components in a series path portion along which the plurality of electronic components are connected in series, and has a plurality of test pads to which probes for testing each of the electronic components are abutted. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide an electronic device that is capable of testing each of a plurality of electronic components mounted on a mounting board. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a plan view of an electronic device according to an embodiment. [Figure 2] FIG. 1 is an exploded perspective view of an electronic device according to an embodiment. [Figure 3] FIG. 2 is a plan view of a mounting substrate according to the embodiment. [Figure 4] FIG. 1 is a schematic circuit diagram of an electronic device according to an embodiment. [Figure 5] FIG. 1 is a first diagram showing a method for inspecting an electronic device according to an embodiment. [Figure 6] FIG. 2 is a second diagram showing the method for testing an electronic device in the embodiment. [Figure 7] FIG. 3 is a third diagram showing a method for testing an electronic device in the embodiment. [Figure 8] FIG. 4 is a fourth diagram showing the method for testing an electronic device in the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] [Embodiment Mode] Embodiments of the present invention will be described with reference to Figures 1 to 8. The embodiments described below are shown as preferred specific examples for carrying out the present invention, and although some of the embodiments specifically exemplify various technically preferred aspects, the technical scope of the present invention is not limited to these specific embodiments.

[0010] Fig. 1 is a plan view of the electronic device in this embodiment. Fig. 2 is an exploded perspective view of the electronic device. Fig. 3 is a plan view of the mounting substrate 2. In Fig. 3, the outline positions of the light emitting element 3 and the protection element 4 are indicated by two-dot chain lines. Fig. 4 is a schematic circuit diagram of the electronic device.

[0011] 1 and 2, the electronic device of this embodiment relates to a light emitting device 1 including a plurality of light emitting elements 3. The light emitting device 1 includes a mounting substrate 2, and four light emitting elements 3 as first electronic components and one protective element 4 as a second electronic component, which are mounted on the mounting substrate 2. As shown in Fig. 4, the light emitting device 1 is configured by connecting a series path section 10 in which the four light emitting elements 3 are connected in series, and the protective element 4 in parallel.

[0012] 1 and 2, in this embodiment, the mounting substrate 2 is a submount substrate having a light emitting element 3 and a protective element 4 mounted on one main surface thereof and being mounted on another wiring substrate (not shown) on the other main surface thereof. The mounting substrate 2 includes a base material 21 and a wiring pattern 22.

[0013] 1 to 3, the base material 21 is made of an electrically insulating material and is formed in the shape of a rectangular flat plate. For example, the base material 21 can be a ceramic substrate made of aluminum nitride (AlN), alumina (Al2O3), or the like. Furthermore, for example, the base material 21 can be made of high temperature co-fired ceramic (HTCC) or low temperature co-fired ceramic (LTCC).

[0014] The wiring pattern 22 includes two elongated vertical pads 221, 222 formed on one main surface of the substrate 21, four first mounting pads 223 for mounting four light-emitting elements 3, and one second mounting pad 224 for mounting one protection element 4.

[0015] The two vertical pads 221, 222 are formed elongated in the same direction. Hereinafter, the longitudinal direction of the vertical pads 221, 222 will be referred to as the vertical direction Y, the thickness direction of the mounting substrate 2 will be referred to as the height direction Z, and the direction perpendicular to both the vertical direction Y and the height direction Z will be referred to as the horizontal direction X. The vertical direction Y and the horizontal direction X are also directions that run along the outline of the rectangular base material 21 when viewed from the height direction Z.

[0016] In this embodiment, the two vertical pads 221, 222 are each formed in a rectangular shape and are arranged side by side at an interval in the horizontal direction X. One vertical pad 221 is electrically connected to the positive electrode of an external power supply, and the other vertical pad 222 is electrically connected to the negative electrode of the external power supply. For example, the vertical pads 221, 222 are electrically connected to a wiring board or the like (not shown), which serves as a current path to the power supply, via a back surface pattern (not shown) formed on the back surface side of the mounting substrate 2 (i.e., the side opposite to the side on which the light emitting element 3 and the protection element 4 are mounted). Four first mounting pads 223 and one second mounting pad 224 are formed between the vertical pad 221 and the vertical pad 222.

[0017] The first mounting pad 223 is a pad for mounting the light-emitting element 3, and includes an anode electrode 223a and a cathode electrode 223b. The anode electrode 223a and the cathode electrode 223b are arranged at an interval in the lateral direction X. The anode electrode 223a is electrically connected to the anode electrode 31 of the light-emitting element 3, and the cathode electrode 223b is electrically connected to the cathode electrode 32 of the light-emitting element 3.

[0018] The four first mounting pads 223 are arranged vertically and horizontally. That is, the four first mounting pads 223 are arranged in a matrix of 2 rows and 2 columns in the vertical direction Y and the horizontal direction X. The vertical pad 221, the four first mounting pads 223 on which the four light-emitting elements 3 are mounted, and the vertical pad 222 are connected in series via five first connecting portions 225 to form the series path portion 10.

[0019] The first mounting pad 223 has a mounting area 223c for mounting the light emitting element 3, protruding pads 223d to 223f formed to protrude from the mounting area 223c, and a recess 223g.

[0020] The mounting area 223c is an area of ​​the first mounting pad 223 where the mounted light emitting element 3 is projected in the height direction Z onto the mounting substrate 2. The mounting area 223c for the anode electrode 223a and the mounting area 223c for the cathode electrode 223b are each elongated in the vertical direction Y and are arranged at intervals in the horizontal direction X.

[0021] The protruding pads 223d to 223f are formed so as to protrude from one of the four mounting regions 223c toward a side opposite to the side on which the mounting region 223c adjacent to that mounting region 223c is located. In this embodiment, the protruding pads 223d to 223f are formed so as to protrude in the vertical direction Y from one of the four mounting regions 223c toward the side opposite to the mounting region 223c adjacent to that mounting region 223c in the vertical direction Y. In this embodiment, the protruding pads 223d to 223f include a protruding pad 223d protruding from the anode electrode 223a side of the second mounting region 223c from the vertical pad 221 side in the series path section 10, a protruding pad 223e protruding from the anode electrode 223a side of the third mounting region 223c, and a protruding pad 223f protruding from the cathode electrode 223b side of the third mounting region 223c. In this embodiment, all of the protruding pads 223d to 223f protrude from one of the two mounting regions 223c that are farther from the protection element 4 among the four mounting regions 223c to the opposite side from the protection element 4 in the vertical direction Y. In this embodiment, the protruding pads 223d to 223f have a rectangular shape that is elongated in the horizontal direction X.

[0022] The three protruding pads 223d to 223f constitute part of five test pads to which probes (see reference numeral 11 in FIGS. 5 to 8 described later) for testing each of the four light-emitting elements 3 mounted on the mounting board 2 come into contact. In this embodiment, the two vertical pads 221 and 222 and the three protruding pads 223d to 223f constitute the five test pads. As shown in FIG. 4, the test pads are formed on both sides of each light-emitting element 3 in the series path section 10. In other words, the test pads and the four light-emitting elements 3 are electrically arranged alternately. This makes it possible to energize each of the plurality of light-emitting elements 3. A method for testing the plurality of light-emitting elements 3 will be described later.

[0023] It is preferable that the protruding pads 223d to 223f protrude from the mounting area 223c in the protruding direction (the vertical direction Y in this embodiment) by a predetermined length or more so that the probes can be easily contacted. In this embodiment, the protruding length of the protruding pads 223d to 223f from the mounting area 223c in the vertical direction Y is preferably 0.2 mm or more. Furthermore, from the viewpoint of miniaturizing the light emitting device 1, it is preferable that the protruding length of the protruding pads 223d to 223f in the vertical direction Y is 0.5 mm or less.

[0024] The recesses 223g are formed to protrude from the mounting region 223c in the horizontal direction X. In this embodiment, the recesses 223g are formed to protrude from each mounting region 223c to both sides in the horizontal direction X. The recesses 223g are regions that serve as escape routes for bonding materials (e.g., solder) that protrude from the mounting region 223c when the light emitting element 3 is bonded to the mounting region 223c. The protruding length of the recesses 223g from the mounting region 223c in the horizontal direction X is shorter than the protruding length of the protruding pads 223d to 223f from the mounting region 223c in the vertical direction Y. Furthermore, the width of the recesses 223g (i.e., the dimension in the vertical direction Y) is greater than the width of the protruding pads 223d to 223f (i.e., the dimension in the horizontal direction X).

[0025] Between the two vertical pads 221, 222 in the horizontal direction X, second mounting pads 224, which are pads for mounting the protection element 4, are formed on one side of the four first mounting pads 223 in the vertical direction Y. The second mounting pads 224 include an anode electrode 224a and a cathode electrode 224b. The anode electrode 224a and the cathode electrode 224b are arranged at an interval in the horizontal direction X. The anode electrode 224a is electrically connected to the cathode electrode of the protection element 4, and the cathode electrode 224b is electrically connected to the anode electrode of the protection element 4. The vertical pad 221, the second mounting pad 224 on which the protection element 4 is mounted, and the vertical pad 222 are connected in series via two second connecting portions 226.

[0026] The wiring pattern 22 has the above-described configuration. To the wiring pattern 22, four light emitting elements 3 and one protective element 4 are connected.

[0027] The light emitting element 3 is, for example, a light emitting diode (LED) or a semiconductor laser (LD: Laser Diode). The light emitting element 3 can emit ultraviolet light, visible light, or infrared light.

[0028] The light-emitting element 3 is formed so as to have a rectangular shape when viewed from the height direction Z. Note that FIG. 2 shows a schematic outline of the light-emitting element 3. The light-emitting element 3 has at least an n-type semiconductor layer, an active layer, and a p-type semiconductor layer stacked in the height direction Z, and an anode electrode 31 and a cathode electrode 32 provided on the mounting substrate 2 side. The anode electrode 31 and the cathode electrode 32 are connected to the anode electrode 223a and the cathode electrode 223b of the mounting substrate 2 via bonding members such as solder or bumps, respectively, so that the light-emitting element 3 is flip-chip mounted on the mounting substrate 2. The light-emitting element 3 is configured to emit light toward the opposite side from the mounting substrate 2.

[0029] The four light-emitting elements 3 are electrically connected to the mounting regions 223c of the four first mounting pads 223 of the wiring pattern 22. The light-emitting elements 3 are arranged vertically and horizontally at positions between the two vertical pads 221, 222 in the horizontal direction X. That is, the four light-emitting elements 3 are arranged in a matrix of 2 rows and 2 columns in the vertical direction Y and the horizontal direction X.

[0030] The protective element 4 is intended to prevent an overcurrent from flowing through the light-emitting element 3. The protective element 4 is a constant voltage element such as a Zener diode. As shown in Fig. 4, the protective element 4 is connected in parallel with the series path portion 10 having the four light-emitting elements 3.

[0031] 1 and 2, the protective element 4 is mounted on the second mounting pad 224 of the wiring pattern 22. The protective element 4 is disposed on one side of the four light-emitting elements 3 in the vertical direction Y, at a position between the two vertical pads 221 and 222 in the horizontal direction X.

[0032] Next, a method for inspecting the light emitting device 1 of this embodiment will be described with reference to FIGS. In the method for testing the light emitting device 1 of this embodiment, the four light emitting elements 3 are energized one by one to test the light emitting state of each of the light emitting elements 3. To cause each of the four light emitting elements 3 to emit light, first, a pair of probes 11 of a testing device is placed on the testing pads on both sides of the specific light emitting element 3 in the series path section 10 to energize the specific light emitting element 3. By performing this process for each of the four light emitting elements 3 in turn, it is possible to test each of the four light emitting elements 3. The testing device may be one in which the probes 11 are placed on the testing pads manually or automatically.

[0033] The light-emitting element 3 is inspected by checking the light-emitting state of the light-emitting element 3 under inspection while the pair of probes 11 is in contact with the two inspection pads. That is, if the light-emitting element 3 under inspection emits light, the light-emitting element 3 is determined to be normal, and if it does not emit light, the light-emitting element 3 is determined to have some kind of abnormality (for example, an open or short circuit).

[0034] 5, first, a pair of probes 11 is brought into contact with the vertical pad 221 and the protruding pad 223d, which serve as test pads, respectively. As a result, electricity is applied to the light-emitting element 3 located at the bottom left of FIG. 5, and the light-emitting element 3 is tested.

[0035] Next, as shown in Fig. 6, a pair of probes 11 is brought into contact with the protruding pad 223d and the protruding pad 223e, respectively. As a result, electricity is applied to the light-emitting element 3 located at the upper left of Fig. 6, and the light-emitting element 3 is inspected.

[0036] Next, as shown in Fig. 7, a pair of probes 11 is brought into contact with the protruding pad 223e and the protruding pad 223f, respectively. As a result, electricity is applied to the light-emitting element 3 located at the upper right of Fig. 7, and the light-emitting element 3 is inspected.

[0037] Next, as shown in Fig. 8, a pair of probes 11 is brought into contact with the protruding pad 223f and the vertical pad 222, respectively. As a result, electricity is applied to the light-emitting element 3 located at the bottom right of Fig. 8, and the light-emitting element 3 is inspected. In this manner, the four light emitting elements 3 can be inspected one by one.

[0038] (Actions and Effects of the Embodiments) In the electronic device (i.e., light emitting device 1) of this embodiment, wiring pattern 22 is formed on both sides of each electronic component (i.e., light emitting elements 3) in series-connected series path section 10, and has a plurality of test pads to which probes 11 for testing each electronic component come into contact. Therefore, in a state where a plurality of electronic components are mounted on mounting board 2, it becomes possible to test the plurality of electronic components one by one.

[0039] In this embodiment, the electronic component to be inspected is the light-emitting element 3. Therefore, the light-emitting element 3 can be inspected by checking the light-emitting state of each light-emitting element 3, which makes it easy to inspect each of the multiple light-emitting elements 3.

[0040] The plurality of testing pads include protruding pads 223d to 223f formed to protrude from one of the mounting areas 223c among the plurality of mounting areas 223c in which the plurality of light-emitting elements 3 are respectively mounted on the wiring pattern 22 to a side different from the side where the mounting area 223c adjacent to that mounting area 223c is located. This makes it easier to apply the probe 11 to the protruding pads 223d to 223f compared to, for example, a case where the protruding pads 223d to 223f are formed between the light-emitting elements 3.

[0041] Furthermore, the number of light emitting elements 3 is four, and they are arranged vertically and horizontally, which makes it easy to achieve miniaturization of the electronic component (that is, the light emitting device 1).

[0042] The wiring pattern 22 is formed on both sides of the four light-emitting elements 3 in the series path portion 10, and has two vertical pads 221, 222 each long in the vertical direction Y, with the four light-emitting elements 3 arranged between the two vertical pads 221, 222 in the horizontal direction X. This allows the light-emitting device 1 to be made smaller.

[0043] Each of the plurality of protruding pads 223d to 223f is formed to protrude from one of the four mounting regions 223c to the opposite side of the mounting region 223c adjacent to that mounting region 223c in the vertical direction Y. This allows the light emitting device 1 to be made smaller in size in the horizontal direction X.

[0044] Furthermore, the light emitting device 1 of this embodiment further includes a protective element 4 as a second electronic component mounted on the mounting substrate 2 between the two vertical pads 221, 222 in the horizontal direction X and on one side of the four light emitting elements 3 in the vertical direction Y. Therefore, even when the light emitting device 1 includes a plurality of first electronic components (i.e., light emitting elements 3) and second electronic components (i.e., protective elements 4), the light emitting device 1 can be made smaller.

[0045] As described above, according to this embodiment, it is possible to provide an electronic device that is capable of testing each of a plurality of electronic components mounted on a mounting board.

[0046] [Variations] Possible modifications of the electronic device according to the embodiment will be described.

[0047] In the embodiment, the electronic device is the light emitting device 1 having a plurality of light emitting elements 3 as electronic components, but is not limited to this. For example, the electronic components may be semiconductor elements other than the light emitting elements 3, or may be other than semiconductor elements. If the electronic components are not light emitting elements 3, the electronic components can be inspected by checking the electrical connection state of the electronic components.

[0048] Furthermore, in the embodiment, an example in which four light emitting elements 3 are arranged vertically and horizontally has been shown, but the number and arrangement of electronic components are not limited to this.

[0049] In the embodiment, the three protruding pads include the protruding pad 223d protruding from the anode electrode 223a side of the second mounting area 223c from the vertical pad 221 side in the series path section 10, the protruding pad 223e protruding from the anode electrode 223a side of the third mounting area 223c, and the protruding pad 223f protruding from the cathode electrode 223b side of the third mounting area 223c, but the locations where the three protruding pads 223d to 223f are formed are not limited to this. As an example, the three protruding pads may be configured by the protruding pad protruding from the cathode electrode 223b side of the first mounting area 223c from the vertical pad 221 side in the series path section 10, the protruding pad protruding from the cathode electrode 223b side of the second mounting area 223c, and the protruding pad protruding from the anode electrode 223a side of the fourth mounting area 223c.

[0050] Furthermore, in the embodiment, the protruding pads 223d to 223f protrude in the vertical direction Y from the mounting area 223c, but this is not limiting and they may protrude in the horizontal direction X from the mounting area 223c.

[0051] (Summary of the embodiment) Next, the technical ideas grasped from the above-described embodiments will be described by using the reference numerals and the like in the embodiments. However, the reference numerals and the like in the following description do not limit the components in the claims to the members and the like specifically shown in the embodiments.

[0052] [1] A first embodiment of the present invention is an electronic device 1 comprising a mounting board 2 having a wiring pattern 22, and a plurality of electronic components mounted on the mounting board 2 and connected in series via the wiring pattern 22, wherein the wiring pattern 22 is formed on both sides of each of the electronic components in a series path section 10 along which the plurality of electronic components are connected in series, and has a plurality of test pads 221, 222, 223d to 223f against which probes 11 for testing each of the electronic components come into contact. This makes it possible to inspect each of the electronic components mounted on the mounting board 2.

[0053] [2] A second embodiment of the present invention is the first embodiment, in which the electronic component is a light-emitting element 3. This makes it easy to inspect each of the plurality of light-emitting elements 3 .

[0054] [3] A third embodiment of the present invention is that, in the first or second embodiment, the plurality of test pads 221, 222, 223d to 223f have protruding pads 223d to 223f formed so as to protrude from one of the plurality of mounting areas 223c in the wiring pattern 22, in which the plurality of electronic components are respectively mounted, to a side different from the side on which the mounting area 223c adjacent to that mounting area 223c is located. This makes it easier to bring the test probes 11 into contact with the protruding pads 223d to 223f.

[0055] [4] A fourth embodiment of the present invention is the third embodiment, in which the plurality of electronic components is four and is arranged vertically and horizontally. This makes it easier to make the electronic device 1 smaller.

[0056] [5] A fifth embodiment of the present invention is the fourth embodiment, in which the wiring pattern 22 is formed on each side of the four electronic components in the series path section 10 and has two vertical pads 221, 222 each long in the vertical direction Y, and the four electronic components are arranged between the two vertical pads 221, 222 in the horizontal direction X. This makes it easier to make the electronic device 1 smaller.

[0057] [6] A sixth embodiment of the present invention is the fifth embodiment, wherein each of the plurality of protruding pads 223d to 223f is formed so as to protrude from one of the four mounting areas 223c to the opposite side of the mounting area 223c adjacent to that mounting area 223c in the vertical direction Y. This makes it easier to reduce the size of the electronic device 1 in the lateral direction X.

[0058] [7] A seventh embodiment of the present invention is the fifth or sixth embodiment, further comprising a second electronic component 4 mounted on the mounting substrate 2 between the two vertical pads 221, 222 in the horizontal direction X and on one side of the four electronic components in the vertical direction Y. This makes it easier to make the electronic device 1 smaller.

[0059] (Addendum) Although the embodiments of the present invention have been described above, the invention according to the claims is not limited to the above-described embodiments. It should be noted that not all of the combinations of features described in the embodiments are necessarily essential to the means for solving the problems of the invention. Furthermore, the present invention can be appropriately modified and implemented within the scope of its spirit. [Explanation of symbols]

[0060] 1...Electronic equipment 10...Serial path section 11...Probe 2...Mounting board 22...Wiring pattern 221...Test pad 222...Vertical pad (test pad) 222...Vertical pad (test pad) 223c...Implementation area 223d~223f (Test pads) 3...Light emitting element 4...Protection element (second electronic component) X: Horizontal Y: Vertical direction

Claims

1. a mounting substrate having a wiring pattern; a plurality of electronic components mounted on the mounting board and connected in series via the wiring pattern, the wiring pattern is formed on both sides of each of the electronic components in a series path portion in which the plurality of electronic components are connected in series, and has a plurality of test pads to which probes for testing each of the electronic components come into contact; electronic equipment.

2. The electronic component is a light-emitting element. The electronic device of claim 1 .

3. the plurality of test pads have protruding pads formed so as to protrude from any one of a plurality of mounting areas in the wiring pattern, in which the plurality of electronic components are respectively mounted, to a side different from a side on which a mounting area adjacent to the mounting area is located; The electronic device of claim 1 .

4. The plurality of electronic components are four in number and are arranged vertically and horizontally. The electronic device of claim 3 .

5. the wiring pattern has two vertical pads formed on both sides of the four electronic components in the series path portion, each of which is long in the vertical direction; the four electronic components are arranged between the two vertical pads in the horizontal direction; 5. The electronic device of claim 4.

6. Each of the plurality of protruding pads is formed to protrude from one of the four mounting areas to a side opposite to the mounting area adjacent to that mounting area in the vertical direction.

6. The electronic device of claim 5.

7. a second electronic component mounted on the mounting board between the two vertical pads in the horizontal direction and on one side of the four electronic components in the vertical direction; 6. The electronic device of claim 5.

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