Magnetic sensor chip and magnetic sensor module

Abstract

To provide a magnetic sensor chip allowing a user to easily perform an operation check of the magnetic sensor chip.SOLUTION: A magnetic sensor chip 10 includes: a detection coil 30 arranged in an X direction as an axial direction; a detection terminal 50 used for detecting an induced voltage generated by the detection coil 30; a test coil 40 arranged at a position spaced from the detection coil 30; and a test terminal 60 used for allowing a test current to flow in the test coil 40. The test coil 40 is arranged at a position at which an induced voltage is generated in the detection coil 30 when a test current flows in the test coil 40.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a magnetic sensor chip and a magnetic sensor module. [Background technology]

[0002] Patent Document 1 discloses a magnetic sensor module including a Hall element, a conductive support member that supports the Hall element, and a sealing resin that covers the Hall element. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2017-120204

[0004] [overview] When checking the operation of the sensor in a magnetic sensor chip, it is necessary to use a measuring device such as a Helmholtz coil that generates a constant magnetic field. Such a measuring device may become large depending on the size of the magnetic sensor chip.

[0005] A magnetic sensor chip according to one embodiment of the present disclosure includes a detection coil arranged with a first direction as its axial direction, a detection terminal used to detect an induced voltage generated by the detection coil, a test coil arranged at a position spaced apart from the detection coil, and a test terminal used to pass a test current through the test coil, wherein the test coil is arranged at a position where the induced voltage is generated in the detection coil when the test current flows through the test coil. [Brief explanation of the drawings]

[0006] [Figure 1] FIG. 1 is a schematic perspective view of an example of an exemplary magnetic sensor chip according to the first embodiment. [Figure 2] FIG. 2 is a schematic plan view of the magnetic sensor chip of FIG. [Figure 3]FIG. 3 is a schematic cross-sectional view of the magnetic sensor chip taken along line F3-F3 in FIG. [Figure 4] FIG. 4 is a schematic cross-sectional view of the magnetic sensor chip taken along line F4-F4 in FIG. [Figure 5] FIG. 5 is a schematic plan view showing an enlarged view of the first coil portion of the detection coil and its periphery in the magnetic sensor chip of FIG. [Figure 6] FIG. 6 is a schematic plan view showing an enlarged view of the second coil portion of the detection coil and its periphery in the magnetic sensor chip of FIG. [Figure 7] FIG. 7 is a schematic plan view showing an enlarged view of the test coil and its periphery in the magnetic sensor chip of FIG. [Figure 8] FIG. 8 is a schematic cross-sectional view of the magnetic sensor chip taken along line F8-F8 in FIG. [Figure 9] FIG. 9 is a schematic plan view of the internal structure of a magnetic sensor module including a magnetic sensor chip. [Figure 10] FIG. 10 is a schematic cross-sectional view of the magnetic sensor module taken along line F10-F10 in FIG. [Figure 11] FIG. 11 is a schematic plan view of an example of an illustrative magnetic sensor chip according to the second embodiment. [Figure 12] FIG. 12 is a graph showing the relationship between test current and magnetic field strength. [Figure 13] FIG. 13 is a schematic plan view of an example of an illustrative magnetic sensor chip according to the third embodiment. [Figure 14] FIG. 14 is a schematic perspective view of an example of an illustrative magnetic sensor chip according to the fourth embodiment. [Figure 15] FIG. 15 is a schematic plan view of the magnetic sensor chip of FIG. [Figure 16] FIG. 16 is a schematic cross-sectional view of the magnetic sensor chip taken along line F16-F16 in FIG. [Figure 17] FIG. 17 is a schematic cross-sectional view of the magnetic sensor chip taken along line F17-F17 in FIG. [Figure 18]FIG. 18 is a schematic perspective view of an example of an illustrative magnetic sensor chip according to the fifth embodiment. [Figure 19] FIG. 19 is a schematic plan view of the magnetic sensor chip of FIG. [Figure 20] FIG. 20 is a schematic cross-sectional view of the magnetic sensor chip taken along line F20-F20 in FIG. [Figure 21] FIG. 21 is a schematic cross-sectional view of the magnetic sensor chip taken along line F21-F21 in FIG. [Figure 22] FIG. 22 is a schematic plan view of a magnetic sensor chip according to a modified example. [Figure 23] FIG. 23 is a schematic cross-sectional view of the magnetic sensor chip taken along line F23-F23 in FIG. [Figure 24] FIG. 24 is a schematic cross-sectional view of a magnetic sensor chip according to a modified example. [Figure 25] FIG. 25 is a schematic cross-sectional view of a magnetic sensor chip according to a modified example. [Figure 26] FIG. 26 is a schematic plan view of a magnetic sensor chip according to a modified example. [Figure 27] FIG. 27 is a schematic cross-sectional view of a magnetic sensor chip according to a modified example.

[0007] [Detailed explanation] Hereinafter, several embodiments of the magnetic sensor chip and magnetic sensor module of the present disclosure will be described with reference to the accompanying drawings. Note that for simplicity and clarity of explanation, the components shown in the drawings are not necessarily drawn to scale. Also, for ease of understanding, hatching lines may be omitted in cross-sectional views. The accompanying drawings merely illustrate embodiments of the present disclosure and should not be considered as limiting the present disclosure.

[0008] The following detailed description includes devices, systems, and methods embodying exemplary embodiments of the present disclosure. This detailed description is merely illustrative in nature and is not intended to limit the embodiments of the present disclosure or the application and uses of such embodiments.

[0009] Terms such as "first," "second," and "third" are used in this disclosure merely to label and are not necessarily intended to dictate any ordering of their objects. The phrase "at least one" used in this disclosure means "one or more" of the desired options. As an example, the phrase "at least one" used in this disclosure means "only one option" or "both of two options" when the number of options is two. As another example, the phrase "at least one" used in this disclosure means "only one option" or "any combination of two or more options" when the number of options is three or more.

[0010] As used in this disclosure, "the dimensions (width, length) of A are equal to the dimensions (width, length) of B" or "the dimensions (width, length) of A and the dimensions (width, length) of B are equal to each other" also includes a relationship in which the difference between the dimensions (width, length) of A and the dimensions (width, length) of B is, for example, within 10% of the dimensions (width, length) of A.

[0011] First Embodiment [Overall configuration of the magnetic sensor chip] The overall configuration of the magnetic sensor chip 10 of the first embodiment will be described with reference to FIGS. 1 to 4. FIG. 1 schematically shows a perspective view of the magnetic sensor chip 10 of the first embodiment. FIG. 2 schematically shows a planar structure of the magnetic sensor chip 10 of FIG. 1. FIG. 3 schematically shows a cross-sectional structure of the magnetic sensor chip 10 taken along line F3-F3 in FIG. 2. FIG. 4 schematically shows a cross-sectional structure of the magnetic sensor chip 10 taken along line F4-F4 in FIG. 2. In FIG. 1, an insulating member 70 (described later) is indicated by a two-dot chain line to facilitate understanding of the drawings. In addition, in FIGS. 2 to 4, the insulating member 70 is indicated by dots to facilitate understanding of the drawings.

[0012] As shown in FIGS. 1 and 2, the magnetic sensor chip 10 includes a substrate 20, and a detection coil 30, a test coil 40, a detection terminal 50, a test terminal 60, and an insulating member 70 provided on the substrate 20.

[0013] The substrate 20 is a rectangular flat plate with its thickness aligned in the Z direction. In the following description, two mutually orthogonal directions perpendicular to the Z direction are referred to as the "X direction" and the "Y direction." Furthermore, "plan view" refers to viewing the magnetic sensor chip 10 from the Z direction.

[0014] The substrate 20 has a rectangular shape with its longer sides in the X direction and its shorter sides in the Y direction in a plan view. The substrate 20 includes a substrate front surface 21, a substrate back surface 22 opposite the substrate front surface 21, and first to fourth substrate side surfaces 23 to 26 as four substrate side surfaces connecting the substrate front surface 21 and the substrate back surface 22. In the first embodiment, both the substrate front surface 21 and the substrate back surface 22 are flat surfaces perpendicular to the Z direction. The first substrate side surface 23 and the second substrate side surface 24 constitute both end surfaces of the substrate 20 in the X direction. The third substrate side surface 25 and the fourth substrate side surface 26 constitute both end surfaces of the substrate 20 in the Y direction.

[0015] The substrate 20 is composed of a substrate body 27 and an insulating film 28. The substrate body 27 is composed of, for example, a semiconductor substrate. The insulating film 28 is a coating having electrical insulating properties. The substrate 20 may also be composed of an insulating resin or ceramic.

[0016] The substrate body 27 is a substrate made of a material containing Si (silicon). In one example, the substrate body 27 is a Si substrate. The substrate body 27 may use a wide bandgap semiconductor or a compound semiconductor as a semiconductor substrate. The wide bandgap semiconductor may be SiC (silicon carbide). The compound semiconductor may be a III-V compound semiconductor. The compound semiconductor may contain at least one of AlN (aluminum nitride), InN (indium nitride), GaN (gallium nitride), and GaAs (gallium arsenide). Alternatively, the substrate body 27 may be an insulating substrate made of a material containing glass, instead of a semiconductor substrate. Alternatively, the substrate body 27 may be a substrate made of a synthetic resin mainly containing epoxy resin or the like.

[0017] The insulating film 28 is made of, for example, SiO2 (silicon oxide). The insulating film 28 is formed by thermally oxidizing the substrate body 27, which is, for example, a Si substrate. The material constituting the insulating film 28 and the method for forming it are not limited. For example, the insulating film 28 may be made of a material containing SiO2 and resin. Alternatively, the insulating film 28 may be made of SiN (silicon nitride), AlN (aluminum nitride), or the like. Alternatively, the insulating film 28 may be made of resin.

[0018] The insulating film 28 is provided on the surface of the substrate main body 27. Therefore, the insulating film 28 forms the substrate surface 21. The back surface of the substrate main body 27 forms the substrate back surface 22. The first to fourth substrate side surfaces 23 to 26 are formed by the side surfaces of the substrate main body 27 and the side surfaces of the insulating film 28.

[0019] A detection coil 30, a test coil 40, a detection terminal 50, a test terminal 60, and an insulating member 70 are provided on the substrate surface 21 formed by the insulating film 28. The detection coil 30 is used to detect magnetism in the magnetic sensor chip 10. The test coil 40 generates a magnetic field by passing a test current through the test coil 40. The detection coil 30 detects the magnetism of the magnetic field of the test coil 40.

[0020] The detection coil 30, the test coil 40, and the insulating member 70 are arranged on the substrate surface 21 of the substrate 20, closer to the fourth substrate side surface 26. The test coil 40 is arranged at a position spaced apart from the detection coil 30. Specifically, the test coil 40 is arranged at a position where an induced voltage is generated in the detection coil 30 when a test current flows through the test coil 40. In one example, the test coil 40 is arranged at a position spaced apart from the detection coil 30 in the X direction. Here, the X direction corresponds to the "first direction."

[0021] The detection coil 30 is disposed with its axis in the X direction. The detection coil 30 includes a first coil section 30A and a second coil section 30B that are electrically connected to each other. The first coil section 30A and the second coil section 30B are disposed at the same position in the Y direction and spaced apart from each other in the X direction. In a plan view, the first coil section 30A is disposed closer to the first substrate side surface 23 than the second coil section 30B.

[0022] In the first embodiment, the test coil 40 is disposed between the first coil section 30A and the second coil section 30B in the X direction. That is, the first coil section 30A, the second coil section 30B, and the test coil 40 are arranged in the X direction. Both the first coil section 30A and the second coil section 30B are disposed with their axes aligned in the X direction. The axis J1 of the first coil section 30A and the axis J2 of the second coil section 30B are coaxial. In the first embodiment, the test coil 40 is disposed with its axis aligned in the X direction. The axis JB of the test coil 40 is coaxial with the axis JA of the detection coil 30.

[0023] 2 and 3, the insulating member 70 is provided so as to penetrate the detection coil 30 and the test coil 40 in the X direction. The insulating member 70 has a strip shape extending in the X direction. As shown in FIG. 4, the insulating member 70 is in contact with the substrate surface 21 of the substrate 20. The insulating member 70 is provided so as to bulge in the direction away from the substrate surface 21 in the Z direction. In one example, the cross-sectional shape of the insulating member 70 in a plane (YZ plane) perpendicular to the X direction is an arc bulging in the direction away from the substrate surface 21. The insulating member 70 is made of, for example, phenolic resin, polyimide resin, epoxy resin, etc.

[0024] The detector coil 30 and the test coil 40 are disposed at positions overlapping the insulating member 70 in a plan view. A portion of each of the detector coil 30 and the test coil 40 is covered by the insulating member 70. Another portion of each of the detector coil 30 and the test coil 40 is provided on the insulating member 70. In this way, the detector coil 30 and the test coil 40 are provided so as to surround the insulating member 70 when viewed from the X direction.

[0025] The detection terminal 50 and the test terminal 60 are disposed on the substrate surface 21 of the substrate 20, closer to the third substrate side surface 25. Therefore, it can be said that both the detection terminal 50 and the test terminal 60 are disposed spaced apart in the Y direction from the test coil 40 and the detection coil 30. Here, the Y direction corresponds to the "second direction." The detection terminal 50 and the test terminal 60 are disposed spaced apart from each other in the X direction.

[0026] The detection terminal 50 is used to detect the induced voltage generated by the detection coil 30. The detection terminal 50 is electrically connected to the detection coil 30. The test terminal 60 is used to apply a test current to the test coil 40. The test terminal 60 is electrically connected to the test coil 40.

[0027] In the magnetic sensor chip 10 described above, when a test current flows through the test terminal 60, the test current flows through the test terminal 60 to the test coil 40. As a result, a magnetic field is generated in the test coil 40. The magnetic field of the test coil 40 generates an induced voltage in the detection coil 30. The induced voltage in the detection coil 30 is detected at the detection terminal 50.

[0028] Each component of the magnetic sensor chip 10 will be described in detail below with reference to Figs. 1 to 7. Fig. 5 is a schematic diagram showing an enlarged planar structure of the first coil portion 30A of the detection coil 30 and its periphery in Fig. 2. Fig. 6 is a schematic diagram showing an enlarged planar structure of the second coil portion 30B of the detection coil 30 and its periphery in Fig. 2. Fig. 7 is a schematic diagram showing an enlarged planar structure of the test coil 40 and its periphery in Fig. 2.

[0029] [Detection coil] As shown in FIGS. 5 and 6, both the first coil section 30A and the second coil section 30B of the detection coil 30 include a plurality of first detection wires 31 and a plurality of second detection wires 32. Each of the first detection wires 31 and each of the second detection wires 32 is made of a conductive metal such as copper (Cu), a Cu alloy, aluminum (Al), or an Al alloy. In one example, the first detection wires 31 and the second detection wires 32 are made of the same material. In the first embodiment, the number of turns of the first coil section 30A and the number of turns of the second coil section 30B are equal to each other. The winding direction of the first coil section 30A and the winding direction of the second coil section 30B are the same.

[0030] The plurality of first detection wirings 31 are provided on the substrate surface 21 of the substrate 20. The plurality of first detection wirings 31 are arranged at intervals in the X direction. In one example, the plurality of first detection wirings 31 are arranged at equal intervals in the X direction. Each of the first detection wirings 31 extends in a direction intersecting the X direction in a plan view. More specifically, each of the first detection wirings 31 extends in a direction intersecting both the X direction and the Y direction in the planar direction of the substrate surface 21 in a plan view. Most of each of the first detection wirings 31 is covered by an insulating member 70.

[0031] Each first detection wiring 31 includes a first end 31A, a second end 31B opposite to the first end 31A, and a first conductor portion 31C between the first end 31A and the second end 31B. Both the first end 31A and the second end 31B have a rectangular shape with a short side in the X direction and a long side in the Y direction in a plan view. Both the first end 31A and the second end 31B are exposed from the insulating member 70. The first end 31A is disposed closer to the detection terminal 50 (see FIG. 2) than the second end 31B.

[0032] The first ends 31A of the multiple first detection wirings 31 are each arranged so as to be shifted in the X direction relative to the second ends 31B in a plan view. Each first end 31A is arranged in the X direction between the second ends 31B that are adjacent to each other in the X direction in a plan view.

[0033] The first conductor portion 31C connects the first end portion 31A and the second end portion 31B, and therefore extends at a predetermined angle with respect to the Y direction in plan view. As shown in FIG. 2, the first conductor portion 31C of the first detection wiring 31 in the first coil portion 30A is inclined so as to approach the test coil 40 from the second end portion 31B toward the first end portion 31A in plan view. The first conductor portion 31C of the first detection wiring 31 in the second coil portion 30B is inclined so as to approach the test coil 40 from the first end portion 31A toward the second end portion 31B in plan view. The inclination directions of the first conductor portion 31C of the first coil portion 30A and the first conductor portion 31C of the second coil portion 30B are the same. In the first embodiment, the inclination angles of the first conductor portion 31C of the first coil portion 30A and the first conductor portion 31C of the second coil portion 30B are equal to each other. Here, the tilt angle of the first conductor 31C can be defined, for example, by the angle formed between the direction in which the first conductor 31C extends and the Y direction in a plan view. Each first conductor 31C is covered with an insulating member 70. As shown in Fig. 3, the insulating member 70 contacts the top surface and side surfaces of each first conductor 31C.

[0034] 5 and 6, the second detection wirings 32 are arranged spaced apart from one another in the X direction. In one example, the second detection wirings 32 are arranged at equal intervals in the X direction. Each second detection wiring 32 extends in a direction that intersects with the X direction in a plan view. More specifically, each second detection wiring 32 extends in a direction that intersects with both the X direction and the Y direction and is perpendicular to the Z direction in a plan view.

[0035] As shown in FIG. 4 , each second detection wiring 32 is in contact with an insulating member 70. Each second detection wiring 32 is provided on the insulating member 70. More specifically, each second detection wiring 32 extends along the surface of the insulating member 70, whose cross section in a plane (YZ plane) perpendicular to the X direction is arc-shaped. Therefore, the central portion of each second detection wiring 32 is provided so as to be separated in the Z direction from each first detection wiring 31 by the insulating member 70. Each second detection wiring 32 is connected to two first detection wirings 31 adjacent to each other in the X direction. More specifically, each second detection wiring 32 connects a first end 31A of one first detection wiring 31 to a second end 31B of the other first detection wiring 31 of two first detection wirings 31 adjacent to each other in the X direction.

[0036] As shown in Figures 5 and 6, each of the multiple second detection wirings 32 includes a third end 32A, a fourth end 32B opposite the third end 32A, and a second conductor portion 32C between the third end 32A and the fourth end 32B.

[0037] Both the third end 32A and the fourth end 32B have a rectangular shape with a short side in the X direction and a long side in the Y direction in a plan view. The third end 32A is disposed closer to the detection terminal 50 (see FIG. 2) than the fourth end 32B.

[0038] The third ends 32A of the multiple second detection wirings 32 are arranged so as to be shifted in the X direction relative to the fourth ends 32B in plan view. Each third end 32A is arranged in the X direction between the fourth ends 32B that are adjacent to each other in the X direction in plan view.

[0039] The third end 32A of the second detection wiring 32 is connected to the first end 31A of the first detection wiring 31. The fourth end 32B of the second detection wiring 32 is connected to the second end 31B of the first detection wiring 31 adjacent to the first detection wiring 31 to which the third end 32A is connected. In other words, the multiple second detection wirings 32 are each connected between two first detection wirings 31 adjacent to each other in the X direction.

[0040] The second conductor portion 32C connects the third end portion 32A and the fourth end portion 32B. Therefore, the second conductor portion 32C extends at a predetermined angle with respect to the Y direction in a plan view. As shown in FIG. 5, the second conductor portion 32C of the second detection wiring 32 in the first coil portion 30A is inclined from the fourth end portion 32B toward the third end portion 32A in a plan view so as to move away from the test coil 40. As shown in FIG. 6, the second conductor portion 32C of the second detection wiring 32 in the second coil portion 30B is inclined from the fourth end portion 32B toward the third end portion 32A in a plan view so as to move closer to the test coil 40. As shown in FIGS. 5 and 6, the inclination directions of the second conductor portion 32C of the first coil portion 30A and the second conductor portion 32C of the second coil portion 30B are the same. In the first embodiment, the inclination angles of the second conductor portion 32C of the first coil portion 30A and the second conductor portion 32C of the second coil portion 30B are equal to each other. Here, the inclination angle of the second conductor portion 32C can be defined by, for example, the angle between the direction in which the second conductor portion 32C extends in a plan view and the Y direction. In the first embodiment, the inclination angle of the second conductor portion 32C of the first coil portion 30A and the second conductor portion 32C of the second coil portion 30B is equal to the inclination angle of the first conductor portion 31C of the first coil portion 30A and the first conductor portion 31C of the second coil portion 30B.

[0041] The width of the second detection wiring 32 is narrower than the width of the first detection wiring 31. Here, the width of the first detection wiring 31 can be defined by the dimension in a direction perpendicular to the extension direction of the first detection wiring 31 in a plan view. The width of the second detection wiring 32 can be defined by the dimension in a direction perpendicular to the extension direction of the second detection wiring 32 in a plan view.

[0042] The width W13 of the third end 32A of the second detection wiring 32 is narrower than the width W11 of the first end 31A of the first detection wiring 31. The length L13 of the third end 32A is shorter than the length L11 of the first end 31A. Similarly, the width W14 of the fourth end 32B of the second detection wiring 32 is narrower than the width W12 of the second end 31B of the first detection wiring 31. The length L14 of the fourth end 32B is shorter than the length L12 of the second end 31B.

[0043] In one example, the width W11 of the first end 31A is equal to the width W12 of the second end 31B. In one example, the length L12 of the first end 31A is equal to the length L12 of the second end 31B. In one example, the width W13 of the third end 32A is equal to the width W14 of the fourth end 32B. In one example, the length L13 of the third end 32A is equal to the length L14 of the fourth end 32B. In one example, the width of the first conductor portion 31C is equal to the width W11 of the first end 31A and the width W12 of the second end 31B. In one example, the width of the second conductor portion 32C is equal to the width W13 of the third end 32A and the width W14 of the fourth end 32B.

[0044] The width of the first conductor portion 31C can be changed arbitrarily. For example, the width of the first conductor portion 31C may be different from the width W11 of the first end portion 31A and the width W12 of the second end portion 31B. The width of the second conductor portion 32C can be changed arbitrarily. For example, the width of the second conductor portion 32C may be different from the width W13 of the third end portion 32A and the width W14 of the fourth end portion 32B.

[0045] 2, the magnetic sensor chip 10 includes a coil connection wiring 80 provided on the substrate surface 21 of the substrate 20. The coil connection wiring 80 is provided on the insulating film 28. The coil connection wiring 80 is made of a conductive metal such as Cu, a Cu alloy, Al, or an Al alloy. In one example, the coil connection wiring 80 is made of the same material as the first detection wiring 31 and the second detection wiring 32.

[0046] The coil connection wiring 80 electrically connects the first coil section 30A and the second coil section 30B. The coil connection wiring 80 is connected to the first detection wiring 31 of the first coil section 30A and the first detection wiring 31 of the second coil section 30B. The coil connection wiring 80 connects an end of the first coil section 30A opposite the test coil 40 in the X direction to an end of the second coil section 30B opposite the test coil 40 in the X direction. More specifically, the coil connection wiring 80 is connected to a first detection wiring 31D at an end opposite the test coil 40 among the multiple first detection wirings 31 arranged in the X direction in the first coil section 30A. The coil connection wiring 80 is connected to a first detection wiring 31E at an end opposite the test coil 40 among the multiple first detection wirings 31 arranged in the X direction in the second coil section 30B. The coil connection wiring 80 is connected to a second end 31B of the first detection wiring 31D. The coil connecting wiring 80 is connected to the second end 31B of the first detection wiring 31E. In one example, the coil connecting wiring 80 is integrated with the first detection wirings 31D and 31E.

[0047] The coil connection wiring 80 is arranged on the opposite side of the test terminal 60 and the detection terminal 50 with respect to the test coil 40 and the detection coil 30 in the Y direction. The coil connection wiring 80 includes a first connection portion 81, a second connection portion 82, and a third connection portion 83.

[0048] The first connection portion 81 is a portion that is connected to the first detection wiring 31D. The first connection portion 81 extends in the Y direction from the second end portion 31B of the first detection wiring 31D toward the fourth substrate side surface 26 in a plan view. In one example, the width of the first connection portion 81 is equal to the width W12 of the second end portion 31B of the first detection wiring 31. Here, the width of the first connection portion 81 can be defined by the dimension in a direction perpendicular to the direction in which the first connection portion 81 extends in a plan view.

[0049] The second connection portion 82 is a portion that is connected to the first detection wiring 31E. The second connection portion 82 extends in the Y direction from the second end portion 31B of the first detection wiring 31E toward the fourth substrate side surface 26 in a plan view. In one example, the length of the second connection portion 82 in the Y direction is equal to the length of the first connection portion 81 in the Y direction. In one example, the width of the second connection portion 82 is equal to the width W12 of the second end portion 31B of the first detection wiring 31. Therefore, the width of the second connection portion 82 is equal to the width of the first connection portion 81. Here, the width of the second connection portion 82 can be defined by the dimension in a direction perpendicular to the direction in which the second connection portion 82 extends in a plan view. Here, the width of the third connection portion 83 can be defined by the dimension in a direction perpendicular to the direction in which the third connection portion 83 extends in a plan view.

[0050] The third connection portion 83 is a portion that connects the first connection portion 81 and the second connection portion 82. The third connection portion 83 is disposed closer to the fourth substrate side surface 26 and spaced apart in the Y direction from the detection coil 30 and the test coil 40. The third connection portion 83 extends in the X direction. In one example, the width of the third connection portion 83 is greater than the width of the first connection portion 81 and the width of the second connection portion 82.

[0051] The widths of the first to third connecting portions 81 to 83 can be changed as desired. For example, the width of the first connecting portion 81 may be larger than the width W12 of the second end 31B of the first detection wiring 31. For example, the width of the second connecting portion 82 may be larger than the width W12 of the second end 31B of the first detection wiring 31. For example, the width of the third connecting portion 83 may be equal to the width of the first connecting portion 81. For example, the width of the third connecting portion 83 may be equal to the width of the second connecting portion 82.

[0052] The first coil section 30A includes a first end 30AA and a second end 30AB. The first end 30AA is the end of the first coil section 30A on the test coil 40 side in the X direction. The second end 30AB is the end of the first coil section 30A on the opposite side of the test coil 40 in the X direction. The first end 30AA is formed by the first end 31A of the first detection wiring 31F on the test coil 40 side among the multiple first detection wirings 31 of the first coil section 30A. The second end 30AB is formed by the second end 31B of the first detection wiring 31D on the opposite side of the test coil 40 among the multiple first detection wirings 31 of the first coil section 30A. Therefore, it can be said that the first connection portion 81 of the coil connection wiring 80 is connected to the second end 30AB of the first coil section 30A. The first connection portion 81 is a portion extending from the second end 31B of the first detection wiring 31D toward the fourth substrate side surface 26 (see FIG. 2). Therefore, the first connection portion 81 is located closer to the fourth substrate side surface 26 than the second end portion 31B of the first detection wiring 31.

[0053] The second coil section 30B includes a first end 30BA and a second end 30BB. The first end 30BA is the end of the second coil section 30B on the test coil 40 side in the X direction. The second end 30BB is the end of the second coil section 30B on the opposite side from the test coil 40 in the X direction. The first end 30BA is formed by a first end 31A of a first detection wiring 31G on the test coil 40 side of the multiple first detection wirings 31 of the second coil section 30B. The second end 30BB is formed by a first end 31A of a first detection wiring 31E on the opposite side from the test coil 40 of the multiple first detection wirings 31 of the second coil section 30B. Therefore, it can be said that the second connection portion 82 of the coil connection wiring 80 is connected to the second end 30BB of the second coil section 30B.

[0054] [Test coil] 7, in the first embodiment, the number of turns of the test coil 40 is 1. That is, the number of turns of the test coil 40 is less than the number of turns of the detection coil 30. The number of turns of the test coil 40 is less than the number of turns of the first coil section 30A and the number of turns of the second coil section 30B.

[0055] The test coil 40 includes a first end 40A and a second end 40B. The first end 40A is the end of the test coil 40 on the first coil section 30A side in the X direction. The second end 40B is the end of the test coil 40 on the second coil section 30B side in the X direction. The first end 40A is disposed apart from the first coil section 30A in the X direction. The second end 40B is disposed apart from the second coil section 30B in the X direction.

[0056] The test coil 40 includes two first test wires 41 and one second test wire 42. The first test wires 41 and the second test wire 42 are made of a conductive metal such as Cu, a Cu alloy, Al, or an Al alloy. In one example, the first test wires 41 and the second test wires 42 are made of the same material. In one example, the first test wires 41 and the second test wires 42 are made of the same material as the first detection wires 31 and the second detection wires 32.

[0057] The two first test wires 41 are provided on the substrate surface 21 of the substrate 20. The two first test wires 41 are arranged spaced apart from each other in the X direction. The two first test wires 41 are provided to extend in a direction intersecting the X direction in a plan view. The two first test wires 41 extend parallel to each other in a plan view. Each first test wire 41 extends parallel to the first detection wire 31 in a plan view.

[0058] The two first test wires 41 extend in a direction intersecting the X direction in a plan view. More specifically, each first test wire 41 extends in a direction intersecting both the X direction and the Y direction of the surface of the substrate surface 21 in a plan view. In one example, the spacing P3 between the two first test wires 41 is equal to the spacing P1 between the multiple first detection wires 31 in the first coil portion 30A and the spacing P2 between the multiple first detection wires 31 in the second coil portion 30B. Most of each first test wire 41 is covered with the insulating member 70.

[0059] Each first test wiring 41 includes a first end 41A, a second end 41B opposite to the first end 41A, and a first conductor portion 41C between the first end 41A and the second end 41B. Of the two first test wirings 41, the first end 41A of the first test wiring 41 closer to the first coil portion 30A constitutes the first end 40A of the test coil 40. Of the two first test wirings 41, the first end 41A of the first test wiring 41 closer to the second coil portion 30B constitutes the second end 40B of the test coil 40.

[0060] Both the first end 41A and the second end 41B have a rectangular shape with a short side in the X direction and a long side in the Y direction in a plan view. Both the first end 41A and the second end 41B are exposed from the insulating member 70. The first end 41A is disposed closer to the test terminal 60 (see FIG. 2) than the second end 41B.

[0061] The first ends 41A of the two first test wirings 41 are arranged so as to be shifted in the X direction relative to the second ends 41B in plan view. Each first end 41A is arranged in the X direction between the second ends 41B that are adjacent to each other in the X direction in plan view.

[0062] The first conductor 41C connects the first end 41A and the second end 41B, and therefore extends at a predetermined angle with respect to the Y direction in plan view. The first conductor 41C of the first test wiring 41 is inclined so as to approach the first coil 30A of the detection coil 30 as it moves from the second end 41B to the first end 41A in plan view. The inclination directions of the first conductor 41C of the first test wiring 41, the first conductor 31C of the first coil 30A, and the first conductor 31C of the second coil 30B are the same. In the first embodiment, the inclination angles of the first conductor 41C of the first test wiring 41, the first conductor 31C of the first coil 30A, and the first conductor 31C of the second coil 30B are the same. Here, the inclination angle of the first conductor 41C can be defined, for example, by the angle between the extension direction of the first conductor 41C and the Y direction in plan view. As shown in FIG. 3, the insulating member 70 contacts the upper surface and side surfaces of each first conductor portion 41C.

[0063] The second test wiring 42 extends in a direction intersecting the X direction in a plan view. More specifically, the second test wiring 42 extends in a direction perpendicular to the Z direction and intersecting both the X direction and the Y direction in a plan view. The second test wiring 42 extends parallel to the second detection wiring 32 in a plan view.

[0064] As shown in FIG. 8 , the second test wires 42 are in contact with the insulating member 70. Each second test wire 42 is provided on the insulating member 70. More specifically, each second test wire 42 extends along the surface of the insulating member 70, whose cross section in a plane (YZ plane) perpendicular to the X direction is arc-shaped. Therefore, the central portion of each second test wire 42 is provided so as to be separated in the Z direction from each first test wire 41 by the insulating member 70. Each second test wire 42 is connected to two first test wires 41. More specifically, the second test wire 42 connects a first end 41A of one first test wire 41 of the two first test wires 41 to a second end 41B of the other first test wire 41.

[0065] As shown in FIG. 7, the second test wiring 42 includes a third end 42A, a fourth end 42B opposite the third end 42A, and a second conductor portion 42C between the third end 42A and the fourth end 42B.

[0066] Both the third end 42A and the fourth end 42B are rectangular in shape with their short sides in the X direction and their long sides in the Y direction in plan view. The third end 42A is positioned closer to the test terminal 60 (see FIG. 2) than the fourth end 42B. The third end 42A is shifted in the X direction relative to the fourth end 42B in plan view.

[0067] The third end 42A of the second test wiring 42 is connected to the first end 41A of the first test wiring 41. The fourth end 42B of the second test wiring 42 is connected to the second end 41B of the first test wiring 41 adjacent to the first test wiring 41 to which the third end 42A is connected.

[0068] The second conductor portion 42C connects the third end portion 42A and the fourth end portion 42B. Therefore, the second conductor portion 42C extends at a predetermined angle with respect to the Y direction in a plan view. The second conductor portion 42C is inclined from the fourth end portion 42B toward the third end portion 42A in a plan view so as to approach the first coil portion 30A. The inclination directions of the second conductor portion 42C, the second conductor portion 32C of the first coil portion 30A, and the second conductor portion 32C of the second coil portion 30B are the same. In the first embodiment, the inclination angles of the second conductor portion 42C, the second conductor portion 32C of the first coil portion 30A, and the second conductor portion 32C of the second coil portion 30B are the same. Here, the inclination angle of the second conductor portion 42C can be defined, for example, by the angle between the extension direction of the second conductor portion 42C and the Y direction in a plan view. In the first embodiment, the inclination angle of the second conductor portion 42C is equal to the inclination angle of the first conductor portion 41C.

[0069] The width of the second test wiring 42 is narrower than the width of the first test wiring 41. Here, the width of the first test wiring 41 can be defined by the dimension in a direction perpendicular to the extension direction of the first test wiring 41 in a plan view. The width of the second test wiring 42 can be defined by the dimension in a direction perpendicular to the extension direction of the second test wiring 42 in a plan view.

[0070] The width W23 of the third end 42A of the second test wiring 42 is narrower than the width W21 of the first end 41A of the first test wiring 41. The length L23 of the third end 42A is shorter than the length L21 of the first end 41A. Similarly, the width W24 of the fourth end 42B of the second test wiring 42 is narrower than the width W22 of the second end 41B of the first test wiring 41. The length L24 of the fourth end 42B is shorter than the length L22 of the second end 41B.

[0071] In one example, the width W21 of the first end 41A is equal to the width W22 of the second end 41B. In one example, the length L21 of the first end 41A is equal to the length L22 of the second end 41B. In one example, the width W23 of the third end 42A is equal to the width W24 of the fourth end 42B. In one example, the length L23 of the third end 42A is equal to the length L24 of the fourth end 42B. In one example, the width of the first conductor portion 41C is equal to the width W21 of the first end 41A and the width W22 of the second end 41B. In one example, the width of the second conductor portion 42C is equal to the width W23 of the third end 42A and the width W24 of the fourth end 42B.

[0072] In one example, the width of the first test wiring 41 is equal to the width of the first detection wiring 31. In one example, the width W21 of the first end 41A of the first test wiring 41 is equal to the width W11 of the first end 31A of the first detection wiring 31. In one example, the width W22 of the second end 41B of the first test wiring 41 is equal to the width W12 of the second end 31B of the first detection wiring 31. In one example, the width W23 of the third end 42A of the second test wiring 42 is equal to the width W13 of the third end 32A of the second detection wiring 32. In one example, the width W24 of the fourth end 42B of the second test wiring 42 is equal to the width W14 of the fourth end 32B of the second detection wiring 32. In one example, the width of the first conductor portion 41C of the first test wiring 41 is equal to the width of the first conductor portion 31C of the first detection wiring 31. In one example, the width of the second conductor portion 42C of the second test wiring 42 is equal to the width of the second conductor portion 32C of the second detection wiring 32.

[0073] The width of the first conductor portion 41C can be changed arbitrarily. For example, the width of the first conductor portion 41C may be different from the width W21 of the first end portion 41A and the width W22 of the second end portion 41B. The width of the second conductor portion 42C can be changed arbitrarily. For example, the width of the second conductor portion 42C may be different from the width W23 of the third end portion 42A and the width W24 of the fourth end portion 42B.

[0074] [Detection and test terminals] As shown in FIG. 2 , the detection terminal 50 includes a first detection terminal 51 and a second detection terminal 52 that are spaced apart in the X direction. The first detection terminal 51 is located closer to the first substrate side surface 23 than the center of the substrate 20 in the X direction in a plan view. The first detection terminal 51 is located adjacent to the first coil unit 30A in the Y direction. The second detection terminal 52 is located closer to the second substrate side surface 24 than the center of the substrate 20 in the X direction in a plan view. The second detection terminal 52 is located adjacent to the second coil unit 30B in the Y direction. Both the first detection terminal 51 and the second detection terminal 52 are rectangular in a plan view. For example, both the first detection terminal 51 and the second detection terminal 52 are rectangular in a plan view with their short sides extending in the X direction and their long sides extending in the Y direction. For example, the first detection terminal 51 and the second detection terminal 52 have the same size and shape.

[0075] 2 and 5, the first detection terminal 51 is electrically connected to the first coil section 30A. More specifically, the first detection terminal 51 is connected to the first coil section 30A by a first connection wiring 53. The first connection wiring 53 is connected to a first end 31A of a first detection wiring 31F, which is an end of the first detection wiring 31 of the first coil section 30A that is on the test coil 40 side, among the multiple first detection wirings 31. The first connection wiring 53 is integrated with the first end 31A of the first detection wiring 31F.

[0076] 2 and 6, the second detection terminal 52 is electrically connected to the second coil section 30B. More specifically, the second detection terminal 52 is connected to the second coil section 30B by a second connection wiring 54. The second connection wiring 54 is connected to a first end 31A of a first detection wiring 31G, which is an end of the multiple first detection wirings 31 of the second coil section 30B on the test coil 40 side. The second connection wiring 54 is integrated with the first end 31A of the first detection wiring 31G.

[0077] 5 and 6, both the first connection wiring 53 and the second connection wiring 54 are provided on the substrate surface 21 of the substrate 20. The first connection wiring 53 and the second connection wiring 54 are made of a conductive metal such as Cu, a Cu alloy, Al, or an Al alloy. In one example, the first connection wiring 53 and the second connection wiring 54 are made of the same material. In one example, the first connection wiring 53 and the second connection wiring 54 are made of the same material as the first detection wiring 31 and the second detection wiring 32.

[0078] As shown in FIG. 2 , the test terminal 60 includes a first test terminal 61 and a second test terminal 62 arranged side by side in the X direction. Both the first test terminal 61 and the second test terminal 62 are arranged between the first detection terminal 51 and the second detection terminal 52 in the X direction. The first test terminal 61 is arranged between the first detection terminal 51 and the second test terminal 62 in the X direction. The second test terminal 62 is arranged between the first test terminal 61 and the second detection terminal 52 in the X direction. Both the first test terminal 61 and the second test terminal 62 are rectangular in plan view. In one example, both the first test terminal 61 and the second test terminal 62 are rectangular in plan view with the short side extending in the X direction and the long side extending in the Y direction. In one example, the first test terminal 61 and the second test terminal 62 have the same size and shape. In one example, the size and shape of the first test terminal 61 and the second test terminal 62 are the same as the first detection terminal 51 and the second detection terminal 52 .

[0079] 2 and 7, the first test terminal 61 is electrically connected to the first end 40A of the test coil 40. More specifically, the first test terminal 61 is connected to the first end 40A of the test coil 40 by a third connection wiring 63. The third connection wiring 63 is integrated with the first end 41A of the first test wiring 41 that is closer to the first coil portion 30A of the two first test wirings 41.

[0080] The second test terminal 62 is electrically connected to the second end 40B of the test coil 40. More specifically, the second test terminal 62 is connected to the second end 40B of the test coil 40 by a fourth connection wiring 64. The fourth connection wiring 64 is integrated with the first end 41A of the first test wiring 41 that is closer to the second coil portion 30B of the two first test wirings 41.

[0081] Both the third connection wiring 63 and the fourth connection wiring 64 are provided on the substrate surface 21 of the substrate 20. Both the third connection wiring 63 and the fourth connection wiring 64 are arranged between the first connection wiring 53 and the second connection wiring 54 in the X direction. The third connection wiring 63 and the fourth connection wiring 64 are made of a conductive metal such as Cu, a Cu alloy, Al, or an Al alloy. In one example, the third connection wiring 63 and the fourth connection wiring 64 are made of the same material. In one example, the third connection wiring 63 and the fourth connection wiring 64 are made of the same material as the first connection wiring 53 and the second connection wiring 54.

[0082] In one example, the plurality of first detection wires 31 of the detection coil 30, the plurality of first test wires 41 of the test coil 40, the first connection wires 53 and the second connection wires 54, the third connection wires 63 and the fourth connection wires 64, and the coil connection wires 80 are formed on the substrate surface 21 of the substrate 20 by plating. More specifically, a mask having openings corresponding to the plurality of first detection wires 31, the plurality of first test wires 41, the first connection wires 53, the second connection wires 54, the third connection wires 63, the fourth connection wires 64, and the coil connection wires 80 is formed on the substrate surface 21, and then a plating metal is deposited in the openings of the mask. The mask is formed, for example, by exposing and developing a photosensitive resist layer.

[0083] Furthermore, the plurality of second detection wires 32 of the detection coil 30 and the plurality of second test wires 42 of the test coil 40 are formed on the insulating member 70, the first detection wires 31, and the first test wires 41 by plating. More specifically, a mask having openings corresponding to the plurality of second detection wires 32 and the plurality of second test wires 42 is formed on the insulating member 70, the first end 31A and the second end 31B of the first detection wires 31, and the first end 41A and the second end 31B of the first test wires 41, and then a plating metal is deposited in the openings of the mask. The mask is formed, for example, by exposing and developing a photosensitive resist layer.

[0084] The detection terminal 50 and the test terminal 60 may also be formed by plating. In this case, the detection terminal 50 and the test terminal 60 may be formed in the same process as the process for forming the plurality of first detection wirings 31, the plurality of first test wirings 41, the first connection wiring 53, the second connection wiring 54, the third connection wiring 63, the fourth connection wiring 64, and the coil connection wiring 80.

[0085] [Magnetic sensor module] Next, the configuration of a magnetic sensor module 100 including the magnetic sensor chip 10 will be described with reference to Fig. 9 and Fig. 10. Fig. 9 schematically shows the internal structure of the magnetic sensor module 100. Fig. 10 schematically shows a cross-sectional structure of the magnetic sensor module 100 taken along line F10-F10 in Fig. 9. Note that Fig. 9 shows a simplified configuration of the magnetic sensor chip 10.

[0086] As shown in FIGS. 9 and 10, the magnetic sensor module 100 includes a die pad 110, external terminals 120, a control chip 130, and a sealing resin 140. The die pad 110 is flat and has a thickness in the Z direction. The die pad 110 is made of a conductive material such as Cu, a Cu alloy, Al, or an Al alloy. A magnetic sensor chip 10 and a control chip 130 are mounted on the die pad 110. The magnetic sensor chip 10 and the control chip 130 are arranged on the die pad 110 at a distance from each other in the Y direction. Both the magnetic sensor chip 10 and the control chip 130 are bonded to the die pad 110 by a conductive bonding material SD.

[0087] The magnetic sensor chip 10 and the control chip 130 are electrically connected by a plurality of wires W1 (four in the first embodiment). The plurality of wires W1 are individually connected to the detection terminals 50 and the test terminals 60 of the magnetic sensor chip 10. Specifically, the plurality of wires W1 are individually connected to the first detection terminal 51, the second detection terminal 52, the first test terminal 61, and the second test terminal 62. In this way, the control chip 130 is individually electrically connected to the detection terminals 50 and the test terminals 60 of the magnetic sensor chip 10.

[0088] The control chip 130 is configured to supply a test current to the test terminal 60 and detect, via the detection terminal 50, an induced voltage generated in the detection coil 30 by the test coil 40 through which the test current flows. In one example, the control chip 130 includes a current source that supplies the test current to the test terminal 60 and an acquisition unit that acquires the induced voltage in the detection coil 30. The acquisition unit is electrically connected to the first detection terminal 51 and the second detection terminal 52. The acquisition unit acquires the voltage between the first detection terminal 51 and the second detection terminal 52 as the induced voltage.

[0089] A plurality of external terminals 120 are arranged around the die pad 110 in a plan view. Some of the plurality of external terminals 120 are electrically connected to the control chip 130 by a plurality of wires W2. The plurality of external terminals 120 are connection terminals that are electrically connected to wiring on a circuit board (not shown) when the magnetic sensor module 100 is mounted on the circuit board.

[0090] The sealing resin 140 seals at least the magnetic sensor chip 10 and the control chip 130. In one example, the sealing resin 140 seals the magnetic sensor chip 10, the control chip 130, the plurality of wires W1, and the plurality of wires W2. The sealing resin 140 partially seals the die pad 110 and the plurality of external terminals 120. The back surface of the die pad 110 and the back surfaces of each external terminal 120 are exposed from the sealing resin 140. In one example, the side surface of each external terminal 120 is exposed from the side surface of the sealing resin 140.

[0091] [Operation of the first embodiment] The operation of the first embodiment will be described. Generally, when checking whether the detection coil of a magnetic sensor chip is operating normally, an external device that generates a constant magnetic field, such as a Helmholtz coil, is required. In particular, when checking the operation of a magnetic sensor module that includes a magnetic sensor chip, the external device becomes even larger.

[0092] In this regard, in the magnetic sensor chip 10 of the first embodiment, a test current is supplied to the test coil 40, causing the detection coil 30 to generate a magnetic field that generates an induced voltage. This makes it possible to check the operation of the detection coil 30 without using an external device that generates a constant magnetic field. In addition, the sensitivity of the magnetic sensor chip 10 can be calibrated based on the relationship between the test current of the test coil 40 and the induced voltage of the detection coil 30.

[0093] [Effects of the first embodiment] The magnetic sensor chip 10 and the magnetic sensor module 100 of the first embodiment provide the following advantages.

[0094] (1-1) The magnetic sensor chip 10 includes a detection coil 30 arranged with its axis in the X direction, a detection terminal 50 used to detect an induced voltage generated by the detection coil 30, a test coil 40 arranged at a position spaced apart from the detection coil 30, and a test terminal 60 used to pass a test current through the test coil 40. The test coil 40 is arranged at a position where an induced voltage is generated in the detection coil 30 when a test current flows through the test coil 40.

[0095] According to this configuration, the operation of the detection coil 30 can be checked using the test coil 40. Therefore, the operation of the detection coil 30 can be easily checked without using an external device that generates a constant magnetic field, such as a Helmholtz coil.

[0096] (1-2) The test coil 40 is disposed at a position spaced apart in the X direction from the detection coil 30. The test coil 40 is disposed with its axis aligned in the X direction. According to this configuration, the magnetic field generated in the test coil 40 by the test current is likely to affect the detection coil 30. Therefore, the magnetic field generated in the test coil 40 is likely to generate an induced voltage in the detection coil 30.

[0097] (1-3) Both the test terminal 60 and the detection terminal 50 are arranged to be spaced apart in the Y direction from the test coil 40 and the detection coil 30. The test terminal 60 and the detection terminal 50 are arranged to be spaced apart from each other in the X direction.

[0098] According to this configuration, the arrangement direction of the test terminals 60 and the detection terminals 50 coincides with the arrangement direction of the test coils 40 and the detection coils 30, and the test terminals 60 and the detection terminals 50 are arranged in a direction perpendicular to the arrangement direction of the test coils 40 and the detection coils 30. Therefore, compared to a case where the test terminals 60 and the detection terminals 50 are arranged dispersedly on both sides of the test coils 40 and the detection coils 30 in the arrangement direction of the test coils 40 and the detection coils 30, for example, the conductive path between the detection terminals 50 and the detection coil 30 and the conductive path between the test terminals 60 and the test coil 40 can each be made shorter.

[0099] (1-4) The detection coil 30 includes a first coil section 30A and a second coil section 30B that are electrically connected to each other. The test coil 40, the first coil section 30A, and the second coil section 30B are arranged in the X direction. The test coil 40 is disposed between the first coil section 30A and the second coil section 30B in the X direction.

[0100] According to this configuration, the test coil 40 can be disposed adjacent to both the first coil portion 30A and the second coil portion 30B. Therefore, the magnetic field generated in the test coil 40 makes it easier for an induced voltage to be generated in the detection coil 30.

[0101] (1-5) The detection terminal 50 includes a first detection terminal 51 electrically connected to the first coil portion 30A and a second detection terminal 52 electrically connected to the second coil portion 30B. The first detection terminal 51 and the second detection terminal 52 are arranged spaced apart in the X direction. The test terminal 60 includes a first test terminal 61 electrically connected to the first end 40A of the test coil 40 and a second test terminal 62 electrically connected to the second end 40B of the test coil 40. Both the first test terminal 61 and the second test terminal 62 are arranged between the first detection terminal 51 and the second detection terminal 52 in the X direction.

[0102] According to this configuration, both the first test terminal 61 and the second test terminal 62 are disposed near the test coil 40, which is disposed between the first coil portion 30A and the second coil portion 30B in the X direction. Therefore, the conductive path between the first end portion 40A of the test coil 40 and the first test terminal 61 and the conductive path between the second end portion 40B of the test coil 40 and the second test terminal 62 can be shortened.

[0103] (1-6) The magnetic sensor chip 10 includes a first connection wiring 53 that connects the first detection terminal 51 and the first coil section 30A, and a second connection wiring 54 that connects the second detection terminal 52 and the second coil section 30B. The first connection wiring 53 is connected to an end of the first coil section 30A that is closer to the test coil 40. The second connection wiring 54 is connected to an end of the second coil section 30B that is closer to the test coil 40.

[0104] This configuration can shorten the conductive path between the first detection terminal 51 and the first coil portion 30A, and the conductive path between the second detection terminal 52 and the second coil portion 30B. Therefore, both the first connection wiring 53 and the second connection wiring 54 can be shortened.

[0105] (1-7) The magnetic sensor chip 10 includes a third connection wiring 63 that connects the first test terminal 61 to the first end 40A of the test coil 40 on the first coil portion 30A side, and a fourth connection wiring 64 that connects the second test terminal 62 to the second end 40B of the test coil 40 on the second coil portion 30B side. Both the third connection wiring 63 and the fourth connection wiring 64 are arranged between the first connection wiring 53 and the second connection wiring 54 in the X direction. This configuration can achieve the same effect as in (1-5) above. Therefore, both the third connection wiring 63 and the fourth connection wiring 64 can be shortened.

[0106] (1-8) The number of turns of the test coil 40 is less than the number of turns of the detection coil 30. This configuration allows the test coil 40 to be miniaturized, and therefore the magnetic sensor chip 10 to be miniaturized.

[0107] (1-9) The number of turns of the test coil 40 is 1. This configuration allows for further miniaturization of the test coil 40. Therefore, the magnetic sensor chip 10 can be further miniaturized.

[0108] (1-10) The magnetic sensor chip 10 includes a coil connection wiring 80 that electrically connects the first coil portion 30A and the second coil portion 30B. According to this configuration, the inductance of the conductive path between the first coil portion 30A and the second coil portion 30B can be reduced compared to when the first coil portion 30A and the second coil portion 30B are electrically connected by, for example, a wire.

[0109] (1-11) The coil connection wiring 80 is arranged on the opposite side of the test terminal 60 and the detection terminal 50 with respect to the test coil 40 and the detection coil 30 in the Y direction. According to this configuration, the coil connection wiring 80 can connect the first coil portion 30A and the second coil portion 30B without detouring the test terminal 60 and the detection terminal 50. Therefore, the conductive path between the first coil portion 30A and the second coil portion 30B can be shortened.

[0110] (1-12) The magnetic sensor chip 10 includes a substrate 20 including a substrate surface 21. The test coil 40 includes a first test wiring 41 provided on the substrate surface 21 and a second test wiring 42 connected to the first test wiring 41.

[0111] According to this configuration, one first test wire 41 and one second test wire 42 constitute the coil portion (one turn) of the test coil 40. In other words, one first test wire 41 and one second test wire 42 constitute a unit element of one turn of the test coil 40. Therefore, by changing the number of first test wires 41 and second test wires 42, the number of turns of the test coil 40 can be easily changed.

[0112] (1-13) The first test wirings 41 and the second test wirings 42 are arranged alternately in the X direction. The first test wirings 41 extend in a direction intersecting the X direction in a plan view. According to this configuration, one first test wire 41 and one second test wire 42 constitute one turn of the test coil 40, and the length of one turn is determined by the length of the first test wire 41 and the length of the second test wire 42. In this regard, because the first test wire 41 is provided on the substrate surface 21, the length of the first test wire 41 can be easily changed.

[0113] (1-14) The detection coil 30 includes a plurality of first detection wires 31 arranged at a distance from each other in the X direction, and a plurality of second detection wires 32 connected to two adjacent first detection wires 31 in the X direction. The plurality of first detection wires 31 are provided on the substrate surface 21.

[0114] According to this configuration, one first detection wiring 31 and one second detection wiring 32 constitute a coil portion (one turn) of the detection coil 30. In other words, one first detection wiring 31 and one second detection wiring 32 constitute a unit element of one turn of the detection coil 30. Therefore, by changing the numbers of first detection wirings 31 and second detection wirings 32, the number of turns of the detection coil 30 can be easily changed.

[0115] (1-15) Each of the plurality of first detection wirings 31 extends in a direction intersecting the X direction in a plan view. According to this configuration, one first detection wiring 31 and one second detection wiring 32 constitute one turn in the detection coil 30, and the length of one turn is determined by the length of the first detection wiring 31 and the length of the second detection wiring 32. In this regard, since the first detection wiring 31 is provided on the substrate surface 21, the length of the first detection wiring 31 can be easily changed.

[0116] (1-16) The magnetic sensor chip 10 includes an insulating member 70 that covers the first test wiring 41 and the plurality of first detection wirings 31. The insulating member 70 is in contact with the substrate surface 21. The second test wiring 42 extends along a surface 71 of the insulating member 70.

[0117] According to this configuration, the length of the second test wire 42 is determined by the cross-sectional shape of the insulating member 70 and the height of the insulating member 70. Therefore, the length of the second test wire 42 can be easily changed by changing the shape of the insulating member 70.

[0118] (1-17) The second detection wiring 32 extends along the surface 71 of the insulating member 70 . According to this configuration, the length of the second detection wiring 32 is determined by the cross-sectional shape of the insulating member 70 and the height of the insulating member 70. Therefore, the length of the second detection wiring 32 can be easily changed by changing the shape of the insulating member 70.

[0119] (1-18) In the detection coil 30, the width W13 of the third end 32A of the second detection wiring 32 is narrower than the width W11 of the first end 31A of the first detection wiring 31. According to this configuration, even if the formation position of the third end 32A is shifted in the X direction due to manufacturing errors, the third end 32A can be provided on the first end 31A.

[0120] (1-19) In the detection coil 30, the length L13 of the third end 32A of the second detection wiring 32 is shorter than the length L11 of the first end 31A of the first detection wiring 31. According to this configuration, even if the formation position of the third end 32A is shifted in the Y direction due to manufacturing errors, the third end 32A can be provided on the first end 31A.

[0121] (1-20) In the detection coil 30, the width W14 of the fourth end 32B of the second detection wiring 32 is narrower than the width W12 of the second end 31B of the first detection wiring 31. According to this configuration, even if the formation position of the fourth end 32B is shifted in the X direction due to manufacturing errors, the fourth end 32B can be provided on the second end 31B.

[0122] (1-21) In the detection coil 30, the length L14 of the fourth end 32B of the second detection wiring 32 is shorter than the length L12 of the second end 31B of the first detection wiring 31. According to this configuration, even if the formation position of the fourth end 32B is shifted in the Y direction due to a manufacturing error, the fourth end 32B can be provided on the second end 31B.

[0123] (1-22) In the test coil 40, the width W23 of the third end 42A of the second test wiring 42 is narrower than the width W21 of the first end 41A of the first test wiring 41. According to this configuration, even if the formation position of the third end 42A is shifted in the X direction due to manufacturing errors, the third end 42A can be provided on the first end 41A.

[0124] (1-23) In the test coil 40, the length L23 of the third end 42A of the second test wiring 42 is shorter than the length L21 of the first end 41A of the first test wiring 41. According to this configuration, even if the formation position of the third end 42A is shifted in the Y direction due to manufacturing errors, the third end 42A can be provided on the first end 41A.

[0125] (1-24) In the test coil 40, the width W24 of the fourth end 42B of the second test wiring 42 is narrower than the width W22 of the second end 41B of the first test wiring 41. According to this configuration, even if the formation position of the fourth end 42B is shifted in the X direction due to manufacturing errors, the fourth end 42B can be provided on the second end 41B.

[0126] (1-25) In the test coil 40, the length L24 of the fourth end 42B of the second test wiring 42 is smaller than the length L22 of the second end 41B of the first test wiring 41. According to this configuration, even if the formation position of the fourth end 42B is shifted in the Y direction due to manufacturing errors, the fourth end 42B can be provided on the second end 41B.

[0127] Second Embodiment A magnetic sensor chip 10 according to the second embodiment will be described with reference to Figures 11 and 12. The magnetic sensor chip 10 according to the second embodiment differs from the magnetic sensor chip 10 according to the first embodiment mainly in the configuration of the test coil 40. The configuration of the test coil 40 will be described in detail below, and components common to those according to the first embodiment will be denoted by the same reference numerals and will not be described again.

[0128] FIG. 11 schematically shows the planar structure of the magnetic sensor chip 10 of the second embodiment. 11, the number of turns of the test coil 40 may be two or more. In the second embodiment, the number of turns of the test coil 40 is three. That is, the number of turns of the test coil 40 is fewer than the number of turns of the detection coil 30. The number of turns of the test coil 40 is fewer than the number of turns of the first coil section 30A and the number of turns of the second coil section 30B.

[0129] The test coil 40 includes four first test wires 41 and three second test wires 42. The material constituting each of the first test wires 41 and each of the second test wires 42 is the same as, for example, the first embodiment. The shape and size of each of the first test wires 41 and each of the second test wires 42 are the same as the first embodiment. Of the four first test wires 41, the first end 41A of the first test wire 41 closest to the first coil section 30A constitutes the first end 40A of the test coil 40. Of the four first test wires 41, the first end 41A of the first test wire 41 closest to the second coil section 30B constitutes the second end 40B of the test coil 40.

[0130] The three second test wires 42 are arranged spaced apart from one another in the X direction. The connection between the second test wires 42 and the first test wires 41 is the same as in the first embodiment. Each second test wire 42 extends along the surface of the insulating member 70, as in the first embodiment.

[0131] 12 is a graph showing the relationship between the test current and the magnetic field when the number of turns in the test coil 40 is 1 and when the number of turns in the test coil 40 is 3. In FIG. 12, circles indicate when the number of turns in the test coil 40 is 1, and triangles indicate when the number of turns in the test coil 40 is 3.

[0132] 12, when the number of turns in the test coil 40 is three, the strength of the magnetic field generated by the test coil 40 due to the test current is stronger than when the number of turns in the test coil 40 is one. In other words, when the number of turns in the test coil 40 is three, the magnitude of the test current required to generate a predetermined amount of induced voltage in the detection coil 30 is smaller than when the number of turns in the test coil 40 is one.

[0133] On the other hand, when the number of turns in the test coil 40 is one, the strength of the magnetic field generated by the test coil 40 increases as the test current increases, but once the test current exceeds a certain value, the strength of the magnetic field decreases as the test current increases. This is thought to be because the strength of the magnetic field generated by the test coil 40 decreases due to the heat generated by the increased test current.

[0134] [Effects of the second embodiment] According to the magnetic sensor chip 10 of the second embodiment, the following effects can be obtained. (2-1) The number of turns of the test coil 40 is two or more.

[0135] With this configuration, the strength of the magnetic field generated by the test coil 40 for the same magnitude of test current is stronger than when the number of turns of the test coil 40 is one. The test current supplied to the test coil 40 to generate a predetermined induced voltage in the detection coil 30 can be reduced. This prevents the test coil 40 from breaking due to an excessively large test current.

[0136] (2-2) The number of turns of the test coil 40 is 3. According to this configuration, the test current supplied to the test coil 40 to generate a predetermined induced voltage in the detection coil 30 can be reduced, and the magnetic sensor chip 10 can be made smaller in size in the X direction.

[0137] Third Embodiment A magnetic sensor chip 10 according to a third embodiment will be described with reference to Fig. 13. The magnetic sensor chip 10 according to the third embodiment differs from the magnetic sensor chip 10 according to the second embodiment mainly in the positions of the test coil 40 and the test terminal 60. In the following, components common to the second embodiment are denoted by the same reference numerals, and their description will be omitted.

[0138] FIG. 13 schematically shows the planar structure of the magnetic sensor chip 10 of the third embodiment. 13, the test coil 40 is arranged closer to the first substrate side surface 23 of the substrate 20 than the detection coil 30. In other words, the first coil portion 30A of the detection coil 30 is arranged between the test coil 40 and the second coil portion 30B in the X direction. The test coil 40 is arranged closer to the first substrate side surface 23 than the coil connection wiring 80 in the X direction.

[0139] In the third embodiment, the first end 40A of the test coil 40 is the end of the test coil 40 opposite the first coil section 30A in the X direction. The second end 40B of the test coil 40 is the end of the test coil 40 on the first coil section 30A side in the X direction. Note that the configuration of the multiple first test wires 41 and multiple second test wires 42 in the test coil 40 is the same as in the second embodiment.

[0140] The test terminal 60 is arranged closer to the first substrate side surface 23 of the substrate 20 than the detection terminal 50. In other words, the first detection terminal 51 is arranged between the test terminal 60 and the second detection terminal 52 in the X direction. The first test terminal 61 and the second test terminal 62 are arranged closer to the first substrate side surface 23 than the first detection terminal 51.

[0141] Both the first detection terminal 51 and the second detection terminal 52 are arranged closer to the second substrate side surface 24 than the center of the substrate 20 in the X direction. The first detection terminal 51 and the second detection terminal 52 are arranged side by side in the X direction. Both the first detection terminal 51 and the second detection terminal 52 are arranged closer to the second coil portion 30B than to the first coil portion 30A in the X direction. Both the first detection terminal 51 and the second detection terminal 52 are arranged at the same position as the second coil portion 30B in the Y direction.

[0142] Both the first test terminal 61 and the second test terminal 62 are arranged closer to the first substrate side surface 23 than the center of the substrate 20 in the X direction. The first test terminal 61 and the second test terminal 62 are arranged side by side in the X direction. Both the first test terminal 61 and the second test terminal 62 are arranged closer to the first coil section 30A than the second coil section 30B in the X direction. Both the first test terminal 61 and the second test terminal 62 are arranged at the same position as the first coil section 30A in the Y direction. According to the third embodiment, the same effects as (1-1) to (1-3), (1-6), (1-8), and (1-10) to (1-25) of the first embodiment and the second embodiment can be obtained.

[0143] <Fourth embodiment> 14 to 17, a magnetic sensor chip 10 according to a fourth embodiment will be described. The magnetic sensor chip 10 according to the fourth embodiment differs from the magnetic sensor chip 10 according to the first embodiment mainly in the configuration of the substrate 20, the configurations of the detection coil 30 and test coil 40, and the configuration of the insulating member 70. In the following, components common to the first embodiment are denoted by the same reference numerals, and their description will be omitted.

[0144] Fig. 14 is a schematic perspective view of the magnetic sensor chip 10 of the fourth embodiment. Fig. 15 is a schematic plan view of the magnetic sensor chip 10 of Fig. 14. Fig. 16 is a schematic cross-sectional view of the magnetic sensor chip 10 taken along line F16-F16 in Fig. 15. Fig. 17 is a schematic cross-sectional view of the magnetic sensor chip 10 taken along line F17-F17 in Fig. 15.

[0145] [substrate] 14 to 17, the substrate 20 includes a recess 29 recessed from the substrate front surface 21 toward the substrate back surface 22. The recess 29 has a strip shape extending in the X direction in a plan view. The recess 29 is provided so as to penetrate both the detection coil 30 and the test coil 40 in the X direction in a plan view.

[0146] The recess 29 includes a bottom surface 29A and side surfaces 29B connecting the bottom surface 29A and the substrate surface 21. The bottom surface 29A is strip-shaped extending in the X direction in a plan view. Four side surfaces 29B are provided along each side of the bottom surface 29A. The pair of side surfaces 29B opposing each other in the X direction are inclined so as to move away from each other from the bottom surface 29A toward the substrate surface 21. The pair of side surfaces 29B opposing each other in the Y direction are inclined so as to move away from each other from the bottom surface 29A toward the substrate surface 21.

[0147] The substrate body 27 of the substrate 20 of the second embodiment is made of a semiconductor material that is a single crystal material. In the second embodiment, the substrate body 27 is a Si substrate. The recesses 29 are formed by etching (anisotropic etching) the substrate body 27. More specifically, the substrate surface 21 of the substrate 20 is a plane oriented based on the crystal structure of Si, that is, a (100) plane. The side surface 29B of the recesses 29 is a (111) plane. Therefore, the inclination angle θ1 of the side surface 29B with respect to the bottom surface 29A is an angle based on the crystal structure of the Si substrate, and is approximately 54.7°.

[0148] An insulating film 28 provided on the substrate body 27 covers the substrate surface 21, four side surfaces 29B of the recess 29, and a bottom surface 29A. The insulating film 28 is made of SiO2. The insulating film 28 is formed, for example, by thermally oxidizing the substrate body 27 in which the recess 29 is formed. The insulating film 28 may also be made of an insulating material such as SiN or AlN.

[0149] [Detection coil, test coil, and insulating material] As shown in FIGS. 14 to 17 , the first detection wiring 31 of the detection coil 30 and the first test wiring 41 of the test coil 40 are provided across the substrate surface 21, the side surface 29B of the recess 29, and the bottom surface 29A. The first detection wiring 31 and the first test wiring 41 can be said to extend along the surface of the recess 29. Here, the surface of the recess 29 is the bottom surface 29A and the side surface 29B of the recess 29. More specifically, the first end 31A and the second end 31B of the first detection wiring 31 are provided on the substrate surface 21. The first conductor portion 31C of the first detection wiring 31 is provided on the side surface 29B and the bottom surface 29A of the recess 29. The first conductor portion 31C can be said to extend along the surface of the recess 29.

[0150] The insulating member 70 is provided so as to fill the recess 29. In plan view, the insulating member 70 penetrates both the detection coil 30 and the test coil 40 in the X direction. The insulating member 70 covers the first detection wiring 31 of the detection coil 30 and the first test wiring 41 of the test coil 40. More specifically, the insulating member 70 covers the first conductor portion 31C of the first detection wiring 31 and the first conductor portion 41C of the first test wiring 41. The first end 31A and the second end 31B of the first detection wiring 31 and the first end 41A and the second end 41B of the first test wiring 41 are exposed from the insulating member 70.

[0151] In the second embodiment, the surface 71 of the insulating member 70 is flat and perpendicular to the Z direction. In the second embodiment, the position of the surface 71 of the insulating member 70 in the Z direction is the same as the positions in the Z direction of the surfaces of both the first end 31A and the second end 31B of the first detection wiring 31 and the surfaces of both the first end 41A and the second end 41B of the first test wiring 41. Note that the position in the Z direction of the surface 71 of the insulating member 70 can be changed as desired.

[0152] The second detection wiring 32 of the detection coil 30 is provided on the surface 71 of the insulating member 70. More specifically, the second conductor portion 32C of the second detection wiring 32 is provided on the surface 71 of the insulating member 70. The third end 32A of the second detection wiring 32 is located closer to the detection terminal 50 than the insulating member 70. The third end 32A is connected to the first end 31A of the first detection wiring 31. The fourth end 32B of the second detection wiring 32 is located on the opposite side of the insulating member 70 from the detection terminal 50. The fourth end 32B is connected to the second end 31B of the first detection wiring 31 adjacent to the first detection wiring 31 to which the third end 32A is connected.

[0153] The second test wiring 42 of the test coil 40 is provided on the surface 71 of the insulating member 70. More specifically, the second conductor portion 42C of the second test wiring 42 is provided on the surface 71 of the insulating member 70. The third end 42A of the second test wiring 42 is located closer to the test terminal 60 than the insulating member 70. The third end 42A is connected to the first end 41A of the first test wiring 41. The fourth end 42B of the second test wiring 42 is located on the opposite side of the insulating member 70 from the test terminal 60. The fourth end 42B is connected to the second end 41B of the first test wiring 41 adjacent to the first test wiring 41 to which the third end 42A is connected.

[0154] [Effects of the fourth embodiment] According to the magnetic sensor chip 10 of the fourth embodiment, the following effects can be obtained. (4-1) The substrate 20 includes a substrate back surface 22 opposite to the substrate front surface 21, and a recess 29 recessed from the substrate front surface 21 toward the substrate back surface 22. The first test wiring 41 and the first detection wiring 31 extend along the surface of the recess 29.

[0155] According to this configuration, the lengths of the first test wiring 41 and the first detection wiring 31 are set by the depth of the recess 29. Furthermore, the lengths of the first test wiring 41 and the first detection wiring 31 are set by the opening width in the Y direction of the recess 29. Therefore, by changing the depth and opening width of the recess 29, the length of one turn of the detection coil 30 and the length of one turn of the test coil 40 can be adjusted.

[0156] (4-2) The recess 29 is filled with the insulating member 70. The insulating member 70 covers the first test wire 41 and the plurality of first detection wires 31. Both the second test wire 42 and the second detection wire 32 extend along the surface 71 of the insulating member 70.

[0157] According to this configuration, the position of the insulating member 70 is determined by the position of the recess 29. This allows for higher positional accuracy of the insulating member 70 compared to, for example, a case where the insulating member 70 is provided on the substrate surface 21. This allows for higher positional accuracy of the second test wiring 42 relative to the first test wiring 41 and higher positional accuracy of the second detection wiring 32 relative to the first detection wiring 31. In addition, since the height of the insulating member 70 protruding upward from the substrate surface 21 can be reduced, the magnetic sensor chip 10 can be made thinner.

[0158] Fifth Embodiment A magnetic sensor chip 10 according to a fifth embodiment will be described with reference to Figures 18 to 21. The magnetic sensor chip 10 according to the fifth embodiment differs from the magnetic sensor chip 10 according to the first embodiment mainly in the configurations of the detection coil 30 and the test coil 40, and the configuration of the insulating member 70. In the following, components common to the first embodiment are denoted by the same reference numerals, and their description will be omitted.

[0159] Fig. 18 schematically shows a perspective structure of the magnetic sensor chip 10 of the fifth embodiment. Fig. 19 schematically shows a planar structure of the magnetic sensor chip 10 of Fig. 18. Fig. 20 schematically shows a cross-sectional structure of the magnetic sensor chip 10 taken along line F20-F20 in Fig. 18. Fig. 21 schematically shows a cross-sectional structure of the magnetic sensor chip 10 taken along line F21-F21 in Fig. 18.

[0160] [Detection coil, test coil, and insulating material] As shown in FIGS. 18 to 21, the first detection wiring 31 of the detection coil 30 and the first test wiring 41 of the test coil 40 are the same as the first detection wiring 31 and the first test wiring 41 of the fourth embodiment.

[0161] The insulating member 70 includes a buried insulating portion 72 that fills the recess 29, and a protruding insulating portion 73 that protrudes from the buried insulating portion 72 toward the side opposite to the substrate back surface 22. Similar to the insulating member 70 of the first embodiment, the protruding insulating portion 73 has an arc-shaped cross-sectional shape that bulges in a direction away from the substrate front surface 21 in a plane (YZ plane) perpendicular to the X direction.

[0162] The second detection wiring 32 of the detection coil 30 is provided on the surface 73S of the protruding insulating portion 73. The second detection wiring 32 extends along the surface 73S of the protruding insulating portion 73, which has an arc-shaped cross section in a plane (YZ plane) perpendicular to the X direction. Therefore, the second detection wiring 32 is provided so as to be separated from the first detection wiring 31 in the Z direction by the insulating member 70.

[0163] The second test wire 42 of the test coil 40 is provided on the surface 73S of the protruding insulating portion 73. The second test wire 42 extends along the surface 73S of the protruding insulating portion 73, which has an arc-shaped cross section in a plane (YZ plane) perpendicular to the X direction. Therefore, the second test wire 42 is provided so as to be separated from the first test wire 41 in the Z direction by the insulating member 70.

[0164] [Effects of the fifth embodiment] According to the magnetic sensor chip 10 of the fifth embodiment, the following effects can be obtained. (5-1) The insulating member 70 includes a buried insulating portion 72 that fills the recess 29 and a protruding insulating portion 73 that protrudes from the buried insulating portion 72 toward the side opposite to the rear surface 22 of the substrate.

[0165] This configuration makes it possible to increase the length of one turn of the detection coil 30, which is made up of the first detection wiring 31 extending along the recess 29 and the second detection wiring 32 extending along the surface 73S of the protruding insulating portion 73. It is also possible to increase the length of one turn of the test coil 40, which is made up of the first test wiring 41 extending along the recess 29 and the second test wiring 42 extending along the surface 73S of the protruding insulating portion 73.

[0166] <Example of change> The above-described embodiments can be modified, for example, as follows: The above-described embodiments and the following modified examples can be combined with each other as long as no technical contradiction occurs. In the following modified examples, parts common to the above-described embodiments are designated by the same reference numerals as the above-described embodiments, and their description will be omitted.

[0167] In each embodiment, the configuration of the portion of the insulating member 70 corresponding to the detection coil 30 and the configuration of the portion corresponding to the test coil 40 may be different from each other. 22 , the insulating member 70 includes, in a plan view, a first coil insulating portion 74 corresponding to the first coil portion 30A of the detection coil 30, a second coil insulating portion 75 corresponding to the second coil portion 30B, and a test insulating portion 76 corresponding to the test coil 40. The first coil insulating portion 74 is a portion that penetrates the first coil portion 30A in the X direction. The second coil insulating portion 75 is a portion that penetrates the second coil portion 30B in the X direction. The test insulating portion 76 is disposed between the first coil insulating portion 74 and the second coil insulating portion 75 in the X direction. The test insulating portion 76 is a portion that penetrates the test coil 40 in the X direction.

[0168] In a plan view, the width (dimension in the Y direction) of the test insulation portion 76 is smaller than the width (dimension in the Y direction) of the first coil insulating portion 74 and the width (dimension in the Y direction) of the second coil insulating portion 75. The width of the first coil insulating portion 74 is equal to the width of the second coil insulating portion 75.

[0169] The second detection wiring 32 of the first coil section 30A extends along the surface of the first coil insulating section 74. The second detection wiring 32 of the second coil section 30B extends along the surface of the second coil insulating section 75. The second test wiring 42 of the test coil 40 extends along the surface of the test insulating section 76. Therefore, the coil diameter of the test coil 40 is smaller than the coil diameters of the first coil section 30A and the second coil section 30B. Here, the coil diameter of the test coil 40 can be defined, for example, by the distance between the third end 42A and the fourth end 42B of the second test wiring 42 in the Y direction in a plan view. The coil diameter of the first coil section 30A can be defined, for example, by the distance between the third end 32A and the fourth end 32B of the second detection wiring 32 of the first coil section 30A in the Y direction in a plan view. The coil diameter of the second coil portion 30B can be defined by the distance in the Y direction between the third end 32A and the fourth end 32B of the second detection wiring 32 of the second coil portion 30B in a plan view, for example.

[0170] 22, the coil diameter of the test coil 40 is reduced, thereby increasing the strength of the magnetic field generated in the test coil 40. Therefore, the test current supplied to the test coil 40 to generate a predetermined induced voltage in the detection coil 30 can be reduced.

[0171] 23, the protruding height HA of the test insulation portion 76 may be smaller than the protruding height HB of the second coil insulating portion 75. In this case, the coil diameter of the test coil 40 is also smaller than the coil diameter of the second coil portion 30B. Although not shown, the protruding height HA of the test insulation portion 76 may be smaller than the protruding height of the first coil insulating portion 74. The coil diameter of the test coil 40 is smaller than the coil diameter of the first coil portion 30A. Note that the protruding height of the first coil insulating portion 74 may be equal to the protruding height HB of the second coil insulating portion 75.

[0172] 23, the width (dimension in the Y direction) of the test insulation portion 76 may be equal to the width (dimension in the Y direction) of the first coil insulating portion 74. Also, in the modification shown in FIG. 22, the protruding height HA of the test insulation portion 76 may be equal to the protruding height HB of the first coil insulating portion 74.

[0173] In each embodiment, the cross-sectional shape of the insulating member 70 in a plane perpendicular to the X direction (YZ plane) can be changed as desired. In one example, the cross-sectional shape of the insulating member 70 may be a square.

[0174] 24 , the cross-sectional shape of the insulating member 70 is a trapezoid that is a quadrilateral and whose length in the Y direction gradually decreases with increasing distance from the substrate surface 21 of the substrate 20. The second detection wiring 32 of the detection coil 30 extends along the surface of the trapezoidal insulating member 70. Although not shown, the second test wiring 42 of the test coil 40 also extends along the surface of the trapezoidal insulating member 70.

[0175] 25, the cross-sectional shape of the insulating member 70 is a quadrilateral that is a rectangle. The second detection wiring 32 of the detection coil 30 extends along the surface of the quadrilateral insulating member 70. Although not shown, the second test wiring 42 of the test coil 40 also extends along the surface of the quadrilateral insulating member 70.

[0176] The cross-sectional shape of the insulating member 70 is not limited to a quadrilateral shape such as the trapezoidal shape shown in FIG. 24 or the rectangular shape shown in FIG. 25. The cross-sectional shape of the insulating member 70 may be a triangle or a polygon with pentagons or more sides. The cross-sectional shape of the insulating member 70 may also be a cross-sectional shape in which the surface of the insulating member 70 has straight lines and curved lines (arc sections). The cross-sectional shape of the protruding insulating portion 73 of the insulating member 70 of the fifth embodiment in a plane perpendicular to the X direction (YZ plane) can also be changed as desired. In one example, the cross-sectional shape of the protruding insulating portion 73 may be a quadrilateral. In another example, the cross-sectional shape of the protruding insulating portion 73 may be changed to the cross-sectional shape shown in FIG. 24 or 25.

[0177] In the fifth embodiment, the configuration of the recess 29 and the configuration of the insulating member 70 can be changed as desired. In one example, the portion of the recess 29 corresponding to the test coil 40 may be omitted. This eliminates the embedded insulating portion 72 in the portion of the insulating member 70 corresponding to the test coil 40. The first test wiring 41 of the test coil 40 is provided on the substrate surface 21. This configuration allows the coil diameter of the test coil 40 to be reduced. In another example, the protruding insulating portion 73 in the portion of the insulating member 70 corresponding to the test coil 40 may be omitted. This configuration allows the coil diameter of the test coil 40 to be reduced.

[0178] In the third embodiment, the configuration of the test coil 40 can be changed as desired. For example, the number of turns of the test coil 40 may be two or less. For example, the test coil 40 may be the same as the test coil 40 of the first embodiment. That is, the number of turns of the test coil 40 may be one.

[0179] In the third embodiment, as shown in FIG. 26 , the test coil 40 includes a first test coil 40P and a second test coil 40Q spaced apart in the X direction. The detection coil 30 is disposed between the first test coil 40P and the second test coil 40Q in the X direction. That is, the first coil section 30A and the second coil section 30B are disposed between the first test coil 40P and the second test coil 40Q in the X direction. The first test coil 40P is disposed adjacent to the first coil section 30A in the X direction. The second test coil 40Q is disposed adjacent to the second coil section 30B in the X direction.

[0180] The first test coil 40P includes a first end 40PA and a second end 40PB. The first end 40PA is an end of the first test coil 40P opposite the first coil section 30A in the X direction. The second end 40PB is an end of the first test coil 40P closer to the first coil section 30A in the X direction. The first test coil 40P includes a plurality of first test wires 41 and a plurality of second test wires 42. Of the plurality of first test wires 41, the first test wire 41 arranged at the end opposite the first coil section 30A in the X direction constitutes the first end 40PA. Of the plurality of first test wires 41, the first test wire 41 arranged at the end closer to the first coil section 30A in the X direction constitutes the second end 40PB.

[0181] The second test coil 40Q includes a first end 40QA and a second end 40QB. The first end 40QA is the end of the second test coil 40Q that is closer to the second coil section 30B in the X direction. The second end 40QB is the end of the second test coil 40Q that is opposite the second coil section 30B in the X direction. The second test coil 40Q includes a plurality of first test wires 41 and a plurality of second test wires 42. Of the plurality of first test wires 41, the first test wire 41 that is arranged at the end that is closer to the second coil section 30B in the X direction constitutes the first end 40QA. Of the plurality of first test wires 41, the first test wire 41 that is arranged at the end that is opposite the second coil section 30B in the X direction constitutes the second end 40QB.

[0182] The first test coil 40P and the second test coil 40Q are electrically connected to each other. Specifically, the first test coil 40P and the second test coil 40Q are connected to each other by a test coil connection wiring 90. The test coil connection wiring 90 is arranged on the opposite side of the test terminal 60 and the detection terminal 50 with respect to the test coil 40 and the detection coil 30 in the Y direction. The test coil connection wiring 90 is provided on the substrate surface 21 of the substrate 20. The test coil connection wiring 90 is provided so as to surround the coil connection wiring 80 in a plan view.

[0183] The test coil connecting wiring 90 is connected to the first test wiring 41 of the first test coil 40P. More specifically, the test coil connecting wiring 90 is integrated with the first test wiring 41 that constitutes the second end 40PB of the first test coil 40P, among the multiple first test wirings 41 of the first test coil 40P.

[0184] The test coil connecting wiring 90 is connected to the first test wiring 41 of the second test coil 40Q. More specifically, the test coil connecting wiring 90 is integrated with the first test wiring 41 that constitutes the first end 40QA of the second test coil 40Q, among the multiple first test wirings 41 of the second test coil 40Q.

[0185] The first detection terminal 51 electrically connected to the first coil portion 30A and the second detection terminal 52 electrically connected to the second coil portion 30B are arranged side by side in the X direction. The first detection terminal 51 is arranged in the same position as the first coil portion 30A in the X direction. The first detection terminal 51 is arranged in the same position as the portion of the first coil portion 30A closer to the second coil portion 30B in the X direction. The second detection terminal 52 is arranged in the same position as the second coil portion 30B in the X direction. The second detection terminal 52 is arranged in the same position as the portion of the second coil portion 30B closer to the first coil portion 30A in the X direction.

[0186] The test terminals 60 include a first test terminal 61 electrically connected to the first test coil 40P and a second test terminal 62 electrically connected to the second test coil 40Q. The first test terminal 61 is electrically connected to the first end 40PA of the first test coil 40P. The third connection wiring 63 electrically connects the first test terminal 61 and the first end 40PA. The third connection wiring 63 is integrated with the first test wiring 41 that constitutes the first end 40PA, among the multiple first test wirings 41 of the first test coil 40P.

[0187] The second test terminal 62 is electrically connected to the second end 40QB of the second test coil 40Q. The fourth connection wiring 64 electrically connects the second test terminal 62 and the second end 40QB. The fourth connection wiring 64 is integrated with the first test wiring 41 that constitutes the second end 40QB, among the multiple first test wirings 41 of the second test coil 40Q.

[0188] First detection terminal 51 and second detection terminal 52 are arranged between first test terminal 61 and second test terminal 62 in the X direction. First test terminal 61 is arranged side by side with first detection terminal 51. Second test terminal 62 is arranged side by side with second detection terminal 52.

[0189] 26, the number of turns of the test coil 40 is increased, so that it is possible to reduce the test current supplied to the test coil 40 in order to generate a predetermined induced voltage in the detection coil 30. This prevents the test coil 40 from being broken due to an excessively large test current.

[0190] In each embodiment, it is possible to arbitrarily change the number of turns of the first coil portion 30A and the second coil portion 30B of the detection coil 30. In one example, the number of turns of the first coil portion 30A and the number of turns of the second coil portion 30B may be different from each other.

[0191] In each embodiment, the configuration of the substrate 20 can be modified as desired. In one example, as shown in FIG. 27 , the substrate 20 includes a substrate main body 27, an insulating film 28, and a substrate insulating layer 20A. The substrate insulating layer 20A is formed on the upper surface of the insulating film 28. The surface of the substrate insulating layer 20A constitutes the substrate surface 21. In one example, in the first and second embodiments, both the first detection wiring 31 of the detection coil 30 and the first test wiring 41 of the test coil 40 are provided on the surface of the substrate insulating layer 20A (substrate surface 21). The substrate insulating layer 20A can be made of an insulating resin such as a phenolic resin, or an insulating material such as SiO2 or SiN. The substrate insulating layer 20A may be made of two or more insulating layers. If the substrate 20 includes the substrate insulating layer 20A, the insulating film 28 may be omitted.

[0192] In each embodiment, the insulating member 70 may be provided for each of the first coil portion 30A, the second coil portion 30B, and the test coil 40 of the detection coil 30. In one example, the insulating member 70 includes a first portion corresponding to the first coil portion 30A, a second portion corresponding to the second coil portion 30B, and a third portion corresponding to the test coil 40. The third portion may be disposed between the first portion and the second portion in the X direction and spaced apart from the first portion and the second portion in the X direction, for example. In one example, the third portion may be provided as a separate member from the first portion and the second portion.

[0193] One or more of the various examples described herein may be combined to the extent that they are not technically inconsistent. The term "on" as used in this disclosure includes the meanings "on" and "above" unless the context clearly indicates otherwise. Thus, for example, the phrase "a first element is mounted on a second element" is intended to mean that in some embodiments, the first element may be placed directly on the second element in contact with the second element, while in other embodiments, the first element may be placed above the second element without contacting the second element. In other words, the term "on" does not exclude a structure in which another element is formed between the first element and the second element.

[0194] The Z direction used in this disclosure does not necessarily have to be the vertical direction, nor does it have to completely coincide with the vertical direction. Therefore, various structures according to this disclosure are not limited to the "up" and "down" in the Z axis direction described in this specification being "up" and "down" in the vertical direction. For example, the X direction may be the vertical direction, or the Y direction may be the vertical direction.

[0195] <Additional Notes> The technical ideas that can be understood from the above-described embodiments and modifications are described below. The reference numerals of the components of the embodiments corresponding to the components described in each appendix are shown in parentheses. The reference numerals are shown as examples to aid understanding, and the components described in each appendix should not be limited to the components indicated by the reference numerals.

[0196] [Appendix 1] a detection coil (30) arranged with its axis in the first direction (X); a detection terminal (50) used to detect an induced voltage generated by the detection coil (30); a test coil (40) disposed at a position spaced apart from the detection coil (30); a test terminal (60) used to apply a test current to the test coil (40); Including, The test coil (40) is disposed at a position where the induced voltage is generated in the detection coil (30) when the test current flows through the test coil (40). A magnetic sensor chip (10).

[0197] [Appendix 2] The test coil (40) is disposed at a position spaced apart from the detection coil (30) in the first direction (X). 2. The magnetic sensor chip of claim 1.

[0198] [Appendix 3] When the direction perpendicular to the first direction (X) in a plan view is defined as a second direction (Y), Both the test terminal (60) and the detection terminal (50) are disposed apart from the test coil (40) and the detection coil (30) in the second direction (Y), The test terminal (60) and the detection terminal (50) are spaced apart from each other in the first direction (X). 3. The magnetic sensor chip according to claim 2.

[0199] [Appendix 4] the detection coil (30) includes a first coil portion (30A) and a second coil portion (30B) electrically connected to each other; The test coil (40), the first coil portion (30A), and the second coil portion (30B) are arranged in the first direction (X). 4. The magnetic sensor chip of claim 3.

[0200] [Appendix 5] The test coil (40) is disposed between the first coil portion (30A) and the second coil portion (30B) in the first direction (X). 5. The magnetic sensor chip of claim 4.

[0201] [Appendix 6] The detection terminal (50) a first detection terminal (51) electrically connected to the first coil portion (30A); a second detection terminal (52) electrically connected to the second coil portion (30B); Including, the first detection terminal (51) and the second detection terminal (52) are arranged apart from each other in the first direction (X); The test terminal (60) a first test terminal (61) electrically connected to a first end (40A) of the test coil (40); a second test terminal (62) electrically connected to the second end (40B) of the test coil (40); Including, Both the first test terminal (61) and the second test terminal (62) are disposed between the first detection terminal (51) and the second detection terminal (52) in the first direction (X). 6. The magnetic sensor chip according to claim 5.

[0202] [Appendix 7] a first connection wire (53) connecting the first detection terminal (51) and the first coil portion (30A); a second connection wire (54) connecting the second detection terminal (52) and the second coil portion (30B); Including, the first connection wiring (53) is connected to an end (30AA) of the first coil portion (30A) on the test coil (40) side; The second connection wiring (54) is connected to an end (30BA) of the second coil portion (30B) on the test coil (40) side. 7. The magnetic sensor chip according to claim 6.

[0203] [Appendix 8] a third connection wiring (63) that connects the first test terminal (61) and a first end (40A) of the test coil (40) on the side of the first coil portion (30A); a fourth connection wiring (64) that connects the second test terminal (62) and a second end (40B) of the test coil (40) on the second coil portion (30B) side; Including, Both the third connection wiring (63) and the fourth connection wiring (64) are disposed between the first connection wiring (53) and the second connection wiring (54) in the first direction (X). 8. The magnetic sensor chip of claim 7.

[0204] [Appendix 9] The first coil section (30A) is disposed between the test coil (40) and the second coil section (30B). 5. The magnetic sensor chip of claim 4.

[0205] [Appendix 10] Both the test terminal (60) and the detection terminal (50) are disposed apart from the test coil (40) and the detection coil (30) in the second direction (Y), The detection terminal (50) a first detection terminal (51) electrically connected to the first coil portion (30A); a second detection terminal (52) electrically connected to the second coil portion (30B); Including, the first detection terminal (51) and the second detection terminal (52) are arranged side by side in the first direction (X); The first detection terminal (51) is disposed between the test terminal (60) and the second detection terminal (52) in the first direction (X). 10. The magnetic sensor chip of claim 9.

[0206] [Appendix 11] The test coil (40) includes a first test coil (40P) and a second test coil (40Q) spaced apart in the first direction (X), The first coil section (30A) and the second coil section (30B) are disposed between the first test coil (40P) and the second test coil (40Q). 5. The magnetic sensor chip of claim 4.

[0207] [Appendix 12] When the direction perpendicular to the first direction (X) in a plan view is defined as a second direction (Y), Both the test terminal (60) and the detection terminal (50) are disposed apart from the test coil (40) and the detection coil (30) in the second direction (Y), The detection terminal (50) a first detection terminal (51) electrically connected to the first coil portion (30A); a second detection terminal (52) electrically connected to the second coil portion (30B); Including, the first detection terminal (51) and the second detection terminal (52) are arranged side by side in the first direction (X); The test terminal (60) a first test terminal (61) electrically connected to an end (40PA) of the first test coil (40P) opposite to the first coil portion (30A); a second test terminal (62) electrically connected to an end (40QB) of the second test coil (40Q) opposite to the second coil portion (30B); Including, The first test terminal (61) and the second test terminal (62) are spaced apart in the first direction (X), The first detection terminal (51) and the second detection terminal (52) are disposed between the first test terminal (61) and the second test terminal (62) in the first direction (X). 12. The magnetic sensor chip of claim 11.

[0208] [Appendix 13] and a test coil connection wiring (90) that electrically connects the first test coil (40P) and the second test coil (40Q). 13. The magnetic sensor chip of claim 12.

[0209] [Appendix 14] The test coil connection wiring (90) is arranged on the opposite side of the test terminal (60) and the detection terminal (50) with respect to the test coil (40) and the detection coil (30) in the second direction (Y). 14. The magnetic sensor chip of claim 13.

[0210] [Appendix 15] The coil connection wiring (80) electrically connects the first coil portion (30A) and the second coil portion (30B). 9. The magnetic sensor chip according to any one of Supplementary notes 5 to 8.

[0211] [Appendix 16] The coil connection wiring (80) connects an end (30AB) of the first coil portion (30A) opposite to the test coil (40) and an end (30BB) of the second coil portion (30B) opposite to the test coil (40). 16. The magnetic sensor chip of claim 15.

[0212] [Appendix 17] The coil connection wiring (80) is arranged on the opposite side of the test terminal (60) and the detection terminal (50) with respect to the test coil (40) and the detection coil (30) in the second direction (Y). 17. The magnetic sensor chip according to claim 15 or 16.

[0213] [Appendix 18] a substrate (20) including a substrate surface (21); The test coil (40) a first test wiring (41) provided on the substrate surface (21); a second test wiring (42) connected to the first test wiring (41); Contains 18. The magnetic sensor chip according to any one of claims 1 to 17.

[0214] [Appendix 19] The detection coil (30) a plurality of first detection wirings (31) provided on the substrate surface (21) and arranged at a distance from each other in the first direction (X); second detection wirings (32) arranged apart from each other in the first direction (X) and connected to two of the first detection wirings (31) adjacent to each other in the first direction (X); Contains 19. The magnetic sensor chip of claim 18.

[0215] [Appendix 20] Each of the plurality of first detection wirings (31) extends in a direction intersecting the first direction (X) in a plan view. 20. The magnetic sensor chip of claim 19.

[0216] [Appendix 21] an insulating member (70) in contact with the substrate surface (21) and covering the first test wiring (41) and the plurality of first detection wirings (31); The second test wiring (42) extends along the surface (71) of the insulating member (70). 21. The magnetic sensor chip according to claim 19 or 20.

[0217] [Appendix 22] The second detection wiring (32) extends along the surface (71) of the insulating member (70). 22. The magnetic sensor chip of claim 21.

[0218] [Appendix 23] the first detection wiring (31) includes a first end (31A) and a second end (31B) opposite to the first end (31A); the second detection wiring (32) includes a third end (32A) connected to the first end (31A) and a fourth end (32B) opposite to the third end (32A) and connected to the second end (31B); The width (W13) of the third end (32A) is narrower than the width (W11) of the first end (31A). 23. The magnetic sensor chip according to any one of claims 19 to 22.

[0219] [Appendix 24] The length (L13) of the third end (32A) is shorter than the length (L11) of the first end (31A). 24. The magnetic sensor chip of claim 23.

[0220] [Appendix 25] The width (W14) of the fourth end (32B) is narrower than the width (W12) of the second end (31B). 25. The magnetic sensor chip according to claim 23 or 24.

[0221] [Appendix 26] The length (L14) of the fourth end (32B) is shorter than the length (L12) of the second end (31B). 26. The magnetic sensor chip of claim 25.

[0222] [Appendix 27] the first test wiring (41) includes a first end (41A) and a second end (41B) opposite to the first end (41A); the second test wiring (42) includes a third end (42A) connected to the first end (41A) and a fourth end (42B) opposite to the third end (42A) and connected to the second end (41B); The width (W23) of the third end (42A) is narrower than the width (W21) of the first end (41A). 27. The magnetic sensor chip according to any one of claims 19 to 26.

[0223] [Appendix 28] The length (L23) of the third end (42A) is shorter than the length (L21) of the first end (41A). 28. The magnetic sensor chip of claim 27.

[0224] [Appendix 29] The width (W24) of the fourth end (42B) is narrower than the width (W22) of the second end (31B). 29. The magnetic sensor chip according to claim 27 or 28.

[0225] [Appendix 30] The length (L24) of the fourth end (42B) is shorter than the length (L22) of the second end (31B). 20. The magnetic sensor chip of claim 29.

[0226] [Appendix 31] The cross-sectional shape of the insulating member (70) perpendicular to the first direction (X) is an arc shape, a trapezoid shape, or a rectangle shape that protrudes in a direction away from the substrate (20). 22. The magnetic sensor chip of claim 21.

[0227] [Appendix 32] The substrate (20) is a rear surface (22) of the substrate opposite to the front surface (21) of the substrate; a recess (29) recessed from the substrate front surface (21) toward the substrate back surface (22); Including, The first test wiring (41) and the first detection wiring (31) extend along the surfaces (29A, 29B) of the recess (29). 31. The magnetic sensor chip according to any one of claims 19 to 30.

[0228] [Appendix 33] an insulating member (70) embedded in the recess (29) and covering the first test wiring (41) and the plurality of first detection wirings (31); Both the second test wiring (42) and the second detection wiring (32) extend along the surface (71) of the insulating member (70). 33. The magnetic sensor chip of claim 32.

[0229] [Appendix 34] the first test wiring (41) extends parallel to the first detection wiring (31) in a plan view, The second test wiring (42) extends parallel to the second detection wiring (32) in a plan view. The magnetic sensor chip according to any one of Supplementary notes 19 to 33.

[0230] [Appendix 35] The test coil (40) is arranged with its axis aligned in the first direction (X). 35. The magnetic sensor chip according to any one of claims 1 to 34.

[0231] [Appendix 36] The axis of the test coil (40) and the axis of the detection coil (30) are coaxial. 36. The magnetic sensor chip of claim 35.

[0232] [Appendix 37] The winding direction of the first coil portion (30A) is the same as the winding direction of the second coil portion (30B). 18. The magnetic sensor chip according to any one of claims 4 to 17.

[0233] [Appendix 38] The number of turns of the test coil (40) is less than the number of turns of the detection coil (30). 38. The magnetic sensor chip according to any one of claims 1 to 37.

[0234] [Appendix 39] The number of turns of the test coil (40) is less than the number of turns of the first coil portion (30A) and the number of turns of the second coil portion (30B). 18. The magnetic sensor chip according to any one of claims 4 to 17.

[0235] [Appendix 40] The number of turns of the first coil portion (30A) and the number of turns of the second coil portion (30B) are equal to each other. 18. The magnetic sensor chip according to any one of claims 4 to 17.

[0236] [Appendix 41] The number of turns of the first coil portion (30A) and the number of turns of the second coil portion (30B) are different from each other. 18. The magnetic sensor chip according to any one of claims 4 to 17.

[0237] [Appendix 42] The number of turns of the test coil (40) is 1. 39. The magnetic sensor chip of claim 38.

[0238] [Appendix 43] The number of turns of the test coil (40) is 2 or more. 39. The magnetic sensor chip of claim 38.

[0239] [Appendix 44] The number of turns of the test coil (40) is 3 39. The magnetic sensor chip of claim 38.

[0240] [Appendix 45] A die pad (110), a magnetic sensor chip (10) according to any one of appendices 1 to 44 mounted on the die pad (110); a control chip (130) mounted on the die pad (110) and electrically connected to the detection terminals (50) and the test terminals (60) of the magnetic sensor chip (10); a sealing resin (140) that seals at least the magnetic sensor chip (10) and the control chip (130); A magnetic sensor module (100) comprising:

[0241] [Appendix 46] The control chip (130) is configured to supply the test current to the test terminal (60) and detect, via the detection terminal (50), the induced voltage generated in the detection coil (30) by the test coil (40) through which the test current flows. 46. ​​The magnetic sensor module of claim 45.

[0242] The above description is merely illustrative. Those skilled in the art will recognize that many more possible combinations and permutations are possible other than the components and methods (manufacturing processes) listed for the purpose of illustrating the technology of the present disclosure. The present disclosure is intended to embrace all alternatives, modifications, and variations that fall within the scope of the present disclosure, including the claims. [Explanation of symbols]

[0243] 10...Magnetic sensor chip 20...Substrate 20A...Substrate insulating layer 21...Substrate surface 22...Back of the board 23~26...1st~4th board side 27...Board body 28...Insulating film 29...recess 29A…Bottom surface 29B…Side 30...Detection coil 30A...First coil section 30AA…1st end 30AB…Second end 30B...Second coil section 30BA...1st end 30BB…Second end 31, 31D, 31E, 31F, 31G...First detection wiring 31A...First end 31B…Second end 31C...First conductor section 32...Second detection wiring 32A...Third end 32B…4th end 32C...Second conductor section 40...Test coil 40P...First test coil 40Q...Second test coil 40A, 40PA, 40QA...First end 40B,40PB,40QB...2nd end 41...First test wiring 41A...First end 41B…Second end 41C...First conductor section 42...Second test wiring 42A...Third end 42B...4th end 42C...Second conductor section 50...Detection terminal 51...First detection terminal 52...Second detection terminal 53...First connection wiring 54...Second connection wiring 60...Test terminal 61...First test terminal 62...Second test terminal 63...Third connection wiring 64...Fourth connection wire 70...insulating member 71…Surface 72...Buried insulation 73...Protruding insulation part 73S…Surface 74...First coil insulation part 75...Second coil insulation part 76...Test insulation section 80...Coil connection wiring 81...First connection part 82...Second connection part 83...Third connection part 90...Test coil connection wiring 100...Magnetic sensor module 110...Die pad 120...External terminal 130...Control chip 140…Sealing resin SD: Conductive adhesive W1, W2...Wire HA: Protrusion height of test insulation HB: Protrusion height of the first coil insulation J1: Axis of the first coil J2: Axis of the second coil JA: Axis of detection coil JB: Test coil axis L11: Length of the first end of the first detection wiring L12: Length of the second end of the first detection wiring L13: Length of the third end of the second detection wiring L14: Length of the fourth end of the second detection wiring W11: Width of the first end of the first detection wiring W12: Width of the second end of the first detection wiring W13: Width of the third end of the second detection wiring W14: Width of the fourth end of the second detection wiring L21: Length of the first end of the first test wire L22: Length of the second end of the first test wire L23: Length of the third end of the second test wire L24: Length of the fourth end of the second test wire W21: Width of the first end of the first test wiring W22: Width of the second end of the first test wire W23: Width of the third end of the second test wire W24: Width of the fourth end of the second test wire θ1: Inclination angle of the side surface relative to the bottom surface of the recess P1: Spacing of the first detection wiring in the first coil section P2: Spacing of the first detection wiring in the second coil section P3: Spacing of the first test wire in the test coil

Claims

1. a detection coil arranged with its axis aligned in the first direction; a detection terminal used to detect an induced voltage generated by the detection coil; a test coil disposed at a position spaced apart from the detection coil; a test terminal used to apply a test current to the test coil; Including, The test coil is disposed at a position where the induced voltage is generated in the detection coil when the test current flows through the test coil. Magnetic sensor chip.

2. The test coil is disposed at a position spaced apart from the detection coil in the first direction. The magnetic sensor chip according to claim 1 .

3. When a direction perpendicular to the first direction in a plan view is defined as a second direction, both the test terminal and the detection terminal are spaced apart from the test coil and the detection coil in the second direction; The test terminal and the detection terminal are spaced apart from each other in the first direction. The magnetic sensor chip according to claim 2 .

4. the detection coil includes a first coil portion and a second coil portion electrically connected to each other; The test coil, the first coil portion, and the second coil portion are arranged in the first direction. The magnetic sensor chip according to claim 3 .

5. The test coil is disposed between the first coil portion and the second coil portion. The magnetic sensor chip according to claim 4 .

6. The detection terminal is a first detection terminal electrically connected to the first coil portion; a second detection terminal electrically connected to the second coil portion; Including, the first detection terminal and the second detection terminal are disposed apart from each other in the first direction, The test terminal is a first test terminal electrically connected to a first end of the test coil; a second test terminal electrically connected to a second end of the test coil; Including, Both the first test terminal and the second test terminal are disposed between the first detection terminal and the second detection terminal in the first direction. The magnetic sensor chip according to claim 5 .

7. a first connection wire connecting the first detection terminal and the first coil portion; a second connection wire connecting the second detection terminal and the second coil portion; Including, the first connection wiring is connected to an end of the first coil portion on the test coil side, The second connection wiring is connected to an end of the second coil portion on the test coil side. The magnetic sensor chip according to claim 6 .

8. a third connection wiring that connects the first test terminal and a first end of the test coil that is on the first coil portion side; a fourth connection wiring that connects the second test terminal and a second end of the test coil that is on the second coil portion side; Including, Both the third connection wiring and the fourth connection wiring are disposed between the first connection wiring and the second connection wiring in the first direction. The magnetic sensor chip according to claim 7 .

9. The first coil portion is disposed between the test coil and the second coil portion in the first direction. The magnetic sensor chip according to claim 4 .

10. both the test terminal and the detection terminal are spaced apart from the test coil and the detection coil in the second direction; The detection terminal is a first detection terminal electrically connected to the first coil portion; a second detection terminal electrically connected to the second coil portion; Including, the first detection terminal and the second detection terminal are arranged side by side in the first direction, The test terminal is a first test terminal electrically connected to a first end of the test coil; a second test terminal electrically connected to a second end of the test coil; Including, The first detection terminal is disposed between the test terminal and the second detection terminal in the first direction. The magnetic sensor chip according to claim 9 .

11. The number of turns in the test coil is less than the number of turns in the detection coil The magnetic sensor chip according to claim 1 .

12. and a coil connection wiring that electrically connects the first coil portion and the second coil portion. The magnetic sensor chip according to claim 4 .

13. The coil connection wiring connects an end of the first coil portion opposite to the test coil and an end of the second coil portion opposite to the test coil. The magnetic sensor chip according to claim 12.

14. The coil connection wiring is arranged on the opposite side of the test terminal and the detection terminal with respect to the test coil and the detection coil in the second direction. The magnetic sensor chip according to claim 12.

15. a substrate including a substrate surface; The test coil a first test wiring provided on the surface of the substrate; a second test wiring connected to the first test wiring; Contains The magnetic sensor chip according to claim 1 .

16. The detection coil a plurality of first detection wirings provided on the surface of the substrate, extending in a direction intersecting the first direction in a plan view, and arranged at a distance from each other in the first direction; second detection wirings that are arranged spaced apart from each other in the first direction and are connected to two of the first detection wirings that are adjacent to each other in the first direction; Contains The magnetic sensor chip according to claim 15.

17. an insulating member in contact with the surface of the substrate and covering the first test wiring and the plurality of first detection wirings; The second test wiring extends along the surface of the insulating member.

17. The magnetic sensor chip according to claim 16.

18. The insulating member has a cross-sectional shape perpendicular to the first direction that is an arc, a trapezoid, or a rectangle that protrudes in a direction away from the substrate.

18. The magnetic sensor chip according to claim 17.

19. A die pad; The magnetic sensor chip according to any one of claims 1 to 18, which is mounted on the die pad; a control chip mounted on the die pad and electrically connected to the detection terminals and the test terminals of the magnetic sensor chip individually; a sealing resin that seals at least the magnetic sensor chip and the control chip; A magnetic sensor module comprising:

20. The control chip is configured to supply the test current to the test terminal and detect, via the detection terminal, the induced voltage generated in the detection coil by the test coil through which the test current flows.

20. The magnetic sensor module according to claim 19.

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