Method for manufacturing a camera device and camera device for a vehicle

Abstract

A method (100) for manufacturing a camera device (200, 300, 400), comprising the steps of: preparing (101) a circuit board (203) on which an image sensor (303) is arranged; attaching (102) at least one electrical contact element (212, 312, 412, 512) having an electrical contact surface (213) to the circuit board (203); aligning (103) an objective lens (201) accommodated in a housing of the camera device (200, 300, 400) and having a conductive contact area (202) with respect to the image sensor (303); fixing (104) the objective lens (201) in the housing; and contacting (105) the conductive contact area (202) of the objective lens (201) with the electrical contact surface (213) of the electrical contact element (212, 312, 412, 512). Here, the electrical contact element (212, 312, 412, 512) comprises a moveable spring arm (208) having an electrical contact (213) disposed thereon, and a moveable locking arm (205), which further restrains the spring arm (208) in the first position (304) until a contacting step (105), at which point a momentary mechanical impact (210) of the locking arm (205) by a release tool (501) releases the restraint of the spring arm (208).

Description

[Technical field]

[0001] The invention relates to a method for manufacturing a camera device and to a camera device comprising the features of the preambles of the independent claims. [Background technology]

[0002] German Patent Application Publication No. 10 2020206331 A1 discloses a camera module for a motor vehicle comprising an objective lens arrangement having at least one objective lens and at least one electrical contact surface, a circuit board arrangement having at least one circuit board on which an image sensor and at least one conductive connection unit are arranged, an alignment element positioned between the objective lens arrangement and the circuit board arrangement such that the objective lens arrangement can be fixed to the circuit board arrangement in a position optically aligned with the image sensor, and a force-applying element configured to exert a force on the conductive connection unit, whereby the conductive connection unit and the electrical contact surface are connectable to one another and at least one current path is formed, via which at least one electrical consumption element in the objective lens arrangement can be electrically connected to the circuit board. Summary of the Invention

[0003] The present invention relates to a method for manufacturing a camera device, the method comprising the steps of: preparing a circuit board on which an image sensor is arranged, attaching at least one electrical contact element having an electrical contact surface to the circuit board, aligning an objective lens housed in a housing of the camera device and having an electrically conductive contact area with respect to the image sensor, fixing the objective lens in the housing, and contacting the electrically conductive contact area of ​​the objective lens with the electrical contact surface of the electrical contact element.

[0004] According to the invention, the electrical contact element comprises a movable spring arm on which the electrical contact is arranged and a movable locking arm, the locking arm restraining the spring arm in a first position until a contacting step, at which point the spring arm is unrestrained by a momentary mechanical impact on the locking arm by a release tool.

[0005] The camera device produced by the method can be used in a vehicle. In the present invention, an objective lens means all components that are fixedly connected to the objective lens and are aligned together as a unit during alignment to the image sensor. The objective lens in particular has an objective lens housing and at least one optical lens arranged in the objective lens housing. Furthermore, the objective lens may also have an electrical consumption element. The electrical consumption element can be, for example, a lens heater. The electrical consumption element of the objective lens can be electrically connected to the conductive contact area. The electrical consumption element of the objective lens can be controlled via the conductive contact area. The conductive contact area of ​​the objective lens is further contacted with an electrical contact surface of at least one electrical contact element. The at least one electrical contact element is further attached to a circuit board. During attachment, in particular one electrical contact is respectively established between the electrical contact element and the circuit board. Thus, the method presented here allows the electrical consumption element of the objective lens to be electrically contacted with the circuit board. In other words, the electrical consumption element can be supplied with electricity via the circuit board. In other words, the electrical contact element is configured in particular to transfer electrical energy from the circuit board to an electrical dissipation element having an electrically conductive contact area, where the electrical dissipation element may be part of a component other than the objective lens.

[0006] The electrical contact elements (also called contact elements for short) are in particular formed as single contacts. If the objective housing of the objective is made of a metallic material, only one electrical contact element may be sufficient to be attached to the circuit board. If the objective housing of the objective is made of a non-metallic material, advantageously at least two electrical contact elements are attached to the circuit board. Here, two contact elements can be attached to opposing sides of the circuit board and contact two contact surfaces of the electrically conductive contact area of ​​the objective that are diametrically opposite each other on the outer peripheral surface of the objective.

[0007] The fixing of the objective lens in the housing takes place in particular after the alignment of the objective lens in order to fix the alignment of the objective lens with respect to the image sensor. The fixing of the objective lens in the housing can take place, for example, by means of a glued or welded connection.

[0008] The electrical contact elements are in particular made of electrically conductive material. The electrical contact elements are in particular made of a material with bending and / or spring properties. This makes it possible to ensure a reliable contact. The electrical contact elements are in particular made flexible and / or spring-loaded, so that the establishment of contact of the electrically conductive contact areas of the objective lens is ensured. The spring arms with the electrical contacts are in particular made preloaded. This makes it possible to ensure a predefined contact force at the electrically conductive contact areas of the objective lens when the contact is established, even if the distance between the objective lens and the electrical contact elements is different. In other words, contact is not only possible at a single distance between the objective lens and the electrical contact elements, but also the distance can have a size within a predefined range. This makes the contact advantageously independent of the size of the housing. To improve the electrical contact, the electrical contact surfaces of the electrical contact elements can be made with a surface coating, for example with a nickel-gold alloy.

[0009] A momentary mechanical shock can be understood as a short-term pressure on the locking arm. In particular, the release tool exerts a short-term pressure on the locking arm. For example, the locking arm can also be equipped with a release clip. In this case, the release tool exerts a momentary mechanical shock on the release clip.

[0010] The advantage of the present invention is that the contact is performed after the alignment of the objective lens to the image sensor in time, so that the alignment remains unaffected by the contact force on the objective lens. It is possible to avoid friction between the electrical contact elements and the objective lens during alignment, so that it is possible to avoid debris, for example in the form of particles, that is generated during alignment and that accumulates on the image sensor, thereby adversely affecting the imaging by the camera device.

[0011] In an advantageous embodiment of the invention, it is provided that in the mounting step, the electrical contact element is attracted by an assembly tool at an attraction surface of the electrical contact element and positioned on the circuit board at a support surface of the electrical contact element. Furthermore, in the mounting step, a solder connection is formed between the support surface and the circuit board. Alternatively, in the mounting step, the electrical contact element is pressed into the circuit board.

[0012] The contact element can therefore be mounted on a circuit board in the framework of an SMD assembly (Surface Mounted Device). The contact element can in particular be mounted on the circuit board together with other components. Advantageously, this allows the costs for manufacturing the camera device to be kept low. Furthermore, the mounting of the contact element is largely independent of the size of the housing. This makes the contact universal, for example for camera devices of different sizes. The same contact element can be used for different camera devices. Here, the suction surface can be formed as a region of a spring arm or as a region of a locking arm. The assembly tool can in particular be a vacuum assembly tool. In order to improve the electrical contact, the support surface of the electrical contact element can be configured with a surface coating, for example with a nickel-gold alloy.

[0013] Here, the fastening of the contact elements to the circuit board by means of a solder connection can be easily realized in terms of process technology when assembling the circuit board, for example with other components, and the solder connection can also be used for electrical contacting of the electrical contact elements to the circuit board.

[0014] Whereas, if the formation of a solder connection is difficult or impossible to realize due to a given geometry, a press-in represents a particularly and very stable alternative for fastening the contact element to the circuit board. Here, the electrical contact element in particular further has a press-in profile. The press-in profile can be aligned from the support surface towards the side opposite the suction surface. In particular, a sleeve and a conductor track running from the sleeve on the underside of the circuit board are further arranged in the through-opening of the circuit board. The press-in profile of the electrical contact element can be arranged in a press-in manner in the through-opening of the circuit board. Here, the press-in profile and the sleeve can be electrically contacted in the through-opening.

[0015] In a further advantageous embodiment of the invention, it is provided that the electrical contact elements have passages at or near the support surface, the circuit board has at least one through-opening, and the electrical contact elements are positioned on the circuit board in the mounting step such that the passages and the through-opening are adjacent to each other. To induce a temporary mechanical shock, a release tool is inserted from the side of the circuit board opposite the objective lens through the through-opening in the circuit board and through the adjacent passage in the electrical contact element. Here, the circuit board in particular has exactly one through-opening for each electrical contact element mounted thereon.

[0016] This method of releasing the binding can be used in particular when the conductive contact area is arranged on the outer peripheral surface of the objective lens. The release tool is dimensioned in such a way that it can be inserted through the through opening and the passage until it hits the locking arm. The release tool can be formed, for example, as a pin. In particular, the diameter of the pin is slightly smaller than the diameter of the through opening and the diameter of the passage. In particular, the pin is formed with such a length that it can hit the locking arm and exert a momentary mechanical shock on the locking arm. The advantage of this form is that the contact step does not affect the aligned and fixed objective lens. Furthermore, the release tool can be guided precisely through the through opening and the passage. Slippage of the release tool during insertion through the through opening and the passage can be prevented. This can ensure that the release tool exerts a sufficiently large pressure on the locking arm. The binding can be released reliably. This is a great advantage, in particular when mass-producing camera devices.

[0017] In a further advantageous embodiment of the invention, it is provided that the circuit board has at least one through-opening, the electrical contact elements are positioned on the circuit board in the mounting step such that at least a part of the locking arm passes through the through-opening towards the side opposite the objective lens, and the release tool is slid parallel to and along the circuit board on the side opposite the objective lens to cause a temporary mechanical shock, where the circuit board in particular has exactly one through-opening for each electrical contact element mounted thereon.

[0018] This release method can be used in particular when the conductive contact area is arranged on the side of the objective lens facing the circuit board. The release tool can be formed, for example, as a pin. In particular, the pin is formed with such a length that it can strike the locking arm and exert a momentary mechanical shock on it. The advantage of this form is that the contact step does not affect the aligned and fixed objective lens. The release can be reliably performed. This is a great advantage, in particular when mass-producing camera devices.

[0019] In a further advantageous embodiment of the invention, the method comprises the further step of positioning and fixing a cover on the housing of the camera device on a side opposite the objective lens, where the cover may have an opening through which a plug may be inserted into the cover, the plug allowing the circuit board to contact a current source external to the camera device.

[0020] The present invention further relates to a camera device for a vehicle comprising: a circuit board on which an image sensor is arranged; at least one electrical contact element having an electrical contact surface attached to the circuit board; a housing; and an objective lens contained within the housing, aligned with the image sensor and fixed within the housing, the objective lens having a conductive contact area, the conductive contact area of ​​the objective lens being in contact with the electrical contact surface of the electrical contact element.

[0021] According to the invention, the electrical contact element comprises a movable spring arm on which the electrical contacts are arranged and a movable locking arm, where the locking arm is configured to lock the spring arm in a first position and configured to release the locking of the spring arm at the camera device in order to establish contact between the conductive contact area of ​​the objective lens and the electrical contact surface of the electrical contact element.

[0022] The camera device presented here is then produced in particular according to the method described above. In an advantageous embodiment of the invention, each electrical contact element has an adhesive surface and a support surface, a solder connection being formed between each support surface and the circuit board, or the support surface of the electrical contact element being pressed into the circuit board, the adhesive surface and the support surface of each electrical contact element being in particular aligned parallel to each other.

[0023] In a further advantageous embodiment of the invention, the electrical contact elements have passages at or near the support surface, the circuit board has at least one through-opening, and the electrical contact elements are positioned on the circuit board such that the passages and the through-opening are adjacent to one another, where the circuit board in particular has exactly one through-opening for each electrical contact element mounted thereon.

[0024] In a further advantageous embodiment of the invention, the circuit board has at least one through-opening and the electrical contact elements are attached to the circuit board in such a way that at least a part of the locking arm passes through the through-opening towards the side opposite the objective lens. In this embodiment, the contact elements can also have a passage in or near the support surface. In this case, this passage is not necessary for the release of the restraint, but can be advantageous during the formation of the solder connection between the support surface and the circuit board and for better positioning. Here, the circuit board in particular has exactly one through-opening for each electrical contact element attached thereto.

[0025] In a further advantageous embodiment of the invention, the locking arm and the spring arm of the electrical contact element are arranged on opposite sides of the support surface or on adjacent sides of the support surface. If the support surface of the electrical contact element is configured in a rectangular shape, in a first alternative, the locking arm and the spring arm are arranged opposite each other. Here, the first alternative has the advantage that the contact element can be manufactured more easily. If the support surface of the electrical contact element is formed in a rectangular shape, in a second alternative, the locking arm and the spring arm are arranged at an angle of 90° to each other. Here, the second alternative has the advantage that a higher rigidity can be achieved.

[0026] The locking arm and the spring arm are arranged in particular to protrude upward from the support surface. Here, for example, the locking arm can be configured in two parts, a first part of the locking arm is arranged to protrude upward from the support surface, and a second part of the locking arm is formed on the side of the contact element facing the support surface, parallel to the support surface. Here, the second part of the locking arm can include an adsorption surface of the contact element. Alternatively, for example, the spring arm can be configured in two parts, a first part of the spring arm is arranged to protrude upward from the support surface, and a second part of the spring arm is formed on the side of the contact element facing the support surface, parallel to the support surface. Here, the second part of the spring arm can include an adsorption surface of the contact element. Here, the second part of the spring arm can further have an extension, which includes an electrical contact surface.

[0027] The locking arm can be formed flat. In particular, the first part of the locking arm and / or the second part of the locking arm can be formed flat. Alternatively, the locking arm or a part of the locking arm can be formed at least partially curved. The locking arm has in particular a fastening region. The fastening region is formed to restrain the spring arm.

[0028] The spring arm can be formed flat. In particular, the first part of the spring arm and / or the second part of the spring arm can be formed flat. Alternatively, the spring arm, or a part of the spring arm, can be formed at least partially curved. The curved part of the spring arm can advantageously improve the bending and / or spring properties of the spring arm. The spring arm has in particular a restraining region. The restraining region is in particular formed to interact with a fixing region of the locking arm for restraining the spring arm.

[0029] It will be understood that the features mentioned above, and those further described below, can be used not only in the respective combinations presented, but also in other combinations or alone, without departing from the scope of the present invention.

[0030] Exemplary embodiments of the invention will now be described more fully hereinafter with reference to the accompanying drawings, in which like reference numbers indicate identical or functionally identical elements. [Brief description of the drawings]

[0031] [Figure 1] FIG. 1 illustrates an exemplary embodiment of a method for manufacturing a camera device. [Figure 2A] FIG. 2 shows, by way of example, a step of contacting a conductive contact area of ​​the objective lens with an electrical contact surface of an electrical contact element. [Figure 2B] FIG. 2 shows, by way of example, a step of contacting a conductive contact area of ​​the objective lens with an electrical contact surface of an electrical contact element. [Figure 3A] 13A-13C show further exemplary embodiments of electrical contact elements. [Figure 3B] FIG. 3B illustrates, by way of example, contacting an objective lens of a camera device with the electrical contact element of FIG. 3A. [Figure 4A] 13A-13C show further exemplary embodiments of electrical contact elements. [Figure 4B] FIG. 4B is a partial view of a camera device with the electrical contact elements of FIG. 4A. [Diagram 5] 13A-13C show further exemplary embodiments of electrical contact elements. [Figure 6] 11A-11C show alternative fastening possibilities of the electrical contact elements to the circuit board. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0032] FIG. 1 shows an exemplary embodiment of a method for manufacturing a camera device. The camera can be used, for example, in a vehicle. The method 100 includes a step 101 of preparing a circuit board on which an image sensor is arranged, a step 102 of attaching at least one electrical contact element having an electrical contact surface to the circuit board, a step 103 of aligning an objective lens housed in a housing of the camera device and having an electrically conductive contact area with respect to the image sensor, a step 104 of fixing the objective lens in the housing, and a step 105 of contacting the electrically conductive contact area of ​​the objective lens with the electrical contact surface of the electrical contact element. Here, the contact element has a movable spring arm on which an electrical contact is arranged and a movable lock arm. Until the contact step 105, the lock arm restrains the spring arm in a first position. In the contact step 105, the spring arm is released from restraint by a momentary mechanical impact on the lock arm by a release tool.

[0033] In particular, the method 100 may include a further step 106 of placing and fixing a cover to the housing of the camera device on the side opposite the objective lens. The method 100, particularly with respect to the contacting step 105, will be explained in more detail with reference to the following figures.

[0034] 2A and 2B, a partial view of camera device 200 is shown, with the housing of camera device 200 omitted for clarity. Camera device 200 comprises a circuit board 203. In particular, FIG. 2A shows camera device 200 up to or during contacting step 105 of method 100. FIG. 2B shows the camera device after contacting step 105.

[0035] 2A and 2B do not show the image sensor arranged on the circuit board. The camera device 200 further comprises an objective lens 201 accommodated in a housing, aligned with the image sensor and fixed in the housing. The objective lens 201 has an electrically conductive contact area 202. A contact element 212 having an electrical contact surface 213 is attached to the circuit board 203 of the camera device 200. In the partial view shown here, only one contact element 212 is visible. However, at least two contact elements 212 can also be arranged on the circuit board 203. The following description of the illustrated contact element 212 applies equally to further contact elements 212 not shown. The electrical contact element 212 of the camera device 200 has a movable spring arm 208 on which the electrical contact 213 is arranged and a movable locking arm 205.

[0036] In the illustrated example, the electrical contact element 212 has an adhesion surface 209, which allows the electrical contact element 212 to be attracted to the adhesion surface 209 by an assembly tool in the attachment step 102 of the method 100 described above. This allows the electrical contact element 212 to be positioned on the circuit board 203 very simply and very accurately. Furthermore, the electrical contact element 212 has a support surface 206. The contact element 212 is positioned on the circuit board 203 at the support surface 206. For example, a solder connection (not shown here) can be formed between the support surface 206 and the circuit board 203 in the attachment step 102.

[0037] In the example shown here, the lock arm 205 and the spring arm 208 are arranged on opposite sides of the support surface 206. The lock arm 205 and the spring arm 208 are arranged to protrude upward from the support surface 206. Here, the lock arm 205 shown here is formed in two parts. The first part 205-1 of the lock arm 205 is arranged to protrude upward from the support surface 206. The second part 205-2 of the lock arm 205 is formed parallel to the support surface 206 on the side of the contact element 212 that faces the support surface 206. Here, the second part 205-2 of the lock arm 205 includes an adsorption surface 209. The first part 205-1 and the second part 205-2 of the lock arm 205 are formed flat here. Furthermore, the lock arm 205 has a fixing area 214 for restraining the spring arm 208 at one end of the second part 205-2. The locking arm 208 shown here projects upward from the circuit board 203 and is initially formed flat, but has a curved portion 216 in the part facing away from the circuit board 203. In the area of ​​the curved portion 216, an electrical contact surface 213 is arranged. Between the flat area and the area with the curved portion 216, the spring arm 208 comprises a restraining area 215 for interacting with a fixing area 214 of the locking arm 205 to restrain the spring arm 208.

[0038] Additionally, the electrical contact element 212 has a passageway 207 in the support surface 206. Additionally, the circuit board 203 has a through opening 204 in the partial view shown here. The electrical contact element 212 is positioned on the circuit board 203 such that the passageway 207 and the through opening 204 shown here are adjacent to each other. This can be advantageously used to release the constraint of the spring arm 208 as described below.

[0039] 2A shows by way of example a method for manufacturing a camera device 200 up to or during step 105 of contacting the conductive contact area 202 of the objective lens 201 with the electrical contact surface 213 of the illustrated electrical contact element 212. Up until the contacting step 105, the locking arm 205 restrains the spring arm 208 in a first position. In this position, the contact surface 213 of the electrical contact element 212 is not yet in electrical contact with the conductive contact area 202 of the objective lens 201.

[0040] In a contacting step 105, the constraint of the spring arm 208 is released by a momentary mechanical impact (here shown by way of example in FIG. 2A with arrow 210) on the locking arm 205 by a release tool (not shown). Thereby, as can be seen in FIG. 2B, the conductive contact area 202 of the objective lens 201 is brought into contact with the electrical contact surface 213 of the electrical contact element 212. The contact element 212 now exerts a contact force, shown by arrow 211 in FIG. 2B, on the conductive contact area 202 of the objective lens 201. The contacting step 105 of the method 100 is performed analogously with respect to the further electrical contact element 212 of the camera arrangement 200.

[0041] 3A shows a further exemplary embodiment of an electrical contact element. The contact element 312 shown in FIG. 3A is in many respects similar to the contact element 212 of FIG. 2, therefore mainly the differences will be described below. The spring arm 208 of the contact element 312 is also arranged to protrude above the support surface 206, but has two curved parts 301 and 302. The curved part 301 is here located on the side of the spring arm 208 closer to the support surface 206. The curved part 301 can serve to improve the spring properties of the spring arm 208. The curved part 302 is located on the side of the spring arm 208 away from the support surface 206. Here, the curved part 302 comprises the electrical contact surface 213. In this contact element 312, the restraining area 215 of the spring arm 208 is formed as a recess. The fixing area 214 of the locking arm 205 for restraining the spring arm 208 is inserted or can be inserted into this recess 215. The contact element 312 also has a passage 207 through which a release tool (not shown) can again be slid to exert a momentary mechanical shock (again shown by way of example with arrow 210) on the locking arm 205, releasing the constraint of the spring arm 208. The spring arm 208 can then exert a contact force, indicated by arrow 211, on the adjacently located objective lens. The spring arm 208 can in particular exert a contact force on the conductive contact area of ​​the adjacently located objective lens. This will be explained again below with reference to FIG. 3B with respect to the contact element 312.

[0042] FIG. 3B exemplarily illustrates the step 105 of contacting the objective lens of the camera device 300 by the electrical contact element 312 of FIG. 3A according to the method 100. FIG. 3B also has many similarities to FIGS. 2A and 2B, and therefore mainly the differences will be described below. In FIG. 3B, for example, an image sensor 303 can also be seen, which is arranged on a circuit board 203. Furthermore, the change in position of the spring arm 208 due to the contact 105 is also shown. That is, the spring arm 208 is constrained in a first position 304 until the contact step 105. After the release of the spring arm 208, the spring arm is in a second position in which the electrical contact surface 213 of the contact element 312 contacts the conductive contact area 202 of the objective lens 201. This is represented by the area enclosed as 305, for example, where only the area of ​​the spring arm having the bend 302 and the electrical contact surface 213 is shown. Additionally, the area circled as 306 indicates the position of the spring arm 208 after release of the constraint if the objective lens 201 was not positioned near the contact element 312 .

[0043] FIG. 4A shows an electrical contact element 412 as a further exemplary embodiment. Here again, the differences with the contact elements 212 and 312 are mainly described. The contact element 412 also comprises a support surface 206 with a passage 207. The locking arm 205 and the spring arm 208 are arranged on opposite sides of the support surface 206 and protrude upward from the support surface 206. Both the locking arm 205 and the spring arm 208 are formed flat. They do not have a curve in this exemplary embodiment. However, designs in which the locking arm 205 and / or the spring arm 208 are provided with at least one curve are also conceivable. In the contact element 412, the spring arm 208 is formed in two parts. A first part 208-1 of the spring arm 208 is arranged to protrude upward from the support surface 206. A second part 208-2 of the spring arm 208 is formed parallel to the support surface 206 on the side of the contact element 412 facing the support surface 206. Here, the second portion 208-2 of the spring arm 208 includes an attraction surface 209. Furthermore, the second portion 208-2 of the spring arm 208 of the contact element 412 shown here has an extension 401. The extension 401 includes an electrical contact surface 213. Furthermore, in the contact element 412, the support surface 206 can also be considered as part of the spring arm 208. A restraining area 215 of the spring arm 208 is arranged on the side of the support surface 206 opposite to the first portion 208-1 of the spring arm 208.

[0044] The locking arm 205 of the contact element 412 also has an extension 402. The extension 402 extends from the support surface 206 towards the side opposite the suction surface 209. In this contact element 412, the fixing area 214 of the locking arm 205 is formed as a recess. A restraining area 215 of the spring arm 208 for restraining the spring arm 208 is inserted or can be inserted into this recess.

[0045] In the contact element 412 described herein, in the contacting step 105 of the method 100 described above, a momentary mechanical shock, indicated by arrow 210, is applied to the extension 402 of the locking arm 205, which releases the constraint of the spring arm 208. This causes the extension 401 of the spring arm 208 to move upwardly away from the support surface 206 and to be able to exert a contact force 211 on the adjacently disposed objective lens. In particular, the spring arm 208 can exert a contact force on the conductive contact region of the adjacently disposed objective lens.

[0046] Figure 4B shows a partial view of the camera device 400 with the electrical contact element of Figure 4A. Again, the following will mainly focus on the differences with Figures 2A and 2B, and 3B. The electrical contact element 412 is positioned on the circuit board 203 with its support surface 206, and is fixedly disposed thereon by the solder connection 401, which can be seen here.

[0047] The circuit board 203 of the camera arrangement 400 also has a through-opening 403, which through-opening 403 is involved in the release of the restraint of the spring arm 208. But here, unlike the camera arrangements 200 and 300, the electrical contact element 412 is positioned on the circuit board 203 in such a way that at least a part of the locking arm 205 passes through the through-opening 403 towards the side opposite the objective lens 201. In particular, the extension 402 of the locking arm 205 extends through the through-opening 403. To cause a temporary mechanical shock, a release tool is slid or has been slid along the side of the circuit board 203 opposite the objective lens 201, parallel to the circuit board. The restraint is thus released or has been released by a lateral force shock below the circuit board 203. This results in contact between the conductive contact area of ​​the objective lens 201 and the electrical contact surface 213 of the contact element 412. 4B, in this example, the conductive contact area of ​​the objective lens 201 is not on the outside of the objective lens 201 but on the side facing the circuit board 203. In other words, the conductive contact area of ​​the objective lens 201 is located on the lower surface of the objective lens 201. As already mentioned, when the constraint is released, the spring arm 208 moves upward and the electrical contact surface of the contact element 412 contacts the conductive contact area of ​​the objective lens 201.

[0048] 5 shows an electrical contact element 512 as a further exemplary embodiment, shown from two viewing directions. The electrical contact element 512 has a movable spring arm 208 on which the electrical contacts 213 are arranged, and a movable locking arm 205. The electrical contact element 512 comprises a support surface 206 having a passage 207. In this exemplary embodiment, the locking arm 205 and the spring arm 208 are arranged on adjacent faces of the support surface 206, which is formed substantially rectangular. The locking arm 205 and the spring arm 208 are arranged to protrude upward from the support surface 206. The spring arm 208 is formed in two parts. A first part 208-1 of the spring arm 208 is arranged to protrude upward from the support surface 206. A second part 208-2 of the spring arm 208 is formed parallel to the support surface 206 on the side of the contact element 512 facing the support surface 206. Here, the second part 208-2 of the spring arm 208 comprises the suction surface 209. Here, the second part 208-2 of the spring arm 208 is formed flat. On the other hand, the first part 208-1 of the spring arm 208 has curved parts 503 and 504. Here, the curved part 503 is in particular part of the restraining area 215 of the spring arm 208. In the area of ​​the second curved part 504, the electrical contact surface 213 is arranged. Furthermore, the spring arm 208 also has a recessed area 505 in its first part 208-1. The locking arm 205 of the electrical contact element 512 is formed substantially flat and has a curved part 506 only at the end opposite the support surface 206. Here, the curved part 506 is part of the fixing area 214 of the locking arm 205 for restraining the spring arm 208. To release the constraint, a release tool 501 can be guided through the passage 207 of the contact element 512, as shown on the left side of Fig. 5. Here, the release tool 501 hits the release clip 502, which is part of the locking arm 205. Here, the release clip 502 is cut out of the locking arm 205, forming a recessed area 506 in the locking arm 205. The resulting momentary mechanical impact on the locking arm 205 releases the constraint of the spring arm 208.

[0049] In the exemplary embodiment of Figures 2A and 2B, 3B, and 4B, the electrical contact element is attached to the circuit board such that a solder connection is formed between the support surface 206 and the circuit board 203. Figure 6 shows an alternative fastening possibility of the electrical contact element 212 to the circuit board 203. This alternative can also be applied to the contact elements 212, 312, and 412 shown in Figures 2A and 2B, 3B, and 4B, and also to the fastening of the contact element 512 shown in Figure 5.

[0050] FIG. 6 is similar in many respects to FIG. 2A, therefore only the differences will be described below. In this example, the electrical contact element 212 also has a press-in contour 601. Here, the press-in contour 601 is aligned from the support surface 206 towards the side opposite the suction surface 209. Furthermore, in the through-opening 204 of the circuit board 203, a sleeve 602 and a conductor path 603 are arranged, which run from the sleeve 602 on the underside of the circuit board 203. In the step of attaching the electrical contact element 212 to the circuit board 203, the electrical contact element 212 can be press-fitted into the circuit board 203. FIG. 6 shows how the electrical contact element 212 has already been press-fitted into the circuit board 203. Here, the press-in contour 601 is arranged press-fitted into the through-opening 204 of the circuit board 203. The press-in contour 601 is arranged in the through-opening 204 of the circuit board 203 and is in electrical contact with the sleeve 602.

Claims

1. A method (100) for manufacturing a camera device (200, 300, 400), comprising: A step (101) of preparing a circuit board (203) on which an image sensor (303) is disposed; Attaching (102) at least one electrical contact element (212, 312, 412, 512) having an electrical contact surface (213) to said circuit board (203); Aligning (103) an objective lens (201) housed in a housing of the camera device (200, 300, 400) and having a conductive contact area (202) with respect to the image sensor (303); Fixing (104) the objective lens (201) in the housing; contacting (105) the electrically conductive contact area (202) of the objective lens (201) with the electrical contact surface (213) of the electrical contact element (212, 312, 412, 512); In a method comprising: the electrical contact element (212, 312, 412, 512) has a movable spring arm (208) on which the electrical contact (213) is disposed, and a movable locking arm (205); Until the contact step (105), the lock arm (205) restrains the spring arm (208) in a first position (304); In the contact step (105), a momentary mechanical impact (210) on the locking arm (205) by a release tool (501) releases the restraint of the spring arm (208).

1. A method (100) comprising:

2. 2. The method (100) of claim 1, wherein in the mounting step (102), the electrical contact elements (212, 312, 412, 512) are attracted to an attraction surface (209) of the electrical contact elements (212, 312, 412, 512) by an assembly tool and positioned to the circuit board (203) by a support surface (206) of the electrical contact elements (212, 312, 412, 512) and a solder connection (401) is formed between the support surface (206) and the circuit board (203), or the electrical contact elements (212, 312, 412, 512) are pressed into the circuit board (203).

3. 3. The method (100) of claim 2, wherein the electrical contact elements (212, 312, 512) have passages (207) at or near the support surface (206), the circuit board (203) has at least one through opening (204), the electrical contact elements (212, 312, 512) are positioned on the circuit board (203) in the mounting step (102) such that the passages (207) and the through openings (204) are adjacent to each other, and the release tool (501) is inserted from a side of the circuit board (203) opposite the objective lens (201) through the through opening (204) in the circuit board (203) and the adjacent passages (207) in the electrical contact elements (212, 312, 512) to cause the temporary mechanical shock (210).

4. 3. The method (100) according to claim 1 or 2, wherein the circuit board (203) has at least one through opening (403), the electrical contact element (412) is positioned on the circuit board (203) in the mounting step (102) such that at least a portion of the locking arm (205) passes through the through opening (403) toward a side opposite the objective lens (201), and the release tool is slid parallel to and along the circuit board (203) on the side opposite the objective lens (201) to cause the temporary mechanical shock (210).

5. A camera device (200, 300, 400) for a vehicle, A circuit board (203) on which an image sensor (303) is disposed; at least one electrical contact element (212, 312, 412, 512) having an electrical contact surface (213) attached to said circuit board (203); Housing and an objective lens (201) housed within the housing, aligned with the image sensor (303) and fixed within the housing, the objective lens (201) having a conductive contact area (202); Equipped with The conductive contact area (202) of the objective lens (201) is in contact with the electrical contact surface (213) of the electrical contact element (212, 312, 412, 512), In the camera device (200, 300, 400), the electrical contact element (212, 312, 412, 512) has a movable spring arm (208) on which the electrical contact (213) is disposed, and a movable locking arm (205); the locking arm (205) is configured to restrain the spring arm (208) in a first position (304); The restraint of the spring arm (208) on the camera device (200, 300, 400) is configured to be released in order to establish contact between the conductive contact area (202) of the objective lens (201) and the electrical contact surface (213) of the electrical contact element (212, 312, 412, 512). A camera device (200, 300, 400).

6. 6. The camera device (200, 300, 400) of claim 5, wherein the electrical contact element (212, 312, 412, 512) has an adsorption surface (209) and a support surface (206), and a solder connection (401) is formed between the support surface (206) and the circuit board (203), or the support surface (206) of the electrical contact element (212, 312, 412, 512) is press-fitted into the circuit board (203).

7. 7. The camera device of claim 6, wherein the electrical contact element has a passageway at or near the support surface, the circuit board has at least one through opening, and the electrical contact element is positioned on the circuit board such that the passageway and the through opening are adjacent to each other.

8. 7. The camera device (400) of claim 5 or 6, wherein the circuit board (203) has at least one through opening (403), and the electrical contact element (412) is attached to the circuit board (203) such that at least a portion of the locking arm (205) passes through the through opening (403) toward the side opposite the objective lens (201).

9. 9. The camera device (200) of claim 6, wherein the locking arm (205) and the spring arm (208) of the electrical contact element (212, 312, 412, 512) are arranged on opposite sides of the support surface (206) or on adjacent sides of the support surface (206).

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