Mounting board, power supply device, and luminaire

Abstract

To improve heat dissipation performance of a heat generating component mounted on a component surface.SOLUTION: A second printed circuit board 42 comprises a substrate 420, an electronic component 421, a heat dissipating member 422, and a heat conduction path 423. The substrate 420 comprises a component surface 420A on which an insertion component is mounted, and a solder surface 420B on the side opposite to the component surface 420A. The electronic component 421 is mounted on the component surface 420A via a first heat conductor 424. The heat dissipating member 422 is installed on the solder surface 420B via a second heat conductor 425. The heat conduction path 423 penetrates the substrate 420, and thermally connects the first heat conductor 424 and the second heat conductor 425.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a mounting board, a power supply device, and a lighting fixture, and more particularly to a mounting board on which an electronic component that generates heat is mounted, a power supply device having the mounting board, and a lighting fixture including the power supply device. [Background technology]

[0002] As a conventional example, a lighting device (power supply device) and a circuit board (mounting board) described in Patent Document 1 are exemplified. The lighting device described in Patent Document 1 includes a circuit board configured by mounting electronic components, including heat-generating components such as transistors, on a printed circuit board, and a metal case body to which the circuit board is attached. The case body has a rectangular bottom surface provided with a case protrusion that protrudes inward. The circuit board is attached to the case body so that the heat-generating components (transistors) come into contact with the case protrusion.

[0003] In the conventional example, heat emitted from the heat-generating components is dissipated to the case body via the case protrusion. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-135263 Summary of the Invention [Problem to be solved by the invention]

[0005] In the conventional example, the case convex portion is brought into contact with heat-generating components mounted on the side of the printed circuit board where only surface-mounted electronic components are mounted, but the case convex portion cannot be brought into contact with heat-generating components mounted on the component side of the printed circuit board where insertable components are mounted.

[0006] An object of the present disclosure is to provide a mounting board, a power supply device, and a lighting fixture that can improve the heat dissipation of heat-generating components mounted on the component surface. [Means for solving the problem]

[0007] A mounting board according to one aspect of the present disclosure includes a substrate, an electronic component, a heat dissipation member, and a heat conduction path. The substrate has a component side on which an insert component is mounted and a side opposite the component side. The electronic component is mounted on the component side via a first thermal conductor. The heat dissipation member is installed on the opposite side via a second thermal conductor. The heat conduction path thermally connects the first thermal conductor and the second thermal conductor through the substrate.

[0008] A power supply device according to one aspect of the present disclosure includes a mounting substrate, the mounting substrate being a printed circuit board on which a power supply circuit is formed.

[0009] A lighting fixture according to one aspect of the present disclosure includes the power supply device, a light source that is lit by power supplied from the power supply device, and a fixture body that supports the power supply device and the light source. [Effects of the Invention]

[0010] The mounting board, power supply device, and lighting fixture of the present disclosure have the advantage of being able to improve the heat dissipation of heat-generating components mounted on the component surface. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a front view of a mounting board according to an embodiment of the present disclosure. [Figure 2] FIG. 2 is a rear view of the mounting board. [Figure 3] 3 is a cross-sectional view taken along line X1-X1 in FIG. [Figure 4] FIG. 4 is a perspective view of a ceramic capacitor corresponding to the heat dissipation member in the mounting board. [Figure 5] FIG. 5 is an exploded perspective view of a power supply device according to an embodiment of the present disclosure. [Figure 6] FIG. 6 is a perspective view of a lighting fixture according to an embodiment of the present disclosure. [Figure 7] FIG. 7 is an exploded perspective view of the lighting fixture. [Figure 8] FIG. 8 is a perspective view of a heat dissipation member in the first modification of the mounting board. [Figure 9] FIG. 9 is a cross-sectional view of a main part of a second modified example of the mounting board. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, a mounting board, a power supply device, and a lighting fixture according to embodiments of the present disclosure will be described in detail with reference to the drawings. However, each diagram described in the following embodiments is a schematic diagram, and the ratios of the sizes and thicknesses of the components do not necessarily reflect the actual dimensional ratios. Note that the configurations described in the following embodiments are merely examples of the present disclosure. The present disclosure is not limited to the following embodiments, and various modifications are possible depending on the design, etc., as long as the effects of the present disclosure can be achieved.

[0013] (1) Overview The mounting board (second printed circuit board 42) according to the embodiment includes a substrate 420, an electronic component 421, a heat dissipation member 422, and a heat conduction path 423 (see FIGS. 1 to 3).

[0014] The substrate 420 has a component side 420A on which insert components are mounted, and a side opposite the component side 420A (solder side 420B). However, not only insert components but also surface-mounted circuit components including electronic components 421 are mounted on the component side 420A of the substrate 420. Surface-mounted circuit components are also mounted on the solder side 420B of the substrate 420. In other words, the substrate 420 is a double-sided printed wiring board in which conductors (copper foil) are formed on both sides (component side 420A and solder side 420B).

[0015] The electronic component 421 is mounted on the component surface 420A via a first thermal conductor 424. The electronic component 421 is a circuit component (a so-called heat-generating component) that generates a relatively large amount of heat when energized, such as an integrated circuit. The first thermal conductor 424 is formed from a part of a conductor (copper foil) formed on the component surface 420A (see FIG. 3).

[0016] Heat dissipation member 422 is placed on solder surface 420B via second thermal conductor 425 (see FIG. 3). Second thermal conductor 425 is formed from a part of the conductor (copper foil) formed on solder surface 420B (see FIG. 3).

[0017] The heat conduction path 423 penetrates the substrate 420 and thermally connects the first heat conductor 424 and the second heat conductor 425 (see FIG. 3). The heat conduction path 423 is, for example, a plurality of plated through holes provided in the substrate 420.

[0018] Thus, the mounting board (second printed circuit board 42) according to the embodiment can conduct heat generated from the electronic component 421 when current is applied from the first thermal conductor 424 to the heat dissipation member 422 through the heat conduction path 423 and the second thermal conductor 425. As a result, the mounting board (second printed circuit board 42) according to the embodiment can improve the heat dissipation of the heat-generating component (electronic component 421) mounted on the component surface 420A by the heat dissipation member 422 thermally connected to the electronic component 421.

[0019] The power supply device 4 according to the embodiment also has a mounting substrate. The mounting substrate is a printed circuit board (second printed circuit board 42) that forms a power supply circuit (see FIGS. 3 and 5).

[0020] Furthermore, the lighting fixture A1 of the embodiment includes a power supply unit 4, a light source (LED 20) that lights up with power supplied from the power supply unit 4, and a fixture body 1 that supports the power supply unit 4 and the light source (LED 20) (see Figures 6 and 7).

[0021] Thus, the power supply device 4 and lighting device A1 according to the embodiment can improve the heat dissipation of the heat-generating components (electronic components 421) mounted on the component surface 420A, similar to the mounting board according to the embodiment.

[0022] (2) Details The mounting board (second printed circuit board 42) according to the embodiment constitutes a part of the power supply device 4 according to the embodiment (hereinafter, abbreviated as power supply device 4). The power supply device 4 is configured to light a light source (LED 20) included in the lighting fixture A1 according to the embodiment.

[0023] (2-1) Lighting equipment The lighting fixture A1 according to the embodiment (hereinafter simply referred to as lighting fixture A1) is a so-called spotlight that is detachably attached to a lighting wiring duct (also referred to as a lighting duct) (see FIG. 6 ). However, the lighting fixture A1 is not limited to a spotlight that is detachably attached to a lighting wiring duct. In the following description, the front-rear, left-right, and up-down directions of the lighting fixture A1 are defined in a state in which the axial direction (longitudinal direction) of the fixture body 1 and the longitudinal direction of the arm 5 are perpendicular to each other, as shown in FIG. 6 . That is, the longitudinal direction of the arm 5 is defined as the up-down direction, the axial direction of the fixture body 1 (the direction perpendicular to the longitudinal direction of the arm 5) is defined as the front-rear direction, and the direction perpendicular to the up-down direction and the front-rear direction is defined as the left-right direction (see the arrows in FIG. 6 ).

[0024] The lighting fixture A1 comprises a lighting fixture B1, an arm 5, and a plug unit 8 (see Figure 6). The plug unit 8 is mechanically, electrically, and detachably attached to a lighting wiring duct installed on a ceiling or the like. The arm 5 is rotatably attached to the bottom of the plug unit 8. The rotation axis of the arm 5 is parallel to the vertical direction. The lighting fixture B1 is supported by the arm 5 so that it can rotate within a plane that includes the vertical and front-to-back directions. However, the range in which the lighting fixture B1 can rotate is approximately 90 degrees from a position (see Figure 6) where the axial direction of the fixture body 1 is perpendicular to the longitudinal direction (vertical direction) of the arm 5 to a position where the axial direction of the fixture body 1 is parallel to the longitudinal direction (vertical direction) of the arm 5.

[0025] (2-2) Lighting equipment The lighting fixture B1 includes a fixture body 1, a light source unit 2, a lens unit 3, a power supply unit 4, an end cover 6, etc. (see FIGS. 6 and 7).

[0026] (2-3) Device body The appliance body 1 has a first body portion 11 and a second body portion 12. The first body portion 11 and the second body portion 12 are each formed by aluminum alloy die-casting into a cylindrical shape with both ends open. The first body portion 11 and the second body portion 12 have the same diameter but different axial lengths. The second body portion 12 is formed to have a longer axial length than the first body portion 11. However, the first body portion 11 and the second body portion 12 are not limited to being aluminum alloy die-casting, and may be formed from other metals, synthetic resins, or the like.

[0027] A rectangular slit 120 is formed in the second main body portion 12 from the rear end to the center in the axial direction. The width (left-right distance) of the slit 120 is wider than the width of the arm 5 (see FIG. 6).

[0028] (2-4) Light source unit The light source unit 2 includes an LED 20 as a light source, a holder 21, a pair of connectors 22, a heat conduction sheet, and a unit body 24 (see FIG. 7).

[0029] The LED 20 is a COB (Chip on Board) type white LED for illumination. However, the light source is not limited to an LED, and may be an organic electroluminescence element, a semiconductor laser element, or the like.

[0030] The unit body 24 is formed into a disk shape by die-casting an aluminum alloy, but the material of the unit body 24 is not limited to die-casting an aluminum alloy, and it may be formed from other metals or synthetic resins.

[0031] A rectangular recess is provided in the center of the front surface of unit body 24. A rectangular heat conduction sheet is housed in this recess. Also, a screw insertion hole 241 and a screw hole 242 are provided on both the left and right ends of unit body 24 (see FIG. 7).

[0032] A holder 21 for holding the LED 20 is attached to the front of the unit body 24. The holder 21 is made of synthetic resin and is formed in the shape of a frame with a square window in the center. The holder 21 holds the LED 20 by fitting it into the window. However, the holder 21 may be made of a material other than synthetic resin, such as metal or ceramic. The LED 20 held by the holder 21 and attached to the unit body 24 is thermally connected to the unit body 24 via the thermal conduction sheet by being in close contact with the thermal conduction sheet.

[0033] (2-5) Lens unit The lens unit 3 includes a lens, a lens holder, a cover 32, a rotor 33, and the like (see FIG. 7).

[0034] The lens is a Fresnel lens made of a light-transmitting synthetic resin such as silicone resin, acrylic resin, polycarbonate resin, etc. However, the lens may be made of a material other than synthetic resin, such as inorganic glass.

[0035] The lens holder is made of synthetic resin and has a circular shape, and holds the lens by surrounding the lens.

[0036] The cover 32 is formed in a disk shape from a translucent synthetic resin such as an acrylic resin. The cover 32 is attached to the rotor 33 as described below. The cover 32 covers the front surface of the rotor 33 to prevent insects from entering the rotor 33 (see FIG. 6).

[0037] The rotor 33 has a cylindrical portion and an annular operating portion 331 provided at the front end of the cylindrical portion (see FIG. 6). A lens and a lens holder are housed inside the cylindrical portion.

[0038] The lens unit 3 is housed in the first body portion 11 of the device main body 1, as will be described later (see FIGS. 6 and 7). Here, the lens unit 3 moves back and forth within the cylindrical portion by operating the operating portion 331 to rotate the rotor 33. In other words, the lens unit 3 can adjust the irradiation range of the light emitted from the LED 20 and collected by the lens by operating the operating portion 331 to change the relative distance between the LED 20 and the lens.

[0039] (2-6) Power supply device The power supply device 4 has an AC / DC conversion block 4A and a DC conversion block 4B (see FIG. 7).

[0040] The AC / DC conversion block 4A has an AC / DC conversion circuit that converts AC voltage (AC power) supplied from the power system via the lighting wiring duct and plug unit 8 into DC voltage (DC power). The AC / DC conversion circuit is composed of a first printed circuit board 41, which is a double-sided printed wiring board on which multiple circuit components are mounted. The AC / DC conversion block 4A also has a first heat sink 43 to which the first printed circuit board 41 is attached, and a first heat conduction member 45 interposed between the first printed circuit board 41 and the first heat sink 43 (see FIG. 7).

[0041] The first heat sink 43 is formed into a flat plate shape using a metal plate (for example, an aluminum plate) that is a good conductor of heat. The first heat conduction member 45 is formed, for example, from a silicone rubber sheet material that has excellent thermal conductivity and electrical insulation properties. Three female threads are provided on the first heat sink 43. The AC / DC conversion block 4A is assembled by placing the first heat conduction member 45 on the surface of the first heat sink 43, and then placing the first printed circuit board 41 on the surface of the first heat conduction member 45, and then screwing three mounting screws into the three female threads one by one.

[0042] The DC conversion block 4B has a DC conversion circuit that converts (steps down) the DC voltage output from the AC / DC conversion block 4A into a DC voltage suitable for the LEDs 20. The DC conversion circuit is configured with a second printed circuit board 42 (a mounting board according to the embodiment) that is a double-sided printed wiring board on which multiple circuit components are mounted. The DC conversion block 4B also has a second heat sink 44 to which the second printed circuit board 42 is attached, and a second heat conduction member 46 interposed between the second printed circuit board 42 and the second heat sink 44 (see FIG. 7).

[0043] The second heat dissipation plate 44 is formed into a rectangular shape from a metal plate (for example, an aluminum plate) that is a good conductor of heat. A pair of cut-and-raised portions 440 is provided at one longitudinal end of the second heat dissipation plate 44 (see FIG. 5). A protruding piece 441 is provided between the pair of cut-and-raised portions 440. A female screw portion 442 is provided at each of the corners of the second heat dissipation plate 44 and the protruding piece 441.

[0044] The second heat conductive member 46 is formed of, for example, a silicone rubber sheet material that has excellent thermal conductivity and electrical insulation. The DC conversion block 4B is assembled by placing the second heat conductive member 46 on the surface of the second heat sink 44, and then placing the second printed circuit board 42 on the surface of the second heat conductive member 46, and screwing two mounting screws 48 into the two female threads 442 (see FIG. 5).

[0045] (2-7) End cover The end cover 6 has a cover plate 60, an attachment portion 61, a first boss 64, and a second boss 65 (see FIG. 7). The cover plate 60, the attachment portion 61, the first boss 64, and the second boss 65 are integrally formed by aluminum alloy die-casting.

[0046] The mounting portion 61 is configured to rotatably mount the arm 5 to the end cover 6. Two screw holes 610 are provided on the front surface of the mounting portion 61, spaced apart in the left-right direction (see FIG. 7). That is, the AC-DC conversion block 4A is mounted to the end cover 6 by screwing the first heat sink 43 into these two screw holes 610. Furthermore, recesses 611 are provided on both ends of the mounting portion 61 in the left-right direction. Each recess 611 has one screw hole 612 provided in the bottom surface (see FIG. 7).

[0047] The first boss 64 is formed in a roughly pyramidal shape. The first boss 64 is formed integrally with the cover plate 60 so as to protrude forward from the lower end of the front surface of the cover plate 60 (see FIG. 7). A screw hole 640 is formed in the tip surface (front surface) of the first boss 64. The second boss 65 is formed in a roughly prismatic shape. The second boss 65 is formed integrally with the cover plate 60 so as to protrude forward from both sides of the first boss 64 at the lower end of the front surface of the cover plate 60. Two screw holes 650 are formed in the tip surface (front surface) of the second boss 65. These two screw holes 650 are provided one on each side of the first boss 64 when viewed from the front (see FIG. 7).

[0048] The DC conversion block 4B is attached to the second boss 65. In other words, two screws are inserted one by one into the screw insertion holes of the pair of cut-and-raised portions 440 of the second heat sink 44, and then screwed one by one into the two screw holes 650, thereby fixing the second heat sink 44 to the end cover 6.

[0049] The end cover 6 is attached to the second main body portion 12 by being screwed into the screw hole 640 of the first boss 64 and the two screw holes 612 of the attachment portion 61 .

[0050] (2-8) Mounting board (second printed circuit board) Next, the second printed circuit board 42, which is the mounting substrate according to the embodiment, will be described in more detail.

[0051] The second printed circuit board 42 has a substrate 420 (see FIGS. 1 to 3). The substrate 420 is a rectangular double-sided printed wiring board. The front surface of the substrate 420 is a component side 420A on which insert components are mainly mounted (see FIG. 1). The back surface of the substrate 420 is a solder side 420B on which leads of the insert components are soldered. However, surface-mounted circuit components are mounted on the solder side 420B of the substrate 420 (see FIG. 2).

[0052] Mounted on component side 420A of substrate 420 are insert components such as electrolytic capacitors, choke coils (inductors), and connectors, as well as heat-generating electronic components 421. Electronic components 421 are components of a DC conversion circuit. Electronic components 421 are, for example, integrated circuits. The integrated circuit corresponding to electronic component 421 incorporates a switching element (field-effect transistor) that constitutes a switching power supply circuit in combination with an external choke coil, diode, and smoothing capacitor (electrolytic capacitor), and a control circuit that controls the switching of the switching element. Electronic component 421 is mounted on component side 420A of substrate 420 via first thermal conductor 424 made of a conductor (copper foil) formed on component side 420A of substrate 420 (see FIG. 3). However, heat-generating components are not limited to electronic components such as integrated circuits, and may be, for example, switching elements such as field-effect transistors, or mechanical components such as connectors.

[0053] Surface-mount circuit components such as chip resistors, chip capacitors, and integrated circuits are mounted on solder surface 420B of substrate 420. Furthermore, heat dissipation member 422 is mounted on solder surface 420B at a position facing electronic component 421 along the thickness direction of substrate 420 (see FIGS. 1 to 3). Heat dissipation member 422 is placed on solder surface 420B via second thermal conductor 425 made of a conductor such as solder (see FIG. 3).

[0054] The heat dissipation member 422 preferably has at least a metal portion exposed on a surface that does not contact the second thermal conductor 425. For example, a surface-mount ceramic capacitor (multilayer ceramic chip capacitor) is suitable for the heat dissipation member 422. The multilayer ceramic chip capacitor is formed into a rectangular parallelepiped shape by stacking ceramic dielectric layers and metal internal electrodes in multiple layers, and has one metal external electrode (terminal electrode) 4220 provided on each end of its longitudinal direction (see FIG. 4). In other words, the portion of the external electrode 4220 of the multilayer ceramic chip capacitor that does not contact the second thermal conductor 425 corresponds to the metal portion exposed on the surface that does not contact the second thermal conductor 425. However, the heat dissipation member 422 may be a circuit component other than a ceramic capacitor, such as a chip inductor or a chip resistor. Alternatively, the heat dissipation member 422 may be formed into a rectangular parallelepiped shape using a metal such as copper or a copper alloy.

[0055] The second printed circuit board 42 also has a plurality of heat conduction paths 423 (see FIGS. 1 to 3). Each of the plurality of heat conduction paths 423 penetrates the substrate 420 and thermally connects the first heat conductor 424 and the second heat conductor 425. The heat conduction paths 423 are preferably plated through holes that penetrate the substrate 420. That is, the heat conduction paths 423 can thermally connect the first heat conductor 424 and the second heat conductor 425 by through-hole plating formed in a through hole that penetrates the substrate 420.

[0056] (3) Advantages of the embodiment As described above, second printed circuit board 42, which is a mounting substrate, can conduct heat generated from electronic component 421 when current is applied from first thermal conductor 424 through heat conduction path 423 and second thermal conductor 425 to heat dissipation member 422. As a result, second printed circuit board 42 can improve the heat dissipation of heat-generating components (electronic component 421) mounted on component surface 420A by heat dissipation member 422 thermally connected to electronic component 421.

[0057] Furthermore, the heat dissipation member 422 in this embodiment has a metal portion exposed on at least the surface that is not in contact with the second thermal conductor 425, and the metal portion, which is a good conductor of heat, can further improve heat dissipation.

[0058] Furthermore, since heat dissipation member 422 in the embodiment includes a surface-mount type circuit component, it can be mounted on solder surface 420B of substrate 420 in the same process as other circuit components. As a result, second printed circuit board 42 can simplify the work of installing heat dissipation member 422 on solder surface 420B of substrate 420. Note that heat dissipation member 422 in the embodiment includes a ceramic capacitor. Therefore, by using a ceramic capacitor with excellent thermal conductivity and heat resistance for heat dissipation member 422 in second printed circuit board 42, it is possible to further improve the heat dissipation performance of electronic component 421 mounted on component surface 420A.

[0059] Here, in second printed circuit board 42, by using plated through holes that penetrate substrate 420 as heat conduction paths 423, heat conduction paths 423 can be formed in substrate 420 in the same process as through holes for mounting inserted components. As a result, second printed circuit board 42 can simplify the work required to provide heat conduction paths 423 in substrate 420.

[0060] Furthermore, power supply device 4 has second printed circuit board 42 as a printed circuit board that forms the power supply circuit, and therefore, it is possible to improve the heat dissipation of electronic component 421 mounted on component surface 420A.

[0061] Furthermore, the lighting fixture A1 includes a power supply device 4, an LED 20 that lights up with power supplied from the power supply device 4, and a fixture body 1 that supports the power supply device 4 and the LED 20 (see FIGS. 6 and 7). Therefore, the lighting fixture A1 can improve the heat dissipation of the electronic component 421 mounted on the component surface 420A.

[0062] The power supply device 4 includes a heat sink (second heat sink 44) made of a good thermal conductor, and a connecting member (second heat conduction member 46) that thermally connects the heat sink 422 and the second heat sink 44. That is, the power supply device 4 can conduct heat conducted to the second thermal conductor 425 and the heat sink 422 to the second heat sink 44 via the second heat conduction member 46. As a result, the power supply device 4 can further improve the heat dissipation performance of the electronic component 421 mounted on the component surface 420A.

[0063] (4) Variations Next, several modified examples of the second printed circuit board 42, which is the mounting board according to the embodiment, will be described. However, the basic configuration of the second printed circuit board 42 in each of the modified examples described below is the same as the basic configuration of the lighting device A1 according to the embodiment. Therefore, the same reference numerals will be used to designate components that are common to the basic configuration of the second printed circuit board 42, which is the mounting board according to the embodiment, and illustrations and descriptions thereof will be omitted as appropriate. In the following description, "substantially common configuration" means a configuration that is slightly different in shape, size, etc., but has the same function.

[0064] (4-1) Variation 1 The second printed circuit board 42 of the first modification is characterized by the heat dissipation member 422. The heat dissipation member 422 of the first modification has a base 490 and a plurality of heat dissipation plates 491 (see FIG. 8).

[0065] Base 490 is made of a metal plate (for example, an aluminum plate or an aluminum alloy plate) formed into a rectangular plate shape. A plurality of heat sinks 491 protrude from the surface of base 490. Each of the plurality of heat sinks 491 is made of a metal plate (for example, an aluminum plate or an aluminum alloy plate) formed into a rectangular plate shape. The plurality of heat sinks 491 are arranged at regular intervals along the thickness direction (see FIG. 8).

[0066] The heat dissipation member 422 in the first modification is attached to the substrate 420 so that the rear surface of the base 490 is in contact with the second thermal conductor 425 .

[0067] Therefore, in the second printed circuit board 42 of the first modified example, the surface area of ​​the heat dissipation member 422 is increased by the plurality of heat dissipation plates 491, and therefore the heat dissipation performance of the electronic component 421 mounted on the component surface 420A can be further improved.

[0068] (4-2) Variation 2 The second printed circuit board 42 of the second modification is characterized by a heat conduction path 423. The heat conduction path 423 in the second modification includes a through hole 4230 that penetrates the substrate 420, and a solid body 4231 that is filled in the through hole 4230 (see FIG. 9).

[0069] Solid body 4231 is formed by filling through-hole 4230 with a metal that is a good thermal conductor, such as lead-free solder. Lead-free solder is generally an alloy containing 90% or more tin with a few percent of silver and copper. However, solid body 4231 may also be formed into a columnar shape using copper, a copper alloy, aluminum, an aluminum alloy, or the like and inserted into through-hole 4230.

[0070] Therefore, second printed circuit board 42 of modification 2 uses filled body 4231 filled in through hole 4230 of substrate 420 as heat conduction path 423, thereby improving the thermal conductivity of heat conduction path 423. As a result, second printed circuit board 42 of modification 2 can further improve the heat dissipation performance of electronic component 421 mounted on component surface 420A.

[0071] (5) Summary The mounting substrate (second printed circuit board 42) according to the first aspect of the present disclosure includes a substrate (420), an electronic component (421), a heat dissipation member (422), and a heat conduction path (423). The substrate (420) has a component side (420A) on which an inserted component is mounted and a side (solder side 420B) opposite the component side (420A). The electronic component (421) is mounted on the component side (420A) via a first thermal conductor (424). The heat dissipation member (422) is installed on the opposite side via a second thermal conductor (425). The heat conduction path (423) penetrates the substrate (420) and thermally connects the first thermal conductor (424) and the second thermal conductor (425).

[0072] The mounting board according to the first aspect can conduct heat generated from the electronic component (421) when current is applied from the first thermal conductor (424) to the heat dissipation member (422) through the heat conduction path (423) and the second thermal conductor (425). As a result, the mounting board according to the first aspect can improve the heat dissipation of the electronic component (421) mounted on the component surface (420A) by the heat dissipation member (422) thermally connected to the electronic component (421).

[0073] A mounting board according to a second aspect of the present disclosure can be realized by combining it with the first aspect. In the mounting board according to the second aspect, it is preferable that the heat dissipation member (422) has at least a metal portion exposed on a surface that does not contact the second thermal conductor (425).

[0074] The mounting board according to the second aspect can further improve heat dissipation by using a metal portion that is a good thermal conductor.

[0075] A mounting board according to a third aspect of the present disclosure can be realized by combining it with the first or second aspect. In the mounting board according to the third aspect, the heat dissipation member (422) preferably includes a surface-mounted circuit component.

[0076] In the mounting board according to the third aspect, the heat dissipation member (422) can be installed on the solder surface (420B) of the substrate (420) in the same process as other circuit components, thereby simplifying the work of installing the heat dissipation member (422) on the solder surface (420B) of the substrate (420).

[0077] A mounting board according to a fourth aspect of the present disclosure can be realized in combination with the third aspect. In the mounting board according to the fourth aspect, the heat dissipation member (422) preferably includes a ceramic capacitor.

[0078] The mounting board according to the fourth aspect includes a ceramic capacitor having excellent thermal conductivity and heat resistance in the heat dissipation member (422), thereby further improving the heat dissipation of the electronic component (421) mounted on the component surface (420A).

[0079] A mounting board according to a fifth aspect of the present disclosure can be realized by combining it with any one of the first to fourth aspects. In the mounting board according to the fifth aspect, the heat dissipation member (422) preferably includes a plurality of heat dissipation plates (491).

[0080] The mounting board according to the fifth aspect has a plurality of heat sinks (491) to increase the surface area of ​​the heat dissipation member (422), thereby further improving the heat dissipation of the electronic components (421) mounted on the component surface (420A).

[0081] A mounting board according to a sixth aspect of the present disclosure can be realized by combining it with any one of the first to fifth aspects. In the mounting board according to the sixth aspect, the heat conduction path (423) is preferably a plated through-hole that penetrates the substrate (420).

[0082] In the mounting board according to the sixth aspect, the plated through-holes that penetrate the substrate (420) serve as the heat conduction paths (423), and therefore the heat conduction paths (423) can be formed in the substrate (420) in the same process as the through-holes for mounting the inserted components. As a result, the mounting board according to the sixth aspect can simplify the work of providing the heat conduction paths (423) in the substrate (420).

[0083] A mounting board according to a seventh aspect of the present disclosure can be realized by combining it with any one of the first to sixth aspects. In the mounting board according to the seventh aspect, the heat conduction path (423) preferably includes a through-hole (4230) penetrating the substrate (420) and a solid body (4231) filled in the through-hole (4230).

[0084] The mounting board according to the seventh aspect has a heat conduction path (423) formed by a filled body (4231) filled in a through-hole (4230) of a substrate (420), thereby improving the thermal conductivity of the heat conduction path (423). As a result, the mounting board according to the seventh aspect can further improve the heat dissipation of the electronic component (421) mounted on the component surface (420A).

[0085] A power supply device (4) according to an eighth aspect of the present disclosure includes a mounting board according to any one of the first to seventh aspects. The mounting board is a printed circuit board (second printed circuit board 42) that forms a power supply circuit.

[0086] The power supply device (4) according to the eighth aspect can improve the heat dissipation of the electronic component (421) mounted on the component surface (420A).

[0087] A power supply device (4) according to a ninth aspect of the present disclosure can be realized by combining it with the eighth aspect. The power supply device (4) according to the ninth aspect preferably includes a heat sink (second heat sink 44) made of a good thermal conductor, and a connecting member (second heat conduction member 46) that thermally connects the heat sink to the heat sink member (422).

[0088] The power supply device (4) according to the ninth aspect can conduct heat conducted to the second thermal conductor (425) and the heat dissipation member (422) to the second heat dissipation plate (44) via the second heat conduction member (46), thereby further improving the heat dissipation of the electronic component (421) mounted on the component surface (420A).

[0089] A lighting fixture (A1) according to a tenth aspect of the present disclosure includes a power supply device (4) according to the eighth or ninth aspect, a light source (LED 20) that is lit by power supplied from the power supply device (4), and a fixture body (1) that supports the power supply device (4) and the light source.

[0090] The lighting fixture (A1) according to the tenth aspect can improve the heat dissipation of the electronic component (421) mounted on the component surface (420A). [Explanation of symbols]

[0091] A1 Lighting fixture 1. Instrument body 4 Power supply 20 LEDs (light source) 42 Second printed circuit board (mounting board) 44 Second heat sink (heat sink) 46 Second heat conducting member (connecting member) 420 board 420A component side 420B Solder side (opposite side to component side) 421 Electronic Components 422 Heat dissipation materials 423 Heat Conduction Path 424 First Heat Conductor 425 Secondary Heat Conductor 491 Heat sink 4230 Through hole 4231 Solid body

Claims

1. a substrate having a component surface on which an insertion component is mounted and a surface opposite to the component surface; an electronic component mounted on the component surface via a first thermal conductor; a heat dissipation member disposed on the opposite surface via a second thermal conductor; a thermal conduction path that penetrates the substrate and thermally connects the first thermal conductor and the second thermal conductor; Equipped with Mounting board.

2. the heat dissipation member has at least a metal portion exposed on a surface that does not contact the second thermal conductor; The mounting board according to claim 1 .

3. The heat dissipation component includes a surface-mounted circuit component. The mounting board according to claim 1 or 2.

4. The heat dissipation member includes a ceramic capacitor. The mounting board according to claim 3.

5. The heat dissipation member includes a plurality of heat dissipation plates. The mounting board according to claim 1 or 2.

6. the heat conduction path is a plated through hole that penetrates the substrate; The mounting board according to claim 1 or 2.

7. The heat conduction path includes a through hole penetrating the substrate and a solid body filled in the through hole. The mounting board according to claim 1 or 2.

8. A mounting board according to claim 1 or 2, The mounting substrate is a printed circuit board that forms a power supply circuit. power supply.

9. a heat sink formed of a good thermal conductor; a connecting member that thermally connects the heat dissipation member and the heat dissipation plate; having 9. The power supply device according to claim 8.

10. the power supply device according to claim 8; a light source that is lit by power supplied from the power supply device; a fixture body that supports the power supply device and the light source; Equipped with Lighting fixtures.

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