Induction heating soldering automation equipment

Abstract

The present invention relates to an automated induction heating soldering equipment, and in particular, the equipment comprises a fixture unit for fixing a board on which electronic elements are mounted, a first conveyor for transporting the fixture unit, an induction heating unit installed above the fixture unit so as to be movable in the x-axis, y-axis and z-axis directions and including a magnetic induction coil for inductively heating the board mounted on the fixture unit to solder the electronic elements, and a controller for controlling the first conveyor and the induction heating unit, and the equipment is capable of locally heating continuously supplied molded interconnected devices (MIDs), printed circuit boards (PCBs) or flexible printed circuit boards (FPCBs) by a non-contact induction heating method, thereby automatically soldering electronic elements while minimizing thermal damage.

Description

[Technical field]

[0001] The present invention relates to an automated induction heating soldering device, and more particularly to an automated induction heating soldering device capable of induction heating molded interconnected devices (MIDs, more precisely, plastic injection molded products with electrical wiring circuits having mechanical and electrical functions) or printed circuit boards (PCBs) on which continuously supplied electronic elements are mounted, to continuously and automatically solder the electronic elements. [Background technology]

[0002] Currently, electrical circuits have become an essential component in all parts of a wide range of industrial fields, such as connecting components together, controlling them, and sensing them.

[0003] Conventional methods for realizing circuits include soldering elements onto a printed circuit board (PCB) or a flexible printed circuit board (FPCB) or assembling a wire harness.

[0004] In the case of PCB, this is the most common method of electrical circuitry, where the required electronic components are soldered to the parts where the electrical circuitry is realized in a two-dimensional (2D) shape. This method is the most widely used method of circuit creation in most industrial fields, and a pattern is created on the board using a photoresist, solder paste is applied using a metal mask or dispensing method, and then the electronic components are mounted and reflow is performed to create a completed board.

[0005] Recently, molded interconnect device (MID) structure circuit devices that use Laser Direct Structuring (LDS) and Microscopic Integrated Processing Technology (MIPTEC) have been introduced. In the case of MID, circuits can be realized in three-dimensional (3D) shapes because the circuits are realized directly on the plastic base, which is advantageous in terms of space restrictions and installation.

[0006] However, when MID soldering is performed using the reflow method, the entire MID passes through a heating path that provides high-temperature heat, which causes thermal damage to the materials, resulting in the limitation that only limited materials can be used. In addition, due to spatial restrictions in the heating path, there are limitations to its application to MID-structured circuitry that has planes with different heights (2.5D) or three-dimensional (3D) shapes.

[0007] Due to the limitations mentioned above, MIDs have the advantage of being a revolutionary solution that makes 3D circuits possible, but the current situation is that they are not being widely used in the industrial field due to the limitations of soldering. Summary of the Invention [Problem to be solved by the invention]

[0008] The present invention has been created to solve the above-mentioned problems of the conventional technology, and has an object to provide an automated induction heating soldering equipment that can locally heat continuously supplied MIDs (Molded Interconnected Devices) or PCBs by a non-contact induction heating method, and automatically solder electronic elements to the MIDs or PCBs while minimizing thermal damage.

[0009] Another object of the present invention is to provide an automated induction heating soldering device capable of automatically soldering a large number of objects to be soldered with uniform quality. [Means for solving the problem]

[0010] In order to solve the above problems, the induction heating soldering automation equipment according to the present invention comprises a jig unit for fixing a board on which electronic elements are mounted, a first conveyor for transporting the jig unit, an induction heating unit installed above the jig unit so as to be movable in the x-axis, y-axis and z-axis directions and equipped with a magnetic induction coil for induction heating the board mounted on the jig unit to solder the electronic elements, and a controller for controlling the first conveyor and the induction heating unit.

[0011] The automated induction heating soldering equipment further includes a pick-up robot that picks up the jig unit transported by the first conveyor and moves it to a soldering stage.

[0012] In this case, a plurality of soldering devices each including the induction heating unit, the pick-up robot, and the controller may be arranged along the first conveyor.

[0013] Here, a second conveyor for transporting the jig unit may be further installed next to the first conveyor.

[0014] Further, a manual stage is provided on one side of the first conveyor, on which the jig unit is manually loaded and unloaded.

[0015] Here, the soldering stage, the waiting area of ​​the first conveyor, the unloading area of ​​the second conveyor and the manual stage are arranged in a straight line along the x-axis direction on the base of the soldering equipment, and the pick-up robot moves above each of these areas along the x-axis direction, loading and unloading the jig unit into and from each area.

[0016] Here, the induction heating movement module, which moves the induction heating unit in three axis directions, x, y, and z, is composed of a y-axis unit supported on the base side of the soldering equipment, an x-axis unit supported on the y-axis unit side, and a z-axis unit supported on the x-axis unit side, and each unit includes a unit body with a guide rail, a drive unit connected to one end of the unit body in the longitudinal direction, and a slider that is transported on the guide rail by the drive of the drive unit.

[0017] In addition, the pickup robot has a pair of robot arms at its lower end that move in the x-axis direction along the jig transport rail and move toward and away from each other on the y-axis to grasp and release the jig unit, and the robot arms may be moved in the z-axis direction using hydraulic or pneumatic pressure.

[0018] Here, the substrate may be composed of a printed circuit board (PCB), a flexible printed circuit board (FPCB) or a molded integrated circuit device (MID) extrusion.

[0019] On the other hand, the jig unit comprises a bottom plate, a pair of guide plates arranged opposite each other on both sides of the upper surface of the bottom plate and having guide holes formed therein, first and second support plates arranged opposite each other on both sides of the upper surface of the bottom plate, a top plate arranged on the upper ends of the pair of guide plates and the first and second support plates and having fitting holes formed therein, a spring arranged on the first support plate, a pressing plate that receives elastic force from the spring and moves by having guide protrusions arranged on both ends fitted into the guide holes, and a fixing member arranged between the second support plate and the pressing plate through the fitting holes of the top plate to fix the substrate.

[0020] Here, the fixing member comprises a number of fixing panels arranged in large numbers between the second support plate and the pressing plate to create a gap in which the MID or PCB is arranged, and a finishing panel installed at the end of one side of the fixing panels and contacting the second support plate.

[0021] The induction heating unit includes a magnetic induction coil stacked spirally upward, one or more magnetic cores erected at the center of the magnetic induction coil, a coil fixing body having a core fitting hole into which the magnetic core is fitted and a coil fitting hole into which the magnetic induction coil is fitted formed on an outer surface thereof, a body jig into which the coil fixing body is built, and a front jig and a base jig respectively installed at the front and rear of the body jig.

[0022] A distance measuring device is installed on the front jig and the base jig, and emits a laser beam through the body jig and the coil fixing body toward the jig unit.

[0023] In addition, a magnetic core is installed in a portion of the jig unit facing the magnetic core. Effect of the Invention

[0024] The automated induction heating soldering equipment of the present invention having the above-mentioned configuration is advantageous in that it can automate the process of soldering electronic elements to MID ejection products or PCBs by locally heating MID ejection products or PCBs on which electronic components are mounted in a non-contact manner, thereby producing a large number of soldered products with uniform quality.

[0025] Another advantage is that it can solve the problems of MID ejection and thermal damage to PCBs that could not be solved by conventional reflow soldering, and can produce products that are free of thermal damage.

[0026] Furthermore, immediately after soldering, there is only radiant heat at a level that allows the MID ejection part or PCB substrate to be touched, so there is no need for a cooling period to lower the temperature after soldering.

[0027] Furthermore, since it is possible to perform soldering of MID injection molded objects made of plastic resins with low heat resistance, a wide range of injection molded object materials can be selected.

[0028] Furthermore, the automated induction heating soldering equipment according to the present invention has the advantages of requiring a much smaller installation space than reflow equipment and consuming much less electricity. [Brief description of the drawings]

[0029] [Figure 1] 1 is a diagram showing an entire induction heating soldering automation equipment according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a diagram showing the internal structure of the automated equipment located at the frontmost position in FIG. 1. [Diagram 3] 2 is a diagram showing an operating state of a pick-up robot in an automated induction heating soldering equipment according to an embodiment of the present invention; FIG. [Figure 4] FIG. 2 is a diagram showing an induction heating transfer module in an induction heating soldering automation equipment according to an embodiment of the present invention. [Diagram 5]FIG. 5 is a diagram showing a y-axis unit in the induction heating transfer module shown in FIG. 4. [Figure 6] 2 is a flow chart showing the overall operation of the induction heating soldering automation equipment according to the embodiment of the present invention; FIG. [Figure 7] FIG. 2 shows an induction heating unit and a fixture unit together according to an embodiment of the present invention. [Figure 8] FIG. 2 shows an induction heating unit and a fixture unit together according to an embodiment of the present invention. [Figure 9] FIG. 2 is a diagram showing a fixture unit according to an embodiment of the present invention. [Figure 10] FIG. 2 is an exploded view of an induction heating unit according to an embodiment of the present invention. [Figure 11] FIG. 11 is an exploded view of the magnetic induction coil and the coil fixing body shown in FIG. 10. [Figure 12] 3A and 3B are diagrams showing a magnetic core and a lower magnetic core in the induction heating unit and the jig unit according to the embodiment of the present invention. [Figure 13] 1 is a diagram showing a fixed panel and a substrate (for example, an external case of a smartphone) in a jig unit according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0030] In order to solve the above problems, the induction heating soldering automation equipment according to the present invention comprises a jig unit for fixing a board on which electronic elements are mounted, a first conveyor for transporting the jig unit, an induction heating unit installed above the jig unit so as to be movable in the x-axis, y-axis and z-axis directions and equipped with a magnetic induction coil for induction heating the board mounted on the jig unit to solder the electronic elements, and a controller for controlling the first conveyor and the induction heating unit.

[0031] (Mode for carrying out the invention) Since the present invention can be modified in various ways and can have various embodiments, a specific embodiment is illustrated in the drawings and described in detail in the detailed description. However, this is not intended to limit the present invention to a specific embodiment, and it should be understood that the present invention includes all modifications, equivalents, and alternatives within the spirit and technical scope of the present invention. In addition, when describing the present invention, if it is recognized that a specific description of related known technology may obscure the gist of the present invention, the detailed description will be omitted.

[0032] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of an automated induction heating soldering apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

[0033] FIG. 1 is a diagram showing the entire induction heating soldering automation equipment according to one embodiment of the present invention, FIG. 2 is a diagram showing the internal structure of the automation equipment located at the frontmost position in FIG. 1, FIG. 3 is a diagram showing the operating state of a pick-up robot in the induction heating soldering automation equipment according to one embodiment of the present invention, and FIG. 4 is a diagram showing an induction heating movement module in the induction heating soldering automation equipment according to one embodiment of the present invention.

[0034] The automated induction soldering equipment according to the present invention can continuously and automatically perform mold direct mounting (MDM) of electronic components to the extrusion by soldering electronic components onto a molded interconnect device (MID) directly mounted on the extrusion, as well as a traditional PCB or FPCB, by induction heating. In this case, the extrusion may have an undulating region or a three-dimensional structure. In the following description, the PCB, FPCB, or MID extrusion on which electronic components are mounted will be collectively referred to as substrate A.

[0035] To explain the overall outline of the present invention in more detail, in the present invention, the induction heating unit that solders the boards can automatically move in the x-, y-, and z-axis directions above the soldering stage while soldering, making it possible to perform large-scale soldering with uniform quality. In particular, by using a multi-type layout for loading and unloading boards around the soldering area (soldering stage), it is possible to perform soldering for different types of lots, and by arranging multiple soldering equipment units in succession along the board transport line, it is possible to significantly improve the soldering yield.

[0036] To this end, as shown in FIG. 1 to FIG. 4, an induction heating soldering automation equipment according to an embodiment of the present invention includes a jig unit 100 for fixing a board A on which an electronic component B is mounted, a first conveyor 200 for transporting the jig unit 100, a pick-up robot 300 for gripping the jig unit 100 transported by the first conveyor 200 and moving along a jig transport rail 600 to pick up and transport the jig unit 100 to a soldering area (soldering stage: C), an induction heating unit 400 including a magnetic induction coil 410 for induction heating the board A mounted on the jig unit 100 transported by the pick-up robot 300 to solder the electronic component B, and a controller 500 for controlling the first conveyor 200, the pick-up robot 300 and the induction heating unit 400.

[0037] The jig unit 100 is disposed below the induction heating unit 400 and fixes the substrate A to be induction heated in a non-contact manner. The jig unit 100 will be described in detail later.

[0038] The first conveyor 200 is disposed long in the front-rear direction, and conveys the jig unit 100, to which the substrate A on which the electronic element B is mounted is fixed, from the front to the rear.

[0039] A second conveyor 800 for transporting the jig unit 100 may be further disposed next to the first conveyor 200. Accordingly, the board A on which the electronic element B needs to be soldered can be carried into the equipment via the first conveyor 200, and the completed product after soldering can be carried out of the equipment via the second conveyor 800. This will be described in detail later.

[0040] 3, the pick-up robot 300 moves along a jig transport rail 600 arranged in an elongated manner in the x-axis direction (left-right direction) between two post structures standing upright on a base 900 of an automated equipment, grips the jig unit 100, and then transports the jig unit 100 to a soldering stage C. A drive unit (not shown) for moving the pick-up robot 300 in the x-axis direction is incorporated in the jig transport rail 600.

[0041] The pick-up robot 300 is configured to have a shape including a cylinder (not shown) having a number of rods, and includes at its lower end a pair of robot arms 310 that move toward and away from each other on the y-axis to grip and release the jig unit 100. The pick-up robot 300 moves the robot arms 310 in the z-axis direction by hydraulic or pneumatic pressure.

[0042] In further detail, the pickup robot 300 moving along the jig transport rail 600 is transported by the first conveyor 200, and in order to grasp the jig unit 100 waiting in the waiting area D or the jig unit 100 placed on the manual stage F, hydraulic or pneumatic pressure is applied to the inside of the cylinder body so that the rod of the cylinder (not shown) advances downward. Then, the pair of robot arms 310 arranged at the lower end of the rod approach each other on the y-axis line, and the robot arms 310 are fitted under the top plate 150 of the jig unit 100. In this state, hydraulic or pneumatic pressure is applied again to the inside of the cylinder body of the transport head 300 so that the cylinder rod advances into the inside of the cylinder body, and the jig unit 100 can be lifted in the z-axis direction. Thereafter, the pickup robot 300 transports the jig unit 100 along the jig transport rail 600 to the soldering stage C, and then lowers the jig unit 100 in the z-axis direction, thereby lowering the jig unit 100 onto the soldering stage C.

[0043] On the other hand, when soldering of the board A placed on the jig unit 100 is completed, the pick-up robot 300 picks up the jig unit 100 and then lowers it into the discharge area E of the second conveyor 800 or into the manual stage F.

[0044] The pick-up robot 300 according to the present invention repeats this process to transport the jig unit 100 loaded onto the first conveyor 200 or the jig unit 100 loaded onto the manual stage F to and from the soldering work area and the unloading area.

[0045] 4, the induction heating unit 400 is moved in the x-axis, y-axis and z-axis directions by the induction heating movement module 700 to inductively heat the board A placed on the fixture unit 100 and solder the electronic component B to the board A. The induction heating unit 400 will be described in detail later.

[0046] The induction heating movement module 700 is a means for moving the position of the induction heating unit 400 in accordance with the shape of the substrate and the position of the electronic element, and is capable of movement along three axes, the x-axis, y-axis, and z-axis.

[0047] For this purpose, the induction heating moving module 700 is formed by combining three units, for example, a y-axis unit 710 supported on the base 900 side while being arranged horizontally in the front-to-back direction of the base 900, an x-axis unit 720 supported on the y-axis unit 710 side while being arranged horizontally in the left-to-right direction of the base 900, and a z-axis unit 730 supported on the x-axis unit 720 side while being arranged vertically in the upward direction of the base 900.

[0048] As a result, when the y-axis unit 710 is operated, the entire induction heating unit 400, z-axis unit 730 and x-axis unit 720 can move in the front-to-back direction (y-axis) of the base 900, when the x-axis unit 720 is operated, the induction heating unit 400 and z-axis unit 730 can move in the left-to-right direction (x-axis) of the base 900, and when the z-axis unit 730 is operated, the induction heating unit 400 can move in the up-down direction (z-axis) of the base 900.

[0049] As shown in FIG. 5, each of the units 710, 720, 730 is composed of a unit body 712 with a guide rail 711, a drive unit 713 (e.g., a servo motor) connected to one end of the unit body 712 in the longitudinal direction, and a slider 714 that moves along the guide rail 711 of the unit body 712 while being linked to the drive unit 713. Each unit is capable of moving in each direction together with the slider by connecting its own unit body to and supporting it on the slider side.

[0050] For example, the unit body of the x-axis unit 720 is coupled to the slider of the y-axis unit 710, the unit body of the z-axis unit 730 is coupled to the slider of the x-axis unit 720, and the body of the induction heating unit 400 is coupled to the slider of the z-axis unit 730. Here, in the case of the z-axis unit 730, it is preferable that it is coupled to the slider of the x-axis unit 720 via a separate bracket.

[0051] Thus, induction heating unit 400 can move in the xyz directions as each unit is transported in the three axes x, y, and z to a desired location for soldering.

[0052] Meanwhile, the above-mentioned soldering stage C, waiting area D for the jig unit 100, unloading area E for the jig unit 100, and manual stage F will be described in more detail with reference to FIGS. 2 and 3. FIG.

[0053] As shown in Figures 2 and 3, inside the soldering equipment 10, a soldering area (soldering stage: C), a waiting area for the jig unit 100 (D: an area of ​​the first conveyor), an unloading area (E: an area of ​​the second conveyor) and a manual area (manual stage: F) are defined in that order along the x-axis direction, and a first conveyor 200 and a second conveyor 800 are arranged in parallel in a long shape along the y-axis direction.

[0054] Here, the first conveyor 200 is a means for transporting the substrate A placed on the jig unit 100 into the interior of the equipment, and when the first conveyor 100 is stopped, it provides a waiting area D where the substrate A that has been transported into the equipment is immediately before being transferred to the soldering stage C.

[0055] On the other hand, the second conveyor 800 is a means for transporting the soldered board A outside the equipment while it is placed on the jig unit 100, and when the second conveyor 800 is stopped, it provides an unloading area E just before the soldered board A is transported outside the equipment.

[0056] The manual stage F provides an area where an operator manually loads and unloads the jig unit 100 on which the substrate A is mounted. Such a manual stage F makes it possible to more flexibly handle soldering of a variety of products in small quantities.

[0057] The above-mentioned soldering stage C, waiting area D of the first conveyor 200, unloading area E of the second conveyor 800, and manual stage F are arranged in a straight line along the x-axis direction on the base 900. At this time, the pick-up robot 300 moves above each of these areas along the x-axis direction, and carries the jig unit 100 into each of the areas C, D, E, and F, and carries the jig unit 100 out of each of the areas C, D, E, and F.

[0058] Here, the soldering stage C and manual stage F are formed by mounting tables 910 fixedly supported on both sides of the upper surface of a base 900 disposed on the floor surface of the soldering equipment 10. The jig unit 100 is mounted on these mounting tables 910. Meanwhile, the first and second conveyors 200, 800 are fixedly supported on the upper surface of the base 900 using brackets or the like while passing above the base 900 between the welding and manual stages C and F.

[0059] The controller 500 controls the positions of the pick-up robot 300 and the induction heating unit 400, and the travel of the first and second conveyors 200, 800. The controller 500 is connected to an input means for inputting various data such as soldering conditions such as the shape of the board, material, soldering position, soldering speed, and high frequency generation output, and soldering objectives such as emphasis on precision, emphasis on speed, and emphasis on energy saving, and a liquid crystal display (LCD) touch panel as a display means for displaying various data.

[0060] Meanwhile, a plurality of (e.g., three) soldering equipments 10 each including a jig unit 100, a pick-up robot 300, an induction heating unit 400, a controller 500, and an induction heating moving module 700 are provided in isolation along the first conveyor 200. Therefore, a variety of soldering products can be produced simultaneously.

[0061] Operations of the automated induction heating soldering equipment of the present invention having the above-mentioned configuration, such as loading and unloading of the jig unit and soldering steps, will be described with reference to FIGS. 2 and 6. FIG.

[0062] As shown in FIG. 2 and FIG. 6, in the present invention, the passage through which the jig unit is carried into the soldering equipment mainly includes the first conveyor and the manual stage.

[0063] First, the process of carrying the jig units onto the first conveyor, soldering them, and carrying them out will be described. A large number of jig units 100 are mounted on the first conveyor 200 at regular intervals and carried into the soldering equipment 10 (step S10). At this time, the first conveyor 200 carries the jig units 100 into the waiting area D of the soldering equipment 10 one by one, repeatedly transporting and stopping one step at a time (step S20). When the jig unit 100 is located in the waiting area D, the pick-up robot 300 moves to the waiting area D along the jig transport rail 600, picks up the jig unit 100, and transfers it to the soldering stage C (step S30). After that, the induction heating unit 400 receives information such as the soldering position according to the shape of the board and the arrangement structure of the electronic elements input to the controller 500, and moves in the x, y, and z directions on the soldering stage C to the desired soldering portion and performs soldering. Here, when a large number of boards A are loaded on the jig unit 100, or when a large number of electronic elements B are soldered to one board A, the controller 500 moves continuously in the x, y, and z directions according to the control logic previously stored in the controller 500, and solders all the electronic elements B of the board A on the jig unit 100 at once (step S40). When the soldering process of all the electronic elements on the jig unit 100 is completed, the pickup robot 300 receives a signal from the controller 500, carries in the jig unit 100 on the soldering stage C, and then moves the jig unit 100 to the carry-out area E of the second conveyor 800 (step S50). The second conveyor 800 carries the soldered jig unit 100 out of the equipment 10 (step S60). This completes one cycle of the process in which the jig unit 100 is carried in by the first conveyor 200, soldered, and then carried out.

[0064] In relation to this, when soldering is performed using one soldering device, the first conveyor alone can be used without the second conveyor. That is, while picking up a jig unit in the waiting area of ​​the first conveyor and performing soldering at the soldering stage (area C), the first conveyor continues to wait with its transportation stopped, and when the soldered jig unit is moved to the waiting area (area D) where the first conveyor was originally located, it moves by one step at that time to perform loading, soldering, and unloading consecutively. In this case, the induction heating unit 400 can directly solder a board mounted on a jig unit in the waiting area (area D) of the first conveyor. That is, instead of moving the jig unit to the soldering stage (area C), the induction heating unit 400 can move to the waiting area (area D) inline with the first conveyor to perform soldering.

[0065] Next, a process in which the jig unit is carried into the manual stage, soldered, and then carried out will be described. The operator places the jig unit 100 on the manual stage F. After this, the pick-up robot 300 transfers the jig unit 100 placed on the manual stage F to the soldering stage C, and the induction heating unit 400 performs the soldering process. This is the same process as the above-mentioned steps S30 and S40. At this time, the operator must set new information about the board to be carried into the manual stage and new soldering logic via a display linked to the controller 500. When the soldering process of all electronic elements in the jig unit 100 is completed based on the new information of the controller 500, the pick-up robot 300 receives a signal from the controller 500, carries in the jig unit 100 at the soldering stage C, and then transfers it again to the manual stage F (step S51). Then, the operator carries out the jig unit at the manual stage F to the outside of the equipment (step S61). This completes one cycle of the process, in which the component is carried in to the manual stage, soldered, and then carried out.

[0066] Such a soldering process using a manual stage is used when soldering is required for a small number of products while soldering is being performed for a large number of products using the first conveyor. In other words, when urgent soldering is required for a small number of products, it is possible to flexibly respond without dismantling all the jig units on the first conveyor line. In this way, the present invention has the advantage that it can simultaneously handle both a small number of products and a large number of products using a single soldering device.

[0067] Next, the soldering process using the second or third soldering equipment will be described. The jig unit is mounted on the first conveyor 200 across the second or third soldering equipment 10. At this time, the jig unit 100 mounted on the first conveyor 200 is loaded with the board A before soldering. If these jig units 100 are positioned in the waiting area D of the second or third soldering equipment (step S21), the above-mentioned steps S20 to S60 are performed in the same process. When soldering is performed using multiple soldering equipment, it is necessary to use the first conveyor 200 and the second conveyor 800 simultaneously. Here, the first conveyor 200 is used as a means for carrying the jig unit before soldering into the equipment, and the second conveyor 800 is used as a means for carrying the jig unit after soldering out of the equipment.

[0068] Hereinafter, the jig unit 100 and the induction heating unit 400 constituting the automated induction heating soldering equipment of the present invention will be described in more detail with reference to the drawings.

[0069] Figures 7 and 8 are views showing an induction heating unit and a fixture unit together according to one embodiment of the present invention, Figure 9 is a view showing a fixture unit according to one embodiment of the present invention, Figure 10 is an exploded view of an induction heating unit according to one embodiment of the present invention, Figure 11 is an exploded view of the magnetic induction coil and coil fixing body shown in Figure 10, Figure 12 is a view showing a magnetic core and a lower magnetic core in an induction heating unit and fixture unit according to one embodiment of the present invention, and Figure 13 is a view showing a fixing panel and a substrate (e.g., an external case of a smartphone) in a fixture unit according to one embodiment of the present invention.

[0070] The jig unit 100 will be described in more detail with reference to Figures 7 to 9 and 13. The jig unit 100 comprises a bottom plate 110, a pair of guide plates 120 installed facing each other on both ends of the upper surface of the bottom plate 110, first and second support plates 130, 140 installed facing each other on both ends of the upper surface of the bottom plate 110 where the guide plate 120 is not installed, a top plate 150 installed on the upper ends of the pair of guide plates 120 and the first and second support plates 130, 140, a spring 160 installed on the first support plate 130, a pressing plate 170 connected to the spring 160 to receive elastic force, and a fixing member 180 for fixing the substrate A.

[0071] The guide plate 120 is formed with an elongated guide hole 121 .

[0072] The first support plate 130, the second support plate 140 and the pair of guide plates 120 are respectively installed on the side ends of the peripheral portion of the bottom plate 110, thereby forming a rectangular shape.

[0073] The top plate 150 has a fitting hole 151 formed therein.

[0074] The spring 160 has one end connected to the first support plate 130 and the other end connected to the pressing plate 170 , and applies an elastic force in a direction that presses the pressing plate 170 towards the second support plate 140 .

[0075] The pressing plate 170 has guide protrusions 171 at both ends, and the guide protrusions 171 are fitted into the guide holes 121 of the guide plate 120 to move forward and backward.

[0076] The fixing member 180 is disposed between the second support plate 140 and the pressing plate 170 through the fitting hole 151 of the top plate 150. Such a fixing member 180 is composed of a number of fixing panels 181 and a finishing panel 182 installed on an edge of one side of the fixing panels 181.

[0077] At least one magnetic core 181 a is installed on the fixed panel 181 , and a large number of such fixed panels 181 are disposed between the second support plate 140 and the pressing plate 170 .

[0078] On the other hand, when multiple fixed panels 181 are stacked horizontally, gaps are generated between the fixed panels 181, and one substrate A is placed in each of these gaps. The first fixed panel 181 of the multiple fixed panels 181 as described above comes into contact with the pressing plate 170.

[0079] The finishing panel 182 is installed next to the last fixed panel 181 among the multiple fixed panels 181 stacked horizontally. The substrate A is also installed between the finishing panel 182 and the fixed panel 181. The finishing panel 182 contacts the second support plate 140.

[0080] Meanwhile, a large number of magnets 181b are installed on the fixed panel 181, so that adjacent fixed panels 181 are attached to each other by magnetic force. Needless to say, it is also possible to install magnets on the finishing panel 182 so that adjacent fixed panels 181 are attached to each other by magnetic force.

[0081] The induction heating unit 100 will be described in more detail with reference to Figures 7 to 8 and Figures 10 to 12. The induction heating unit 400 includes a magnetic induction coil 410, a magnetic core 420 installed at the center of the magnetic induction coil 410, a coil fixing body 430 in which the magnetic induction coil 410 and the magnetic core 420 are installed, a body fixture 440 in which the coil fixing body 430 is built, and a front fixture 450 and a base fixture 460 installed at the front and rear of the body fixture 440, respectively.

[0082] The magnetic induction coil 410 is connected to a high-frequency power source 480 in order to convert electrical energy into thermal energy by electromagnetic induction, and locally heats an area requiring soldering at a certain distance above the substrate A in a non-contact manner to solder the electronic element B.

[0083] Such magnetic induction coil 410 is wound in a spiral shape and stacked in multiple layers upward. Since the magnetic induction coil is wound in a spiral shape in this manner, an internal space 410a is formed in the center.

[0084] The magnetic core 420 is made of a magnetic material, preferably ferrite, and is installed in the internal space 410a of the magnetic induction coil 410 to concentrate the magnetic flux and concentrate the heat source at the soldered portion.

[0085] On the other hand, as described above, the magnetic core 181a is also installed in the fixed panel 181 of the fixed member 180, but from the viewpoint of concentrating the magnetic flux, it is preferable that the magnetic core 420 installed in the magnetic induction coil 410 and the magnetic core 151a installed in the fixed panel 181 are installed so as to face each other.

[0086] The coil fixing body 430 is fabricated in a shape similar to a rectangle that is long in one direction, and is formed with at least one core fitting hole 431 into which the magnetic core 420 is fitted, and a coil fitting hole 432 into which the magnetic induction coil 410 is fitted is formed on the outer surface.

[0087] The core fitting hole 431 is a hole into which the magnetic core 420 standing upright in the internal space 410a of the magnetic induction coil 410 is fitted. A core cover 433 is installed at the upper end of the inside of the core fitting hole 431 to prevent the magnetic core 420 from slipping out to the outside.

[0088] A spirally wound magnetic induction coil 410 is fitted into the coil fitting hole 432 .

[0089] Meanwhile, in the coil fixing body 430, a number of communication holes 434 that connect the magnetic core 420 and the magnetic induction coil 410 are formed.

[0090] The communication hole 434 is formed so that the core fitting hole 431, into which the magnetic core 420 is fitted, communicates with the outer surface of the coil fixing body 430. Air can flow through the communication hole 434 to cool the magnetic core 420 and the magnetic induction coil 410.

[0091] Meanwhile, a heat dissipation sheet (seat) 435 may be installed in the communication hole 434. Therefore, the heat dissipation sheet 435 has an inner surface in contact with the outer surface of the magnetic core 420 and an outer surface in contact with the magnetic induction coil 410, so that the cooling of the magnetic core 420 and the magnetic induction coil 410 can be promoted.

[0092] The body jig 440 includes a coil fixing body 430 in which a magnetic core 420 and a magnetic induction coil 410 are installed.

[0093] The front jig 450 and the base jig 460 are respectively installed on both side ends of the body jig 440. When the body jig 440, the front jig 450, and the base jig 460 are connected in this manner, an empty space is formed between them, and the distance measuring device 470 is installed in this empty space.

[0094] The distance measuring device 470 has both ends installed on the front jig 450 and the base jig 460 , respectively, and irradiates a laser toward the jig unit 100 through the body jig 440 and the coil fixing body 430 .

[0095] Such a distance measuring device 470 irradiates a laser toward the jig unit 100 to measure the distance between the magnetic core 420 and the electronic element B mounted on the board A. Therefore, the magnetic core 420 and the electronic element B are positioned at optimal positions for uniform, high-quality soldering using the distance measuring device 470.

[0096] In this manner, the laser passing holes 436 and 441 through which the laser emitted from the distance measuring device 470 passes are formed in the coil fixing body 430 and the body jig 440 so as to be connected to each other.

[0097] The induction heating soldering equipment according to the present invention can perform the soldering process of electronic components by performing separate induction heating, thereby improving precision and stability, and greatly reducing the time and power consumption required for soldering the entire board.

[0098] In addition, since the induction heating unit moves adjacent to the electronic device while soldering, the process of heating the entire board and then cooling the entire board can be omitted. In this regard, the conventional reflow soldering equipment includes a process of heating the entire board and then cooling the entire board again, which uniformly melts the solder paste located on the entire board, and at the same time, heats the board at a low temperature for a long time to prevent thermal damage to the molded circuit components and other components, which has the limitation that the time required for soldering is long, and further requires a chamber and an oven for heating, and a space for moving the entire board to perform each process must be secured. In addition, since a separate cooling process must be performed, a moving device and cooling equipment for the cooling process are required, which makes the cooling time longer. However, the automated soldering equipment according to the present invention can solve all of these problems.

[0099] Each embodiment of the present invention has been described above with reference to the drawings. However, these terms are merely for the purpose of clearly explaining the present invention, and it should be understood that a person having ordinary knowledge in the art can modify and change the present invention in various ways without departing from the spirit and scope of the present invention as described in the claims.

[0100] In one embodiment of the present invention, the soldering target is an outer case of a mobile phone, which is an MID product, but the electronic device of various embodiments of the present invention is not limited thereto and can be applied to any kind of electronic device requiring a soldering process. For example, the electronic device may be a wearable device such as a smart watch or anti-reflective (AR) glass, a display device, a home appliance, a vehicle part, a light-emitting diode (LED) lamp, a touch panel, an antenna module, etc. [Industrial Applicability]

[0101] The present invention relates to an automated induction heating soldering device, and can be widely used in the electronics / electrical industry and mechanical industry, where elements are soldered to PCBs for connection between components, control, sensing, etc.

Claims

1. a jig unit (100) for fixing a substrate (A) on which an electronic element (B) is mounted; A first conveyor (200) for transporting the jig unit (100); an induction heating unit (400) that is installed above the jig unit (100) so as to be movable in the x-axis, y-axis, and z-axis directions and that includes a magnetic induction coil (410) that induction heats the substrate (A) attached to the jig unit (100) to solder the electronic element (B); a controller (500) for controlling the first conveyor (200) and the induction heating unit (400); An automated induction heating soldering equipment comprising:

2. 2. The automated induction heating soldering equipment according to claim 1, further comprising a pick-up robot (300) that picks up the jig unit (100) transported by the first conveyor (200) and moves it to a soldering stage (C).

3. 3. The automated induction heating soldering equipment according to claim 2, wherein a plurality of soldering equipments each including the induction heating unit (400), the pick-up robot (300) and the controller (500) are arranged along the first conveyor (200).

4. 4. The automated induction heating soldering equipment according to claim 3, further comprising a second conveyor (800) for transporting the jig unit (100) next to the first conveyor (200).

5. 5. The induction heating soldering automation equipment according to claim 4, further comprising a manual stage (F) on one side of the first conveyor (200) for manually loading and unloading the jig unit (100).

6. 6. The automated induction heating soldering equipment according to claim 5, wherein the soldering stage (C), the waiting area (D) of the first conveyor (200), the unloading area (E) of the second conveyor (800) and the manual stage (F) are arranged in a straight line along the x-axis direction on the base (900) of the soldering equipment (10), and the pick-up robot (300) moves along the x-axis direction above each of these areas (C), (D), (E), and (F) to load the jig unit (100) into each of the areas (C), (D), (E), and (F) and unload the jig unit (100) from each of the areas (C), (D), (E), and (F).

7. The induction heating movement module (700) for moving the induction heating unit (400) in three axial directions of x, y, and z is composed of a y-axis unit (710) supported on the base (900) of the soldering equipment (10), an x-axis unit (720) supported on the y-axis unit (710) side, and a z-axis unit (730) supported on the x-axis unit (720) side.

6. The induction heating soldering automation equipment according to claim 5, wherein each of the units (710), (720), (730) comprises a unit body (712) with a guide rail (711), a driving unit (713) coupled to one end of the unit body (712) in the longitudinal direction, and a slider (714) that is transported along the guide rail (711) by driving the driving unit (713).

8. The pickup robot (300) has a pair of robot arms (310) at its lower end which move along the jig transport rail (600) in the x-axis direction and move toward and away from each other on the y-axis line to grip and release the jig unit (100), and the robot arms (310) are moved in the z-axis direction by hydraulic or pneumatic pressure.

9. 2. The induction heating soldering automation equipment according to claim 1, wherein the substrate (A) is a printed circuit board (PCB), a flexible printed circuit board (FPCB) or a molded integrated circuit device (MID) extrusion.

10. 2. The automated induction heating soldering equipment according to claim 1, wherein the jig unit (10) is provided with a pressing plate (170) having one side connected to a spring (160) for pressing and fixing a plurality of substrates.

11. The jig unit (100) comprises: A bottom plate (110); A pair of guide plates (120) are installed on both sides of the upper surface of the bottom plate (110) so as to face each other and have guide holes (121) formed therein; a first and a second support plate (130), (140) installed on both sides of the upper surface of the bottom plate (110) so as to face each other; a top plate (150) disposed on the upper ends of the pair of guide plates (120) and the first and second support plates (130) and (140), and having a fitting hole (151) formed therein; a spring (160) mounted on the first support plate (130); a pressing plate (170) that receives elastic force from the spring (160) and moves with guide protrusions (171) provided at both ends fitted into the guide holes (121); a fixing member (180) that is disposed between the second support plate (140) and the pressing plate (170) through a fitting hole (151) of the top plate (150) and fixes the substrate (A); The automated induction heating soldering equipment according to claim 10, further comprising:

12. The fixing member (180) is arranged between the second support plate (140) and the pressing plate (170) in large numbers, and includes a large number of fixing panels (181) that create a gap for the substrate (A) to be placed thereon; a finishing panel (182) installed at one end of the fixed panel (181) and in contact with the second support plate (140); The induction heating soldering automation equipment according to claim 11, further comprising:

13. The induction heating unit (400) includes a magnetic induction coil (410) that is spirally stacked upward; One or more magnetic cores (420) standing in the center of the magnetic induction coil (410); a coil fixing body (430) having a core fitting hole (431) into which the magnetic core (420) is fitted and a coil fitting hole (432) into which the magnetic induction coil (410) is fitted formed on an outer surface thereof; a body jig (440) in which the coil fixing body (430) is built; a front jig (450) and a base jig (460) installed in front and rear of the body jig (440), respectively; 2. The automated induction heating soldering equipment according to claim 1, comprising:

14. 14. The induction heating soldering automation equipment according to claim 13, wherein the front jig (450) and the base jig (460) are provided with a distance measuring device (470) for irradiating a laser toward the jig unit (100) through the body jig (440) and the coil fixing body (430).

15. 14. The automated induction heating soldering equipment according to claim 13, wherein a magnetic core (181a) is installed in a portion of the jig unit (100) facing the magnetic core (420).

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