Plurality of electrical nodes, electrical node modules, electrical nodes, and methods for manufacturing multi-layer structures - Patents.com

Abstract

1. A method for manufacturing a plurality of electrical nodes (10), the method comprising: providing (410) a plurality of electronic circuits onto a first substrate (11), such as a printed circuit board or other electronic substrate, optionally a low temperature co-fired ceramic substrate, each of the electronic circuits comprising a circuit pattern (14) and at least one electronic component (12) connected to the circuit pattern (14), the electronic circuits being spaced apart from one another on the first substrate (11), thereby defining blank areas (30) surrounding each of the plurality of electronic circuits, respectively; providing (420) a potting or casting material, embedding each of the plurality of electronic circuits in the potting or casting material, and subsequently solidifying (430), including optionally curing, the potting or casting material to form a filler material layer of the plurality of electrical nodes (10).

Description

[Technical field]

[0001] The present invention relates generally to functional integrated structures, such as electronic (multi-layer) assemblies, and methods for their manufacture. In particular, however, the present invention relates to electrical nodes, including, for example, molded, optionally injection molded layers of material, for implementing a function or functions in such structures or assemblies, and methods for their manufacture. [Background technology]

[0002] In relation to electronics and electronic products, there are a variety of different stacking assemblies and structures. The motivation behind the integration of electronics and related products can be as diverse as the relevant use context. Size savings, weight savings, cost savings, or even just efficient integration of components is relatively often pursued, for which the resulting solution ultimately exhibits multi-layered nature. The relevant use scenarios can then relate to product packaging or food casings, visual design of device housings, wearable electronics, personal electronic devices, displays, detectors or sensors, vehicle interiors, antennas, labels, and vehicle electronics, etc.

[0003] Electronics, such as electronic components, ICs (integrated circuits), and conductors, can generally be provided on substrate elements by a number of different techniques. For example, prefabricated electronics, such as various surface mounted devices (SMDs), can be mounted on substrate surfaces that will ultimately form the inner or outer interface layers of the multi-layer structure. Additionally, techniques falling under the term "printed electronics" can be applied to actually create electronics directly and additively on the substrate concerned. The term "printing" in this context refers to various printing techniques that can create electronics / electrical elements from printed matter, including but not limited to screen printing, flexography, and inkjet printing, through a substantially additive printing process. The substrates used can be flexible, printed organic materials, however, this is not necessarily the case.

[0004] Furthermore, the concept of injection molded structural electronics (IMSE) involves building functional devices and their parts in the form of multi-layer structures, which encapsulates electronic functionality as seamlessly as possible. A characteristic of IMSE is also that electronics are generally manufactured in true 3D (non-planar) form according to a 3D model of the target product, part, or generally the entire design. To achieve the desired 3D layout of electronics on the 3D substrate and in the related final product, electronics can still be provided on an initially planar substrate, such as a film, using two-dimensional (2D) electronics assembly methods, and then the substrate housing the electronics can be formed into a desired three-dimensional, i.e., 3D, shape, and overmolded with a suitable plastic material that covers and embeds the underlying elements, such as electronics, to protect and possibly hide them from the environment.

[0005] In typical solutions, electrical circuits are fabricated on a printed circuit board (PCB) or a substrate film, which are then overmolded with a plastic material. However, the known structures and methods still have some drawbacks depending on the associated usage scenario. To fabricate an electronic assembly with one or more functionalities, typically, rather complex electrical circuits for achieving these functionalities must be fabricated on a substrate by printing and / or utilizing SMDs, and then overmolded with a plastic material.

[0006] However, with known solutions, the implementation of complex functionality may face reliability risks and assembly yield-related issues resulting from challenges in integrating very dense component(s) with complex geometries. Furthermore, electronic assemblies may require, for example, the use of external control electronics, which reduces the degree of integration and makes the structure unattractive. For example, integrating a potentially large number of dense and complex shaped components directly onto a potentially sizable substrate may be difficult and potentially very risky, since reliability is often affected by molding pressures and assembly yields at different fabrication stages may be very low. Subassemblies mounted or disposed on PCBs and covered with plastic layers may, for example, suffer from mismatches in terms of thermal expansion, may be difficult to overmold due to their complex structure, and may exhibit stresses in the structure that may cause the subassemblies to tear from their electrical contacts. Thermal management challenges may also generally cause problems such as overheating.

[0007] Thus, both the direct provision of functional or specifically electrical elements, such as associated components, on a larger host substrate, and the preparation of aggregated subassemblies for subsequent mounting, have their own drawbacks in terms of, for example, electronics fragility, structural and installation complexity, and thermal management, and leave room for improvement in terms of associated improved or alternative manufacturing techniques and resulting final structures. Thus, there remains a need for the development of structures and methods relating to both IMSE technology and integrated electronics in general.

[0008] Furthermore, in some known attempts, the electronics on the substrate may be protected by a separate cover or shell. It is very difficult to control the alignment between the cover and the circuit board. Furthermore, when placing a component or subassembly on the substrate, both misalignment and rotation of the substrate relative to the cover or shell may make it more difficult for the pick-and-place machine vision to correctly identify the actual substrate orientation and place the contact pads directly on the corresponding portion on the substrate. Typical problems associated with this type of misalignment are misalignment and pick rejection when the machine vision cannot fully recognize the orientation of the circuit board. Furthermore, the space between the cover and the substrate has a very complex shape due to the component shape. This makes it difficult to reliably fill the space without leaving voids, which collapse in the injection molding, thereby damaging the component. The injection method results in the most voids, while applying a small amount of filler pre-fill on the substrate, allowing it to flow and settle, and then immediately sealing the substrate onto the shell and then injecting the space filled with filler may improve the results, but still provides little control over the voids. Vacuum distribution is also useful for air gaps, but is prohibitively expensive, which increases the amount of process-related costs in the total cost of each such subassembly. Summary of the Invention [Problem to be solved by the invention]

[0009] It is an object of the present invention to alleviate at least one or more of the above-mentioned disadvantages associated with known solutions in the context of integrated structures that contain functional elements such as electronics and utilize molded or cast material layers or structures. [Means for solving the problem]

[0010] The object of the invention is achieved by a plurality of electrical nodes, an electrical node module, an electrical node and a method for manufacturing a multi-layer structure as defined in the respective independent claims.

[0011] According to a first aspect, there is provided a method for manufacturing a plurality of electrical nodes, the method comprising: - obtaining or providing, respectively, on or onto a first substrate, preferably a substantially rigid substrate such as a printed circuit board or other electronic substrate, optionally a low temperature co-fired ceramic substrate, each of the electronic circuits comprising a circuit pattern and at least one electronic component connected to the circuit pattern, each of the electronic circuits being spaced apart from one another on the first substrate, thereby defining, respectively, a blank area surrounding each of the plurality of electronic circuits; providing a potting or molding material and embedding each of the plurality of electronic circuits in the potting or molding material; and thereafter - solidifying, including optionally curing, the potting or casting material to form a filler material layer of the plurality of electrical nodes.

[0012] Obtaining or providing a plurality of electronic circuits on or onto, respectively, a first substrate as referred to herein may mean obtaining a prefabricated substrate on which at least a circuit pattern and, optionally, also electronic components are provided. The circuit pattern may (or may have) been provided additively, e.g., by printing or dispensing, or at least partially in a subtractive manner, e.g., by etching. For example, providing the circuit pattern may (or may have) been provided by etching, and the electronic components may be added by mounting a surface mount technology (SMT) electronic component on the first substrate that is connected to the circuit pattern.

[0013] The method may further include, preferably, providing a barrier or dam element around the plurality of electronic circuits to restrict flow or the like of the potting or casting material during the provision of the potting or casting material. In some embodiments, the barrier or dam element may be provided prior to the provision of the potting or casting material.

[0014] The barrier or dam element may be initially made of a solid material such as a (plastic) frame or may be provided with an initially flowable or dispensable material that is subsequently solidified to form the barrier or dam element.

[0015] In other embodiments, the barrier or dam element may be provided after provision of the potting or casting material, such as by pressing a roller or mold or the like, and may be preferably molded at least partially toward and into the layer of potting or casting material provided to at least partially correspond to the shape of the blank area.

[0016] In various embodiments, the barrier or dam element each defines an individual barrier portion around each of the plurality of electronic circuits.

[0017] The barrier element may be provided at least partially on a peripheral portion of the first substrate.

[0018] The potting or casting material, and / or the flowable or dispensable material of the barrier or dam element preferably exhibits a very low viscosity, in various embodiments, the potting or casting material may have a kinematic viscosity of less than 5000 centipoise, preferably less than 2500 centipoise, at a temperature of about 20 degrees Celsius.

[0019] In some exemplary embodiments, the potting or casting material and / or the flowable or dispensable material of the barrier or dam element may include at least one of polyurethane, acrylic, polyester, silicone, polysiloxane, epoxy, and copolymers thereof. Additionally, the potting or casting material may include a curing agent, a crosslinking agent, a polymerization catalyst, or a chain extender.

[0020] In some embodiments, the method may include applying a low pressure, such as a substantial vacuum, onto at least one side of the first substrate including the filler material layer to remove air bubbles from the filler material layer prior to solidification.

[0021] In some embodiments, the method may include separating the embedded electronic circuits from one another along the blank areas to provide a plurality of electrical nodes, preferably after solidification of the filler material layer. The separating may include cutting, such as milling, bypass shear cutting, sawing, stamping, water jet cutting, laser cutting, or abrasive cutting.

[0022] Alternatively or additionally, the separating may include removing at least portions of the first substrate and filler material layers at the locations of the blank areas.

[0023] In various embodiments, the separating can include only or additionally removing the barrier or dam element and the portion of the first substrate underneath or in contact with the barrier or dam element.

[0024] In some embodiments, the separating can include removing portions of the first substrate, the barrier or dam element, and the filler material layer that are in the location of the blank areas.

[0025] In various embodiments, the separating can include aligning the first substrate based on optical or mechanical alignment markers on the first substrate.

[0026] The electrical node may be a system-in-package (SiP) module.

[0027] In various embodiments, the dimension of the plurality of electrical nodes in a first lateral direction, and optionally a second perpendicular lateral direction, may range from 5 to 25 millimeters, for example, 10, 15, or 20 millimeters.

[0028] In various embodiments, the thickness of the electrical nodes may range from 1 to 10 or 5 millimeters, preferably from 1.5 to 4 millimeters, and most preferably from 1.8 to 3.5 millimeters.

[0029] Additionally, the at least one electronic component may be a surface mount or through-hole device or component.

[0030] In various embodiments, at least one electronic component may be mounted in association with the circuit pattern having solder paste and / or adhesives.

[0031] Further, the method may include providing a plurality of contact pads or patterns at least partially on an opposite side of the first substrate for and in response to the plurality of electronic circuits, the contact pads or patterns being connected to at least corresponding electronic circuits.

[0032] In addition, the multiple contact pads or patterns may be disposed at least partially adjacent to the blanked area, such as less than 2 millimeters from the edge of the blanked area.

[0033] In various embodiments, the number of electronic circuits on the first substrate can be at least 2, such as in the range of 2 to 50, such as 2, 4, 9, 16, 25, 30, 36, 40, 45, or 50 or more, such as up to 500.

[0034] As an example, there may be, for example, a "5x5" or "7x8" circuit pattern on the first substrate 11, or an "8x9".

[0035] Additionally, the at least one electronic component may be selected from the group consisting of a microcontroller, an integrated circuit, a transistor, a resistor, a capacitor, an inductor, a diode, a photodiode, a light emitting diode, and a semiconductor switch.

[0036] Further, the at least one electronic component, electronic circuit, and / or remaining multi-layer structure may be an electronic component, an electromechanical component, an electro-optical component, a radiation emitting component, a light emitting component, an LED (light emitting diode), an OLED (organic LED), a side shooting LED or other light source, a top shooting LED or other light source, a bottom shooting LED or other light source, a radiation detecting component, a light detecting component or a light sensing component, a photodiode, a phototransistor, a photovoltaic device, a sensor, a micromechanical component, a switch, a touch switch, a touch panel, a proximity switch, a touch sensor, an air sensor, a temperature sensor, a pressure sensor, a humidity sensor, a gas sensor, a proximity sensor, a capacitance switch, The device may include at least one component selected from the group consisting of a touch panel, a capacitive sensor, a projected capacitive sensor or switch, a single-electrode capacitive switch or sensor, a capacitive button, a multi-electrode capacitive switch or sensor, a self-capacitance sensor, a mutual capacitance sensor, an inductive sensor, a sensor electrode, a micromechanical component, a UI element, a user input element, a vibration element, a sound generating element, a communication element, a transmitter, a receiver, a transceiver, an antenna, an infrared (IR) receiver or transmitter, a wireless communication element, a wireless tag, a radio tag, a tag reader, a data processing element, a microprocessor, a microcontroller, a digital signal processor, a signal processor, a programmable logic chip, an ASIC (application specific integrated circuit), a data storage element, and an electronic subassembly.

[0037] According to a second aspect, an electrical node module is provided. The electrical node module comprises a first substrate, preferably a rigid substrate such as a printed circuit board or other electronic substrate, optionally a low temperature co-fired ceramic substrate (LTCC). The electrical node module also comprises a plurality of electronic circuits on the first substrate, each of the electronic circuits comprising a circuit pattern and at least one electronic component connected to the circuit pattern, the plurality of electronic circuits being spaced apart from one another on the first substrate, thereby defining respective blank areas surrounding each of the plurality of electronic circuits. The electrical node module further comprises a filler material layer, preferably a potting or casting material, embedding the plurality of electronic circuits and extending along at least 80 percent and / or preferably substantially the entire length of the electrical node in the lateral direction perpendicular to the thickness direction of the filler material layer.

[0038] Further, the number of electronic circuits on the first substrate can be at least 2, for example, in the range of 2 to 50, for example, 2, 4, 9, 16, 25, 30, 36, 40, 45, or 50, or more, for example, up to 500.

[0039] According to a third aspect, there is provided an electrical node comprising a first substrate, such as a printed circuit board or other electronic substrate, optionally a low temperature co-fired ceramic substrate, and an electronic circuit on the first substrate, the electronic circuit comprising a circuit pattern and at least one electronic component connected to the circuit pattern. The electrical node also comprises a filler material layer embedding the electronic circuit, embedding a plurality of electronic circuits, and extending in a lateral direction, preferably perpendicular to a thickness direction of the potting or casting material, along at least 80 percent and / or preferably substantially the entire length of the electrical node in the lateral direction.

[0040] According to a fourth aspect, there is provided a multi-layer structure comprising a second substrate, such as a flexible, optionally thermoformable, and / or plastic, film, or sheet, and an electrical node according to the third aspect described herein above, disposed on, for example attached to, a surface of, the second substrate. The multi-layer structure also comprises a molding material layer, such as an injection molding material layer, on an opposite side of the electrical node to the second substrate, at least partially, if not completely (except for the portion in contact with other elements, for example the second substrate) embedding the electrical node in the molding material layer.

[0041] The multi-layer structure comprises a second circuit pattern on a second substrate, and the electrical node is connected to the second circuit pattern, e.g., via a plurality of contact pads or patterns at least partially on the opposite side of the first substrate of the node to the electronic circuitry thereon.

[0042] Additionally, the second substrate may be a flexible (thermo)plastic film or sheet, preferably having a thickness of up to 1 millimeter.

[0043] In various embodiments, the second substrate can exhibit a non-planar shape, such as at least a local 3D shape that is, for example, concave or convex.

[0044] The present invention provides methods for manufacturing multiple electrical nodes, electrical node modules, electrical nodes, and multi-layer structures. The present invention provides an advantage over known solutions in that each module can have many, even very many, electrical nodes being manufactured and / or processed simultaneously. Prior to singulation or separation, the electrical nodes are moved in large panels where manipulators such as robots exist and are affordable. Existing circuit board manipulation, storage, and handling equipment is entirely suitable. Furthermore, controlling voids in potting or casting materials is much easier than known attempts. Also, circuit board space can be utilized very efficiently, reducing the cost per electrical node.

[0045] Manufacturing methods and processes will dramatically shift to processes and equipment that are widely available and do not require special expertise to use. This means that all processing equipment can be applied as is, without the need for specific picking nozzles, grabbers, or other expensive equipment. This has the potential to significantly reduce costs, and the threshold for adoption is very low.

[0046] Components can be arranged on the substrate however is most convenient or best for electrical performance, and design care does not need to be taken, for example, to always center flat components, because the filler simplifies the geometry for picking.

[0047] Various other advantages will become apparent to those skilled in the art based on the following detailed description.

[0048] The phrase "a number of," as used herein, may refer to any positive integer beginning with one (1), i.e., one, at least one, or more than one.

[0049] The term "a plurality of" may refer to any positive integer beginning with two (2), i.e., two, at least two, or any integer greater than two.

[0050] The terms "first," "second," and "third" are used herein, unless expressly stated otherwise, to distinguish one element from other elements and not to specifically prioritize or order them.

[0051] The exemplary embodiments of the invention presented herein should not be construed as limiting the applicability of the appended claims. The verb "comprises" is used herein as a disclosure limitation that does not exclude the presence of unrecited features. Features recited in dependent claims may be freely combined with each other, unless expressly stated otherwise.

[0052] The novel features which are believed to be characteristic of the invention are set forth with particularity in the appended claims. The invention itself, however, both as to its structure and its method of operation, together with additional objects and advantages thereof, will best be understood from the following description of specific embodiments when read in connection with the accompanying drawings.

[0053] Some embodiments of the present invention are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings. [Brief description of the drawings]

[0054] [Figure 1A] 1 illustrates a schematic diagram of an electrical node module. [Figure 1B] 1 illustrates a schematic diagram of an electrical node module. [Figure 1C] 1 illustrates a schematic diagram of an electrical node module. [Figure 1D] 1 illustrates diagrammatically an electrical node; [Figure 2A] 1 illustrates a schematic diagram of an electrical node module. [Figure 2B] 1 illustrates a schematic diagram of an electrical node module. [Figure 3A] 1 illustrates a schematic diagram of an electrical node module. [Figure 3B] 1 illustrates a schematic diagram of an electrical node module. [Figure 4] 1 illustrates a flow diagram of a method for manufacturing a plurality of electrical nodes. [Diagram 5] 1 illustrates a schematic diagram of a multi-layer structure. [Figure 6A] 1 illustrates several stages in a manufacturing process for a plurality of electrical nodes or an electrical node module. [Figure 6B] 1 illustrates several stages in a manufacturing process for a plurality of electrical nodes or an electrical node module. [Figure 6C] 1 illustrates several stages in a manufacturing process for a plurality of electrical nodes or an electrical node module. [Figure 7A]1 illustrates several stages in a manufacturing process for a plurality of electrical nodes or an electrical node module. [Figure 7B] 1 illustrates several stages in a manufacturing process for a plurality of electrical nodes or an electrical node module. [Figure 7C] 1 illustrates several stages in a manufacturing process for a plurality of electrical nodes or an electrical node module. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0055] Figures 1A-1C generally illustrate an electrical node module 100. Figure 1A shows the electrical node module 100 in a perspective view, Figure 1B shows it in a cross-sectional side view, and Figure 1C shows it from above / below, i.e., perpendicular to Figure 1B.

[0056] The electrical node module 100 may comprise a first substrate 11, a preferred rigid substrate, such as, but not limited to, a printed circuit board or other electronic substrate, optionally a (low temperature) co-fired ceramic substrate. Additionally, the electrical node module 100 may comprise a plurality of electronic circuits on the first substrate 11, each of the electronic circuits comprising a circuit pattern 14 and at least one electronic component 12 connected to the circuit pattern 14. The plurality of electronic circuits may be spaced apart from one another on the first substrate 11, thereby defining blank areas 30 surrounding each of the plurality of electronic circuits, respectively. Additionally, the electrical node module 100 may comprise a filler material layer 16, embedding the plurality of electronic circuits and extending along at least 80 percent and / or preferably substantially the entire length of the electrical node in the lateral direction perpendicular to a thickness direction TH of the filler material layer 16.

[0057] 1A and 1C, for example, nine electrical circuits, and thus ultimately electrical nodes 10, may be disposed on the substrate 11. However, in various embodiments, the number of electronic circuits on the first substrate 11 may be at least 2, for example, in the range of 2-50, for example, 2, 4, 9, 16, 25, 30, 36, 40, 45, or 50, or more, for example, up to 500.

[0058] 1C, after the filler material layer 16 has substantially solidified along the void areas 30, the embedded electronic circuits are separated to provide a plurality of electrical nodes. Separation may be by cutting, such as milling, bypass shear cutting, sawing, stamping, waterjet cutting, laser cutting, or abrasive cutting. Alternatively or additionally, separating may include removing at least portions of the first substrate 11 and the filler material layer 16 at the void areas 30.

[0059] Additionally, there may be optical or mechanical alignment markers on the first substrate 11 based on or through which the separation may take place.

[0060] In some embodiments, the mechanical alignment markers may be alignment pins that fit into equally spaced holes on the edge of the electrical node module 100 (preferably at the center point of each "slice" containing a row of electronic circuitry, although there may be multiple alignment pin hole pairs per slice, and need not be precisely centered, e.g., if the central mass of the electrical node 10 is not in the center), outside of the actual electronic circuitry area (including if there is a barrier or dam element 20 that confines the potting compound / filler). The slices may then be further cut into completed electrical nodes 10, for example, using a grabber or the like that picks up the slice based on the location of the alignment pins and runs it through a saw blade in stages, ultimately dropping the row of separated electrical nodes 10 into a container or the like.

[0061] 1A-1C, the electrical node module 100 may include a barrier or dam element 20 around the number of electronic circuits. The barrier or dam element 20 may be provided prior to or after the provision of the potting or casting material.

[0062] The barrier or dam element 20 can also define individual barrier portions 20B around each of a plurality of electronic circuits or around a set of electronic circuits, respectively, as shown in Figures 3A and 3B. In various embodiments, the barrier or dam element 20 can be provided at least partially on a peripheral portion of the first substrate 11.

[0063] FIG. 1D illustrates generally an electrical node module 10. The electrical node 10 comprises a first substrate 11, such as a printed circuit board or other electronic substrate, optionally a low temperature co-fired ceramic substrate, an electronic circuit on the first substrate 11, the electronic circuit comprising a circuit pattern 14, at least one electronic component 12 connected to the circuit pattern 14, and a filler material layer 16 having a plurality of electronic circuits embedded therein, the filler material layer 16 extending in a lateral direction perpendicular to a thickness direction TH of the filler material layer 16 along at least 80 or 90 percent and / or preferably substantially the entire length of the lateral electrical node. The electrical node 10 of FIG. 1D may, but is not necessarily, such that it may be separated from the electrical node module 100 of FIGS. 1A-1C. Further, the electrical node 10 may include providing, at least partially on the opposite side of the first substrate 11, a plurality of contact pads or patterns 19 corresponding to and in accordance with the number of electronic circuits, the contact pads or patterns 19 being connected to at least corresponding electronic circuits (such as those shown by the dashed lines passing through the first substrate 11 in FIG. 1C).

[0064] Further, in some embodiments, the contact pads or patterns 19 may be disposed at least partially adjacent to the blank area 30, such as less than 2 millimeters from an edge of the blank area 30, such that separation may occur near the contact pads or patterns 19. Thus, in some embodiments, the contact pads or patterns 19 may be disposed on a peripheral portion of the first substrate 11.

[0065] 2A and 2B illustrate generally an electrical node module 100. The electrical node module 100 is substantially similar to that shown in FIGS. 1A and 1B, except that in FIGS. 2A and 2B, the barrier or dam element 20 also defines individual barrier portions 20B around each of the plurality of electronic circuits. The barrier or dam element 20 may be provided at least partially on the periphery of the first substrate 11, but also includes individual barrier portions 20B inside the area defined by the barrier or dam element 20 on the periphery of the substrate 11, i.e., on the outer portion of the barrier or dam element 20.

[0066] 2B, the surface of the filler material layer 16 may or may not extend higher than the upper ends of the individual barrier portions 20B in the direction of the thickness TH of the filler material layer 16. Thus, the filler material layer 16 may be discontinuous at the individual barrier portions 20B if the individual barrier portions 20B extend further than the surface. On the other hand, the filler material layer 16 may be continuous across the module 100 if the surface extends further than the top ends of the individual barrier portions 20B.

[0067] Figures 3A and 3B illustrate generally an electrical node module 100. The electrical node module 100 is substantially similar to that shown in Figures 2A and 2B, however, in Figures 3A and 3B, there are multiple electronic circuits in each of the spaces defined by the barrier or dam elements 20. In the case of Figures 3A and 3B, there are four electronic circuits in each of the spaces, thus ultimately resulting in four electrical nodes 10.

[0068] FIG. 4 illustrates a flow diagram of a method for manufacturing a plurality of electrical nodes 10.

[0069] Step or item 400 refers to the start-up stage of the method, where suitable equipment and components are obtained and the system is assembled and configured for operation.

[0070] Step or item 410 refers to obtaining a plurality of electronic circuits on a first substrate 11, which is preferably a substantially rigid substrate such as a printed circuit board or other electronic substrate, and optionally a low-temperature co-fired ceramic substrate or a FR-4 substrate, or alternatively providing a plurality of electronic circuits onto the first substrate 11, each of the electronic circuits comprising a circuit pattern 14 and at least one electronic component 12 connected to the circuit pattern 14, the electronic circuits being spaced apart from one another on the first substrate 11, thereby defining blank areas 30 surrounding each of the plurality of electronic circuits, respectively.

[0071] Step or item 420 refers to providing a potting or molding material and embedding each of the plurality of electronic circuits in the potting or molding material.

[0072] Step or item 430 refers to solidifying, including optionally curing, the potting or casting material to form a filler material layer of the plurality of electrical nodes.

[0073] In various embodiments, steps 410, 420, and 430 are performed in that order.

[0074] The result is thus an electrical node module 100 containing multiple electrical nodes 10 ready to be singulated or separated.

[0075] In various embodiments, the method may further include, as an optional feature, separating 440 the embedded electronic circuits from one another along the blank areas 30 to provide a plurality of electrical nodes 10 after solidification of the filler material layer. The separating may include cutting, such as milling, bypass shear cutting, sawing, stamping, waterjet cutting, laser cutting, or abrasive cutting. Alternatively or additionally, the separating 440 may include removing at least portions of the first substrate 11 and the filler material layer 16 at the blank areas 30. Still further alternatively or additionally, the separating 440 may include aligning the first substrate 11 based on optical or mechanical alignment markers on the first substrate 11.

[0076] In various embodiments, separating 440 may include only or additionally removing the barrier or dam elements 20, 20B and portions of the first substrate 11 underneath or in contact with the barrier or dam elements 20, 20B.

[0077] In some embodiments, separating 440 may include removing portions of the first substrate 11, barrier or dam elements 20, 20B, and filler material layer 16 that are located at the blank areas 30.

[0078] Execution of the method may be stopped at step or item 499.

[0079] In various preferred embodiments, the method may include providing a barrier or dam element 20 around the plurality of electronic circuits during the provision 420 of the potting or casting material to restrict flow or the like of the potting or casting material. The barrier or dam element may be provided prior to the provision 420 of the potting or casting material. The barrier or dam element 20 may be an initially solid material such as a (plastic) frame, or may be provided with an initially flowable or dispensable material that is subsequently solidified to form the barrier or dam element. Solidification may be performed by hardening. In some embodiments, the initially flowable or dispensable material of the barrier or dam element 20 may be the same as the potting or casting material, but this is not necessarily the case. Alternatively, the barrier or dam element 20 may be provided after the provision 420 of the potting or casting material. These two alternatives are further described in relation to FIGS. 6A-6C and 7A-7C.

[0080] Preferably, in various embodiments, the barrier or dam element 20 is disposed after the electronic circuitry is disposed on the first substrate 11, regardless of whether the potting or molding material is provided before or after the barrier or dam element 20. However, in some embodiments, the barrier or dam element 20 may be disposed before the electronic circuitry or before the at least one electronics component 12.

[0081] In various embodiments, the barrier or dam element 20 may define individual barrier portions 20B around each of the plurality of electronic circuits, respectively. Alternatively or in addition, the barrier or dam element 20 may be provided at least partially on a peripheral portion of the first substrate 11.

[0082] Regarding properties of the potting or casting material, the potting or casting material may have a kinematic viscosity of less than 5000 centipoise, preferably less than 2500 centipoise, at a temperature of about 20 degrees Celsius.

[0083] Alternatively or in addition, the potting or casting material may include at least one of polyurethane, acrylic, polyester, silicone, polysiloxane, epoxy, and copolymers thereof, in some embodiments, the potting or casting material may further include a curing agent, a crosslinking agent, a polymerization catalyst, or a chain extender.

[0084] In terms of materials, some embodiments may use a two-component oligomeric / polymeric resin and reactive hardener material, while other embodiments may use the polymerization of smaller monomers to form the aforementioned polyesters.

[0085] In various embodiments, the two-component potting or casting material can be mixed and then adjusted to cure / crosslink / polymerize over time at room temperature, however, it can alternatively be accelerated with additional heat if deemed necessary.

[0086] In an embodiment, the method may include applying a low pressure, such as a substantial vacuum, onto at least one side of the first substrate 11 including the filler material layer 16 to remove air bubbles from the filler material layer 16 prior to solidification.

[0087] In some embodiments, the method may include applying hot gas to the filler material layer 16 prior to solidifying 430 to collapse any gas bubbles within the filler material layer 16 .

[0088] In various embodiments, the electrical node may be a system-in-package (SiP) module.

[0089] Further, the dimensions of the plurality of electrical nodes 11 in a first lateral direction, and optionally a second perpendicular lateral direction, range from 5 to 25 millimeters, for example, 10, 15, or 20 millimeters. The lateral direction is perpendicular to a thickness direction TH of the filler material layer 16.

[0090] Alternatively or additionally, the thickness of the plurality of electrical nodes 11 in the thickness direction TH is in the range of 1 to 10 or 5 millimeters, preferably in the range of 1.5 to 4 millimeters, and most preferably in the range of 1.8 to 3.5 millimeters.

[0091] Alternatively or in addition, the at least one electronic component 12 may be a surface mount or through-hole device or component.

[0092] In various embodiments, at least one electronic component 12 may be attached in association with the circuit pattern 14 with solder paste and / or adhesives. For example, solder paste and reflow soldering may be used.

[0093] In various embodiments, the method may include providing a plurality of contact pads or patterns 19, at least partially on the opposite side of the first substrate 11, for and in response to a plurality of electronic circuits, the contact pads or patterns 19 being connected to at least corresponding electronic circuits.

[0094] Additionally, the contact pads or patterns 19 may be disposed at least partially adjacent to the blanked area 30, such as less than one or two millimeters from the edge of the blanked area 30. Thus, during singulation or separation 440, the contact pads or patterns 19 may remain in a position close to the edge of the electrical node 10, i.e., its periphery.

[0095] The number of electronic circuits on the first substrate 11 can be at least 2, for example, in the range of 2 to 50, for example, 2, 4, 9, 16, 25, 30, 36, 40, 45, or 50, or more, for example, up to 500.

[0096] The at least one electronic component 12 may be selected from the group consisting of a microcontroller, an integrated circuit, a transistor, a resistor, a capacitor, an inductor, a diode, a photodiode, a light emitting diode, and a semiconductor switch. Other known electronic components may also be utilized.

[0097] Further, the electronic circuitry and / or the remaining multi-layer structure may comprise an electromechanical component, an electro-optical component, a radiation emitting component, a light emitting component, an LED (light emitting diode), an OLED (organic LED), a side shooting LED or other light source, a top shooting LED or other light source, a bottom shooting LED or other light source, a radiation detecting component, a light detecting component or a light sensing component, a photodiode, a phototransistor, a photovoltaic device, a sensor, a micromechanical component, a switch, a touch switch, a touch panel, a proximity switch, a touch sensor, an air sensor, a temperature sensor, a pressure sensor, a humidity sensor, a gas sensor, a proximity sensor, a capacitive switch, a capacitance sensor, a projected capacitance sensor, The device may include at least one component selected from the group consisting of a sensor or switch, a single-electrode capacitance switch or sensor, a capacitance button, a multi-electrode capacitance switch or sensor, a self-capacitance sensor, a mutual capacitance sensor, an inductive sensor, a sensor electrode, a micromechanical component, a UI element, a user input element, a vibration element, a sound generating element, a communication element, a transmitter, a receiver, a transceiver, an antenna, an infrared (IR) receiver or transmitter, a wireless communication element, a wireless tag, a radio tag, a tag reader, a data processing element, a microprocessor, a microcontroller, a digital signal processor, a signal processor, a programmable logic chip, an ASIC (application specific integrated circuit), a data storage element, and an electronic subassembly.

[0098] FIG. 5 illustrates a schematic representation of a multi-layer structure 150. The multi-layer structure 150 may include a second substrate 40, such as a flexible film or sheet. The second substrate 40 may be (thermo)formable. Furthermore, the second substrate 40 may include a substantially electrically insulating material at least on its surface. Thus, a circuit pattern may be provided thereon, such as by printing. The multi-layer structure 150 may also include an electrical node 10 disposed onto the second substrate 40. The electrical node 10 may be as previously described herein. Still further, the multi-layer structure 150 may include a molding material layer 50, such as an injection molding material layer, on an opposite side of the electrical node 10 relative to the second substrate 40, the electrical node 10 being at least partially embedded within the molding material layer 50.

[0099] The multi-layer structure 150 may include a second circuit pattern 42 on a second substrate 40 with the electrical node 10 connected to the second circuit pattern 42 .

[0100] Alternatively or additionally, the second substrate 40 can be a flexible plastic film or sheet, preferably having a thickness of up to 1 millimeter.

[0101] Furthermore, the second substrate 40 may exhibit a non-planar shape, such as, at least locally, a 3D shape, for example, that is concave or convex.

[0102] In various embodiments, the second substrate 40 may be formed, such as by thermoforming, to assume a non-planar shape, at least locally. Forming may be performed prior to disposing the electrical node 10 on the second substrate 40, or alternatively after disposing the electrical node 10 on the second substrate 40. Forming may utilize vacuum forming, heat forming, cold forming, negative pressure forming, high pressure forming, and the like.

[0103] 5, the multi-layer structure 150 may further include a third substrate 60. The third substrate 60, such as a flexible film or sheet of a thermoplastic material, may be disposed on the opposite side of the molding material layer 50 relative to the electrical node 10 and / or the second substrate 40. The third substrate 60 may also be thermoformed prior to or simultaneously with providing the molding material layer 50 between the second substrate 40 and the third substrate 60.

[0104] Structure 150 can be, and will be in many usage scenarios, connected to an external system or device, such as a host device or host arrangement for the structure, which can be implemented by connectors, such as electrical connectors, or connector cables, that can be attached to structure 150 and its elements, such as electrical nodes 10, in a selected manner, such as for communication and / or power supply. Attachment points can be, for example, on the sides or bottom of the structure (e.g., via through holes in second substrate 40).

[0105] In various embodiments, the electronic circuitry and / or conductive elements of the multi-layer structure 150, such as conductive traces, conductors, pads, etc., may comprise at least one material selected from the group consisting of conductive ink, conductive nanoparticle ink, copper, steel, iron, tin, aluminum, silver, gold, platinum, conductive adhesives, carbon fiber, alloys, silver alloys, zinc, brass, titanium, solder, and any components thereof. The conductive material used may be optically opaque, semi-transparent, and / or transparent at least at a desired wavelength, such as a portion of visible light, and thus mask or reflect therefrom, absorb therein, or pass radiation, such as visible light.

[0106] Typically, prefabricated components, including electronic components such as various SMDs, can be attached to the contact areas on the substrate, for example by solder and / or adhesive. For example, light sources (e.g. LEDs) of selected technology and packaging, as well as, for example, different elements of control electronics, communication, sensing, connection (e.g. connectors), hosting (circuit board, carrier, etc.) and / or power supply (e.g. batteries), depending on the embodiment, can be provided herein. Suitable pick-and-place or other mounting devices can, for example, be utilized for that purpose. Alternatively or additionally, printed electronics techniques can be applied to actually manufacture at least a part of the components, such as OLEDs, directly on the substrate, or in particular on a film or sheet.

[0107] In various embodiments, possible additional layers or features in general can be added to the multi-layer structure 150 by molding, lamination, or suitable coating (e.g., deposition) procedures, not forgetting other possible positioning or fastening techniques. The layers can be of protective, instructional and / or aesthetic value (graphics, colors, figures, text, numerical data, etc.), including, for example, textile, leather, or rubber materials, instead of or in addition to further plastics. Additional elements such as electronics, modules, module internal parts or components, and / or optics can be placed and fastened to the outer surface of the structure, for example, to the outer surface of the included film or molded layer, depending on the embodiment. Necessary material shaping / cutting can be performed. For example, a diffuser can be made locally from a laser light conduit material. If a connector is provided, the connector of the multi-layer structure can be connected to a desired external connection element, such as an external device, system or structure, for example, an external connector of a host device. For example, these two connectors together can form a plug-and-socket type connection and interface. The multi-layer structure may also be generally positioned, and in this specification, in embodiments where the multi-layer structure establishes a portion of the exterior or interior of a vehicle, such as a dashboard, and may be attached to a larger ensemble such as a personal communication device, a computer, a home appliance, an industrial device, or an electronic device, such as, for example, a vehicle.

[0108] 6A-6C illustrate several stages in the manufacturing process of a plurality of electrical nodes or electrical node modules 100. FIG. 6A shows providing a plurality of electronic circuits on a first substrate 11, preferably a substantially rigid substrate such as a printed circuit board or other electronic substrate, optionally a low temperature co-fired ceramic substrate or a FR-4 substrate, each of the electronic circuits comprising a circuit pattern 14 and at least one electronic component 12 connected to the circuit pattern 14, each electronic circuit being spaced apart from one another on the first substrate 11, thereby defining a blank area 30 surrounding each of the plurality of electronic circuits, respectively, as described. In some embodiments, the first substrate 11 may be obtained as a prefabricated assembly comprising the plurality of electronic circuits and the blank area 30 thereon.

[0109] 6B illustrates providing a barrier or dam element 20 around a number of electronic circuits to restrict the flow of the potting or casting material, e.g., during the application of the potting or casting material. The barrier or dam element is provided prior to the application of the potting or casting material.

[0110] 6C illustrates providing a potting or molding material for embedding each of the plurality of electronic circuits in the potting or molding material. The potting or molding material may then be solidified, including optionally cured, to form the filler material layer 16 of the plurality of electrical nodes 11. Finally, there may be a step of separating the electrical nodes 10 that remains to be performed.

[0111] 7A-7C illustrate several stages in the manufacturing process of a plurality of electrical nodes or electrical node modules 100. FIG. 7A shows providing a plurality of electronic circuits on a first substrate 11, preferably a substantially rigid substrate such as a printed circuit board or other electronic substrate, optionally a low temperature co-fired ceramic substrate or a FR-4 substrate, each of the electronic circuits comprising a circuit pattern 14 and at least one electronic component 12 connected to the circuit pattern 14, the electronic circuits being spaced apart from one another on the first substrate 11, thereby defining blank areas 30 surrounding each of the plurality of electronic circuits, respectively, as described. In some embodiments, the first substrate 11 may be obtained as a prefabricated assembly comprising the plurality of electronic circuits and blank areas 30 thereon.

[0112] FIG. 7B illustrates providing a potting or molding material for embedding each of a plurality of electronic circuits in the potting or molding material.

[0113] 7C illustrates providing a barrier or dam element 20 around the plurality of electronic circuits. The barrier or dam element 20 may be provided after providing a potting or casting material to form the filler material layer 16 of the plurality of electrical nodes 11.

[0114] In various embodiments, the barrier or dam element 20 may be provided after the provision of the potting or casting material layer by at least partially pressing the roller or mold 70 into the unsolidified potting or casting material such that the surface of the potting or casting material is lowered in such portions. Thus, the barrier or dam element 20 may be formed in the thinner portions where the separation step is performed. However, this does not have to be done in all blank areas, only some of them. In various embodiments, the roller or mold 70 may be preferably shaped to correspond to the shape of at least a portion of the blank areas 30 on the first substrate 11.

[0115] In some embodiments, the rollers or molds 70 or some other elements that may be used to press into the potting or casting material may be heated before being pressed into the potting or casting material. The heating provides a hardening effect at least in the portions that contact the potting or casting material. Thus, the electrical nodes 10 may be more quickly separated from one another because the potting or casting material has been substantially solidified in the portions where separation occurs, even though other portions may not have solidified, at least not completely.

[0116] The scope of the present invention is determined by the appended claims together with their equivalents. Those skilled in the art will appreciate that the disclosed embodiments have been constructed for illustrative purposes only, and that other configurations applying many of the principles described above can be readily prepared to best suit each potential usage scenario.

Claims

1. A method for manufacturing a plurality of electrical nodes (10), comprising: obtaining or providing (410) on or onto a first substrate (11), respectively, a plurality of electronic circuits, each of the electronic circuits comprising a circuit pattern (14) and at least one electronic component (12) connected to the circuit pattern (14), the electronic circuits being spaced apart from one another on the first substrate (11), thereby defining a blank area (30) surrounding each of the plurality of electronic circuits, respectively; providing a potting or molding material and embedding each of the plurality of electronic circuits in the potting or molding material (420); and thereafter and solidifying (430) the potting or casting material to form a filler material layer (16) of the plurality of electrical nodes (10).

2. 10. The method of claim 1, further comprising providing a barrier or dam element (20, 20B) around the plurality of electronic circuits to confine the potting or molding material during the application of the potting or molding material.

3. The method of claim 2 , wherein the barrier or dam element (20, 20B) is provided prior to providing the potting or casting material (420).

4. The method of claim 2, wherein the barrier or dam element (20, 20B) is provided after providing the potting or casting material (420).

5. The method of any one of claims 2 to 4, wherein the barrier or dam elements (20, 20B) each define an individual barrier portion (20B) around each of the plurality of electronic circuits.

6. The method according to any one of claims 2 to 4, wherein the barrier or dam element (20, 20B) is provided at least partly on a peripheral portion of the first substrate (11).

7. The method of any one of claims 1 to 4, wherein the potting or casting material has a kinematic viscosity of less than 5000 centipoise, or less than 2500 centipoise at a temperature of about 20 degrees Celsius.

8. The method of any one of claims 1 to 4, wherein the potting or casting material comprises at least one of polyurethane, acrylic, polyester, silicone, polysiloxane, epoxy, and copolymers thereof.

9. The method of claim 8 , wherein the potting or casting material comprises a curing agent, a cross-linking agent, a polymerization catalyst, or a chain extender.

10. 5. The method according to any one of claims 1 to 4, comprising applying low pressure onto at least one side of the first substrate (11) including the filler material layer (16) before the solidification to remove air bubbles from the filler material layer (16).

11. 5. The method of claim 1, further comprising, after the solidification of the filler material layer, separating the embedded electronic circuits from one another along the blank areas to provide the electrical nodes.

12. The method of claim 11 , wherein the separating (440) comprises milling, cutting, bypass shear cutting, sawing, stamping, water jet cutting, laser cutting, or abrasive cutting.

13. 12. The method of claim 11, wherein the separating (440) comprises removing at least portions of the first substrate (11) and the filler material layer (16) at the locations of the blank areas (30).

14. 12. The method of claim 11, wherein the separating (440) comprises aligning the first substrate (11) based on optical (22) or mechanical alignment markers on the first substrate (11).

15. The method of any one of claims 1 to 4, wherein the electrical node (10) is a System-in-Package (SiP) module.

16. The method of any one of claims 1 to 4, wherein the dimensions of said plurality of electrical nodes (10) in a first lateral direction, and optionally in a second perpendicular lateral direction, are in the range of 5 to 25 millimeters.

17. 5. The method of claim 1, wherein the thickness of the plurality of electrical nodes in a thickness direction is in the range of 1 to 10 or 5 millimeters, in the range of 1.5 to 4 millimeters, or in the range of 1.8 to 3.5 millimeters.

18. The method of any one of claims 1 to 4, wherein the at least one electronic component (12) is a surface mount or through-hole device or component.

19. The method according to any one of claims 1 to 4, wherein the at least one electronic component is connected and attached to the circuit pattern using solder paste and / or multiple adhesives.

20. 5. The method according to claim 1, further comprising providing a plurality of contact pads or patterns (19) at least partially on the opposite side of the first substrate (11) corresponding to and corresponding to said plurality of electronic circuits, said contact pads or patterns (19) being connected to at least said corresponding electronic circuits.

21. 21. The method of claim 20, wherein the plurality of contact pads or patterns (19) are disposed at least partially adjacent to the blank area (30).

22. The method according to any one of claims 1 to 4, wherein the number of electronic circuits on the first substrate (11) is at least two.

23. The at least one electronic component (12) may be a microcontroller, an integrated circuit, a transistor, a resistor, a capacitor, an inductor, a diode, a photodiode, a light emitting diode, a semiconductor switch, an electronic component, an electromechanical component, an electro-optical component, a radiation emitting component, a light emitting component, an OLED (organic LED), a side shooting LED or other light source, a top shooting LED or other light source, a bottom shooting LED or other light source, a radiation detecting component, a light detecting or light sensing component, a photodiode, a phototransistor, a photovoltaic device, a sensor, a micromechanical component, a switch, a touch switch, a touch panel, a proximity switch, a touch sensor, an air sensor, a temperature sensor, a pressure sensor, a humidity sensor , a gas sensor, a proximity sensor, a capacitance switch, a capacitance sensor, a projected capacitance sensor or switch, a single-electrode capacitance switch or sensor, a capacitance button, a multi-electrode capacitance switch or sensor, a self-capacitance sensor, a mutual capacitance sensor, an inductive sensor, a sensor electrode, a micromechanical component, a UI element, a user input element, a vibration element, a sound generating element, a communication element, a transmitter, a receiver, a transceiver, an antenna, an infrared (IR) receiver or transmitter, a wireless communication element, a wireless tag, a radio frequency tag, a tag reader, a data processing element, a microprocessor, a microcontroller, a digital signal processor, a signal processor, a programmable logic chip, an ASIC (application specific integrated circuit), a data storage element, and an electronic subassembly.

24. An electrical node module (100), comprising: A first substrate (11); a plurality of electronic circuits on the first substrate (11), each of the electronic circuits comprising a circuit pattern (14) and at least one electronic component (12) connected to the circuit pattern (14), the plurality of electronic circuits being spaced apart from one another on the first substrate (11), thereby defining blank areas (30) surrounding each of the plurality of electronic circuits; a filler material layer (16) in which the plurality of electronic circuits are embedded and which extends along at least 80 percent of the total length of the electrical node (10) in a lateral direction perpendicular to a thickness direction (TH) of the filler material layer (16).

25. 25. The electrical node module of claim 24, wherein the number of electronic circuits on the first substrate (11) is at least two.

26. An electrical node (10), comprising: A first substrate (11); an electronic circuit on the first substrate (11), the electronic circuit comprising a circuit pattern (14) and at least one electronic component (12) connected to the circuit pattern (14); a filler material layer (16) that embeds the electronic circuit, embeds the plurality of electronic circuits, and extends along at least 80 percent of the total length of the electrical node (10) in a lateral direction perpendicular to a thickness direction (TH) of the filler material layer (16).

27. A multi-layer structure (150) comprising: a second substrate (40); an electrical node (10) disposed on the second substrate (40), A first substrate (11); an electronic circuit on the first substrate (11), the electronic circuit comprising a circuit pattern (14) and at least one electronic component (12) connected to the circuit pattern (14); an electrical node (10) comprising: a filler material layer (16) in which the electronic circuit is embedded, the filler material layer (16) embedding the plurality of electronic circuits and extending in a lateral direction perpendicular to a thickness direction (TH) of the filler material layer (16) along at least 80 percent of the total length of the electrical node (10) in the lateral direction; a molding material layer (50), such as an injection molding material layer, on an opposite side of the second substrate (40) from the electrical node (10), the electrical node (10) being at least partially embedded within the molding material layer (50).

28. 28. The multilayer structure of claim 27, comprising a second circuit pattern (42) on said second substrate (40), said electrical node (10) being connected to said second circuit pattern (42).

29. 29. A multilayer structure according to claim 27 or 28, wherein the second substrate (40) is a flexible plastic film or sheet.

30. 29. The multilayer structure of claim 27 or 28, wherein the second substrate (40) exhibits a non-planar shape.

Images