Endoscope lens module, array-type optical image module, optical image module, and method for manufacturing the same

Abstract

To provide an array-type optical image module, an optical image module, and a method for manufacturing the array-type optical image module and the optical image module.SOLUTION: This method includes: providing a positioning pedestal having a plurality of lens barrel passages and alignment marks, inserting lenses into the passages, and fixing the lenses using an adhesive to form lens modules; providing a planar glass layer on another surface of the positioning pedestal, cutting the positioning pedestal on the basis of the alignment marks to form filling passages; injecting a light-shielding material into the filling passages and curing the light-shielding material to form an array-type optical image module; and finally cutting the light-shielding material along side walls of grooves and separating pedestal units to form a plurality of optical image modules for endoscope lenses. The method is manufactured in an array manner, enables formation, after cutting, of lens modules corresponding to a size of an image sensor, and enables formation of optical image modules having an image acquisition function by being coupled to the image sensor.SELECTED DRAWING: Figure 3A

Description

[Technical Field]

[0001] The present invention relates to the technical field of endoscope lenses, and more particularly to an endoscope lens module, an array-type optical image module, an optical image module, and a manufacturing method thereof. Summary of the Invention [Problem to be solved by the invention]

[0002] Currently, endoscopic lenses used in endoscopes are becoming increasingly miniaturized and micro-sized. The typical method involves directly using an image capture lens module (hereinafter referred to as a barrel-type lens module) assembled inside a barrel and aligning it with an image sensor printed on a printed circuit board (PCB or FPC) using automatic alignment equipment. The machine uses a multi-axis adjustment mechanism to fit the image sensor, calibrates the image, obtains the optimal test image, and then dispenses it. This fixes and aligns the relative position and orientation between the lens module and the image sensor, resulting in a complete image sensor module with an image capture lens. This is a typical single-module method. However, this method involves assembling the assembled barrel-type lens module with the image sensor, which results in a large outer diameter for the image sensor module. Adding an LED light source makes the final end of the endoscope too large, making it incompatible with the needs of micro-sized endoscopes.

[0003] Another method is to use a reference wafer for manufacturing. This involves directly combining wafer-level packaged image sensors with corresponding wafer-level lenses. Layer-by-layer alignment and bonding are then performed on the image sensor wafer, followed by cutting to obtain the required image sensor module. Finally, a black or dark-colored material is applied around the image sensor module to block light and prevent stray light from entering the lens and affecting imaging quality. However, the wafer-level lens package manufacturing process does not allow for self-adjusting alignment between the lens and the image sensor. Each wafer-level lens can only be aligned and bonded using an alignment point, and its position cannot be adjusted based on the imaging quality of the image sensor. This makes it difficult to control the image formation quality of each image sensor on the wafer, resulting in a loss of quality. Furthermore, damaged image sensors cannot be screened during the manufacturing process, or the lens package manufacturing process for the entire wafer must be continued even if the image sensor is found to be damaged, resulting in increased overall costs and reduced quality. Furthermore, once the optical specifications of the lens (e.g., field of view, depth of field, etc.) are fixed, they cannot be adjusted by the user during use, making it impossible to meet the needs of different endoscopes. If a design change is required, the molding die used to design the wafer-level lens must be changed at great expense, which is more expensive than conventional barrel-type lenses. Therefore, the manufacturing process of the wafer-level lens package is not only difficult to process, but also has a low yield rate, resulting in high overall costs and prices. [Means for solving the problem]

[0004] Therefore, in response to the above-mentioned problems of the prior art, the present invention further provides a lens module of an endoscopic lens, an array-type optical image module, an optical image module, and a manufacturing method thereof, thereby solving the problems arising in known methods.

[0005] In view of the above-mentioned problems, one of the objects of the present invention is to provide a lens module, an array-type optical image module, an optical image module, and a manufacturing method thereof that solve the problems of known endoscopic lenses, such as their large size, complicated manufacturing process, high cost, and inability to flexibly adjust optical specifications.

[0006] To achieve the above-mentioned object, the present invention provides a method for manufacturing a lens module for an endoscope, the method comprising the steps of: providing a positioning base, the positioning base having first and second surfaces opposed to each other above and below, and a plurality of lens barrel passages, the positioning base being provided with a plurality of alignment marks, the plurality of lens barrel passages passing through the first and second surfaces to define a plurality of base units arranged in an array together with the plurality of alignment marks; In each base unit, placing a plurality of lenses in layers into the corresponding lens barrel passage; Injecting adhesive between the lenses to bond them together; providing a planar glass layer on a second surface of the positioning pedestal; cutting the alignment pedestal along the plurality of alignment marks to form a plurality of fill passages; injecting and curing a light blocking material into the plurality of filler passages such that the light blocking material surrounds the plurality of lens modules but avoids covering the surfaces of the plurality of lens modules; The method includes a step of cutting the light-shielding material along the side walls of the filling passages, forming optical barrier layers on the outer walls of the plurality of lens barrel passages after cutting, and separating the plurality of base units to form a lens module.

[0007] In accordance with the above object, the present invention provides a method for manufacturing an optical image module, the method for manufacturing an optical image module comprising: providing a lens module, the lens module being manufactured by the manufacturing method of a lens module for an endoscope; After the step of injecting adhesive between the plurality of lenses to bond them, or before or after the step of injecting light-shielding material into the cutting grooves and hardening it, an image sensor is respectively provided on one side of the plurality of lenses, and the other side of each image sensor facing away from the corresponding plurality of lenses protrudes and adjacent to the first side of the positioning base, thereby forming an array-type optical image module, and after the step of cutting the light-shielding material along the side wall of the filling passage, a step of combining the plurality of optical image modules to form them.

[0008] In accordance with the above object, the present invention further provides an optical imaging module, comprising: The optical image module includes one of a plurality of optical image modules manufactured by the above-mentioned method for manufacturing an optical image module.

[0009] In accordance with the above-mentioned object, the present invention also provides an array-type optical imaging module, comprising a positioning base, a plurality of lens modules, a flat glass layer, an optical barrier layer, and an image sensor. The positioning base has first and second surfaces opposed to each other, a plurality of barrel passages, and a plurality of alignment marks, each of which is provided on the first surface. The plurality of barrel passages penetrate the first and second surfaces, and the plurality of barrel passages define a plurality of base units arranged in an array together with the alignment marks. The positioning base also has a plurality of filling passages along the alignment marks. Each lens module includes a plurality of lenses, which are arranged in layers within the plurality of barrel passages, and adhesive is provided between the lenses. The flat glass layer is provided on the second surface of the positioning base. The optical barrier layer is provided within the filling passages and covers the outer walls of the barrel passages after cutting, while avoiding covering the surfaces of the plurality of lens modules. One surface of each of the plurality of image sensors is provided on one surface of each of the plurality of lens modules, and the other surfaces of each of the plurality of image sensors protrude and are adjacent to the first surface of the base unit. [Effects of the Invention]

[0010] As described above, the endoscopic lens module, array-type optical image module, optical image module, and manufacturing method thereof of the present invention can form a lens module corresponding to the size of an image sensor after cutting using a lens module (including a light-shielding material portion but not an image sensor) manufactured in an array manner, and this lens module can be further combined with an image sensor to form an optical image module with image acquisition function. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a flowchart of one embodiment of a method for manufacturing a lens module of the present application. [Figure 2A] FIG. 2A is a schematic diagram of step S1 in FIG. [Figure 2B] FIG. 2B is a schematic diagram of step S2 in FIG. [Figure 2C] FIG. 2C is a schematic diagram of step S3 in FIG. [Figure 2D] FIG. 2D is a schematic diagram of step S3 in FIG. [Figure 2E] FIG. 2E is a schematic diagram of step S3 in FIG. [Figure 2F] FIG. 2F is a schematic diagram of step S3 in FIG. [Figure 2G] FIG. 2G is a schematic diagram of step S4 in FIG. [Figure 2H] FIG. 2H is a schematic diagram of step S5 in FIG. [Figure 2I] FIG. 2I is a schematic diagram of step S6 in FIG. [Figure 2J] FIG. 2J is a schematic diagram of step S7 in FIG. [Figure 3A] FIG. 3A is a flowchart of a first embodiment of the method for manufacturing an optical image module of the present invention. [Figure 3B] FIG. 3B is a schematic diagram of step S17 in FIG. [Figure 3C] FIG. 3C is a schematic diagram of step S18 in FIG. [Figure 4] FIG. 4 is a flowchart of a second embodiment of the method for manufacturing an optical image module according to the present invention. [Figure 5A] FIG. 5A is a schematic diagram of steps S23 to S25 in FIG. [Figure 5B] FIG. 5B is a schematic diagram of steps S23 to S25 in FIG. [Figure 5C] FIG. 5C is a schematic diagram of step S26 in FIG. [Figure 5D] FIG. 5D is a schematic diagram of step S27 in FIG. [Figure 5E] FIG. 5E is a schematic diagram of step S28 in FIG. [Figure 6] FIG. 6 is a flowchart of a third embodiment of the method for manufacturing an optical image module according to the present invention. [Figure 7A] FIG. 7A is a schematic diagram of step S36 in FIG. [Figure 7B] FIG. 7B is a schematic diagram of step S37 in FIG. [Figure 8] FIG. 8 is a schematic diagram 1 of another embodiment of the positioning base of the present invention. [Figure 9] FIG. 9 is a schematic diagram 2 of another embodiment of the positioning base of the present invention. [Figure 10] FIG. 10 is a schematic diagram of one embodiment of the arrayed optical image module of the present invention. [Figure 11A] FIG. 11A is a schematic diagram of one embodiment of an optical imaging module of the present invention. [Figure 11B] FIG. 11B is a schematic diagram of one embodiment of an optical imaging module of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0012] The embodiments of the present invention will be further described below with reference to the drawings. In the drawings and the specification, the same symbols indicate the same or similar components as much as possible. In the drawings, shapes and thicknesses may be exaggerated for simplicity and ease of illustration. Elements not specifically shown in the drawings or the specification are understood to be in forms known to those skilled in the art. Those skilled in the art will be able to make various improvements and modifications based on the contents of the present invention.

[0013] It should be noted that the order of each step and the actual operation method described in the embodiments of the present invention can be adjusted as needed, and this is not a limitation of the description of the embodiments.

[0014] Referring to FIG. 1, the following describes a flow chart of the manufacturing method of the endoscope lens module of the present invention, which includes steps S1 to S7.

[0015] As shown in FIGS. 1 and 2A, step S1 includes providing a positioning base 11. The positioning base 11 has a first surface 11A and a second surface 11B that are opposed to each other above and below, and a plurality of lens barrel passages 112. The positioning base 11 is provided with a plurality of alignment marks 114, and the plurality of lens barrel passages 112 penetrate the first surface 11A and the second surface 11B to define a plurality of base units 110 arranged in an array together with the plurality of alignment marks 114. In FIG. 2A, the plurality of alignment marks 114 may be provided on the edge of the first surface 11A, but is not limited thereto. The plurality of alignment marks 114 are connected to each other by dashed lines and intersect, and the single base units 110 defined by the intersections of these dashed lines are arranged in an array. It can be seen that the local region R is a local cross section of the lens barrel passage 112, and a plurality of support structures 113 are formed on the inner wall of the lens barrel passage 112, and the height between the plurality of support structures 113 and the depth of each support structure 113 can be designed according to the optical design and lens size. Alternatively, the positioning base 11 with the lens barrel passages 112 arranged in an array can be manufactured using a mold by injection molding. The cross section of the lens barrel passage 112 can be circular or rectangular, and although a circular passage is shown in the figure as an example, it is not limited thereto.

[0016] As shown in FIGS. 1 and 2B, step S2 includes the following steps: This involves placing a plurality of lenses 120 in layers within each of the lens barrel passages 112. To clarify the positional relationship, the lenses 120 are designated as lens 1201, lens 1202, and lens 1203, respectively, as follows. The lenses 1201, lens 1202, and lens 1203 are placed in layers within the lens barrel passage 112 in order from smallest to largest according to their respective lens widths, and the edges of the lenses 1201, lens 1202, and lens 1203 abut against the support structure 113. The support structure 113 has a support surface, allowing the edges of the lenses 1201, lens 1202, and lens 1203 to abut against the support surface.

[0017] As shown in FIGS. 1 and 2C to 2F, step S3 includes injecting adhesive 13 between and bonding multiple lenses 120. In FIGS. 2C to 2F, lens 120 has imaging region 120A and non-imaging region 120B. Imaging region 120A is located at the center of lens 120, and non-imaging region 120B surrounds imaging region 120A. Different bonding positions have different aspects. As shown in FIGS. 2C and 2D, the position where adhesive 13 is injected is non-imaging region 120B. In FIGS. 2E and 2F, the positions where adhesive 13 is injected are imaging region 120A and non-imaging region 120B.

[0018] 1 and 2G, step S4 includes providing a flat glass layer 14 on the second surface 11B of the positioning base 11. The purpose of providing the flat glass layer 14 is not only to protect the lenses in the lens barrel passage, but also to further enhance the optical design by providing an anti-reflection coating layer on the flat glass layer 14.

[0019] In other embodiments, another flat glass layer (not shown) can be further provided on the first surface 11A of the positioning base 11, or one of the lenses 120 can be replaced with another flat glass layer, and the other flat glass layer can be inserted into the respective lens barrel passage 112. This allows the flat glass layer to be bonded to the image sensor in a subsequent step, further strengthening the positioning and installation of the image sensor. In this embodiment, the other flat glass layer is not shown in the figures, but those skilled in the art should be able to understand its structure and features.

[0020] An additional step can be added after step S4, which is to provide a support plate under the positioning base 11. The support plate can be a temporary support plate, and different installation methods can be used depending on the material of the support plate. For example, if the support plate is made of adhesive tape, the adhesive on the support plate can be used to attach it to the bottom of the positioning base 11. In this way, the positioning base 11 can prevent the parts from scattering or shifting during the cutting process in the subsequent cutting step, which would affect the manufacturing process, and also allows different light-blocking materials or curing methods to be selected depending on the material of the support plate to cure the subsequent light-blocking material.

[0021] As shown in FIGS. 1 and 2H, step S5 includes cutting the positioning pedestal 11 along the alignment marks 114 to form a plurality of fill passages 15.

[0022] 1 and 2I, step S6 includes injecting and curing a light-shielding material 16 into the plurality of filling passages 15 so that the light-shielding material 16 covers the outer walls of the lens barrel passages and avoids covering the surface of the lens 120. Regarding the curing method, if a step of providing a temporary support plate is further performed after step S14, different light-shielding materials 16 or curing methods are selected based on the material of the support plate, and the curing methods include UV curing (ultraviolet curing) or thermal curing.

[0023] As shown in Figures 1 and 2J, step S7 includes cutting the light-shielding material 16 along the side walls of the filling passages 15, forming optical barrier layers 17 on the outer walls of the multiple barrel passages after cutting, and separating each base unit to form lens modules 12.

[0024] 3A to 3C, a first embodiment of the method for manufacturing an optical imaging module of the present invention will be described, which includes steps S11 to S18. Steps S11 to S16 are the same as the aforementioned steps S1 to S6, and you can also refer to FIGS. 2A to 2I, so they will not be described again here. In this embodiment, in the steps of manufacturing the lens module, step S17 is performed after the step of injecting and curing the light-blocking material 16 into the multiple filling channels 15.

[0025] As shown in Figures 3A and 3B, step S17 includes providing an image sensor 18 on one side of the lens 120, and the other side of the image sensor 18 protruding and adjacent to the first surface 11A of the positioning base 11, thereby forming an array-type endoscopic lens module 1A.

[0026] It should be noted that a step related to wafer-level optical measurement can be added if necessary, for example, wafer-level optical measurement can be performed after step S17 to detect whether there is a defect in the lens module, and if there is a defect, directly mark the location of the defect; if there is no defect, continue to perform step S18.

[0027] 3A and 3C, step S18 includes cutting the light-shielding material along the sidewall of the filling passage to form an optical barrier layer 17 around the lens module 12 and separate multiple base units. Therefore, after cutting the array-type optical imaging module 1A, multiple optical imaging modules 20 are formed together, and this manufacturing method can realize mass production of optical imaging modules 20 for wafer-level endoscopes. In step S18, a predetermined thickness of the light-shielding material is left on the sidewall of the filling passage during cutting, which serves as the lens optical barrier layer 17 and prevents light from entering the lens module 12, thereby preventing the final optical imaging quality from being affected.

[0028] Furthermore, for convenience in manufacturing and assembly in actual implementation, in this embodiment, the first surface 11A of the positioning base 11 faces upward and the second surface 11B faces downward. When actually used in an endoscope after production is completed, the optical imaging module 20 is inverted so that the image sensor 18 is located below the entire optical imaging module 20 and is electrically connected to the other elements. As shown in the optical imaging module 20 on the right side of Figure 3C, the structure of the optical imaging module 20 after cutting the array-type optical imaging module 1A is shown after being inverted 180 degrees. In actual implementation, components can also be inverted as needed, and this is not a limiting example.

[0029] Referring to FIG. 4 and FIG. 5A to FIG. 5E, a second embodiment of the method for manufacturing an optical imaging module of the present invention will be described, and the method for manufacturing an optical imaging module includes steps S21 to S28.

[0030] Step S21 provides a positioning base. Step S22 places multiple lenses in layers into multiple lens barrel passages. Step S23 injects adhesive between the multiple lenses to bond them. Steps S21 and S22 are described above in FIGS. 2A and 2B, and step S23 is described above in FIGS. 2C to 2F, and will not be described again here.

[0031] 4, 5A, and 5B, step S24 includes providing an image sensor 18 on one side of the lens, and the other side of each image sensor 18, which faces away from the corresponding lenses, protrudes and is adjacent to the first surface 11A of the positioning base 11. Step S25 includes providing a flat glass layer 14 on the second surface 11B of the positioning base 11. The lenses 120 (lenses 1201, 1202, and 1203), the image sensors 18, and the flat glass layer 14 in the local region R' can be bonded to each other with adhesive 13.

[0032] If necessary, a step related to wafer-level optical measurement can be added. For example, it should be noted that wafer-level optical measurement can be performed after step S25 or after step S27. For example, after step S25, it is detected whether there are any defective lens modules. If there are any defective ones, the location of the defective ones is marked. If there are no defective ones, step S26 is continued. Therefore, if optical measurement is performed first in this step, the defective ones can be immediately ignored and not subjected to subsequent assembly processes, thereby improving work efficiency and reducing waste. Alternatively, optical measurement can be ignored first after step S25 and not performed, and wafer-level optical measurement can be performed after the subsequent step S27.

[0033] As shown in FIGS. 4 and 5C, step S26 includes cutting the positioning pedestal 11 along the alignment marks 114 to form a plurality of filling passages 15.

[0034] As shown in Figures 4 and 5D, step S27 involves injecting and hardening a light-shielding material 16 into the multiple filling passages 15 so that the light-shielding material 16 covers the periphery of the lens module 12 but avoids covering the surface of the lens module 12, thereby forming an array-type optical image module 1B.

[0035] As shown in Figures 4 and 5E, step S28 includes cutting the array-type optical imaging module 1B, by cutting the light-shielding material along the sidewall of the filling passage, an optical barrier layer is formed around the lens module, and multiple base units are separated, and multiple optical imaging modules 20 are formed after cutting the array-type optical imaging module 1B.

[0036] Referring to Figures 6, 7A and 7B, a third embodiment of the method for manufacturing an optical module of the present invention will be described, and the method for manufacturing an optical image module includes steps S31 to S38. The difference between this embodiment and the first embodiment is the processes of steps S36 and S37. Steps S31 to S35 and S38 are the same as steps S11 to S15 and S18 in the first embodiment, so steps S31 to S35 and S38 will not be described again here.

[0037] As shown in FIGS. 6 and 7A, step S36 includes providing an image sensor 18 on one side of the lens, and the other side of the image sensor 18 protruding adjacent to the first surface 11A of the positioning base 11.

[0038] As shown in Figures 6 and 7B, step S37 includes injecting and curing a light-shielding material 16 into the filling passage 15 so that the light-shielding material 16 surrounds the lens module 12 but avoids covering the surface of the lens module 12, thereby forming an array-type optical image module 1C.

[0039] 8 and 9, another embodiment of the positioning base will be described below. The positioning base includes a plurality of flow channels 116 and an inlet 118. One end of the inlet 118 is located on the surface of the positioning base, and is shown on the first surface 11A in the drawings, but this is not a limitation. The other end of the inlet 118 is connected to a plurality of flow channels 116, which are in turn connected to a plurality of lens barrel passages 112. In the step of injecting adhesive 13 between and bonding the plurality of lenses 120, the adhesive is injected from the inlet 118 into the plurality of flow channels 116, fills the plurality of lens barrel passages 112, and flows between the lenses 120.

[0040] In the process of explaining the method for manufacturing an optical image module of the present invention described above, the array-type optical image module manufactured by the method for manufacturing an optical image module and the optical image module were described at the same time, but for clarity, they will be described in detail below separately with schematic diagrams.

[0041] 10, the array-type optical imaging module 1 can be manufactured and formed according to the above-described embodiments of the optical imaging module manufacturing method. Also, referring to FIGS. 2A to 2J and 3B to 3C, it can be understood in detail that the array-type optical imaging module 1 includes a plurality of lens modules 12 and an image sensor 18. The plurality of lens modules 12 includes a positioning base 11, a plurality of lenses 120, a flat glass layer 14, and an optical barrier layer 17.

[0042] The positioning base 11 has a first surface 11A and a second surface 11B that face each other vertically, and a plurality of lens barrel passages 112. The positioning base 11 is provided with a plurality of alignment marks 114, which are shown in the drawing as being provided on the edges of the first surface 11A, but are not limited to this. The plurality of lens barrel passages 112 penetrate the first surface 11A and the second surface 11B, and together with the plurality of alignment marks 114, the plurality of lens barrel passages 112 define a plurality of base units 110 arranged in an array, and the alignment marks 114 are cut to form filling passages 15. A plurality of lenses 120 are provided in each base unit 110, and the plurality of lenses 120 are provided in layers within each of the lens barrel passages 112, and are bonded together by providing adhesive 13 between the plurality of lenses 120. The flat glass layer 14 is provided on the second flat surface 11B of the positioning base 11. The optical barrier layer 17 is located in the filling passage 15, and is provided in the filling passage 15 with a light-shielding material 16. The light-shielding material 16 is cured to form the optical barrier layer 17. The optical barrier layer 17 covers the outer wall of the lens barrel passage 112 and does not cover the surface of the lens module 12. The image sensor 18 is provided on one side of the lens module 12, and the other end of the image sensor 18 is adjacent to the first surface 11A of the base unit 110, and the other surface of the image sensor 18 protrudes and is adjacent to the first surface 11A of the base unit 110.

[0043] 10 does not show that the positioning base has a plurality of channels 116 and an inlet 118, but by referring to FIGS. 8 and 9 together, it can be seen that one end of the inlet 118 is located on the first surface 11A and the other end is connected to one of the plurality of channels 116, and the plurality of channels 116 are connected to the plurality of lens barrel passages 112, and adhesive is injected from the inlet 118 into the plurality of channels 116 and fills the plurality of lens barrel passages 112. The shape and size of the channels 116 and the method of connecting them to the lens barrel passages 112 and the inlet 118 can all be designed differently according to different needs, and the position, size and number of the inlets 118 can be adjusted according to the actual adhesive injection situation, adhesive quality and needs without limitation.

[0044] The image sensor 18 is preferably a CSP (Chip Scale Package) image sensor, and the size and weight of the package are minimized by packaging the image sensor chip on a package substrate of the same size as the chip. The image sensor 18 may be, but is not limited to, a color (RGB) image sensor, a near-infrared (IR) sensor, a monochrome sensor, or a niche image sensor.

[0045] Referring to Figures 11A and 11B, Figures 11A and 11B each show the optical image module 20 when flipped 180 degrees, and the optical image module 20 is formed by cutting the aforementioned array-type optical image module 1, and the optical image module 20 includes a lens module 12 and an image sensor 18.

[0046] 2A to 2I, 3B, and 3C, the lens module 12 includes a base unit 110, a plurality of lenses 120, a flat glass layer 14, and an optical barrier layer 17. The base unit 110 includes a first surface 11A and a second surface 11B that face each other vertically, and a lens barrel passage 112. The lens barrel passage 112 penetrates the first surface 11A and the second surface 11B. The lenses 120 are positioned in layers within the plurality of lens barrel passages 112, and the lenses 120 are bonded together with an adhesive 13. The flat glass layer 14 is positioned on the second flat surface 11B of the positioning base 110. The optical barrier layer 17 covers the outer wall of the lens barrel passage 112 and prevents it from covering the surface of the lens module 12. The image sensor 18 is provided on one surface of the lens module 12, and the other surface of the image sensor 18 protrudes and is adjacent to the first surface 11A of the base unit 110.

[0047] The inner wall of the lens barrel passage 112 has a plurality of support structures 113, and the edges of the plurality of lenses 120 respectively abut against the plurality of support structures 113. The lenses 120 are arranged in the lens barrel passage 112 from small to large in the direction from the first plane 11A to the second plane 11B according to their respective lens widths.

[0048] To summarize, the advantages of the endoscopic lens module, array-type optical imaging module, optical imaging module, and manufacturing method thereof of the present invention are as follows: First, by utilizing an array-type lens barrel design, the lens assembly cost is not only lower than the manufacturing cost of wafer-level lenses, but also improves overall manufacturing efficiency. Second, by performing lens alignment and assembly within a single lens barrel, the resulting lens quality has higher precision and resolution than lenses made by stacking wafer-level lenses, making it suitable for high-pixel image sensors. In addition, the assembled lens module can be inspected using wafer-level optical measurement methods, and any defects can be pre-screened, thereby saving costs and improving the yield rate. Furthermore, by closely attaching an image sensor to an array of lens barrels with pre-installed lenses, the same wafer-level production method can be achieved, achieving the goal of large-scale production. Furthermore, the lens module manufactured using the array method improves manufacturing efficiency. Furthermore, the light-shielding layer can be simultaneously manufactured during the wafer-level manufacturing process, ultimately forming an image sensor module with image capture function, further improving imaging quality.

[0049] As mentioned above, only the preferred embodiments of the present invention have been described by way of example, but this does not limit the scope of the implementation, and simple substitutions and equivalent modifications made in accordance with the claims of this application and the contents of the patent specification all belong to the scope of the claims of the present invention. [Explanation of symbols]

[0050] 11 Positioning base 11A 1st page 11B 2nd side 110 Pedestal unit 112 Telescope Passage 113 Support structure 114 Alignment Symbol 116 Channel 118 Inlet 12 Lens Module 120, 1201, 1202, 1203 lenses 120A imaging area 120B Non-imaging area 13 Adhesive 14 flat glass layers 15 Filling aisle 16 Light-blocking materials 17 Optical Barrier Layer 18 Image Sensor 1, 1A, 1B, 1C Array type optical image module 20 Optical Image Module R, R' local area S1~S7, S11~S18, S21~S28, S31~S38 steps

Claims

1. A method for manufacturing a lens module for an endoscope, comprising: providing a positioning base, the positioning base having first and second surfaces opposed to each other above and below, and a plurality of lens barrel passages, the positioning base being provided with a plurality of alignment marks, the plurality of lens barrel passages passing through the first and second surfaces and defining a plurality of base units arranged in an array together with the plurality of alignment marks; In each of the base units, placing a plurality of lenses in layers into the corresponding lens barrel passage; Injecting adhesive between the lenses to bond them together; providing a planar glass layer on the second surface of the positioning pedestal; cutting the positioning pedestal along the alignment marks to form a plurality of fill passages; injecting and curing a light-blocking material into the plurality of fill passages such that the light-blocking material covers sidewalls of the plurality of fill passages and avoids covering surfaces of the plurality of lenses; a step of cutting the light-shielding material along the side walls of the filling passage, forming an optical barrier layer on each of the outer walls of the plurality of barrel passages after cutting, and separating the plurality of base units to form the lens module.

2. After the step of providing the flat glass layer on the second surface of the positioning pedestal, 2. The method for manufacturing a lens module for an endoscope according to claim 1, further comprising the step of: performing wafer-level optical measurement to detect whether each of the lens modules has a defect; if a defect is found, marking the location of the defect; if not, continuing to perform the step of forming the plurality of filling passages by cutting the positioning base along the plurality of alignment marks.

3. after the step of injecting and curing the light-blocking material into the plurality of filling passages so that the light-blocking material covers the periphery of the lens module and avoids covering the surface of the lens module; 2. The method for manufacturing a lens module for an endoscope according to claim 1, further comprising the step of: performing wafer-level optical measurement to detect whether each of the lens modules has a defect; if a defect is found, marking the location of the defect; if not, continuing with the step of cutting the light-blocking material along the side walls of the plurality of filling passages.

4. each of the plurality of lenses has an image forming region and a non-image forming region, the image forming region is located at a central position of the plurality of lenses, and the non-image forming region surrounds the image forming region; 2. The method for manufacturing a lens module for an endoscope according to claim 1, wherein in the step of injecting adhesive between the plurality of lenses to bond them, the adhesive is injected into the non-imaging region, or into the non-imaging region and the imaging region.

5. the positioning base includes a plurality of flow paths and an injection port, one end of the injection port is located on the first surface and the other end of the injection port is connected to one of the plurality of flow paths, and the plurality of flow paths are connected to corresponding ones of the plurality of lens barrel passages, 2. The method for manufacturing a lens module for an endoscope according to claim 1, wherein in the step of injecting adhesive between the plurality of lenses to bond them, the adhesive is injected from the injection port into the plurality of flow paths and fills the plurality of lens barrel passages.

6. 2. The method for manufacturing a lens module for an endoscope according to claim 1, wherein a plurality of support structures are formed on inner walls of the plurality of lens-barrel passages, respectively, and in the step of placing the plurality of lenses in layers into the plurality of lens-barrel passages, edges of the plurality of lenses abut against the plurality of support structures, respectively.

7. 7. The method for manufacturing a lens module for an endoscope according to claim 6, wherein the plurality of lenses are placed in layers into each of the lens barrel passages in order from small to large according to their respective lens widths, and edges of the plurality of lenses abut against one of a plurality of support structures.

8. After the step of providing the flat glass layer on the second flat surface of the positioning pedestal, providing a support plate under the positioning pedestal; The method for manufacturing a lens module for an endoscope according to claim 1 , further comprising the step of selecting different light-blocking materials or hardening methods depending on the support plate.

9. A method for manufacturing an optical image module, comprising: providing a lens module, the lens module being manufactured by the manufacturing method for a lens module for an endoscope according to any one of claims 1 to 8; A method for manufacturing an optical image module, comprising: after the step of injecting adhesive between the plurality of lenses to bond them, or before or after the step of injecting the light-shielding material into the cutting grooves and hardening it, providing an image sensor on one side of each of the plurality of lenses, and the other side of each image sensor facing away from the corresponding plurality of lenses protruding and adjacent to the first surface of the positioning base, thereby forming an array-type optical image module; and after the step of cutting the light-shielding material along the side wall of the filling passage, forming a plurality of optical image modules together.

10. After the step of respectively providing the image sensors on one side of each of the lens modules, 10. The method for manufacturing an optical image module according to claim 9, further comprising: performing wafer-level optical measurement to detect whether there is a defect in each of the lens modules; if there is a defect, marking the location of the defect; if there is no defect, continuing to cut the light-shielding material along the sidewalls of the plurality of filling passages.

11. An optical imaging module comprising one of the plurality of optical imaging modules manufactured by the method for manufacturing an optical imaging module according to claim 9.

12. An array-type optical image module, A plurality of lens modules are provided, The plurality of lens modules include: a positioning base having first and second surfaces opposed to each other in the vertical direction and a plurality of lens barrel passages, the positioning base being provided with a plurality of alignment marks, the plurality of lens barrel passages penetrating the first and second surfaces and defining a plurality of base units arranged in an array together with the plurality of alignment marks, and the positioning base being provided with a plurality of filling passages along the plurality of alignment marks; a plurality of lenses provided in each of the base units, the lenses being arranged in layers in the respective lens barrel passages, with adhesive provided between the lenses; a flat glass layer disposed on the second surface of the positioning base; an optical barrier layer disposed within the plurality of filling passages, covering an outer wall within the plurality of barrel passages and avoiding covering surfaces of the plurality of lenses; an array-type optical image module comprising a plurality of image sensors, one surface of which is provided on one surface of each of the plurality of lens modules, and the other surface of which protrudes and is adjacent to the first surface of the positioning base;

13. 13. The array-type optical image module of claim 12, wherein the plurality of lenses each have an imaging area and a non-imaging area, the imaging area is located at a central position of the plurality of lenses, the non-imaging area surrounds the imaging area, and the adhesive is provided in the non-imaging area or in the non-imaging area and the imaging area.

14. 13. The array-type optical image module of claim 12, wherein the positioning base has a plurality of flow paths, the positioning base has an injection port, one end of the injection port is located on the surface of the positioning base, the other end of the injection port is connected to the plurality of flow paths, and the plurality of flow paths are connected to the plurality of lens barrel passages, and the adhesive is injected from the injection port into the plurality of flow paths and fills the plurality of lens barrel passages.

15. 13. The array-type optical imaging module according to claim 12, wherein the inner walls of the plurality of lens barrel passages have a plurality of support structures, and the edges of the plurality of lenses abut against the plurality of support structures, respectively.

16. 16. The array-type optical imaging module according to claim 15, wherein the plurality of lenses are arranged in the plurality of lens barrel passages from small to large in a direction from the first plane to the second plane according to their respective lens widths.

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