Resin composition and prepreg, use

Abstract

The present invention relates to a resin composition, a prepreg, and its use. The resin composition contains, as components by weight, 50-150 parts of modified epoxy resin, 40-120 parts of modified benzoxazine resin, 20-100 parts of bismaleimide resin, 0.1-15 parts of initiator, and 150-550 parts of inorganic filler, the structural formula of the modified epoxy resin is formula (1-1), and the modified benzoxazine resin is a base benzoxazine resin whose terminal group is modified with a double bond. In the above resin composition, the polybutadiene-modified epoxy resin forms an interpenetrating polymer network with the bismaleimide resin, and finally, a resin composition having a low dielectric constant, low dielectric loss, and low linear expansion coefficient can be obtained. TIFF2025504305000018.tif53170

Description

[Technical field]

[0001] The present invention relates to the field of polymeric materials, in particular to resin compositions and prepregs, and uses. [Background technology]

[0002] With the continuous development of miniaturization, multi-function and continuous improvement of operating speed of electronic products, the continuous improvement of chip integration and the continuous progress of chip packaging technology are required, which puts higher requirements on the performance of substrate materials for mounting semiconductor elements, especially the performance of substrate materials, such as dielectric properties.

[0003] The addition of cyanate ester to the resin material of the conventional board reduces the dielectric properties, but causes a decrease in the resistance to moisture and heat and an increase in the linear expansion coefficient. If the difference in the thermal expansion coefficient between the semiconductor element and the board is too large, the board is prone to warping due to the difference in the thermal expansion coefficient under heat receiving conditions, which causes serious problems such as poor connections between the semiconductor element and the board and between the board and the printed circuit board. Summary of the Invention [Problem to be solved by the invention]

[0004] Based on this, a main object of the present invention is to provide a resin composition and a prepreg having a low dielectric constant, a low dielectric loss and a low coefficient of linear expansion, and a use thereof. [Means for solving the problem]

[0005] The present invention comprises, as components, in parts by weight: Modified epoxy resin 50 to 150 parts, 40 to 120 parts of modified benzoxazine resin, 20 to 100 parts of bismaleimide resin, 0.1 to 15 parts of an initiator, and Contains 150 to 550 parts of inorganic filler, The structural formula of the modified epoxy resin is formula (1-1): [ka] and M and N are both positive integers, and M+N=15 to 50; the number average molecular weight of the modified epoxy resin is 1,000 to 10,000; The modified benzoxazine resin is selected from a base benzoxazine resin whose terminal group is modified with a double bond.

[0006] In one embodiment, the bismaleimide resin is at least one selected from the group consisting of 4,4'-diphenylmethane bismaleimide, N-2,6-dimethylphenylmaleimide, N-(2,3-dimethylphenyl)maleimide, N-phenylmaleimide, 1,6-di(maleimide)hexane, N,N-(4-methyl-1,3-phenylene)bismaleimide, 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide, bisphenol A diphenyl ether bismaleimide, N'-m-phenylene bismaleimide, diphenylmethane maleimide, biphenyl bismaleimide resin, polyphenylmethane maleimide, and bis(3-ethyl-5-methyl-4-maleimidophenyl)methane.

[0007] In one embodiment, the base benzoxazine resin of the modified benzoxazine resin is at least one selected from the group consisting of BPA-type benzoxazine, BPF-type benzoxazine, ODA-type benzoxazine, and BPS-type benzoxazine.

[0008] In one embodiment, in the structural formula of the modified epoxy resin, M is 3-8, N is 5-15, and the number average molecular weight of the modified epoxy resin is 1,000-4,000.

[0009] In one embodiment, the initiator is at least one selected from the group consisting of bis(t-butylperoxy-m-isopropyl)benzene, dicumyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, di-t-butyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)-3-hexyne, benzoyl peroxide, chloranil, 2,4,6-tri-t-butylphenol, t-butylperoxyisopropyl monocarbonate, and azobisisobutyronitrile.

[0010] In one embodiment, the inorganic filler is at least one selected from the group consisting of silica, alumina, titanium oxide, mica, aluminum hydroxide, magnesium hydroxide, talc, aluminum borate, barium sulfate, and calcium carbonate.

[0011] In one embodiment, the resin composition further comprises 20-80 parts of a halogen-free flame retardant.

[0012] In one embodiment, the non-halogen flame retardant is at least one selected from the compounds represented by structural formulas (2-1) to (2-4). [ka]

[0013] The present invention further provides a prepreg comprising a substrate and a resin material supported on the substrate, the resin material being the above-mentioned resin composition.

[0014] Furthermore, the present invention further provides the use of the prepreg in the manufacture of a laminate, a copper clad laminate or a wiring board. Effect of the Invention

[0015] In the above resin composition, the polybutadiene-modified epoxy resin and the bismaleimide resin form an interpenetrating polymer network, and the polybutadiene-modified epoxy resin reacts with the bismaleimide resin through the initiator, and the polybutadiene-modified epoxy resin reacts with the double-bond-modified benzoxazine. Through the interaction between the three resins, the bismaleimide resin improves the problem of the polybutadiene-modified epoxy resin's insufficient heat resistance, rigidity and strength, the polybutadiene-modified epoxy resin improves the problem of the bismaleimide resin's insufficient dielectric properties, and the bismaleimide resin and the double-bond-modified benzoxazine form a bismaleimide-benzoxazine structure to improve the problem of the bismaleimide resin's large linear expansion coefficient, and finally obtain a resin composition with low dielectric constant, low dielectric loss and low linear expansion coefficient. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] The present invention may be embodied in many different forms and is not limited to the embodiments set forth herein. On the contrary, the purpose of providing these embodiments is to provide a more complete and thorough understanding of the present disclosure. Of course, these are merely illustrative and are not intended to limit the present invention. Furthermore, the present invention may repeatedly refer to numbers and / or letters in different examples. This repetition is for purposes of brevity and clarity and does not in itself indicate a relationship between the various embodiments and / or settings discussed.

[0017] Additionally, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying a relative importance or implying a number of the technical features indicated. Thus, a feature qualified as "first" or "second" may explicitly or implicitly include at least one of said features. In the present description, unless otherwise clearly and specifically limited, "plurality" means at least two, e.g., two, three, etc. In the present description, unless otherwise clearly and specifically limited, "several" means at least one, e.g., one, two, etc.

[0018] As used herein, the terms "preferably," "more preferably," and the like refer to embodiments of the invention that may provide certain advantages, under certain circumstances. However, other embodiments may be preferred, under the same or different circumstances. Furthermore, recitation of one or more preferred embodiments does not imply that other embodiments are not useful, and is not intended to exclude other embodiments from the scope of the invention.

[0019] When a numerical range is disclosed herein, the range is continuous and includes the minimum and maximum values ​​of the range, and each value between the minimum and maximum values. Also, when a range indicates an integer, each integer between the minimum and maximum values ​​of the range is included. In addition, when there are multiple ranges describing a feature or characteristic, they may be combined. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all subranges subsumed therein.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used herein are for the purpose of describing specific examples only and are not intended to be limiting of the invention. As used herein, the term "and / or" includes any and all combinations of one or more associated items.

[0021] The present invention comprises, as components, in parts by weight: Modified epoxy resin 50 to 150 parts, 40 to 120 parts of modified benzoxazine resin, 20 to 100 parts of bismaleimide resin, 0.1 to 15 parts of an initiator, and Contains 150 to 550 parts of inorganic filler, The structural formula of the modified epoxy resin is formula (1-1): [ka] wherein M and N are both positive integers, and M+N=15 to 50; and the number average molecular weight of the modified epoxy resin is 1,000 to 10,000. The modified benzoxazine resin provides a resin composition in which the base benzoxazine resin is modified at the end groups with double bonds.

[0022] In one specific example, in the structural formula of the modified epoxy resin, M is 3-8, N is 5-15, and the number average molecular weight of the modified epoxy resin is 1,000-4,000.

[0023] The number average molecular weight may be a value measured by a conventional molecular weight measurement method, and may be a value measured by gel permeation chromatography (GPC), but is not limited to these.

[0024] In one specific example, the bismaleimide resin is at least one selected from the group consisting of 4,4'-diphenylmethane bismaleimide, N-2,6-dimethylphenylmaleimide, N-(2,3-dimethylphenyl)maleimide, N-phenylmaleimide, 1,6-di(maleimide)hexane, N,N-(4-methyl-1,3-phenylene)bismaleimide, 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide, bisphenol A diphenyl ether bismaleimide, N'-m-phenylene bismaleimide, diphenylmethane maleimide, biphenyl bismaleimide resin, polyphenylmethane maleimide, and bis(3-ethyl-5-methyl-4-maleimidophenyl)methane.

[0025] Furthermore, the bismaleimide resin is at least one selected from the group consisting of biphenyl bismaleimide resin, polyphenylmethane maleimide, and bis(3-ethyl-5-methyl-4-maleimidephenyl)methane.

[0026] Specific examples of the bismaleimide resin include bismaleimide resins manufactured by Daiwakasei Corporation under the trade names BMI-70, BMI-80, BMI-1000, BMI-1000H, BMI-1100, BMI-1100H, BMI-2000, BMI-2300, BMI-3000, BMI-3000H, BMI-4000H, BMI-5000, BMI-5100, BMI-7000, and BMI-7000H.

[0027] Preferably, the bismaleimide resin is BMI-2300, the structural formula of which is: [ka] and the bismaleimide resin is BMI-5100, the structural formula of which is [ka] The bismaleimide resin is MIR-3000 manufactured by Nippon Kayaku Co., Ltd., and its structural formula is [ka] It is.

[0028] In one embodiment, the base benzoxazine resin of the modified benzoxazine resin is at least one selected from the group consisting of BPA-type benzoxazine, BPF-type benzoxazine, ODA-type benzoxazine, and BPS-type benzoxazine.

[0029] Preferably, the modified benzoxazine resin is an allyl-modified BPA-type benzoxazine resin, and its structural formula may be, but is not limited to, the following structural formula: [ka] or [ka]

[0030] In one embodiment, the initiator is at least one selected from the group consisting of bis(t-butylperoxy-m-isopropyl)benzene, dicumyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, di-t-butyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)-3-hexyne, benzoyl peroxide, chloranil, 2,4,6-tri-t-butylphenol, t-butylperoxyisopropyl monocarbonate, and azobisisobutyronitrile.

[0031] In one embodiment, the resin composition further comprises 20 to 80 parts of a non-halogen flame retardant.

[0032] In one specific example, the non-halogen flame retardant is at least one selected from the compounds represented by structural formulas (2-1) to (2-4). [ka]

[0033] Preferably, the halogen-free flame retardant has the structural formula (2-1).

[0034] In one specific example, the inorganic filler is at least one selected from the group consisting of silica, alumina, titanium oxide, mica, aluminum hydroxide, magnesium hydroxide, talc, aluminum borate, barium sulfate, and calcium carbonate.

[0035] The shape of the inorganic filler may be, but is not limited to, spherical, fibrous, plate-like, granular, flake-like or whisker-like.

[0036] In the above resin composition, the polybutadiene-modified epoxy resin and the bismaleimide resin form an interpenetrating polymer network, and the polybutadiene-modified epoxy resin reacts with the bismaleimide resin through the initiator, and the polybutadiene-modified epoxy resin reacts with the double-bond-modified benzoxazine. Through the interaction between the three resins, the bismaleimide resin improves the problem of the polybutadiene-modified epoxy resin's insufficient heat resistance, rigidity and strength, the polybutadiene-modified epoxy resin improves the problem of the bismaleimide resin's insufficient dielectric properties, and the bismaleimide resin and the double-bond-modified benzoxazine form a bismaleimide-benzoxazine structure to improve the problem of the bismaleimide resin's large linear expansion coefficient, and finally obtain a resin composition with low dielectric constant, low dielectric loss and low linear expansion coefficient.

[0037] Preferably, the resin composition comprises, in parts by weight, 80 to 120 parts of modified epoxy resin, 40 to 110 parts of modified benzoxazine resin, 30 to 70 parts of bismaleimide resin, 0.1 to 5 parts of initiator, Flame retardant 40-70 parts, and Contains 150 to 450 parts of inorganic filler.

[0038] The method for producing the resin composition includes the following steps S10 to S20.

[0039] In step S10, a bismaleimide resin and a solvent are mixed to prepare a premixture.

[0040] In the above step, the bismaleimide resin and the solvent may be heated to thoroughly mix them together. The heating temperature is 40°C to 80°C.

[0041] In step S20, the modified epoxy resin, the modified benzoxazine resin, the halogen-free flame retardant, the inorganic filler, the initiator and the solvent are added to the premix.

[0042] Furthermore, the solvent is at least one selected from the group consisting of methanol, ethanol, ethylene glycol monomethyl ether, acetone, butanone, methyl isobutyl ketone, cyclohexanone, toluene, xylene, 2-methoxyethyl acetate, 2-ethoxyethyl acetate, 2-ethoxyethyl acrylate, ethyl acetate, dimethylformamide, dimethylacetamide, and propylene glycol methyl ether.

[0043] Preferably, the solvent is acetone.

[0044] The present invention further provides a prepreg comprising a substrate and a resin material supported on the substrate, the resin material being the above-mentioned resin composition.

[0045] The resin composition is supported on a substrate and heated until semi-cured to obtain a prepreg material. The method for supporting the resin composition on the substrate may be at least one of the following methods: impregnation, roll pressing, molding, coating, bar coating, and spraying, but is not limited thereto.

[0046] The loading step may be repeated multiple times as necessary, and multiple types of thermosetting resin compositions with different compositions and solid contents may be repeatedly loaded to finally adjust the composition and resin content to the desired one.

[0047] The heating conditions are a heating temperature of 80° C. to 200° C. for 1 to 20 minutes, and a semi-cured prepreg material, that is, a prepreg, can be obtained.

[0048] The heating conditions are preferably a baking temperature of 110° C. to 190° C. and a heating time of 2 minutes to 10 minutes.

[0049] In one embodiment, the substrate is at least one selected from the group consisting of glass fiber, carbon fiber, silicon carbide fiber, rock wool fiber, nylon, polyethylene fiber, aramid fiber, polyimide fiber, polyester fiber, and cotton fiber.

[0050] The substrate is preferably a glass cloth, and the type of the glass cloth may be, but is not limited to, E, NE, D, S or T type, and a laminate having excellent mechanical strength can be obtained, and a glass cloth that has been flattened is particularly preferable. The flattening process is a process in which the glass cloth is continuously pressed by a press roll at an appropriate pressure to compress the yarns flat.

[0051] Furthermore, the present invention further provides the use of the prepreg in the manufacture of a laminate, a copper clad laminate or a wiring board.

[0052] The method for producing the laminated board includes a step of laminating at least one of the prepregs.

[0053] Furthermore, the process parameters for lamination are temperature 170℃~250℃, pressure 10kgf / cm 2 ~30kgf / cm 2 The mixture is subjected to hot press molding for 60 to 120 minutes under a vacuum condition of less than 2 kPa.

[0054] In particular, during lamination, a metal copper foil can be attached to one or both sides of a plurality of the prepregs, i.e., a laminate, and then laminated to obtain a metal copper foil-clad laminate.

[0055] The thickness of the metal copper foil is 3 μm to 70 μm.

[0056] The laminate has a low dielectric constant, a low dielectric loss and a low coefficient of linear expansion, and is widely used in semiconductor packages. EXAMPLES

[0057] The resin composition and the method for producing the same of the present invention will be described in more detail below with reference to specific examples. In the following specific examples, all raw materials are commercially available unless otherwise specified.

[0058] Regarding the modified epoxy resins, JP-100 is a butadiene-modified epoxy resin, Mn=1300, manufactured by Soda Corporation; JP-200 is a butadiene-modified epoxy resin, Mn=2200, manufactured by Soda Corporation; PB4700 is a butadiene-modified epoxy resin, Mn=3100, manufactured by Daicel Corporation; and 901 is a BPA-type epoxy resin, Mn=1100, manufactured by Kosho Electronics Co., Ltd.

[0059] For the modified benzoxazine resins, 5031 is an allyl benzoxazine manufactured by Kolon, CB6900 is a double bond modified benzoxazine manufactured by Kolon, and CB3170 is a BPA type benzoxazine manufactured by Kolon.

[0060] Regarding the bismaleimide resins, BMI-2300 is polyphenylmethane maleimide, manufactured by Nippon Daiwa Kasei Co., Ltd., BMI-5100 is bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, manufactured by Nippon Daiwa Kasei Co., Ltd., and MIR-3000 is biphenyl bismaleimide, manufactured by Nippon Kayaku Co., Ltd.

[0061] Regarding non-halogen flame retardants, GU304 is a double DPO type phosphorus-containing flame retardant, melting point 320℃, P%=12%, molecular formula is as follows, manufactured by Kayi Co., Ltd. [ka] PX-200 is resorcinol bis-dixylenyl phosphate, P%=9%, manufactured by Daihachi Co., Ltd.; SPB-100 is a phosphazene compound, P%=13%, manufactured by Otsuka Co., Ltd.; and SPV-100 is an allyl-modified phosphazene compound, P%=11%, manufactured by Otsuka Co., Ltd.

[0062] Regarding the inorganic filler, SC2300-SVJ is a double bond treated spherical silica manufactured by Admatechs.

[0063] Regarding the initiator, PERBUTYLP is 1,3-bis(butylperoxyisopropyl)benzene, manufactured by NOF Corporation.

[0064] The compositions of the resin compositions according to the examples and comparative examples are as follows.

[0065] [Table 1]

[0066] [Table 2]

[0067] The resin compositions according to the above examples and comparative examples were produced in the following manner.

[0068] First, the bismaleimide resin was mixed with acetone as a solvent, and the preliminary mixture was heated to 60°C and thoroughly stirred to thoroughly dissolve the bismaleimide resin in acetone, obtaining an acetone solution with a solid content of 40% by mass. Then, the modified epoxy resin and the modified benzoxazine resin were added to the above solution in the appropriate ratio, and thoroughly dissolved by stirring for 2 hours. Finally, a non-halogen flame retardant, an inorganic filler, an initiator, and an appropriate amount of acetone were further added, and thoroughly dispersed with a bead mill to obtain a resin composition.

[0069] The method for producing the prepregs carrying the resin compositions according to the above-mentioned Examples and Comparative Examples is as follows.

[0070] The resin compositions prepared in each of the Examples and Comparative Examples were impregnated into glass cloth (Kowa Co., Ltd. 2116 cloth) and dried by heating at 160° C. for about 3 minutes to obtain prepregs. At this time, by adjusting the solid content of the resin composition, a prepreg with a mass ratio of 50% can be obtained.

[0071] The method for producing a copper clad laminate is as follows.

[0072] Eight sheets of the prepreg corresponding to each of the obtained examples and comparative examples were stacked, 35 μm copper foil was placed on both sides, and the temperature was 220° C. and the pressure was 25 kgf / cm 2The resulting laminate was heated and pressed under these conditions for 2 hours to obtain a copper-clad laminate having a thickness of approximately 0.9 mm.

[0073] [Performance test] 1. Peel strength is tested using Tensilon, and the test method is in accordance with IPC-TM-650 2.4.8.

[0074] 2. Glass transition temperature (Tg) is measured by a dynamic mechanical analyzer (DMA) (DMA850 manufactured by TA Instruments) at a heating rate of 3°C / min. The test standard for glass transition temperature is the detection method of IPC-TM-650 2.4.25C and 24C of the Institute for Interconnecting and Packaging Electronic Circuits (IPC).

[0075] 3. Measurement of dielectric constant and dielectric loss: Agilent E5071C network analyzer is used to measure the dielectric constant (Dk) and dissipation factor (Df) at an operating frequency of 10 megahertz (GHz) according to IPC-TM-650 2.5.5.13 standard.

[0076] 4.For the 288℃ soldering heat resistance test, the test piece is boiled in a PCT pressure cooker for 2 hours and then immersed in a 288℃ soldering furnace for 6 minutes, and it is recorded whether the test piece explodes or not.

[0077] 5. Thermal expansion coefficient test and the expansion coefficient in the X / Y / Z axis directions are measured using a thermal expansion analyzer of TA Instrument's type TA Q800, the measurement temperature is 50℃~260℃, the heating rate is 10℃ / min, and the thermal expansion coefficient and expansion coefficient in each direction (X / Y / Z axis directions) of the test sample are measured.

[0078] 6. Regarding the flame retardancy test, refer to the UL-94 standard, and use a Bunsen burner, methane gas and a stopwatch to measure the automatic extinguishing time after the sample is burned, and judge the flame retardancy level based on that time.

[0079] 7. Elastic modulus is measured using Tensilon in accordance with GB / T 22315-2008 standard.

[0080] The performance of the copper-clad laminates according to the above examples and comparative examples is as follows.

[0081] [Table 3]

[0082] [Table 4]

[0083] As can be seen from the performance of the copper-clad laminates according to the above examples and comparative examples, when the resin composition in Example 6 is used, a cured product can be obtained which is halogen-free and has a high glass transition temperature, a high flexural modulus, excellent dielectric properties, and a low XY linear expansion coefficient, and the resin composition contains a polybutadiene-modified epoxy resin, a double bond-modified benzoxazine resin, a bismaleimide resin, and a double DPO type phosphorus-containing flame retardant.

[0084] In Comparative Example 1, Comparative Example 2, and Comparative Example 3, the phosphorus-containing flame retardant in the resin composition can react with the resin, so that the Tg of the cured product is lowered and the electrical properties are deteriorated. In Comparative Example 4, the addition ratio of the double DPO type phosphorus-containing flame retardant in the resin composition is insufficient, so that the flame retardant performance of the cured product meets only the 94UL-V1 level. In Example 5, the ratio of the filler in the resin composition is insufficient, so that the elastic modulus of the cured product is low. In Examples 6, 7, and 8, the XY linear expansion coefficient of BMI-2300 is the smallest among the bismaleimide resins in the resin composition. The copper-clad laminate produced by the resin composition of Example 6 has a Tg of 265°C, a Peel of 7.5 lb / in, a Df of 0.0070 at 10 GHz, an elastic modulus of 30 GPa, and an XY linear expansion coefficient of 9.5 ppm / °C.

[0085] The technical features of the above-mentioned embodiments can be combined in any combination. For the sake of brevity, all possible combinations of the technical features of the above-mentioned embodiments are not described, but all such combinations should be considered to be within the scope of the present specification.

[0086] The above examples only describe some embodiments of the present invention, and facilitate a specific and detailed understanding of the technical means of the present invention, but should not be construed as limiting the scope of the claims of the present invention. In addition, those skilled in the art can make various modifications and improvements to the present invention without departing from the spirit of the present invention, and these modifications and improvements also belong to the scope of the present invention. It should be understood that any technical means obtained by a person skilled in the art through logical analysis, reasoning, or limited experiments based on the technical means provided by the present invention are within the scope of the claims attached to the present invention. Therefore, the scope of protection of the patent of the present invention depends on the content of the attached claims, and the specification is intended to explain the content of the claims.

Claims

1. In parts by weight, 50 to 150 parts of modified epoxy resin, 40 to 120 parts of modified benzoxazine resin, 20 to 100 parts of bismaleimide resin, 0.1 to 15 parts of an initiator, and Contains 150 to 550 parts of inorganic filler; The structural formula of the modified epoxy resin is formula (1-1): 【Chemistry 1】 and M and N are both positive integers, and M+N=15 to 50; the number average molecular weight of the modified epoxy resin is 1,000 to 10,000; A resin composition, characterized in that the modified benzoxazine resin is selected from base benzoxazine resins whose terminal groups are modified with double bonds.

2. The bismaleimide resin is at least one selected from the group consisting of 4,4'-diphenylmethane bismaleimide, N-2,6-dimethylphenylmaleimide, N-(2,3-dimethylphenyl)maleimide, N-phenylmaleimide, 1,6-di(maleimide)hexane, N,N-(4-methyl-1,3-phenylene)bismaleimide, 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide, bisphenol A diphenyl ether bismaleimide, N'-m-phenylene bismaleimide, diphenylmethane maleimide, biphenyl bismaleimide resin, polyphenylmethane maleimide and bis(3-ethyl-5-methyl-4-maleimidephenyl)methane, characterized in that the resin composition according to claim 1.

3. The resin composition according to claim 1, wherein the base benzoxazine resin of the modified benzoxazine resin is at least one selected from the group consisting of BPA-type benzoxazine, BPF-type benzoxazine, ODA-type benzoxazine, and BPS-type benzoxazine.

4. The resin composition according to claim 1, characterized in that, in the structural formula of the modified epoxy resin, M is 3 to 8, N is 5 to 15, and the number average molecular weight of the modified epoxy resin is 1000 to 4000.

5. The resin composition according to claim 1, characterized in that the initiator is at least one selected from the group consisting of bis(t-butylperoxy-m-isopropyl)benzene, dicumyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, di-t-butyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)-3-hexyne, benzoyl peroxide, chloranil, 2,4,6-tri-t-butylphenol, t-butylperoxyisopropyl monocarbonate, and azobisisobutyronitrile.

6. 2. The resin composition according to claim 1, wherein the inorganic filler is at least one selected from the group consisting of silica, alumina, titanium oxide, mica, aluminum hydroxide, magnesium hydroxide, talc, aluminum borate, barium sulfate, and calcium carbonate.

7. The resin composition according to any one of claims 1 to 6, further comprising 20 to 80 parts of a non-halogen flame retardant.

8. The resin composition according to claim 7, wherein the non-halogen flame retardant is at least one selected from the compounds represented by structural formulas (2-1) to (2-4). 【Chemistry 2】

9. A prepreg comprising a substrate and a resin material supported on the substrate, the resin material being the resin composition according to any one of claims 1 to 8.

10. 10. Use of the prepreg according to claim 9 in the manufacture of a laminate, a copper clad laminate or a wiring board.

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