Top ring, substrate polishing device, and substrate polishing method

Abstract

To provide a top ring holding a polygonal substrate in which an impact due to a collision between a base member and a substrate holding member at the time of rotating of the top ring is suppressed and prevented.SOLUTION: A top ring for holding a polygonal substrate includes: a base member connected to a rotation shaft and having a first guide part including a circular outer peripheral surface; a substrate holding member including an opening part having a circular inner peripheral surface corresponding to the outer peripheral surface of the first guide part and including a frame member that vertically slidably fits to the first guide part; and a second guide part provided between the first guide part and the frame member, the second guide part including a first rolling body that rotates around an axial line extending in a rotational radius direction of the top ring and a recess that receives the first rolling body.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present application relates to a top ring, a substrate polishing apparatus, and a substrate polishing method. [Background technology]

[0002] Chemical mechanical polishing (CMP) equipment is used to planarize the surface of a substrate in the manufacture of semiconductor devices. The substrates used in semiconductor device manufacturing are often disk-shaped. In addition to semiconductor devices, there is also a growing demand for flatness when planarizing the surfaces of rectangular substrates such as copper clad laminate (CCL) substrates, printed circuit board (PCB) substrates, photomask substrates, and display panels. There is also a growing demand for planarizing the surfaces of package substrates on which electronic devices are mounted, such as PCB substrates.

[0003] A substrate polishing apparatus includes a top ring for holding a substrate. For example, the top ring of the substrate polishing apparatus described in Patent Documents 1 and 2 includes a rotating shaft, a base member connected to the rotating shaft, and a substrate holding member (e.g., a substrate suction member) that is fitted to the lower outer surface of the base member and is movable up and down relative to the base member. The top rings described in Patent Documents 1 and 2 are configured to hold, in most cases, polygonal substrates on their lower surface (substrate suction surface), and to press the substrate against the polishing surface of a polishing pad while rotating the top ring and polishing table, thereby polishing the substrate's polished surface.

[0004] The top ring described in Patent Document 3 comprises a top ring body including an elastic membrane (pressure chamber) that serves as the substrate support surface, and a retainer that is arranged to surround the outer periphery of the substrate support surface and is movable up and down relative to the top ring body. The top ring shown in Patent Document 3 is designed to polish the surface of a substrate, which is mainly polygonal, by inflating the elastic membrane to bring the substrate support surface into contact with the polishing surface while the retainer prevents the substrate from slipping out of position, and by rotating the top ring and polishing table. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2022-059509 [Patent Document 2] Japanese Patent Publication No. 2023-57047 [Patent Document 3] Patent No. 7074606 Specification Summary of the Invention [Problem to be solved by the invention]

[0006] In the top rings shown in Patent Documents 1 and 2, the substrate holding member floats relative to the base member via an elastic member during substrate polishing. In this structure, the frictional force generated between the substrate and the polishing pad is supported by the lower guide member below the base member. When the lower guide member of the base member and the lower frame member of the substrate holding member are polygonal in shape to match the polygonal shape of the substrate, as in the top rings shown in Patent Documents 1 and 2, the following disadvantages arise.

[0007] (1) A part of the inner wall of the lower frame member fixed to the substrate holding member comes into contact with the corner of the lower guide member of the base member, resulting in high localized pressure, which may cause significant wear at the contact point between the lower frame member and the base member (see Figure 11). (2) The inner wall of the lower frame member and the outer wall of the lower guide member collide four times during one rotation of the top ring, causing large collision vibrations in both the base member and the substrate holding member. (See Figure 11.) This can cause the fastening bolts that fasten the top ring components together to become loose. (3) As mentioned in (1) above, localized high pressure on a portion of the lower frame member creates resistance when the substrate holding member moves up and down relative to the base member. A large frictional force is generated at the contact point between the lower frame member and the lower guide member, making it difficult for the substrate holding member to move up and down relative to the base member, which may cause problems with the distribution of polishing pressure on the substrate. Furthermore, at the moment when the polishing frictional force on the substrate is supported by the entire edges of the lower frame member and the lower guide member in contact with each other, the contact area becomes large, making it difficult for the substrate holding member to move up and down relative to the base member, as described above.

[0008] The top ring disclosed in Patent Document 3 also has a similar problem.

[0009] The present invention aims to solve at least some of the problems described above. One object of the present invention is to suppress or prevent impacts caused by collisions between a base member and a substrate holding member during rotation of a top ring that holds polygonal substrates. Another object of the present invention is to facilitate smooth vertical movement of the substrate holding member relative to the base member in a top ring that holds polygonal substrates. [Means for solving the problem]

[0010] According to one aspect of the present invention, there is provided a top ring for holding a polygonal substrate, comprising: a base member connected to a rotating shaft, the base member having a first guide portion with a circular outer peripheral surface; a substrate holding member having a frame member having an opening with a circular inner peripheral surface corresponding to the outer peripheral surface of the first guide portion and engaging with the first guide portion so as to be slidable in the vertical direction; and a second guide portion provided between the first guide portion and the frame member, the second guide portion having a first rolling element that rotates around an axis extending in the direction of the rotation radius of the top ring and a recess that receives the first rolling element. [Brief explanation of the drawings]

[0011] [Figure 1]1 is a plan view showing an overall configuration of a substrate polishing apparatus according to an embodiment; [Figure 2] FIG. 1 is a perspective view schematically illustrating a configuration of a polishing unit according to an embodiment. [Figure 3] FIG. 1 is a cross-sectional view schematically illustrating a top ring according to an embodiment. [Figure 4A] FIG. 10 is a cross-sectional view schematically illustrating a top ring according to another aspect of an embodiment. [Figure 4B] FIG. 10 is a cross-sectional perspective view schematically illustrating a top ring according to another aspect of an embodiment. [Figure 5] FIG. 10 is a plan view schematically illustrating a guide portion of a top ring according to an embodiment. [Figure 6A] FIG. 6 is an enlarged perspective view of a portion B of FIG. 5. [Figure 6B] FIG. 6 is an enlarged plan view of a portion B of FIG. 5. [Figure 7] FIG. 10 is an explanatory diagram illustrating forces acting on the top ring when the top ring rotates. [Figure 8] FIG. 10 is a plan view showing a guide portion of a top ring according to another embodiment. [Figure 9] FIG. 10 is a cross-sectional view showing an example of a biasing mechanism for a top ring. [Figure 10] FIG. 10 is a cross-sectional view showing another example of a biasing mechanism for a top ring. [Figure 11] 10A and 10B are explanatory diagrams illustrating contact between components during rotation of a top ring according to a related art.

[0012] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings described below, the same or corresponding components are designated by the same reference numerals, and redundant description will be omitted.

[0013] 1 is a plan view showing the overall configuration of a substrate polishing apparatus 1000 according to one embodiment. The substrate polishing apparatus 1000 shown in FIG. 1 includes a load unit 100, a transfer unit 200, a polishing unit 300, a drying unit 500, and an unload unit 600. In this embodiment, the transport unit 200 has two transport units 200A and 200B, and the polishing unit 300 has two polishing units 300A and 300B. One or more transport units 200 and polishing units 300 may be provided. In one embodiment, each of these units can be formed independently. By forming these units independently, it is possible to easily form substrate polishing apparatuses 1000 with different configurations by arbitrarily combining the number of each unit. The substrate polishing apparatus 1000 also includes a controller 900, and each component of the substrate polishing apparatus 1000 is controlled by the controller 900. In one embodiment, the controller 900 can be configured as a general computer including an input / output device, an arithmetic unit 900b, a storage device (storage medium) 900a, and the like. The storage device (storage medium) 900a can include any volatile and / or nonvolatile memory. The controller 900 functions as the main body of operations that controls the substrate polishing apparatus 1000. The controller 900 performs various processes by reading and executing programs stored in the storage device 900a etc. The programs may be obtained by being recorded on a recording medium such as a DVD-ROM, or may be obtained via a network.

[0014] <Load unit> The load unit 100 is a unit for introducing a substrate WF before processing such as polishing and cleaning into the substrate polishing apparatus 1000. In one embodiment, the load unit 100 is configured to comply with the SMEMA (Surface Mount Equipment Manufacturers Association) Mechanical Device Interface Standard (IPC-SMEMA-9851).

[0015] In the illustrated embodiment, the transport mechanism of the load unit 100 includes multiple transport rollers 202 and multiple roller shafts 204 to which the transport rollers 202 are attached. In the embodiment shown in FIG. 1, three transport rollers 202 are attached to each roller shaft 204. The substrate WF is placed on the transport rollers 202, and the substrate WF is transported by the rotation of the transport rollers 202. The transport rollers 202 may be attached at any position on the roller shaft 204 as long as they can stably transport the substrate WF. However, since the transport rollers 202 come into contact with the substrate WF, it is preferable to position the transport rollers 202 so that they contact an area of ​​the substrate WF to be processed that does not cause any problems. In one embodiment, the transport rollers 202 of the load unit 100 may be made of a conductive polymer. In one embodiment, the transport rollers 202 are electrically grounded via the roller shafts 204 or the like. This is to prevent the substrate WF from being charged and damaging the substrate WF. In one embodiment, the load unit 100 may also be provided with an ionizer (not shown) to prevent the substrate WF from being charged.

[0016] <Transport unit> 1 includes two transfer units 200A and 200B. The two transfer units 200A and 200B can have the same configuration, and therefore will be collectively referred to as the transfer unit 200 in the following description.

[0017] The illustrated transport unit 200 includes a plurality of transport rollers 202 for transporting the substrate WF. By rotating the transport rollers 202, the substrate WF on the transport rollers 202 can be transported in a predetermined direction. The transport rollers 202 of the transport unit 200 may be formed from a conductive polymer or a non-conductive polymer.

[0018] In one embodiment, the transport unit 200 includes a cleaning nozzle 284. The cleaning nozzle 284 is connected to a cleaning liquid supply source (not shown). The cleaning nozzle 284 is configured to supply the cleaning liquid to the substrate WF transported by the transport rollers 202.

[0019] <Polishing unit> Fig. 2 is a perspective view schematically illustrating the configuration of a polishing unit 300 according to one embodiment. The substrate polishing apparatus 1000 shown in Fig. 1 includes two polishing units 300A and 300B. The two polishing units 300A and 300B can have the same configuration, and therefore will be collectively referred to as the polishing unit 300 below.

[0020] 2, the polishing unit 300 includes a polishing table 350 and a top ring 302 constituting a polishing head that holds a substrate, which is an object to be polished, and presses it against the polishing surface on the polishing table 350. The polishing table 350 is connected to a polishing table rotation motor (not shown) disposed below the polishing table 350 via a table shaft 351, and is rotatable about the table shaft 351. A polishing pad 352 is affixed to the upper surface of the polishing table 350, and a surface (polishing surface) 352a of the polishing pad 352 constitutes the polishing surface that polishes the substrate.

[0021] A polishing liquid supply nozzle 354 is installed above the polishing table 350, and this polishing liquid supply nozzle 354 supplies a polishing liquid onto a polishing pad 352 on the polishing table 350. Also, as shown in FIG. 2, the polishing table 350 and the table shaft 351 are provided with a passage 353 for supplying the polishing liquid. The passage 353 communicates with an opening 355 in the surface of the polishing table 350. A through-hole 357 is formed in the polishing pad 352 at a position corresponding to the opening 355 in the polishing table 350, and the polishing liquid passing through the passage 353 is supplied to the surface of the polishing pad 352 through the opening 355 in the polishing table 350 and the through-hole 357 in the polishing pad 352. The opening 355 in the polishing table 350 and the through-hole 357 in the polishing pad 352 may be one, multiple, or none. Furthermore, the positions of the opening 355 in the polishing table 350 and the through-hole 357 in the polishing pad 352 are arbitrary, but in one embodiment, they are located near the center of the polishing table 350. Note that in one embodiment, during polishing of the substrate, the substrate WF held by the top ring 302 is moved so as to pass near the center of the polishing table 350 (so as to cover the through-hole 357).

[0022] 2, in one embodiment, the polishing unit 300 includes an atomizer 358 (see FIG. 1) for spraying a liquid or a mixture of liquid and gas toward the polishing pad 352. The liquid sprayed from the atomizer 358 is, for example, pure water, and the gas is, for example, nitrogen gas.

[0023] The top ring 302 is connected to a top ring shaft 18, which is movable up and down relative to a swing arm 360 by a vertical movement mechanism 319. The vertical movement of the top ring shaft 18 moves the entire top ring 302 up and down relative to the swing arm 360, thereby positioning it. The top ring shaft 18 is rotated by a top ring rotation motor (not shown). The rotation of the top ring shaft 18 causes the top ring 302 to rotate around the top ring shaft 18.

[0024] The top ring 302 is capable of holding a rectangular substrate on its underside. In this embodiment, "rectangular substrate" refers to a substrate (polygonal substrate) having a triangular, rectangular, or polygonal surface with five or more sides. The swing arm 360 is configured to be rotatable about a support shaft 362. By rotating the swing arm 360, the top ring 302 can move between the substrate transfer position of the transport unit 200 and above the polishing table 350. By lowering the top ring shaft 18, the top ring 302 can be lowered to press the substrate against the polishing surface 352a of the polishing pad 352. At this time, the top ring 302 and the polishing table 350 can be rotated and set above the polishing table 350. A polishing liquid is supplied onto the polishing pad 352 from a polishing liquid supply nozzle 354 provided in the polishing table 350 and / or from an opening 355 provided in the polishing table 350. In this manner, the surface of the substrate can be polished by pressing the substrate against the polishing surface 352a of the polishing pad 352. As described above, the swing arm 360 may be fixed or swingable so that the top ring 302 passes through the center of the polishing pad 352 (so as to cover the through-hole 357 of the polishing pad 352) during polishing of the substrate WF.

[0025] The up-and-down movement mechanism 319 that moves the top ring shaft 18 and the top ring 302 up and down includes a bridge 28 that rotatably supports the top ring shaft 18 via a bearing 321, a ball screw 32 attached to the bridge 28, a support base 29 supported by a support column 130, and an AC servo motor 38 provided on the support base 29. The support base 29 that supports the servo motor 38 is fixed to a swing arm 360 via the support column 130.

[0026] The ball screw 32 includes a screw shaft 32a connected to a servo motor 38 and a nut 32b onto which the screw shaft 32a is threaded. The top ring shaft 18 moves up and down integrally with the bridge 28. Therefore, when the servo motor 38 is driven, the bridge 28 moves up and down via the ball screw 32, which in turn moves the top ring shaft 18 and the top ring 302 up and down.

[0027] The polishing unit 300 according to one embodiment includes a dressing unit 356 that dresses the polishing surface 352a of the polishing pad 352. The dressing unit 356 includes a dresser 50 that slides against the polishing surface 352a, a dresser shaft 51 to which the dresser 50 is connected, an air cylinder 53 attached to the upper end of the dresser shaft 51, and a swing arm 55 that rotatably supports the dresser shaft 51. The lower portion of the dresser 50 is formed by a dressing member 50a, and needle-shaped diamond particles are attached to the underside of the dressing member 50a. The air cylinder 53 is disposed on a support base 57 supported by struts 56, and the struts 56 are fixed to the swing arm 55.

[0028] The swing arm 55 is driven by a motor (not shown) and configured to rotate around a support shaft 58. The dresser shaft 51 is rotated by the drive of the motor (not shown), and the rotation of the dresser shaft 51 causes the dresser 50 to rotate around the dresser shaft 51. The air cylinder 53 moves the dresser 50 up and down via the dresser shaft 51, and presses the dresser 50 against the polishing surface 352a of the polishing pad 352 with a predetermined pressing force.

[0029] The polishing surface 352a of the polishing pad 352 is dressed as follows. The dresser 50 is pressed against the polishing surface 352a by the air cylinder 53, and simultaneously, pure water is supplied to the polishing surface 352a from a pure water supply nozzle (not shown). In this state, the dresser 50 rotates around the dresser shaft 51, and the swing arm 55 swings over the polishing surface 352a, causing the lower surface (diamond particles) of the dressing member 50a to slide against the rotating polishing surface 352a. In this way, the dresser 50 scrapes off the polishing pad 352, and the polishing surface 352a is dressed.

[0030] <Drying unit> The drying unit is a device for drying the substrate WF. In the substrate polishing apparatus 1000 shown in FIG. 1, the drying unit 500 dries the substrate WF that has been polished in the polishing unit 300 and then cleaned in the cleaning section of the transfer unit 200. As shown in FIG. 1, the drying unit 500 is disposed downstream of the transfer unit 200. The drying unit 500 has a nozzle 530 for spraying gas toward the substrate WF being transported on the transport rollers 202. The gas can be, for example, compressed air or nitrogen. The water droplets on the substrate WF can be blown away by the gas ejected from the nozzle 530, thereby drying the substrate WF.

[0031] <Unload unit> The unload unit 600 is a unit for unloading the substrate WF after processing such as polishing and cleaning to the outside of the substrate polishing apparatus 1000. In the substrate polishing apparatus 1000 shown in FIG. 1, the unload unit 600 receives the substrate after drying in the drying unit 500. As shown in FIG. 1, the unload unit 600 is disposed downstream of the drying unit 500. In one embodiment, the unload unit 600 is configured to comply with the Mechanical Device Interface Standard (IPC-SMEMA-9851) of the SMEMA (Surface Mount Equipment Manufacturers Association).

[0032] <Top ring> Next, the top ring 302 of the polishing unit 300 according to one embodiment will be described. FIG. 3 is a cross-sectional view schematically illustrating the top ring 302 according to one embodiment. FIG. 4A is a cross-sectional view schematically illustrating the top ring 302 according to another aspect of the embodiment. FIG. 4B is a cross-sectional perspective view schematically illustrating the top ring 302 according to another aspect of the embodiment.

[0033] 3, the top ring 302 includes a base member 301 connected to the top ring shaft (rotating shaft) 18. As a specific example, the base member 301 includes a flange 303 connected to the top ring shaft 18, an upper guide member 305 attached to the lower surface of the flange 303, and a lower guide member 306 provided on the lower surface of the upper guide member 305.

[0034] 5, in this embodiment, the lower guide member 306 has an annular shape in a plan view and has a circular outer shape (outline). The lower guide member 306 has a circumferential (circular) outer peripheral surface 371 and a circumferential (circular) inner peripheral surface 372. The lower guide member 306 can be made of, for example, a stainless steel material.

[0035] The flange 303 and the upper guide member 305 are fixed together by any fastening member (not shown, for example, bolt 307 shown in FIGS. 4 and 4B). The upper guide member 305 and the lower guide member 306 are fixed together by any fastening member (not shown, for example, bolt 326 shown in FIGS. 4A and 4B) with the elastic member 340 sandwiched therebetween. The shielding member 332, the upper frame member 342, and the lower frame member 343 are fixed together by any fastening member (not shown, for example, bolt 308 shown in FIGS. 4A and 4B). The lower frame member 343 can be made of, for example, a resin material (PEEK, PPS, PVC). The ends of the elastic membranes 320-1, 320-2, and 320-3 are fixed to different positions on the underside of the upper guide member 305 via respective holders (not shown) by any fastening member (not shown, for example, bolt 325 shown in FIGS. 4A and 4B). The elastic member 340 can be made of a rubber material such as, but not limited to, silicone rubber, EPDM (ethylene propylene diene rubber), FKM (fluoro rubber), etc. The lower guide member 306 is provided in a frame shape on the peripheral portion of the lower surface of the upper guide member 305.

[0036] 4A and 4B, the base member 301 includes a flange 303 connected to the top ring shaft 18, a spacer 304 attached to the lower surface of the flange 303, an upper guide member 305 attached to the lower surface of the spacer 304, and a frame-shaped lower guide member 306 attached to the lower surface of the upper guide member 305. The flange 303, the spacer 304, and the upper guide member 305 are fixed together by bolts 307. The upper guide member 305 and the lower guide member 306 are fixed together by bolts 326, with an elastic member 340 sandwiched between them. The shielding member 332, the upper frame member 342, and the lower frame member 343 are , and fixed by bolts 308. The ends of elastic membranes 320-1, 320-2, and 320-3 are fixed to different positions on the underside of upper guide member 305 via respective holders by bolts 325. As the other configurations are the same as those shown in FIG. 3, the configuration of FIG. 3 will be described below. In FIGS. 3, 4A, and 4B, similar configurations are denoted by similar reference numerals.

[0037] As shown in FIG. 3, the top ring 302 includes a substrate holding member 330 for attracting the backside of the substrate WF with its surface to be polished facing downward. The substrate holding member 330 is disposed below the base member 301. The substrate holding member 330 includes a substrate attracting body 334. The substrate attracting body 334 may be any member capable of attracting the substrate WF by vacuuming using a decompression module 31 (e.g., a module including a vacuum source). The substrate attracting body 334 may be made of a resin porous material (porous material) having numerous pores formed in a resin such as PE (polyethylene), PP (polypropylene), PTFE (polytetrafluoroethylene), or PVC (polyvinyl chloride). In this embodiment, the substrate attracting body 334 is formed in a plate shape, and its lower surface defines a substrate attracting surface 334a for attracting the substrate WF. The substrate attracting body 334 has a decompression section 334d communicating with the decompression module 31.

[0038] The substrate holding member 330 also includes a shielding member 332. The shielding member 332 may be any airtight member capable of blocking the flow of gas, and may be formed, for example, from a relatively soft resin plate such as PE (polyethylene), PP (polypropylene), PTFE (polytetrafluoroethylene), or PVC (polyvinyl chloride). In this embodiment, the shielding member 332 is formed so as to shield a surface 334b ​​of the substrate adsorption body 334 opposite to the substrate adsorption surface 334a. The shielding member 332 includes a suction hole 336 formed to communicate with the substrate adsorption body 334. A pressure reduction section 334d is provided at the position where the suction hole 336 is formed. In this embodiment, the suction hole 336 is formed in the shielding member 332 so as to communicate with a side surface 334c of the substrate adsorption body 334, and the pressure reduction section 334d is provided on the side surface 334c. One end of the suction hole 336 is connected to the side surface 334 c of the substrate suction body 334 , and the other end is connected to the decompression module 31 via the suction path 312 .

[0039] By providing the shielding member 332, when the substrate attracting body 334 is evacuated by the decompression module 31, a negative pressure can be efficiently generated on the substrate attracting surface 334a. This allows the substrate WF to be reliably attracted to the substrate holding member 330 (substrate attracting body 334), preventing the substrate WF from slipping out during polishing without providing a retaining member around the substrate WF. Furthermore, if the substrate WF has a rectangular shape, the corners of the substrate WF may come into contact with the retaining member during polishing, potentially damaging the substrate WF or the top ring. In contrast, according to this embodiment, the substrate WF can be vacuum-attracted by the substrate holding member 330 (substrate attracting body 334) while being pressed against the polishing pad 352. This prevents the substrate WF from slipping out during polishing, and also prevents damage to the substrate WF or the top ring during polishing.

[0040] As shown in FIG. 3 , the substrate holding member 330 includes a frame member 344 attached to the shielding member 332 so as to surround at least a portion of the base member 301 (specifically, the upper guide member 305 and the lower guide member 306). The frame member 344 includes a lower frame member 343 attached in a frame-like shape to the periphery of the upper surface of the shielding member 332, and a frame-like upper frame member 342 attached on the lower frame member 343. The lower frame member 343 and the shielding member 332 are connected via a sealant 341. In this embodiment, the sealant 341 is formed in a film shape that covers the upper surface of the substrate holding member 330. However, the sealant 341 may be in a frame shape having only a periphery for sealing the lower frame member 343 and the shielding member 332. As an example, the shielding member 332 and the frame member 344 are fixed by any fastening means such as bolts (not shown, for example, the bolts 308 shown in FIGS. 4A and 4B ). In addition, the upper frame member 342 and the lower frame member 34 3 is connected with an elastic member 340 sandwiched therebetween.

[0041] The upper frame member 342 includes a frame member protrusion 342a that protrudes toward the base member 301 (specifically, the upper guide member 305). The upper guide member 305 also includes a guide member protrusion 305a that protrudes toward the upper frame member 342 at a height position different from that of the frame member protrusion 342a. The frame member protrusion 342a and the guide member protrusion 305a overlap each other in a predetermined region when the top ring 302 is viewed from above. Therefore, contact between the frame member protrusion 342a and the guide member protrusion 305a can restrict movement of the substrate holding member 330 in the height direction.

[0042] 5, the lower frame member 343 has a rectangular outer shape and a circular opening 380 formed inside the rectangular outer shape. The opening 380 has a circumferential (circular) inner peripheral surface 381 that corresponds to the circumferential (circular) outer peripheral surface 371 of the lower guide member 306.

[0043] Substrate holding member 330 includes elastic member 340 that connects at least a portion of base member 301 surrounded by frame member 344 to frame member 344. Specifically, elastic member 340 is a frame-shaped plate member having an inner end 340a that is sandwiched between upper guide member 305 and lower guide member 306, and an outer end 340b that is sandwiched between lower frame member 343 and upper frame member 342. Elastic member 340 can be made of a rubber material such as silicone rubber, EPDM (ethylene propylene diene rubber), or FKM (fluororubber), but is not limited to these.

[0044] 3, the top ring 302 includes an elastic membrane 320 configured to form a pressure chamber for applying pressure to the substrate WF between the base member 301 and the substrate holding member 330 (substrate adsorbent 334). In this embodiment, the elastic membrane 320 includes multiple elastic membranes 320-1, 320-2, and 320-3 that are stacked and have different areas. Each of the elastic membranes 320-1, 320-2, and 320-3 includes a central portion that contacts the upper surface of the shielding member 332 and end portions that extend from the central portion and are fixed at different positions on the lower surface of the upper guide member 305. The multiple elastic membranes 320-1, 320-2, and 320-3 form multiple concentric pressure chambers for applying pressure to the substrate WF between the base member 301 and the multiple elastic membranes 320-1, 320-2, and 320-3. Further, outside the pressure chamber formed by the outermost elastic film 320-3, a pressure chamber is formed that directly pressurizes the space between the base member 301 and the substrate holding member 330. When the inside of the elastic film 320-3 is pressurized, this pressure chamber is defined by the elastic film 320-3, the base member 301, the substrate holding member 330, and the elastic member 340. By providing a pressure chamber further outside the elastic film 320-3, even if the lower guide member 306 is annular, it is possible to apply pressure to the entire surface of the substrate holding member 330 (substrate adsorbent 334), and to press each portion of the substrate over the entire surface against the polishing pad 352 with a desired pressure.

[0045] Each of the multiple pressurizing chambers is connected to a pressure adjusting unit (fluid supply source) 30 via a pressurizing path 313. The pressure adjusting unit 30 has a pressure adjusting function that adjusts the pressure of the pressurized fluid supplied to each pressurizing chamber. By forming multiple pressurizing chambers, the pressing force of the substrate WF against the polishing pad 352 via the substrate holding member 330 can be controlled for each area. According to this embodiment, the substrate WF is attracted to the substrate attracting surface 334a by applying a negative pressure to the substrate attracting body 334 using the decompression module 31, and the substrate WF can be pressed against the polishing pad 352 via the substrate holding member 330 by pressurizing the pressurizing chamber using the pressure adjusting unit 30.

[0046] The top ring 302 is not limited to one having multiple concentric pressurizing chambers. The top ring 302 may have a single pressure chamber formed therein, separated in the circumferential direction. The elastic membrane 320 is not limited to a membrane formed by stacking multiple membranes, but may have partition walls that separate the multiple pressure chambers. For example, an elastic membrane formed by a mold, such as that disclosed in Japanese Patent No. 7074606, may be used. The top ring 302 may have a single pressure chamber formed therein, without the elastic membrane 320.

[0047] 3 , the top ring 302 further includes a band 345 that connects the outer side surface of the base member 301 and the outer side surface of the frame member 344. The band 345 is attached from the outer side surface of the flange 303 to the outer side surface of the upper frame member 342. The band 345 allows the substrate holding member 330 to be displaced relative to the base member 301 and prevents the polishing liquid and the like from entering the space between the substrate holding member 330 and the base member 301.

[0048] The top ring 302 can vacuum the substrate attracting member 334 using the decompression module 31 and attract the substrate WF to the substrate attracting surface 334a. The pressure adjusting unit 30 then pressurizes the pressure chamber, thereby pressing the substrate WF against the polishing pad 352 via the substrate holding member 330. The controller 900 may control the pressure supplied to the pressure chamber so that the film thickness distribution of the substrate WF becomes a target distribution. For example, the controller 900 may control the pressure adjusting unit 30 based on a recipe predefined based on the characteristics of the substrate WF. The substrate polishing apparatus 1000 may also be provided with a sensor for measuring the film thickness of the substrate WF, and the controller 900 may acquire information from the sensor during substrate polishing and control the pressure adjusting unit 30 based on the acquired information. The sensor for measuring the film thickness of the substrate WF may be an eddy current sensor, an optical sensor, or a microwave sensor. The controller 900 may also modify the subsequent control of the pressure adjusting unit 30 based on the polishing profile of the polished substrate WF.

[0049] <Guide section> Fig. 5 is a plan view schematically showing a guide portion of a top ring according to one embodiment, and corresponds to a cross-sectional view taken along line VV in Fig. 4A. Fig. 6A is an enlarged perspective view of portion B in Fig. 5. Fig. 6B is an enlarged plan view of portion B in Fig. 5. In Fig. 5, the position (outer edge) of the substrate WF held by the top ring 302 is indicated by a dashed line.

[0050] The guide section 420 according to this embodiment is provided between a circular outer peripheral surface 371 of the lower guide member 306 and a circular inner peripheral surface 381 of the lower frame member 343. As shown in FIGS. 6A and 6B , the guide section 420 includes one or more roller members 421 provided on the lower guide member 306, a recessed portion 424 provided in the lower frame member 343, and a guide member 425 and a cushioning material 426 (not shown in FIG. 5 ) provided in the recessed portion 424. The roller members 421 provided on the outer peripheral surface 371 of the lower guide member 306 fit into the recessed portions 424 provided in the inner peripheral surface 381 of the lower frame member 343. Incidentally, even when one roller member 421 is provided, the operational effect of guide section 420 (described later) can be achieved, but from the viewpoint of evenly supporting and dispersing the frictional force in the substrate rotation direction (arrow D in FIG. 7), it is preferable that a plurality of roller members 421 are arranged evenly (at equal intervals) along the circumferential direction of lower guide member 306. Incidentally, cushion material 426 may be omitted in some cases, and guide member 425 and cushion material 426 may be omitted in other cases (described later).

[0051] As described above, in this embodiment, the lower guide member 306 has an annular shape in a plan view, and has a circular outer shape (outline). The lower guide member 306 has a circumferential (circular) outer peripheral surface 371 and a circumferential (circular) inner peripheral surface 372. As can be seen from FIGS. 3 and 5, an elastic membrane 320 (a laminated membrane for dividing the pressurizing chamber) that constitutes the pressurizing chamber is disposed inside the lower guide member 306 (the region close to the top ring shaft 18). 5, the gap between the radially outer side of the elastic membrane 320 and the lower guide member 306 is omitted.

[0052] A plurality of roller members 421 are provided along the circumferential direction on the outer peripheral surface 371 of the lower guide member 306. Each roller member 421 is provided to protrude radially outward from the lower guide member 306. Each roller member 421 includes a shaft 423 provided along an axis extending in the direction of the rotation radius of the top ring 302 (the radial direction of the lower guide member 306), and rollers 422 (an example of a first rolling element) attached to rotate around the shaft 423. The roller members 421 may be, for example, cam followers. A cam follower is a highly rigid shafted bearing incorporating a thick outer ring (roller 422) and needle-shaped rollers called needles inside. The roller members 421 may be roller followers or any other rolling members.

[0053] The lower frame member 343 has a rectangular outer shape and a circular opening 380. The opening 380 has a circumferential (circular) inner peripheral surface 381 that corresponds to the circumferential (circular) outer peripheral surface 371 of the lower guide member 306. The wall surface of the opening 380 constitutes the inner peripheral surface 381 of the lower frame member 343. A plurality of recesses 424 are formed in the inner peripheral surface 381 of the opening 380 so as to be recessed radially outward from the inner peripheral surface 381. Each recess 424 is configured to receive a roller member 421. As shown in FIGS. 6A and 6B , the recess 424 contains a guide member 425 having a contact surface that contacts the roller member 421 (roller 422), and a cushioning material 426 that is arranged on the surface of the guide member 425 opposite the contact surface.

[0054] The guide member 425 is preferably relatively high in height. Therefore, it is preferable that the guide member 425 be made of metal (e.g., SUS material, stainless steel). However, as long as the hardness requirement is satisfied, the guide member 425 may be made of PEEK, PPS, or the like. For example, as shown in FIG. 6B , the guide member 425 has a U-shape in plan view (top view) and is attached to the lower frame member 343 by any attachment means (in this example, the portion bent onto the upper and / or lower surface of the lower frame member 343). Opposite sides of the U-shaped guide member 425 are disposed along the inner wall of the recess 424, which extends in the radial direction of the top ring 302 (the radial direction of the lower guide member 306). The middle portion of the U-shaped guide member 425 is disposed along the inner wall (bottom surface) at the back of the recess 424. As shown in FIG. 6B , the guide member 425 is disposed so as to open in the vertical direction and receive the roller members 421 (rollers 422) from above. The guide member 425 may have any structure as long as it is capable of receiving the load from the roller members 421 (for example, a structure having a portion that extends radially of the top ring 302 and fits along the inner wall of the recessed portion 424). For example, the guide member 425 and the cushion material 426 do not have to be U-shaped so as to surround the recessed portion 424, and the guide member 425 and the cushion material 426 may be provided only on both side wall surfaces of the recessed portion 424 that come into contact with the roller members 421. In other words, the guide member 425 and the cushion material 426 may be removed from the portions that are not in contact with the roller members 421, and the guide member 425 and the cushion material 426 may be configured as separate parts.

[0055] Cushion material 426 is preferably made of high-hardness urethane. Cushion material 426 may be made of common rubber materials such as urethane rubber, silicone rubber, fluororubber, EPDM, and FKM, or resins such as PFA and PTFE. However, cushion material 426 preferably has a high hardness (for example, a hardness of about 70 degrees). As shown in FIGS. 6A and 6B , cushion material 426 has a U-shape in plan view, is arranged along the wall surface of recess 424, and is sandwiched and fixed between the back surface of guide member 425 and the wall surface of recess 424. Cushion material 426 is arranged so as to open toward the inside in the radial direction of lower frame member 343. Cushion material 426 may have any structure as long as it can be arranged behind the load-bearing portion of guide member 425.

[0056] When substrate polishing is performed using the structure of this embodiment shown in Fig. 5, the frictional force in the substrate polishing surface direction is supported at one point (corresponding to the starting point of arrow E in Fig. 7) between the lower guide member 306 and the lower frame member 343. When substrate polishing is performed using the structure of this embodiment, the frictional force in the substrate rotation direction is supported by one or more roller members 421 (rollers 422) coming into contact with the inner wall of a recess 424 (in this example, a guide member 425 arranged in the recess 424) provided in the lower frame member 343 (arrow D in Fig. 7). In addition, the cushion material 426 increases the number of support points for the substrate rotation direction / frictional force during substrate polishing (reducing (or distributing) the load (burden) per support point).

[0057] FIG. 7 is an explanatory diagram illustrating the forces acting on the top ring during rotation. In the figure, arrow C indicates the direction of the polishing friction force in the planar direction (the radial direction of the top ring rotation) generated by polishing a substrate. Arrow D indicates the direction of the rotational friction force exerted by the roller members 421 at multiple locations on the guide member 425 during substrate polishing. That is, the rotational force (corresponding to the support of the friction force in the substrate rotation direction) that the lower frame member 343 receives from the lower guide member 306 via the roller members 421 during substrate polishing. Arrow E indicates the force (corresponding to the support of the friction force in the direction of the substrate polishing surface) that the lower frame member 343 receives from the lower guide member 306 during substrate polishing.

[0058] As can be seen from Figure 7, when substrate polishing is performed using the structure of the guide section 420 of this embodiment, the friction force (arrow E) in the direction of the substrate polishing surface is supported at one point between the lower guide member 306 and the lower frame member 343 (the starting point of arrow E in Figure 7).

[0059] Furthermore, when substrate polishing is performed using the structure of this embodiment, the frictional force in the substrate rotation direction is supported by one or more roller members 421 contacting the guide members 425 of the lower frame member 343 (arrow D in FIG. 7). This makes it possible to suppress or prevent the frictional force in the substrate rotation direction from concentrating locally on a part of the lower frame member 343.

[0060] Furthermore, the cushion material 426 can increase the number of support points (points or areas where the roller members 421 contact the guide members 425) against the frictional force in the substrate rotation direction during substrate polishing. In other words, it can increase the contact area between the roller members 421 and the guide members 425. This can further suppress or prevent the frictional force in the substrate rotation direction from concentrating locally on one part of the lower frame member 343.

[0061] FIG. 11 is an explanatory diagram illustrating contact between components during rotation of a top ring according to a related art. In the structure of the related art shown in FIG. 11, the mating portion between the lower guide member 306 and the lower frame member 343, which supports the polishing frictional force generated parallel to the polished surface of the substrate, is rectangular. Therefore, during one rotation of the top ring 302, the outer wall of the lower guide member 306 comes into contact with the inner wall of the lower frame member 343 four times (simultaneously or separately), resulting in impact (see point F in FIG. 11 ). This causes severe localized wear and / or loosening of fastening members due to the impact. Furthermore, the application of localized high pressure to a portion of the lower frame member 343 creates resistance when the substrate holding member 330 moves up and down relative to the base member 301, making it difficult for the substrate holding member to move up and down relative to the base member, potentially affecting the distribution of polishing pressure on the substrate. Furthermore, at the moment when the polishing friction force of the substrate is in contact and supported by the entire edges of the lower frame member and the lower guide member, the contact area becomes large, and as described above, it becomes difficult for the substrate holding member to move up and down relative to the base member, which may cause problems with the distribution of polishing pressure on the substrate.

[0062] On the other hand, according to the configuration of the guide part 420 of this embodiment, the shape of the part that supports the polishing friction force (the mating part of the lower frame member 343 and the lower guide member 306: the inner peripheral surface of the lower frame member 343, the outer peripheral surface of the lower guide member 306) is circular, so that it is possible to suppress or prevent the impact caused by the contact between the inner peripheral surface of the lower frame member 343 and the outer peripheral surface of the lower guide member 306. This can suppress or prevent the fastening members that fasten the components of the top ring 302 from loosening due to impact.

[0063] Furthermore, frictional forces in the planar direction are supported by outer peripheral surface 371 of lower guide member 306 and inner peripheral surface 381 of lower frame member 343, but frictional forces in the rotational direction are supported by a combination of multiple roller members 421 and guide member 425 / cushion material 426, so the support load is dispersed. This reduces wear on each member (lower guide member 306, lower frame member 343).

[0064] Furthermore, the rotation of the roller members 421 reduces the frictional force caused by the relative vertical movement between the substrate holding member 330 and the base member 301, and also reduces the support force against the frictional force in the planar direction per location (arrows D and E in FIG. 7), further reducing the frictional force caused by the vertical movement between the lower frame member 343 and the lower guide member 306. As a result, compared to the structure of the related art, the frictional force caused by the vertical movement between the substrate holding member 330 and the base member 301 during substrate polishing can be effectively reduced. This allows the substrate holding member 330 to more firmly follow the polishing pad 352 in response to deflection or warping that occurs in the swing arm 360 and / or support shaft 362 during polishing (while the substrate is being pressed).

[0065] In the above embodiment, if the frictional force in the rotational direction can be sufficiently supported by the guide member 425 alone, the cushion material 426 may be omitted.

[0066] (Another embodiment 1) In the above embodiment, part or all of the lower frame member 343 may be made of a low-friction material. The low-friction material may be, for example, a solid lubricant (e.g., oil-impregnated polyacetal, as described in Patent Document 3). Alternatively, instead of or in addition to the lower frame member 343, part or all of the lower guide member 306 may be made of a low-friction material. This further reduces the frictional force of the relative vertical movement between the substrate holding member 330 and the base member 301 at the support point against the frictional force in the planar direction along the substrate polishing surface. At least the portion of the wall surface of the recess 424 of the lower frame member 343 that contacts the roller member 421 may be made of a low-friction material, so that the load (frictional force) from the roller member 421 is supported by the wall surface (inner wall) of the recess 424, thereby eliminating the guide member 425. If the guide member 425 is omitted, the cushion material 426 is also omitted.

[0067] (Another embodiment 2) In the above embodiment, instead of or in addition to forming part or all of at least one of the lower guide member 306 and the lower frame member 343 from a low-friction material, a plurality of support rollers for supporting against frictional forces in the planar direction may be provided between the outer peripheral surface 371 of the lower guide member 306 and the inner peripheral surface 381 of the lower frame member 343. Also, support pads may be provided that come into contact with the support rollers and receive the load (frictional force).

[0068] FIG. 8 is a plan view showing a guide unit 420 of a top ring 302 according to another embodiment. This embodiment differs from the above-described embodiment in that the guide unit 420 further includes a plurality of support roller members 431 that rotate around an axis extending in the circumferential direction (tangential direction) of the lower guide member 306 between the outer peripheral surface 371 of the lower guide member 306 and the inner peripheral surface 381 of the lower frame member 343, and a support pad 435 that contacts the support roller members 431. The other configurations are the same as those of the above-described embodiment. More specifically, the guide unit 420 according to this embodiment further includes the support roller members 431 and the support pad 435 in addition to one or more roller members 421, recesses 424, guide members 425, and cushion materials 426. Note that the cushion material 426 may be omitted, and the guide members 425 and cushion materials 426 may also be omitted. Regardless of the omission of the guide members 425 and / or cushion materials 426, the support pads 435 may be omitted. In some cases, code 435 may be omitted (see below).

[0069] A plurality of recesses 434 are formed in the outer peripheral surface 371 of the lower guide member 306 along the circumferential direction, and a support roller member 431 is disposed in each recess 434. The support roller members 431 are preferably arranged alternately with the roller members 421 along the circumferential direction, although other arrangements may also be employed. In one example, the support roller members 431 are arranged at equal intervals in the circumferential direction, and the roller members 421 are arranged at equal intervals in the circumferential direction. Each recess 434 is formed by recessing radially inward from the outer peripheral surface 371 of the lower guide member 306. Each support roller member 431 includes a shaft 433 extending along an axis that is tangent to the rotational direction of the top ring 302 (i.e., the tangential direction of the lower guide member 306), and a support roller 432 (an example of a second rolling element) mounted to rotate around the shaft 433. The support roller 432 may be mounted on the shaft 433 via a bearing (e.g., a low-sliding bearing) (not shown). In one example, the support roller member 431 may be, for example, a cam follower. The support roller member 431 may be a roller follower or any other rolling member. The rolling surface of the support roller member 431 is preferably provided so as to protrude radially outward from the outer circumferential surface 371 of the lower guide member 306 by a predetermined amount. This is to ensure that the support roller member 431 reliably supports contact between the base member 301 (lower guide member 306) and the substrate holding member 330 (lower frame member 343) and suppress resistance or friction to vertical movement between the base member 301 and the substrate holding member 330. The predetermined amount is set and / or adjusted from this perspective.

[0070] The support pads 435 are provided on the inner peripheral surface 381 of the lower frame member 343 in correspondence with the respective support roller members 431. The support pads 435 are members that come into contact with the support roller members 431 (support rollers 432) and support the force from the support roller members 431 (support rollers 432) (frictional force in the planar direction from the lower guide member 306: arrow E in FIG. 7). The support pad 435 may be omitted. In the case where the support pad 435 is omitted, the portion corresponding to the support pad 435 may be made of a low-friction material (for example, the entire lower frame member 343, including the portion corresponding to the support pad 435, may be made of a low-friction material, or only the portion of the lower frame member 343 corresponding to the support pad 435 may be made of a low-friction material). In the case where the support pad 435 is omitted, the portion corresponding to the support pad 435 may be made of a material other than a low-friction material (for example, the entire lower frame member 343, including the portion corresponding to the support pad 435, may be made of a material other than a low-friction material). In the case where the support pad 435 is provided, if the support pad 435 wears out due to contact with the support roller member 431, only the support pad 435 can be removed and replaced, rather than replacing the entire lower frame member 343.

[0071] Such support roller members 431 can further improve support against frictional forces in the planar direction, and can further reduce sliding resistance of the substrate holding member 330 in the up and down movement relative to the base member 301.

[0072] The configuration of the support roller member 431 and the support pad 435 can be similar to the configuration shown in Fig. 12 of Patent Document 3, for example. That is, the lower guide member 306 may be recessed at portions corresponding to both ends of the shaft 433, and the shaft 433 may be fixed to the lower guide member 306 with any fastening means (for example, bolts), and then both ends of the shaft 433 may be covered with a cover member so that the outer peripheral surface of the cover member is smoothly connected to the outer peripheral surface of the lower guide member 306 on both sides of the recess 434. The method of attaching the support roller member 431 and the support pad 435 is not limited to the above, and they may be attached to the lower guide member 306 and the lower frame member 343 using any other attachment method.

[0073] In one embodiment, the shaft 433 and the support roller 432 can be made of a metal such as SUS. In one embodiment, the low-sliding bearing is made of, for example, oil-impregnated polyacetal. In one embodiment, the low sliding bearing may be a cylindrical roller bearing.

[0074] Furthermore, instead of or in addition to providing the support pad 435, a part or all of the lower frame member 343 (at least the part that the support roller member 431 abuts) may be made of a low-friction material (a solid lubricant, for example, oil-impregnated polyacetal).

[0075] (Other embodiment 3) The above embodiment may further include a biasing mechanism 400 (see FIGS. 9 and 10) that has a first end that contacts the base member 301 (for example, the flange 303 in FIG. 3) and a second end that contacts the frame member 344 (for example, the upper frame member 342 in FIG. 3), and that applies a biasing force in a direction that moves the base member 301 and the frame member 344 closer to or farther apart. The biasing mechanisms 400 may be provided at multiple locations (which may include corners) around the circumference of the top ring.

[0076] FIG. 9 is a cross-sectional view showing an example of a biasing mechanism 400 for the top ring. The biasing mechanism 400 may include a pneumatic actuator having the first end and the second end. As shown in FIG. 9, the pneumatic actuator may include a cylinder 401 attached to the base member 301 and capable of receiving a working fluid therein, a diaphragm 408 disposed within the cylinder 401, and a piston 410 in contact with the frame member 344 and displaceable in response to movement of the diaphragm 408. The pneumatic actuator may be configured to be actuated by working fluid from the fluid supply source 30 (see FIG. 3). In FIG. 9, reference numeral 400 denotes the biasing mechanism, 401 denotes the cylinder, 402 denotes an upper cylinder housing, 404 denotes a lower cylinder housing, 408 denotes a diaphragm, and 410 denotes the piston. Other reference numerals denote the same components as those in the above-described embodiment.

[0077] FIG. 10 is a cross-sectional view showing another example of the biasing mechanism of the top ring. In another configuration example, the biasing mechanism 400 can be an elastic body 410A having the first end and the second end. Various known elastic bodies, such as a coil spring, can be used as the elastic body 410A. In FIG. 10, reference numeral 400A denotes the biasing mechanism, reference numeral 404A denotes a lower flange, reference numeral 410A denotes an elastic body, and reference numerals 406A and 408A denote collars. Other reference numerals denote the same configurations as those in the above embodiment. As shown in FIGS. 9 and 10, the first and second ends of the biasing mechanism 400 are preferably spaced apart from the substrate attracting body 334 when viewed perpendicularly to the substrate attracting surface. In other words, the first and second ends of the biasing mechanism 400 are preferably positioned outward and away from the substrate attracting body 334 in a plan view.

[0078] (Other embodiment 4) In the above embodiment, the pressure chamber may be omitted, and the lower guide member 306 may be provided so as to correspond to the entire surface of the substrate WF (for example, the entire lower surface of the upper guide member 305), and the lower guide member 306 may press the substrate holding member 330 against the polishing surface by the up and down movement of the top ring shaft 18.

[0079] The present invention can also be described in the following aspects. [1] According to one embodiment, there is provided a top ring for holding a polygonal substrate, comprising: a base member connected to a rotating shaft, the base member having a first guide portion with a circular outer peripheral surface; a substrate holding member having a frame member having an opening with a circular inner peripheral surface corresponding to the outer peripheral surface of the first guide portion and engaging with the first guide portion so as to be freely slidable in the vertical direction; and a second guide portion provided between the first guide portion and the frame member, the second guide portion having a first rolling element that rotates around an axis extending in the direction of the rotation radius of the top ring, and a recess that receives the first rolling element.

[0080] According to this embodiment, the circular shape of the portion supporting the polishing friction force can suppress or prevent impacts caused by contact between the inner peripheral surface of the frame member and the outer peripheral surface of the first guide portion. This suppresses or prevents high pressure from being generated at the contact points between the inner peripheral surface of the frame member and the outer peripheral surface of the first guide portion, which can cause wear at the contact points. Furthermore, it can suppress or prevent loosening of the fastening members that fasten the various components of the top ring due to impacts.

[0081] Furthermore, by configuring the first rolling members to fit into (engage with) the recesses, it is possible to restrict the displacement of the substrate holding member in the rotational direction relative to the base member within a predetermined range.

[0082] Furthermore, the frictional force in the planar direction is supported by the outer peripheral surface of the first guide portion and the inner peripheral surface of the frame member, and by arranging the first rolling bodies / recesses in multiple locations, the frictional force in the rotational direction can be dispersed, thereby reducing wear on each component of the top ring (especially the first guide portion and frame member).

[0083] Furthermore, the rolling of the first rolling elements reduces the frictional force caused by the relative vertical movement between the substrate holding member and the base member, and the support force against the frictional force in the planar direction can be reduced (distributed) by the multiple first rolling elements, further reducing the frictional force caused by the vertical movement. As a result, the frictional force caused by the vertical movement between the substrate holding member and the base member during substrate polishing can be reduced. Furthermore, the substrate holding member can more firmly follow the polishing pad in response to bending or warping that occurs in the swing arm and / or support shaft supporting the top ring during polishing (while the substrate is being pressed).

[0084] [2] According to one embodiment, the second guide portion includes a guide member that is disposed in the recess and has a contact surface that contacts the first rolling element.

[0085] According to this embodiment, the guide member can absorb the impact from the first rolling element.

[0086] [3] According to one embodiment, the second guide portion further includes a cushioning material disposed on a surface of the guide member opposite to the contact surface.

[0087] According to this embodiment, the cushioning material can increase the number of support points (points / areas where the first rolling elements contact the guide member) against the frictional force in the rotational direction of the substrate during substrate polishing, and can further distribute the frictional force in the rotational direction received from the first rolling elements, thereby suppressing or preventing localized pressure from being applied to the frame member.

[0088] [4] According to one embodiment, at least a portion of the wall surface of the recess that comes into contact with the first rolling element is made of a low-friction material.

[0089] According to this embodiment, the first rolling element can roll on the wall surface of the recess, which makes it possible to omit a guide member disposed in the recess.

[0090] [5] According to one embodiment, the first rolling elements are arranged in a circumferential direction, which is the rotation direction of the top ring.

[0091] According to this embodiment, by providing a plurality of first rolling elements along the circumferential direction, frictional force in the rotational direction can be effectively dispersed.

[0092] [6] According to one embodiment, the first rolling element is a cam follower.

[0093] According to this configuration, it becomes easy for the cam follower to support a sufficiently large friction force.

[0094] [7] According to one embodiment, at least the portions of the first guide portion and the frame member where the first guide portion and the frame member come into contact with each other are formed of a low-friction material.

[0095] According to this aspect, by forming the portion where the first guide portion and the frame member come into contact with each other using a low-friction material, it is possible to reduce friction in the vertical direction between the first guide portion and the frame member.

[0096] [8] According to one embodiment, the second guide portion further has a plurality of second rolling elements that rotate around an axis extending in a circumferential direction or a tangential direction, which is the rotation direction of the top ring, and the second guide portion has a plurality of the first rolling elements, and the first rolling elements and the second rolling elements are arranged alternately along the circumferential direction.

[0097] According to this embodiment, the frictional force in the planar direction can be further supported by the second rolling elements. As a result, the frictional force in the planar direction can be further dispersed. This further improves support for the frictional force in the planar direction, and further reduces the sliding resistance of the substrate holding member to the base member when it moves up and down.

[0098] [9] According to one embodiment, the second guide portion further includes a support pad with which the second rolling element comes into contact.

[0099] According to this embodiment, when the support pad is worn out due to repeated contact with the second rolling element, it is possible to easily replace only the support pad instead of replacing the entire frame member or the first guide portion.

[0100]

[10] According to one embodiment, the first rolling element is provided protruding from the outer peripheral surface of the first guide portion of the base member, and the recess is provided on the inner peripheral surface of the frame member, or the first rolling element is provided protruding from the inner peripheral surface of the frame member, and the recess is provided on the outer peripheral surface of the first guide portion of the base member.

[0101] According to this embodiment, the first rolling elements may be provided on one of the base member and the frame member, and the recesses may be provided on the other of the base member and the frame member. Note that a combination of a first rolling element provided on the base member and a recessed portion provided on the frame member and a combination of a first rolling element provided on the frame member and a recessed portion provided on the base member may be mixed.

[0102]

[11] According to one embodiment, the second rolling element is provided on an outer peripheral surface of the first guide portion of the base member, or the second rolling element is provided on an inner peripheral surface of the frame member.

[0103] According to this embodiment, the second rolling elements may be provided on either the base member or the frame member, although a plurality of second rolling elements may be provided dispersedly on both the base member and the frame member.

[0104]

[12] According to one embodiment, the base member has a flange connected to the rotating shaft, a first end contacting the flange, and a second end contacting the frame member, and further includes a biasing mechanism that applies a biasing force in a direction that brings the base member and the frame member closer to each other or in a direction that moves them apart.

[0105] According to this embodiment, the pressing force with which the top ring presses the substrate against the polishing surface can be made uniform between the center side and the outer edge side of the rectangular substrate, thereby making the polishing profile more uniform.

[0106]

[13] According to one embodiment, the substrate holding member has a substrate adsorbent made of a porous material.

[0107] According to this aspect, the substrate can be attracted and held by the substrate attracting member made of a porous material, and the retainer member can be omitted.

[0108]

[14] According to one embodiment, the substrate adsorbent is made of a resin material.

[0109] According to this embodiment, the porous material can be easily formed using a resin material.

[0110]

[15] According to one embodiment, the base member and the frame member are connected by an elastic member.

[0111] According to this embodiment, by connecting the base member and the frame member with an elastic member, the vertical movement of the base member relative to the frame member can be smoothed, and the rotational movement of the base member relative to the frame member can be permitted to a certain extent.

[0112]

[16] According to one embodiment, the polishing device further comprises one or more pressure chambers for pressing the substrate against the polishing surface of the polishing pad by fluid pressure.

[0113] According to this aspect, the substrate can be pressed effectively against the polishing surface by the pressure chamber.

[0114]

[17] According to one embodiment, the plurality of pressure chambers are arranged substantially concentrically.

[0115] According to this aspect, the pressure applied to the substrate against the polishing surface can be controlled for each area by the pressure chambers arranged approximately concentrically.

[0116]

[18] According to one embodiment, there is provided a polishing apparatus for polishing a substrate, comprising: a top ring as described above; a polishing table supporting a polishing pad that is pressed against the substrate held by the top ring; and a polishing liquid supply mechanism that supplies a polishing liquid onto the polishing pad.

[0117] According to this aspect, the substrate polishing apparatus can achieve the above-mentioned effects.

[0118]

[19] According to one embodiment, the polishing apparatus further includes: a first drive mechanism for driving the top ring; a second drive mechanism for driving the polishing table; one or more pressure chambers for pressing the substrate against the polishing surface by fluid pressure; a fluid supply line for supplying a predetermined pressure fluid to the one or more pressure chambers; and a control device for adjusting the pressure in the pressure chamber.

[0119] According to this aspect, the substrate can be polished satisfactorily by the polishing apparatus having the above configuration.

[0120]

[20] According to one embodiment, the polishing liquid supply mechanism supplies the polishing liquid from the polishing pad side.

[0121] According to this aspect, by supplying the polishing liquid from the polishing pad side, it is possible to reduce the space required for the structure above the polishing pad.

[0122]

[21] According to one aspect, a top ring for holding a polygonal substrate, comprising: A top ring is provided, comprising: a substrate holding member having a base member connected to a shaft; and a frame member fitted to the lower part of the base member; and a guide member fixed to the outer periphery of the base member and facing the substrate holding member, and supporting the substrate holding member inside the frame member so that it can slide freely in the axial direction of the rotating shaft and so that the rotational force of the top ring can be transmitted from the base member to the substrate holding member, wherein the guide member has rolling elements, and the frame member and the base member are engaged by the rolling elements.

[0123] According to this configuration, frictional forces in the planar direction are supported by the outer peripheral surface of the base member and the inner peripheral surface of the frame member, and frictional forces in the rotational direction are dispersed by the guide member (guide portion). This reduces wear on the components of the top ring (especially the sliding portions of the base member and frame member). Furthermore, it is possible to suppress or prevent loosening of the fastening members fastening the components of the top ring due to impact. Because the frame member and the base member are engaged (convex-concave engagement) by rolling elements, it is possible to restrict the rotational displacement of the frame member relative to the base member within a predetermined range.

[0124] Furthermore, the rolling of the rolling elements reduces the frictional force caused by the relative vertical movement between the frame member and the base member, and the reduction in the support force against the frictional force in the planar direction further reduces the frictional force caused by the vertical movement of the frame member and the base member. As a result, the frictional force caused by the vertical movement between the substrate holding member and the base member during substrate polishing can be reduced. Furthermore, the substrate holding member can more firmly follow the polishing pad in response to bending or warping that occurs in the swing arm and / or support shaft supporting the top ring during polishing (while the substrate is being pressed).

[0125]

[22] According to one embodiment, there is provided a substrate polishing method for polishing a polygonal substrate, the method comprising: preparing a top ring including a base member connected to a rotating shaft and having a first guide portion with a circular outer peripheral surface; and a substrate holding member having a frame member with an inner peripheral surface corresponding to the outer peripheral surface of the first guide portion and fitted to the base member by the frame member so as to be freely slidable in the vertical direction; bringing the substrate into contact with a polishing surface while being held by the top ring; and guiding the vertical movement between the base member and the substrate holding member by a first rolling element provided on either the outer peripheral surface of the first guide portion or the inner peripheral surface of the frame member and rotating around an axis extending in the direction of the rotation radius of the top ring, and a recess provided on the other outer peripheral surface of the first guide portion or the inner peripheral surface of the frame member for receiving the first rolling element.

[0126] Although the embodiments of the present invention have been described above, the above-described embodiments are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The present invention may be modified or improved without departing from the spirit thereof, and the present invention naturally includes equivalents thereof. Furthermore, any combination of the embodiments and modifications is possible within the scope of solving at least part of the above-described problems or achieving at least part of the effects, and any combination or omission of the components described in the claims and specification is possible.

[0127] The specification, claims, and abstract of Patent No. 7,074,606 are incorporated herein by reference in their entirety. [Explanation of symbols]

[0128] 18...Top ring shaft (rotating shaft) 30...Pressure adjustment section 31...Decompression module 300...Polishing unit 301...Base member 302...Top ring 303...Flange 305...Upper guide member 306...Lower guide member 307...Bolt 308...Bolt 312...Suction path 313...Pressure path 320...Elastic membrane 320-1~320-3...Elastic membrane 325...volts 326...volts 330...Substrate holding member 332...Shielding member 334...Substrate adsorption body 334a...Substrate adsorption surface 334b...opposite side 334c...side 334d...Decompression section 336...Suction hole 340...Elastic member 340a…Inner end 340b…outside end 341...Sealing material 342...Upper frame member 343...Lower frame member 344...Frame member 345...Band 350...Polishing table 351...Table axis 352...Polishing pad 352a…Surface (polished surface) 353...Aisle 354...Polishing liquid supply nozzle 355...Opening 356...Dressing unit 357...Through hole 360...swing arm 362…Spindle 371...Outer surface 372…Inner peripheral surface 380...Opening 381…Inner peripheral surface 400...Biasing mechanism 420...Guide section 421...Roller member 422...Laura 423...Axis 424...recess 425...Guide member 426...Cushioning material 431...Support roller member 432...Support roller 433...Axis 434...recess 435...Pad 900...Controller 900a...Storage device 1000…Substrate polishing equipment WF...Substrate

Claims

1. A top ring for holding a polygonal substrate, a base member connected to the rotary shaft, the base member having a first guide portion with a circular outer circumferential surface; a substrate holding member having a frame member that has an opening with a circular inner peripheral surface corresponding to the outer peripheral surface of the first guide portion and that is slidably fitted to the first guide portion in the up-down direction; a second guide portion provided between the first guide portion and the frame member, the second guide portion having a first rolling element that rotates around an axis extending in a rotational radius direction of the top ring and a recess that receives the first rolling element; A top ring equipped with

2. 2. The top ring according to claim 1, The second guide portion includes a guide member that is disposed in the recess and has a contact surface that contacts the first rolling element.

3. 3. The top ring according to claim 2, The second guide portion further includes a cushioning material disposed on a surface of the guide member opposite to the contact surface.

4. 2. The top ring according to claim 1, At least a portion of the wall surface of the recess that comes into contact with the first rolling element is formed of a low-friction material.

5. 2. The top ring according to claim 1, The top ring has a plurality of first rolling elements arranged along a circumferential direction, which is a rotation direction of the top ring.

6. 2. The top ring according to claim 1, The top ring, wherein the first rolling element is a cam follower.

7. 2. The top ring according to claim 1, In the top ring, at least portions of the first guide portion and the frame member where the first guide portion and the frame member come into contact with each other are formed of a low-friction material.

8. 2. The top ring according to claim 1, the second guide portion further includes a plurality of second rolling elements that rotate around an axis extending in a circumferential direction or a tangential direction, which is a rotation direction of the top ring, and the second guide portion has a plurality of the first rolling elements, The first rolling elements and the second rolling elements are arranged alternately along the circumferential direction of the top ring.

9. 9. The top ring according to claim 8, The second guide portion further includes a support pad with which the second rolling element comes into contact.

10. 2. The top ring according to claim 1, The first rolling element is provided to protrude from an outer peripheral surface of the first guide portion of the base member, and the recess is provided on an inner peripheral surface of the frame member, or The first rolling element is provided so as to protrude from the inner peripheral surface of the frame member, and the recess is a top ring provided on the outer peripheral surface of the first guide portion of the support member;

11. 9. The top ring according to claim 8, The second rolling element is or provided on the outer peripheral surface of the first guide portion of the base member; The second rolling element is provided on an inner peripheral surface of the frame member.

12. 2. The top ring according to claim 1, the base member has a flange connected to the rotating shaft; a top ring having a first end that contacts the flange and a second end that contacts the frame member, and further comprising a biasing mechanism that applies a biasing force in a direction that brings the base member and the frame member closer to or away from each other.

13. 2. The top ring according to claim 1, The substrate holding member has a substrate adsorbent made of a porous material.

14. 14. The top ring according to claim 13, The substrate attracting body is made of a resin material.

15. 2. The top ring according to claim 1, The base member and the frame member are connected by an elastic member.

16. 2. The top ring according to claim 1, The top ring further comprises one or more pressure chambers for pressing the substrate against the polishing surface of the polishing pad by fluid pressure.

17. 17. The top ring according to claim 16, A top ring in which the plurality of pressure chambers are arranged substantially concentrically.

18. A substrate polishing apparatus for polishing a polygonal substrate, comprising: A top ring according to any one of claims 1 to 17; a polishing table supporting a polishing pad that is pressed against the substrate held by the top ring; a polishing liquid supply mechanism for supplying a polishing liquid onto the polishing pad; A substrate polishing apparatus comprising:

19. 20. The substrate polishing apparatus according to claim 18, a first drive mechanism that drives the top ring; a second driving mechanism for driving the polishing table; one or more pressure chambers for pressing the substrate against a polishing surface by fluid pressure; a fluid supply line for supplying a predetermined pressure fluid to the one or more pressure chambers; a control device for adjusting the pressure in the pressure chamber; The substrate polishing apparatus further comprises:

20. 20. The substrate polishing apparatus according to claim 19, The polishing liquid supply mechanism supplies the polishing liquid from the polishing pad side.

21. A top ring for holding a polygonal substrate, comprising: a base member connected to the rotating shaft; a substrate holding member having a frame member fitted to a lower portion of the base member; a guide member fixed to the outer circumferential side of the base member and facing the substrate holding member, the guide member supporting the substrate holding member inside the frame member so as to be slidable in the axial direction of the rotating shaft and so as to transmit the rotational force of the top ring from the base member to the substrate holding member; Equipped with The guide member has a rolling element, and the frame member and the base member are engaged with each other by the rolling element.

22. A substrate polishing method for polishing a polygonal substrate, comprising: preparing a top ring including: a base member connected to a rotary shaft and having a first guide portion with a circular outer circumferential surface; and a substrate holding member having a frame member with an inner circumferential surface corresponding to the outer circumferential surface of the first guide portion, the substrate holding member being fitted to the base member by the frame member so as to be slidable in the up and down direction; bringing the substrate into contact with a polishing surface while being held by the top ring; a first rolling element provided on one of the outer peripheral surface of the first guide portion and the inner peripheral surface of the frame member, the first rolling element rotating around an axis extending in the direction of the rotation radius of the top ring, and a recess provided on the other of the outer peripheral surface of the first guide portion and the inner peripheral surface of the frame member for receiving the first rolling element, to guide the vertical movement between the base member and the substrate holding member; A method for polishing a substrate, comprising:

Images