Display device

Abstract

To provide a display device.SOLUTION: A display device includes: a display panel; a digitizer member below the display panel; a shielding member below the digitizer member; a first electromagnetic wave shielding layer below the shielding member; a second electromagnetic wave shielding layer below the shielding member, spaced apart from the first electromagnetic wave shielding layer; and a connection member below the shielding member, disposed between the first electromagnetic wave shielding layer and the second electromagnetic wave shielding layer, and including an electromagnetic wave shielding sheet.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a display device, and more particularly to a foldable display device. [Background technology]

[0002] 2. Description of the Related Art In recent years, as interest in information displays has increased, research and development into flexible display devices, including foldable and rollable display devices, has been continuously conducted. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Korean Patent Application Publication No. 2022-0082957 Summary of the Invention [Problem to be solved by the invention]

[0004] The problem to be solved by the present invention is to provide a display device in which the folded and unfolded regions are made of the same material and have the same performance.

[0005] The problems to be solved by the present invention are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0006] A display device according to an embodiment of the present invention may include a display panel, a digitizer member disposed below the display panel, a shielding member disposed below the digitizer member, a first electromagnetic wave shielding layer disposed below the shielding member, a second electromagnetic wave shielding layer disposed below the shielding member and spaced apart from the first electromagnetic wave shielding layer, and a connecting member disposed below the shielding member, between the first electromagnetic wave shielding layer and the second electromagnetic wave shielding layer, and including an electromagnetic wave shielding sheet.

[0007] In one embodiment, the shielding member may include a first shielding layer overlapping the first electromagnetic wave shielding layer, and a second shielding layer overlapping the second electromagnetic wave shielding layer and spaced apart from the first shielding layer.

[0008] In one embodiment, the connecting member can connect the first shielding layer and the second shielding layer to each other.

[0009] In one embodiment, the connecting member may be attached to each of the first shielding layer and the second shielding layer.

[0010] In one embodiment, the first and second shielding layers may be integrally formed and made entirely of the same material.

[0011] In one embodiment, the digitizer member may include a first digitizer overlapping the first shielding layer, and a second digitizer overlapping the second shielding layer and spaced apart from the first digitizer.

[0012] In one embodiment, the first shielding layer may entirely overlap the first digitizer, and the second shielding layer may entirely overlap the second digitizer.

[0013] In one embodiment, the electromagnetic wave shielding sheet may include at least one of copper, silver, and nickel.

[0014] In one embodiment, the electromagnetic wave shielding sheet may include the same material as the first electromagnetic wave shielding layer and the second electromagnetic wave shielding layer.

[0015] In one embodiment, the shielding member may include magnetic metal powder.

[0016] In an embodiment, the connection member may further include a support sheet disposed below the electromagnetic wave shielding sheet.

[0017] In one embodiment, the support sheet may comprise a metal.

[0018] A display device according to an embodiment of the present invention includes a display panel including a first non-folding area, a second non-folding area, and a folding area between the first non-folding area and the second non-folding area, a first digitizer disposed below the display panel, a second digitizer disposed below the display panel and spaced apart from the first digitizer in a first direction, a first shielding layer disposed below the first digitizer, and a second digitizer disposed below the second digitizer and spaced apart from the first digitizer in a first direction. The shielding element may include: a second shielding layer spaced apart from the first shielding layer in the first direction; a first electromagnetic shielding layer disposed below the first shielding layer; a second electromagnetic shielding layer disposed on a side of the second shielding layer and spaced apart from the first electromagnetic shielding layer in the first direction; and a connecting member disposed below the first shielding layer and the second shielding layer, between the first electromagnetic shielding layer and the second electromagnetic shielding layer, connecting the first shielding layer and the second shielding layer to each other and overlapping the folding region, the connecting member including an electromagnetic shielding sheet.

[0019] In one embodiment, the first digitizer may overlap the first non-folding area and at least a portion of the folding area, and the second digitizer may overlap the second non-folding area and at least a portion of the folding area.

[0020] In one embodiment, the first shielding layer may overlap the first non-folding region and at least a portion of the folding region, and the second shielding layer may overlap the second non-folding region and at least a portion of the folding region.

[0021] In one embodiment, the first electromagnetic wave shielding layer may overlap the first non-folding region, and the second electromagnetic wave shielding layer may overlap the second non-folding region.

[0022] In one embodiment, a gap between the first and second shielding layers in the first direction may overlap the folding region and may be smaller than the width of the folding region.

[0023] In one embodiment, the gap between the first electromagnetic wave shielding layer and the second electromagnetic wave shielding layer in the first direction may be wider than the gap between the first shielding layer and the second shielding layer in the first direction.

[0024] In one embodiment, the electromagnetic wave shielding sheet may be disposed in the gap between the first electromagnetic wave shielding layer and the second electromagnetic wave shielding layer.

[0025] In an embodiment, the electromagnetic wave shielding sheet may overlap the first electromagnetic wave shielding layer and the second electromagnetic wave shielding layer in the first direction.

[0026] Further details of the embodiments are included in the detailed description and drawings. [Effects of the Invention]

[0027] According to the above-described embodiment, the shielding member entirely overlaps the folding region and the non-folding region, and the shielding member is made of the same material throughout the folding region and the non-folding region, and the display device may include an electromagnetic shielding member overlapping the non-folding region and an electromagnetic shielding sheet overlapping the folding region. This allows electromagnetic field signals to be shielded and electromagnetic interference to be shielded throughout the entire display device, while eliminating the need to use different materials for the shielding member in the folding region and the non-folding region. This simplifies the structure of the display device, reduces manufacturing costs, and improves manufacturing efficiency.

[0028] The effects of the embodiments are not limited to those exemplified above, and various other effects are included in this specification. [Brief explanation of the drawings]

[0029] [Figure 1] 1 is a block diagram illustrating a display device according to an embodiment of the present invention. [Figure 2] FIG. 2 is a block diagram illustrating an embodiment of one of the subpixels of FIG. 1. [Figure 3] FIG. 2 is a perspective view showing an embodiment of the display device of FIG. [Figure 4] FIG. 4 is a diagram showing a folded state of the display device shown in FIG. 3. [Figure 5] 5 is a diagram schematically illustrating the folded state of the display device shown in FIG. 4 and a set member outside the display device. [Figure 6] FIG. 4 is a cross-sectional view taken along line II' in FIG. [Figure 7] 7 is an enlarged cross-sectional view of the display panel of FIG. 6. [Figure 8] FIG. 7 is a cross-sectional view showing another embodiment of the display device of FIG. [Figure 9] 1A to 1C are diagrams illustrating a method for manufacturing a display device according to an embodiment of the present invention. [Figure 10]1A to 1C are diagrams illustrating a method for manufacturing a display device according to an embodiment of the present invention. [Figure 11] 1A to 1C are diagrams illustrating a method for manufacturing a display device according to an embodiment of the present invention. [Figure 12] 1A to 1C are diagrams illustrating a method for manufacturing a display device according to an embodiment of the present invention. [Figure 13] 1A to 1C are diagrams illustrating a method for manufacturing a display device according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0030] Because the present invention can be modified in various ways and can take various forms, specific embodiments are shown by way of example in the drawings and described in detail herein, but it is understood that this is not to limit the invention to the particular forms disclosed, but rather to include all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

[0031] In describing the various drawings, like reference numerals are used to refer to like elements. The dimensions of structures in the accompanying drawings are exaggerated to clarify the present invention. Terms such as "first" and "second" may be used to describe various elements, but these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, a first element may be referred to as a "second element," and similarly, a second element may be referred to as a "first element" without departing from the scope of the present invention.

[0032] In this application, the use of terms such as "comprises" or "has" is intended to specify the presence of a specified feature, numeral, step, operation, component, part, or combination thereof, but should not be understood to preclude the presence or addition of one or more other features, numerals, steps, operations, components, parts, or combinations thereof. When a layer, film, region, plate, or other part is referred to as being "on" another part, this includes not only being "directly on" the other part, but also having another part between them. When a layer, film, region, plate, or other part is referred to as being formed on another part, this does not mean that the formation direction is limited to the top direction, but also includes being formed on the side or bottom direction. Conversely, when a layer, film, region, plate, or other part is referred to as being "under" another part, this includes not only being "directly under" the other part, but also having another part between them.

[0033] Hereinafter, preferred embodiments of the present invention and other matters necessary for those skilled in the art to easily understand the contents of the present invention will be described in detail with reference to the accompanying drawings. In the following description, the singular expression also includes the plural expression unless the context clearly indicates the singular expression only.

[0034] FIG. 1 is a block diagram showing a display device according to an embodiment of the present invention.

[0035] Referring to FIG. 1, the display device DD may include a display panel DP, a gate driver 120, a data driver 130, a voltage generator 140, and a controller 150.

[0036] The display panel DP includes sub-pixels SP. The sub-pixels SP may be connected to the gate driver 120 via first to m-th gate lines GL1 to GLm. The sub-pixels SP may be connected to the data driver 130 via first to n-th data lines DL1 to DLn.

[0037] The sub-pixels SP can generate light of two or more colors, for example, red, green, blue, cyan, magenta, yellow, etc.

[0038] Two or more of the subpixels SP can constitute one pixel PX. For example, the pixel PX may include three subpixels SP as shown in Figure 1. In this way, the pixel PX can emit light of various colors and luminances depending on the combination of light emitted from the subpixels SP included in the pixel PX.

[0039] The gate driver 120 is connected to the sub-pixels SP arranged in the row direction via the first to m-th gate lines GL1 to GLm. The gate driver 120 can output gate signals to the first to m-th gate lines GL1 to GLm in response to gate control signals GCS. In an embodiment, the gate control signals GCS may include a start signal indicating the start of each frame, a horizontal synchronization signal, etc.

[0040] The gate driver 120 may be arranged on one side of the display panel DP. However, embodiments are not limited to this. For example, the gate driver 120 may be divided into two or more physically and / or logically separated drivers, and the drivers may be arranged on one side of the display panel DP and the other side of the display panel DP opposite the one side. In this way, the gate driver 120 may be arranged around the display panel DP in various forms depending on the embodiment.

[0041] The data driver 130 is connected to the sub-pixels SP arranged in the column direction via first to n-th data lines DL1 to DLn. The data driver 130 receives video data DATA and a data control signal DCS from the controller 150. The data driver 130 operates in response to the data control signal DCS. In an embodiment, the data control signal DCS may include a source start signal, a source shift clock, a source output enable signal, etc.

[0042] The data driver 130 can receive a voltage from the voltage generator 140. The data driver 130 can use the received voltage to apply data signals having grayscale voltages corresponding to video data DATA to the first to n-th data lines DL1 to DLn. When gate signals are applied to the first to m-th gate lines GL1 to GLm, respectively, the data signals corresponding to the video data DATA can be applied to the data lines DL1 to DLn. This allows the sub-pixels SP to generate light corresponding to the data signals, and the display panel DP to display an image.

[0043] In an embodiment, the gate driver 120 and the data driver 130 may include complementary metal-oxide semiconductor (CMOS) circuit elements.

[0044] The voltage generator 140 can operate in response to a voltage control signal VCS from the controller 150. The voltage generator 140 is configured to generate a plurality of voltages and provide the generated voltages to components of the display device DD, such as the gate driver 120, the data driver 130, and the controller 150. The voltage generator 140 can receive an input voltage from outside the display device DD and generate a plurality of voltages by regulating the received voltage.

[0045] The voltage generator 140 may generate a first power supply voltage and a second power supply voltage. The generated first and second power supply voltages may be provided to the sub-pixels SP via the power supply lines PL. In another embodiment, at least one of the first and second power supply voltages may be provided from outside the display device DD.

[0046] In addition, the voltage generator 140 may provide various voltages and / or signals. For example, the voltage generator 140 may provide one or more initialization voltages applied to the subpixels SP. For example, during a sensing operation for sensing electrical characteristics of transistors and / or light-emitting elements of the subpixels SP, predetermined reference voltages may be applied to the first to n-th data lines DL1 to DLn, and the voltage generator 140 may generate and transmit the reference voltages to the data driver 130. For example, during a display operation for displaying an image on the display panel DP, a common pixel control signal may be applied to the subpixels SP, and the voltage generator 140 may generate the pixel control signal. In the embodiment, the voltage generator 140 may provide the pixel control signal to the subpixels SP via the pixel control line PXCL. Although FIG. 1 illustrates that the pixel control line PXCL is connected between the voltage generator 140 and the display panel DP, the embodiment is not limited thereto. For example, the pixel control line PXCL may be connected between the gate driver 120 and the display panel DP. In this case, the pixel control signal may be transmitted from the voltage generator 140 via the gate driver 120 to the pixel control line PXCL.

[0047] The controller 150 controls various operations of the display device DD. The controller 150 receives input image data IMG and a corresponding control signal CTRL from the outside. The controller 150 can provide a gate control signal GCS, a data control signal DCS, and a voltage control signal VCS in response to the control signal CTRL.

[0048] The controller 150 can convert the input image data IMG to be compatible with the display device DD or the display panel DP and output the image data DATA. In an embodiment, the controller 150 can align the input image data IMG to be compatible with the row-based sub-pixels SP and output the image data DATA.

[0049] Two or more components of the data driver 130, the voltage generator 140, and the controller 150 may be implemented in a single integrated circuit. As shown in FIG. 1 , the data driver 130, the voltage generator 140, and the controller 150 may be included in a driver integrated circuit DIC. In this case, the data driver 130, the voltage generator 140, and the controller 150 may be functionally distinct components within a single driver integrated circuit DIC. In other embodiments, at least one of the data driver 130, the voltage generator 140, and the controller 150 may be provided as a distinct component from the driver integrated circuit DIC.

[0050] FIG. 2 is a block diagram illustrating an embodiment of one of the subpixels of FIG.

[0051] Figure 2 shows, as an example, subpixels SPij arranged in the i-th row (i is an integer greater than or equal to 1 and less than or equal to m) and j-th column (j is an integer greater than or equal to 1 and less than or equal to n) of the subpixels SP of Figure 1.

[0052] Referring to FIG. 2, the sub-pixel SPij may include a sub-pixel circuit SPC and a light-emitting element LD.

[0053] The light emitting element LD is connected between a first power supply voltage node VDDN and a second power supply voltage node VSSN. The first power supply voltage node VDDN is connected to one of the power supply lines PL of FIG. 1 to receive a first power supply voltage. The second power supply voltage node VSSN is connected to the other of the power supply lines PL of FIG. 1 to receive a second power supply voltage. The first power supply voltage may have a higher voltage level than the second power supply voltage.

[0054] The light-emitting element LD is connected between an anode electrode AE ​​and a cathode electrode CE. The anode electrode AE ​​may be connected to a first power supply voltage node VDDN via a sub-pixel circuit SPC. For example, the anode electrode AE ​​may be connected to the first power supply voltage node VDDN via one or more transistors included in the sub-pixel circuit SPC. The cathode electrode CE may be connected to a second power supply voltage node VSSN. The light-emitting element LD is configured to emit light in response to a current flowing from the anode electrode AE ​​to the cathode electrode CE.

[0055] The sub-pixel circuit SPC may be connected to the ith gate line GLi among the first to mth gate lines GL1 to GLm in FIG. 1 and the jth data line DLj among the first to nth data lines DL1 to DLn in FIG. 1. In response to a gate signal received via the ith gate line GLi, the sub-pixel circuit SPC controls the light-emitting element LD to emit light in accordance with a data signal received via the jth data line DLj. In an embodiment, the sub-pixel circuit SPC may be further connected to the pixel control line PXCL in FIG. 1. In this case, the sub-pixel circuit SPC may control the light-emitting element LD in further response to a pixel control signal received via the pixel control line PXCL.

[0056] For this operation, the sub-pixel circuit SPC may include circuit elements, such as transistors and one or more capacitors.

[0057] The transistors of the sub-pixel circuits SPC may include P-type transistors and / or N-type transistors. In an embodiment, the transistors of the sub-pixel circuits SPC may include MOSFETs (Metal Oxide Silicon Field Effect Transistors). In an embodiment, the transistors of the sub-pixel circuits SPC may include amorphous silicon semiconductors, monocrystalline silicon, polycrystalline silicon semiconductors, oxide semiconductors, etc.

[0058] Fig. 3 is a perspective view showing one embodiment of the display device of Fig. 1. Fig. 4 is a diagram showing a folded state of the display device shown in Fig. 3. Fig. 5 is a diagram showing the folded state of the display device shown in Fig. 4 and a schematic view of a set member outside the display device.

[0059] 3, the display device DD according to the embodiment of the present invention may have a rectangular shape having a short side extending in a first direction DR1 and a long side extending in a second direction DR2 intersecting the first direction DR1. However, the shape of the display device DD is not limited thereto, and the positions of the short side and the long side of the display device DD may be interchangeable, and the display device DD may have various shapes such as a circle and a polygon. The display device DD may be a flexible display device.

[0060] Hereinafter, a direction that intersects substantially perpendicularly with a plane defined by the first direction DR1 and the second direction DR2 is defined as a third direction DR3. In addition, in this specification, "planar view" can be defined as a state viewed from the third direction DR3.

[0061] The display device DD may include a folding area FA and a plurality of non-folding areas NFA1, NFA2 adjacent to the folding area FA. The non-folding areas NFA1, NFA2 may include a first non-folding area NFA1 and a second non-folding area NFA2. The second non-folding area NFA2 may be spaced apart from the first non-folding area NFA1 in a first direction DR1. The folding area FA may be disposed between the first non-folding area NFA1 and the second non-folding area NFA2. The first non-folding area NFA1, the folding area FA, and the second non-folding area NFA2 may be arranged in the first direction DR1.

[0062] Although one folding area FA and two non-folding areas NFA1, NFA2 are illustrated, the number of folding areas FA and non-folding areas NFA1, NFA2 is not limited to this. For example, the display device DD may include multiple non-folding areas greater than two and multiple folding areas disposed between the non-folding areas.

[0063] The top surface of the display device DD can be defined as a display surface DS, and the display surface DS can have a plane defined by a first direction DR1 and a second direction DR2. An image IM generated by the display device DD can be provided to a user via the display surface DS.

[0064] The display surface DS may include a display area DA and a non-display area NDA surrounding the display area DA. The display area DA may display an image, while the non-display area NDA may not display an image. The non-display area NDA may surround the display area DA and define the edge of the display device DD, which may be printed in a predetermined color.

[0065] Although not shown, the display device DD may include at least one sensor and at least one camera. The sensor may be a proximity sensor, but the type of sensor is not limited thereto. The camera can capture an external image.

[0066] 4, the display device DD may be a foldable display device DD that can be folded or unfolded. For example, the display device DD can be folded by bending the folding region FA about a folding axis FX parallel to the second direction DR2. The folding axis FX may be defined as a major axis parallel to the long side of the display device DD. The folding region FA may be bent to have a radius of curvature R.

[0067] When folding the display device DD, the first non-folding area NFA1 and the second non-folding area NFA2 face each other, and the display device DD may be in-folded so that the display surface DS is not exposed to the outside. However, embodiments of the present invention are not limited thereto. For example, the display device DD may be out-folded around the folding axis FX so that the display surface DS is exposed to the outside.

[0068] The distance between the first non-folding area NFA1 and the second non-folding area NFA2 may be less than twice the radius of curvature R. In this case, the folding area FA may be folded into a dumbbell shape.

[0069] 5, when the folding area FA is folded into a dumbbell shape, the first non-folding area NFA1 and the second non-folding area NFA2 are brought into contact with each other as a whole, and the distance between the first non-folding area NFA1 and the second non-folding area NFA2 may be reduced as a whole, thereby improving the structural stability of the display device DD when folding the display device DD and reducing the thickness of the display device DD.

[0070] A setting member ST may be provided on the outside of the display device DD, which can cover the display device DD from the outside to protect the display device DD and to stabilize the structure of the display device DD when folding and unfolding the display device DD.

[0071] At this time, due to the dumbbell shape of the folding area FA when folding the display device DD, interference may occur between the components of the display device DD that extend from the non-folding area FA and have one end disposed in the folding area FA (e.g., the digitizer member DGM, the shielding member SDM, etc. in FIG. 6 ) and the set member ST outside the display device DD. To prevent this, a connecting member (e.g., the connecting member CM in FIG. 6 ) that joins together one end of the components disposed in the non-folding areas NFA1 and NFA2 may be disposed in the folding area FA of the display device DD. The connecting member can prevent interference between the internal components of the display device DD and the set member ST, allowing the display device DD to be folded and unfolded more stably.

[0072] FIG. 6 is a cross-sectional view taken along line II' in FIG.

[0073] 6, the display device DD may include a display panel DP, a first support member SPM1, a digitizer member DGM, a shielding member SDM, an electromagnetic wave shielding member ESM, an adhesive member ADM, a second support member SPM2, and a connection member CM. However, the present invention is not limited thereto, and a glass layer, a protective layer, etc. may be further disposed on the display panel DP. Furthermore, although not shown, an adhesive layer may be further disposed between each component.

[0074] The display panel DP can have a folding area FA and non-folding areas NFA1, NFA2 because the display device DD has a folding area FA and non-folding areas NFA1, NFA2. The display panel DP will be described in detail with reference to FIG. 7.

[0075] FIG. 7 is an enlarged cross-sectional view of the display panel of FIG.

[0076] 7, the display panel DP may include a substrate SUB, a buffer layer BF, a circuit element layer PCL, a light-emitting element layer EML, and a thin-film encapsulation layer TFEL. The circuit element layer PCL may include a thin-film transistor TFT, a first gate insulating layer GI1, a first gate conductive layer GAT1, a second gate insulating layer GI2, a second gate conductive layer GAT2, an interlayer insulating layer ILD, a first metal conductive layer SD1, a second metal conductive layer SD2, a first via insulating layer VIA1, and a second via insulating layer VIA2.

[0077] The substrate SUB may function to support various components disposed above the substrate SUB, and may be made of an insulating material such as glass or resin.

[0078] In one embodiment, the substrate SUB may be made of a flexible material so that it can be bent or folded, and may have a single-layer structure or a multi-layer structure. The substrate SUB may include a polyimide substrate. However, the present invention is not limited thereto, and in another example, the substrate SUB may include a glass substrate. As yet another example, the substrate SUB may include a silicon wafer substrate formed using a semiconductor process.

[0079] The buffer layer BF can be disposed on the substrate SUB. The buffer layer BF can be disposed on the upper surface of the substrate SUB to protect the thin film transistor TFT and the light-emitting layer EL of the light-emitting element layer EML from moisture that penetrates through the substrate SUB, which is susceptible to moisture permeation.

[0080] In one embodiment, the buffer layer BF may be an inorganic film. The buffer layer BF may be composed of multiple inorganic films stacked alternately. For example, the buffer layer BF may be composed of a multilayer film in which one or more inorganic films selected from the group consisting of silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, and aluminum oxide are stacked alternately. In some embodiments, the buffer layer BF may be omitted.

[0081] A circuit element layer PCL including a thin film transistor TFT may be disposed on the buffer layer BF. The thin film transistor TFT may include an active layer ACT, a gate electrode GE, a source electrode S, and a drain electrode D. While FIG. 7 illustrates a top-gate arrangement in which the gate electrode GE of the thin film transistor TFT is located above the active layer ACT, this arrangement is not limiting. For example, in some embodiments, the thin film transistor TFT may be disposed in a bottom-gate arrangement in which the gate electrode GE is located below the active layer ACT, or in a double-gate arrangement in which the gate electrode GE is located both above and below the active layer ACT.

[0082] Specifically, an active layer ACT may be disposed on the buffer layer BF. The active layer ACT may include polycrystalline silicon, single-crystalline silicon, low-temperature polycrystalline silicon, amorphous silicon, or an oxide semiconductor. For example, the oxide semiconductor may include a binary compound (ABx), a ternary compound (ABxCy), or a quaternary compound (ABxCyDz) containing indium, zinc, gallium, tin, titanium, aluminum, hafnium (Hf), zirconium (Zr), magnesium (Mg), or the like. For example, the active layer ACT may include ITZO (oxide containing indium, tin, and titanium) or IGZO (oxide containing indium, gallium, and tin).

[0083] A first gate insulating layer GI1 may be disposed on the active layer ACT. The first gate insulating layer GI1 may be disposed to a thickness substantially equal to the profile of the active layer ACT. In one embodiment, the first gate insulating layer GI1 may be an inorganic film. For example, the first gate insulating layer GI1 may be formed of a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. FIG. 5 illustrates an example in which the first gate insulating layer GI1 is disposed in areas other than the area overlapping the gate electrode GE, but this is not limiting. For example, in some embodiments, the first gate insulating layer GI1 may be disposed only in the area overlapping the gate electrode GE.

[0084] A first gate conductive layer GAT1 may be disposed on the first gate insulating layer GI1. The first gate conductive layer GAT1 may include a gate electrode GE of the thin film transistor TFT, a first electrode CE1 of the storage capacitor Cst, and a scanning line.

[0085] The first gate conductive layer GAT1 may be composed of a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0086] A second gate insulating layer GI2 may be disposed on the first gate conductive layer GAT1. The second gate insulating layer GI2 may be disposed on the first gate insulating layer GI1 on which the first gate conductive layer GAT1 is disposed, to cover the first gate conductive layer GAT1. The second gate insulating layer GI2 may be disposed to substantially the same thickness as the first gate conductive layer GAT1 according to the profile of the first gate conductive layer GAT1. In one embodiment, the second gate insulating layer GI2 may be an inorganic film. For example, the second gate insulating layer GI2 may include the same material as the first gate insulating layer GI1. However, this is not limiting.

[0087] The second gate conductive layer GAT2 may be disposed on the second gate insulating layer GI2. The second gate conductive layer GAT2 may include a second electrode CE2 of the storage capacitor Cst. For example, the second electrode CE2 may form the storage capacitor Cst together with the first electrode CE1. The second electrode CE2 may overlap the first electrode CE1 in the third direction DR3.

[0088] The interlayer insulating layer ILD may be disposed on the second gate insulating layer GI2 on which the second gate conductive layer GAT2 is disposed. In one embodiment, the interlayer insulating layer ILD may be an inorganic film. For example, the interlayer insulating layer ILD may be a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0089] The first metal conductive layer SD1 may be disposed on the interlayer insulating layer ILD. The first metal conductive layer SD1 may be a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof. For example, the first metal conductive layer SD1 may have a multi-layer structure. For example, the first metal conductive layer SD1 may be a two-layer structure of Ti / Al or a three-layer structure of Ti / Al / Ti.

[0090] The first metal conductive layer SD1 may include a source electrode S and a drain electrode D of the thin film transistor TFT. Each of the source electrode S and the drain electrode D may be connected to the active layer ACT via a contact hole that penetrates the first gate insulating layer G1, the second gate insulating layer GI2, and the interlayer insulating layer ILD.

[0091] The first via insulating layer VIA1 partially insulates the first metal conductive layer SD1 from a second metal conductive layer SD2 (described later) and may serve to flatten steps caused by thin film transistor TFT elements. The first via insulating layer VIA1 may be disposed on the interlayer insulating layer ILD on which the first metal conductive layer SD1 is disposed. The first via insulating layer VIA1 may be an organic film. The first via insulating layer VIA1 may be formed using an organic insulating material such as an acrylic resin, a polyimide resin, or a polyamide resin. For example, the first via insulating layer VIA1 may include at least one material selected from the group consisting of an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, and a polyimide resin.

[0092] The second metal conductive layer SD2 may be disposed on the first via insulating layer VIA1. The second metal conductive layer SD2 may include a metal. The second metal conductive layer SD2 may include one or more metals selected from molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu). For example, the second metal conductive layer SD2 may have a multilayer structure. For example, the second metal conductive layer SD2 may have a two-layer structure of Ti / Al or a three-layer structure of Ti / Al / Ti.

[0093] The second metal conductive layer SD2 may include a connection electrode CNE, a data line DL, an initialization voltage line, etc., which are electrically connected to the source electrode S or the drain electrode D of the thin film transistor TFT. For example, as shown in Fig. 5, the second metal conductive layer SD2 may include a connection electrode CNE which is electrically connected to the drain electrode D. The connection electrode CNE may be electrically connected to the drain electrode D through a contact hole formed through the first via insulating layer VIA1.

[0094] The second via insulating layer VIA2 may be disposed on the first via insulating layer VIA1 on which the second metal conductive layer SD2 is disposed. The second via insulating layer VIA2 may be an organic film. The second via insulating layer VIA2 may include at least one material selected from the group consisting of acrylic resin, polyimide resin, and polyamide resin.

[0095] The light emitting element layer EML is formed on the circuit element layer PCL. The light emitting element layer EML includes a light emitting element LD and a pixel defining film PDL.

[0096] Each of the light emitting elements LD may include an anode electrode AE, an emitting layer EL, and a cathode electrode CE, and the light emitting element LD and the pixel defining layer PDL may be formed on the second via insulating layer VIA2.

[0097] The anode electrode AE ​​of the light emitting element LD is electrically connected to the connection electrode CNE through a contact hole formed through the second via insulating layer VIA2, and can be electrically connected to the drain electrode D of the thin film transistor TFT.

[0098] In a top emission structure in which light is emitted from the light emitting layer EL toward the cathode electrode CE, the anode electrode AE ​​may be made of a highly reflective metal material such as a laminated structure of aluminum and titanium (Ti / Al / Ti), a laminated structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, or a laminated structure of an APC alloy and ITO (ITO / APC / ITO). The APC alloy may be an alloy of silver (Ag), palladium (Pd), and copper (Cu). Alternatively, the anode electrode AE ​​may be made of a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al).

[0099] In a bottom emission structure in which light is emitted from the light emitting layer EL toward the anode electrode AE, the anode electrode AE ​​may be made of a transparent metal material (TCO, Transparent Conductive Material) such as ITO or IZO that can transmit light, or a semi-transmissive metal material (TCO, Transparent Conductive Material) such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag).

[0100] The pixel definition film PDL can define the light-emitting area of ​​each sub-pixel SP. The pixel definition film can be disposed on the second via insulating layer VIA2 so as to define the anode electrode AE. The pixel definition film PDL can be disposed so as to cover the edge of the anode electrode AE. The pixel definition film PDL can be an organic film. For example, the pixel definition film PDL can be made of an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, or the like.

[0101] An emitting layer EL may be disposed on the anode electrode AE ​​and the pixel defining layer PDL. In one embodiment, the emitting layer EL may emit light of a predetermined color containing an organic material. For example, the emitting layer EL may include a hole transporting layer, an organic material layer, and an electron transporting layer. In this case, the emitting layer EL may emit light of one of red, green, and blue colors.

[0102] The cathode electrode CE may be disposed on the light-emitting layer EL. The cathode electrode CE may be disposed so as to cover the light-emitting layer EL. The cathode electrode CE may be a common layer formed in common to the pixels.

[0103] In the top emission structure, the cathode electrode CE may be made of a transparent metal material (TCO, Transparent Conductive Material) such as ITO or IZO that can transmit light, or a semi-transmissive metal material (Semi-transmissive Conductive Material) such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag).

[0104] In the lower light emitting structure, the cathode electrode CE may be made of a highly reflective metal material such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, or a stacked structure of an APC alloy and ITO (ITO / APC / ITO). The APC alloy may be an alloy of silver (Ag), palladium (Pd), and copper (Cu). However, the present invention is not limited thereto, and in other embodiments, the cathode electrode CE may be made of a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), aluminum (Al), or ITO.

[0105] A thin film encapsulation layer TFEL may be disposed on the light-emitting element layer EML. Specifically, the thin film encapsulation layer TFEL may be disposed on the cathode electrode CE. The thin film encapsulation layer TFEL may include at least one inorganic film to prevent oxygen or moisture from penetrating into the light-emitting layer EL and the cathode electrode CE. The thin film encapsulation layer TFEL may also include at least one organic film to protect the light-emitting element layer EML from foreign matter such as dust.

[0106] For example, the thin-film encapsulation layer TFEL may include a first inorganic encapsulation layer IEL1 disposed on the cathode electrode CE, an organic encapsulation layer OEL disposed on the first inorganic encapsulation layer IEL1, and a second inorganic encapsulation layer IEL2 disposed on the organic encapsulation layer OEL. Each of the first inorganic encapsulation layer IEL1 and the second inorganic encapsulation layer IEL2 may be made of, but is not limited to, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic encapsulation layer OEL may be made of, but is not limited to, an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, or the like.

[0107] 6, a first support member SPM1 may be disposed below the display panel DP, and may support the display panel DP.

[0108] The strength of the first support member SPM1 may be greater than the strength of the display panel DP. The first support member SPM1 may include a non-metallic material. For example, the first support member SPM1 may include a reinforced fiber composite material. The reinforced fiber composite material may be carbon fiber reinforced plastic (CFRP) or glass fiber reinforced plastic (GFRP).

[0109] The first support member SPM1 may overlap the non-folding areas NFA1 and NFA2 and the folding area FA of the display panel DP. The first support member SPM1 may have an opening pattern OPP overlapping the folding area FA to reduce folding stress of the display device DD.

[0110] A digitizer member DGM may be disposed below the first support member SPM1. The digitizer member DGM may include an electrode pattern for detecting access or contact of an electronic pen, such as a stylus pen that supports electromagnetic resonance (EMR). The digitizer member DGM detects a magnetic field or electromagnetic signal emitted from the electronic pen based on the electrode pattern, and determines the point where the detected magnetic field or electromagnetic signal is strongest as the touch coordinate.

[0111] The digitizer member DGM may include a first digitizer DG1 and a second digitizer DG2. The first digitizer DG1 may overlap the first non-folding area NFA1 and at least a portion of the folding area FA, and the second digitizer DG2 may overlap the second non-folding area NFA2 and at least a portion of the folding area FA. That is, the second digitizer DG2 may be spaced apart from the first digitizer DG1 in the first direction DR1.

[0112] The first digitizer DG1 and the second digitizer DG2 may be separated from each other by a folding area FA to reduce folding stress of the display device DD. The gap between the first digitizer DG1 and the second digitizer DG2 may overlap the folding area FA and may be narrower than the folding area FA.

[0113] A shielding member SDM may be disposed below the digitizer member DGM. The shielding member SDM can prevent electromagnetic field signals from being emitted below the shielding member SDM. Specifically, the shielding member SDM can allow electromagnetic field signals that have passed through the digitizer member DGM to flow inside the shielding member SDM. Therefore, the shielding member SDM can reduce noise that may be generated by the electromagnetic field. The shielding member SDM may include magnetic metal powder.

[0114] The shielding member SDM may include a first shielding layer SDL1 and a second shielding layer SDL2. The first shielding layer SDL1 may entirely overlap the first digitizer DG1, and the second shielding layer SDL2 may entirely overlap the second digitizer DG2. That is, the first shielding layer SDL1 may overlap the first non-folding area NFA1 and at least a portion of the folding area FA, and the second shielding layer SDL2 may overlap the second non-folding area NFA2 and at least a portion of the folding area FA. The second shielding layer SDL2 may be spaced apart from the first shielding layer SDL1 in the first direction DR1.

[0115] The first shielding layer SDL1 and the second shielding layer SDL2 may be separated and spaced apart from each other at a folding region FA to reduce folding stress of the display device DD. A gap g1 between the first shielding layer SDL1 and the second shielding layer SDL2 may overlap the folding region FA and may be narrower than the folding region FA.

[0116] The first shielding layer SDL1 may be integrally formed and made of the same material. Similarly, the second shielding layer SDL2 may be integrally formed and made of the same material. That is, the portions of the first shielding layer SDL1 overlapping the non-folding regions NFA1 and NFA2 and the portions overlapping the folding region FA may be integrally connected to each other and may include the same material. The portions of the second shielding layer SDL2 overlapping the non-folding regions NFA1 and NFA2 and the portions overlapping the folding region FA may also be integrally connected to each other and may include the same material. This eliminates the need to use different materials for the non-folding regions NFA1 and NFA2 and the folding region FA when forming the shielding member SDM, thereby reducing manufacturing costs and improving manufacturing efficiency of the display device DD.

[0117] An electromagnetic wave shielding member ESM may be disposed below the shielding member SDM. The electromagnetic wave shielding member ESM may shield electromagnetic interference (EMI) that reduces the electronic pen sensing sensitivity of the digitizer member DGM and may also perform a heat dissipation function. The electromagnetic wave shielding member ESM may include a conductive material. For example, the electromagnetic wave shielding member ESM may include at least one of metals, such as copper (Cu), silver (Ag), and nickel (Ni).

[0118] The electromagnetic shielding member ESM may include a first electromagnetic shielding layer ESL1 and a second electromagnetic shielding layer ESL2. The first electromagnetic shielding layer ESL1 may overlap the first shielding layer SDL1. However, the first electromagnetic shielding layer ESL1 may not overlap the first shielding layer SDL1 in the folding region FA. The second electromagnetic shielding layer ESL2 may overlap the second shielding layer SDL2. However, the second electromagnetic shielding layer ESL2 may not overlap the second shielding layer SDL2 in the folding region FA. The second electromagnetic shielding layer ESL2 may be spaced apart from the first electromagnetic shielding layer ESL1 in the first direction DR1. The first electromagnetic shielding layer ESL1 may overlap the first non-folding region NFA1, and the second electromagnetic shielding layer ESL2 may overlap the second non-folding region NFA2, but each of the first electromagnetic shielding layer ESL1 and the second electromagnetic shielding layer ESL2 may not overlap the folding region FA, although the present invention is not limited thereto.

[0119] The first and second electromagnetic shielding layers ESL1 and ESL2 may be separated from each other in a folding region FA to reduce folding stress of the display device DD. A gap g2 between the first and second electromagnetic shielding layers ESL1 and ESL2 may overlap the folding region FA and may have a width equal to or greater than that of the folding region FA. That is, the gap g2 between the first and second electromagnetic shielding layers ESL1 and ESL2 may have a width in the first direction DR1 greater than that of the gap g1 between the first and second shielding layers SDL1 and SDL2.

[0120] A connecting member CM may be disposed below the shielding member SDM and may be attached to the first shielding layer SDL1 and the second shielding layer SDL2 via a first adhesive sheet ADS1 and a second adhesive sheet ADS2, respectively.

[0121] The connecting member CM may be disposed between the first electromagnetic shielding layer ESL1 and the second electromagnetic shielding layer ESL2. That is, the connecting member CM may overlap the folding region FA and be disposed in the gap g2 between the first electromagnetic shielding layer ESL1 and the second electromagnetic shielding layer ESL2.

[0122] The connecting member CM connects the first shielding layer SDL1 and the second shielding layer SDL2 to each other and can function to join one ends of the components below the display panel DP to each other when folding the display device DD. For example, the connecting member CM can be attached to one end of the first shielding layer SDL1 and one end of the second shielding layer SDL2 to join one end of the first shielding layer SDL1 and one end of the second shielding layer SDL2 to each other so that one end of the first shielding layer SDL1 and one end of the second shielding layer SDL2 do not interfere with the setting member ST of FIG. 5.

[0123] The connection member CM may include an electromagnetic wave shielding sheet ESS and a support sheet SPS.

[0124] The electromagnetic shielding sheet ESS may be attached to the first shielding layer SDL1 via a first adhesive sheet ADS1 and to the second shielding layer SDL2 via a second adhesive sheet ADS2. The electromagnetic shielding sheet ESS may include the same material as the first electromagnetic shielding layer ESL1 and the second electromagnetic shielding layer ESL2. That is, the electromagnetic shielding sheet ESS may include a conductive material. For example, the electromagnetic shielding sheet ESS may include at least one of a metal, such as copper (Cu), silver (Ag), and nickel (Ni). However, the present invention is not limited thereto.

[0125] The electromagnetic wave shielding sheet ESS, like the first electromagnetic wave shielding layer ESL1 and the second electromagnetic wave shielding layer ESL2, can shield electromagnetic interference that reduces the electronic pen sensing sensitivity of the digitizer member DGM and perform heat dissipation functions. Therefore, the first electromagnetic wave shielding layer ESL1 and the second electromagnetic wave shielding layer ESL2 can shield electromagnetic interference and perform heat dissipation functions in the first non-folding area NFA1 and the second non-folding area NFA2, respectively, and the electromagnetic wave shielding sheet ESS can shield electromagnetic interference and perform heat dissipation functions in the folding area FA.

[0126] The electromagnetic wave shielding sheet ESS may be disposed in the gap g2 between the first electromagnetic wave shielding layer ESL1 and the second electromagnetic wave shielding layer ESL2, and may overlap the first electromagnetic wave shielding layer ESL1 and the second electromagnetic wave shielding layer ESL2 in the first direction DR1. However, the present invention is not limited thereto, and if the connection member CM further includes another member on top of the electromagnetic wave shielding sheet ESS, the electromagnetic wave shielding sheet ESS may not overlap the first electromagnetic wave shielding layer ESL1 and the second electromagnetic wave shielding layer ESL2 in the first direction DR1.

[0127] A support sheet SPS may be disposed below the electromagnetic wave shielding sheet ESS. The support sheet SPS can support and protect the electromagnetic wave shielding sheet ESS. The support sheet SPS may include a metal. For example, the support sheet SPS may include stainless steel (SUS), titanium, copper, etc.

[0128] The connecting member CM may further include an adhesive layer below the support sheet SPS for bonding to the set member ST of Fig. 5. However, the present invention is not limited thereto, and the adhesive layer may be omitted.

[0129] The second support member SPM2 may be attached to the lower part (lower surface) of the electromagnetic shielding member ESM via an adhesive member ADM. That is, the adhesive member ADM may be disposed below the electromagnetic shielding member ESM, and the second support member SPM2 may be disposed below the adhesive member ADM via the adhesive member ADM. The second support member SPM2 may support the components on the second support member SPM2.

[0130] The adhesive member ADM may include a first adhesive layer ADL1 and a second adhesive layer ADL2. The adhesive member ADM may include a transparent adhesive such as a pressure-sensitive adhesive (PSA) or an optically clear adhesive (OCA), although the present invention is not limited thereto.

[0131] The second support member SPM2 may include a 2-1 support layer SPL2-1 and a 2-2 support layer SPL2-2. That is, the 2-1 support layer SPL2-1 may be attached to the lower part of the first electromagnetic wave shielding layer ESL1 via a first adhesive layer ADL1, and the 2-2 support layer SPL2-2 may be attached to the lower part of the second electromagnetic wave shielding layer ESL2 via a second adhesive layer ADL2.

[0132] The first adhesive layer ADL1 and the second-1 support layer SPL2-1 may overlap the first electromagnetic wave shielding layer ESL1. The second adhesive layer ADL2 and the second-2 support layer SPL2-2 may overlap the second electromagnetic wave shielding layer ESL2. The second adhesive layer ADL2 and the second-2 support layer SPL2-2 may be spaced apart from the first adhesive layer ADL1 and the second-1 support layer SPL2-1 in the first direction DR1. The first adhesive layer ADL1 and the second-1 support layer SPL2-1 may overlap the first non-folding area NFA1, and the second adhesive layer ADL2 and the second-2 support layer SPL2-2 may overlap the second non-folding area NFA2. However, the adhesive member ADM and the second support member SPM2 may not overlap the folding area FA. However, the present invention is not limited to this.

[0133] The first adhesive layer ADL1 and the second adhesive layer ADL2, and the second-first support layer SPL2-1 and the second-second support layer SPL2-2 may be separated and spaced apart from each other in a folding region FA to reduce folding stress of the display device DD. The gap spaced apart in the first direction DR1 between the first adhesive layer ADL1 and the second adhesive layer ADL2, and the gap spaced apart in the first direction DR1 between the second-first support layer SPL2-1 and the second-second support layer SPL2-2 may overlap the folding region FA and may have a width equal to or greater than that of the folding region FA. That is, the width of the gap between the first adhesive layer ADL1 and the second adhesive layer ADL2 and the width of the gap between the 2-1 support layer SPL2-1 and the 2-2 support layer SPL2-2 may be larger than or equal to the width of the gap g2 spaced apart in the first direction DR1 between the first electromagnetic wave shielding layer ESL1 and the second electromagnetic wave shielding layer ESL2, although the present invention is not limited thereto.

[0134] In one embodiment, the first shielding layer SDL1 and the second shielding layer SDL2 are integrally formed over the folding area FA and the non-folding area NFA and are made of the same material throughout. The display device DD includes an electromagnetic shielding member ESM overlapping the non-folding areas NFA1 and NFA2 and an electromagnetic shielding sheet ESS overlapping the folding area FA, thereby shielding electromagnetic field signals and electromagnetic interference over the entire display device DD. However, it is not necessary to use different materials for the shielding member SDM in the folding area FA and the non-folding area NFA. This simplifies the structure of the display device DD, reduces manufacturing costs, and improves manufacturing efficiency.

[0135] FIG. 8 is a cross-sectional view showing another embodiment of the display device of FIG.

[0136] The display device DD' according to this embodiment differs from the above-described display device DD in the internal structure of the connection member CM, so that the same content as that described above will be briefly explained or omitted.

[0137] Referring to FIG. 8, the connection member CM may include an electromagnetic wave shielding sheet ESS.

[0138] The electromagnetic shielding sheet ESS may be attached to the first shielding layer SDL1 via a first adhesive sheet ADS1 and to the second shielding layer SDL2 via a second adhesive sheet ADS2. The electromagnetic shielding sheet ESS may include the same material as the first electromagnetic shielding layer ESL1 and the second electromagnetic shielding layer ESL2. That is, the electromagnetic shielding sheet ESS may include a conductive material. For example, the electromagnetic shielding sheet ESS may include at least one of a metal, such as copper (Cu), silver (Ag), and nickel (Ni). However, the present invention is not limited thereto.

[0139] The connecting member CM according to this embodiment differs from the connecting member CM of Fig. 6 in that the support sheet SPS below the electromagnetic shielding sheet ESS may be omitted. The electromagnetic shielding sheet ESS may also be made of metal, just like the support sheet SPS, so that the electromagnetic shielding sheet ESS may also serve as the support sheet SPS. In other embodiments, the electromagnetic shielding sheet ESS and the support sheet SPS of Fig. 6 may contain the same material. That is, the electromagnetic shielding sheet ESS and the support sheet SPS may be integrally formed, or the electromagnetic shielding sheet ESS and the support sheet SPS may be formed of the same material, so that the connecting member CM can shield electromagnetic interference and support the connecting member CM itself.

[0140] In one embodiment, when forming the connection member CM, no additional materials other than the electromagnetic wave shielding sheet ESS are required, so the manufacturing costs of the connection member CM can be reduced and the structure of the connection member CM can be simplified.

[0141] 9 to 13 are diagrams showing a method for manufacturing a display device according to an embodiment of the present invention.

[0142] 9 to 13 show a method for manufacturing the display device DD according to the embodiment described above with reference to Fig. 1 to Fig. 7. Contents that overlap with those described above will be briefly explained or omitted.

[0143] 9, a first support member SPM1 may be formed below the display panel DP. A plurality of opening patterns OPP may be formed in a portion of the first support member SPM1 overlapping the folding area FA.

[0144] 10, a digitizer member DGM may be formed below the first support member SPM1. Specifically, a first digitizer DG1 may be formed below a portion of the first support member SPM1 that overlaps with the first non-folding area NFA1 and at least a portion of the folding area FA. A second digitizer DG2 may be formed below a portion of the first support member SPM1 that overlaps with the second non-folding area NFA2 and at least a portion of the folding area FA. The first digitizer DG1 and the second digitizer DG2 are spaced apart from each other in the first direction DR1 to reduce folding stress.

[0145] A shielding member SDM may be formed below the digitizer member DGM. Specifically, a first shielding layer SDL1 may be formed below the first digitizer DG1. A second shielding layer SDL2 may be formed below the second digitizer DG2. The first shielding layer SDL1 and the second shielding layer SDL2 may be formed to entirely overlap the first digitizer DG1 and the second digitizer DG2, respectively. The first shielding layer SDL1 and the second shielding layer SDL2 are spaced apart from each other by a predetermined gap (width) g1 in the first direction DR1, thereby reducing folding stress of the display device.

[0146] 11, an electromagnetic shielding member ESM may be formed below the shielding member SDM. Specifically, a first electromagnetic shielding layer ESL1 may be formed below a portion of the first shielding layer SDL1 that overlaps with the first non-folding region NFA1. A second electromagnetic shielding layer ESL2 may be formed below a portion of the second shielding layer SDL2 that overlaps with the second non-folding region NFA2. The first electromagnetic shielding layer ESL1 and the second electromagnetic shielding layer ESL2 may be spaced apart from each other in the first direction DR1 by a predetermined gap (width) g2. In this case, the gap g2 between the first electromagnetic shielding layer ESL1 and the second electromagnetic shielding layer ESL2 may be larger than the gap g1 between the first shielding layer SDL1 and the second shielding layer SDL2.

[0147] A second support member SPM2 may be formed below the electromagnetic shielding member ESM via an adhesive member ADM. Specifically, a first adhesive layer ADL1 and a second-first support layer SPL2-1 may be formed below the first electromagnetic shielding layer ESL1. Also, a second adhesive layer ADL2 and a second-second support layer SPL2-2 may be formed below the second electromagnetic shielding layer ESL2. The first adhesive layer ADL1 and the second adhesive layer ADL2, and the second-first support layer SPL2-1 and the second-second support layer SPL2-2 may be formed spaced apart from each other in the first direction DR1. In this case, the gap between the first adhesive layer ADL1 and the second adhesive layer ADL2 and the gap between the 2-1 support layer SPL2-1 and the 2-2 support layer SPL2-2 may each have a width that is larger than or the same as the width of the gap g2 between the first electromagnetic wave shielding layer ESL1 and the second electromagnetic wave shielding layer ESL2.

[0148] 12, a connection member CM may be formed. Specifically, an electromagnetic wave shielding sheet ESS may be formed on a support sheet SPS.

[0149] The support sheet SPS may be made of a metal, such as stainless steel (SUS), titanium, or copper.

[0150] In one embodiment, an electromagnetic wave shielding sheet ESS may be provided on a support sheet SPS. That is, the electromagnetic wave shielding sheet ESS may be laminated or attached to the support sheet SPS. The electromagnetic wave shielding sheet ESS may be made of a conductive material. For example, the electromagnetic wave shielding sheet ESS may be made of at least one of metals, such as copper (Cu), silver (Ag), and nickel (Ni).

[0151] In another embodiment, an electromagnetic wave shielding paint may be plated or vapor-deposited on the support sheet SPS. That is, the electromagnetic wave shielding sheet ESS may be formed by plating or vapor-depositing the electromagnetic wave shielding paint on the support sheet SPS. Here, the electromagnetic wave shielding paint may include at least one of metals, for example, copper (Cu), silver (Ag), and nickel (Ni).

[0152] However, the present invention is not limited to this, and in other embodiments, the support sheet SPS and the electromagnetic wave shielding sheet ESS may be formed integrally (see FIG. 8), or the support sheet SPS and the electromagnetic wave shielding sheet ESS may be formed from the same material.

[0153] Referring to FIG. 13, a connection member CM may be provided in a gap formed inside the electromagnetic wave shielding member ESM, the adhesive member ADM, and the second support member SPM2.

[0154] That is, a connecting member CM may be provided across the gap g2 between the first electromagnetic wave shielding layer ESL1 and the second electromagnetic wave shielding layer ESL2, the gap between the first adhesive layer ADL1 and the second adhesive layer ADL2, and the gap between the 2-1 support layer SPL2-1 and the 2-2 support layer SPL2-2. The connecting member CM may be attached to the first shielding layer SDL1 and the second shielding layer SDL2 via the first adhesive sheet ADS1 and the second adhesive sheet ADS2. By providing the connecting member CM in the folding region FA, interference between the internal configuration of the display device DD and the setting member ST of FIG. 5 may be prevented when folding the display device DD, and the display device DD may be folded and unfolded more stably.

[0155] Although the technical concept of the present invention has been specifically described with reference to the above-mentioned embodiment, it should be noted that the above-mentioned embodiment is for illustrative purposes only and is not intended to be limiting. Those skilled in the art will understand that various modifications are possible within the scope of the technical concept of the present invention.

[0156] The scope of the present invention is not limited to the contents described in the detailed description of the specification, but should be determined by the claims. All modifications and alterations derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention.

[0157] According to a preferred specific embodiment, it is as follows:

[0158] The background and issues of this case are as follows (i) to (v).

[0159] (i) Foldable display panels, such as organic light-emitting display panels, and flat-type mobile devices including such panels, such as smartphones, have been realized and are now commercially available. Such foldable display panels and mobile devices are required to be thinner, with lighter weight and thinner thicknesses.

[0160] (ii) To achieve this thinning, the folding area FA is folded so that its cross section is not U-shaped but rather teardrop-shaped or Ω-shaped (a "dumbbell shape" as shown in Figure 4 of the present application). In other words, a hinge structure that folds in this way is adopted.

[0161] (iii) On the other hand, it is common to attach a digitizer (DG1, DG2) to the back of a flexible display panel so that input can be made using a pressure-sensitive or electromagnetic induction method using a stylus pen. Here, since making the digitizers (DG1, DG2) flexible can cause problems such as increased costs, they are usually attached to the flat parts (non-folding areas NFA1, NFA2) on the left and right sides of the folding part (folding area FA).

[0162] (iv) According to Patent Document 1, support plates (support members SPM1 and SPM2 in the present application; plate members FLT, PLT1 to 6 in Cited Document 1) are attached to support the left and right digitizers (DG1 and DG2) from the front and back sides, respectively. Furthermore, an opening pattern such as a slit pattern (opening pattern OPP of the present application; pattern portion FLT_P of the cited document 1) is formed on the support plate (support member SPM1 of the present application; FLT of the cited document 1) on the front side (display panel side) to form the bending portion.

[0163] (v) In the example shown in Figures 9 and 10 of Patent Document 1, it is proposed to attach a connecting member (CM) to connect the left and right support plates (plate members FLT, PLT1 to PLT6) in a folded state so as to cover the folded parts. Here, this connecting member (CM) is made of a flexible material and is designed to narrow (shrink) in the width direction when the display panel and the plate-shaped mobile device are unfolded.

[0164] The present applicant has worked to further improve the display panel and mobile device as disclosed in Patent Document 1, and has found the following problems (a) and (b).

[0165] (a) A separate member for the folding portion (folding area FA) and a process for assembling this member are required. (b) In particular, when electromagnetic shielding is performed from the rear side, it is necessary to arrange a separate electromagnetic shielding plate on the connecting member (CM).

[0166] In a specific embodiment of the present application, A6 to A8 are provided on the premise of A1 to A4 or A1 to A5 below.

[0167] A1: A front support plate (support member SPM1) is attached to the back surface of the display panel (DP). The front support plate (support member SPM1) has a number of slits or mesh-like opening patterns (OPP) at the center of the folding area (FA) to facilitate folding.

[0168] A1-1 The front support plate (support member SPM1) can be a fiber reinforced resin plate such as carbon fiber reinforced plastic (CFRP) or glass fiber reinforced plastic (GFRP). A1-2 The contour of the front support plate (support member SPM1) may be substantially the same as the contour of the display panel (DP).

[0169] A2 The left and right digitizers (DG1, DG2) are attached to the rear surface of the front support plate (support member SPM1) so as to sandwich the center of the folding area (FA). A2-1 A small gap (g1) is formed between the left and right digitizers (DG1, DG2) when the display panel (DP) is unfolded.

[0170] A3 Electromagnetic shielding plates (first shielding layer SDL1 and second shielding layer SDL2 of the shielding member SDM) are attached to the rear surfaces of the left and right digitizers (DG1, DG2), respectively.

[0171] A3-1 These electromagnetic shielding plates (SDL1, SDL2) are designed to absorb electromagnetic noise generated by the digitizers (DG1, DG2) and can be formed as resin plates with magnetic metal powder dispersed in them. A3-2 In the example shown, the left and right electromagnetic shielding plates (SDL1, SDL2) have outlines that roughly match those of the corresponding digitizers (DG1, DG2).

[0172] A4 Metal plates (first electromagnetic wave shielding layer ESL1 and second electromagnetic wave shielding layer ESL2 of the electromagnetic wave shielding member ESM) are placed on the back side of the left and right electromagnetic shielding plates (SDL1, SDL2) respectively to "shield against electromagnetic interference (EMI) that reduces the electronic pen sensing sensitivity" of the digitizer and to perform heat dissipation functions. A4-1 The left and right metal plates (ESL1, ESL2) can be formed of a metal or alloy selected from copper (Cu), silver (Ag) and nickel (Ni).

[0173] A5 Rear support plates (SPL1, SPL2) can be attached to the rear surfaces of the left and right metal plates (ESL1, ESL2), respectively, with adhesive members (ADL1, ADL2) sandwiched therebetween.

[0174] A5-1 Like the front support plate (support member SPM1), the rear support plates (SPL1, SPL2) can be fiber-reinforced resin plates such as carbon fiber reinforced plastic (CFRP) or glass fiber reinforced plastic (GFRP).

[0175] A6 Between the left and right metal plates (ESL1, ESL2), a gap (g2) having a width approximately corresponding to the folding area FA is provided.

[0176] A7 A connecting member (CM) is provided in a gap (g2) formed between the left and right metal plates (ESL1, ESL2) or between the left and right metal plates (ESL1, ESL2) and the rear support plate (SPL1, SPL2).

[0177] A7-1 The left and right contours of the connection member (CM) may be positioned slightly apart from the contours of the left and right metal plates (ESL1, ESL2), i.e., slightly apart from both edges of the folding portion (folding area FA). A7-2 The connecting members (CM) are attached to the lower surfaces of the left and right rear support plates (SPL1, SPL2) within the folding portions (folding areas FA) via the left and right adhesive sheets (ADS1, ADS2).

[0178] A8 The connecting member (CM) can be formed from a metal sheet (electromagnetic wave shielding sheet ESS) that is cut out from the same raw sheet from which the left and right metal plates (ESL1, ESL2) are cut out. A8-1 A support sheet (SPS) can be laminated on the back of the metal sheet (electromagnetic wave shielding sheet ESS) of the connecting member (CM), which is manufactured by cutting out from the same original sheet as the back support plate (SPL1, SPL2). [Explanation of symbols]

[0179] DD display device DP display panel FA folding region NFA1 first unfolded region NFA2 second unfolded region ST set parts SPM1 First support member DGM Digitizer Parts SDM shielding material ESM electromagnetic wave shielding material ADM adhesive material SPM2 Second Support Member CM connection material ESS electromagnetic wave shielding sheet SPS Support Sheet

Claims

1. A display panel; a digitizer member disposed below the display panel; a shielding member disposed below the digitizer member; a first electromagnetic wave shielding layer disposed below the shielding member; a second electromagnetic wave shielding layer disposed below the shielding member and spaced apart from the first electromagnetic wave shielding layer; a connecting member disposed below the shielding member, between the first electromagnetic wave shielding layer and the second electromagnetic wave shielding layer, the connecting member including an electromagnetic wave shielding sheet.

2. The shielding member is a first shielding layer overlapping the first electromagnetic wave shielding layer; The display device of claim 1 , further comprising: a second shielding layer overlapping the second electromagnetic wave shielding layer and spaced apart from the first shielding layer.

3. The display device according to claim 2 , wherein the connecting member connects the first shielding layer and the second shielding layer to each other.

4. The display device according to claim 3 , wherein the connection member is attached to each of the first shielding layer and the second shielding layer.

5. The display device of claim 2 , wherein the first shielding layer and the second shielding layer are integrally formed and are entirely made of the same material.

6. The digitizer member a first digitizer overlying the first shielding layer; The display device of claim 2 , further comprising: a second digitizer overlapping the second shielding layer and spaced apart from the first digitizer.

7. the first shielding layer entirely overlaps the first digitizer; The display device of claim 6 , wherein the second shielding layer entirely overlaps the second digitizer.

8. The display device according to claim 1 , wherein the electromagnetic wave shielding sheet contains at least one of copper, silver, and nickel.

9. The display device of claim 8 , wherein the electromagnetic wave shielding sheet includes the same material as the first electromagnetic wave shielding layer and the second electromagnetic wave shielding layer.

10. The display device according to claim 1 , wherein the shielding member includes a magnetic metal powder.

11. The connecting member is The display device according to claim 1 , further comprising a support sheet disposed below the electromagnetic wave shielding sheet.

12. The display device of claim 11 , wherein the support sheet comprises a metal.

13. a display panel including a first non-folding area, a second non-folding area, and a folding area between the first non-folding area and the second non-folding area; a first digitizer disposed below the display panel; a second digitizer disposed below the display panel and spaced apart from the first digitizer in a first direction; a first shielding layer disposed below the first digitizer; a second shielding layer disposed below the second digitizer and spaced apart from the first shielding layer in the first direction; a first electromagnetic wave shielding layer disposed below the first shielding layer; a second electromagnetic wave shielding layer disposed below the second shielding layer and spaced apart from the first electromagnetic wave shielding layer in the first direction; a connecting member disposed below the first shielding layer and the second shielding layer, disposed between the first electromagnetic wave shielding layer and the second electromagnetic wave shielding layer, connecting the first shielding layer and the second shielding layer to each other, overlapping the folding region, and including an electromagnetic wave shielding sheet.

14. the first digitizer overlaps the first non-folding area and at least a portion of the folding area; The display device of claim 13 , wherein the second digitizer overlaps the second non-folding area and at least a portion of the folding area.

15. the first shielding layer overlaps the first non-folding region and at least a portion of the folding region; The display device of claim 14 , wherein the second shielding layer overlaps the second non-folding region and at least a portion of the folding region.

16. the first electromagnetic wave shielding layer overlaps the first non-folding region; The display device of claim 15 , wherein the second electromagnetic wave shielding layer overlaps the second non-folding region.

17. 17. The display device of claim 16, wherein the gap between the first shielding layer and the second shielding layer spaced apart in the first direction overlaps the folding region and has a width smaller than that of the folding region.

18. 17. The display device of claim 16, wherein a gap between the first electromagnetic wave shielding layer and the second electromagnetic wave shielding layer spaced apart in the first direction is wider than a gap between the first shielding layer and the second shielding layer spaced apart in the first direction.

19. The display device according to claim 18 , wherein the electromagnetic wave shielding sheet is disposed in the gap between the first electromagnetic wave shielding layer and the second electromagnetic wave shielding layer.

20. The display device of claim 13 , wherein the electromagnetic wave shielding sheet overlaps the first electromagnetic wave shielding layer and the second electromagnetic wave shielding layer in the first direction.

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