Substrate and antenna

Abstract

To provide a substrate or an antenna capable of ensuring light transmissivity.SOLUTION: The substrate includes a transparent first dielectric layer having a first surface and a second surface, and a first conductive layer positioned on the first surface side of the first dielectric layer, the first conductive layer including a conductive first mesh forming a filter. The antenna includes a transparent first dielectric layer having a first surface and a second surface, a first conductive layer positioned on the first surface side of the first dielectric layer, and a second conductive layer positioned on the second surface side of the first dielectric layer, the first conductive layer including a conductive first mesh forming a filter, and the second conductive layer including a conductive second mesh forming a radiating element electrically connected to the filter.SELECTED DRAWING: Figure 14

Description

[Technical Field]

[0001] The present disclosure relates to a substrate and an antenna. [Background technology]

[0002] A substrate that is transparent to visible light and includes a transparent dielectric layer having a first surface and a second surface, a mesh-shaped antenna conductor provided on the first surface side, and a mesh-shaped ground conductor provided on the second surface side is known (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2020 / 095786 Summary of the Invention [Problem to be solved by the invention]

[0004] A filter may be provided on a substrate or antenna having a transparent dielectric layer with a first surface and a second surface, but the filter may block visible light transmission, reducing the optical transparency of the substrate or antenna.

[0005] The present disclosure provides a substrate or antenna that can ensure optical transparency. [Means for solving the problem]

[0006] The substrate of the first embodiment is a transparent first dielectric layer having a first surface and a second surface; a first conductive layer located on the first surface side of the first dielectric layer, The first conductive layer includes a conductive first mesh that forms a filter.

[0007] The substrate of the second embodiment is The filter may include a resonator formed by the first mesh.

[0008] The substrate of the third embodiment is the substrate of the second embodiment, The resonator may include a stub formed by the first mesh.

[0009] The substrate of the fourth aspect is the substrate of the second or third aspect, The resonator may include a distributed constant line formed by the first mesh.

[0010] The substrate of the fifth aspect is the substrate of any one of the second to fourth aspects, The aperture ratio of the resonator may be 92% or less.

[0011] The substrate of the sixth aspect is the substrate of any one of the second to seventh aspects, The aperture ratio of the resonator may be 40% or more.

[0012] The substrate of the seventh aspect is the substrate of any one of the second to sixth aspects, The outer edge of the resonator may be thicker than the conductive wires that form the holes of the first mesh.

[0013] The substrate of the eighth aspect is the substrate of any one of the first to seventh aspects, The filter may be a filter included in a multiplexer.

[0014] The substrate of the ninth embodiment is the substrate of the eighth embodiment, The multiplexer may include a main line formed by the first mesh and a plurality of branch lines formed by the first mesh, The filter may be provided on each of the plurality of branch lines.

[0015] The substrate of the tenth aspect is the substrate of any one of the first to ninth aspects, The first dielectric layer may have a dielectric loss tangent of 0.03 or less at 2.5 GHz.

[0016] The substrate of an eleventh aspect is the substrate of any one of the first to tenth aspects, a second conductive layer located on the second surface of the first dielectric layer; The second conductive layer may include a second conductive mesh.

[0017] The substrate of the twelfth embodiment is the substrate of the eleventh embodiment, The second mesh may form a radiating element electrically connected to the filter.

[0018] The substrate of the thirteenth aspect is the substrate of any one of the first to tenth aspects, a second conductive layer located on the second surface side of the first dielectric layer; a third conductive layer; a second dielectric layer located between the second conductive layer and the third conductive layer, The second conductive layer may include a conductive second mesh; The third conductive layer may include a radiating element fed by a slot in the second mesh.

[0019] The substrate of a fourteenth aspect is the substrate of any one of the first to tenth aspects, a second conductive layer located on the second surface side of the first dielectric layer; a third conductive layer; a second dielectric layer located between the first conductive layer and the third conductive layer, The second conductive layer may include a conductive second mesh; The third conductive layer may include a radiating element electrically connected to the filter.

[0020] The substrate of a fifteenth aspect is the substrate of any one of the first to tenth aspects, a second conductive layer located on the second surface side of the first dielectric layer; a third conductive layer located between the first dielectric layer and the second conductive layer; a second dielectric layer located between the third conductive layer and the second conductive layer, The second conductive layer may include a conductive second mesh; The third conductive layer may include a radiating element electrically connected to the filter.

[0021] The substrate of a 16th aspect is the substrate of any one of the 13th to 15th aspects, The third conductive layer may include a conductive third mesh that forms the radiating element.

[0022] The substrate of the seventeenth aspect is the substrate of any one of the first to tenth aspects, a second conductive layer located on the second surface of the first dielectric layer; When the distance between the first conductive layer and the second conductive layer is D and the opening ratio of the first mesh is R, D and R may satisfy the following formula.

[0023]

number

[0024] The antenna of the eighteenth aspect is a transparent first dielectric layer having a first surface and a second surface; a first conductive layer located on the first surface side of the first dielectric layer; a second conductive layer located on the second surface side of the first dielectric layer, The first conductive layer may include a conductive first mesh forming a filter; The second conductive layer may include a second conductive mesh forming a radiating element electrically connected to the filter. [Effects of the Invention]

[0025] According to the present disclosure, a substrate or a filter capable of ensuring light transmittance can be provided. [Brief explanation of the drawings]

[0026] [Figure 1]FIG. 2 is a cross-sectional view showing an example of a laminated structure of the substrate of the first embodiment. [Figure 2] 3 is a plan view showing an example of a conductive first mesh forming a filter in the substrate of the first embodiment. FIG. [Figure 3] FIG. 2 is a plan view showing a first example of a filter. [Figure 4] FIG. 2 is a diagram showing an equivalent circuit using lumped constants of a first example of a filter. [Figure 5A] FIG. 10 is a plan view showing a second example of the filter. [Figure 5B] FIG. 10 is a plan view showing a second example of the filter. [Figure 6A] FIG. 10 is a plan view showing a third example of the filter. [Figure 6B] FIG. 10 is a plan view showing a third example of the filter. [Figure 7] FIG. 10 is a plan view showing a fourth example of the filter. [Figure 8] FIG. 10 is a plan view showing a fifth example of the filter. [Figure 9] FIG. 10 is a plan view showing a sixth example of the filter. [Figure 10] FIG. 10 is a cross-sectional view showing an example of a laminated structure of a substrate according to a second embodiment. [Figure 11] FIG. 10 is a plan view showing an example of a conductive second mesh that forms a ground plane in the substrate of the second embodiment. [Figure 12] FIG. 10 is a plan view showing an example of a conductive second mesh that forms a radiating element in the substrate of the second embodiment. [Figure 13] FIG. 10 is a cross-sectional view showing an example of a laminated structure of a substrate according to a third embodiment. [Figure 14] FIG. 11 is a plan view showing an example of a conductive third mesh that forms a radiating element in a substrate according to a third embodiment. [Figure 15] FIG. 10 is a cross-sectional view showing an example of a laminated structure of a substrate according to a fourth embodiment. [Figure 16] FIG. 10 is a cross-sectional view showing an example of a laminated structure of a substrate according to a fifth embodiment. [Figure 17] FIG. 10 is a diagram illustrating the relationship between aperture ratio and insertion loss. [Figure 18] FIG. 10 is a plan view of an entire analytical model of a substrate according to a second embodiment. [Figure 19] FIG. 10 is an enlarged plan view of an entire analytical model of a substrate according to a second embodiment. [Figure 20] FIG. 10 is a plan view of a power supply line model of a substrate according to the second embodiment. [Figure 21] 10 is a diagram showing the relationship between the distance D and the insertion loss for each aperture ratio R. FIG. [Figure 22] 10 is a diagram showing the relationship between the aperture ratio R and the distance D. FIG. [Figure 23] 10A and 10B are diagrams illustrating an example of use of a substrate. DETAILED DESCRIPTION OF THE INVENTION

[0027] Hereinafter, the present embodiment will be described with reference to the drawings. Note that for ease of understanding, the scale of each part in the drawings may differ from the actual scale. Directions such as parallel, right angle, orthogonal, horizontal, vertical, up, down, left, and right, as well as terms such as identical and equal, are permitted to be deviated to the extent that they do not impair the functions and effects of the embodiment. The shape of the corners is not limited to right angles and may be rounded in an arched shape. Overlapping may include the meaning of partial overlap. Parallel, right angle, orthogonal, horizontal, and vertical may include approximately parallel, approximately right angle, approximately orthogonal, approximately horizontal, and approximately vertical.

[0028] In this specification, a three-dimensional Cartesian coordinate system with three axial directions (X-axis, Y-axis, and Z-axis) is used. The X-axis, Y-axis, and Z-axis directions represent directions parallel to the X-axis, Y-axis, and Z-axis, respectively. The X-axis, Y-axis, and Z-axis directions are perpendicular to one another. The XY plane, YZ plane, and ZX plane represent imaginary planes parallel to the X-axis and Y-axis directions, imaginary planes parallel to the Y-axis and Z-axis directions, and imaginary planes parallel to the Z-axis and X-axis directions, respectively.

[0029] The substrate of this embodiment is used for transmitting signals in high frequency bands (e.g., 0.3 GHz to 300 GHz) such as microwaves and millimeter waves. Such high frequency bands include the UHF band of 0.3 to 3 GHz, the SHF band of 3 to 30 GHz, and the EHF band of 30 to 300 GHz. Specific examples of high frequency devices formed on the substrate of this embodiment include planar antennas and planar waveguides (planar transmission lines).

[0030] The board of this embodiment may be used in, for example, a fifth generation mobile communication system (so-called 5G), wireless communication standards such as Bluetooth (registered trademark), and wireless LAN (Local Area Network) standards such as IEEE802.11ac. When used in a vehicle, the board of this embodiment may be used in an in-vehicle radar system that emits radar, or a V2X communication system such as vehicle-to-vehicle communication or road-to-vehicle communication.

[0031] Fig. 1 is a cross-sectional view showing an example of a layered structure of a substrate according to the first embodiment. The substrate 101 shown in Fig. 1 includes a first dielectric layer LD1 and a first conductive layer LC1. The Z-axis direction corresponds to the thickness direction of the substrate 101. The first dielectric layer LD1 and the first conductive layer LC1 are layered in the Z-axis direction.

[0032] The first dielectric layer LD1 is a transparent dielectric layer having a first surface 11 and a second surface 12. The second surface 12 is the surface opposite to the first surface 11. In the first embodiment, the first surface 11 faces the negative Z-axis direction. The second surface 12 faces the positive Z-axis direction. The normal direction of the first surface 11 and the second surface 12 corresponds to the Z-axis direction. The first surface 11 and the second surface 12 are major surfaces parallel to the XY plane, but may be curved with respect to the XY plane.

[0033] The first dielectric layer LD1 may be a plate-shaped or sheet-shaped substrate mainly made of a dielectric. The first dielectric layer LD1 may be a dielectric substrate or a dielectric sheet. The first dielectric layer LD1 may be a single dielectric layer or may include multiple dielectric layers. Examples of dielectric materials include glass and resin.

[0034] Examples of the glass used for the first dielectric layer LD1 include quartz glass, soda lime glass, alkali-free glass, aluminosilicate glass, borosilicate glass, and alkali borosilicate glass.

[0035] Examples of resins used for the first dielectric layer LD1 include COC (cycloolefin copolymer), COP (cycloolefin polymer), PET (polyethylene terephthalate), polycarbonate, acrylic, PVB (polyvinyl butyral), EVA (ethylene vinyl acetate), ionomer, polyimide, ceramics, liquid crystal polymer (LCP), polyphenylene ether (PPE), polycarbonate, or fluororesin.

[0036] Examples of fluororesins include ethylene-tetrafluoroethylene copolymers (hereinafter also referred to as "ETFE"), hexafluoropropylene-tetrafluoroethylene copolymers (hereinafter also referred to as "FEP"), tetrafluoroethylene-propylene copolymers, tetrafluoroethylene-hexafluoropropylene-propylene copolymers, perfluoro(alkyl vinyl ether)-tetrafluoroethylene copolymers (hereinafter also referred to as "PFA"), tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymers (hereinafter also referred to as "THV"), polyvinylidene fluoride (hereinafter also referred to as "PVDF"), vinylidene fluoride-hexafluoropropylene copolymers, polyvinyl fluoride, chlorotrifluoroethylene polymers, ethylene-chlorotrifluoroethylene copolymers (hereinafter also referred to as "ECTFE"), and polytetrafluoroethylene.

[0037] The dielectric material used for the first dielectric layer LD1 may be any one of these materials or a combination of two or more of them, but the dielectric material used for the first dielectric layer LD1 is not limited to these materials.

[0038] The first dielectric layer LD1 is a transparent dielectric layer that transmits visible light. "Transparent" may include "semitransparent." The visible light transmittance of the first dielectric layer LD1 is, for example, preferably 30% or more, more preferably 50% or more, even more preferably 70% or more, particularly preferably 80% or more, and most preferably 90% or more, in order to prevent blocking of visible light. The visible light transmittance of the first dielectric layer LD1 can be determined according to JIS R 3106 (1998).

[0039] A large dielectric loss tangent of the first dielectric layer LD1 increases the dielectric loss relative to the transmission loss of the filter (described later) formed on the first conductive layer LC1. When the dielectric loss tangent of the first dielectric layer LD1 at 2.5 GHz is 0.03 or less, dielectric loss can be reduced compared to when it exceeds 0.03. From the viewpoint of reducing dielectric loss, the dielectric loss tangent of the first dielectric layer LD1 at 2.5 GHz may be 0.02 or less, preferably 0.01 or less, more preferably 0.008 or less, and even more preferably 0.006 or less. The dielectric loss tangent can be measured, for example, by the split post dielectric resonator method (SPDR method). For such measurements, a Keysight split post dielectric resonator with a nominal fundamental frequency of 2.5 GHz, a Keysight E8361C vector network analyzer, and Keysight 85071E Option 300 dielectric constant calculation software can be used.

[0040] The first conductive layer LC1 is a conductive layer located on the side of the first surface 11 of the first dielectric layer LD1. The first conductive layer LC1 may be in contact with the first surface 11 of the first dielectric layer LD1, or may be disposed with a dielectric layer sandwiched between the first conductive layer LC1 and the first surface 11.

[0041] The first conductive layer LC1 is, for example, a planar conductor pattern whose main surface is parallel to the XY plane. The first conductive layer LC1 may be a conductor pattern formed on the first surface 11 side of the first dielectric layer LD1, or may be formed by a conductor sheet or conductor substrate arranged on the first surface 11 side of the first dielectric layer LD1.

[0042] Examples of conductor materials used for the first conductive layer LC1 include, but are not limited to, gold, silver, copper, platinum, aluminum, and chromium. The conductor used for the first conductive layer LC1 may be plated. The plated first conductive layer LC1 is resistant to corrosion and has good design properties.

[0043] The first conductive layer LC1 may be formed on the first surface 11 side of the first dielectric layer LD1 via an intermediate film such as polyvinyl butyral or ethylene vinyl acetate, or an adhesive layer such as optically clear adhesive (OCA). The first conductive layer LC1 may be formed by forming a conductor in a resin layer such as polyethylene terephthalate, etching it into a conductor pattern, and then forming the first conductive layer LC1 on the first surface 11 side of the first dielectric layer LD1 via an adhesive layer such as OCA. The first conductive layer LC1 may be formed by forming a conductor in polyvinyl butyral, ethylene vinyl acetate, polyethylene terephthalate, or the like by sputtering, vapor deposition, or the like, and then etching it into a conductor pattern, and then forming the first conductive layer LC1 on the first surface 11 side of the first dielectric layer LD1. The first conductive layer LC1 may be in direct contact with the first surface 11. Examples of a method for directly forming the first conductive layer LC1 on the first surface 11 include screen-printing a conductor paste such as silver or copper on the first surface 11 to form a conductor pattern, and then sintering the conductor pattern.

[0044] 2 is a plan view showing an example of a conductive first mesh forming a filter in the substrate of the first embodiment. In this example, the first conductive layer LC1 includes a conductive first mesh 13 forming filters 64 and 65. The filters 64 and 65 are configured with the first mesh 13 to function as, for example, a low-pass filter, a high-pass filter, a band-pass filter, or a band-rejection filter.

[0045] 2 shows an enlarged view of the first mesh 13. The first mesh 13 is, for example, a conductor pattern including conductive wires 16 that form the holes 15 of the first mesh 13. The holes 15 are open spaces defined by the conductive wires 16, and are regions of the first mesh 13 where the conductive wires 16 are not formed. The shape of the holes 15 is not limited to a hexagon, and may be other shapes such as a triangle, a rectangle, or a circle.

[0046] In the substrate 101 of the first embodiment, the filters 64, 65 are formed of a conductive first mesh 13. This improves the transmittance of visible light to the filters 64, 65 compared to a configuration in which the filters 64, 65 are formed of a conductive solid pattern, thereby improving the light transmittance of the substrate 101. The improved light transmittance of the substrate 101 makes it possible to suitably employ the substrate 101 as a substrate used in an environment in which transparency is required, for example, to improve design.

[0047] The filters 64 and 65 are circuits formed on the first conductive layer LC1 and are configured to be defined by the first mesh 13. The filters 64 and 65 receive a high-frequency signal flowing through the wiring formed on the first conductive layer LC1, and extract and output specific frequency components of the high-frequency signal. In Figure 2, a main line 61 and branch lines 62 and 63 are shown as examples of the wiring formed on the first conductive layer LC1.

[0048] The first mesh 13 may have a ground plane formed on the first conductive layer LC1. In the first conductive layer LC1, the ground plane is placed close to wiring (for example, the main line 61 and the branch lines 62 and 63), thereby generating a coplanar line using the wiring as a signal line.

[0049] The filters 64 and 65 are, for example, filters included in a diplexer 60. The diplexer 60 is a type of multiplexer that separates, extracts, or combines multiple signals. In this example, the diplexer 60 mixes two signals of different frequency bands that are input to two branch lines 62 and 63 and outputs the mixed signals from a single main line 61, or separates a signal that is input to a single main line 61 into two signals of different frequency bands and outputs the mixed signals from the two branch lines 62 and 63.

[0050] The diplexer 60 includes one main line 61, a plurality of branch lines 62, 63 branching from the main line 61, and a plurality of filters 64, 65 provided on the plurality of branch lines 62, 63.

[0051] The main line 61 may be formed of the conductive first mesh 13, similar to the filters 64 and 65. This improves the transmittance of visible light to the main line 61 compared to a configuration in which the main line 61 is formed of a conductive solid pattern, thereby improving the light transmittance of the substrate 101. By forming the main line 61 from the same first mesh 13 as the filters 64 and 65, the process of forming the main line 61 and the filters 64 and 65 is simplified.

[0052] At least one of the branch lines 62, 63 may be formed from the conductive first mesh 13, similar to the filters 64, 65. This improves the transmittance of visible light to the branch lines 62, 63 compared to a configuration in which the branch lines 62, 63 are formed from a conductive solid pattern, thereby improving the light transmittance of the substrate 101. By forming the branch lines 62, 63 from the same first mesh 13 as the filters 64, 65, the process of forming the branch lines 62, 63 and the filters 64, 65 is simplified.

[0053] The filters 64 and 65 may be used as filters included in a duplexer for electrically separating the transmission path and the reception path, rather than as filters included in a diplexer. The filters 64 and 65 may also be used as filters included in a multiplexer such as a triplexer, a quadplexer, or a pentaplexer. The greater the number of filters formed by the first mesh 13, the greater the effect of improving the optical transparency of the substrate 101 by forming the filters by the first mesh 13.

[0054] Fig. 3 is a plan view showing a first example of a filter. The filter shown in Fig. 3 is a two-stage resonator filter applicable to the above-mentioned filters 64 and 65. The filter shown in Fig. 3 has a resonator 70A provided on a wiring 72 connecting a signal input side 73 and an output side 74. A signal with a wavelength λ passing through the wiring 72 is transmitted from the input side 73 to the output side 74 via the resonator 70A.

[0055] The resonator 70A may be formed of a conductive first mesh 13. This improves the transmittance of visible light to the resonator 70A compared to a configuration in which the resonator 70A is formed of a conductive solid pattern, thereby improving the light transmittance of the substrate 101.

[0056] In the example shown in FIG. 3, the resonator 70A is a two-stage resonator including stubs 66, 67, 68, and 69 and a connection line 71.

[0057] The stubs 66 and 67 are open stubs having an inductive reactance component, and are connected in parallel to the wiring 72. The stubs 66 and 67 have a stub length longer than λ / 4, for example.

[0058] The stubs 68 and 69 are open stubs having a capacitive reactance component, and are connected in parallel to the wiring 72. The stubs 68 and 69 have a stub length that is shorter than λ / 4, for example.

[0059] The connection line 71 is a part of the wiring 72, and connects between the points where the stubs 66 and 68 are connected to the wiring 72 and the points where the stubs 67 and 69 are connected to the wiring 72. The characteristic impedance of the connection line 71 is higher than the characteristic impedance of the wiring on the input side 73 and the output side 74 outside the resonator 70A. The connection line 71 has a line length shorter than λ / 8, for example. The connection line 71 may have a line length that is an integer multiple of λ / 2 in the pass band of the resonator 70A.

[0060] Fig. 4 is a diagram showing a lumped-constant equivalent circuit of the filter shown in Fig. 3. Stubs 66 and 68 are LC resonators having a function equivalent to one LC parallel resonant circuit having an inductive reactance component and a capacitive reactance component. Stubs 67 and 69 are LC resonators having a function equivalent to one LC parallel resonant circuit having an inductive reactance component and a capacitive reactance component. Connection line 71 is a series inductor having a function of coupling the two LC resonators.

[0061] 3, some or all of the stubs 66, 67, 68, 69 and the connection line 71 may be formed from the conductive first mesh 13. This improves the transmittance of visible light to the stubs 66, 67, 68, 69 and the connection line 71 compared to a configuration in which the stubs 66, 67, 68, 69 and the connection line 71 are formed from a conductive solid pattern, thereby improving the light transmittance of the substrate 101.

[0062] FIG. 3 shows an enlarged view of the area where the first mesh 13 forms the resonator 70A. The resonator 70A has a predetermined aperture ratio. The aperture ratio of a resonator represents the ratio of the total area of ​​the apertures to the total area of ​​the resonator. The total area of ​​the resonator represents the total area of ​​the area where the first mesh 13 forms the resonator. The total area of ​​the apertures represents the total area of ​​the area (mesh 15) of the first mesh 13 where no conductor 16 is formed. In the case of FIG. 3, the total area of ​​the resonator 70A corresponds to the total area of ​​the stubs 66, 67, 68, 69 and the connecting line 71.

[0063] Increasing the aperture ratio of the resonator improves the light transmittance of the resonator, but increases the transmission loss of the resonator due to a decrease in the effective conductivity of the resonator. When the aperture ratio of the resonator is 92% or less, it is possible to ensure the light transmittance of the resonator and suppress the transmission loss, compared to when it exceeds 92%. From the viewpoint of suppressing the transmission loss, the aperture ratio of the resonator may be 90% or less, preferably 88% or less, and more preferably 86% or less.

[0064] When the aperture ratio of the resonator is 40% or more, it is possible to ensure light transmittance in the resonator and suppress transmission loss, compared to when the aperture ratio is less than 40%. From the viewpoint of improving light transmittance, the aperture ratio of the resonator may be 50% or more, preferably 60% or more, more preferably 70% or more, and even more preferably 80% or more.

[0065] The aperture ratio of the resonator is determined by the unit area (for example, 1 mm ) within the area where the first mesh 13 forms the resonator. 2 ) may be defined as the ratio of the total area of ​​the openings to the total area of ​​the openings.

[0066] Furthermore, when the outer edge of the resonator is thicker, high-frequency current flows more easily along the portion of the outer edge of the resonator where electrical resistance is low, thereby reducing the insertion loss in the resonator. In the example shown in Fig. 3, the outer edge 14 of the resonator 70A has a line width d2 that is wider than the line width d1 of the conductive wire 16 that forms the holes 15 of the first mesh 13. When the line width d2 is wider than the line width d1, high-frequency current flows more easily along the outer edge 14 than when the line width is the same, thereby reducing the insertion loss in the resonator 70A.

[0067] The form of the filter is not limited to the form shown in Fig. 3. Next, an example of a filter having a form different from that shown in Fig. 3 will be described. Note that the above description of Fig. 3 can also be applied to other example filters shown below.

[0068] 5A is a plan view showing a second example of the filter. The filter shown in FIG. 5A is a two-stage resonator filter applicable to the above-described filters 64 and 65, and has a resonator 70B formed by a first mesh 13.

[0069] The resonator 70B is a two-stage resonator including stubs 66, 67, 68, and 69 and a connection line 71. The resonator 70B differs from the resonator 70A in the shape of the stubs 66 and 67.

[0070] Stubs 66 and 67 are short stubs having an inductive reactance component and are connected in parallel to wiring 72. The tips of stubs 66 and 67 are connected to ground 75. Ground 75 shown in FIG. 5A is a ground plane formed on first conductive layer LC1 and corresponds to the ground of the coplanar line.

[0071] 6A is a plan view showing a third example of a filter. The filter shown in FIG. 6A is a two-stage resonator filter applicable to the above-described filters 64 and 65, and has a resonator 70C formed by a first mesh 13.

[0072] The resonator 70C is a two-stage resonator including stubs 66 and 67, interdigital capacitors 76 and 77, and a connecting line 71. The resonator 70B in FIG. 5A has stubs 68 and 69, whereas the resonator 70C in FIG. 6A differs from the resonator 70B in that it has interdigital capacitors 76 and 77.

[0073] The interdigital capacitors 76 and 77 are patterns having capacitive reactance components. The tips of the interdigital capacitors 76 and 77 are connected to the ground 75.

[0074] Fig. 7 is a plan view showing a fourth example of a filter. The filter shown in Fig. 7 is a distributed constant filter 78A applicable to the above-mentioned filters 64 and 65, and has ribbon resonators 79A and 79B linearly formed by a first mesh 13. Distributed constant filter 78A is an edge-coupled filter including ribbon resonators 79A and 79B, each having a line length of λ / 2. Ribbon resonators 79A and 79B have distributed constant lines formed by a first mesh 13.

[0075] Fig. 8 is a plan view showing a fifth example of a filter. The filter shown in Fig. 8 is a distributed constant filter 78B applicable to the above-mentioned filters 64 and 65, and has ribbon resonators 80A, 80B, 80C, and 80D formed to include bends by first mesh 13. Distributed constant filter 78B is a hairpin filter including ribbon resonators 80A, 80B, 80C, and 80D, each having a line length of λ / 2. Ribbon resonators 80A, 80B, 80C, and 80D have distributed constant lines formed by first mesh 13.

[0076] Fig. 9 is a plan view showing a sixth example of a filter. The filter shown in Fig. 9 is a distributed constant filter 78C applicable to the above-mentioned filters 64 and 65, and has an open loop resonator 81 formed to include a notch by the first mesh 13. The open loop resonator 81 has a distributed constant line formed by the first mesh 13.

[0077] Fig. 10 is a cross-sectional view showing an example of the laminated structure of a substrate according to the second embodiment. In the second embodiment, the description of the same structure, action, and effect as those of the first embodiment will be omitted by referencing the above description. The substrate 102 shown in Fig. 10 differs from the substrate 101 in that it further includes a second conductive layer LC2.

[0078] The substrate 102 includes a second conductive layer LC2 located on the second surface 12 side of the first dielectric layer LD1. The second conductive layer LC2 may be in contact with the second surface 12 of the first dielectric layer LD1, or may be disposed with a dielectric layer sandwiched between the second surface 12 and the second conductive layer LC2. The configuration, material, and aperture ratio of the second conductive layer LC2 may be the same as the above-described configuration, material, and aperture ratio of the first conductive layer LC1.

[0079] 10, the distance between the first conductive layer LC1 and the second conductive layer LC2 is D, and the aperture ratio of the first mesh 13 (the conductive first mesh that forms the filter) included in the first conductive layer LC1 is R. In this case, if D and R satisfy the following formula, it is possible to ensure the light transmittance of the filter and suppress the transmission loss at the same time.

[0080]

number

[0081] Fig. 11 is a plan view showing an example of a conductive second mesh that forms a ground plane in a substrate according to the second embodiment. For convenience, Fig. 11 shows each layer transparently so that the configuration of each layer can be clearly seen. The second conductive layer LC2 of the substrate 102 shown in Fig. 11 includes a conductive second mesh 23 that forms the ground plane.

[0082] 11 shows an enlarged view of the second mesh 23. The second mesh 23 is, for example, a conductor pattern including conductive wires 26 that form the holes 25 of the second mesh 23. The holes 25 are open spaces defined by the conductive wires 26, and are regions of the second mesh 23 where the conductive wires 26 are not formed. The shape of the holes 25 is not limited to a hexagon, and may be other shapes such as a triangle, a rectangle, or a circle.

[0083] In the substrate 102 of the second embodiment, the ground plane is formed of a conductive second mesh 23. This improves the transmittance of visible light to the ground plane compared to a configuration in which the ground plane is formed of a conductive solid pattern, thereby improving the optical transparency of the substrate 102. The improved optical transparency of the substrate 102 makes it suitable for use as a substrate in environments where transparency is required, for example, to improve design.

[0084] In a plan view of the substrate 102, a first dielectric layer LD1 is disposed between the wiring (e.g., main line 61 and branch lines 62, 63) formed on the first conductive layer LC1 and the ground plane formed on the second conductive layer LC2 by the second mesh 23. This forms a microstrip line using the wiring as a signal line.

[0085] FIG. 11 shows an enlarged view of the area where the second mesh 23 forms the ground plane. The ground plane has a predetermined aperture ratio. The aperture ratio of the ground plane represents the ratio of the total area of ​​the apertures to the total area of ​​the ground plane. The total area of ​​the ground plane represents the total area of ​​the area where the second mesh 23 forms the ground plane. The total area of ​​the apertures represents the total area of ​​the area (mesh 25) of the second mesh 23 where no conductors 26 are formed.

[0086] The aperture ratio of the ground plane may be the same as or different from the aperture ratio of the resonator described above. The aperture ratio of the ground plane is determined by the ratio of the number of apertures per unit area (for example, 1 mm²) within the region where the second mesh 23 forms the ground plane. 2 ) may be defined as the ratio of the total area of ​​the openings to the total area of ​​the openings.

[0087] Fig. 12 is a plan view showing an example of a conductive second mesh that forms radiating elements in a substrate according to the second embodiment. For convenience, Fig. 12 shows each layer transparently so that the configuration of each layer can be clearly seen. The second conductive layer LC2 of the substrate 102A shown in Fig. 12 includes a conductive second mesh 23 that forms radiating elements 21 and 22.

[0088] The radiating element 21 is electrically connected to the filter 64. The radiating element 21 formed on the second conductive layer LC2 may overlap the branch line 62 formed on the first conductive layer LC1 in a planar view, with the first dielectric layer LD1 sandwiched between them. Examples of a coupling method between the branch line 62 and the radiating element 21 include direct coupling, capacitive coupling, inductive coupling, and electromagnetic field coupling. The radiating element 21 is formed so as to be able to transmit or receive radio waves having a frequency within the pass band of the filter 64.

[0089] The radiating element 22 is electrically connected to the filter 65. The radiating element 22 formed on the second conductive layer LC2 may overlap the branch line 63 formed on the first conductive layer LC1 in a planar view, with the first dielectric layer LD1 sandwiched between them. Examples of a coupling method between the branch line 63 and the radiating element 22 include direct coupling, capacitive coupling, inductive coupling, and electromagnetic field coupling. The radiating element 22 is formed so as to be able to transmit or receive radio waves having a frequency within the passband of the filter 65.

[0090] In the substrate 102A of the second embodiment, the radiating elements 21, 22 are formed by a conductive second mesh 23. This improves the transmittance of visible light to the radiating elements 21, 22 compared to a configuration in which the radiating elements 21, 22 are formed by a conductive solid pattern, thereby improving the light transmittance of the substrate 102A. Due to the improved light transmittance of the substrate 102A, the substrate 102A can be suitably used as a substrate for use in environments where transparency is required, for example, to improve design. Since the substrate 102A has the radiating elements 21, 22, it can be used as an antenna.

[0091] The second mesh 23 of the substrate 102A may form a ground plane with the radiating element, similar to the case of the substrate 102.

[0092] Fig. 13 is a cross-sectional view showing an example of the laminated structure of a substrate according to the third embodiment. In the third embodiment, the description of the same configuration, action, and effect as those of the above-described embodiments will be omitted by referencing the above description. The substrate 103 shown in Fig. 13 differs from the substrate 102 in that it further includes a second dielectric layer LD2 and a third conductive layer LC3.

[0093] The second dielectric layer LD2 is located between the second conductive layer LC2 and the third conductive layer LC3. The configuration, material, and visible light transmittance of the second dielectric layer LD2 may be the same as those of the first dielectric layer LD1.

[0094] The third conductive layer LC3 may be in contact with the second dielectric layer LD2, or may be disposed with a dielectric layer sandwiched between it and the second dielectric layer LD2. The configuration, material, and aperture ratio of the third conductive layer LC3 may be the same as the above-described configuration, material, and aperture ratio of the first conductive layer LC1.

[0095] Fig. 14 is a plan view showing an example of a conductive third mesh that forms radiating elements in a substrate according to the third embodiment. For convenience, Fig. 14 shows each layer transparently so that the configuration of each layer can be clearly seen. The third conductive layer LC3 of the substrate 103 shown in Fig. 14 includes a conductive third mesh 33 that forms radiating elements 31 and 32. The third mesh 33 may form lines 37 and 38.

[0096] 14 shows an enlarged view of the third mesh 33. The third mesh 33 is, for example, a conductor pattern including conductive wires 36 that form the holes 35 of the third mesh 33. The holes 35 are open spaces defined by the conductive wires 36, and are regions of the third mesh 33 where the conductive wires 36 are not formed. The shape of the holes 35 is not limited to a hexagon, and may be other shapes such as a triangle, a rectangle, or a circle.

[0097] The radiating element 31 is fed by a slot 27 formed in the second mesh 23 of the second conductive layer LC2. The slot 27 formed in the second conductive layer LC2 intersects (e.g., is perpendicular to) a straight portion of the branch line 62 formed in the first conductive layer LC1 in a planar view, with the first dielectric layer LD1 sandwiched between them. The slot 27 formed in the second conductive layer LC2 intersects (e.g., is perpendicular to) a straight portion of the line 37 formed in the third conductive layer LC3 in a planar view, with the second dielectric layer LD2 sandwiched between them. The line 37 is electrically connected to the radiating element 31 by direct coupling, capacitive coupling, inductive coupling, or the like. The radiating element 31 is configured to be able to transmit or receive radio waves having a frequency within the passband of the filter 64.

[0098] The radiating element 32 is fed by a slot 28 formed in the second mesh 23 of the second conductive layer LC2. The slot 28 formed in the second conductive layer LC2 intersects (e.g., is perpendicular to) a straight portion of the branch line 63 formed in the first conductive layer LC1 in a planar view, with the first dielectric layer LD1 sandwiched therebetween. The slot 28 formed in the second conductive layer LC2 intersects (e.g., is perpendicular to) a straight portion of the line 38 formed in the third conductive layer LC3 in a planar view, with the second dielectric layer LD2 sandwiched therebetween. The line 38 is electrically connected to the radiating element 32 by direct coupling, capacitive coupling, inductive coupling, or the like. The radiating element 32 is configured to be able to transmit or receive radio waves having a frequency within the passband of the filter 65.

[0099] In the substrate 103 of the third embodiment, the radiating elements 31, 32 are formed by a conductive third mesh 33. This improves the transmittance of visible light to the radiating elements 31, 32 compared to a configuration in which the radiating elements 31, 32 are formed by a conductive solid pattern, thereby improving the light transmittance of the substrate 103. Due to the improved light transmittance of the substrate 103, the substrate 103 can be suitably used as a substrate for use in environments where transparency is required, for example, to improve design. Since the substrate 103 has the radiating elements 31, 32, it can be used as an antenna.

[0100] Fig. 15 is a cross-sectional view showing an example of the laminated structure of the substrate of the fourth embodiment. In the fourth embodiment, the description of the same structure, action, and effect as those of the above-mentioned embodiments will be omitted by citing the above description. The structure, material, visible light transmittance, and aperture ratio of each layer of the substrate 104 of the fourth embodiment shown in Fig. 15 may be the same as those of each layer of the substrate of the above-mentioned embodiments.

[0101] In the fourth embodiment, the first surface 11 of the first dielectric layer LD1 faces the positive Z-axis direction. The second surface 12 of the first dielectric layer LD1 faces the negative Z-axis direction. The first conductive layer LC1 is located on the first surface 11 side of the first dielectric layer LD1. The first conductive layer LC1 includes a conductive first mesh 13 that forms the filters 64 and 65, as in the above embodiments. The second conductive layer LC2 is located on the second surface 12 side of the first dielectric layer LD1. The second conductive layer LC2 includes a conductive second mesh 23 that forms a ground plane, as in the above embodiments. The second dielectric layer LD2 is located between the first conductive layer LC1 and the third conductive layer LC3. The third conductive layer LC3 includes radiating elements 31 and 32 that are electrically connected to the filters 64 and 65, as in the above embodiments. The third conductive layer LC3 includes a conductive third mesh 33 that forms the radiating elements 31 and 32, as in the above embodiments. Therefore, the substrate 104 of the fourth embodiment can be used as an antenna with ensured optical transparency, similar to the above embodiments.

[0102] Fig. 16 is a cross-sectional view showing an example of the laminated structure of the substrate of the fifth embodiment. In the fifth embodiment, the description of the same structure, action, and effect as those of the above-mentioned embodiments will be omitted by citing the above description. The structure, material, visible light transmittance, and aperture ratio of each layer of the substrate 105 of the fifth embodiment shown in Fig. 16 may be the same as those of each layer of the substrate of the above-mentioned embodiments.

[0103] In the fifth embodiment, the first surface 11 of the first dielectric layer LD1 faces the positive Z-axis direction. The second surface 12 of the first dielectric layer LD1 faces the negative Z-axis direction. The first conductive layer LC1 is located on the first surface 11 side of the first dielectric layer LD1. The first conductive layer LC1 includes a conductive first mesh 13 that forms the filters 64 and 65, as in the above embodiments. The second conductive layer LC2 is located on the second surface 12 side of the first dielectric layer LD1. The second conductive layer LC2 includes a conductive second mesh 23 that forms a ground plane, as in the above embodiments. The second dielectric layer LD2 is located between the third conductive layer LC3 and the second conductive layer LC2. The third conductive layer LC3 is located between the first dielectric layer LD1 and the second conductive layer LC2. The third conductive layer LC3 includes radiating elements 31 and 32 that are electrically connected to the filters 64 and 65, as in the above embodiments. Similar to the above-described embodiments, the third conductive layer LC3 includes a conductive third mesh 33 that forms the radiating elements 31 and 32. Therefore, similar to the above-described embodiments, the substrate 105 of the fifth embodiment can be used as an antenna with ensured optical transparency.

[0104] Fig. 17 is a diagram showing the relationship between the aperture ratio and the insertion loss. Fig. 17 shows the results of a simulation of the relationship between the aperture ratio of the resonator 70A shown in Fig. 3 and the insertion loss in the resonator 70A. When the aperture ratio of the resonator 70A is 95% or less, the insertion loss in the resonator 70A is 8 dB or less. When the aperture ratio of the resonator 70A is 89% or less, the insertion loss in the resonator 70A is 4 dB or less.

[0105] Fig. 17 shows the simulation results obtained using the simulator ANSYS HFSS, using the model shape shown in Figs. 18-20 corresponding to the substrate 102 (Fig. 10) of the second embodiment. The dimensions of each part of the model shape are the dimensional values ​​shown in Figs. 18-20 (unit: mm). The insertion loss on the vertical axis represents the insertion loss at 4.05 GHz, and is the calculated value obtained by subtracting the insertion loss of the feeder line model in Fig. 20 from the insertion loss of the overall analysis model in Fig. 18.

[0106] FIG. 18 is a plan view of an overall analytical model of a substrate according to the second embodiment. A first conductive layer LC1 has a conductive first mesh 13 that forms a filter. The filter shown in FIG. 18 has a resonator 70 provided on a wiring 72 that connects a signal input side 73 and an output side 74. The resonator 70 is a three-stage resonator having six stubs extending from the wiring 72 in the X-axis direction. FIG. 19 is an enlarged plan view of the overall analytical model of a substrate according to the second embodiment. FIG. 20 is a plan view of a power supply line model of a substrate according to the second embodiment.

[0107] The aperture ratio R of the first mesh 13 is equal to the aperture ratio of the resonator 70. The aperture ratio of the resonator 70 represents the ratio of the total area of ​​the apertures to the total area of ​​the resonator 70. The total area of ​​the resonator 70 represents the total area of ​​the region where the first mesh 13 forms the resonator 70. The total area of ​​the apertures represents the total area of ​​the region (mesh 15) of the first mesh 13 where no conductor 16 (FIG. 2) is formed. In the cases of FIGS. 18 and 19, the total area of ​​the resonator 70 corresponds to the total area of ​​the six stubs and the connecting lines connecting those stubs.

[0108] In the simulation of FIG. 17, the aperture ratio R is substituted with the conductivity σ, which correlates with the aperture ratio R. The effective conductivity σ (=1933333 S / m) of a honeycomb mesh (first mesh 13) with a line width of 28 μm and an aperture ratio of 76.6% is defined as the reference conductivity σ0, and the aperture ratio R when the line width is multiplied by X is substituted with the conductivity σ obtained by multiplying the reference conductivity σ0 by X. Specifically, in the simulation of FIG. 17, the relationship between the aperture ratio R and the conductivity σ of the first mesh 13 is as follows: R=66.6%⇒σ=2900000S / m R=76.6%⇒σ=1933333S / m R=86.7%⇒σ=580000S / m R=91.7%⇒σ=483333S / m R=92.9%⇒σ=322222S / m is.

[0109] Other conditions during the simulation in Figure 17 are: Thickness D1 of the first conductive layer LC1: 12 μm Thickness of the first dielectric layer LD1: equal to the distance D Distance D: 0.73mm Relative permittivity of first dielectric layer LD1: 5.2 Dielectric tangent of first dielectric layer LD1: 0.006 Thickness D2 of the second conductive layer LC2: 12 μm Let's say.

[0110] Next, for the substrate 102 of the second embodiment (Figure 10), we will explain the results of a simulation of the relationship between the distance D between the first conductive layer LC1 and the second conductive layer LC2 and the aperture ratio R of the first mesh 13 (Figure 2) included in the first conductive layer LC1.

[0111] Figure 21 shows the relationship between distance D and insertion loss for each aperture ratio R. Figure 21 shows the simulation results obtained using the simulator ANSYS HFSS, using the model geometry shown in Figures 18-20. The dimensions of each part of the model geometry are the dimensional values ​​shown in Figures 18-20 (unit: mm). The insertion loss on the vertical axis represents the insertion loss at 4.05 GHz, and is the calculated value obtained by subtracting the insertion loss of the feeder line model in Figure 20 from the insertion loss of the overall analysis model in Figure 18.

[0112] Other conditions during the simulation in Figure 21 are: Distance D: 6 types: 0.23mm, 0.33mm, 0.53mm, 0.73mm, 0.93mm, 1.23mm The simulation conditions are the same as those described above in FIG. 17, except that

[0113] Fig. 22 is a diagram showing the relationship between the aperture ratio R and the distance D. Fig. 22 shows the relationship between the distance D and the aperture ratio R at which the insertion loss in Fig. 21 becomes 4 dB. When the aperture ratio R is 92.9% or more, the insertion loss of the filter does not become 4 dB or less even if the distance D is increased. When the aperture ratio R is less than 92.9%, the regression equation that expresses the relationship shown in Fig. 22 is expressed by the following Equation 1.

[0114]

number

[0115]

number

[0116] The main substrate 50 is, for example, a glass plate for construction or a vehicle. Architectural glass plates include window glass, glass facades, etc. The main substrate 50 may be a substrate other than a glass plate for construction. The main substrate 50 may include concrete, mortar, cement paste, glass, crystallized glass, ceramic tile, stone, etc.

[0117] The main substrate 50 is not limited to a single pane, and may be laminated glass, double-glazed glass, Low-E glass, light-control glass, or glass containing linear components. Low-E glass is also called low-emissivity glass, and may be a glass in which a heat-reflecting coating layer (transparent conductive film) is coated on the indoor surface of the window glass (main substrate 50). When the window glass (main substrate 50) is a double-glazed glass, a heat-reflecting coating layer (transparent conductive film) may be coated on the surface of the indoor-side glass facing the hollow layer, or a transparent conductive film may be coated on the surface of the outdoor-side glass facing the hollow layer.

[0118] The main substrate 50 may include a conductive layer 53 having a heat ray reflection function. The conductive layer 53 is, for example, a coating layer formed on the indoor main surface of the main substrate 50. The conductive layer 53 may be provided on the inner layer of the main substrate 50. When the main substrate 50 is a double-glazed glass, the conductive layer 53 may be formed on the main surface of the indoor glass on the hollow layer side, or the conductive layer 53 may be coated on the surface of the outdoor glass on the hollow layer side. The conductive layer 53 may have an opening 54 formed in a location facing at least a portion of the substrate 100 (e.g., one or more radiating elements included in the substrate 100) in a planar view. The opening 54 is a portion of the conductive layer 53 where no conductor is formed. The opening 54 improves the transmission performance of radio waves transmitted or received by the substrate 100 through the main substrate 50. The number of openings 54 may be one or more. The shape of the opening 54 may be rectangular, circular, slit-shaped, or the like.

[0119] The conductive layer 53 may be a conductive film. Examples of the conductive film include a laminated film in which a transparent dielectric, a metal film, and a transparent dielectric are sequentially stacked, indium tin oxide (ITO), or fluorinated tin oxide (FTO). Examples of the metal film include a film containing at least one selected from the group consisting of silver, gold, copper, and aluminum as a main component.

[0120] The support part 40 fixes the substrate 100 so that a space is formed between the main substrate 50 and the substrate 100. The space is, for example, a fluid layer such as an air layer. By forming the space between the main substrate 50 and the substrate 100, convection occurs in the space due to the chimney effect, which can increase heat dissipation from the substrate 100 and prevent the main substrate 50 (for example, window glass) from cracking due to heat.

[0121] The support portion 40 may be a spacer that secures a space between the main substrate 50 and the substrate 100. The support portion 40 may be formed of a dielectric base material. The material of the support portion 40 may be a known resin such as polycarbonate resin, polyphenylene ether resin, polybutylene terephthalate, ABS resin, silicone resin, polysulfide resin, or acrylic resin. Alternatively, a metal such as aluminum may be used.

[0122] The distance Dg between the main substrate 50 and the substrate 100 is, for example, 150 mm or less. If the distance Dg is 3 mm or more and 20 mm or less, it is possible to suppress cracking of the main substrate 50 due to heat while also allowing radio wave transmission through the main substrate 50, thereby improving the effectiveness of installing the substrate 100. If the distance Dg is 3 mm or more, heat dissipation is improved, making the main substrate 50 less likely to crack due to heat. If the distance Dg is 5 mm or more, the heat dissipation of the substrate 100 is improved, making the main substrate 50 less likely to crack. Furthermore, if the distance Dg is 20 mm or less, it is possible to suppress a decrease in the intensity of the beam radiated through the main substrate 50. If the distance Dg is 8 mm or less, it is possible to further suppress a decrease in the intensity of the beam radiated through the main substrate 50. Furthermore, if the wavelength at the operating frequency of the radiating element of the substrate 100 is λg, the distance Dg may be 0.28 λg or more and 0.93 λg or less.

[0123] The substrate 100 is optically transparent, so that when the substrate 100 is placed opposite a transparent main substrate 50 such as a window pane, visibility through the window pane can be ensured.

[0124] Although the embodiments have been described above, they are presented as examples and the present invention is not limited to the above embodiments. The above embodiments can be implemented in various other forms, and various combinations, omissions, substitutions, modifications, etc. can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, and are also included in the scope of the invention and its equivalents as set forth in the claims.

[0125] For example, the antenna device 200 does not have to be fixed to the main board 50. The antenna device 200 can be hung from the ceiling or fixed to a protrusion present around the main board 50 (for example, a window frame or window sash that holds the outer edge of the window glass) so that it is installed and used facing the main board 50. The antenna device 200 can be installed in contact with the main board 50, or in close proximity to the main board 50 without contacting it.

[0126] Furthermore, the antenna device 200 is not limited to being placed indoors facing the indoor surface of the window glass main substrate 50, but may also be placed outdoors facing the outdoor surface of the main substrate 50. [Explanation of symbols]

[0127] 11 Page 1 12 Side 2 13 1st mesh 14 outer edge 15 eyes 16 Conductor 21,22 Radiating element 23 2nd mesh 25 eyes 26 Conductor 27,28 Slots 31,32 Radiating element 33 3rd mesh 35 eyes 36 Conductor 37,38 railroad tracks 40 Support part 50 Main board 53 Conductive layer 54 Aperture 60 Diplexer 61 Main Line 62,63 branch line 64,65 Filter 66,67,68,69 Stub 70,70A,70B,70C resonator 71 Connecting Line 72 Wiring 73 Input side 74 Output side 75 grand 76,77 Interdigital capacitor 78A, 78B, 78C distributed constant filters 79A, 79B, 80A, 80B, 80C, 80D ribbon resonators 81 Open Loop Resonator 100,101,102,103,104,105 board 200 Antenna device d1,d2 line width LC1 1st conductive layer LC2 second conductive layer LC3 3rd conductive layer LD1 First dielectric layer LD2 Second dielectric layer

Claims

1. a transparent first dielectric layer having a first surface and a second surface; a first conductive layer located on the first surface side of the first dielectric layer, The first conductive layer includes a conductive first mesh forming a filter.

2. The substrate of claim 1 , wherein the filter includes a resonator formed by the first mesh.

3. The substrate of claim 2 , wherein the resonator includes a stub formed by the first mesh.

4. 3. The substrate according to claim 2, wherein the resonator includes a distributed constant line formed by the first mesh.

5. The substrate according to claim 2 , wherein the aperture ratio of the resonator is 92% or less.

6. The substrate according to claim 5 , wherein the aperture ratio of the resonator is 40% or more.

7. The substrate according to claim 2 , wherein the outer edges of the resonators are thicker than the conductive wires that form the holes of the first mesh.

8. The substrate of claim 1 , wherein the filter is a filter included in a multiplexer.

9. the multiplexer includes a main line formed by the first mesh and a plurality of branch lines formed by the first mesh; The substrate of claim 8 , wherein the filter is provided on each of the plurality of branch lines.

10. The substrate of claim 1 , wherein the first dielectric layer has a dielectric loss tangent of 0.03 or less at 2.5 GHz.

11. a second conductive layer located on the second surface side of the first dielectric layer; The substrate of claim 1 , wherein the second conductive layer comprises a second conductive mesh.

12. The substrate of claim 11 , wherein the second mesh forms a radiating element electrically connected to the filter.

13. a second conductive layer located on the second surface of the first dielectric layer; a third conductive layer; a second dielectric layer located between the second conductive layer and the third conductive layer; the second conductive layer includes a conductive second mesh; The substrate of claim 1 , wherein the third conductive layer includes a radiating element fed by a slot opened in the second mesh.

14. a second conductive layer located on the second surface of the first dielectric layer; a third conductive layer; a second dielectric layer located between the first conductive layer and the third conductive layer; the second conductive layer includes a conductive second mesh; The substrate of claim 1 , wherein the third conductive layer includes a radiating element electrically connected to the filter.

15. a second conductive layer located on the second surface of the first dielectric layer; a third conductive layer located between the first dielectric layer and the second conductive layer; a second dielectric layer located between the third conductive layer and the second conductive layer; the second conductive layer includes a conductive second mesh; The substrate of claim 1 , wherein the third conductive layer includes a radiating element electrically connected to the filter.

16. 16. The substrate of claim 13, wherein the third conductive layer includes a conductive third mesh that forms the radiating element.

17. a second conductive layer located on the second surface side of the first dielectric layer; 11. The substrate according to claim 1, wherein when a distance between the first conductive layer and the second conductive layer is D and an opening ratio of the first mesh is R, D and R satisfy the following formula: [Equation 1]

18. a transparent first dielectric layer having a first surface and a second surface; a first conductive layer located on the first surface side of the first dielectric layer; a second conductive layer located on the second surface side of the first dielectric layer, the first conductive layer includes a conductive first mesh forming a filter; The second conductive layer includes a conductive second mesh forming a radiating element electrically connected to the filter.

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