Identification label, identification system, and method for manufacturing the identification label

Abstract

The identification label (1) comprises an RFID transponder (3) with an RFID chip (5) and an antenna structure (6) which are signal-technically connected to one another, and a sealing layer (2, 4) which covers the RFID transponder (3). The sealing layer (2, 4) is material-bondedly connected to the substrate (4, 8, 13) by welding. The RFID chip (5) and / or the antenna structure (6) are thus surrounded by a welded seam (7) and are encapsulated between the sealing layer (2, 4) and the substrate (4, 8, 13).

Description

[Technical field]

[0001] The present invention relates to an identification label that allows reliable and durable labeling of objects in a simple and cost-effective manner. The present invention also relates to a labeling system comprising such an identification label and to a method for producing such an identification label. [Background technology]

[0002] Labels can be used for authentication or proof of origin wherever identification or verification of an object is required. Some labels are equipped with electronic components, such as RFID transponders, which allow convenient detection and electronic recording of information on the label and its bearer (Informationen der Etiketten und damit versehener Informationen). Summary of the Invention

[0003] The problem that the present invention aims to solve is to provide an identification label which can be produced in a simple and cost-effective manner and which allows for reliable and durable labelling of objects.

[0004] This problem is solved by the features of the independent patent claims. Advantageous further developments are given in the respective dependent claims.

[0005] According to one aspect of the invention, an identification label comprises an RFID transponder having an RFID chip and an antenna structure which are signal-technically connected to one another and a sealing layer which covers the RFID transponder, the sealing layer being material-bondedly connected to the substrate by welding in such a way that the RFID chip and / or the antenna structure are surrounded by a weld seam and are encapsulated between the sealing layer and the substrate.

[0006] Identification labels are a simple and cost-effective way of providing safe and reliable electronic labeling on objects. Due to the sealing welded seam, the identification label is reliably protected against undesired external influences, for example in the form of moisture. For example, identification labels can be designed as RFID labels with welded edges and are used in the medical or pharmaceutical sector for labeling syringes or containers, which are usually processed using sterilization processes, such as autoclaving. Due to the described structure of the identification label, the penetration of steam or liquids into the area of ​​the RFID transponder is reliably prevented, so that the identification label remains on the object without significantly impairing its functionality.

[0007] In the context of the present invention, it has been found that conventional electronic labels with RFID functionality are subject to corrosion and reduced performance due to the ingress of moisture. Despite the use of protective films, moisture can penetrate laterally through the adhesive layer and reach the sensitive areas of the RFID function, sooner or later adversely affecting its functionality. The use of such labels on products to be sterilized is therefore either not possible or poses a high risk in terms of functionality.

[0008] The described identification label and sealing welded seam provide the desired moisture barrier so that the RFID functionality is maintained after the autoclave process and a general reliable protection of the RFID transponder against chemical and / or physical influences is established.

[0009] According to a further development of the identification label, the RFID transponder comprises a carrier layer, on which the RFID chip and the antenna structure are arranged, the carrier layer forming a sealing layer which is material-bondingly connected to the substrate by means of a welded seam. Alternatively, such a carrier layer of the RFID transponder can also form the substrate to which the sealing layer is connected by means of a welded seam. The carrier layer is designed, for example, as a polyethylene (PE) or polyethylene terephthalate (PET) film element and is connected to the substrate by melting. Furthermore, other thermoplastics or plastics or materials in general are also possible, which can be material-bondingly connected to the substrate by welding, sealing or melting. The carrier layer can form a component of the RFID transponder and also function as a sealing layer. Alternatively, the carrier layer can form a support for the RFID chip and the antenna and can be covered with a further sealing layer, for example in the form of a film-based top layer. Furthermore, the RFID transponder with the carrier layer can also be arranged and encapsulated between these components, without a fixed connection to the top layer, the sealing layer and / or the substrate, but freely movable, so to speak, free-floating.

[0010] Furthermore, the identification label can have a bottom layer forming a substrate that is materially connected to the sealing layer by a welded seam. The bottom layer can be realized as a film element, such as a PET or PE film, and can be welded to the carrier layer of the RFID transponder described above. Insofar as there is an upper layer that also forms a sealing layer, the bottom layer can be welded to the upper layer and, optionally, also to the carrier layer, and surround the RFID transponder.

[0011] Preferably, films of the same type are welded together. For example, the sealing layer is a PET film and the substrate is a lower layer in the form of another PET film. Alternatively, different weldable materials can be provided on the sealing layer and the substrate. For example, semi-crystalline and amorphous films can be mixed or materially connected. In both cases, a composite can be formed of at least one meltable or hermetically sealable sealing layer and the substrate, which realizes the carrier material of the RFID transponder. Furthermore, other layers can also be incorporated into the structure of the identification label, so that a multi-layer composite system can be realized, for example with different functional layers.

[0012] The sealing layer and / or the processed film of the substrate have a thickness of, for example, 15 μm to 500 μm in order to provide the defined properties, such as high flexibility, high resistance to mechanical influences or light protection, etc. This thickness refers to the lamination direction transverse to the main extension plane of the identification label, which in the state applied to the object essentially corresponds to the surface normal of the object.

[0013] The aforementioned bottom layer can form a component of the identification label or can be associated with the object to which the label is to be applied. For example, the bottom layer can be formed by an already applied label or a film element such as a shrink film applied by a syringe. Thus, the label or the shrink film can form the bottom layer, which is material-bondedly connected to the sealing layer of the identification label by welding.

[0014] Alternatively, the object itself can also form a lower layer or substrate to which the sealing layer of the identification label is material-bondably connected by welding. For example, a plastic syringe or injector (Kunststoffspritze) is provided, the surface of which forms a weldable substrate. This substrate or such surface is provided with a sealing layer and can be material-bondably connected by welding. That is to say, the RFID chip and the antenna structure can be applied directly to a solid substrate or component by means of a carrier material or sealing layer. The carrier material serves to self-protect the RFID transponder. The electronic identification label is therefore provided only in a previous step by the RFID transponder and the sealing layer and is formed as a final product by material-bondably welding connection with a given substrate.

[0015] The identification label can be realized with a particularly simple and clear structure, and does not require additional barrier elements, protective bodies or additional layers to establish a reliable sealing of the RFID function, in particular against moisture and corrosion. Corrosion due to excessive moisture occurs, for example, in the area of ​​the RFID chip, which usually has metal or metal contacts. The antenna structure of the RFID transponder, which is formed, for example, by conductor tracks of silver, aluminum or copper, can also suffer significant loss of function due to corrosion. With the described identification label, for example, based on the material bonding effect of the RFID chip and / or the RFID antenna structure, flexible adhesive labels can be realized which reliably prevent the ingress of moisture and prevent corrosion or at least significantly reduce the risk of corrosion. Therefore, it is not necessary to protect the RFID function in a complex and costly manner, which, for example, would not be possible to ensure the same flexibility and versatility as flexible adhesive labels, by completely molding the RFID.

[0016] According to a further development of the identification label, the sealing layer is connected to the substrate by an adhesive layer, so that the adhesive layer is at least partially surrounded by the weld seam in the weld seam and enclosed between the sealing layer and the substrate. In this way, the adhesive layer is also protected against the effects of moisture and can contribute to a secure holding or binding of the components of the identification label. For example, the adhesive layer is applied locally to the underside of the sealing layer facing the RFID transponder and the substrate. Such an adhesive layer can be applied partially or form a closed ring or a closed frame. Preferably, the adhesive layer is formed over the entire surface of the underside of the sealing layer, and the weld seam displaces the adhesive layer inward or outward of the material-bonding adhesive area during formation. The adhesive layer can therefore also be present in the area where the weld seam and the material-bonding connection are formed. Alternatively or additionally, the adhesive layer or further adhesive layer can be arranged outside the area of ​​the welded seam in order to first connect the sealing layer to the substrate in its adhesive end region and then form a welded seam in the adhesive region.

[0017] The adhesive layer is preferably provided so that it remains completely or to a large extent in the region of the joining zone where the weld seam is formed. The joining zone can thus be designed adhesive-free and the sealing layer can be reliably welded to the substrate. The adhesive layer can be formed only in the inner region of the RFID antenna structure and surrounded by the weld seam. Alternatively or additionally, the adhesive layer or a further adhesive layer can also be arranged in the outer edge region adjacent to the weld seam. The identification label can thus have two or more adhesive parts separated by purposefully formed adhesive-free regions. The adhesive-free regions are provided for forming the weld seam and are in particular adapted to the shape of the RFID antenna structure. For example, the RFID antenna structure and the adhesive-free regions are formed rectangular, square or circular. Alternatively, they can also be formed in other geometric shapes.

[0018] According to a further development of the identification label, the weld seam extends and closes along the label edge of the identification label. The weld seam forms, for example, a ring or frame around the RFID transponder, at least around the RFID chip or the RFID antenna structure. It is advantageous, for example, if the identification label reliably seals the RFID chip as a sensitive electronic semiconductor component, and different antenna structures can also be coupled to the welded RFID chip. RFID chips often have a similar structure, but the antenna structures can have different shapes and structures depending on the application and functional specifications. The weld seam extends over a part of the antenna structure that is connected to the RFID chip. However, even at such overlaps, the weld seam is reliably formed and material-bondedly connected to the antenna structure, which for example consists of or contains silver, aluminum or copper.

[0019] The identification label can be assigned a stacking direction and a main extension surface, the stacking direction forming a direction substantially perpendicular to the main extension surface. The identification label is in particular, like most labels, flat, so that the label width and label length clearly exceed the label thickness. The label width and label length span the main extension surface, the label thickness is along the stacking direction. For example, then along the stacking direction a top layer is applied, followed by an RFID transponder with or without its own carrier layer, followed by a bottom layer or substrate.

[0020] The weld seam is preferably designed with a predefined construction profile and with a predefined width relative to the main extension plane, for example with values ​​between 0.2 mm and 10 mm. Such a weld seam can be easily and reliably formed, in particular by ultrasonic welding. Alternatively, the weld seam can be formed using laser welding and can be even thinner or narrower and have a width of 0.1 mm. However, the weld seam of the identification label can be wider than 10 mm, since wider weld seams can also be formed by welding or sealing. A predefined wide weld seam creates a corresponding inherent stiffness of the weld seam, which contributes to an increased stiffness of the identification label and can counteract undesired wrinkles of the identification label. The height or thickness of the weld seam can also be designed depending on the RFID function involved.

[0021] The identification label can furthermore be designed such that the welded seam has a predefined two-dimensional structure relative to the main extension plane, for example a wavy, zigzag and / or waffle structure. In this way, the welded seam can also be effectively widened, which, in comparison with a narrow, straight welded seam, increases the inherent stiffness and strength of the welded connection, contributes to an increased stiffness of the identification label and prevents undesired wrinkling of the identification label. The described options for designing the two-dimensional structure contribute to the stability of the bond of the identification label and, for example, ensures a distortion-free subsequent application of the identification label on or to an object. The welded seam can be formed in parts or closed continuously in one working step.

[0022] The weld seam can be formed locally or circumferentially around the RFID chip and / or antenna structure, which ensures a sealing of the RFID chip and / or antenna structure. Such a material-bonding connection does not necessarily have to be self-sealing, but can also cooperate with one or more auxiliary elements and / or adjacent structures of the identification label and / or substrate. At least the material-bonding connection by the weld seam formed between the sealing layer and the substrate contributes to a reliable sealing of the RFID transponder or the RFID chip and / or antenna structure.

[0023] According to a further development of the identification label, the sealing layer and / or the substrate are previously material-bondedly connected to one another by a welded seam, so that the identification label forms a predefined curved labeling medium. The welded seam can thus be formed in a predefined three-dimensional configuration, so that the shape of the identification label is adapted to the contour shape of the object to be labeled. Such adaptation has a beneficial effect on the easy application and secure holding of the identification label, since the restoring forces that would force the identification label into a flat position are reduced compared to flat labels that are to be applied to curved surfaces. For example, the identification label is formed by a sonotrode using ultrasonic welding and a support in the form of an anvil, and is intended for use with cylindrical containers, such as syringes with a cylindrical syringe body. Particularly preferably, the anvil has a contact surface with the sonotrode, which has a curvature that corresponds to the circumferential curvature of the syringe body.

[0024] The identification label may further comprise a film element, which is bonded to the RFID transponder and / or the sealing layer and / or the substrate and is designed to counteract moisture absorption into the encapsulated area carrying the RFID chip and / or antenna structure. For example, the sealing layer may be combined with a film material having special properties, which forms the top material, the intermediate layer and / or the inlay substrate and establishes an additional barrier effect, for example against oxygen and / or water vapor and also against corrosive gases and / or liquids, or counteracts the absorption of oxygen and / or moisture or the absorption of corrosive gases and / or liquids into the area of ​​the RFID transponder.

[0025] According to a further development, the identification label has a functional element connected to or attached to or applied to the RFID transponder and / or the sealing layer and / or the substrate and designed to provide mechanical protection for the RFID chip and / or antenna structure. For example, mechanical protection can be provided for the RFID transponder by additionally inserting a fleece layer. Alternatively or additionally, foam elements and / or rubber-elastic film elements can be provided, which serve as upper and / or lower cover layers for the RFID transponder and jointly form the sandwich structure of the identification label.

[0026] The functional elements and / or the above-mentioned film elements can be arranged on the inside and / or outside of the welded seam and can also be welded to the sealing layer, if necessary. In this way, reliable mechanical, physical and / or chemical protection can be provided on the inside or in the area of ​​the RFID transponder. On the outside or opposite side of the welded seam of the RFID transponder, the functional elements and / or film elements can act as spacers and form a predefined height of the identification label. Alternatively or additionally, distance designations can also be implemented on the inside, for example by arranging paint dots around the RFID chip and printing them on the carrier layer. Furthermore, ferrite films can be provided as functional elements of the identification label and can contribute to an improved RFID function of the RFID transponder even on metal substrates.

[0027] The desired barrier properties and security functions can be produced by processing the identification label with a film and / or functional layer. Furthermore, the processing of rubber-coated and non-rubber-coated films for fixing and further processing of the identification label can also be included in the label structure. The functional element can be designed in the form of, for example, a void layer or can include such a layer. The void layer provides a void effect that provides protection against manipulation. For example, the void layer is realized with two or more different adhesive structures or release gradations. For example, a more adhesive structure in the form of a lettering is realized in the void structure, while other parts of the void structure are less adhesive. When an identification label having a voided structure or layer is applied to an object to be labeled, for example, upon peeling the identification label, the more adhesive lettering remains attached to the object while the less adhesive portion is peeled off along with the identification label or label portion that is peeled off from the object. Alternatively, the described structures can be designed inversely with respect to adhesion, e.g., structures in the form of lettering have less adhesive strength.

[0028] Alternatively or additionally, security features can be provided in the form of punched holes, which set a defined weakening structure of the label layer of the identification label. In this way, for example, tear locations can be provided, whereby the label is torn in a defined manner in the event of a tampering attempt. Alternatively or additionally, one or more layers of the identification label can also be provided with perforations, which allow the respective layers to be cut or separated in a defined manner.

[0029] According to a further development of the identification label, the sealing layer and / or the substrate are designed as transparent film elements. The transparent film allows the RFID transponder to be visualized in the enclosed label structure and allows optical inspection. Alternatively or additionally, colored and / or non-transparent film elements can also be provided to hide the RFID transponder and the internal structure of the identification label.

[0030] According to a further aspect of the invention, an identification system comprises an identification label as described above, which is attached to an object. In particular, the surface of the object can form the substrate of the identification label to which the sealing layer is materially connected by a welded seam. The surface of the object can be provided, for example, by the outer surface of a container made of a weldable, soluble and / or bondable material. Alternatively, an element such as a film or a label, which is placed on the surface of the object, can form a weldable substrate for the sealing layer.

[0031] Since the labeling system includes the described embodiments of the identification label, the described properties and characteristics of the identification label are also disclosed for the identification system and vice versa.

[0032] According to a further aspect of the invention, a method for producing an identification label comprises the steps of providing an RFID transponder having an RFID chip and an antenna structure signal-technically coupled to one another and providing a sealing layer. The method further comprises the steps of applying the RFID transponder and the sealing layer to a substrate, so that the RFID chip and / or the antenna structure are located between the sealing layer and the substrate. The application of the RFID transponder and the sealing layer can be performed simultaneously in one step or separately in time from one another. The method also comprises the step of forming a welded seam by welding of the sealing layer, so that the RFID chip and / or the antenna structure are surrounded by the welded seam and encapsulated between the sealing layer and the substrate.

[0033] The formation of the welded seam can be performed cost-effectively and quickly, in particular by ultrasonic welding. Torsional and / or longitudinal ultrasonic welding can be performed using a sonotrode and anvil as welding tools. The sonotrode is moved and vibrated, and the material of the sealing layer is melted in cooperation with the anvil as a rest. The anvil and the sonotrode are arranged on opposite sides of the layers to be welded. The anvil can be a separate tool or can be realized as an object itself, for example a syringe. In longitudinal ultrasonic welding, the sonotrode acts as a hammer or the like, striking the sealing layer and the substrate to be welded. In torsional ultrasonic welding, the sonotrode rubs along a predetermined path to form the welded seam. Alternatively or additionally, the welded seam can be formed by heat welding and / or sealing and / or laser welding. Sealing includes heat sealing and cold sealing.

[0034] According to a further development of the method, the welded seam is performed by a sonotrode and anvil which have complementary surfaces of curvature facing each other during operation, so that the welded seam is designed with a predetermined curvature relative to the stacking direction of the identification label, so that the identification label is formed with a predetermined curvature relative to its main extension plane. The shape or working surface of the sonotrode and the anvil are preferably selected to correspond to the contour of the object to which the identification label is to be attached.

[0035] The method can include the steps of performing a punching and / or cutting process and a process of forming the contour of the identification label. The identification labels are preferably formed in plurality on a continuous material web and processed into a label roll. The punching and / or cutting process can in particular be performed simultaneously with the deposition of the sealing layer in a common work step.

[0036] According to a further development, the method comprises the step of providing a substrate to be welded with said sealing layer (2, 4) in the form of a carrier layer of an RFID transponder and / or in the form of a bottom layer and / or in the form of a surface of an object to be labelled with an identification label. For example, a number of weld seams can also be formed in the described manner, such that a top layer is welded as a sealing layer to the carrier layer of the RFID transponder and to the bottom layer forming the substrate. In this way, a particularly reliable and secure encapsulation of the RFID transponder in the identification label can be achieved.

[0037] Since each method is specifically designed to produce the aforementioned identification label embodiments, the properties and characteristics of the identification label are also disclosed for the methods of production, and vice versa.

[0038] A large number of identification labels can be processed, in particular in a quasi-static, clocked roll-to-roll process with a front-end and a back-end process. Several sonotrodes can also be provided, for example clocked in a line, in order to carry out several welding processes simultaneously. In this way, the roll-to-roll process can be carried out by dynamic changes in the belt speed and by permanently introducing vibrations via the sonotrode. Alternatively, the roll-to-roll process can also be carried out continuously without dynamic changes, for example if the sonotrode and / or the anvil are designed as roller sonotrodes or roller anvils.

[0039] Processing can also take place in a part-picking process for fixed application to individual parts. The inlay or RFID transponder process can also be set up to form loose parts and place them in a container loose, for example to track an entire collection of parts on a pallet.

[0040] The processing frequencies can be in the range of 20 kHz to 100 kHz, in particular the welding process can be combined with the punching process in a single work step. The separation process can be carried out in a previous or subsequent stage by carrying out the cutting step using a laser, ultrasonic knife, cutting knife, roll knife and / or punching profiles or punching dies.

[0041] Furthermore, the positioning of the articles to be welded, i.e. the sealing layer relative to the RFID transponder and / or the sealing layer relative to the substrate, can be achieved by web-like feeding of the respective web material. It is also possible to set up individual applications at defined locations. In connection with ultrasonic welding, the RFID transponder and the sealing layer can be placed directly on the sonotrode by fixing the welded articles on the sonotrode and / or on the anvil via vacuum. Alternatively or additionally, the welded articles can be fixed locally or globally on the substrate by applying a rubber coating on the underside of the RFID transponder and / or the top layer and / or the bottom layer.

[0042] With the described manufacturing options, the RFID inlay film can be reliably protected against moisture penetration and the associated corrosion, for example by being material-bondedly welded to a top film or between two films. Alternatively, the RFID transponder with its carrier layer can be fixed directly to the component by welding. [Brief description of the drawings]

[0043] Hereinafter, an embodiment of the present invention will be described with reference to the schematic drawings. [Figure 1] 1-4 are side views showing various embodiments of an identification label. [Diagram 2] 1-4 are side views showing various embodiments of an identification label. [Diagram 3] 1-4 are side views showing various embodiments of an identification label. [Figure 4] 1-4 are side views showing various embodiments of an identification label. [Diagram 5] FIG. 5 shows an example of process steps for forming an identification label according to FIGS. [Figure 6] 6-7 show examples of identification labels in respective top views. [Figure 7]6-7 show examples of identification labels in respective top views. [Figure 8] 8-10 are top views illustrating various embodiments of welded seams for identification labels. [Figure 9] 8-10 are top views illustrating various embodiments of welded seams for identification labels. [Figure 10] 8-10 are top views illustrating various embodiments of welded seams for identification labels. [Figure 11] FIG. 11 is a flow chart of a method for manufacturing the identification labels according to FIGS. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0044] Elements or features of the same structure or function are labeled with the same reference numerals throughout the drawings. For clarity, not all elements or features shown in every figure are labeled with corresponding reference numerals.

[0045] 1 to 4 each show a schematic side view of various embodiments of an electronic identification label 1. The identification label 1 comprises an RFID transponder 3 with an RFID chip 5 and an antenna structure 6 which are signal-technically coupled to one another. Furthermore, the identification label 1 comprises a sealing layer, which is realized as a separate top layer 2 (see FIGS. 1, 2 and 5) or as a carrier layer 4 of the RFID transponder 3 (see FIGS. 3 and 4). The sealing layer covers the RFID transponder 3 and is material-bondedly connected to the substrate by welding, so that the RFID chip 5 and / or the antenna structure 6 are surrounded by a welded seam 7 and are enclosed between the sealing layer and the substrate. The substrate is realized as a separate bottom layer 8 (see FIGS. 1 and 4), as the surface 13 of the object 10 (see FIG. 3) or as the carrier layer 4 of the RFID transponder 3 (see FIGS. 2, 5 and 6).

[0046] By means of the identification label 1, a safe and reliable electronic label can be set on the object 10 in a simple and cost-effective manner. By means of the sealing welded seam 7, the identification label 1 is reliably protected against undesired external influences, for example in the form of moisture. The identification label 1 is designed, for example, as a sealed RFID label with welded edges 12 and can be used, in particular in the medical or pharmaceutical field, to identify syringes or containers that are processed by a sterilization process, such as an autoclave. The described structure of the identification label 1 reliably prevents the penetration of steam or liquids into the area of ​​the RFID transponder 3, so that the identification label 1 remains on the object 10 without impairing its function.

[0047] The identification label 1 shown in FIG. 1 has a bottom layer 8 as substrate, which forms a bottom cover layer or support for the RFID transponder 3 and / or the top layer 2. The top layer 2 in this embodiment realizes a sealing layer. At the label edge 12 of the identification label 1, the top layer 2 and the bottom layer 8 are materially connected by a welded seam 7, so that the RFID transponder 3 with the RFID chip 5, the antenna structure 6 and the carrier layer 4 according to FIG. 1 is welded into a kind of label pocket. Preferably, the RFID transponder 3 is bonded to the top layer 2 and / or the bottom layer 8 and fixed in position. Alternatively, the RFID transponder 3 with the carrier layer 4 can also be freely movable in the labeling pocket without being bonded to the top layer 2 and / or the bottom layer 8, so to speak, floating freely. Furthermore, the identification label 1 has an adhesive layer 9, which is arranged below or on the outside of the bottom layer 8, so that the identification label 1 can be applied simply and reliably to the object.

[0048] In this specification, terms such as "top", "bottom", "upper layer", "lower layer", "substrate" and the like refer to the alignment and orientation of the components of the identification label 1 as shown in the figures. Furthermore, the stacking direction R of the identification label 1 is shown and corresponds to a vertical line in the figures. When applied to an object, the stacking direction R generally corresponds to the normal of the object surface to which the identification label 1 is to be applied. Thus, the lower layer 8 faces the object and the sealing layers 2, 4 rest on top and face away from the object.

[0049] The welded seam 7 forms a material bond between the top layer 2 and the bottom layer 8 and forms a sealing surface within which the RFID transponder 3 is placed. The RFID transponder 3 forms a completely encapsulated or surrounded inlay.

[0050] Fig. 2 shows a further embodiment of the identification label 1, in which the carrier layer 4 of the RFID transponder 3 forms the weldable substrate of the top layer 2. The top layer 2 is welded to the inlay substrate of the RFID transponder 3 itself. This allows the identification label 1 to be realized particularly flat. Particularly advantageously, the top layer 2 and the bottom layer 4, as well as the bottom layer 8 according to Fig. 1, are designed as thin flexible film elements, and preferably they are made of the same material. In this way, a reliable welded connection can be formed and a flexible and particularly flat identification label can be designed.

[0051] Fig. 3 shows a further embodiment of the identification label 1, in which the substrate is provided by the surface 13 of the object 10 itself. The surface 13 provides a solid substrate that can be welded to the sealing layer 2, 4, for example as the outer surface of a plastic injection molding. For example, as shown in Fig. 3, the sealing layer is realized by a carrier layer 4 of an RFID transponder 3, which is attached by welding to a predetermined position on the circumference of a plastic syringe, thereby forming the identification label 1. Alternatively, the object 10 can realize a pharmaceutical package or label that is attached to an injection bottle or vial. In both cases, the surface 13 is set as a substrate so that it can be welded to the sealing layer 2, 4.

[0052] 4 shows a further embodiment of the identification label 1, in which it is shown that the sealing layers 2, 4 can also be connected to the substrate 4, 8, 13 by means of an adhesive layer 11. The adhesive layer 11 is preferably arranged on the inside of the welded seam 7 so as to be protected also from external chemical and / or physical influences. In particular, the adhesive layer 11 can be used to position the sealing layers 2, 4 before they are material-bondably connected to the substrate 4, 8, 13 by welding.

[0053] Alternatively or additionally, the adhesive layer 11 or a further adhesive layer can be arranged outside the area of ​​the welded seam 7 in order to adhere the sealing layer 2, 4 with its adhesive end area to the substrate 4, 8, 13 and subsequently form the welded seam 7 in the adhesive area (see also Fig. 7). The adhesive layer 11 is shown by way of example in Fig. 4 but can also be provided in other embodiments. In particular, the adhesive layer 11 can also be formed over the entire surface of the underside of the sealing layer 2, 4 and serves to fix the inlay.

[0054] Figure 5 is a schematic diagram illustrating how an identification label 1 can be formed by ultrasonic welding using a sonotrode 14 and anvil 15. In this context, reference is made in particular to the description of Figure 10 below.

[0055] FIG. 6 shows a schematic representation of an identification label 1. FIG. 6 shows that the antenna structure 6 is designed in the form of a conductive track and is connected to the RFID chip 5. For example, the antenna structure 6 is printed on the carrier layer 4 in the form of a copper, silver or aluminum track. The RFID chip 5 can also be applied to the carrier layer 4 by means of a printing process. Both the antenna structure 6 and the RFID chip 5 are surrounded by a welded seam 7, are laterally enclosed by this welded seam 7 and are protected in particular against the ingress of moisture. Alternatively, only the RFID chip 5 can be surrounded by the welded seam 7. Alternatively, further welded seams can also be formed, such that the identification label 1 has at least one welded seam 7. For example, the RFID chip 5 is surrounded by a welded seam 7 and, in addition, the antenna structure 6 can also be surrounded by a further welded seam 7. Correspondingly, a particularly reliable and safe barrier can be formed against the ingress of moisture in the area of ​​the antenna structure 6 and / or the RFID chip 5. The welded seam 7 can also be designed to be located on the antenna structure 6 or to cross the antenna structure 6 .

[0056] FIG. 7 is a top view showing a schematic representation of a further example of an identification label 1. The adhesive layer 11 has a large surface area and can have two separate adhesive sections spaced apart from each other. A non-adhesive area 16, which separates the two adhesive sections from each other, is located between the two adhesive sections of the adhesive layer 11. The adhesive layer 11 is therefore missing in the non-adhesive area 16. The non-adhesive area 16 provides a joining area for forming the welded seam 7. According to the embodiment shown in FIG. 7, the adhesive layer 11 is not continuous and is arranged in the inner area of ​​the RFID antenna structure 6 and in the outer edge area adjacent to the welded seam 7. The adhesive missing area 16 is adapted to the shape of the RFID antenna structure 6 and is essentially rectangular according to the embodiment shown in FIG. 7.

[0057] The welded seam 7 can also be formed in a predetermined two-dimensional structure, as shown in Figures 8 to 10. Figures 8 to 10 each show schematic diagrams of possible designs of the welded seam 7 extending substantially in the main extension plane of the identification label 1. The welded seam 7 can have a wavy or zigzag structure (see Figure 8), a sunray structure (see Figure 9) or a waffle structure (see Figure 10). In all cases, the welded seam 7 is purposely made wide in order to increase the inherent stiffness of the welded seam and contribute to the increased stiffness of the identification label 1 compared to narrow, straight welded seams. Such a welded seam configuration also helps to counteract undesired wrinkling of the identification label 1, allowing subsequent distortion-free application of the identification label 1 to or on an object. The welded seam 7 can be formed in sections, have several starting and ending points or can be closed in one continuous operation. The illustrated line sections of FIGS. 9 and 10 thus make it possible to realise respective weld seams which coherently form or at least contribute to the illustrated weld seam 7 in the form of a frame.

[0058] 11 is a flow chart of the process of producing the design of the identification label 1. The production can be carried out, for example, by ultrasonic welding according to the device shown in FIG.

[0059] In step S1, the components of an identification label 1 are provided. The RFID transponder 3 comprises an RFID chip 5, an antenna structure 6 and a carrier layer 4 on which the RFID chip 5 and the antenna structure 6 are arranged. Furthermore, a sealing layer is provided in the form of a top layer 2.

[0060] In a further step S2, the RFID transponder 3 and the top layer 2 are positioned relative to each other such that the RFID chip 5 and / or the antenna structure 6 are arranged between the top layer 2 and the carrier layer 4.

[0061] In a further step S3, the weld seam 7 is formed by ultrasonic welding. The sonotrode 14 and the anvil 15 are guided towards each other and are brought into contact such that the top layer 2 and the carrier layer 4 are pressed together and fused together. The sonotrode 14 can for example hammer the anvil 15 so that the top layer 2 and the backing layer 4 are joined by longitudinal ultrasonic welding. Alternatively or additionally, the sonotrode 14 rubs against the anvil 15 so that the top layer 2 and the carrier layer 4 are joined by torsional ultrasonic welding. By forming the weld seam 7, the RFID chip 5 and / or the antenna structure 6 are surrounded by the weld seam 7 and are encapsulated between the top layer 2 and the carrier layer 4 (see figures 2 and 4).

[0062] Alternatively or additionally, the welded seam 7 may be formed by heat welding and / or laser welding and / or sealing.

[0063] In step S4, a punching and / or cutting process can be carried out in order to form the outer contour of the identification label 1. Preferably, steps S3 and S4 can be carried out in a single work step, for example, welding of the top layer 2 with the carrier layer 4 can be carried out in combination with punching and / or laser cutting.

[0064] According to the device shown in Fig. 5, the welded seam 7 can also be formed with a predetermined three-dimensional contour in order to introduce a base radius into the identification label 1 to form it with a predetermined curvature. The sonotrode 14 and the anvil 15 have complementary curved surfaces at the working contact point and face each other during the working process. This means that the welded seam 7 can therefore be formed with a predetermined curvature relative to the stacking direction R and therefore the identification label 1 can be formed with a predetermined curvature relative to its main extension plane.

[0065] The shape or working surface of the sonotrode 14 and the anvil 15 are preferably selected to correspond to the contour of the object 10 to which the identification label 1 is to be applied, for example the circumferential shape of a syringe. In comparison with a flat label to be applied to a curved surface, the restoring forces biasing the identification label 1 into a flat position are reduced. This makes it particularly easy to apply the identification label 1 to the syringe and improves retention of the syringe.

[0066] The formation of the identification labels 1 can in particular be carried out continuously from one or more webs of material, so that large numbers of the identification labels 1 can be produced easily and cost-effectively.

[0067] The RFID inlay is enclosed inside the label and protected from moisture by material-bonding the top and bottom materials of the identification label 1. The top material or top layer 2 can be directly welded to the inlay substrate or to the carrier layer 4 of the RFID transponder 3. According to further embodiments, the top material can be welded to the bottom cover layer or bottom layer 8. In both cases, a completely sealed space is formed, which protects the RFID chip 5, the antenna structure 6 and possibly the gluing point 11 from moisture. Furthermore, it is also possible to only carry out a localized weld directly around the RFID chip 5 or around the antenna structure 6. In particular, the localized weld can be carried out along the label edge 12 in the shape of the label format. [Explanation of symbols]

[0068] 1 Identification label 2 Sealing layer / upper layer (Versiegelungsschicht / Oberschicht) 3 RFID Transponder 4 Sealing layer / Underlayer / Carrier layer for RFID transponders (Versiegelungsschicht / Untergrund / Traegerschicht des RFID-Transponders) 5 RFID chips in RFID transponders 6 Antenna structure of RFID transponders 7 Welded seam (Schweissnaht) 8 Substrate / Underlayer (Untergrund / Unterschicht) 9 Adhesive layer (Klebeschicht) 10 Object 11 Adhesive layer (Klebeschicht) 12 Label Edge (Etikettenrand) 13 Substrate / surface of object (Underground / Overface of objects) 14 Sonotrode 15 Amboss 16 Adhesion-free area / bonding zone R Stacking direction of identification labels (Stapelrichtung des Kennzeichnungsetiketts) S(i) Steps in the method for producing an identification label

Claims

1. 13. An identification label comprising: - an RFID transponder having an RFID chip and an antenna structure which are signal-technically coupled to one another; a sealing layer covering the RFID transponder and materially connected to the substrate by welding, so that the RFID chip and / or the antenna structure are surrounded by a welded seam and are encapsulated between the sealing layer and the substrate; An identification label comprising:

2. the RFID transponder comprises a carrier layer on which the RFID chip and the antenna structure are disposed; the carrier layer forms a sealing layer and is material-bondedly connected to the substrate by the welded seam; 2. The identification label according to claim 1.

3. the RFID transponder comprises a carrier layer on which the RFID chip and the antenna structure are disposed; the carrier layer forms a substrate, and the sealing layer is materially connected to the substrate by the welded seam.

2. The identification label according to claim 1.

4. a lower layer forming the substrate, the sealing layer being materially connected to the substrate by the welded seam; 2. The identification label according to claim 1.

5. the sealing layer is connected to the substrate by an adhesive layer, and thus the adhesive layer is at least partially surrounded by the welded seam within the welded seam and is encapsulated between the sealing layer and the substrate; 2. The identification label according to claim 1.

6. The welded seam is formed with a predetermined width within a range of 0.2 mm to 10 mm with respect to a main extending surface of the identification label.

2. The identification label according to claim 1.

7. The welded seam is formed in a predetermined structural path with respect to a main extension surface of the identification label, and has a wave structure, a zigzag structure and / or a waffle structure.

2. The identification label according to claim 1.

8. The welded seam is formed locally or circumferentially around the RFID chip and / or the antenna structure.

2. The identification label according to claim 1.

9. the sealing layer and / or the substrate are materially connected to one another by the welded seam, so that the identification label forms a predetermined curved identification medium.

2. The identification label according to claim 1.

10. a film element coupled to the RFID transponder, the sealing layer and / or the substrate and adapted to prevent moisture absorption into an encapsulated area having the RFID chip and / or the antenna structure; 2. The identification label according to claim 1.

11. - comprising a functional element bonded to the RFID transponder, to the sealing layer and / or to the substrate and adapted to provide mechanical protection for the RFID chip and / or the antenna structure, 2. The identification label according to claim 1.

12. The functional element comprises a nonwoven layer and / or a foam and / or a rubber element; The identification label according to claim 11.

13. The sealing layer and / or the substrate are formed as a transparent film element; 2. The identification label according to claim 1.

14. 1. An identification system comprising: - the object; - an identification label according to any one of claims 1 to 13, which is attached to the object; An identification system comprising:

15. a surface of the object forming the substrate; the sealing layer of the identification label is form-fittingly connected to the substrate by the welded seam; 15. The identification system of claim 14.

16. 1. A method for producing an identification label, comprising: providing an RFID transponder having an RFID chip and an antenna structure which are signal-technically coupled to one another; - providing a sealing layer; - applying the RFID transponder and the sealing layer to a substrate, so that the RFID chip and / or the antenna structure are located between the sealing layer and the substrate; - forming a welded seam by welding said sealing layer, Thus, the RFID chip and / or the antenna structure are surrounded by a welded seam and encapsulated between the sealing layer and the substrate; A method comprising:

17. The welded seam is formed by ultrasonic welding, heat welding and / or laser welding.

17. The method of claim 16.

18. the welding seam is performed by a sonotrode and anvil having complementary surfaces of curvature that face each other during operation, so that the welding seam is designed with a predetermined curvature relative to the stacking direction of the identification label, so that the identification label is formed with a predetermined curvature relative to its main extension plane, 18. The method according to claim 16 or 17.

19. performing a punching and / or cutting process and a process for forming the outline of the identification label. The welding of the sealing layer and the punching and / or cutting process are carried out in one work step.

18. The method according to claim 16 or 17.

20. providing a substrate in the form of a carrier layer of the RFID transponder and / or in the form of a bottom layer and / or in the form of a surface of an object to be labelled with an identification label, to be fused with the sealing layer, 18. The method of claim 16 or 17, comprising:

Images