Overmolded structure in glass

Abstract

An arrangement of one or more electronic devices in or on a photosensitive glass substrate includes a photosensitive glass substrate, one or more electronic devices disposed in or on the photosensitive glass substrate, one or more overmold openings in the photosensitive glass substrate, and a layer of overmold material filling the one or more overmold openings and covering at least a portion of the one or more electronic devices.

Description

[Technical field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to U.S. Provisional Patent Application No. 63 / 321,421, filed March 18, 2022, the entire contents of which are incorporated herein by reference.

[0002] STATEMENT OF FEDERALLY FUNDED RESEARCH none

[0003] The present invention relates to methods and associated apparatus for encapsulating components, and more particularly, to overmolding electronic devices onto glass substrates. [Background technology]

[0004] Without limiting the scope of the invention, its background is described in terms of RF and electronic circuits.

[0005] Driven by wearable devices, small form factor devices, device-to-device communication, RF communication, and many other applications, there is an increasing demand for overmolded electronics packages. Overmolding packaging techniques provide enhanced mechanical strength, reduced electrostatic discharge (ESD) damage, reduced packaging size, and protection against humidity, dust, dirt, and vibration. Overmolding also seals connectors, overmolded grommets (also referred to herein as "overmolding openings"), and strain reliefs. The main reason for overmolding openings is to enhance the adhesion of the overmolding material to the substrate. Overmolding techniques can therefore protect integrated circuit dies, passive electronic components, or systems-in-a-packages (SiPs), etc.

[0006] Overmolding can be performed by a variety of methods and materials to encapsulate the RF and electronic circuitry. These methods and materials include low-pressure molding (LPM) and liquid silicone rubber (LSR) molding processes. LPM processes can include either polyamide or polyolefin (hot melt) materials and are typically used to encapsulate and environmentally protect electronic components. Liquid silicone rubber (LSR) injection molding is typically used to mass produce flexible, durable parts. Overmolding encapsulation is used on several substrates, including printed circuit boards (PCBs), silicon, sapphire, and other materials.

[0007] LSR is a cured silicone-based resin with low compression set, high stability, and resistance to extreme temperatures. LSR is ideally suited for producing parts where high quality is a must. Thermoset liquid silicone injection molding requires intensive distributive mixing at low temperatures before being extruded into a heated cavity. Materials that flow easily at elevated temperatures and harden at low temperatures are called thermoplastics.

[0008] LPM materials used in overmolding for electronics include a group of amorphous thermoplastic polyamides because they have a processing temperature range of 180-240°C and a viscosity of approximately 3,000 centipoise. Polyamides have two suitable characteristics for electronics molding. The first is their adhesive properties. Polyamides are high performance hot melt materials that mechanically bond to the substrate. Mechanical adhesion means that there is no chemical reaction with the substrate. To promote the necessary adhesion, overmolding openings have been used to anchor the overmolding material to the substrate. These overmolding openings are created by etching or milling mold holes, vias, trenches, or other structures into the substrate so that the molding material flows into the opening. The molding material then solidifies around the electronic components, traces, bond pads, or adhesive structures. Overmolding openings typically fill in a few seconds, while a typical full molding cycle lasts 20-45 seconds. Some solutions for creating openings in overmolded packages include laser cutting and mechanical drilling. These solutions can be expanded by using molding enclosures (e.g., mold chases) that create surface voids (e.g., edge chamfers) or removable inserts. Some components may require precise opening tolerances, such as openings over optical sensors. It is highly desirable to improve and expand the use of overmolded electronics packaging in consumer electronics while reducing the difficulties in their overmolding process. Unfortunately, current technology processes for mechanical bonding have not been transferable to glass substrates because the bond between the glass and the overmolding material is not sufficient to withstand handling and packaging. Summary of the Invention

[0009] In one embodiment, the present invention includes a method for overmolding one or more electronic devices in or on a photosensitive glass substrate, the method includes providing a photosensitive glass substrate including one or more electronic devices, forming one or more overmold openings in the photosensitive glass substrate, and applying an overmold material to fill the one or more overmold openings and cover at least a portion of the one or more electronic devices. In one aspect, the photosensitive glass substrate includes silica, lithium oxide, aluminum oxide, and cerium oxide. In another aspect, the method includes masking a design layout including one or more overmold structures to form one or more overmold openings, exposing at least a portion of the photosensitive glass substrate to an active energy source, heating the photosensitive glass substrate above its glass transition temperature for at least 10 minutes, and cooling the photosensitive glass substrate to convert at least a portion of the exposed glass into a crystalline material to form a glass crystalline substrate. In another aspect, forming the one or more overmold openings is performed by etching the glass crystal structure with an etchant. In another aspect, an anisotropic etch ratio between the exposed and unexposed portions is at least 30:1. In another aspect, each of the one or more overmold openings includes a top opening and an interior, and at least a portion of the interior is wider than the top opening. In another aspect, the overmold material includes a liquid silicone rubber, a polyolefin, or an amorphous thermoplastic polyamide. In another aspect, applying the overmold material is performed using a low pressure molding process or a liquid silicone rubber process to achieve flow and formation of the overmold. In another aspect, each overmold opening is a blind opening or a through opening.In another embodiment, the one or more electronic devices include an integrated circuit die; one or more passive electronic components; one or more lumped circuit elements including resistors, inductors, or capacitors; or a system in package.

[0010] Another embodiment includes an apparatus of one or more electronic devices in or on a photosensitive glass substrate, the apparatus including a photosensitive glass substrate, one or more electronic devices disposed in or on the photosensitive glass substrate, one or more overmold openings in the photosensitive glass substrate, and a layer of overmold material filling the one or more overmold openings and covering at least a portion of the one or more electronic devices. In one aspect, each of the one or more overmold openings includes a top opening and an interior, at least a portion of the interior being wider than the top opening. In another aspect, the photosensitive glass substrate includes silica, lithium oxide, aluminum oxide, and cerium oxide. In another aspect, the overmold material includes liquid silicone rubber, polyolefin, or amorphous thermoplastic polyamide. In another aspect, the step of applying the overmold material is performed using a low pressure molding process or a liquid silicone rubber process. In another aspect, the one or more overmold openings are formed by masking a design layout including one or more overmold structures to form one or more overmold openings, exposing at least a portion of the photosensitive glass substrate to an active energy source, heating the photosensitive glass substrate above its glass transition temperature for at least 10 minutes, and cooling the photosensitive glass substrate to convert at least a portion of the exposed glass to a crystalline material to form a glass crystalline substrate. In another aspect, forming the one or more overmold openings is performed by etching the glass crystalline structures with an etchant. In another aspect, the anisotropic etch ratio of the exposed portion to the unexposed portion is at least 30:1. In another aspect, each overmold opening is a blind opening or a through opening. In another aspect, the one or more electronic devices include an integrated circuit die; one or more passive electronic components including a resistor, an inductor, or a capacitor; one or more lumped circuit elements including a resistor, an inductor, or a capacitor; or a system in package.

[0011] Another embodiment includes an apparatus of one or more electronic devices in or on a photosensitive glass substrate, the apparatus including a photosensitive glass substrate, one or more electronic devices disposed in or on the photosensitive glass substrate, one or more overmold openings in the photosensitive glass substrate, and a layer of overmold material filling the one or more overmold openings and covering at least a portion of the one or more electronic devices, the apparatus being made by a method including the steps of masking a design layout including one or more overmold structures to form one or more overmold openings, exposing at least a portion of the photosensitive glass substrate to an active energy source, heating the photosensitive glass substrate above its glass transition temperature for at least 10 minutes, and cooling the photosensitive glass substrate to convert at least a portion of the exposed glass into a crystalline material to form a glass crystalline substrate. In one aspect, the step of applying the overmold material is carried out using a low pressure molding process or a liquid silicone rubber process. In another aspect, the step of forming the one or more overmold openings is performed by etching the glass crystal structure with an etchant. In another aspect, the anisotropic etching ratio of the exposed portions to the unexposed portions is at least 30:1. [Brief description of the drawings]

[0012] For a more complete understanding of the features and advantages of the present invention, reference is now made to the detailed description of the invention taken in conjunction with the accompanying drawings. [Figure 1] FIG. 1 illustrates a cross section with an exemplary overmolded opening in a photosensitive glass substrate. [Diagram 2] FIG. 1 illustrates an overmolded system in package (SiP). [Diagram 3] FIG. 1 illustrates a cross section of an overmolded opening in a copper metallized substrate. [Figure 4]FIG. 1 illustrates a cross section of a photosensitive glass substrate with a surface mounted electronic device and filled blind and through-hole overmold openings. [Diagram 5] FIG. 2 illustrates a cross section of a surface mount wire bond die covered with an overmold layer secured by a filled overmold opening. [Figure 6] FIG. 13 is a top view of a SiP with overmold openings at the four corners. [Figure 7] 1 is a flow chart of a method embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] The making and using of various embodiments of the invention are discussed in detail below, with the understanding that the invention provides many applicable inventive concepts that can be embodied in a variety of specific contexts. The specific embodiments discussed herein are merely illustrative of specific ways to make and use the invention and do not delimit the scope of the invention.

[0014] The device of the present invention can be used for devices and arrays in glass ceramic substrates for electronics, microwave, radio frequency in general. The present invention creates cost-effective glass ceramic inductive individual or array devices. Using glass ceramic substrates, it is possible to form inductive individual or array devices through both vertical and horizontal plane processing, either separately or simultaneously. Using glass ceramic substrate circulator / isolator devices can be fabricated and used in various telecommunications and other platforms. The novel circulator / isolator glass ceramic devices can be fabricated as standalone devices for adding to other devices, directly integrated into substrates, and then connected to other electronic components using vias, wires, or ball bonding, etc.

[0015] In one embodiment, the present invention is an RF circulator / isolator built for integrated passive devices (IPDs) with reduced size versus currently available options. The present invention can be done by core material optimization in the test vehicle. The test vehicle can include one or more types of glass, for example, obtained from 3DGS, USA, with methods and parts made and designed as described herein and improved by core filling. First, a standard cavity depth is used to ensure consistent measurements. Next, components to be formed, added, or connected to form a circuit are connected to the circulator / isolator and then evaluated as the test proceeds and the specific volume is required for accurate calculation.

[0016] Overmolded devices can be incorporated in, on, or around glass-ceramics (APEX® glass-ceramics) as a novel packaging and substrate material for semiconductors, RF electronics, microwave electronics, and optical imaging devices. APEX® glass-ceramics are processed using first generation semiconductor equipment in a simple three-step process, and the final material can be either glass, ceramic, or a material containing regions of both glass and ceramic. APEX® glass-ceramics have several advantages over current materials, including easily fabricated high density vias, demonstrated microfluidic capabilities, microlens or microlens array capabilities, high Young's modulus for more rigid packaging, halogen-free manufacturing, and economical manufacturing. Photosensitive glasses have several advantages for the fabrication of various microsystem components. Microstructures have been produced relatively inexpensively with these glasses using conventional semiconductor processing equipment. In general, glasses have high temperature stability, good mechanical and electrical properties, and better chemical resistance than plastics and many metals. One example of a glass-ceramic, for example, includes 75-85 weight percent silicon oxide (SiO2), 7-11 weight percent lithium oxide (Li2O), 3-6 weight percent aluminum oxide (Al2O3), 1-2 weight percent sodium oxide (Na2O), 0.2-0.5 weight percent diantimony trioxide (Sb2O3) or arsenic oxide (As2O3), 0.05-0.15 weight percent silver oxide (Ag2O), and 0.01-0.04 weight percent cerium oxide (CeO2). As used herein, the terms "APEX® glass-ceramic," "APEX® glass," or simply "APEX®" are used to refer to one embodiment of a glass-ceramic composition for making a device with one or more electronic devices on or in a photosensitive glass substrate having blind or through overmold openings etched or machined into the photosensitive glass substrate, where the electronic circuitry and overmold openings are filled by use of standard overmold materials and processes.

[0017] Any exposed portions of the photosensitive glass substrate in the form of the overmolded aperture structures are converted to a crystalline material by heating the glass substrate to a temperature near its glass transition temperature. When etching the glass substrate in an etchant such as hydrofluoric (HF) acid, the anisotropic etch ratio of exposed to unexposed portions is at least 30:1 when the glass is exposed to a broad spectrum mid-ultraviolet (approximately 308-312 nm) flood lamp. The exposed glass is then baked, typically in a two-step process. First, the exposed glass is heated to 420°C-520°C for 10 minutes-2 hours to associate the silver ions with the silver nanoparticles, and second, the exposed glass is heated to 520°C-620°C for 10 minutes-2 hours to form lithium oxide around the silver nanoparticles. The glass plate is then etched. The glass substrate is etched in an etchant, typically a 5% to 10% by volume solution of HF, with an etch ratio of the exposed portion to the unexposed portion of at least 30:1, thus delineating one or more overmold openings, which are then filled using standard overmold processes and materials.

[0018] FIG. 1 illustrates a cross-section of an embodiment with an exemplary overmolded opening in a photosensitive glass substrate. The apparatus 100 has one or more electronic devices 105 disposed in or on a photosensitive glass substrate 110. An exemplary overmolded opening 115 is present in the photosensitive glass substrate 110. A layer of overmolded material 120 fills the overmolded opening 115 and covers at least a portion of each of the electronic devices 105. In one aspect of the embodiment, the overmolded opening 115 includes a top opening and an interior, and at least a portion of the interior of the overmolded opening 115 is wider than the top opening of the overmolded opening 115. In another aspect, the photosensitive glass substrate 110 includes silica, lithium oxide, aluminum oxide, and cerium oxide. In another aspect, the overmolded material 120 includes a liquid silicone rubber, a polyolefin, or an amorphous thermoplastic polyamide. In another aspect, the overmolded material is implemented using a low pressure molding process or a liquid silicone rubber process. In another aspect, the one or more overmold openings are formed by masking a design layout including one or more overmold structures to form one or more overmold openings, exposing at least a portion of a photosensitive glass substrate to an active energy source, heating the photosensitive glass substrate above its glass transition temperature for at least 10 minutes, and cooling the photosensitive glass substrate to convert at least a portion of the exposed glass to a crystalline material to form a glass crystalline substrate. In another aspect, forming the overmold openings 115 is performed by etching the glass crystalline structures with an etchant. In another aspect, the anisotropic etch ratio of the exposed portion to the unexposed portion is at least 30:1. In another aspect, the one or more electronic devices 105 include an integrated circuit die; one or more passive electronic components including a resistor, an inductor, or a capacitor; one or more lumped circuit elements including a resistor, an inductor, or a capacitor; or a system in package.

[0019] 2 shows an overmolded system in package (SiP). SiP 200 is shown with an overmolded layer 205 (not shown).

[0020] 3 shows a cross section of an overmold opening in a copper metallized substrate. Apparatus 300 is shown with an integrated circuit die 305 on a copper metallized substrate 310. Overmold material 315 covers integrated circuit die 305 and fills overmold opening 320 that has etched locking features 325, an interior portion of overmold opening 320 that is wider than the top opening of overmold opening 320 and serves to lock the overmold material to copper metallized substrate 310.

[0021] FIG. 4 shows a cross-section of an apparatus 400 with one or more surface mounted electronic devices 410 and a photosensitive glass substrate 405 with filled blind and through overmolded openings 415a,b.

[0022] FIG. 5 shows a cross section of a device 500 with a surface mount wirebond integrated circuit die 505 on a copper lead frame 510 and covered by a layer of overmold material 515 secured by a filled overmold opening 520 .

[0023] 6 shows a top view of a SiP with overmolded openings at the four corners. SiP 600 has overmolded opening 605.

[0024] FIG. 7 illustrates a method embodiment of the present invention. Method 700 begins at block 705 with providing a photosensitive glass substrate including one or more electronic devices. This is followed by block 710, which includes forming one or more overmold openings in the photosensitive glass substrate. Applying an overmold material to fill the one or more overmold openings and to cover at least a portion of the one or more electronic devices is illustrated in block 715. One aspect of the embodiment further includes masking the design layout including one or more overmold structures to form one or more overmold openings, illustrated in block 720, exposing at least a portion of the photosensitive glass substrate to an active energy source, illustrated in block 725, heating the photosensitive glass substrate above its glass transition temperature for at least 10 minutes, illustrated in block 730, and cooling the photosensitive glass substrate to convert at least a portion of the exposed glass into a crystalline material to form a glass crystalline substrate, illustrated in block 735. Another aspect of the embodiment includes forming one or more overmold openings by etching the glass crystal structure with an etchant, as shown in block 740.

[0025] In one embodiment, the invention includes a method for overmolding one or more electronic devices in or on a photosensitive glass substrate, the method consisting essentially of or consisting of the steps of providing a photosensitive glass substrate including one or more electronic devices, forming one or more overmold openings in the photosensitive glass substrate, and applying an overmold material to fill the one or more overmold openings and cover at least a portion of the one or more electronic devices. In one aspect, the photosensitive glass substrate includes silica, lithium oxide, aluminum oxide, and cerium oxide. In another aspect, the method further includes masking a design layout including one or more overmold structures to form one or more overmold openings, exposing at least a portion of the photosensitive glass substrate to an active energy source, heating the photosensitive glass substrate above its glass transition temperature for at least 10 minutes, and cooling the photosensitive glass substrate to convert at least a portion of the exposed glass into a crystalline material to form a glass crystalline substrate. In another aspect, forming the one or more overmolded openings is performed by etching the glass crystal structure with an etchant. In another aspect, the anisotropic etching ratio between the exposed and unexposed portions is at least 30:1. In another aspect, each of the one or more overmolded openings includes a top opening and an interior, and at least a portion of the interior is wider than the top opening. In another aspect, the overmolded material includes a liquid silicone rubber, a polyolefin, or an amorphous thermoplastic polyamide. In another aspect, applying the overmolded material is performed using a low pressure molding process or a liquid silicone rubber process. In another aspect, each overmolded opening is a blind opening or a through opening. In another aspect, the one or more electronic devices include an integrated circuit die; one or more passive electronic components including resistors, inductors, or capacitors; one or more lumped circuit elements including resistors, inductors, or capacitors; or a system in package.

[0026] In another embodiment, the invention includes an apparatus of one or more electronic devices in or on a photosensitive glass substrate, the apparatus consisting essentially of or consisting of a photosensitive glass substrate, one or more electronic devices disposed in or on the photosensitive glass substrate, one or more overmold openings in the photosensitive glass substrate, and a layer of overmold material filling the one or more overmold openings and covering at least a portion of the one or more electronic devices. In one aspect, the one or more overmold openings each include a top opening and an interior, at least a portion of the interior being wider than the top opening. In another aspect, the photosensitive glass substrate includes silica, lithium oxide, aluminum oxide, and cerium oxide. In another aspect, the overmold material includes liquid silicone rubber, polyolefin, or amorphous thermoplastic polyamide. In another aspect, the step of applying the overmold material is performed using a low pressure molding process or a liquid silicone rubber process. In another aspect, the one or more overmold openings are formed by masking a design layout including one or more overmold structures to form one or more overmold openings, exposing at least a portion of the photosensitive glass substrate to an active energy source, heating the photosensitive glass substrate above its glass transition temperature for at least 10 minutes, and cooling the photosensitive glass substrate to convert at least a portion of the exposed glass to a crystalline material to form a glass crystalline substrate. In another aspect, forming the one or more overmold openings is performed by etching the glass crystalline structures with an etchant. In another aspect, the anisotropic etch ratio of the exposed portion to the unexposed portion is at least 30:1. In another aspect, each overmold opening is a blind opening or a through opening. In another aspect, the one or more electronic devices include an integrated circuit die; one or more passive electronic components including a resistor, an inductor, or a capacitor; one or more lumped circuit elements including a resistor, an inductor, or a capacitor; or a system in package.

[0027] In another embodiment, the invention includes an apparatus of one or more electronic devices in or on a photosensitive glass substrate, the apparatus comprising a photosensitive glass substrate, one or more electronic devices disposed in or on the photosensitive glass substrate, one or more overmold openings in the photosensitive glass substrate, and a layer of overmold material filling the one or more overmold openings and covering at least a portion of the one or more electronic devices, the apparatus being made by a method consisting essentially of or consisting of the steps of masking a design layout including one or more overmold structures to form one or more overmold openings, exposing at least a portion of the photosensitive glass substrate to an active energy source, heating the photosensitive glass substrate above its glass transition temperature for at least 10 minutes, and cooling the photosensitive glass substrate to convert at least a portion of the exposed glass into a crystalline material to form a glass crystalline substrate. In one aspect, the step of applying the overmold material is carried out using a low pressure molding process or a liquid silicone rubber process. In another aspect, the step of forming the one or more overmold openings is performed by etching the glass crystal structure with an etchant. In another aspect, the anisotropic etching ratio of the exposed portions to the unexposed portions is at least 30:1.

[0028] It should be understood that the specific embodiments described herein are shown for purposes of illustration and not as limitations of the invention. The principal features of this invention can be employed in various embodiments without departing from the scope of the invention. Those skilled in the art will recognize, or be able to ascertain using no more than routine experimentation, numerous equivalents to the specific procedures described herein. Such equivalents are considered to be within the scope of the invention and are covered by the claims.

[0029] All publications and patent applications mentioned in this specification are indicative of the level of skill of those skilled in the art to which this invention pertains. All publications and patent applications are herein incorporated by reference to the same extent as if each individual publication or patent application was specifically and individually indicated to be incorporated by reference.

[0030] The use of the word "a" or "an" when used in conjunction with the term "comprising" in the claims and / or specification can mean "one," but is also consistent with the meanings of "one or more," "at least one," and "one or more than one." The use of the term "or" in the claims is used to mean "and / or" unless expressly indicated to refer to alternatives only or that the alternatives are mutually exclusive, but the present disclosure supports a definition that refers to alternatives only and "and / or." Throughout this application, the term "about" is used to indicate that a value includes the inherent variation of device error and the method is used to determine the value or the variation that exists among the study subjects.

[0031] As used in the specification and claims, the words "comprising" (and any form of comprising, such as "comprise" and "comprises"), "having" (and any form of having, such as "have" and "has"), "including" (and any form of including, such as "includes" and "include"), or "containing" (and any form of containing, such as "contains" and "contain") are inclusive or open-ended and do not exclude additional, unrecited elements or method steps. In any embodiment of the compositions and methods provided herein, "comprising" may be interchanged with "consisting essentially of" or "consisting of." As used herein, the phrase "consisting essentially of" requires certain integers or steps, and those that do not materially affect the features or function of the claimed invention. As used herein, the term "consisting" is used to indicate the presence of only a listed integer (e.g., feature, element, property, property, method / process step, or limitation) or group of integers (e.g., feature, element, property, property, method / process step, or limitation).

[0032] The term "or combinations thereof" as used herein refers to all permutations and combinations of the recited items preceding the term. For example, "A, B, C, or combinations thereof" is intended to include at least one of A, B, C, AB, AC, BC, or ABC, and also BA, CA, CB, CBA, BCA, ACB, BAC, or CAB, if order is important in the particular context. Continuing with this example, expressly included are combinations that include one or more repeats of an item or term, such as BB, AAA, AB, BBC, AAABCCCC, CBBAAA, CABABB, etc. Those skilled in the art will understand that there is typically no limitation on the number of items or terms in any combination, unless otherwise apparent from the context.

[0033] As used herein, without limitation, approximation words such as "about", "effectively", or "substantially" refer to a state that is understood not necessarily to be absolute or perfect when so modified, but is considered close enough to warrant a person skilled in the art specifying the state as existing. The extent to which the description may vary depends on how large a change may occur, and still allow a person skilled in the art to recognize the modified feature as still having the required properties and capabilities of the unmodified feature. In general, however, subject to the influence of the preceding discussion, numerical values ​​in this specification modified by approximation words such as "about" may vary from the stated value by at least ±1, 2, 3, 4, 5, 6, 7, 10, 12, or 15%.

[0034] All of the compositions and / or methods disclosed and claimed herein can be made and executed without undue experimentation in light of the present disclosure. Although the compositions and methods of the present invention have been described in terms of preferred embodiments, it will be apparent to those skilled in the art that variations may be applied to the compositions and / or methods, and in the steps or in the sequence of steps of the methods described herein, without departing from the concept, spirit and scope of the invention. All such similar substitutes and modifications apparent to those skilled in the art are deemed to be within the spirit, scope and concept of the invention as defined by the appended claims.

Claims

1. 1. A method for overmolding one or more electronic devices in or onto a photosensitive glass substrate, comprising: providing the photosensitive glass substrate containing the one or more electronic devices; forming one or more overmold openings in the photosensitive glass substrate; and applying an overmold material to fill the one or more overmold openings and to cover at least a portion of the one or more electronic devices.

2. The method of claim 1 , wherein the photosensitive glass substrate comprises silica, lithium oxide, aluminum oxide, and cerium oxide.

3. masking a design layout including one or more overmold structures to form the one or more overmold openings; exposing at least a portion of the photosensitive glass substrate to an active energy source; heating the photosensitive glass substrate above its glass transition temperature for at least 10 minutes; and cooling the photosensitive glass substrate to convert at least a portion of the exposed glass into a crystalline material to form a glass crystalline substrate.

4. The method of claim 3 , wherein the step of forming the one or more overmold openings is performed by etching a glass crystal structure with an etchant.

5. The method of claim 3 , wherein the anisotropic etch ratio of the exposed portions to the unexposed portions is at least 30:

1.

6. The method of claim 1 , wherein each of the one or more overmold openings includes an upper opening and an interior, at least a portion of the interior being wider than the upper opening.

7. The method of claim 1 , wherein the overmold material comprises a liquid silicone rubber, a polyolefin, or an amorphous thermoplastic polyamide.

8. The method of claim 1 , wherein the step of applying the overmold material is performed using a low pressure molding process or a liquid silicone rubber process.

9. The method of claim 1 , wherein each overmolded opening is a blind opening or a through opening.

10. 10. The method of claim 1, wherein the one or more electronic devices comprise: an integrated circuit die; one or more passive electronic components including a resistor, inductor, or capacitor; one or more lumped circuit elements including a resistor, inductor, or capacitor; or a system in package.

11. An arrangement of one or more electronic devices in or on a photosensitive glass substrate, comprising: The photosensitive glass substrate; the one or more electronic devices disposed in or on the photosensitive glass substrate; one or more overmolded openings in the photosensitive glass substrate; a layer of overmold material filling the one or more overmold openings and covering at least a portion of the one or more electronic devices.

12. The apparatus of claim 11 , wherein each of the one or more overmold openings includes an upper opening and an interior, at least a portion of the interior being wider than the upper opening.

13. The apparatus of claim 11 , wherein the photosensitive glass substrate comprises silica, lithium oxide, aluminum oxide, and cerium oxide.

14. The device of claim 11 , wherein the overmold material comprises a liquid silicone rubber, a polyolefin, or an amorphous thermoplastic polyamide.

15. The apparatus of claim 11 , wherein each overmolded opening is a blind opening or a through opening.

16. 12. The apparatus of claim 11, wherein the one or more electronic devices comprise: an integrated circuit die; one or more passive electronic components including a resistor, inductor, or capacitor; one or more lumped circuit elements including a resistor, inductor, or capacitor; or a system in package.

17. An apparatus of one or more electronic devices in or on a photosensitive glass substrate, the apparatus comprising: the photosensitive glass substrate; the one or more electronic devices disposed in or on the photosensitive glass substrate; one or more overmold openings in the photosensitive glass substrate; and a layer of overmold material filling the one or more overmold openings and covering at least a portion of the one or more electronic devices; masking a design layout including one or more overmold structures to form the one or more overmold openings; exposing at least a portion of the photosensitive glass substrate to an active energy source; heating the photosensitive glass substrate above its glass transition temperature for at least 10 minutes; and cooling the photosensitive glass substrate to convert at least a portion of the exposed glass into a crystalline material to form a glass crystalline substrate.

18. 20. The apparatus of claim 17, wherein the step of applying the overmolding material is performed using a low pressure molding process or a liquid silicone rubber process.

19. 20. The apparatus of claim 17, wherein the step of forming the one or more overmold openings is performed by etching a glass crystal structure with an etchant.

20. 20. The apparatus of claim 17, wherein an anisotropic etch ratio between the exposed and unexposed portions is at least 30:1.

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