Antenna Device

Abstract

It offers the advantage of being able to improve or maintain XPD and isolation characteristics while maintaining heat dissipation performance. [Solution] The antenna device includes a front heat dissipation housing in which two or more antenna arrangement sections, each having at least one radiating element disposed on the front side, are continuously arranged in the horizontal direction, and a rear heat dissipation housing to which the front heat dissipation housing is coupled at a front end and which is provided with a plurality of rear heat dissipation fins for dissipating a predetermined amount of heat rearward. The front heat dissipation housing is integrally provided with a plurality of front heat dissipation fins for dissipating a predetermined amount of heat forward, and a part of the plurality of front heat dissipation fins is provided in the form of at least one partition wall for partitioning the two or more antenna arrangement sections in the H-direction.

Description

[Technical field]

[0001] The present invention relates to an antenna apparatus, and more particularly to an antenna apparatus that can improve heat dissipation performance and reduce manufacturing costs by removing the radome of a conventional antenna apparatus and arranging a radiating element in a front housing of the antenna apparatus, thereby enabling slimming and reducing the manufacturing costs of the product. [Background technology]

[0002] 2. Description of the Related Art Base station antennas, including repeaters, used in mobile communication systems have a variety of shapes and structures, but typically have a structure in which multiple radiating elements are appropriately arranged on at least one reflector plate that stands upright in the longitudinal direction.

[0003] Recently, there has been active research into achieving compact, lightweight, and low-cost structures while satisfying the high performance requirements for MIMO-based antennas. In particular, in the case of antenna devices that use patch-type radiating elements to achieve linear or circular polarization, a method is widely used in which a radiating element made of a dielectric substrate made of plastic or ceramic material is plated and soldered to a PCB (printed circuit board) or the like.

[0004] FIG. 1 is an exploded perspective view showing an example of an antenna device according to the prior art.

[0005] As shown in FIG. 1, in an antenna device 1 according to the prior art, a plurality of radiating elements 35 are arranged so as to be exposed on the front side of the antenna housing main body 10, which is the beam output direction, so that the radiating elements 35 are output in a desired direction to facilitate beamforming, and a radome (50) is attached to the front end of the antenna housing main body 10, sandwiching the plurality of radiating elements 35, to protect them from the external environment.

[0006] More specifically, the antenna device 1 is in the shape of a thin rectangular box with an open front and includes an antenna housing main body 10 having a plurality of heat dissipation fins 11 integrally formed on the rear surface thereof, a main board 20 stacked on the rear surface inside the antenna housing main body 10, and an antenna board 30 stacked on the front surface inside the antenna housing main body 10.

[0007] The main board 20 is mounted with a plurality of power supply related component elements for calibration power supply control, and heat generated from the elements during the power supply process is dissipated rearward through a plurality of heat dissipation fins 11 at the rear of the antenna housing body 10.

[0008] A PSU board 40 having a PSU (Power Supply Unit) element mounted thereon is stacked or disposed at the same height below the main board 20 or below the antenna housing body 10, and heat generated from the PSU element is also radiated backward through the plurality of heat dissipation fins 11 integrally provided at the rear of the antenna housing body 10, or PSU heat dissipation fins 16 of a PSU housing 15 formed separately from the antenna housing body 10 and attached to the rear of the antenna housing body 10. A plurality of RF filters 25 of a cavity filter type are disposed on the front of the main board 20, and the rear of the antenna board 30 is disposed so as to be stacked on the front of the plurality of RF filters 25.

[0009] A patch-type radiating element or a dipole-type radiating element 35 is mounted on the front surface of the antenna board 30, and a radome 50 may be provided on the front surface of the antenna housing main body 10 to protect the internal components from the outside while facilitating smooth radiation from the radiating element 35.

[0010] However, in one example of an antenna device 1 according to the prior art, the front part of the antenna housing main body 10 is shielded by the radome 50, and the heat dissipation area is limited to the area of ​​the radome 50. The radiating element 35 is also designed only to transmit and receive RF signals, and the heat generated from the radiating element 35 cannot be dissipated forward. As a result, the heat generated inside the antenna housing main body 10 has to be uniformly discharged to the rear of the antenna housing main body 10, resulting in a significant reduction in heat dissipation efficiency. There is a growing demand for a new heat dissipation structure design to solve these problems.

[0011] In addition, according to an example of an antenna device 1 according to the prior art, there is a problem that it is extremely difficult to realize a base station of a slim size required for in-building or 5G shadow areas due to the volume of the radome 50 and the volume occupied by the arrangement structure in which the radiating element 35 is spaced apart from the front surface of the antenna board 30. Summary of the Invention [Problem to be solved by the invention]

[0012] The present invention has been made to solve the above-mentioned technical problems, and aims to provide an antenna device in which the radome is eliminated and the radiating element is disposed in the front housing of the antenna device, thereby using the front and rear housings of the antenna device entirely for front-rear heat dissipation, thereby greatly improving heat dissipation performance.

[0013] Another object of the present invention is to provide an antenna device that can efficiently transfer heat inside the antenna housing to the front of the antenna device by using a filter as a heat transfer medium.

[0014] In addition, another object of the present invention is to provide an antenna device that can easily realize a base station of a slim size required for in-building installation or 5G shadow areas, by eliminating the radome and reducing the front and rear volume occupied by a conventional radome.

[0015] The technical problems of the present invention are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0016] According to one embodiment of the present invention, an antenna device includes a front heat dissipation housing in which two or more antenna arrangement sections, each having at least one radiating element disposed on a front side thereof, are arranged in succession in a horizontal direction (H-direction), and a rear heat dissipation housing to which the front heat dissipation housing is coupled at a front end and which is provided with a plurality of rear heat dissipation fins for dissipating a predetermined amount of heat rearward, wherein the front heat dissipation housing is integrally provided with a plurality of front heat dissipation fins for dissipating a predetermined amount of heat forward, and a portion of the plurality of front heat dissipation fins are provided in the form of at least one partition wall that partitions the two or more antenna arrangement sections in the H-direction.

[0017] Here, a front end of the at least one partition wall may protrude from a front surface of the front heat dissipation housing to be flush with a front surface of the radiating element.

[0018] Furthermore, a front end of the at least one partition wall may be provided so as to protrude forward from the front surface of the front heat dissipation housing beyond the front surface of the radiating element.

[0019] In addition, the at least one radiating element may be provided in the form of a radiation director made of a conductive metal material on an antenna patch circuit portion printed on a radiating element printed circuit board disposed in the antenna placement portion and electrically connected to the antenna patch circuit portion, and a front end of the at least one partition wall may be provided to protrude at least further than a front surface of the radiation director.

[0020] Further, a plurality of window grooves may be cut and formed in the partition wall so as to open in the H-direction.

[0021] The window grooves may also be formed adjacent to left and right ends of each of the radiating elements.

[0022] Also, the cut depths of the window grooves may be designed to be different in consideration of isolation performance measurements between adjacent radiating elements in the H-direction.

[0023] An antenna device according to another embodiment of the present invention includes a front heat dissipation housing in which at least two or more antenna modules are arranged consecutively in a horizontal direction (H-direction), and the front heat dissipation housing is integrally provided with a plurality of front heat dissipation fins that dissipate a predetermined amount of heat forward, and a portion of the plurality of front heat dissipation fins are provided in the form of at least one partition wall that partitions each of the two or more antenna modules in the H-direction.

[0024] Here, the antenna module may include an antenna patch circuit portion printed and formed on a radiating element printed circuit board disposed in the antenna placement portion, an antenna module cover disposed to cover a front surface of the antenna patch circuit portion, and a radiation director disposed in front of the antenna module cover, made of a conductive metal material, and electrically connected to the antenna patch circuit portion, and the at least one partition wall may be integrally formed with the front heat dissipation housing to partition between the radiating element printed circuit boards of two or more antenna module configurations disposed adjacent to each other in the H-direction.

[0025] Further, the partition wall may be formed with a plurality of window grooves opening in the H-direction.

[0026] The window grooves may be formed in adjacent left and right ends of the radiation director. Effect of the Invention

[0027] According to an embodiment of the antenna device according to the present invention, the following various effects can be achieved.

[0028] First, the radome, which is an obstruction to forward heat dissipation of the antenna, is removed, and the radiating element is arranged so as to be exposed to the outside air in the front heat dissipation housing of the antenna device, thereby enabling heat dissipation in both the front and rear directions of the antenna device, thereby greatly improving heat dissipation performance.

[0029] Second, since it is possible to eliminate the radome that was an essential component of the conventional antenna device, there is an effect of greatly reducing the manufacturing cost of the product.

[0030] Third, since the area of ​​the heat sink cover increases due to the removal of the radome, the system heat inside the antenna housing body can be dissipated forward, thereby improving the heat dissipation performance.

[0031] Fourth, since heat can be dissipated all over the front, the length of the heat dissipation fins of the rear heat dissipation housing can be reduced, which facilitates a slim design of the product as a whole.

[0032] Fifth, heat dissipation through the radiation director that performs the function of radiating electromagnetic waves in the antenna module is also possible, which has the effect of maximizing the heat dissipation area of ​​the front heat dissipation housing.

[0033] Sixth, at least a portion of the front heat dissipation fins integrally formed on the front surface of the front heat dissipation housing are arranged to partition the radiating elements or antenna arrangement portion arranged continuously in the H-direction, or to partition the antenna module, thereby providing an effect of greatly improving heat dissipation performance while minimizing degradation of isolation performance.

[0034] The effects of the present invention are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims. [Brief description of the drawings]

[0035] [Figure 1] FIG. 1 is an exploded perspective view showing an example of an antenna device according to a conventional technique. [Diagram 2] 1 is a perspective view of a front portion of an antenna device according to an embodiment of the present invention; [Figure 3A] FIG. 2 is a front view of an antenna device according to an embodiment of the present invention. [Figure 3B] FIG. 2 is a rear view of the antenna device according to the embodiment of the present invention. [Figure 4] 3 is an exploded perspective view showing the internal space of the antenna device shown in FIG. 2. [Diagram 5] 3B is a cross-sectional view taken along line AA in FIG. 3A and a partially enlarged view thereof. [Figure 6A] 3 is an exploded front perspective view showing a main board and a filter stacked in the internal space of a rear heat dissipation housing in the configuration of FIG. 2. [Figure 6B] 3 is an exploded rear perspective view showing a main board and a filter stacked in the internal space of a rear heat dissipation housing in the configuration of FIG. 2. [Figure 7] 3 is an exploded perspective view showing a direct rear heat dissipation structure via a rear heat dissipation housing in the configuration of FIG. 2. FIG. [Figure 8A] 3 is an exploded front perspective view showing the installation of a subboard and a shielding panel on a main board in the configuration of FIG. 2. [Figure 8B] 3 is an exploded rear perspective view showing the state in which a cover sub-board and a shielding panel are installed on a main board in the configuration of FIG. 2. [Figure 9] 3 is an exploded perspective view illustrating an electrical connection of a PSU unit to a main board in the configuration of FIG. 2. FIG. [Figure 10] 3 is an exploded perspective view for explaining a state in which a filter is coupled to a main board in the configuration of FIG. 2. FIG. [Figure 11] 3 is a partially cutaway perspective view for explaining how heat generated from a filter in the configuration of FIG. 2 is dissipated through a rear heat dissipation housing. FIG. [Figure 12A]3 is an exploded front perspective view showing an assembly process of internal components to a rear heat dissipation housing in the configuration of FIG. 2. [Figure 12B] 3 is an exploded rear perspective view showing a process of assembling internal components to a rear heat dissipation housing in the configuration of FIG. 2. [Figure 13] 3 is an exploded perspective view illustrating a process of assembling an outer member to a rear heat dissipation housing in the configuration of FIG. 2. FIG. [Figure 14] 3 is an exploded front perspective view illustrating the state in which the antenna module is installed in the front heat dissipation housing in the configuration of FIG. 2. FIG. [Figure 15] 15 is an exploded perspective view of the front and rear sides showing the state in which the antenna module is installed on the front surface of the front heat dissipation housing in the configuration of FIG. 14. [Figure 16] 15 is a perspective view showing an antenna module in the configuration of FIG. 14. [Figure 17A] FIG. 15 is an exploded front perspective view of FIG. [Figure 17B] FIG. 15 is an exploded perspective view of the rear side of FIG. [Figure 18] 15 is a front view, a cross-sectional view along line BB, and a cutaway perspective view of the antenna module in the configuration of FIG. 14. [Figure 19] FIG. 11 is a perspective view showing another embodiment of the antenna module. [Figure 20] FIG. 20 is a perspective view showing a modified example of FIG. 19. [Figure 21] 21 is a three-view diagram (front view, side view, and plan view) of FIG. 20. [Figure 22] 21 is a graph for comparing the isolation values ​​of the antenna modules of FIG. 19 and FIG. 20. [Diagram 23] 21 is a graph for comparing the XPD values ​​of the antenna modules of FIG. 19 and FIG. 20. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0036] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an antenna device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0037] In assigning reference symbols to components in each drawing, it should be noted that the same components are assigned the same symbols as much as possible even if they are displayed in different drawings. In addition, in describing the embodiments of the present invention, if it is determined that a detailed description of such known configurations or functions would hinder understanding of the embodiments of the present invention, the detailed description will be omitted.

[0038] In describing components of the embodiments of the present invention, terms such as 1, 2, A, B, (a), (b) and the like may be used. Such terms are merely used to distinguish the components from other components, and do not limit the essence, order, or procedure of the components. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention belongs. Terms as defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense unless expressly defined in this application.

[0039] FIG. 2 is a perspective view of the front portion of an antenna device according to one embodiment of the present invention, FIG. 3A and FIG. 3B are front and rear views of an antenna device according to one embodiment of the present invention, FIG. 4 is an exploded perspective view showing the internal space of the antenna device shown in FIG. 2, and FIG. 5 is a cross-sectional view along line AA in FIG. 3A and a partially enlarged view thereof.

[0040] As shown in FIG. 2, an antenna device 1 according to an embodiment of the present invention includes a front heat dissipation housing 100 that forms the front exterior of the antenna device 1, and a rear heat dissipation housing 200 that forms the rear exterior of the antenna device 1.

[0041] Here, the front heat dissipation housing 100 includes an antenna arrangement section (see reference numeral "170" in FIG. 14 described later) in which at least one radiating element 116, 117 is arranged on the front side, and a heat dissipation section 105 exposed to the outside air to transfer heat generated at the rear to the front.

[0042] In particular, at least one of the antenna placement sections 170 may be integrally formed on the front surface of the front heat dissipation housing 100 and spaced apart from each other in the H-direction (horizontal direction) and V-direction (vertical direction), and the heat dissipation section 105 may be formed over the entire area of ​​the front surface of the front heat dissipation housing 100 to fill the gap between adjacent antenna placement sections 170.

[0043] 2 to 5, the front heat dissipation housing 100 is made of a metal material with excellent thermal conductivity so that heat generated between it and the rear heat dissipation housing 200 described below can be dissipated directly forward. As described above, the front surface of the front heat dissipation housing 100 can be roughly divided into an antenna placement section 170 and a heat dissipation section 105 in appearance.

[0044] Here, the remaining area excluding the antenna placement section 170 mainly functions as a heat dissipation section 105, which is formed integrally with the front heat dissipation housing 100 in the form of a plurality of heat dissipation fins and has a predetermined pattern shape, and heat generated in the internal space between the front heat dissipation housing 100 and the rear heat dissipation housing 200 can be quickly dissipated forward through the heat dissipation section 105 formed in the form of a plurality of heat dissipation fins.

[0045] In other words, one embodiment of the antenna device 1 according to the present invention improves upon the conventional structure that was equipped with a radome, which limited heat dissipation in the forward direction of the antenna device 1, and proposes a new heat dissipation structure that dissipates heat in all directions of the antenna device 1.

[0046] More specifically, one embodiment of the antenna device 1 according to the present invention can convert only the area occupied by the existing radome into a heat dissipation area by introducing a front heat dissipation housing 100.

[0047] The front heat dissipation housing 100 converts the entire area of ​​the heat dissipation part 105, excluding at least an area occupied by the antenna module 110 described below, into a usable area capable of dissipating heat. In addition, by providing the radiation director 117 of the antenna module 110 with a metal material capable of thermal conduction, a larger usable area for dissipating heat can be secured.

[0048] As shown in FIG. 3A, the front heat dissipation housing 100 is shaped to cover the front end of a rectangular parallelepiped box of the rear heat dissipation housing 200 (described later), and may be formed as a substantially rectangular plate.

[0049] An antenna placement part 170 to which a plurality of antenna modules 110 (to be described later) are coupled may be formed flat on the front surface of the front heat dissipation housing 100 .

[0050] The multiple antenna arrangement portions 170 are formed to match the external shape of the multiple antenna modules 110. Since the multiple antenna modules 110 are each provided as a rectangular plate formed long in the vertical direction and each antenna module 110 is arranged in a row at a predetermined distance apart in the H-direction and the V-direction, the multiple antenna arrangement portions 170 may also be arranged on the front surface of the forward heat dissipation housing 100 in the same shape.

[0051] Here, the lower side of the internal space of the rear heat dissipation housing 200 described later does not need to have multiple antenna arrangement sections 170 formed therein, so that heat generated from multiple PSU elements 417 of the PSU unit 400 described later can be easily dissipated directly forward via the heat dissipation section 105 described above.

[0052] The heat dissipation part 105 may be formed in the form of a plurality of heat dissipation fins in the remaining area of ​​the front surface of the front heat dissipation housing 100 that is not occupied by the plurality of antenna arrangement parts 170. The heat dissipation part 105 may have a shape that is good for increasing the heat dissipation area through the front heat dissipation housing 100, which is different from the shape design of the plurality of rear heat dissipation fins 201 formed integrally with the rear heat dissipation housing 200 described later, which is considered for dispersion or rapid discharge of the rising air current of the radiated rear heat. That is, the heat dissipation part 105 does not necessarily have to have a shape for dispersion or rapid discharge of the rising air current of the radiated front heat (however, it goes without saying that such a shape increases the heat dissipation performance), and any shape may be adopted as long as it increases the surface area of ​​the front heat dissipation housing 100.

[0053] Meanwhile, the rear heat dissipation housing 200 is combined with the front heat dissipation housing 100 to form the rear exterior of the overall antenna device 1, and the internal space 200S of the rear heat dissipation housing 200 is provided with a plurality of filters 350 for filtering RF signals and a main board 310 on which a plurality of associated RF elements (not shown in the drawing) are mounted.

[0054] The rear heat dissipation housing 200 is made of a metal material with excellent thermal conductivity so that heat dissipation by thermal conduction is favored overall, and is formed in a rectangular box shape with a thin thickness in the front-to-rear direction and is formed so that the front is open, and an internal space 200S can be formed inside in which multiple RF filters 350 and a main board 310 on which various RF elements and an FPGA (Field Programmable Gate Array, 317a) are mounted, etc. are provided.

[0055] Referring to FIG. 3B, a plurality of rear heat dissipation fins 201 are integrally formed with the rear heat dissipation housing 200 on the rear surface of the rear heat dissipation housing 200 to have a predetermined pattern shape, and heat generated on the rear side of the internal space 200S of the rear heat dissipation housing 200, centered on the main board 310, can be directly dissipated to the rear through the plurality of rear heat dissipation fins 201.

[0056] The multiple rear heat dissipation fins 201 are arranged with an upward inclination toward the left and right ends based on the midpoint of the left and right width (see reference numerals 201a and 201b in FIG. 3B ) so that the heat dissipated toward the rear of the rear heat dissipation housing 200 forms an ascending air current that disperses toward the left and right directions of the rear heat dissipation housing 200, respectively, thereby dissipating the heat more quickly, but the shape of the heat dissipation fins 201 is not limited thereto.

[0057] For example, although not shown, when a blower fan module (not shown) is provided on the rear side of the rear heat dissipation housing 200, it is preferable that the rear heat dissipation fins be formed parallel to the left and right ends, respectively, of the intermediately disposed blower fan module so that the heat dissipated by the blower fan module can be discharged more quickly.

[0058] Although not shown, a bracket mounting portion 205 to which a clamping device (not shown) for connecting the antenna device 1 to a support pole (not shown) is connected may be integrally formed on some of the rear heat dissipation fins 201. Here, the clamping device may be configured to rotate the antenna device 1 according to one embodiment of the present invention installed at its tip in the left-right direction or tilt it in the up-down direction to adjust the directionality of the antenna device 1.

[0059] Meanwhile, heat generated around the filters 350 in the space between the rear surface of the front heat dissipation housing 100 and the rear heat dissipation housing 200 is transferred to the front surface of the front heat dissipation housing 100 by contacting the rear surface of the front heat dissipation housing 100 with the front heat dissipation housing 100 as a heat transfer medium or by using the filters 350 as a heat transfer medium. In addition, a portion of the heat generated inside the filters 350 can be directly dissipated backward through the rear heat dissipation housing 200. This will be described in more detail later.

[0060] A shielding pad 330, which will be described later, may be provided in a clamshell shape on the front surface of the main board 310 stacked in the internal space 200S of the rear heat dissipation housing 200 to perform a function of blocking and interfering with external electromagnetic waves, such as a plurality of RF filters 350, and may be mounted and arranged at a predetermined position. This will be described in more detail later.

[0061] In the antenna device 1 according to one embodiment of the present invention, a total of eight RF filters 350 are arranged adjacent to each other in the left-right direction, and a total of four rows of such RF filters 350 are arranged in the up-down direction. However, this is not necessarily limited to this, and it goes without saying that the arrangement positions and the number of RF filters 350 can be variously designed depending on the required capacity of the transmission channel.

[0062] Although not shown, the multiple RF filters 350 may be arranged as cavity filters that have multiple cavities therein and filter the frequency band of the output signal relative to the input signal by adjusting the frequency using the resonator of each cavity. However, the RF filter 350 is not necessarily limited to a cavity filter, and a ceramic waveguide filter is not necessarily excluded.

[0063] The RF filter 350 is advantageous in designing the entire product to be slimmer if its thickness in the front-rear direction is small. In terms of designing the product to be slimmer, the RF filter 350 may be a ceramic waveguide filter, which is advantageous in designing a compact size, rather than a cavity filter, which is limited in designing the thickness in the front-rear direction. However, in order to satisfy the high output performance of the base station antenna required in the 5G frequency environment, it is necessary to solve the associated antenna heat dissipation problem, and the RF filter 350 is preferably used because the RF filter 350 can be used as a heat transfer medium to transfer the heat generated inside the antenna to the front surface of the front heat dissipation housing 100 in order to effectively dissipate the heat generated inside the antenna.

[0064] Heat generated from the RF filter 350 can be transferred to the front surface of the front heat dissipation housing 100 by contacting the rear surface of the front heat dissipation housing 100, and a thermal pad (109) can be interposed between the filter 350 and the rear surface of the front heat dissipation housing 100. The thermal pad 109 not only functions to smoothly transfer the heat generated from the filter 350 by surface contact with the front heat dissipation housing 100, but also functions to eliminate tolerances during assembly between the filter 350 and the front heat dissipation housing 100.

[0065] 4, the inner surface forming the internal space 200S of the rear heat dissipation housing 200 may be formed in a shape that matches the rear portions of the main board 310 and the sub-board 320 described later. That is, the thermal contact area with the rear surfaces of the main board 310 and the sub-board 320 can be increased to improve heat dissipation performance.

[0066] The rear heat dissipation housing 200 may further be provided with gripping handles 160 on both the left and right sides to facilitate a worker in transporting the antenna device 1 according to an embodiment of the present invention at the site or attaching it to a support pole (not shown).

[0067] In addition, various external mounting members 500 for cable connection to a base station device (not shown) and adjustment of internal components may be inserted and assembled on the outside of the lower end of the rear heat dissipation housing 200 .

[0068] Figures 6A and 6B are front and rear exploded oblique views showing the main board and filter stacked in the internal space of the rear heat dissipation housing in the configuration of Figure 2, Figure 7 is an exploded oblique view showing a direct rear heat dissipation structure via the rear heat dissipation housing in the configuration of Figure 2, Figures 8A and 8B are front and rear exploded oblique views showing the installation of the base board and shielding panel on the main board in the configuration of Figure 2, and Figure 9 is an exploded oblique view for explaining the electrical connection of the PSU unit to the main board in the configuration of Figure 2.

[0069] An antenna device 1 according to an embodiment of the present invention may include an antenna stack assembly 300 that is stacked in the internal space 200S of the rear heat dissipation housing 200, as shown in FIGS. 6A and 6B.

[0070] As shown in Figures 6A and 6B, the antenna stacked assembly 300 may include a plurality of filters 350 as RF filters stacked on the front side of the main board 310, and a sub-board 320 stacked on the back side of the main board 310.

[0071] Although not shown, the main board 310 may be laminated in multiple layers, and a power supply circuit may be pattern-printed on the inside or surface of the main board 310 for supplying power to the multiple filters 350. In particular, the LNA element 312 among the multiple power supply components may be mounted on the front surface of the main board 310, and multiple power supply connectors 360 for connecting power to the multiple filters 350 may be inserted and mounted.

[0072] On the other hand, the subboard 320 may have a pair of power supply circuits 321 for supplying power to the multiple filters 350 printed on the front surface as a transmission path and a reception path, similar to the main board 310, and may have a PA element 322 mounted thereon among the multiple power supply components.

[0073] Here, the main board 310 may be formed with a plurality of through holes 312 so that the power supply circuit 321 and the PA element 322 on the front side of the sub-board 320 stacked on the back side of the main board 310 are exposed on the back side of the plurality of filters 350.

[0074] Furthermore, as described above, a clamshell (not shown in the drawing) is integrally formed on the rear end side of the multiple filters 350, so that a predetermined air layer is formed between the rear end side of the multiple filters 350 and the main board 310 and the sub-board 320, and heat generated from the LNA element 312 and the PA element 322, which are typical heat-generating elements, can be dissipated to the rear heat dissipation housing 200 side through a heat dissipation via hole (see drawing reference number "357a" in Figure 11) formed in the main board 310.

[0075] 7, a plurality of FPGA elements 317a and RFIC elements 317b, which are representative of heat generating elements, can be mounted and arranged on the rear surface of the main board 310. The plurality of FPGA elements 317a and the plurality of RFIC elements 317b are semiconductor elements that emit a large amount of heat when driven, and are employed in a structure in which they come into direct thermal surface contact with the inner surface of the internal space 200S of the rear heat dissipation housing 200 and dissipate heat rearward through the rear heat dissipation housing 200.

[0076] 7, the inner surface of the rear heat dissipation housing 200 is formed with a thermal contact accommodating surface 203a that is in direct thermal contact with the surfaces of the multiple FPGAs 317a and RFIC elements 317b, protruding forward, and the rear surface of the sub-board 320 may be printed with an engraved pattern or may be processed to form a thermal contact groove 203b that accommodates the multiple protruding components mounted thereon in a recessed form that is recessed backward. Therefore, the entire rear surfaces of the main board 310 and the sub-board 320 are in thermal surface contact with the inner surface of the rear heat dissipation housing 200, which has the advantage of greatly improving heat dissipation performance.

[0077] Meanwhile, as shown in Figures 8A and 8B, a shielding pad 330 may be stacked and coupled in a clamshell shape to the remaining portion of the front surface of the main board 310 excluding the portion occupied by the plurality of filters 350. The shielding pad 330 is a shielding member disposed between the main board 310 and the front heat dissipation housing 100 to block the influence of electrical components or external electromagnetic waves on the remaining portion excluding the electrical signal line via the plurality of filters 350, thereby ensuring more stable signal performance.

[0078] The antenna device 1 according to an embodiment of the present invention may further include a PSU unit 400 for powering the multiple filters 350 and the antenna module 110, as shown in FIGS. 6A and 6B and in FIG.

[0079] The PSU unit 400 may be stacked in the internal space 200S of the rear heat dissipation housing 200 below the main board 310 at the same height as the main board 310, as shown in FIGS. 6A, 6B and 7.

[0080] Such a PSU unit 400 may include a PSU board 410 and a number of electrical components 419 including a number of PSU elements 417 disposed on either the front or rear surface of the PSU board 410 .

[0081] The PSU unit 400 may be provided to distribute power to the main board 310 via a plurality of bus bars 340. More specifically, the plurality of bus bars 340 are arranged to interconnect the left and right ends of the PSU substrate 410 and the main board 310, respectively, as shown in Fig. 6A, Fig. 6B, and Fig. 9. In particular, the plurality of bus bars 340 can be connected by being inserted into connection holes 319 pre-formed in the main board 310.

[0082] In particular, since the PSU element 417 and the electrical element 419 of the PSU unit 400 emit a large amount of heat when operating, the thermal contact accommodation portion 217 may be recessed rearward to correspond to the shapes of the PSU element 417 and the electrical element 419 in a portion of the internal space 200S of the rear heat dissipation housing 200 occupied by the PSU board 410, as shown in Fig. 7. Therefore, the heat generated from the PSU element 417 and the electrical element 419 of the PSU unit 400 can be dissipated rearward using the rear heat dissipation housing 200 as a heat transfer medium.

[0083] However, it is not necessarily required that the heat generated in the PSU unit 400 is dissipated rearward through the rear heat dissipation housing 200, and it goes without saying that the heat can be dissipated forward toward the front heat dissipation housing 100 through a vapor chamber or heat pipe structure (not shown) separately provided as a heat transfer medium. This is because the antenna device 1 according to the embodiment of the present invention has a structure that is advantageous for forward heat dissipation through the front heat dissipation housing 100, unlike the case where a conventional radome is provided.

[0084] FIG. 10 is an exploded perspective view illustrating the manner in which the filter is connected to the main board in the configuration of FIG. 2, and FIG. 11 is a partially cutaway perspective view illustrating the manner in which heat generated from the filter is dissipated through a rear heat dissipation housing in the configuration of FIG. 2.

[0085] When the shielding pad 330 and the sub-board 320 are stacked on the front and back surfaces of the main board 310 as described above, a plurality of filters 350 are mounted on the front surface of the main board 310 as RF filters, as shown in Figures 10 and 11.

[0086] In this case, the filters 350 may be cavity filters having a clamshell integrally provided at the rear end thereof for shielding electromagnetic waves from the outside. It should be noted that the clamshell is a feature of a component that is distinct from the shielding pad 330 provided in a clamshell shape to cover the front surface of the main board 310 as described above.

[0087] At least one filter assembly protrusion 357 is formed in each of the clamshell-formed portions of the plurality of filters 350 to be inserted into filter assembly holes 317 formed in the main board 310 for assembly, and the filter assembly protrusion 357 may be formed in a tube shape with an empty interior.

[0088] Therefore, the heat generated and collected from the LNA element 312 and the PA element 322 in the air layer between the rear end of each of the multiple filters 350 and the main board 310 can be easily dissipated to the rear heat dissipation housing 200 side through the tube-shaped filter assembly protrusion 357 and the heat dissipation via hole 357a formed in the main board 310.

[0089] On the other hand, the rear ends of the multiple filters 350 may be provided with a pair of main board side coaxial connectors 353a electrically connected to the power supply connector 360 mounted on the main board 310, as shown in FIG. 10, and the front ends of the multiple filters 350 may be provided with a pair of antenna side coaxial connectors 353b electrically connected to the antenna module 110 arranged on the front surface of the front heat dissipation housing 100.

[0090] In addition, a thermal pad 109 that mediates heat transfer to the rear surface of the front heat dissipation housing 100 is disposed on the front ends of the multiple filters 350, allowing the heat generated from each of the multiple filters 350 to be dissipated forward more quickly using the front heat dissipation housing 100 as a heat transfer medium.

[0091] In addition, screw fastening holes 359 are formed at the front ends of the multiple filters 350 for screwing using fixing screws 351 to the front heat dissipation housing 100, and the fixing screws 351 are fastened to the screw fastening holes 359 through screw through holes 119 formed in the front heat dissipation housing 100, so that the front heat dissipation housing 100 can be stacked and fastened to the front of the multiple filters 350.

[0092] According to the above-mentioned configuration, it was confirmed that the heat generated in the filter 350 directly contacts the rear surface of the front heat dissipation housing 100 or the radiation director 117 of the antenna module 110, and the heat of the filter 350 is about 14 to 16°C lower than the conventional one. This is understood to be due not only to the effect of removing the radome, which was a conventional impediment to heat dissipation, but also to the effect of improving the heat transfer performance by direct heat transfer (thermal conduction) of the heat of the filter 350 to the rear surface of the front heat dissipation housing 100 and the radiation director 117, which are made of materials suitable for heat dissipation.

[0093] 12A and 12B are front and rear exploded oblique views showing the assembly process of internal components to the rear heat dissipation housing in the configuration of FIG. 2, and FIG. 13 is an exploded oblique view for explaining the assembly process of an outer member to the rear heat dissipation housing in the configuration of FIG. 2.

[0094] As shown in Figures 2 to 11, once the assembly of components onto the main board 310 and the assembly of the stacked assembly 300 onto the rear heat dissipation housing 200 are completed, the outer member 500 is moved from the lower end of the rear heat dissipation housing 200 to complete the assembly, as shown in Figures 12A to 13.

[0095] Here, the rear heat dissipation housing 200 has an internal space 200S completely sealed off by assembly of the front heat dissipation housing 100 and the antenna module 110, which will be described later, and does not require a separate protective member such as a radome.

[0096] Figure 14 is a front side exploded oblique view for explaining the installation of the antenna module on the front heat dissipation housing in the configuration of Figure 2, Figure 15 is a front and rear side exploded oblique view showing the installation of the antenna module on the front surface of the front heat dissipation housing in the configuration of Figure 14, Figure 16 is a perspective view showing the antenna module in the configuration of Figure 14, Figures 17A and 17B are front side exploded oblique view and rear side exploded oblique view of Figure 14, and Figure 18 is a front view of the antenna module in the configuration of Figure 14, a cross-sectional view along line BB, and a cutaway oblique view.

[0097] To realize beamforming, multiple radiating elements are required as an array antenna as shown in Figures 14 to 18. The multiple radiating elements can generate a narrow directional beam to increase the concentration of radio waves in a specified direction.

[0098] Recently, the multiple radiating elements are most frequently used as dipole antennas or patch antennas, and are designed and arranged at a distance to minimize signal interference between them. Conventionally, a radome was required to protect the multiple radiating elements from the outside in order to prevent the arrangement design of the multiple radiating elements from being changed by external environmental factors. Therefore, the multiple radiating elements and the antenna board on which the multiple radiating elements are installed were not exposed to the outside air only in the area covered by the radome, which was extremely restrictive in dissipating system heat generated by the operation of the antenna device 1 to the outside.

[0099] The radiating element (not shown in the drawings) of the antenna device 1 according to an embodiment of the present invention may be realized in the form of a radiating director 117 formed of a conductive metal material on and electrically connected to the front surface of the antenna patch circuit unit 116 printed on the radiating element printed circuit board 115 arranged in the antenna arrangement unit 170. The antenna patch circuit unit 116 is printed on the radiating element printed circuit board 115 and is provided as a dual polarized patch element that generates dual polarized waves of either orthogonal ±45 polarization or vertical / horizontal polarization. A feed line (not shown in the drawings) that supplies a feed signal to the antenna patch circuit unit 116 is patterned on the upper surface of the radiating element printed circuit board 115 to interconnect the antenna patch circuit units 116.

[0100] In conventional antenna devices, the feed line must form a feed line below the printed circuit board on which the antenna patch circuit section is mounted, which results in a complex feed structure, such as having a plurality of through holes, and the feed structure occupies the space below the printed circuit board for radiating element 115, which causes a problem of acting as a factor that inhibits direct surface thermal contact between the filter 350 and the printed circuit board for radiating element 115. However, the feed line according to the embodiment of the present invention is pattern-printed on the same front surface as the printed circuit board for radiating element 115 on which the antenna patch circuit section 116 is pattern-printed, which not only makes the feed structure very simple, but also has the advantage of ensuring coupling space for direct surface thermal contact between the filter 350 and the printed circuit board for radiating element 115.

[0101] Meanwhile, the radiation director 117 is made of a thermally or electrically conductive metal material and is electrically connected to the antenna patch circuit unit 116. The radiation director 117 guides the direction of the radiation beam in all directions and also transfers heat generated behind the radiating element printed circuit board 115 to the front by thermal conduction. The radiation director 117 may be made of a conductive metal material through which radio waves can flow well, and is provided at a distance from the front of each antenna patch circuit unit 116.

[0102] Here, the height of the heat dissipation section (105, front heat dissipation fins) of the front heat dissipation housing 100 can be set by the height of the radiation director 117 coupled to the antenna module cover 111 described later. It goes without saying that by designing the height of the radiation director 117 to be variable, the height of the heat dissipation section (105, heat dissipation fins) can be varied to adjust the amount of heat dissipation.

[0103] In the embodiment of the present invention, a radiating element using an antenna patch circuit section 116 and a radiation director 117 has been described. However, when a dipole antenna is applied, the radiation director configuration can be omitted, and since the height of the dipole antenna is relatively high, the height of the heat dissipation section (105, heat dissipation fins) can be set high to increase the amount of heat dissipation.

[0104] 14 to 18, a radiation director 117 has a protrusion 117a formed on a rear surface thereof, which is electrically connected to an antenna patch circuit unit 116 through a through hole 114a of an antenna module cover 111. As shown in FIG.

[0105] The overall size, shape, installation position, etc. of the radiation director 117 can be appropriately designed by measuring the characteristics of the radiation beam radiated from the antenna patch circuit section 116 and experimentally or by simulating the characteristics.

[0106] The radiation director 117 functions to guide the direction of the radiation beam generated from the antenna patch circuit unit 116 in all directions, thereby further reducing the overall antenna beam width and improving the side lobe characteristics.

[0107] In addition, it can compensate for the loss of the patch antenna and can also perform a heat dissipation function by being made of a conductive metal material. The shape of the radiation director 117 is preferably formed in an appropriate shape for guiding the direction of the radiation beam in all directions, for example, a circular shape having no directionality, but is not limited thereto.

[0108] Alternatively, at least one radiating element may be implemented in the form of one antenna module 110 .

[0109] For example, the antenna module 110 can be defined as a concept including an antenna patch circuit section 116 printed on a printed circuit board 115 for a radiating element arranged in the antenna arrangement section 170, an antenna module cover 111 arranged to cover the front surface of the antenna patch circuit section 116, and a radiation director 117 arranged in front of the antenna module cover 111, made of a conductive metal material, and electrically connected to the antenna patch circuit section 116.

[0110] 14 to 18 show an example in which three antenna patch circuit units 116 and a radiation director 117 form one unit antenna module 110, and the number of antenna patch circuit units 116 and radiation directors 117 can be varied depending on the optimum design of the antenna module to increase the gain.

[0111] As described above, the antenna module 110 may further include an antenna module cover 111 that seals at least one surface of the radiating element printed circuit board 115 of the antenna module 110. The antenna module cover 111 may be molded from a plastic resin material that is relatively light in weight.

[0112] The antenna module cover 111 and the printed circuit board 115 for the radiating element are formed with a cover through hole 113 and a board through hole 115b that penetrate in the front-rear direction, respectively, and fixing screws 351 are passed through the cover through hole 113 and the board through hole 115b in sequence from the outside of the front heat dissipation housing 100, and then passed through the screw through hole 119 of the front heat dissipation housing 100 and fastened to screw fastening holes 359 formed at the front ends of the multiple filters 350, thereby fixing each of the antenna modules 110 to the front of the antenna arrangement portion 170.

[0113] Here, as shown in (a) of Figure 15, a accommodating rib 178 is formed on the peripheral portion of the antenna arrangement portion 170 to accommodate at least the peripheral end portion of the antenna module cover 111, and it is preferable that the antenna module cover 111 is formed to a size that allows it to be tightly fitted into the accommodating rib 178 of the antenna arrangement portion 170 and be airtight or waterproof.

[0114] Meanwhile, as shown in FIG. 15, the printed circuit board 115 for radiating elements has four positioning holes 115-1 to 115-4 formed at the corners of a rectangle, penetrating in the front-rear direction, and two positioning protrusions 173a, 173b are formed on the front surface of the antenna arrangement part 170 to be pressed into two diagonal positioning holes 115-1, 115-2 of the four positioning holes 115-1 to 115-4 formed on the printed circuit board 115 for radiating elements, and two positioning protrusions 111-3, 111-4 are formed on the rear surface of the antenna module cover 111 to be pressed into the remaining two positioning holes 115-3, 115-4 not occupied by the two positioning protrusions 173a, 173b formed on the front surface of the antenna arrangement part 170 of the four positioning holes 115-1 to 115-4 formed on the printed circuit board 115 for radiating elements.

[0115] Therefore, as shown in FIG. 15, when the antenna module 110 is installed in the antenna arrangement portion 170, the printed circuit board 115 for radiating element is moved to the rear side of the antenna module cover 111, and the two position setting protrusions 111-3, 111-4 are fixed by pressing and inserting the two position setting protrusions 111-3, 111-4 into the two position setting holes 115-3, 115-4 formed on the rear side of the antenna module cover 111 (see FIG. 15(b)), and then the antenna module cover 111 to which the printed circuit board 115 for radiating element is coupled is moved to the antenna arrangement portion 170 formed on the front side of the front heat dissipation housing 100, and the two position setting protrusions 173a, 173b are temporarily fixed by pressing and inserting the two position setting holes 115-1, 115-2 of the printed circuit board 115 for radiating element.

[0116] That is, the printed circuit board 115 for radiating element can be stably positioned between the rear surface of the antenna module cover 111, which is provided to cover the front surface, and the front surface of the antenna placement part 170 of the front heat dissipation housing 100, which is provided to closely contact the rear surface, by pressing and inserting the positioning protrusions 111-3, 111-4, 173a, and 173b into the positioning holes 115-1 to 115-4, respectively.

[0117] On the other hand, as shown in FIG. 15, the above-mentioned antenna patch circuit section 116 is printed on the front surface of the radiating element printed circuit board 115, and a conductive contact pattern 115c is printed on the rear surface of the radiating element printed circuit board 115, and power is fed to the antenna patch circuit section 116 side through the contact between the antenna side coaxial connector 353b provided at the front end of the filter 350 and the contact pattern 115c.

[0118] Here, the antenna module cover 111 is injection molded from a plastic material, and one side of the antenna module cover 111 is provided with a director fixing portion 114 that is molded to the rear surface of the radiation director 117, as shown in FIG. 17A, and the director fixing portion 114 may have a director fixing protrusion 114b that can be coupled to the radiation director 117 and protrudes forward.

[0119] In addition, as shown in FIG. 17B, the radiation director 117 can be press-fitted and fixed into at least one director fixing groove 117b recessed and formed in a position corresponding to at least one director fixing protrusion 114b on the rear surface of the radiation director 117.

[0120] In addition, the antenna module cover 111 may have a filter fixing hole 113 formed therethrough for coupling with the filter 350. When a filter fixing screw (not shown) passes through the antenna module cover 111 via the filter fixing hole 113 and then passes through a through hole 115b formed in the radiating element printed circuit board 115 and is fastened to a screw fastening hole 359 formed in the filter 350, the front heat dissipation housing 100 can be firmly stacked and coupled to the front surface of the filter 350. The filter fixing hole 113 is preferably sealed via a hole shielding cap 119 as shown in FIG. 16.

[0121] Here, the antenna module cover 111 may have at least one board fixing hole 114a for screw fastening with the radiating element printed circuit board 115 by a fixing screw 180, and the rear surface of the radiation director 117 may have at least one fixing boss 117a that penetrates the board fixing hole 114a and is exposed to the rear surface of the antenna module cover 111. The radiating element printed circuit board 115 may be fixed to the rear surface of the antenna module cover 111 by the action of the fixing screw 180 penetrating the director fixing hole 178 formed to penetrate the antenna placement part 170 of the front heat dissipation housing 100 in the front-rear direction and then fastening to the fixing boss 117a.

[0122] Meanwhile, the fixing screw 180 is preferably a countersunk screw fastened so that its rear end is matched to the front surface of the rear-located filter 350. This is to allow the rear end surface of the fixing screw 180, which is a countersunk screw, to come into surface thermal contact with the front surface of the filter 350 over the maximum possible area. Since the fixing screw 180 and the radiation director 117 are made of a thermally conductive material, heat dissipated into the internal space 200S between the front heat dissipation housing 100, in which the filter 350 is provided, and the main board 310 and the PSU unit 400 can be dissipated to the front side by thermal conduction of the front heat dissipation housing 100 itself or by thermal conduction via the fixing screw 180 and the radiation director 117.

[0123] Also, at least one reinforcing rib 111a is formed on one surface of the antenna module cover 111 to define the outer appearance of the antenna module cover 111 and to reinforce the strength of the antenna module cover 111 made of plastic material.

[0124] FIG. 19 is a perspective view showing another embodiment of the antenna module, FIG. 20 is a perspective view showing a modified example of FIG. 19, FIG. 21 is a three-view diagram (front view, side view, and plan view) of FIG. 20, and FIGS. 22 and 23 are graphs for comparing the XPD values ​​and Isolation values ​​of the antenna modules of FIG. 19 and FIG. 20.

[0125] As shown in Figures 19 and 20, the antenna device 1 according to one embodiment of the present invention may further include a module mounting plate 118 that expands the area of ​​the antenna placement section 170 formed on the front surface of the front heat dissipation housing 100 so that at least two antenna modules 110 can be simultaneously mounted in the expanded antenna placement section 170.

[0126] Here, the module mounting plate 118 may be understood as a configuration meaning the front heat dissipation housing 100 itself already described with reference to Figures 1 to 18, or may be defined as a medium for mediating the connection of the remaining module type configuration as one component of the antenna module 110 separately provided on the front side of the front heat dissipation housing 100. Therefore, the module mounting plate 118 described below may be understood as a substitute for the front heat dissipation housing 100, and the partition wall 118w and window groove 118h described below formed on the module mounting plate 118 may also be understood as substitutes for the heat dissipation portion (front heat dissipation fins, 105) of the front heat dissipation housing 100.

[0127] The module mounting plate 118 may have at least two (three are shown in the drawings, but note that this is not limited to) antenna modules 110 arranged side by side, as shown in Figures 19 and 20.

[0128] Additionally, the module mounting plate 118 may be formed with partition walls 118w that partition the antenna modules 110. The module mounting plate 118 including the partition walls 118w is preferably formed of a metal material so as to facilitate the dissipation of heat transferred from the front heat dissipation housing 100, and is formed to a protruding height that protrudes forward beyond the front end of the radiation director 117, which is advantageous in terms of heat dissipation.

[0129] Here, in the case of an embodiment in which the antenna module 110 is directly mounted on the antenna arrangement section 170 provided on the front surface of the front heat dissipation housing 100 without the module mounting plate 118, it can be understood that the partition wall 118w is realized by any one of the multiple front heat dissipation fins (heat dissipation section, 105).

[0130] However, in this case, the partition wall 118w can be defined as a configuration that partitions between the antenna arrangement sections 170 arranged adjacently in the H-direction, and can also be defined as a configuration that partitions the two antenna modules 110 themselves arranged at a distance in the H-direction.

[0131] At this time, some of the front heat dissipation fins 105 are provided in the form of at least one partition wall 118w that partitions each of the two or more antenna placement parts 170 in the H-direction.

[0132] In particular, a front end of at least one partition wall 118w may be provided to protrude from the front surface of the front heat dissipation housing 100 or the module mounting plate 118 flush with the front surface of the radiating element (particularly, the radiation director 117).

[0133] However, the front end of the partition wall 118w does not necessarily need to protrude flush with the front surface of the radiation director 117, and may be provided protruding forward of the front surface of the radiation director 117.

[0134] However, although a larger protrusion amount of the partition wall 118w is more advantageous in terms of heat dissipation, as shown in FIG. 22 and FIG. 23, XPD and isolation characteristics may relatively decrease.

[0135] Therefore, as shown in FIG. 20, in an antenna module 110b according to a modified example, a plurality of window grooves 118h may be formed in a partition wall 118w so as to prevent degradation of XPD and isolation characteristics while maintaining the heat dissipation effect of the partition wall 118w.

[0136] It is preferable that the multiple window grooves 118h are formed so as to open in the left-right direction (i.e., in the H-direction based on the radiation director 117) at a position close to (adjacent to) the left or right end of the radiation director 117 in the configuration of the antenna module 110 coupled between the partition walls 118w.

[0137] For example, as shown in Figures 20 and 21, when an antenna module 110 having three radiation directors 117 arranged in the vertical direction is fixed to one module mounting plate 118, three window grooves 118h may be formed in one partition wall 118w.

[0138] In particular, as shown in Figures 22 and 23, since there is a certain degree of difference in the degree of deterioration of the XPD / Isolation characteristics between a case where no window groove 118h is formed in the partition wall 118w (see (a) of Figures 22 and 23) and a case where a window groove 118h is formed in the partition wall 118w (see (b) of Figures 22 and 23), it is preferable that the cutting depths of the multiple window grooves 118h are designed to be different in consideration of the isolation performance measurement values ​​with adjacent radiating elements in the H-direction.

[0139] In the antenna device according to one embodiment of the present invention described above, a module mounting plate 118 is provided separately, and the partition wall 118w is provided on the module mounting plate 118. However, the partition wall 118w does not necessarily have to be provided on the separately provided module mounting plate 118. It is also possible to provide the heat dissipation fin closest to the antenna module 110 among the configuration of the heat dissipation section 105 provided in the form of multiple heat dissipation fins as the partition wall 118w, and to form the above-mentioned multiple window grooves 118h in any one of the multiple front heat dissipation fins 105 itself.

[0140] In the antenna module 110a (see FIG. 19) according to another embodiment and the antenna module 110b (see FIG. 20 and FIG. 21) according to the modification having such a configuration, it can be confirmed that the XPD (cross polarization separation) and isolation characteristics are improved as shown by the change from graph (a) to graph (b) depending on whether or not the antenna module 110a has a plurality of window grooves 118h, as shown in FIG. 22 and FIG. 23. Here, (a) in each of FIG. 22 and FIG. 23 is a graph relating to the antenna module 110a according to another embodiment, and (b) in each of FIG. 22 and FIG. 23 is a graph relating to the antenna module 110b according to the modification in which the window groove 118h is further added.

[0141] The state of heat dissipation in the antenna device 1 according to the embodiment of the present invention configured as above will be briefly described as follows.

[0142] The heat generated between the front heat dissipation housing 100 and the filter 350 corresponding to the space between the main board 310 and the front heat dissipation housing 100 can be dissipated to the front of the front heat dissipation housing 100 by direct surface thermal contact with the rear surface of the front heat dissipation housing 100 or by interposing the filter 350 and the radiation director 117 therebetween.

[0143] In this case, in the case of the antenna device 1 according to the embodiment of the present invention, instead of removing the conventional radome, only the area occupied by the radome is converted into a heat dissipation area, thereby making it possible to achieve better heat dissipation performance.

[0144] Using the main board 310 as a reference, heat generated on the rear side of the main board 310 and heat generated on the rear side of the PSU unit 400 can be quickly dissipated rearward using a plurality of heat dissipation fins 201 formed integrally with the rear heat dissipation housing 200 in direct surface thermal contact with the rear heat dissipation housing 200.

[0145] At this time, the heat captured by the clamshell in the space between the filter 350 and the main board 310 can be dissipated rearward through the filter assembly protrusion 357 of the filter 350 and the heat dissipation via hole 357a of the main board 310, with the rear heat dissipation housing 200 serving as a heat transfer medium.

[0146] In this way, the antenna device 1 according to one embodiment of the present invention can dissipate system heat inside the antenna device 1 in all directions including the front as well as the rear by the area of ​​the front heat dissipation housing 100 which is increased by removing the radome, and since the antenna module 110 is arranged in the front heat dissipation housing 100 of the antenna device 1 and is arranged so as to be exposed to the outside air, front and rear heat dissipation of the antenna device 1 is possible, thereby achieving a significant improvement in heat dissipation performance.

[0147] An antenna device according to an embodiment of the present invention has been described in detail above with reference to the accompanying drawings. However, the embodiment of the present invention is not necessarily limited to the above-mentioned embodiment, and it is obvious that various modifications and equivalent implementations are possible by those skilled in the art to which the present invention pertains. Therefore, the true scope of the present invention is defined by the claims that follow. [Industrial Applicability]

[0148] The present invention provides an antenna device with significantly improved heat dissipation performance by eliminating the radome and arranging the radiating element in the front housing of the antenna device, thereby using the front and rear housings of the antenna device entirely for front-to-rear heat dissipation. [Explanation of symbols]

[0149] 1: antenna device, 100: front heat dissipation housing 110: antenna module, 111: antenna module cover 117: Radiation director, 118: Module installation plate 118w: partition wall, 118h: window groove 120: printed circuit board, 121: director 122: antenna patch section, 124: power supply line 178: Director fixing hole, 170: Antenna arrangement section 105: heat sink, 350: filter 180: Fixing screw, 200: Rear heat dissipation housing 210: Rear heat dissipation fin, 220: Main board

Claims

1. a front heat dissipation housing in which two or more antenna arrangement parts, each having at least one radiating element arranged on a front surface thereof, are continuously arranged in a horizontal direction (H-direction); a rear heat dissipation housing, the rear heat dissipation housing being coupled to a front end thereof and having a plurality of rear heat dissipation fins for dissipating a predetermined amount of heat rearward, The antenna device has a front heat dissipation housing integrally provided with a plurality of front heat dissipation fins that dissipate a predetermined amount of heat forward, and a portion of the plurality of front heat dissipation fins are provided in the form of at least one partition wall that partitions each of the two or more antenna arrangement sections in the H-direction.

2. The antenna device according to claim 1 , wherein a front end of the at least one partition wall protrudes from the front surface of the front heat dissipation housing to be flush with a front surface of the radiating element.

3. The antenna device according to claim 1 , wherein a front end of the at least one partition wall is provided so as to protrude forward from the front surface of the front heat dissipation housing beyond a front surface of the radiating element.

4. the at least one radiating element is formed of a conductive metal material in an antenna patch circuit portion printed on a radiating element printed circuit board disposed in the antenna arrangement portion, and is provided in the form of a radiation director electrically connected to the antenna patch circuit portion; 4. The antenna device according to claim 2, wherein a front end of the at least one partition wall is provided so as to protrude beyond at least a front surface of the radiation director.

5. 2. The antenna device according to claim 1, wherein a plurality of window grooves are formed in the partition wall so as to open in the H-direction.

6. The antenna device according to claim 5 , wherein the plurality of window grooves are formed adjacent to left and right ends of each of the radiating elements.

7. 7. The antenna device according to claim 6, wherein the cut depths of the plurality of window grooves are designed to be different from each other in consideration of an isolation performance measurement value between adjacent radiating elements in the H-direction.

8. a front heat dissipation housing in which at least two or more antenna modules are arranged consecutively in a horizontal direction (H-direction); The antenna device has a front heat dissipation housing integrally provided with a plurality of front heat dissipation fins that dissipate a predetermined amount of heat forward, and a portion of the plurality of front heat dissipation fins are provided in the form of at least one partition wall that partitions each of the two or more antenna modules in the H-direction.

9. The antenna module includes: an antenna patch circuit portion printed on a printed circuit board for a radiating element disposed in the antenna placement portion; an antenna module cover arranged to cover a front surface of the antenna patch circuit unit; a radiation director disposed on a front surface of the antenna module cover, the radiation director being made of a conductive metal material and electrically connected to the antenna patch circuit unit; The antenna device according to claim 8, wherein the at least one partition wall is integrally formed with the front heat dissipation housing so as to partition between the radiating element printed circuit boards of two or more antenna module configurations arranged adjacent to each other in the H-direction.

10. 10. The antenna device according to claim 9, wherein the partition wall is formed with a plurality of window grooves opening in the H- direction.

11. The antenna device according to claim 10 , wherein the window grooves are formed in portions adjacent to both left and right ends of the radiation director.

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